WO2024090267A1 - Electronic component accommodation body and electronic component accommodation body package - Google Patents

Electronic component accommodation body and electronic component accommodation body package Download PDF

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Publication number
WO2024090267A1
WO2024090267A1 PCT/JP2023/037392 JP2023037392W WO2024090267A1 WO 2024090267 A1 WO2024090267 A1 WO 2024090267A1 JP 2023037392 W JP2023037392 W JP 2023037392W WO 2024090267 A1 WO2024090267 A1 WO 2024090267A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
conductor
antenna
rfid tag
component housing
Prior art date
Application number
PCT/JP2023/037392
Other languages
French (fr)
Japanese (ja)
Inventor
博美 村山
信人 山田
奏子 深堀
直徒 池田
Original Assignee
株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2024090267A1 publication Critical patent/WO2024090267A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Definitions

  • the present invention relates to an electronic component storage unit in which multiple electronic components are stored in a bulk case, and an electronic component storage package in which multiple electronic component storage units are packaged.
  • parts reels are labeled with a barcode or two-dimensional code, which allows information about the parts reels as products to be managed.
  • the bulk cases mentioned above are also used for packing multiple items together and shipping, transporting, and storing them in that state.
  • Patent Document 1 discloses a technology for storing electronic components in bulk in a case (bulk case) and managing this bulk case with an RFID tag.
  • the RFID tags are within the range of radio waves, the information on many bulk cases can be read at once even when they are stored inside a box, making shipping management, inventory management, etc. extremely convenient. Also, if the bulk cases are installed directly on the mounter and parts are supplied from the bulk cases, waste from taping reels can be significantly reduced. This also leads to cost reductions.
  • RFID tag on the bulk case can be read directly by the mounter when the bulk case is attached to the mounter, data can be managed from the shipment of parts to production, making many operations more efficient and labor-saving.
  • the object of the present invention is to provide an electronic component storage unit and electronic component storage package in a bulk case that stores electronic components and that allows the communication distance of the RFID to be changed depending on the purpose of reading.
  • an electronic component storage unit includes a bulk case capable of storing multiple electronic components, an RFID tag for identifying the bulk case, and a conductor, the RFID tag having an RFIC and an antenna electrically connected to the RFIC, and the conductor is capable of being displaced relative to the antenna.
  • the electronic component storage package of the present disclosure is characterized in that it comprises a plurality of electronic component storage units, each having the above-described configuration, and a packaging box for packaging the plurality of electronic component storage units, and is configured by packaging the plurality of electronic component storage units in the packaging box.
  • the present invention provides an electronic component storage unit that allows the communication distance of the RFID tag in a bulk case containing electronic components to be changed depending on the purpose of reading. For example, even if multiple bulk cases are in close proximity, it is possible to read the RFID tag of a specific bulk case individually, and it is also possible to read the RFID tags of each bulk case collectively when multiple bulk cases are packed together.
  • FIG. 1 is a diagram showing the structure of an electronic component housing 101 according to the first embodiment in a first state.
  • FIG. 2 is a perspective view of an electronic component housing package 201 that is composed of a plurality of electronic component housings 101 and a packaging box 200 in which the electronic component housings 101 are packaged.
  • FIG. 3 is a diagram showing the structure of electronic component housing 101 in a second state.
  • FIG. 4 is a plan view showing the configuration of the RFID tag 20.
  • FIG. 5 is a diagram showing a structure of an electronic component housing 102 according to the second embodiment in a first state.
  • FIG. 6 is a diagram showing the structure of the electronic component housing 102 in the second state.
  • FIG. 5 is a diagram showing a structure of an electronic component housing 102 according to the second embodiment in a first state.
  • FIG. 7 is a diagram showing the structure of an electronic component housing 103 according to the third embodiment in a second state.
  • FIG. 8 is a vertical cross-sectional view of an electronic component housing 104 according to the fourth embodiment in a first state.
  • FIG. 9 is a vertical cross-sectional view of the electronic component housing 104 in the second state.
  • First Embodiment 1 is a diagram showing the structure of an electronic component housing 101 in a first state according to a first embodiment of the present invention.
  • the upper left diagram in FIG. 1 is a vertical cross-sectional view of the electronic component housing 101
  • the upper right diagram is a right side view of the electronic component housing 101
  • the lower left diagram is a bottom view of the electronic component housing 101.
  • the electronic component storage unit 101 includes a bulk case 2 made of resin. In the orientation shown in FIG. 1, an electronic component storage section SP1 that stores a large number of electronic components 3 is formed in the upper part of the bulk case 2, and a spare space SP2 is formed below this electronic component storage section.
  • the bulk case 2 has an opening 4 for removing electronic components 3.
  • the electronic component storage body 101 has a slider 5 and a lid 6 which are connected to each other and are made of an electrical insulator such as polyethylene (PE).
  • PE polyethylene
  • the lid 6 opens and closes the opening 4 as the slider 5 moves.
  • the slider 5 is positioned on the right side in the orientation shown in FIG. 1, and the opening 4 is closed by the lid 6.
  • This lid 6 is an example of a "substrate" according to the present invention.
  • An RFID tag 20 is placed on the inner surface of the bulk case 2.
  • a conductor 13 is provided on the lid 6. As shown in FIG. 1, when the slider 5 closes the removal opening 4 (first state), the conductor 13 is separated from the RFID tag 20, the RFID tag 20 is not affected by the conductor 13, and the RFID tag reader/writer can read the RFID tag from a distance.
  • the communication frequency of the RFID tag 20 is, for example, in the 900 MHz band (860 MHz to 920 MHz) range.
  • this RFID tag is an RFID tag that uses the UHF band.
  • the RFID tag 20 communicates with the RFID tag reader/writer by electric field coupling (capacitive coupling) or magnetic field coupling.
  • FIG 2 is a perspective view of an electronic component storage package 201 that is composed of multiple electronic component storage units 101 and a packaging box 200 in which the electronic component storage units 101 are packaged.
  • the removal opening 4 is closed by the lid 6, so the electronic components 3 do not spill out of the removal opening 4.
  • the antenna gain of the RFID tag is high, and the contents of the RFID tag of each electronic component storage unit 101 in the electronic component storage package 201 can be read even from a certain distance.
  • FIG. 3 is a diagram showing the structure of the electronic component housing 101 in the second state.
  • the upper left diagram in FIG. 3 is a vertical cross-sectional view of the electronic component housing 101
  • the upper right diagram is a right side view of the electronic component housing 101
  • the lower left diagram is a bottom view of the electronic component housing 101.
  • Fig. 1 the lid 6 is shown covering the access port 4, but Fig. 3 shows the lid 6 opening the access port 4 (second state).
  • the slider 5 is slid to open the removal port 4. In this state, the conductor 13 overlaps the RFID tag 20.
  • FIG. 4 is a plan view showing the configuration of the RFID tag 20.
  • a meandering line-shaped radiating electrode 15 and end electrode 16 are formed on an insulating RFID tag sheet 14.
  • the radiating electrode 15 and end electrode 16 form an antenna.
  • An RFID tag sheet 14 is also mounted with an RFIC 7.
  • the RFIC 7 may be an IC alone, or may include an IC, a matching circuit, an antenna, etc. If the RFIC 7 is an IC alone, the electrode of the RFIC 7 may be electrically connected directly to the radiating electrode 15, and if the RFIC 7 is an RFIC module equipped with an antenna, the electrode of the RFIC 7 may be capacitively coupled to the radiating electrode 15 via capacitance, or magnetically coupled via a magnetic field.
  • the radiating electrode 15 and RFIC 7 act as an RFID tag equipped with a dipole antenna, and in this state the antenna gain is the highest.
  • the longest communication distance between the RFID tag and the RFID tag reader/writer is several meters or more.
  • the RFID tags of each electronic component housing 101 in the electronic component housing package 201 can be read all at once from a predetermined distance.
  • the electronic component storage body 101 when the electronic component storage body 101 is attached to the mounter, it is in the second state shown in FIG. 3, in which the conductor 13 overlaps the RFID tag 20, resulting in a reduced antenna gain.
  • the maximum communication distance between the RFID tag reader/writer provided on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader provided on the mounter can only read (or read and write) the RFID tag in the bulk case closest to the tag reader attached to the mounter.
  • the antenna of the RFID tag is not limited to one that forms a dipole antenna when normally used as an antenna, but may be configured to have a monopole antenna structure when normally used as an antenna.
  • the RFID tag 20 shown in Figures 1 and 3 may be configured so that a conductor pattern for a monopole antenna is formed, and the conductor 13 covers the conductor pattern for the monopole antenna as shown in Figure 3.
  • the antenna of the RFID tag is not limited to an antenna with a linear radiating conductor, but may be a patch antenna.
  • the RFID tag 20 may be configured so that a patch antenna is formed, and the antenna gain is reduced by overlapping the conductor 13 with the patch antenna in the state shown in FIG. 3.
  • the RFID tag 20 is attached to the inner bottom surface of the bulk case 2, but it may be formed on the side surface of the bulk case 2.
  • the RFID tag 20 can be made of PET (polyethylene terephthalate), PP (polypropylene), or paper with a metal pattern formed on it. Furthermore, a substrate such as glass epoxy can be used. These substrates can be fixed to the bulk case 2 with adhesive, double-sided tape, etc.
  • the conductor 13 is formed on the lid 6, the RFID tag 20 is formed on the bulk case 2, and the conductor 13 and the RFID tag 20 overlap in the second state when the lid 6 has the access opening 4 open, but this is just one example.
  • the RFID tag 20 may be formed on the lid 6, and the conductor 13 may be formed on the bulk case 2. Even in this case, the conductor 13 and the RFID tag 20 overlap in the second state when the lid 6 has the access opening 4 open, so that communication is only possible over short distances when the device is attached to the mount.
  • the RFID tag 20 is provided on the inner surface of the bulk case 2, but the RFID tag 20 may be provided on the outer surface of the bulk case 2.
  • providing the RFID tag 20 on the inner surface of the bulk case 2 makes it easier to prevent counterfeiting by a third party.
  • FIG. 5 is a diagram showing the structure of an electronic component storage body 102 in a first state according to a second embodiment of the present invention.
  • the lower left diagram in FIG. 5 is a vertical cross-sectional view of the electronic component storage body 102
  • the lower right diagram in FIG. 5 is a right side view of the electronic component storage body 102
  • the upper left diagram is a top view of the electronic component storage body 102.
