WO2024098767A1 - Module conducteur, connecteur électrique, ensemble connecteur et dispositif électronique - Google Patents

Module conducteur, connecteur électrique, ensemble connecteur et dispositif électronique Download PDF

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Publication number
WO2024098767A1
WO2024098767A1 PCT/CN2023/102118 CN2023102118W WO2024098767A1 WO 2024098767 A1 WO2024098767 A1 WO 2024098767A1 CN 2023102118 W CN2023102118 W CN 2023102118W WO 2024098767 A1 WO2024098767 A1 WO 2024098767A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
leads
electrical connector
shielding sheet
holder
Prior art date
Application number
PCT/CN2023/102118
Other languages
English (en)
Chinese (zh)
Inventor
肖聪图
熊旺
张居旺
叶涛
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024098767A1 publication Critical patent/WO2024098767A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6477—Impedance matching by variation of dielectric properties

Definitions

  • the present application relates to the structure of a connector for realizing information communication between electronic devices, and specifically to a lead module, an electrical connector including the lead module, a connector assembly including the electrical connector, and an electronic device including the above-mentioned electrical connector or connector assembly.
  • interconnection architecture In today's electronic devices, there is an interconnection architecture based on circuit boards and optical modules.
  • electrical connectors such as input/output connectors
  • electrical connectors are key components of the interconnection architecture, which can ensure the signal integrity of the optoelectronic/electro-optical conversion link in high-speed links. Therefore, whether it is to achieve short-distance interconnection or long-distance interconnection in the interconnection architecture, there are high requirements for the performance of electrical connectors.
  • the transmission rate of electrical connectors In order to transmit more information in a timely and effective manner, the transmission rate of electrical connectors needs to be continuously improved. With the increase in the transmission rate of electrical connectors, the number of devices used can be reduced while meeting the same information transmission requirements, and layout space for circuit boards can also be saved.
  • a lead module which can optimize the impedance of the lead to reduce the insertion loss of the lead for transmitting signals, and can also suppress the crosstalk between the lead pairs for transmitting signals.
  • An electrical connector including the lead module and a connector assembly including the electrical connector are also proposed.
  • the electrical connector, the connector assembly and the electronic device achieve the same technical effect by adopting the lead module according to the present application.
  • an embodiment of the present application provides a lead module, including:
  • each of the leads has a first side surface and a second side surface facing oppositely, the first side surface and the second side surface are both parallel to the arrangement direction of the plurality of leads,
  • the first side surface is in contact with and covered by the holder, and at least a portion of the second side surface is separated from the holder to be exposed to the outside.
  • the first side surface contacts the non-conductive material of the retainer, and at least a portion of the second side surface contacts the air because it is exposed to the outside. Since the dielectric constant of the non-conductive material of the retainer is different from the dielectric constant of the air, the dielectric constants of the media contacted by the two opposite sides of the lead are different, which is conducive to adjusting the impedance in the signal lead and reducing the insertion loss of the lead. In addition, since the main body of the lead The first side of the lead is covered by a non-conductive material, so the electric field balance between different signal pairs is optimized by adjusting the structural characteristics of the non-conductive material, thereby suppressing crosstalk between adjacent lead pairs.
  • each of the leads further has a third side surface and a fourth side surface facing oppositely, and the third side surface and the fourth side surface are perpendicular to the arrangement direction.
  • each of the leads at least a portion of the third side surface is separated from the holder to be exposed to the outside, and at least a portion of the fourth side surface is separated from the holder to be exposed to the outside.
  • each of the leads has a rectangular cross-section, the short sides of the rectangle are located at the third side and the fourth side, and the third side of one lead and the fourth side of another lead adjacent to the arrangement direction face each other.
  • the retaining member has a supporting surface in contact with the first side surface.
  • the retaining member is formed with a plurality of grooves, each of which is located between two adjacent leads, and each of which extends along an extending direction of the lead and is recessed relative to the supporting surface.
  • the retaining member forms a groove between every two adjacent leads, which can optimize the electric field balance between different signal pairs, thereby further suppressing the crosstalk between the lead pairs.
  • one side wall surface of the groove is flush with the third side surface of one of the leads, and another side wall surface of the groove is flush with the fourth side surface of another of the leads.
  • the plurality of leads include a signal lead and a ground lead, two adjacent signal leads form a lead pair, and one ground lead is disposed between adjacent lead pairs.
