WO2024098114A1

WO2024098114A1 - A device, system, and method for sensing an electronic property of fluid sample

Info

Publication number: WO2024098114A1
Application number: PCT/AU2023/051141
Authority: WO
Inventors: Samuel Joseph PEPPOU-CHAPMAN; Rhea Friederike Cornely; David Alexander KATZMAREK; Mohammad Choucair
Original assignee: Archer Materials Limited
Priority date: 2022-11-11
Filing date: 2023-11-10
Publication date: 2024-05-16

Abstract

Disclosed herein is a kit or a device for one or more sensor components for sensing one or more electronic properties of fluid sample comprising: a securing portion adapted to secure a sensor component in position, the sensor component comprising one or more sensor regions for receiving fluid sample, a fluidic interconnect comprising one or more fluidic paths, each fluidic path adapted to deliver fluid sample to at least one sensor region of the sensor component, and an electronic interconnect comprising one or more electronic connections, each electronic connection for operatively connecting the one or more sensor regions of the sensor component to a circuit for sensing one or more electronic properties of fluid sample, wherein the sensor component is removable from position.

Description

A DEVICE, SYSTEM, AND METHOD FOR SENSING AN ELECTRONIC PROPERTY OF FLUID SAMPLE

TECHNICAL FIELD

[0001] The embodiments described herein broadly relate to a device, system, and a method for sensing an electronic property of fluid sample.

BACKGROUND

[0002] Experiments are often conducted on a lab-on-a chip to test for electronic properties of fluid sample, as is often the case in the field of biotechnology and/or microfluidics for example. Typically, fluid sample is pipetted onto an active site of a lab-on- a-chip that is wire -bonded so that the electronic properties of fluid sample can be tested and analysed.

SUMMARY OF INVENTION

[0003] It is desirable to provide one or more of: a device, a kit, a system, and a method for sensing one or more electronic properties of the fluid sample. Additionally or alternatively, it is desirable to provide the industry with a useful choice.

[0004] In a first aspect, there is provided a device for one or more sensor components for sensing one or more electronic properties of fluid sample comprising: a securing portion adapted to secure a sensor component in position, the sensor component comprising one or more sensor regions for receiving fluid sample, a fluidic interconnect comprising one or more fluidic paths, each fluidic path adapted to deliver fluid sample to at least one sensor region of the sensor component, and an electronic interconnect comprising one or more electronic connections, each electronic connection for operatively connecting the one or more sensor regions of the sensor component to a circuit for sensing one or more electronic properties of fluid sample, wherein the sensor component is removable from position.

[0005] In some embodiments, the sensor component is removable from position such that the securing portion can secure a second sensor component in position. [0006] In some embodiments, the sensor component is removable from position such that at least one operative connection between the sensor region and the circuit is broken.

[0007] In some embodiments, the electronic connection and at least a portion of the sensor component are capable to touching each other for forming at least one operative connection between the sensor region and the circuit.

[0008] In some embodiments, the securing portion is adapted such that the sensor component abuts against the electronic connection for forming at least one operative connection.

[0009] In some embodiments, the electronic connection is or comprises electronic contacts.

[0010] In some embodiments, the electronic contacts directly contact the sensor component.

[0011] In some embodiments, the electronic contacts directly touch a respective electrode on the sensor component.

[0012] In some embodiments, the electronic contacts are pins.

[0013] In some embodiments, the electronic contacts are spring loaded.

[0014] In some embodiments, the securing portion comprises a surround and/or an enclosure.

[0015] In some embodiments, the sensor component is removable from position by removing the sensor component from the surround.

[0016] In some embodiments, the sensor component comprises four sensor regions.

[0017] In some embodiments, the fluidic interconnect comprises four fluidic paths.

[0018] In some embodiments, each fluidic path is adapted to deliver fluid sample to a respective sensor region. [0019] In some embodiments, the electronic interconnect comprises four electronic connections.

[0020] In some embodiments, each electronic connection is configured to operatively connect a respective sensor region to the circuit.

[0021] In some embodiments, the fluidic path: comprises an o-ring and/or comprises compressible material and/or is adapted to bonding for sealing the fluidic path to the sensor component.

[0022] In some embodiments, the fluidic path is further adapted such that fluid sample is removable from the sensor region.

[0023] In some embodiments, the fluidic path is or comprises a fluidic well.

[0024] In some embodiments, the fluidic path is or comprises a Luer slip connector.

[0025] In some embodiments, the device is a cassette.

[0026] In some embodiments, the device is adapted to be assembled from a kit according to the fifth aspect.

[0027] In a second aspect, there is provided a securing portion adapted to secure a sensor component in position, the sensor component comprising one or more sensor regions for receiving fluid sample from a fluidic interconnect comprising one or more fluidic paths, each fluidic path adapted to deliver fluid sample to at least one sensor region of the sensor component, the one or more sensor regions configured to be operatively connected to a circuit for sensing one or more electronic properties of fluid sample by one or more electronic connections part of an electronic interconnect, wherein the sensor component is removable from position.

[0028] In a third aspect, there is provided a fluidic interconnect comprising one or more fluidic paths, each fluidic path adapted to deliver fluid sample to at least one sensor region of a sensor component for sensing one or more electronic properties of fluid sample, the sensor component securable in position by a securing portion, the one or more sensor regions configured to be operatively connected to a circuit for sensing one or more electronic properties of fluid sample by one or more electronic connections part of an electronic interconnect, wherein the sensor component is removable from position.

[0029] In a fourth aspect, there is provided an electronic interconnect comprising one or more electronic connections, each electronic connection for operatively connecting one or more sensor regions of a sensor component for sensing one or more electronic properties of fluid sample to a circuit for sensing one or more electronic properties of fluid sample, the sensor component securable in position by a securing portion, the sensor component comprising one or more sensor regions for receiving fluid sample from a fluidic interconnect comprising one or more fluidic paths, each fluidic path adapted to deliver fluid sample to at least one sensor region of the sensor component, wherein the sensor component is removable from position.

[0030] In a fifth aspect, there is provided a kit for one or more sensor components for sensing one or more electronic properties of fluid sample comprising: a securing portion adapted to secure a sensor component in position, the sensor component comprising one or more sensor regions for receiving fluid sample, a fluidic interconnect comprising one or more fluidic paths, each fluidic path adapted to deliver fluid sample to at least one sensor region of the sensor component, and an electronic interconnect comprising one or more electronic connections, each electronic connection for operatively connecting the one or more sensor regions of the sensor component to a circuit for sensing one or more electronic properties of fluid sample, wherein the sensor component is removable from position.

[0031] In some embodiments, the sensor component is removable from position such that the securing portion can secure a second sensor component in position.

[0032] In some embodiments, the sensor component is removable from position such that at least one operative connection between the sensor region and the circuit is broken.

[0033] In some embodiments, the electronic connection and at least a portion of the sensor component are capable to touching each other for forming at least one operative connection between the sensor region and the circuit.

[0034] In some embodiments, the securing portion is adapted such that the sensor component abuts against the electronic connection for forming at least one operative connection. [0035] In some embodiments, the electronic connection is or comprises electronic contacts.

[0036] In some embodiments, the electronic contacts directly contact the sensor component.

[0037] In some embodiments, the electronic contacts directly touch a respective electrode on the sensor component.

[0038] In some embodiments, the electronic contacts are pins.

[0039] In some embodiments, the electronic contacts are spring loaded.

[0040] In some embodiments, the securing portion comprises a surround and/or an enclosure.

[0041] In some embodiments, the sensor component is removable from position by removing the sensor component from the surround.

[0042] In some embodiments, the sensor component comprises four sensor regions.

[0043] In some embodiments, the fluidic interconnect comprises four fluidic paths.

[0044] In some embodiments, each fluidic path is adapted to deliver fluid sample to a respective sensor region.

[0045] In some embodiments, the electronic interconnect comprises four electronic connections.

[0046] In some embodiments, each electronic connection is configured to operatively connect a respective sensor region to the circuit.

[0047] In some embodiments, the fluidic path: comprises an o-ring and/or comprises compressible material and/or is adapted to bonding for sealing the fluidic path to the sensor component.

