WO2024088493A1 - A folded probe device for an antenna - Google Patents

A folded probe device for an antenna Download PDF

Info

Publication number
WO2024088493A1
WO2024088493A1 PCT/EP2022/079493 EP2022079493W WO2024088493A1 WO 2024088493 A1 WO2024088493 A1 WO 2024088493A1 EP 2022079493 W EP2022079493 W EP 2022079493W WO 2024088493 A1 WO2024088493 A1 WO 2024088493A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
probes
substrate
pair
layer
Prior art date
Application number
PCT/EP2022/079493
Other languages
French (fr)
Inventor
Ajay Babu Guntupalli
Dmitrij SEMILOVSKY
Tekin ÖLMEZ
Dieter Zierhut
Christian Helbig
Liansong WANG
Qiangguo Zhou
Serban REBEGEA
Sebastian ILSANKER
Bernhard Rist
Juan Segador Alvarez
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to PCT/EP2022/079493 priority Critical patent/WO2024088493A1/en
Publication of WO2024088493A1 publication Critical patent/WO2024088493A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H01Q19/108—Combination of a dipole with a plane reflecting surface

Definitions

  • the present disclosure relates to antennas, for instance, antennas suitable for entities in a mobile communication network.
  • the disclosure provides a probe device for such an antenna.
  • the probe device comprises one or more folded probe structures, wherein each folded probe structured includes a pair of probes and a balun.
  • the limitation of one antenna per sector is still a very strict requirement.
  • the weight of the antennas cannot be allowed to grow linearly with the number of bands, but needs to be kept as low as possible to facilitate installation and site acquisition.
  • Foldable structures may play a role in future antenna designs, as they allow creating relatively complex 3D structures at low cost and with low weight. In particular, they may help to reduce the number of parts and interconnections and to maintain low weight and cost.
  • one or more probes on the one hand side, and one or more baluns on the other hand side are provided as separate components. To connect these separate components, typically a soldering process is required, which is elaborate.
  • This disclosure has the aim to provide a probe device for an antenna, which addresses the above- mentioned challenges for the antenna.
  • An objective is to enable an antenna that integrates several bands in a cost efficient way and has a low weight.
  • Another objective is an antenna with a low complexity, a reduced number of components, and a simple manufacturing process.
  • a first aspect of this disclosure provides a probe device for an antenna, the probe device comprising: a first flexible layer; a first conductive layer provided on the first flexible layer; wherein a first part of the first conductive layer comprises a first pair of probes, and a second part of the first conductive layer comprises a first balun for feeding the first pair of probes with a radio frequency (RF) signal; wherein a plane of the first part of the first conductive layer is inclined towards a plane of the second part of the first conductive layer; and wherein the first flexible layer and the first conductive layer are bent between the first part and the second part of the first conductive layer.
  • RF radio frequency
  • the first pair of probes and the first balun which are made from the first conductive layer and are provided on the first flexible layer, may form a first folded probe structure, due to the bend between the first part and the second part of the first conductive layer.
  • the probe device may comprise one or more such folded probe structures.
  • the first balun configured to feed the first pair of probes may be fabricated in the same flat part (comprising the first conductive layer provided on the first flexible layer), and may then be folded upward to reach the inclination of the plane of the first part of the first conductive layer towards the plane of the second part of the first conductive layer. Therefore, elaborate solder connections may be avoided.
  • the probe device of the first aspect may help to reduce the complexity of the antenna for which it is designed.
  • the probe device itself is easy to manufacture and of low complexity.
  • the probe device may further fulfill the requirements of the next generation of base station antennas. Multiple probe device according to the first aspect could be used to build an antenna that integrates several bands in a cost efficient way and has a low weight.
  • the probe device further comprises a second flexible layer; a second conductive layer provided on the second flexible layer; wherein a first part of the second conductive layer comprises a second pair of probes, and a second part of the second conductive layer comprises a second balun for feeding the second pair of probes with the RF signal; wherein a plane of the first part of the second conductive layer is inclined towards a plane of the second part of the second conductive layer; and wherein the second flexible layer and the second conductive layer are bent between the first part and the second part of the second conductive layer.
  • the second pair of probes and the second balun which are made from the second conductive layer and are provided on the second flexible layer, may form a second folded probe structure, due to the bend between the first part and the second part of the second conductive layer.
  • the probe device may comprise one or more folded probe structures.
  • the probe device comprises a first device part and a second device part, wherein the first device part comprises the first flexible layer and the first conductive layer; the second device part comprises the second flexible layer and the second conductive layer; and the first device part and the second device part are arranged such with respect to each other that the first pair of probes and the second pair of probes form a radiating element or form a probe arrangement for feeding radiating element.
  • the first device part may comprise the first folded probe structure
  • the second device part may comprise the second folded probe structure.
  • the folded probe structures may be combined to form the radiating element or probe arrangement for feeding the radiating element.
  • the first pair of probes and the second pair of probes together form a dual-polarized radiating element, tri-polarized radiating element, or quad-polarized radiating element, configured to radiate the RF signal.
  • the probe device further comprises a radiating element configured to radiate the RF signal, wherein the first pair of probes and the second pair of probes together form a probe arrangement configured to feed the RF signal to the radiating element.
  • the radiating element is a patch radiating element, a dipole radiating element, or a slot radiating element.
  • the radiating element and the probe arrangement are an integral part.
  • the first flexible layer and the first conductive layer between the first part and the second part of the first conductive layer are configured as a bendable hinge; and/or the second flexible layer and the second conductive layer between the first part and the second part of the second conductive layer are configured as a bendable hinge.
  • the first flexible layer and the first conductive layer are formed by an aluminum foil laminate; and/or the second flexible layer and the second conductive layer are formed by an aluminum foil laminate.
  • the aluminum foil laminate allows creating the bent/folded (3D) structures at low cost and with low weight.
  • the probe device comprises a planar first substrate and a planar second substrate, which are inclined to each other, and a planar third substrate and a planar fourth substrate, which are inclined to each other, wherein the first flexible layer is provided on the first substrate and on the second substrate; the first part of the first conductive layer is arranged above the first substrate and the second part of the first conductive layer is arranged above the second substrate; the second flexible layer is provided on the third substrate and on the fourth substrate; and the first part of the second conductive layer is arranged above the third substrate and the second part of the second conductive layer is arranged above the fourth substrate.
  • the substrates may help to stabilize the folded probe structures in the probe device.
  • the first flexible layer is further arranged and across a gap between the first substrate and the second substrate, and/or the second flexible layer is further arranged across a gap between the third substrate and the fourth substrate; or the first substrate and the second substrate are an integral part, and/or the third substrate and the fourth substrate are an integral part.
  • At least one of the first substrate, the second substrate, the third substrate, and the fourth substrate is made of a polymer material.
  • a polymer material is stable but of light weight, and is moreover cheap.
  • the probe device further comprises a feeding network connected to the first balun and/or to the second balun, and configured to feed the RF signal to the first balun and/or to the second balun.
  • the feeding network can be made from or in the same first and/or second conductive layer, from which the first and/or second balun is made. This simplifies the manufacturing process.
  • the probe device further comprises a reflector coupled to or acting as a ground plane, wherein the first balun and/or the second balun is capacitively coupled to the reflector.
  • a second aspect of this disclosure provides a method for fabricating a probe device for an antenna, the method comprising: forming a first flexible layer; forming a first conductive layer on the first flexible layer, wherein a first part of the first conductive layer comprises a first pair of probes, and a second part of the first conductive layer comprises a first balun for feeding the first pair of probes with a RF signal; and bending the first flexible layer and the first conductive layer between the first part of the first conductive layer and the second part of the first conductive layer such that a plane of the first part of the first conductive layer is inclined towards a plane of said second part of the first conductive layer.
  • the bending step may also be referred to as a folding step, and may result in the first folded probe structure.
  • the manufacturing method of the second aspect is of low complexity, and leads to a probe device having the advantages described above for the first aspect.
