WO2024103566A1

WO2024103566A1 - Display module and display panel

Info

Publication number: WO2024103566A1
Application number: PCT/CN2023/078681
Authority: WO
Inventors: 曾勉; 孙亮
Original assignee: 武汉华星光电半导体显示技术有限公司
Priority date: 2022-11-14
Filing date: 2023-02-28
Publication date: 2024-05-23
Also published as: CN115732514A

Abstract

The present application provides a display module and a display panel. A pixel driving module and a light-emitting element are integrally packaged to form the display module. Compared with the structure of a silicon-based microchip, the display module of the present application has a low process cost, thereby reducing the cost of the display panel.

Description

Display module and display panel

Technical Field

The present application relates to the field of display technology, and in particular to a display module and a display panel.

Background technique

At present, the mainstream mini-LED backlight products, mini-LED direct display products and micro-LED direct display products basically adopt active drive. One of them is an active drive structure based on a glass backplane or a flexible backplane: it is based on a backplane process of low-temperature polysilicon or indium gallium zinc oxide thin-film transistors. After the array process is completed, the metal anode and metal cathode that drive the LED light in the pixel circuit will be exposed on the backplane surface; then the P electrode and N electrode of the mini-LED lamp are electrically connected to the metal anode and metal cathode that drive the LED light in the pixel circuit on the substrate through the welding process, or the P electrode and N electrode of the micro-LED lamp are electrically connected to the metal anode and metal cathode that drive the LED light in the pixel circuit on the substrate through mass transfer and metal bonding or other bonding processes, and finally the mini-LED or micro-LED can be actively driven through the backplane circuit.

In mini-LED direct display products with larger pitch, the active driving structure used is generally based on the structure of a silicon-based microchip: that is, a silicon-based microchip is used instead of the original pixel driving module to drive single or multiple LED lamps. The LED lamp is bonded to the active driving wiring substrate by means of bonding, realizing the electrical connection between the LED and the driving circuit of the silicon-based microchip, and forming an array structure.

At present, due to the high cost of silicon-based microchips and the limited size of wafers, the number of chips produced on a wafer is limited, resulting in higher costs for high-resolution display panels.

technical problem

The present application provides a display module and a display panel to solve the problem of high cost of display panels.

Technical Solutions

The present application provides a display module, which includes: a substrate, a pixel driving module, a light-emitting element, a packaging film layer, a scan signal terminal, a data signal terminal, a first level terminal and a second level terminal, wherein the pixel driving module is arranged on one side of the substrate; the light-emitting element is arranged on a side of the pixel driving module away from the substrate, and the pixel driving module is electrically connected to the light-emitting element; the packaging film layer is arranged on a side of the light-emitting element away from the substrate; the scan signal terminal is arranged on a side of the substrate away from the packaging film layer, and the scan signal terminal is electrically connected to the pixel driving module through an opening on the substrate; the data signal terminal is arranged on a side of the substrate away from the packaging film layer, and the data signal terminal is electrically connected to the pixel driving module through an opening on the substrate; the first level terminal is arranged on a side of the substrate away from the packaging film layer, and the first level terminal is electrically connected to the light-emitting element or the pixel driving module through the opening on the substrate; the second level terminal is arranged on a side of the substrate away from the packaging film layer, and the second level terminal is electrically connected to the pixel driving module or the light-emitting element through the opening on the substrate.

Optionally, in some embodiments of the present application, the display module also includes: a sensor and a signal reading terminal, the sensor is arranged between the substrate and the packaging film layer; the signal reading terminal is arranged on a side of the substrate away from the packaging film layer, the signal reading terminal is electrically connected to the sensor through an opening on the substrate, and the scanning signal terminal is electrically connected to the sensor through an opening on the substrate.

Optionally, in some embodiments of the present application, the pixel driving module includes: a first transistor and a second transistor, the source, the drain and the light-emitting element of the first transistor are connected in series between the first level terminal and the second level terminal; the gate of the second transistor is electrically connected to the scanning signal terminal, the source of the second transistor is electrically connected to the data signal terminal, and the drain of the second transistor is electrically connected to the gate of the first transistor.

Optionally, in some embodiments of the present application, the source of the first transistor is electrically connected to the first level terminal, the drain of the first transistor is electrically connected to the second electrode of the light emitting element, and the first electrode of the light emitting element is electrically connected to the second level terminal;

Optionally, in some embodiments of the present application, the source of the first transistor is electrically connected to the first electrode of the light-emitting element, the drain of the first transistor is electrically connected to the second level terminal, and the second electrode of the light-emitting element is electrically connected to the first level terminal.

Optionally, in some embodiments of the present application, the pixel driving module further includes: a holding capacitor, a first plate of the holding capacitor being electrically connected to the gate of the first transistor, and a second plate of the holding capacitor being electrically connected to the first level terminal.

Optionally, in some embodiments of the present application, the sensor includes: a common electrode, a photodiode and a third transistor, the first electrode of the photodiode is electrically connected to the common electrode; the drain of the third transistor is electrically connected to the second electrode of the photodiode, the source of the third transistor is electrically connected to the signal reading terminal, and the gate of the third transistor is electrically connected to the scanning signal terminal.

Optionally, in some embodiments of the present application, the display module also includes: an active layer, the active layer is arranged between the substrate and the packaging film layer, the active layer includes the semiconductor portion of the first transistor, the semiconductor portion of the second transistor, the semiconductor portion of the photodiode and the semiconductor portion of the third transistor.

Optionally, in some embodiments of the present application, the display module further includes: a first electrode layer, the first electrode layer is arranged between the substrate and the packaging film layer, the first electrode layer includes a gate of the first transistor, a gate of the second transistor and a gate of the third transistor.

Optionally, in some embodiments of the present application, the first electrode layer also includes a first routing electrode, the first end of the first routing electrode is electrically connected to the gate of the first transistor and the gate of the third transistor, respectively, and the second end of the first routing electrode is electrically connected to the scan signal terminal through an opening on the substrate.