[0048] In some embodiments, the fluidic path is further adapted such that fluid sample is removable from the sensor region. [0049] In some embodiments, the fluidic path is or comprises a fluidic well.

[0050] In some embodiments, the fluidic path is or comprises a Luer slip connector.

[0051] In some embodiments, the device is a cassette.

[0052] In some embodiments, securing portion, the fluidic interconnect and the electronic interconnect (that the kit comprises of) are adapted to form a device according to the first aspect.

[0053] In a sixth aspect, there is provided a system for sensing one or more electronic properties of fluid sample comprising: a device according to any previous aspect, a circuit for sensing one or more electronic properties of fluid sample, and optionally a sensor component comprising one or more sensor regions for receiving fluid sample.

[0054] In some embodiments, the circuit is configured to sense one or more electronic properties of fluid sample by sensing one or more voltages/currents of one or more transistors corresponding to a sensor region.

[0055] In some embodiments, the circuit is configured to sense one or more electronic properties of fluid sample by sensing one or more of: a voltage across a source electrode and a drain electrode a current between the source electrode and the drain electrode a voltage across a gate electrode and the drain electrode a voltage across the gate electrode and the source electrode, optionally the gate electrode is a back-gate.

[0056] In some embodiments, the circuit is configured to control operation of the device and/or the sensor component.

[0057] In some embodiments, the circuit is configured to control operation of the sensor component by applying one or more voltages/currents of one or more transistors corresponding to a sensor region.

[0058] In some embodiments, the circuit is configured to control operation of the sensor component by: generating a voltage across a source electrode and a drain electrode, and varying a voltage on a gate electrode, optionally the gate electrode is a back- gate.

[0059] In some embodiments, the transistor comprises a plurality of gate electrodes, optionally any one of the plurality of gate electrodes is a back-gate.

[0060] In some embodiments, the system further comprises a computing device.

[0061] In some embodiments, the circuit is, or is part of an electronic device.

[0062] In some embodiments, the circuit and/or the electronic device is operatively connected to a computing device.

[0063] In some embodiments, the circuit is, or is part of a computing device.

[0064] In some embodiments, the sensor component comprises a CMOS -based circuit configured to generate one or more voltages for sensing the one or more electronic properties of fluid sample.

[0065] In a seventh aspect, there is provided a method for one or more sensor components for sensing one or more electronic properties of the fluid sample comprising the steps of: securing a sensor component in position, delivering a fluid sample to a sensor region of a sensor component, operatively connecting the sensor region of the sensor component to a circuit, sensing one or more electronic properties of fluid sample, and removing the sensor component from position.

[0066] In this specification, the phrase "sense (or measure) one or more electronic properties of fluid sample" may refer to sensing or measuring one or more electronic parameters induced by the deliverance of fluid sample to a sensor region of the sensor component. Such electronic parameter may include one or more of: voltage, current, capacitance, inductance, resistance, or change thereof, and the like. The sensed or measured electronic property of fluid sample may then be used to infer a property of fluid sample, such as chemical composition of fluid sample for example. Other properties of fluid sample, including physical, chemical or electrical (or other) properties may be inferred based on one or more sensed or measured electronic properties of fluid sample.

BRIEF DESCRIPTION OF THE DRAWINGS [0067] Figure 1 shows an overview of an exemplary device and system for sensing an electronic property of fluid sample.

[0068] Figures 2A-D show an exemplary embodiment of a device and a sensor component for sensing an electronic property of fluid sample.

[0069] Figures 2E-H show an exemplary embodiment of a device and a sensor component for sensing an electronic property of fluid sample.

[0070] Figures 3A-D show CAD drawings of the exemplary device embodiment shown in Figures 2A-C.

[0071] Figures 4A-C show various exemplary fluidic interconnect embodiments.

[0072] Figures 5A-B show overviews of exemplary circuits for sensing an electronic property of fluid sample.

[0073] Figures 6A-B show circuit diagrams of exemplary embodiments of a circuit for sensing an electronic property of fluid sample.

[0074] Figures 7A-B show exemplary embodiments of a circuit for sensing an electronic property of fluid sample.

[0075] Figure 8 shows an exemplary graphical user interface displaying a sensed electronic property of fluid sample.

[0076] Figures 9A-V show exemplary methods of assembling a system comprising a device for sensing an electronic property of fluid sample so that it is ready for use.

[0077] Figure 10 shows a flow chart of an exemplary method for sensing an electronic property of fluid sample.

DETAILED DESCRIPTION

[0078] The following modes, features or aspects, given by way of example only, are described in order to provide a more precise understanding of the subject matter of a preferred embodiment or embodiments. 1. Overview

[0079] A general overview of a system, device, kit, and method for sensing one or more electronic properties of fluid sample will be described with reference to Figure 1.

[0080] Figure 1 shows a general diagrammatic overview of a system 1 for sensing one or more electronic properties of fluid sample. In this example, the system comprises a device 10 (which could be formed from a kit of parts 11) and a circuit 12. The device 10 is designed to operate with a sensor component 14 (which could be a lab-on-a-chip and/or a graphene biosensor for example), which may optionally be part of the system 1. The device 10 is used to deliver fluid sample 16 to the sensor component 14. The device 1 is also used to electronically connect the sensor component 14 to the circuit 12. By connecting the sensor component 14 to the circuit 12, experiments can be conducted on fluid sample 16 delivered to the sensor component 14. For example, sensor measurements can be taken which can be used to sense or measure one or more electronic properties of fluid sample 16. The system may additionally include a computing device 18 to operate together with the circuit 12 and/or the device 10. For example, the computing device 18 may include a graphical user interface to enable a (human) user to control operation of the circuit 12 and/or device 10.

[0081] The embodiments described herein enable high throughput of testing that turnover a plurality of sensor components. This is considered to be an improvement from conventional methods involving wire-bonding of the sensor component which in conventional methods is used to electronically connect the sensor component so that experiments can be conducted on it to sense or measure one or more electronic properties of fluid sample. It is desirable if the need to wire -bond the sensor component can be avoided to enable fast switching/interchanging of a plurality of sensor components under test. Embodiments described herein (of the system 1 and/or device 10 for example) provide such advantage as will be apparent from the remaining description.

2. General embodiments

[0082] General embodiments will now be described with respect to Figure 1. Discussion turns to the sensor component 14, followed by the device 10, followed by the circuit 12, and then followed by the computing device 18. [0083] The sensor component 14 is a component used to sense or measure one or more electronic properties of fluid sample 16. The sensor component 14 includes one or more sensor regions 20. In this specification, sensor region 20 can be considered to refer to a portion of the sensor component 14 that fluid sample 16 is delivered to so that an electronic property of delivered fluid sample 16 can be sensed or measured. The sensor component 14 may comprise one sensor region, or two sensor regions, or three sensor regions, or four sensor regions, or more. The sensor region 20 may be a sensor and/or an active site for example. The sensor component 14 may be a generic off-the-shelf product and/or be custom made for any embodiment of the system/device as described herein. The term "sensor component" can be interchangeable with "chip" throughout the specification. The sensor component can be a lab-on-a-chip and/or a graphene biosensor for example. In some embodiments, the sensor component comprises a CMOS -based circuit configured to generate one or more voltages for sensing the one or more electronic properties of fluid sample. Although the sensor component 14 is to be used in conjunction with described embodiments (of the system and/or device for example), the sensor component 14 may be considered to be part of the system 1 and/or the device 10, but it is not essential for the sensor component 14 to be part of the system 1. An exemplary embodiment of the sensor component 14 is biosensor chip 114 as shown in Figure 2D. Another exemplary embodiment of the sensor component 14 is biosensor chip 214 as shown in Figure 2H. Both exemplary embodiments will be described in more detail later.