  • the electronic component storage unit 102 includes a bulk case 2 made of resin. In the orientation shown in FIG. 5, an electronic component storage section SP1 that stores a large number of electronic components 3 is formed at the bottom of the bulk case 2, and a spare space SP2 is formed above this electronic component storage section.
  • the bulk case 2 has an access opening 4 for electronic components 3.
  • the electronic component storage body 102 has a slider 5 and a lid 6 that are connected to each other.
  • the lid 6 opens and closes the access opening 4 as the slider 5 moves.
  • the slider 5 is positioned on the right side and the access opening 4 is closed by the lid 6.
  • a conductor 13 is provided in the spare space SP2 inside the bulk case 2. This conductor 13 is provided in a state in which it can be displaced in the vertical direction.
  • An RFID tag 20 is placed on the inner surface of the bulk case 2. In the first state shown in FIG. 5, the conductor 13 is located away from the RFID tag 20 due to its own weight. Therefore, the influence of the conductor 13 on the RFID tag 20 is small.
  • the communication frequency of the RFID tag 20 is, for example, in the 900 MHz band (860 MHz to 920 MHz) range.
  • this RFID tag is an RFID tag that uses the UHF band.
  • FIG. 6 is a diagram showing the structure of the electronic component storage body 102 in a second state.
  • the upper left diagram in FIG. 6 is a vertical cross-sectional view of the electronic component storage body 102
  • the upper right diagram is a right side view of the electronic component storage body 102
  • the lower left diagram is a bottom view of the electronic component storage body 102.
  • Fig. 5 shows a first state in which the lid 6 covers the access port 4
  • Fig. 6 shows a second state in which the lid 6 opens the access port 4.
  • Fig. 5 shows a state in which the slider 5 and access port 4 are upwardly oriented as shown in Fig. 5
  • Fig. 6 shows a state in which the slider 5 and access port 4 are downwardly oriented as shown in Fig. 6.
  • Fig. 6 shows the electronic component storage body 102 attached to the mounter.
  • the direction in which it is attached to the mounter can be determined by the structure of the access port 4 and the storage section for the electronic components 3. That is, in order to remove all of the electronic components 3 from the bulk case 2, the access port 4 is placed on the mounter in a position closer to the gravitational acceleration direction than the storage section.
  • the conductor 13 is separated from the RFID tag 20. This allows the RFID tag 20 to function as an original RFID tag without being affected by the conductor 13. This enables long-distance communication, and allows reading even when the electronic component housing is stored in the packaging box 200.
  • the conductor 13 is close to the RFID tag 20.
  • the RFID tag 20 is affected by the conductor 13, and the antenna gain is lower than that of an original RFID tag.
  • the maximum communication distance between the RFID tag reader/writer provided on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader provided on the mounter can only read (or read and write) the RFID tag in the bulk case that is closest to the tag reader attached to the mounter.
  • Figures 5 and 6 show an example in which the weight of the conductor 13 brings the conductor 13 close to the antenna of the RFID tag 20 when the bulk case 2 is placed in a direction that allows the electronic component 3 to be removed.
  • the conductor 13 is a ferromagnetic material
  • a magnet may be provided on an external structure such as a mount. This may allow the conductor 13 to be configured so that when the conductor 13 approaches the antenna of the RFID tag 20 due to its own weight, the conductor 13 is attracted to the magnet in that direction. This makes it possible to more reliably bring the conductor 13 close to the antenna of the RFID tag 20.
  • the communication distance was changed by moving the lid 6, but in the second implementation state, the communication distance can be changed by changing the orientation of the electronic component housing, regardless of the lid 6. This makes it possible to read information from only the bulk case 2 closest to the tag reader without removing the electronic component 3, and, for example, makes it possible to replace the electronic component 3 without losing it, even if it is attached to the wrong mounter.
  • the conductor 13 when not mounted on a mounter, the conductor 13 is spaced apart from the RFID tag 20 and is present between the RFID tag 20 and the electronic component 3. Therefore, the characteristics of the RFID tag 20 can be stabilized regardless of the amount of electronic components 3.
  • the electronic component also contains metal parts
  • the distance between the antenna of the RFID tag 20 and the metal parts in the electronic component 3 changes depending on the amount of electronic components contained in the electronic component storage section SP1, which changes the radiation characteristics of the antenna of the RFID tag 20.
  • the conductor 13 present between the antenna of the RFID tag 20 and the electronic component storage section SP1
  • the radiation characteristics of the antenna become constant regardless of the amount of electronic components.
  • FIG. 7 is a diagram showing the structure of an electronic component storage body 103 in a second state, which is given as a third embodiment of the present invention.
  • the left figure in FIG. 7 is a vertical cross-sectional view of the electronic component storage body 103, and the right figure is a right side view of the electronic component storage body 103.
  • the electronic component storage body 103 of the third embodiment is oriented as shown in FIG. 7 when attached to a mounter.
  • the conductor 13 is formed on a substrate 41.
  • the substrate 41 is provided with a ferromagnetic member 40 that is attracted to a magnet 30 provided on an external structure such as a mounter.
  • the other configurations are similar to those of the electronic component housing 102 shown in the second embodiment.
  • the ferromagnetic member 40 is attracted to the magnet 30.
  • the conductor 13 may be made of a non-magnetic material such as Cu or Al. This also makes it possible to more reliably move the substrate 41, the conductor 13, and the ferromagnetic member 40.
  • the ferromagnetic member 40 may be a magnet arranged with a polarity that is attracted to the magnet 30.
  • FIG. 8 is a diagram showing the structure of an electronic component housing 104 in a first state according to a fourth embodiment of the present invention, and is a vertical cross-sectional view of the electronic component housing 104.
  • the electronic component storage body 104 includes a bulk case 2 made of resin. In the orientation shown in FIG. 8, an electronic component storage section SP1 that stores a large number of electronic components 3 is formed in the upper part of the bulk case 2, and a spare space SP2 is formed below this electronic component storage section.
  • a conductor 13 is provided in the spare space inside the bulk case 2.
  • the conductor 13 is positioned so that it can be displaced vertically due to the attraction of the electromagnet 31 and its elasticity.
  • An RFID tag 20 is also placed on the inner surface of the bulk case 2.
  • the conductor 13 is a ferromagnetic plate such as an iron plate, but in the state shown in Figure 8, the conductor 13 is not attracted to the electromagnet 31. Therefore, the RFID tag 20 is not affected by the conductor 13.
  • Figure 9 is a vertical cross-sectional view of the electronic component storage body 103 in the second state. While Figure 8 shows the state in which the conductor 13 is not attracted to the electromagnet, Figure 9 shows the state in which the conductor 13 is attracted to the electromagnet. Figure 9 also shows the state in which the lid 6 opens the removal opening 4. Figure 9 shows the electronic component storage body 103 attached to the mounter.
  • the conductor 13 When the electronic component storage unit 103 is not attached to the mounter, the conductor 13 is in a first state away from the RFID tag 20 as shown in FIG. 8. This allows the RFID tag 20 to function as an RFID tag capable of long-distance communication without being affected by the conductor 13.
  • the electromagnet 31 is, for example, an electromagnet with a ferrite core. Therefore, as shown in FIG. 8, even if the electromagnet 31 is close to the RFID tag 20, the RFID tag 20 is not affected by the conductivity of the electromagnet 31.
  • the electronic component storage body 103 When the electronic component storage body 103 is attached to the mounter, the electronic component storage body 103 is in a second state in which the conductor 13 is attracted by the electromagnet 31 as shown in FIG. 9. This causes the RFID tag 20 to be affected by the conductor 13, reducing the antenna gain. For example, the maximum communication distance between the RFID tag reader/writer provided on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader provided on the mounter can only read (or read and write) the RFID tag in the bulk case closest to the tag reader attached to the mounter.
  • the conductor 13 may, for example, have its end, which is the support portion, inserted from the spare space SP2 into the electronic component storage section SP1 side. In other words, the conductor 13 may be placed in the spare space SP2 closer to the electronic component storage section SP1 without being fixed. In other words, it is sufficient to configure the conductor 13 so that it does not come out when attracted by the electromagnet 31. This allows the conductor 13 to be freely deformed, while at the same time providing the rigidity to the conductor 13 to maintain its shape, thereby stabilizing the antenna characteristics by returning to a linear shape as shown in FIG. 8 when the electromagnet 31 is not present.
  • the conductor 13 may be formed on a deformable substrate, and the deformation due to the attractive force of the electromagnet 31 and the restoring force in the absence of the electromagnet 31 may be adjusted by combining the rigidity of the substrate and the conductor 13.
  • the magnetic force strength of the electromagnet 31 can be set in multiple stages, allowing the distance of the conductor 13 from the RFID tag 20 to be set in multiple stages, thereby controlling the antenna gain in multiple stages.
  • the electromagnet 31 may be turned on and off in conjunction with the operation of the slider 5, but in this embodiment, the electromagnet 31 can be turned on and off independently of the operation of the slider 5. This makes it possible to determine the type of electronic component 3 mounted on the mounter without removing the electronic component 3, and eliminates the loss of electronic components 3 caused by opening the removal port 4.
  • both ends of the conductor 13 are fixed, but only one end may be fixed.
  • electronic components are not limited to being rectangular in shape, but may also be cylindrical, for example.
  • the RFID tag 20 is attached to the bottom or top surface of the bulk case 2, but it may also be formed on the side surface of the bulk case 2.
  • the electronic component of the present invention may be provided in any of the following forms:
  • a bulk case capable of storing a plurality of electronic components, an RFID tag for identifying the bulk case, and a conductor;
  • the RFID tag has an RFIC and an antenna electrically connected to the RFIC, the conductor is displaceable relative to the antenna;
  • Electronic component storage unit
  • the conductor is displaceable between a position where it overlaps the antenna and a position where it does not overlap the antenna.
  • the conductor is a ferromagnetic material that is attracted to a magnet provided in the external structure, The conductor is attracted to the magnet in a direction approaching the antenna due to its own weight.
  • the conductor is formed on a substrate; the substrate has a ferromagnetic member that is attracted to a magnet provided in an external structure, The ferromagnetic member is attracted to the magnet by its own weight in a direction in which the conductor approaches the antenna.
