WO2024114628A1

WO2024114628A1 - Sliding floating base for socket assemblies for integrated circuits

Info

Publication number: WO2024114628A1
Application number: PCT/CN2023/134700
Authority: WO
Inventors: Jinrong Chen; Long Zhang
Original assignee: Antares Advanced Test Technologies (Suzhou) Limited
Priority date: 2022-11-28
Filing date: 2023-11-28
Publication date: 2024-06-06
Also published as: CN118099108A

Abstract

A socket assembly is disclosed. The socket assembly comprises a socket body comprises a contact surface and a first opening sized to accept a floating base. The floating base comprises a body that defines a second opening sized to seat an integrated circuit chip. A plurality of step pins extend from the contact surface and are configured to align and engage with a plurality step holes of the floating base defined on a bottom surface of the floating base. The plurality of step pins each comprise a beveled flange insertable into an associated step hole of the plurality of step holes. In a free state, the flange of each step pin is positioned within the bottom portion of the associated step hole, and in a test state, the beveled flange is configured to cause the floating base to displace in a lateral direction when the floating base is advanced in a downward direction.

Description

SLIDING FLOATING BASE FOR SOCKET ASSEMBLIES FOR INTEGRATED CIRCUITS

This application claims the benefit of Chinese patent Application No. 202211502922.3 having a filing date of November 28, 2022, which is incorporated by reference as if fully set forth.

BACKGROUND

The field of the disclosure relates to sockets for integrated circuits, and more particularly, to sockets having a sliding and floating socket body.

An integrated circuit (IC) is a set of electronic circuits fabricated on a flat substate, or chip, of semiconductor material such as silicon. Production of ICs generally includes testing of the ICs in a manner that simulates an end-user’s application of those ICs. One manner of testing ICs is to connect each IC through a test socket assembly to a printed circuit board (PCB) , or load board, that exercises various functionalities of the IC. The test socket assembly can be re-used to test many ICs.

LGA (Land Grid Array) and QFN (Quad Flat No-leads package) are two common package structures of semiconductor IC chips. The pads of these kinds IC package are flat, conductive surfaces which creates an electrical connection with point contacts of the socket assembly. However, oxidation of the flat conductive surface of the chips can cause a poor electrical connection. Conventional point contacts can penetrate the oxidation formed on the flat conductive surface. However, if sufficient pressure is not applied to the chip, the point contacts may not adequately penetrate the oxidation formed, causing an unstable electrical connection.

Thus, it would be desirable to improve the electrical connections between point contacts and chips in socket assemblies.

SUMMARY

In one aspect, a socket assembly for mounting an integrated circuit chip is disclosed. The socket assembly comprises a socket body comprising a contact surface that defines a plurality of cavities sized to receive a plurality of spring probes, the socket body also defining a first opening sized to accept a floating base. The floating base comprises a body that defines a second opening sized to seat the integrated circuit chip against a step of the second opening. A plurality of step holes are defined on a bottom surface of the floating base. The plurality of step holes have a bottom portion adjacent to the bottom surface of the floating base. A plurality of step pins extend from the contact surface of the socket body, and the plurality of step pins are configured to align and engage with the plurality step holes of the floating base. The plurality of step pins each comprising a beveled flange insertable into an associated step hole of the plurality of step holes. In a free state, the flange of each step pin is positioned within the bottom portion of the associated step hole, and in a test state, the beveled flange is configured to cause the floating base to displace in a lateral direction when the floating base is advanced in a downward direction.

In another aspect, a socket assembly for mounting an integrated circuit chip is disclosed. The socket assembly comprises a socket body comprising a first beveled sidewall, an opposite sidewall, and a contact surface that define a first opening sized to accept a floating base. The contact surface defines a plurality of cavities sized to receive a plurality of spring probes. A floating base comprises a body that defines a second opening sized to seat the integrated circuit chip against a step of the opening, a beveled outer sidewall and an opposite outer sidewall. In a free state, the beveled outer sidewall is positioned against the first beveled sidewall of the socket body, and in a test state, the floating base is configured to be advanced in a downward direction such that the beveled outer sidewall of the floating base slides against the first beveled sidewall of the socket body, causing the floating base to displace in a lateral direction.