[0084] The system 1 comprises a device 10 for sensing one or more electronic properties of fluid sample 16. As mentioned, the device 10 is designed to operate with the sensor component 14. The device 10 is used to deliver fluid sample 16 to the sensor component 14 to electronically connect the sensor component 14 to the circuit 12. The device 10 may be a cassette, but this is optional. An exemplary embodiment of the device 10 is the device 110. The device HOis shown in Figures 2A-2C and Figures 3A-3D, which will be described in more detail later. Another exemplary embodiment of the device 10 is the device 210. The device 210 is shown in Figures 2E-G, which will be described in more detail later.

[0085] The device 10 includes a securing portion 22, a fluidic interconnect 24, and an electronic interconnect 26. Each of these components will be discussed in turn. [0086] The securing portion 22 is a portion of the device 10 used to secure the sensor component 14 in position. The securing portion 22 may be a singular component or made from multiple components. In some embodiments, the securing portion 22 may be a surround that the sensor component 14 can fit into. This is so that the sensor component is snap-fitted into position and is secure. An exemplary embodiment of the securing portion 22 is the securing portion 122 comprising a surround 134 and bottom enclosure 136 as shown in Figures 2A-C and Figures 3A-3D, which will be described in more detail later.

[0087] The fluidic interconnect 24 is a portion of the device 10 used to assist in delivering fluid sample 16 to the sensor component 14. It will be apparent to a person skilled in the art that from a safety perspective it is desirable that fluid sample 16 is safely delivered to a sensor component 14, which in itself is an electronic component and may be operatively connected to a circuit 12. The fluidic interconnect 24 includes one or more fluidic paths 28 which are used to deliver fluid sample 16 to the sensor component 14 effectively, particularly at the micro-fluidics scale. More specifically, the sensor component 14 includes one or more sensor regions 20 which the fluidic path/s 28 of the fluidic interconnect 24 are adapted to deliver fluid to so that electronic properties of the fluid can be sensed or measured by the circuit (see progression of arrows of fluid sample 16a-d for example). The fluidic path 28 may be adapted in a number of ways to interface with the sensor component 14 to reduce leakage of fluid sample. For example, an o-ring may be used to provide a seal between the fluidic path 28 and the (sensor region 20 of the) sensor component 14. Additionally or alternatively, the fluidic path 28 may comprise of compressible material that seals to the (sensor region 20 of the) sensor component 14. Additionally or alternatively the fluidic path 28 may be adapted to bond directly to the (sensor region 20 of the) sensor component 14. The fluidic interconnect 24 may comprise one fluidic path, or two fluidic paths, or three fluidic paths, or four fluidic paths, or more. In some embodiments, a fluidic path 28 is used deliver fluid sample 16 to a single sensor region 20 of a sensor component 14. In some embodiments, a fluidic path 28 is used to deliver fluid sample 16 to a plurality of sensor regions 20 of a sensor component 14. In some embodiments, the fluidic interconnect 24 comprises a plurality of fluidic paths 28, each fluidic path 28 for delivering fluid sample 16 to a sensor region 20 respectively such as shown in Figure 1. The fluidic path 28 may be or comprise a fluidic well. The fluidic interconnect 24 may be a singular component or made from multiple components. The fluidic interconnect 24 may be modular in nature such that one fluidic interconnect embodiment may be swapped for another fluidic interconnect embodiment. Exemplary embodiments of the fluidic interconnect 24 include the fluidic interconnects 124, 224, 324 as shown in Figure 2A Figures 3A-D, and Figures 4A-4C which will be described in more detail later.

[0088] The electronic interconnect 26 is a portion of the device 10 used to assist in electronically connecting the sensor component 14 to the circuit 12. The electronic interconnect 26 partitions the fluid sample 16 from potentially sensitive/fragile electronics present in the circuit 12 and/or computing device 18 which might pose a safety hazard if exposed to fluid. In particular, the electronic interconnect 26 includes one or more electronic connections 30. Each electronic connection 30 provided by the electronic interconnect 26 is for forming an operative connection 32 between the one or more sensor regions 20 of the sensor component 14 to the circuit 12 and/or computing device 18. The electronic interconnect 26 may comprise one electronic connection, or two electronic connections, or three electronic connections, or four electronic connections, or more. In some embodiments, each electronic connection 30 can be for forming a respective operative connection 32 between a respective sensor region and the circuit (and/or the computing device). However, the electronic connection 30 may be used to operatively connect 32 a plurality of sensor regions 20 to the circuit 12 (and/or the computing device 18). In some embodiments, the electronic connection 30 is or comprises electronic contacts. In some embodiments, the electronic contacts directly contact the sensor component 14. In some embodiments, the electronic contacts directly touch a respective electrode on the sensor component 14 (the electrode electronically connected to a sensor region 20). In some embodiments, the electronic contacts are pins. In some embodiments, the electronic contacts are spring loaded. For example, the electronic contacts are spring-loaded pins. In some embodiments, the electronic interconnect 26 is configured to facilitate simultaneous measurements across a plurality of sensor regions of a sensor component 14. This may be done through multiplexing. Exemplary embodiments of the electronic interconnect 26 include the electronic interconnect 126 as shown in Figures 2B-C and Figures 3A-D, as well as the electronic interconnect 226 as shown in Figures 2E-G, which will be described in more detail later.

[0089] Although Figure 1 shows the securing portion 22, a fluidic interconnect 24, and an electronic interconnect 26 as separate components of the device 10, some device embodiments may have any one of the securing portion 22, a fluidic interconnect 24, and an electronic interconnect 26 as being integrated with each other. For example, the device may comprise a fluidic interconnect 24 and an electronic interconnect 26 integrated into a single component.

[0090] Once the securing portion 22 holds the sensor component 14 in position, and the device 10 is connected to a circuit 12, the device 10 is designed to be used as follows. Fluid sample 16 is delivered to a sensor region 20 of a sensor component 14. This is done by passing fluid sample 16 through a fluidic path 28 of a fluidic interconnect 24. The device 10 connects to the circuit 12 by having sensor region 20 operatively connected 32 to the circuit 12 using a connection 30 of the electronic interconnect 26. This means once the sensor region 20 receives the delivered fluid sample 16 any voltage applied across the sensor region 20 and/or current passing through the sensor region 20 results in a signal recorded by the circuit 12 which can be considered to be a sensed or measured electronic property of fluid sample.

[0091] Given that the device 10 may comprise a plurality of fluidic paths 28 to deliver fluid sample 16 to a plurality of sensor regions 20 that are operatively connectable 32 to the circuit 12 and/or computing device 18, it is possible to use the device 10 to sense or measure one or more different types of fluid samples. For example, it is possible to deliver different analytes to a common sensor component 14 to sense or measure one or more electronic properties pertaining to the different analytes delivered to the different sensor regions 20 of the common sensor component 14. That is, multiple independent experiments can be conducted using a single device 10. This is possible if the device 10 is configured with a fluidic interconnect 24 comprising a plurality of fluidic paths 28 and an electronic interconnect 26 used to form multiple operative connections 32 to a circuit 12 and/or computing device 18 (and the device 10 is used with a sensor component 14 comprising a plurality of sensor regions 20).

[0092] The device 10 can be said to be advantageous for reasoning as follows. The device 10 can be operated such that the sensor component 14 is removable from position following use of the device. That is, the sensor component 14 is removable from position such that the securing portion 22 can secure a second sensor component 14 in position. Or to put it in another way, the sensor component 14 is removable from position such that at least one operative connection 32 between the sensor region 20 and the circuit 12 is broken. The device is therefore configured to provide removability of the sensor component 14. This enables the device 10 to be used with multiple sensor components. The device 10 can be used in applications where there is a desire for high turnover, specifically where there is a desire to conduct numerous testing on a plurality of sensor components. This can be contrasted to existing methods that use wire-bonding techniques which is acceptable for one- off use of a chip, but is impractical where there is a desire to swap/interchange chips between testing. In the device 10, the sensor component 14 does not need to be wire-bonded (although this remains an option).

[0093] The advantage provided by the removability of the sensor component 14 from position can be said to come about because the device 10 has a securing portion 22 to secure the sensor component 14 into position. When the sensor component 14 is in position, the device 10 can be configured such that the electronic connection 30 and at least a portion of the sensor component 14 are capable of touching/contacting each other for forming at least one operative connection 32 between the sensor region 20 and the circuit 12. For example, this could be made possible because the securing portion 22 is adapted such that the sensor component 14 abuts against the electronic connection 30 (and/or vice versa) for forming at least one operative connection 32.