  • differential signals can be transmitted in the lead pairs composed of signal leads, thereby significantly reducing the interference of electromagnetic signals around the lead module on the signals in the leads.
  • a ground lead is provided between adjacent lead pairs transmitting differential signals, which can effectively suppress crosstalk between adjacent lead pairs.
  • a shielding plate is further included, which is made of or includes a conductive material, and is fixedly mounted on the retaining member, and is spaced apart from the signal lead and faces the second surface of the main body of the signal lead.
  • the interference of external signals of the lead module on the signal lead transmission signal can be reduced through the shielding sheet.
  • all the signal leads share one shielding sheet, and the shielding sheet extends in the arrangement direction to cover all the signal leads.
  • the shielding sheet is electrically connected to all the grounding leads.
  • the shielding sheet includes a shielding sheet body and an elastic contact portion, the shielding sheet body is parallel to and spaced apart from the second side surface, and the elastic contact portion is tilted from the shielding sheet body and contacts the ground lead.
  • each of the lead wires includes a first end, a second end, and a main body, wherein the main body is located between the first end and the second end.
  • the first end portion includes a first embedded portion and a first protruding portion, wherein the first embedded portion is embedded in the retaining member and the first protruding portion protrudes from the retaining member.
  • the second end portion includes a second embedded portion embedded in the retainer and a second protruding portion protruding from the retainer.
  • each lead can be stably held by the holding member, and the protruding portion of the lead can be electrically connected to the docking module through welding or other connection methods.
  • more than 80% of the region or area of the second side surface of the main body of the lead is not covered by the retaining member.
  • an embodiment of the present application provides an electrical connector, which includes a lead module as described in any one of the above technical solutions.
  • the first ends of all the lead modules are arranged in a matrix;
  • the second ends of all the lead modules are arranged in a matrix.
  • an embodiment of the present application provides a connector assembly, comprising a circuit board and an electrical connector as described in any one of the above technical solutions, wherein the electrical connector is mounted on the circuit board.
  • an arrangement direction of the plurality of leads is parallel to the circuit board.
  • connection component realizes the so-called horizontal architecture, which is beneficial to reduce insertion loss and suppress crosstalk.
  • an embodiment of the present application provides an electronic device, comprising the electrical connector described in any one of the above technical solutions or the connector assembly described in any one of the above technical solutions.
  • an optical module is further included, and the optical module is connected to the corresponding electrical connector to achieve electrical conduction.
  • the electronic device when the optical interface and the electrical connector are connected to each other, the electronic device can transmit signals of various rates with higher efficiency.
  • the electronic device is a router, a switch or a network server.
  • FIG. 1A is a schematic three-dimensional diagram of a lead module according to a first embodiment of the present application.
  • FIG. 1B is a schematic longitudinal cross-sectional view of the lead module in FIG. 1A .
  • FIG. 1C is a partial cross-sectional view taken along line M1 - M1 in FIG. 1B .
  • FIG. 1D is a perspective schematic diagram of a partial structure of the lead module in FIG. 1A .
  • FIG. 1E is a schematic diagram of a first model of a lead module according to the first embodiment of the present application.
  • FIG. 1F is a schematic diagram showing the electric field state of the first model in FIG. 1E .
  • FIG. 1G is a schematic diagram of a second model of the lead mold assembly according to the first comparative example.
  • FIG. 1H is a schematic diagram showing the electric field state of the second model in FIG. 1G .
  • FIG. 1I is a schematic diagram of a third model of a lead mold assembly according to the second comparative example.
  • FIG. 1J is a schematic diagram showing the electric field state of the third model in FIG. 1I .
  • FIG. 1K is a graph showing insertion loss versus frequency for the models in FIGS. 1E , 1G , and 1I .
  • 1L is a graph showing crosstalk as a function of frequency for the models in FIGS. 1E , 1G , and 1I .
  • 1M is a graph showing the differential common mode conversion of the models in FIGS. 1E , 1G , and 1I as a function of frequency.
  • FIG. 2A is a schematic longitudinal cross-sectional view of a lead module according to a second embodiment of the present application.
  • FIG. 2B is a partial cross-sectional view taken along line M2 - M2 in FIG. 2A .
  • FIG. 3A is a schematic longitudinal cross-sectional view of a lead module according to a third embodiment of the present application.
  • FIG. 3B is a partial cross-sectional view taken along line M3 - M3 in FIG. 3A .
