WO2024090481A1 - Fluid pressure control device - Google Patents

Fluid pressure control device Download PDF

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Publication number
WO2024090481A1
WO2024090481A1 PCT/JP2023/038525 JP2023038525W WO2024090481A1 WO 2024090481 A1 WO2024090481 A1 WO 2024090481A1 JP 2023038525 W JP2023038525 W JP 2023038525W WO 2024090481 A1 WO2024090481 A1 WO 2024090481A1
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WO
WIPO (PCT)
Prior art keywords
coil spring
hole
substrate
cover
control device
Prior art date
Application number
PCT/JP2023/038525
Other languages
French (fr)
Japanese (ja)
Inventor
雄紀 平田
泰幸 前田
翔太 嶋崎
Original Assignee
株式会社アドヴィックス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アドヴィックス filed Critical 株式会社アドヴィックス
Publication of WO2024090481A1 publication Critical patent/WO2024090481A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T8/00—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force
    • B60T8/32—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration
    • B60T8/34—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration having a fluid pressure regulator responsive to a speed condition
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00

Definitions

  • An embodiment of the present invention relates to a hydraulic control device.
  • the hydraulic control device has a board on which electronic components that control various components, such as solenoid valves, are mounted, and a cover that covers the board.
  • the metal cover may become charged with static electricity, for example.
  • a coil spring is brought into contact with the cover.
  • the coil spring is electrically connected to the ground layer of the board by contacting an electrode on the board, for example, thereby grounding the cover (Patent Document 1).
  • providing electrodes on a board reduces the mounting area of the board on which various electronic components are mounted or on which signal wiring is provided.
  • the board In order to compensate for the reduction in mounting area caused by providing electrodes, the board must be made larger or have more layers.
  • the present invention has been made in consideration of the above, and provides a hydraulic control device that can prevent the coil spring used to ground the cover from reducing the mounting area of the board.
  • a hydraulic control device includes, as an example, a substrate having a conductive layer and a first through hole spaced apart from the conductive layer, a coil spring passing through the first through hole and spaced apart from the conductive layer, and a housing having an internal space in which the substrate and the coil spring are housed, a cover at least partially made of metal and covering the internal space, and a metal portion of the cover contacts the compressed coil spring and is grounded through the coil spring.
  • the coil spring can suppress the effect of the charging of the cover due to static electricity, for example, on the operation of electronic components mounted on the substrate.
  • the coil spring is spaced apart from the conductive layer, it is not necessary to connect the coil spring to the conductive layer of the substrate around the first through hole. Therefore, the substrate does not need to have a land connected to the coil spring, and it is possible to suppress the reduction in the mounting area of the substrate on which electronic components are mounted or signal wiring is provided, due to the provision of the land.
  • FIG. 1 is a cross-sectional view that illustrates a hydraulic control device according to one embodiment.
  • FIG. 2 is a perspective view showing a part of the hydraulic pressure control device of the embodiment in an exploded state.
  • FIG. 3 is a perspective view showing the ECU, the case, and the cover of the embodiment in a separated state.
  • FIG. 1 is a cross-sectional view that shows a schematic diagram of a hydraulic control device 10 according to one embodiment.
  • the hydraulic control device 10 may also be referred to as an electric device, for example.
  • the hydraulic control device 10 of this embodiment is mounted on a vehicle, such as an automobile.
  • the hydraulic control device 10 adjusts the pressure (hydraulic pressure) in a hydraulic line of a brake device of the vehicle. Note that the hydraulic control device 10 is not limited to this example.
  • an X-axis, a Y-axis, and a Z-axis are defined in this specification.
  • the X-axis, the Y-axis, and the Z-axis are mutually perpendicular.
  • the X-axis is provided along the width of the hydraulic control device 10.
  • the Y-axis is provided along the length of the hydraulic control device 10.
  • the Z-axis is provided along the thickness of the hydraulic control device 10.
  • the X direction is a direction along the X axis, and includes the +X direction indicated by the X axis arrow, and the -X direction opposite the X axis arrow.
  • the Y direction is a direction along the Y axis, and includes the +Y direction indicated by the Y axis arrow, and the -Y direction opposite the Y axis arrow.
  • the Z direction is a direction along the Z axis, and includes the +Z direction indicated by the Z axis arrow, and the -Z direction opposite the Z axis arrow.
  • the hydraulic control device 10 has a housing 11, a pump 12, a motor 13, a plurality of solenoid valves 14, an electronic control unit (ECU) 15, and a coil spring 16.
  • the coil spring 16 may also be referred to as a conductive member.
  • the housing 11 has a housing 21, a case 22, a plurality of connecting parts 23, and a cover 24. Note that the housing 11 is not limited to this example.
  • the housing 21 is made of, for example, a conductive metal and is formed into a roughly cubic shape. Note that the shape of the housing 21 is not limited to this example.
  • the pump 12, motor 13, multiple solenoid valves 14, and various other parts are attached to the housing 21.
  • the housing 21 has two side surfaces 21a and 21b.
  • Side surface 21a is formed to be approximately flat and faces approximately in the +Z direction.
  • Side surface 21b is located on the opposite side to side surface 21a.
  • Side surface 21b is formed to be approximately flat and faces approximately in the -Z direction.
  • Side surfaces 21a and 21b may have irregularities.
  • the housing 21 is provided with a plurality of holes and flow paths.
  • the pump 12 and the plurality of solenoid valves 14 are each mounted in a corresponding one of the plurality of holes.
  • Each of the plurality of flow paths connects at least two of the plurality of holes to each other, or connects one of the plurality of holes to the outer surface of the housing 21.
  • the case 22 is made of, for example, insulating synthetic resin. However, the case 22 may be made of other materials.
  • the case 22 is attached to the housing 21 by, for example, screws. However, the case 22 may be attached to the housing 21 by other methods.
  • the case 22 has an intermediate wall 31, two side walls 32, 33, a connector frame 34, and a guide 35.
  • the intermediate wall 31 is formed in a plate shape that is approximately perpendicular to the Z axis, and is spaced from the housing 21 in the +Z direction.
  • the intermediate wall 31 has two surfaces 31a, 31b.
  • the surface 31a is formed approximately flat and faces approximately in the +Z direction.
  • the surface 31b is located on the opposite side of the surface 31a.
  • the surface 31b is formed approximately flat and faces approximately in the -Z direction.
  • the surface 31b faces the side surface 21a of the housing 21 via a gap.
  • FIG. 2 is a perspective view showing the ECU 15, case 22, and cover 24 of this embodiment in a separated state.
  • the side wall 32 extends in the +Z direction from the edge of the intermediate wall 31 and surrounds the surface 31a.
  • the side wall 33 extends in the -Z direction from the surface 31b and surrounds a portion of the surface 31b.
  • the side wall 33 extends from the surface 31b toward the side surface 21a of the housing 21 and abuts against the side surface 21a.
  • the connector frame 34 extends in the -Z direction from the surface 31b outside the side wall 33 and surrounds a portion of the surface 31b.
  • the connector frame 34 is spaced apart from the housing 21.
  • the guide 35 is located inside the side wall 32 and protrudes from the surface 31a of the intermediate wall 31 in approximately the +Z direction.
  • the guide 35 is, for example, a substantially cylindrical protrusion. Note that the guide 35 may also be formed, for example, in a substantially cylindrical shape.
  • the multiple connection parts 23 are assembled into the case 22, for example, by insert molding.
  • the multiple connection parts 23 include multiple pins 37 and a bus bar 38.
  • the bus bar 38 is an example of a metal member.
  • the multiple connection parts 23 may also include other components, such as various circuits.
  • the multiple pins 37 and bus bar 38 are made of conductive metal. At least one of the multiple pins 37 protrudes from surface 31a of intermediate wall 31 in approximately the +Z direction. At least another of the multiple pins 37 protrudes from surface 31b of intermediate wall 31 in the -Z direction.
  • the bus bar 38 is embedded in intermediate wall 31 near surface 31a.
  • the cover 24 is made of, for example, a conductive metal. Note that a portion of the cover 24 may be made of an insulating material such as a synthetic resin. In other words, the cover 24 is at least partially made of metal.
  • the cover 24 is attached to the side wall 32 of the case 22. As a result, the cover 24 is indirectly attached to the housing 21 via the case 22. Note that the cover 24 may also be attached directly to the housing 21.
  • the cover 24 has an inner surface 24a.
  • the inner surface 24a faces the surface 31a of the intermediate wall 31 via a gap.
  • at least a portion of the inner surface 24a is made of a metal.
  • the internal space S is a space surrounded by the housing 11, and is located between the housing 21 and the cover 24.
  • the cover 24 covers the internal space S.
  • the side surface 21a of the housing 21 and the inner surface 24a of the cover 24 face the internal space S.
  • the solenoid valve 14, the ECU 15, and the coil spring 16 are housed in the internal space S.
  • the internal space S has a portion between the housing 21 and the case 22, and a portion between the case 22 and the cover 24. However, these two portions of the internal space S communicate with each other through a hole provided in the intermediate wall 31.
  • the pump 12 is, for example, a gear pump. However, the pump 12 may be another type of pump.
  • the pump 12 can send brake fluid to a fluid path of a brake device, for example, through a flow path in the housing 21.
  • the motor 13 is, for example, a three-phase brushless motor. However, the motor 13 may be another type of motor.
  • the motor 13 is attached to the side surface 21b of the housing 21. The motor 13 drives the rotor of the pump 12.
  • the gap between the housing 21 and the side wall 33, the gap between the side wall 32 and the cover 24, and the gap between the motor 13 and the housing 21 may be sealed, for example, by a gasket. This makes the internal space S liquid-tight.
  • Each of the multiple solenoid valves 14 is, for example, a differential pressure control valve, a pressure increase control valve, or a pressure reduction control valve.
  • the solenoid valve 14 opens or closes the flow path of the housing 21 by passing a current through the solenoid of the solenoid valve 14.
  • the solenoid valve 14 may generate a pressure difference between the flow path upstream and downstream of the solenoid valve 14.
  • the ECU 15 has a substrate 41, electronic components 42, and a capacitor 43.
  • the substrate 41 is, for example, a printed circuit board (PCB). However, the substrate 41 may be another type of substrate.
  • the substrate 41 is formed in a plate shape that is approximately perpendicular to the Z direction.
  • the substrate 41 is located between the intermediate wall 31 of the case 22 and the cover 24, and is attached to the case 22, for example.
  • the substrate 41 has two surfaces 41a, 41b and an outer edge 41c.
  • Surface 41a is formed to be approximately flat and faces approximately in the +Z direction.
  • Surface 41a faces the inner surface 24a of cover 24 via a gap.
  • Surface 41b is located on the opposite side of surface 41a.
  • Surface 41b is formed to be approximately flat and faces approximately in the -Z direction.
  • Surface 41b faces surface 31a of intermediate wall 31 via a gap.
  • Outer edge 41c is provided between the edge of surface 41a and the edge of surface 41b, and faces in a direction approximately perpendicular to the Z direction.
  • a number of pins 37 protruding from the surface 31a of the intermediate wall 31 are joined, for example by press-fitting, to through holes provided in the substrate 41.
  • the substrate 41 is electrically connected to the motor 13 and the solenoid of the solenoid valve 14 via the pins 37. Note that the substrate 41 may also be electrically connected to the motor 13 and the solenoid valve 14 by other methods.
  • the electronic components 42 include, for example, an IC, a microcomputer, and various other components.
  • the electronic components 42 and the capacitor 43 are mounted on the substrate 41.
  • the ECU 15 has an electronic circuit formed by the wiring of the substrate 41, the electronic components 42, and the capacitor 43.
