WO2024103570A1 - 光模块 - Google Patents

光模块 Download PDF

Info

Publication number
WO2024103570A1
WO2024103570A1 PCT/CN2023/079275 CN2023079275W WO2024103570A1 WO 2024103570 A1 WO2024103570 A1 WO 2024103570A1 CN 2023079275 W CN2023079275 W CN 2023079275W WO 2024103570 A1 WO2024103570 A1 WO 2024103570A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
polarization
coherent
optical fiber
local oscillator
Prior art date
Application number
PCT/CN2023/079275
Other languages
English (en)
French (fr)
Inventor
赵其圣
隋少帅
陈思涛
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202223076811.9U external-priority patent/CN218995729U/zh
Priority claimed from CN202211449403.5A external-priority patent/CN115712179A/zh
Priority claimed from CN202211449378.0A external-priority patent/CN115728884A/zh
Priority claimed from CN202211449404.XA external-priority patent/CN115728885A/zh
Priority claimed from CN202223076812.3U external-priority patent/CN218866167U/zh
Priority claimed from CN202223073672.4U external-priority patent/CN218728198U/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2024103570A1 publication Critical patent/WO2024103570A1/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/27—Optical coupling means with polarisation selective and adjusting means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/61—Coherent receivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q11/00—Selecting arrangements for multiplex systems