  • FIG. 4 is a schematic diagram of a connector assembly according to the present application, wherein the connector assembly includes the electrical connector and a circuit board of the present application.
  • FIG5 is a schematic diagram of an electronic device (switch) according to the present application, wherein the electronic device includes the electrical connector and the optical module of the present application.
  • height direction refers to the height direction of the lead module of this application, that is, the thickness direction of the lead.
  • this height direction should not be understood as a limitation on the use direction or posture of the lead module and electrical connector of this application.
  • the first side of the lead contacts the non-conductive material of the retaining member used to retain the lead, and the second side of the lead does not contact the retaining member but is exposed to the outside, thereby contacting the air.
  • the dielectric constant of the non-conductive material of the retaining member is different from the dielectric constant of the air, the dielectric constants of the medium contacted by the two opposite sides of the lead are different, which is beneficial to adjusting the impedance in the signal lead and reducing the insertion loss of the lead.
  • the present application implements different exemplary embodiments.
  • the lead module according to the first embodiment of the present application includes a holder 1, a plurality of leads 2 and a shielding sheet 3 assembled together.
  • the plurality of leads 2 and the shielding sheet 3 are fixedly mounted on the holder 1, so that the holder 1, the plurality of leads 2 and the shielding sheet 3 are integrated together to form a whole.
  • the retainer 1 is made of a non-conductive insulating material such as plastic.
  • the retainer 1 can also form an assembly structure that cooperates with other devices (such as other lead modules), a foolproof design, etc.
  • a plurality of leads 2 are arranged in a row at intervals in the arrangement direction A, and all the leads 2 extend parallel to each other, and each lead 2 can be made of a conductive material (e.g., metal, particularly phosphor bronze).
  • a plurality of leads 2 include a signal lead 2a and a ground lead 2b, as shown in Fig. 1C and Fig. 1D, two adjacent signal leads 2a form a lead pair, and a ground lead 2b is arranged between adjacent lead pairs. In this way, differential signals can be transmitted in the two signal leads 2a in the lead pair, thereby significantly reducing the interference of electromagnetic signals around the lead module to the signal in the signal lead 2a.
  • a ground lead 2b is arranged between adjacent lead pairs that transmit differential signals, which can effectively suppress the crosstalk between adjacent lead pairs.
  • the lead 2 at the outermost position in the arrangement direction A can be a ground lead 2b, thereby further improving the shielding effect for interference signals.
  • a plurality of leads 2 include five pairs of such lead pairs.
  • each lead 2 is a rectangular shape, so that each The lead 2 includes four sides (a first side 21s1, a second side 21s2, a third side 21s3 and a fourth side 21s4) connected to each other, and each side 21s1, 21s2, 21s3, 21s4 is formed into a plane.
  • the first side 21s1 and the second side 21s2 face oppositely, and the first side 21s1 and the second side 21s2 are parallel to the arrangement direction A of the plurality of leads 2.
  • the third side 21s3 and the fourth side 21s4 face oppositely, and the third side 21s3 and the fourth side 21s4 are perpendicular to the arrangement direction A.
  • each lead 2 includes or is divided into a main body 21, a first end 22 and a second end 23, and the main body 21 is located between the first end 22 and the second end 23.
  • the first end 22 includes a first embedded portion 221 and a first protruding portion 222, the first embedded portion 221 is embedded in the retaining member 1 and is covered and clamped by the retaining member 1, and the first protruding portion 222 protrudes from the retaining member 1.
  • the second end portion 23 includes a second embedded portion 231 and a second extended portion 232, wherein the second embedded portion 231 is embedded in the holder 1 and covered and clamped by the holder 1, and the second extended portion 232 extends from the holder 1.
  • first embedded portion 221 and the second embedded portion 231 covered and clamped by the holder 1, it is beneficial for the lead 2 to be fixedly held by the holder 1.
  • the first extended portion 222 and the second extended portion 232 can be electrically connected to a circuit board or other modules by welding or other connection methods.
  • the first side 21s1 contacts the retainer 1 and is covered by the retainer 1, and at least a portion of the second side 21s2 is separated from the retainer 1 to be exposed to the outside.
  • the first side 21s1 contacts the retainer 1 and is completely covered by the retainer 1, and the vast majority of the second side 21s2 is separated from the retainer 1 to be exposed to the outside air.
  • the vast majority of the second side 21s2 here may be an area or area of more than 80% of the second side 21s2 of the main body 21 of the lead 2.