  • the electronic circuit controls the operation of the motor 13 and the solenoid valve 14 through the connection components 23.
  • the electronic circuit may also have other components.
  • FIG. 3 is a cross-sectional view showing a portion of the hydraulic control device 10 of this embodiment.
  • a first through hole 51 and a second through hole 52 are provided in the substrate 41.
  • the first through hole 51 and the second through hole 52 each penetrate the substrate 41 approximately in the Z direction and open to the surfaces 41a, 41b.
  • the first through hole 51 is provided near the outer edge 41c of the substrate 41.
  • the cross section of the first through hole 51 is, for example, substantially circular.
  • the diameter of the first through hole 51 is, for example, approximately 4 mm.
  • the second through hole 52 is spaced apart from the first through hole 51.
  • the cross section of the second through hole 52 may be formed to be approximately circular or may be formed to be another shape.
  • the second through hole 52 is smaller than the first through hole 51.
  • the diameter of the second through hole 52 is approximately 1 mm. Note that the sizes of the first through hole 51 and the second through hole 52 are not limited to this example.
  • the substrate 41 is, for example, a so-called double-sided substrate, and has a base layer 61, two conductive layers 62, 63, and two cover layers 64, 65. Note that the substrate 41 is not limited to this example, and may be a multilayer board having three or more conductive layers.
  • the base layer 61 is an insulating plate such as FR-4.
  • the base layer 61 has two planes 61a and 61b.
  • the plane 61a faces approximately in the +Z direction.
  • the plane 61b is located on the opposite side of the plane 61a and faces approximately in the -Z direction.
  • the conductive layers 62 and 63 are made of a conductive metal such as copper.
  • the conductive layer 62 is provided on the plane 61a.
  • the conductive layer 63 is provided on the plane 61b.
  • the conductive layer 63 has a ground layer 71 and a connection layer 72.
  • the ground layer 71 is a conductor of the conductive layer 63 that is set to a ground potential (reference potential) on the substrate 41.
  • the ground potential is, for example, the same potential as the body of the vehicle.
  • the ground layer 71 has, for example, a ground plane, a ground wiring connected to the ground plane, and a ground terminal connected to the ground wiring.
  • At least one of the multiple pins 37 penetrates the intermediate wall 31 and is surrounded by the connector frame 34.
  • the connector frame 34 and the pins 37 surrounded by the connector frame 34 form a connector C.
  • At least one of the pins 37 included in the connector C is electrically connected to the ground layer 71.
  • a wire harness W is connected to the connector C.
  • the ground layer 71 is electrically connected to, for example, the vehicle body via the pin 37 and the wire harness W. This allows the ground layer 71 to be grounded. Note that the ground layer 71 may also be grounded by other methods.
  • connection layer 72 is separated from the ground layer 71. Therefore, the potential of the ground layer 71 and the potential of the connection layer 72 may be different from each other.
  • the connection layer 72 has, for example, a connection terminal 75, a mounting terminal 76, and a connection wiring 77.
  • connection terminal 75 is, for example, a so-called through-hole plating provided on an area of the plane 61b that contacts the edge of the second through hole 52 and on the inner surface of the second through hole 52.
  • the second through hole 52 and the connection terminal 75 form a through hole H.
  • the mounting terminal 76 is spaced apart from the connection terminal 75.
  • the mounting terminal 76 is, for example, a pad used for surface mounting, but may also be a through hole.
  • the connection wiring 77 connects the connection terminal 75 and the mounting terminal 76.
  • the cover layers 64 and 65 are, for example, solder resist.
  • the cover layer 64 covers the flat surface 61a of the base layer 61 and a part of the conductive layer 62.
  • the cover layer 65 covers the flat surface 61b of the base layer 61 and a part of the conductive layer 63.
  • the cover layer 65 exposes the ground terminal of the ground layer 71, the connection terminal 75, and the mounting terminal 76.
  • the surface 41a of the substrate 41 is formed by the cover layer 64, the flat surface 61a of the base layer 61 exposed by the cover layer 64, and a part of the conductive layer 62.
  • the surface 41b of the substrate 41 is formed by the cover layer 65, the flat surface 61b of the base layer 61 exposed by the cover layer 65, and a part of the conductive layer 63. Note that the surfaces 41a and 41b are not limited to this example.
  • the conductor of the substrate 41 including the conductive layers 62 and 63, is spaced apart from the first through hole 51.
  • the inner surface of the first through hole 51 is made of an insulating material.
  • the distance between each of the conductive layers 62 and 63 and the edge of the first through hole 51 is longer than the wire diameter (wire diameter) of the coil spring 16.
  • the ground layer 71 may be provided between the first through hole 51 and the outer edge 41c of the substrate 41.
  • the ground plane of the ground layer 71 is provided between the first through hole 51 and the outer edge 41c of the substrate 41.
  • the busbar 38 has a support wall 81 and a pin 82.
  • the support wall 81 is formed in a plate shape arranged along the surface 31a of the intermediate wall 31.
  • the support wall 81 has a support surface 81a.
  • the support surface 81a is formed to be approximately flat and faces approximately in the +Z direction.
  • the support wall 81 may be provided on the surface 31a, or may be partially embedded in the intermediate wall 31. When the support wall 81 is embedded in the intermediate wall 31, the support surface 81a is exposed to the outside of the intermediate wall 31. A portion of the support surface 81a faces the first through hole 51 of the substrate 41.
  • a through hole 85 is provided in the support wall 81.
  • the through hole 85 penetrates the support wall 81 in approximately the Z direction and opens to the support surface 81a.
  • the through hole 85 has a substantially circular cross section. Note that the shape of the through hole 85 is not limited to this example.
  • the guide 35 extends through the insertion hole 85.
  • the guide 35, the first through hole 51, and the insertion hole 85 have a common central axis and are arranged coaxially (concentrically). Therefore, the guide 35 extends toward the first through hole 51. Note that the respective central axes of the guide 35, the first through hole 51, and the insertion hole 85 may be misaligned with each other.
  • the diameter of the guide 35 is smaller than the diameter of the first through hole 51.
  • the length of the guide 35 in the Z direction is shorter than the distance between the surface 31a of the intermediate wall 31 and the surface 41b of the substrate 41.
  • the guide 35 is not inserted into the first through hole 51. In this way, the guide 35 is spaced apart from the substrate 41. Note that a portion of the guide 35 may be disposed inside the first through hole 51.
  • the pin 82 extends from the support wall 81 in approximately the +Z direction at a position spaced apart from the insertion hole 85.
  • the pin 82 extends through the second through hole 52 and is joined to the connection terminal 75.
  • the pin 82 is joined to the connection terminal 75 by press-fitting. That is, the pin 82 is pressed into the second through hole 52 and abuts against the connection terminal 75 provided on the inner surface of the second through hole 52.
  • the pin 82 may also be joined to the connection terminal 75 by, for example, soldering.
  • the coil spring 16 is made of a conductive material such as metal.
  • the wire diameter, inner diameter, outer diameter, and pitch of the coil spring 16 are approximately constant.
  • the outer diameter of the coil spring 16 is smaller than the diameter of the first through hole 51.
  • the inner diameter of the coil spring 16 is larger than the diameter of the guide 35. Note that the dimensions of the coil spring 16 are not limited to this example.
  • the coil spring 16 extends through the first through hole 51 in approximately the Z direction. In other words, the coil spring 16 extends through the substrate 41.
  • the coil spring 16 is spaced apart from the inner surface of the first through hole 51. Therefore, the coil spring 16 is spaced apart from the substrate 41.
  • the coil spring 16 may be in contact with the inner surface of the first through hole 51. In this case, the inner surface of the first through hole 51 supports the coil spring 16 and can suppress buckling of the coil spring 16.
  • One end 16a of the coil spring 16 contacts the inner surface 24a of the cover 24. If the cover 24 is partially made of metal, the end 16a contacts the part of the inner surface 24a that is made of metal. The other end 16b of the coil spring 16 contacts the support surface 81a of the support wall 81. Note that the coil spring 16 may contact the cover 24 and the bus bar 38 at a part other than the ends 16a and 16b.
  • the coil spring 16 is compressed between the inner surface 24a of the cover 24 and the support surface 81a of the support wall 81. As a result, the coil spring 16 presses the inner surface 24a in approximately the +Z direction and presses the support surface 81a in approximately the -Z direction.
  • the cylindrical guide 35 is inserted into the inside of the coil spring 16 through the end 16b. In other words, the guide 35 is disposed inside the coil spring 16. In this way, the guide 35 supports the coil spring 16 and suppresses buckling of the coil spring 16. Note that the cylindrical guide 35 may surround the coil spring 16 to suppress buckling of the coil spring 16.
  • the coil spring 16 Since the conductive layers 62, 63 are spaced apart from the first through hole 51, the coil spring 16 is also spaced apart from the conductive layers 62, 63. Meanwhile, the coil spring 16 is conductive to the cover 24 and also conductive to the bus bar 38. Therefore, the coil spring 16 provides electrical conductivity between the cover 24 and the bus bar 38.
  • the capacitor 43 is connected, for example, to the ground terminal of the ground layer 71 and the mounting terminal 76 of the connection layer 72. As a result, the ground layer 71 and the connection terminal 75 are electrically connected to each other via the capacitor 43. Furthermore, the ground layer 71 is electrically connected to the bus bar 38 via the capacitor 43 and the connection terminal 75.
  • the cover 24 is grounded via the coil spring 16, the bus bar 38, the connection layer 72 including the connection terminal 75, the capacitor 43, and the ground layer 71. This allows the charge generated in the cover 24 due to, for example, static electricity to be removed.
  • the cover 24 may also be grounded through other paths.
  • the bus bar 38 may be electrically connected to the collar 90 in FIG. 2 through which the screw that connects the housing 21 and the case 22 passes.
  • the collar 90 is assembled into the case 22 outside the internal space S.
  • the screw passes through the collar 90 and is screwed into the housing 21, thereby making the collar 90 and the housing 21 conductive to each other.
  • the cover 24 is electrically connected to the vehicle body via the coil spring 16, the bus bar 38, the collar 90, the screw, and the housing 21.
  • the first through hole 51 is used as a reference hole for the ECU 15.
  • a jig is inserted into the first through hole 51, or the first through hole 51 is set as a reference for image recognition. This allows the position of the ECU 15 relative to the case 22 to be set more accurately, and for example, the pin 82 can be properly inserted into the second through hole 52.
  • the first through hole 51 is not a through hole used for electrical connection, nor is it a hole through which a screw passes.
  • the hydraulic control device 10 of this embodiment uses the first through hole 51, which is a reference hole, as a hole through which the coil spring 16 passes.
  • the first through hole 51 is spaced apart from the conductive layers 62, 63.
  • the coil spring 16 passes through the first through hole 51 and is spaced apart from the conductive layers 62, 63.
  • the cover 24 of the housing 11 contacts the compressed coil spring 16 and is grounded through the coil spring 16. This allows the coil spring 16 to suppress the effect of the charging of the cover 24 due to static electricity, for example, on the operation of the electronic components 42 mounted on the board 41.
  • the coil spring 16 is spaced apart from the conductive layers 62, 63, it is not necessary to connect the coil spring 16 to the conductive layers 62, 63 of the board 41 around the first through hole 51.
  • the board 41 does not need to have a land connected to the coil spring 16, and it is possible to suppress the reduction in the mounting area of the board 41 on which various electronic components are mounted or signal wiring is provided, due to the provision of the land. Furthermore, the substrate 41 does not need to be enlarged or multi-layered to compensate for the reduction in mounting area caused by providing lands, and the increase in cost due to enlargement or multi-layering can be suppressed.
