WO2024095565A1

WO2024095565A1 - Inductor component

Info

Publication number: WO2024095565A1
Application number: PCT/JP2023/030124
Authority: WO
Inventors: 由雅吉岡; 剛高松; 秀基加茂; 浩司山内
Original assignee: 株式会社村田製作所
Priority date: 2022-11-02
Filing date: 2023-08-22
Publication date: 2024-05-10

Abstract

Provided is an inductor component enabling higher efficiency of inductance acquisition. This inductor component comprises: an element including a first principal surface and second principal surface that face one another; a coil that is provided to the element and is wound helically along an axis; and a first external electrode and a second external electrode that are provided to the element and are electrically connected to the coil. The axis of the coil is arranged in parallel to the first principal surface. The coil includes: a plurality of first coil wirings that are provided to a first principal surface side with respect to the axis and are arrayed along the axis on a plane parallel to the first principal surface; a plurality of second coil wirings that are provided to a second principal surface side with respect to the axis and are arrayed along the axis on a plane parallel to the second principal surface; a plurality of first through wirings that extend from the first coil wiring side toward the second coil wiring side and are arrayed along the axis; and a plurality of second through wirings that extend from the first coil wiring side toward the second coil wiring side, are provided to the opposite side from the first through wirings with respect to the axis, and are arrayed along the axis. The first coil wirings, the first through wirings, the second coil wirings, and the second through wirings are connected in the stated order and thereby constitute at least part of the helical shape. A reference coil wiring, which is the one of the first coil wirings and the second coil wirings constituting an outermost turn of the first external electrode-side coils that is located electrically closer to the first external electrode, has a shorter length than the length of an adjacent coil wiring that is located on the same plane as that of the reference coil wiring and adjoins the reference coil wiring in the axial direction.

Description

Inductor Components

This disclosure relates to inductor components.

A conventional inductor component is described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has an element body, a coil provided within the element body and wound along the axial direction, and a first external electrode and a second external electrode provided on the element body and electrically connected to the coil.

The coil has multiple coil patterns stacked along the axis. Adjacent coil patterns in the axial direction are connected via conductive vias. The coil pattern has a wiring portion extending in a direction perpendicular to the axis, and a pad portion provided at the end of the wiring portion and connecting to the conductive via. The width of the pad portion is wider than the width of the wiring portion to improve the connectivity between the pad portion and the conductive via.

Patent No. 6652280

In the conventional inductor components described above, the width of the pad portion is wider than the width of the wiring portion, so part of the pad portion is located radially inside the coil relative to the wiring portion. This makes the inner diameter of the coil smaller, and the efficiency of obtaining inductance is not necessarily high.

The present disclosure therefore aims to provide an inductor component that can increase the efficiency of obtaining inductance.

In order to solve the above problems, an inductor component according to one aspect of the present disclosure comprises:
an element body including a first main surface and a second main surface opposed to each other;
a coil provided on the element body and wound helically along an axis;
a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
The axis of the coil is disposed parallel to the first major surface;
The coil is
a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface;
a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface;
a plurality of first through wires extending from the first coil wiring side toward the second coil wiring side and arranged along the axis;
a plurality of second through wirings extending from the first coil wiring side toward the second coil wiring side, provided on an opposite side of the axis from the first through wirings, and arranged along the axis;
the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape;
The length of a reference coil wiring, which is one of the first coil wiring and the second coil wiring that constitute the outermost turn of the coil on the first external electrode side and is located electrically closer to the first external electrode, is shorter than the length of an adjacent coil wiring that is located on the same plane as the reference coil wiring and is adjacent to the reference coil wiring in the axial direction.

In this specification, the "axis" refers to the intersection of a first plane passing through the center between the first coil wiring and the second coil wiring and a second plane passing through the center between the first through wiring and the second through wiring. The "outermost turn on the first external electrode side" refers to the turn closest to the first external electrode, and is composed of one each of the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring.
The "length of the reference coil wiring" is the length along the center line of the width of the reference coil wiring, viewed from a direction perpendicular to the first main surface, between the centers of the connection surfaces of the first external electrodes or through wirings connected to both ends of the reference coil wiring. The "length of the adjacent coil wiring" is the length along the center line of the width of the adjacent coil wiring, viewed from a direction perpendicular to the first main surface, between the centers of the connection surfaces of the through wirings connected to both ends of the adjacent coil wiring.
"The external electrodes are provided on the element body" specifically means that the external electrodes are provided on the outer surface side of the element body, including cases where the external electrodes are provided directly on the outer surface of the element body, cases where the external electrodes are provided on the outside of the element body via a separate member on the element body, and cases where the external electrodes are provided on the outer surface of the element body with part of them embedded in the element body.

According to the embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring, and the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of a spiral shape, so that the inner diameter of the coil can be increased and the efficiency of obtaining inductance can be increased. Also, by increasing the efficiency of obtaining inductance, the Q value can be increased.
Furthermore, since the length of the reference coil wiring is shorter than the length of the adjacent coil wiring, the wiring length of the outermost turn can be adjusted, making it easy to adjust the inductance required for impedance matching, for example.

In order to solve the above problems, an inductor component according to one aspect of the present disclosure comprises:
an element body including a first main surface and a second main surface opposed to each other;
a coil provided on the element body and wound helically along an axis;
a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
The axis of the coil is disposed parallel to the first major surface;
The coil is
a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface;
a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface;
a plurality of first through wires extending from the first coil wiring side toward the second coil wiring side and arranged along the axis;
a plurality of second through wirings extending from the first coil wiring side toward the second coil wiring side, provided on an opposite side of the axis from the first through wirings, and arranged along the axis;
the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape;
The length of a reference coil wiring, which is one of the first coil wiring and the second coil wiring that constitute the outermost turn of the coil on the first external electrode side and is located electrically closer to the first external electrode, is shorter than the length of a central coil wiring that is located on the same plane as the reference coil wiring and is located in the center of the axial direction of the coil.

In this specification, the "length of the central coil wiring" refers to the length along the center line of the width of the central coil wiring, viewed from a direction perpendicular to the first main surface, between the centers of the connection surfaces of the through-wires that are connected to both ends of the central coil wiring.

According to the embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring, and the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of a spiral shape, so that the inner diameter of the coil can be increased and the efficiency of obtaining inductance can be increased. Also, by increasing the efficiency of obtaining inductance, the Q value can be increased.
Furthermore, since the length of the reference coil wiring is shorter than the length of the central coil wiring, the wiring length of the outermost turn can be adjusted, making it easy to adjust the inductance required for impedance matching, for example.

Preferably, in one embodiment of the inductor component, the body comprises _SiO2 .

According to the above embodiment, it is possible to provide the element with insulation and rigidity.

Preferably, in one embodiment of the inductor component, all of the first coil wiring is arranged in parallel.

According to the above embodiment, by using modified illumination in the photolithography process, for example, it is possible to form fine first coil wiring and reduce the size of the inductor component.

Preferably, in one embodiment of the inductor component, all of the second coil wiring is arranged in parallel.

According to the above embodiment, by using modified illumination in the photolithography process, for example, it is possible to form fine second coil wiring and reduce the size of the inductor component.

Preferably, in one embodiment of the inductor component, the first external electrode is disposed above the reference coil wiring, and the first external electrode is connected to the reference coil wiring.

According to the above embodiment, there is no need to provide a wiring path that spans the inner diameter of the coil when connecting the coil and the first external electrode, and the Q value can be improved.

Preferably, in one embodiment of the inductor component, the first external electrode is connected to the first through-hole wiring.

According to the above embodiment, the coil can be connected to the first external electrode over the shortest distance, reducing DC resistance.

Preferably, in one embodiment of the inductor component, the first through-hole wiring and the second through-hole wiring are not parallel when viewed in a direction parallel to the axis.

According to the above embodiment, the distance between the first through-hole wiring and the second through-hole wiring can be increased, the inner diameter of the coil can be increased, and the Q value can be improved.

Preferably, in one embodiment of the inductor component, the element body includes _SiO2 , and the first through wire includes _SiO2 .

According to the above embodiment, the linear expansion coefficient of the first through-hole wiring can be matched to the linear expansion coefficient of the element body, thereby suppressing cracks between the first through-hole wiring and the element body.

In one embodiment of the inductor component, the first through wiring preferably includes a void portion or a resin portion.

According to the above embodiment, the stress caused by the difference in linear expansion coefficient between the first through wiring and the element body can be absorbed by the void portion or the resin portion, thereby alleviating the stress.

Preferably, in one embodiment of the inductor component, the first through-hole wiring has a conductive layer located on the outer periphery when viewed from the direction in which the first through-hole wiring extends, and a non-conductive layer located inside the conductive layer.

In the above embodiment, when used in the high frequency band, the current mainly flows through the surface of the first through-hole wiring due to the skin effect, so by providing a conductive layer on the outer periphery, the Q value is not lowered. In addition, by providing a non-conductive layer on the inside, stress can be alleviated, and manufacturing costs can be reduced by not using a conductor.

Preferably, in one embodiment of the inductor component, the axial length of the coil is shorter than the inner diameter of the coil.

In the above embodiment, the coil length is short and the coil inner diameter is large, which improves the Q value.

Preferably, in one embodiment of the inductor component, the inductor component further comprises an organic insulator provided on the first main surface, and the base body is an inorganic insulator.