  • ⁇ 8> The distance between the conductor and the antenna is changed depending on the strength of attraction by the magnet.
  • the magnet is an electromagnet, and the strength of attraction by the magnet changes depending on whether or not electricity is applied to the electromagnet.
  • the electronic component housing according to any one of ⁇ 6> to ⁇ 8>.
  • ⁇ 10> a base material on which the conductor is formed, the position of the conductor being displaced with respect to the antenna by displacement of the base material; the bulk case has an outlet through which the electronic components can be removed by displacement of the base material, the displacement of the base material causes the conductor and the RFID tag to come close to each other in an open state of the outlet;
  • the electronic component housing according to any one of ⁇ 1> to ⁇ 4>.
  • the electronic component housing package is constructed by packaging the plurality of electronic component housings in the packaging box.
  • SP1 Electronic component storage section
  • SP2 Spare space 2: Bulk case 3:
  • Electronic component 4 Access port 5: Slider 6: Lid (base material) 7.
  • RFIC 13 ...conductor 14
  • RFID tag sheet 15 ...radiating electrode 16
  • 20 ...RFID tag 30
  • magnet 31 ...electromagnet 40
  • ferromagnetic member 41 ...substrates 101 to 104...electronic component housing 200
  • packaging box 201 ...packaging body for electronic component housing

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)

Abstract

An electronic component accommodation body (101) is provided with: a bulk case (2) capable of accommodating a plurality of electronic components (3); an RFID tag (20) for identifying the bulk case (2); and an electric conductor (13). The RFID tag (20) has an RFIC and an antenna electrically connected to the RFIC. The electric conductor (13) is capable of displacing with respect to the antenna. Thus, an electronic component accommodation body and an electronic component accommodation body package that are capable of changing a communication distance of an RFID according to a reading purpose can be obtained.

Description

電子部品収納体及び電子部品収納体梱包体Electronic component container and electronic component container packaging
　本発明はバルクケースに複数の電子部品が収納された電子部品収納体及び複数の電子部品収納体が梱包された電子部品収納体梱包体に関する。 The present invention relates to an electronic component storage unit in which multiple electronic components are stored in a bulk case, and an electronic component storage package in which multiple electronic component storage units are packaged.
　従来、チップ部品等の電子部品は、テーピングリールに個別に包装されることによって部品リールが構成され、必要な種類の部品リールが電子部品実装装置（マウンタ）に設置され、それぞれの部品が電子基板上の所定の場所にマウントされていく。 Traditionally, electronic components such as chips are individually packaged in taping reels to form component reels, and the required type of component reel is then placed in an electronic component mounting device (mounter), and each component is mounted in the designated location on an electronic circuit board.
　通常、部品リールにはバーコードや二次元コードなどのラベルが貼り付けられており、これにより、商品としての部品リールに関する情報が管理されている。 Typically, parts reels are labeled with a barcode or two-dimensional code, which allows information about the parts reels as products to be managed.
　テーピングリール方式による電子部品の個別包装は嵩高いため、輸送コストの削減、あるいは近年の輸送に関するＣＯ２削減に関して問題となっている。そこで、例えば積層セラミックキャパシタ（ＭＬＣＣ）などの非常に小さな電子部品はバルクケースに入れて出荷搬送することが検討されている。 Individual packaging of electronic components using the taping and reel method is bulky, which has become a problem in terms of reducing transportation costs and reducing CO2 emissions from transportation in recent years. Therefore, it has been considered to ship and transport very small electronic components such as multilayer ceramic capacitors (MLCCs) in bulk cases.
　上記バルクケースは複数個まとめて箱詰めし、その状態で出荷・搬送・保管する、といった業務も行われる。 The bulk cases mentioned above are also used for packing multiple items together and shipping, transporting, and storing them in that state.
　一方、電子部品をバルク状態でケース（バルクケース）に収納し、このバルクケースをＲＦＩＤタグで管理する技術は特許文献１に開示されている。 On the other hand, Patent Document 1 discloses a technology for storing electronic components in bulk in a case (bulk case) and managing this bulk case with an RFID tag.
　バルクケースごとにバーコードラベルや二次元コードラベルを貼り付ければ品物を個別に管理することは可能であるが、複数のバルクケースが梱包箱に梱包されている状態では、バーコードリーダーや二次元コードリーダでこれらを読み取ることができない。そこで、バルクケース毎にＲＦＩＤタグを取り付けることが求められている。 It is possible to manage items individually by attaching a barcode label or two-dimensional code label to each bulk case, but when multiple bulk cases are packed into a shipping box, they cannot be read by a barcode reader or two-dimensional code reader. This is why there is a demand to attach an RFID tag to each bulk case.
　ＲＦＩＤタグは、電波が届く範囲でありさえすれば、箱の中に収められた状態でも、多数のバルクケースの情報を一気に読み取れるため、出荷管理、在庫管理等が非常に便利になる。また、バルクケースをマウンタに直接設置して、バルクケースから部品を供給するようにすれば、テーピングリールの廃材などを大幅に削減することができる。またコストダウンにもなる。 As long as the RFID tags are within the range of radio waves, the information on many bulk cases can be read at once even when they are stored inside a box, making shipping management, inventory management, etc. extremely convenient. Also, if the bulk cases are installed directly on the mounter and parts are supplied from the bulk cases, waste from taping reels can be significantly reduced. This also leads to cost reductions.
　バルクケースをマウンタに装着した際に、バルクケースのＲＦＩＤタグをマウンタ側で直接読み取るようにすれば、部品の出荷から製品化までを通してデータ管理できるようになり、多くの業務が効率化・省力化できる。 If the RFID tag on the bulk case can be read directly by the mounter when the bulk case is attached to the mounter, data can be managed from the shipment of parts to production, making many operations more efficient and labor-saving.
国際公報第２０２２／１２３９０４号International Publication No. 2022/123904
　しかしながら、マウンタに装着したバルクケースは個別のバルクケースごとにデータを読み取り管理する必要がある。すなわち、まとめて置かれている物品を、まとめて読み込んで在庫管理するという場合とは異なり、どの電子部品が収納されたバルクケースがマウンタのどの位置に設置されているかを正確に読み取る必要がある。 However, it is necessary to read and manage the data for each bulk case attached to the mounter. In other words, unlike when items stored together are read together and inventory is managed, it is necessary to accurately read which bulk case contains which electronic components and where on the mount it is placed.
　マウンタ上には、複数のバルクケースが並べられて設置されるので、それらバルクケースに装着されたＲＦＩＤタグを通常のＲＦＩＤリーダで読み込むと、すべてのバルクケースのＲＦＩＤが反応してしまう。すなわちバルクケースのＲＦＩＤはある程度の距離以内で反応するように構成されているため、近傍のバルクケースが全て反応してしまう。そのため、マウンタ側のＡの位置にＢというバルクケースが装着されているかどうか、Ａの位置のリーダが読み取ろうとしても、Ａの位置にＢというバルクケースが正しく設置されているかどうかわからない。 Since multiple bulk cases are placed side by side on the mount, if the RFID tags attached to these bulk cases are read with a normal RFID reader, the RFIDs of all the bulk cases will react. In other words, because the RFIDs of the bulk cases are configured to react within a certain distance, all nearby bulk cases will react. Therefore, even if a reader at position A tries to read whether bulk case B is attached at position A on the mount side, it cannot tell whether bulk case B is correctly placed at position A.
　そこで、本発明の目的は、電子部品が収納されたバルクケースにおいて、読み取り目的に応じてＲＦＩＤの通信距離の変化を可能とした電子部品収納体及び電子部品収納体梱包体を提供することにある。 The object of the present invention is to provide an electronic component storage unit and electronic component storage package in a bulk case that stores electronic components and that allows the communication distance of the RFID to be changed depending on the purpose of reading.
　本開示の一例として電子部品収納体は、複数の電子部品が収納可能なバルクケースと、当該バルクケースを識別するためのＲＦＩＤタグと、導電体とを備え、前記ＲＦＩＤタグは、ＲＦＩＣと、当該ＲＦＩＣに電気的に接続するアンテナと、を有し、前記導電体は、前記アンテナに対して変位可能である、ことを特徴とする。 As an example of the present disclosure, an electronic component storage unit includes a bulk case capable of storing multiple electronic components, an RFID tag for identifying the bulk case, and a conductor, the RFID tag having an RFIC and an antenna electrically connected to the RFIC, and the conductor is capable of being displaced relative to the antenna.
　また、本開示の電子部品収納体梱包体は、それぞれが上記構成の複数の電子部品収納体と、これら複数の電子部品収納体を梱包する梱包箱とを備え、前記複数の電子部品収納体が前記梱包箱に梱包されて構成されることを特徴とする。 The electronic component storage package of the present disclosure is characterized in that it comprises a plurality of electronic component storage units, each having the above-described configuration, and a packaging box for packaging the plurality of electronic component storage units, and is configured by packaging the plurality of electronic component storage units in the packaging box.
　本発明によれば、電子部品が収納されたバルクケースにおいて、読み取り目的に応じてＲＦＩＤタグの通信距離の変化を可能とした電子部品収納体が得られる。例えば、複数のバルクケースが近接している場合でも、所定のバルクケースのＲＦＩＤタグを個別に読み取れるようにし、また、複数のバルクケースが梱包された状態で、各バルクケースのＲＦＩＤを一括して読み取れるようにもできる。 The present invention provides an electronic component storage unit that allows the communication distance of the RFID tag in a bulk case containing electronic components to be changed depending on the purpose of reading. For example, even if multiple bulk cases are in close proximity, it is possible to read the RFID tag of a specific bulk case individually, and it is also possible to read the RFID tags of each bulk case collectively when multiple bulk cases are packed together.