  • the method further comprises forming a second flexible layer; forming a second conductive layer on the second flexible layer, wherein a first part of the second conductive layer comprises a second pair of probes, and a second part of the second conductive layer comprises a second balun for feeding the second pair of probes with the RF signal; and bending the second flexible layer and the second conductive layer between the first part of the second conductive layer and the second part of the second conductive layer such that a plane of said first part of the second conductive layer is inclined towards a plane of said second part of the second conductive layer.
  • the bending step may again be referred to as a folding step, and may result in the second folded probe structure.
  • the probe device comprises a first device part and a second device part; the first device part comprises the first conductive layer and the first flexible layer; the second device part comprises the second conductive layer and the second flexible layer; and the method further comprises arranging the first device part and the second device part such that the first pair of probes and the second pair of probes form a radiating element or form a probe arrangement for feeding a radiating element.
  • the first device part and the second device part are connected together mechanically by inserting one into the other.
  • the first device part and the second device part are formed on an integral 3D printed part.
  • the first pair of probes and the first balun are formed in the first conductive layer by a single etching step; and/or the second pair of probes and the second balun are formed in the second conductive layer bay a single etching step.
  • the first part of the first conductive layer comprises a plurality of first pairs of probes
  • the second part of the first conductive layer comprises a plurality of first baluns, wherein each first balun is configured to feed one of the first pairs of probes with the RF signal.
  • a third part of the first conductive layer comprises a feeding network connected to the first baluns and configured to feed the RF signal to the first baluns.
  • the feeding network can be fabricated in the same conductive layer as the first baluns, which leads to a low complex process.
  • the present disclosure proposes integrating a pair of probes and a balun into one single flat part, for instance based on an aluminum foil laminate, and then bending/folding the flat part to create a 3D structure with the inclination of planes of the first part and the second part of the conductive layer(s). All traces of the pair of probes and the balun may be etched in a single conductive layer. Therefore, an aluminum foil laminate with a lamination of the foil on only one side is sufficient, simplifying a lot the manufacturing process.
  • the probe device of this disclosure can be used, depending on the dimensions of the pairs(s) of probes in terms of wavelength, as radiating element itself or to feed additional a radiating element arranged on top of it (e.g., patches, slots or parasitic dipoles). In this way the probe device can be used to build antennas integrating several bands. For instance, a radiating element formed by the probe device itself may be configured to radiate in a different band than a radiating element fed by the probe device. Those and more radiating elements could be combined in the antenna.
  • FIG. 1 shows a probe device according to this disclosure.
  • FIG. 2 shows a first part and a second part of an exemplary probe device in a flat state.
  • FIG. 3 shows a folding operation and an assembly of the first part and second part of an exemplary probe device according to this disclosure
  • FIG. 4 shows an exemplary probe device according to this disclosure, wherein the pairs of probes form a standalone radiating element.
  • FIG. 5 shows a probe device according to this disclosure, wherein the pairs of probes form a probe arrangement for feeding a slot radiating element.
  • FIG. 6 shows a layer stack of a probe device according to this disclosure.
  • FIG. 7 shows (a) an exemplary probe device in the flat state; and (b) the probe device in the folded state according to this disclosure.
  • FIG. 8 compares (a) a probe device according to this disclosure with (b) a conventional probe device.
  • FIG. 9 shows an arrangement of multiple probe devices in the flat state including a feeding network.
  • FIG. 10 shows a system environment in which one or more probe devices according to this disclosure can be implemented.
  • FIG. 11 shows a specific implementation of one or more probe devices according to this disclosure.
  • FIG. 12 shows an arrangement of multiple probe devices according to this disclosure in the flat state.
  • FIG. 13 shows a method for fabricating a probe device according to this disclosure.
  • FIG. 1 shows a probe device 100 according to this disclosure.
  • the probe device 100 is for an antenna.
  • the antenna may comprise multiple probe devices 100 according to this disclosure.
  • the antenna may be an antenna for a device of a mobile network, in particular, of a 5G mobile network.
  • This device may be a network entity or user equipment.
  • the antenna may support multiple bands including new bands, like the 700 MHz band and/or the 3.5 GHz band.
  • the probe device 100 comprises a first flexible layer 101, and a first conductive layer 102 provided on the first flexible layer 101.
  • the first conductive layer 102 may be deposited on the first flexible layer 101.
  • the first conductive layer 102 may be structured, wherein the structuring of the first conductive layer 102 may be done in an etching step during the manufacturing process of the probe device 100.
  • the first conductive layer 102 may comprise a first part and a second part.
  • the first part comprises a first pair of probes 103
  • the second part comprises a first balun 104 configured to feed the first pair of probes 103 with a RF signal.
  • the first pair of probes 103 and the first balun 104 may be formed during the structuring of the first conductive layer 102, for example, they may be formed by a single etching step of the first conductive layer 102.
  • a plane of the first part of the first conductive layer 102 is inclined towards a plane of the second part of the first conductive layer 102.
  • the two planes can be inclined by 90° with respect to each other, or can be inclined by an angle within a range of 45°-135° with respect to each other.
  • the first flexible layer 101 and the first conductive layer 102 are both bent in a region between the first part and the second part of the first conductive layer 102.
  • the regions of the first flexible layer 101 and the first conductive layer 102, which are arranged between the first part and the second part of the first conductive layer 102, may be configured as a bendable hinge.
  • the above mentioned inclination angle may also be adjustable in the probe device 100.
  • FIG. 2 shows parts of an exemplary probe device 100 according to this disclosure.
  • FIG. 2 shows a first device part 110 and a second device part 210 of the probe device 100, which are not yet assembled together.
  • the first device part 110 comprises (an example of) the first flexible layer 101 and the first conductive layer 102.
  • the plane of the first part of the first conductive layer 102 is not yet inclined towards the plane of the second part of the first conductive layer 102, i.e., the first device part is still in a “flat state” (compared to the “folded state” shown in FIG. 1 or FIG. 3).
  • the second device part 210 comprises a second flexible layer 201 and a second conductive layer 202, which may be implemented in a similar manner as in the first device part 110.
  • a first part of the second conductive layer 202 comprises a second pair of probes 203, and a second part of the second conductive layer 202 comprises a second balun 204 configured to feed the second pair of probes 203 with the RF signal.
  • a plane of the first part of the second conductive layer 202 is not yet inclined towards a plane of the second part of the second conductive layer 202, i.e., the second device part 210 is in the flat state, like the first device part 110 in FIG. 2.
  • FIG. 3 shows how the first device part 110 and the second device part 210 can be brought from the flat state to the folded state, by performing a step of bending/folding, and how they can be assembled to form the exemplary probe device 100 according to this disclosure.
  • the bending/folding step may lead to the first device part 110 comprising a first folded probe structure made of the first pair of probes 103 and the first balun 104, and the second device part 210 comprising a second folded probe structure made of the second pair of probes 203 and the second balun 204.
  • first flexible layer 101 and the first conductive layer 102 can be bent in a region between the first part of the first conductive layer 102 and the second part of the first conductive layer 102, so that after the bending step, the plane of the first part of the first conductive layer 102 is inclined towards the plane of the second part of the first conductive layer 102.
  • second flexible layer 201 and the second conductive layer 202 can be bent in a region between the first part of the second conductive layer 202 and the second part of the second conductive layer 202, so that after the bending step, the plane of the first part of the second conductive layer 202 is inclined towards the plane of the second part of the second conductive layer 102.
  • This is shown in the upper part of FIG. 3, and may also be referred to as “folding operation” and may yield the folded probe structures.
  • the lower part of FIG. 3 shows that the first device part 110 and the second device part 210 can, after the folding operations, be are arranged such with respect to each other, that the first pair of probes 103 and the second pair of probes 203 either form a radiating element or form a probe arrangement for feeding another radiating element.
  • the first device part 110 and the second device part 210 may be connected together mechanically.
  • the mechanical connection may be established by inserting one device part into the other device part.
  • this disclosure proposes folded probe structures, which each include a pair of probes 103, 203 and a feeding balun 104, 204.
