WO2024099169A1 - Electronic device and manufacturing method therefor - Google Patents

Electronic device and manufacturing method therefor Download PDF

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Publication number
WO2024099169A1
WO2024099169A1 PCT/CN2023/128276 CN2023128276W WO2024099169A1 WO 2024099169 A1 WO2024099169 A1 WO 2024099169A1 CN 2023128276 W CN2023128276 W CN 2023128276W WO 2024099169 A1 WO2024099169 A1 WO 2024099169A1
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WIPO (PCT)
Prior art keywords
circuit board
printed circuit
redistribution layer
emitting device
device array
Prior art date
Application number
PCT/CN2023/128276
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French (fr)
Chinese (zh)
Inventor
龙浩晖
张立
张建
Original Assignee
华为技术有限公司
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Publication of WO2024099169A1 publication Critical patent/WO2024099169A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/7685—Barrier, adhesion or liner layers the layer covering a conductive structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present application relates to the field of display technology, and in particular to an electronic device and a manufacturing method thereof.
  • the technical solution of the present application provides an electronic device and a manufacturing method thereof, which can realize a display panel design with a narrower frame.
  • an electronic device comprising a display panel, the display panel comprising: a light emitting device array; a redistribution layer, the light emitting device array being mounted on one side surface of the redistribution layer; a printed circuit board, the printed circuit board being mounted on one side surface of the redistribution layer away from the light emitting device array, the size of the printed circuit board being smaller than the size of the redistribution layer, and the edge of the redistribution layer exceeding the edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; a driver chip, the driver chip being mounted on one side surface of the printed circuit board away from the redistribution layer, the light emitting device array being electrically connected to the driver chip through wiring in the redistribution layer and wiring in the printed circuit board.
  • the electronic device includes a plurality of display panels, and any two adjacent display panels are spliced with each other based on an edge of a redistribution layer.
  • the display panel further includes related components, and the related components are mounted on a surface of the printed circuit board that is away from the redistribution layer.
  • the related devices include at least one or any combination of the following: an application processor, a power management chip, a memory, and a sensor.
  • the light emitting device array is a light emitting diode array; the light emitting diode array includes a red light emitting diode, a blue light emitting diode, and a green light emitting diode.
  • a method for manufacturing an electronic device comprising: manufacturing a redistribution layer based on a photolithography process on one side of a light-emitting device array; mounting a printed circuit board on a side of the redistribution layer away from the light-emitting device array, wherein the size of the printed circuit board is smaller than the size of the redistribution layer, and an edge of the redistribution layer exceeds an edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; mounting a driver chip on a side of the printed circuit board away from the redistribution layer, wherein the light-emitting device array is electrically connected to the driver chip through wiring in the redistribution layer and wiring in the printed circuit board.
  • the method before manufacturing a redistribution layer based on a photolithography process on one side of the light-emitting device array, the method further includes: transferring the light-emitting device array to a temporary carrier; manufacturing a redistribution layer based on a photolithography process on one side of the light-emitting device array includes: manufacturing a redistribution layer based on a photolithography process on a side of the light-emitting device array away from the temporary carrier; before mounting a driver chip on a side of the printed circuit board away from the redistribution layer, after mounting a printed circuit board on a side of the redistribution layer away from the light-emitting device array, the method further includes: removing the temporary carrier on the light-emitting device array.
  • mounting the driver chip on the side of the printed circuit board away from the redistribution layer includes: mounting the driver chip on the side of the printed circuit board away from the redistribution layer by using a surface mounting technology process.
  • mounting a printed circuit board on a side of the redistribution layer away from the light emitting device array comprises: mounting a printed circuit board on the redistribution layer The side away from the light emitting device array is mounted with a printed circuit board by using a surface mounting technology or a binding bonding technology.
  • a display panel including a light-emitting device array, a redistribution layer, a printed circuit board and a driver chip is obtained; after obtaining a plurality of display panels, the method further includes: splicing the plurality of display panels with each other based on the edges of the redistribution layer.
  • the rewiring layer is a high-precision process
  • the rewiring layer is directly manufactured on the light-emitting device array by photolithography based on the photolithography process.
  • the dense arrangement of the light-emitting device array can be ensured, that is, the display resolution is high.
  • the distance between the boundary of the light-emitting device array and the boundary of the rewiring layer is small.
  • the larger rewiring layer is bonded to the smaller printed circuit board. Even if the reserved distance of the printed circuit board boundary is large, it will not affect the boundary distance between the light-emitting device array and the rewiring layer.
  • the boundary distance between the light-emitting device array and the rewiring layer is used as the border width of the display panel, that is, a narrower display panel border is achieved, and the distance between the boundary of the light-emitting device array and the boundary of the rewiring layer is small.
  • the traditional mature PCB on-board technology is used to realize complex electrical interconnection, and the entire architecture process flow is simple, the yield is high and the cost is low.
  • FIG1 is a schematic diagram of the structure of an electronic device in the related art
  • FIG2 is a schematic diagram of the cross-sectional structure along the AA' direction in FIG1;
  • FIG3 is a schematic cross-sectional view of another electronic device in the related art.
  • FIG4 is a schematic cross-sectional view of an electronic device according to an embodiment of the present application.
  • FIG5 is a schematic diagram of the front structure of an electronic device in an embodiment of the present application.
  • FIG6 is a schematic diagram of the structure of an electronic device after a plurality of display panels are spliced together according to an embodiment of the present application;
  • FIG7 is a schematic cross-sectional view of another electronic device in an embodiment of the present application.
  • FIG. 8 is a schematic flow chart of a method for manufacturing an electronic device in an embodiment of the present application.
  • a glass substrate is used as the backplane of a light emitting diode (LED), and a driver chip is arranged on the other side of the backplane.
  • the driver chip is electrically connected to the LED through a metal signal line on the edge of the glass substrate.
  • the tolerance of the process itself causes the distance between the LED and the edge of the glass substrate to be large, generally greater than 400 ⁇ m, which leads to a significant splicing gap between the two display panels after splicing;
  • second due to the need to deposit metal wiring on the side of the glass substrate when routing on the side of the glass substrate, this sidewall deposition and etching process is difficult, resulting in a low product yield.
  • a through glass via (TGV) solution is proposed to realize the electrical connection between the LED on the front of the glass substrate and the driver chip on the back of the glass substrate.
  • This solution has a high product yield.
  • this solution still cannot solve the problem of wide display panel borders. The reason is that due to the difference in thermal expansion coefficients, TGVs cannot be densely arranged, which limits the wiring layout and the setting position of LEDs, and cannot achieve a higher resolution. If a higher resolution is to be achieved, it is necessary to occupy more space in the border area of the display panel, resulting in a wider border of the display panel.