[0094] Although general embodiments of the device 10 described above is said to include a securing portion 22, a fluidic interconnect 24, and an electronic interconnect 26 as described above, the device 10 may be formed from a kit assembly 11 including a securing portion 22, a fluidic interconnect 24, and an electronic interconnect 26 as described above. That is, there may be provided a kit assembly 11 including a securing portion 22, fluidic interconnect 24, and an electronic interconnect 26, such that the securing portion 22, fluidic interconnect 24, and the electronic interconnect 26 can be assembled together to form a device 10 as described above.

[0095] In addition to the device 10, the system 1 also comprises a circuit 12. The circuit 12 refers to the electronics used to sense or measure one or more properties of fluid sample 16. In some embodiments, the circuit 12 is configured to facilitate simultaneous measurements across a plurality of sensor regions of a sensor component 14. This may be done through multiplexing. In some embodiments, the circuit 12 may be a printed circuit board (PCB). In some embodiments, the circuit 12 may be part of an electronic device. Although the circuit 12 is shown separately to the device 10 and computing device 18 in Figure 1, this is not necessary. For example, the circuit 12 may be incorporated as part of the device 10. For example, the circuit 12 may be incorporated as part of the electronic interconnect 26 (while still protecting the circuit 12 from the fluid sample 16 delivered to the sensor region 20 of the sensor component 14 when in use). In another example, the device 10 may be part of the computing device 18. Exemplary embodiments of the circuit 12 include the circuit 412 as shown on Figures 6A and 7A, as well as the circuit 512 as shown on Figure 6B and 7B. In some embodiments, the system may comprise a holder 13 to hold the device 10 and circuit 12 together. One example holder 513 as shown in Figure 7B. The holder 513 may be used to hold any device embodiment together with any circuit embodiment.

[0096] Some embodiments of the system 1 may further comprise a computing device 18. The computing device 18 can be operatively connected 33 to the rest of the system 1 to control operation of the device 10 and/or the circuit 12. In some embodiments, the computing device 18 may be a laptop configured with a graphical user interface for displaying the results of the sensed or measured property of fluid sample 16. In some embodiments, the computing device 18 is configured to facilitate simultaneous measurements across a plurality of sensor regions of a sensor component 14. This may be done through multiplexing.

[0097] From the general and exemplary embodiments of the system 1, device 10, 110, 210 and kit 11 described above, as well as exemplary embodiments of device 110, 210 (falling within the scope of embodiments of the system 1, device 10, and kit 11) that will be discussed in later sections of the detailed description, the following are provided.

[0098] There is provided a device 10, 110, 210 for one or more sensor components 14, 114, 214 for sensing one or more electronic properties of fluid sample 16. The device 10, 110, 210 including a securing portion 22, 122 adapted to secure a sensor component 14, 114, 214 in position. The sensor component 14, 114, 214 including one or more sensor regions 20, 144, 244 for receiving fluid sample 16. The device 10, 110, 210 including a fluidic interconnect 24, 124, 224, 324 including one or more fluidic paths 28, 128, 228, 328. Each fluidic path 28, 128, 228, 328 adapted to deliver fluid sample 16 to at least one sensor region 20, 114, 214 of the sensor component 14, 114, 214. The device 10, 110, 210 including an electronic interconnect 26, 126, 226 including one or more electronic connections 30, 130, 230. Each electronic connection 30, 130, 230 for operatively connecting 32 the one or more sensor regions 20, 144, 244 of the sensor component 14, 114, 214 to a circuit 12, 412, 512 for sensing one or more electronic properties of fluid sample 16. The sensor component 14, 114, 214 is removable from position.

[0099] In some embodiments, the sensor component 14, 114, 214 is removable from position such that the securing portion 22, 122 can secure a second sensor component 14, 114 ,214 in position. In some embodiments, the sensor component 14, 114, 214 is removable from position such that at least one operative connection 32 between the sensor region and the circuit is broken. In some embodiments, the electronic connection 30, 130, 230 and at least a portion of the sensor component 14, 114 ,214 are capable of touching each other for forming at least one operative connection 32 between the sensor region 20, 144, 244 and the circuit 12, 412, 512. In some embodiments, the securing portion 22, 122 is adapted such that the sensor component 14, 144, 244 abuts against the electronic connection 30 for forming at least one operative connection 32. In some embodiments, the electronic connection 30, 130, 230 is or comprises electronic contacts. In some embodiments, the electronic contacts directly contact the sensor component 14, 114, 214. In some embodiments, the electronic contacts directly touch a respective electrode on the sensor component 14, 114. In some embodiments, the electronic contacts are pins. In some embodiments, the electronic contacts are spring loaded. In some embodiments, the securing portion 22, 122 comprises a surround and/or an enclosure. In some embodiments, the sensor component 14, 114, 214 is removable from position by removing the sensor component 14, 114, 214 from the surround. In some embodiments, the device 10 is adapted to be assembled from a kit 11. For example, a kit 11 including a securing portion 22, 122, a fluidic interconnect 24, 124, 224, 324, and an electronic interconnect 26, 126, 226.

[00100] There is also provided a securing portion 22, 122 adapted to secure a sensor component 14, 114, 214 in position. The sensor component 14, 114, 214 including one or more sensor regions 20, 144 ,244 for receiving fluid sample 16 from a fluidic interconnect 26, 126, 226, 326 including one or more fluidic paths 28, 128, 228, 328. Each fluidic path 28, 128, 228, 328 adapted to deliver fluid sample 16 to at least one sensor region 20, 144, 244 of the sensor component 14, 114, 214. The one or more sensor regions 20, 144, 244 configured to be operatively connected 32 to a circuit 12, 412, 512 for sensing one or more electronic properties of fluid sample 16 by one or more electronic connections 30, 130, 230 part of an electronic interconnect 26, 126, 226. The sensor component 14, 114, 214 is removable from position.

[00101] There is also provided a fluidic interconnect 24, 124, 224, 324 including one or more fluidic paths 28, 128, 228, 328. Each fluidic path 28, 128, 228, 328 adapted to deliver fluid sample 16 to at least one sensor region 20, 144, 244 of a sensor component 14, 114, 214 for sensing one or more electronic properties of fluid sample 16. The sensor component 14, 114, 214 securable in position by a securing portion 22, 122. The one or more sensor regions 20, 144, 244 configured to be operatively connected 32 to a circuit 12, 412, 512 for sensing one or more electronic properties of fluid sample 16 by one or more electronic connections 30, 130, 230 part of an electronic interconnect 26, 126, 226. The sensor component 14, 114, 214 is removable from position.

[00102] There is also provided an electronic interconnect 26, 126, 226 including one or more electronic connections 30, 130, 230. Each electronic connection 30, 130, 230 for operatively connecting 32 one or more sensor regions 20, 144, 244 of a sensor component 14, 114, 214 for sensing one or more electronic properties of fluid sample 16 to a circuit 12, 412, 512 for sensing one or more electronic properties of fluid sample 16. The sensor component 14, 114, 214 securable in position by a securing portion 22, 122. The sensor component 14, 114, 214 including one or more sensor regions 20, 144, 244 for receiving fluid sample 16 from a fluidic interconnect 24, 124, 224, 324 including one or more fluidic paths 28, 128, 228, 328. Each fluidic path 28, 128, 228, 328 adapted to deliver fluid sample 16 to at least one sensor region 20, 144, 244 of the sensor component 14. The sensor component 14 is removable from position.