Definitions

  • the present disclosure relates to the field of optical communication technology, and in particular to an optical module.
  • optical communication technology is used in new services and application models such as cloud computing, mobile Internet, and video.
  • optical modules are tools for converting photoelectric signals into each other. They are one of the key components in optical communication equipment.
  • optical modules which are at the core of optical communication, have made great progress.
  • the present disclosure provides an optical module, characterized in that it includes: a light source configured to emit local oscillator light without a signal.
  • a local oscillator optical fiber one end of which is connected to the light source, and the other end of which is connected to the optical fiber connector.
  • a coherent optical chip coupled and connected to the optical fiber connector, includes: a receiving optical fiber coupling port, which receives the received signal light; a local oscillator optical fiber coupling port, which receives the local oscillator light; a polarization rotation beam splitter, which is arranged on one side of the receiving optical fiber coupling port, and is configured to divide the received signal light into a first received signal light and a second received signal light according to different deflection angles; a receiving coupling power monitor, which is arranged between the two light outlets of the polarization rotation beam splitter, and is configured to monitor the coupled optical power of the receiving optical fiber coupling port; a transmitting optical fiber coupling port; a connection between the beam combining port of the polarization rotation combiner and the transmitting optical fiber coupling port; a transmitting coupling power monitor, which is arranged between the first port and the second port of the polarization rotation combiner, and is configured to monitor the coupled optical power of the transmitting optical fiber coupling port; an MCU is arranged on the circuit board, and
  • FIG1 is a connection diagram of an optical communication system provided according to some embodiments of the present disclosure.
  • FIG2 is a structural diagram of an optical network terminal provided according to some embodiments of the present disclosure.
  • FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • FIG4 is an exploded structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • FIG5 is a structural diagram of an optical module without a housing and an unlocking component according to some embodiments of the present disclosure
  • FIG6 is a structural diagram of a fiber optic adapter, a light source, coherent components, and a circuit board according to some embodiments of the present disclosure
  • FIG7 is an exploded structural diagram of an optical module without a housing and an unlocking component according to some embodiments of the present disclosure
  • FIG8 is a structural diagram of a coherent component provided according to some embodiments of the present disclosure.
  • FIG9 is a schematic diagram of a coherent component decomposition according to some embodiments of the present disclosure.
  • FIG10 is a schematic diagram of a carrier structure provided according to some embodiments of the present disclosure.
  • FIG11 is a structural schematic diagram 1 of a cover shell provided according to some embodiments of the present disclosure.
  • FIG12 is a second structural schematic diagram of a cover shell provided according to some embodiments of the present disclosure.
  • FIG13 is a cross-sectional schematic diagram of the connection between an optical fiber connector and a coherent component according to some embodiments of the present disclosure
  • FIG14 is a first structural diagram of an optical fiber fixing member provided according to some embodiments of the present disclosure.
  • FIG15 is a second structural schematic diagram of an optical fiber fixing member provided according to some embodiments of the present disclosure.
  • FIG16 is a schematic diagram of the structure of a coherent optical chip provided according to some embodiments of the present disclosure.
  • FIG17 is a second structural schematic diagram of a coherent optical chip provided according to some embodiments of the present disclosure.
  • FIG18 is a coherent optical chip surface ball planting layout provided according to some embodiments of the present disclosure.
  • FIG19 is a third schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure.
  • FIG20 is a fourth schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure.
  • FIG21 is a fifth structural diagram of a coherent optical chip provided according to some embodiments of the present disclosure.
  • FIG22 is a schematic diagram of the structure of an unbalanced optical splitter provided according to some embodiments of the present disclosure.
  • FIG23 is a sixth schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure.
  • FIG. 24 is a seventh schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure.
  • light signals are used to carry information to be transmitted, and the light signals carrying information are transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since light has passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost and low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion between electrical signals and optical signals.
  • Optical modules realize the above-mentioned mutual conversion function between optical signals and electrical signals in the field of optical communication technology.
  • Optical modules include optical ports and electrical ports.
  • the optical modules realize optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical ports, and realize electrical connection with optical network terminals (for example, optical modems) through the electrical ports.
  • the electrical connection is mainly configured for power supply, I2C signal transmission, data information transmission, and grounding.
  • the optical network terminal transmits electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology.
  • FIG1 is a connection diagram of an optical communication system according to some embodiments of the present disclosure.
  • the optical communication system includes a remote server 1000 , a local information processing device 2000 , an optical network terminal 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .
  • the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200.
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if a repeater is used, infinite distance transmission can be achieved in theory. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 can be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, etc.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100.
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to access the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a dual
  • the electrical port is configured to be connected to the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100.
  • the optical module 200 realizes the mutual conversion between optical signals and electrical signals, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101. Since the optical module 200 is a tool for realizing the mutual conversion between optical signals and electrical signals.
  • the optical network terminal 100 includes a roughly rectangular housing, and an optical module interface 102 and a network cable interface 104 arranged on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the network cable 103.
  • the optical module 200 and the network cable 103 are connected through the optical network terminal 100.
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100, as the host computer of the optical module 200, can monitor the operation of the optical module 200.
  • the host computer of the optical module 200 can also include an optical line terminal (OLT) and the like.
  • OLT optical line terminal
  • the remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG2 is a structural diagram of an optical network terminal provided according to some embodiments of the present disclosure.
  • FIG2 only shows the structure of the optical network terminal 100 related to the optical module 200.
  • the optical network terminal 100 also includes a circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106.
  • the electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protrusion such as a fin to increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the cage 106 fixes the optical module 200.
  • the heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107.
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection.
  • the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.
  • FIG. 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • FIG. 4 is a decomposed structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • FIG. 5 is a structural diagram of an optical module provided according to some embodiments of the present disclosure with a housing and unlocking components removed.
  • FIG. 6 is a structural diagram of an optical fiber adapter, a light source, a coherent component, and a circuit board provided according to some embodiments of the present disclosure.
  • the optical module 200 includes a housing, a circuit board 300 disposed in the housing, an optical transceiver component, a coherent component 500, a DSP chip 600, and an optical fiber winding rack 700.
  • the shell comprises an upper shell 201 and a lower shell 202 .
  • the upper shell 201 covers the lower shell 202 to form the above shell with two openings.
  • the outer contour of the shell is generally a square body.
  • the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.
  • the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021;
  • the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.
  • the direction of the connection line of the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200.
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200.
  • the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the upper computer (for example, the optical network terminal 100); the opening 205 It is an optical port configured to be connected to the external optical fiber 101 so that the external optical fiber 101 is connected to the optical transceiver component inside the optical module 200 .
  • the upper housing 201 and the lower housing 202 are combined to facilitate installation of components such as the circuit board 300 and the optical transceiver component into the housing, and these components are packaged and protected by the upper housing 201 and the lower housing 202.
  • components such as the circuit board 300 and the light source 401
  • the upper shell 201 and the lower shell 202 are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component 203 located outside its housing, and the unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.
  • the unlocking component is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a snap-fit component that matches the cage of the host computer (for example, the cage 106 of the optical network terminal 100).
  • the snap-fit component of the unlocking component fixes the optical module 200 in the cage of the host computer;
  • the snap-fit component of the unlocking component moves accordingly, thereby changing the connection relationship between the snap-fit component and the host computer, so as to release the snap-fit relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage of the host computer.
  • the circuit board 300 includes circuit traces, electronic components and chips.
  • the electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding.
  • the electronic components include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET).
  • the chips include microcontroller units (MCU), laser driver chips, limiting amplifiers (limiting amplifiers), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; when the light source is located on the circuit board, the rigid circuit board can also provide stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • the circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106.
  • the gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in FIG. 4), or can be set on the upper and lower surfaces of the circuit board 300 to adapt to occasions where a large number of pins are required.
  • the gold finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules.
  • Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.
  • a flexible circuit board can be used to connect a rigid circuit board to a light source.
  • the circuit board 300 includes a first circuit board 301, a second circuit board 302 and a third circuit board 303.
  • the first circuit board 301 and the second circuit board 302 are both rigid circuit boards, and the third circuit board 303 is a flexible circuit board.
  • the second circuit board 302 is stacked and placed on one end of the first circuit board 301 close to the light source 401.
  • the second circuit board 302 is located between the first circuit board 301 and the upper shell 201.
  • the first circuit board 301 and the second circuit board 302 are connected through the third circuit board 303.
  • the optical transceiver component 400 includes a light source 401, which is connected to the second circuit board 302 and is configured to emit a preset specific wavelength light beam.
  • the light source 401 includes a semiconductor gain chip and a silicon photonic chip.
  • the semiconductor gain chip emits a light beam in a wavelength range.
  • the silicon photonic chip selects a specific wavelength light beam from the light beam in a wavelength range.
  • the silicon photonic chip and the semiconductor gain chip form a resonant cavity.
  • the specific wavelength light beam is reflected back and forth between the silicon photonic chip and the semiconductor gain chip, so that the specific wavelength light beam is stably output by the semiconductor gain chip.
  • the optical module further includes a transmitting optical fiber adapter 800 and a receiving optical fiber adapter 801.
  • the transmitting optical fiber adapter 800 is configured to transmit a high-speed optical signal
  • the receiving optical fiber adapter 801 is configured to receive a high-speed optical signal.
  • the coherent component 500 is placed on the circuit board and is configured to realize high-speed photoelectric signal conversion.
  • the coherent component 500 includes an optical transmission interface, an optical receiving interface and a local oscillator optical interface.
  • the optical transmission interface extends from a first optical fiber
  • the optical receiving interface extends from a second optical fiber
  • the local oscillator optical interface extends from a second optical fiber.
  • the local oscillator interface extends out of the third optical fiber
  • the optical transmission interface is connected to the transmission optical fiber adapter 800
  • the optical receiving interface is connected to the receiving optical fiber adapter 801
  • the local oscillator interface is connected to the light source 401.
  • the coherent component is connected to the transmission optical fiber adapter, the receiving optical fiber adapter and the light source 401 through the optical transmission interface, the optical receiving interface and the local oscillator interface, respectively, and the coherent component 500 is also connected to the DSP chip 600.
  • the narrow line width and high power laser emitted by the light source 401 is input into the coherent component 500 through the local oscillator optical interface, and the laser is split inside the coherent component 500, one of which is used as the emission beam and enters the coherent modulator inside the coherent component, and realizes the electro-optical signal conversion under the high-speed electrical signal drive of the DSP chip 600, and the converted high-speed optical signal is output from the optical transmission interface of the module; the other beam is used as the local oscillator beam, and is coherently demodulated with the high-speed optical signal input into the coherent component 500 from the optical receiving port of the module, and the demodulated electrical signal enters the DSP chip 600 for signal processing, thereby completing the optical-electrical signal conversion.
  • the narrow line width and high power laser are beams of specific wavelengths.
  • the light source 401 also includes an internal optical fiber adapter, the internal optical fiber adapter extends a first optical fiber, the local oscillator optical interface extends a local oscillator optical fiber, the first optical fiber is fused and connected to the local oscillator optical interface, so that the internal optical fiber adapter is connected to the local oscillator optical interface.
  • the transmitting optical fiber adapter 800 extends a second optical fiber, the optical transmission interface extends the transmitting optical fiber, the second optical fiber is fused and connected to the transmitting optical fiber, so that the transmitting optical fiber adapter 800 is connected to the optical transmission interface.
  • the receiving optical fiber adapter 801 extends a third optical fiber, the optical receiving interface extends the receiving optical fiber, the third optical fiber is fused and connected to the receiving optical fiber, so that the receiving optical fiber adapter 801 is connected to the optical receiving interface.
  • connection point of the first optical fiber and the local oscillator optical fiber fusion connection is located near the internal optical fiber adapter, the connection point of the second optical fiber and the transmitting optical fiber fusion connection is located near the transmitting optical fiber adapter 800, and the connection point of the third optical fiber and the receiving optical fiber fusion connection is located near the receiving optical fiber adapter 801, the lengths of the first optical fiber, the local oscillator optical fiber, the transmitting optical fiber and the receiving optical fiber are relatively long.
  • the optical fiber winding frame 700 is configured to fix the optical fiber. Since the circuit board 300 is provided with high-frequency signal lines and many devices, the optical fiber cannot be directly laid on the surface of the circuit board 300. Since the first optical fiber, the local oscillator optical fiber, the transmitting optical fiber and the receiving optical fiber are long, in order to prevent the upper shell from damaging the first optical fiber, the local oscillator optical fiber, the transmitting optical fiber and the receiving optical fiber, an optical fiber winding frame 700 for fixing the optical fiber is provided between the coherent component 500 and the upper shell 201.
  • the first optical fiber, local oscillator optical fiber, transmitting optical fiber and receiving optical fiber are all neatly fixed on the optical fiber winding frame 700, which not only avoids the upper shell from damaging the first optical fiber, local oscillator optical fiber, transmitting optical fiber and receiving optical fiber, but also avoids the signal crosstalk problem caused by directly laying the optical fiber on the surface of the circuit board 300.
  • optical modules are rapidly increasing, such as 200G/400G high-speed optical modules.
  • the optical module provided in the embodiment of the present disclosure is a coherent optical module, and further a silicon photonic coherent optical module; the coherent optical module is an optical module that uses coherent modulation at the transmitting end and uses coherent technology for detection at the receiving end.
  • frequency or phase modulation can also be performed by external modulation, such as quadrature amplitude modulation (QAM).
  • external modulation is used at the transmitting end, and a quadrature modulator based on a Mach-Zehnder modulator (MZM) is used to achieve high-order modulation, modulate the signal onto an optical carrier, and thus generate light carrying the signal and transmit it.
  • MZM Mach-Zehnder modulator
  • the silicon photonic chip has a Mach-Zehnder modulator inside to achieve power and phase modulation.
  • the Mach-Zehnder modulator modulation adopts the principle of interference of light of the same wavelength.
  • a Mach-Zehnder modulator is provided with two interference arms.
  • a single interference arm inputs a beam of light.
  • a total of two beams of light of the same wavelength need to be provided to a Mach-Zehnder modulator. After modulation by the Mach-Zehnder modulator, the light on the interference arm will merge into one beam of light.
  • a beam of light with a single wavelength can be provided to the silicon photonic chip, and the beam splitting waveguide inside the silicon photonic chip can split the beam of light with a single wavelength into two beams of light with the same wavelength, which are respectively input into the two interference arms of the Mach-Zehnder modulator.
  • two beams of light with the same wavelength can be provided to the silicon photonic chip, and the two beams of light with the same wavelength are directly input into the two interference arms of the Mach-Zehnder modulator. Since the Mach-Zehnder modulator eventually merges the light on each interference arm, two beams of light can be provided to the silicon photonic chip under the premise of using a single chip with the same optical power.
  • the light solution can provide higher optical power than the solution that provides a beam of light.
  • the local oscillator light is mixed with the received external optical signal in the optical mixer to obtain a difference frequency signal whose frequency, phase and amplitude change in the same way as the external optical signal; the magnitude of the output photocurrent after coherent mixing is proportional to the product of the power of the external optical signal and the power of the local oscillator light signal. Since the power of the local oscillator light is greater than the power of the external optical signal, the output photocurrent after coherent mixing increases significantly, and the detection sensitivity is thereby improved. Therefore, it can be concluded that in an incoherent optical module, many amplifiers are used during the transmission process to continuously relay and amplify the signal, while in a coherent optical module, the weak arrival signal is directly mixed and amplified at the receiving end.
  • digital signal processing technology is used in the embodiments of the present invention to counteract and compensate for distortion and reduce the impact of distortion on the system bit error rate.
  • Digital signal processing technology can perform various signal compensation processes, such as chromatic dispersion compensation and polarization mode dispersion compensation.
  • Figure 8 is a coherent component provided according to some embodiments of the present disclosure
  • Figure 9 is a decomposed schematic diagram of a coherent component provided according to some embodiments of the present disclosure.
  • the coherent component 500 generally includes a cover shell 501 and a carrier plate 502, and the cover shell 501 is buckled on the carrier plate 502 to form a coherent shell with an opening; the outer contour of the shell can present a cube structure or a rectangular structure.
  • the side of the carrier 502 is provided with a first U-shaped groove 5021, and the first U-shaped groove 5021 is located at the opening of the relevant shell.
  • a mounting groove 5013 is provided on one side of the cover shell 501, and the position of the mounting groove 5013 corresponds to the position of the first U-shaped groove 5012.
  • the cover shell 501 is provided with a first limiting portion and a second limiting portion, and the first limiting portion and the second limiting portion are configured as the mounting limit of the carrier 502 and the shell.
  • the first limiting portion and the second limiting portion are respectively arranged on both sides of the mounting groove.
  • the lower surface of the first limiting portion is set lower than the upper surface of the carrier 502, and the lower surface of the second limiting portion is set lower than the upper surface of the carrier 502.
  • the first limiting portion and the second limiting portion are placed against the side wall of the carrier 502 to achieve the limit in the length direction.
  • the first U-shaped groove 5021 is also called the carrier groove.
  • the opening of the coherent housing is arranged toward the wavelength tunable optical component, and an optical fiber connector is arranged at the opening, and an optical fiber array is arranged at the optical fiber connector, wherein the optical fiber array includes a local oscillator optical fiber, a receiving optical fiber and a transmitting optical fiber.
  • One end of the optical fiber connector extends into the opening.
  • One end of the local oscillator optical fiber is connected to the wavelength tunable optical component to receive the local oscillator light.
  • the receiving optical fiber is connected to the receiving adapter, and the receiving optical fiber is configured to receive the receiving signal light sent from the outside to the inside of the optical module.
  • the transmitting optical fiber is connected to the transmitting adapter, and the transmitting optical fiber is configured to send out the modulated transmitting signal light.
  • the optical fiber fixing member 503 is fixedly connected to the optical fiber connector, and the optical fiber fixing member 503 is fixedly connected to the cover shell.
  • the optical fiber fixing member 503 fixes the optical fiber connector and the cover shell together.
  • FIG10 is a schematic diagram of a carrier structure provided according to some embodiments of the present disclosure.
  • a coherent optical chip 510 is carried on the carrier 502, and is configured to modulate and demodulate optical signals.
  • An optical port is arranged on the side of the coherent optical chip 510, and the end face of the optical port is coupled and connected with the end face of the optical fiber connector.
  • a first electrical chip 520 is arranged on the surface of the carrier 502, the first electrical chip 520 is located on the side of the coherent optical chip, and the first electrical chip 520 is electrically connected to the coherent optical chip.
  • a second electrical chip 530 is arranged on the surface of the carrier 502, the second electrical chip 530 is arranged on the side of the coherent optical chip, and the second electrical chip 530 is electrically connected to the coherent optical chip.
  • a third electrical chip 540 is arranged on the surface of the carrier 502, the third electrical chip 540 is arranged on the side of the coherent optical chip, and the third electrical chip 540 is electrically connected to the coherent optical chip.
  • the first electrical chip 520 is a coherent emission driver chip, and the first electrical chip 520 is located on the opposite side of the optical port of the coherent optical chip.
  • the first electrical chip 520 is configured to realize the driving of the coherent modulator in the coherent optical chip.
  • the second electrical chip 530 is a first receiving amplifier chip, and the second electrical chip 530 is located on the adjacent side of the coherent emission driver chip, close to the coherent optical chip.
  • the second electrical chip 530 is configured to amplify the received electrical signal.
  • the third electrical chip 540 is a second receiving amplifier chip, and the third electrical chip 540 is located on the adjacent side of the coherent emission driver chip, close to the coherent optical chip.
  • the third electrical chip 540 is configured to amplify the received electrical signal.
  • the carrier board 502 also carries a plurality of power supply circuits, which are configured to supply power to the balanced receiver, power monitor, and transmission optical attenuator inside the coherent optical chip, and the specific electrical components are set according to the setting of the functional pins of the coherent optical chip.
  • the carrier board 502 is a high-speed carrier board 502, and is electrically connected to the circuit board by setting a conductive area on the side or the bottom surface.