In the above embodiment, since the organic insulator is included, the organic insulator is easily given fluidity, and when the first coil wiring is covered with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, improving insulation.

Preferably, in one embodiment of the inductor component, the outer surface of the first external electrode has a recessed portion.

According to the above embodiment, when the inductor component is mounted on a substrate, the solder penetrates into the recessed portion of the first external electrode, improving the connection strength between the first external electrode and the solder.

Preferably, in one embodiment of the inductor component, the first through-hole wiring extends in a direction perpendicular to the first main surface, and the cross-sectional area of at least one of the two ends of the first through-hole wiring in the extension direction is larger than the cross-sectional area of the center of the first through-hole wiring in the extension direction.

According to the above embodiment, the cross-sectional area of the end of the first through wiring can be increased, improving the connectivity between the first through wiring and at least one of the first coil wiring and the second coil wiring. In addition, when forming a hole in the element body and filling the hole with a conductive material by filling plating or the like to form the first through wiring in the hole in the element body, it is easy to fill the conductive material on the opening side of the hole. Furthermore, since the cross-sectional area of the end of the first through wiring is large and the cross-sectional area of the center of the first through wiring is small, it is easy to form the first through wiring.

Preferably, in one embodiment of the inductor component, the thickness of the inductor component is 200 μm or less.

According to the above embodiment, the inductor components can be made thinner.

In one embodiment of the inductor component, the first external electrode and the second external electrode are preferably located inside the outer peripheral surface of the element body when viewed in a direction perpendicular to the first main surface.

In the above embodiment, the first external electrode and the second external electrode are not in contact with the outer peripheral surface of the element body, so that when the inductor components are singulated, the load on the first external electrode and the second external electrode can be reduced, and deformation and peeling of the first external electrode and the second external electrode can be suppressed. Therefore, even if the inductor component is made small, deformation and peeling of the first external electrode and the second external electrode can be prevented.

The inductor component according to one aspect of the present disclosure can improve the efficiency of obtaining inductance.

1 is a schematic perspective view of an inductor component according to a first embodiment, as viewed from the bottom side. FIG. This is a cross-sectional view of FIG. FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1 is a schematic bottom view of the bottom wiring as viewed from the bottom side. FIG. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. FIG. 11 is a cross-sectional view showing a first modified example of an inductor component. FIG. 11 is a cross-sectional view showing a second modified example of the inductor component. FIG. 11 is a cross-sectional view showing a third modified example of the inductor component. FIG. 11 is a cross-sectional view showing a fourth modified example of the inductor component. FIG. 11 is a schematic perspective view of an inductor component according to a second embodiment, as viewed from the bottom side. FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7. 1 is a schematic bottom view of bottom wiring as viewed from the bottom side. FIG. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. FIG. 11 is a cross-sectional view showing a first modified example of an inductor component. FIG. 11 is a cross-sectional view showing a second modified example of the inductor component. 13 is a schematic bottom view showing a third embodiment of an inductor component as viewed from the bottom side. FIG. 13 is a cross-sectional view taken along line XIII-XIII of FIG. 12. 1 is a schematic bottom view of the top surface wiring as viewed from the bottom surface side. FIG.

Below, an inductor component, which is one aspect of the present disclosure, will be described in detail with reference to the illustrated embodiment. Note that some of the drawings are schematic and may not reflect actual dimensions or proportions.

First Embodiment
The inductor component 1 according to the first embodiment will be described below. Fig. 1 is a schematic bottom view of the inductor component 1 as viewed from the bottom side. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. For convenience, external electrodes are depicted by two-dot chain lines in Fig. 1. Also, in Fig. 1, the element body 10 is depicted as transparent so that the structure can be easily understood, but it may be semi-transparent or opaque.

1. Overview of Configuration The overview of the inductor component 1 will be described. The inductor component 1 is a surface mount type inductor component used, for example, in a high frequency signal transmission circuit. As shown in Figures 1, 2 and 3, the inductor component 1 includes an element body 10, a coil 110 provided on the element body 10 and wound in a spiral shape along an axis AX, and a first external electrode 121 and a second external electrode 122 provided on the element body 10 and electrically connected to the coil 110.

The element body 10 has a length, width, and height. The element body 10 has a first end face 100e1 and a second end face 100e2 at both ends in the length direction, a first side face 100s1 and a second side face 100s2 at both ends in the width direction, and a bottom face 100b and a top face 100t at both ends in the height direction. In other words, the outer surface 100 of the element body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b, and the top face 100t. The bottom face 100b corresponds to an example of a "first main face" as described in the claims, and the top face 100t corresponds to an example of a "second main face" as described in the claims.

As shown in the drawings, for ease of explanation, the length direction (longitudinal direction) of the element body 10, which is the direction from the first end face 100e1 to the second end face 100e2, is referred to as the X direction. The width direction of the element body 10, which is the direction from the first side face 100s1 to the second side face 100s2, is referred to as the Y direction. The height direction of the element body 10, which is the direction from the bottom face 100b to the top face 100t, is referred to as the Z direction. The X direction, Y direction, and Z direction are mutually perpendicular, and when arranged in the order X, Y, Z, they form a right-handed system.

In this specification, the "outer surface 100 of the element body" including the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the element body 10 does not simply mean a surface facing the outer periphery of the element body 10, but a surface that is the boundary between the outside and the inside of the element body 10. Furthermore, "above the outer surface 100 of the element body 10" does not mean an absolute direction such as vertically upward as defined by the direction of gravity, but refers to a direction toward the outside of the outside and the inside with the outer surface 100 as a boundary, based on the outer surface 100. Therefore, "above the outer surface 100" is a relative direction determined by the orientation of the outer surface 100. Furthermore, "above" with respect to a certain element includes not only an upper side away from the element, that is, an upper position through another object on the element or an upper position with a space therebetween, but also a position directly above the element (on).

The axis AX of the coil 110 is arranged parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom surface wirings 11b arranged on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top surface wirings 11t arranged on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom surface wiring 11b side toward the top surface wiring 11t side and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom surface wiring 11b side toward the top surface wiring 11t side, arranged on the opposite side of the first through wirings 13 with respect to the axis AX and arranged along the axis AX. The bottom surface wirings 11b, the first through wirings 13, the top surface wirings 11t, and the second through wirings 14 are connected in this order to form at least a part of a spiral shape.

The bottom wiring 11b corresponds to an example of the "first coil wiring" described in the claims, and the top wiring 11t corresponds to an example of the "second coil wiring" described in the claims. The axis AX is the intersection of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t, and a second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 has no dimension in a direction perpendicular to the axis AX.

According to the above configuration, the coil 110 includes the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14. The bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14 are connected in this order to form at least a part of a spiral shape, so that the inner diameter of the coil 110 can be increased and the efficiency of obtaining inductance can be increased. Furthermore, by increasing the efficiency of obtaining inductance, the Q value can be increased.

Specifically, the pad portion of a conventional inductor component and the bottom wiring 11b and top wiring 11t of this embodiment are "receiving portions" for the wiring that penetrates the element body (the conductive vias of a conventional inductor component and the first through wiring 13 and second through wiring 14 of this embodiment), and therefore have a shape that extends perpendicularly in the direction that penetrates the element body. Here, in the configuration of a conventional inductor component, since the conductive vias extend in a direction parallel to the axis of the coil, the pad portion extends in a direction perpendicular to the axis of the coil, and is likely to have a structure that blocks magnetic flux generated in the axial direction of the coil.

In contrast, in this embodiment, the first through wiring 13 and the second through wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, so the bottom wiring 11b and the top wiring 11t extend in a direction parallel to the axis AX of the coil 110. Therefore, the bottom wiring 11b and the top wiring 11t are unlikely to have a structure that blocks magnetic flux generated in the direction of the axis AX. In other words, with this embodiment, a structure that is unlikely to block magnetic flux can be achieved, improving the inductance acquisition efficiency and Q value.

FIG. 4 is a schematic bottom view of bottom wiring 11b as viewed from the bottom side. For convenience, in FIG. 4, the first external electrode 121 and the second external electrode 122 are depicted with two-dot chain lines, and further, the connection surface 13y of the first through wiring 13 with the bottom wiring 11b, the connection surface 14y of the second through wiring 14 with the bottom wiring 11b, the connection surface 121y of the first external electrode 121 with the bottom wiring 11b, and the connection surface 122y of the second external electrode 122 with the bottom wiring 11b are depicted with two-dot chain lines.

As shown in FIG. 4, of the bottom wiring 11b and top wiring 11t that constitute the outermost turn of the coil 110 on the first external electrode 121 side, the bottom wiring 11b is the first reference coil wiring 111b that is located electrically closer to the first external electrode 121. One of the multiple bottom wirings 11b is the first adjacent coil wiring 113b that is located on the same plane as the first reference coil wiring 111b and is adjacent to the first reference coil wiring 111b in the axial AX direction. The length of the first reference coil wiring 111b (hereinafter referred to as the first length L1) is shorter than the length of the first adjacent coil wiring 113b (hereinafter referred to as the second length L2).