  • the guide 35 is spaced apart from the substrate 41 and surrounds or is disposed inside the coil spring 16 to support the coil spring 16. This allows the guide 35 to suppress buckling of the coil spring 16. Furthermore, because the guide 35 is not provided on the substrate 41, it is possible to suppress a reduction in the mounting area of the substrate 41 due to the provision of the guide 35.
  • the bus bar 38 contacts the coil spring 16.
  • the coil spring 16 is compressed between the cover 24 and the bus bar 38.
  • the conductive layer 63 has a ground layer 71 that is electrically connected to the bus bar 38 and is grounded. That is, the cover 24 is grounded through the coil spring 16, the bus bar 38, and the ground layer 71 of the substrate 41.
  • This allows the hydraulic control device 10 to suppress the occurrence of a potential difference between the cover 24 and the ground layer 71 of the substrate 41, and suppresses the potential difference from affecting the operation of the electronic components 42 mounted on the substrate 41.
  • the hydraulic control device 10 can electrically connect the cover 24 and the ground layer 71 in a manner other than the contact between the coil spring 16 and the land, and suppresses the mounting area of the substrate 41 from being reduced by providing the land.
  • the second through hole 52 which is smaller than the first through hole 51, is provided in the substrate 41.
  • the conductive layers 62, 63 have a connection terminal 75.
  • the connection terminal 75 is provided in at least one of the inner surface of the second through hole 52 and the area contacting the edge of the second through hole 52, and is electrically connected to the ground layer 71.
  • the bus bar 38 has a pin 37 that extends through the second through hole 52 and is joined to the connection terminal 75. That is, although the bus bar 38 is connected to the substrate 41, the through hole H (the second through hole 52 and the connection terminal 75) used to connect the bus bar 38 to the substrate 41 is relatively small. As a result, the hydraulic control device 10 can suppress a reduction in the mounting area of the substrate 41 compared to a case in which the land connected to the coil spring 16 is provided around the first through hole 51 or on the surface 41a of the substrate 41.
  • the capacitor 43 is mounted on the substrate 41.
  • the ground layer 71 and the connection terminal 75 are electrically connected to each other via the capacitor 43. This allows the hydraulic control device 10 to prevent a large current from flowing into the ground layer 71 even if a short circuit occurs in the metal part of the cover 24.
  • the guide 35 is provided on the case 22 made of an insulating rigid resin.
  • the guide 35 may also be provided on the bus bar 38 made of a conductive metal.
  • the bus bar 38 may have a guide 35 that protrudes from the support surface 81a of the support wall 81 in approximately the +Z direction.
  • the guide 35 supports the coil spring 16 and can be electrically connected to the coil spring 16.
  • the hydraulic control device includes, as an example, a substrate having a conductive layer and a first through hole spaced apart from the conductive layer, a coil spring passing through the first through hole and spaced apart from the conductive layer, and a housing having an internal space in which the substrate and the coil spring are housed, a cover at least partially made of metal and covering the internal space, and a metal portion of the cover contacts the compressed coil spring and is grounded through the coil spring.
  • the coil spring can suppress the effect of the charging of the cover due to static electricity, for example, on the operation of electronic components mounted on the substrate.
  • the coil spring since the coil spring is spaced apart from the conductive layer, it is not necessary to connect the conductive layer of the substrate around the first through hole.
  • the substrate does not need to have a land connected to the coil spring, and it is possible to suppress the reduction in the mounting area of the substrate on which electronic components are mounted or signal wiring is provided due to the provision of the land. Furthermore, the board does not need to be enlarged or multi-layered to compensate for the reduction in mounting area caused by providing lands, and the increase in cost due to enlargement or multi-layering can be suppressed.
  • the hydraulic control device further includes a guide that is spaced apart from the substrate, surrounds the coil spring or is disposed inside the coil spring, and supports the coil spring.
  • the guide can suppress buckling of the coil spring.
  • the guide since the guide is not provided on the substrate, it is possible to suppress a reduction in the mounting area of the substrate due to the provision of the guide.
  • the hydraulic control device further includes, as an example, a metal member that contacts the coil spring, and the coil spring is compressed between the metal portion of the cover and the metal member, and the conductive layer has a ground layer that is electrically connected to the metal member and is grounded.
  • the metal portion of the cover is grounded through the coil spring, the metal member, and the ground layer of the board.
  • the hydraulic control device can electrically connect the metal portion of the cover to the ground layer in a manner other than the contact between the coil spring and the land, and can suppress the mounting area of the board from being reduced by providing the land.
  • a second through hole smaller than the first through hole is provided in the substrate
  • the conductive layer has a connection terminal provided on at least one of the inner surface of the second through hole and the area contacting the edge of the second through hole and electrically connected to the ground layer
  • the metal member has a pin extending through the second through hole and joined to the connection terminal.
  • the hydraulic control device further includes a capacitor mounted on the substrate, and the ground layer and the connection terminal are electrically connected to each other via the capacitor. Therefore, as an example, the hydraulic control device can prevent a large current from flowing into the ground layer even if a short circuit occurs in the metal part of the cover.
  • suppression is defined as, for example, preventing the occurrence of an event, action, or influence, or reducing the severity of an event, action, or influence.
  • restriction is defined as, for example, preventing movement or rotation, or allowing movement or rotation within a specified range and preventing movement or rotation beyond the specified range.

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  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
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  • General Engineering & Computer Science (AREA)
  • Regulating Braking Force (AREA)
  • Details Of Reciprocating Pumps (AREA)

Abstract

A fluid pressure control device according to an embodiment is, in one example, provided with: a substrate that has an electroconductive layer and that is provided with a first through hole separated from the electroconductive layer; a coil spring that passes through the first through hole and that is separated from the electroconductive layer; and a casing which is provided with an internal space where the substrate and the coil spring are housed, which has a cover that is at least partially made of metal and that covers the internal space, and in which a portion of the cover made of metal contacts the compressed coil spring and is grounded through the coil spring.

Description

液圧制御装置Hydraulic Pressure Control Device
　本発明の実施形態は、液圧制御装置に関する。 An embodiment of the present invention relates to a hydraulic control device.
　従来、例えばブレーキ装置の液路における圧力を調整する液圧制御装置が知られている。液圧制御装置は、例えば、電磁弁のような種々の部品を制御する電子部品が実装された基板と、当該基板を覆うカバーとを有する。 　Conventionally, hydraulic control devices are known that adjust the pressure in hydraulic paths of brake devices, for example. The hydraulic control device has a board on which electronic components that control various components, such as solenoid valves, are mounted, and a cover that covers the board.
　金属製のカバーは、例えば静電気により帯電することがある。カバーを接地するために、例えば、コイルバネがカバーに接触する。当該コイルバネは、例えば、基板の電極に接触することで、当該基板のグランド層に電気的に接続され、カバーを接地する（特許文献１）。 The metal cover may become charged with static electricity, for example. To ground the cover, for example, a coil spring is brought into contact with the cover. The coil spring is electrically connected to the ground layer of the board by contacting an electrode on the board, for example, thereby grounding the cover (Patent Document 1).
特開２０１１－０２９２６６号公報JP 2011-029266 A
　しかしながら、従来の構成では、基板に電極を設けることにより、種々の電子部品が実装され又は信号配線が設けられる基板の実装領域が減少してしまう。電極を設けることによる実装領域の減少を補うためには、基板が大型化又は多層化することとなってしまう。 However, in conventional configurations, providing electrodes on a board reduces the mounting area of the board on which various electronic components are mounted or on which signal wiring is provided. In order to compensate for the reduction in mounting area caused by providing electrodes, the board must be made larger or have more layers.
　そこで、本発明は上記に鑑みてなされたものであり、カバーの接地に用いられるコイルバネが基板の実装領域を減少させてしまうことを抑制可能な液圧制御装置を提供する。 The present invention has been made in consideration of the above, and provides a hydraulic control device that can prevent the coil spring used to ground the cover from reducing the mounting area of the board.
　本発明の実施形態に係る液圧制御装置は、一例として、導電層を有し、前記導電層から離間した第１の貫通孔が設けられた、基板と、前記第１の貫通孔を通り、前記導電層から離間した、コイルバネと、前記基板及び前記コイルバネが収容された内部空間が設けられ、少なくとも部分的に金属で作られるとともに前記内部空間を覆うカバーを有し、当該カバーのうち金属で作られた部分が圧縮された前記コイルバネに接触するとともに当該コイルバネを通じて接地された、筐体と、を備える。よって、一例としては、コイルバネは、例えば静電気によるカバーの帯電が基板に実装された電子部品の動作に影響することを抑制できる。また、コイルバネは、導電層から離間しているため、第１の貫通孔の周辺において基板の導電層に接続される必要がない。このため、基板は、コイルバネに接続されるランドを有する必要が無く、電子部品が実装され又は信号配線が設けられる当該基板の実装領域が当該ランドを設けることによって減少してしまうことを抑制できる。 A hydraulic control device according to an embodiment of the present invention includes, as an example, a substrate having a conductive layer and a first through hole spaced apart from the conductive layer, a coil spring passing through the first through hole and spaced apart from the conductive layer, and a housing having an internal space in which the substrate and the coil spring are housed, a cover at least partially made of metal and covering the internal space, and a metal portion of the cover contacts the compressed coil spring and is grounded through the coil spring. Thus, as an example, the coil spring can suppress the effect of the charging of the cover due to static electricity, for example, on the operation of electronic components mounted on the substrate. Also, since the coil spring is spaced apart from the conductive layer, it is not necessary to connect the coil spring to the conductive layer of the substrate around the first through hole. Therefore, the substrate does not need to have a land connected to the coil spring, and it is possible to suppress the reduction in the mounting area of the substrate on which electronic components are mounted or signal wiring is provided, due to the provision of the land.
図１は、一つの実施形態に係る液圧制御装置を概略的に示す断面図である。FIG. 1 is a cross-sectional view that illustrates a hydraulic control device according to one embodiment. 図２は、上記実施形態の液圧制御装置の一部を分解して示す斜視図である。FIG. 2 is a perspective view showing a part of the hydraulic pressure control device of the embodiment in an exploded state. 図３は、上記実施形態のＥＣＵ、ケース、及びカバーを分離して示す斜視図である。FIG. 3 is a perspective view showing the ECU, the case, and the cover of the embodiment in a separated state.
　以下に、一つの実施形態について、図１乃至図３を参照して説明する。なお、本明細書において、実施形態に係る構成要素及び当該要素の説明が、複数の表現で記載されることがある。構成要素及びその説明は、一例であり、本明細書の表現によって限定されない。構成要素は、本明細書におけるものとは異なる名称でも特定され得る。また、構成要素は、本明細書の表現とは異なる表現によっても説明され得る。 Below, one embodiment will be described with reference to Figures 1 to 3. Note that in this specification, components according to the embodiment and descriptions of the components may be described using multiple expressions. The components and their descriptions are merely examples and are not limited by the expressions in this specification. The components may also be identified by names different from those in this specification. The components may also be described using expressions different from those in this specification.
　図１は、一つの実施形態に係る液圧制御装置１０を概略的に示す断面図である。液圧制御装置１０は、例えば、電気装置とも称され得る。本実施形態の液圧制御装置１０は、例えば、自動車のような車両に搭載される。液圧制御装置１０は、車両のブレーキ装置の液路における圧力（液圧）を調整する。なお、液圧制御装置１０は、この例に限られない。 FIG. 1 is a cross-sectional view that shows a schematic diagram of a hydraulic control device 10 according to one embodiment. The hydraulic control device 10 may also be referred to as an electric device, for example. The hydraulic control device 10 of this embodiment is mounted on a vehicle, such as an automobile. The hydraulic control device 10 adjusts the pressure (hydraulic pressure) in a hydraulic line of a brake device of the vehicle. Note that the hydraulic control device 10 is not limited to this example.