In yet another aspect, a socket assembly for mounting an integrated circuit chip is disclosed. The socket assembly comprises a socket body comprising a first beveled sidewall, an opposite second beveled sidewall, and a contact surface that define a first opening sized to accept a floating base. The contact surface defines a plurality of cavities sized to receive a plurality of spring probes. A floating base comprises a body that defines a second opening sized to seat the integrated circuit chip against a step of the opening, a first beveled outer sidewall, and an opposite second beveled outer sidewall. In a free state, the first beveled outer sidewall of the floating base is positioned against the first beveled sidewall of the socket body, and the second beveled outer sidewall of the floating base is positioned against the second beveled sidewall of the socket body, and in a test state, the floating base is configured to be advanced in a downward direction such that the first beveled outer sidewall of the floating base slides against the first beveled sidewall of the socket body and the second beveled outer sidewall of the floating base slides against the second beveled sidewall of the socket body causing the floating base to displace in a lateral direction.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects, and advantages of the present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:

FIG. 1 is an exploded view of an IC chip socket assembly in accordance with one or more embodiments of the present disclosure;

FIG. 2 is an enlarged view of region A of the IC chip socket assembly of FIG. 1;

FIG. 3 is a cross-sectional view of a portion of the IC chip socket assembly of FIG. 1 taken along cross-section line B-B’ illustrating the IC chip socket assembly mounted on a test board and IC chip in an IC chip socket assembly free state;

FIG. 4 is a cross-sectional view of a portion the IC chip socket assembly of FIG. 1 taken along cross-section line B-B’ illustrating the IC chip socket assembly mounted on the test board and IC chip in an IC chip socket assembly test state;

FIG. 5 is an exploded view of an IC chip socket assembly in accordance with one or more embodiments of the present disclosure;

FIG. 6 is a cross-sectional view of the IC chip socket assembly of FIG. 5 taken along cross-section line C-C’ illustrating the IC chip socket assembly mounted on a test board and IC chip in an IC chip socket assembly free state;

FIG. 7 is a cross-sectional view of the IC chip socket assembly of FIG. 5 taken along cross-section line C-C’ illustrating the IC chip socket assembly mounted on the test board and IC chip in an IC chip socket assembly test state;

FIG. 8 is an exploded view of an IC chip socket assembly in accordance with one or more embodiments of the present disclosure;

FIG. 9 is a cross-sectional view of the IC chip socket assembly of FIG. 8 taken along cross-section line D-D’ illustrating the IC chip socket assembly mounted on a test board and IC chip in an IC chip socket assembly free state; and,

FIG. 10 is a cross-sectional view of the IC chip socket assembly of FIG. 8 taken along cross-section line D-D’ illustrating the IC chip socket assembly mounted on the test board and IC chip in an IC chip socket assembly test state.

Unless otherwise indicated, the drawings provided herein are meant to illustrate features of embodiments of this disclosure. These features are believed to be applicable in a wide variety of systems comprising one or more embodiments of this disclosure. As such, the drawings are not meant to include all conventional features known by those of ordinary skill in the art to be required for the practice of the embodiments disclosed herein.

DETAILED DESCRIPTION

In the following specification and the claims, reference will be made to a number of terms, which shall be defined to have the following meanings.

The singular forms “a” , “an” , and “the” include plural references unless the context clearly dictates otherwise.

“Optional” or “optionally” means that the subsequently described event or circumstance may or may not occur, and that the description includes instances where the event occurs and instances where it does not.