  • the carrier board 502 Since the optoelectronic chips on the surface of the carrier board 502 have a certain height and weight, and the optoelectronic chips are distributed relatively concentratedly, the carrier board 502
  • the center of gravity of the cover 501 is not near its geometric center of gravity, and the center of gravity of the carrier 502 is near the coherent optical chip.
  • the center of gravity of the cover 501 is set to be symmetrical to the center of gravity of the carrier 502.
  • FIG. 11 is a structural schematic diagram 1 of a cover shell provided according to some embodiments of the present disclosure
  • FIG. 12 is a structural schematic diagram 2 of a cover shell provided according to some embodiments of the present disclosure
  • FIG. 11 and FIG. 12 are structural schematic diagrams of the cover shell 501 at different angles.
  • the cover shell 501 is a rectangular structure.
  • a mounting groove 5013 is provided on one side of the cover shell 501.
  • the position of the mounting groove 5013 corresponds to the position of the first U-shaped groove.
  • the cover shell 501 is provided with a first limiting portion 5011 and a second limiting portion 5012.
  • the first limiting portion 5011 and the second limiting portion 5012 are configured as installation limits for the carrier plate 502 and the shell.
  • the first limiting portion 5011 and the second limiting portion 5012 are respectively provided on both sides of the mounting groove 5013.
  • the lower surfaces of the first limit part 5011 and the second limit part 5012 are set lower than the upper surface of the carrier 502.
  • the first limit part 5011 and the second limit part 5012 can be placed against the side wall of the carrier 502 to achieve the limit in the length direction.
  • the cover shell 501 is provided with a related installation protrusion protruding from the upper surface of the cover shell 501.
  • the related installation protrusion is set along the shape of the installation groove, and the related installation protrusion is configured to be connected with the cover shell 501 and the extension part.
  • a carrier plate 50111 is provided around the installation groove, and its upper surface is connected to the lower surface of the extension part.
  • the carrier plate 50111 is configured to limit the upper and lower directions of the optical fiber fixing member on the cover shell 501.
  • the upper surface of the extension part is flush with the upper surface of the coherent installation protrusion 5016.
  • the side wall of the coherent mounting protrusion is abutted against the side wall of the extension part to limit the extension part in the horizontal direction, thereby achieving coupling limitation of the optical fiber array and the coherent optical chip.
  • the bearing plate 50111 is provided with a mounting position limiting part, which includes: a first mounting position limiting part 5014 and a second mounting position limiting part 5015.
  • the first mounting position limiting part 5014 is protruded from the upper surface of the bearing plate
  • the second mounting position limiting part 5015 is protruded from the upper surface of the bearing plate.
  • the upper surface of the first mounting position limiting part 5014 and the second mounting position limiting part 5015 are flush with the upper surface of the coherent mounting protrusion 5016.
  • the first installation limit portion 5014 and the second installation limit portion 5015 can be symmetrically arranged or asymmetrically arranged.
  • the first installation limit portion 5014 and the second installation limit portion 5015 are symmetrically arranged.
  • the first installation limit portion 5014 and the second installation limit portion 5015 can be semicircularly arranged, or triangularly arranged or arranged in other geometric shapes.
  • a support arm is disposed on the lower surface of the cover shell 501 .
  • the support arm is located around the lower surface of the cover shell 501 , and the support arm is connected to the carrier board.
  • the lower surface of the cover shell 501 is provided with cover shell protrusions with different heights to adapt to the structure of the optoelectronic device on the carrier 502.
  • the cover shell 501 is provided with a connecting portion, which is connected to the upper surface of the carrier 502, and the connecting portion is protruding from the lower surface of the cover shell 501.
  • the lower surface of the cover shell 501 is provided with a first protruding platform 5018 and a second protruding platform 5017 with different heights. Among them, the first protruding platform 5018 is protruding from the lower surface of the cover shell 501, and the first protruding platform 5018 corresponds to the position of the first electric chip, the second electric chip and the third electric chip.
  • the lower surface of the first protruding platform 5018 is higher than the lower surface of the second protruding platform, and the lower surface of the second protruding platform 5017 is higher than the connecting portion.
  • the first protruding platform 5018 includes a first sub-platform 50181 and a second sub-platform 50182, and the first sub-platform 50181 is arranged above the first electric chip 520, and the projection of the first sub-platform 50181 on the carrier 502 covers the first electric chip 520.
  • the second sub-platform 50182 is disposed above the second electrical chip 530 and the third electrical chip 540, and the projection of the second sub-platform 50182 on the carrier 502 covers the second electrical chip 530 and the third electrical chip 540.
  • the bottom surface of the cover 501 covers the coherent optical chip.
  • the second raised platform 5017 covers other electrical components on the carrier 502.
  • the second raised platform 5017 is arranged at the edge of the first raised platform 5018 and is located between the first raised platform 5018 and the connection portion.
  • the second raised platform 5017 is also provided with a raised connection portion 5019, which is located at the corner farthest from the coherent optical chip.
  • the raised connection portion 5019 is connected to the carrier 502 through a conductive silver glue, so that the heat on the carrier 502 can be dissipated through the raised connection portion and the cover 501.
  • the first raised platform 5018 and the second raised platform 5017 are arranged at diagonal positions of the coherent optical chip. Since the thickness of the first raised platform 5018 and the second raised platform 5017 is higher than the thickness of the bottom surface of the cover shell 501, the center of gravity of the cover shell 501 is located near the bottom surface of the cover shell 501. The second raised platform 5017 is located near the cover shell 501. After the cover shell 501 and the carrier plate 502 are covered, the center of gravity of the coherent component 500 is as close to the geometric center as possible to ensure the stability of the coherent component 500.
  • FIG13 is a schematic diagram of connecting an optical fiber connector and a coherent component according to some embodiments of the present disclosure.
  • a coherent connection plate 550 is connected between a coherent optical chip 510 and an optical fiber connector 504.
  • the coherent connection plate 550 is configured to fix the coherent optical chip and the optical fiber connector.
  • the optical fiber adapter is connected to the optical fiber inside the optical fiber connector.
  • the central axis of the optical fiber array and the central axis of the optical port of the coherent optical chip are at an angle of 6° to 8° to reduce the reflection of light at the connection between the end face of the optical fiber connector and the end face of the coherent optical chip.
  • the optical fiber connector 504 is arranged in a rectangular parallelepiped, and a coherent connection plate 550 is arranged above the optical fiber connector 504.
  • the coherent connection plate 550 is connected between the coherent optical chip and the optical fiber connector.
  • a colloid is arranged on the lower surface of the coherent connection plate 550, and the colloid connects and fixes the coherent connection plate 550 to the optical fiber connector and the coherent connection plate 550 to the coherent optical chip.
  • a pigtail sleeve 5041 is also provided in the present disclosure, which is sleeved on the outside of the optical fiber array.
  • the optical fiber fixing part is provided on the outside of the optical fiber connector and is fixedly connected to the pigtail sleeve.
  • the upper surface of the pigtail sleeve 5041 is provided with a double-sided adhesive material or glue material, which is connected to the optical fiber fixing part.
  • the pigtail sleeve is a square tube body with a through hole, the optical fiber array passes through one end of the square tube body, the optical fiber connector abuts against the end of the square tube body, and the optical fiber array and the pigtail sleeve are filled with colloid for connection.
  • FIG. 14 is a structural schematic diagram of an optical fiber fixing member provided according to some embodiments of the present disclosure.
  • FIG. 15 is a structural schematic diagram of an optical fiber fixing member provided according to some embodiments of the present disclosure. As shown in FIG. 14 and FIG. 15, the optical fiber fixing member is shown from different angles.
  • the optical fiber fixing member has the same thickness and is die-cast from a plate.
  • the optical fiber fixing member includes: a fixed base plate 5031 and a first optical fiber side plate 5032 and a second optical fiber side plate 5033 arranged on both sides of the fixed base plate.
  • the fixed base plate 5031 includes a first fixed base plate 50311 and a second fixed base plate 50312 with different heights, and the upper surface of the second fixed base plate 50312 is arranged higher than the upper surface of the first fixed base plate.
  • the pigtail sleeve 5041 is arranged in the space enclosed by the first fixed base plate and the first optical fiber side plate and the second optical fiber side plate.
  • the coherent connection plate 550 is arranged on the upper surface of the coherent optical chip and the optical fiber connector, so that the upper surface of the coherent connection plate 550 is higher than the upper surface of the optical fiber connector, and the upper surface of the coherent connection plate 550 is connected to the second fixed base plate 50312.
  • the first fixed base plate and the second fixed base plate 50312 of different heights are configured to be set to adapt to the height of the coherent connection plate 550.
  • the upper surface of the pigtail sleeve is connected to the lower surface of the first fixed bottom plate, and the side surface thereof is connected to the first optical fiber side plate and the second optical fiber side plate.
  • An extension part 50313 is provided on one side of the second fixed bottom plate 50312, and its width is greater than that of the fixed bottom plate.
  • a first extension limit groove 503131 and a second extension limit groove 503132 are provided on the side of the extension part 50313, which are limited by the corresponding structure on the upper surface of the cover shell 501 to facilitate the connection and fixation between the optical fiber fixing part and the cover shell 501.
  • a plurality of glue dispensing grooves 5034 are also provided on the side of the extension part 50313. After the extension part 50313 and the cover shell 501 are positioned, liquid glue is dispensed into the glue dispensing grooves to achieve the connection between the extension part 50313 and the cover shell 501.
  • the glue dispensing groove has the same shape as the first extension limiting groove and the second extension limiting groove.
  • the first extension limiting groove 503131 is matched and connected with the first installation limiting portion 5014
  • the second extension limiting groove 503132 is matched and connected with the second installation limiting portion 5015 .
  • the coherent optical chip is first installed and connected to the carrier board 502, the pigtail sleeve 5041 is connected to the optical fiber array, and the optical port of the coherent optical chip protrudes from the first U-shaped groove of the carrier board 502. Then the coherent connecting plate 550 is bridged over the optical fiber connector and the coherent optical chip to achieve the coupling connection between the optical fiber connector and the coherent optical chip. Then the cover shell 501 is connected to the edge of the carrier board 502. During the installation process, the first limiting portion and the second limiting portion are against the side of the carrier board 502, the connecting portion of the cover shell 501 is connected to the carrier board 502, and the protruding connecting portion is connected to the edge of the carrier board 502.
  • the first fixing base plate of the optical fiber fixing part is connected to the pigtail sleeve 5041, and the second fixing base plate 50312 is connected to the coherent connecting plate 550.
  • the connecting plate 550 is connected, and the extension part 50313 is connected to the bearing plate 502 on the upper surface of the cover shell 501.
  • the optical fiber connector is fixedly connected to the optical fiber fixing member through the pigtail sleeve 5041 and the coherent connecting plate 550.
  • the force is dispersed and transferred through the connection, which reduces the force on the optical fiber connector, improves the connection stability of the optical fiber connector and the coherent optical chip, and avoids the optical coupling accuracy.
  • the optical fiber array and the coherent optical chip are connected by a glass bridge and connected using soft glue, which has strong maintainability and is conducive to production and manufacturing.
  • the upper shell is divided into two parts: the optical fiber fixing part is die-cast, and the cover shell 501 is a sheet metal part.
  • the overall thickness of the product is only 2.42mm, which meets the packaging requirements of the SFP-DD optical module.
  • a pigtail sleeve 5041 is designed on the outside of the optical fiber array. When in use, it is fixed to the optical fiber fixing part with glue, and the optical fiber fixing part is fixed to the cover shell 501 with glue to protect the optical end face of the optical fiber array and the coherent optical chip from external forces.
  • a plurality of grooves are designed on both sides of the bonding part of the metal cover shell 501 and the optical fiber fixing part. The grooves are configured for glue fixing to improve the connection stability.
  • the coherent modulator is a dual-polarization coherent modulator
  • the emitted signal light is a coupled light beam of signal light with different polarization directions
  • the received signal light includes two groups of signal light with different polarization directions, thereby realizing single-channel multi-signal transmission.
  • FIG16 is a schematic diagram of the structure of a coherent optical chip provided according to some embodiments of the present disclosure.
  • the layout scheme of a high-speed coherent optical chip proposed in the present disclosure adopts silicon photonic integration technology, and integrates dual-polarization coherent transmission and reception functions in a single chip.
  • the fiber coupling port includes three fiber coupling ports, which are, from top to bottom, a receiving fiber coupling port 5111, a local oscillator fiber coupling port 5112, and a transmitting fiber coupling port 5113.
  • the local oscillator fiber coupling port 5112 is connected to an external local oscillator light source through a polarization-maintaining fiber.
  • the light of the external local oscillator light source After the light of the external local oscillator light source enters the chip, it is divided into two beams, one of which enters the dual-polarization coherent modulator as the transmitting light, and is output from the transmitting fiber coupling port 5113 after being loaded with an electro-optical signal and polarized by a polarization rotation beam combiner 5141; the other light is a local oscillator light, which is split again and enters the first polarization balanced receiver and the second polarization balanced receiver respectively, and is optically mixed with the light processed by the polarization rotation beam splitter coming from the receiving fiber coupling port 5111, thereby realizing signal demodulation processing.
  • a transmitting coupling power monitor and a receiving coupling power monitor are respectively integrated behind the polarization rotation beam splitter 5141 and the polarization rotation beam splitter for active coupling of the fiber array.
  • a small part of the two beams of light after passing through the polarization rotation beam splitter are respectively separated into the same receiving coupling power monitor for real-time monitoring of active coupling
  • a small part of the two beams of light after passing through the polarization rotation beam splitter 5141 are respectively separated into the same transmitting coupling power monitor for real-time monitoring of active coupling.
  • a polarization beam splitter can be integrated in front of the coupling power monitor to improve the polarization purity of the monitoring light, thereby improving the accuracy of active coupling monitoring.
  • a fiber coupling port is provided at the optical port of the coherent optical chip, and the fiber coupling port is coupled and connected with the optical fiber connector.
  • the fiber coupling port includes: a receiving fiber coupling port 5111, a local oscillator fiber coupling port 5112, and a transmitting fiber coupling port 5113.
  • a polarization-balanced receiver is connected to the receiving fiber coupling port 5111 and the local oscillator fiber coupling port 5112, and the polarization-balanced receiver is configured to convert the received signal light into a received electrical signal.
  • a dual-polarization coherent modulator is connected to the transmitting fiber coupling port 511 and the local oscillator fiber coupling port 5112, and the dual-polarization coherent modulator is configured to convert the transmitting electrical signal emitted by the DSP chip into an optical signal, and load the optical signal into the local oscillator light to form a transmitting signal light.
  • the receiving fiber coupling port 5111 is connected to the receiving fiber adapter, and the receiving fiber coupling port 5111 is configured to receive the signal light from the opposite end.
  • the signal light from the opposite end is called the receiving signal light
  • the receiving signal light is a coupled light beam of the first receiving signal light and the second receiving signal light with different polarization directions.
  • the polarization rotation beam splitter 5121 is connected to the fiber coupling port through an optical waveguide, and the polarization rotation beam splitter 5121 is configured to split the receiving signal light into the first receiving signal light and the second receiving signal light according to different polarization directions.
  • the local oscillator fiber coupling port 5112 receives the local oscillator light emitted by the wavelength tunable optical component, and splits the local oscillator light into the first sub-local oscillator light and the second sub-local oscillator light through the optical waveguide, wherein the first sub-local oscillator light is further divided into the first receiving local oscillator light and the second receiving local oscillator light.
  • the first received local oscillator light and the first received signal light are coupled into the first polarization balanced receiver 5123.
  • the first polarization balanced receiver 5123 converts the first received signal light into a first received electrical signal by mixing and balanced detection of the first received local oscillator light and the first received signal light. After being amplified by the first receiving amplifier chip, the first received electrical signal enters the DSP chip and is converted into a first received digital signal.
  • the second received local oscillator light is coupled with the second received signal light and enters the second polarization balanced receiver 5124.
  • the second polarization balanced receiver 5124 converts the second received signal light into a second received electrical signal by mixing and balanced detection of the second received local oscillator light and the second received signal light. After being amplified by the second receiving amplifier chip, the second received electrical signal enters the DSP chip and is converted into a second received digital signal.
  • the test light is connected outside the optical fiber coupling port, including the first test light, the second test light and the third test light.
  • the test light enters the coherent optical chip from the outside of the coherent optical chip.
  • the coherent optical chip is also provided with a receiving coupling power monitor 5122, which receives part of the light of the two light output paths of the polarization rotation beam splitter 5121 to monitor the coupling power.
  • the MCU is electrically connected to the receiving coupling power monitor 5122, receives the electrical signal of the receiving coupling power monitor 5122, calculates the optical power of the optical fiber coupling port according to the electrical signal of the receiving coupling power monitor 5122, and compares the optical power of the optical fiber coupling port with the optical power of the first test light to adjust the coupling accuracy of the receiving optical fiber receiving coupler and the receiving optical fiber.
  • the first test optical power threshold interval is set in the MCU. If the optical power of the optical fiber coupling port is not within the first test optical power threshold interval, it is necessary to adjust the coupling accuracy between the receiving optical fiber and the receiving optical fiber coupling port 5111.
  • the local oscillator fiber coupling port 5112 is disposed between the receiving fiber coupling port 5111 and the transmitting fiber coupling port 511 .
  • the node positions shown in FIG. 16 are to realize the splitting of part of the light, such as at node 5125, the optical waveguide between node 5125 and the first light outlet of the polarization rotation beam splitter 5121 is called the first waveguide, the optical waveguide between the receiving coupling power monitor 5122 and the node 5125 is called the second waveguide, and the optical waveguide between the first polarization balance receiver 5123 and the node 5125 is called the third waveguide.
  • a directional coupler is set at the node, and the receiving coupling power monitor 5122 is set between the node 5125 and the first polarization balance receiver 5123.
  • the receiving coupling power monitor 5122 is set between the node 5126 and the second polarization balance receiver 5124.
  • the dual-polarization coherent modulator 516 is connected to the transmitting fiber coupling port 511 and the local oscillator fiber coupling port 5112 through an optical waveguide.
  • the dual-polarization coherent modulator 516 is configured to convert the transmitting electrical signal emitted by the DSP chip into an optical signal, load it into the local oscillator light, and form a transmitting signal light.
  • a transmission coupling power monitor is provided between the two input ends of the polarization rotation combiner 5141 .
  • the test light is connected outside the optical fiber coupling port, including the first test light, the second test light and the third test light.
  • the test light enters the coherent optical chip from the outside of the coherent optical chip, wherein the first test light enters from the receiving optical fiber coupling port 5111, the second test light enters from the local oscillator optical fiber coupling port 5112, and the third test light is connected from the transmitting optical fiber coupling port 511.
  • the coherent optical chip is also provided with a transmitting coupling power monitor 5143, which transmits part of the light from the two input ends of the polarization rotation combiner 5141 to monitor the coupling power.
  • the MCU is electrically connected to the transmitting coupling power monitor 5143, receives the electrical signal of the transmitting coupling power monitor 5143, calculates the optical power of the transmitting optical fiber coupling port 511 according to the electrical signal of the transmitting coupling power monitor 5143, and compares the optical power of the optical fiber coupling port with the optical power of the third test light to adjust the coupling accuracy between the transmitting optical fiber receiving coupler and the transmitting optical fiber.
  • the second test optical power threshold interval is set in the MCU. If the optical power of the transmitting optical fiber coupling port 511 is not within the second test optical power threshold interval, the coupling accuracy between the transmitting optical fiber and the transmitting optical fiber coupling port 511 needs to be adjusted.
  • FIG17 is a second schematic diagram of the structure of a coherent optical chip provided according to some embodiments of the present disclosure.
  • a receiving coupling power monitor 5122 and a polarization rotation beam splitter 5121 are connected.
  • a first polarization beam splitter 5128 is disposed between the first light outlet of the polarization rotation beam splitter 5121 to prevent light that does not belong to the first polarization state from entering the receiving coupling power monitor 5122.
  • a second polarization beam splitter 5127 is disposed between the receiving coupling power monitor 5122 and the second light outlet of the polarization rotation beam splitter 5121 to prevent light that does not belong to the second polarization state from entering the receiving coupling power monitor 5122.
  • the test light including the first test light, the second test light and the third test light, is connected to the outside of the optical fiber coupling port. In this process, the test light enters the coherent optical chip from the outside of the coherent optical chip.
  • the first test light enters the coherent optical chip from the receiving optical fiber coupling port 5111, and receives part of the light from the two light output paths on the right side of the polarization rotation beam splitter 5121, forming a first sub-test light and a second sub-test light with different polarization directions, such as the first sub-test light is X-polarized light, and the second sub-test light is Y-polarized light, wherein the receiving polarization rotation beam splitter 5121 transmits the X-polarized light through the first path (above), and then part of it enters the first polarization balance receiver, and part of it enters the first polarization beam splitter 5128.
  • the first polarization beam splitter 5128 can allow the X-polarized light in the light beam transmitted to the first polarization beam splitter 5128 to pass through, and filter out the light in other directions.
  • the receiving polarization rotating beam splitter 5121 transmits the Y polarized light through the second path (below), and then part of it enters the second polarization balanced receiver and part of it enters the second polarization beam splitter.
  • the second polarization beam splitter allows the Y polarized light in the light beam transmitted to the second polarization beam splitter to pass through, and filters out the light in other directions.
  • the receiving coupling power monitor 5122 performs coupling power monitoring.
  • the MCU is electrically connected to the receiving coupling power monitor 5122, receives the electrical signal of the receiving coupling power monitor 5122, calculates the optical power of the optical fiber coupling port according to the electrical signal of the receiving coupling power monitor 5122, and compares the optical power of the optical fiber coupling port with the optical power of the first test light to adjust the coupling accuracy of the receiving optical fiber receiving coupler and the receiving optical fiber.