　各図面に示されるように、本明細書において、便宜上、Ｘ軸、Ｙ軸及びＺ軸が定義される。Ｘ軸とＹ軸とＺ軸とは、互いに直交する。Ｘ軸は、液圧制御装置１０の幅に沿って設けられる。Ｙ軸は、液圧制御装置１０の長さに沿って設けられる。Ｚ軸は、液圧制御装置１０の厚さに沿って設けられる。 As shown in each drawing, for the sake of convenience, an X-axis, a Y-axis, and a Z-axis are defined in this specification. The X-axis, the Y-axis, and the Z-axis are mutually perpendicular. The X-axis is provided along the width of the hydraulic control device 10. The Y-axis is provided along the length of the hydraulic control device 10. The Z-axis is provided along the thickness of the hydraulic control device 10.
　さらに、本明細書において、Ｘ方向、Ｙ方向及びＺ方向が定義される。Ｘ方向は、Ｘ軸に沿う方向であって、Ｘ軸の矢印が示す＋Ｘ方向と、Ｘ軸の矢印の反対方向である－Ｘ方向とを含む。Ｙ方向は、Ｙ軸に沿う方向であって、Ｙ軸の矢印が示す＋Ｙ方向と、Ｙ軸の矢印の反対方向である－Ｙ方向とを含む。Ｚ方向は、Ｚ軸に沿う方向であって、Ｚ軸の矢印が示す＋Ｚ方向と、Ｚ軸の矢印の反対方向である－Ｚ方向とを含む。 Furthermore, in this specification, the X direction, Y direction, and Z direction are defined. The X direction is a direction along the X axis, and includes the +X direction indicated by the X axis arrow, and the -X direction opposite the X axis arrow. The Y direction is a direction along the Y axis, and includes the +Y direction indicated by the Y axis arrow, and the -Y direction opposite the Y axis arrow. The Z direction is a direction along the Z axis, and includes the +Z direction indicated by the Z axis arrow, and the -Z direction opposite the Z axis arrow.
　液圧制御装置１０は、筐体１１と、ポンプ１２と、モータ１３と、複数の電磁弁１４と、エレクトロニックコントロールユニット（ＥＣＵ）１５と、コイルバネ１６とを有する。コイルバネ１６は、導電部材とも称され得る。筐体１１は、ハウジング２１と、ケース２２と、複数の接続部品２３と、カバー２４とを有する。なお、筐体１１は、この例に限られない。 The hydraulic control device 10 has a housing 11, a pump 12, a motor 13, a plurality of solenoid valves 14, an electronic control unit (ECU) 15, and a coil spring 16. The coil spring 16 may also be referred to as a conductive member. The housing 11 has a housing 21, a case 22, a plurality of connecting parts 23, and a cover 24. Note that the housing 11 is not limited to this example.
　ハウジング２１は、例えば、導電性の金属で作られ、略立方体状に形成される。なお、ハウジング２１の形状は、この例に限られない。ハウジング２１に、ポンプ１２、モータ１３、複数の電磁弁１４、及び種々の部品が取り付けられる。 The housing 21 is made of, for example, a conductive metal and is formed into a roughly cubic shape. Note that the shape of the housing 21 is not limited to this example. The pump 12, motor 13, multiple solenoid valves 14, and various other parts are attached to the housing 21.
　ハウジング２１は、二つの側面２１ａ，２１ｂを有する。側面２１ａは、略平坦に形成され、略＋Ｚ方向に向く。側面２１ｂは、側面２１ａの反対側に位置する。側面２１ｂは、略平坦に形成され、略－Ｚ方向に向く。なお、側面２１ａ，２１ｂに凹凸が設けられても良い。 The housing 21 has two side surfaces 21a and 21b. Side surface 21a is formed to be approximately flat and faces approximately in the +Z direction. Side surface 21b is located on the opposite side to side surface 21a. Side surface 21b is formed to be approximately flat and faces approximately in the -Z direction. Side surfaces 21a and 21b may have irregularities.
　ハウジング２１に、複数の穴及び流路が設けられる。ポンプ１２及び複数の電磁弁１４のそれぞれは、複数の穴のうち対応する一つに装着される。複数の流路のそれぞれは、複数の穴のうち少なくとも二つを互いに連通させ、又は複数の穴のうち一つとハウジング２１の外面とを互いに連通させる。 The housing 21 is provided with a plurality of holes and flow paths. The pump 12 and the plurality of solenoid valves 14 are each mounted in a corresponding one of the plurality of holes. Each of the plurality of flow paths connects at least two of the plurality of holes to each other, or connects one of the plurality of holes to the outer surface of the housing 21.
　ケース２２は、例えば絶縁性の合成樹脂で作られる。なお、ケース２２は、他の材料で作られても良い。ケース２２は、例えばネジにより、ハウジング２１に取り付けられる。なお、ケース２２は、他の方法によりハウジング２１に取り付けられても良い。ケース２２は、中間壁３１と、二つの側壁３２，３３と、コネクタフレーム３４と、ガイド３５とを有する。 The case 22 is made of, for example, insulating synthetic resin. However, the case 22 may be made of other materials. The case 22 is attached to the housing 21 by, for example, screws. However, the case 22 may be attached to the housing 21 by other methods. The case 22 has an intermediate wall 31, two side walls 32, 33, a connector frame 34, and a guide 35.
　中間壁３１は、Ｚ軸と略直交する板状に形成され、ハウジング２１から＋Ｚ方向に離間している。中間壁３１は、二つの表面３１ａ，３１ｂを有する。表面３１ａは、略平坦に形成され、略＋Ｚ方向に向く。表面３１ｂは、表面３１ａの反対側に位置する。表面３１ｂは、略平坦に形成され、略－Ｚ方向に向く。表面３１ｂは、間隔を介してハウジング２１の側面２１ａに向く。 The intermediate wall 31 is formed in a plate shape that is approximately perpendicular to the Z axis, and is spaced from the housing 21 in the +Z direction. The intermediate wall 31 has two surfaces 31a, 31b. The surface 31a is formed approximately flat and faces approximately in the +Z direction. The surface 31b is located on the opposite side of the surface 31a. The surface 31b is formed approximately flat and faces approximately in the -Z direction. The surface 31b faces the side surface 21a of the housing 21 via a gap.
　図２は、本実施形態のＥＣＵ１５、ケース２２、及びカバー２４を分離して示す斜視図である。側壁３２は、中間壁３１の縁から＋Ｚ方向に延び、表面３１ａを囲む。側壁３３は、表面３１ｂから－Ｚ方向に延び、表面３１ｂの一部を囲む。側壁３３は、表面３１ｂからハウジング２１の側面２１ａに向かって延び、側面２１ａに当接する。コネクタフレーム３４は、側壁３３の外部において表面３１ｂから－Ｚ方向に延び、表面３１ｂの一部を囲む。コネクタフレーム３４は、ハウジング２１から離間している。 FIG. 2 is a perspective view showing the ECU 15, case 22, and cover 24 of this embodiment in a separated state. The side wall 32 extends in the +Z direction from the edge of the intermediate wall 31 and surrounds the surface 31a. The side wall 33 extends in the -Z direction from the surface 31b and surrounds a portion of the surface 31b. The side wall 33 extends from the surface 31b toward the side surface 21a of the housing 21 and abuts against the side surface 21a. The connector frame 34 extends in the -Z direction from the surface 31b outside the side wall 33 and surrounds a portion of the surface 31b. The connector frame 34 is spaced apart from the housing 21.
　図１に示すように、ガイド３５は、側壁３２の内側に位置し、中間壁３１の表面３１ａから略＋Ｚ方向に突出する。ガイド３５は、例えば、略円柱状の突起である。なお、ガイド３５は、例えば、略円筒状に形成されても良い。 As shown in FIG. 1, the guide 35 is located inside the side wall 32 and protrudes from the surface 31a of the intermediate wall 31 in approximately the +Z direction. The guide 35 is, for example, a substantially cylindrical protrusion. Note that the guide 35 may also be formed, for example, in a substantially cylindrical shape.
　複数の接続部品２３は、例えばインサート成形により、ケース２２に組み込まれる。複数の接続部品２３は、複数のピン３７と、バスバー３８と含む。バスバー３８は、金属部材の一例である。複数の接続部品２３は、種々の回路のような他の部品を含んでも良い。 The multiple connection parts 23 are assembled into the case 22, for example, by insert molding. The multiple connection parts 23 include multiple pins 37 and a bus bar 38. The bus bar 38 is an example of a metal member. The multiple connection parts 23 may also include other components, such as various circuits.
　複数のピン３７及びバスバー３８は、導電性の金属により作られる。複数のピン３７のうち少なくとも一つは、中間壁３１の表面３１ａから略＋Ｚ方向に突出している。複数のピン３７のうち少なくとも他の一つは、中間壁３１の表面３１ｂから－Ｚ方向に突出している。バスバー３８は、表面３１ａの近傍において、中間壁３１に組み込まれる。 The multiple pins 37 and bus bar 38 are made of conductive metal. At least one of the multiple pins 37 protrudes from surface 31a of intermediate wall 31 in approximately the +Z direction. At least another of the multiple pins 37 protrudes from surface 31b of intermediate wall 31 in the -Z direction. The bus bar 38 is embedded in intermediate wall 31 near surface 31a.
　カバー２４は、例えば導電性の金属によって作られる。なお、カバー２４の一部が合成樹脂のような絶縁性の材料で作られても良い。すなわち、カバー２４は、少なくとも部分的に金属で作られる。 The cover 24 is made of, for example, a conductive metal. Note that a portion of the cover 24 may be made of an insulating material such as a synthetic resin. In other words, the cover 24 is at least partially made of metal.
　カバー２４は、ケース２２の側壁３２に取り付けられる。これにより、カバー２４は、ケース２２を介して間接的にハウジング２１に取り付けられる。なお、カバー２４は、直接的にハウジング２１に取り付けられても良い。 The cover 24 is attached to the side wall 32 of the case 22. As a result, the cover 24 is indirectly attached to the housing 21 via the case 22. Note that the cover 24 may also be attached directly to the housing 21.
　カバー２４は、内面２４ａを有する。内面２４ａは、間隔を介して中間壁３１の表面３１ａに向く。カバー２４の一部が絶縁性の材料で作られる場合、内面２４ａの少なくとも一部が金属で作られる。 The cover 24 has an inner surface 24a. The inner surface 24a faces the surface 31a of the intermediate wall 31 via a gap. When a portion of the cover 24 is made of an insulating material, at least a portion of the inner surface 24a is made of a metal.
　筐体１１に、内部空間Ｓが設けられる。内部空間Ｓは、筐体１１によって囲まれた空間であり、ハウジング２１とカバー２４との間に位置する。すなわち、カバー２４は、内部空間Ｓを覆う。ハウジング２１の側面２１ａと、カバー２４の内面２４ａとは、内部空間Ｓに面する。電磁弁１４、ＥＣＵ１５、及びコイルバネ１６は、内部空間Ｓに収容される。 An internal space S is provided in the housing 11. The internal space S is a space surrounded by the housing 11, and is located between the housing 21 and the cover 24. In other words, the cover 24 covers the internal space S. The side surface 21a of the housing 21 and the inner surface 24a of the cover 24 face the internal space S. The solenoid valve 14, the ECU 15, and the coil spring 16 are housed in the internal space S.