Optionally, in some embodiments of the present application, the display module also includes: a second electrode layer, the second electrode layer is arranged between the substrate and the packaging film layer, the second electrode layer includes the source and drain of the first transistor, the source and drain of the second transistor, and the source and drain of the third transistor.

Optionally, in some embodiments of the present application, the second electrode layer also includes a second routing electrode, the first ends of the second routing electrodes are respectively electrically connected to the source of the first transistor, and the second ends of the second routing electrodes are electrically connected to the first level terminal through the opening on the substrate.

Optionally, in some embodiments of the present application, the second electrode layer also includes a third routing electrode, the first end of the third routing electrode is electrically connected to the source of the second transistor, and the second end of the third routing electrode is electrically connected to the data signal terminal through an opening on the substrate.

Optionally, in some embodiments of the present application, the second electrode layer also includes a fourth routing electrode, the first end of the fourth routing electrode is electrically connected to the drain of the third transistor, and the second end of the fourth routing electrode is electrically connected to the signal reading terminal through an opening on the substrate.

On the other hand, the present application also provides a display panel, which includes: a substrate, a pixel driving module, a light-emitting element, a packaging film layer, a scan signal terminal, a data signal terminal, a first level terminal, a second level terminal and a substrate, wherein the pixel driving module is arranged on one side of the substrate; the light-emitting element is arranged on a side of the pixel driving module away from the substrate, and the pixel driving module is electrically connected to the light-emitting element; the packaging film layer is arranged on a side of the light-emitting element away from the substrate; the scan signal terminal is arranged on a side of the substrate away from the packaging film layer, and the scan signal terminal is electrically connected to the pixel driving module through an opening on the substrate; the data signal terminal is arranged on a side of the substrate away from the packaging film layer, and the data signal terminal is electrically connected to the pixel driving module through an opening on the substrate; the first A level terminal is arranged on a side of the substrate away from the packaging film layer, and the first level terminal is electrically connected to the light-emitting element or the pixel driving module through an opening on the substrate; the second level terminal is arranged on a side of the substrate away from the packaging film layer, and the second level terminal is electrically connected to the pixel driving module or the light-emitting element through an opening on the substrate; the display module is arrayed on the substrate, and a scan line, a data line, a first level signal line, a second level signal line and a signal reading line are arranged on the substrate; the scan line is electrically connected to the scan signal terminal, the data line is electrically connected to the data signal terminal, the first level signal line is electrically connected to the first level terminal, the second level signal line is electrically connected to the second level terminal, and the signal reading line is electrically connected to the signal reading terminal.

Beneficial Effects

The present application provides a display module and a display panel, wherein the display module comprises: a substrate, a pixel driving module, a light-emitting element, a packaging film layer, a scan signal terminal, a data signal terminal, a first level terminal and a second level terminal, wherein the pixel driving module is arranged on one side of the substrate; the light-emitting element is arranged on a side of the pixel driving module away from the substrate, and the pixel driving module is electrically connected to the light-emitting element; the packaging film layer is arranged on a side of the light-emitting element away from the substrate; the scan signal terminal is arranged on a side of the substrate away from the packaging film layer, and the scan signal terminal is electrically connected to the pixel driving module through an opening on the substrate; the data signal terminal is arranged on a side of the substrate away from the packaging film layer, and the data signal terminal is electrically connected to the pixel driving module through an opening on the substrate; the first level terminal is arranged on a side of the substrate away from the packaging film layer, and the first level terminal is electrically connected to the light-emitting element or the pixel driving module through the opening on the substrate; the second level terminal is arranged on a side of the substrate away from the packaging film layer, and the second level terminal is electrically connected to the pixel driving module or the light-emitting element through the opening on the substrate. The present application integrates and packages the pixel driving module and the light-emitting element to form a display module. Compared with the structure of a silicon-based microchip, the display module of the present application has a lower process cost, thereby reducing the cost of the display panel.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

FIG1 is a schematic diagram of a display module provided by the present application;

Fig. 2 is a cross-sectional view of A-A in Fig. 1;

FIG3 is a schematic diagram of the manufacturing process of the display module of the present application;

FIG4 is a circuit connection diagram of a first embodiment of a display module of the present application;

FIG5 is a schematic diagram of the specific structure of the first embodiment of the display module of the present application;

FIG6 is a first structural schematic diagram of a display panel of the present application;

FIG7 is a second structural schematic diagram of the display panel of the present application;

FIG8 is a circuit connection diagram of a second embodiment of a display module of the present application;

FIG9 is a schematic diagram of a specific structure of a second embodiment of a display module of the present application;

FIG. 10 is a schematic diagram of a third embodiment of a display module of the present application.

Embodiments of the present invention

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first" and "second" etc. may explicitly or implicitly include one or more features, and therefore should not be understood as limiting the present application.

The transistors used in all embodiments of the present application can be thin film transistors or field effect transistors or other devices with the same characteristics. Since the source and drain of the transistors used here are symmetrical, their source and drain are interchangeable. In the embodiment of the present application, in order to distinguish the two poles of the transistor except the gate, one of the poles is called the source and the other is called the drain. According to the form in the accompanying drawings, the middle end of the switching transistor is defined as the gate, the signal input end is the source, and the output end is the drain. In addition, the transistors used in the embodiments of the present application may include P-type transistors and/or N-type transistors, wherein the P-type transistor is turned on when the gate is at a low level and is turned off when the gate is at a high level, and the N-type transistor is turned on when the gate is at a high level and is turned off when the gate is at a low level. According to the form in the accompanying drawings, the middle end of the transistor is defined as the gate, the signal input end is the source, and the output end is the drain.

The present application provides a display module and a display panel, which are described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments of the present application.

It should be noted that, since the source and drain of the transistor used in the present application are symmetrical, the source and drain are interchangeable.