Approximating language, as used herein throughout the specification and claims, may be applied to modify any quantitative representation that could permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about” , “approximately” , and “substantially” , are not to be limited to the precise value specified. In at least some instances, the approximating language may correspond to the precision of an instrument for measuring the value. Here and throughout the specification and claims, range limitations may be combined and/or interchanged, such ranges are identified and include all the sub-ranges contained therein unless context or language indicates otherwise.

As used herein, the term “IC chip” shall mean an integrated circuit chip. An integrated circuit chip includes a substrate with electronic circuits layered onto semiconductor material such as silicone. The electronic circuits include MOSFETs (metal-oxide-semiconductor field-effect transistors) integrated into the chip. Contacts of the electronic circuits extend through the substrate to a bottom surface of the substrate. The bottom surface can include multiple electrical contacts for the electronic surface. The IC chip can be mounted to a mainboard or system board such that the electrical contacts create an electrical connection with pins of the mainboard. IC chips can include, by way of example, central processing units (CPU’s ) for use in server systems or consumer desktop computers, as well as graphics processing units (GPU’s ) for use in graphics cards. The IC chip may include BGA packages, chip-scale packages (CSP) , flip chip packages, wafer-level packages (WLP) , wafer-level chip-scale packages (WL-CSP) , and the like. The electrical contacts which may be formed from electrically conductive materials, including tin, copper, and/or gold, and alloys of tin, copper, and/or gold.

In fabrication and testing of IC chips, a fundamental component of the test system is connecting the IC chip to the test system by a test socket. The test socket assembly connects, both electrically and mechanically, the IC package to a printed circuit board (PCB) or a load board. The test socket includes a socket cartridge having spring probes which extend through the socket cartridge and electrically connect with the pads of the IC chip. The spring probes have point contacts which interface with the pads of the IC chip, when the IC chip is pressed to the socket in a test state, the tip of the spring probes can penetrate the oxidation layer formed on the pad surface of the IC chip. However, the biasing force applied by the spring probes may be inadequate to penetrate the oxidation layer in some situations.

Embodiments of the present disclosure are directed to an IC chip socket assembly that improves penetration of the oxidation layer formed on the pad surface of the IC chip. The socket assembly includes a floating base which moves laterally in addition to downward as the floating base and the IC chip are mounted onto the socket body. The lateral movement improves “scrubbing” or penetration of the spring probes on the oxidation layer formed on the bottom surface of the IC chip.

As used herein, the terms “upward, ” “downward” , and “laterally” shall denote relative movement of elements of the present disclosure. The terms “upward” and “downward” denote movement along a Y-axis which is perpendicular to a bottom surface of the socket body (as shown in FIG, 3) . The term “laterally” denotes movement along an X-axis which is perpendicular to the bottom surface of the socket body (as shown in FIG. 3) .

As used herein, the term “free state” shall mean a state of the socket assembly where the IC chip and the floating base are floating over the socket body and the IC chip and floating base are not secured to the socket body. As used herein, the term “test state” shall mean a state of the socket assembly where the IC chip and floating base are secured to the socket body.

FIG. 1 illustrates is an exploded view of an IC chip socket assembly 100 (hereinafter referred to as “socket assembly 100” ) in accordance with an embodiment of the present disclosure and FIG. 2 illustrates an enlarged view of region A shown in FIG. 1. The socket assembly 100 includes a socket body 110 and a floating base 150. An IC chip 190 (hereinafter referred to as “chip 190” ) is seated on the floating base 150, and the chip 190 and the floating base 150 are together clamped onto the socket body 110 by a clamping mechanism (not shown) in a first direction downward along the Y-axis (as shown in FIG. 3) . FIG. 3 illustrates a cross-sectional view of the socket assembly 100 taken along cross-section line B-B’ in a free state, and FIG. 4 illustrates a cross-sectional view of the socket assembly 100 taken along cross-section line B-B’ in a test state. In the test state, the clamping mechanism has depressed the floating base 150 and the chip 190 such that the floating base 150 contacts the socket body 110.