　内部空間Ｓは、ハウジング２１とケース２２との間の部分と、ケース２２とカバー２４との間の部分とを有する。しかし、内部空間Ｓの当該二つの部分は、中間壁３１に設けられた孔を通じて互いに連通する。 The internal space S has a portion between the housing 21 and the case 22, and a portion between the case 22 and the cover 24. However, these two portions of the internal space S communicate with each other through a hole provided in the intermediate wall 31.
　ポンプ１２は、例えばギヤポンプである。なお、ポンプ１２は、他の種類のポンプであっても良い。ポンプ１２は、例えばハウジング２１の流路を通じて、ブレーキ装置の液路にブレーキ液を送ることができる。 The pump 12 is, for example, a gear pump. However, the pump 12 may be another type of pump. The pump 12 can send brake fluid to a fluid path of a brake device, for example, through a flow path in the housing 21.
　モータ１３は、例えば、三相ブラシレスモータである。なお、モータ１３は、他の種類のモータであっても良い。モータ１３は、ハウジング２１の側面２１ｂに取り付けられる。モータ１３は、ポンプ１２の回転子を駆動する。 The motor 13 is, for example, a three-phase brushless motor. However, the motor 13 may be another type of motor. The motor 13 is attached to the side surface 21b of the housing 21. The motor 13 drives the rotor of the pump 12.
　ハウジング２１と側壁３３との間の隙間、側壁３２とカバー２４との間の隙間、及びモータ１３とハウジング２１との間の隙間は、例えば、ガスケットにより封止されても良い。これにより、内部空間Ｓは、液密に封止される。 The gap between the housing 21 and the side wall 33, the gap between the side wall 32 and the cover 24, and the gap between the motor 13 and the housing 21 may be sealed, for example, by a gasket. This makes the internal space S liquid-tight.
　複数の電磁弁１４のそれぞれは、例えば、差圧制御弁、増圧制御弁、又は減圧制御弁である。電磁弁１４は、当該電磁弁１４のソレノイドに電流を流されることで、ハウジング２１の流路を開放し又は閉鎖する。電磁弁１４は、当該電磁弁１４の上流の流路と下流の流路との間で圧力差を生じさせても良い。 Each of the multiple solenoid valves 14 is, for example, a differential pressure control valve, a pressure increase control valve, or a pressure reduction control valve. The solenoid valve 14 opens or closes the flow path of the housing 21 by passing a current through the solenoid of the solenoid valve 14. The solenoid valve 14 may generate a pressure difference between the flow path upstream and downstream of the solenoid valve 14.
　ＥＣＵ１５は、基板４１と、電子部品４２と、コンデンサ４３とを有する。基板４１は、例えば、プリント回路板（ＰＣＢ）である。なお、基板４１は、他の種類の基板であっても良い。 The ECU 15 has a substrate 41, electronic components 42, and a capacitor 43. The substrate 41 is, for example, a printed circuit board (PCB). However, the substrate 41 may be another type of substrate.
　基板４１は、Ｚ方向と略直交する板状に形成される。基板４１は、ケース２２の中間壁３１とカバー２４との間に位置し、例えばケース２２に取り付けられる。基板４１は、二つの表面４１ａ，４１ｂと外縁４１ｃとを有する。 The substrate 41 is formed in a plate shape that is approximately perpendicular to the Z direction. The substrate 41 is located between the intermediate wall 31 of the case 22 and the cover 24, and is attached to the case 22, for example. The substrate 41 has two surfaces 41a, 41b and an outer edge 41c.
　表面４１ａは、略平坦に形成され、略＋Ｚ方向に向く。表面４１ａは、間隔を介してカバー２４の内面２４ａに向く。表面４１ｂは、表面４１ａの反対側に位置する。表面４１ｂは、略平坦に形成され、略－Ｚ方向に向く。表面４１ｂは、間隔を介して中間壁３１の表面３１ａに向く。外縁４１ｃは、表面４１ａの縁と表面４１ｂの縁との間に設けられ、Ｚ方向と略直交する方向に向く。 Surface 41a is formed to be approximately flat and faces approximately in the +Z direction. Surface 41a faces the inner surface 24a of cover 24 via a gap. Surface 41b is located on the opposite side of surface 41a. Surface 41b is formed to be approximately flat and faces approximately in the -Z direction. Surface 41b faces surface 31a of intermediate wall 31 via a gap. Outer edge 41c is provided between the edge of surface 41a and the edge of surface 41b, and faces in a direction approximately perpendicular to the Z direction.
　中間壁３１の表面３１ａから突出する複数のピン３７が、例えばプレスフィットにより、基板４１に設けられたスルーホールに接合される。基板４１は、当該ピン３７を介して、モータ１３及び電磁弁１４のソレノイドに電気的に接続される。なお、基板４１は、他の方法によってモータ１３及び電磁弁１４に電気的に接続されても良い。 A number of pins 37 protruding from the surface 31a of the intermediate wall 31 are joined, for example by press-fitting, to through holes provided in the substrate 41. The substrate 41 is electrically connected to the motor 13 and the solenoid of the solenoid valve 14 via the pins 37. Note that the substrate 41 may also be electrically connected to the motor 13 and the solenoid valve 14 by other methods.
　電子部品４２は、例えば、ＩＣ、マイコン、及び他の種々の部品を含む。電子部品４２及びコンデンサ４３は、基板４１に実装される。ＥＣＵ１５は、基板４１の配線、電子部品４２、及びコンデンサ４３により形成される電子回路を有する。当該電子回路は、接続部品２３を通じてモータ１３及び電磁弁１４の駆動を制御する。なお、当該電子回路は、他の部品を有しても良い。 The electronic components 42 include, for example, an IC, a microcomputer, and various other components. The electronic components 42 and the capacitor 43 are mounted on the substrate 41. The ECU 15 has an electronic circuit formed by the wiring of the substrate 41, the electronic components 42, and the capacitor 43. The electronic circuit controls the operation of the motor 13 and the solenoid valve 14 through the connection components 23. The electronic circuit may also have other components.
　図３は、本実施形態の液圧制御装置１０の一部を示す断面図である。図３に示すように、基板４１に、第１の貫通孔５１と、第２の貫通孔５２とが設けられる。第１の貫通孔５１及び第２の貫通孔５２のそれぞれは、略Ｚ方向に基板４１を貫通し、表面４１ａ，４１ｂに開口する。 FIG. 3 is a cross-sectional view showing a portion of the hydraulic control device 10 of this embodiment. As shown in FIG. 3, a first through hole 51 and a second through hole 52 are provided in the substrate 41. The first through hole 51 and the second through hole 52 each penetrate the substrate 41 approximately in the Z direction and open to the surfaces 41a, 41b.
　第１の貫通孔５１は、基板４１の外縁４１ｃの近傍に設けられる。第１の貫通孔５１の断面は、例えば略円形に形成される。第１の貫通孔５１の直径は、例えば、約４ｍｍである。 The first through hole 51 is provided near the outer edge 41c of the substrate 41. The cross section of the first through hole 51 is, for example, substantially circular. The diameter of the first through hole 51 is, for example, approximately 4 mm.
　第２の貫通孔５２は、第１の貫通孔５１から離間している。第２の貫通孔５２の断面は、略円形に形成されても良いし、他の形状に形成されても良い。第２の貫通孔５２は、第１の貫通孔５１よりも小さい。例えば、第２の貫通孔５２の直径は、約１ｍｍである。なお、第１の貫通孔５１及び第２の貫通孔５２の大きさは、この例に限られない。 The second through hole 52 is spaced apart from the first through hole 51. The cross section of the second through hole 52 may be formed to be approximately circular or may be formed to be another shape. The second through hole 52 is smaller than the first through hole 51. For example, the diameter of the second through hole 52 is approximately 1 mm. Note that the sizes of the first through hole 51 and the second through hole 52 are not limited to this example.
　基板４１は、例えば、いわゆる両面基板であり、ベース層６１と、二つの導電層６２，６３と、二つのカバー層６４，６５とを有する。なお、基板４１はこの例に限られず、三つ以上の導電層を有する多層板であっても良い。 The substrate 41 is, for example, a so-called double-sided substrate, and has a base layer 61, two conductive layers 62, 63, and two cover layers 64, 65. Note that the substrate 41 is not limited to this example, and may be a multilayer board having three or more conductive layers.
　ベース層６１は、例えば、ＦＲ－４のような絶縁性の板である。ベース層６１は、二つの平面６１ａ，６１ｂを有する。平面６１ａは、略＋Ｚ方向に向く。平面６１ｂは、平面６１ａの反対側に位置し、略－Ｚ方向に向く。 The base layer 61 is an insulating plate such as FR-4. The base layer 61 has two planes 61a and 61b. The plane 61a faces approximately in the +Z direction. The plane 61b is located on the opposite side of the plane 61a and faces approximately in the -Z direction.
　導電層６２，６３は、例えば銅のような導電性の金属で作られる。導電層６２は、平面６１ａに設けられる。導電層６３は、平面６１ｂに設けられる。例えば、導電層６３は、グランド層７１と、接続層７２とを有する。 The conductive layers 62 and 63 are made of a conductive metal such as copper. The conductive layer 62 is provided on the plane 61a. The conductive layer 63 is provided on the plane 61b. For example, the conductive layer 63 has a ground layer 71 and a connection layer 72.
　グランド層７１は、導電層６３のうち、基板４１において実質的にグランド電位（基準電位）に設定される導体である。グランド電位は、例えば、車両の車体と同一の電位である。グランド層７１は、例えば、グランドプレーンと、当該グランドプレーンに接続されるグランド配線と、当該グランド配線に接続されるグランド端子とを有する。 The ground layer 71 is a conductor of the conductive layer 63 that is set to a ground potential (reference potential) on the substrate 41. The ground potential is, for example, the same potential as the body of the vehicle. The ground layer 71 has, for example, a ground plane, a ground wiring connected to the ground plane, and a ground terminal connected to the ground wiring.
　図１に示すように、例えば、複数のピン３７のうち少なくとも一つは、中間壁３１を貫通し、コネクタフレーム３４に囲まれる。コネクタフレーム３４と、当該コネクタフレーム３４に囲まれたピン３７とは、コネクタＣを形成する。コネクタＣに含まれるピン３７のうち少なくとも一つは、グランド層７１に電気的に接続される。 As shown in FIG. 1, for example, at least one of the multiple pins 37 penetrates the intermediate wall 31 and is surrounded by the connector frame 34. The connector frame 34 and the pins 37 surrounded by the connector frame 34 form a connector C. At least one of the pins 37 included in the connector C is electrically connected to the ground layer 71.
　コネクタＣに、ワイヤハーネスＷが接続される。グランド層７１は、ピン３７及びワイヤハーネスＷを介して、例えば車体に電気的に接続される。これにより、グランド層７１は接地される。なお、グランド層７１は、他の方法により接地されても良い。 A wire harness W is connected to the connector C. The ground layer 71 is electrically connected to, for example, the vehicle body via the pin 37 and the wire harness W. This allows the ground layer 71 to be grounded. Note that the ground layer 71 may also be grounded by other methods.
　図３に示すように、接続層７２は、グランド層７１から離間している。このため、グランド層７１の電位と接続層７２の電位とが互いに異なることがあっても良い。接続層７２は、例えば、接続端子７５と、実装端子７６と、接続配線７７とを有する。 As shown in FIG. 3, the connection layer 72 is separated from the ground layer 71. Therefore, the potential of the ground layer 71 and the potential of the connection layer 72 may be different from each other. The connection layer 72 has, for example, a connection terminal 75, a mounting terminal 76, and a connection wiring 77.