The first length L1 is the length along the center line of the width of the first reference coil wiring 111b between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the first reference coil wiring 111b and the center of the connection surface 121y of the first external electrode 121 connected to the second end of the first reference coil wiring 111b, when viewed from a direction perpendicular to the bottom surface 100b. The second length L2 is the length along the center line of the width of the first adjacent coil wiring 113b between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the first adjacent coil wiring 113b and the center of the connection surface 14y of the second through wiring 14 connected to the second end of the first adjacent coil wiring 113b, when viewed from a direction perpendicular to the bottom surface 100b.

With the above configuration, since the first length L1 is shorter than the second length L2, the wiring length of the outermost turn on the first external electrode 121 side can be adjusted, and it is easy to adjust the inductance required for impedance matching, for example. Specifically, the wiring length of the outermost turn can be made shorter than the wiring length of the turn formed by the first adjacent coil wiring 113b.

Preferably, the first external electrode 121 is connected to the first reference coil wiring 111b while being disposed on the first reference coil wiring 111b. This eliminates the need to provide a wiring path that spans the inner diameter of the coil 110 when connecting the coil 110 and the first external electrode 121, and improves the Q value. On the other hand, if the first external electrode 121 is connected to the first through wiring 13 connected to the top wiring 11t, rather than the first reference coil wiring 111b, shortening the length of the top wiring 11t will result in the first through wiring 13 being disposed so as to span the inner diameter of the coil 110. In this case, the first through wiring 13 may impede the flow of magnetic flux in the coil 110, and the Q value may not be improved.

In addition, of the bottom wiring 11b and top wiring 11t constituting the outermost turn of the coil 110 on the first external electrode 121 side, the top wiring 11t may be a reference coil wiring that is located electrically closer to the first external electrode 121. In this case, one of the multiple top wirings 11t is an adjacent coil wiring that is located on the same plane as the reference coil wiring and is adjacent to the reference coil wiring in the axial AX direction. The length of the reference coil wiring is shorter than the length of the adjacent coil wiring. This allows the wiring length of the outermost turn to be adjusted, making it easy to adjust the inductance.

As shown in FIG. 4, one of the multiple bottom wirings 11b is a central coil wiring 115b that is located on the same plane as the first reference coil wiring 111b and is located in the center of the axis AX direction of the coil 110. The length of the first reference coil wiring 111b (first length L1) is shorter than the length of the central coil wiring 115b (hereinafter referred to as third length L3).

The third length L3 is the length along the center line of the width of the central coil wiring 115b, as viewed from a direction perpendicular to the bottom surface 100b, between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the central coil wiring 115b and the center of the connection surface 14y of the second through wiring 14 connected to the second end of the central coil wiring 115b.

With the above configuration, since the first length L1 is shorter than the third length L3, the wiring length of the outermost turn on the first external electrode 121 side can be adjusted, and it is easy to adjust the inductance required for impedance matching, for example. Specifically, the wiring length of the outermost turn can be made shorter than the wiring length of the central turn in the axial AX direction of the coil 110.

In addition, of the bottom wiring 11b and top wiring 11t constituting the outermost turn of the coil 110 on the first external electrode 121 side, the top wiring 11t may be a reference coil wiring that is located electrically closer to the first external electrode 121. In this case, one of the multiple top wirings 11t is a central coil wiring that is located on the same plane as the reference coil wiring and is located in the center of the coil 110 in the axial AX direction. The length of the reference coil wiring is shorter than the length of the central coil wiring. This makes it possible to adjust the wiring length of the outermost turn, making it easy to adjust the inductance.

In this embodiment, it is sufficient to satisfy at least one of the first characteristic that "the first length L1 is shorter than the second length L2" and the second characteristic that "the first length L1 is shorter than the third length L3." This allows the wiring length of the outermost turn to be adjusted, making it easy to adjust the inductance.

As shown in FIG. 4, the configuration of the outermost turn of the coil 110 on the second external electrode 122 side may be the same as the configuration of the outermost turn of the coil 110 on the first external electrode 121 side described above.

Specifically, of the bottom wiring 11b and top wiring 11t constituting the outermost turn of the coil 110 on the second external electrode 122 side, the bottom wiring 11b is the second reference coil wiring 112b located electrically closer to the second external electrode 122. One of the multiple bottom wirings 11b is the second adjacent coil wiring 114b located on the same plane as the second reference coil wiring 112b and adjacent to the second reference coil wiring 112b in the axial AX direction. The length of the second reference coil wiring 112b (hereinafter referred to as the fourth length L4) is shorter than the length of the second adjacent coil wiring 114b (hereinafter referred to as the fifth length L5). This makes it possible to adjust the wiring length of the outermost turn on the second external electrode 122 side, and to easily adjust the inductance.

The fourth length L4 is the length along the center line of the width of the second reference coil wiring 112b between the center of the connection surface 14y of the second through wiring 14 connected to the first end of the second reference coil wiring 112b and the center of the connection surface 122y of the second external electrode 122 connected to the second end of the second reference coil wiring 112b, when viewed from a direction perpendicular to the bottom surface 100b. The fifth length L5 is the length along the center line of the width of the second adjacent coil wiring 114b between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the second adjacent coil wiring 114b and the center of the connection surface 14y of the second through wiring 14 connected to the second end of the second adjacent coil wiring 114b, when viewed from a direction perpendicular to the bottom surface 100b.

Preferably, the second external electrode 122 is connected to the second reference coil wiring 112b while being disposed on the second external electrode 122. This eliminates the need to provide a wiring path that crosses the inner diameter of the coil 110 when connecting the coil 110 and the second external electrode 122, thereby improving the Q value.

Furthermore, one of the multiple bottom wirings 11b is a central coil wiring 115b that is located on the same plane as the second reference coil wiring 112b and is located in the center of the coil 110 in the axial AX direction. The length of the second reference coil wiring 112b (fourth length L4) is shorter than the length of the central coil wiring 115b (referred to as third length L3). This makes it possible to adjust the wiring length of the outermost turn on the second external electrode 122 side, and thus makes it easy to adjust the inductance.

The top surface wiring 11t constituting the outermost turn of the coil 110 on the second external electrode 122 side may be the reference coil wiring. In this case, one of the multiple top surface wirings 11t is the adjacent coil wiring, or one of the multiple top surface wirings 11t is the central coil wiring. In addition, it is sufficient to satisfy at least one of the first characteristic that "the fourth length L4 is shorter than the fifth length L5" and the second characteristic that "the fourth length L4 is shorter than the third length L3".

2. Components (Inductor Component 1)
The volume of the inductor component 1 is ^0.08 mm3 or less, and the size of the long side of the inductor component 1 is 0.65 mm or less. The size of the long side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, refers to the length in the X direction. According to the above configuration, the volume of the inductor component 1 is small and the long side of the inductor component 1 is short, so that the weight of the inductor component 1 is light. Therefore, even if the

external electrodes

121 and 122 are small, the necessary mounting strength can be obtained. In addition, the thickness of the inductor component 1 is preferably 200 μm or less. This allows the inductor component 1 to be made thin.

Specifically, the size of the inductor component 1 (length (X direction) x width (Y direction) x height (Z direction)) is 0.6 mm x 0.3 mm x 0.3 mm, 0.4 mm x 0.2 mm x 0.2 mm, 0.25 mm x 0.125 mm x 0.120 mm, etc. Furthermore, the width and height do not have to be equal, and may be, for example, 0.4 mm x 0.2 mm x 0.3 mm.

(Element 10)
The element body 10 contains _SiO2 , which can provide insulation and rigidity to the element body 10. The element body 10 is made of, for example, a sintered glass body. The sintered glass body may contain alumina, which can further increase the strength of the element body.

The glass sintered body is formed, for example, by stacking multiple insulating layers containing glass. The stacking direction of the multiple insulating layers is the Z direction. In other words, the insulating layers are in a layered form having main surfaces extending in the XY plane. Note that, due to firing or the like, the interfaces between the multiple insulating layers of the element body 10 may not be clear.

The element body 10 may be made of, for example, a glass substrate. The glass substrate may be a single-layer glass substrate, and since the majority of the element body is made of glass, losses such as eddy current losses at high frequencies can be suppressed.

(Coil 110)
The coil 110 includes a plurality of bottom wirings 11b, a plurality of top wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in sequence to form at least a portion of the coil 110 wound in the axial direction AX.

With the above configuration, the coil 110 is a so-called helical-shaped coil 110, so that in a cross section perpendicular to the axis AX, the area in which the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14 run parallel to the winding direction of the coil 110 can be reduced, thereby reducing the stray capacitance in the coil 110.

Here, a helical shape refers to a shape in which the number of turns in the entire coil is greater than one turn, and the number of turns in the coil in a cross section perpendicular to the axis is less than one turn. "One turn or more" refers to a state in which, in a cross section perpendicular to the axis, the coil wiring has parts that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction, and "less than one turn" refers to a state in which, in a cross section perpendicular to the axis, the coil wiring does not have parts that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction.

The bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the Y direction at a slight incline toward the X direction. All the bottom wiring 11b are arranged parallel to the X direction. Here, if modified illumination such as annular illumination or dipole illumination is used in the photolithography process, the pattern resolution in a specific direction can be improved to form a finer pattern. According to the above configuration, the bottom wiring 11b extends in only one direction and all the bottom wirings 11b are arranged in parallel, so that fine bottom wiring 11b can be formed by using modified illumination in the photolithography process, for example, and the inductor component 1 can be made smaller.