  • an embodiment of the present application provides an electronic device, including a display panel, the display panel including: a light-emitting device array 1; a redistribution layout (RDL) 2, the light-emitting device array 1 is installed on one side surface of the redistribution layer 2; a printed circuit board (PCB) 3, the printed circuit board 3 is installed on a side surface of the redistribution layer 2 away from the light-emitting device array 1, the size of the printed circuit board 3 is smaller than the size of the redistribution layer 2, in a direction perpendicular to the plane where the printed circuit board 3 is located, the edge of the redistribution layer 2 exceeds the edge of the printed circuit board 3, the dotted box in Figure 5 is the edge of the printed circuit board 3, that is, one function of the redistribution layer 2 is fan-in, that is, the terminals on one side surface used to electrically connect the light-emitting device array 1 are converted into terminals with a smaller overall occupancy area after wiring and provided on the
  • the printed circuit board is a coarse-precision process. If the printed circuit board and the light-emitting device array are to be mounted together, a certain reserved distance, such as 0.5 mm, must be ensured between the boundary of the printed circuit board and the boundary of the light-emitting device array to ensure successful mounting. This will result in a larger width of the display panel border.
  • the rewiring layer 2 is a high-precision process. The rewiring layer 2 is made directly on the light-emitting device array 1 by photolithography based on the photolithography process. On the one hand, the dense arrangement of the light-emitting device array 1 can be ensured, that is, the display resolution is high.
  • the distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 is small.
  • the fan-in effect of the rewiring layer 2 is used to make the larger rewiring layer 2 fit with the smaller printed circuit board 3. Even if the reserved distance of the boundary of the printed circuit board 3 is large, it will not affect the boundary distance between the light-emitting device array 1 and the rewiring layer 2.
  • the boundary distance between the light-emitting device array 1 and the rewiring layer 2 is used as the border width of the display panel, that is, a narrower display panel border is achieved.
  • the distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 can be reduced to tens of ⁇ m.
  • the distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 is less than or equal to 0.3mm.
  • the traditional mature PCB on-board technology is used to realize complex electrical interconnection. The entire architecture process is simple, the yield is high and the cost is low.
  • the electronic device includes a plurality of display panels, and any two adjacent display panels are spliced with each other based on the edge of the redistribution layer 2.
  • the splicing gap is determined by the border width of adjacent display panels, that is, the splicing gap is the distance between the boundaries of the light-emitting device arrays 1 in adjacent display panels, and in the embodiment of the present application, due to the high-precision process characteristics of the redistribution layer 2, the distance between the redistribution layer 2 and the boundary of the light-emitting device array 1 is small, and finally they are spliced with each other based on the edge of the redistribution layer 2, so the splicing gap is small.
  • each individual small-sized display panel is about 22 inches
  • the overall display panel size of the electronic device after splicing can be greater than 100 inches, that is, small-sized display panels can be made first, and then seamlessly spliced, so as to realize electronic devices with large-screen displays.
  • the overall architecture and assembly process are simple, and can support large-screen home use.
  • the display panel further includes related devices, which are mounted on a surface of the printed circuit board 3 on one side away from the redistribution layer 2.
  • the related devices may be non-display related devices, that is, further integration is performed based on the printed circuit board 3, and the printed circuit board 3 is reused as the main board of the overall electronic device.
  • the related devices are integrated on the printed circuit board 3, thereby realizing two-in-one multiplexing between the display carrier board and the main board.
  • the related devices include at least one or any combination of the following: an application processor (AP), a power management IC (PMIC), a memory, and a sensor.
  • AP application processor
  • PMIC power management IC
  • memory a memory
  • sensor a sensor
  • the embodiment of the present application does not limit the type and quantity of the sensor. It should be noted that the driver chip is omitted in FIG. 7 .
  • the light emitting device array 1 is a light emitting diode (LED) array; the light emitting diode array includes a red light emitting diode 11 , a blue light emitting diode 12 and a green light emitting diode 13 to realize the display of a color picture.
  • LED light emitting diode
  • the embodiment of the present application further provides a method for manufacturing an electronic device, including:
  • Step 101 a redistribution layer 2 is produced on one side of the light-emitting device array 1 based on a photolithography process. Taking two layers of redistribution layers 2 as an example, the first redistribution layer 21 is produced first, and then the second redistribution layer 22 is produced. The production of the redistribution layer 2 is realized. The number of layers of the redistribution layer 2 can be set according to needs. Two layers are just an example here.
  • Step 102 mounting a printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1 , wherein the size of the printed circuit board 3 is smaller than that of the redistribution layer 2 , and the edge of the redistribution layer 2 exceeds the edge of the printed circuit board 3 in a direction perpendicular to the plane where the printed circuit board 3 is located.
  • Step 103 mounting a driver chip 4 on a side of the printed circuit board 3 away from the redistribution layer 2 , and the light emitting device array 1 is electrically connected to the driver chip 4 through wiring in the redistribution layer 2 and wiring in the printed circuit board 3 .
  • the electronic device manufactured by the manufacturing method is the same as the electronic device in the above embodiment, so the specific structure and principle of the electronic device are not described in detail.
  • the rewiring layer 2 is made by photolithography, which is a high-precision process, the rewiring layer 2 is made directly on the light-emitting device array 1 by photolithography based on the photolithography process.
  • the dense arrangement of the light-emitting device array 1 can be guaranteed, that is, the display resolution is high.
  • the distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 is small.
  • the boundary distance between the light-emitting device array 1 and the rewiring layer 2 is used as the border width of the display panel, that is, a narrower display panel border is achieved.
  • the traditional mature PCB on-board technology is used to realize complex electrical interconnection, and the entire architecture process flow is simple, with a high yield and low cost.
  • the method further includes: step 100, transferring the light emitting device array 1 to the temporary carrier 10;
  • Step 103 before mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2, and after step 102, after mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light emitting device array 1, further comprising:
  • Step 104 removing the temporary carrier 10 on the light emitting device array 1 .
  • step 103, mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2 includes: mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2 by using a surface mounting technology (SMT) process.
  • SMT surface mounting technology
  • step 102, mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1, includes: mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1 by using a surface mounting technology (SMT) process or a bonding technology.
  • SMT surface mounting technology
  • step 103 after mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2, a display panel including the light-emitting device array 1, the redistribution layer 2, the printed circuit board 3 and the driver chip 4 is obtained; after obtaining multiple display panels, the step may further include: splicing the multiple display panels together based on the edges of the redistribution layer 2 to obtain a spliced display panel structure as shown in FIG6.
  • the electronic device in the embodiment of the present application can be any electronic device with display function, such as a wearable watch, a tablet computer or a TV, and can be an electronic device with a plurality of display panels spliced together for display, or can be an electronic device with a non-spliced display having only one display panel.
  • the embodiment of the present application can realize a narrow frame design to increase the screen-to-body ratio and provide a larger visible area under the premise of occupying a smaller space; for electronic devices with spliced display, in addition to realizing a narrow frame design, the splicing gap can also be reduced to improve the overall display effect after splicing.