図１は第１の実施形態に係る電子部品収納体１０１の第１状態の構造を示す図である。FIG. 1 is a diagram showing the structure of an electronic component housing 101 according to the first embodiment in a first state. 図２は、複数の電子部品収納体１０１と、それら電子部品収納体１０１を梱包する梱包箱２００とで構成される電子部品収納体梱包体２０１の斜視図である。FIG. 2 is a perspective view of an electronic component housing package 201 that is composed of a plurality of electronic component housings 101 and a packaging box 200 in which the electronic component housings 101 are packaged. 図３は電子部品収納体１０１の第２状態の構造を示す図である。FIG. 3 is a diagram showing the structure of electronic component housing 101 in a second state. 図４はＲＦＩＤタグ２０の構成を示す平面図である。FIG. 4 is a plan view showing the configuration of the RFID tag 20. As shown in FIG. 図５は第２の実施形態に係る電子部品収納体１０２の第１状態の構造を示す図である。FIG. 5 is a diagram showing a structure of an electronic component housing 102 according to the second embodiment in a first state. 図６は電子部品収納体１０２の第２状態の構造を示す図である。FIG. 6 is a diagram showing the structure of the electronic component housing 102 in the second state. 図７は第３の実施形態に係る電子部品収納体１０３の第２状態の構造を示す図である。FIG. 7 is a diagram showing the structure of an electronic component housing 103 according to the third embodiment in a second state. 図８は第４の実施形態に係る電子部品収納体１０４の第１状態の縦断面図である。FIG. 8 is a vertical cross-sectional view of an electronic component housing 104 according to the fourth embodiment in a first state. 図９は電子部品収納体１０４の第２状態の縦断面図である。FIG. 9 is a vertical cross-sectional view of the electronic component housing 104 in the second state.
《第１の実施形態》
　図１は本発明に係る第１実施形態として挙げる電子部品収納体１０１の第１状態の構造を示す図である。図１中の左上図は電子部品収納体１０１の縦断面図、右上図は電子部品収納体１０１の右側面図、左下図は電子部品収納体１０１の下面図である。 First Embodiment
1 is a diagram showing the structure of an electronic component housing 101 in a first state according to a first embodiment of the present invention. The upper left diagram in FIG. 1 is a vertical cross-sectional view of the electronic component housing 101, the upper right diagram is a right side view of the electronic component housing 101, and the lower left diagram is a bottom view of the electronic component housing 101.
　電子部品収納体１０１は樹脂製のバルクケース２を備える。図１に示す向きでバルクケース２の上部には、多数の電子部品３を収納する電子部品収納部ＳＰ１が形成されていて、この電子部品収納部より下部に余空間ＳＰ２が形成されている。 The electronic component storage unit 101 includes a bulk case 2 made of resin. In the orientation shown in FIG. 1, an electronic component storage section SP1 that stores a large number of electronic components 3 is formed in the upper part of the bulk case 2, and a spare space SP2 is formed below this electronic component storage section.
　バルクケース２は電子部品３の取り出し口４を有する。電子部品収納体１０１は互いに連結されたスライダ５及び蓋６はポリエチレン（ＰＥ）等による電気絶縁体である。蓋６はスライダ５の移動にともなって取り出し口４を開閉する。電子部品収納体１０１の運搬時や保管時には、図１に示す向きで、スライダ５は右側に位置して、取り出し口４は蓋６で閉じられている。この蓋６は本発明に係る「基材」の一例である。 The bulk case 2 has an opening 4 for removing electronic components 3. The electronic component storage body 101 has a slider 5 and a lid 6 which are connected to each other and are made of an electrical insulator such as polyethylene (PE). The lid 6 opens and closes the opening 4 as the slider 5 moves. When the electronic component storage body 101 is transported or stored, the slider 5 is positioned on the right side in the orientation shown in FIG. 1, and the opening 4 is closed by the lid 6. This lid 6 is an example of a "substrate" according to the present invention.
　バルクケース２の内面にはＲＦＩＤタグ２０が配置されている。蓋６には導電体１３が設けられている。図１に示すとおり、スライダ５が取り出し口４を閉じている状態（第１状態）で、導電体１３はＲＦＩＤタグ２０から分離された状態となって、ＲＦＩＤタグ２０は導電体１３の影響を受けず、ＲＦＩＤタグリーダライタは離れた位置でのＲＦＩＤタグの読み取りが可能である。 An RFID tag 20 is placed on the inner surface of the bulk case 2. A conductor 13 is provided on the lid 6. As shown in FIG. 1, when the slider 5 closes the removal opening 4 (first state), the conductor 13 is separated from the RFID tag 20, the RFID tag 20 is not affected by the conductor 13, and the RFID tag reader/writer can read the RFID tag from a distance.
　ＲＦＩＤタグ２０の通信周波数は例えば９００ＭＨｚ帯（８６０ＭＨｚから９２０ＭＨｚ）の範囲である。つまり、このＲＦＩＤタグはＵＨＦ帯を用いるＲＦＩＤタグである。 The communication frequency of the RFID tag 20 is, for example, in the 900 MHz band (860 MHz to 920 MHz) range. In other words, this RFID tag is an RFID tag that uses the UHF band.
　後に示すように、ＲＦＩＤタグ２０はＲＦＩＤタグリーダライタと電界結合（容量結合）又は磁界結合して通信する。 As will be described later, the RFID tag 20 communicates with the RFID tag reader/writer by electric field coupling (capacitive coupling) or magnetic field coupling.
　図２は、複数の電子部品収納体１０１と、それら電子部品収納体１０１を梱包する梱包箱２００とで構成される電子部品収納体梱包体２０１の斜視図である。図１に示したとおり、蓋６により取り出し口４が閉じられているので、電子部品３が取り出し口４からこぼれ出ることはない。また、後に示すとおり、各電子部品収納体１０１が図１に示した第１状態であることにより、ＲＦＩＤタグのアンテナ利得が高く、所定の遠方からでも電子部品収納体梱包体２０１内の各電子部品収納体１０１のＲＦＩＤタグの内容を読み取ることができる。 Figure 2 is a perspective view of an electronic component storage package 201 that is composed of multiple electronic component storage units 101 and a packaging box 200 in which the electronic component storage units 101 are packaged. As shown in Figure 1, the removal opening 4 is closed by the lid 6, so the electronic components 3 do not spill out of the removal opening 4. Also, as will be shown later, by each electronic component storage unit 101 being in the first state shown in Figure 1, the antenna gain of the RFID tag is high, and the contents of the RFID tag of each electronic component storage unit 101 in the electronic component storage package 201 can be read even from a certain distance.
　図３は電子部品収納体１０１の第２状態の構造を示す図である。図３中の左上図は電子部品収納体１０１の縦断面図、右上図は電子部品収納体１０１の右側面図、左下図は電子部品収納体１の下面図である。 FIG. 3 is a diagram showing the structure of the electronic component housing 101 in the second state. The upper left diagram in FIG. 3 is a vertical cross-sectional view of the electronic component housing 101, the upper right diagram is a right side view of the electronic component housing 101, and the lower left diagram is a bottom view of the electronic component housing 101.
　図１では蓋６が取り出し口４を遮蔽している状態を示したが、図３は蓋６が取り出し口４を開口している状態（第２状態）を示している。 In Fig. 1, the lid 6 is shown covering the access port 4, but Fig. 3 shows the lid 6 opening the access port 4 (second state).
　電子部品収納体１０１がマウンタに装着された後にスライダ５がスライドされることにより取り出し口４は開口する。また、その状態で、ＲＦＩＤタグ２０に導電体１３が重なる。 After the electronic component storage unit 101 is attached to the mounter, the slider 5 is slid to open the removal port 4. In this state, the conductor 13 overlaps the RFID tag 20.
　図４はＲＦＩＤタグ２０の構成を示す平面図である。絶縁性のＲＦＩＤタグシート１４にはミアンダライン状の放射電極１５及び端部電極１６が形成されている。この放射電極１５及び端部電極１６でアンテナが構成されている。また、ＲＦＩＤタグシート１４にはＲＦＩＣ７が搭載されている。ＲＦＩＣ７はＩＣ単体であってもよいし、ＩＣと整合回路やアンテナ等とを備えたものであってもよい。ＲＦＩＣ７がＩＣ単体であれば、ＲＦＩＣ７の電極は放射電極１５に電気的に直接接続されていればよいし、ＲＦＩＣ７がアンテナを備えたＲＦＩＣモジュールである場合はＲＦＩＣ７の電極は放射電極１５と容量を介して容量性結合されていたり、磁界を介して磁界結合されていたりしてもよい。 FIG. 4 is a plan view showing the configuration of the RFID tag 20. A meandering line-shaped radiating electrode 15 and end electrode 16 are formed on an insulating RFID tag sheet 14. The radiating electrode 15 and end electrode 16 form an antenna. An RFID tag sheet 14 is also mounted with an RFIC 7. The RFIC 7 may be an IC alone, or may include an IC, a matching circuit, an antenna, etc. If the RFIC 7 is an IC alone, the electrode of the RFIC 7 may be electrically connected directly to the radiating electrode 15, and if the RFIC 7 is an RFIC module equipped with an antenna, the electrode of the RFIC 7 may be capacitively coupled to the radiating electrode 15 via capacitance, or magnetically coupled via a magnetic field.
　図１に示した第１状態で、放射電極１５及びＲＦＩＣ７によって、ダイポールアンテナを備えたＲＦＩＤタグとして作用し、その状態でアンテナ利得は最も高い。例えば、ＲＦＩＤタグとＲＦＩＤタグリーダライタとの最長通信距離は数ｍ以上である。すなわち、図１、図４に示した状態で、所定の遠方から電子部品収納体梱包体２０１内の各電子部品収納体１０１のＲＦＩＤタグを一括して読み取ることができる。 In the first state shown in FIG. 1, the radiating electrode 15 and RFIC 7 act as an RFID tag equipped with a dipole antenna, and in this state the antenna gain is the highest. For example, the longest communication distance between the RFID tag and the RFID tag reader/writer is several meters or more. In other words, in the state shown in FIG. 1 and FIG. 4, the RFID tags of each electronic component housing 101 in the electronic component housing package 201 can be read all at once from a predetermined distance.
　一方、電子部品収納体１０１をマウンタに装着した状態では、図３に示した第２状態となり、ＲＦＩＤタグ２０に導電体１３が重なる構造となるので、アンテナ利得が低下する。例えば、マウンタに設けられているＲＦＩＤタグリーダライタとＲＦＩＤタグとの最長通信距離は数ｃｍ以内である。そのため、この状態では、マウンタに設けられているタグリーダはマウンタに装着されているタグリーダ直近のバルクケースのＲＦＩＤタグのみを読み取ること（または読み書きすること）ができる。 On the other hand, when the electronic component storage body 101 is attached to the mounter, it is in the second state shown in FIG. 3, in which the conductor 13 overlaps the RFID tag 20, resulting in a reduced antenna gain. For example, the maximum communication distance between the RFID tag reader/writer provided on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader provided on the mounter can only read (or read and write) the RFID tag in the bulk case closest to the tag reader attached to the mounter.