[00103] There is provided a kit 11 for one or more sensor components 14, 114, 214 for sensing one or more electronic properties of fluid sample 16. The kit 11 including a securing portion 22, 122 adapted to secure a sensor component 14, 114, 214 in position. The sensor component 14, 114, 214 including one or more sensor regions 20, 144, 244 for receiving fluid sample 16. The kit 11 including a fluidic interconnect 24, 124, 224, 324 including one or more fluidic paths 28, 128, 228, 328. Each fluidic path 28, 128, 228, 328 adapted to deliver fluid sample 16 to at least one sensor region 20, 144, 244 of the sensor component 14, 114, 214. The kit 11 including an electronic interconnect 26, 126, 226 including one or more electronic connections 30, 130, 230. Each electronic connection 30, 130, 230 for operatively connecting 32 the one or more sensor regions 20, 144, 244 of the sensor component 14, 114, 214 to a circuit 12, 412, 512 for sensing one or more electronic properties of fluid sample 16. The sensor component 14, 114, 214 is removable from position.

[00104] In some embodiments, the securing portion 22, 122, the fluidic interconnect 24, 124, 224, 324 and the electronic interconnect 26, 126, 226 that form the kit 11 are adapted to form a device 10, 110, 210, the device optionally being a cassette.

3. Exemplary embodiments

[00105] Various specific embodiments of the system 1, device 10, and kit 11 for sensing an electronic property of fluid sample 16 will now be described in more detail.

3.1. First exemplary device embodiment

[00106] Figures 2A-C show first exemplary embodiment of a device 110. The device 110 can be said to be a device cassette. The device 110 is configured for use with a sensor component, which for example can be a graphene biosensor chip 114 or 214, shown on Figures 2D and 2H respectively.

[00107] Referring to Figures 2A-C, the device 110 comprises a securing portion 122, a fluidic interconnect 124, and an electronic interconnect 126. Each will be described in turn.

[00108] In this particular embodiment of the device 110, the securing portion 122 comprises a surround 134 and a bottom enclosure 136. The surround 134 and bottom enclosure 136 are used to secure the graphene biosensor chip in position. The surround 134 comprises a cavity or slot 138 for the graphene biosensor to snap-fit into. That is, the surround 134 holds the chip 114 in place laterally and aligns the bond pads on the chip 114 with the pins (or electronic connection more generally) of the electronic interconnect 126. The bottom enclosure comprises a contact portion 140 used to push the biosensor chip into the correct position (along with the cavity 138 or slot of the surround 134). That is, the bottom enclosure pushes the chip into the o-rings (or fluid path more generally) and the spring-loaded pins (or electronic connections more generally) and is affixed to the rest of the device cassette using screws. Both the surround 134 and the bottom enclosure 136 may be manufactured by either CNC milling, injection moulding, or 3D printing. [00109] In this particular embodiment of the device 110, the fluidic interconnect 124 comprises four fluidic paths, which in this example are four fluidic wells 128. Each fluidic well connector 128 can accept fluid deposited with a pipette. Each fluidic well may come with an o-ring 142 that interfaces with the active site of the biosensor chip 114. The o-ring 142 acts as a sealant to reduce unwanted leakage/spillage of fluid sample over the biosensor chip.

[00110] In this particular embodiment of the device 110, the electronic interconnect 126 comprises a PCB that has four electronic connections, each electronic connection 130 for providing an operative connection between an active site (or sensor region more generally) and a circuit for reading the biosensor chip. Each electronic connection may be or comprise (a plurality of) pins. In the example shown in Figure 2C, each electronic connection 130 has five pins. The pins are optionally spring loaded. The pins provide a stable electrical contact to the chip when depressed. In embodiments where the spring loaded pins and o-rings (for the fluidic well/s) are used, it is preferable that they are at substantially same height/length such that both make contact with the chip at the same time. Without the feature of the pins, the chip would require wire bonding or the use of thin tungsten probes such as on a probe station. This allows the chip signal read-out to be mobile and accessible as well as being able to quickly and easily replace or substitute/interchange a chip. The electronic interconnect 126 also comprises four plugs 131. Each plug 131 can be used to connect the device 110 to a circuit to provide electronics to sense or measure fluid sample.

[00111] Figure 2D shows a first exemplary embodiment of a graphene biosensor chip 114. The biosensor chip 114 can be used with the electronic interconnect 126. The graphene biosensor chip 114 comprises four transistors, which in this example are the gFETs 144 encircled in Figure 2D. The biosensor chip 114 also comprises four sensor regions which in this example are active sites 144 provided by each gFET 144. Each gFET 144 is connected to a plurality of bond pads (electrodes) 146 as indicated by the arrows. The bond pads 146 are adapted to directly contact the electronic contacts/pins of an electronic connection of the electronic interconnect to form an operative connection between the active site/sensor region of the of the biosensor chip 114 and a circuit. In the example shown in Figure 2D, there are 6 bond pads used to form each operative connection between a gFET 144 and a circuit. Optionally, the gFETs 144 have a global back gate (that is, a gate located under the graphene layer of the biosensor chip), the bond pad of which is shown at 148. Optionally, the biosensor chip 114 further comprises a plurality of probe stations not connected to the bond pads 146. There are two probe stations 152 each comprising two graphene contacts for electrical measurement, two probe stations 154 each comprising six graphene contacts for electrical measurement, and one probe station 156 that is a gFET.

3.2. Second exemplary device embodiment

[00112] Figures 2D-F show a second exemplary embodiment of a device 210. The device 210 can be said to be a device cassette. The device 210 is configured for use with a sensor component, which can be for example a graphene biosensor chip 114 or 214, shown on Figures 2G and 2H respectively.

[00113] The second exemplary device embodiment 210 is similar to the first exemplary device embodiment 110, except device embodiment 210 uses a different electronic interconnect embodiment 226. That is, Figures 2E-G show a device embodiment 210 that comprises a securing portion 122, a fluidic interconnect 124, and an electronic interconnect 226.

[00114] One way that the electronic interconnect 226 differs from the electronic interconnect 126 is that the electronic interconnect 226 has only a single plug 231 for connecting the device 210 to the circuit as can be seen on Figures 2E-G. In contrast, the electronic interconnect 126 has four plugs 131. Another way that the electronic interconnect 226 differs from the electronic interconnect 126 is that the electronic interconnect 226 has a greater number of pins 230 for forming the operative connection between the gFET of the biosensor chip and the circuit. In the example of Figure 2G, there are seven pins for each electronic connection 230 of the electronic interconnect 226. In contrast, the example of Figure 2C has only five pins for each electronic connection 130 found on the electronic interconnect 126. Having additional pins for each electronic connection 230 facilitates multiplexing when using gFETs to sense fluid sample. The pins can be assigned as source, drain, gate electrodes using software (implemented in the circuit or computing device) which facilitates multiple chip designs.

[00115] Figure 2H shows a second exemplary embodiment of a graphene biosensor chip 214. The graphene biosensor chip 214 preferably used with electronic interconnect 226 than electronic interconnect 126 since electronic interconnect 226 has more pins per electronic connection 230 compared with electronic interconnect 125, however this is not essential. The graphene biosensor chip 214 comprises four transistors, which in this example are the gFETs 244 encircled in Figure 2H. The biosensor chip 214 also comprises four sensor regions which in this example are active sites 244 provided by each gFET 244. Each gFET 244 is connected to a plurality of bond pads (electrodes) 246 as indicated by the arrows. The bond pads 246 are adapted to directly contact the electronic contacts/pins of an electronic connection of the electronic interconnect to form an operative connection between the active site/sensor region of the of the biosensor chip 214 and a circuit. The four gFETs 244 of the biosensor chip 214 each have a back-gate (that is, a gate located under the graphene layer of the biosensor chip), the respective bond pads of the back-gates shown at 248. Optionally, the biosensor chip 214 further comprises a plurality of probe stations. Each probe station is connected to a respective gFET 244. There is a probe station 262 for Van der Pauws (to measure resistivity and Hall Coefficient of a sample), which can optionally be liquid gated. There is a probe station 264 to measure the inherent resistance of graphene. There is a probe station 266 to measure Hall bar. There is a probe station 268 that is a gFET able to act as a single graphene sheet or two sheets in parallel.

