WO2024064396A2

WO2024064396A2 - Advanced functional strands ropes and cables, methods and systems for manufacturing thereof

Info

Publication number: WO2024064396A2
Application number: PCT/US2023/033561
Authority: WO
Inventors: Maroun Farah
Original assignee: Senso Medical Labs, Ltd.; LAM, Ricky
Priority date: 2022-09-23
Filing date: 2023-09-23
Publication date: 2024-03-28

Abstract

The disclosure relates to continuous additive manufacturing methods, systems and devices for forming functional strands, ropes and cables. More specifically, the disclosure relates to additive manufacturing methods, systems and devices for forming functional strands, ropes and cables comprised of filaments or wires, having integrated and embedded components operable to provide the continuously formed strands, ropes and cables a predetermined functionality.

Description

ADVANCED FUNCTIONAL STRANDS ROPES AND CABLES, METHODS AND SYSTEMS FOR

MANUFACTURING THEREOF

BACKGROUND

[0001] The disclosure is directed to continuous additive manufacturing methods, systems and devices for forming functional strands, ropes and cables. More specifically, the disclosure is directed to additive manufacturing methods, systems and devices for forming functional strands, ropes and cables comprised of filaments or wires, having integrated and embedded components operable to provide the continuously formed strands, ropes and cables a predetermined functionality.

[0002] For example, in Deep brain stimulation (DBS) is a surgical procedure involving the implantation of a medical device called a macroelectrode (also referred to as a “lead”, “brain pacemaker”, “electrode” or “chronic electrode”), which sends electrical impulses to specific parts of the brain. DBS uses the surgically imbedded, battery-operated medical neurostimulator to deliver electrical stimulation to targeted areas in the brain that control movement, blocking the abnormal nerve signals that cause tremor and PD symptoms.

[0003] Electrodes are often produced using standard methods of assembling metal contacts which are small pieces of metal that are usually rings that are welded to conductors (wires) running along the electrode body to the other side where they usually form connector terminal again through welding of the wires to the connector terminal, a plastic tubing is usually assembled around the conductors to protect and insulate the conductor and the contact from each other; additional processes are usually conducted involving welding, gluing, grinding, microassembly in order to build the electrodes.

[0004] To date, most processes for forming electrodes, or for that matter any electric wires having enhanced functionality are done in a batch process, requiring time for forming enhanced functionality wires, and systems on braided yarns are needed.

[0005] These and other aspects of the disclosed technology address the shortcomings of the current methods.

SUMMARY

[0006] Provided herein are exemplary implementations of additive manufacturing methods, systems and devices for forming functional strands, ropes and cables comprised of filaments or wires, having integrated and embedded components operable to provide the continuously formed strands, ropes and cables having a predetermined functionality.

[0007] In an exemplary implementation, provided herein is a cable interlocking system (CIS) comprising: a base deck, defining a plurality of tracks; a plurality of carriers, each carrier detachably coupled to a corresponding track on the base deck, wherein each carrier is adapted to accommodate a bobbin spooling: a predetermined filament, a predetermined strand, or a predetermined cable; and a collector module operable to collect the predetermined filament, the predetermined strand, or the predetermined cable, wherein the collector module is disposed at a given distance from the base deck, forming an interlocking axis, and wherein at least one of: the predetermined filaments, the predetermined strands, or the predetermined cables is configured to form an angle of between 0° and 180° relative to the interlocking axis.

[0008] In another exemplary implementation, provided herein is a method of continuously integrating and constructing at least one of: a filament coil, a filament twist, and a shorted filament in a strand, the strand comprising a plurality of filaments, implemented in the CIS system disclosed herein, the method comprising: decoupling a first predetermined filament from the collector module; drawing a portion of the first predetermined filament from a first carrier associated with the first predetermined filament; backfilling the drawn portion of the first predetermined filament into a first empty carrier forming a secondary carrier; positioning the first carrier, or the secondary carrier in a position detached from the base deck configured to enable forming the at least one of: the filament coil, the filament twist, and the filament short; using at least one of: the first carrier, and the secondary carrier, integrating the at least one of: the filament coil, the filament twist, and the shorted filament around at least one of a plurality of predetermined filaments coupled to the collector module; and repositioning the first carrier, or the secondary carrier to the base deck.

[0009] In yet another exemplary implementation, provided herein is a method for continuously forming at least one of: an adjustable strand, an adjustable rope, and an adjustable cable, each comprised of a plurality of filaments or wires, each of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable having a plurality of embedded contacts, each contact in communication with a corresponding terminal of a plurality of terminals, implemented in the CIS system disclosed herein: positioning a first carrier storing a conductive filament having an insulated portion and a non-insulated portion in a position detached from the base deck configured to enable interlocking the conductive filament having the insulated portion and the non-insulated portion, which is associated with the first carrier; using the first carrier, continuously interlocking the conductive filament having the insulated portion and the non-insulated portion, wherein the non-insulated portion of the conductive filament is configured to extend radially from the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; repositioning the first carrier to the base deck; forming an insulating sleeve over the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; marking the location of the plurality of contacts formed by the conductive filament having the insulated portion and the non-insulated portion, which is associated with the first carrier on an external surface of the insulating sleeve of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; upon determining an operational length of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, based on the marking, removing the insulating sleeve over a first contact point from the plurality of contacts sized and configured to form the proximal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; removing the insulating sleeve over at least one contact point from the plurality of contacts associated with the first contact point, configured to form a first terminal in a distal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; cutting the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable comprising the plurality of marked contact points and the exposed terminal; and insulating the proximal end.

[00010] In an exemplary implementation, provided herein is a method of continuously integrating at least one of: a coiled filament, a twisted filament pair, and a shorted filament pair in at least one of a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments or wires, implemented in the CIS system disclosed herein, whereby the method comprises: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; removing insulation over a portion of the first insulated conductive filament thereby forming an exposed portion on the first insulated conductive filament; removing insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; using the first carrier and the second carrier, contacting the exposed portion on the fir st insulated conductive filament with the exposed portion on the second insulated conductive filament positioning the first carrier, or the secondary earner in a position detached from the base deck configured to enable forming the at least one of: the coiled filament, and the twisted filament pair; using at least one of: the first carrier, and the second carrier, forming the at least one of: the coiled filament, and the twisted filament pair around at least one filament coupled to the collector module; and repositioning the at least one of: the first carrier, and the second carrier to the base deck.

[00011] In another exemplary implementation, provided herein is a method of continuously forming a woven strand having at least one coiled portion implemented in the CIS system disclosed, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; removing the insulation over a portion of the first insulated conductive filament forming an exposed portion on the first insulated conductive filament; removing the insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; shorting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament; weaving the shorted portion across a predetermined number of predetermined filaments coupled to the collector module; positioning the first carrier, or the second carrier in a position detached from the base deck configured to enable forming the at least one coiled portion; using the first carrier, or the second carrier, forming at least one coil of the first predetermined conductive filament, or the second predetermined conductive filament around a predetermined number of the predetermined filaments coupled to the collector module.

[00012] In yet another exemplary implementation, provided herein is a method of continuously integrating at least one capacitor in at least one of a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system disclosed herein comprising: providing a first carrier, adapted to accommodate a bobbin of a strand comprising a first and a second conductive filament (both on the same bobbin), each conductive filament coated with a dielectric coating; positioning the first carrier, in a position detached from the base deck configured to enable forming at least one winding; and using the first carrier forming the at least one winding of the str and comprising the first and the second conductive filament, thereby continuously forming the at least one of: the strand, the rope, and the cable having the at least one integrated capacitor.

[00013] In an exemplary implementation, provided herein is a method of continuously integrating at least one capacitor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system disclosed, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; providing a third carrier associated with a dielectric filament; positioning the first earner, or the second carrier, in a position detached from the base deck configured to enable forming at least one winding using the first, or second conductive filament; using the first carrier, or the second carrier, forming at least one winding of the first insulated conductive filament, or the second insulated conductive filament around at least one filament coupled to the collector module; repositioning the first carrier, or the second movable carrier to the base deck; positioning the third earner, in a position detached from the base deck configured to enable forming at least one winding of the dielectric filament; using the third carrier, forming at least one winding of the dielectric filament around the winding formed by the first or second conductive filaments; repositioning the third carrier to the base deck; positioning the first carrier, or the second carrier, in a position detached from the base deck configured to enable forming at least one winding using the first, or second insulated conductive filament; using the first carrier, or the second carrier, forming at least one winding of the first insulated conductive filament, or the second insulated conductive filament around the winding formed by the dielectric filament; and repositioning the first carrier, or the second carrier to the base deck, thereby continuously forming the wire having at least one integrated capacitor.

[00014] In another exemplary implementation, provided herein is a method of continuously integrating at least one resistor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system disclosed herein, the method comprising: providing a first earner associated with a first insulated conductive filament; providing a second earner associated with a second insulated conductive filament, wherein the second insulated conductive filament has a different resistivity than the first insulated conductive filament; removing the insulation over a portion of the first insulated conductive filament forming an exposed portion on the first insulated conductive filament; removing the insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; contacting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament, thereby creating a short between the first insulated conductive filament, and the second insulated conductive filament; positioning the first carrier, in a position detached from the base deck configured to enable forming at least one of: a winding, a wrinkle, and a wave of the first insulated filament; using the first carrier, forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament around a portion of the second insulated filament, or adjacent to the second insulated filament; and repositioning the first carrier to the base deck. [00015] In yet another exemplary implementation, provided herein is a method of continuously integrating at least one cored transformer in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system disclosed herein, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; providing an elongated core; positioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around the elongated core; using the first earner, forming at least one winding of the first insulated conductive filament around the elongated core; repositioning the fir st carrier to the base deck; positioning the second carrier in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the second insulated conductive filament around the elongated core; using the second carrier, forming at least one winding of the second insulated conductive filament around the elongated core; and repositioning the second carrier to the base deck.

[00016] In an exemplary implementation, provided herein is a method of continuously integrating at least one sensor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system disclosed herein, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a sensor, wherein the sensor comprises at least one contact region; positioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around at least one contact region; using the first carrier, forming at least one winding of the first insulated conductive filament around the at least one contact region; and repositioning the first carrier to the base deck.

[00017] In another exemplary implementation, provided herein is a method of continuously coating a filament or at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments with an additive agent, implemented in the CIS system disclosed herein, the method comprising: providing a first carrier associated with a first predetermined filament; positioning the dispenser in a position configured to dispense the agent onto the first predetermined filament; dispensing the agent onto the first predetermined filament.

[00018] In yet another exemplary implementation, provided herein is a method of forming at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, each of the at least one of: the strand, the rope, and the cable having a predetermined three-dimensional (3D) structure, implemented in the CIS system disclosed herein, the method comprising: providing a first carrier associated with a shape memory filament; selectively heating the shape memory filament at predetermined position while in the process of interlocking the shape memory filament.

[00019] In an exemplary implementation, provided herein is a method of forming at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, each of the at least one of: the strand, the rope, and the cable having a predetermined structure, implemented in the CIS system disclosed herein, the method comprising: using the at least one core filament carrier, providing the core filament to the collector module, wherein the core filament is comprised of a material configured to enhance a conductivity of the at least one of: the strand, the rope, and the cable; using a first sub-portion of the plurality of the carriers, forming a structural layer over the core filament; using a second sub-portion of the plurality of the carriers, forming a biocompatibility layer over the structural layer; using a third sub-portion of the plurality of the carriers, forming a charge injection layer over the biocompatibility layer; and forming an insulating layer over the charge injection layer.

[00020] In another exemplary implementation, provided herein is a method of continuously forming an electrode in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, implemented in the CIS system disclosed herein, the method, wherein a first sub-portion of the plurality of the predetermined filaments comprising a first conductive filament, is coupled to the collector module, the method comprising: providing a first carrier associated with a second conductive filament; positioning the first carrier in a position detached from the base deck configured to enable forming at least one of: a filament winding, a twisted filament, and a shorted filament; continuously forming at least one winding around the first sub-portion of the plurality of the predetermined filaments comprising the at least one conductive filament at a predetermined position along the at least one of: the strand, the rope, and the cable, the at least one winding forming at least one contact point on the at least one of: the strand, the rope, and the cable; repositioning the first carrier to the base deck; using the base deck, with a second sub-portion of the plurality of the predetermined filaments, forming an external braided sleeve around the first sub-portion of the plurality of the predetermined filaments comprising the at least one conductive filament, while exposing a portion of the at least one contact points at a predetermined radial position along the electrode formed in the at least one of: the strand, the rope, and the cable; cutting the electrode formed in the at least one of: the strand, the rope, and the cable comprising the at least one radially exposed contact point forming the wire electrode having a proximal end and a distal end; and optionally insulating the proximal end.

[00021] In yet another exemplary implementation, provided herein is a method of integrating at least one strain relief region disposed in a predetermined location in a structured electrode, the at least one strain relief region configured to impart onto the structured electrode a predetermined stiffness profile, implemented in the CIS system disclosed herein, the method, the method comprising: providing the core filament to the collector module; providing a first sub-portion of the plurality of the carriers, forming a coiled layer over the core filament; providing a second sub-portion of the plurality of the carriers, forming a removable structural layer on at least one predetermined location over the coiled layer; forming an insulating layer over at least the structural layer; cutting the structured electrode at a predetermined length comprising the at least one predetermined location of the removable structural layer; and removing the structural layer.

[00022] In an exemplary implementation, provided herein is a method of imparting a predetermined stiffness profile to at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, implemented in the CIS system disclosed herein, the method comprising: providing a first earner associated with a thermoplastic filament configured to undergo reflow upon application of heat; positioning the first carrier in a position detached from the base deck configured to enable forming at least one of: a filament winding, and a filament coil; continuously forming a plurality of windings around a portion of a plurality of the predetermined filaments comprising at least one conductive filament at a predetermined position along the at least one of: the strand, the rope, and the cable the windings forming a plurality of external reflow regions on the at least one of: the strand, the rope, and the cable; repositioning the first carrier to the base deck; providing a second carrier associated with a thermoplastic filament configured not to undergo reflow upon application of heat; positioning the second carrier, in a position detached from the base deck configured to enable forming at least one of: the filament winding, and the filament coil; continuously forming a plurality of windings around the portion of the plurality of the predetermined filaments comprising the at least one conductive filament between at least two adjacent external reflow regions on the at least one of: the strand, the rope, and the cable; repositioning the second carrier to the base deck; cutting the at least one of: the strand, the rope, and the cable comprising the plurality of reflow regions and the non-reflow windings between the at least two external reflow regions; and using the heating tunnel, removing the reflow regions, thereby imparting the predetermined stiffness profile to the at least one of: the strand, the rope, and the cable.

[00023] In another exemplary implementation, provided herein is a method of forming micro-contacts on a strand comprising at least one filament implemented in the CIS system disclosed herein, the method comprising: providing a first carrier associated with a non-insulated conductive filament; forming a first insulating layer over the non-insulated conductive filament, wherein the insulating layer defines a predetermined number of microapertures disposed in a predetermined number of locations along the non-insulated conductive filament; forming a second insulating layer over the first insulating layer; and optionally marking the predetermined number of locations of the micro-apertures along the filament externally on the second insulating layer.