  • “at least one” refers to one or more, and “plurality” refers to two or more.
  • “And/or” describes the association relationship of associated objects, indicating that three relationships may exist.
  • a and/or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone. Among them, A and B can be singular or plural.
  • the character “/” generally indicates that the previous and subsequent associated objects are in an "or” relationship.
  • “At least one of the following” and similar expressions refer to any combination of these items, including any combination of single or plural items.
  • At least one of a, b and c can be represented by: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple.

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Abstract

The embodiments of the present application relate to the technical field of display. Provided are an electronic device and a manufacturing method therefor, which can realize the design of a display panel with a narrow frame. The electronic device comprises a display panel, and the display panel comprises: a light-emitting device array; a rewiring layer, the light-emitting device array being mounted on a side surface of the rewiring layer; a printed circuit board, which is mounted on the side surface of the rewiring layer that is away from the light-emitting device array, wherein the size of the printed circuit board is smaller than that of the rewiring layer, and in a direction perpendicular to the plane where the printed circuit board is located, the edge of the rewiring layer extends beyond the edge of the printed circuit board; and a driving chip, which is mounted on the side surface of the printed circuit board that is away from the rewiring layer, wherein the light-emitting device array is electrically connected to the driving chip by means of a wire in the rewiring layer and a wire in the printed circuit board.

Description

电子设备及其制作方法Electronic device and method for manufacturing the same
本申请要求于2022年11月10日提交中国国家知识产权局、申请号为202211407283.2、申请名称为“电子设备及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 10, 2022, with application number 202211407283.2 and application name “Electronic device and its manufacturing method”, all contents of which are incorporated by reference in this application.
技术领域Technical Field
本申请涉及显示技术领域，特别涉及一种电子设备及其制作方法。The present application relates to the field of display technology, and in particular to an electronic device and a manufacturing method thereof.
背景技术Background technique
随着显示技术的发展，用户不断追求极致的显示体验。例如，对于手机、平板电脑、穿戴设备等电子设备中的屏幕，窄边框设计越来越受欢迎，以实现在小尺寸下更大可视画面的呈现。又例如，为了沉浸式的观影效果，大尺寸的显示屏越来越受欢迎，出现了98寸电视、110寸电视等，然而如此巨大的尺寸对于运输和安装入户来说比较困难，因此出现了模块化拼接大尺寸电视，其中单个模块尺寸小，便于运输、安装和维修，拼接后形成大尺寸的电视，但是拼接屏幕存在拼接缝隙大的问题，而拼接缝隙大的原因在于显示面板的边框尺寸较宽。With the development of display technology, users are constantly pursuing the ultimate display experience. For example, for screens in electronic devices such as mobile phones, tablets, and wearable devices, narrow-frame designs are becoming more and more popular to achieve a larger visible picture at a small size. For another example, in order to achieve an immersive viewing effect, large-size display screens are becoming more and more popular, and 98-inch TVs and 110-inch TVs have appeared. However, such a huge size is difficult to transport and install at home, so modular spliced large-size TVs have appeared. The size of a single module is small, which is easy to transport, install and maintain. After splicing, a large-size TV is formed. However, the spliced screen has a large splicing gap problem, and the reason for the large splicing gap is that the frame size of the display panel is relatively wide.
所以说，对于目前的电子设备，如何实现较窄边框的显示面板设计成为了待解决的问题。Therefore, for current electronic devices, how to achieve a display panel design with a narrower border has become a problem to be solved.
发明内容Summary of the invention
本申请技术方案提供了一种电子设备及其制作方法，可以实现较窄边框的显示面板设计。The technical solution of the present application provides an electronic device and a manufacturing method thereof, which can realize a display panel design with a narrower frame.
第一方面，提供一种电子设备，包括显示面板，显示面板包括：发光器件阵列；重布线层，发光器件阵列安装于重布线层的一侧表面；印刷电路板，印刷电路板安装于重布线层远离发光器件阵列的一侧表面，印刷电路板的尺寸小于重布线层的尺寸，在垂直于印刷电路板所在平面的方向上，重布线层的边缘超出印刷电路板的边缘；驱动芯片，驱动芯片安装于印刷电路板远离重布线层的一侧表面，发光器件阵列通过重布线层中的布线以及印刷电路板中的布线电连接于驱动芯片。In a first aspect, an electronic device is provided, comprising a display panel, the display panel comprising: a light emitting device array; a redistribution layer, the light emitting device array being mounted on one side surface of the redistribution layer; a printed circuit board, the printed circuit board being mounted on one side surface of the redistribution layer away from the light emitting device array, the size of the printed circuit board being smaller than the size of the redistribution layer, and the edge of the redistribution layer exceeding the edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; a driver chip, the driver chip being mounted on one side surface of the printed circuit board away from the redistribution layer, the light emitting device array being electrically connected to the driver chip through wiring in the redistribution layer and wiring in the printed circuit board.
在一种可能的实施方式中，电子设备包括多个显示面板，任意相邻的两个显示面板基于重布线层的边缘相互拼接。In a possible implementation, the electronic device includes a plurality of display panels, and any two adjacent display panels are spliced with each other based on an edge of a redistribution layer.
在一种可能的实施方式中，显示面板还包括相关器件，相关器件安装于印刷电路板远离重布线层的一侧表面。In a possible implementation manner, the display panel further includes related components, and the related components are mounted on a surface of the printed circuit board that is away from the redistribution layer.
在一种可能的实施方式中，相关器件包括以下各项中的至少一项或任意组合：应用处理器、电源管理芯片、存储器和传感器。In a possible implementation, the related devices include at least one or any combination of the following: an application processor, a power management chip, a memory, and a sensor.
在一种可能的实施方式中，发光器件阵列为发光二极管阵列；发光二极管阵列包括红色发光二极管、蓝色发光二极管和绿色发光二极管。In a possible implementation, the light emitting device array is a light emitting diode array; the light emitting diode array includes a red light emitting diode, a blue light emitting diode, and a green light emitting diode.
第二方面，提供一种电子设备的制作方法，包括：在发光器件阵列的一侧基于光刻工艺制作重布线层；在重布线层远离发光器件阵列的一侧贴装印刷电路板，印刷电路板的尺寸小于重布线层的尺寸，在垂直于印刷电路板所在平面的方向上，重布线层的边缘超出印刷电路板的边缘；在印刷电路板远离重布线层的一侧贴装驱动芯片，发光器件阵列通过重布线层中的布线以及印刷电路板中的布线电连接于驱动芯片。In a second aspect, a method for manufacturing an electronic device is provided, comprising: manufacturing a redistribution layer based on a photolithography process on one side of a light-emitting device array; mounting a printed circuit board on a side of the redistribution layer away from the light-emitting device array, wherein the size of the printed circuit board is smaller than the size of the redistribution layer, and an edge of the redistribution layer exceeds an edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; mounting a driver chip on a side of the printed circuit board away from the redistribution layer, wherein the light-emitting device array is electrically connected to the driver chip through wiring in the redistribution layer and wiring in the printed circuit board.