3.3. Fluid interconnect embodiments

[00116] Figures 4A-4C show various CAD drawings of exemplary embodiments of the fluidic interconnect. Figure 4A shows fluidic interconnect 124 as previously described. Figure 4B shows yet a further exemplary fluidic interconnect embodiment 224. In this particular example, the fluidic interconnect 224 comprises eight fluidic paths, which in this example are eight fluidic slip connectors 228. Figure 4C shows yet a further exemplary fluidic interconnect embodiment 324. In this particular example, the fluidic interconnect 324 comprises four fluidic paths, which in this example are four fluidic slip connectors 328. Each fluidic slip connector 328 can accept fluid when interfaced with a pump. In the fluidic interconnect embodiments 224 and 234, each active site 120 (or sensor region more generally) can be connected to two fluidic slip connectors 228, 328 to pump fluid in and remove it (e.g. washing), or pump it out (e.g. drying and/or pipetting).

[00117] The fluidic interconnects 124, 224, 324 can be manufactured in several ways. The example embodiments 124 shown in Figures 4A can be made using computer numerical control (CNC) milling and out of a variety of materials including various thermoplastics or metals. The more complex design of example embodiments 224, 324 shown in Figures 3C and 3D involves 3D printing or injection moulding which means polymer-based materials are normally used.

[00118] The exemplary fluid interconnect embodiments 124, 224, 324 as described can be used with device embodiment 110, device embodiment 210 or any other embodiment of device 10. Each fluid interconnect embodiment 124, 224, 324 may be interchangeable with each other with any device embodiment 110, 210.

3.4. Circuit design

[00119] In addition to a circuit, the system 1 may also comprise a circuit 12. Embodiments of the circuit 12 will now be described with respect to Figures 5A-7B. A first circuit embodiment 412 will be described with respect to Figures 5A, 6A, and 7A. A second circuit embodiment 512 will then be described with respect to Figures 5B, 6B, and 7B.

[00120] 412. In this example, the circuit drives and reads the biosensor chip, and interfaces with a computing device, such as a laptop computer for example. The circuit drives the active site of the biochip sensor by generating a voltage across the source and drain electrodes and varying the electrodes and varying the voltage on the gate electrode. It then reads the voltage/current across the source and drain electrodes, the voltage across the gate and drain electrodes and the voltage across the gate and source electrodes. To achieve this, the circuit 412 comprises a Digital to Analogue (DAC) Converter 422 (to generate voltages), an Analogue to Digital (ADC) Converter 424 (to read voltages), a power regulator 426, and a USB interface 428. Any of items 422-228 can be an integrated chip (IC), but this is not necessary. The DAC 422 is to generate the voltages. The ADC 424 is used to read voltages. The USB interface 428 communicates with the other chips (or components of the circuit 412 more generally) using a serial communication interface, which could be an Serial Peripheral Interface (SPI), such as the i2c protocol for example. The electronics sense current using a current sense resistor of sufficiently high resistance (e.g., 470 Ohm in this case) to read current values down to nA to provide maximum sensing sensitivity. The high resistance of the shunt resistor can affect the voltage accuracy of the DAC (due to the large voltage drop across the shunt). This can be compensated for by implementing a software routine to account for the voltage drop to give accurate voltage readings. Alternatively, the current sense resistor can have a smaller resistance (e.g. 1.5-2 Ohms) but be used in conjunction with an instrumentation amplifier to amplify the voltage drop across the resistor before being read by the ADC. Alternatively, a transimpedance amplifier can be used to covert current to voltage directly without the need for a shunt resistor. The circuit 412 can be operatively connected to any electronic interconnect embodiment, including electronic interconnect 126 or 226 for example.

[00121] Figure 6A shows an exemplary schematic of the exemplary circuit embodiment 412. Figure 7A shows an exemplary prototype of the exemplary circuit embodiment 412.

[00122] Figure 5B shows an overview of an exemplary circuit embodiment 512. The circuit 512 includes a Digital to Analogue (DAC) Converter 522 (to generate voltages), an Analogue to Digital (ADC) Converter 524 (to read voltages), a power regulator 526, and a USB interface 528. Unlike circuit 412 as shown on Figure 5A, circuit 512 comprises multiplexing channels 532, as well as back-gating channels 534. As the circuit 512 comes with multiplexing channels and backgating channels, it is preferable that the circuit 512 is operatively connected to biosensor chip 214 and fluid interconnect 226 as described already. However, other biosensor chip embodiments and/or other fluid interconnect embodiments may be used to operatively connect to circuit 512 instead. The circuit 512 may also have any of the features described with respect to circuit 412.

[00123] Figure 6B shows an exemplary schematic of the exemplary circuit embodiment 512. Figure 7B show an exemplary prototype of the exemplary circuit embodiment 512. In Figure 7B, the circuit 512 is contained by a holder 513 for holding the circuit 512 together with a device 10, 110, 210 as a single unit to form the system 1, or part thereof.

[00124] Some specifications of circuit 512 are provided by way of example as follows:

• Circuit 512 has a Digital to Analogue (DAC) Converter 522 to generate voltages, for example with a specification of +/- 1.5V with 12-bit resolution across 7 multiplex channels/sensor.

• Circuit 512 can have a number of multiplexing channels 532. For example, circuit 512 may include four multiplexing channels, with each multiplexing channel being used with up to five FETs for sensing fluid sample. Such multiplexing would facilitate up to 20 sensor measurements simultaenously. The facilitation of multiplexing improves sampling efficiency, for example a sampling rate of up to 1300 samples per second. • The circuit 512 may have a port for external back gating card (with communication capabilities). Selection to use the external card or the internal DAC (max 1.5V).

• The circuit 512 may be configured to sense current at a range of +/- 1.5 mA with resolution 10-100 nA.

• The circuit 512 may be sized 80 x 60mm.

• The circuit 512 may fit within SBS footprint.

• The circuit 512 is tethered via USB to connect to a computing device.

• The circuit 512 can be used to sense ambient temperature, ambient humidity, and/or ambient pressure

[00125] The circuit 512 may have an LED provided as an indicator for each multiplexing and/or back-gating channel to indicate status, including power and active state for example.

[00126] The circuit 512 may be development focused with expansion capabilities have test points.

[00127] In some embodiments, the system 1 may additionally comprise a computing device 18. That is, there may be provided a computing device configured to operatively connect with the device and/or circuit. The computing device can be a laptop computer, an embedded device, single-board computer, and the like. Some embodiments of the computing device may have software run on it to provides a graphical interface for the (human) user to interface with the chip and/or device. The software designed to be used in development providing an easy way to run tests on chips with different designs/coatings. The software can be built on several open- source packages. In one example, the software is written in Python using the following packages:

• ‘tkinter’ (https://docs.python.Org/3/library/tkinter.html) for the graphical interface.

• ‘Adafruit-blinka’ (https://pypi.org/project/Adafruit-Blinka/) for the USB interface.

• Various ‘Adafruit CircuitPython’ (https://github.com/adafruit/circuitpython) packages for interfacing with the individual ICs.

• ‘SciPy’ (https://scipy.org/) for automated data analysis.

• ‘Matplotlib’ (https://matplotlib.org/) for data visualisation. [00128] Other packages may be used, including one or more of: numpy, pandas, openpyxl, requests, opentrons, Pillow, hidapi, adafruit circuitpython/blinka/drivers, aiohttp, and the like. The software at its core performs the same operations in each loop: sets the voltages across the FET and reads the voltage across the source/drain electrode, the voltage across the gate/drain electrodes, the gate/source electrodes and the current through the source/drain electrodes. Additionally or alternatively, the software provides an easy way to vary parameters and run the tests automatically. Figure 8 shows one such example. Although the software currently runs on a laptop, the software is compatible to be run on an embedded device without too much alteration. Additionally, all the current hardware/software can be designed to run a single FET but can extended to multiple FETs for multiplexed measurements. In some embodiments, the software is configured to display all single and time series measurements in real-time for the 4 channels simultaneously.

3.5. Device and system assembly

[00129] Figures 9A shows a general method 900 of assembling system 1 comprising a device embodiment so that it is ready for use by way of example. Figure 9A shows a flowchart of the method 900 showing the various method steps 902-912. Two examples of assembling a device embodiment will be described in terms of the steps of method 900. As will be evident from the exemplary methods being described, it is not necessary to perform all of steps 902-912, and in some situations, one or more of method steps 902-912 may be omitted. Moreover, the method steps do not necessarily need to be performed in the order shown in Figure 9A as will be evident from the exemplary methods being described.