　ＲＦＩＤタグのアンテナは、アンテナとしての通常使用時にダイポールアンテナを構成するものに限らず、アンテナとしての通常使用時にモノポールアンテナ構造となる構成であってよい。例えば、図１、図３に示したＲＦＩＤタグ２０にモノポールアンテナ用の導体パターンが形成されていて、図３に示したように導電体１３がモノポールアンテナ用の導体パターンを覆うように構成してもよい。 The antenna of the RFID tag is not limited to one that forms a dipole antenna when normally used as an antenna, but may be configured to have a monopole antenna structure when normally used as an antenna. For example, the RFID tag 20 shown in Figures 1 and 3 may be configured so that a conductor pattern for a monopole antenna is formed, and the conductor 13 covers the conductor pattern for the monopole antenna as shown in Figure 3.
　また、ＲＦＩＤタグのアンテナは放射導体が線状に延びたアンテナに限らず、パッチアンテナであってもよい。例えば、ＲＦＩＤタグ２０にパッチアンテナが形成されていて、図３に示した状態でパッチアンテナに導電体１３が重なることでアンテナ利得が低下するように構成してもよい。 Furthermore, the antenna of the RFID tag is not limited to an antenna with a linear radiating conductor, but may be a patch antenna. For example, the RFID tag 20 may be configured so that a patch antenna is formed, and the antenna gain is reduced by overlapping the conductor 13 with the patch antenna in the state shown in FIG. 3.
　また、図１、図３に示した例では、ＲＦＩＤタグ２０をバルクケース２の内底面に貼り付けた例を示したが、バルクケース２の側面に形成してもよい。 In the example shown in Figures 1 and 3, the RFID tag 20 is attached to the inner bottom surface of the bulk case 2, but it may be formed on the side surface of the bulk case 2.
　ＲＦＩＤタグ２０の材質としては、ポリエチレンを材質とするＦＰＣ以外に、ＰＥＴ（ポリエチレンテレフタレート）やＰＰ（ポリプロピレン）、あるいは紙等に金属パターンが形成されたものを用いることもできる。さらにはガラスエポキシなどの基板を使用してもよい。これら基材は接着剤や両面テープなどによってバルクケース２に固定することができる。 In addition to FPC made of polyethylene, the RFID tag 20 can be made of PET (polyethylene terephthalate), PP (polypropylene), or paper with a metal pattern formed on it. Furthermore, a substrate such as glass epoxy can be used. These substrates can be fixed to the bulk case 2 with adhesive, double-sided tape, etc.
　図１や図３では、蓋６に導電体１３が形成され、バルクケース２にＲＦＩＤタグ２０が形成されており、蓋６が取り出し口４を開いている第２状態で導電体１３とＲＦＩＤタグ２０とが重なる例を示したが、これは一例である。蓋６にＲＦＩＤタグ２０が形成され、バルクケース２に導電体１３が形成されていてもよい。この場合でも蓋６が取り出し口４を開いている第２状態で導電体１３とＲＦＩＤタグ２０とが重なることで、マウンタに設けられている状態では近距離でのみの通信が可能となる。 In Figures 1 and 3, the conductor 13 is formed on the lid 6, the RFID tag 20 is formed on the bulk case 2, and the conductor 13 and the RFID tag 20 overlap in the second state when the lid 6 has the access opening 4 open, but this is just one example. The RFID tag 20 may be formed on the lid 6, and the conductor 13 may be formed on the bulk case 2. Even in this case, the conductor 13 and the RFID tag 20 overlap in the second state when the lid 6 has the access opening 4 open, so that communication is only possible over short distances when the device is attached to the mount.
　また、図１や図３に示した例では、ＲＦＩＤタグ２０をバルクケース２の内面に設けたが、ＲＦＩＤタグ２０はバルクケース２の外面に設けてもよい。但し、ＲＦＩＤタグ２０をバルクケース２の内面に設ければ、第三者による偽装防止が容易である。 In the examples shown in Figures 1 and 3, the RFID tag 20 is provided on the inner surface of the bulk case 2, but the RFID tag 20 may be provided on the outer surface of the bulk case 2. However, providing the RFID tag 20 on the inner surface of the bulk case 2 makes it easier to prevent counterfeiting by a third party.
《第２の実施形態》
　第１の実施形態では、蓋６のスライドに応じて導電体１３とＲＦＩＤタグ２０のアンテナとの近接具合が変化する例を示したが、第２の実施形態では、電子部品収納体の上下の向きに応じて導電体１３とＲＦＩＤタグ２０のアンテナとの近接具合が変化する例を示す。 Second Embodiment
In the first embodiment, an example is shown in which the proximity between the conductor 13 and the antenna of the RFID tag 20 changes depending on the sliding of the lid 6, whereas in the second embodiment, an example is shown in which the proximity between the conductor 13 and the antenna of the RFID tag 20 changes depending on the up-down orientation of the electronic component storage body.
　図５は本発明に係る第２実施形態として挙げる電子部品収納体１０２の第１状態の構造を示す図である。図５中の左下図は電子部品収納体１０２の縦断面図、図５中の右下図は電子部品収納体１０２の右側面図、左上図は電子部品収納体１０２の上面図である。第２の実施形態の電子部品収納体１０２は、梱包体に梱包されている状態で、各電子部品収納体１０２は図５に示すとおりの向き、すなわち電子部品３の収納部が下側にある向き（取り出し口４が上部にある向き）である。 FIG. 5 is a diagram showing the structure of an electronic component storage body 102 in a first state according to a second embodiment of the present invention. The lower left diagram in FIG. 5 is a vertical cross-sectional view of the electronic component storage body 102, the lower right diagram in FIG. 5 is a right side view of the electronic component storage body 102, and the upper left diagram is a top view of the electronic component storage body 102. When the electronic component storage bodies 102 of the second embodiment are packed in a packaging body, each electronic component storage body 102 is oriented as shown in FIG. 5, i.e., with the storage section for electronic components 3 facing downward (with the removal opening 4 facing upward).
　電子部品収納体１０２は樹脂製のバルクケース２を備える。図５に示す向きでバルクケース２の下部に、多数の電子部品３を収納する電子部品収納部ＳＰ１が形成されていて、この電子部品収納部より上部に余空間ＳＰ２が形成されている。 The electronic component storage unit 102 includes a bulk case 2 made of resin. In the orientation shown in FIG. 5, an electronic component storage section SP1 that stores a large number of electronic components 3 is formed at the bottom of the bulk case 2, and a spare space SP2 is formed above this electronic component storage section.
　バルクケース２は電子部品３の取り出し口４を有する。電子部品収納体１０２は互いに連結されたスライダ５及び蓋６を備える。蓋６はスライダ５の移動にともなって取り出し口４を開閉する。電子部品収納体１０２の運搬時や保管時には、図５に示すとおり、スライダ５は右側に位置して、取り出し口４は蓋６で閉じられている。 The bulk case 2 has an access opening 4 for electronic components 3. The electronic component storage body 102 has a slider 5 and a lid 6 that are connected to each other. The lid 6 opens and closes the access opening 4 as the slider 5 moves. When the electronic component storage body 102 is transported or stored, as shown in FIG. 5, the slider 5 is positioned on the right side and the access opening 4 is closed by the lid 6.
　バルクケース２の内部の余空間ＳＰ２には導電体１３が設けられている。この導電体１３は上下方向に変位可能な状態に設けられている。バルクケース２の内面にはＲＦＩＤタグ２０が配置されている。図５に示す第１状態で、導電体１３はその自重によってＲＦＩＤタグ２０から離れた位置にある。したがって、ＲＦＩＤタグ２０は導電体１３の影響は小さい。 A conductor 13 is provided in the spare space SP2 inside the bulk case 2. This conductor 13 is provided in a state in which it can be displaced in the vertical direction. An RFID tag 20 is placed on the inner surface of the bulk case 2. In the first state shown in FIG. 5, the conductor 13 is located away from the RFID tag 20 due to its own weight. Therefore, the influence of the conductor 13 on the RFID tag 20 is small.
　ＲＦＩＤタグ２０の通信周波数は例えば９００ＭＨｚ帯（８６０ＭＨｚから９２０ＭＨｚ）の範囲である。つまり、このＲＦＩＤタグはＵＨＦ帯を用いるＲＦＩＤタグである。 The communication frequency of the RFID tag 20 is, for example, in the 900 MHz band (860 MHz to 920 MHz) range. In other words, this RFID tag is an RFID tag that uses the UHF band.
　図６は電子部品収納体１０２の第２状態の構造を示す図である。図６中の左上図は電子部品収納体１０２の縦断面図、右上図は電子部品収納体１０２の右側面図、左下図は電子部品収納体１０２の下面図である。第２の実施形態の電子部品収納体１０２は、マウンタに装着されている状態で、電子部品収納体１０２は図６に示すとおりの向きにある。 FIG. 6 is a diagram showing the structure of the electronic component storage body 102 in a second state. The upper left diagram in FIG. 6 is a vertical cross-sectional view of the electronic component storage body 102, the upper right diagram is a right side view of the electronic component storage body 102, and the lower left diagram is a bottom view of the electronic component storage body 102. When the electronic component storage body 102 of the second embodiment is attached to the mounter, the electronic component storage body 102 is oriented as shown in FIG. 6.
　図５では蓋６が取り出し口４を遮蔽している第１状態を示したが、図６は蓋６が取り出し口４を開口している第２状態を示している。また、図５ではスライダ５及び取り出し口４が図５に示す向きで上方にある状態を示したが、図６ではスライダ５及び取り出し口４が図６に示す向きで下方にある状態を示している。図６は電子部品収納体１０２がマウンタに装着された状態である。マウンタに装着される方向は取り出し口４と電子部品３の収納部の構造で判断できる。すなわち、バルクケース２から電子部品３を残さず取り出そうとするため、収納部に対して取り出し口４が重力加速度方向側に寄った状態でマウンタに設置される。 While Fig. 5 shows a first state in which the lid 6 covers the access port 4, Fig. 6 shows a second state in which the lid 6 opens the access port 4. Also, Fig. 5 shows a state in which the slider 5 and access port 4 are upwardly oriented as shown in Fig. 5, Fig. 6 shows a state in which the slider 5 and access port 4 are downwardly oriented as shown in Fig. 6. Fig. 6 shows the electronic component storage body 102 attached to the mounter. The direction in which it is attached to the mounter can be determined by the structure of the access port 4 and the storage section for the electronic components 3. That is, in order to remove all of the electronic components 3 from the bulk case 2, the access port 4 is placed on the mounter in a position closer to the gravitational acceleration direction than the storage section.