在一种可能的实施方式中，在发光器件阵列的一侧基于光刻工艺制作重布线层之前，还包括：将发光器件阵列转移至临时载板上；在发光器件阵列的一侧基于光刻工艺制作重布线层包括：在发光器件阵列远离临时载板的一侧基于光刻工艺制作重布线层；在印刷电路板远离重布线层的一侧贴装驱动芯片之前，在重布线层远离发光器件阵列的一侧贴装印刷电路板之后，还包括：去除发光器件阵列上的临时载板。In a possible embodiment, before manufacturing a redistribution layer based on a photolithography process on one side of the light-emitting device array, the method further includes: transferring the light-emitting device array to a temporary carrier; manufacturing a redistribution layer based on a photolithography process on one side of the light-emitting device array includes: manufacturing a redistribution layer based on a photolithography process on a side of the light-emitting device array away from the temporary carrier; before mounting a driver chip on a side of the printed circuit board away from the redistribution layer, after mounting a printed circuit board on a side of the redistribution layer away from the light-emitting device array, the method further includes: removing the temporary carrier on the light-emitting device array.
在一种可能的实施方式中，在印刷电路板远离重布线层的一侧贴装驱动芯片包括：在印刷电路板远离重布线层的一侧通过表面贴装技术工艺贴装驱动芯片。In a possible implementation, mounting the driver chip on the side of the printed circuit board away from the redistribution layer includes: mounting the driver chip on the side of the printed circuit board away from the redistribution layer by using a surface mounting technology process.
在一种可能的实施方式中，在重布线层远离发光器件阵列的一侧贴装印刷电路板包括：在重布线层 远离发光器件阵列的一侧通过表面贴装技术工艺或者绑定键合技术贴装印刷电路板。In a possible implementation manner, mounting a printed circuit board on a side of the redistribution layer away from the light emitting device array comprises: mounting a printed circuit board on the redistribution layer The side away from the light emitting device array is mounted with a printed circuit board by using a surface mounting technology or a binding bonding technology.
在一种可能的实施方式中，在印刷电路板远离重布线层的一侧贴装驱动芯片后得到包括发光器件阵列、重布线层、印刷电路板和驱动芯片的显示面板；在得到多个显示面板后，还包括：将多个显示面板基于重布线层的边缘相互拼接。In a possible implementation, after mounting a driver chip on a side of a printed circuit board away from a redistribution layer, a display panel including a light-emitting device array, a redistribution layer, a printed circuit board and a driver chip is obtained; after obtaining a plurality of display panels, the method further includes: splicing the plurality of display panels with each other based on the edges of the redistribution layer.
本申请实施例中的电子设备及其制作方法中，由于重布线层是一个高精度的工艺，直接在发光器件阵列上通过光刻基于光刻工艺制作重布线层，一方面，可以保证发光器件阵列的密排，即显示分辨率较高，另一方面，发光器件阵列边界和重布线层边界之间的距离较小，在重布线层制作完成之后，较大的重布线层与较小的印刷电路板贴合，即便印刷电路板边界预留距离较大，也不会影响发光器件阵列与重布线层的边界距离，最终以发光器件阵列与重布线层的边界距离作为显示面板的边框宽度，即实现了较窄的显示面板边框，发光器件阵列边界和重布线层边界之间的距离较小。另外，利用传统成熟的PCB板载技术实现复杂的电学互联，整个架构工艺流程简单，良率较高且成本较低。In the electronic device and its manufacturing method in the embodiment of the present application, since the rewiring layer is a high-precision process, the rewiring layer is directly manufactured on the light-emitting device array by photolithography based on the photolithography process. On the one hand, the dense arrangement of the light-emitting device array can be ensured, that is, the display resolution is high. On the other hand, the distance between the boundary of the light-emitting device array and the boundary of the rewiring layer is small. After the rewiring layer is manufactured, the larger rewiring layer is bonded to the smaller printed circuit board. Even if the reserved distance of the printed circuit board boundary is large, it will not affect the boundary distance between the light-emitting device array and the rewiring layer. Finally, the boundary distance between the light-emitting device array and the rewiring layer is used as the border width of the display panel, that is, a narrower display panel border is achieved, and the distance between the boundary of the light-emitting device array and the boundary of the rewiring layer is small. In addition, the traditional mature PCB on-board technology is used to realize complex electrical interconnection, and the entire architecture process flow is simple, the yield is high and the cost is low.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为相关技术中一种电子设备的结构示意图；FIG1 is a schematic diagram of the structure of an electronic device in the related art;
图2为图1中AA’向的剖面结构示意图；FIG2 is a schematic diagram of the cross-sectional structure along the AA' direction in FIG1;
图3为相关技术中另一种电子设备的剖面结构示意图；FIG3 is a schematic cross-sectional view of another electronic device in the related art;
图4为本申请实施例中一种电子设备的剖面结构示意图；FIG4 is a schematic cross-sectional view of an electronic device according to an embodiment of the present application;
图5为本申请实施例中一种电子设备的正面结构示意图；FIG5 is a schematic diagram of the front structure of an electronic device in an embodiment of the present application;
图6为本申请实施例中一种多个显示面板拼接后的电子设备结构示意图；FIG6 is a schematic diagram of the structure of an electronic device after a plurality of display panels are spliced together according to an embodiment of the present application;
图7为本申请实施例中另一种电子设备的剖面结构示意图；FIG7 is a schematic cross-sectional view of another electronic device in an embodiment of the present application;
图8为本申请实施例中一种电子设备的制作方法流程示意图。FIG. 8 is a schematic flow chart of a method for manufacturing an electronic device in an embodiment of the present application.
具体实施方式Detailed ways
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.
在对本申请实施例进行说明之前，首先对相关技术及其技术问题进行介绍。Before describing the embodiments of the present application, the related technologies and their technical problems are first introduced.
如图1和图2所示，在一种相关技术中，采用玻璃基板作为发光二极管(Light Emitting Diode，LED)的背板，在背板的另一侧设置有驱动芯片，驱动芯片通过玻璃基板边缘的金属信号线实现与LED的电连接。这种方案中存在两个问题，一是由于玻璃基板和LED之间采用绑定bonding键合的互联工艺，其工艺自身的公差导致LED与玻璃基板边缘之间的距离较大，一般大于400μm，这导致拼接后的两个显示面板之间的拼接缝隙明显；二是由于在玻璃基板侧面走线需要在玻璃侧边沉积金属走线，这种侧壁沉积和刻蚀工艺难度较大，导致产品良率较低。As shown in Figures 1 and 2, in a related technology, a glass substrate is used as the backplane of a light emitting diode (LED), and a driver chip is arranged on the other side of the backplane. The driver chip is electrically connected to the LED through a metal signal line on the edge of the glass substrate. There are two problems in this solution. First, due to the bonding interconnection process between the glass substrate and the LED, the tolerance of the process itself causes the distance between the LED and the edge of the glass substrate to be large, generally greater than 400μm, which leads to a significant splicing gap between the two display panels after splicing; second, due to the need to deposit metal wiring on the side of the glass substrate when routing on the side of the glass substrate, this sidewall deposition and etching process is difficult, resulting in a low product yield.