[00130] A first example of assembling a system 1 comprising a device 110 according to method 900 is described with reference to Figures 9A-K according to the method steps 902- 912. Figure 9B shows an overview of the kit of parts to be assembled into the device 110, showing from left to right, the bottom enclosure 136, the surround 134, the electronic interconnect 126, the fluidic interconnect 124 (shown inverted in the photo), and the o-rings 142. At step 902 and as shown in Figure 9C, the first example of method 900 comprises placing the electronic interconnect 126 onto the fluidic interconnect 124. At step 904, and as shown in Figure 9D, the first example of method 900 comprises placing surround 134 over electronic interconnect 126 and fastening surround 134 in with screws. At step 906, and as shown in Figure 9E, the first example of method 900 comprises placing o-rings 142 over each fluidic well 128 of the fluidic interconnect 124. At step 908, and as shown in Figures 9F-H, the first example of method 900 comprises placing chip 114 onto the pins 130 and/or o-rings 142. At step 910, and as shown in Figure 91, the first example of method 900 comprises attaching bottom enclosure 136 and affixing with screws to seal chip 114 to the fluidic interconnect 124. At this point, the device 110 is assembled. At step 912, and as shown in Figure 9J, the second example of method 900 comprises connecting the device 110 to the circuit 412. At step 914, and as shown in Figure 9K, the circuit 412 can be connected to a computing device 18 for example using a USB-C connection 433. At this point, the system 1 comprising the device 110 is ready for use.

[00131] A second example of assembling a system 1 comprising a device 210 according to method 900 is described with reference to Figures 9A, and Figures 9L-V according to the method steps 902-904, and method steps 908-912.

[00132] Figure 9L shows an overview of the kit of parts to be assembled into the device 210, showing from left to right, the bottom enclosure 136, the surround 134, the electronic interconnect 226, the fluidic interconnect 124 (shown inverted in the photo and the o-rings 142 already placed in position, for example from previous use). At step 902 and as shown in Figure 9M, the second example of method 900 comprises placing the electronic interconnect 226 onto the fluidic interconnect 124. At step 904, and as shown in Figure 9N, the second example of method 900 comprises placing surround 134 over electronic interconnect 226 and fastening surround 134 in with screws. At step 908, and as shown in Figures 9O-Q, the second example of method 900 comprises placing chip 214 onto the pins 230 and/or o-rings 142. At step 910, and as shown in Figure 9R, the second example of method 900 comprises attaching bottom enclosure 136 and affixing with screws to seal chip 214 to the fluidic interconnect 124. At this point, the device 210 is assembled. At step 912, and as shown in Figures 9S-T, the second example of method 900 comprises connecting the device 210 to the circuit 512. At step 914, and as shown in Figure 9U-V, the circuit 512 can be connected to a computing device 18 for example using a USB-C connection 533. At this point, the system 1 comprising the device 210 is ready for use.

4. Method

[00133] Referring to Figure 10, a method 1000 for one or more sensor components for sensing one or more electronic properties of the fluid sample is also provided. The method may be performed in accordance with any system and/or device embodiment disclosed. At step 1002, the method 1000 comprises securing a sensor component 14 in position. At step 1004, the method 1000 comprises delivering a fluid sample 16 to a sensor region 20 of a sensor component 14. At step 1006, the method 1000 comprises operatively connecting 32 the sensor region 20 of the sensor component 14 to a circuit 12. At step 1008, the method 1000 comprises sensing one or more electronic properties of fluid sample 16. At step 1010, the method 1000 comprises removing the sensor component 14 from position. The method steps may be performed in any order.

5. Advantages

[00134] Based on the embodiments as described, one or more advantages may be realised as follows:

• Cost and time savings from avoiding having to wire bond sensor components (e.g. chips) to a circuit (e.g. printed circuit boards).

• Provides an option for having replaceable sensor components.

• Provides a more robust/less fragile design than wirebonded chip (advantage for potentially user replaceable components)

• Easily interchangeable fluidic interconnects with different fluidic pathways for different fluid handling scenarios (e.g., hand pipetting, integration with pipetting automation, integration with fluidic pumps).

• No need for specialised equipment to change between sensing components or device.

6. Disclosed features

1. A kit or a device for one or more sensor components for sensing one or more electronic properties of fluid sample comprising: a securing portion adapted to secure a sensor component in position, the sensor component comprising one or more sensor regions for receiving fluid sample, a fluidic interconnect comprising one or more fluidic paths, each fluidic path adapted to deliver fluid sample to at least one sensor region of the sensor component, and an electronic interconnect comprising one or more electronic connections, each electronic connection for operatively connecting the one or more sensor regions of the sensor component to a circuit for sensing one or more electronic properties of fluid sample, wherein the sensor component is removable from position.

2. A kit or a device according to clause 1, wherein the sensor component is removable from position such that the securing portion can secure a second sensor component in position.

3. A kit or a device according to clause 1 or 2, wherein the sensor component is removable from position such that at least one operative connection between the sensor region and the circuit is broken.

4. A kit or a device according to any one of clauses 1 to 3, wherein the electronic connection and at least a portion of the sensor component are capable to touching each other for forming at least one operative connection between the sensor region and the circuit.

5. A kit or a device according to clause 4, wherein the securing portion is adapted such that the sensor component abuts against the electronic connection for forming at least one operative connection.

6. A kit or a device according to any one of clauses 1 to 5, wherein the electronic connection is or comprises electronic contacts.

7. A kit or a device according to clause 6, wherein the electronic contacts directly contact the sensor component.

8. A kit or a device according to clause 7, wherein the electronic contacts directly touch a respective electrode on the sensor component.

9. A kit or a device according to any one of clauses 6 to 8, wherein the electronic contacts are pins.

10. A kit or a device according to any one of clauses 6 to 9, wherein the electronic contacts are spring loaded. 11. A kit or a device according to any one of the previous clauses, wherein the securing portion comprises a surround and/or an enclosure.

12. A kit or a device according to clause 11, wherein the sensor component is removable from position by removing the sensor component from the surround.

13. A kit or a device according to any one of the previous clauses, wherein the sensor component comprises four sensor regions.

14. A kit or a device according to any one of the previous clauses, wherein the fluidic interconnect comprises four fluidic paths.

15. A kit or a device according to any one of the previous clauses, wherein each fluidic path is adapted to deliver fluid sample to a respective sensor region.

16. A kit or a device according to any one of the previous clauses, wherein the electronic interconnect comprises four electronic connections.

17. A kit or a device according to any one of the previous clauses, wherein each electronic connection is configured to operatively connect a respective sensor region to the circuit.

18. A kit or a device according to any one of the previous clauses, wherein the fluidic path: comprises an o-ring and/or comprises compressible material and/or is adapted to bonding for sealing the fluidic path to the sensor component.

19. A kit or a device according to any one of the previous clauses, wherein the fluidic path is further adapted such that fluid sample is removable from the sensor region.

20. A kit or a device according to any one of the previous clauses, wherein the fluidic path is or comprises a fluidic well.

21. A kit or a device according to any one of the previous clauses, wherein the fluidic path is or comprises a Luer slip connector.

22. A device according to any one of the previous clauses, wherein the device is a cassette. 23. A device according to any one of the previous clauses, wherein the device is adapted to be assembled from a kit (for example a kit according to any one of the previous clauses).

24. A kit according to any one of clauses 1 to 21, wherein the securing portion, the fluidic interconnect and the electronic interconnect are adapted to form a device (for example a device according to any one of the previous clauses), the device optionally being a cassette.

25. A system for sensing one or more electronic properties of fluid sample comprising: a kit or device according to any one of the previous clauses, a circuit for sensing one or more electronic properties of fluid sample, and optionally a sensor component comprising one or more sensor regions for receiving fluid sample.

26. A system according to clause 25, wherein the circuit is configured to sense one or more electronic properties of fluid sample by sensing one or more voltages/currents of one or more transistors corresponding to a sensor region.