The socket body 110 includes opening 112 sized to seat the floating base 150. The opening 112 extends a distance into the socket body and defines a sidewall 114 of the socket body 110, and a contact surface 120. The socket body 110 further includes a plurality of cavities 118, each sized to receive a spring probe 90 installed in cavities 118, the plurality of cavities 118 extending through the thickness of the socket body 110 from a bottom surface 122 of the socket body 110 to the contact surface 120 of the socket body 110. The bottom surface 122 is opposite the contact surface 120.

In some embodiments, the spring probe 90 includes a biasing element (such as a spring) (not shown) disposed within the spring probe 90, and a top plunger 92. The spring probe 90 is positioned within the plurality of cavities 118 such that the top plunger 92 extends beyond the contact surface 120 of the socket body 110 in the free state as shown in FIG. 3. As the floating base 150 is seated within the opening 112 of the socket body 110, the floating base 150 is pushed up by spring (not shown) , and the pointed end of the top plunger 92 compresses the spring probe 90 such that a force is exerted against the chip 190 along the Y-axis. The force exerted against the chip 190 along the Y-axis is sufficient to pierce or penetrate the oxidation layer formed on a bottom surface 192 of the chip 190. The spring probes 90 can include a ground type spring probe, a signal type spring probe, and/or a power type spring probe and the like.

In some embodiments, the socket body 110 further includes apertures 124 extending a distance into the contact surface 120 configured to receive biasing elements 126. The biasing elements 126 of the socket body 110 apply a upward force against the floating base 150 such that the floating base 150 is suspended above the contact surface 120 of the socket body 110 in the free state.

In some embodiments, the socket body 110 further includes pin apertures 130 configured to receive a step pin 134. As explained in further detail below, the step pin 134 is configured to engage with the floating base 150 such that the floating base displaces along the X-axis in a lateral direction.

The floating base 150 includes a body having an opening 152 extending through the thickness of the floating base 150. The opening 152 of the floating base 150 defines a sidewall 154 having a beveled portion 156 and a step 158 adjacent to the beveled portion 156. The beveled portion 156 extends from the step 158 to a top surface 160 of the floating base 150, and the step 158 extends from the beveled portion 156 to a bottom surface 162 of the floating base 150. The beveled portion 156 is configured to center the chip 190 into the step 158, and the step 158 is configured to receive the chip 190. Stated differently, the chip 190 is seated against the step 158.

In some embodiments, the floating base 150 further includes a plurality of step holes 170 extending at least partially through the bottom surface 162 of the floating base 150. As best shown in FIG. 2, the step holes 170 of the floating base 150 axially align with the step pins 134. As best shown in FIGS. 3 and 4, the step holes 170 include a bottom portion 172 adjacent to the bottom surface 162 of the floating base 150, and a beveled portion 174 adjacent to the bottom portion 172. The bottom portion 172 has a diameter D1, which is greater than a diameter D2 of the step holes 170. As best shown in FIG. 4, the step pins 134 further include a beveled flange 136 having a diameter D3 slightly less than the diameter D2 of the step holes 170, such that the beveled flange 136 is insertable into the step hole 170. In a free state, the beveled flange 136 of the plurality of step pins 13 is positioned within the bottom portion 172 of the step holes 170.

In operation, with reference to FIGS. 3 and 4, as the floating base 150 is advanced downward in a first direction A1 (along the Y-Axis) in the free state, the beveled flange 136 of the step pins 134 causes the floating base 150 to displace in a lateral direction ΔX (along the X-axis) in the test state. In particular, the beveled flange 136 of the step pins 136 slide against the beveled portion 174 of the step holes 170 such that the step pins 136 self-center relative to the step holes 170, causing the movement in the lateral direction ΔX as the floating base 150 is advanced downward in the first direction.