  • the first side 21s1 contacts the non-conductive insulating material of the retainer 1
  • the second side 21s2 contacts the air due to being exposed to the outside. Since the dielectric constant of the non-conductive material of the retaining member 1 is different from the dielectric constant of the air, the dielectric constants of the media contacted by the two opposite surfaces of the lead 2 are different, which is conducive to adjusting the impedance in the signal lead 2a to reduce the insertion loss of the lead 2.
  • the electric field balance between different signal pairs can be optimized by adjusting the structural characteristics of the insulating material, thereby suppressing the crosstalk between the lead pairs of adjacent signal leads 2a.
  • the length of the portion of each lead 2 that is completely covered by the retaining member 1 (mainly the embedded portion) can be made shorter than the length of the portion of the main body 21 of each lead 2 that is exposed to the outside.
  • the vast majority of the third side surface 21s3 and the vast majority of the fourth side surface 21s4 here may be more than 80% of the region or area of the third side surface 21s3 and the fourth side surface 21s4 of the main body 21 of the guide line 2.
  • the retaining member 1 has a supporting surface 1s in contact with the first side surface 21s1. At a position between the main bodies 21 of every two adjacent leads 2, the retaining member 1 is formed with a groove 1c that is recessed relative to the supporting surface 1s. The groove 1c extends along the extension direction of the lead 2. In the present embodiment, between the main bodies 21 of two adjacent leads 2, a plurality of grooves 1c spaced apart in the extension direction of the lead 2 are provided. In an optional scheme, between the main bodies 21 of two adjacent leads 2, only one groove that extends continuously in the extension direction of the lead 2 may be provided.
  • the cross-sectional shape of the groove 1c is also rectangular, one side wall surface of the groove 1c is flush with the third side surface 21s3 of one lead 2, and the other side wall surface of the groove 1c is flush with the fourth side surface 21s4 of another lead 2.
  • the retaining member 1 is formed with a groove 1c between every two adjacent leads 2, the electric field balance between different signal pairs can be optimized, thereby further reducing the crosstalk between the leads 2. Disturbance.
  • the cross-sectional shape of the lead 2 is a rectangle, that is, the lead 2 is actually formed into a flat strip shape.
  • the long side of the rectangle is located at the first side 21s1 and the second side 21s2, and the short side of the rectangle is located at the third side 21s3 and the fourth side 21s4. That is, the widths of the first side 21s1 and the second side 21s2 are equal, the widths of the third side 21s3 and the fourth side 21s4 are equal, and the widths of the third side 21s3 and the fourth side 21s4 are smaller than the widths of the first side 21s1 and the second side 21s2.
  • the third side 21s3 of one lead 2 faces the fourth side 21s4 of another lead 2 adjacent in the arrangement direction.
  • the positions of the first end 22 and the second end 23 of the lead 2 can be adjusted by changing the extension direction of the main body 21 of the lead 2.
  • the lead module can be adapted to more application structures.
  • the shielding sheet 3 is made of metal (e.g., brass or phosphor bronze). As shown in FIGS. 1A to 1D , the shielding sheet 3 is fixedly mounted on the holder 1.
  • the shielding sheet 3 may form a mounting hole, and the holder 1 may form a mounting protrusion, and the shielding sheet 3 is fixedly mounted on the holder 1 by means of the mounting hole and the mounting protrusion, such as interference fit.
  • the shielding sheet 3 includes a shielding sheet body 31 and an elastic contact portion 32 formed as one.
  • the shielding sheet body 31 is formed in a flat plate shape, and the shielding sheet body 31 is spaced apart from all signal leads 2a in the height direction H, and the shielding sheet body 31 and the second side surface 21s2 of the main body 21 of the signal lead 2a face each other and are parallel to each other. Further, in the present embodiment, all signal leads 2a share one shielding sheet 3. For this reason, the shielding sheet 3 extends in the arrangement direction A to cover all signal leads 2a, that is, the width of the shielding sheet 3 is configured to at least cover all signal leads 2a.
  • the elastic contact portion 32 can be an elastic contact piece punched out from the shielding sheet body 31, and the elastic contact portion 32 is tilted relative to the shielding sheet body 31, and each elastic contact portion 32 contacts the corresponding grounding lead 2b, so that the entire shielding sheet 3 is electrically conductive with all the grounding leads 2b.