The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t extends in the Y direction. All the top surface wiring 11t are arranged in parallel along the X direction. With the above configuration, the top surface wiring 11t extends in only one direction and is arranged in parallel. Therefore, by using, for example, modified illumination in the photolithography process, fine top surface wiring 11t can be formed, and the inductor component 1 can be made smaller.

The bottom wiring 11b and the top wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy of these. The bottom wiring 11b and the top wiring 11t may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste. The bottom wiring 11b and the top wiring 11t may also be a multi-layer structure in which multiple metal layers are stacked. The thickness of the bottom wiring 11b and the top wiring 11t is preferably 5 μm or more and 50 μm or less.

The first through wiring 13 is disposed on the first side surface 100s1 side of the axis AX within the through hole V of the element body 10, and the second through wiring 14 is disposed on the second side surface 100s2 side of the axis AX within the through hole V of the element body 10. The first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. This allows the lengths of the first through wiring 13 and the second through wiring 14 to be shortened, thereby suppressing the DC resistance (Rdc). All of the first through wirings 13 and all of the second through wirings 14 are disposed in parallel along the X direction.

Preferably, the first through wiring 13 contains SiO _2. According to this, when the element body 10 contains SiO ₂ , the linear expansion coefficient of the first through wiring 13 can be matched to the linear expansion coefficient of the element body 10, and cracks between the first through wiring 13 and the element body 10 can be suppressed. For example, a conductive paste is used for the first through wiring 13. The conductive material is Ag, Cu, or the like. Preferably, the second through wiring 14 similarly contains SiO ₂ .

Preferably, as shown in FIG. 2, the first end of the bottom wiring 11b and the first end of the top wiring 11t overlap when viewed from a direction perpendicular to the bottom surface 100b, and the angle θ between the bottom wiring 11b and the top wiring 11t is an acute angle. The angle θ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in FIG. 2) and the center line of the width of the top wiring 11t (the dashed line in FIG. 2) when viewed from a direction perpendicular to the bottom surface 100b.

Preferably, as shown in FIG. 2, the angle θ between the bottom wiring 11b and the top wiring 11t connected to the same first through wiring 13 is 5° or more and 45° or less when viewed from a direction perpendicular to the bottom surface 100b. The angle θ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in FIG. 2) and the center line of the width of the top wiring 11t (the dashed line in FIG. 2) when viewed from a direction perpendicular to the bottom surface 100b.

With the above configuration, the coil 110 is wound tightly, so that the inductance can be improved. Since the angle θ is 45° or less, the coil length is shortened, the leakage magnetic flux is reduced, and the Q value is increased. The coil length refers to the distance between the two ends located at the outermost positions in the axis AX direction among the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14. Since the angle θ is 5° or more, the possibility of contact between two adjacent first through wirings 13 in the axis AX direction is reduced, and the possibility of contact between two adjacent second through wirings 14 in the axis AX direction is reduced. Note that the angle θ may be 5° or more and 45° or less in at least one pair of bottom wiring 11b and top wiring 11t among all the bottom wirings 11b and top wiring 11t.

Preferably, when viewed from a direction perpendicular to the bottom surface 100b, the angle θ between the bottom surface wiring 11b and the top surface wiring 11t connected to the same second through wiring 14 is 5° or more and 45° or less. This allows the coil 110 to be wound tightly, improving the inductance.

Preferably, at least one of the bottom wiring 11b, top wiring 11t, first through wiring 13, and second through wiring 14 includes a void portion or a resin portion. This allows the stress caused by the difference in linear expansion coefficient between the wiring and the element body 10 to be absorbed by the void portion or resin portion, and the stress can be alleviated. As a method for forming the void portion, for example, a material that is burned away by sintering is used as the wiring material, and the void portion can be formed by sintering the wiring. As a method for forming the resin portion, for example, a conductive paste can be used as the wiring material to form the resin portion.

Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t contains SiO _2. According to this, when the element body 10 contains SiO ₂ , the linear expansion coefficient of the wiring can be matched to the linear expansion coefficient of the element body 10, and cracks between the wiring and the element body 10 can be suppressed.

(First External Electrode 121 and Second External Electrode 122)
The first external electrode 121 is connected to a first end of the coil 110, and the second external electrode 122 is connected to a second end of the coil 110. The first external electrode 121 is provided on the first end face 100e1 side with respect to the center in the X direction of the element body 10 so as to be exposed from the outer surface 100 of the element body 10. The second external electrode 122 is provided on the second end face 100e2 side with respect to the center in the X direction of the element body 10 so as to be exposed from the outer surface 100 of the element body 10.

When viewed from a direction perpendicular to the bottom surface 100b, the first external electrode 121 and the second external electrode 122 are located inside the outer surface 100 of the element body 10. In other words, the first external electrode 121 and the second external electrode 122 are located inside the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, and the second side surface 100s2 of the element body 10.

With the above configuration, the first external electrode 121 and the second external electrode 122 are not in contact with the outer surface 100 of the element body 10, so when the inductor components are singulated, the load on the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component is made small, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

The first external electrode 121 may be provided continuously on the bottom surface 100b and the first end surface 100e1. In this way, since the first external electrode 121 is a so-called L-shaped electrode, a solder fillet can be formed on the first external electrode 121 when the inductor component 1 is mounted on a mounting board. Similarly, the second external electrode 122 may be provided continuously on the bottom surface 100b and the second end surface 100e2.

The first external electrode 121 has a bottom surface portion 121b provided on the bottom surface 100b and a via portion 121v embedded in the bottom surface 100b. The via portion 121v is connected to the bottom surface portion 121b. The via portion 121v is connected to an end of the bottom surface wiring 11b located on the first end surface 100e1 side in the axis AX direction.

The second external electrode 122 has a bottom surface portion 122b provided on the bottom surface 100b and a via portion 122v embedded in the bottom surface 100b. The via portion 122v is connected to the bottom surface portion 122b. The via portion 122v is connected to the end of the bottom surface wiring 11b located on the second end surface 100e2 side in the axis AX direction.

The first external electrode 121 has an underlayer 121e1 and a plating layer 121e2 that covers the underlayer 121e1. The underlayer 121e1 includes a conductive material such as Ag or Cu. The plating layer 121e2 includes a conductive material such as Ni or Sn. A part of the bottom portion 121b and the via portion 121v are composed of the underlayer 121e1. Another part of the bottom portion 121b is composed of the plating layer 121e2. Similarly, the second external electrode 122 has an underlayer and a plating layer that covers the underlayer. The first external electrode 121 and the second external electrode 122 may be composed of a single layer of conductive material.

(Method of Manufacturing Inductor Component 1)
Next, a method for manufacturing the inductor component 1 will be described with reference to Figures 5A to 5M. Figures 5A to 5H, 5K, and 5L are views corresponding to the cross section II-II of Figure 1. Figures 5I, 5J, and 5M are views corresponding to the cross section III-III of Figure 1.

As shown in FIG. 5A, a first insulating layer 1011 is provided on a base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc., and the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, or an inorganic insulating film such as SiO or SiN.

As shown in FIG. 5B, the second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed, for example, by a photolithography process. Note that the groove may be formed from the beginning as a printing pattern.

As shown in FIG. 5C, a top conductor layer 1011t is provided in the groove 1012a by printing. The material of the top conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc. At this time, for example, the top conductor layer 1011t is formed as a printing pattern so that it remains only in the groove 1012a. Note that after the top conductor layer 1011t is printed on the second insulating layer 1012, a photolithography process may be used to make the top conductor layer 1011t remain only in the groove 1012a.

As shown in FIG. 5D, a third insulating layer 1013 is provided on the second insulating layer 1012 by printing. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed in the same manner as in FIG. 5B.

As shown in FIG. 5E, the first through conductor layer 1131 of the first layer is provided by printing in the first groove 1013a, and the second through conductor layer 1141 of the first layer is provided by printing in the second groove 1013b. The first through conductor layer 1131 of the first layer and the second through conductor layer 1141 of the first layer are formed in the same manner as in FIG. 5C.

By repeating the above steps, as shown in FIG. 5F, a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a second-layer first penetrating conductor layer 1132 and a second-layer second penetrating conductor layer 1142 are provided in each of the two grooves provided in the fourth insulating layer 1014. Furthermore, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third-layer first penetrating conductor layer 1133 and a third-layer second penetrating conductor layer 1143 are provided in each of the two grooves provided in the fifth insulating layer 1015.

As shown in FIG. 5G, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a bottom conductor layer 1011b is provided in a groove provided in the sixth insulating layer 1016. The material of the bottom conductor layer 1011b is the same as the material of the top conductor layer 1011t. As shown in FIG. 5H, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016.

As shown in FIG. 5I, a groove 1017a is provided in the seventh insulating layer 1017 so that a portion of the bottom conductor layer 1011b is exposed. As shown in FIG. 5J, an underlying conductor layer 1121e1 is provided on the seventh insulating layer 1017 and in the groove 1017a. The material of the underlying conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.