Please refer to Figures 1 and 2, Figure 1 is a schematic diagram of a display module 100 provided by the present application, and Figure 2 is a cross-sectional view of A-A in Figure 1. The present application provides a display module 100, which includes: a packaging film layer 10, a substrate 20, a pixel driving module 30, a light-emitting element 40, a scanning signal terminal 101, a data signal terminal 102, a first level terminal 103 and a second level terminal 104;

The pixel driving module 30 is arranged on one side of the substrate 20; the light emitting element 40 is arranged on the side of the pixel driving module 30 away from the substrate 20, and the pixel driving module 30 is electrically connected to the light emitting element 40; the encapsulation film layer 10 is arranged on the side of the light emitting element 40 away from the substrate 20; the scan signal terminal 101 is arranged on the side of the substrate 20 away from the encapsulation film layer 10, and the scan signal terminal 101 is electrically connected to the pixel driving module 30 through the opening on the substrate 20; the data signal terminal 102 is arranged on the side of the substrate 20 away from the encapsulation film layer 10, and the data signal terminal 102 is electrically connected to the pixel driving module 30 through the opening on the substrate 20; the first level terminal 103 is arranged on the side of the substrate 20 away from the encapsulation film layer 10, and the first level terminal 103 is electrically connected to the light emitting element 40 or the pixel driving module 30 through the opening on the substrate 20; the second level terminal 104 is arranged on the side of the substrate 20 away from the encapsulation film layer 10, and the second level terminal 104 is electrically connected to the pixel driving module 30 or the light emitting element 40 through the opening on the substrate 20.

The present application integrates and packages the pixel driving module 30 and the light emitting element 40 to form a display module 100. Compared with the structure of a silicon-based microchip, the display module 100 of the present application has a lower process cost, thereby reducing the cost of the display panel.

Furthermore, the display module 100 further includes:

The sensor 50 is disposed between the substrate 20 and the packaging film layer 10;

The signal reading terminal 105 is disposed on a side of the substrate 20 away from the encapsulation film layer 10. The signal reading terminal 105 is electrically connected to the sensor 50 through an opening on the substrate 20. The scanning signal terminal 101 is electrically connected to the sensor 50 through an opening on the substrate 20. In some embodiments, the sensor 50 is a fingerprint sensor.

Specifically, the sensor 50 is used to obtain a touch signal, and transmit the touch signal to the signal reading terminal 105 under the control of the scanning signal terminal 101. The present application packages the pixel driving module 30, the light emitting element 40 and the sensor 50 together, and the pixel driving module 30 and the sensor 50 are connected using the same scanning signal terminal 101, which is conducive to further reducing the cost of the display panel.

Further, in some embodiments, the orthographic projection of the light emitting element 40 on the substrate 20 is within the range of the orthographic projection of the pixel driving module 30 on the substrate 20. The orthographic projection of the light emitting element 40 on the substrate 20 does not overlap with the orthographic projection of the sensor 50 on the substrate 20.

Specifically, the packaging film layer 10 is a packaging shell with an opening; the substrate 20 is sealed at the opening of the packaging film layer 10; the pixel driving module 30 is arranged on the substrate 20 and located in the packaging film layer 10; the light emitting element 40 is arranged on the side of the pixel driving module 30 away from the substrate 20 and located in the packaging film layer 10, and the pixel driving module 30 is electrically connected to the light emitting element 40; the scanning signal terminal 101 is arranged on the side of the substrate 20 away from the packaging film layer 10, and the scanning signal terminal 101 is electrically connected to the pixel driving module through the opening on the substrate 20; the data signal terminal 102 is arranged on a side of the substrate 20 away from the packaging film layer 10, and the data signal terminal 102 is electrically connected to the pixel driving module 30 through an opening on the substrate 20; the first level terminal 103 is arranged on a side of the substrate 20 away from the packaging film layer 10, and the first level terminal 103 is electrically connected to the light-emitting element 40 or the pixel driving module 30 through an opening on the substrate 20; the second level terminal 104 is arranged on a side of the substrate 20 away from the packaging film layer 10, and the second level terminal 104 is electrically connected to the pixel driving module 30 or the light-emitting element 40 through an opening on the substrate 20.

Among them, the scan signal terminal 101, the data signal terminal 102, the first level terminal 103 and the second level terminal 104 are respectively arranged on the side of the substrate 20 away from the packaging film layer 10, the scan signal terminal 101 is used to be electrically connected to the scan signal line, the data signal terminal 102 is used to be electrically connected to the data signal line, the first level terminal 103 is used to access a high level or a low level, and the second level terminal 104 is used to access a low level or a high level. The pixel driving module 30 drives the light-emitting element 40 to emit light under the control of the scan signal terminal 101, the data signal terminal 102, the first level terminal 103 and the second level terminal 104, and the light of the light-emitting element 40 is emitted through the packaging film layer 10.

In some embodiments, the display module 100 includes one pixel driving module 30 and one light emitting element 40 . In other embodiments of the present application, the display module 100 may include multiple pixel driving modules 30 and multiple light emitting elements 40 .

Please refer to FIG. 1 to FIG. 3 , FIG. 3 is a schematic diagram of the manufacturing process of the display module 100 of the present application. In addition, the manufacturing method of the display module 100 of the present application is specifically as follows:

A pixel driving module 30 is formed on one side of a substrate 20 with one display module 100 as a unit to form a plurality of display modules 100. The plurality of display modules 100 form a display module 100 array, and a cutting interval is left between adjacent display modules 100. A light emitting element 40 is formed on each pixel driving module 30. A scanning signal terminal 101, a data signal terminal 102, a first level terminal 103, and a second level terminal 104 are formed on a side of the substrate 20 away from the pixel driving module 30. A hole is drilled by laser and metal is filled in the hole. The pixel driving module 30 and the light emitting element 40 are electrically connected to the scanning signal terminal 101, the data signal terminal 102, the first level terminal 103 and the second level terminal 104 by a process or a process of etching deep holes and then filling metal; a packaging film layer 10 is formed, the packaging film layer 10 covers the pixel driving module 30 and the light emitting element 40 of the display module 100, and the packaging film layer 10 is sealed and packaged with the substrate 20. Specifically, the packaging film layer 10 is formed by transparent glue; the display module 100 array is cut to obtain a plurality of display modules 100.