  • a shielding sheet 3 By providing such a shielding sheet 3, the interference of external signals of the lead module on the signal lead 2a can be reduced. All signal leads 2a share a shielding sheet 3, which can simplify the shielding structure for the lead 2 and facilitate processing and manufacturing. All grounding leads 2b and the shielding sheet 3 are shielded with the same ground, which is conducive to stabilizing the shielding effect.
  • the lead module according to the first embodiment of the present application achieves the reduction of the insertion loss of the signal in the lead 2 at a relatively low cost and effectively suppresses the crosstalk between the leads 2.
  • the inventor of the present application prepared a first model MU1 of the lead module of the first embodiment of the present application (as shown in FIG. 1E ) and a second model MU2 of the lead module according to the first comparative example (as shown in FIG. 1G ) and a third model MU3 of the lead module according to the second comparative example (as shown in FIG. 1I ) for comparison.
  • plastic (equivalent to the structure of the retainer 1) is disposed above all leads 2 (including signal leads 2a and ground leads 2b).
  • the part other than the white part is an electric field with different field strengths (unit: V/m), and the electric field boundary rules with similar field strengths in the first model MU1 are provided.
  • the portion other than the white portion is an electric field with different field strengths (unit: V/m), and the electric field boundaries with similar field strengths in the second model MU2 are irregular.
  • the portion other than the white portion is an electric field with different field strengths (unit: V/m), and the electric field boundaries with similar field strengths in the third model MU3 are irregular.
  • FIG1K, FIG1L and FIG1M respectively show the curves of the insertion loss (unit: db), crosstalk (unit: db) and differential common mode conversion (unit: db) of the three models MU1, MU2 and MU3 as the frequency (unit: GHz) of the signal changes.
  • the insertion loss, crosstalk and differential common mode conversion corresponding to the first model MU1 are improved relative to the second model MU2 and the third model MU3.
  • the differential signal transmission has good balance and no obvious resonance.
  • the differential signal transmission has poor balance and there is obvious resonance.
  • the resonance point moves toward the high frequency, but the resonance is not completely eliminated.
  • the structure of the lead module according to the second embodiment of the present application is substantially the same as the structure of the lead module according to the first embodiment of the present application, and the structural differences between the two are mainly described below.
  • the shielding plate 3 is omitted compared to the first embodiment. Therefore, in this embodiment, the second side surface 21s2 of the main body 21 of all the leads 2 is substantially unobstructed.
  • the shielding plate is omitted and the structural design is simplified, the effect of optimizing impedance to reduce insertion loss and suppress crosstalk can still be achieved in this embodiment.
  • one or more plastic protrusions or convex strips can be provided on at least one of the third side 21S3, the fourth side 21S4 and the second side 21S2 of the main body 21 of the lead 2, and these plastic protrusions or convex strips can be connected to the plastic of the retaining frame 1, or be part of the plastic of the retaining frame 1.
  • the structure of the lead module according to the third embodiment of the present application is substantially the same as the structure of the lead module according to the first embodiment of the present application, and the structural differences between the two are mainly described below.
  • the groove 1c formed between the adjacent leads 2 of the holder 1 is omitted. Therefore, in this embodiment, the surface of the portion of the holder 1 located between the adjacent leads 2 is flush with the surface for contacting the leads 2. Although the groove 1c is omitted and the structural design is simplified, the effect of optimizing impedance to reduce insertion loss and suppressing crosstalk can still be achieved in this embodiment.
  • the electrical connector according to the present application may include one or more of the above-mentioned lead modules.
  • the multiple lead modules can be stacked together in the height direction. It can be understood that the specific structures of different lead modules can be appropriately adjusted to assemble multiple lead modules together to form an electrical connector.
  • the rows of leads 2 of different lead modules can be arranged in an array (e.g., a matrix), that is, the first ends 22 of all the lead modules are arranged in a matrix, and the second ends 23 of all the lead modules are arranged in a matrix.
  • the electrical connector C according to the present application is arranged at the edge of the circuit board P.
  • a device such as an optical module
  • high-speed signal transmission can be achieved.
  • the arrangement direction A of the multiple leads 2 of each lead module of the electrical connector C is parallel to the circuit board P, thereby constructing a so-called horizontal architecture.
  • the shielding sheet 3 is made of a conductive metal material in the above specific embodiments, the present application is not limited thereto, and the shielding sheet 3 may be partially made of a conductive material, and the other part may be made of a non-conductive material. In other words, the shielding sheet 3 only needs to include a conductive material such as metal to achieve a shielding effect.