  • the pair of probes 103, 203 and the balun 104, 204 may be initially integrated into a single flat part, which may then folded to create the folded probe structure for the probe device 100.
  • all traces e.g., metal traces if a conductive layer 102, 202 is a metal layer
  • the balun(s) 104, 204 may be fabricated, e.g. etched, from or in a single layer.
  • the flexible layer(s) 101, 201 and the conductive layer(s) 102, 202 with the probe pair(s) 103, 203 and balun(s) may be formed by an aluminum foil laminate.
  • any foil comprising a conductive or metal laminate to form the conductive layer(s) 102, 202.
  • the lamination of the foil may be required on only one side, simplifying the manufacturing process of the probe device 100.
  • the folded probe structures can be used, depending on the dimensions of the probes e.g. in terms of wavelength, as a dipole radiating element itself or to feed additional radiating structures arranged on top (patches, slots or parasitic dipoles).
  • FIG. 4 shows an exemplary probe device according to this disclosure, wherein the probe pairs
  • the radiating element may be a dual-polarized radiating element, atri-polarized radiating element, or a quad-polarized radiating element, and the radiating element is configured to radiate the RF signal.
  • the radiating element is exemplarily a dual-polarized radiating element.
  • a director 401 can be arranged next to the radiating element formed by the pairs of probes 103, 203, for instance, such that the pairs of probes 103, 203 are arranged between the baluns 104, 204 and the director 401, as shown in FIG. 4.
  • FIG. 5 shows a probe device 100 according to this disclosure, wherein the probe pairs 103, 203 form a probe arrangement for feeding a radiating element 501. That means, the first device part 110 and the second device part 210 are arranged such with respect to each other that the first pair of probes 103 and the second pair of probes 203 form the probe arrangement for feeding the radiating element 501.
  • the probes 103, 203 can be used as a feeder of the additional radiating element 501 that may be arranged on top of the probes 103, 203.
  • the radiating element 501 can be a patch radiating element, a dipole radiating element, or a slot radiating element.
  • the radiating element 501 and the probe arrangement may be an integral part.
  • the radiating element 501 is exemplarily a slot radiating element.
  • One balun 104 may be a 1 st polarization balun, and the other balun 204 may be a 2 nd polarization balun.
  • a director 401 may again be arranged next to the radiating element 501, for instance, such that the radiating element 501 is arranged between the pairs of probes 103, 203 and the director 401, as shown in FIG. 5.
  • FIG. 6 shows a layer stack for a probe device 100 according to this disclosure.
  • the layer stack may comprise an aluminum foil laminate that provides the first flexible layer 101 and the first conductive layer 102, respectively.
  • the first conductive layer 102 may thereby be provided by the aluminum laminate, and the first flexible layer 101 may be provided by the laminated foil.
  • the aluminum foil laminate in this case contains the circuit(s) that make the first pair of probes 103 and the first balun 104. This is in case of the first device part 110.
  • the second device 210 part may be made in a similar manner, that is, also the second flexible layer 201 and the second conductive layer 202 may be formed by an aluminum foil laminate.
  • the first flexible layer 101 and the first conductive layer 102 may be provided on a substrate material, in particular on a first substrate 601a and a second substrate 601b made of the substrate material.
  • the substrate material may be a polymer material, for example, PPS GF40.
  • the first flexible layer 101 may be provided on the first substrate 601a and on the second substrate 601b. Further, the first flexible layer 101 may be arranged across a gap between the first substrate 601a and the second substrate 601b.
  • the first conductive layer 102 is then provided on the first flexible layer 101.
  • the first part of the first conductive layer 101 may be arranged above the first substrate 601a and the second part of the first conductive layer 101 may be arranged above the second substrate 601b.
  • the second device part 210 may be made similarly, in that it includes a third substrate and fourth substrate on which the second conductive layer 202 and the second flexible layer 201 are arranged.
  • the first device part 110 is still in the flat state, wherein the substrate surfaces of the first substrate 601a and the second substrate 601b are arranged in parallel and/or in plane, i.e., the planes of the first part and the second part of the first conductive layer 102 are in plane.
  • the first device part 110 is now in the folded state, wherein the substrate surfaces of the first substrate 601a and the second substrate 601b are inclined to each other, and accordingly the planes of the first part and the second part of the first conductive layer 102 are inclined by an angle.
  • the exemplary implementation of the probe device 100 with the polymer material and the aluminum foil laminate allows producing the probe device 100 with very low cost and low weight. Further, this implementation facilitates the manufacturing of the probe device 100, as it can be easily folded to create the more complex 3D structures.
  • FIG. 7(a) shows an exemplary probe device 100 in the flat state
  • FIG. 7(b) shows the same probe device 100 in the folded state, according to this disclosure.
  • the first device part 110 and the second device part 210 may form a dual-polarized radiating element including the pairs of probes 103 and 203.
  • the second device part 210 may provide a 45° polarization, while the first device part 110 may provide a -45° polarization, or vice versa.
  • the radiating element which is formed by the probe pairs 103, 203, does not have to be directly connected to a reflector, but may be connected to the balun(s) 104, 204.
  • the probe device 100 may further comprise a reflector 801 coupled to or acting as a ground plane.
  • the first balun 104 (likewise can be implemented for the second balun 204) may be capacitively coupled to the reflector 801.
  • the balun 104 and a feeding network may share the common ground provided by the reflector 801. Therefore, there are no transitions required on the ground.
  • FIG. 9 shows an arrangement of N probe devices 100 in the flat state, wherein the probe devices 100 include a common feeding network 901 comprising the power divider.
  • the multiple probe devices 100 can be created out of a single flexible layer 101 and conductive layer 102, e.g., an aluminum foil laminate.
  • the first part of the first conductive layer 102 may comprises a plurality of first pairs of probes 103
  • the second part of the first conductive layer 102 may comprises a plurality of first baluns 104.
  • Each first balun 104 is configured to feed one of the first pairs of probes 103.
  • a third part of the first conductive layer 102 may comprise the feeding network 901 connected to the first baluns 104 and configured to feed the first baluns 104.
  • FIG. 9 shows that an 8x1 array (upper part), a pair arrangement (lower left part), or an 8x4 arrangement (lower right part) are possible examples.
  • FIG. 10 shows a system architecture or scenario to which the probe device 100 according to this disclosure is applicable.
  • An example scenario may be, as shown in a sectional view, a four- column UTMS mobile communication antenna comprising multiple probe devices 100.
  • FIG. 11 shows a 10-dipole array combined with a feeding network in one single aluminum foil laminate and multiple probe devices 100.
  • FIG. 11 shows the example of a four-column UMTS mobile communication antenna.
  • FIG. 12 shows how necessary interconnections (solder joints) between the probe pairs 103 of the probe devices 100 and the feeding network 901 (lOx per polarization) can be erased.
  • Fig. 13 shows a method 1300 according to this disclosure in a schematic flow-diagram.
  • the method 1300 is for fabricating a probe device 100 for an antenna, according to this disclosure.
  • the method 1300 comprises a step 1301 of forming a first flexible layer 101, followed by a step 1302 of forming a first conductive layer 102 on the first flexible layer 101.
  • a first part of the first conductive layer 102 comprises a first pair of probes 103, and a second part of the first conductive layer 102 comprises a first balun 104 for feeding the first pair of probes 103 with a RF signal.
  • the method 1300 further comprises a step 1303 of bending the first flexible layer 101 and the first conductive layer 102 between the first part of the first conductive layer 102 and the second part of the first conductive layer 102, such that a plane of the first part of the first conductive layer 102 is inclined towards a plane of said second part of the first conductive layer 102.
  • this disclosure uses a pair of probes 103 and a balun 104 to feed the probes 103, for instance using as input an unbalanced signal.
  • the pair of probes 103 and the balun 104 may be produced in a single flat foldable part (and structured in a single layer). As therefore all parts can be produced in the flat state, the production of the (unfolded) components is very simple (and cost effective).
  • all the traces, probes 103, balun 104 and eventually power divider may be etched in a single layer, so the lamination is required in only one side of the support material, simplifying a lot the manufacturing process and avoiding errors in the alignment of several layers.
  • balun 104 and probes 103 there is no solder joint necessary to connect the balun 104 and probes 103, as they can be realized in one component.
  • the folding mechanism may avoid at least in two points a solder joint.
  • the problem of a grounding of the radiating element is avoided, as the radiating element is connected to a balun 104, 204 and the balun 104, 204 and feeding network 901 may share a common ground.
  • Two device parts 110, 120 with each a pair of probes 103, 203 and a balun 104, 204 may be arranged together to create a dual polarized radiating element or a probe arrangement to feed a dual polarized radiating element. No cable or printed circuit board (PCB) connection between the two dipoles is necessary. Two full dipoles may be integrated in one foil layer.
  • PCB printed circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