　接続端子７５は、例えば、平面６１ｂのうち第２の貫通孔５２の縁に接する領域と、第２の貫通孔５２の内面と、に設けられた、いわゆるスルーホールメッキである。第２の貫通孔５２及び接続端子７５は、スルーホールＨを形成する。実装端子７６は、接続端子７５から離間している。実装端子７６は、例えば表面実装に用いられるパッドであるが、スルーホールであっても良い。接続配線７７は、接続端子７５と実装端子７６とを接続する。 The connection terminal 75 is, for example, a so-called through-hole plating provided on an area of the plane 61b that contacts the edge of the second through hole 52 and on the inner surface of the second through hole 52. The second through hole 52 and the connection terminal 75 form a through hole H. The mounting terminal 76 is spaced apart from the connection terminal 75. The mounting terminal 76 is, for example, a pad used for surface mounting, but may also be a through hole. The connection wiring 77 connects the connection terminal 75 and the mounting terminal 76.
　カバー層６４，６５は、例えば、ソルダーレジストである。カバー層６４は、ベース層６１の平面６１ａと、導電層６２の一部とを覆う。カバー層６５は、ベース層６１の平面６１ｂと、導電層６３の一部とを覆う。例えば、カバー層６５は、グランド層７１のグランド端子と、接続端子７５と、実装端子７６とを露出させる。 The cover layers 64 and 65 are, for example, solder resist. The cover layer 64 covers the flat surface 61a of the base layer 61 and a part of the conductive layer 62. The cover layer 65 covers the flat surface 61b of the base layer 61 and a part of the conductive layer 63. For example, the cover layer 65 exposes the ground terminal of the ground layer 71, the connection terminal 75, and the mounting terminal 76.
　基板４１の表面４１ａは、カバー層６４と、カバー層６４によって露出されたベース層６１の平面６１ａ及び導電層６２の一部とによって形成される。基板４１の表面４１ｂは、カバー層６５と、カバー層６５によって露出されたベース層６１の平面６１ｂ及び導電層６３の一部とによって形成される。なお、表面４１ａ，４１ｂはこの例に限られない。 The surface 41a of the substrate 41 is formed by the cover layer 64, the flat surface 61a of the base layer 61 exposed by the cover layer 64, and a part of the conductive layer 62. The surface 41b of the substrate 41 is formed by the cover layer 65, the flat surface 61b of the base layer 61 exposed by the cover layer 65, and a part of the conductive layer 63. Note that the surfaces 41a and 41b are not limited to this example.
　導電層６２，６３を含む基板４１の導電体は、第１の貫通孔５１から離間している。このため、第１の貫通孔５１の内面は、絶縁性の材料で作られる。例えば、導電層６２，６３のそれぞれと、第１の貫通孔５１の縁との間の距離は、コイルバネ１６の線の直径（線径）よりも長い。 The conductor of the substrate 41, including the conductive layers 62 and 63, is spaced apart from the first through hole 51. For this reason, the inner surface of the first through hole 51 is made of an insulating material. For example, the distance between each of the conductive layers 62 and 63 and the edge of the first through hole 51 is longer than the wire diameter (wire diameter) of the coil spring 16.
　第１の貫通孔５１と基板４１の外縁４１ｃとの間には、電気信号が流れる信号配線や電子部品は設けられない。ただし、グランド層７１は、第１の貫通孔５１と基板４１の外縁４１ｃとの間に設けられても良い。例えば、グランド層７１のグランドプレーンが、第１の貫通孔５１と基板４１の外縁４１ｃとの間に設けられる。 No signal wiring or electronic components through which electrical signals flow are provided between the first through hole 51 and the outer edge 41c of the substrate 41. However, the ground layer 71 may be provided between the first through hole 51 and the outer edge 41c of the substrate 41. For example, the ground plane of the ground layer 71 is provided between the first through hole 51 and the outer edge 41c of the substrate 41.
　バスバー３８は、支持壁８１と、ピン８２とを有する。支持壁８１は、中間壁３１の表面３１ａに沿って配置された板状に形成される。支持壁８１は、支持面８１ａを有する。支持面８１ａは、略平坦に形成され、略＋Ｚ方向に向く。 The busbar 38 has a support wall 81 and a pin 82. The support wall 81 is formed in a plate shape arranged along the surface 31a of the intermediate wall 31. The support wall 81 has a support surface 81a. The support surface 81a is formed to be approximately flat and faces approximately in the +Z direction.
　支持壁８１は、表面３１ａ上に設けられても良いし、中間壁３１に部分的に埋まっても良い。支持壁８１が中間壁３１に埋まる場合、支持面８１ａは、中間壁３１の外部に露出する。支持面８１ａの一部は、基板４１の第１の貫通孔５１に向く。 The support wall 81 may be provided on the surface 31a, or may be partially embedded in the intermediate wall 31. When the support wall 81 is embedded in the intermediate wall 31, the support surface 81a is exposed to the outside of the intermediate wall 31. A portion of the support surface 81a faces the first through hole 51 of the substrate 41.
　支持壁８１に、挿通孔８５が設けられる。挿通孔８５は、支持壁８１を略Ｚ方向に貫通し、支持面８１ａに開口する。挿通孔８５は、略円形の断面を有する。なお、挿通孔８５の形状は、この例に限られない。 A through hole 85 is provided in the support wall 81. The through hole 85 penetrates the support wall 81 in approximately the Z direction and opens to the support surface 81a. The through hole 85 has a substantially circular cross section. Note that the shape of the through hole 85 is not limited to this example.
　ガイド３５は、挿通孔８５を通って延びている。ガイド３５、第１の貫通孔５１、及び挿通孔８５は、共通の中心軸を有し、同軸（同心）に配置される。このため、ガイド３５は、第１の貫通孔５１に向かって延びている。なお、ガイド３５、第１の貫通孔５１、及び挿通孔８５のそれぞれの中心軸が、互いにズレていても良い。 The guide 35 extends through the insertion hole 85. The guide 35, the first through hole 51, and the insertion hole 85 have a common central axis and are arranged coaxially (concentrically). Therefore, the guide 35 extends toward the first through hole 51. Note that the respective central axes of the guide 35, the first through hole 51, and the insertion hole 85 may be misaligned with each other.
　ガイド３５の直径は、第１の貫通孔５１の直径よりも小さい。Ｚ方向におけるガイド３５の長さは、中間壁３１の表面３１ａと基板４１の表面４１ｂとの間の距離よりも短い。ガイド３５は、第１の貫通孔５１には挿入されない。このように、ガイド３５は、基板４１から離間している。なお、ガイド３５の一部が第１の貫通孔５１の内部に配置されても良い。 The diameter of the guide 35 is smaller than the diameter of the first through hole 51. The length of the guide 35 in the Z direction is shorter than the distance between the surface 31a of the intermediate wall 31 and the surface 41b of the substrate 41. The guide 35 is not inserted into the first through hole 51. In this way, the guide 35 is spaced apart from the substrate 41. Note that a portion of the guide 35 may be disposed inside the first through hole 51.
　ピン８２は、挿通孔８５から離間した位置で、支持壁８１から略＋Ｚ方向に延びている。ピン８２は、第２の貫通孔５２を通って延びるとともに、接続端子７５に接合される。例えば、ピン８２は、プレスフィットにより接続端子７５に接合される。すなわち、ピン８２は、第２の貫通孔５２に圧入され、第２の貫通孔５２の内面に設けられた接続端子７５に当接する。なお、ピン８２は、例えば半田によって接続端子７５に接合されても良い。 The pin 82 extends from the support wall 81 in approximately the +Z direction at a position spaced apart from the insertion hole 85. The pin 82 extends through the second through hole 52 and is joined to the connection terminal 75. For example, the pin 82 is joined to the connection terminal 75 by press-fitting. That is, the pin 82 is pressed into the second through hole 52 and abuts against the connection terminal 75 provided on the inner surface of the second through hole 52. The pin 82 may also be joined to the connection terminal 75 by, for example, soldering.
　コイルバネ１６は、金属のような導電性の材料によって作られる。コイルバネ１６の線径、内径、外径、及びピッチは略一定である。コイルバネ１６の外径は、第１の貫通孔５１の直径よりも小さい。コイルバネ１６の内径は、ガイド３５の直径よりも大きい。なお、コイルバネ１６の寸法は、この例に限られない。 The coil spring 16 is made of a conductive material such as metal. The wire diameter, inner diameter, outer diameter, and pitch of the coil spring 16 are approximately constant. The outer diameter of the coil spring 16 is smaller than the diameter of the first through hole 51. The inner diameter of the coil spring 16 is larger than the diameter of the guide 35. Note that the dimensions of the coil spring 16 are not limited to this example.
　コイルバネ１６は、第１の貫通孔５１を通って略Ｚ方向に延びている。言い換えると、コイルバネ１６は、基板４１を貫通して延びている。コイルバネ１６は、第１の貫通孔５１の内面から離間している。このため、コイルバネ１６は、基板４１から離間している。なお、コイルバネ１６は、第１の貫通孔５１の内面に接触しても良い。この場合、第１の貫通孔５１の内面は、コイルバネ１６を支持し、コイルバネ１６の座屈を抑制できる。 The coil spring 16 extends through the first through hole 51 in approximately the Z direction. In other words, the coil spring 16 extends through the substrate 41. The coil spring 16 is spaced apart from the inner surface of the first through hole 51. Therefore, the coil spring 16 is spaced apart from the substrate 41. The coil spring 16 may be in contact with the inner surface of the first through hole 51. In this case, the inner surface of the first through hole 51 supports the coil spring 16 and can suppress buckling of the coil spring 16.
　コイルバネ１６の一方の端部１６ａは、カバー２４の内面２４ａに接触する。カバー２４が部分的に金属で作られる場合、端部１６ａは、内面２４ａのうち金属で作られた部分に接触する。コイルバネ１６の他方の端部１６ｂは、支持壁８１の支持面８１ａに接触する。なお、コイルバネ１６は、端部１６ａ，１６ｂとは異なる部分でカバー２４及びバスバー３８に接触しても良い。 One end 16a of the coil spring 16 contacts the inner surface 24a of the cover 24. If the cover 24 is partially made of metal, the end 16a contacts the part of the inner surface 24a that is made of metal. The other end 16b of the coil spring 16 contacts the support surface 81a of the support wall 81. Note that the coil spring 16 may contact the cover 24 and the bus bar 38 at a part other than the ends 16a and 16b.
　コイルバネ１６は、カバー２４の内面２４ａと支持壁８１の支持面８１ａとの間で圧縮される。このため、コイルバネ１６は、内面２４ａを略＋Ｚ方向に押し、支持面８１ａを略－Ｚ方向に押す。 The coil spring 16 is compressed between the inner surface 24a of the cover 24 and the support surface 81a of the support wall 81. As a result, the coil spring 16 presses the inner surface 24a in approximately the +Z direction and presses the support surface 81a in approximately the -Z direction.
　円柱状のガイド３５は、端部１６ｂを通ってコイルバネ１６の内部に挿入されている。すなわち、ガイド３５は、コイルバネ１６の内側に配置される。これにより、ガイド３５は、コイルバネ１６を支持し、コイルバネ１６の座屈を抑制する。なお、円筒形のガイド３５がコイルバネ１６を囲むことで、コイルバネ１６の座屈を抑制しても良い。 The cylindrical guide 35 is inserted into the inside of the coil spring 16 through the end 16b. In other words, the guide 35 is disposed inside the coil spring 16. In this way, the guide 35 supports the coil spring 16 and suppresses buckling of the coil spring 16. Note that the cylindrical guide 35 may surround the coil spring 16 to suppress buckling of the coil spring 16.