Furthermore, in some embodiments, the display module 100 further includes:

The sensor 50 is disposed on the substrate 20 and located in the packaging film layer 10;

The signal reading terminal 105 is arranged on a side of the substrate 20 away from the packaging film layer 10 . The signal reading terminal 105 is electrically connected to the sensor 50 through an opening on the substrate 20 . The scanning signal terminal 101 is electrically connected to the sensor 50 through an opening on the substrate 20 .

Please refer to FIG. 1 , FIG. 2 and FIG. 4 , FIG. 4 is a circuit connection diagram of a first embodiment of a display module 100 of the present application. Specifically, a pixel driving module 30 includes:

A first transistor T1, a source electrode, a drain electrode and a light emitting element 40 of the first transistor T1 are connected in series between a first level wiring terminal 103 and a second level wiring terminal 104;

The second transistor T2 has a gate electrically connected to the scan signal terminal 101 , a source electrically connected to the data signal terminal 102 , and a drain electrically connected to the gate of the first transistor T1 .

That is, when the signal from the scan signal terminal 101 turns on the second transistor T2, the signal from the data signal terminal 102 is transmitted to the gate of the first transistor T1 through the second transistor T2, and turns on the first transistor T1. The turning on of the first transistor T1 turns on the loop connected in series between the first level terminal 103 and the second level terminal 104, thereby causing the light-emitting element 40 to emit light.

Furthermore, in some embodiments of the present application, the source of the first transistor T1 is electrically connected to the first level terminal 103 , the drain of the first transistor T1 is electrically connected to the second electrode 42 of the light emitting element 40 , and the first electrode 41 of the light emitting element 40 is electrically connected to the second level terminal 104 .

In some embodiments, the pixel driving module 30 further includes:

A holding capacitor C, wherein a first plate of the holding capacitor C is electrically connected to the gate of the first transistor T1 , and a second plate of the holding capacitor C is electrically connected to the first level connection terminal 103 .

In some embodiments, the sensor 50 includes:

Common electrode 58;

A photodiode L, wherein a first electrode of the photodiode L is electrically connected to the common electrode 58;

The third transistor T3, the drain of the third transistor T3 is electrically connected to the second electrode of the photodiode L, the source of the third transistor T3 is electrically connected to the signal reading terminal 105, and the gate of the third transistor T3 is electrically connected to the scanning signal terminal 101. The first electrode of the photodiode L is an anode, and the second electrode of the photodiode L is a cathode.

When the finger is pressed on the position corresponding to the sensor 50, the incident light of the light source irradiates the finger, and different areas of the fingerprint of the finger generate different reflected lights. The different reflected lights reach the photodiode L to generate leakage currents of different sizes. The third transistor T3 is turned on under the control of the signal of the scanning signal terminal 101 to read the leakage current of the photodiode L, and then fingerprint imaging is performed according to the different sizes of currents corresponding to different areas read out.

Please refer to FIG. 1 , FIG. 2 , FIG. 4 and FIG. 5 , FIG. 5 is a schematic diagram of a specific structure of a first embodiment of a display module 100 of the present application. In some embodiments, the display module 100 further includes:

The active layer 201 is disposed between the substrate 20 and the packaging film layer 10 , and includes a semiconductor portion of the first transistor T1 , a semiconductor portion of the second transistor T2 , a semiconductor portion of the photodiode L, and a semiconductor portion of the third transistor T3 .

That is, in the present application, the semiconductor part of the first transistor, the semiconductor part of the second transistor, the semiconductor part of the photodiode and the semiconductor part of the third transistor are arranged on the same active layer, which is beneficial to reduce the number of layers of the active layer, thereby reducing the cost and thickness.

In some embodiments, the display module 100 further includes:

The first electrode layer 203 is disposed between the substrate 20 and the packaging film layer 10 . The first electrode layer 203 includes a gate of the first transistor T1 , a gate of the second transistor T2 , and a gate of the third transistor T3 .

That is, in the present application, the gate of the first transistor, the gate of the second transistor and the gate of the third transistor are arranged on the same electrode layer, which is beneficial to reduce the number of metal layers, thereby reducing the cost and thickness.

Furthermore, the first electrode layer 203 further includes a first wiring electrode 310, a first end of the first wiring electrode 310 is electrically connected to the gate of the first transistor T1 and the gate of the third transistor T3, respectively, and a second end of the first wiring electrode 310 is electrically connected to the scan signal terminal 101 through an opening on the substrate 20. In the present application, the scan signal terminal is configured by electrically connecting the first wiring electrode to the gate of the first transistor and the gate of the third transistor, respectively, and the first wiring electrode is configured in the same layer as the gate of the first transistor and the gate of the third transistor, which is beneficial to reducing the number of metal layers, thereby reducing cost and thickness.

In some embodiments, the display module 100 further includes:

The second electrode layer 205 is disposed between the substrate 20 and the packaging film layer 10 . The second electrode layer 205 includes a source and a drain of the first transistor T1 , a source and a drain of the second transistor T2 , and a source and a drain of the third transistor T3 .

That is, in the present application, the source and drain of the first transistor, the source and drain of the second transistor, and the source and drain of the third transistor are arranged on the same electrode layer, which is beneficial to reduce the number of metal layers, thereby reducing cost and thickness.

Furthermore, the second electrode layer 205 further includes a second wiring electrode 320, the first ends of the second wiring electrode 320 are respectively electrically connected to the source of the first transistor T1, and the second ends of the second wiring electrode 320 are electrically connected to the first level terminal 103 through the opening on the substrate 20. The second wiring electrode and the source of the first transistor are arranged in the same layer, which can reduce the number of metal layers.

In some embodiments, the second electrode layer 205 further includes a third routing electrode 330, the first ends of the third routing electrodes 330 are respectively electrically connected to the source of the second transistor T2, and the second ends of the third routing electrodes 330 are electrically connected to the data signal terminal 102 through the opening on the substrate 20. The third routing electrode and the source of the second transistor are arranged in the same layer, which can reduce the number of metal layers.