The present disclosure relates to antennas for mobile communication network. The disclosure provides a probe device for such an antenna. The probe device comprises a first flexible layer and a first conductive layer provided on the first flexible layer. A first part of the first conductive layer comprises a first pair of probes, and a second part of the first conductive layer comprises a first balun for feeding the first pair of probes with a RF signal. A plane of the first part of the first conductive layer is inclined towards a plane of the second part of the first conductive layer. The first flexible layer and the first conductive layer are bent between the first part and the second part of the first conductive layer.

Description

A FOLDED PROBE DEVICE FORAN ANTENNA
TECHNICAL FIELD
The present disclosure relates to antennas, for instance, antennas suitable for entities in a mobile communication network. The disclosure provides a probe device for such an antenna. The probe device comprises one or more folded probe structures, wherein each folded probe structured includes a pair of probes and a balun.
BACKGROUND
With the deployment of 5th generation (5G) mobile communication networks, new frequency bands need to be supported, for instance, the 700 MHz and the 3.5 GHz bands. There is accordingly a growing demand in the market to develop antennas with an increased number of bands. In addition, in order to fully exploit the capabilities of the New Radio (NR) standard, the number of TRX and/or antenna ports and arrays and/or antenna columns per band should also be increased.
Despite the increased number of bands and ports per band, the limitation of one antenna per sector (or a maximum of two antennas per sector in exceptional cases) is still a very strict requirement. In addition, the weight of the antennas cannot be allowed to grow linearly with the number of bands, but needs to be kept as low as possible to facilitate installation and site acquisition.
This scenario leads to an increased complexity, in which any technology that enables the integration of multiple bands in an antenna in a cost efficient way and with low weight becomes valuable.
SUMMARY
This disclosure and its solution are based further on the following considerations.
Foldable structures may play a role in future antenna designs, as they allow creating relatively complex 3D structures at low cost and with low weight. In particular, they may help to reduce the number of parts and interconnections and to maintain low weight and cost. |ln an exemplary solution of an antenna, one or more probes on the one hand side, and one or more baluns on the other hand side, are provided as separate components. To connect these separate components, typically a soldering process is required, which is elaborate.
This disclosure has the aim to provide a probe device for an antenna, which addresses the above- mentioned challenges for the antenna. An objective is to enable an antenna that integrates several bands in a cost efficient way and has a low weight. Another objective is an antenna with a low complexity, a reduced number of components, and a simple manufacturing process.
These and other objectives are achieved by this disclosure as described in the enclosed independent claims. Advantageous implementations are further defined in the dependent claims.
A first aspect of this disclosure provides a probe device for an antenna, the probe device comprising: a first flexible layer; a first conductive layer provided on the first flexible layer; wherein a first part of the first conductive layer comprises a first pair of probes, and a second part of the first conductive layer comprises a first balun for feeding the first pair of probes with a radio frequency (RF) signal; wherein a plane of the first part of the first conductive layer is inclined towards a plane of the second part of the first conductive layer; and wherein the first flexible layer and the first conductive layer are bent between the first part and the second part of the first conductive layer.
The first pair of probes and the first balun, which are made from the first conductive layer and are provided on the first flexible layer, may form a first folded probe structure, due to the bend between the first part and the second part of the first conductive layer. The probe device may comprise one or more such folded probe structures.
An advantage of the probe device of the first aspect is that the first balun configured to feed the first pair of probes may be fabricated in the same flat part (comprising the first conductive layer provided on the first flexible layer), and may then be folded upward to reach the inclination of the plane of the first part of the first conductive layer towards the plane of the second part of the first conductive layer. Therefore, elaborate solder connections may be avoided. Further, the probe device of the first aspect may help to reduce the complexity of the antenna for which it is designed. The probe device itself is easy to manufacture and of low complexity. The probe device may further fulfill the requirements of the next generation of base station antennas. Multiple probe device according to the first aspect could be used to build an antenna that integrates several bands in a cost efficient way and has a low weight.
In an implementation form of the first aspect, the probe device further comprises a second flexible layer; a second conductive layer provided on the second flexible layer; wherein a first part of the second conductive layer comprises a second pair of probes, and a second part of the second conductive layer comprises a second balun for feeding the second pair of probes with the RF signal; wherein a plane of the first part of the second conductive layer is inclined towards a plane of the second part of the second conductive layer; and wherein the second flexible layer and the second conductive layer are bent between the first part and the second part of the second conductive layer.
The second pair of probes and the second balun, which are made from the second conductive layer and are provided on the second flexible layer, may form a second folded probe structure, due to the bend between the first part and the second part of the second conductive layer. The probe device may comprise one or more folded probe structures.
In an implementation form of the first aspect, the probe device comprises a first device part and a second device part, wherein the first device part comprises the first flexible layer and the first conductive layer; the second device part comprises the second flexible layer and the second conductive layer; and the first device part and the second device part are arranged such with respect to each other that the first pair of probes and the second pair of probes form a radiating element or form a probe arrangement for feeding radiating element.
The first device part may comprise the first folded probe structure, and the second device part may comprise the second folded probe structure. The folded probe structures may be combined to form the radiating element or probe arrangement for feeding the radiating element.
In an implementation form of the first aspect, the first pair of probes and the second pair of probes together form a dual-polarized radiating element, tri-polarized radiating element, or quad-polarized radiating element, configured to radiate the RF signal. In an implementation form of the first aspect, the probe device further comprises a radiating element configured to radiate the RF signal, wherein the first pair of probes and the second pair of probes together form a probe arrangement configured to feed the RF signal to the radiating element.
In an implementation form of the first aspect, the radiating element is a patch radiating element, a dipole radiating element, or a slot radiating element.
In an implementation form of the first aspect, the radiating element and the probe arrangement are an integral part.
In an implementation form of the first aspect, the first flexible layer and the first conductive layer between the first part and the second part of the first conductive layer are configured as a bendable hinge; and/or the second flexible layer and the second conductive layer between the first part and the second part of the second conductive layer are configured as a bendable hinge.
In this way, the inclination between the planes of the first part and the second part of either conductive layer may be adjusted. That is, a folding angle of each folded probe structure may be changed.
In an implementation form of the first aspect, the first flexible layer and the first conductive layer are formed by an aluminum foil laminate; and/or the second flexible layer and the second conductive layer are formed by an aluminum foil laminate.
The aluminum foil laminate allows creating the bent/folded (3D) structures at low cost and with low weight.