  • the shielding sheet 3 may be composed of a conductive layer and a non-conductive layer (e.g., a plastic layer), or a metal coating and a metal plating layer may be provided on the non-conductive material layer.
  • the lead module of the present application and the electrical connector and connector assembly composed of the lead module can effectively suppress crosstalk and reduce insertion loss with a simple shielding structure, improve the structural reliability of the device, reduce manufacturing costs, and facilitate large-scale industrial production.
  • the link terminal impedance can be optimized to a central value of 90 ohms, and the crosstalk between links meets less than -45dB@0-60GHz, which greatly improves the signal integrity.
  • the present application also provides an electronic device, which may include the electrical connector or connector assembly described above.
  • an electronic device may be, but is not limited to, a router, a switch or a network server.
  • the electronic device is a switch EB.
  • the switch EB includes an electrical connector C and an optical module T of the present application.
  • a plurality of electrical connectors C of the present application may be provided on the main body of the switch EB, and the optical module T may be plugged into the corresponding electrical connector C, so that the optical module T and the electrical connector C are electrically connected, and thus the switch EB can send and receive signals via the electrical connector C and the optical module T.
  • the optical module T may include an optoelectronic device, a functional circuit and an optical interface, and the optoelectronic device may include a transmitting part and a receiving part.
  • the transmitting part converts the electrical signal into an optical signal and then transmits it through a medium such as an optical fiber
  • the receiving part can convert the received optical signal into an electrical signal.
  • Various rate signals can be transmitted through the optical interface and the electrical connector of the present application, including but not limited to various low-rate, 100M, 1G, 2.5G, 4.25G, 4.9G, 6G, 8G, 10G, 40G and even higher rate signals.
  • the electronic device of the present application may include a separately provided electrical connector, or may include the connector assembly of the present application.

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Abstract

La présente demande concerne un module conducteur, un connecteur électrique, un ensemble connecteur et un dispositif électronique. Le module conducteur comprend un support et une pluralité de conducteurs. La pluralité de conducteurs sont maintenus par le support et fixés par rapport au support. Chaque conducteur a une première surface latérale et une seconde surface latérale qui sont parallèles à la direction d'agencement de la pluralité de conducteurs et sont opposées l'une à l'autre. Dans une partie de corps principal de chaque conducteur, la première surface latérale est en contact avec le support et est recouverte par le support, et au moins une partie de la seconde surface latérale est séparée du support de façon à être exposée vers l'extérieur. D'une part, cela permet d'ajuster l'impédance dans le conducteur de signal de façon à réduire la perte d'insertion du conducteur ; et d'autre part, il est ainsi possible d'ajuster les caractéristiques structurales d'un matériau non conducteur de façon à optimiser un équilibre de champ électrique entre différentes paires de signaux, ce qui permet d'inhiber la diaphonie entre des paires de conducteurs adjacentes. Un connecteur électrique, un ensemble connecteur et un dispositif électronique qui comprennent ledit ensemble conducteur ont le même effet. Le dispositif électronique de la présente demande peut être, mais sans y être limité, un routeur, un commutateur ou un serveur de réseau.
PCT/CN2023/102118 2022-11-10 2023-06-25 Module conducteur, connecteur électrique, ensemble connecteur et dispositif électronique WO2024098767A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211405590.7 2022-11-10
CN202211405590.7A CN118017296A (zh) 2022-11-10 2022-11-10 引线模组、电连接器、连接器组件及电子设备

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WO2024098767A1 true WO2024098767A1 (fr) 2024-05-16

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CN1833339A (zh) * 2003-08-05 2006-09-13 Fci公司 具有可选择地被指定作为信号或者接地触点的触点的电连接器
CN203536644U (zh) * 2013-08-20 2014-04-09 嘉基电子科技(苏州)有限公司 电连接器
CN205016739U (zh) * 2015-09-16 2016-02-03 庆良电子股份有限公司 电连接器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176521A (ja) * 1997-10-06 1999-07-02 Kel Corp シールドコンタクトおよびこれを用いたコネクタ
CN1833339A (zh) * 2003-08-05 2006-09-13 Fci公司 具有可选择地被指定作为信号或者接地触点的触点的电连接器
CN203536644U (zh) * 2013-08-20 2014-04-09 嘉基电子科技(苏州)有限公司 电连接器
CN205016739U (zh) * 2015-09-16 2016-02-03 庆良电子股份有限公司 电连接器

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