27. A system according to clause 25 or 26, wherein the circuit is configured to sense one or more electronic properties of fluid sample by sensing one or more of: a voltage across a source electrode and a drain electrode a current between the source electrode and the drain electrode a voltage across a gate electrode and the drain electrode a voltage across the gate electrode and the source electrode, optionally the gate electrode is a back-gate.

28. A system according to any one of clauses 25 to 27, wherein the circuit is configured to control operation of the device and/or the sensor component.

29. A system according to any one of clauses 25 to 28, wherein the circuit is configured to control operation of the sensor component by applying one or more voltages/currents of one or more transistors corresponding to a sensor region.

30. A system according to any one of clauses 25 to 29, wherein the circuit is configured to control operation of the sensor component by: generating a voltage across a source electrode and a drain electrode, and varying a voltage on a gate electrode, optionally the gate electrode is a back- gate.

31. A system according to any one of clauses 25 to 30, wherein the transistor comprises a plurality of gate electrodes, optionally any one of the plurality of gate electrodes is a back- gate.

32. A system according to any one of clauses 25 to 31, further comprising a computing device.

33. A system according to any one of clauses 25 to 32, wherein the circuit is, or is part of an electronic device.

34. A system according to any one of clauses 25 to 33, wherein the circuit and/or the electronic device is operatively connected to a computing device.

35. A system according to any one of clauses 25 to 34, wherein the circuit is, or is part of a computing device.

36. A system according to any one of clauses 25 to 35, wherein the sensor component comprises a CMOS -based circuit configured to generate one or more voltages for sensing the one or more electronic properties of fluid sample.

37. A method for one or more sensor components for sensing one or more electronic properties of the fluid sample comprising the steps of: securing a sensor component in position, delivering a fluid sample to a sensor region of a sensor component, operatively connecting the sensor region of the sensor component to a circuit, sensing one or more electronic properties of fluid sample, and removing the sensor component from position.

[00135] From the foregoing it will be appreciated that, although specific embodiments have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the disclosure. Furthermore, where an alternative is disclosed for a particular embodiment, this alternative may also apply to other embodiments even if not specifically stated. Moreover, one or more components of a described apparatus or system, or one or more steps of a described method, may have been omitted from the description for clarity or for another reason. In addition, one or more components of a described apparatus or system that have been included in the description may be omitted from the apparatus or system, and one or more steps of a described method that have been included in the description may be omitted from the method.

[00136] It is understood that functions and operations described as being performed by software are performed by hardware, such as a controller (e.g., a microcontroller, or microprocessor), executing the software. Furthermore, it is understood that functions and operations described as being performed by software can be performed, instead, by hardware, firmware, one or more field -programmable gate arrays (FPGAs), one or more controllers, or a combination or subcombination of one or more of hardware, firmware, FPGAs, and controllers.

[00137] Throughout this specification and the claims which follow, unless the context requires otherwise, the word "comprise", and variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated integer or step or group of integers or steps but not the exclusion of any other integer or step or group of integers or steps.

[00138] The reference in this specification to any prior publication (or information derived from it), or to any matter which is known, is not, and should not be taken as, an acknowledgement or admission or any form of suggestion that that prior publication (or information derived from it) or known matter forms part of the common general knowledge in the field of endeavour to which this specification relates.

Claims

CLAIMS:

2. A kit or a device according to claim 1, wherein the sensor component is removable from position such that the securing portion can secure a second sensor component in position.

3. A kit or a device according to claim 1 or 2, wherein the sensor component is removable from position such that at least one operative connection between the sensor region and the circuit is broken.

4. A kit or a device according to any one of claims 1 to 3, wherein the electronic connection and at least a portion of the sensor component are capable of touching each other for forming at least one operative connection between the sensor region and the circuit.

5. A kit or a device according to claim 4, wherein the securing portion is adapted such that the sensor component abuts against the electronic connection for forming at least one operative connection.

6. A kit or a device according to any one of claims 1 to 5, wherein the electronic connection is or comprises electronic contacts.

7. A kit or a device according to claim 6, wherein the electronic contacts directly contact the sensor component.

8. A kit or a device according to claim 7, wherein the electronic contacts directly touch a respective electrode on the sensor component.

9. A kit or a device according to any one of claims 6 to 8, wherein the electronic contacts are pins.

10. A kit or a device according to any one of claims 6 to 9, wherein the electronic contacts are spring loaded.

11. A kit or a device according to any one of the previous claims, wherein the securing portion comprises a surround and/or an enclosure.

12. A kit or a device according to claim 11, wherein the sensor component is removable from position by removing the sensor component from the surround.

13. A kit or a device according to any one of the previous claims, wherein the sensor component comprises four sensor regions.

14. A kit or a device according to any one of the previous claims, wherein the fluidic interconnect comprises four fluidic paths.

15. A kit or a device according to any one of the previous claims, wherein each fluidic path is adapted to deliver fluid sample to a respective sensor region.

16. A kit or a device according to any one of the previous claims, wherein the electronic interconnect comprises four electronic connections.

17. A kit or a device according to any one of the previous claims, wherein each electronic connection is configured to operatively connect a respective sensor region to the circuit.

18. A kit or a device according to any one of the previous claims, wherein the fluidic path: comprises an o-ring and/or comprises compressible material and/or is adapted to bonded for sealing the fluidic path to the sensor component.

19. A kit or a device according to any one of the previous claims, wherein the fluidic path is further adapted such that fluid sample is removable from the sensor region.

20. A kit or a device according to any one of the previous claims, wherein the fluidic path is or comprises a fluidic well.

21. A kit or a device according to any one of the previous claims, wherein the fluidic path is or comprises a Luer slip connector.

22. A device according to any one of the previous claims, wherein the device is a cassette.

23. A device according to any one of the previous claims, wherein the device is adapted to be assembled from a kit, optionally a kit according to any one of the previous claims .

24. A kit according to any one of claims 1 to 21, wherein the securing portion, the fluidic interconnect and the electronic interconnect are adapted to form a device, optionally a device according to any one of claims 1 to 23, the device optionally being a cassette.

25. A system for sensing one or more electronic properties of fluid sample comprising: a kit or device according to any one of the previous claims, a circuit for sensing one or more electronic properties of fluid sample, and optionally a sensor component comprising one or more sensor regions for receiving fluid sample.

26. A system according to claim 25, wherein the circuit is configured to sense one or more electronic properties of fluid sample by sensing one or more voltages/currents of one or more transistors corresponding to a sensor region.

27. A system according to claim 25 or 26, wherein the circuit is configured to sense one or more electronic properties of fluid sample by sensing one or more of: a voltage across a source electrode and a drain electrode a current between the source electrode and the drain electrode a voltage across a gate electrode and the drain electrode a voltage across the gate electrode and the source electrode, optionally the gate electrode is a back-gate.

28. A system according to any one of claims 25 to 27, wherein the circuit is configured to control operation of the device and/or the sensor component.

29. A system according to any one of claims 25 to 28, wherein the circuit is configured to control operation of the sensor component by applying one or more voltages/currents of one or more transistors corresponding to a sensor region.

30. A system according to any one of claims 25 to 39, wherein the circuit is configured to control operation of the sensor component by: generating a voltage across a source electrode and a drain electrode, and varying a voltage on a gate electrode, optionally the gate electrode is a back-gate.

31. A system according to any one of claims 25 to 30, wherein the transistor comprises a plurality of gate electrodes, optionally any one of the plurality of gate electrodes is a back- gate.

32. A system according to any one of claims 25 to 31, further comprising a computing device.

33. A system according to any one of claims 25 to 32, wherein the circuit is, or is part of an electronic device.

34. A system according to any one of claims 25 to 33, wherein the circuit and/or the electronic device is operatively connected to a computing device.

35. A system according to any one of claims 25 to 34, wherein the circuit is, or is part of a computing device.

36. A system according to any one of claims 25 to 35, wherein the sensor component comprises a CMOS -based circuit configured to generate one or more voltages for sensing the one or more electronic properties of fluid sample.