[00024] In yet another exemplary implementation, provided herein is a method of forming a system on a braided yarn (SOBY), the braided yarn is comprised of at least one of: a strand, a rope, and a cable, wherein the plurality of predetermined filaments comprise at least one of: at least one strand having an integrated coil, at least one strand having an integrated capacitor, at least one strand having an integrated resistor, at least one strand having an integrated cored transformer, at least one strand having an integr ated sensor, at least one strand having an external conductive contact terminal, at least one strand having an integrated printed circuit board, at least one electrode strand, and a cable comprising two or more of the foregoing, implemented in the CIS disclosed, the method comprising: using a plurality of carriers, continuously forming a single yarn, the predetermined filament carriers configured to provide a predetermined functionality to the SOBY; and cutting the yarn at a predetermined length, configured to result in an operable SOBY.

[00025] Thus, the exemplary implementations disclosed provide many advantages that may include, but are not limited to: providing a functional strands, ropes and cables systems that may be integrated into several applications, such as a wearable garment and/or made conformal to an anatomical structure for providing stimulation or measuring responses, as well as many other implementations that will be appreciated by the skilled artisan.

BRIEF DESCRIPTION OF THE DRAWINGS

[00026] The features of the additive manufacturing methods, systems and devices for forming functional strands, ropes and cables having integrated and/or embedded components described herein, will become apparent from the following detailed description when read in conjunction with the drawings, which are exemplary, not limiting, and wherein like elements are numbered alike in several figures and in which:

[00027] FIG.s 1A-1F, is a schematic illustration of the cable-interlocking system used for implementing certain exemplary implementations disclosed;

[00028] FIG.s 2A-2B, illustrate the steps of backfilling a single filament;

[00029] FIG. 3A-3B, is a schematic illustration showing the process of forming a winding, a coil, a twisted filament using the system;

[00030] FIG.s 4A - 5C are schematic illustrations of the tensioning filament carriers used in certain exemplary implementations ;

[00031] FIG. 6 A is a schematic illustration showing an adjustable filament, strand, rope, or cable with FIG. 6B, showing an enlargement of section B in FIG. 6A;

[00032] FIG. 7A is a schematic illustration showing the cut end of the adjustable strand, an adjustable rope, and an adjustable cable, each comprised of a plurality of filaments or wires illustrated in FIG. 6A;

[00033] FIG.s 8A-8G is a schematic illustration showing another exemplary implementation of forming a coil, a winding, a wrinkle, a short between conductive portions of wires, or a bend continuously;

[00034] FIG.s 9A-9E is a schematic illustration showing various exemplary implementations for forming a woven circuit board using the systems and processes disclosed;

[00035] FIG.s 10A-10C is a schematic illustration showing various exemplary implementations for integrating a capacitor in the strands, ropes or cables formed by the methods, with FIG. 10D illustrating an exemplary testing method; and FIG. 10E illustrating a resulting complex circuitry.

[00036] FIG.s 11-12B is a schematic illustration showing various exemplary implementations of integrating various components in the strands, ropes or cables formed by the methods disclosed;

[00037] FIG.s 13A and 13B, is a schematic illustration showing the process of adding a component capable of dispensing glue or insulation coating to the filament(s) (interchangeable with wires);

[00038] FIG.s 14A-14D is a schematic illustration showing process for selectively insulated filaments (or wires); with FIG.s 14E-14G illustrating an example product created by this process; [00039] FIG.s 15A-15B is a schematic illustration showing the process of building internal strain or wire form memory into an interlocked filament, with FIG. 15C, illustrating the strain built into the strands, ropes or cables with the shape filament incorporated;

[00040] FIG. 16 is a schematic illustration showing three exemplary implementations of structured wires;

[00041] FIG.s 17A-17F is a schematic illustration showing the process of forming an electrode filament, strand, rope, or cable having external points contacts and contact terminals;

[00042] FIG.s 18A-18B is a schematic illustration showing additional configurations for structured strands, ropes, or cables;

[00043] FIG.19 is a schematic illustration showing full coverage stimulation using a macro electrode with a plurality of micro-electrode branching therefrom;

[00044] FIG.s 20A-20D is a schematic illustration showing various exemplary implementations for introducing strain relief into the strands, ropes or cables formed using the disclosed methods;

[00045] FIG.s 21A-21D is also a schematic illustration showing additional exemplary implementations for introducing strain relief into the strands, ropes or cables formed using the disclosed methods;

[00046] FIG.s 22A-22C is a schematic illustration showing an alternative reflow implementation;

[00047] FIG.s 23A-23B is a schematic illustration showing the formation of micro-contacts on a wire;

[00048] FIG.s 24A-24D is a schematic illustration showing the system on a braided yarn (in other words, the strands, ropes or cables);

[00049] FIG. 25 is a schematic illustration showing an additional exemplary implementation of selectively imparting rigidity to the wire using material capable of reflow;

[00050] FIG.s 26A-26B is a schematic illustration showing integration method of a connector into the wire;

[00051] FIG. 27, illustrates another exemplary implementation of integrating a connector/PCB into the wire formed; and

[00052] FIG. 28, is a schematic illustration showing an exemplary implementation of the interrelationship between the strands, ropes or cables (interlocked ropes).

[00053] While the disclosure is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be further described in detail hereinbelow. It should be understood, however, that the intention is not to limit the disclosure to the particular exemplary implementations described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives.

DETAILED DESCRIPTION

[00054] Provided herein are exemplary implementations of continuous additive manufacturing methods, systems and devices for forming functional strands, ropes and cables. More specifically, the disclosure is directed to additive manufacturing methods, systems and devices for forming functional strands, ropes and cables comprised of filaments or wires, having integrated and embedded components operable to continuously provide the formed strands, ropes and cables a predetermined electronic and structural functionality.

[00055] As a preliminary matter and as illustrated in FIG. 28, throughout the description, the terms: “filament”, “wire”, could be used interchangeably. Furthermore, strands can be comprised of a single, filament/wire or a coated, insulated or braided, interlocked, run in parallel, coiled, or twisted plurality of filaments, while a rope can be comprised of coated, insulated or braided, wire or single or plurality of strands and a cable (or lead or electrode (referring to elongated body with electrode contacts and terminals, for example - pacemaker leads, deep-brain stimulation leads and the like), catheter, sensor product) can be comprised of braided single or plurality of ropes, wires or strands. Additionally, a cable, a rope or a strand could be used as a wire, a strand or a rope and then be used in the buildup of wires, strands, ropes or cables; Furthermore, while certain figures depicted using braiding, or coiling or weaving all textile technologies are relevant.

[00056] As indicated, while most figures depict braiding, the disclosure is also applicable for weaving, knitting, embroidery, twisting, coiling, interlocking, and the like and their combination, for example in 2D flat structures that can be accomplished by all the above technologies, reflow for circular structure was demonstrated by using of heat-shrink or an oven, in 2D structure this could be accomplished by one or two hot plates, rolls optionally pressed against the 2D structure or optionally without any molding or pressing and simply through exposure to heat.

[00057] In certain exemplary implementations, removal of insulation from wires could be accomplished by using laser ablation during or after interlocking (in other words, the process of forming the cables disclosed, which may comprise one or more strands, filaments, and form braids), or by mechanical means, (e.g., grinding by a sand paper, using a knife and the like), chemical, lithography, thermal and lots of other options.

[00058] Turning now to FIG.s 1 A-1F, illustrating the cable interlocking system (CIS). As illustrated, provided herein is a CIS 200 for continuously manufacturing a filament, and/or a strand, and/or a rope, and/or a cable having a predetermined electric and/or structural functionality, comprising: a base deck 201, having upper surface 2010 defining a plurality of tracks 2012; a plurality of carriers 102i, each i^th carrier 102i detachably coupled to a corresponding track 2012 on the top surface 2010 of base deck, wherein each i^,h carrier 102i is adapted to accommodate a bobbin spooling a predetermined filament 1020i, a predetermined strand, a predetermined rope or a predetermined cable; and a collector module 2000 operable to collect the predetermined filament 1020i, the predetermined strand, predetermined rope, or the predetermined cable, wherein the collector module 2000 is disposed at a given distance from the upper surface 2010 of base deck 201, forming an interlocking axis (Xz), and wherein at least one of: the predetermined filaments, the predetermined strands, or the predetermined cables is configured to form an angle of between 0° and 180° (see e.g., FIG. 1C) relative to the interlocking axis (Xz); a rotatable interlocking platform (interchangeable with braiding deck) 202, operable to controllably engage each of the plurality of carriers 102i; at least one core filament supplier 150 (not shown), operably coupled to the base deck 201; a collector module 2000 configured for collecting the filament, and/or the strand, and/or the rope, and/or the cable, each having a predetermined electric and/or structural functionality. Furthermore, the collector module optionally comprises a collector powertrain; and at least one pulley (not shown), coupled to the collector powertrain, sized and configured to controllably roll the at least one of: the predetermined filaments, the predetermined strands, and the predetermined cables. The CIS optionally further comprises a plurality of levers 2013a operably coupled to the base deck 201 and optionally supporting at least one ring 2014, the plurality of levers 2013a configured to selectably raise the at least one ring 2014 to a predetermined height above the base deck’s 201 upper surface 2010, wherein the at least one ring 2014 is configured to raise at least one filament 1020i to a predetermined position from the (braiding)base deck 201, as well as, in other exemplary implementations, the earner 102i, or a mechanism coupled to the carriers, such as a knitting needles. Furthermore, the collector module 2000 comprises a collector powertrain (not shown); and at least one pulley, coupled to the collector powertrain, sized and configured to controllably roll the structured wire.

[00059] In certain exemplary implementations, the CIS further comprises at least one core filament carrier 150 (not shown), configured for feeding at least one core filament to at least one of the electrically and/or structurally functionalized strand, rope, and cable 100 each comprised of a plurality of wires or the filaments, wherein the at least one core filament is coupled to the collector module 2000; at least one weaving member 1028i, configured to engage at least one of the plurality of carriers 102i and raise the at least one engaged filament 1020i (see e.g., FIG. 1C) to a predetermined position away from a base deck surface 2010, or additionally or alternatively, raise the carrier 102i, or other components coupled to the earner 102i, configured to manipulate filament 1020i; and/or a heating tunnel (See e.g., 710, FIG. 22B), operable to selectively reflow a thermoplastic resin configured to undergo a reflow process.

[00060] In the context of the disclosure, and as illustrated for example in FIG. 1C, [00061] As further illustrated in FIG.s 1 A-1E, the CIS 200 further comprising a cutter, interposed between the at least one collector module’s pulley and the interlocking platform, operable to cut the at least one of: the predetermined filaments; the electrically and/or structurally functionalized strand, rope, and cable 100 at a predetermined length.

[00062] In an exemplary implementation, and as shown in FIG.s 14A - 14G, further provided herein is an embroider 600 having a powertrain; and a needle 601 operable to engage the predetermined filament, the electrically and/or structurally functionalized strand, rope, and cable 100 associated with the corresponding carrier, as well as an additive dispenser 500, operable to dispense an additive agent 5020 onto at least one of: the predetermined filament, the electrically and/or structurally functionalized strand, rope, and cable 100. The additive dispenser 500 is a co-extruder, an additive vat, spray, chemical vapor depositor, physical vapor depositor, doping depositor, dip coating tank, ionic depositor, or a spout, each operable to dispense an additive agent 5020 (e.g., an adhesive, insulating agent, materials with specific electrical or chemical properties, a conductive agent, a special agent that electrochemicaly functionalizes a surface, an agent that functionalizes a surface for optical special surfaces, a slip agents and the like) onto at least a (exposed or insulated) portion of the predetermined filament, the electrically and/or structurally functionalized strand, rope, and cable 100.

[00063] FIG. IF illustrates the different tracks’ revolutions of an exemplary base braiding deck. Each revolution defines a track for the carriers to move on, these tracks could conduct a revolution in any direction, change directions, move like a braiding deck, or twisting, or helical or coiling. 1. Is an outer revolution track, 2. Is a second revolution track 3. Is a third revolution track 4. Inner coil tracks allowing carriers to spin against one another, creating twisted pairs inside the lead 5. FIG. IF depicts a single carrier. Carriers from one track could also travel or move to another track on the braiding deck or to any other deck. The inner circular tracks each consist of pairs of wires carriers spinning around each other causing the wires coming out of them towards the braiding point to be twisted against each other (see e.g., FIG. IE); when there is a need to build coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament, one of these carriers is taken to the braiding deck to allow it to twist against the electrically and/or structurally functionalized strand, rope, and cable 100 (see e.g., 175, FIG. ID), in another embodiment, the CIS can include multi decks where each deck having a plurality of tracks or bases for carriers, each deck can even be moved from its position into another position in space; carriers can move inside each track in the specific decks; each carrier can be picked from any of the tracks or bases in any of the decks and placed in any other track or base in any other deck.

[00064] The outer braiding track, can be used to create an external braided jacket around the electrically and/or structurally functionalized strand, rope, and cable 100, which can be used with a variety of filaments for example, thermoplastic filaments are used. This external braid could later and after a post processing step can undergo reflow process to create an external continuous jacket to the cable, lead or catheter. In addition, the second track in the base deck is responsible in certain exemplary implementations for holding earners responsible for establishing a structural braid in the cable, lead or catheter, the track holds carriers holding different types of yarns e.g. stainless steel, polymers, . . .etc with the purpose of establishing a structure braid for the lead not to form kink, twist or collapse; optionally this track can also be used to hold carriers that hold wires that are used for creating electrode contacts . The braid can be used both for rigidity and for shielding. Likewise, the third track is an internal track, is another option for the inner track of the braiding deck, which holds carriers responsible for creating electrode contacts. This deck has the ability to restrict motion of the earners or move carriers in two directions either along a one spinning direction creating helical progression of the wires they hold in the lead or along opposite directions (like braiding decks) to create a braid; optionally this deck can also hold carriers with filaments or wires or a combination that are responsible for creating a structural braided layer within the lead, for example, the strands having integrated components therein; note that each carrier 102i can hold any of wires, str ands, ropes and cables and use them as if they were filaments to build any of the strands, ropes or cables..

[00065] An interlocking platform is provided in certain exemplary implementation, with carriers equipped with filaments or wires, moving in a circular movement in a track around the center axis (see e.g., FIG. 1C). Their movement is specified by the operator using the customer’s requirement data, thus moving them in full revolution, partial revolution, or reversed spinning direction. The braiding deck is responsible for building electrode contacts, coils, deposit additional layers in the lead or structure. Additionally, a roof deck in certain exemplary implementations can be used for “fly over” wire placement, referring to holding earners above the circular braiding deck while weaving machine is in process, achieving a fly over the lead structure while the yarn is being built. In an exemplary implementations, a filament 1020i, or a carrier 102i with the filament 1020i, can be detached from the base deck 201, and using the fly over positioning, removed from the process of constructing the strand, rope, or cable, then as needed, reincorporated into the based deck 201 or any other deck, and reenter the process. [00066] The collector module 2000, comprises a linear vertical feed motion, or drivetrain on the top. The motion away from the base deck, whether vertical or horizontal, is controlled over a wide range of speed depending on the application of the CIS and the diameter of coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filamenting carrier’s wire. The core filament is fed into the CIS, and the electrically and/or structurally functionalized strand, rope, and cable 100 can be built on top of the core, parts of the electrically and/or structurally functionalized strand, rope, and cable 100 built will be gathered by the collector module 2000.