如图3所示，在另一种相关技术中，为了降低侧壁走线导致的产品良率低的问题，提出了玻璃通孔(Through Glass Via，TGV)方案来实现玻璃基板正面的LED和玻璃基板背面的驱动芯片之间的电连接，这种方案的产品良率较高。但是，这种方案仍无法解决显示面板边框较宽的问题，原因在于，由于热膨胀系数差异的问题，TGV不能密排，从而限制了走线布局和LED的设置位置，无法实现较高的分辨率，如果要实现较高的分辨率，则需要在显示面板的边框区域占用较多的空间，从而导致显示面板的边框较宽。As shown in FIG3 , in another related technology, in order to reduce the problem of low product yield caused by sidewall wiring, a through glass via (TGV) solution is proposed to realize the electrical connection between the LED on the front of the glass substrate and the driver chip on the back of the glass substrate. This solution has a high product yield. However, this solution still cannot solve the problem of wide display panel borders. The reason is that due to the difference in thermal expansion coefficients, TGVs cannot be densely arranged, which limits the wiring layout and the setting position of LEDs, and cannot achieve a higher resolution. If a higher resolution is to be achieved, it is necessary to occupy more space in the border area of the display panel, resulting in a wider border of the display panel.
为解决上述问题，提供了本申请实施例的技术方案，下面对本申请实施例的技术方案进行说明。In order to solve the above problems, a technical solution of an embodiment of the present application is provided, and the technical solution of the embodiment of the present application is described below.
如图4和图5所示，本申请实施例提供一种电子设备，包括显示面板，显示面板包括：发光器件阵列1；重布线层(Redistribution Layout，RDL)2，发光器件阵列1安装于重布线层2的一侧表面；印刷电路板(Printed Circuit Board，PCB)3，印刷电路板3安装于重布线层2远离发光器件阵列1的一侧表面，印刷电路板3的尺寸小于重布线层2的尺寸，在垂直于印刷电路板3所在平面的方向上，重布线层2的边缘超出印刷电路板3的边缘，图5中虚线框为印刷电路板3的边缘，也就是说，重布线层2的一个作用是扇入fanin，即将一侧表面用于电连接发光器件阵列1的端子通过布线后变为整体占用面积较小的端子后在另一侧表面提供，以便于较小尺寸的印刷电路板3可以与重布线层2实现电路互联；驱动芯片4，驱动芯片4安装于印刷电路板3远离重布线层2的一侧表面，发光器件阵列1通过重布线层2 中的布线以及印刷电路板3中的布线电连接于驱动芯片4。需要说明的是，图4和图5中不同部分之间的尺寸比例并不一定一致。As shown in Figures 4 and 5, an embodiment of the present application provides an electronic device, including a display panel, the display panel including: a light-emitting device array 1; a redistribution layout (RDL) 2, the light-emitting device array 1 is installed on one side surface of the redistribution layer 2; a printed circuit board (PCB) 3, the printed circuit board 3 is installed on a side surface of the redistribution layer 2 away from the light-emitting device array 1, the size of the printed circuit board 3 is smaller than the size of the redistribution layer 2, in a direction perpendicular to the plane where the printed circuit board 3 is located, the edge of the redistribution layer 2 exceeds the edge of the printed circuit board 3, the dotted box in Figure 5 is the edge of the printed circuit board 3, that is, one function of the redistribution layer 2 is fan-in, that is, the terminals on one side surface used to electrically connect the light-emitting device array 1 are converted into terminals with a smaller overall occupancy area after wiring and provided on the other side surface, so that the smaller-sized printed circuit board 3 can realize circuit interconnection with the redistribution layer 2; a driver chip 4, the driver chip 4 is installed on a side surface of the printed circuit board 3 away from the redistribution layer 2, the light-emitting device array 1 is connected to the redistribution layer 2 through the redistribution layer 2 The wiring in the circuit board 3 and the wiring in the printed circuit board 3 are electrically connected to the driving chip 4. It should be noted that the size ratios of different parts in Figures 4 and 5 are not necessarily consistent.
具体地，印刷电路板是一个粗精度的工艺，如果印刷电路板与发光器件阵列之间贴合安装，则必须要保证印刷电路板边界与发光器件阵列边界之间具有一定预留距离，例如0.5mm，才能够保证贴合成功，这样就会导致显示面板边框宽度较大。而重布线层2是一个高精度的工艺，直接在发光器件阵列1上通过光刻基于光刻工艺制作重布线层2，一方面，可以保证发光器件阵列1的密排，即显示分辨率较高，另一方面，发光器件阵列1边界和重布线层2边界之间的距离较小，在重布线层2制作完成之后，利用重布线层2的扇入作用，使较大的重布线层2与较小的印刷电路板3贴合，即便印刷电路板3边界预留距离较大，也不会影响发光器件阵列1与重布线层2的边界距离，最终以发光器件阵列1与重布线层2的边界距离作为显示面板的边框宽度，即实现了较窄的显示面板边框，发光器件阵列1边界和重布线层2边界之间的距离可以减小至几十μm，例如，发光器件阵列1边界和重布线层2边界之间的距离小于或等于0.3mm。另外，利用传统成熟的PCB板载技术实现复杂的电学互联，整个架构工艺流程简单，良率较高且成本较低。Specifically, the printed circuit board is a coarse-precision process. If the printed circuit board and the light-emitting device array are to be mounted together, a certain reserved distance, such as 0.5 mm, must be ensured between the boundary of the printed circuit board and the boundary of the light-emitting device array to ensure successful mounting. This will result in a larger width of the display panel border. The rewiring layer 2 is a high-precision process. The rewiring layer 2 is made directly on the light-emitting device array 1 by photolithography based on the photolithography process. On the one hand, the dense arrangement of the light-emitting device array 1 can be ensured, that is, the display resolution is high. On the other hand, the distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 is small. After the rewiring layer 2 is completed, the fan-in effect of the rewiring layer 2 is used to make the larger rewiring layer 2 fit with the smaller printed circuit board 3. Even if the reserved distance of the boundary of the printed circuit board 3 is large, it will not affect the boundary distance between the light-emitting device array 1 and the rewiring layer 2. Finally, the boundary distance between the light-emitting device array 1 and the rewiring layer 2 is used as the border width of the display panel, that is, a narrower display panel border is achieved. The distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 can be reduced to tens of μm. For example, the distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 is less than or equal to 0.3mm. In addition, the traditional mature PCB on-board technology is used to realize complex electrical interconnection. The entire architecture process is simple, the yield is high and the cost is low.