As shown in FIG. 5K, the entire laminate is sintered in a high-temperature (e.g., 500°C or higher) furnace. The first to seventh insulating layers 1011-1017 are sintered to form the base body 10, the top conductor layer 1011t is sintered to form the top wiring 11t, the bottom conductor layer 1011b is sintered to form the bottom wiring 11b, the first through conductor layers 1131-1133 of the first to third layers are sintered to form the first through wiring 13, the second through conductor layers 1141-1143 of the first to third layers are sintered to form the second through wiring 14, and the base conductor layer 1121e1 is sintered to form the base layer 121e1. Therefore, the strength can be improved by sintering the insulating layers, and the conductor layers are sintered to volatilize unnecessary resin components contained in the conductor layers and fuse the conductor material contained in the conductor layers to achieve high conductivity. The base substrate 1000 may be peeled off by decomposing the surface during sintering, or may be mechanically removed by grinding or the like before or after sintering, or may be chemically removed by etching or the like before or after sintering.

As shown in FIG. 5L, the chip is cut into individual pieces along cut lines C. As shown in FIG. 5M, a plating layer 121e2 is formed by barrel plating so as to cover the base layer 121e1, forming a first external electrode 121. In this way, the inductor component 1 is manufactured as shown in FIG. 2.

3. Modification (First Modification)
Fig. 6A is a view showing a first modified example of an inductor component corresponding to the II-II cross section of Fig. 1. As shown in Fig. 6A, in the inductor component 1A of the first modified example, the first through wire 13 and the second through wire 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This makes it possible to increase the distance between the first through wire 13 and the second through wire 14, thereby making it possible to increase the inner diameter of the coil 110 and improve the Q value.

Specifically, the first through wiring 13 and the second through wiring 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 toward the center in the Z direction. Furthermore, the first through wiring 13 and the second through wiring 14 each have a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 and the second through wiring 14 are each formed by stacking multiple conductor layers, the first through wiring 13 and the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.

(Second Modification)
Fig. 6B is a view showing a second modified example of the inductor component, corresponding to the cross section taken along line II-II in Fig. 1. As shown in Fig. 6B, in the inductor component 1B of the second modified example, the first through wire 13 and the second through wire 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This makes it possible to increase the distance between the first through wire 13 and the second through wire 14, thereby making it possible to increase the inner diameter of the coil 110 and improve the Q value.

Specifically, the first through wiring 13 and the second through wiring 14 are inclined so that the distance between them becomes wider toward the top wiring 11t in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 as far as the top wiring 11t in the Z direction. In this way, the coil 110 has a trapezoidal shape when viewed from the axis AX direction. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed in a straight line and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.

(Third Modification)
Fig. 6C is a view showing a third modified example of an inductor component corresponding to the cross section taken along line II-II in Fig. 1. As shown in Fig. 6C, an inductor component 1C of the third modified example includes a first coil 110A and a second coil 110B, as compared with the inductor component 1A of the first modified example shown in Fig. 6A.

In the first coil 110A, the first through-wire 13 and the second through-wire 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.

Specifically, the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1A of the first modified example. On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The first through wiring 13 has a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 is formed by stacking multiple conductor layers, the conductor layers of each layer are stacked with a shift, so that the first through wiring 13 can be easily formed in a stepped shape.

In the second coil 110B, the first through-wire 13 and the second through-wire 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.

Specifically, the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1A of the first modified example. On the other hand, the first through wiring 13 has a linear shape parallel to the Z direction. In other words, the second through wiring 14 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The second through wiring 14 has a stepped shape along the Z direction. According to the above configuration, when the second through wiring 14 is formed by stacking multiple conductor layers, the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.

(Fourth Modification)
Fig. 6D is a view showing a fourth modified example of an inductor component corresponding to the cross section taken along line II-II in Fig. 1. As shown in Fig. 6D, an inductor component 1D of the fourth modified example includes a first coil 110A and a second coil 110B, as compared with the inductor component 1B of the second modified example shown in Fig. 6B.

Specifically, the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1B of the second modified example. On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t side. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed in a linear shape and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.

Specifically, the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1B of the second modified example. On the other hand, the first through wiring 13 has a linear shape parallel to the Z direction. In other words, the second through wiring 14 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed in a linear shape, and the electrical resistance of the first through wiring 13 and the second through wiring 14 can be reduced.

Second Embodiment
Fig. 7 is a schematic bottom view showing the second embodiment of the inductor component as viewed from the bottom side. Fig. 8 is a cross-sectional view taken along line VIII-VIII of Fig. 7. In Fig. 7, for convenience, the insulating layer is omitted, and the external electrodes are drawn with two-dot chain lines. In Fig. 7, the element body 10 is drawn transparently so that the structure can be easily understood. The second embodiment differs from the first embodiment mainly in the position of the coil axis, the material of the element body, and the provision of an insulating layer, and these differences in configuration will be mainly described below. The other configurations are the same as those of the first embodiment, and description thereof will be omitted.

1. Configuration of each part (inductor component 1E)
7, in the inductor component 1E, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the element body 10 in the X direction. This can reduce the interference with the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122, improving the efficiency of obtaining inductance.

The length of coil 110 in the axial AX direction is shorter than the inner diameter of coil 110. The length of coil 110 in the axial AX direction is also called the coil length. This allows the Q value to be improved because the coil length is short and the coil inner diameter is large. The inner diameter of the coil refers to the equivalent diameter of a circle based on the minimum area of the region surrounded by coil 110 when viewed through the axial AX direction.

(Element 10)
The element body 10 is an inorganic insulator. The material of the element body 10 is preferably glass, which has high insulating properties and can suppress eddy currents and increase the Q value. The element body 10 preferably contains silicon, which provides high thermal stability of the element body 10 and therefore can suppress fluctuations in dimensions of the element body 10 due to heat and reduce variations in electrical characteristics.

The element body 10 is preferably a single-layer glass plate. This ensures the strength of the element body 10. Furthermore, in the case of a single-layer glass plate, the dielectric loss is small, so the Q value at high frequencies can be increased. Furthermore, since there is no sintering process as in the case of sintered bodies, deformation of the element body 10 during sintering can be suppressed, which suppresses pattern misalignment, making it possible to provide an inductor component with a small inductance tolerance.

From the viewpoint of the manufacturing method, the material of the single-layer glass plate is preferably a photosensitive glass plate such as Foturan II (registered trademark of Schott AG). In particular, the single-layer glass plate preferably contains cerium oxide (ceria: CeO ₂ ), in which case the cerium oxide acts as a sensitizer, making processing by photolithography easier.

However, since the single-layer glass plate can be processed by mechanical processing such as drilling and sandblasting, dry/wet etching using a photoresist/metal mask, laser processing, etc., it may be a glass plate that does not have photosensitivity. In addition, the single-layer glass plate may be made by sintering a glass paste, or may be formed by a known method such as the float method.

(Insulator 22)
8, the inductor component 1E has an insulator 22. The insulator 22 covers both the bottom surface 100b and the top surface 100t of the element body 10. Note that the insulator 22 may be provided only on the bottom surface 100b out of the bottom surface 100b and the top surface 1100t.

The insulator 22 is a member that covers the wiring (bottom wiring 11b, top wiring 11t) to protect the wiring from external forces, prevent damage to the wiring, and improve the insulation of the wiring. The insulator 22 is preferably an organic insulator. For example, the insulator 22 may be a resin film such as epoxy or polyimide, which is easy to form. In particular, the insulator 22 is preferably made of a material with a low dielectric constant, which can reduce the stray capacitance formed between the coil 110 and the

external electrodes

121 and 122 when the insulator 22 is present between the coil 110 and the

external electrodes

121 and 122. The insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.), or by applying a paste-like resin and thermally curing it. The insulator 22 may be an inorganic film such as an oxide, nitride, or oxynitride of silicon or hafnium, which has excellent insulation properties and can be made into a thin film.

Preferably, when the base body 10 is an inorganic insulator and the insulator 22 is an organic insulator, the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from a direction perpendicular to the bottom surface 100b. With this, since the organic insulator is included, the organic insulator is easily given fluidity, and when the wiring (bottom surface wiring 11b, top surface wiring 11t) is covered with the organic insulator, the organic insulator can be easily filled between adjacent wirings, improving insulation. In addition, since the organic insulator is not in contact with the outer surface of the mechanical insulator, the load on the organic insulator can be reduced when singulating into individual inductor components, and deformation and peeling of the organic insulator can be suppressed.

(Coil 110)
As shown in Fig. 7, the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the X direction. All the bottom wirings 11b are arranged in parallel along the Y direction. The top wiring 11t extends in only one direction. Specifically, the top wiring 11t extends in the X direction at a slight incline toward the Y direction. All the top wirings 11t are arranged in parallel along the Y direction.

The first through wiring 13 is disposed on the first end face 100e1 side with respect to the axis AX within the through hole V of the element body 10, and the second through wiring 14 is disposed on the second end face 100e2 side with respect to the axis AX within the through hole V of the element body 10. The first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. The multiple first through wirings 13 and the multiple second through wirings 14 are each disposed in parallel along the Y direction.

FIG. 9 is a schematic bottom view of the bottom wiring 11b as viewed from the bottom side. For convenience, in FIG. 9, the first external electrode 121 and the second external electrode 122 are depicted with two-dot chain lines, and further, the connection surface 13y of the first through wiring 13 with the bottom wiring 11b, the connection surface 14y of the second through wiring 14 with the bottom wiring 11b, the connection surface 121y of the first external electrode 121 with the bottom wiring 11b, and the connection surface 122y of the second external electrode 122 with the bottom wiring 11b are depicted with two-dot chain lines.