  • the first test optical power threshold interval is set in the MCU. If the optical power of the optical fiber coupling port is not within the first test optical power threshold interval, it is necessary to adjust the coupling accuracy of the receiving optical fiber and the receiving optical fiber coupling port 5111.
  • a first transmitting polarization beam splitter 5161 is provided between the transmitting coupling power monitor 5143 and the first input end of the polarization rotation beam combiner 5141 to prevent light that does not belong to the first polarization state from entering the receiving coupling power monitor 5122.
  • a second receiving polarization beam splitter 5162 is provided between the transmitting coupling power monitor 5143 and the second input end of the polarization rotation beam combiner 5141 to prevent light that does not belong to the second polarization state from entering the receiving coupling power monitor 5122.
  • the local oscillator fiber coupling port 5112 receives the local oscillator light emitted by the wavelength tunable optical component, and divides the local oscillator light into a first sub-local oscillator light and a second sub-local oscillator light through an optical waveguide, wherein the first sub-local oscillator light is further divided into a first received local oscillator light and a second received local oscillator light.
  • the second received local oscillator light is further divided into a first emitted light and a second emitted light, and enters two input ends of the dual-polarization coherent modulator 516 respectively.
  • the dual-polarization coherent modulator 516 has a first optical input end for receiving the first emission light and a second optical input end for receiving the second emission light, performs signal modulation on the first emission light and the second emission light respectively, and outputs the first emission signal light and the second emission signal light.
  • the polarization rotation beam combiner 5141 is connected to the first output end and the second output end of the dual-polarization coherent modulator 516, rotates the first emission signal light and the second emission signal light into light beams with polarization directions perpendicular to each other, and couples and outputs them as emission signal light.
  • the first emission light and the second emission light have the same polarization direction, and have different amplitudes and phases to load different signals.
  • the polarization rotation combiner 5141 deflects one of the first emission light or the second emission light, and after forming an angle of nearly 90° with the other light, merges them into a beam of emission signal light.
  • the polarization rotation combiner 5141 includes a first input end, a second input end, and an output end, wherein the first input end is connected to the first output end of the dual-polarization coherent modulator 516, the second input end is connected to the second output end of the dual-polarization coherent modulator 516, and the output end is connected to the emission fiber coupling port 511, and the emission signal light enters the emission fiber through the emission fiber coupling port 511.
  • the coherent optical chip is also provided with a first transmission optical attenuator 5144, which is arranged between the polarization rotation beam combiner 5141 and the first polarization coherent modulator 5142 to control the attenuation of the first transmission signal light.
  • a first optical attenuator power monitor 5145 is arranged at the second output end of the first transmission optical attenuator 5144, and the first output end of the first transmission optical attenuator 5144 is connected to the first input end of the transmission polarization rotation beam combiner 5141.
  • the MCU is electrically connected to the first optical attenuator power monitor 5145, and the MCU is electrically connected to the first optical attenuator power monitor 5145.
  • the data collected by the first optical attenuator power monitor 5145 controls the output voltage of the first transmitting optical attenuator 5144 .
  • a first transmission power monitor 5147 is provided between the second output port of the first transmission optical attenuator 5144 and the polarization rotation combiner 5141.
  • the first transmission power monitor 5147 is configured to monitor the optical power of the attenuated first transmission signal light.
  • the MCU is electrically connected to the first transmission power monitor 5147, and the host computer can read the optical power of the first transmission signal light stored in the MCU.
  • the coherent optical chip is also provided with a second transmission optical attenuator 5154, which is arranged between the polarization rotation beam combiner 5141 and the second polarization coherent modulator 5152 to perform attenuation control on the second transmission signal light.
  • a second optical attenuator power monitor 5155 is arranged at the second output end of the second transmission optical attenuator 5154, and the first output end of the second transmission optical attenuator 5154 is connected to the second input end of the transmission polarization rotation beam combiner 5141.
  • the MCU is electrically connected to the second optical attenuator power monitor 5155, and the output voltage of the second transmission optical attenuator 5154 is controlled by the data collected by the second optical attenuator power monitor 5155.
  • a second transmission power monitor 5157 is provided between the second transmission light attenuator 5154 and the polarization rotation beam combiner 5141.
  • the second transmission power monitor 5157 is configured to monitor the optical power of the attenuated second transmission signal light.
  • the MCU is electrically connected to the second transmission power monitor, and the host computer can read the optical power of the second transmission signal light stored in the MCU.
  • a first modulator power monitor 5146 is provided between the first transmission optical attenuator 5144 and the first polarization coherent modulator 5142.
  • the first modulator power monitor 5146 is configured to monitor the phase of the first transmission signal light.
  • the first modulator power monitor 5146 is connected to the MCU.
  • the MCU receives the monitoring data of the first modulator power monitor 5146 and performs phase modulation of the first transmission signal light.
  • a second modulator power monitor 5156 is provided between the second transmission optical attenuator 5154 and the second polarization coherent modulator 5152.
  • the second modulator power monitor 5156 is configured to monitor the phase of the second transmission signal light.
  • the second modulator power monitor 5156 is connected to the MCU.
  • the MCU receives the monitoring data of the second modulator power monitor 5156 and performs phase modulation of the second transmission signal light.
  • FIG18 is a layout of ball implantation on the surface of a coherent optical chip according to some embodiments of the present disclosure.
  • a dual-polarization coherent modulator conductive area 5171 and a fiber coupling port conductive area 5172 are respectively distributed on the upper and lower sides of the surface of the coherent optical chip
  • a first polarization balanced receiver conductive area 5173 and a second polarization balanced receiver conductive area 5174 are distributed on the left side of the coherent optical chip
  • other DC signal balls are distributed around the coherent optical chip to facilitate signal interconnection with an external electrical chip.
  • the middle part of the coherent optical chip is evenly filled with balls to improve the reliability and stability of the 2.5D flip-chip package. These filling balls have no actual function and can be grounded or disconnected.
  • the spacing between the implant ball around the fiber coupling port and the fiber coupling port is required to be greater than 0.5mm.
  • the fiber coupling port contains five coupling optical ports, from left to right, namely the receiving coupling optical port, the local oscillator coupling optical port and the transmitting coupling optical port.
  • the two optical ports on the right are loopback test optical ports, which are configured for coupling testing.
  • the fiber coupler uses silicon nitride material and direct slicing and dissociation to ensure the verticality of the end face of the fiber coupling port.
  • FIG. 19 is a schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure
  • FIG. 20 is a schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure. As shown in FIG. 19 and FIG.
  • the first local oscillator beam splitter 5131 its input end is connected to the local oscillator fiber coupling port, the first output end is connected to the first polarization coherent modulator 5412, and the second output end is connected to the input end of the second local oscillator beam splitter 5132; the first output end of the second local oscillator beam splitter 5132 is connected to the second polarization coherent modulator 5152, and the second output end is connected to the input end of the third local oscillator beam splitter 5133; the first output end of the third local oscillator beam splitter 5133 is connected to the first polarization balanced receiver, and the second output end is connected to the second polarization balanced receiver.
  • first local oscillator optical splitter whose input end is connected to the local oscillator fiber coupling port, the first output end is connected to the input end of the second local oscillator optical splitter, and the second output end is connected to the input end of the third local oscillator optical splitter; the first output end of the third local oscillator optical splitter is connected to the first polarization coherent modulator, and the second output end is connected to the first polarization coherent modulator; the first output end of the second local oscillator optical splitter is connected to the first polarization balanced receiver, and the second output end is connected to the second polarization balanced receiver. Vibration balanced receiver connections.
  • power splitters are used at the first local oscillator splitter 5131, the second local oscillator splitter 5132 and the third local oscillator splitter 51333 to divide the light into two equal beams as shown in Figure 18.
  • the light from the external local oscillator light source After the light from the external local oscillator light source enters the chip, it is split into two beams with optical powers of 50% and 50% respectively at the first local oscillator beam splitter 5131, one of which is used as the transmitted light and is equally divided into two beams at the fourth local oscillator beam splitter 5134, which enter the first polarization coherent modulator and the second polarization coherent modulator respectively, and are output from the transmitting fiber coupling port 5113 after being loaded with electro-optical signals and polarized by the polarization rotation beam splitter 5141; the other beam of light is used as the local oscillator light and is again split by the third local oscillator beam splitter 5133 to enter the first polarization balanced receiver 5123 and the second polarization balanced receiver 5124 respectively, and is optically mixed with the light coming from the receiving fiber coupling port 5111 and processed by the polarization rotation beam splitter 5121.
  • the light is divided into two beams with optical powers of 50% and 50% respectively.
  • One beam is used as the emission light and is equally divided into two beams at the fourth local oscillator splitter 5134, which enter the first polarization coherent modulator 5142 and the second polarization coherent modulator 5152 respectively. Therefore, the optical powers of the light entering the first polarization coherent modulator and the second polarization coherent modulator are the same.
  • a first transmission optical attenuator 5144 is also provided, which is arranged between the polarization rotation beam combiner 5141 and the first polarization coherent modulator 5142 to perform attenuation control on the first transmission signal light.
  • a first optical attenuator power monitor 5145 is provided at the second output end of the first transmission optical attenuator 5144, and the first output end of the first transmission optical attenuator 5144 is connected to the first input end of the transmission polarization rotation beam combiner 5141.
  • the MCU is electrically connected to the first optical attenuator power monitor 5145, and the output voltage of the first transmission optical attenuator 5144 is controlled by the data collected by the first optical attenuator power monitor 5145.
  • a first transmission power monitor 5147 is provided between the second output port of the first transmission optical attenuator 5144 and the polarization rotation beam combiner 5141.
  • the first transmission power monitor 5147 is configured to monitor the optical power of the attenuated first transmission signal light.
  • the MCU is electrically connected to the first transmission power monitor 5147, and the host computer can read the optical power of the first transmission signal light stored in the MCU.
  • the coherent optical chip is also provided with a second transmission optical attenuator 5154, which is arranged between the polarization rotation beam combiner 5141 and the second polarization coherent modulator 5152 to perform attenuation control on the second transmission signal light.
  • a second optical attenuator power monitor 5155 is arranged at the second output end of the second transmission optical attenuator 5154, and the first output end of the second transmission optical attenuator 5154 is connected to the second input end of the transmission polarization rotation beam combiner 5141.
  • the MCU is electrically connected to the second optical attenuator power monitor 5155, and the output voltage of the second transmission optical attenuator 5154 is controlled by the data collected by the second optical attenuator power monitor 5155.
  • a second transmission power monitor 5157 is provided between the second transmission light attenuator 5154 and the polarization rotation beam combiner 5141.
  • the second transmission power monitor 5157 is configured to monitor the optical power of the attenuated second transmission signal light.
  • the MCU is electrically connected to the second transmission power monitor, and the host computer can read the optical power of the second transmission signal light stored in the MCU.
  • the difference ratio of the optical power of the emitted light output by two polarization coherent modulators in different directions should be no more than 15%, that is, the difference between the first polarization coherent modulator and the second polarization coherent modulator is no more than 15% of the ratio of the first polarization coherent modulator; and the difference between the first polarization coherent modulator and the second polarization coherent modulator is no more than 15% of the ratio of the second polarization coherent modulator.
  • the MCU can control the attenuation value of the first optical attenuator or the second optical attenuator by monitoring the optical power of the first transmitted signal light and the optical power of the second transmitted signal light, so that the difference ratio between the first polarization coherent modulator and the second polarization coherent modulator is within a preset difference ratio range.
  • the present disclosure also provides another embodiment, in which the first local oscillator beam splitter 5131 and the fourth local oscillator beam splitter 5134 are adjustable beam splitters, and the magnitude of the emission light power can be controlled by controlling the splitting ratio of the output ends of the first local oscillator beam splitter and the third local oscillator beam splitter.
  • the difference ratio between the output light power of the first polarization coherent modulator and the output light power of the second polarization coherent modulator is controlled to be no more than 15%.
  • the insertion loss of the fiber coupling port and the polarization rotation combiner 5141 for light of different polarization states will be different.
  • the optical insertion loss of the fiber coupling port will also be affected by the chip processing technology, and in practical applications, the optical powers of two different polarizations emitted from the transmitting end are required to be balanced. Therefore, the present disclosure provides another schematic diagram of the coherent optical chip structure, in which the optical power of the higher-power polarization state is attenuated by an adjustable optical attenuator integrated on the coherent optical chip, thereby reducing the effective optical transmission power and affecting the chip yield.
  • FIG21 is a schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure.
  • the fiber coupler includes three fiber coupling ports, which are, from top to bottom, a receiving fiber coupling port 5111, a local oscillator fiber coupling port 5112, and a transmitting fiber coupling port 511.
  • the local oscillator fiber coupling port 5112 is connected to an external local oscillator light source through a polarization-maintaining fiber.
  • the first local oscillator beam splitter 5131 is an unbalanced beam splitter, the input end of which is connected to the local oscillator fiber coupling port 5112, the first output end is connected to the first polarization coherent modulator, and the second output end is connected to the input end of the second local oscillator beam splitter.
  • the first output end of the second local oscillator beam splitter 5132 is connected to the second polarization coherent modulator, and the second output end is connected to the input end of the third local oscillator beam splitter.
  • the first output end of the third local oscillator beam splitter 5133 is connected to the first polarization balanced receiver 5123, and the second output end is connected to the second polarization balanced receiver 5124.
  • the coherent optical chip After the light from the external local oscillator light source enters the coherent optical chip, it is divided into two beams by the unbalanced optical splitter, one of which enters the first polarization coherent modulator 5142 as the transmitting light, and is output from the transmitting fiber coupling port 5113 after being loaded with the electro-optical signal and polarized by the polarization rotation beam combiner 5141; the other light is divided into two beams by the second local oscillator optical splitter 5132 as the local oscillator light, one of which enters the second polarization coherent modulator 5152 as the transmitting light, and is output from the transmitting fiber coupling port 5111 and the transmitting fiber coupling port 5113 after being loaded with the electro-optical signal and polarized by the polarization rotation beam combiner 5141.
  • the other output port of the second local oscillator optical splitter 5132 is connected to the input end of the third local oscillator optical splitter 5133, and is divided into two beams by the third local oscillator optical splitter and enters the first polarization balanced receiver 5123 and the second polarization balanced receiver 5124 respectively, and is optically mixed with the light coming from the receiving fiber coupling port 5111 and processed by the polarization rotation beam splitter 5121, thereby realizing signal demodulation processing.
  • the splitting process is as follows: first, a certain proportion of the light is split by the unbalanced splitter and enters the first polarization coherent modulator (for example, 40%).
  • the splitting ratio can be designed differently according to the difference in the power of the first and second polarized emission lights.
  • the other 60% of the light enters the second local oscillator splitter 5132.
  • the second local oscillator splitter 5132 After the second local oscillator splitter 5132, it is evenly divided into two parts, one of which is connected to the second polarization coherent modulator 5152, and the other enters the third local oscillator splitter 5133.
  • different structures can be designed for the splitting ratio of the unbalanced optical splitter according to the difference in the output optical power of the first polarization coherent modulator and the second polarization coherent modulator, so that the power of the two polarized lights at the first angle and the second angle in the light beam emitted from the transmitting optical fiber coupling port 5113 is balanced, thereby increasing the effective optical transmission power.
  • the unbalanced optical splitter is usually designed with an optical splitter structure of an asymmetric waveguide structure.
  • the output end of the polarization rotation combiner 5141 is connected to the transmitting optical fiber coupling port 511 , the first input end is connected to the first polarization coherent modulator 5142 , and the second input end is connected to the second polarization coherent modulator 5152 .
  • the unbalanced optical splitter can adopt an optical splitter structure design of an asymmetric waveguide structure, or can utilize a device based on a Mach-Zehnder interference type structure, as shown in FIG19 .
  • a heater is integrated above the Mach-Zehnder interference type structure, and the splitting ratio of the unbalanced optical splitter can be changed by adjusting the heater.
  • the splitting ratio of the unbalanced optical splitter can be adjusted in real time according to the output optical power of the second polarization coherent modulator, so that the power of the two polarized lights in the light beam emitted from the emission coupling port is balanced, thereby increasing the effective optical emission power and improving the chip yield.
  • FIG22 is a schematic diagram of the structure of an unbalanced splitter provided according to some embodiments of the present disclosure.
  • the unbalanced splitter includes: a first sub-splitter component 51321, a modulation arm 51323, an interference arm 51324, and a second sub-splitter component 51322, wherein the input end of the first sub-splitter component is connected to the local oscillator fiber coupling port to divide the local oscillator light into two beams.
  • the first output end of the first sub-splitter component is connected to the modulation arm, and the second output end is connected to the interference arm.
  • the first input end of the second sub-splitter component is connected to the output end of the modulation arm, the second input end is connected to the output end of the interference arm, the first output end is connected to the input end of the second local oscillator splitter 5132, and the second output end is connected to the first biased optical fiber coupling port.
  • the MCU is electrically connected to the first modulation arm and the second modulation arm, and controls the temperature of the modulation arm by outputting a voltage to control the refractive index of the modulation arm, thereby realizing the light splitting of the two output ends of the unbalanced beam splitter.
  • FIG23 is a sixth schematic diagram of a coherent optical chip structure provided according to some embodiments of the present disclosure.
  • the coherent optical chip further includes: a first transmission optical attenuator 5144 is also provided in the coherent optical chip, which is provided between the polarization rotation beam combiner 5141 and the first polarization coherent modulator to perform attenuation control on the first transmission signal light.
  • a first optical attenuator power monitor 5145 is provided at the first output end of the first transmission optical attenuator 5144, and the first output end of the first transmission optical attenuator 5144 is connected to the first input end of the transmission polarization rotation beam combiner 5141.
  • the MCU is electrically connected to the first optical attenuator power monitor 5145, and the output voltage of the first transmission optical attenuator 5144 is controlled by the data collected by the first optical attenuator power monitor 5145.
  • FIG24 is a schematic diagram of a coherent optical chip structure according to some embodiments of the present disclosure.
  • a first transmission power monitor 5147 is provided between the first transmission optical attenuator 5144 and the polarization rotation beam combiner 5141 in the coherent optical chip.
  • the first transmission power monitor 5147 is configured to monitor the optical power of the attenuated first transmission signal light.
  • the MCU is electrically connected to the first transmission power monitor 5147, and the host computer can read the optical power of the first transmission signal light stored in the MCU.
  • a second transmitted power monitor is provided between the second transmitted optical attenuator and the polarization rotation combiner 5141, and the second transmitted power monitor is configured to monitor the optical power of the attenuated second transmitted signal light.
  • the MCU is electrically connected to the second transmitted power monitor, and the host computer can read the optical power of the second transmitted signal light stored in the MCU.
  • the splitting ratio of the unbalanced splitter is regulated based on the data collected by the second transmission power monitor 5157 and the first transmission power monitor 5147 .
  • the unbalanced optical splitter can also use a device based on a Mach-Zehnder interferometer structure.
  • a heater is integrated above the Mach-Zehnder interferometer structure, and the splitting ratio of the unbalanced optical splitter can be changed by adjusting the heater.
  • the splitting ratio of the unbalanced optical splitter can be adjusted in real time according to the output optical power of the second polarization coherent modulator, so that the power of the two polarized lights in the light beam emitted from the transmitting optical fiber coupling port 511 and the transmitting optical fiber coupling port 5115113 is balanced, thereby increasing the effective optical transmission power and improving the chip yield.
  • the input end of the unbalanced optical splitter is connected to the local oscillator fiber coupling port 5112, the first output end of the unbalanced optical splitter is connected to the first polarization coherent modulator, and the second output end of the unbalanced optical splitter is connected to the input end of the second local oscillator optical splitter.
  • the first output end of the second local oscillator optical splitter is connected to the second polarization coherent modulator, and the second output end of the second local oscillator optical splitter is connected to the input end of the third local oscillator optical splitter.
  • the first output end of the third local oscillator optical splitter is connected to the first polarization balanced receiver 5123, and the second output end of the third local oscillator optical splitter is connected to the second polarization balanced receiver 5124.
  • the second local oscillator optical splitter 5132 is an adjustable optical splitter, which can adjust the optical splitting of the adjustable optical splitter according to the difference in the output optical power of the first polarization coherent modulator and the second polarization coherent modulator.
  • the output optical power of the first polarization coherent modulator is greater than the output optical power of the second polarization coherent modulator, the light output ratio of the second output end of the adjustable optical splitter is increased, and the optical power of the second emitted light entering the second polarization coherent modulator increases, reducing the difference between the output optical power of the first polarization coherent modulator and the output optical power of the second polarization coherent modulator.
  • the light output ratio of the second output end of the adjustable optical splitter is reduced, so that the optical power of the second emitted light entering the second polarization coherent modulator is reduced, and the difference between the output optical power of the first polarization coherent modulator and the output optical power of the second polarization coherent modulator is reduced.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