In some embodiments, the second electrode layer 205 further includes a fourth wiring electrode 340, the first ends of the fourth wiring electrode 340 are respectively electrically connected to the drain of the third transistor T3, and the second ends of the fourth wiring electrode 340 are electrically connected to the signal reading terminal 105 through the opening on the substrate 20. The fourth wiring electrode and the source of the third transistor are arranged in the same layer, which can reduce the number of metal layers.

Specifically, the display module 100 further includes:

An active layer 201, wherein the active layer 201 is disposed on the substrate 20, and the active layer 201 includes a first semiconductor portion 31 and a second semiconductor portion 35;

A first insulating layer 202, wherein the first insulating layer 202 is disposed on the active layer 201;

A first electrode layer 203, the first electrode layer 203 is disposed on the first insulating layer 202, the first electrode layer 203 includes a first gate 32 and a second gate 36, the orthographic projection of the first gate 32 on the substrate 20 overlaps with the orthographic projection of the first semiconductor portion 31 on the substrate 20, the orthographic projection of the second gate 36 on the substrate 20 overlaps with the orthographic projection of the second semiconductor portion 35 on the substrate 20, and the second gate 36 is electrically connected to the scan signal terminal 101;

A second insulating layer 204, the second insulating layer 204 is disposed on the first electrode layer 203;

The second electrode layer 205 is disposed on the second insulating layer 204. The second electrode layer 205 includes a first drain electrode 34, a second drain electrode 38, a first source electrode 33, and a second source electrode 37. The first drain electrode 34 and the first source electrode 33 are electrically connected to the first semiconductor portion 31 through openings on the first insulating layer 202 and the second insulating layer 204, respectively. The second drain electrode 38 and the second source electrode 37 are electrically connected to the second semiconductor portion 35 through openings on the first insulating layer 202 and the second insulating layer 204, respectively. The second drain electrode 38 is electrically connected to the first gate electrode 32. The second source electrode 37 is electrically connected to the data signal terminal 102. The first source electrode 33 is electrically connected to the first level terminal 103.

A first planar layer 206, wherein the first planar layer 206 is disposed on the second electrode layer 205;

The light-emitting unit 40 is disposed on the first flat layer 206, the first drain electrode 34 is electrically connected to the first electrode 41 of the light-emitting element 40 through the opening on the first flat layer 206, and the second electrode 42 of the light-emitting unit 40 is electrically connected to the second level terminal 104. The first electrode is one of the anode and the cathode, and the second electrode is the other of the anode and the cathode.

The first semiconductor portion 31 , the first gate 32 , the first drain 34 and the first source 33 form a first transistor T1 , and the second semiconductor portion 35 , the second gate 36 , the second drain 38 and the second source 37 form a second transistor T2 .

Further, in some embodiments, the active layer 201 further includes a third semiconductor portion 51, a fourth semiconductor portion 55, a fifth semiconductor portion 57 and an intrinsic semiconductor portion 56, and the fourth semiconductor portion 55, the intrinsic semiconductor portion 56 and the fifth semiconductor portion 57 are connected in sequence;

The first electrode layer 203 further includes a third gate 52, the orthographic projection of the third gate 52 on the substrate 20 overlaps with the orthographic projection of the third semiconductor portion 51 on the substrate 20, and the third gate 52 is electrically connected to the scan signal terminal 101;

The second electrode layer 205 further includes a third drain electrode 54 and a third source electrode 53, the third drain electrode 54 and the third source electrode 53 are electrically connected to the third semiconductor portion 51 through the openings on the first insulating layer 202 and the second insulating layer 204, respectively, the third drain electrode 54 is electrically connected to the fifth semiconductor portion 57, and the third source electrode 53 is electrically connected to the signal reading terminal 105;

The display module 100 further includes:

A third electrode layer 207, the third electrode layer 207 is disposed on the first planar layer 206, the third electrode layer 207 includes a common electrode 58, and the common electrode 58 is electrically connected to the fourth semiconductor portion 55 through openings in the first insulating layer 202, the second insulating layer 204 and the first planar layer 206;

The second flat layer 208 is disposed on the third electrode layer 207, and the light emitting unit 40 is disposed on the second flat layer 208. The fourth semiconductor portion 55 is a P-type semiconductor, and the fifth semiconductor portion 57 is an N-type semiconductor.

The fourth semiconductor portion 55 , the intrinsic semiconductor portion 56 and the fifth semiconductor portion 57 are sequentially connected to form a photodiode L, and the third semiconductor portion 51 , the third gate 52 , the third drain 54 and the third source 53 form a third transistor T3 .

Further, the substrate 20 includes a first buffer layer 21, a third insulating layer 22, a first barrier layer 23, a fourth insulating layer 24, a second barrier layer 25, and a second buffer layer 26 which are stacked in sequence. The active layer 201 is arranged on a side of the second buffer layer 26 away from the first buffer layer 21. Further, the display module 100 also includes: a sixth electrode layer 302, the sixth electrode layer 302 is arranged on a side of the second buffer layer 26 away from the first buffer layer 21, the active layer 201 is arranged on the sixth electrode layer 302, the sixth electrode layer 302 includes a light shielding electrode 510, and the orthographic projection of the sixth electrode layer 302 on the substrate 20 overlaps with the orthographic projection of the intrinsic semiconductor portion 56 on the substrate 20. The light shielding electrode 510 shields the light directed to the intrinsic semiconductor portion 56, which is conducive to improving the working accuracy of the photodiode L.

Furthermore, the orthographic projection of one end of the first source 33 on the substrate 20 does not overlap with the orthographic projection of the first semiconductor portion 31 on the substrate 20 , and one end of the first source 33 is electrically connected to the first level terminal 103 through the first insulating layer 202 , the second insulating layer 204 and the opening on the substrate 20 .

The orthographic projection of one end of the second source electrode 37 on the substrate 20 does not overlap with the orthographic projection of the second semiconductor portion 35 on the substrate 20 . One end of the second source electrode 37 is electrically connected to the data signal terminal 102 through the first insulating layer 202 , the second insulating layer 204 and the opening in the substrate 20 .