As shown in FIG. 9, of the bottom wiring 11b and top wiring 11t that constitute the outermost turn of the coil 110 on the first external electrode 121 side, the bottom wiring 11b is the first reference coil wiring 111b that is located electrically closer to the first external electrode 121. One of the multiple bottom wirings 11b is the adjacent coil wiring 116b that is located on the same plane as the first reference coil wiring 111b and is adjacent to the first reference coil wiring 111b in the axial AX direction. The length of the first reference coil wiring 111b (hereinafter referred to as the sixth length L6) is shorter than the length of the adjacent coil wiring 116b (hereinafter referred to as the seventh length L7).

The sixth length L6 is the length along the center line of the width of the first reference coil wiring 111b between the center of the connection surface 14y of the second through wiring 14 connected to the first end of the first reference coil wiring 111b and the center of the connection surface 121y of the first external electrode 121 connected to the second end of the first reference coil wiring 111b, when viewed from a direction perpendicular to the bottom surface 100b. The seventh length L7 is the length along the center line of the width of the adjacent coil wiring 116b between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the adjacent coil wiring 116b and the center of the connection surface 14y of the second through wiring 14 connected to the second end of the adjacent coil wiring 116b, when viewed from a direction perpendicular to the bottom surface 100b.

With the above configuration, since the sixth length L6 is shorter than the seventh length L7, the wiring length of the outermost turn on the first external electrode 121 side can be adjusted, and it is easy to adjust the inductance required for impedance matching, for example. Specifically, the wiring length of the outermost turn can be made shorter than the wiring length of the turn formed by the adjacent coil wiring 116b.

As shown in FIG. 9, one of the multiple bottom wirings 11b is a central coil wiring 115b that is located on the same plane as the first reference coil wiring 111b and is located in the center of the coil 110 in the axial AX direction. The length of the first reference coil wiring 111b (sixth length L6) is shorter than the length of the central coil wiring 115b (hereinafter referred to as eighth length L8). In this embodiment, since the central coil wiring 115b is the same as the adjacent coil wiring 116b, the eighth length L8 is the same as the seventh length L7.

With the above configuration, since the sixth length L6 is shorter than the eighth length L8, the wiring length of the outermost turn on the first external electrode 121 side can be adjusted, and it is easy to adjust the inductance required for impedance matching, for example. Specifically, the wiring length of the outermost turn can be made shorter than the wiring length of the central turn in the axial AX direction of the coil 110.

In this embodiment, it is sufficient to satisfy at least one of the first characteristic that "the sixth length L6 is shorter than the seventh length L7" and the second characteristic that "the sixth length L6 is shorter than the eighth length L8." This allows the wiring length of the outermost turn to be adjusted, making it easy to adjust the inductance.

As shown in FIG. 9, the configuration of the outermost turn of the coil 110 on the second external electrode 122 side may be the same as the configuration of the outermost turn of the coil 110 on the first external electrode 121 side described above.

Specifically, of the bottom wiring 11b and top wiring 11t constituting the outermost turn of the coil 110 on the second external electrode 122 side, the bottom wiring 11b is the second reference coil wiring 112b located electrically closer to the second external electrode 122. One of the multiple bottom wirings 11b is the adjacent coil wiring 116b located on the same plane as the second reference coil wiring 112b and adjacent to the second reference coil wiring 112b in the axial AX direction. The length of the second reference coil wiring 112b (hereinafter referred to as the ninth length L9) is shorter than the length of the adjacent coil wiring 116b (seventh length L7). This makes it possible to adjust the wiring length of the outermost turn on the second external electrode 122 side, and to easily adjust the inductance.

The ninth length L9 is the length along the center line of the width of the second reference coil wiring 112b when viewed from a direction perpendicular to the bottom surface 100b, between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the second reference coil wiring 112b and the center of the connection surface 122y of the second external electrode 122 connected to the second end of the second reference coil wiring 112b.

Furthermore, one of the multiple bottom wirings 11b is a central coil wiring 115b that is located on the same plane as the second reference coil wiring 112b and is located in the center of the coil 110 in the axial AX direction. The length of the second reference coil wiring 112b (ninth length L9) is shorter than the length of the central coil wiring 115b (eighth length L8). This allows the wiring length of the outermost turn on the second external electrode 122 side to be adjusted, making it easy to adjust the inductance.

It is sufficient that at least one of the first characteristic that "the ninth length L9 is shorter than the seventh length L7" and the second characteristic that "the ninth length L9 is shorter than the eighth length L8" is satisfied.

(First External Electrode 121 and Second External Electrode 122)
8, the outer surface of the first external electrode 121 has a recess 121a. When viewed from a direction perpendicular to the bottom surface 100b, the recess 121a is provided at a position that overlaps with the via portion 121v on the upper surface of the first external electrode 121. With this, when the inductor component 1E is mounted on a substrate, solder fills the recess 121a of the first external electrode 121, improving the connection strength between the first external electrode 121 and the solder.

Similarly, the outer surface of the second external electrode 122 may have a recessed portion. With this, when the inductor component 1E is mounted on a substrate, solder will enter the recessed portion of the second external electrode 122, improving the connection strength between the second external electrode 122 and the solder. The top surfaces of the first external electrode 121 and the second external electrode 122 may be formed to be flat.

(Method of Manufacturing Inductor Component 1E)
A method for manufacturing the inductor element 1E will now be described with reference to Figures 10A to 10H, which are cross-sectional views taken along the line VIII-VIII in Figure 7.

As shown in FIG. 10A, copper foil 2001 is provided by printing on a base substrate 2000. The material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.

As shown in FIG. 10B, a glass substrate 2010 that will become the element body 10 is provided on a base substrate 2000. For example, the base substrate 2000 and the glass substrate 2010 are attached to each other using a jig such as conductive tape, pins, or a frame. The glass substrate 2010 has a through hole V. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. A TGV substrate is a substrate in which a through hole has been formed in advance by a laser, photolithography, or the like. The glass substrate 2010 may be, for example, a TSV (Through Silicon Via) substrate, or may be something else. In addition, Ti/Cu or other necessary conductive materials may be deposited in advance as a seed on the surface of the glass substrate 2010 by sputtering or the like.

As shown in FIG. 10C, a first through conductor layer 2013 that will become the first through wiring 13 is formed in the through hole V of the glass substrate 2010. Although not shown, a second through conductor layer that will become the second through wiring 14 is similarly formed in the through hole V. Specifically, by supplying power from the copper foil 2001 on the base substrate 2000, electrolytic plating is performed in the through hole V of the glass substrate 2010 to form the first through conductor layer 2013. Alternatively, a seed layer may be formed on the surface of the glass substrate 2010 or the inner surface of the through hole V by sputtering or the like, and a through conductor layer may be formed by known methods such as filled plating, conformal plating, or a printing and filling method of a conductive paste. If there is unnecessary plating growth on the surface of the glass substrate 2010, the unnecessary portions are removed by polishing, CMP, wet etching (etch-back), or dry etching.

As shown in FIG. 10D, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 may be removed mechanically by grinding or the like, or may be removed chemically by etching or the like.

As shown in FIG. 10E, a bottom conductor layer 2011b that will become the bottom wiring 11b and a top conductor layer 2011t that will become the top wiring 11t are formed on a glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed by electrolytic plating on the seed layer in the openings of the photoresist. The photoresist and seed layer are removed by wet etching or dry etching. This forms the bottom conductor layer 2011b and the top conductor layer 2011t that are patterned into an arbitrary shape. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one at a time, or both may be formed simultaneously.

As shown in FIG. 10F, insulating layers 2022 that become insulators 22 are provided on the top and bottom surfaces of glass substrate 2010 so as to cover the conductor layers. At this time, bottom-side insulating layer 2022 and top-side insulating layer 2022 may be formed one at a time, or both may be formed simultaneously. After that, holes 2022a are provided on bottom conductor layer 2011b of bottom-side insulating layer 2022 using photolithography or laser processing.

As shown in FIG. 10G, a first external electrode conductor layer 2121 that will become the first external electrode 121 is provided on the bottom insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b through the hole 2022a. Specifically, a Pd catalyst (not shown) is provided on the bottom insulating layer 2022, and a Ni, Au plating layer is formed by electroless plating. A patterned photoresist is formed on the plating layer. The plating layer in the opening of the photoresist is removed by wet etching or dry etching. This forms the first external electrode conductor layer 2121 patterned into an arbitrary shape. Alternatively, a seed layer (not shown) is provided on the bottom insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the opening of the photoresist is removed by wet etching or dry etching. A Ni, Au plating layer may be formed on the remaining seed layer by electroless plating. Although not shown, a second external electrode conductor layer that will become the second external electrode 122 is similarly provided on the bottom insulating layer 2022.

Here, the first external electrode conductor layer 2121 is formed to conform to the shape of the upper surface of the insulating layer 2022 on the bottom side, so that the upper surface of the first external electrode conductor layer 2121 has a recessed portion in the area that overlaps with the hole 2022a.

As shown in FIG. 10H, the chip is cut into individual pieces along cut lines C. This produces inductor component 1E as shown in FIG. 8.