　電子部品収納体１０２がマウンタに装着されていない第１状態（図５）では、導電体１３はＲＦＩＤタグ２０から離れている。このことにより、ＲＦＩＤタグ２０は導電体１３の影響を受けずに、本来のＲＦＩＤタグとして作用する。そのため長距離の通信が可能となり、電子部品収納体が梱包箱２００に収納された状態でも読み取ることが可能である。 In the first state (Figure 5) where the electronic component housing 102 is not attached to the mounter, the conductor 13 is separated from the RFID tag 20. This allows the RFID tag 20 to function as an original RFID tag without being affected by the conductor 13. This enables long-distance communication, and allows reading even when the electronic component housing is stored in the packaging box 200.
　電子部品収納体１０２がマウンタに装着された第２状態（図６）では、導電体１３はＲＦＩＤタグ２０に近接する。このことにより、ＲＦＩＤタグ２０は導電体１３の影響を受けて、本来のＲＦＩＤタグよりアンテナ利得が低下する。例えば、マウンタに設けられているＲＦＩＤタグリーダライタとＲＦＩＤタグとの最長通信距離は数ｃｍ以内である。そのため、この状態では、マウンタに設けられているタグリーダはマウンタに装着されているタグリーダ直近のバルクケースのＲＦＩＤタグのみを読み取ること（または読み書きすること）ができる。 In the second state (Figure 6) in which the electronic component storage unit 102 is attached to the mounter, the conductor 13 is close to the RFID tag 20. As a result, the RFID tag 20 is affected by the conductor 13, and the antenna gain is lower than that of an original RFID tag. For example, the maximum communication distance between the RFID tag reader/writer provided on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader provided on the mounter can only read (or read and write) the RFID tag in the bulk case that is closest to the tag reader attached to the mounter.
　なお、図５、図６では、電子部品３の取り出し可能な方向にバルクケース２が設置された場合に、導電体１３の自重によりその導電体１３がＲＦＩＤタグ２０のアンテナに近接する例を示したが、導電体１３が強磁性体であれば、例えばマウンタ等の外部構造体に磁石を設けてもよい。そのことにより、導電体１３がその自重によりＲＦＩＤタグ２０のアンテナに近接する際に、導電体１３がその方向に上記磁石に吸引されるように構成してもよい。このことにより、導電体１３をＲＦＩＤタグ２０のアンテナにより確実に近接させることができる。 Note that Figures 5 and 6 show an example in which the weight of the conductor 13 brings the conductor 13 close to the antenna of the RFID tag 20 when the bulk case 2 is placed in a direction that allows the electronic component 3 to be removed. However, if the conductor 13 is a ferromagnetic material, a magnet may be provided on an external structure such as a mount. This may allow the conductor 13 to be configured so that when the conductor 13 approaches the antenna of the RFID tag 20 due to its own weight, the conductor 13 is attracted to the magnet in that direction. This makes it possible to more reliably bring the conductor 13 close to the antenna of the RFID tag 20.
　第１の実施状態では、蓋６を可動することで通信可能距離を変更していたが、第２の実施状態では、蓋６に関係なく電子部品収納体の向きを変えることで通信可能距離を変更できる。このことから、電子部品３を取り出さずにタグリーダ直近のバルクケース２のみの情報を読み取ることができ、例えば、マウンタへの装着を間違えた場合も電子部品３をロスすることなく付け替えることが可能となる。 In the first implementation state, the communication distance was changed by moving the lid 6, but in the second implementation state, the communication distance can be changed by changing the orientation of the electronic component housing, regardless of the lid 6. This makes it possible to read information from only the bulk case 2 closest to the tag reader without removing the electronic component 3, and, for example, makes it possible to replace the electronic component 3 without losing it, even if it is attached to the wrong mounter.
　第２の実施形態では、図５に示したように、マウンタに装着しない状態で、導電体１３がＲＦＩＤタグ２０から離間した状態で、導電体１３がＲＦＩＤタグ２０と電子部品３との間に存在する。そのため、電子部品３の量に係わらずにＲＦＩＤタグ２０の特性を安定化させることができる。すなわち、電子部品にも金属部が含まれる場合、電子部品収納部ＳＰ１に含まれる電子部品の量によってＲＦＩＤタグ２０のアンテナと電子部品３内の金属部との距離が変わるので、そのことでＲＦＩＤタグ２０のアンテナの放射特性が変化するが、図５に示したように、導電体１３がＲＦＩＤタグ２０のアンテナと電子部品収納部ＳＰ１との間に存在することにより、アンテナの放射特性が電子部品の量に依らず一定となる。 In the second embodiment, as shown in FIG. 5, when not mounted on a mounter, the conductor 13 is spaced apart from the RFID tag 20 and is present between the RFID tag 20 and the electronic component 3. Therefore, the characteristics of the RFID tag 20 can be stabilized regardless of the amount of electronic components 3. In other words, if the electronic component also contains metal parts, the distance between the antenna of the RFID tag 20 and the metal parts in the electronic component 3 changes depending on the amount of electronic components contained in the electronic component storage section SP1, which changes the radiation characteristics of the antenna of the RFID tag 20. However, as shown in FIG. 5, by having the conductor 13 present between the antenna of the RFID tag 20 and the electronic component storage section SP1, the radiation characteristics of the antenna become constant regardless of the amount of electronic components.
《第３の実施形態》
　第３の実施形態では、第２の実施形態の場合と同様に、電子部品収納体の上下の向きに応じて導電体１３とＲＦＩＤタグ２０のアンテナとの近接具合が変化する例を示す。 Third Embodiment
In the third embodiment, similarly to the second embodiment, an example will be shown in which the proximity between the conductor 13 and the antenna of the RFID tag 20 changes depending on the up-down orientation of the electronic component housing.
　図７は本発明に係る第３実施形態として挙げる電子部品収納体１０３の第２状態の構造を示す図である。図７中の左図は電子部品収納体１０３の縦断面図、右図は電子部品収納体１０３の右側面図である。第３の実施形態の電子部品収納体１０３は、マウンタに装着されている状態で、図７に示すとおりの向きにある。 FIG. 7 is a diagram showing the structure of an electronic component storage body 103 in a second state, which is given as a third embodiment of the present invention. The left figure in FIG. 7 is a vertical cross-sectional view of the electronic component storage body 103, and the right figure is a right side view of the electronic component storage body 103. The electronic component storage body 103 of the third embodiment is oriented as shown in FIG. 7 when attached to a mounter.
　この第３の実施形態では、導電体１３は基板４１に形成されている。その基板４１には、マウンタ等の外部構造体に設けられた磁石３０に吸引される強磁性体部材４０が設けられている。その他の構成は第２の実施形態で示した電子部品収納体１０２と同様である、
　第３の実施形態によれば、基板４１、導電体１３及び強磁性体部材４０の自重により導電体１３がＲＦＩＤタグ２０のアンテナに近接する状態にあるとき、強磁性体部材４０が磁石３０に吸引される。そのことにより、導電体１３は非磁性体であるＣｕやＡｌ等で形成できる。また、基板４１、導電体１３及び強磁性体部材４０の移動をより確実なものとすることができる。なお、強磁性体部材４０は、磁石３０に吸引される極性に配置された磁石であってもよい。 In the third embodiment, the conductor 13 is formed on a substrate 41. The substrate 41 is provided with a ferromagnetic member 40 that is attracted to a magnet 30 provided on an external structure such as a mounter. The other configurations are similar to those of the electronic component housing 102 shown in the second embodiment.
According to the third embodiment, when the conductor 13 is in a state where it is close to the antenna of the RFID tag 20 due to the weight of the substrate 41, the conductor 13, and the ferromagnetic member 40, the ferromagnetic member 40 is attracted to the magnet 30. This allows the conductor 13 to be made of a non-magnetic material such as Cu or Al. This also makes it possible to more reliably move the substrate 41, the conductor 13, and the ferromagnetic member 40. The ferromagnetic member 40 may be a magnet arranged with a polarity that is attracted to the magnet 30.
《第４の実施形態》
　第４の実施形態では、導電体を吸引する磁力に応じて導体パターンとＲＦＩＤタグとの近接具合が変化する例を示す。 Fourth embodiment
In the fourth embodiment, an example will be shown in which the proximity between a conductor pattern and an RFID tag changes depending on the magnetic force that attracts a conductor.
　図８は本発明に係る第４の実施形態として挙げる電子部品収納体１０４の第１状態の構造を示す図であり、電子部品収納体１０４の縦断面図である。 FIG. 8 is a diagram showing the structure of an electronic component housing 104 in a first state according to a fourth embodiment of the present invention, and is a vertical cross-sectional view of the electronic component housing 104.
　電子部品収納体１０４は樹脂製のバルクケース２を備える。図８に示す向きでバルクケース２の上部に、多数の電子部品３を収納する電子部品収納部ＳＰ１が形成されていて、この電子部品収納部より下部に余空間ＳＰ２が形成されている。 The electronic component storage body 104 includes a bulk case 2 made of resin. In the orientation shown in FIG. 8, an electronic component storage section SP1 that stores a large number of electronic components 3 is formed in the upper part of the bulk case 2, and a spare space SP2 is formed below this electronic component storage section.
　バルクケース２の内部の余空間には導電体１３が設けられている。この導電体１３は電磁石３１による吸引及び弾性により上下方向に変位可能な状態となる位置に設けられている。また、バルクケース２の内面にはＲＦＩＤタグ２０が配置されている。導電体１３は鉄板等の強磁性体板であるが、図８に示す状態では導電体１３が電磁石３１に吸引されていない状態である。したがって、ＲＦＩＤタグ２０は導電体１３の影響を受けない。 A conductor 13 is provided in the spare space inside the bulk case 2. The conductor 13 is positioned so that it can be displaced vertically due to the attraction of the electromagnet 31 and its elasticity. An RFID tag 20 is also placed on the inner surface of the bulk case 2. The conductor 13 is a ferromagnetic plate such as an iron plate, but in the state shown in Figure 8, the conductor 13 is not attracted to the electromagnet 31. Therefore, the RFID tag 20 is not affected by the conductor 13.