　導電層６２，６３が第１の貫通孔５１から離間しているため、コイルバネ１６も、導電層６２，６３から離間している。一方、コイルバネ１６は、カバー２４に導通するとともに、バスバー３８に導通する。このため、コイルバネ１６は、カバー２４とバスバー３８とを互いに導通させる。 Since the conductive layers 62, 63 are spaced apart from the first through hole 51, the coil spring 16 is also spaced apart from the conductive layers 62, 63. Meanwhile, the coil spring 16 is conductive to the cover 24 and also conductive to the bus bar 38. Therefore, the coil spring 16 provides electrical conductivity between the cover 24 and the bus bar 38.
　コンデンサ４３は、例えば、グランド層７１のグランド端子と、接続層７２の実装端子７６とに接続される。これにより、グランド層７１と接続端子７５とは、コンデンサ４３を介して互いに電気的に接続される。さらに、グランド層７１は、コンデンサ４３及び接続端子７５を介してバスバー３８に電気的に接続される。 The capacitor 43 is connected, for example, to the ground terminal of the ground layer 71 and the mounting terminal 76 of the connection layer 72. As a result, the ground layer 71 and the connection terminal 75 are electrically connected to each other via the capacitor 43. Furthermore, the ground layer 71 is electrically connected to the bus bar 38 via the capacitor 43 and the connection terminal 75.
　以上より、カバー２４は、コイルバネ１６と、バスバー３８と、接続端子７５を含む接続層７２と、コンデンサ４３と、グランド層７１とを介して接地される。これにより、例えば静電気に起因してカバー２４に生じた電荷は、除去される。 As a result, the cover 24 is grounded via the coil spring 16, the bus bar 38, the connection layer 72 including the connection terminal 75, the capacitor 43, and the ground layer 71. This allows the charge generated in the cover 24 due to, for example, static electricity to be removed.
　なお、カバー２４は、他の経路を通じて接地されても良い。例えば、バスバー３８は、ハウジング２１とケース２２とを結合するネジが通過する図２のカラー９０に電気的に接続されても良い。 The cover 24 may also be grounded through other paths. For example, the bus bar 38 may be electrically connected to the collar 90 in FIG. 2 through which the screw that connects the housing 21 and the case 22 passes.
　カラー９０は、内部空間Ｓの外部において、ケース２２に組み込まれる。ネジは、カラー９０を通過してハウジング２１に捻じ込まれることで、カラー９０とハウジング２１とを互いに導通させる。これにより、カバー２４は、コイルバネ１６と、バスバー３８と、カラー９０と、ネジと、ハウジング２１とを介して、車体に電気的に接続される。 The collar 90 is assembled into the case 22 outside the internal space S. The screw passes through the collar 90 and is screwed into the housing 21, thereby making the collar 90 and the housing 21 conductive to each other. As a result, the cover 24 is electrically connected to the vehicle body via the coil spring 16, the bus bar 38, the collar 90, the screw, and the housing 21.
　液圧制御装置１０の製造時において、第１の貫通孔５１は、ＥＣＵ１５の基準孔として用いられる。例えば、ケース２２にＥＣＵ１５が搭載されるとき、治具が第１の貫通孔５１に挿入され、又は第１の貫通孔５１が画像認識の基準として設定される。これにより、ケース２２に対するＥＣＵ１５の位置がより正確に設定され、例えばピン８２が第２の貫通孔５２に適切に挿入されることができる。 When manufacturing the hydraulic control device 10, the first through hole 51 is used as a reference hole for the ECU 15. For example, when the ECU 15 is mounted in the case 22, a jig is inserted into the first through hole 51, or the first through hole 51 is set as a reference for image recognition. This allows the position of the ECU 15 relative to the case 22 to be set more accurately, and for example, the pin 82 can be properly inserted into the second through hole 52.
　ＥＣＵ１５がケース２２に搭載されると、例えば治具が第１の貫通孔５１から抜かれる。第１の貫通孔５１は、電気的接続のために利用されるスルーホールではなく、ネジが通る孔でもない。本実施形態の液圧制御装置１０は、基準孔である第１の貫通孔５１を、コイルバネ１６に貫通される孔として用いる。 When the ECU 15 is mounted in the case 22, for example, a jig is removed from the first through hole 51. The first through hole 51 is not a through hole used for electrical connection, nor is it a hole through which a screw passes. The hydraulic control device 10 of this embodiment uses the first through hole 51, which is a reference hole, as a hole through which the coil spring 16 passes.
　以上説明された実施形態に係る液圧制御装置１０において、第１の貫通孔５１は、導電層６２，６３から離間している。コイルバネ１６は、第１の貫通孔５１を通り、導電層６２，６３から離間している。筐体１１のカバー２４は、圧縮されたコイルバネ１６に接触するとともに、当該コイルバネ１６を通じて接地される。これにより、コイルバネ１６は、例えば静電気によるカバー２４の帯電が基板４１に実装された電子部品４２の動作に影響することを抑制できる。また、コイルバネ１６は、導電層６２，６３から離間しているため、第１の貫通孔５１の周辺において基板４１の導電層６２，６３に接続される必要がない。このため、基板４１は、コイルバネ１６に接続されるランドを有する必要が無く、種々の電子部品が実装され又は信号配線が設けられる当該基板４１の実装領域が当該ランドを設けることによって減少してしまうことを抑制できる。さらに、基板４１は、ランドを設けることによる実装領域の減少を補うように大型化又は多層化する必要が無く、大型化又は多層化によるコストの増加を抑制できる。 In the hydraulic control device 10 according to the embodiment described above, the first through hole 51 is spaced apart from the conductive layers 62, 63. The coil spring 16 passes through the first through hole 51 and is spaced apart from the conductive layers 62, 63. The cover 24 of the housing 11 contacts the compressed coil spring 16 and is grounded through the coil spring 16. This allows the coil spring 16 to suppress the effect of the charging of the cover 24 due to static electricity, for example, on the operation of the electronic components 42 mounted on the board 41. In addition, since the coil spring 16 is spaced apart from the conductive layers 62, 63, it is not necessary to connect the coil spring 16 to the conductive layers 62, 63 of the board 41 around the first through hole 51. For this reason, the board 41 does not need to have a land connected to the coil spring 16, and it is possible to suppress the reduction in the mounting area of the board 41 on which various electronic components are mounted or signal wiring is provided, due to the provision of the land. Furthermore, the substrate 41 does not need to be enlarged or multi-layered to compensate for the reduction in mounting area caused by providing lands, and the increase in cost due to enlargement or multi-layering can be suppressed.
　ガイド３５は、基板４１から離間し、コイルバネ１６を囲み又はコイルバネ１６の内側に配置され、当該コイルバネ１６を支持する。これにより、ガイド３５は、コイルバネ１６の座屈を抑制できる。さらに、ガイド３５は、基板４１に設けられないため、基板４１の実装領域が当該ガイド３５を設けることによって減少してしまうことを抑制できる。 The guide 35 is spaced apart from the substrate 41 and surrounds or is disposed inside the coil spring 16 to support the coil spring 16. This allows the guide 35 to suppress buckling of the coil spring 16. Furthermore, because the guide 35 is not provided on the substrate 41, it is possible to suppress a reduction in the mounting area of the substrate 41 due to the provision of the guide 35.
　バスバー３８は、コイルバネ１６に接触する。コイルバネ１６は、カバー２４と、バスバー３８と、の間で圧縮される。導電層６３は、バスバー３８に電気的に接続されるとともに接地されたグランド層７１を有する。すなわち、カバー２４は、コイルバネ１６と、バスバー３８と、基板４１のグランド層７１とを通じて接地される。これにより、液圧制御装置１０は、カバー２４と基板４１のグランド層７１との間に電位差が生じることを抑制でき、当該電位差が基板４１に実装された電子部品４２の動作に影響することを抑制できる。さらに、液圧制御装置１０は、コイルバネ１６とランドとの接触とは異なる方法でカバー２４とグランド層７１とを電気的に接続することができ、基板４１の実装領域がランドを設けることによって減少してしまうことを抑制できる。 The bus bar 38 contacts the coil spring 16. The coil spring 16 is compressed between the cover 24 and the bus bar 38. The conductive layer 63 has a ground layer 71 that is electrically connected to the bus bar 38 and is grounded. That is, the cover 24 is grounded through the coil spring 16, the bus bar 38, and the ground layer 71 of the substrate 41. This allows the hydraulic control device 10 to suppress the occurrence of a potential difference between the cover 24 and the ground layer 71 of the substrate 41, and suppresses the potential difference from affecting the operation of the electronic components 42 mounted on the substrate 41. Furthermore, the hydraulic control device 10 can electrically connect the cover 24 and the ground layer 71 in a manner other than the contact between the coil spring 16 and the land, and suppresses the mounting area of the substrate 41 from being reduced by providing the land.
　基板４１に、第１の貫通孔５１よりも小さい第２の貫通孔５２が設けられる。導電層６２，６３は、接続端子７５を有する。接続端子７５は、第２の貫通孔５２の内面及び第２の貫通孔５２の縁に接する領域のうち少なくとも一方に設けられるとともに、グランド層７１に電気的に接続される。バスバー３８は、第２の貫通孔５２を通って延びるとともに接続端子７５に接合されたピン３７を有する。すなわち、バスバー３８が基板４１に接続されるものの、バスバー３８と基板４１との接続に用いられるスルーホールＨ（第２の貫通孔５２及び接続端子７５）は、比較的小さい。これにより、液圧制御装置１０は、コイルバネ１６に接続されるランドが第１の貫通孔５１の周り又は基板４１の表面４１ａに設けられる場合に比べ、基板４１の実装領域が減少してしまうことを抑制できる。 The second through hole 52, which is smaller than the first through hole 51, is provided in the substrate 41. The conductive layers 62, 63 have a connection terminal 75. The connection terminal 75 is provided in at least one of the inner surface of the second through hole 52 and the area contacting the edge of the second through hole 52, and is electrically connected to the ground layer 71. The bus bar 38 has a pin 37 that extends through the second through hole 52 and is joined to the connection terminal 75. That is, although the bus bar 38 is connected to the substrate 41, the through hole H (the second through hole 52 and the connection terminal 75) used to connect the bus bar 38 to the substrate 41 is relatively small. As a result, the hydraulic control device 10 can suppress a reduction in the mounting area of the substrate 41 compared to a case in which the land connected to the coil spring 16 is provided around the first through hole 51 or on the surface 41a of the substrate 41.
　コンデンサ４３は、基板４１に実装される。グランド層７１と接続端子７５とは、コンデンサ４３を介して互いに電気的に接続される。これにより、液圧制御装置１０は、カバー２４のうち金属で作られた部分に短絡が生じたとしても、大電流がグランド層７１に流入することを抑制できる。 The capacitor 43 is mounted on the substrate 41. The ground layer 71 and the connection terminal 75 are electrically connected to each other via the capacitor 43. This allows the hydraulic control device 10 to prevent a large current from flowing into the ground layer 71 even if a short circuit occurs in the metal part of the cover 24.
　以上の実施形態おいて、ガイド３５は、絶縁性の剛性樹脂で作られたケース２２に設けられる。しかし、ガイド３５は、導電性の金属で作られたバスバー３８に設けられても良い。言い換えると、バスバー３８は、挿通孔８５が設けられる代わりに、支持壁８１の支持面８１ａから略＋Ｚ方向に突出するガイド３５を有しても良い。この場合、ガイド３５は、コイルバネ１６を支持するとともに、コイルバネ１６に導通することができる。 In the above embodiment, the guide 35 is provided on the case 22 made of an insulating rigid resin. However, the guide 35 may also be provided on the bus bar 38 made of a conductive metal. In other words, instead of having an insertion hole 85, the bus bar 38 may have a guide 35 that protrudes from the support surface 81a of the support wall 81 in approximately the +Z direction. In this case, the guide 35 supports the coil spring 16 and can be electrically connected to the coil spring 16.