本公开公开了一种光模块，包括：光源；本振光纤，一端与光源连接，另一端与光纤接头连接。相干光芯片，包括：接收光纤耦合端口、本振光纤耦合端口、发射光纤耦合端口。偏振旋转分束器被配置为将接收信号光分为第一接收信号光和第二接收信号光；接收耦合功率监控器，被配置为监控所述接收光纤耦合端口的耦合光功率。发射耦合功率监控器，被配置为监控发射光纤耦合端口的耦合光功率；电路板，设置有MCU，与接收耦合功率监控器、发射耦合功率监控器电连接。在安装耦合阶段，可通过读取MCU内的接收耦合功率监控器、发射耦合功率监控器的监控数据，得到光纤接头与相干光芯片的耦合精度，方便安装调节。

Description

光模块
本公开要求在2022年11月18日提交中国专利局、申请号202223073672.4的中国专利申请，在2022年11月18日提交中国专利局、申请号202223076812.3的中国专利申请；2022年11月18日提交中国专利局、申请号202223076811.9的中国专利申请，2022年11月18日提交中国专利局、申请号202211449403.5的中国专利申请，2022年11月18日提交中国专利局、申请号202211449404.X的中国专利申请和2022年11月18日提交中国专利局、申请号202211449378.0的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
在云计算、移动互联网、视频等新型业务和应用模式，均会用到光通信技术，而在光通信中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，并且随着5G网络的快速发展，处于光通信核心位置的光模块得到了长足的发展。
发明内容
本公开提供了一种光模块，其特征在于，包括：光源，被配置为发出不带信号的本振光。本振光纤，一端与光源连接，另一端与光纤接头连接。相干光芯片，与光纤接头耦合连接，包括：接收光纤耦合端口，接收接收信号光；本振光纤耦合端口，接收本振光；偏振旋转分束器，设置于接收光纤耦合端口的一侧，被配置为根据偏转角度的不同将接收信号光分为第一接收信号光和第二接收信号光；接收耦合功率监控器，设置于偏振旋转分束器的两个出光口之间，被配置为监控接收光纤耦合端口的耦合光功率；发射光纤耦合端口；偏振旋转合束器的合束端口与发射光纤耦合端口的连接；发射耦合功率监控器，设置于偏振旋转合束器的第一端口与第二端口之间，被配置为监控发射光纤耦合端口的耦合光功率；电路板上设置有MCU，与接收耦合功率监控器、发射耦合功率监控器电连接。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据本公开一些实施例提供的光通信系统的连接关系图；
图2为根据本公开一些实施例提供的光网络终端的结构图；
图3为根据本公开一些实施例提供的一种光模块结构图；
图4为根据本公开一些实施例提供的光模块分解结构图；
图5为根据本公开一些实施例提供的除去壳体和解锁部件的光模块结构图；
图6为根据本公开一些实施例提供的光纤适配器、光源、相干部件和电路板结构图；
图7为根据本公开一些实施例提供的除去壳体和解锁部件的光模块分解结构图；
图8为根据本公开一些实施例提供的一种相干部件结构图；
图9为根据本公开一些实施例提供的一种相干部件分解示意图；
图10为根据本公开一些实施例提供的一种载板结构示意图；
图11为根据本公开一些实施例提供的一种盖壳的结构示意图一；
图12为根据本公开一些实施例提供的一种盖壳的结构示意图二；
图13为根据本公开一些实施例提供的光纤接头与相干部件连接剖面示意图；
图14为根据本公开一些实施例提供的一种光纤固定件的结构示意图一；
图15为根据本公开一些实施例提供的光纤固定件的结构示意图二；
图16为根据本公开一些实施例提供的一种相干光芯片的结构示意图；
图17为根据本公开一些实施例提供的一种相干光芯片的结构示意图二；
图18为根据本公开一些实施例提供的一种相干光芯片表面植球布局；
图19为根据本公开一些实施例提供的一种相干光芯片结构示意图三；
图20为根据本公开一些实施例提供的一种相干光芯片结构示意图四；
图21为根据本公开一些实施例提供的一种相干光芯片结构示意图五；
图22为根据本公开一些实施例提供的一种非均衡分光器的结构示意图；
图23为根据本公开一些实施例提供的一种相干光芯片结构示意图六；
图24为根据本公开一些实施例提供的一种相干光芯片结构示意图七。
具体实施方式
光通信系统中，使用光信号携带待传输的信息，并使携带有信息的光信号通过光纤或光波导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光通过光纤或光波导传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。
光模块在光通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要被配置为供电、I2C信号传输、数据信息传输以及接地等；光网络终端通过网线或无线保真技术将电信号传输给计算机等信息处理设备。
图1为根据本公开一些实施例提供的光通信系统的连接关系图。如图1所示，光通信系统包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103。
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现无限距离传输。因此在通常的光通信系统中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平板电脑、电视机等。
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000之间的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。
光模块200包括光口和电口，光口被配置为接入光纤101，从而使得光模块200与光纤101建立双 向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立信息连接。示例地，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。由于光模块200是实现光信号与电信号相互转换的工具。
光网络终端100包括大致呈长方体的壳体，以及设置在壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。示例地，光网络终端100将来自光模块200的电信号传递给网线103，将来自网线103的电信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立了双向的信号传递通道。
图2为根据本公开一些实施例提供的光网络终端的结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100的与光模块200相关的结构。如图2所示，光网络终端100还包括设置于壳体内的电路板105，设置在电路板105表面的笼子106，设置在笼子106上的散热器107，以及设置在笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建议双向的电信号连接。此外，光模块200的光口与光纤101连接，从而光模块200与光纤101建立双向的光信号连接。
图3为根据本公开一些实施例提供的一种光模块的结构图。图4为根据本公开一些实施例提供的光模块分解结构图。图5为根据本公开一些实施例提供的除去壳体和解锁部件的光模块结构图。图6为根据本公开一些实施例提供的光纤适配器、光源、相干部件和电路板结构图。如图3-图6所示，光模块200包括壳体，设置于壳体内的电路板300、光收发部件、相干部件500、DSP芯片600和光纤绕架700。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口的上述壳体；壳体的外轮廓一般呈现方形体。
在本公开的一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，盖板2011盖合在下壳体202的两个下侧板2022上，以形成上述壳体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011以及位于盖板2011两侧、与盖板2011垂直设置的两个上侧板，由两个上侧板与两个下侧板2022结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在的方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。例如，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。开口204为电口，电路板300的金手指从电口伸出，插入上位机(例如，光网络终端100)中；开口205 为光口，被配置为接入外部光纤101，以使外部光纤101连接光模块200内部的光收发部件。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光收发部件等器件安装到壳体中，由上壳体201、下壳体202对这些器件形成封装保护。此外，在装配电路板300和光源401等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化地实施生产。
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外部的解锁部件203，解锁部件203被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
示例地，解锁部件位于下壳体202的两个下侧板2022的外壁上，具有与上位机笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200插入上位机的笼子里，由解锁部件的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件时，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如包括微控制单元(Microcontroller Unit，MCU)、激光驱动芯片、限幅放大器(limiting amplifier)、时钟数据恢复(Clock and Data Recovery，CDR)芯片、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳地承载上述电子元件和芯片；当光源位于电路板上时，硬性电路板也可以提供平稳地承载；硬性电路板还可以插入上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300插入笼子106中，由金手指与笼子106内的电连接器导通连接。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。
当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。例如，硬性电路板与光源之间可以采用柔性电路板连接。
电路板300包括第一电路板301、第二电路板302和第三电路板303，第一电路板301和第二电路板302均为硬性电路板，第三电路板303为柔性电路板，第二电路板302堆叠放置于第一电路板301靠近光源401的一端，第二电路板302位于第一电路板301与上壳体201之间，第一电路板301与第二电路板302通过第三电路板303连接。
光收发部件400包括光源401，光源401与第二电路板302连接，该光源401被配置为发射预设特定波长光束。光源401包括半导体增益芯片和硅光芯片，半导体增益芯片发射一个波段范围的光束，硅光芯片从一个波段范围的光束中筛选出特定波长光束，硅光芯片和半导体增益芯片形成谐振腔，特定波长光束在硅光芯片与半导体增益芯片之间来回反射，实现特定波长光束由半导体增益芯片稳定输出。
光模块还包括发射光纤适配器800和接收光纤适配器801。发射光纤适配器800被配置为发射高速光信号，接收光纤适配器801被配置为接收高速光信号。
相干部件500，放置于电路板上，该相干部件500被配置为实现高速光电信号的转换。相干部件500包括光发射接口、光接收接口和本振光接口，光发射接口伸出第一光纤，光接收接口伸出第二光纤，本 振光接口伸出第三光纤，光发射接口与发射光纤适配器800连接，光接收接口与接收光纤适配器801连接，本振光接口与光源401连接。相干部件通过光发射接口、光接收接口和本振光接口分别与发射光纤适配器、接收光纤适配器及光源401连接，相干部件500还与DSP芯片600连接。
光源401发出的窄线宽和高功率激光通过本振光接口输入进相干部件500中，并在相干部件500内部将该激光进行分束处理，其中一束作为发射光束，进入相干部件内部的相干调制器中，在DSP芯片600的高速电信号驱动下实现电光信号转换，转换后的高速光信号从模块的光发射接口输出；另一束作为本振光束，与从模块光接收端口输入进相干部件500的高速光信号进行相干解调，解调后的电信号进入DSP芯片600中进行信号处理，从而完成光电信号转换。其中，窄线宽和高功率激光为特定波长光束。
光源401还包括内部光纤适配器，内部光纤适配器伸出第一光纤，本振光接口伸出本振光纤，第一光纤与本振光纤熔接连接，以使内部光纤适配器与本振光接口连接。发射光纤适配器800伸出第二光纤，光发射接口伸出发射光纤，第二光纤与发射光纤熔接连接，以使发射光纤适配器800与光发射接口连接。接收光纤适配器801伸出第三光纤，光接收接口伸出接收光纤，第三光纤与接收光纤熔接连接，以使接收光纤适配器801与光接收接口连接。
由于两根光纤熔接时有一定的失败率，为了保证两根光纤最后熔接成功，需要预留一定的光纤长度，以便两根光纤在熔接失败后可以继续熔接。又由于第一光纤与本振光纤熔接连接的连接点位于内部光纤适配器附近，第二光纤与发射光纤熔接连接的连接点位于发射光纤适配器800附近，第三光纤与接收光纤熔接连接的连接点位于接收光纤适配器801附近，则第一光纤、本振光纤、发射光纤和接收光纤的长度较长。
光纤绕架700，被配置为固定光纤。由于电路板300设置有高频信号线和很多器件，所以光纤不能直接铺设在电路板300的表面。又由于第一光纤、本振光纤、发射光纤和接收光纤的长度较长，为了防止上壳体压损第一光纤、本振光纤、发射光纤和接收光纤，因此，在相干部件500与上壳体201之间设置有固定光纤的光纤绕架700。
第一光纤、本振光纤、发射光纤和接收光纤均整齐固定于光纤绕架700上，不仅避免了上壳体压损第一光纤、本振光纤、发射光纤和接收光纤，还避免了光纤直接铺设在电路板300的表面造成的信号串扰问题。
在大型超大规模和云数据中心提供商的推动下，光模块的传输速率在快速提升，如200G/400G高速光模块等。
本公开实施例提供的光模块为相干光模块，进一步为硅光相干光模块；相干光模块为一种发射端采用相干调制、接收端采用相干技术进行检测的光模块。
在发射端，除了可以对光进行幅度调制之外，还可以采用外调制的方式进行频率或相位调制，如正交幅度调制(Quadrature Amplitude Modulation，QAM)等；进一步，在发射端采用外调制方式，使用基于马赫-曾德尔调制器(Mach-Zehnder Modulator，MZM)的正交调制器实现高阶调制，将信号调制到光载波上，从而生成携带信号的光而发射出去。硅光芯片内部具有马赫曾德调制器，以实现功率和相位调制。马赫曾德调制器调制采用了同波长光干涉原理，一个马赫曾德调制器设置有两个干涉臂，单个干涉臂上输入一束光，一共需要向一个马赫曾德调制器提供两束同波长的光，经马赫曾德调制器调制后，干涉臂上的光会融合为一束光。可以向硅光芯片提供一束单一波长的光，由硅光芯片内部的分光波导，将一束单一波长的光分为两束同波长的光，分别输入马赫曾德调制器的两个干涉臂上；也可以向硅光芯片提供两束同波长的光，这两束同波长的光直接分别输入马赫曾德调制器的两个干涉臂上；由于马赫曾德调制器最终将各干涉臂上的光进行融合，在采用单个相同光功率芯片的前提下，向硅光芯片提供两束 光的方案，比提供一束光的方案，可以提供更高的光功率。
在接收端，利用本振光与接收到的外部光信号在光混频器中进行混频，得到与外部光信号的频率、相位和振幅按相同规律变化的差频信号；经相干混合后的输出光电流的大小，与外部光信号功率与本振光信号功率的乘积成正比，由于本振光的功率大于外部光信号的功率，所以，经相干混合后的输出光电流大幅增加，检测灵敏度进而得到提升。因此可以得出，在非相干光模块中，在传输过程中使用很多的放大器而不断第中继和放大信号，在相干光模块中，直接在接收端对微弱的到达信号进行混频放大。
由于光信号在光纤链路传输过程中，会产生失真；本公开的实施例中采用数字信号处理技术，从而对抗和补偿失真，降低失真对系统误码率的影响；数字信号处理技术可进行各种信号补偿处理，如色度色散补偿和偏振模式色散补偿。
图8为根据本公开一些实施例提供的一种相干部件，图9为根据本公开一些实施例提供的的一种相干部件分解示意图，如图8和图9中所示，相干部件500通常包括盖壳501和载板502，盖壳501扣合在载板502上，以形成具有一个开口的相干壳体；壳体的外轮廓可呈现正方体结构或长方体结构。
载板502的侧边设置有第一U型槽5021，第一U型槽5021位于相干壳体的开口处。盖壳501的一侧设置安装凹槽5013，安装凹槽5013的位置与第一U型槽5012的位置向对应。盖壳501设置第一限位部、第二限位部，第一限位部与第二限位部被配置为载板502与壳体的安装限位。第一限位部和第二限位部分别设置于安装凹槽的两侧。为实现载板502与盖壳501的安装限位，第一限位部的下表面低于载板502的上表面设置，第二限位部的下表面低于载板502的上表面设置。安装时，将第一限位部与第二限位部抵靠于载板502的侧壁，即可实现长度方向的限位。第一U型槽5021又称为载板凹槽。
相干壳体的开口朝向波长可调光部件设置，开口处设置光纤接头，光纤接头处设置光纤阵列，其中光纤阵列包括本振光纤、接收光纤和发射光纤。光纤接头的一端深入开口处。本振光纤的一端与波长可调光部件连接，接收本振光。接收光纤与接收适配器连接，接收光纤被配置为接收外部发送至光模块内部的接收信号光。发射光纤，与发射适配器连接，发射光纤被配置为将调制后的发射信号光发送出去。
光纤固定件503与光纤接头固定连接，且光纤固定件503与盖壳固定连接，光纤固定件503将光纤接头与盖壳固定连接在一起。
图10为根据本公开一些实施例提供的一种载板结构示意图，如图10中所示，载板502上方承载有相干光芯片510，被配置为对光信号进行调制与解调。相干光芯片510的侧面设置光口，光口端面与光纤接头的端面耦合连接。第一电芯片520设于载板502表面，第一电芯片520位于相干光芯片的侧面，且第一电芯片520与相干光芯片电连接。第二电芯片530设于载板502表面，第二电芯片530设于相干光芯片侧面，且第二电芯片530与相干光芯片电连接。第三电芯片540设置于载板502表面，第三电芯片540设于相干光芯片侧面，且第三电芯片540与相干光芯片电连接。
根据本公开的一些示例，第一电芯片520为相干发射驱动芯片，第一电芯片520位于相干光芯片的光口的对侧。第一电芯片520被配置为实现对相干光芯片中的相干调制器的驱动。第二电芯片530为第一接收放大芯片，第二电芯片530位于相干发射驱动芯片的邻侧，靠近相干光芯片。第二电芯片530被配置为对接收的电信号进行放大。第三电芯片540为第二接收放大芯片，第三电芯片540位于相干发射驱动芯片的邻侧，靠近相干光芯片。第三电芯片540被配置为对接收的电信号进行放大。
载板502还承载有多个供电电路，被配置为相干光芯片内部平衡接收器、功率监控器、发射光衰减器的供电，具体电器件的设置根据相干光芯片的功能引脚的设置进行设置。载板502为高速类载板502，通过侧边或下表面设置导电区域，与电路板电连接。
因载板502表面的光电芯片具有一定的高度和重量，且光电芯片分布位置相对集中，导致载板502 的重心不在其几何重心的附近，载板502的重心在邻近相干光芯片的位置。为增加相干部件500的结构稳定性，使得其几何中心与重心尽可能的重合，将盖壳501的重心设置为载板502重心的对称方向。
图11为根据本公开一些实施例提供的一种盖壳的结构示意图一，图12为根据本公开一些实施例提供的一种盖壳的结构示意图二。图11和图12为不同角度的盖壳501的结构示意图，盖壳501为长方形结构，盖壳501的一侧设置安装凹槽5013，安装凹槽5013的位置与第一U型槽的位置向对应。盖壳501设置第一限位部5011、第二限位部5012，第一限位部5011和第二限位部5012被配置为载板502与壳体的安装限位。第一限位部5011和第二限位部5012分别设置于安装凹槽5013的两侧。为实现载板502与盖壳501的安装限位，第一限位部5011与第二限位部5012的下表面低于载板502的上表面设置，安装时，将第一限位部5011与第二限位部5012抵靠于载板502的侧壁即可实现长度方向的限位。盖壳501设置有凸出于盖壳501上表面的相干安装凸起，相干安装凸起沿安装凹槽的形状进行设置，相干安装凸起被配置为盖壳501与延展部的连接限位。
为实现相干部件500表面平整，方便相干部件500为光模块内部的安装，在安装凹槽的周边设置承载板50111，其上表面与延展部的下表面连接，承载板50111被配置为限定光纤固定件在盖壳501上的上下方向的限位。根据本公开的一些示例，延展部的上表面与相干安装凸起5016的上表面平齐设置。
相干安装凸起的侧壁与延展部的侧壁抵靠连接，实现对延展部在水平方向的限位，实现了光纤阵列与相干光芯片的耦合限位。
为方便光纤固定件的延展部与相干安装凸起的限位，承载板50111设置有安装限位部，安装限位部包括：第一安装限位部5014和第二安装限位部5015，第一安装限位部5014凸出于承载板的上表面设置，和第二安装限位部5015凸出于承载板的上表面。为保证相干部件表面的完整性，第一安装限位部5014和第二安装限位部5015的上表面与相干安装凸起5016的上表面平齐。
根据本公开的一些示例，第一安装限位部5014和第二安装限位部5015可对称设置，也可非对称设置。为方便安装使用，第一安装限位部5014和第二安装限位部5015对称设置。第一安装限位部5014和第二安装限位部5015可以是半圆形设置，也可以是三角形或其他几何形状设置。
盖壳501的下表面设置支撑臂，支撑臂位于盖壳501的下表面的四周，且支撑臂与载板连接。
盖壳501的下表面设置具有不同高度的盖壳凸起，以适应载板502上光电器件的结构。盖壳501设置有连接部，连接部与载板502的上表面连接，连接部凸出于盖壳501的下表面设置。盖壳501的下表面设置具有不同高度的第一凸起平台5018和第二凸起平台5017。其中，第一凸起平台5018凸出于盖壳501的下表面设置，第一凸起平台5018与第一电芯片、第二电芯片和第三电芯片的位置对应。第一凸起平台5018的下表面高于第二凸起平台的下表面设置，第二凸起平台5017的下表面高于连接部设置。第一凸起平台5018包括第一子平台50181和第二子平台50182，第一子平台50181设置于第一电芯片520的上方，第一子平台50181在载板502的的投影覆盖第一电芯片520。第二子平台50182设置于第二电芯片530和第三电芯片540的上方，第二子平台50182在载板502的的投影覆盖第二电芯片530和第三电芯片540。盖壳501的底面覆盖相干光芯片。
第二凸起平台5017覆盖载板502上其他电器件，第二凸起平台5017设置于第一凸起平台5018的边缘，位于第一凸起平台5018与连接部之间。第二凸起平台5017还设置有凸起连接部5019，凸起连接部5019位于距离相干光芯片最远的边角。凸起连接部5019与载板502通过导电银胶连接，可实现载板502上热量通过凸起连接部、盖壳501进行散热。
根据本公开的一些示例，第一凸起平台5018与第二凸起平台5017设置于相干光芯片的对角位置，因第一凸起平台5018与第二凸起平台5017的厚度高于盖壳501底面厚度，使得盖壳501的重心位于靠 近第二凸起平台5017的位置处。盖壳501与载板502盖合后，使得相干部件500的重心尽可能的向几何中心靠近，保证相干部件500的稳定性。
图13为根据本公开一些实施例的光纤接头与相干部件连接示意图，如图13中所示，相干连接板550跨接于相干光芯片510与光纤接头504之间，相干连接板550被配置为固定相干光芯片与光纤接头。光纤适配器，与光纤接头内部的光纤对应连接。
为避免光纤接头内的光在光纤接头的端面与相干光芯片的端面的连接处形成反射，影响光功率，光纤阵列的中轴线与相干光芯片的光口的中轴线呈6°～8°夹角，减少光在光纤接头的端面与相干光芯片的端面的连接处形成反射。
根据本公开的一些示例，光纤接头504呈长方体设置，光纤接头504的上方设置有相干连接板550。相干连接板550跨接于相干光芯片与光纤接头之间。相干连接板550的下表面设置胶体，该胶体将相干连接板550与光纤接头以及相干连接板550与相干光芯片连接固定。
为减少运输或使用过程中，因外力对光纤产生拉扯，导致光纤接头与相干光芯片的耦合精度变差，本公开中还设置有尾纤套5041，套接与光纤阵列的外部。光纤固定件设置于光纤接头的外部，与尾纤套固定连接。尾纤套5041的上表面设有双面粘接材料或胶材，与光纤固定件连接。根据本公开的一些示例，尾纤套为具有一通孔的的方形管体，光纤阵列由方型管体的一端穿过，光纤接头抵靠于方型管体的端部，光纤阵列与尾纤套之间填充有胶体进行连接。
图14为根据本公开一些实施例提供的一种光纤固定件的结构示意图一。图15为根据本公开一些实施例提供的光纤固定件的结构示意图二。如图14和图15从不用角度对光纤固定件进行展示，光纤固定件具有相同的厚度，由一块板材压铸而成。光纤固定件包括：固定底板5031和设置于固定底板两侧的第一光纤侧板5032和第二光纤侧板5033。其中，固定底板5031包括具有不同的高度的第一固定底板50311和第二固定底板50312，第二固定底板50312的上表面高于第一固定底板的上表面设置。尾纤套5041设置于第一固定底板与第一光纤侧板、第二光纤侧板围合形成的空间内。相干连接板550设置于相干光芯片与光纤接头的上表面，使得相干连接板550的上表面高于光纤接头的上表面，相干连接板550的上表面与第二固定底板50312连接。不同高度的第一固定底板和第二固定底板50312被配置为适应相干连接板550的高度进行设置。
尾纤套的上表面与第一固定底板的下表面连接，其侧表面与第一光纤侧板、第二光纤侧板连接。
第二固定底板50312的一侧设置延展部50313，其宽度大于固定底板的宽度。延展部50313的侧边设置第一延展限位槽503131和第二延展限位槽503132，与盖壳501上表面的相应结构进行限位，方便光纤固定件与盖壳501之间的连接固定。为方便光纤固定件与盖壳501之间的连接固定，延展部50313的侧边还设置有多个点胶凹槽5034，延展部50313与盖壳501完成定位后，在点胶凹槽处点入液体胶，实现延展部50313与盖壳501之间的连接。
根据本公开的一些示例，点胶凹槽与第一延展限位槽、第二延展限位槽的形状相同。
第一延展限位槽503131与第一安装限位部5014匹配连接，第二延展限位槽503132与第二安装限位部5015匹配连接。