Because the top plunger 92 of the spring probes 90 contact the bottom surface 192 of the chip 190, the pointed ends of the top plunger 92 “scrub” or laterally penetrates the oxidation layer formed on the bottom surface 192 of the chip 190, resulting in an improved electrical connection between the contacts of the bottom surface 192 of the chip 190 and the spring probes 90. In the test state as shown in FIG. 4, the beveled flange 136 of the step pins 134 remains seated within the beveled portion 174 of an associated step hole of the plurality of step holes 170 such that the floating base 150 remains centered relative to the socket body 110.

FIG. 5 illustrates is an exploded view of an IC chip socket assembly 200 (hereinafter referred to as “socket assembly 200” ) in accordance with an embodiment of the present disclosure. The socket assembly 200 includes a socket body 210 and a floating base 250. The chip 190 is seated on the floating base 250, and the chip 190 and floating base 250 are together clamped onto the socket body 210 by a clamping mechanism (not shown) in a first direction downward along the Y-axis (as shown in FIG. 6) . FIG. 6 illustrates a cross-sectional view of the socket assembly 200 taken along cross-section line C-C’ in an free state and FIG. 7 illustrates a cross-sectional view of the socket assembly 200 taken along cross-section line C-C’ in a test state. In the test state, the clamping mechanism has depressed the floating base 250 and chip 190 such that the floating base 250 contacts the socket body 210.

The socket body 210 includes an opening 212 sized to seat the floating base 250 and chip 190. The opening 212 extends a distance into the socket body 210 and defines a sidewall 214 of the socket body 210, and a contact surface 220. The socket body 210 further includes a plurality of cavities 218 each sized to receive the spring probe 90 installed in cavities 218, the plurality of cavities 218 extending through the thickness of the socket body 210 from a bottom surface 222 of the socket body 210 to the contact surface 220. The bottom surface 222 is opposite the contact surface 220.

The spring probes 90 are positioned within the plurality of cavities 218 such that a pointed end of the top plunger 92 of each spring probe 90 extends beyond the contact surface 220 of the socket body 210 in the free state as shown in FIG. 6. As the floating base 250 is seated within the opening 212 of the socket body 210, the top plunger 92 compresses the spring probe 90 such that a biasing force is exerted against the chip 190 along the Y-axis. The biasing force exerted against the chip 190 along the Y-axis is sufficient to pierce or penetrate the oxidation layer formed on a bottom surface 192 of the chip 190. The spring probes 90 may include a ground type spring probe, a signal type spring probe, and/or a power type spring probe and the like.

In some embodiments, the socket body 210 further includes apertures 224 extending a distance into the contact surface 220 configured to receive biasing elements 226. The biasing elements 226 of the socket body 210 apply a biasing force against the floating base 250 such that the floating base 250 is suspended above the contact surface 220 of the socket body 210 in the test state.

In some embodiments, the sidewall 214 of the socket body 210 further includes a first beveled sidewall 216. An opposite sidewall 214a (opposite the first beveled sidewall 216) includes an aperture 224 for receiving a biasing element 226. As explained in further detail below, the biasing element 226 of the socket body 210 is configured to apply a lateral biasing force against the floating base 250 along the X-axis.

The floating base 250 includes a body having an opening 252 extending through the thickness of the floating base 250. The opening 252 of the floating base 250 defines a sidewall 254 having a beveled portion 256 and a step 258 adjacent to the beveled portion 256. The beveled portion 256 extends from the step 258 to a top surface 260 of the floating base 250, and the step 258 extends from the beveled portion 256 to a bottom surface 262 of the floating base 250. The beveled portion 256 is configured to center the chip 190 into the step 258, and the step 258 is configured to receive the chip 190. Stated differently, the chip 190 is seated against the step 258.

As best shown in FIGS 6 and 7, In some embodiments, the floating base 250 further includes a beveled outer sidewall 270 and an opposite outer sidewall 272 (opposite the beveled outer sidewall 270) . In the free state, the beveled outer sidewall 270 is positioned against the first beveled sidewall 216 of the socket body 210 such that the biasing element 226 of the socket body 210 applies a lateral biasing force against the floating base 250 along the X-axis.