In an implementation form of the first aspect, the probe device comprises a planar first substrate and a planar second substrate, which are inclined to each other, and a planar third substrate and a planar fourth substrate, which are inclined to each other, wherein the first flexible layer is provided on the first substrate and on the second substrate; the first part of the first conductive layer is arranged above the first substrate and the second part of the first conductive layer is arranged above the second substrate; the second flexible layer is provided on the third substrate and on the fourth substrate; and the first part of the second conductive layer is arranged above the third substrate and the second part of the second conductive layer is arranged above the fourth substrate.
The substrates may help to stabilize the folded probe structures in the probe device.
In an implementation form of the first aspect, the first flexible layer is further arranged and across a gap between the first substrate and the second substrate, and/or the second flexible layer is further arranged across a gap between the third substrate and the fourth substrate; or the first substrate and the second substrate are an integral part, and/or the third substrate and the fourth substrate are an integral part.
In an implementation form of the first aspect, at least one of the first substrate, the second substrate, the third substrate, and the fourth substrate is made of a polymer material.
A polymer material is stable but of light weight, and is moreover cheap.
In an implementation form of the first aspect, the probe device further comprises a feeding network connected to the first balun and/or to the second balun, and configured to feed the RF signal to the first balun and/or to the second balun.
The feeding network can be made from or in the same first and/or second conductive layer, from which the first and/or second balun is made. This simplifies the manufacturing process.
In an implementation form of the first aspect, the probe device further comprises a reflector coupled to or acting as a ground plane, wherein the first balun and/or the second balun is capacitively coupled to the reflector.
Thus, a sensitive grounding that easily creates resonances and unstable products can be avoided.
A second aspect of this disclosure provides a method for fabricating a probe device for an antenna, the method comprising: forming a first flexible layer; forming a first conductive layer on the first flexible layer, wherein a first part of the first conductive layer comprises a first pair of probes, and a second part of the first conductive layer comprises a first balun for feeding the first pair of probes with a RF signal; and bending the first flexible layer and the first conductive layer between the first part of the first conductive layer and the second part of the first conductive layer such that a plane of the first part of the first conductive layer is inclined towards a plane of said second part of the first conductive layer.
The bending step may also be referred to as a folding step, and may result in the first folded probe structure. The manufacturing method of the second aspect is of low complexity, and leads to a probe device having the advantages described above for the first aspect.
In an implementation form of the second aspect, the method further comprises forming a second flexible layer; forming a second conductive layer on the second flexible layer, wherein a first part of the second conductive layer comprises a second pair of probes, and a second part of the second conductive layer comprises a second balun for feeding the second pair of probes with the RF signal; and bending the second flexible layer and the second conductive layer between the first part of the second conductive layer and the second part of the second conductive layer such that a plane of said first part of the second conductive layer is inclined towards a plane of said second part of the second conductive layer.
The bending step may again be referred to as a folding step, and may result in the second folded probe structure.
In an implementation form of the second aspect, the probe device comprises a first device part and a second device part; the first device part comprises the first conductive layer and the first flexible layer; the second device part comprises the second conductive layer and the second flexible layer; and the method further comprises arranging the first device part and the second device part such that the first pair of probes and the second pair of probes form a radiating element or form a probe arrangement for feeding a radiating element.
In an implementation form of the first aspect, the first device part and the second device part are connected together mechanically by inserting one into the other.
In this way, the two folded probe structures can be easily combined.
In an implementation form of the first aspect, the first device part and the second device part are formed on an integral 3D printed part. In an implementation form of the first aspect, the first pair of probes and the first balun are formed in the first conductive layer by a single etching step; and/or the second pair of probes and the second balun are formed in the second conductive layer bay a single etching step.
This simplifies the fabrication method of the probe device.
In an implementation form of the first aspect, when forming the first conductive layer on the first flexible layer, the first part of the first conductive layer comprises a plurality of first pairs of probes, and the second part of the first conductive layer comprises a plurality of first baluns, wherein each first balun is configured to feed one of the first pairs of probes with the RF signal.
In this way, multiple folded probe arrangements can be fabricated at the same time in a simple and efficient process.
In an implementation form of the first aspect, a third part of the first conductive layer comprises a feeding network connected to the first baluns and configured to feed the RF signal to the first baluns.
The feeding network can be fabricated in the same conductive layer as the first baluns, which leads to a low complex process.
In summary, the present disclosure proposes integrating a pair of probes and a balun into one single flat part, for instance based on an aluminum foil laminate, and then bending/folding the flat part to create a 3D structure with the inclination of planes of the first part and the second part of the conductive layer(s). All traces of the pair of probes and the balun may be etched in a single conductive layer. Therefore, an aluminum foil laminate with a lamination of the foil on only one side is sufficient, simplifying a lot the manufacturing process.
The probe device of this disclosure can be used, depending on the dimensions of the pairs(s) of probes in terms of wavelength, as radiating element itself or to feed additional a radiating element arranged on top of it (e.g., patches, slots or parasitic dipoles). In this way the probe device can be used to build antennas integrating several bands. For instance, a radiating element formed by the probe device itself may be configured to radiate in a different band than a radiating element fed by the probe device. Those and more radiating elements could be combined in the antenna.
BRIEF DESCRIPTION OF DRAWINGS
The above described aspects and implementation forms will be explained in the following description of specific embodiments in relation to the enclosed drawings, in which FIG. 1 shows a probe device according to this disclosure.
FIG. 2 shows a first part and a second part of an exemplary probe device in a flat state.
FIG. 3 shows a folding operation and an assembly of the first part and second part of an exemplary probe device according to this disclosure
FIG. 4 shows an exemplary probe device according to this disclosure, wherein the pairs of probes form a standalone radiating element.
FIG. 5 shows a probe device according to this disclosure, wherein the pairs of probes form a probe arrangement for feeding a slot radiating element.
FIG. 6 shows a layer stack of a probe device according to this disclosure.
FIG. 7 shows (a) an exemplary probe device in the flat state; and (b) the probe device in the folded state according to this disclosure.
FIG. 8 compares (a) a probe device according to this disclosure with (b) a conventional probe device.
FIG. 9 shows an arrangement of multiple probe devices in the flat state including a feeding network.
FIG. 10 shows a system environment in which one or more probe devices according to this disclosure can be implemented.
FIG. 11 shows a specific implementation of one or more probe devices according to this disclosure.
FIG. 12 shows an arrangement of multiple probe devices according to this disclosure in the flat state.
FIG. 13 shows a method for fabricating a probe device according to this disclosure.
DETAILED DESCRIPTION OF EMBODIMENTS
FIG. 1 shows a probe device 100 according to this disclosure. The probe device 100 is for an antenna. The antenna may comprise multiple probe devices 100 according to this disclosure. The antenna may be an antenna for a device of a mobile network, in particular, of a 5G mobile network. This device may be a network entity or user equipment. The antenna may support multiple bands including new bands, like the 700 MHz band and/or the 3.5 GHz band.