[00067] Base deck 201 further comprises at least one movable weaving member 1028i, configured to engage at least one of the plurality of carriers 102i or filaments 10201 and raise the engaged filament 10201 or carrier 102i to a predetermined position away from the braiding deck’s 201 surface 2010. Furthermore, a cutter 190 (not shown), interposed between the at least one pulley and the interlocking platform 202, operable to cut the filament, and/or the strand, and/or the rope, and/or the cable, each having a predetermined electric and/or structural functionality at a predetermined length. The CIS further comprises a shuttle 204, referring to carriers operably coupled to any deck and in certain implementations, become a weft 170 when the carrier engaged with it is moved for example from base deck 201 to the interlocking platform 202, configured to engage at least one of the filament carriers 102i and weave the predetermined filament 1020i associated with the at least one filament earner. In the context of the disclosure, the term "engage" and various forms thereof, when used with reference to retention of a carrier attachment, refer to the application of any forces that tend to hold a carrier and a hack together against inadvertent or undesired separating forces (e.g., such as may be introduced during use of the tool). The term "engaged" may particular ly mean the interlocking of two or more components. It is to be understood, however, that engagement does not in all cases require an interlocking connection that is maintained against every conceivable type or magnitude of separating force.

[00068] As further illustrated, for example, in FIG. 1C. positioning a carrier in a position detached from the base deck configured to enable forming at least one of: a filament winding, a twisted filament, and a shorted filament means in certain exemplary implementations, coupling the selected earner to interlocking platform 202 (interchangeable with weaving deck, interlocking deck, or braiding deck). Interlocking platform 202, further defines interlocking tracks 2032 (not shown) similar to tracks 2012 on upper surface 2010 of base deck 201. Carriers 102i can also be coupled to carrier ports 2020v and used in a circular motion, to form inter-alia, coils or for a “fly-over” processing. Generally, the term “fly-over” refers to any external manipulation of the carriers away from the main braiding operation. Accordingly, in certain implementations, selected carriers arc positioned in a flyover position for certain number of operations, then relocated either to the base deck, or to the interlocking platform. For example, in weaving a shuttle holding a weft 170 wire or filament (while in process, see e.g., FIG.1C), where carrier port 2020v is used to first connect with other weft 175 wire and then will coil under warp filaments 202 li and over warp filament 1020i (202 li and 1020i referring to a filament or wire that extends generally along a longitudinal axis extending from a proximal end to a distal end of the strand, rope, or cable), configured, using weaving member(s) 1028i operating in reciprocal motion while the second weft 170 is circulating. In the context of the disclosure, the term “weft filament”, or “weft wire” refers to a wire or filament in a strand, rope or cable formed that extends circumferentially, partially circumferentially, helically, partially helically, or otherwise around or partially around a longitudinal axis extending from a proximal end to a distal end of at least one of: the strand, the rope, and the cable and is woven, or interlocked with one or more warp wires, or filaments.

[00069] In certain exemplary implementations, the CIS 200 further comprises a focused heat source, operable to heat at least one of: the predetermined filament, the predetermined strand, the core, and the predetermined cable, wherein the focused heat source is: a laser, a heated ah dispenser, a radiative heating element, a conductive heating element, or a focused heat source comprising one or more of the foregoing.

[00070] In an exemplary implementation, the CIS further comprises a central processing module (CPM) in communication with the base deck 201, the interlocking platform 202, each of the plurality of carriers 102i, the collector module 2000, the plurality of levers 2013a, and the at least one movable weaving member 1028i, the CPM comprising at least one processor in communication with a non-transitory memory device, storing thereon a set of executable instructions, operable, when executed by the processor, to execute the steps for continuously forming the filament, and/or the strand, and/or the rope, and/or the cable, each having a predetermined electric and/or structural functionality as disclosed in the methods provided.

[00071] Turning now to FIG.s 2A-3B, illustrating the use of carrier that backfills (in other words, fills an otherwise empty carrier with a filament from a full carrier) filaments or wires. For creating a filament coil, and/or a filament twist, and/or a shorted filament, and/or a wrinkled filament, each or together in a single strand during braiding or otherwise interlocking. As illustrated in FIG. 2 A, the carrier 102i is initially set up, and the wire 1020i (or filament, strand, rope or cable) is loaded in it. Accordingly provided herein is method of continuously integrating at least one coil 1031 into strand (see e.g., FIG. 3B), and/or rope, and/or cable 100, implemented in CIS system comprising: plurality of carriers 102i, each carrier 102i adapted to accommodate a bobbin (see e.g., 1021, FIG. 4A) spooling predetermined filament 1020i; collector module 2000 operable for collecting plurality of predetermined filaments 1020i; and base deck 201 (see e.g., FIG. 1 A), defining plurality of braiding tracks 2012 on upper surface 2010 of base deck 201, operable to engage plurality of carriers 102i; and optionally at least one core filament supplier 150 (not shown), configured for feeding at least one core filament to strand, and/or rope, and/or cable 100, wherein plurality of predetermined filaments 1020i are coupled to collector module 2000, the method comprising: decoupling first predetermined filament 1010 from collector module 2000; drawing portion of first predetermined filament 1010 from first carrier 101 associated with first predetermined filament 1010; backfilling the drawn portion of first predetermined filament 1010 into first empty carrier 101’ forming secondary (winding) carrier; positioning the first carrier 101, in a position detached from the upper surface 2010 of base deck 201 (see e.g., FIG. 1C) configured to enable forming the coiled filament, and/or the twisted filament, and/or the shorted filament, and/or a bent filament (see e.g., FIG. 3A, 3B); using at least one of: first carrier 101, and secondary (winding) carrier 101’, forming at least one coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament 1031 of first predetermined filament 1010 around at least one of plurality of predetermined filaments 1020i coupled to collector module 2000, thereby forming strand, and/or rope, and/or cable 100 having at least one coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament 1031 ; and repositioning first carrier 101, or secondary (winding) carrier 101’ to base deck 201.

[00072] Furthermore, before building the coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament 1031. As further illustrated in FIG. 2B, wire 1010 is cut from strand, and/or rope, and/or cable 100, or held by a mechanism that extends from another carrier, after wire 1010 is cut, the other carrier (10F) will be backfilled with as much wire as needed in order to create coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament. Now there will be two carriers 101, 101’ ready to create coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament.

[00073] Turning now to FIG. 3A, first carrier 101 is now put in a position detached from base deck 201 so that it can form a coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament over the strand, and/or rope, and/or cable 100; where it is assumed as needed covering number of windings and a number of layers until reaching a desired dimensions and specifications for the strand, and/or rope, and/or cable 100. In FIG. 3B the two carriers 101, 101’ now each hold one connection of coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament, 1031, they can now extend to the proximal side of the lead and be used to build the terminals, while the strand, and/or rope, and/or cable 100 continues embedding these wires, which can be twisted around each-others. A third wire can also be twisted with them or around them to create an electromagnetic shielding or other functional need. As used herein, when coils are formed, their use can vary between capacitors, sensors, transformers and other electronic components requiring a coil component for their operation, function or structure.

[00074] In the above exemplary implementation, the carrier pair for building a coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament, can consist of two carriers 101, 101’; the first one 101 holds the bobbin of the wires (predetermined filament 1010) and the second carrier holds an almost empty bobbin with an automatic mechanism (such as a spring-loaded bobbin, a motorized bobbin, and the like) that can engage the wire of first carrier, then by rotating, (back)filling its internal bobbin 1021 (see e.g., FIG. 5A, 5B) with enough wires needed to build the coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament; optionally when engaging the wire of the first carrier 101, another mechanism (e.g., scissors, blade, guillotine) will be used to cut the engaged wire from the Icad/cathctcr/braidcd wire (formed as the strand, and/or rope, and/or cable 100) in-process, so that this wire is now loaded between the bobbins 1021, 1021’ of the two carriers 101, 101'; after the second carrier 101’ is filled with enough wires; one of the carriers can be used according to the methods disclosed to twist, wind, bend, or wrinkle against the other carrier forming the coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament, and/or wrinkled filament (relative to other filaments) in the strand, and/or rope, and/or cable 100.

[00075] In certain implementations, the first predetermined filament 1010 is electrically conductive. Following the formation of coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament 1031, the method further comprises a step of cutting the strand, and/or rope, and/or cable 100 at a predetermined length comprising coiled filament, and/or twisted filament, and/or shorted filament, and/or bent formed. In addition, the step of repositioning further comprises transferring the at least one of: the first carrier 101, and the secondary (winding) carrier 101 ’ , from a first position on the upper surface 2010 of base deck 201 , to a second position not on the base deck (see e.g., FIG. 1C, ID). Moreover, the step of transferring can further comprise using a robotic arm (not shown, see e.g., lifters 1029i, FIG. ID) to position the at least one of: the first carrier 101, and the secondary (winding) carrier 10F in a position configured to form the coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament 1031. As noted above, the method can further comprise using the first carrier 101, or the secondary (winding) carrier 101’, forming coiled filament having a predetermined number of windings, thereby forming a primary windings structure 1031; repositioning a second carrier 105 to a position detached from base deck 201 configured to enable forming a secondary coil (see e.g., FIG. 8C) selectably causing the second carrier 105 to form a predetermined number of windings of the predetermined filament 1050 associated with the second carrier 105 wound around the windings formed by the predetermined filament associated with the first carrier 101 thereby forming an electromagnetic shielding having primary-secondary (PS) structure.

[00076] In another exemplary implementation, provided herein are carriers that automatically change the tension on the filaments. This is achieved using a winding mechanism inside the carriers that automatically increases or reduces the tension on the wires. As illustrated in FIG.s 4A-4C, the carriers include several springs (biasing elements), or a single biasing element having a variable tension. This variable tension mechanism enables changing the tension of the wire used for forming the strand, and/or rope, and/or cable 100, during the process. The tension change may be done mechanically or using a drive system. FIG. 4A illustrates a carrier that has a tension mechanism based on springs, whereby one spring produces different tension on the filament compared with the other spring; a selection mechanism can determine which tension spring is active in the carrier; in FIG. 4A, the right-hand spring is active, in FIG. 3B the left spring is selected; in Fig. 4C the selected right spring imposes tension on the carrier. Other tension mechanisms are also contemplated, e.g based on gravity, and/or on electric actuation. In addition, the selection mechanism could be done by an external button that is actuated on an external system to select the proper spring, it could also be a solenoid in the carrier that can get a command to select the proper spring; As mentioned, the carrier could move between different tracks 2012 (see e,g„ FIG.s 1 A, IF); or move in certain track in different segments - a different engagement mechanisms can be used in the different tracks or different places (see e.g., FIG.s 1C, IE) in the tracks 2012 so that when carriers 102i are placed on a different track 2012 or move to certain places on the tracks, the tension selection mechanism will adjust to alter the selection of the tension, this could be accomplished by for example, a mechanical key blade 2013 (not shown) embedded in each track 2012 and extending above upper surface 2010 of base deck 201 that is compatible with a keyhole 2013’ at the bottom of each i^th carrier 102i, one key 2013 could be for the selection of a first tension and another for the selection of another tension, so that the track 2012 configuration (see e.g., FIG. 1A, IF) could select the required tension for the carrier 102i on that track. This can be useful for example for earners that are used to place wire in the final strand, and/or rope, and/or cable 100, sometimes the wire is part of the base deck where a small tension is needed and sometimes in the interlocking platform 202 (see e,g„ FIG. 1 A, 1C), where a higher tension may be required to allow that wire to compress all the braided wires underneath it. As illustrated in FIG. 5C, also provided are carriers that automatically compensate for tension loss by adding a motorized mechanism, that can rewind wire released from the bobbin 1021 (see e.g., FIG. 5A), of any extra wire that is released from the earner. Typically, the carrier includes a spring that defines the limits of tension compensation. Any tension beyond that limit, and the filament drawn will remain lax. Accordingly, as illustrated in FIG. 5C, provided is a motor 1042, to rewind the bobbin 1021 to prevent losing the required tension, this motor could be for example implemented in the lifters (robotic arm) so that the rewinding might occur while the lifters or robotic arms are moving the carrier from one track in one deck to any track in any other deck, amount of rewinding needed is determined by the path the lifter or robotic arm will take.

[00077] As further illustrated in FIG. 1A-1D, one of the carriers 102i functions is to maintain same tension of the whe 1020i or filaments consistently during braiding, weaving, coiling, etc.; usually springs are used to set this tension. However as the carrier gets closer to the interlocking point (closer to the center (see e.g., FIG. 1 A)) the spring (in addition to other backfilling mechanisms based on other springs or gravity) will be used to maintain tension. When the springs reach their maximum length (or maximum dynamic range), additional motion on tracks 2012 towards the interlocking point 10025 (see e.g., FIG ID) will cause the wire to lose tension and become loose with the risk of releasing out of the carrier’s pulleys 1022, 1023 e.g. The dynamic range of the carrier (how much wires it can backfill, maintaining the required tension) is called the degree of compensation. As illustrated in FIG. 5A some kind of an internal sensing mechanism can be used to sense that the tension is continuously less than required and will be used as a signal for another mechanism (e.g., the motorized robot arm 104 or lifters, see e.g., FIG. 5C), to conduct motorized or automatic backfill (in other words, rewinding) (an external sensing mechanism, or other mechanism for determining when the carrier needs to be backfilled could be also be implemented and used). As illustrated in FIG. 5B, a motor 1032 can be used to rewind as much wire as needed in order to return the earner into a functional position that is needed to maintain the proper tension. An alternative mechanism is illustrated in FIG. 5C, where the robotic arm 104 further comprises an internal mechanism operable to maintain a constant, predetermined tension along the whole operation range of the robotic arm, which adjusts the tension compensation continuously in the wire by, for example, attaching a gear- 1044 to the bobbin 1021 and rewinding bobbin as needed to maintaining the wire continuously within compensation range. Determination of the amount of rewinding (for back filling) needed could be calculated according to the carrier path and its distance from the interlocking point 185 (see e.g., FIG. IE). And optionally could be done in real time.