在一种可能的实施方式中，如图6所示，电子设备包括多个显示面板，任意相邻的两个显示面板基于重布线层2的边缘相互拼接。对于拼接显示的电子设备，由于拼接缝隙由相邻显示面板的边框宽度决定，即拼接缝隙为相邻显示面板中发光器件阵列1边界之间的距离，而本申请实施例中，由于重布线层2的高精度工艺的特点，使得重布线层2与发光器件阵列1边界之间的距离较小，且最终基于重布线层2的边缘相互拼接，因此拼接缝隙较小。例如，每个单独的小尺寸显示面板的尺寸为22寸左右，拼接之后的电子设备的整体显示面板尺寸可以大于100寸，即可以先制作小尺寸的显示面板，然后进行无缝拼接，从而实现大屏显示的电子设备，整体架构和组装流程简单，可以支持大屏入户。In one possible implementation, as shown in FIG6 , the electronic device includes a plurality of display panels, and any two adjacent display panels are spliced with each other based on the edge of the redistribution layer 2. For electronic devices with spliced displays, since the splicing gap is determined by the border width of adjacent display panels, that is, the splicing gap is the distance between the boundaries of the light-emitting device arrays 1 in adjacent display panels, and in the embodiment of the present application, due to the high-precision process characteristics of the redistribution layer 2, the distance between the redistribution layer 2 and the boundary of the light-emitting device array 1 is small, and finally they are spliced with each other based on the edge of the redistribution layer 2, so the splicing gap is small. For example, the size of each individual small-sized display panel is about 22 inches, and the overall display panel size of the electronic device after splicing can be greater than 100 inches, that is, small-sized display panels can be made first, and then seamlessly spliced, so as to realize electronic devices with large-screen displays. The overall architecture and assembly process are simple, and can support large-screen home use.
在一种可能的实施方式中，如图7所示，显示面板还包括相关器件，相关器件安装于印刷电路板3远离重布线层2的一侧表面，相关器件可以为非显示相关的器件，即基于印刷电路板3进一步进行集成，将印刷电路板3复用作为整体电子设备的主板，将相关器件集成设置在印刷电路板3上，从而实现显示载板和主板之间的二合一复用。In a possible implementation, as shown in FIG. 7 , the display panel further includes related devices, which are mounted on a surface of the printed circuit board 3 on one side away from the redistribution layer 2. The related devices may be non-display related devices, that is, further integration is performed based on the printed circuit board 3, and the printed circuit board 3 is reused as the main board of the overall electronic device. The related devices are integrated on the printed circuit board 3, thereby realizing two-in-one multiplexing between the display carrier board and the main board.
在一种可能的实施方式中，相关器件包括以下各项中的至少一项或任意组合：应用处理器(Application Process，AP)、电源管理芯片(Power Management IC，PMIC)、存储器memory和传感器，本申请实施例对于传感器的类型和数量不做限定。需要说明的是，图7中省略了驱动芯片。In a possible implementation, the related devices include at least one or any combination of the following: an application processor (AP), a power management IC (PMIC), a memory, and a sensor. The embodiment of the present application does not limit the type and quantity of the sensor. It should be noted that the driver chip is omitted in FIG. 7 .
在一种可能的实施方式中，如图5所示，发光器件阵列1为发光二极管LED阵列；发光二极管阵列包括红色发光二极管11、蓝色发光二极管12和绿色发光二极管13，以实现彩色画面的显示。In a possible implementation, as shown in FIG. 5 , the light emitting device array 1 is a light emitting diode (LED) array; the light emitting diode array includes a red light emitting diode 11 , a blue light emitting diode 12 and a green light emitting diode 13 to realize the display of a color picture.
如图8所示，本申请实施例还提供一种电子设备的制作方法，包括：As shown in FIG8 , the embodiment of the present application further provides a method for manufacturing an electronic device, including:
步骤101、在发光器件阵列1的一侧基于光刻工艺制作重布线层2，以两层重布线层2为例，首先制作其中的第一重布线层21，再制作第二重布线层22，即实现了重布线层2的制作，重布线层2的层数具体可以根据需要设置，这里两层仅为举例。Step 101, a redistribution layer 2 is produced on one side of the light-emitting device array 1 based on a photolithography process. Taking two layers of redistribution layers 2 as an example, the first redistribution layer 21 is produced first, and then the second redistribution layer 22 is produced. The production of the redistribution layer 2 is realized. The number of layers of the redistribution layer 2 can be set according to needs. Two layers are just an example here.
步骤102、在重布线层2远离发光器件阵列1的一侧贴装印刷电路板3，印刷电路板3的尺寸小于重布线层2的尺寸，在垂直于印刷电路板3所在平面的方向上，重布线层2的边缘超出印刷电路板3的边缘。Step 102 , mounting a printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1 , wherein the size of the printed circuit board 3 is smaller than that of the redistribution layer 2 , and the edge of the redistribution layer 2 exceeds the edge of the printed circuit board 3 in a direction perpendicular to the plane where the printed circuit board 3 is located.
步骤103、在印刷电路板3远离重布线层2的一侧贴装驱动芯片4，发光器件阵列1通过重布线层2中的布线以及印刷电路板3中的布线电连接于驱动芯片4。Step 103 , mounting a driver chip 4 on a side of the printed circuit board 3 away from the redistribution layer 2 , and the light emitting device array 1 is electrically connected to the driver chip 4 through wiring in the redistribution layer 2 and wiring in the printed circuit board 3 .
通过该制作方法制作得到的电子设备与上述实施例中的电子设备相同，因此电子设备的具体结构和原理不再赘述。The electronic device manufactured by the manufacturing method is the same as the electronic device in the above embodiment, so the specific structure and principle of the electronic device are not described in detail.