2. Modification (First Modification)
Fig. 11A is a view showing a first modified example of an inductor component, corresponding to the VIII-VIII cross section of Fig. 7. As shown in Fig. 11A, in an inductor component 1F of the first modified example, the first through wiring 13 extends in a direction perpendicular to the bottom wiring 11b, and the cross-sectional area of each of both end portions 13e in the extending direction of the first through wiring 13 is larger than the cross-sectional area of a central portion 13m in the extending direction of the first through wiring 13. That is, in a cross section along the extending direction of the first through wiring 13, the width in the direction perpendicular to the extending direction of the first through wiring 13 increases continuously from the central portion 13m toward both end portions 13e.

This allows the cross-sectional area of the end 13e of the first through wiring 13 to be increased, improving the connectivity between the first through wiring 13 and at least one of the bottom wiring 11b and the top wiring 11t. Furthermore, when forming a through hole V as a hole in the base body 10 and filling this through hole V with a conductive material by filling plating or the like to form the first through wiring 13 in the through hole V, it is easy to fill the opening side of the through hole V with the conductive material. Furthermore, since the cross-sectional area of the end 13e of the first through wiring 13 is large and the cross-sectional area of the central portion 13m of the first through wiring 13 is small, it is easy to form the first through wiring 13.

Note that the cross-sectional area of one end 13e of the first through-hole wiring 13 may be larger than the cross-sectional area of the central portion 13m of the first through-hole wiring 13. Similarly, the cross-sectional area of at least one end of the second through-hole wiring 14 may be larger than the cross-sectional area of the central portion 13m of the first through-hole wiring 13.

(Second Modification)
11B is a diagram showing a second modified inductor component corresponding to the VIII-VIII cross section of FIG. 7. As shown in FIG. 11B, in the inductor component 1G of the second modified example, the first through wiring 13 has a conductive layer 13s located on the outer periphery side as viewed from the extending direction of the first through wiring 13, and a non-conductive layer 13u located inside the conductive layer 13s. According to this, when used in a high frequency band, current mainly flows through the surface of the first through wiring 13 due to the skin effect, so that the Q value is not lowered by providing the conductive layer 13s on the outer periphery side. In addition, by providing the non-conductive layer 13u on the inner side, stress can be alleviated, and the manufacturing cost can be reduced by not using a conductor.

An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through hole V of the element body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electrolytic plating. In this way, multiple conductive layers 13s such as Ti/Cu/electrolytic Cu or Pd/electroless Cu/electrolytic Cu can be formed on the outer periphery of the first through wiring 13. After that, the inside of the conductive layer 13s is sealed with resin by printing or heat pressing to form a non-conductive layer 13u made of resin. In this way, stress can be relieved by the non-conductive layer 13u inside the first through wiring 13 while current flows through the surface (conductive layer 13s) of the first through wiring 13.

Similarly, the second through wiring 14 may have a conductive layer located on the outer periphery when viewed from the direction in which the second through wiring 14 extends, and a non-conductive layer located inside the conductive layer. Note that the cross-sectional area of each of the two ends in the extension direction of the first through wiring 13 is larger than the cross-sectional area of the center part in the extension direction of the first through wiring 13, but the cross-sectional area of each of the two ends in the extension direction of the first through wiring 13 may be the same as the cross-sectional area of the center part in the extension direction of the first through wiring 13.

Third Embodiment
FIG. 12 is a schematic bottom view showing the third embodiment of the inductor component as viewed from the bottom side. FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 12. In FIG. 12, for convenience, the insulating layer is omitted, and the external electrodes are drawn by two-dot chain lines. In FIG. 12, the element body 10 is drawn transparently so that the structure can be easily understood. The third embodiment differs from the second embodiment in the shapes of the bottom wiring and the top wiring, and in the connections between the first external electrode and the second external electrode and the coil, and these different configurations will be described below. The other configurations are the same as those of the first embodiment, and their description will be omitted.

As shown in FIG. 12, in the inductor component 1H of the third embodiment, the top wiring 11t extends in only one direction. Specifically, the top wiring 11t is shaped to extend in the X direction. All the top wirings 11t are arranged in parallel along the Y direction. The bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the X direction at a slight incline toward the Y direction. All the bottom wirings 11b are arranged in parallel along the Y direction.

As shown in Figures 12 and 13, the first external electrode 121 is connected to the first through-hole wiring 13, not the bottom wiring 11b. In other words, the first end of the first through-hole wiring 13 is connected to the first external electrode 121, and the second end of the first through-hole wiring 13 is connected to the top wiring 11t. This makes it possible to easily connect the coil 110 to the first external electrode 121 even if the number of turns of the coil 110 is changed.

Similarly, the second external electrode 122 is connected to the second through-hole wiring 14 at the top in FIG. 12, not to the bottom wiring 11b. In other words, the first end of the second through-hole wiring 14 is connected to the second external electrode 122, and the second end of the second through-hole wiring 14 is connected to the top wiring 11t at the top in FIG. 12.

FIG. 14 is a schematic bottom view of the top wiring 11t as viewed from the bottom side. For convenience, in FIG. 14, the first external electrode 121 and the second external electrode 122 are depicted with two-dot chain lines, and further, the connection surface 13y of the first through wiring 13 with the top wiring 11t and the connection surface 14y of the second through wiring 14 with the top wiring 11t are depicted with two-dot chain lines.

As shown in FIG. 14, of the bottom wiring 11b and top wiring 11t that constitute the outermost turn of the coil 110 on the first external electrode 121 side, the top wiring 11t is the first reference coil wiring 111t that is electrically closer to the first external electrode 121. One of the multiple top wirings 11t is an adjacent coil wiring 116t that is located on the same plane as the first reference coil wiring 111t and is adjacent to the first reference coil wiring 111t in the axial AX direction. The length of the first reference coil wiring 111t (hereinafter referred to as the tenth length L10) is shorter than the length of the adjacent coil wiring 116t (hereinafter referred to as the eleventh length L11).

The tenth length L10 is the length along the center line of the width of the first reference coil wiring 111t between the center of the connection surface 14y of the second through wiring 14 connected to the first end of the first reference coil wiring 111t and the center of the connection surface 13y of the first through wiring 13 connected to the second end of the first reference coil wiring 111t, when viewed from a direction perpendicular to the bottom surface 100b. The eleventh length L11 is the length along the center line of the width of the adjacent coil wiring 116t between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the adjacent coil wiring 116t and the center of the connection surface 14y of the second through wiring 14 connected to the second end of the adjacent coil wiring 116t, when viewed from a direction perpendicular to the bottom surface 100b.

With the above configuration, since the tenth length L10 is shorter than the eleventh length L11, the wiring length of the outermost turn on the first external electrode 121 side can be adjusted, and for example, the inductance required for impedance matching can be easily adjusted.

As shown in FIG. 14, one of the multiple top surface wirings 11t is a central coil wiring 115t that is located on the same plane as the first reference coil wiring 111t and is located in the center of the coil 110 in the axial AX direction. The length of the first reference coil wiring 111t (tenth length L10) is shorter than the length of the central coil wiring 115t (hereinafter referred to as twelfth length L12). In this embodiment, since the central coil wiring 115t is the same as the adjacent coil wiring 116t, the twelfth length L12 is the same as the eleventh length L11.

With the above configuration, since the tenth length L10 is shorter than the twelfth length L12, the wiring length of the outermost turn on the first external electrode 121 side can be adjusted, and for example, the inductance required for impedance matching can be easily adjusted.

In this embodiment, it is sufficient to satisfy at least one of the first characteristic that "the tenth length L10 is shorter than the eleventh length L11" and the second characteristic that "the tenth length L10 is shorter than the twelfth length L12." This allows the wiring length of the outermost turn to be adjusted, making it easy to adjust the inductance.

As shown in FIG. 14, the configuration of the outermost turn of the coil 110 on the second external electrode 122 side may be the same as the configuration of the outermost turn of the coil 110 on the first external electrode 121 side described above.

Specifically, of the bottom wiring 11b and top wiring 11t constituting the outermost turn of the coil 110 on the second external electrode 122 side, the top wiring 11t is the second reference coil wiring 112t located electrically closer to the second external electrode 122. One of the multiple top wirings 11t is an adjacent coil wiring 116t located on the same plane as the second reference coil wiring 112t and adjacent to the second reference coil wiring 112t in the axial AX direction. The length of the second reference coil wiring 112t (hereinafter referred to as the thirteenth length L13) is shorter than the length of the adjacent coil wiring 116t (the eleventh length L11). This makes it possible to adjust the wiring length of the outermost turn on the second external electrode 122 side, making it easy to adjust the inductance.

The thirteenth length L13 is the length along the center line of the width of the second reference coil wiring 112t when viewed from a direction perpendicular to the bottom surface 100b, between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the second reference coil wiring 112t and the center of the connection surface 14y of the second through wiring 14 connected to the second end of the second reference coil wiring 112t.

Furthermore, one of the multiple top surface wirings 11t is a central coil wiring 115t that is located on the same plane as the second reference coil wiring 112t and is located in the center of the coil 110 in the axial AX direction. The length of the second reference coil wiring 112t (thirteenth length L13) is shorter than the length of the central coil wiring 115t (twelfth length L12). This makes it possible to adjust the wiring length of the outermost turn on the second external electrode 122 side, and thus makes it easy to adjust the inductance.

It is sufficient that at least one of the first characteristic that "the thirteenth length L13 is shorter than the eleventh length L11" and the second characteristic that "the thirteenth length L13 is shorter than the twelfth length L12" is satisfied.