在本公开示例的安装过程中，首先相干光芯片与载板502安装连接，尾纤套5041与光纤阵列连接，相干光芯片的光端口凸出于载板502的第一U型槽处，然后将相干连接板550跨接于光纤接头与相干光芯片的上方，实现光纤接头与相干光芯片的耦合连接。然后将盖壳501与载板502边缘进行连接，安装过程中第一限位部与第二限位部抵靠于载板502的侧边，盖壳501的连接部与载板502连接，且凸起连接部与载板502边缘。光纤固定件的第一固定底板与尾纤套5041连接，第二固定底板50312与相干连 接板550连接，延展部50313与盖壳501上表面的承载板502连接。通过以上连接，光纤接头通过尾纤套5041、相干连接板550与光纤固定件固定连接，当光纤受到外部作用力时，通过连接处将受到的力进行分散、转移，减少了光纤接头的受力，提高了光纤接头与相干光芯片的连接稳定性，避免了对光耦合精度。
根据本公开的一些示例，光纤阵列与相干光芯片之间通过玻璃过桥连接，使用软胶连接，可维修性强，利于生产制造。上壳分成两部分：光纤固定件采用压铸方式，盖壳501采用钣金件，产品整体厚度只有2.42mm，满足SFP-DD光模块封装要求。在光纤阵列外部设计有尾纤套5041，使用时用胶水固定在光纤固定件上，光纤固定件再通过胶水固定在盖壳501上，用以保护光纤阵列与相干光芯片光学端面避免受到外力。金属盖壳501与光纤固定件粘接部分的两侧设计有多个凹槽，该凹槽被配置为胶水固定，提高连接稳定性。
为提高光的通信效率，本公开示例的相干部件500中，相干调制器为双偏振相干调制器，发射的信号光为具有不同偏振方向的信号光的耦合光束，接收的信号光中包含具有不同偏振方向的两组信号光，实现单通道多信号传输。
图16为根据本公开一些实施例提供的一种相干光芯片的结构示意图，如图16所示，本公开提出的一种高速相干光芯片的布局方案，采用硅光子集成技术，单片内集成了双偏振相干发射和接收功能，光纤耦合端口包含三个光纤耦合端口，从上到下依次为接收光纤耦合端口5111、本振光纤耦合端口5112和发射光纤耦合端口5113。其中本振光纤耦合端口5112与外部本振光源通过保偏光纤相连接，外部本振光源的光进入芯片后，分成两束，其中一束作为发射光进入双偏振相干调制器中，经过电光信号加载和偏振旋转合束器5141偏振处理后从发射光纤耦合端口发射光纤耦合端口5113输出；另一束光作为本振光再次经过分束分别进入第一偏振平衡接收器和第二偏振平衡接收器，与从接收光纤耦合端口5111进来的经过偏振旋转分束器处理后的光进行光学混频，从而实现信号的解调处理。
为了方便光纤耦合端口与光纤阵列进行有源耦合，在偏振旋转合束器5141和偏振旋转分束器后方分别集成了一个发射耦合功率监控器和一个接收耦合功率监控器用来进行光纤阵列的有源耦合。其中，在接收端，经过偏振旋转分束器后的两束光分别分出一小部分光进入同一个接收耦合功率监控器中进行有源耦合实时监控，在发射端，经过偏振旋转合束器5141后的两束光分别分出一小部分光进入同一个发射耦合功率监控器中进行有源耦合实时监控。同时，为了降低不同偏振态对耦合功率监控器的影响，提高有源耦合监控的精度，可以在耦合功率监控器前集成偏振分束器，用来提高监控光的偏振纯度，从而提高有源耦合监控的精度。
相干光芯片的光口处设有光纤耦合端口，光纤耦合端口与光纤接头耦合连接。光纤耦合端口包括：接收光纤耦合端口5111、本振光纤耦合端口5112和发射光纤耦合端口5113。偏振平衡接收器，与接收光纤耦合端口5111、本振光纤耦合端口5112连接，偏振平衡接收器被配置为将接收信号光转换为接收电信号。双偏振相干调制器与发射光纤耦合端口511、本振光纤耦合端口5112连接，双偏振相干调制器被配置为将DSP芯片发出的发射电信号转换为光信号，将光信号加载至本振光中，形成发射信号光。
接收光纤耦合端口5111与接收光纤适配器连接，接收光纤耦合端口5111被配置为接收对端的信号光，为方便表述，将来自对端的信号光称为接收信号光，接收信号光为具有不同偏振方向的第一接收信号光和第二接收信号光的耦合光束。偏振旋转分束器5121与光纤耦合端口通过光波导连接，偏振旋转分束器5121被配置为将接收信号光根据偏振方向的不同分为第一接收信号光和第二接收信号光。本振光纤耦合端口5112接收波长可调光部件发出的本振光，通过光波导将本振光分为第一子本振光和第二子本振光，其中第一子本振光又分为第一接收本振光和第二接收本振光。
第一接收本振光与第一接收信号光耦合进入第一偏振平衡接收器5123，第一偏振平衡接收器5123通过对第一接收本振光与第一接收信号光进行混频和平衡探测，将第一接收信号光转换为第一接收电信号，经第一接收放大芯片进行放大后，进入DSP芯片，由第一接收电信号转换为第一接收数字信号。
第二接收本振光与第二接收信号光耦合进入第二偏振平衡接收器5124，第二偏振平衡接收器5124通过对第二接收本振光与第二接收信号光进行混频和平衡探测，将第二接收信号光转换为第二接收电信号，经第二接收放大芯片进行放大后，进入DSP芯片，由第二接收电信号转换为第二接收数字信号。
为方便对接收光纤与接收光纤耦合端口5111的耦合精度的监控，在进行耦合安装时，在光纤耦合端口外连接测试光，包括第一测试光、第二测试光和第三测试光，在此过程中，测试光均由相干光芯片的外部进入相干光芯片。相干光芯片还设置有接收耦合功率监控器5122，接收偏振旋转分束器5121的两个出光光路的部分光，进行耦合功率监控，MCU与接收耦合功率监控器5122电连接，接收接收耦合功率监控器5122的电信号，根据接收耦合功率监控器5122的电信号计算得到光纤耦合端口的光功率，根据光纤耦合端口的光功率与第一测试光的光功率进行比较，进行接收光纤接收耦合器与接收光纤耦合精度的调节。MCU内设置第一测试光功率阈值区间，如果光纤耦合端口的光功率不位于第一测试光功率阈值区间内，则需要对接收光纤与接收光纤耦合端口5111的耦合精度进行调节。
为简化相干光芯片内的波导路径，本振光纤耦合端口5112设置于接收光纤耦合端口5111与发射光纤耦合端口511之间。
根据本公开的一些示例，如图16中所示的节点位置为实现对部分光进行分路，如节点5125处，节点5125与偏振旋转分束器5121的第一出光口之间的光波导称为第一波导，接收耦合功率监控器5122与节点5125之间的光波导称为第二波导，第一偏振平衡接收器5123与节点5125之间的光波导称为第三波导，为实现对偏振旋转分束器5121的第一出光口内光的分束，节点处设置定向耦合器，接收耦合功率监控器5122设置于节点5125与第一偏振平衡接收器5123之间。同理，接收耦合功率监控器5122设置于节点5126与第二偏振平衡接收器5124之间。
双偏振相干调制器516，与发射光纤耦合端口511、本振光纤耦合端口5112通过光波导连接，双偏振相干调制器516被配置为将DSP芯片发出的发射电信号转换为光信号，加载至本振光中，形成发射信号光。
为了方便光纤耦合端口与光纤阵列进行有源耦合，在偏振旋转合束器5141的两个输入端之间设置发射耦合功率监控器。
为方便对发射光纤与发射光纤耦合端口511的耦合精度的监控，在进行耦合安装时，在光纤耦合端口外连接测试光，包括第一测试光、第二测试光和第三测试光，在此过程中，测试光均由相干光芯片的外部进入相干光芯片，其中第一测试光由接收光纤耦合端口5111进入，第二测试光由本振光纤耦合端口5112进入，第三测试光由发射光纤耦合端口511连接。相干光芯片还设置有发射耦合功率监控器5143，发射偏振旋转合束器5141的两个输入端的部分光，进行耦合功率监控，MCU与发射耦合功率监控器5143电连接，接收发射耦合功率监控器5143的电信号，根据发射耦合功率监控器5143的电信号计算得到发射光纤耦合端口511的光功率，根据光纤耦合端口的光功率与第三测试光的光功率进行比较，进行发射光纤接收耦合器与发射光纤耦合精度的调节。MCU内设置第二测试光功率阈值区间，如果发射光纤耦合端口511的光功率不位于第二测试光功率阈值区间内，则需要对发射光纤与发射光纤耦合端口511的耦合精度进行调节。
图17为根据本公开一些实施例提供的一种相干光芯片的结构示意图二，为了降低不同偏振态对耦合功率监控器的影响，提高有源耦合监控的精度，在接收耦合功率监控器5122与偏振旋转分束器5121 的第一出光口之间设置第一偏振分束器5128，避免不属于第一偏振态的光进入接收耦合功率监控器5122。同样的，在接收耦合功率监控器5122与偏振旋转分束器5121的第二出光口之间设置第二偏振分束器5127，避免不属于第二偏振态的光进入接收耦合功率监控器5122。
为方便对接收光纤与接收光纤耦合端口5111的耦合精度的监控，在进行耦合安装时，在光纤耦合端口外连接测试光，包括第一测试光、第二测试光和第三测试光，在此过程中，测试光均由相干光芯片的外部进入相干光芯片。其中第一测试光由接收光纤耦合端口5111进入相干光芯片，接收偏振旋转分束器5121的右侧两个出光光路的部分光，形成偏振方向不同的第一子测试光和第二子测试光，如第一子测试光为X偏振光，第二子测试光为Y偏振光，其中接收偏振旋转分束器5121将X偏振光经第一路径(上方)进行传导，然后部分进入第一偏振平衡接收器，部分进入第一偏振分束器5128，第一偏振分束器5128可允许传导至第一偏振分束器5128的光束中的X偏振光透过，其他方向的光滤除。接收偏振旋转分束器5121将Y偏振光经第二路径(下方)进行传导，然后部分进入第二偏振平衡接收器，部分进入第二偏振分束器，第二偏振分束器可允许传导至第二偏振分束器的光束中的Y偏振光透过，其他方向的光滤除。接收耦合功率监控器5122进行耦合功率监控，MCU与接收耦合功率监控器5122电连接，接收接收耦合功率监控器5122的电信号，根据接收耦合功率监控器5122的电信号计算得到光纤耦合端口的光功率，根据光纤耦合端口的光功率与第一测试光的光功率进行比较，进行接收光纤接收耦合器与接收光纤耦合精度的调节。MCU内设置第一测试光功率阈值区间，如果光纤耦合端口的光功率不位于第一测试光功率阈值区间内，则需要对接收光纤与接收光纤耦合端口5111的耦合精度进行调节。
同样，为了降低不同偏振态对耦合功率监控器的影响，提高有源耦合监控的精度，在发射耦合功率监控器5143与偏振旋转合束器5141的第一输入端之间设置第一发射偏振分束器5161，避免不属于第一偏振态的光进入接收耦合功率监控器5122。在发射耦合功率监控器5143与偏振旋转合束器5141的第二输入端之间设置第二接收偏振分束器5162，避免不属于第二偏振态的光进入接收耦合功率监控器5122。
继续结合图16、图17所示，示例的，工作过程中，本振光纤耦合端口5112接收波长可调光部件发出的本振光，通过光波导将本振光分为第一子本振光和第二子本振光，其中第一子本振光又分为第一接收本振光和第二接收本振光。第二接收本振光又分为第一发射光和第二发射光，分别进入双偏振相干调制器516的两个输入端。
如双偏振相干调制器516具有第一光输入端接收第一发射光、第二光输入端接收第二发射光，分别对第一发射光和第二发射光进行信号调制，输出第一发射信号光和第二发射信号光。偏振旋转合束器5141，与双偏振相干调制器516的第一输出端和第二输出端连接，将第一发射信号光和第二发射信号光旋转为偏振方向相互垂直的光束，并耦合输出为发射信号光。
第一发射光和第二发射光的偏振方向相同，具有不同幅度和相位以加载不同的信号。偏振旋转合束器5141将第一发射光或第二发射光中的一束进行偏转，与另一束光形成近90°夹角后，合并为一束发射信号光。偏振旋转合束器5141包括第一输入端、第二输入端和输出端，其中，第一输入端与双偏振相干调制器516的第一输出端连接，第二输入端与双偏振相干调制器516的第二输出端连接，输出端与发射光纤耦合端口511连接，发射信号光经发射光纤耦合端口511进入发射光纤。
相干光芯片中还设置有第一发射光衰减器5144，设置于偏振旋转合束器5141与第一偏振相干调制器5142之间，对第一发射信号光进行衰减控制。为实现对第一发射光衰减器5144的控制，在第一发射光衰减器5144的第二输出端设置第一光衰减器功率监控器5145，第一发射光衰减器5144的第一输出端与发射偏振旋转合束器5141的第一输入端连接。MCU与第一光衰减器功率监控器5145电连接，通过 第一光衰减器功率监控器5145采集到的数据控制对第一发射光衰减器5144的输出电压。
为更加精确的实现对发射光功率的监控，在第一发射光衰减器5144的第二输出端口与偏振旋转合束器5141之间设置第一发射功率监控器5147，该第一发射功率监控器5147被配置为监控衰减后的第一发射信号光的光功率。MCU与第一发射功率监控器5147电连接，上位机可读取MCU内存储的第一发射信号光的光功率。
同样的，相干光芯片中还设置有第二发射光衰减器5154，设置于偏振旋转合束器5141与第二偏振相干调制器5152之间，对第二发射信号光进行衰减控制。为实现对第二发射光衰减器5154的控制，在第二发射光衰减器5154的第二输出端设置第二光衰减器功率监控器5155，第二发射光衰减器5154的第一输出端与发射偏振旋转合束器5141的第二输入端连接。MCU与第二光衰减器功率监控器5155电连接，通过第二光衰减器功率监控器5155采集到的数据控制对第二发射光衰减器5154的输出电压。
为更加精确的实现对发射光功率的监控，在第二发射光衰减器5154与偏振旋转合束器5141之间设置第二发射功率监控器5157，该第二发射功率监控器5157被配置为监控衰减后的第二发射信号光的光功率。MCU与第二发射功率监控器电连接，上位机可读取MCU内存储的第二发射信号光的光功率。
第一发射光衰减器5144与第一偏振相干调制器5142之间设置第一调制器功率监控器5146，第一调制器功率监控器5146被配置为监控第一发射信号光的相位，第一调制器功率监控器5146与MCU连接。MCU接收第一调制器功率监控器5146的监控数据，进行第一发射信号光的相位调制。
第二发射光衰减器5154与第二偏振相干调制器5152之间设置第二调制器功率监控器5156，第二调制器功率监控器5156被配置为监控第二发射信号光的相位，第二调制器功率监控器5156与MCU连接。MCU接收第二调制器功率监控器5156的监控数据，进行第二发射信号光的相位调制。
图18为根据本公开一些实施例提供的本公开一种相干光芯片表面植球布局，如图18所示，其中双偏振相干调制器导电区5171与光纤耦合端口导电区5172分别分布于相干光芯片表面的上下两侧，第一偏振平衡接收器导电区5173和第二偏振平衡接收器导电区5174分布于相干光芯片的左侧，其他的直流信号植球分布于相干光芯片周围方便与外部电芯片进行信号互连，相干光芯片中间部分进行均匀的植球填充，用来提高2.5D倒装焊封装的可靠性和稳定性，这些填充用的植球没有实际功能，可以接地或断路。
为了方便光纤阵列和光纤耦合端口耦合封装，要求光纤耦合端口周围的植球与光纤耦合端口的间距大于0.5mm。光纤耦合端口包含五个耦合光口从左至右分别为接收耦合光口、本振耦合光口和发射耦合光口，右侧的两个光口为环回测试光口，该环回测试光口被配置为耦合测试用。为了提高与FA的耦合效率和耦合的可返修性，该光纤耦合器采用了氮化硅材料和直接划片解离的方式，保证光纤耦合端口端面的垂直性。
根据本公开的一些示例，图19为根据本公开一些实施例提供的一种相干光芯片结构示意图三；图20为根据本公开一些实施例提供的一种相干光芯片结构示意图四。如图19和图20所示，第一本振分光器5131，其输入端与本振光纤耦合端口连接，第一输出端与第一偏振相干调制器5412连接，第二输出端与第二本振分光器5132的输入端连接；第二本振分光器5132的第一输出端与第二偏振相干调制器5152连接，第二输出端与第三本振分光器5133连接的输入端连接；第三本振分光器5133的第一输出端与第一偏振平衡接收器连接，第二输出端与第二偏振平衡接收器连接。还可设置为第一本振分光器，其输入端与本振光纤耦合端口连接，第一输出端与第二本振分光器的输入端连接，第二输出端与第三本振分光器的输入端连接；第三本振分光器的第一输出端与第一偏振相干调制器连接，第二输出端与第一偏振相干调制器连接；第二本振分光器的第一输出端与第一偏振平衡接收器连接，第二输出端与第二偏 振平衡接收器连接。
在以上相干光芯片中，为了提高有效发射光功率，保证两个不同方向的偏振相干调制器输出的发射光的光功率基本保持一致，本公开中在第一本振分光器5131、第二本振分光器5132和第三本振分光器51333处采用功分器，将光等分为两束如图18中所示。外部本振光源的光进入芯片后，在第一本振分光器5131处分成光功率分别为50％和50％两束，其中一束作为发射光在第四本振分光器5134处等分为两束，分别进入第一偏振相干调制器和第二偏振相干调制器中，经过电光信号加载和偏振旋转合束器5141偏振处理后从发射光纤耦合端口发射光纤耦合端口5113输出；另一束光作为本振光再次经过第三本振分光器5133分束分别进入第一偏振平衡接收器5123和第二偏振平衡接收器5124，与从接收光纤耦合端口5111进来的经过偏振旋转分束器5121处理后的光进行光学混频。
在第一本振分光器5131处分成光功率分别为50％和50％两束，其中一束作为发射光在第四本振分光器5134处等分为两束，分别进入第一偏振相干调制器5142和第二偏振相干调制器5152中，因此进入第一偏振相干调制器和第二偏振相干调制器的光的光功率相同。
为避免因不同的相干调制器在调制过程中对光的损耗不同，造成第一偏振相干调制器和第二偏振相干调制器输出的光功率差距较大，还设置有第一发射光衰减器5144，设置于偏振旋转合束器5141与第一偏振相干调制器5142之间，对第一发射信号光进行衰减控制。为实现对第一发射光衰减器5144的控制，在第一发射光衰减器5144的第二输出端设置第一光衰减器功率监控器5145，第一发射光衰减器5144的第一输出端与发射偏振旋转合束器5141的第一输入端连接。MCU与第一光衰减器功率监控器5145电连接，通过第一光衰减器功率监控器5145采集到的数据控制对第一发射光衰减器5144的输出电压。
在第一发射光衰减器5144的第二输出端口与偏振旋转合束器5141之间设置第一发射功率监控器5147，第一发射功率监控器5147被配置为监控衰减后的第一发射信号光的光功率。MCU与第一发射功率监控器5147电连接，上位机可读取MCU内存储的第一发射信号光的光功率。
相干光芯片中还设置有第二发射光衰减器5154，设置于偏振旋转合束器5141与第二偏振相干调制器5152之间，对第二发射信号光进行衰减控制。为实现对第二发射光衰减器5154的控制，在第二发射光衰减器5154的第二输出端设置第二光衰减器功率监控器5155，第二发射光衰减器5154的第一输出端与发射偏振旋转合束器5141的第二输入端连接。MCU与第二光衰减器功率监控器5155电连接，通过第二光衰减器功率监控器5155采集到的数据控制对第二发射光衰减器5154的输出电压。
在第二发射光衰减器5154与偏振旋转合束器5141之间设置第二发射功率监控器5157，该第二发射功率监控器5157被配置为监控衰减后的第二发射信号光的光功率。MCU与第二发射功率监控器电连接，上位机可读取MCU内存储的第二发射信号光的光功率。
在本公开中为提高有效发射光功率，两个不同方向的偏振相干调制器输出的发射光的光功率的差比应不大于15％，即第一偏振相干调制器与第二偏振相干调制器的差值，与第一偏振相干调制器比值不大于15％；且第一偏振相干调制器与第二偏振相干调制器的差值，与第二偏振相干调制器比值不大于15％。
MCU可通过对第一发射信号光的光功率、第二发射信号光的光功率的监控，控制第一光衰减器或第二光衰减器衰减值的大小，使得第一偏振相干调制器与第二偏振相干调制器的差比在预设差比范围内。
本公开还提供了另一种实施例，其中，第一本振分光器5131和第四本振分光器5134为可调分光器，可通过控制第一本振分光器和第三本振分光器的输出端的分光比例，控制发射光功率的大小。为提高有效发射光功率，保证两个不同方向的偏振相干调制器输出的发射光的光功率基本保持一致，控制第一偏振相干调制器的输出光功率与第二偏振相干调制器的输出光功率的差比不大于15％。
在以上相干光芯片中，光纤耦合端口和偏振旋转合束器5141对不同偏振态光的插损耗会存在不同， 尤其光纤耦合端口的光学插损还会收到芯片加工工艺的影响，而在实际应用中要求从发射端发出的两种不同偏振的光功率均衡，因此，本公开提供了另一种相干光芯片结构示意图，通过相干光芯片上集成的可调光衰减器来对功率较高的偏振态的光功率进行功率衰减，从而降低有效的光发射功率，并且影响芯片良率。
图21为根据本公开一些实施例提供的一种相干光芯片结构示意图五，如图21中所示，光纤耦合器包含三个光纤耦合端口，从上到下依次为接收光纤耦合端口5111、本振光纤耦合端口5112和发射光纤耦合端口511。其中，本振光纤耦合端口5112与外部本振光源通过保偏光纤相连接。第一本振分光器5131为非均衡分光器，非均衡分光器的输入端与本振光纤耦合端口5112连接，第一输出端与第一偏振相干调制器连接，第二输出端与第二本振分光器的输入端连接。第二本振分光器5132的第一输出端与第二偏振相干调制器连接，第二输出端与第三本振分光器的输入端连接。第三本振分光器5133的第一输出端与第一偏振平衡接收器5123连接，第二输出端与第二偏振平衡接收器5124连接。
外部本振光源的光进入相干光芯片后经非均衡分光器分成两束，其中一束作为发射光进入第一偏振相干调制器5142中，经过电光信号加载和偏振旋转合束器5141偏振处理后从发射光纤耦合端口5113输出；另一束光作为本振光再次经过第二本振分光器5132分为两束，其中一束作为发射光进入第二偏振相干调制器5152中，经过电光信号加载和偏振旋转合束器5141偏振处理后从发射光纤耦合端口511发射光纤耦合端口5113输出，第二本振分光器5132的另一输出端口与第三本振分光器5133的输入端连接，经第三本振分光器分为两束分别进入第一偏振平衡接收器5123和第二偏振平衡接收器5124，与从接收光纤耦合端口5111进来的经过偏振旋转分束器5121处理后的光进行光学混频，从而实现信号的解调处理。
外部本振光源的光进入相干芯片后，分光过程如下：先经过非均衡分光器分出一定比例的光进入第一偏振相干调制器(比如40％)，该分光比例可以根据第一和第二两个不同偏振发射光功率差异需要进行不同的设计，另外60％光进入第二本振分光器5132中。经过第二本振分光器5132均匀分成两份，其中一束接入第二偏振相干调制器5152中，另外一束进入第三本振分光器5133中。
在实际芯片设计中，可以根据第一偏振相干调制器与第二偏振相干调制器的输出光功率的差异，来对非均衡分光器的分光比例进行不同的结构设计，使得从发射光纤耦合端口5113出射的光束中第一角度和第二角度两个偏振光功率均衡，从而提高有效光发射功率。该非均衡分光器通常采用非对称波导结构的分光器结构设计。
偏振旋转合束器5141的输出端与发射光纤耦合端口511连接，第一输入端与第一偏振相干调制器5142连接，第二输入端与第二偏振相干调制器5152连接。
根据本公开的一些示例，非均衡分光器可采用非对称波导结构的分光器结构设计，也可利用基于马赫曾德干涉型结构的器件，如图19所示。在马赫曾德干涉型结构上方集成加热器，通过对加热器进行调节可以改变非均衡分光器的分光比例。在实际工作中，可以根据第二偏振相干调制器的输出光功率，实时调节非均衡分光器的分光比例，使得从发射耦合端口出射的光束中两个偏振光功率均衡，从而提高有效光发射功率，并提高芯片良率。
图22为根据本公开一些实施例提供的一种非均衡分光器的结构示意图。如图22中所示，非均衡分光器包括：第一子分光部件51321、调制臂51323、干涉臂51324和第二子分光部件51322，其中，第一子分光部件的输入端与本振光纤耦合端口连接，将本振光分为两束。第一子分光部件的第一输出端与调制臂连接，第二输出端与干涉臂连接。第二子分光部件的第一输入端与调制臂的输出端连接，第二输入端与干涉臂的输出端连接，第一输出端与第二本振分光器5132的输入端连接，第二输出端与第一偏 振相干调制器5142连接。MCU与第一调制臂、第二调制臂电连接，通过输出电压控制调制臂的温度，以控制调制臂的折射率，实现非均衡分光器的两个输出端的分光。
图23为根据本公开一些实施例提供的一种相干光芯片结构示意图六，根据本公开的一些示例，相干光芯片还包括：相干光芯片中还设置有第一发射光衰减器5144，设置于偏振旋转合束器5141与第一偏振相干调制器之间，对第一发射信号光进行衰减控制。为实现对第一发射光衰减器5144的控制，在第一发射光衰减器5144的第一输出端设置第一光衰减器功率监控器5145，第一发射光衰减器5144的第一输出端与发射偏振旋转合束器5141的第一输入端连接。MCU与第一光衰减器功率监控器5145电连接，通过第一光衰减器功率监控器5145采集到的数据控制对第一发射光衰减器5144的输出电压。
图24为根据本公开一些实施例提供的一种相干光芯片结构示意图七，如图24中所示，为了实现对有效光发射功率的监控，计算非均衡分光器的分光比例，相干光芯片中在第一发射光衰减器5144与偏振旋转合束器5141之间设置第一发射功率监控器5147，第一发射功率监控器5147被配置为监控衰减后的第一发射信号光的光功率。MCU与第一发射功率监控器5147电连接，上位机可读取MCU内存储的第一发射信号光的光功率。
同样的，为更加精确的实现对发射光功率的监控，在第二发射光衰减器与偏振旋转合束器5141之间设置第二发射功率监控器，第二发射功率监控器被配置为监控衰减后的第二发射信号光的光功率。MCU与第二发射功率监控器电连接，上位机可读取MCU内存储的第二发射信号光的光功率。
根据第二发射功率监控器5157、第一发射功率监控器5147采集的数据进行非均衡分光器分光比例的调控。
非均衡分光器也可以利用基于马赫曾德干涉型结构的器件。在马赫曾德干涉型结构上方集成加热器，通过对加热器进行调节可以改变非均衡分光器的分光比例。在实际工作中，可以根据第二偏振相干调制器的输出光功率，来实时调节非均衡分光器的分光比例，使得从发射光纤耦合端口511发射光纤耦合端口5115113出射的光束中两个偏振光功率均衡，从而提高有效光发射功率，并提高芯片良率。
本公开的一些示例的相干光模块中，非均衡分光器的输入端与本振光纤耦合端口5112连接，非均衡分光器的第一输出端与第一偏振相干调制器连接，非均衡分光器的第二输出端与第二本振分光器的输入端连接。第二本振分光器的第一输出端与第二偏振相干调制器连接，第二本振分光器的第二输出端与第三本振分光器的输入端连接。第三本振分光器的第一输出端与第一偏振平衡接收器5123连接，第三本振分光器的第二输出端与第二偏振平衡接收器5124连接。
为实现两种不同偏振的光功率均衡，第二本振分光器5132位可调分光器，可根据第一偏振相干调制器与第二偏振相干调制器的输出光功率的差异，进行可调分光器的分光调节。当第一偏振相干调制器的输出光功率大于第二偏振相干调制器的输出光功率时，调节可调分光器的第二输出端的出光比例增加，则进入的第二偏振相干调制器第二发射光的光功率增加，减小第一偏振相干调制器的输出光功率与第二偏振相干调制器的输出光功率的差值。
当第一偏振相干调制器的输出光功率小于第二偏振相干调制器的输出光功率时，调节可调分光器的第二输出端的出光比例减小。则进入的第二偏振相干调制器的第二发射光的光功率减小，减小第一偏振相干调制器的输出光功率与第二偏振相干调制器的输出光功率的差值。
需要说明的是，在本说明书中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的电路结构、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种电路结构、物品或者设备所固有的要素。在没有更多限制的情况下，有语句“包括一个……”限定的要素，并不排除在包括所述要素的电路结构、物品或者设备中还存在另 外的相同要素。
本领域技术人员在考虑说明书及实践这里发明的公开后，将容易想到本公开的其他实施方案。本公开旨在涵盖本发明的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求的内容指出。
以上所述的本公开实施方式并不构成对本公开保护范围的限定。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (21)