The probe device 100 comprises a first flexible layer 101, and a first conductive layer 102 provided on the first flexible layer 101. The first conductive layer 102 may be deposited on the first flexible layer 101. The first conductive layer 102 may be structured, wherein the structuring of the first conductive layer 102 may be done in an etching step during the manufacturing process of the probe device 100.
The first conductive layer 102 may comprise a first part and a second part. The first part comprises a first pair of probes 103, and the second part comprises a first balun 104 configured to feed the first pair of probes 103 with a RF signal. The first pair of probes 103 and the first balun 104 may be formed during the structuring of the first conductive layer 102, for example, they may be formed by a single etching step of the first conductive layer 102.
A plane of the first part of the first conductive layer 102 is inclined towards a plane of the second part of the first conductive layer 102. For instance, the two planes can be inclined by 90° with respect to each other, or can be inclined by an angle within a range of 45°-135° with respect to each other. The first flexible layer 101 and the first conductive layer 102 are both bent in a region between the first part and the second part of the first conductive layer 102. For example, the regions of the first flexible layer 101 and the first conductive layer 102, which are arranged between the first part and the second part of the first conductive layer 102, may be configured as a bendable hinge. Thus, the above mentioned inclination angle may also be adjustable in the probe device 100.
FIG. 2 shows parts of an exemplary probe device 100 according to this disclosure. In particular, FIG. 2 shows a first device part 110 and a second device part 210 of the probe device 100, which are not yet assembled together.
The first device part 110 comprises (an example of) the first flexible layer 101 and the first conductive layer 102. The plane of the first part of the first conductive layer 102 is not yet inclined towards the plane of the second part of the first conductive layer 102, i.e., the first device part is still in a “flat state” (compared to the “folded state” shown in FIG. 1 or FIG. 3). The second device part 210 comprises a second flexible layer 201 and a second conductive layer 202, which may be implemented in a similar manner as in the first device part 110. A first part of the second conductive layer 202 comprises a second pair of probes 203, and a second part of the second conductive layer 202 comprises a second balun 204 configured to feed the second pair of probes 203 with the RF signal. A plane of the first part of the second conductive layer 202 is not yet inclined towards a plane of the second part of the second conductive layer 202, i.e., the second device part 210 is in the flat state, like the first device part 110 in FIG. 2.
FIG. 3 shows how the first device part 110 and the second device part 210 can be brought from the flat state to the folded state, by performing a step of bending/folding, and how they can be assembled to form the exemplary probe device 100 according to this disclosure. The bending/folding step may lead to the first device part 110 comprising a first folded probe structure made of the first pair of probes 103 and the first balun 104, and the second device part 210 comprising a second folded probe structure made of the second pair of probes 203 and the second balun 204.
In particular, the first flexible layer 101 and the first conductive layer 102 can be bent in a region between the first part of the first conductive layer 102 and the second part of the first conductive layer 102, so that after the bending step, the plane of the first part of the first conductive layer 102 is inclined towards the plane of the second part of the first conductive layer 102. Likewise, the second flexible layer 201 and the second conductive layer 202 can be bent in a region between the first part of the second conductive layer 202 and the second part of the second conductive layer 202, so that after the bending step, the plane of the first part of the second conductive layer 202 is inclined towards the plane of the second part of the second conductive layer 102. This is shown in the upper part of FIG. 3, and may also be referred to as “folding operation” and may yield the folded probe structures.
The lower part of FIG. 3 shows that the first device part 110 and the second device part 210 can, after the folding operations, be are arranged such with respect to each other, that the first pair of probes 103 and the second pair of probes 203 either form a radiating element or form a probe arrangement for feeding another radiating element. For example, the first device part 110 and the second device part 210 may be connected together mechanically. For instance, the mechanical connection may be established by inserting one device part into the other device part. Other assembly methods are possible. According to the above, this disclosure proposes folded probe structures, which each include a pair of probes 103, 203 and a feeding balun 104, 204. The pair of probes 103, 203 and the balun 104, 204 may be initially integrated into a single flat part, which may then folded to create the folded probe structure for the probe device 100. Advantageously, all traces (e.g., metal traces if a conductive layer 102, 202 is a metal layer) for the probe pair(s) 103, 203 and the balun(s) 104, 204 may be fabricated, e.g. etched, from or in a single layer. In an example, the flexible layer(s) 101, 201 and the conductive layer(s) 102, 202 with the probe pair(s) 103, 203 and balun(s) may be formed by an aluminum foil laminate. Alternatively, of any foil comprising a conductive or metal laminate to form the conductive layer(s) 102, 202. The lamination of the foil may be required on only one side, simplifying the manufacturing process of the probe device 100. The folded probe structures can be used, depending on the dimensions of the probes e.g. in terms of wavelength, as a dipole radiating element itself or to feed additional radiating structures arranged on top (patches, slots or parasitic dipoles).
FIG. 4 shows an exemplary probe device according to this disclosure, wherein the probe pairs
103 and 203 form together a standalone radiating element. That means, the first device part 110 and the second device part 210 are arranged such with respect to each other that the first pair of probes 103 and the second pair of probes 203 form the radiating element. The radiating element may be a dual-polarized radiating element, atri-polarized radiating element, or a quad-polarized radiating element, and the radiating element is configured to radiate the RF signal.
In FIG. 4 the radiating element is exemplarily a dual-polarized radiating element. One balun
104 is thus a 1st polarization balun, and the other balun 204 is thus a 2nd polarization balun. Optionally, a director 401 can be arranged next to the radiating element formed by the pairs of probes 103, 203, for instance, such that the pairs of probes 103, 203 are arranged between the baluns 104, 204 and the director 401, as shown in FIG. 4.
FIG. 5 shows a probe device 100 according to this disclosure, wherein the probe pairs 103, 203 form a probe arrangement for feeding a radiating element 501. That means, the first device part 110 and the second device part 210 are arranged such with respect to each other that the first pair of probes 103 and the second pair of probes 203 form the probe arrangement for feeding the radiating element 501. The probes 103, 203 can be used as a feeder of the additional radiating element 501 that may be arranged on top of the probes 103, 203. The radiating element 501 can be a patch radiating element, a dipole radiating element, or a slot radiating element. Notably, the radiating element 501 and the probe arrangement may be an integral part.
In FIG. 5 the radiating element 501 is exemplarily a slot radiating element. One balun 104 may be a 1st polarization balun, and the other balun 204 may be a 2nd polarization balun. Optionally, a director 401 may again be arranged next to the radiating element 501, for instance, such that the radiating element 501 is arranged between the pairs of probes 103, 203 and the director 401, as shown in FIG. 5.
FIG. 6 shows a layer stack for a probe device 100 according to this disclosure. In particular, the layer stack may comprise an aluminum foil laminate that provides the first flexible layer 101 and the first conductive layer 102, respectively. The first conductive layer 102 may thereby be provided by the aluminum laminate, and the first flexible layer 101 may be provided by the laminated foil. The aluminum foil laminate in this case contains the circuit(s) that make the first pair of probes 103 and the first balun 104. This is in case of the first device part 110. The second device 210 part may be made in a similar manner, that is, also the second flexible layer 201 and the second conductive layer 202 may be formed by an aluminum foil laminate.