[00078] In another exemplary implementation, the systems disclosed further comprise another “pick-and- place” sub-system for the embedded components (e.g., interposer, terminals PCBs), the primary function is to automate the process of picking up different electronic components and placing them onto the strand, and/or rope, and/or cable. The sub-system can consist of a robotic arm with multiple degrees of freedom, allowing it to move in various directions. The arm is equipped with suction nozzles or grippers, which are designed to securely pick up and hold electronic components. These nozzles or grippers are adaptable to different component sizes and shapes, ensuring compatibility with various components. To accurately identify and locate the components, pick-and-place sub-systems incorporate in an exemplary implementation, vision systems. These vision systems use cameras and image processing algorithms to recognize the components on the feeders or storage trays. This enables the subsystem to determine the precise position and orientation of each component before picking it up, ensuring proper alignment during placement on the the strand, and/or rope, and/or cable. To achieve high accuracy and precision, these sub-systems employ advanced motion control mechanisms. The robotic arm moves according to programmed instructions or coordinates obtained from, for example, CAD (Computer-Aided Design) files. The control system ensures smooth and controlled movements, enabling the sub-system to align and place components with precision onto the proper section of the the strand, and/or rope, and/or cable. The pick-and-place sub-systems used with the systems disclosed herein, allow for quick changeovers between different component types and strand, and/or rope, and/or cable designs, as well as be programmed to handle various sizes, shapes, and orientations of components, adapting to different assembly requirements.

[00079] Accordingly and in an exemplary implementation, provided herein is a tension controlling carrier (TCC) 102i, the TCC further comprising: a first adjustable biasing element 1025 (see e.g., FIG. 4C) coupled to a predetermined filament 1020i, operable to control the tension on the predetermined filament 1020i: a bobbin 1021 adapted sized and configured to spool the predetermined filament 1020i; a selector 1024 (see e.g., FIG. 3A); and at least one movable pulley 1023 (see e.g., FIG. 3B) operably coupled to the selector 1024, configured to engage the predetermined filament 1020i, wherein the selector 1024 is operable to selectably couple to the first biasing element 1025. Also illustrated is a second biasing element 1026 having a different biasing force than the biasing force of the first biasing element 1025, and a sensor 1027 operable to maintain a predetermined tension on the predetermined filament 1020i associated with the TCC 102i. The sensor 1027 is operably coupled to at least one of: the at least one pulley 1023, and the bobbin 1021. As indicated, maintaining the predetermined tension comprises at least one of: selectably translating the at least one pulley 1023 relative to the fir st 1025 or second 1026 biasing element then-engaged by the selector 1024, and rotating the bobbin 1021. [00080] In another exemplary implementation provided herein is hidden terminal contacts, that can be punctured at different sites to allow connection of another device to the electrode as needed. For example, in order to cut unnecessarily lead portions outside the body. During connection, the layers isolating the hidden terminals could be stripped or punctured to have an electronic communication between device and terminals. As illustrated in FIG.s 6A and 6B, the strand, and/or rope, and/or cable 100 (left most) has a distal 1111 and a proximal end 1110, electrode contacts 1123p at the distal end will have conductors running through the strand, and/or rope, and/or cable 100 each to multi terminal contact points 1120j at the proximal end, once a certain position A’ for connection at the proximal end 1110 is selected, either by markers on the jacket of the strand, and/or rope, and/or cable 100, or by other means; the selection of the connection site could be in circumstances where the connection to the electronically, and/or structurally functionalized strand, and/or rope, and/or cable 100 is needed to be as close as possible to some anatomical structure, e.g. directly where the electronically, and/or structurally functionalized strand, and/or rope, and/or cable 100 exit the skull in case of a brain implant; the electronically, and/or structurally functionalized strand, and/or rope, and/or cable 100 can have multi connection site A, each A site will be suitable for connecting to all the contacts in the electronically, and/or structurally functionalized strand, and/or rope, and/or cable 100. Connector 300 can connect on the electronically, and/or structurally functionalized strand, and/or rope, and/or cable 100 at the required site A’ , because the electrode terminals 1120j are insulated to the outside, the connector 300 connecting to the lead will have pins 301q, needles or knifes that will protrude the insulation 1001 and couple to the contact point 1120j . The extra lead length at the proximal side can now be cut away and be removed. Tip insulation can be used in order to insulate the cross section where the cut was conducted (see e,g„ FIG. 7A). Additionally, or alternatively, the electronically, and/or structurally functionalized strand, and/or rope, and/or cable 100 can be marked on the underlying patterns, beginning and end of each contact points 1120j group A, and/or be marked with numbers, so that when external connector 300 is coupled, the number under the first pin 30 Iq, or the number where connector B is starts its connection to the cable (or any other alphanumeric designation) is entered in a software product provided to map electrode contact points 1123p to the software. For example, if connector B is connected at apposition to 1123p is connected to electrode No. 3, then the software (and the set of executable instructions encoded) will need to know this information, so that electrode 3 is always connected to pin No. 1 in connector 300 (see e.g., 6B).

[00081] In another embodiment all the electrode contact terminals 1120j are exposed before connection of connector B, or where cable is cut after or before the connection of connector B (see e.g., FIG.s 7A-7B) then an insulating jacket for terminals that are exposed will be provided. This can be done with a dedicated tool that will cap the exposed lead.

[00082] Therefore, and as seen in FIG. 6A-7B, in an exemplary implementation, provided herein is a method for continuously forming an adjustable strand, an adjustable rope, and an adjustable cable, 100 each comprised of a plurality of filaments or wires having a plurality of embedded contacts, each electrode contact point 1123p in communication with a corresponding electrode terminal 1120j of a plurality of terminals, implemented in the CIS disclosed herein, the method comprising: positioning a first carrier 105 (see c,g., FIG. 8A) having a conductive filament in a position detached from the base deck 201 configured to enable interlocking the conductive filament having an insulated portion 1050 and the non-insulated portion 1051, which is associated with the first carrier 105; using the first carrier 105, continuously interlocking the conductive filament having the insulated portion 1050 and the non-insulated portion 1051, wherein the non-insulated portion 1051 of the conductive filament is configured to extend radially from the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable 100; repositioning the first carrier 105 to the base deck 201; forming an insulating sleeve 1001 over a portion of the strand, and/or rope, and/or cable 100 comprising a plurality of contact points 1120j , and electrode terminals 1123p; marking the location of the plurality of contact points 1120j, and electrode terminals 1123p formed by the conductive filament having the insulated portion 1050 and the non-insulated portion 1051, which is associated with the first carrier 105 on an external surface of the insulating sleeve 1001 of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; removing (or not insulating in the first place) the insulating sleeve 1001 from over at least one electrode terminal 1023p on a distal portion of the adjustable strand, the adjustable rope, and the adjustable cable 100; upon determining an operational length of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable 100, based on the marking, removing the insulating sleeve 1001 over a first contact point 1020j from the plurality of contacts points sized and configured to form the proximal end 1110 of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable 100; and insulating the proximal end 1110. Further prior to the step of forming an insulating sleeve 1001 : positioning a second carrier 106 having a second conductive filament 1020i in a position detached from the base deck 201 configured to enable interlocking the conductive filament having the insulated portion 1060 and the non-insulated portion 1061 (See e.g., FIG. 8D), which is associated with the second carrier 106; using the second earner 106, continuously interlocking the conductive filament having the insulated portion 1060 and the non-insulated portion 1061, wherein the non-insulated portion 1061 of the conductive filament is configured to extend radially from the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable 100, forming a plurality of second contact points 1020j and electrode terminals 1023p at a predetermined distance along the adjustable strand, the adjustable rope, and the adjustable cable 100; and repositioning the second carrier 106 to the base deck 201, wherein the step of marking the location of the contact points 1020j =, and electrode terminals 1023p on the external surface of the insulating sleeve 1001 further comprises marking the location of the second contact terminal points 1120j under the surface of the insulating sleeve 1001; and removing the insulating sleeve 1001 over at least one contact point configured to form the terminal of the adjustable strand, the adjustable rope, and the adjustable cable 100 further comprises removing the insulating sleeve over at least one second contact point. Further, the insulating sleeve 1001 is configured to allow coupling of the adjustable cord 100 to at least one of: a device, a terminal, and an interposer (generally 300), wherein the marking is at least one of: a geometric shape corresponding to the region, a letter, and a number. [00083] Additionally, the method further comprises contacting a tissue, an organ, or a surface with the distal portion of the electrically and/or structurally functionalized adjustable str and, rope, and cable 100 comprising the electrode terminal 1123p ; selectively coupling the at least one of: the device, the terminal, and the interposer at the contact 1120j marking below the proximal end 1110 of the adjustable cord 100; and cutting the electrically and/or structurally functionalized adjustable strand, rope, and cable 100 between the at least one of: the device, the terminal, and the interposer coupled at the selected marking, and the proximal end 1110 forming an exposed proximal end, then reinsulating the electrically and/or structurally functionalized adjustable strand, rope, and cable 100.

[00084] An additional exemplary implementation of integrating at least one of: a coiled filament, a twisted filament pair, and a shorted filament pair into the electrically and/or structurally functionalized, and/or adjustable strand, rope, and cable 100 using the CIS disclosed, is illustrated in FIG.s 8A-8G, illustrating the various ways of forming shorted filaments, that can later be used to construct additional electrical components, such as resistors, capacitors, transformers, sensors, electrodes, and their combinations to continuously construct electric circuits integrated into the strand(s), rope(s), or cable(s) disclosed.

[00085] The two isolated wires are exposed, for example at a predetermined area to create a short between the wires when brought in contact with each other, then create coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament between the two wires along the isolated portion of the wire. As illustrated in FIG. 8A before forming a coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament, two wires (1050 and 1060) will be used in order to create at least one of: a coiled filament, a twisted filament pair, and a shorted filament pair, FIG. 8B first insulated wire 1050 is exposed at a certain location (1051), then coiled or interlocked into the electrically and/or structurally functionalized strand, rope, and cable 100; FIG. 8C second wire 1060 is exposed at a certain place (1061), then is wound (wrapped) or interlocked onto the first wire such that both exposed segments 1051, 1061 of the two wir es will now be shorted together creating a connection 1035.

[00086] FIG. 8D, showing another alternate way of forming a functional component (coil, resistor, capacitor, an electric circuit, a sensor, and the like or their combination) from two filaments that are now shorted together at a certain point, where winding, twisting and shorting can now be done with one (or both) of the wires to create the coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament each with the desired dimensions, lengths, number of windings, layers and spacing; one of the wires could, for example extend in the middle of coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament or on top of it as desired; FIG. 8E showing another alternative way to form a short where the CIS is back to its starting position ready to continue interlocking depicting another way of establishing g a short between two wires by twisting two exposed segments of the wires against each other and thus creating a short, now it will be possible to create the desired element (e.g. FID. 8D).

[00087] It is noted that the connection accomplished in FIG.s 8B and 8C or in FIG. 8E could be used as a method for connecting any two or more wires at different positions in the lead body using interlocking mechanisms, the connection and/or shorting could be accomplished by coiling at least the two wires together or twisting the wires (see e.g., FIG. 8C, FIG. 8E), or knitting them together, or just abutting one against each other, at the position when the wires are exposed. As illustrated in FIG. 8C or in FIG. 8E, the two wires are twisted against each other such that the exposed segments 1051, 1061, are twisted together creating a short between the two wires; in FIG. 8D now one carrier will form a winding, or a twist while the other wire remains uncoiled or coiled according to a certain pattern optionally creating for example an inductive coil, a resistor, a capacitor, a sensor, a memristor, or any other element. Now these two wires could optionally be twisted together after the element is created to eliminate electromagnetic interference, the two ends can be further coupled to other electronic components or extend in the body of the electrically and/or structurally functionalized strand, rope, and cable 100 towards the terminal area to be connected to external systems. Moreover, laser welding or resistive welding can be used in certain exemplary implementations to affirm connection of the wires.

[00088] Accordingly, provided herein is a method of continuously integrating at least one of: a coiled filament, a twisted filament pair, and a shorted filament pair in at least one of a strand, a rope, and a cable, 100 each comprised of a plurality of wires or the filaments, implemented in the CIS systems disclosed herein, the method comprising: providing a first predetermined moveable filament carrier 105 associated with a first insulated conductive filament 1050; providing a second predetermined moveable filament carrier 106 associated with a second insulated conductive filament 1060; removing the insulation over a portion of the first insulated conductive filament 1050 forming an exposed portion 1051 on the first insulated conductive filament 1050; removing the insulation over a portion of the second insulated conductive filament 1060 forming an exposed portion 1061on the second insulated conductive filamentl060; shorting the exposed portion on the first insulated conductive filament 1051 with the exposed portion on the second insulated conductive filament 1061; positioning the first carrier 105, or the second movable carrier 106 to a position configured to enable forming coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament; using at least one of: the first carrier 105, and the second movable carrier 106, forming at least one shorted region 1035 of: the first predetermined conductive filament 105, and the second predetermined conductive filament 106 around at least one filament 1020i coupled to the collector module 2000; and repositioning the at least one of: the first carrier 105, and the second movable carrier 106 to the base deck 201, thereby continuously forming the strand 100 having at least one coil with two terminals. In addition, the method further comprises a step of cutting the strand at a predetermined length sized to include the at least one coil with two terminals, and wherein each of the first insulated conductive filament 1050 and the second insulated conductive filament 1060 comprise an interrupted insulating sleeve forming an insulated portion, and an exposed portion 1051, 1061.

[00089] In addition, the step of repositioning further comprises transferring the at least one of: the first carrier 105, and the second carrier 106, from a first position on the base deck 201, to a second position not on the base deck, and whereby the step of shorting comprises abutting the exposed conductive filament portion of the first insulated conductive filament 1051 and the exposed portion of the second insulated conductive filament 1061. [00090] Turning now to FIG.s 9 A to 9E, illustrating forming coiled, or woven, or wound filament, and/or twisted filament, and/or shorted filament, and/or bent filament in a weaving technology, or, additionally or alternatively, using the CIS systems disclosed, where in creating coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament from two wires two wires are used. These are shorted at certain points by e.g., twisting together, pushing them against each other through the weave or other methods in order to create a steady connection between the wires; then one of the wires is woven through the structure (see e.g., FIG. 9B), or against number of filaments (see e.g., FIG. 9A), which is accomplished here by coiling against the warp filaments; optionally upon completion the two edges of coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament are twisted to prevent electromagnetic interferences.

[00091] Accordingly, and as illustrated in FIG.s 9A-9E, provided herein is a method of continuously forming a woven strand 100 having at least one coiled portion implemented in a CIS system disclosed herein, the method comprising: providing a first carrier 108 associated with a first insulated conductive filament 1080; providing a second carrier 109 associated with a second insulated conductive filament 1090; removing the insulation over a portion of the first insulated conductive filament forming an exposed portion 1081 on the first insulated conductive filament; removing the insulation over a portion of the second insulated conductive filament forming an exposed portion 1091 on the second insulated conductive filament 1090; shorting the exposed portion on the first insulated conductive filament 1081 with the exposed portion on the second insulated conductive filament 1091; weaving the shorted portion across a predetermined number of predetermined filaments 1020i coupled to the collector module 2000, repositioning the first carrier 108, or the second movable carrier 109 in a position configured to enable forming coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament; using at least one of: the insulated portion 1080 of the first carrier 108, or the insulated portion 1090 of the second movable carrier 109, forming at least one winding of: the first predetermined conductive filament 1080, or the second predetermined conductive filament 1090 around a predetermined number of the predetermined filaments 1020i coupled to the collector module 2000.