In some embodiments, the second electrode layer 205 further includes a fifth routing electrode 350 , the orthographic projection of the fifth routing electrode 350 on the substrate 20 overlaps with the orthographic projection of the first routing electrode 310 on the substrate 20 , and the fifth routing electrode 350 and the first routing electrode 310 form a holding capacitor C.

In some embodiments, the second electrode layer 205 further includes:

The first connection electrode 59 is electrically connected to the fifth semiconductor portion 57 through the openings on the first insulating layer 202 and the second insulating layer 204 , and the first connection electrode 59 is electrically connected to the third drain electrode 54 .

In some embodiments, the third electrode layer 207 further includes:

The second connection electrode 39 is electrically connected to the first gate electrode 32 through the openings on the second insulating layer 204 and the first planar layer 206, and the second connection electrode 39 is electrically connected to the second drain electrode 38 through the openings on the first planar layer 206. The orthographic projection of the second connection electrode 39 on the substrate 20 overlaps with the orthographic projection of the second drain electrode 38 on the substrate and the orthographic projection of the first gate electrode 32 on the substrate 20.

In some embodiments, the orthographic projection of one end of the third source electrode 53 on the substrate 20 does not overlap with the orthographic projection of the third semiconductor portion 51 on the substrate 20 , and one end of the third source electrode 53 is electrically connected to the signal reading terminal 105 through the first insulating layer 202 , the second insulating layer 204 and the opening on the substrate 20 .

In some embodiments, the light emitting unit 40 includes a light emitting diode;

The display module 100 further includes:

The fourth electrode layer 209 is disposed on the second flat layer 208. The fourth electrode layer 209 includes an anode and a cathode of a light-emitting diode; that is, the first electrode 41 of the light-emitting element 40 is an anode, and the second electrode 42 of the light-emitting element 40 is a cathode;

A pixel definition layer 301, the pixel definition layer 301 is disposed on the fourth electrode layer 209, the pixel definition layer 301 is provided with a pixel opening, the light emitting diode chip 43 of the light emitting diode is disposed in the pixel opening, and the anode and the cathode are electrically connected to the light emitting diode chip 43 of the light emitting diode respectively;

The first drain electrode 34 is electrically connected to the anode of the light-emitting diode through the openings on the first planar layer 206 and the second planar layer 208 , and the cathode of the light-emitting diode is electrically connected to the second level terminal 104 through the openings on the first insulating layer 202 , the second insulating layer 204 , the first planar layer 206 and the second planar layer 208 .

The display module 100 further includes:

The third flat layer 303 is provided on the fourth electrode layer 209, the pixel definition layer 301 is provided on the third flat layer 303, the pixel definition layer 301 is provided with a pixel opening, and the light-emitting diode chip 43 of the light-emitting diode is provided in the pixel opening; the third flat layer is provided with an opening for exposing the first electrode 41 of the light-emitting element 40 and the second electrode 42 of the light-emitting element 40, and the light-emitting diode chip 43 of the light-emitting diode is electrically connected to the first electrode 41 of the light-emitting element 40 and the second electrode 42 of the light-emitting element 40 through the opening on the third flat layer; the packaging film layer 10 is provided on the side of the pixel definition layer 301 away from the substrate.

Please refer to Figures 6 and 7, Figure 6 is a schematic diagram of the first structure of the display panel of the present application, and Figure 7 is a schematic diagram of the second structure of the display panel of the present application. Correspondingly, the embodiment of the present application also provides a display panel 200, the display panel 200 includes the display module 100 as described above;

A substrate 210, on which the display modules 100 are arrayed, and on which the scanning lines 220, the data lines 230, the first level signal lines, the second level signal lines and the signal reading lines are arranged;

The scan line 220 is electrically connected to the scan signal terminal 101 , the data line 230 is electrically connected to the data signal terminal 102 , the first level signal line is electrically connected to the first level terminal 103 , the second level signal line is electrically connected to the second level terminal 104 , and the signal read line is electrically connected to the signal read terminal 105 .

Compared with the prior art, the beneficial effects of the array substrate provided in the embodiment of the present application are the same as the beneficial effects of the display module 100 provided by the above technical solution, which will not be elaborated here.

After the display module 100 is completed, a display panel with an array of display modules 100 is prepared. If the gate drive circuit is not provided on the display panel, the scan line 220, the data line 230, the first level signal line, the second level signal line and the signal reading line are prepared on the substrate. The exposure, development and etching process of the panel industry can be used to prepare the signal line, and the thick metal preparation process such as electroplating/chemical plating process or printing process can also be used to form a thicker metal line on the surface of the substrate; if the gate drive circuit is provided on the display panel, the gate drive circuit and the signal line need to be prepared on the substrate. After the gate drive circuit and the signal line are prepared, the prepared display modules are installed to the corresponding positions through welding or binding processes to form an array structure of the display module; then the pads on the flexible circuit board/chip-on-chip film are connected to the pads of the display panel through metal welding or binding processes, that is, the signals corresponding to the external system circuit are connected to the signal lines of the display panel; finally, a thicker transparent silicone layer can be coated on the substrate to fill the gap between the substrate and the display module, so that the preparation of the entire display panel can be completed.

Correspondingly, an embodiment of the present application further provides a display device, the display device comprising the above-mentioned display panel. Referring to FIG6 , in some embodiments, the display device further comprises a light emitting controller, a column driver and a GOA unit, the light emitting controller is electrically connected to the column driver and the GOA unit respectively, the GOA units are respectively arranged on both sides of the display panel, the GOA units are electrically connected to the scan lines 220, and the column driver is electrically connected to the data lines 230.

Please refer to Figure 7. In other embodiments of the present application, the display device also includes a light-emitting controller, a column driver and a row driver. The light-emitting controller is electrically connected to the column driver and the row driver respectively. The row driver is electrically connected to the scan line 220, and the column driver is electrically connected to the data line 230.

Compared with the prior art, the beneficial effects of the display device provided in the embodiment of the present application are the same as the beneficial effects of the display module 100 provided by the above technical solution, which will not be elaborated here.