The first flexible layer 101 and the first conductive layer 102, in this example provided by the aluminum foil laminate, may be provided on a substrate material, in particular on a first substrate 601a and a second substrate 601b made of the substrate material. The substrate material may be a polymer material, for example, PPS GF40. The first flexible layer 101 may be provided on the first substrate 601a and on the second substrate 601b. Further, the first flexible layer 101 may be arranged across a gap between the first substrate 601a and the second substrate 601b. The first conductive layer 102 is then provided on the first flexible layer 101. Thereby, the first part of the first conductive layer 101 may be arranged above the first substrate 601a and the second part of the first conductive layer 101 may be arranged above the second substrate 601b. Notably, the second device part 210 may be made similarly, in that it includes a third substrate and fourth substrate on which the second conductive layer 202 and the second flexible layer 201 are arranged.
In FIG. 6(a) the first device part 110 is still in the flat state, wherein the substrate surfaces of the first substrate 601a and the second substrate 601b are arranged in parallel and/or in plane, i.e., the planes of the first part and the second part of the first conductive layer 102 are in plane. In FIG. 6(b) the first device part 110 is now in the folded state, wherein the substrate surfaces of the first substrate 601a and the second substrate 601b are inclined to each other, and accordingly the planes of the first part and the second part of the first conductive layer 102 are inclined by an angle.
The exemplary implementation of the probe device 100 with the polymer material and the aluminum foil laminate allows producing the probe device 100 with very low cost and low weight. Further, this implementation facilitates the manufacturing of the probe device 100, as it can be easily folded to create the more complex 3D structures.
FIG. 7(a) shows an exemplary probe device 100 in the flat state, and FIG. 7(b) shows the same probe device 100 in the folded state, according to this disclosure. The first device part 110 and the second device part 210 may form a dual-polarized radiating element including the pairs of probes 103 and 203. The second device part 210 may provide a 45° polarization, while the first device part 110 may provide a -45° polarization, or vice versa.
Another advantage of the design of the probe device 100 according to this disclosure is that the radiating element, which is formed by the probe pairs 103, 203, does not have to be directly connected to a reflector, but may be connected to the balun(s) 104, 204. For instance, as shown in FIG. 8(a), the probe device 100 may further comprise a reflector 801 coupled to or acting as a ground plane. The first balun 104 (likewise can be implemented for the second balun 204) may be capacitively coupled to the reflector 801. The balun 104 and a feeding network may share the common ground provided by the reflector 801. Therefore, there are no transitions required on the ground.
With a conventional probe device, as shown in FIG. 8b, it is usually necessary to ground the radiating element(s) either galvanic (screwing) or capacitively. This grounding is very sensitive, especially when capacitive coupling is used, and easily creates resonances and unstable products.
Moreover, not only a single probe device 100, but several probe devices 100 may be combined. This may be achieved by connecting their baluns 104 via a (1-to-N) power divider to a common input, as shown in FIG. 9. In particular, FIG. 9 shows an arrangement of N probe devices 100 in the flat state, wherein the probe devices 100 include a common feeding network 901 comprising the power divider.
The multiple probe devices 100 can be created out of a single flexible layer 101 and conductive layer 102, e.g., an aluminum foil laminate. For example, to make multiple such probe devices 100, the first part of the first conductive layer 102 may comprises a plurality of first pairs of probes 103, and the second part of the first conductive layer 102 may comprises a plurality of first baluns 104. Each first balun 104 is configured to feed one of the first pairs of probes 103. A third part of the first conductive layer 102 may comprise the feeding network 901 connected to the first baluns 104 and configured to feed the first baluns 104.
This allows creating a complete array, including feeding and distribution network 901 out of one single aluminum foil laminate, for instance, minimizing the cost and number of interconnections. FIG. 9 shows that an 8x1 array (upper part), a pair arrangement (lower left part), or an 8x4 arrangement (lower right part) are possible examples.
FIG. 10 shows a system architecture or scenario to which the probe device 100 according to this disclosure is applicable. An example scenario may be, as shown in a sectional view, a four- column UTMS mobile communication antenna comprising multiple probe devices 100.
A specific implementation is illustrated in FIG. 11. In particular, FIG. 11 shows a 10-dipole array combined with a feeding network in one single aluminum foil laminate and multiple probe devices 100. FIG. 11 shows the example of a four-column UMTS mobile communication antenna.
FIG. 12 shows how necessary interconnections (solder joints) between the probe pairs 103 of the probe devices 100 and the feeding network 901 (lOx per polarization) can be erased.
Fig. 13 shows a method 1300 according to this disclosure in a schematic flow-diagram. The method 1300 is for fabricating a probe device 100 for an antenna, according to this disclosure.
The method 1300 comprises a step 1301 of forming a first flexible layer 101, followed by a step 1302 of forming a first conductive layer 102 on the first flexible layer 101. A first part of the first conductive layer 102 comprises a first pair of probes 103, and a second part of the first conductive layer 102 comprises a first balun 104 for feeding the first pair of probes 103 with a RF signal. The method 1300 further comprises a step 1303 of bending the first flexible layer 101 and the first conductive layer 102 between the first part of the first conductive layer 102 and the second part of the first conductive layer 102, such that a plane of the first part of the first conductive layer 102 is inclined towards a plane of said second part of the first conductive layer 102.
In summary, this disclosure uses a pair of probes 103 and a balun 104 to feed the probes 103, for instance using as input an unbalanced signal. The pair of probes 103 and the balun 104 may be produced in a single flat foldable part (and structured in a single layer). As therefore all parts can be produced in the flat state, the production of the (unfolded) components is very simple (and cost effective). For example, all the traces, probes 103, balun 104 and eventually power divider (if several probe devices 100 are produced with one aluminum foil laminate) may be etched in a single layer, so the lamination is required in only one side of the support material, simplifying a lot the manufacturing process and avoiding errors in the alignment of several layers. Furthermore there is no solder joint necessary to connect the balun 104 and probes 103, as they can be realized in one component. The folding mechanism may avoid at least in two points a solder joint. In addition, the problem of a grounding of the radiating element is avoided, as the radiating element is connected to a balun 104, 204 and the balun 104, 204 and feeding network 901 may share a common ground.
Two device parts 110, 120 with each a pair of probes 103, 203 and a balun 104, 204 may be arranged together to create a dual polarized radiating element or a probe arrangement to feed a dual polarized radiating element. No cable or printed circuit board (PCB) connection between the two dipoles is necessary. Two full dipoles may be integrated in one foil layer.
It is also possible to produce several radiating elements out of one foil, including a feeding network 901 to further reduce the number of connections. This technology is also very low weight compared to traditional die-cast or bended metal sheet
The present disclosure has been described in conjunction with various embodiments as examples as well as implementations. However, other variations can be understood and effected by those persons skilled in the art and practicing the claimed matter, from the studies of the drawings, this disclosure and the independent claims. In the claims as well as in the description the word “comprising” does not exclude other elements or steps and the indefinite article “a” or “an” does not exclude a plurality. A single element or other unit may fulfill the functions of several entities or items recited in the claims. The mere fact that certain measures are recited in the mutual different dependent claims does not indicate that a combination of these measures cannot be used in an advantageous implementation.