[00092] Additionally or alternatively, the step of using at least one of: the fu st carrier 108, or the second movable carrier 109, forming at least one coil, is replaced with a step of weaving the insulated portion 1080 of the first predetermined conductive filament, or the insulated portion 1090 of the second predetermined conductive filament in a predetermined pattern through a predetermined number of the predetermined filaments coupled to the collector module, forming a woven fabric 800 of a portion of the predetermined filaments 1020i.

[00093] Likewise, at least one coil can be formed in parallel (see e.g., FIG. 9B, right side) of the collection direction by the collector module 2000. Also, before the step of weaving the shorted portion, forming a woven fabric 800 of a portion of the predetermined filaments.

[00094] In another exemplary implementation, the systems and methods disclosed are used to integrate a capacitor into the wire (CIW). Capacitors are typically made of two plates separated by a dielectric layer. To be able to produce a good capacitor with the micro-weaving technology a material with a good dielectric constant is used. The dielectric constant for thermoplastic poly(urcthanc) (TPU) is 1.02 - 1.21 (similar to air). Some polymers have higher dielectric constants than TPU. For example, Poly(vinylidenefluoride) (PVDF) or polyvinylidene difluoride has a dielectric constant of 10.2. For comparison, the dielectric constant of an aluminum oxide capacitor is 8.5. Dielectric constant of ceramic capacitors can range from 15 to 20,000. The materials used in ceramic capacitors are ferroelectrics, the main one used is barium titanate (BaTiO3). Ferroelectrics can be ideal for miniature capacitors. In addition, the dielectric strength of a polymer can be changed by adding impurities to it (e.g. barium titanate powder). For example, adding BaTiO3 powder to PVDF (40% by weight) can increase its dielectric strength to 70. Other powders can be used, for example some metal oxides like titanium dioxide (TiO2) (which is also biocompatible) can be added to PVDF or other polymers and increases the dielectric strength to 20. Additionally, some materials are affected very differently from the addition of TiO2, for example, polypyrrole mixed with 5% by weight TiO2 exhibited very high dielectric strength (much higher than each material alone) 4300 @ lkHz and 1250 @ 10kHz.

[00095] In an exemplary implementation, TiO2 powder is added to the TPU, PVDF, or other thermoplastic filaments while being extruded (or melted and mixed before extrusion). This should increase the dielectric constant depending on the volume percent (^yTlOz) added.

[00096] In an exemplary implementation, the wire is insulated via the dielectric material. Meaning the uninsulated wire is coated with the dielectric material before loading on the CIS and into the carrier. Two wires are coiled one on top of the other (see e.g., FIG. 10B), possibly multiple times. For example, the wire diameter can be 30 pm, the dielectric coating can be 10 pm, the length of coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament is 5mm, and the diameter of coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament is 1 mm. The equation representing a parallel plate capacitor is provided as EQU. 1 :

Where k the dielectric is constant, £ is vacuum permittivity constant, A is the plate’s area and D is the distance between the plates. Substituting the values (for a single layer): k = 100, s = 8.854

We get capacitance of:

C = 1.3 nF

[00097] Another exemplary implementation, can be where two uninsulated coils are coiled on top of each other and separated by a dielectric layer (see e.g., FIG. 10C). The dielectric layer would be applied by a separate filament that is coiled between the two wire coils. Multiple layers can be made. The calculation for this is the same for above but does not have intrinsic inductance.

[00098] In yet another method, electromechanical sensors could be built from the same elements created by the CIS (e.g. coils, capacitors, resistors, electrical circuits, piezo bodies, etc.) any mechanical force that is projected on the element will change its properties, or in some cases will change an electrical field within them, or create a charge or a change of impedance that can be read by a system connected to the sensor. An example of such sensors is a touch sensor that is fabricated for producing a tip touch sensor for cables, leads or catheters. The sensor is placed at the head of the catheter. For example in capacitors if the dielectric layer is compressible then its capacitance would change by applied mechanical force; the applied force could be in the form of bending, pulling, displacement, crushing, etc. To produce an exemplrary force sensing capacitors, two metal plates are used, held in place by the separating dielectric layer, and as explained earlier if the dielectric layer is compressible then its capacitance would change by applied mechanical force later during its operation. The plates of the capacitor can be made like the similar' method: uninsulated wires coiled and separated by dielectric coil, the structure would then be wrapped in heat shrink polymer film and heated in oven to reflow the dielectric material (e.g., TPU mixed with other substances). Afterwards, the cylinder would be cut along its length to produce a sheet, each coil would have an input wire coming out of the complex. For small deflections the capacitance changes linearly around C_nonimal according to the following equation:

EQU. 2

[00099] Where C is the capacitance, F is the applied force, £ is the vacuum permittivity A is capacitor area, fc is the dielectric constant, and d is the nominal distance between the plates.

[000100] The capacitors provided herein can be used to implement connections between two separate wires frequency' (3dB attenuation) for a RC circuit is provided by equation 3:

EQU. 3

[000101] It should be understood; that creating electromechanical sensors that can tr anslate mechanical forces in any force can be accomplished by using the CIS system braiding, coiling or weaving electrical components such as coils, capacitors, resistors, etc. in specific places along the cable. These elements would translate forces applied on them into an electrical charge, current, electrochemical change, impedance change, etc., a system connected to these elements will be

[000102] The micro-weaving technology can also implement a low pass filter by including the capacitors in par allel to the load. This is done by coiling the wire before it goes out to the load, and coiling another wire on top of it, which is connected to ground. [000103] Accordingly, provided herein is a continuously integrating at least one capacitor in at least one of the electrically and/or structurally functionalized strand, rope, and cable 100 each comprised of a plurality of wires or the filaments, implemented in the CIS system disclosed herein, the method comprising: providing a first carrier (e.g., 106), adapted to accommodate a bobbin of a filament comprising a first and a second conductive strands 1062, 1063 (see e.g., FIG. 10A), each conductive strand 1062, 1063, coated with a dielectric coating; positioning the first carrier 106, in a position detached from the base deck 201 configured to enable forming at least one winding; and using the first carrier 106 forming at least one winding of the filament comprising a first and a second conductive strands, 1062, 1063, coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament and/or wound filament around at least one of the plurality of predetermined filaments 10101 coupled to the collector module 2000. Additionally, the method comprises a step of cutting the electrically and/or structurally functionalized strand, rope, and cable 100 at a predetermined length, configured to comprise the at least one integrated capacitor formed by the method.

[000104] Additionally, or alternatively, provided herein is a method of continuously integrating at least one capacitor into the electrically and/or structurally functionalized strand, rope, and cable 100, implemented in the CIS system disclosed herein, the method comprising: providing a first carrier 106 associated with a first insulated conductive filament 1062; providing a second carrier 106’ associated with a second insulated conductive filament 1063; providing a third carrier 106” associated with a third dielectric filament 1065; in a position detached from the base deck 201 configured to enable forming at least one winding using the first, or second conductive filament 1062, 1063; using the first earner 106, or the second movable carrier 106’, forming at least one winding of the first insulated conductive filament 1062, or the second insulated conductive filament 1063 around at least one filament lOlOi coupled to the collector module 2000, wherein the formed winding of the first or second insulated conductive filament 1062, 1063 has a predetermined number of windings; repositioning the first carrier 106, or the second movable carrier 106’ to the base deck 201; positioning the third carrier 106” in a position detached from the base deck 201 configured to enable forming at least one winding of the dielectric filament 1065; using the third carrier 106”, forming at least one winding of the dielectric filament 1065 around the winding(s) formed by the first 1062 or second 1063 conductive filaments; repositioning the third carrier 106” to the base deck 201; positioning the first carrier 106, or the second carrier 106’, in a position detached from the base deck 201 configured to enable forming at least one winding using the first 1062, or second 1063 insulated conductive filament; using the first carrier 106, or the second movable carrier 106’, forming at least one windings of the first predetermined conductive filament 1062, or the second predetermined conductive filament 1063 around the winding(s) formed by the dielectric filament 1065, wherein the formed winding(s) of the first 1062 or second 1063 insulated conductive filament has a predetermined number of windings thereby continuously forming the wire having an integrated capacitor 402; and repositioning the first carrier 106, or the second movable carrier 106’ to the base deck 201. The electrically and/or structurally functionalized strand, rope, and cable 100 is then cut at a length configured to comprise integrated capacitor 401, and/or 402. [000105] Similarly, as illustrated for an exemplary implementation in FIG. 11, the methods and systems disclosed can be used to integrate a resistor into the electrically and/or structurally functionalized strand, rope, and cable 100. For example, by using insulated carbon wires. Including shorts, zero value. Filaments are made of carbon or conductive polymers, while coiling in different rotational directions provides for eliminating inductance. Additionally or alternatively. Insulation is selectively removed from filaments 1062 and 1063 in the capacitor area (e.g., using laser or other focused heat source), thus shortening the windings of the same wire creating a layer, which is used to prevent the component from turning into an inductive coil.

[000106] Alternatively, a strand, rope, or cable is constructed that includes wires and dielectric filaments that run in a certain portion along the strand, rope, or cable then fold against each other in space, creating capacitor components within the strand, rope, or cable, then these wires continue for a certain portion along the lead then the two wires can be used as the terminal of this capacitor - connecting to other electrical components within the lead or forming terminals for external systems. Accordingly, provided herein is a strand, rope, or cable, each comprising an integrally formed capacitor, the capacitor formed of at least a portion of the filaments used to form the strand, rope, or cable. In other words, disclosed is a product that includes wires and dielectric filaments that run in a certain portion along the strand, rope, or cable, which are then being reconfigured spatially within each of the strand, rope, or cable, creating a capacitor components (or a resistor, or a transformer, or a sensor) integrated within each of the strand, rope, or cable, which then continue “running” for a certain portion along the strand, rope, or cable. The two wires/filaments can then be used as the terminal of this capacitor (or a resistor, or a transformer, or a sensor)- connecting to other electrical components within the strand, rope, or cable, or forming terminals for coupling to external systems/devices. Additionally, when creating a coil, a capacitor or a resistor one can control the parameters of the System, filament, strands, ropes or cables and other materials used that will contribute to the values of the inductance, resistance and capacitance in order to create a complex circuit that is created by one element. For example, when creating an inductor by a coil the system will incorporate dielectric materials between the coil layers (as illustrated in FIG.s 10A-10D) or the coil adjacent windings and by selecting the appropriate resistance material one can thus and for example create a complex circuit that can have a model of an inductor and resistor in series parallel to a capacitor FIG. 10F; such an element becomes a resonant circuit with a specific resonant frequency; this can be used in leads that are implantable in order to tune the lead communication and powering to external antenna. Creating a complex circuit with one element only can reduce the cable complexity and number of physical elements compared to the number of electrical element it actually created. Such complex elements could include a sensing element that includes a sensor in it. E.g. a coil can become an electromechanical sensor because its inductance is dependent on its mechanical form (e.g. number of windings, layers, spacing between layers and winding), capacitance materials laid within its layers could even enhance its sensitivity (e.g. a resonant circuit impedance is very sensitive to form changes), any mechanical stress, strain, bending, crushing, kinking, twisting of this physical coil element could immediately change the properties of the circuit something that can be used to enhance the sensitivity of this circuit to mechanical changes. Multi elements like these could be spread in the resulting wire, strand, rope or cable, all the sensors all be interrogated for their impedance values, returned values could now be fed into algorithms (e.g. Al algorithms, Al models, . . . etc.) in order to determine a certain mechanical force that is applied on the cable or on specific points within the cable, the availability of multiple such elements trying to measure for example same measure will yield a more accurate result. Additionally, given the ability to create a complex construct of a tuning circuit and a sensor (with at least one element) it will be possible to interrogate such a complex construct with a radio magnetic waves (RF wave) by measuring specific influence the complex construct inflict on the magnetic wave or field.

[000107] Accordingly, provided herein is a method of continuously integrating at least one resistor 900 into the electrically and/or structurally functionalized strand, rope, and cable 100 optionally implemented in the CIS system disclosed herein, the method comprising: providing a first carrier 901 associated with a first insulated conductive filament 9010; providing a second carrier 902 associated with a second insulated conductive filament 9020, wherein the second insulated conductive filament 9020 has a different resistivity than the first insulated conductive filament 9010; removing the insulation over a portion of the first insulated conductive filament 9010 forming an exposed portion 9011 on the first insulated conductive filament; removing the insulation over a portion of the second insulated conductive filament 9020 forming an exposed portion 9021 on the second insulated conductive filament 9020; contacting the exposed portion 9011 on the first insulated conductive filament 9010 with the exposed portion 9021 on the second insulated conductive filament 9020; note that contacting of the two exposed segments could also be accomplished by twisting the two exposed segments of the conductive fillaments against each other; positioning the first carrier 901, in a position detached from the base deck 201 configured to enable forming at least one of: a winding, a wrinkle, and a wave of the first insulated filament 9010; using the first carrier 901, forming at least one winding of the first insulated conductive filament 9010 around a portion of the second insulated filament 9020. The resistor can also be formed by using two filaments with the same resistance properties, with one filament (e.g., 9010) having a different length over the same distance as the other filament (e.g., 9020). Upon completing the formation of the resistor, the first carrier 901 is detached from the weaving deck and repositioned onto the base deck, to the base deck 201, thereby continuously forming the electrically and/or structurally functionalized strand, rope, and cable 100 having at least one resistor 900. Furthermore, the step of contacting the exposed portion on the first insulated conductive filament 9011 with the exposed portion on the second insulated conductive filament 9021 comprises: positioning the first carrier 901 in a position detached from the base deck 201 and coupling first carrier 901 to a predetermined track on weaving deck 202 (e.g., in carrier ports 2020v), configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament 9010. Shorting the exposed portion on the fir st insulated conductive filament 9011 with the exposed portion on the second insulated conductive filament 9021 can also be achieved as disclosed in connection with FIG.s 8A-8E. Next, using the first carrier 901, forming the winding in a predetermined direction of the first insulated conductive filament using only the exposed portion 9011 on the first insulated conductive filament 9010; repositioning the first carrier 901 to the base deck 201; positioning the second carrier 902 in a position detached from base deck 201 configured to enable forming coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament, and or wrinkled filament; using the second carrier 902, forming a (plurality of) winding(s) in a direction opposite, or the same to the predetermined direction of the first insulated conductive filament 9010 using only the exposed portion 9021 on the second insulated conductive filament 9020, wherein the (plurality of) winding(s) formed by the exposed portion of second insulated conductive filament 9021 abuts the exposed portion of the first insulated conductive filament 9011. The total value of the resistance of the element created will be a function of the resistivity to length of each wire and the total length of the wires used to create the resister from the point of their short to the terminal points. As indicated before, the electrically and/or structurally functionalized strand, rope, and cable 100 comprising the resistor can then be cut and used alone or as in other cases, bundled to form an electrically and/or structurally functionalized strand, rope, and cable 100 of one or more resistors, capacitors and other integrated components.