Please refer to Figures 8 and 9, Figure 8 is a circuit connection diagram of the second embodiment of the display module of the present application, and Figure 9 is a specific structural diagram of the second embodiment of the display module of the present application. The difference between this embodiment and the embodiment provided in Figure 5 is that the source of the first transistor T1 is electrically connected to the first electrode 41 of the light emitting element 40, the drain of the first transistor T1 is electrically connected to the second level connection terminal 104, and the second electrode 42 of the light emitting element 40 is electrically connected to the first level connection terminal 103.

Furthermore, the second electrode layer 205 further includes a second wiring electrode 320, the first ends of the second wiring electrode 320 are respectively electrically connected to the drain of the first transistor T1, and the second ends of the second wiring electrode 320 are electrically connected to the second level terminal 104 through the opening on the substrate 20. The second wiring electrode is arranged in the same layer as the source of the first transistor, which can reduce the number of metal layers.

In some embodiments, the pixel driving module 30 further includes:

A holding capacitor C, wherein a first plate of the holding capacitor C is electrically connected to the gate of the first transistor T1 , and a second plate of the holding capacitor C is electrically connected to the second level connection terminal 104 .

The display module 100 further includes:

The second electrode layer 205 is disposed on the second insulating layer 204. The second electrode layer 205 includes a first drain electrode 34, a second drain electrode 38, a first source electrode 33, and a second source electrode 37. The first drain electrode 34 and the first source electrode 33 are electrically connected to the first semiconductor portion 31 through openings on the first insulating layer 202 and the second insulating layer 204, respectively. The second drain electrode 38 and the second source electrode 37 are electrically connected to the second semiconductor portion 35 through openings on the first insulating layer 202 and the second insulating layer 204, respectively. The second drain electrode 38 is electrically connected to the first gate electrode 32. The second source electrode 37 is electrically connected to the data signal terminal 102. The first drain electrode 34 is electrically connected to the second level terminal 104.

The light emitting unit 40 is disposed on the first planar layer 206 . The first source electrode 33 is electrically connected to the second electrode 42 of the light emitting element 40 through the opening on the first planar layer 206 . The first electrode of the light emitting unit 40 is electrically connected to the first level terminal 103 .

The display module 100 further includes:

Further, in some embodiments, the light emitting unit 40 includes a light emitting diode;

The display module 100 further includes:

The first source electrode 33 is electrically connected to the cathode of the light-emitting diode through the openings on the first planar layer 206 and the second planar layer 208 , and the anode of the light-emitting diode is electrically connected to the first level terminal 103 through the openings on the first insulating layer 202 , the second insulating layer 204 , the first planar layer 206 and the second planar layer 208 .

The display module 100 further includes:

Please refer to Figure 10, which is a schematic diagram of a third embodiment of the display module of the present application. This embodiment is different from the embodiment provided in Figure 5 in that the light emitting unit 40 includes an organic light emitting diode;

The display module 100 further includes:

The fourth electrode layer 209 is disposed on the second planar layer 208 . The fourth electrode layer 209 includes an anode of an organic light emitting diode; that is, the first electrode 41 of the light emitting element 40 is the anode.

The pixel definition layer 301 is disposed on the fourth electrode layer 209 . The pixel definition layer 301 is provided with a pixel opening located above the anode. The light emitting layer 43 of the organic light emitting diode is disposed in the pixel opening and electrically connected to the anode.

The fifth electrode layer 302 is disposed on the pixel definition layer 301 . The fifth electrode layer 302 includes a cathode of an organic light emitting diode, and the cathode is electrically connected to the light emitting layer 43 through a pixel opening. The second electrode 42 of the light emitting element 40 is a cathode.

The first drain electrode 34 is electrically connected to the anode through openings in the first planar layer 206 and the second planar layer 208 , and the second electrode is electrically connected to the second level terminal 104 through openings in the first insulating layer 202 , the second insulating layer 204 , the first planar layer 206 , the second planar layer 208 and the pixel definition layer 301 .

The third flat layer 303 is disposed on the fifth electrode layer 302 , and the packaging film layer 10 is disposed on a side of the third flat layer 303 away from the substrate.

The above is a detailed introduction to a display module and a display panel provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

A display module, comprising:

substrate;

A pixel driving module, wherein the pixel driving module is arranged on one side of the substrate;

A light emitting element, wherein the light emitting element is disposed on a side of the pixel driving module away from the substrate, and the pixel driving module is electrically connected to the light emitting element;

A packaging film layer, wherein the packaging film layer is arranged on a side of the light-emitting element away from the substrate;

A scanning signal wiring terminal, the scanning signal wiring terminal is arranged on a side of the substrate away from the packaging film layer, and the scanning signal wiring terminal is electrically connected to the pixel driving module through an opening on the substrate;

A data signal wiring terminal, the data signal wiring terminal is arranged on a side of the substrate away from the packaging film layer, and the data signal wiring terminal is electrically connected to the pixel driving module through an opening on the substrate;

A first level wiring terminal, which is arranged on a side of the substrate away from the packaging film layer, and is electrically connected to the light-emitting element or the pixel driving module through an opening on the substrate;

The second level connection terminal is arranged at a side of the substrate away from the packaging film layer, and the second level connection terminal is electrically connected to the pixel driving module or the light emitting element through an opening on the substrate.
The display module according to claim 1, wherein the display module further comprises:

A sensor, wherein the sensor is disposed between the substrate and the packaging film layer;

A signal reading terminal is arranged on a side of the substrate away from the packaging film layer, the signal reading terminal is electrically connected to the sensor through an opening on the substrate, and the scanning signal terminal is electrically connected to the sensor through an opening on the substrate.
The display module according to claim 1, wherein the pixel driving module comprises:

A first transistor, wherein a source electrode, a drain electrode and the light emitting element of the first transistor are connected in series between the first level wiring terminal and the second level wiring terminal;