Note that this disclosure is not limited to the above-described embodiments, and design modifications are possible without departing from the gist of this disclosure. For example, the respective characteristic points of the first to third embodiments may be combined in various ways.

In the first embodiment, one end of the first reference coil wiring 111b is connected to the first external electrode 121, but it may be connected to the first external electrode 121 via other wiring (columnar wiring). In this case, the first length L1 is the length along the center line of the width of the first reference coil wiring 111b, as viewed from a direction perpendicular to the bottom surface 100b, between the center of the connection surface 13y of the first through wiring 13 connected to the first end of the first reference coil wiring 111b and the center of the connection surface of the other wiring connected to the second end of the first reference coil wiring 111b. The same may also be true for the connection between the second reference coil wiring 112b and the second external electrode 122.

The present disclosure includes the following aspects.
＜1＞
an element body including a first main surface and a second main surface opposed to each other;
a coil provided on the element body and wound helically along an axis;
a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
The axis of the coil is disposed parallel to the first major surface;
The coil is
a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface;
a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface;
a plurality of first through wires extending from the first coil wiring side toward the second coil wiring side and arranged along the axis;
a plurality of second through wirings extending from the first coil wiring side toward the second coil wiring side, provided on an opposite side of the axis from the first through wirings, and arranged along the axis;
the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape;
An inductor component, wherein the length of a reference coil wiring, which is one of the first coil wiring and the second coil wiring that constitute the outermost turn of the coil on the first external electrode side and is located electrically closer to the first external electrode, is shorter than the length of an adjacent coil wiring that is located on the same plane as the reference coil wiring and is adjacent to the reference coil wiring in the axial direction.
＜2＞
an element body including a first main surface and a second main surface opposed to each other;
a coil provided on the element body and wound helically along an axis;
a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
The axis of the coil is disposed parallel to the first major surface;
The coil is
a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface;
a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface;
a plurality of first through wires extending from the first coil wiring side toward the second coil wiring side and arranged along the axis;
a plurality of second through wirings extending from the first coil wiring side toward the second coil wiring side, provided on an opposite side of the axis from the first through wirings, and arranged along the axis;
the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape;
An inductor component, wherein the length of a reference coil wiring, which is one of the first coil wiring and the second coil wiring that constitute the outermost turn of the coil on the first external electrode side and is located electrically closer to the first external electrode, is shorter than the length of a central coil wiring that is located on the same plane as the reference coil wiring and is located in the center of the axial direction of the coil.
＜3＞
The inductor component according to <1> or <2>, wherein the element body contains SiO ₂ .
＜4＞
The inductor component according to any one of <1> to <3>, wherein all of the first coil wirings are arranged in parallel.
＜5＞
The inductor component according to any one of <1> to <4>, wherein all of the second coil wirings are arranged in parallel.
＜6＞
The inductor component according to any one of <1> to <5>, wherein the first external electrode is disposed above the reference coil wiring, and the first external electrode is connected to the reference coil wiring.
＜７＞
The inductor component according to any one of <1> to <5>, wherein the first external electrode is connected to the first through wiring.
＜8＞
The inductor component according to any one of <1> to <7>, wherein the first through wiring and the second through wiring are not parallel to each other when viewed in a direction parallel to the axis.
＜9＞
The element body includes _SiO2 ,
The inductor component according to any one of <1> to <8>, wherein the first through wiring contains SiO ₂ .
＜10＞
The inductor component according to any one of <1> to <9>, wherein the first through wiring includes a void portion or a resin portion.
<11>
An inductor component described in any one of <1> to <10>, wherein the first through wiring has a conductive layer located on the outer periphery when viewed from the direction in which the first through wiring extends, and a non-conductive layer located inside the conductive layer.
＜12＞
The inductor component according to any one of <1> to <11>, wherein an axial length of the coil is shorter than an inner diameter of the coil.
＜13＞
Further, an organic insulator is provided on the first main surface,
The inductor component according to any one of <1> to <12>, wherein the element body is an inorganic insulator.
＜14＞
The inductor component according to any one of <1> to <13>, wherein an outer surface of the first external electrode has a recess.
＜15＞
the first through-hole wiring extends in a direction perpendicular to the first main surface,
An inductor component according to any one of <1> to <14>, wherein a cross-sectional area of at least one of both ends in the extension direction of the first through wiring is larger than a cross-sectional area of a central portion in the extension direction of the first through wiring.
＜16＞
The inductor component according to any one of <1> to <15>, wherein the inductor component has a thickness of 200 μm or less.
＜１７＞
An inductor component described in any one of <1> to <16>, wherein, when viewed in a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer peripheral surface of the element body.

1, 1A-1H Inductor component 10 Body 11b Bottom wiring (first coil wiring)
11t Top wiring (second coil wiring)
13 First through-hole wiring 13e End portion 13m Central portion 13s Conductive layer

13u Non-conductive layer

13y Connection surface 14 Second through-hole wiring 14y Connection surface 22 Insulator 100b Bottom surface (first main surface)
100t Top surface (second main surface)
DESCRIPTION OF THE

PREFERRED EMBODIMENTS

110, 110A,

110B Coil

111b, 111t First

reference coil wiring

112b, 112t Second reference coil wiring 113b First adjacent coil wiring 114b Second

adjacent coil wiring

115b, 115t

Central coil wiring

116b, 116t Adjacent coil wiring 121 First external electrode 121a Recessed portion 121b Bottom portion 121v Via portion 121e1 Base layer 121e2 Plating layer 121y Connection surface 122 Second external electrode 122b Bottom portion 122v Via portion 122y Connection surface AX Axis L1-L13 First to thirteenth lengths V Through hole θ Angle between bottom wiring and top wiring

Claims

an element body including a first main surface and a second main surface opposed to each other;
a coil provided on the element body and wound helically along an axis;
a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
The axis of the coil is disposed parallel to the first major surface;
The coil is
a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface;
a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface;
a plurality of first through wires extending from the first coil wiring side toward the second coil wiring side and arranged along the axis;
a plurality of second through wirings extending from the first coil wiring side toward the second coil wiring side, provided on an opposite side of the axis from the first through wirings, and arranged along the axis;
the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape;
An inductor component, wherein the length of a reference coil wiring, which is one of the first coil wiring and the second coil wiring that constitute the outermost turn of the coil on the first external electrode side and is located electrically closer to the first external electrode, is shorter than the length of an adjacent coil wiring that is located on the same plane as the reference coil wiring and is adjacent to the reference coil wiring in the axial direction.
an element body including a first main surface and a second main surface opposed to each other;
a coil provided on the element body and wound helically along an axis;
a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
The axis of the coil is disposed parallel to the first major surface;
The coil is
a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface;
a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface;
a plurality of first through wires extending from the first coil wiring side toward the second coil wiring side and arranged along the axis;
a plurality of second through wirings extending from the first coil wiring side toward the second coil wiring side, provided on an opposite side of the axis from the first through wirings, and arranged along the axis;
the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape;
An inductor component, wherein the length of a reference coil wiring, which is one of the first coil wiring and the second coil wiring that constitute the outermost turn of the coil on the first external electrode side and is located electrically closer to the first external electrode, is shorter than the length of a central coil wiring that is located on the same plane as the reference coil wiring and is located in the center of the axial direction of the coil.
The inductor component according to claim 1 , wherein the element body contains SiO 2 .
An inductor component according to any one of claims 1 to 3, wherein all of the first coil wiring is arranged in parallel.
An inductor component according to any one of claims 1 to 4, wherein all of the second coil wirings are arranged in parallel.
An inductor component according to any one of claims 1 to 5, wherein the first external electrode is disposed above the reference coil wiring, and the first external electrode is connected to the reference coil wiring.
An inductor component according to any one of claims 1 to 5, wherein the first external electrode is connected to the first through-hole wiring.
An inductor component according to any one of claims 1 to 7, in which the first through-hole wiring and the second through-hole wiring are not parallel when viewed in a direction parallel to the axis.
The body includes SiO2 ,
The inductor component according to claim 1 , wherein the first through via comprises SiO 2 .
An inductor component according to any one of claims 1 to 9, wherein the first through-hole wiring includes a void portion or a resin portion.
An inductor component according to any one of claims 1 to 10, wherein the first through-hole wiring has a conductive layer located on the outer periphery when viewed from the direction in which the first through-hole wiring extends, and a non-conductive layer located inside the conductive layer.
An inductor component according to any one of claims 1 to 11, wherein the axial length of the coil is shorter than the inner diameter of the coil.
Further, an organic insulator is provided on the first main surface,
The inductor component according to claim 1 , wherein the element body is an inorganic insulator.
An inductor component according to any one of claims 1 to 13, wherein the outer surface of the first external electrode has a recessed portion.
the first through-hole wiring extends in a direction perpendicular to the first main surface,
The inductor component according to claim 1 , wherein a cross-sectional area of at least one of both end portions in the extension direction of the first through wiring is larger than a cross-sectional area of a central portion of the first through wiring in the extension direction.
An inductor component according to any one of claims 1 to 15, wherein the thickness of the inductor component is 200 μm or less.
An inductor component according to any one of claims 1 to 16, wherein the first external electrode and the second external electrode are located inside the outer peripheral surface of the element body when viewed from a direction perpendicular to the first main surface.