[000108] In addition, other sensors can be added to the interlocked structure, such as touch sensor, temperature sensor, electromagnetic sensor, microphone, electrochemical sensors, electromechanical sensors (different coating, when exposed reacts to different materials). As illustrated in FIG. 12A-12C, additional components can be similarly added to the wires, such as cored transformers and sensors. Thus, provided herein is a method of continuously integrating at least one cored transformer in the electrically and/or structurally functionalized strand, rope, and cable 100 implemented in the CIS system disclosed herein, the method comprising: providing a first carrier 911 associated with a first insulated conductive filament 9110; providing a second carrier 912 associated with a second insulated conductive filament 9120; providing an elongated core 91; positioning the first carrier 911 in a position detached from the base deck 201 configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around the elongated core 91; using the first carrier 911, forming at least one winding of the first insulated conductive filament 9110 around the elongated core 91 (it is noted, that the method can be configured to form multi-layers as needed as well); repositioning the first carrier 911 to the base deck 201; positioning the second carrier 912 in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the second insulated conductive filament around the elongated core 91; using the second carrier 912, forming at least one winding of the second insulated conductive filament 9120 around the elongated core 91; and repositioning the second carrier 912 to the base deck 201.

[000109] Similarly, as illustrated in FIG. 12B, provided herein is a method of continuously integrating at least one sensor in the electrically and/or structurally functionalized strand, rope, and cable 100 implemented in the CIS system disclosed herein, the method comprising: providing a first earner 107 associated with a first insulated conductive filament 1070; providing a sensor 92, wherein the sensor 92 comprises at least one contact region 921; positioning the first carrier 107 in a position detached from the base deck 201 configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around the at least one contact region 921; using the first carrier 107, forming at least one winding of the first insulated conductive filament 1070 around the at least one contact region 921, with a predetermined number of windings; and repositioning the first carrier 107 to the base deck 201. In addition, where the sensor further comprises a second contact region 921’, the method further comprises, following the step of repositioning the first carrier 107 to the base deck 201: providing a second carrier 107’ associated with a second insulated conductive filament 1070’ ; positioning the first carrier 107’ in a position detached from the base deck 201 configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around the second contact region 921’ ; using the second carrier 107’, forming at least one winding of the second insulated conductive filament 1070’ around the second contact region 921’ of the sensor 92; and repositioning the second carrier 107’ to the base deck 201.

[000110] Turning now to FIG.s 13A, and 13B, where controlled gluing or coating injection of microstructures by dispensing glue or other substances or agents on the wire or filament before wire is interlocked into the structure, glue is injected in an exemplary implementation, or form a layer on the wires as the insulation layers of a wire. Alternatively, a mechanism that pushes the wire into a glue or other substances container (see e.g., FIG. 14A) could apply glue or other substance over the wire while braiding, Optionally pushing a sponge filled with glue or other substances onto the wire could be utilized. Alternatively, a mechanism where the wire passes through or on (like a wheel) could have a glue injection mechanism (and/or other substance) determining when to apply glue (and/or other substance) on the wire. Once glue (and/or other substance) is applied to the wire, a component could for example be added on the wire, then this component (e.g. IC, electronic components) could be interlocked/braided into the lead structure (of course - all these are also relevant to other types of filaments and the glue could be a conductive glue). As illustrated in FIG.s 14A, 14B, glue (and/or other substance) injection during interlocking/braiding, additionally injection of other materials could be accomplished, other mechanism like drying, passivation, UV curing, sintering are also used in certain implementations after the injection or application of glue and/or other substances in order to functionalize the agent after it was injected; such methods could also be done on the electrically and/or structurally functionalized strand, rope, and cable 100 post-processing.

[000111] Accordingly, provided herein is a method of continuously coating a filament or the electrically and/or structurally functionalized strand, rope, and cable 100 with an additive agent implemented in the CIS system disclosed herein, the method comprising: providing a first carrier 110 associated with a first predetermined filament 1100; positioning the dispenser 120 in a position configured to dispense the agent 1200 onto the first predetermined filament 1100; and dispensing the agent 1200 onto the first predetermined filament 1100. Moreover, the additive agent 5020 can be an adhesive, a special substance creating electrochemical surfaces on the wire, insulation materials, Lithographic agent, conductive substance, capacitive substance (e.g. TPU mixed with Titanium dioxide, TPU with AgCL) or an insulating liquid adapted to form an insulating layer around the first predetermined filament 1100. Dispensing of the agent could be done in many techniques like spraying, applying, coextrusion, dipping, and the like or their combination. [000112] An alternative system can comprise an embroider, as illustrated in FIG.s 14A-14D, where the wire used in the CIS is initially not insulated, the wire passes through, for example, a co extruder 500, where an insulated jacket is coextruded with the wire to form an insulation; (See e.g., FIG.14B) at certain wire segments and as predetermined the extruder 501 will not extrude insulation over the wire 130 and a segment of the wire will remain non insulated 1300 (see FIG. 14A); The exposed wire segment is advanced through to interlocking with the cable or for example stitching until being used by the needle 601; Through embroidery (see e.g., FIG. 14D) the exposed segment 1300 will now be laid in a pattern over the embroidery base fabric 800 creating, for example a sensor or a connection area or other electrical need (a printed circuit). The pattern of the sensor is determined by a computerized system. Additionally, the system can comprise additional co-extruder or additional dispenser that each applies other substances (e.g. other insulation materials, capacitive materials, chemical substances used as capacitive layers, or sensing layers, or substances that can form one of the layers of electrochemical or electromechanical sensors, or substances that can form an enhanced capacitive surface over the exposed wire like polymers mixed with titanium dioxide, polymers mixed with AgCl, or any of the substances described in FIG. 14A to 14G) on the wires at set location before they are being interlocked into the cable or the constructs.

[000113] As further illustrated in FIG.s 14A, and 14B conductive glue (and other types of glue) can be applied to PCB inserts, then exposed (e.g., 1300) interlocked wires/filaments are interlocked on the PCB (see e.g., FIG. 14D). In another process step a UV light source at about 255nm to about 380nm is projected on the place of the PCB insert in order to cure the conductive glue (e.g., comprising poly(methylmethacrylate) (PMMA) and a photoinitiator), and creating a robust connection between PCB inserts and conducting wires within the structure. Alternatively, heat is utilized through an oven or a laser projected in order to speed the curing of the glue.

[000114] Accordingly, and in an exemplary implementation, the method further comprises providing a fabric 800 to the embroider; coupling the conductive non-insulated filament 1300 to the embroider needle 601 ; and using the additive dispenser 500 to selectively insulate the conductive non-insulated filament 1300, forming an insulated 1301 and non-insulated 1300 pattern on the fabric 800, wherein the pattern formed on the fabric 800 is operable as an electric circuit. The additive dispenser could be a spraying mechanism, a dipping mechanism or any other mechanism capable of providing an insulation over a wire, where the conductive non-insulated filament 1300 passes through to apply the insulation onto the filament; curing by heat, hot ah', UV or other means could after that be potentially used in order to cure the accomplished insulation for immediate embroidery of the filament through the needle onto the fabric. Alternatively, additional additive dispensers could be added to the system dispensing other substances (e.g. capacitive or chemical substances that can be exposed at predetermined locations on the wire that will form the contact) at pre-determined locations on the wire. Examples of capacitive substances: TPU mixed with Titanium Dioxide, TPU missed with Silver Chloride (AgCl), Platinum oxide, any polymer mixed with metal- oxides, or chlorinated metals, or any other substances that have high dielectric properties. Examples for substances that can be used for chemical sensing include Platinum black; to any of these substances, conductive materials could be added (c.g. carbon based conductive materials, metals like gold, platinum, etc.) in order to increase the conductive.

[000115] The embroider described in FIG.s 14A-14D could also be used to build an electroencephalogram (EEG) caps through embroidery using methods described in FIG.s 14A-14D ; looking at FIG. 14E a piece of fabric 1450 could be used as a substrate for the embroider, the piece of fabric can now be loaded into the embroider. Side of the fabric can be cut as illustrated in FIG. 14D or can be in a rectangular form (not shown) and cut into the required shape at any point during the process of building the cap.

[000116] Turning to FIG. 14F an embroidery 1451 could now be embroidered by the embroider onto the fabric 1450 using one of the wires, yarns, thread or cables, the wire can initially be conductive or non insulated and as the embroider embroiders it will insulate according to the pattern so that at least the electrode contacts and the terminal areas will not be insulted while the other segments of the wire will be insulated; this can be accomplished according to methods described in FIG. 14A-14D; The conductive filament 1300 will be used to create the embroidery pattern 1451, as it passes through the needle the processor provided in the embroider will issue commands to the embroider to create the pattern but also to apply insulation by the dispenser over the filament insulating the filament at the required segments of the filament (those segments in the filament that will at end constitute the insulated portion of the filament), when however the filament will be used to create conductive areas in the braid (e.g. at electrode contacts 1455 or at terminal contact 1456) the embroider processor will first determine when to dispense the insulation over the wire and then give a command to the dispenser to dispense the insulation over the filament and cure before passing into the needle (note that the processor based on the embroidery pattern required will need to exactly calculate where the insulation would be dispensed on the filament before the filament gets into the needle); also it should be noted that the embroidery pattern loaded into the embroider SW will denote segments of the wire that should be insulated and those that are not (e.g. contact and terminal areas 1455 and 1456 should remain without insulation). Optionally, additional dispenser could be used to dispense other substances (e.g. capacitive substances like polymers with Titanium Dioxide) on the wires on predetermined locations on the wires these locations could potentially end up in the EEG electrode contacts location providing for example a better electrode surface and interface to the human skin.

[000117] Optionally, instead of applying insulation one can provide an insulated filament to begin with, in this case the embroider will have an ablation mechanism (e.g. laser, heat source, grinder, .. . etc) that can be directed towards the filament ablating the insulation at the required segments. Turning now to FIG. 14G the fabric with the embroidered pattern can now pass sewing or interlocking together at required lines and patterns to create the final cap structure, as an example fabric complementing edges or lines 1452 and 1453can now be sewn or interlocked or connected together (note that fabric edges 1452 and 1453 could be lines that denote where to interlock or sew two pieces of the fabric together, in the case that building of the cap starts with a rectangular or a fabric shape not according to the edges shown, cutting of the extra fabric after interlocking the edges could be done in order to remove unnecessary fabric). Also not that this same method could also be used to create any biointerface system through embroidery, for example a headband, a bracelet, ... etc. Optionally, wires used could be made from a variety of matels plated with silver, silver chloride (AgCl), platinum, gold or other biocompatible materials; in case of silver a post processing step that includes a chemical treatment of the silver silver with chlorine in order to create the desired AgCl surface. Alternatively, the cap electrodes could pass coating with capacitive substances in order to increase the properties of the electrode.

[000118] In an exemplary implementation, nitinol is used as a core or as filaments used in the interlocking/braiding sequence. The heating of the nitinol could be done by a precise laser source. Once heated, the nitinol wire will have internal strain that will memorize its shape, as interlocking continues. These nitinol wire shapes resulting from the internal strain built using the heating source, are retained forming a customized 3D structure. Heating the nitinol using a laser and thus create a shape to the structure during interlocking, thereby providing 3D customized structures. Other materials can deform and preserve their shape, for example, the core filament or filament is formed of a resilient and elastic materials using a laser create customized shape.

[000119] FIG.s 15A-15B illustrate an example of the braiding of nitinol core, which is put into a certain predetermined bending (3D shape) with a laser source directed towards it and heating the nitinol to forming temperature, when the nitinol core is cooled the shape will be built in, and thus the core shape will influence the final shape of the lead. In FIG. 15B the laser source will be directed towards nitinol or other wires (e.g., shapememory filaments, e.g., polytetrafluoroethylene (PTFE), polylactide (PLA), and ethylene-vinyl acetate (EVA)) that are used as the braiding wires creating the same effect of forming these wires, this will in turn affect the final shape of the braded lead.

[000120] Accordingly, (see e.g., FIG. 15A-15C) provided herein is a method of forming a strand or the electrically and/or structurally functionalized strand, rope, and cable 100, each having a predetermined three dimensional (3D) structure, implemented the CIS system disclosed herein, the method comprising: providing a first carrier 150/114 associated with a shape memory filament (e.g., nitinol); using the focused heating source 700 selectively heating the nitinol filament 1500/1140 at predetermined position while in the process of interlocking the strand or the electrically and/or structurally functionalized strand, rope, and cable 100.

[000121] In an exemplary implementation, the methods and systems disclosed, are further used to form wires, and/or electrically and/or structurally functionalized strand, rope, and cable 100 for leads that are built from multiple layers, for example an inner layer for conductance e.g. silver or copper; another for mechanical properties (nitinol, tungsten, stainless steel) and the outer for electrode being biocompatible and appropriate for the application (e.g. Pl. Ir., Au, stainless steel, pallidum, etc); another layer of the wire could be made from other materials that enhances electrode contacts charge capacity e.g. Titanium Nitrade (TiN); Titanium Oxide, Black platinum, etc. the wires can be eventually insulated with a polymeric material (e.g. polyimide, Teflon, etc). Alternatively, a strand comprising one or more of these wires are braided or interlocked together to form the electrically and/or structurally functionalized rope, and/or cable 100, this rope, or cable can be insulated with another material. And the rope, or cable could be manufactured, so that an additional external layer is applied where there is a gap between the external layer and the rope, or cable to allow the cable some freedom for bending and pulling (and other mechanical forces) of the cable. It is noted that the wires, and/or electrically and/or structurally functionalized strand, rope, and cable are used as raw materials to form additional ropes and cables with integrated components.

[000122] Turning now to FIG. 16, illustrating different options for wires or filaments that can be used as materials and filaments in the CIS systems disclosed, to “build” the leads, electrodes and the like described herein. The wire layers, with cross sections are illustrated, where in top left 115, the internal layer is used to enhance conductivity of wire, the second layer for structure, the third for biocompatibility, the 4^th functional layer is for example for increasing charge injection or add special electrochemical or sensing features and the 5^th for insulation; in top right 116, displaying four layers -conductivity, strength, biocompatibility and insulation; while the bottom central schematic displays three layers: conductivity, biocompatibility and insulation. The wires could be made with any combination of the described layers, including situation with wires missing certain layers. [000123] Accordingly and in an exemplary implementation, provided herein is a strand, a rope, and a cable, each comprised of a plurality of wires or filaments having a predetermined structure, potentially implemented in the CIS systems, embroidery systems and weaving systems disclosed herein, comprising: the core filament 1150 comprised of a material configured to enhance conductivity of the wire; structural layer 1151 over the core filament 1150; a biocompatibility layer 1152 over the structural layer 1151; a charge injection layer 1153 over the biocompatibility layer 1152; and an insulating layer 1001 over the charge injection layer. Additionally or alternatively, layers 1151, 1152 and the like, can be formed using other methods of formation, like electroplating, co-extrusion, CVD, elecroless plating, doping, cold-extrusing and the like to mention a few.