其中，由于重布线层2通过光刻工艺制作，是一个高精度的工艺，直接在发光器件阵列1上通过光刻基于光刻工艺制作重布线层2，一方面，可以保证发光器件阵列1的密排，即显示分辨率较高，另一方面，发光器件阵列1边界和重布线层2边界之间的距离较小，在重布线层2制作完成之后，利用重布线层2的扇入作用，使较大的重布线层2与较小的印刷电路板3贴合，即便印刷电路板3边界预留距离较大，也不会影响发光器件阵列1与重布线层2的边界距离，最终以发光器件阵列1与重布线层2的边界距离作为显示面板的边框宽度，即实现了较窄的显示面板边框。另外，利用传统成熟的PCB板载技术实现复杂的电学互联，整个架构工艺流程简单，良率较高且成本较低。 Among them, since the rewiring layer 2 is made by photolithography, which is a high-precision process, the rewiring layer 2 is made directly on the light-emitting device array 1 by photolithography based on the photolithography process. On the one hand, the dense arrangement of the light-emitting device array 1 can be guaranteed, that is, the display resolution is high. On the other hand, the distance between the boundary of the light-emitting device array 1 and the boundary of the rewiring layer 2 is small. After the rewiring layer 2 is completed, the fan-in effect of the rewiring layer 2 is used to make the larger rewiring layer 2 fit with the smaller printed circuit board 3. Even if the reserved distance of the boundary of the printed circuit board 3 is large, it will not affect the boundary distance between the light-emitting device array 1 and the rewiring layer 2. Finally, the boundary distance between the light-emitting device array 1 and the rewiring layer 2 is used as the border width of the display panel, that is, a narrower display panel border is achieved. In addition, the traditional mature PCB on-board technology is used to realize complex electrical interconnection, and the entire architecture process flow is simple, with a high yield and low cost.
在一种可能的实施方式中，步骤101、在发光器件阵列1的一侧基于光刻工艺制作重布线层2之前，还包括：步骤100、将发光器件阵列1转移至临时载板10上；In a possible implementation manner, before step 101, manufacturing the redistribution layer 2 on one side of the light emitting device array 1 based on the photolithography process, the method further includes: step 100, transferring the light emitting device array 1 to the temporary carrier 10;
步骤101、在发光器件阵列1的一侧基于光刻工艺制作重布线层2包括：在发光器件阵列1远离临时载板10的一侧基于光刻工艺制作重布线层2；Step 101, manufacturing a redistribution layer 2 on one side of the light emitting device array 1 based on a photolithography process comprises: manufacturing a redistribution layer 2 on a side of the light emitting device array 1 away from the temporary carrier 10 based on a photolithography process;
步骤103、在印刷电路板3远离重布线层2的一侧贴装驱动芯片4之前，步骤102、在重布线层2远离发光器件阵列1的一侧贴装印刷电路板3之后，还包括：Step 103, before mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2, and after step 102, after mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light emitting device array 1, further comprising:
步骤104、去除发光器件阵列1上的临时载板10。Step 104 : removing the temporary carrier 10 on the light emitting device array 1 .
在一种可能的实施方式中，步骤103、在印刷电路板3远离重布线层2的一侧贴装驱动芯片4包括：在印刷电路板3远离重布线层2的一侧通过表面贴装技术(Surface Mounted Technology，SMT)工艺贴装驱动芯片4。In one possible implementation, step 103, mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2 includes: mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2 by using a surface mounting technology (SMT) process.
在一种可能的实施方式中，步骤102、在重布线层2远离发光器件阵列1的一侧贴装印刷电路板3包括：在重布线层2远离发光器件阵列1的一侧通过表面贴装技术SMT工艺或者绑定bonding键合技术贴装印刷电路板3。In a possible implementation, step 102, mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1, includes: mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1 by using a surface mounting technology (SMT) process or a bonding technology.
在一种可能的实施方式中，步骤103、在印刷电路板3远离重布线层2的一侧贴装驱动芯片4后得到包括发光器件阵列1、重布线层2、印刷电路板3和驱动芯片4的显示面板；在得到多个显示面板后，还可以包括：将多个显示面板基于重布线层2的边缘相互拼接。以得到如图6所示的拼接显示面板结构。In a possible implementation, step 103, after mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2, a display panel including the light-emitting device array 1, the redistribution layer 2, the printed circuit board 3 and the driver chip 4 is obtained; after obtaining multiple display panels, the step may further include: splicing the multiple display panels together based on the edges of the redistribution layer 2 to obtain a spliced display panel structure as shown in FIG6.
本申请实施例中的电子设备可以为穿戴手表、平板电脑或电视等任意具有显示功能的电子设备，可以为由多个显示面板拼接显示的电子设备，也可以为仅具有一个显示面板的非拼接显示的电子设备。对于非拼接显示的电子设备，本申请实施例可以实现窄边框设计，以提高屏占比，在较小空间占用的前提下提供更大的可视区域；对于拼接显示的电子设备，除了可以实现窄边框涉及之外，还可以减小拼接缝隙，以提高拼接后的整体显示效果。The electronic device in the embodiment of the present application can be any electronic device with display function, such as a wearable watch, a tablet computer or a TV, and can be an electronic device with a plurality of display panels spliced together for display, or can be an electronic device with a non-spliced display having only one display panel. For electronic devices with non-spliced display, the embodiment of the present application can realize a narrow frame design to increase the screen-to-body ratio and provide a larger visible area under the premise of occupying a smaller space; for electronic devices with spliced display, in addition to realizing a narrow frame design, the splicing gap can also be reduced to improve the overall display effect after splicing.
本申请实施例中，“至少一个”是指一个或者多个，“多个”是指两个或两个以上。“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示单独存在A、同时存在A和B、单独存在B的情况。其中A，B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。“以下至少一项”及其类似表达，是指的这些项中的任意组合，包括单项或复数项的任意组合。例如，a，b和c中的至少一项可以表示：a,b,c,a-b,a-c,b-c,或a-b-c，其中a,b,c可以是单个，也可以是多个。In the embodiments of the present application, "at least one" refers to one or more, and "plurality" refers to two or more. "And/or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and/or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone. Among them, A and B can be singular or plural. The character "/" generally indicates that the previous and subsequent associated objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b and c can be represented by: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple.
以上仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。 The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

  1. 一种电子设备，其特征在于，包括显示面板，所述显示面板包括：An electronic device, characterized in that it comprises a display panel, wherein the display panel comprises:
    发光器件阵列；Light emitting device array;
    重布线层，所述发光器件阵列安装于所述重布线层的一侧表面；A redistribution layer, wherein the light emitting device array is mounted on a side surface of the redistribution layer;
    印刷电路板，所述印刷电路板安装于所述重布线层远离所述发光器件阵列的一侧表面，所述印刷电路板的尺寸小于所述重布线层的尺寸，在垂直于所述印刷电路板所在平面的方向上，所述重布线层的边缘超出所述印刷电路板的边缘；A printed circuit board, wherein the printed circuit board is mounted on a surface of the redistribution layer away from the light-emitting device array, the size of the printed circuit board is smaller than the size of the redistribution layer, and the edge of the redistribution layer exceeds the edge of the printed circuit board in a direction perpendicular to the plane where the printed circuit board is located;
    驱动芯片，所述驱动芯片安装于所述印刷电路板远离所述重布线层的一侧表面，所述发光器件阵列通过所述重布线层中的布线以及所述印刷电路板中的布线电连接于所述驱动芯片。A driving chip is mounted on a surface of the printed circuit board away from the redistribution layer, and the light emitting device array is electrically connected to the driving chip through wiring in the redistribution layer and wiring in the printed circuit board.