  1. 一种光模块，包括：
    光源，被配置为发出不带信号的本振光；
    本振光纤，一端与所述光源连接，另一端与光纤接头连接；
    相干光芯片，与所述光纤接头耦合连接，所述相干光芯片包括：
    接收光纤耦合端口，被配置为接收接收信号光；
    本振光纤耦合端口，被配置为接收所述本振光；
    偏振旋转分束器，设置于接收光纤耦合端口的一侧，所述偏振旋转分束器被配置为根据偏转角度的不同将接收信号光分为第一接收信号光和第二接收信号光；
    接收耦合功率监控器，设置于所述偏振旋转分束器的两个出光口之间，所述接收耦合功率监控器被配置为监控所述接收光纤耦合端口的耦合光功率；
    发射光纤耦合端口，
    偏振旋转合束器，所述偏振旋转合束器的合束端口与发射光纤耦合端口的连接；
    发射耦合功率监控器，设置于所述偏振旋转合束器的第一输入端口与第二输入端口之间，所述发射耦合功率监控器被配置为监控所述发射光纤耦合端口的耦合光功率；
    电路板，设置有MCU，所述MCU分别与接收耦合功率监控器、发射耦合功率监控器电连接；
    第一偏振相干调制器，设置于所述偏振旋转合束器的第一端口与所述本振光纤耦合端口之间，对所述本振光调制形成第一发射信号光；
    第二偏振相干调制器，设置于所述偏振旋转合束器的第二端口与所述本振光纤耦合端口之间，对所述本振光调制形成第二发射信号光。
  2. 根据权利要求1所述的光模块，其中，所述相干光芯片还包括：
    第一偏振平衡接收器，与所述偏振旋转分束器的第一输出端口和所述本振光纤耦合端口连接；所述第一偏振平衡接收器被配置为接收所述第一接收信号光和所述本振光，并进行混频和平衡探测，转换为第一接收电信号；
    第二偏振平衡接收器，与所述偏振旋转分束器的第二输出端口和所述本振光纤耦合端口连接，接收所述第二接收信号光和所述本振光，并进行混频和平衡探测，转换为第二接收电信号；
    第一偏振分束器，设置于所述偏振旋转分束器的第一输出端口与所述接收耦合功率监控器之间，所述第一偏振分束器的偏振方向与所述偏振旋转分束器的第一输出端口的偏振方向一致。
  3. 根据权利要求1或2所述的光模块，其中，所述相干光芯片还包括：第二偏振分束器，设置于所述偏振旋转分束器的第二输出端口与所述接收耦合功率监控器之间，所述第二偏振分束器的偏振方向与所述偏振旋转分束器的第二输出端口的偏振方向一致。
  4. 根据权利要求1-2中任一项所述的光模块，其中，所述相干光芯片还包括：
    偏振旋转合束器的合束端口与所述发射光纤耦合端口连接，所述偏振旋转合束器被配置为将第一发射信号光旋转一定的偏振角度，并和第二发射信号光合并为一束发射信号光。
  5. 根据权利要求4所述的光模块，其中，所述相干光芯片还包括：第一发射偏振分束器，设置于所述偏振旋转合束器的第一端口与所述发射耦合功率监控器之间，所述第一发射偏振分束器的偏振方向与所述偏振旋转合束器的第一端口的偏振方向一致。
  6. 根据权利要求4或5所述的光模块，其中，所述相干光芯片还包括：第二发射偏振分束器，设置于所述偏振旋转合束器的第二端口与所述发射耦合功率监控器之间，所述第二发射偏振分束 器的偏振方向与所述偏振旋转合束器的第二端口的偏振方向一致。
  7. 根据权利要求4-6中任一项所述的光模块，其中，所述相干光芯片还包括：第一发射光衰减器，设置于所述第一偏振相干调制器的出光口；
    所述偏振旋转合束器与所述第一发射光衰减器的第一输出端口连接；
    第一发射光衰减器功率监控器，设置于所述第一发射光衰减器的第二输出端口，所述第一发射光衰减器功率监控器被配置为监控所述第一发射光衰减器的第二输出端口的光功率。
  8. 根据权利要求4-7中任一项所述的光模块，其中，所述相干光芯片还包括：第二发射光衰减器，设置于所述第二偏振相干调制器的出光口；
    所述偏振旋转合束器与所述第二发射光衰减器的第一输出端口连接；
    第二发射光衰减器功率监控器，设置于所述第二发射光衰减器的第二输出端口，所述第二发射光衰减器功率监控器被配置为监控所述第二发射光衰减器的第二输出端口的光功率。
  9. 根据权利要求4-8中任一项所述的光模块，其中，所述相干光芯片还包括：第一本振分光器，所述第一本振分光器的输入端与所述本振光纤耦合端口连接，第一输出端与第二本振分光器的输入端连接，第二输出端与第三本振分光器的输入端连接；
    所述第三本振分光器的第一输出端与所述第一偏振相干调制器连接，第二输出端与所述第一偏振相干调制器连接；
    第二本振分光器的第一输出端与所述第一偏振平衡接收器连接，第二输出端与所述第二偏振平衡接收器连接。
  10. 根据权利要求9所述的光模块，其中，所述第一偏振相干调制器与所述第二偏振相干调制器输出的光功率相差不超过15％。
  11. 根据权利要求9或10所述的光模块，其中，所述第一本振分光器为非均衡分光器。
  12. 根据权利要求11所述的光模块，其中，所述非均衡分光器为马赫增德尔干涉器，所述非均衡分光器包括：第一子分光部件、调制臂、干涉臂和第二子分光部件，其中：
    所述第一子分光部件的输入端与所述本振光纤耦合端口连接，所述第一子分光部件被配置为将本振光分为两束；
    所述第一子分光部件的第一输出端与所述调制臂连接，第二输出端与所述干涉臂连接；
    所述第二子分光部件的第一输入端与所述调制臂的输出端连接，第二输入端与所述干涉臂的输出端连接，第一输出端与所述第二本振分光器的输入端连接，第二输出端与所述第一偏振相干调制器连接。
  13. 根据权利要求11或12所述的光模块，其中，所述MCU与所述非均衡分光器电连接，所述MCU被配置为控制所述非均衡分光器的分光比例。
  14. 根据权利要求1-13中任一项所述的光模块，其中，所述本振光纤耦合端口设置于所述发射光纤耦合端口与所述接收光纤耦合端口之间。
  15. 根据权利要求4所述的光模块，其中，所述相干光芯片还包括：第一发射功率监控器，设置于所述第一偏振相干调制器与所述偏振旋转合束器之间，所述第一发射功率监控器被配置为监控所述第一偏振相干调制器的发射光功率；
    第二发射功率监控器，设置于所述第二偏振相干调制器与所述偏振旋转合束器之间，所述第二发射功率监控器被配置为监控所述第二偏振相干调制器的发射光功率。
  16. 根据权利要求1-15中任一项所述的光模块，其中，所述光模块还包括：
    载板，一侧设置有载板凹槽；
    盖壳，一侧设置有安装凹槽，所述安装凹槽与所述载板凹槽的位置相对应，
    其中，所述盖壳与所述载板盖合形成具有一开口的相干壳体；
    其中，所述载板承载有：
    所述相干光芯片，所述相干光芯片的光口凸出于所述开口处；
    相干发射驱动芯片，邻近所述相干光芯片设置，位于所述光口对侧；
    第一接收放大芯片，位于所述相干发射驱动芯片的邻侧，与所述相干光芯片电连接；
    第二接收放大芯片，靠近所述第一接收放大芯片，与所述相干光芯片电连接；
    其中，所述盖壳的下表面设置第一凸起平台和第二凸起平台，所述第一凸起平台在所述载板的投影覆盖所述相干发射驱动芯片、所述第一接收放大芯片和所述第二接收放大芯片；
    其中，所述第一凸起平台的下表面与所述载板的上表面的距离，小于所述第二凸起平台的下表面与所述载板的上表面的距离。
  17. 根据权利要求16所述的光模块，其中，所述盖壳设置有安装承载部，所述安装承载部沿所述安装凹槽设置；
    相干安装凸起，凸出于所述盖壳的上表面设置；
    光纤接头，与所述相干光芯片耦合连接；
    所述光纤固定件包括：固定底板和设置于固定底板两侧的第一光纤侧板和第二光纤侧板；
    固定底板包括：具有不同高度的第一固定底板和第二固定底板；
    延展部，抵靠于所述相干安装凸起的侧壁，且所述延展部下表面与所述安装承载部的上表面连接；所述延展部设置于第二固定底板的一侧；
    光纤尾套，套接于所述光纤接头的尾部，所述光纤尾套的侧壁与所述第一光纤侧板、所述第二光纤侧板连接，所述光纤尾套的上表面与所述第一固定底板连接；
    相干连接板，跨接于所述光纤接头与所述相干光芯片之间，其上表面与所述第二固定底板固定连接。
  18. 根据权利要求17所述的光模块，其中，所述光纤固定件包括：第一延展限位槽和第二延展限位槽；
    所述安装承载部设置有第一安装限位部和第二安装限位部；
    所述第一延展限位槽与所述第一安装限位部匹配连接，所述第二延展限位槽与所述第二安装限位部匹配连接；
    所述第一安装限位部和所述第二安装限位部凸出于安装承载部设置，所述第一安装限位部和所述第二安装限位部的上表面与所述相干安装凸起的上表面平齐。
  19. 根据权利要求17或18所述的光模块，其中，所述盖壳设置第一限位部和第二限位部，所述第一限位部和所述第二限位部的下表面低于所述载板的上表面，所述载板的侧面抵靠于所述第一限位部、所述第二限位部的侧壁。
  20. 根据权利要求19所述的光模块，其中，所述盖壳的下表面还设置有连接部，其下表面与所述载板连接；所述连接部设置于所述相干光芯片的对侧。
  21. 根据权利要求19或20所述的光模块，其特征在于，所述光纤尾套与所述第一固定底板的下表面连接；所述相干连接板的上表面与所述所述第一固定底板的下表面连接；
    所述延展部的宽度大于所述固定底板的宽度；所述延展部的侧边设置多个点胶凹槽。
PCT/CN2023/079275 2022-11-18 2023-03-02 光模块 WO2024103570A1 (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
CN202223076811.9U CN218995729U (zh) 2022-11-18 2022-11-18 一种光模块
CN202223076812.3 2022-11-18
CN202211449403.5A CN115712179A (zh) 2022-11-18 2022-11-18 一种光模块
CN202211449378.0A CN115728884A (zh) 2022-11-18 2022-11-18 一种光模块
CN202223073672.4 2022-11-18
CN202211449378.0 2022-11-18
CN202211449404.XA CN115728885A (zh) 2022-11-18 2022-11-18 一种光模块
CN202223076811.9 2022-11-18
CN202223076812.3U CN218866167U (zh) 2022-11-18 2022-11-18 一种光模块
CN202211449403.5 2022-11-18
CN202211449404.X 2022-11-18
CN202223073672.4U CN218728198U (zh) 2022-11-18 2022-11-18 一种光模块