[000124] Improved damping and insulation properties can be achieved in an exemplary implementation, using co-extrusion. For example, the properties of an extrudate are modified by using an appropriate type of polymer and/or by incorporating blowing agents (porophors) into the polymer. The obtained extrudate coating over the filament may have an entirely solid or an entirely cellular structure. The properties of a cellular extrudate depend on many factors: for example, the type of polymer; the type and content of the blowing agent; the size, number and geometric char acteristics of cells formed (if so desired) during cellular foaming; the method used and conditions of the extrusion process; the distribution of polymer temperature in the extruder’s heating regions and in the dye; type and amount of plasticizers, and the like. In the context of the disclosure, “co-extrusion” means can also be used in case two or more layers are desired on a single filament (or a single filament with a coating), whereby the layers can be extruded in separate steps, or at least two or all of the layers can be coextruded in a same extrusion step. The term “co-extrusion” also means that all or pail of the layer(s) are formed simultaneously using one or more extrusion heads. For instance a triple extrusion can be used for forming three layers. In case a layer is formed using more than one extrusion heads, then for instance, the layers can be extruded using two extrusion heads, the first one for forming the inner conductive layer and the inner part of the insulation layer, and the second head for forming the outer insulation layer and the outer scmiconductivc layer. Co-extrusion can be effected in any conventional cable extruder, e.g. a single or twin screw extruder.

[000125] Additionally, or alternatively (see e.g., FIG. 16, 117), the charge injection 1153 layer is omitted and the insulating layer 1001 is formed on the biocompatibility layer 1162. Likewise, the step of forming the structural layer can be omitted and the biocompatibility layer 1171 is formed over the core filament 1170.

[000126] For example, the functional layer could be built to turn the wire surface into an electrochemical or a functional surface, being for example able to sense different chemical signals. Surface could be used spanning from platinum, platinum iridium, tungsten, nichrome, stainless steel, titanium, alloys of metal, AgCl, oxidized surface, ceramic surface such as gold, Titanium Nitride (TiN), platinum black surfaces, as well as surfaces coated with specific agents specific to measuring certain analytes or compounds.

[000127] For example, the conductivity-enhancing filament, is formed of silver (Ag), copper-chromium (Cu-Cr) alloy, carbon-nanotubes (CNT) doped with KAuBr4, or an alloy comprising conductivity enhancing particles selected from: carbides and nitrides of 4A group elements, 5A group elements, 6A group elements, 7A group elements, silicon and boron, or a conductivity enhancing particles combination of one or more of the foregoing, while the structural layer is comprised of platinum, nitinol, tungsten, a resilient thermoplastic resin that is: thermoplastic poly(urethane) (TPU), poly(dimethyl-sulfate) (PDMS), poly(ethylene-ether-ketone) (PEEK) and the like, and the biocompatibility layer can be comprised of AgCl, gold, platinum, polyethylene glycol, polypropylene glycol, polyoxyethylene, polytrimethylene glycol, polylactic acid and derivatives thereof, polyacrylic acid and derivatives thereof, poly(amino acid), polyurethane, polyphosphazene, poly(L-lysine), polyalkylene oxide, polysaccharide, dextran, polyvinyl pyrrolidone, polyvinyl alcohol, polyacryl amide, copolymers thereof, and terpolymers thereof.

[000128] In yet another exemplary implementation, the systems and methods disclosed are used to continuously form multi-contact electrodes (see e.g., FIG. 17A-17B). The filaments are interlocked/braided together where each contact is created by a wire that creates a lateral contact (at the distal end) of the lead (the electrically and/or structurally functionalized strand, rope, and cable 100) and an electrode terminal at the other (proximal end) side of the lead; the process is continuous and leads (or electrodes formed using the electrically and/or structurally functionalized strand, rope, and cable 100) are created continuously one after the other, and thus the same wires from first lead will continue their path exiting or entering the first lead at their edges or at any point laterally from the body of the electrically and/or structurally functionalized strand, rope, and cable 100; these exiting wires are eventually cut in post processing, their points of exit or entry will be fixed (either mechanically by cutting them flush or electrochemically by etching them - so that they are flush with the surface) tipping or fixing the surface could optionally be done at the end to create smooth insulated surfaces at the point of entry or exit of the wires from the lead. At the terminal areas rigid thermoplastic polymers could be used as a supporting layer underneath the terminal (possible polymers are PEEK. Polyvinylidene fluoride (PVDF), polycarbonate (PC)) - these polymers will for example be available as filaments, interlocked locally in the supporting layer and then be subject to reflow in the post process, creating a strong connection terminal that do not yield. FIG. 17C shows a multi contact needle built using the disclosed methods and systems. As shown, a lead (referring in an exemplary implementation to the electrically functionalized strand, rope, and cable) could be built in the same method as previously described, then coupled to the needle (see e.g., 155 FIG. 17C), alternatively the interlocking/braiding using the CIS could be done directly over the needle 155 (see e.g., sensor integration FIG. 12A). Note the sharp edge of the needle 155 and the tip of the lead jacket, the jacket ends smoothly while the running wires at the end of the jacket are almost flush with the tip; to maintain needle stiffness the whole lead or the polymer used to build the multi contact needle jacket could be built from the interlocking filaments built from rigid polymers that will be subject to reflow post process. In FIG.s 18 A, and 18B the lead built from multiple layers having an internal layer depicting a hollow or filled core, then another layer where wires will run then a braid to give structure and finally contacts or terminal as well as filaments that will undergo reflow as a jacket. FIG. 18B is a cross section of yet another option of lead layers - an internal core that optionally could be tubular or built from filaments (optionally from materials like Teflon, ETFE, PTFE, polyimide, and the like), the second layer is where the wires run along the lead, the third layer shows a layer interlocked from filaments to create a continuous tube along the lead (e.g. from coiled nylon or Teflon filaments), then a braid layer to create structure and then the outer layer that consists from a jacket layer and/or terminals and contacts; in post process when the structure is subject to reflow, some of the layers could undergo reflow according to melting temperature, and glass transition temperature associated with these polymers in these layers. The electrode described in 17C could be used as a brain depth electrode, with more than 0.64 min inner diameter and less than 0.78 mm outer diameter; at its distal end, then couple of cm ideally 4 - 8 cm the electrode outside diameter can increase to a 1.1 mm outside diameter so that the electrode body at the proximal end is stronger and thicker. Turning now to Fig. 17E The system and methods described could also create electrodes, cables, threads, each with gradually increasing diameter from their distal to their proximal ends. Such electrodes can be built on top of a gradually increasing diameter core filament wires 1170; the core wirel 170 have gradually increasing diameters for a certain segment and then repeats in a periodic manner, when building an electrode on top of these core filaments (i.e., having an alternating diameter), electrode contacts can be built on top of the sections where the core wire is thinnest (distal end of a segment 1710) and electrode terminals built on top of the sections where the core wires is thickest (proximal end 1711); as an example at the core wire at distal ends 1710 will have a small diameter of 0.2 mm and then gradually increasing reaching a diameter of over 0.5mm at an axial distance of 2-8 cm from the distal tip reaching, for example 0.6mm at the proximal ends 1711. The electrode built on top of core wire can be configured to have a lumen that corresponds to this gradually increasing inner diameter wire, from the tip to the proximal end. Due to the size of the distal end then through such an electrode it will be possible to record for example, single cell (neuron) activity from the brain. Such an electrode can be used as a depth electrode for brain mapping.

[000129] Turning now to Fig. 17F. describing an electrode that combines many types of sensors and analytical abilities for e.g., a catheter and leads as example for depth electrodes used to map brain activity invasively from epilepsy patients, or for electrodes to be used for deep brain stimulation, cardiac catheters or octhr applicaitons. These electrodes will combine sensors for electrochemical or other biochemical sensing modality 1763, electrophysiological sensing and stimulation 1760, for recording of single cells through micro electrodes 1761, for conducting photonic sensing 1762 or fiber optics sensing and analytics 1764; such electrodes could for example be used to record brain chemical signals or sense drug molecules, or measure brain biomarkers, and in return couple to an implantable central processing unit (CPU) or an external CPU console operable to control treatment or generally make clinical decisions. Another example for the use of such electrodes could be to measure ionic compounds, neurotransmitters, epilepsy drug molecules during invasive use of the electrode in patient’s brains, coupled with electrophysiological signals such as stereotactic EEG (SEEG), brain electrode, or brain depth electrodes for localizing of brain epileptic activity and their sources. Such electrodes and incorporated elements can be built by any of the methods described. For example in order to create electrodes that have a fine thin wall and thus creating a hollow inner diameter of more than 0.58mm and an outer diameter of less than 0.8 mm, thus the inner diameter can accommodate a rigid rod or stylet of more than 0.5 mm that contributes to stiffness and rigidity of the electrode.

[000130] Optionally, a fiber optic could be inserted into the inner side of the electrode after the rigid stylet is removed where the distal end tip incorporates a material that is formed as a diffuser for diffusing the light out of the electrode or as lens to focus or defocus how the light exits the electrode. The same brain electrode could optionally have a tapered distal end as described in FIG 17D optionally using the method of 17D - creating a tapered profile of the electrode, this allows the electrodes to be less than 0.5mm in outside diameter at the distal end, such dimensions and the utilization of microelectrodes at the distal end will allow the electrode to be used in recording of single neurons or multi neurons from the microelectrodes at its distal end. Additionally and optionally the electrodes distal end can utilize in its composition stiffer materials than those utilized more proximally (for example the distal 20mm could use PVDF harder than shore 55D e.g. shore 47D, or polycarbonate material, then rest of the body or for example for at least another 8cm can utilize softer materials e.g. TPU shore 55D) This will create a body that is stiffer at the distal end and softer proximally; of course that combination of softer and more rigid areas of the electrode can be utilized interchangeably. Additionally and optionally and as described in FIG. 17E the brain electrode could also utilized a plurality of sensors; additionally and optionally the brain electrode could include and embed along its body at least one of a digitization circuit, a computing module, a read only memory, a memory, an RF ID, a neuromorphic computing circuitry or processor, an Al accelerator, an Al computing module, an Antenna, a power module, a battery, a communication link, or other relevant electrical circuit. This circuit will allow the electrode to act as a complete system or module on its own. Encapsulating these electronics circuitry or elements will allow the SEEG electrode to be fully implantable. In case of a fully implantable electrode, multiple electrodes could be fully implanted in the same patient, where the distal end is implanted inside the brain and the proximal end being implanted under the scalp outside the brain or in the subgalial space, optionally and in this case each electrode will include at least two electrical circuits each encapsulated separately, these encapsulated circuit can be connected together by interlocking with other wires according to the methods described. One of these encapsulated circuits could optionally include at least one battery. Optionally the multitudes of these electrodes could be implanted in the same patient, the electrodes will communicate with each other through an external non implanted circuit that will communicate with each of the electrodes, if needed synchronize them together, read their data and outputs, remotely power or charge them if needed.

[000131] Yet in another exemplary implementation, utilizing the electrode illustrated in FIG. 17D the electrode could be utilized in a wearable sensor, or an implant incorporating biochemical sensors, that continuously measures sodium levels in blood through the skin or from within the body, analyzing the data and sending alarms if a patient is being dehydtrated. Such biochemical sensors used for this application and many other applications could optionally be built from threads, yarns, filaments or wires that have copper, tungsten, gold, platinum, nichrome, incomplete parylene coating surface, combination of carbon nano tubes (CNT) and titanium, metal oxides.

[000132] Additionally, electrodes as described in FIG. 7E could utilize multiple sensors from the multi types of sensors in the electrode that are coated with controlled biodegradable materials, so that the sensor will be protected from attacks by the biological tissue (fouling), at that time the sensor does not work at all, at a certain time we activate the biodegradble area on for example one of the sensors, and the biodegradable material will be removed and now the sensor will be ready for use for a period of time until fouling happens to it, when that happen another sensor can then be activated to continue measuring. Activating of the biodegradability of the materials can happen time programmed through materials compositions or biodegr adable coat dimensions, or other methods.

[000133] Accordingly, (see e.g., FIG.s 17A-18B) provided herein is a method of continuously forming an electrode in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, implemented in the CIS system disclosed herein, the method comprising: providing a first earner 118 associated with a second conductive filament 1180; positioning the first carrier 118 in a position detached from the base deck 201 configured to enable forming wound filament, and/or twisted filament, and/or shorted filament, and/or bent filament; continuously forming at least one winding around the first sub-portion of the plurality of the predetermined filaments 1020i’ comprising at least one conductive filament at a predetermined position (e.g. D, E) along the strand, and/or rope, and/or cable 100 forming a contact point 1181 on the electrode strand, and/or rope, and/or cable 100; repositioning the first carrier 118 to the base deck 201; using the base deck 201, with a second sub-portion of the plurality of the predetermined filaments 1020i”, forming an external braided sleeve 1002 around the fust sub-portion of the plurality of the predetermined filaments comprising the at least one conductive filament, while periodically exposing a portion of the contact points 1181 (see e.g., FIG. 17B) at a predetermined radial position along the wire electrode; cutting the electrode strand, and/or rope, and/or cable 100 comprising the plurality of radially exposed contact points 1181 forming the wire electrode having a proximal end and a distal end; and optionally insulating the proximal end. [000134] Furthermore, portion of the plurality of contact points 118 along the longitudinal axis of the wired electrode 100 towards the proximal end 1110, and a portion of the contact points along the longitudinal axis towards the distal end 155 of the electrode wire forming a plurality of connection terminals, each further comprises a structural underlayer (see e.g., 1003, FIG. 18B, FIG. 25), sized and configured to provide rigidity to each of the contact points, and the connection terminals 1181D (see e.g., FIG. 17C), the structural underlayer is comprised of poly(carbonate), or poly(ethylene-ether ketone)(PEEK), PVDF, poly(carbonate-sulfate) copolymer or a thermoplastic polymer having a glass transition temperature over 60 °C.

[000135] As illustrated in FIG. 17A, 17B, the wires built or used in the systems disclosed and described, the wire electrode is further comprised of: a filled core filament, or a tube core filament 1005 of a thermoplastic polymer (e.g., PEDF, ETFE, PTFE); the first sub-portion of the plurality of the predetermined filaments 1020i’ comprising at least one conductive filament; the external braid sleeve 1002; a structural layer 1003; the plurality of contacts 1181B, D,; and the plurality of connection terminals 1181C, and E.