　図９は電子部品収納体１０３の第２状態の縦断面図である。図８では導電体１３が電磁石に吸引されていない状態を示したが、図９は導電体１３が電磁石に吸引されている状態を示している。また、図９では、蓋６が取り出し口４を開口している状態を示している。図９は電子部品収納体１０３がマウンタに装着された状態である。 Figure 9 is a vertical cross-sectional view of the electronic component storage body 103 in the second state. While Figure 8 shows the state in which the conductor 13 is not attracted to the electromagnet, Figure 9 shows the state in which the conductor 13 is attracted to the electromagnet. Figure 9 also shows the state in which the lid 6 opens the removal opening 4. Figure 9 shows the electronic component storage body 103 attached to the mounter.
　電子部品収納体１０３がマウンタに装着されていない状態では、図８に示したように、導電体１３はＲＦＩＤタグ２０から離れた第１状態となっている。このことにより、ＲＦＩＤタグ２０は導電体１３の影響を受けずに、長距離の通信が可能なＲＦＩＤタグとして作用する。電磁石３１は例えばフェライトを磁芯とする電磁石である。そのため、図８に示したように、ＲＦＩＤタグ２０に電磁石３１が近接していてもＲＦＩＤタグ２０は電磁石３１の導電性の影響を受けない。 When the electronic component storage unit 103 is not attached to the mounter, the conductor 13 is in a first state away from the RFID tag 20 as shown in FIG. 8. This allows the RFID tag 20 to function as an RFID tag capable of long-distance communication without being affected by the conductor 13. The electromagnet 31 is, for example, an electromagnet with a ferrite core. Therefore, as shown in FIG. 8, even if the electromagnet 31 is close to the RFID tag 20, the RFID tag 20 is not affected by the conductivity of the electromagnet 31.
　電子部品収納体１０３がマウンタに装着された状態では、電子部品収納体１０３は図９に示すように導電体１３が電磁石３１により導電体１３が吸引された第２状態となっている。このことにより、ＲＦＩＤタグ２０は導電体１３の影響を受けて、アンテナ利得が低下する。例えば、マウンタに設けられているＲＦＩＤタグリーダライタとＲＦＩＤタグとの最長通信距離は数ｃｍ以内である。そのため、この状態では、マウンタに設けられているタグリーダはマウンタに装着されているタグリーダ直近のバルクケースのＲＦＩＤタグのみを読み取ること（または読み書きすること）ができる。 When the electronic component storage body 103 is attached to the mounter, the electronic component storage body 103 is in a second state in which the conductor 13 is attracted by the electromagnet 31 as shown in FIG. 9. This causes the RFID tag 20 to be affected by the conductor 13, reducing the antenna gain. For example, the maximum communication distance between the RFID tag reader/writer provided on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader provided on the mounter can only read (or read and write) the RFID tag in the bulk case closest to the tag reader attached to the mounter.
　導電体１３は、例えばその端部である支持部を余空間ＳＰ２から電子部品収納部ＳＰ１側へ差し込んでもよい。つまり、導電体１３を固定することなく、それを余空間ＳＰ２の電子部品収納部ＳＰ１寄りに設置してもよい。つまり、電磁石３１で吸引されたときに導電体１３が抜けないように構成しておけばよい。そのことで、導電体１３を自由に変形させることができる一方、導電体１３に形状維持する剛性を持たせておくことで、電磁石３１が無い場合には図８に示したような直線形状に戻ることで、アンテナ特性を安定させることができる。 The conductor 13 may, for example, have its end, which is the support portion, inserted from the spare space SP2 into the electronic component storage section SP1 side. In other words, the conductor 13 may be placed in the spare space SP2 closer to the electronic component storage section SP1 without being fixed. In other words, it is sufficient to configure the conductor 13 so that it does not come out when attracted by the electromagnet 31. This allows the conductor 13 to be freely deformed, while at the same time providing the rigidity to the conductor 13 to maintain its shape, thereby stabilizing the antenna characteristics by returning to a linear shape as shown in FIG. 8 when the electromagnet 31 is not present.
　また、導電体１３は変形可能な基板上に形成されていてもよく、電磁石３１による吸引力での変形と、電磁石３１の無い場合での復元力とを、基板と導電体１３の剛性を組み合わせて調整してもよい。 In addition, the conductor 13 may be formed on a deformable substrate, and the deformation due to the attractive force of the electromagnet 31 and the restoring force in the absence of the electromagnet 31 may be adjusted by combining the rigidity of the substrate and the conductor 13.
　なお、電磁石３１の磁力の強度を多段階にすることによってＲＦＩＤタグ２０に対する導電体１３の距離を多段階に設定できるようにし、そのことでアンテナ利得を多段階に制御してもよい。 In addition, the magnetic force strength of the electromagnet 31 can be set in multiple stages, allowing the distance of the conductor 13 from the RFID tag 20 to be set in multiple stages, thereby controlling the antenna gain in multiple stages.
　また、電磁石３１のオンオフをスライダ５の操作に連動させてもよいが、本実施形態ではスライダ５の操作とは連動させずに電磁石３１のオンオフが可能である。そのことで、電子部品３を取り出さない状態で、マウンタに装着された電子部品３の種類を判定でき、取り出し口４を開口することによる電子部品３のロスをなくせる。 The electromagnet 31 may be turned on and off in conjunction with the operation of the slider 5, but in this embodiment, the electromagnet 31 can be turned on and off independently of the operation of the slider 5. This makes it possible to determine the type of electronic component 3 mounted on the mounter without removing the electronic component 3, and eliminates the loss of electronic components 3 caused by opening the removal port 4.
　さらに、図９に示した例では、導電体１３の両端を固定したが、片端のみを固定してもよい。 Furthermore, in the example shown in FIG. 9, both ends of the conductor 13 are fixed, but only one end may be fixed.
　最後に、本発明は上述した各実施形態に限られるものではない。当業者によって適宜変形及び変更が可能である。本発明の範囲は、上述の各実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲内と均等の範囲内での実施形態からの変形及び変更が含まれる。 Finally, the present invention is not limited to the above-described embodiments. Appropriate modifications and changes are possible by those skilled in the art. The scope of the present invention is indicated by the claims, not by the above-described embodiments. Furthermore, the scope of the present invention includes modifications and changes from the embodiments within the scope of the claims and the equivalent range.
　例えば、電子部品は直方体形状に限らず、例えば円柱状などであってもよい。 For example, electronic components are not limited to being rectangular in shape, but may also be cylindrical, for example.
　また、以上の各実施形態では、ＲＦＩＤタグ２０をバルクケース２の下面又は上面に貼り付けた例を示したが、バルクケース２の側面に形成してもよい。 In addition, in each of the above embodiments, an example has been shown in which the RFID tag 20 is attached to the bottom or top surface of the bulk case 2, but it may also be formed on the side surface of the bulk case 2.
　本発明の電子部品は次に記載の各態様で提供されてもよい。 The electronic component of the present invention may be provided in any of the following forms:
＜１＞
　複数の電子部品が収納可能なバルクケースと、当該バルクケースを識別するためのＲＦＩＤタグと、導電体とを備え、
　前記ＲＦＩＤタグは、ＲＦＩＣと、当該ＲＦＩＣに電気的に接続するアンテナと、を有し、
　前記導電体は、前記アンテナに対して変位可能である、
　電子部品収納体。 ＜1＞
A bulk case capable of storing a plurality of electronic components, an RFID tag for identifying the bulk case, and a conductor;
The RFID tag has an RFIC and an antenna electrically connected to the RFIC,
the conductor is displaceable relative to the antenna;
Electronic component storage unit.
＜２＞
　前記アンテナの平面視で、前記導電体は前記アンテナに対して重なる位置と重ならない位置とに変位可能である、
　＜１＞に記載の電子部品収納体。 ＜2＞
In a plan view of the antenna, the conductor is displaceable between a position where it overlaps the antenna and a position where it does not overlap the antenna.
The electronic component housing according to <1>.
＜３＞
　前記バルクケースに対して変位可能な基材を備え、
　前記導電体は、前記基材に形成され、前記基材の変位により前記アンテナに対する前記導電体の位置が変化する、
　＜１＞又は＜２＞に記載の電子部品収納体。 ＜3＞
A base member displaceable relative to the bulk case,
the conductor is formed on the base material, and a position of the conductor with respect to the antenna changes due to a displacement of the base material;
The electronic component housing according to <1> or <2>.
＜４＞
　前記バルクケースに対して変位可能な基材を備え、
　前記ＲＦＩＤタグは、前記基材に形成され、前記基材の変位により前記アンテナに対する前記導電体の位置が変化する、
　＜１＞又は＜２＞に記載の電子部品収納体。 ＜4＞
A base member displaceable relative to the bulk case,
The RFID tag is formed on the base material, and a position of the conductor relative to the antenna changes due to a displacement of the base material.
The electronic component housing according to <1> or <2>.
＜５＞
　前記電子部品が取り出し可能な方向に前記バルクケースが設置された場合に、前記導電体の自重により当該導電体は前記アンテナに近接し、前記電子部品が取り出し可能ではない方向に前記バルクケースが設置された場合に、前記導電体は前記アンテナから離間する、
　＜１＞に記載の電子部品収納体。 ＜5＞
When the bulk case is placed in a direction in which the electronic components can be removed, the conductor is brought close to the antenna due to its own weight, and when the bulk case is placed in a direction in which the electronic components cannot be removed, the conductor is moved away from the antenna.
The electronic component housing according to <1>.
＜６＞
　前記導電体は外部構造体に設けられた磁石に吸引される強磁性体であり、
　前記導電体は前記自重による前記アンテナに近接する方向に前記磁石に吸引される、
　＜５＞に記載の電子部品収納体。 ＜6＞
the conductor is a ferromagnetic material that is attracted to a magnet provided in the external structure,
The conductor is attracted to the magnet in a direction approaching the antenna due to its own weight.
The electronic component housing according to <5>.