Publications (1)

Publication Number Publication Date
WO2024103570A1 true WO2024103570A1 (zh) 2024-05-23

Family

ID=91083716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/079275 WO2024103570A1 (zh) 2022-11-18 2023-03-02 光模块

Country Status (1)

Country Link
WO (1) WO2024103570A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118509052A (zh) * 2024-07-22 2024-08-16 绍兴中科通信设备有限公司 用于光模块多径干扰测试的一体化测试系统及测试方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110989099A (zh) * 2019-11-18 2020-04-10 青岛海信宽带多媒体技术有限公司 一种光模块
CN113132009A (zh) * 2019-12-31 2021-07-16 烽火通信科技股份有限公司 一种相干光模块及光通信系统
WO2022143254A1 (zh) * 2020-12-30 2022-07-07 华为技术有限公司 相干光接收机、光通信设备及系统
CN114826409A (zh) * 2021-01-28 2022-07-29 青岛海信宽带多媒体技术有限公司 一种光模块
CN115712179A (zh) * 2022-11-18 2023-02-24 青岛海信宽带多媒体技术有限公司 一种光模块

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110989099A (zh) * 2019-11-18 2020-04-10 青岛海信宽带多媒体技术有限公司 一种光模块
CN113132009A (zh) * 2019-12-31 2021-07-16 烽火通信科技股份有限公司 一种相干光模块及光通信系统
WO2022143254A1 (zh) * 2020-12-30 2022-07-07 华为技术有限公司 相干光接收机、光通信设备及系统
CN114826409A (zh) * 2021-01-28 2022-07-29 青岛海信宽带多媒体技术有限公司 一种光模块
CN115712179A (zh) * 2022-11-18 2023-02-24 青岛海信宽带多媒体技术有限公司 一种光模块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118509052A (zh) * 2024-07-22 2024-08-16 绍兴中科通信设备有限公司 用于光模块多径干扰测试的一体化测试系统及测试方法

Similar Documents

Publication Publication Date Title
US11163126B2 (en) Light source assembly supporting direct coupling to an integrated circuit
US10879648B2 (en) Method and system for large silicon photonic interposers by stitching
US20210392419A1 (en) Assembly of network switch asic with optical transceivers
CN110989099B (zh) 一种光模块
CN218728198U (zh) 一种光模块
CN218995729U (zh) 一种光模块
CN115718351A (zh) 一种光模块
CN115712179A (zh) 一种光模块
CN217879744U (zh) 一种光模块
WO2024103570A1 (zh) 光模块
US11606145B2 (en) Silicon photonics based single-wavelength 100 gbit/S PAM4 DWDM transceiver in pluggable form factor
CN115728884A (zh) 一种光模块
CN210775929U (zh) 一种光模块
CN115728885A (zh) 一种光模块
CN112817098A (zh) 一种光模块
CN115728886A (zh) 一种光模块
WO2024104491A1 (zh) 光模块
CN218866167U (zh) 一种光模块
CN113805290A (zh) 一种光模块
CN113423028A (zh) 一种光模块
US20190312653A1 (en) Chip-in-connector photonic apparatus
WO2024103573A1 (zh) 光模块
CN216013742U (zh) 一种光模块
CN216160876U (zh) 一种光模块
CN113805289B (zh) 一种光模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23890017

Country of ref document: EP

Kind code of ref document: A1