Claims

1. A probe device (100) for an antenna, the probe device (100) comprising: a first flexible layer (101); a first conductive layer (102) provided on the first flexible layer (101); wherein a first part of the first conductive layer (102) comprises a first pair of probes (103), and a second part of the first conductive layer (102) comprises a first balun (104) for feeding the first pair of probes (103) with a radio frequency, RF, signal; wherein a plane of the first part of the first conductive layer (102) is inclined towards a plane of the second part of the first conductive layer (102); and wherein the first flexible layer (101) and the first conductive layer (102) are bent between the first part and the second part of the first conductive layer (102).
2. The probe device (100) according to claim 1, further comprising: a second flexible layer (201); a second conductive layer (202) provided on the second flexible layer (201); wherein a first part of the second conductive layer (202) comprises a second pair of probes (203), and a second part of the second conductive layer (202) comprises a second balun (204) for feeding the second pair of probes (203) with the RF signal; wherein a plane of the first part of the second conductive layer (202) is inclined towards a plane of the second part of the second conductive layer (202); and wherein the second flexible layer (201) and the second conductive layer (202) are bent between the first part and the second part of the second conductive layer (202).
3. The probe device (100) according to claim 2, comprising a first device part (110) and a second device part (210), wherein: the first device part (110) comprises the first flexible layer (101) and the first conductive layer (102); the second device part (210) comprises the second flexible layer (201) and the second conductive layer (202); and the first device part (110) and the second device part (210) are arranged such with respect to each other that the first pair of probes (103) and the second pair of probes (203) form a radiating element or form a probe arrangement for feeding a radiating element (501).
4. The probe device (100) according to claim 3, wherein the first pair of probes (103) and the second pair of probes (203) together form a dual-polarized radiating element, tri-polarized radiating element, or quad-polarized radiating element, configured to radiate the RF signal.
5. The probe device (100) according to claim 3, further comprising a radiating element configured to radiate the RF signal, wherein: the first pair of probes (103) and the second pair of probes (203) together form a probe arrangement configured to feed the RF signal to the radiating element (501).
6. The probe device (100) according to claim 5, wherein the radiating element (501) is a patch radiating element, a dipole radiating element, or a slot radiating element.
7. The probe device (100) according to claim 5 or 6, wherein the radiating element (501) and the probe arrangement are an integral part.
8. The probe device (100) according to one of the claims 1 to 7, wherein: the first flexible layer (101) and the first conductive layer (102) between the first part and the second part of the first conductive layer (102) are configured as a bendable hinge (602); and/or the second flexible layer (201) and the second conductive layer (202) between the first part and the second part of the second conductive layer(202) are configured as a bendable hinge.
9. The probe device (100) according to one of the claims 1 to 8, wherein: the first flexible layer (101) and the first conductive layer (102) are formed by an aluminum foil laminate; and/or the second flexible layer (201) and the second conductive layer (202) are formed by an aluminum foil laminate.
10. The probe device (100) according to one of the claims 2 to 9, further comprising a planar first substrate (601a) and a planar second substrate (601b), which are inclined to each other, and a planar third substrate and a planar fourth substrate, which are inclined to each other, wherein: the first flexible layer (101) is provided on the first substrate (601a) and on the second substrate (601b); the first part of the first conductive layer (102) is arranged above the first substrate (601a) and the second part of the first conductive layer (102) is arranged above the second substrate (601b); the second flexible layer (201) is provided on the third substrate and on the fourth substrate; and the first part of the second conductive layer (202) is arranged above the third substrate and the second part of the second conductive layer (202) is arranged above the fourth substrate.
11. The probe device (100) according to claim 10, wherein: the first flexible layer (101) is further arranged across a gap between the first substrate (601a) and the second substrate (601b), and/or the second flexible layer (201) is further arranged across a gap between the third substrate and the fourth substrate; or the first substrate (601a) and the second substrate (601b) are an integral part, and/or the third substrate and the fourth substrate are an integral part.
12. The probe device (100) according to claim 10 or 11, wherein at least one of the first substrate (601a), the second substrate (601b), the third substrate, and the fourth substrate is made of a polymer material.
13. The probe device (100) according to one of the claims 1 to 12, further comprising a feeding network (901) connected to the first balun (104) and/or to the second balun (204), and configured to feed the RF signal to the first balun (104) and/or to the second balun (204).
14. The probe device (100) according to one of the claims 1 to 13, further comprising a reflector (801) coupled to or acting as a ground plane, wherein the first balun (104) and/or the second balun (204) is capacitively coupled to the reflector (801).
15. A method (1300) for fabricating a probe device (100) for an antenna, the method (1300) comprising: forming (1301) a first flexible layer (101); forming (1302) a first conductive layer (102) on the first flexible layer (101), wherein a first part of the first conductive layer (102) comprises a first pair of probes (103), and a second part of the first conductive layer (102) comprises a first balun (104) for feeding the first pair of probes (103) with a RF signal; and bending (1303) the first flexible layer (101) and the first conductive layer (102) between the first part of the first conductive layer (102) and the second part of the first conductive layer (102) such that a plane of the first part of the first conductive layer (102) is inclined towards a plane of said second part of the first conductive layer (102).
16. The method (1300) according to claim 15, further comprising: forming a second flexible layer (201); forming a second conductive layer (202) on the second flexible layer (201), wherein a first part of the second conductive layer (202) comprises a second pair of probes (203), and a second part of the second conductive layer (202) comprises a second balun (204) for feeding the second pair of probes (203) with the RF signal; and bending the second flexible layer (201) and the second conductive layer (202) between the first part of the second conductive layer (202) and the second part of the second conductive layer (202) such that a plane of said first part of the second conductive layer (202) is inclined towards a plane of said second part of the second conductive layer (202).
17. The method (1300) according to claim 16, wherein: the probe device (100) comprises a first device part (110) and a second device part (201); the first device part (110) comprises the first conductive layer (102) and the first flexible layer (101); the second device part (210) comprises the second conductive layer (202) and the second flexible layer (201); and the method (1300) further comprises arranging the first device part (110) and the second device part (210) such that the first pair of probes (103) and the second pair of probes (203) form a radiating element or form a probe arrangement for feeding a radiating element (501).
18. The method (1300) according to claim 17, wherein the first device part (110) and the second device part (210) are connected together mechanically by inserting one into the other.
19. The method (1300) according to claim 17, wherein the first device part (110) and the second device part (210) are formed on an integral 3D printed part.
20. The method (1300) according to one of the claims 15 to 19, wherein: the first pair of probes (103) and the first balun (104) are formed in the first conductive layer (102) by a single etching step; and/or the second pair of probes (203) and the second balun (204) are formed in the second conductive layer (202) bay a single etching step.
21. The method (1300) according to one of the claims 15 to 20, wherein when forming (1302) the first conductive layer (102) on the first flexible layer (101): the first part of the first conductive layer (102) comprises a plurality of first pairs of probes (103), and the second part of the first conductive layer (102) comprises a plurality of first baluns (104), wherein each first balun (104) is configured to feed one of the first pairs of probes (103) with the RF signal.
22. The method (1300) according to one of the claims 15 to 21, wherein a third part of the first conductive layer (102) comprises a feeding network (901) connected to the first baluns
(104) and configured to feed the RF signal to the first baluns (104).
PCT/EP2022/079493 2022-10-23 2022-10-23 A folded probe device for an antenna WO2024088493A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2022/079493 WO2024088493A1 (en) 2022-10-23 2022-10-23 A folded probe device for an antenna

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2022/079493 WO2024088493A1 (en) 2022-10-23 2022-10-23 A folded probe device for an antenna

Publications (1)

Publication Number Publication Date
WO2024088493A1 true WO2024088493A1 (en) 2024-05-02

Family

ID=84360363

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/079493 WO2024088493A1 (en) 2022-10-23 2022-10-23 A folded probe device for an antenna

Country Status (1)

Country Link
WO (1) WO2024088493A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317099B1 (en) * 2000-01-10 2001-11-13 Andrew Corporation Folded dipole antenna
US20120306715A1 (en) * 2010-12-02 2012-12-06 Skycross, Inc. Detachable antenna for radio communications device
EP2599161A1 (en) * 2010-07-31 2013-06-05 Motorola Solutions, Inc. Embedded printed edge-balun antenna system and method of operation thereof
CN108199146A (en) * 2018-01-05 2018-06-22 广东曼克维通信科技有限公司 Annular ultra wideband dual polarization base station antenna unit and frequency antenna system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317099B1 (en) * 2000-01-10 2001-11-13 Andrew Corporation Folded dipole antenna
EP2599161A1 (en) * 2010-07-31 2013-06-05 Motorola Solutions, Inc. Embedded printed edge-balun antenna system and method of operation thereof
US20120306715A1 (en) * 2010-12-02 2012-12-06 Skycross, Inc. Detachable antenna for radio communications device
CN108199146A (en) * 2018-01-05 2018-06-22 广东曼克维通信科技有限公司 Annular ultra wideband dual polarization base station antenna unit and frequency antenna system

Similar Documents

Publication Publication Date Title
US10431892B2 (en) Antenna-in-package structures with broadside and end-fire radiations
US9437929B2 (en) Dual polarized array antenna with modular multi-balun board and associated methods
JP5468085B2 (en) Grid array antenna and integrated structure
CN110098477B (en) Radiation structure and array antenna
US6985114B2 (en) Multi-frequency antenna and constituting method thereof
KR102138841B1 (en) Antenna device
US20030020656A1 (en) Dual band planar high-frequency antenna
US9425515B2 (en) Multi-slot common aperture dual polarized omni-directional antenna
US7394427B2 (en) Multilayer planar array antenna
US20070040758A1 (en) Dipole antenna
EP2984709B1 (en) Array antenna and related techniques
ZA200401573B (en) Patch fed printed antenna.
WO2018202304A1 (en) Dual-polarized radiating element and antenna
CN110676577A (en) Antenna oscillator and array antenna
US9831566B2 (en) Radiating element for an active array antenna consisting of elementary tiles
CN103460506B (en) There is the double-antenna structure of circular polarization characteristics
WO2018072827A1 (en) Integrated filtering for band rejection in an antenna element
JP4503592B2 (en) Microwave connector, antenna, and manufacturing method thereof
US20220368034A1 (en) Antenna array device
CN210468111U (en) Antenna oscillator and array antenna
WO2024088493A1 (en) A folded probe device for an antenna
CN109417225A (en) Antenna and system including antenna
CN112400256B (en) Patch antenna design that is easy to manufacture and controllable in performance at high frequency bands
Dufilie Practical design of an octave-band stacked patch antenna phased array
CN101983456A (en) A novel planar radio-antenna module