In operation, with reference to FIGS. 6 and 7, as the floating base 250 is advanced downward in a first direction A1 (along the Y-axis) in the free state, the beveled outer sidewall 270 of the floating base 250 slides laterally and displaces in a lateral direction ΔX (along the X-axis) against the first beveled sidewall 216 of the socket body 210 in the test state. Because the top plunger 92 of the spring probes 90 contacts the bottom surface 192 of the chip 190, the pointed ends of the top plunger 92 “scrub” or laterally penetrate the oxidation layer formed on the bottom surface 192 of the chip 190, resulting in an improved electrical connection between the contacts of the bottom surface 192 of the chip 190 and the spring probes 90 in the test state. The biasing force of the biasing element biasing element 226 of the socket body 210 is configured to maintain the contact between beveled outer sidewall 270 of the floating base 250 and the first beveled sidewall 216 of the socket body 210.

FIG. 8 illustrates is an exploded view of an IC chip socket assembly 300 (hereinafter referred to as “socket assembly 300” ) in accordance with an embodiment of the present disclosure. The socket assembly 300 includes a socket body 310 and a floating base 350. The chip 190 is seated on the floating base 350, and the chip 190 and floating base 350 are together clamped onto the socket body 310 by a clamping mechanism (not shown) in a first direction downward along the Y-axis (as shown in FIG. 9) . FIG. 9 illustrates cross-sectional view of the socket assembly 300 taken along cross-section line D-D’ in a free state, and FIG. 10 illustrates a cross-sectional view of the socket assembly 300 taken along cross-section line D-D’ in a test state. In the test state, the clamping mechanism has depressed the floating base 350 and chip 190 such that the floating base 350 contacts the socket body 310.

The socket body 310 includes an opening 312 sized to seat the floating base 350 and chip 190. The opening 312 extends a distance into the socket body defining a sidewall 314 of the socket body 310, and a contact surface 320. The socket body 310 further includes a plurality of cavities 318 disposed within the second opening 312, each sized to receive the spring probe 90 installed in the plurality of cavities 318, the plurality of cavities 318 extending through the thickness of the socket body 310 from a bottom surface 322 of the socket body 310 to the contact surface 320, where the bottom surface 322 is opposite the contact surface 320.

The spring probes 90 are positioned within the plurality of cavities 318 such that the top plunger 92 of each spring probe 90 extends beyond the contact surface 320 of the socket body 310 in a free state as shown in FIG. 6. As the floating base 350 is seated within the opening 312 of the socket body 310, the pointed ends of the top plunger 92 compresses the spring probe 90 such that a biasing force is exerted against the chip 190 along the Y-axis. The biasing force exerted against the chip 190 along the Y-axis is sufficient to pierce or penetrate the oxidation layer formed on a bottom surface 192 of the chip 190. The spring probes 90 may include a ground type spring probe, a signal type spring probe, and a power type spring probe and/or the like.

In some embodiments, the socket body 310 further includes apertures 324 extending a distance into the contact surface 320 and configured to receive biasing elements 326. The biasing elements 326 of the socket body 310 apply a biasing force against the floating base 350 such that the floating base 350 is suspended above the contact surface 320 of the socket body 310 in the free state.

In some embodiments, the sidewall 314 of the socket body 310 further includes a first beveled sidewall 316 and a second beveled sidewall 317 opposite first beveled sidewall 316. As explained in further detail below, the first beveled sidewall 316 and second beveled sidewall 317 are configured to laterally displace the floating base 350 along the X-axis as the floating base 350 is clamped to the socket body 210 between the free state of FIG. 9 and the test state of FIG. 10.

The floating base 350 includes a body having an opening 352 extending through the thickness of the floating base 350. The opening 352 of the floating base 350 defines a sidewall 354 having a beveled portion 356 and a step 358 adjacent to the beveled portion 356. The beveled portion 356 extends from the step 358 to a top surface 360 of the floating base 350, and the step 358 extends from the beveled portion 356 to a bottom surface 362 of the floating base 350. The beveled portion 356 is configured to center the chip 190 into the step 358, and the step 358 is configured to receive the chip 190. Stated differently, the chip 190 is seated against the step 358.