A second transistor, wherein a gate of the second transistor is electrically connected to the scan signal terminal, a source of the second transistor is electrically connected to the data signal terminal, and a drain of the second transistor is electrically connected to the gate of the first transistor.
The display module according to claim 3, wherein the source of the first transistor is electrically connected to the first level terminal, the drain of the first transistor is electrically connected to the second electrode of the light emitting element, and the first electrode of the light emitting element is electrically connected to the second level terminal.
The display module according to claim 3, wherein the source of the first transistor is electrically connected to the first electrode of the light emitting element, the drain of the first transistor is electrically connected to the second level wiring terminal, and the second electrode of the light emitting element is electrically connected to the first level wiring terminal.
The display module according to claim 4, wherein the pixel driving module further comprises:

A holding capacitor, wherein a first plate of the holding capacitor is electrically connected to the gate of the first transistor, and a second plate of the holding capacitor is electrically connected to the first level terminal.
The display module according to claim 3, wherein the sensor comprises:

Common electrode;

a photodiode, wherein a first electrode of the photodiode is electrically connected to the common electrode;

A third transistor, wherein the drain of the third transistor is electrically connected to the second electrode of the photodiode, the source of the third transistor is electrically connected to the signal reading terminal, and the gate of the third transistor is electrically connected to the scanning signal terminal.
The display module according to claim 7, wherein the display module further comprises:

An active layer is provided between the substrate and the encapsulation film layer, and the active layer includes a semiconductor portion of the first transistor, a semiconductor portion of the second transistor, a semiconductor portion of the photodiode, and a semiconductor portion of the third transistor.
The display module according to claim 7, wherein the display module further comprises:

A first electrode layer is provided between the substrate and the packaging film layer, and the first electrode layer includes a gate of the first transistor, a gate of the second transistor, and a gate of the third transistor.
The display module according to claim 9, wherein the first electrode layer further comprises a first wiring electrode, a first end of the first wiring electrode is electrically connected to the gate of the first transistor and the gate of the third transistor respectively, and a second end of the first wiring electrode is electrically connected to the scan signal terminal through an opening on the substrate.
The display module according to claim 7, wherein the display module further comprises:

A second electrode layer, wherein the second electrode layer is disposed between the substrate and the packaging film layer, and the second electrode layer includes a source and a drain of the first transistor, a source and a drain of the second transistor, and a source and a drain of the third transistor.
The display module according to claim 11, wherein the second electrode layer further comprises a second wiring electrode, the first ends of the second wiring electrodes are respectively electrically connected to the source of the first transistor, and the second ends of the second wiring electrodes are electrically connected to the first level terminal through the opening on the substrate.
The display module according to claim 11, wherein the second electrode layer further comprises a third wiring electrode, the first ends of the third wiring electrodes are respectively electrically connected to the source of the second transistor, and the second ends of the third wiring electrodes are electrically connected to the data signal terminal through the opening on the substrate.
The display module according to claim 11, wherein the second electrode layer further comprises a fourth wiring electrode, the first ends of the fourth wiring electrodes are respectively electrically connected to the drain of the third transistor, and the second ends of the fourth wiring electrodes are electrically connected to the signal reading terminal through the opening on the substrate.
A display panel, comprising:

substrate;

A pixel driving module, wherein the pixel driving module is arranged on one side of the substrate;

A light emitting element, wherein the light emitting element is disposed on a side of the pixel driving module away from the substrate, and the pixel driving module is electrically connected to the light emitting element;

A packaging film layer, wherein the packaging film layer is arranged on a side of the light-emitting element away from the substrate;

A scanning signal wiring terminal, the scanning signal wiring terminal is arranged on a side of the substrate away from the packaging film layer, and the scanning signal wiring terminal is electrically connected to the pixel driving module through an opening on the substrate;

A data signal wiring terminal, the data signal wiring terminal is arranged on a side of the substrate away from the packaging film layer, and the data signal wiring terminal is electrically connected to the pixel driving module through an opening on the substrate;

A first level wiring terminal, which is arranged on a side of the substrate away from the packaging film layer, and is electrically connected to the light-emitting element or the pixel driving module through an opening on the substrate;

A second level wiring terminal, which is arranged on a side of the substrate away from the packaging film layer, and is electrically connected to the pixel driving module or the light emitting element through an opening on the substrate;

A substrate, on which the display modules are arrayed, and on which scan lines, data lines, first-level signal lines, second-level signal lines, and signal reading lines are arranged;

The scan line is electrically connected to the scan signal terminal, the data line is electrically connected to the data signal terminal, the first level signal line is electrically connected to the first level terminal, the second level signal line is electrically connected to the second level terminal, and the signal read line is electrically connected to the signal read terminal.
The display panel according to claim 15, wherein the display module further comprises:

A sensor, wherein the sensor is disposed between the substrate and the packaging film layer;

A signal reading terminal is arranged on a side of the substrate away from the packaging film layer, the signal reading terminal is electrically connected to the sensor through an opening on the substrate, and the scanning signal terminal is electrically connected to the sensor through an opening on the substrate.
The display panel according to claim 15, wherein the pixel driving module comprises:

A first transistor, wherein a source electrode, a drain electrode and the light emitting element of the first transistor are connected in series between the first level wiring terminal and the second level wiring terminal;

A second transistor, wherein a gate of the second transistor is electrically connected to the scan signal terminal, a source of the second transistor is electrically connected to the data signal terminal, and a drain of the second transistor is electrically connected to the gate of the first transistor.
The display panel according to claim 17, wherein the source of the first transistor is electrically connected to the first level terminal, the drain of the first transistor is electrically connected to the second electrode of the light emitting element, and the first electrode of the light emitting element is electrically connected to the second level terminal.
The display panel according to claim 17, wherein the source of the first transistor is electrically connected to the first electrode of the light emitting element, the drain of the first transistor is electrically connected to the second level terminal, and the second electrode of the light emitting element is electrically connected to the first level terminal.
The display panel according to claim 18, wherein the pixel driving module further comprises:

A holding capacitor, wherein a first plate of the holding capacitor is electrically connected to the gate of the first transistor, and a second plate of the holding capacitor is electrically connected to the first level terminal.