　以上説明された少なくとも一つの実施形態に係る液圧制御装置は、一例として、導電層を有し、前記導電層から離間した第１の貫通孔が設けられた、基板と、前記第１の貫通孔を通り、前記導電層から離間した、コイルバネと、前記基板及び前記コイルバネが収容された内部空間が設けられ、少なくとも部分的に金属で作られるとともに前記内部空間を覆うカバーを有し、当該カバーのうち金属で作られた部分が圧縮された前記コイルバネに接触するとともに当該コイルバネを通じて接地された、筐体と、を備える。よって、一例としては、コイルバネは、例えば静電気によるカバーの帯電が基板に実装された電子部品の動作に影響することを抑制できる。また、コイルバネは、導電層から離間しているため、第１の貫通孔の周辺において基板の導電層に接続される必要がない。このため、基板は、コイルバネに接続されるランドを有する必要が無く、電子部品が実装され又は信号配線が設けられる当該基板の実装領域が当該ランドを設けることによって減少してしまうことを抑制できる。さらに、基板は、ランドを設けることによる実装領域の減少を補うように大型化又は多層化する必要が無く、大型化又は多層化によるコストの増加を抑制できる。 The hydraulic control device according to at least one embodiment described above includes, as an example, a substrate having a conductive layer and a first through hole spaced apart from the conductive layer, a coil spring passing through the first through hole and spaced apart from the conductive layer, and a housing having an internal space in which the substrate and the coil spring are housed, a cover at least partially made of metal and covering the internal space, and a metal portion of the cover contacts the compressed coil spring and is grounded through the coil spring. Thus, as an example, the coil spring can suppress the effect of the charging of the cover due to static electricity, for example, on the operation of electronic components mounted on the substrate. Also, since the coil spring is spaced apart from the conductive layer, it is not necessary to connect the conductive layer of the substrate around the first through hole. Therefore, the substrate does not need to have a land connected to the coil spring, and it is possible to suppress the reduction in the mounting area of the substrate on which electronic components are mounted or signal wiring is provided due to the provision of the land. Furthermore, the board does not need to be enlarged or multi-layered to compensate for the reduction in mounting area caused by providing lands, and the increase in cost due to enlargement or multi-layering can be suppressed.
　上記液圧制御装置は、一例として、前記基板から離間し、前記コイルバネを囲み又は前記コイルバネの内側に配置され、当該コイルバネを支持する、ガイド、をさらに備える。よって、一例としては、ガイドは、コイルバネの座屈を抑制できる。さらに、ガイドは、基板に設けられないため、基板の実装領域が当該ガイドを設けることによって減少してしまうことを抑制できる。 As an example, the hydraulic control device further includes a guide that is spaced apart from the substrate, surrounds the coil spring or is disposed inside the coil spring, and supports the coil spring. Thus, as an example, the guide can suppress buckling of the coil spring. Furthermore, since the guide is not provided on the substrate, it is possible to suppress a reduction in the mounting area of the substrate due to the provision of the guide.
　上記液圧制御装置は、一例として、前記コイルバネに接触する金属部材、をさらに備え、前記コイルバネは、前記カバーのうち金属で作られた部分と、前記金属部材と、の間で圧縮され、前記導電層は、前記金属部材に電気的に接続されるとともに接地されたグランド層を有する。よって、一例としては、カバーのうち金属で作られた部分は、コイルバネと、金属部材と、基板のグランド層とを通じて接地される。これにより、液圧制御装置は、カバーのうち金属で作られた部分と基板のグランド層との間に電位差が生じることを抑制でき、当該電位差が基板に実装された電子部品の動作に影響することを抑制できる。さらに、液圧制御装置は、コイルバネとランドとの接触とは異なる方法でカバーのうち金属で作られた部分とグランド層とを電気的に接続することができ、基板の実装領域がランドを設けることによって減少してしまうことを抑制できる。 The hydraulic control device further includes, as an example, a metal member that contacts the coil spring, and the coil spring is compressed between the metal portion of the cover and the metal member, and the conductive layer has a ground layer that is electrically connected to the metal member and is grounded. Thus, as an example, the metal portion of the cover is grounded through the coil spring, the metal member, and the ground layer of the board. This allows the hydraulic control device to suppress the occurrence of a potential difference between the metal portion of the cover and the ground layer of the board, and to suppress the potential difference from affecting the operation of the electronic components mounted on the board. Furthermore, the hydraulic control device can electrically connect the metal portion of the cover to the ground layer in a manner other than the contact between the coil spring and the land, and can suppress the mounting area of the board from being reduced by providing the land.
　上記液圧制御装置では、一例として、前記基板に、前記第１の貫通孔よりも小さい第２の貫通孔が設けられ、前記導電層は、前記第２の貫通孔の内面及び前記第２の貫通孔の縁に接する領域のうち少なくとも一方に設けられるとともに前記グランド層に電気的に接続された接続端子を有し、前記金属部材は、前記第２の貫通孔を通って延びるとともに前記接続端子に接合されたピンを有する。よって、一例としては、液圧制御装置は、コイルバネに接続されるランドが第１の貫通孔の周り又は基板の表面に設けられる場合に比べ、基板の実装領域が減少してしまうことを抑制できる。 In the above-mentioned hydraulic control device, as one example, a second through hole smaller than the first through hole is provided in the substrate, the conductive layer has a connection terminal provided on at least one of the inner surface of the second through hole and the area contacting the edge of the second through hole and electrically connected to the ground layer, and the metal member has a pin extending through the second through hole and joined to the connection terminal. Thus, as one example, the hydraulic control device can prevent the mounting area of the substrate from being reduced compared to a case in which the land connected to the coil spring is provided around the first through hole or on the surface of the substrate.
　上記液圧制御装置は、一例として、前記基板に実装されたコンデンサ、をさらに備え、前記グランド層と前記接続端子とは、前記コンデンサを介して互いに電気的に接続される。よって、一例としては、液圧制御装置は、カバーのうち金属で作られた部分に短絡が生じたとしても、大電流がグランド層に流入することを抑制できる。 As an example, the hydraulic control device further includes a capacitor mounted on the substrate, and the ground layer and the connection terminal are electrically connected to each other via the capacitor. Therefore, as an example, the hydraulic control device can prevent a large current from flowing into the ground layer even if a short circuit occurs in the metal part of the cover.
　以上の説明において、抑制は、例えば、事象、作用、若しくは影響の発生を防ぐこと、又は事象、作用、若しくは影響の度合いを低減させること、として定義される。また、以上の説明において、制限は、例えば、移動若しくは回転を防ぐこと、又は移動若しくは回転を所定の範囲内で許容するとともに当該所定の範囲を超えた移動若しくは回転を防ぐこと、として定義される。 In the above explanation, suppression is defined as, for example, preventing the occurrence of an event, action, or influence, or reducing the severity of an event, action, or influence. Also, in the above explanation, restriction is defined as, for example, preventing movement or rotation, or allowing movement or rotation within a specified range and preventing movement or rotation beyond the specified range.
　以上、本発明の実施形態を例示したが、上記実施形態および変形例はあくまで一例であって、発明の範囲を限定することは意図していない。上記実施形態や変形例は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、組み合わせ、変更を行うことができる。また、各実施形態や各変形例の構成や形状は、部分的に入れ替えて実施することも可能である。 The above are examples of embodiments of the present invention, but the above embodiments and variations are merely examples and are not intended to limit the scope of the invention. The above embodiments and variations can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, the configurations and shapes of each embodiment and variation can also be partially interchanged in implementation.

Claims (5)

  1. 　導電層を有し、前記導電層から離間した第１の貫通孔が設けられた、基板と、
    　前記第１の貫通孔を通り、前記導電層から離間した、コイルバネと、
    　前記基板及び前記コイルバネが収容された内部空間が設けられ、少なくとも部分的に金属で作られるとともに前記内部空間を覆うカバーを有し、当該カバーのうち金属で作られた部分が圧縮された前記コイルバネに接触するとともに当該コイルバネを通じて接地された、筐体と、
    　を具備する液圧制御装置。     A substrate having a conductive layer and a first through hole spaced apart from the conductive layer;
    a coil spring passing through the first through hole and spaced apart from the conductive layer;
    a housing having an internal space in which the substrate and the coil spring are housed, the housing having a cover at least partially made of metal and covering the internal space, a portion of the cover made of metal being in contact with the compressed coil spring and being grounded through the coil spring;
    A hydraulic control device comprising:
  2. 　前記基板から離間し、前記コイルバネを囲み又は前記コイルバネの内側に配置され、当該コイルバネを支持する、ガイド、
    　をさらに具備する請求項１の液圧制御装置。     a guide spaced apart from the substrate, surrounding the coil spring or disposed inside the coil spring, and supporting the coil spring;
    2. The hydraulic control device of claim 1, further comprising:
  3. 　前記コイルバネに接触する金属部材、
    　をさらに具備し、
    　前記コイルバネは、前記カバーのうち金属で作られた部分と、前記金属部材と、の間で圧縮され、
    　前記導電層は、前記金属部材に電気的に接続されるとともに接地されたグランド層を有する、
    　請求項１又は請求項２の液圧制御装置。     A metal member in contact with the coil spring;
    Further comprising:
    the coil spring is compressed between a portion of the cover made of metal and the metal member,
    The conductive layer has a ground layer electrically connected to the metal member and grounded.
    The hydraulic control device according to claim 1 or 2.
  4. 　前記基板に、前記第１の貫通孔よりも小さい第２の貫通孔が設けられ、
    　前記導電層は、前記第２の貫通孔の内面及び前記第２の貫通孔の縁に接する領域のうち少なくとも一方に設けられるとともに前記グランド層に電気的に接続された接続端子を有し、
    　前記金属部材は、前記第２の貫通孔を通って延びるとともに前記接続端子に接合されたピンを有する、
    　請求項３の液圧制御装置。     a second through hole smaller than the first through hole is provided in the substrate;
    the conductive layer has a connection terminal provided on at least one of an inner surface of the second through hole and a region contacting an edge of the second through hole and electrically connected to the ground layer;
    the metal member has a pin extending through the second through hole and joined to the connection terminal;
    The hydraulic control device according to claim 3.
  5. 　前記基板に実装されたコンデンサ、
    　をさらに具備し、
    　前記グランド層と前記接続端子とは、前記コンデンサを介して互いに電気的に接続される、
    　請求項４の液圧制御装置。     a capacitor mounted on the substrate;
    Further comprising:
    the ground layer and the connection terminal are electrically connected to each other via the capacitor;
    The hydraulic control device according to claim 4.
PCT/JP2023/038525 2022-10-28 2023-10-25 Fluid pressure control device WO2024090481A1 (en)

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JP2022173514A JP2024064719A (en) 2022-10-28 2022-10-28 Hydraulic Pressure Control Device

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187985A (en) * 1997-07-17 1999-03-30 Tektronix Inc Electronic apparatus and its assembling method
JP2019084970A (en) * 2017-11-07 2019-06-06 株式会社デンソー Electronic device and brake fluid pressure control actuator using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187985A (en) * 1997-07-17 1999-03-30 Tektronix Inc Electronic apparatus and its assembling method
JP2019084970A (en) * 2017-11-07 2019-06-06 株式会社デンソー Electronic device and brake fluid pressure control actuator using the same

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