As best shown in FIGS 9 and 10, in some embodiments, the floating base 350 further includes a first beveled outer sidewall 370 and second beveled outer sidewall 372 opposite the first beveled outer sidewall 370. In the test state, the beveled first beveled outer sidewall 370 is positioned against the first beveled sidewall 316 of the socket body 310 and the second beveled outer sidewall 372 is positioned against the second beveled sidewall 317 of the socket body 310. As the floating base 350 is advanced in the first direction A1 (along the Y-Axis) , the first beveled outer sidewall 370 and second beveled outer sidewall 372 of the floating base 350 displace both laterally and downward along the X-axis and Y-axis respectively.

In operation, with reference to FIGS. 9 and 10, as the floating base 350 is advanced downward in a first direction A1 (along the Y-Axis) in the free state, the first beveled outer sidewall 370 and second beveled outer sidewall 372 of the floating base 350 slide laterally and displaces in a lateral direction ΔX (along the X-axis) against the first beveled sidewall 316 of the socket body 310 and the second beveled outer sidewall 372 in the test state. Because the pointed end of the top plunger 92 of the spring probes 90 contact the bottom surface 192 of the chip 190, the top plunger 92 “scrubs” or laterally penetrates the oxidation layer formed on the bottom surface 192 of the chip 190, resulting in an improved electrical connection between the contacts of the bottom surface 192 of the chip 190 and the spring probes 90 in the test state.

Although specific features of various embodiments of the disclosure may be shown in some drawings and not in others, this is for convenience only. In accordance with the principles of the disclosure, any feature of a drawing may be referenced and/or claimed in combination with any feature of any other drawing.

This written description uses examples to disclose the embodiments, including the best mode, and also to enable any person skilled in the art to practice the embodiments, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the disclosure is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

A socket assembly for mounting an integrated circuit chip, the socket assembly comprising:

a socket body comprising a contact surface that defines a plurality of cavities sized to receive a plurality of spring probes, the socket body also defining a first opening sized to accept a floating base;

the floating base comprising a body that defines a second opening sized to seat the integrated circuit chip against a step of the second opening, wherein a plurality of step holes are defined on a bottom surface of the floating base, the plurality of step holes having a bottom portion adjacent to the bottom surface of the floating base; and

a plurality of step pins extending from the contact surface of the socket body, the plurality of step pins configured to align and engage with the plurality step holes of the floating base, the plurality of step pins each comprising a beveled flange insertable into an associated step hole of the plurality of step holes;

wherein, in a free state, the flange of each step pin is positioned within the bottom portion of the associated step hole, and wherein, in a test state, the beveled flange is configured to cause the floating base to displace in a lateral direction when the floating base is advanced in a downward direction.
The assembly of claim 1, wherein the beveled flange of the step pins slide against a beveled portion of the step holes as the floating base is advanced downward in the first direction such that the step pins self-center relative to the step holes, the beveled portion adjacent to the bottom portion of the step holes.
The assembly of claim 1, wherein each of the plurality of spring probes is configured to exert a biasing force against the integrated circuit chip in the test state such that a top plunger of each of the plurality of spring probes pierces an oxidation layer formed on a bottom surface of the integrated circuit chip.
The assembly of claim 3, wherein the top plunger of the spring probes are configured to laterally pierce the oxidation layer due to the displacement of the floating base in the lateral direction in the test state.
The assembly of claim 3, wherein the spring probes include a biasing element disposed within the spring probe, and the top plunger of the spring probes extend beyond the contact surface of the socket body in the free state.
The assembly of claim 3, wherein the spring probes include one or more of a ground type spring probe, a signal type spring probe, and a power type spring probe.
The assembly of claim 1, wherein the socket body further comprises biasing elements disposed within apertures of the contact surface, the biasing elements configured to apply a biasing force against the floating base such that the floating base is suspended above the contact surface of the socket body in the free state.
The assembly of claim 1, wherein the second opening of the floating base defines a sidewall having a beveled portion configured to center the integrated circuit chip into the step of the second opening.
A socket assembly for mounting an integrated circuit chip, the socket assembly comprising:

a socket body comprising a first beveled sidewall, an opposite sidewall, and a contact surface that define a first opening sized to accept a floating base, the contact surface defining a plurality of cavities sized to receive a plurality of spring probes; and,

a floating base comprising a body that defines a second opening sized to seat the integrated circuit chip against a step of the opening, a beveled outer sidewall and an opposite outer sidewall;

wherein, in a free state, the beveled outer sidewall is positioned against the first beveled sidewall of the socket body, and wherein, in a test state, the floating base is configured to be advanced in a downward direction such that the beveled outer sidewall of the floating base slides against the first beveled sidewall of the socket body, causing the floating base to displace in a lateral direction.
The assembly of claim 9, wherein the opposite sidewall of the socket body comprises a biasing element disposed within an aperture of the opposite sidewall, the biasing element configured to apply a lateral biasing force against the opposite sidewall of the floating base.
The assembly of claim 10, wherein the lateral biasing force is configured to maintain the contact between beveled outer sidewall of the floating base and the first beveled sidewall of the socket body.
The assembly of claim 10, wherein each of the plurality of the spring probes is configured to exert a biasing force against the integrated circuit chip in the test state such that a top plunger of each of the plurality of spring probes pierces an oxidation layer formed on a bottom surface of the integrated circuit chip.
The assembly of claim 12, wherein the spring probes are configured laterally pierce the oxidation layer due to the displacement of the floating base in the lateral direction in the test state.
The assembly of claim 9, wherein the spring probes include a biasing element disposed within the spring probe, and the spring probes extend beyond the contact surface of the socket body in the free state.
The assembly of claim 9, wherein the socket body further comprises biasing elements disposed within apertures of the contact surface, the biasing elements configured to apply a biasing force against the floating base such that the floating base is suspended above the contact surface of the socket body in the free state.
A socket assembly for mounting an integrated circuit chip, the socket assembly comprising:

a socket body comprising a first beveled sidewall, an opposite second beveled sidewall, and a contact surface that define a first opening sized to accept a floating base, the contact surface defining a plurality of cavities sized to receive a plurality of spring probes; and,

a floating base comprising a body that defines a second opening sized to seat the integrated circuit chip against a step of the opening, a first beveled outer sidewall, and an opposite second beveled outer sidewall;

wherein, in a free state, the first beveled outer sidewall of the floating base is positioned against the first beveled sidewall of the socket body, and the second beveled outer sidewall of the floating base is positioned against the second beveled sidewall of the socket body, and wherein, in a test state, the floating base is configured to be advanced in a downward direction such that the first beveled outer sidewall of the floating base slides against the first beveled sidewall of the socket body and the second beveled outer sidewall of the floating base slides against the second beveled sidewall of the socket body causing the floating base to displace in a lateral direction.
The assembly of claim 16, wherein each of the plurality of spring probes is configured to exert a biasing force against the integrated circuit chip in the test state such that a top plunger of each of the plurality of spring probes pierces an oxidation layer formed on a bottom surface of the integrated circuit chip.
The assembly of claim 17, wherein the top plungers of the spring probes are configured to laterally pierce the oxidation layer due to the displacement of the floating base in the lateral direction in the test state.
The assembly of claim 16, wherein the socket body further comprises biasing elements disposed within apertures of the contact surface, the biasing elements configured to apply a biasing force against the floating base such that the floating base is suspended above the contact surface of the socket body in the free state.
The assembly of claim 16, wherein the spring probes include a biasing element disposed within the spring probe, and wherein the spring probes extend beyond the contact surface of the socket body in the free state.