＜７＞
　前記導電体は基板に形成され、
　前記基板は外部構造体に設けられた磁石に吸引される強磁性体部材を有し、
　前記強磁性体部材は前記自重により前記導電体が前記アンテナに近接する方向に前記磁石に吸引される、
　＜５＞又は＜６＞に記載の電子部品収納体。 ＜７＞
The conductor is formed on a substrate;
the substrate has a ferromagnetic member that is attracted to a magnet provided in an external structure,
The ferromagnetic member is attracted to the magnet by its own weight in a direction in which the conductor approaches the antenna.
The electronic component housing according to <5> or <6>.
＜８＞
　前記磁石による吸引の強度により前記アンテナに対する前記導電体の間隔が変化する、
　＜６＞又は＜７＞に記載の電子部品収納体。 ＜8＞
The distance between the conductor and the antenna is changed depending on the strength of attraction by the magnet.
The electronic component housing according to <6> or <7>.
＜９＞
　前記磁石は電磁石であり、当該電磁石に対する通電有無によって前記磁石による吸引の強度が変化する、
　＜６＞から＜８＞のいずれかに記載の電子部品収納体。 ＜9＞
The magnet is an electromagnet, and the strength of attraction by the magnet changes depending on whether or not electricity is applied to the electromagnet.
The electronic component housing according to any one of <6> to <8>.
＜１０＞
　前記導電体が形成された基材を備え、当該基材の変位により前記アンテナに対する前記導電体の位置が変位し、
　前記バルクケースは前記基材の変位により前記電子部品の排出を可能とする取り出し口を有し、
　前記基材の変位により前記取り出し口の開口状態で前記導電体と前記ＲＦＩＤタグとが近接する、
　＜１＞から＜４＞のいずれかに記載の電子部品収納体。 ＜10＞
a base material on which the conductor is formed, the position of the conductor being displaced with respect to the antenna by displacement of the base material;
the bulk case has an outlet through which the electronic components can be removed by displacement of the base material,
the displacement of the base material causes the conductor and the RFID tag to come close to each other in an open state of the outlet;
The electronic component housing according to any one of <1> to <4>.
＜１１＞
　＜１＞から＜１０＞のいずれかに記載の複数の電子部品収納体と、これら複数の電子部品収納体を梱包する梱包箱とを備え、
　前記複数の電子部品収納体が前記梱包箱に梱包されて構成される電子部品収納体梱包体。 <11>
A packaging box for packaging a plurality of electronic component housings according to any one of <1> to <10>,
The electronic component housing package is constructed by packaging the plurality of electronic component housings in the packaging box.
ＳＰ１…電子部品収納部
ＳＰ２…余空間
２…バルクケース
３…電子部品
４…取り出し口
５…スライダ
６…蓋（基材）
７…ＲＦＩＣ
１３…導電体
１４…ＲＦＩＤタグシート
１５…放射電極
１６…端部電極
２０…ＲＦＩＤタグ
３０…磁石
３１…電磁石
４０…強磁性体部材
４１…基板
１０１～１０４…電子部品収納体
２００…梱包箱
２０１…電子部品収納体梱包体 SP1: Electronic component storage section SP2: Spare space 2: Bulk case 3: Electronic component 4: Access port 5: Slider 6: Lid (base material)
7. RFIC
13...conductor 14...RFID tag sheet 15...radiating electrode 16...end electrode 20...RFID tag 30...magnet 31...electromagnet 40...ferromagnetic member 41...substrates 101 to 104...electronic component housing 200...packaging box 201...packaging body for electronic component housing

Claims (11)

  1. 　複数の電子部品が収納可能なバルクケースと、当該バルクケースを識別するためのＲＦＩＤタグと、導電体とを備え、
    　前記ＲＦＩＤタグは、ＲＦＩＣと、当該ＲＦＩＣに電気的に接続するアンテナと、を有し、
    　前記導電体は、前記アンテナに対して変位可能である、
    　電子部品収納体。     A bulk case capable of storing a plurality of electronic components, an RFID tag for identifying the bulk case, and a conductor;
    The RFID tag has an RFIC and an antenna electrically connected to the RFIC,
    the conductor is displaceable relative to the antenna;
    Electronic component storage unit.
  2. 　前記アンテナの平面視で、前記導電体は前記アンテナに対して重なる位置と重ならない位置とに変位可能である、
    　請求項１に記載の電子部品収納体。     In a plan view of the antenna, the conductor is displaceable between a position where it overlaps the antenna and a position where it does not overlap the antenna.
    The electronic component housing according to claim 1 .
  3. 　前記バルクケースに対して変位可能な基材を備え、
    　前記導電体は、前記基材に形成され、前記基材の変位により前記アンテナに対する前記導電体の位置が変化する、
    　請求項１又は請求項２に記載の電子部品収納体。     a base member displaceable relative to the bulk case;
    the conductor is formed on the base material, and a position of the conductor with respect to the antenna changes due to a displacement of the base material;
    The electronic component housing according to claim 1 or 2.
  4. 　前記バルクケースに対して変位可能な基材を備え、
    　前記ＲＦＩＤタグは、前記基材に形成され、前記基材の変位により前記アンテナに対する前記導電体の位置が変化する、
    　請求項１又は請求項２に記載の電子部品収納体。     A base member displaceable relative to the bulk case,
    The RFID tag is formed on the base material, and a position of the conductor relative to the antenna changes due to a displacement of the base material.
    The electronic component housing according to claim 1 or 2.
  5. 　前記電子部品が取り出し可能な方向に前記バルクケースが設置された場合に、前記導電体の自重により当該導電体は前記アンテナに近接し、前記電子部品が取り出し可能ではない方向に前記バルクケースが設置された場合に、前記導電体は前記アンテナから離間する、
    　請求項１に記載の電子部品収納体。     When the bulk case is placed in a direction in which the electronic components can be removed, the conductor is brought close to the antenna due to its own weight, and when the bulk case is placed in a direction in which the electronic components cannot be removed, the conductor is moved away from the antenna.
    The electronic component housing according to claim 1 .
  6. 　前記導電体は外部構造体に設けられた磁石に吸引される強磁性体であり、
    　前記導電体は前記自重による前記アンテナに近接する方向に前記磁石に吸引される、
    　請求項５に記載の電子部品収納体。     the conductor is a ferromagnetic material that is attracted to a magnet provided in the external structure,
    The conductor is attracted to the magnet in a direction approaching the antenna due to its own weight.
    The electronic component housing according to claim 5 .
  7. 　前記導電体は基板に形成され、
    　前記基板は外部構造体に設けられた磁石に吸引される強磁性体部材を有し、
    　前記強磁性体部材は前記自重により前記導電体が前記アンテナに近接する方向に前記磁石に吸引される、
    　請求項５に記載の電子部品収納体。     The conductor is formed on a substrate;
    the substrate has a ferromagnetic member that is attracted to a magnet provided in an external structure,
    The ferromagnetic member is attracted to the magnet by its own weight in a direction in which the conductor approaches the antenna.
    The electronic component housing according to claim 5 .
  8. 　前記磁石による吸引の強度により前記アンテナに対する前記導電体の間隔が変化する、
    　請求項６又は請求項７に記載の電子部品収納体。     The distance between the conductor and the antenna is changed depending on the strength of attraction by the magnet.
    The electronic component housing according to claim 6 or 7.
  9. 　前記磁石は電磁石であり、当該電磁石に対する通電有無によって前記磁石による吸引の強度が変化する、
    　請求項６から請求項８のいずれかに記載の電子部品収納体。     The magnet is an electromagnet, and the strength of attraction by the magnet changes depending on whether or not electricity is applied to the electromagnet.
    The electronic component housing according to any one of claims 6 to 8.
  10. 　前記バルクケースは前記基材の変位により前記電子部品の排出を可能とする取り出し口を有し、
    　前記基材の変位により前記取り出し口の開口状態で前記導電体と前記ＲＦＩＤタグとが近接する、
    　請求項３に記載の電子部品収納体。     the bulk case has an outlet through which the electronic components can be removed by displacement of the base material,
    the displacement of the base material causes the conductor and the RFID tag to come close to each other in an open state of the outlet;
    The electronic component housing according to claim 3 .
  11. 　請求項１から請求項１０のいずれかに記載の複数の電子部品収納体と、これら複数の電子部品収納体を梱包する梱包箱とを備え、
    　前記複数の電子部品収納体が前記梱包箱に梱包されて構成される電子部品収納体梱包体。     A packaging box for packaging a plurality of electronic component housings according to any one of claims 1 to 10,
    The electronic component housing package is constructed by packaging the plurality of electronic component housings in the packaging box.
PCT/JP2023/037392 2022-10-28 2023-10-16 Electronic component accommodation body and electronic component accommodation body package WO2024090267A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5881782A (en) * 1997-10-20 1999-03-16 Motorola, Inc. Hopper with cartridge opener
JP2005348030A (en) * 2004-06-02 2005-12-15 Fujita Denki Seisakusho:Kk Container for transportation utilizing rfid tag and system thereof
JP2011097256A (en) * 2009-10-28 2011-05-12 Denso Wave Inc Non-contact information communication apparatus
WO2020079961A1 (en) * 2018-10-15 2020-04-23 株式会社村田製作所 Method for manufacturing wireless communication device and apparatus for manufacturing wireless communication device
WO2022181557A1 (en) * 2021-02-26 2022-09-01 株式会社村田製作所 Case
JP2022143817A (en) * 2021-03-18 2022-10-03 株式会社村田製作所 Component storage device
JP2022147343A (en) * 2021-03-23 2022-10-06 株式会社村田製作所 Component storage device and production management system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5881782A (en) * 1997-10-20 1999-03-16 Motorola, Inc. Hopper with cartridge opener
JP2005348030A (en) * 2004-06-02 2005-12-15 Fujita Denki Seisakusho:Kk Container for transportation utilizing rfid tag and system thereof
JP2011097256A (en) * 2009-10-28 2011-05-12 Denso Wave Inc Non-contact information communication apparatus
WO2020079961A1 (en) * 2018-10-15 2020-04-23 株式会社村田製作所 Method for manufacturing wireless communication device and apparatus for manufacturing wireless communication device
WO2022181557A1 (en) * 2021-02-26 2022-09-01 株式会社村田製作所 Case
JP2022143817A (en) * 2021-03-18 2022-10-03 株式会社村田製作所 Component storage device
JP2022147343A (en) * 2021-03-23 2022-10-06 株式会社村田製作所 Component storage device and production management system

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