  2. 根据权利要求1所述的电子设备，其特征在于，The electronic device according to claim 1, characterized in that
    包括多个所述显示面板，任意相邻的两个所述显示面板基于所述重布线层的边缘相互拼接。It comprises a plurality of the display panels, and any two adjacent display panels are spliced with each other based on the edge of the redistribution layer.
  3. 根据权利要求1所述的电子设备，其特征在于，The electronic device according to claim 1, characterized in that
    所述显示面板还包括相关器件，所述相关器件安装于所述印刷电路板远离所述重布线层的一侧表面。The display panel further comprises related components, and the related components are mounted on a surface of the printed circuit board on a side away from the redistribution layer.
  4. 根据权利要求3所述的电子设备，其特征在于，The electronic device according to claim 3, characterized in that
    所述相关器件包括以下各项中的至少一项或任意组合：The related devices include at least one or any combination of the following:
    应用处理器、电源管理芯片、存储器和传感器。Application processors, power management chips, memory and sensors.
  5. 根据权利要求1至4中任意一项所述的电子设备，其特征在于，The electronic device according to any one of claims 1 to 4, characterized in that:
    所述发光器件阵列为发光二极管阵列；The light emitting device array is a light emitting diode array;
    所述发光二极管阵列包括红色发光二极管、蓝色发光二极管和绿色发光二极管。The light emitting diode array includes red light emitting diodes, blue light emitting diodes and green light emitting diodes.
  6. 一种电子设备的制作方法，其特征在于，包括：A method for manufacturing an electronic device, comprising:
    在发光器件阵列的一侧基于光刻工艺制作重布线层；A redistribution layer is fabricated on one side of the light emitting device array based on a photolithography process;
    在所述重布线层远离所述发光器件阵列的一侧贴装印刷电路板，所述印刷电路板的尺寸小于所述重布线层的尺寸，在垂直于所述印刷电路板所在平面的方向上，所述重布线层的边缘超出所述印刷电路板的边缘；A printed circuit board is mounted on a side of the redistribution layer away from the light-emitting device array, the size of the printed circuit board is smaller than the size of the redistribution layer, and the edge of the redistribution layer exceeds the edge of the printed circuit board in a direction perpendicular to the plane where the printed circuit board is located;
    在所述印刷电路板远离所述重布线层的一侧贴装驱动芯片，所述发光器件阵列通过所述重布线层中的布线以及所述印刷电路板中的布线电连接于所述驱动芯片。A driving chip is mounted on a side of the printed circuit board away from the redistribution layer, and the light emitting device array is electrically connected to the driving chip through wiring in the redistribution layer and wiring in the printed circuit board.
  7. 根据权利要求6所述的方法，其特征在于，The method according to claim 6, characterized in that
    在发光器件阵列的一侧基于光刻工艺制作重布线层之前，还包括：Before a redistribution layer is fabricated on one side of the light emitting device array based on a photolithography process, the method further includes:
    将所述发光器件阵列转移至临时载板上；Transferring the light emitting device array to a temporary carrier;
    所述在发光器件阵列的一侧基于光刻工艺制作重布线层包括：The method of manufacturing a redistribution layer on one side of the light emitting device array based on a photolithography process comprises:
    在发光器件阵列远离所述临时载板的一侧基于光刻工艺制作重布线层；Manufacturing a redistribution layer based on a photolithography process on a side of the light emitting device array away from the temporary carrier;
    在所述印刷电路板远离所述重布线层的一侧贴装驱动芯片之前，在所述重布线层远离所述发光器件阵列的一侧贴装印刷电路板之后，还包括：Before mounting a driver chip on a side of the printed circuit board away from the redistribution layer, and after mounting a printed circuit board on a side of the redistribution layer away from the light emitting device array, the method further comprises:
    去除所述发光器件阵列上的所述临时载板。The temporary carrier on the light emitting device array is removed.
  8. 根据权利要求6所述的方法，其特征在于，The method according to claim 6, characterized in that
    在所述印刷电路板远离所述重布线层的一侧贴装驱动芯片包括：Mounting a driver chip on a side of the printed circuit board away from the redistribution layer comprises:
    在所述印刷电路板远离所述重布线层的一侧通过表面贴装技术工艺贴装驱动芯片。A driving chip is mounted on a side of the printed circuit board away from the redistribution layer by using a surface mounting technology process.
  9. 根据权利要求6所述的方法，其特征在于，The method according to claim 6, characterized in that
    在所述重布线层远离所述发光器件阵列的一侧贴装印刷电路板包括：Mounting a printed circuit board on a side of the redistribution layer away from the light emitting device array comprises:
    在所述重布线层远离所述发光器件阵列的一侧通过表面贴装技术工艺或者绑定键合技术贴装印刷电路板。A printed circuit board is mounted on a side of the redistribution layer away from the light emitting device array by using a surface mounting technology or a binding bonding technology.
  10. 根据权利要求6至9中任意一项所述的方法，其特征在于，The method according to any one of claims 6 to 9, characterized in that
    所述在所述印刷电路板远离所述重布线层的一侧贴装驱动芯片后得到包括所述发光器件阵列、所述重布线层、所述印刷电路板和所述驱动芯片的显示面板；After mounting the driver chip on a side of the printed circuit board away from the redistribution layer, a display panel including the light-emitting device array, the redistribution layer, the printed circuit board and the driver chip is obtained;
    在得到多个所述显示面板后，还包括：After obtaining a plurality of the display panels, the method further comprises:
    将多个所述显示面板基于所述重布线层的边缘相互拼接。 The plurality of display panels are spliced together based on the edge of the redistribution layer.
PCT/CN2023/128276 2022-11-10 2023-10-31 Electronic device and manufacturing method therefor WO2024099169A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111933630A (en) * 2020-07-28 2020-11-13 华为技术有限公司 LED chip packaging module, display screen and manufacturing method thereof
US20210005520A1 (en) * 2019-07-02 2021-01-07 Sharp Kabushiki Kaisha Method and apparatus for manufacturing array device
CN215008219U (en) * 2021-06-15 2021-12-03 深圳大道半导体有限公司 Display module and display screen
CN215731722U (en) * 2021-05-31 2022-02-01 成都辰显光电有限公司 Display panel, display assembly and splicing display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210005520A1 (en) * 2019-07-02 2021-01-07 Sharp Kabushiki Kaisha Method and apparatus for manufacturing array device
CN111933630A (en) * 2020-07-28 2020-11-13 华为技术有限公司 LED chip packaging module, display screen and manufacturing method thereof
CN215731722U (en) * 2021-05-31 2022-02-01 成都辰显光电有限公司 Display panel, display assembly and splicing display device
CN215008219U (en) * 2021-06-15 2021-12-03 深圳大道半导体有限公司 Display module and display screen

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