[000136] In yet another exemplary implementation, the systems and methods disclosed are used to continuously form long multi-contact electrodes, lead, catheters or cables (see FIG. 17D), where the distal end containing the electrode contacts is at a substantial distance from the proximal end including the electrode the terminals. For example in micro leads and micro catheters, it is desired to use thin wires and filaments to build the leads through the CIS system and methods, wire resistance and impedance becomes very high with a higher length. Sometimes this resistance can be as high as 500 Ohms in specific wire materials. It is preferable for electrode contacts to be built from materials that can have a high charge injection capacity and that are biocompatible such as platinum and gold while have the wire or conductor running along the lead built from highly conductive materials such as copper and silver. This can be accomplished using the method as described in Fig. 8C. AS further illustrated in FIG. 17D1 and 17D2 a first carrier 111 holding a first wire 11110 made from a wire material suited becoming an electrode contact 11111 (e.g. platinum, platinum iridium, tungsten, stainless steel, titanium, gold, gold plated tungsten, etc.) and a second carrier 111’ holding a second wire 11110’; first carrier will be used to create an electrode contact along the proximal end, and then at a specific position the first carrier 111 will be detached from the base deck and positioned onto the weaving deck, a portion of the wire will be exposed (insulation removed) and then coiled or applied to the cable, catheter or lead; this carrier will then be placed back in the base deck, or away from the weaving deck; now the second carrier holding the highly conductive wire (e.g., copper, silver), will be placed on the weaving deck a segment of the 11110’ wire will be exposed, and then through coiling or weaving this portion will be deployed on top or in contact with the exposed segment of the 11110 wire thus creating a short between the two wire (e.g., the platinum and the copper). At this point, the 111’ carrier (102i) will return to the base deck or another deck, and the interlocking process can continue over the length of the cable and terminal connectors can be created at the proximal end of the catheter. Additional short points could be accomplished along the catheter to affirm the shorting of the two 11110 and 11110’ wires. This short between the two types of wires could be accomplished also using the same methods as illustrated in Fig.s 8A - Fig. 8E or Fig. 9A to Fig. 9D. Alternatively, the wire built or used in the CIS disclosed implemented in the methods provided (see c.g., FIG.s 18A-18B) can comprise the filled core filament 1005, or the tube core filament, the first sub-portion of the plurality of the predetermined filaments 1020i’ comprising at least one conductive filament, the external braid sleeve 1002, the plurality of contacts 1181, and the plurality of connection terminals 1118E are each formed of a non-reflow material, wherein the structural layer is adapted for reflow, by at least one of: providing a thermoplastic polymer for the structural layer having a base glass transition temperature (Tg), or melting temperature (Tm), than each of the filled core filament, or the tube core filament, the plurality of predetermined filaments, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals, adding a plasticizer, and controlling the molecular weight average ((Mw)w) of the thermoplastic polymer forming the structural layer.

[000137] In post processing, subjecting the electrode wire to a reflow process is configured to elevate the temperature above the Tg of the thermoplastic polymer forming the structural layer (e.g., thermoplastic poly(urethane) (TPU), or semi-crystalline poly(ether-block-amine) (pebax)) and below the Tg, and Tm of each of the filled core filament, or the tube core filament, the first sub-portion of the plurality of the predetermined filaments comprising at least one conductive filament, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals.

[000138] In certain exemplary implementations, the methods disclosed are used to continuously form macroelectrodes (cables), having miniature-electrodes created in the same methods described and branching thereform. These continuously formed macro-electrodes as illustrated schematically in FIG. 19, with branching miniature electrodes 1021 i can be used for example in the provision of Full coverage Deep Brain Stimulation (DBS) electrode: FCS - Full coverage stimulation, In FCS, miniature electrodes are advanced in a brain target stimulation region covering the area with many electrodes, this will allow stimulation from many small electrode contacts sitting on the miniature electrodes to send stimulation to small distances and thus the total stimulation accomplished would cover all the small stimulation areas generated from the contact sitting on the miniature electrode, this means that stimulation is now shaped by many small pixels covering the desired area. Using an electrode 100 that branches out into multiple electrodes. Can be used for monitoring as well as for stimulation. These miniature electrodes are penetrating shanks that have micro and macro contacts. Stimulating fields software and user interface control over the field (method of optimizing field). Properly placing the miniature electrodes through the lead to the right brain region place can be done through electrophysiological navigation or other surgical method, with internal lumens or internal Teflon or other tubes that are guides for the penetrating miniature electrodes, In an example when an internal stylet is inserted it pushes these flexible tubes aside, the tube collapses radially, when the lead stylet is extracted, there is enough space for many of these guide filaments because now they retain their initial outer diameter (OD) and can lead the penetrating miniature electrodes outside of the lead. [000139] This means that the penetrating miniature electrodes could have bigger ODs, the same principle applies between every longitudinal tube, or stylet along the lead. In other words, these internal tubes (that guide the miniature electrodes probes/leads) can all be collapsible, when there is no stylet in a tube, the internal tube could collapse and thus leaving a space for other electrodes or stylets inside the tube. At the proximal side, there arc inputs inside the jacket of the macro-structure, for example formed using the systems and methods disclosed for the smaller electrodes. Each tube length from entry at proximal side of lead to exit at the distal side have a fixed length, and this length is ideally the same as the lengths of the other (miniature) tubes. On the proximal side the openings for the entry are arranged circumferentially on the lead in a way to mimic the way they exit, so that a neurosurgeon will know exactly where the electrode will exit on the lead body by visually inspecting the proximal side. When an extension cable or a pulse generator is connected to the proximal side, all the openings in the lead of the unused electrodes will be covered tightly to disallow brain fluids to get out of the lead. As an example, this can be accomplished using rubber stylets that will be inserted in the entry holes, blocking them, alternatively by providing a tool that have a heat source, when the tool is applied to the proximal side it reflow the edges of the proximal side and blocks the lumens. Alternatively - at the proximal side a handle is provided, that is part of the electrode, that when pressed will force the small electrodes to protrude outwards. The small diameter probes entering the lead at the proximal side and exiting at the distal side (or exiting the lead at any other side of the electrode, could have sensors inside it, such as, for example, an RF ablation electrode, a laser ablation fiber, a fiber optic for sensing or analytics, another lead with an LED at its distal side, potentiostat electrodes, a photonic sensor, a biochip, micro electrodes, macro electrodes, and the like or their combination.

[000140] Regardless of the formation method, provided herein is a macro-electrodes as illustrated schematically in FIG. 19, with branching miniature electrodes 1021 i, used for example in the provision of Full coverage Deep Brain Stimulation (DBS) electrode: FCS - Full coverage stimulation using the macro/micro electrodes disclosed herein.

[000141] In yet another exemplary implementation, the systems, filaments, the electrically and/or structurally functionalized strand, rope, and cable 100 and methods disclosed are used to introduce strain relief into the built electrically and/or structurally functionalized strand, rope, and cable 100. As illustrated in FIG.s 20A-21D, in certain circumstances, the internal conductors are loose inside the structure, allowing flexibility when lead is pulled, bent, stretched or otherwise manipulated. This can be achieved by, for example as illustrated in FIG.s 20A, and 20B, during interlocking a layer 1002 and 152 is put over (or under) running conductors, at post processing when the electrically and/or structurally functionalized strand, rope, and cable 100 is interlocked, this layer is removed. Likewise, Heat-shrink filaments can be used for forming a layer 1022j by the methods of interlocking, e.g. coiling. After curing this heat shrink filaments will reduce the size of inner layers and thus leaving a space for the conductors to move freely in the emptied space. In an exemplary implementation, the heat shrink layer is formed of heat-shrink filaments forming the layer through weaving using the systems and methods disclosed (as an alternative, a regular tubular heat shrink may be used). The heat shrink can also be used for patterning, creating certain discrete areas that would be affected by the heat shrinks and other areas that are not affected (see e.g., FIG. 21A). [000142] FIG. 20C is showing, a heat shrink tube 1022j that was disposed in one of the leads internal layers preferably under the conductors layers, when this heat shrink filament is heated, it will shrink and will create a space (see e.g., the difference between De and > t), thus making the conductors have a higher degree of freedom to move inside the lead when the lead is subjected to bending, twisting, or pulling. Additionally, or alternatively, as illustrated in FIG. 20D, instead of tubular heat shrinks, heat shrinkable filaments are used. Before heating and after heating showing that these shrinkable fibers are shrinking and optionally reflowing the layer underneath. Other filaments used in the methods disclosed, implemented in the systems provided could be used when an increase in size would leave a space underneath them for conductors to have some freedom of movement (see e.g., FIG. 2 IB). These filaments could be made from nitinol, and they could be pre shaped to allow such a behavior. Another example could be that the lead would have an interlocked filament layer or structure that when inserted in the body changes configuration between the filaments (e.g. pre-shaped nitinol) the change in the shape would leave a space for other filaments to run freely in layer below, the same layer or even in layer above. Conversely, certain filaments can be configured to reduce in size, (e.g., in diameter) through chemical, physical or heat treatment changes. When size of a filament layers is reduced the shrinkage will free space, conductors and wires residing in this space will now be able to move more freely.

[000143] Similarly, a thermoplastic star-shaped cross section of a filament (see e.g., FIG. 21D), after treatment cross section becomes round thus reducing in diameter. Change from star-shaped to a minimal cross section; this is applicable to any fillaments with a cross section shape occupying a bigger space than that when it is reflown. Likewise Heat shrinkable yarns - are coiled or interlocked around thermoplastic filament or a structure that shrink in size when subjected to heat or other treatment or around other structure that can shrink in size due to the shrinking of the heat shrink filament, or the layer formed of these filaments. On top of the heat shrink layer conductors or other yarns that need some free space can be laid or interlocked. When the structure is subjected to heat, the heat shrink will create space.

[000144] In addition, tunneling yarns, filaments or wires with bigger diameters than the isolated wires run in parallel to the conducting wires, these tunneling filaments will form a tunnel or a space between them (see e.g., FIG. 21B), wires that pass in this space will have a greater freedom inside the space because its diameter is smaller. Wide and narrow wires interlocked together, thus creating spaces therebetween.

[000145] As illustrated in FIG. 21C, one of the layers formed under the conductors can be of resilient material, such as foamy filaments, flexible filaments, plastic filaments, or other filler filaments, that when lead is bent the conductors will bend over and into this flexible inner layer thus adding extra space for the wires to travel into forming the strain relief mechanism.

[000146] Accordingly, and in an exemplary implementation, provided herein is a method of integrating at least one strain relief region disposed in a predetermined location in the electrically and/or structurally functionalized strand, rope, and cable 100, the at least one strain relief region configured to give the electrode a predetermined stiffness profile (in other words, a predetermined shape where some regions are rigid, while other(s) are flexible), implemented in the CIS system disclosed herein, the method comprising (see c.g., FIG. 20A ): providing the core filament 151 to the collector module 2000; providing a first sub-portion of the plurality of the earners 102i’, forming filament windings layer 118, 119 over the core filament 151; providing a second sub-portion of the plurality of the carriers 102i” , forming a removable structural layer 152 on at least one predetermined location over the filament windings 118, 119; forming an insulating layer 1001 over at least the structural layer 152; cutting the electrically and/or structurally functionalized strand, rope, and cable 100 at a predetermined length comprising the at least one predetermined location of the removable structural layer; and removing the structural layer 152. Furthermore, the location of the str uctural layer can also be as illustrated in FIG. 20B, namely under the filament windings layer 118, 119. For example, and as illustrated in FIG. 20C, removable structural layer 152 is replaced with a heat-shrinkable tube 1022j , or formed of heat shrinkable filaments 1022j , disposed on at least one predetermined location over wound filament layer 118, 119, and the step of removing the removable structural layer 152 is replaced with a step of exposing the cut structured electrode (in other words, post processing) to heat configured to shrink the heat-shrinkable tube.

[000147] Alternatively or additionally, the second sub-portion of the plurality of predetermined filaments 1020i” can be comprised of thermoplastic filaments configured to undergo reflow process and step of removing comprises subjecting the cut electrode wire to the reflow process. In the context of the disclosure, the term “reflow layer” and its various derivatives, is understood to refer to a layer of an amorphous material that flows and becomes viscous when it is brought to a temperature beyond its glass transition temperature (Tg). For example, the Tg of the materials used for reflow would be between about 60 °C and about 240°C °C.

[000148] Alternatively or additionally, provided herein is a method of imparting a predetermined stiffness profile to the electrically and/or structurally functionalized strand, rope, and cable 100, implemented in the CIS system disclosed herein, the method comprising: providing a first carrier associated with a thermoplastic filament configured to undergo reflow upon application of heat; positioning the first carrier in a position detached from the base deck 201, configured to enable forming coiled, or wound filament, and/or twisted filament, and/or shorted filament, and/or bent filament; continuously forming at least one winding around the portion of the plurality of the predetermined filaments comprising at least one conductive filament at a predetermined position along the electrically and/or structurally functionalized strand, rope, and cable 100 each coil having a predetermined number of windings forming a plurality of external reflow regions 157 on the electrically and/or structurally functionalized strand, rope, and cable 100; repositioning the first carrier to the base deck 201; providing a second carrier associated with a thermoplastic filament configured not to undergo reflow upon application of heat; positioning the second carrier in a position detached from the base deck 201, configured to enable forming coiled or wound filament; continuously forming at least one winding around the portion of the plurality of the predetermined filaments comprising at least one conductive filament between at least two adjacent reflow regions 156 on the structured strand, and/or rope, and/or cable 100; repositioning the first carrier to the base deck 201; cutting the structured wire comprising the plurality of reflow regions and the non-reflow coil windings between the at least two reflow regions (see c.g., FIG. 22A); and using the heating tunnel 710, removing the reflow regions 157, thereby imparting the predetermined stiffness profile to the electrically and/or structurally functionalized strand, rope, and cable 100.

[000149] Moreover, instead of peelable/removable/reflowable heat shrink in order to reflow the plastic jacket, the jacket or strain-relieving layer is a tube or a funnel 710 (see e.g., FIG. 22B) that gradually reduces in internal diameter, heated to correct gradient temperature that will allow the polymers to melt or semi melt (flow above Tg), as the final lead/catheter (or strand, rope or cable) is passing through this funnel it will get a final shape (OD) that is consistent with this funnel; then it will be cooled in-process (or post-processing) by a further step yielding a final reflow for the cable, lead or catheter.

[000150] As illustrated in FIG. 22 A, and FIG. 22B, and in an exemplary implementation, selectably forming rigid regions is done in the interior of the rope or cable while structuring the strand, rope or cable, or postprocessing if the reflow filaments and non-reflow filaments are external to the strand, rope, or cable.

[000151] Another exemplary implementation provided herein (see e.g., FIG. 23A, 23B), is the formation of micro-electrodes having predefined micro contacts. These micro- wires can already be patterned with micro holes to create micro contacts by an internal insulation, then an external insulation is added, where internal insulation patterned on wire during manufacturing of wire while external insulation is removed by laser during probe building (in other words, during the methods disclosed herein), bores in internal insulation can be spaced apart for example, in an exemplary implementation - 1 mm, so that laser on external layer exposes only controlled number of bores. The micro electrodes are formed using the processes disclosed herein, for example, using the dispenser to form the insulation over the exposed micro-electrode.

[000152] Accordingly, provided herein is a method of forming micro-contacts on a strand implemented in the CIS system disclosed herein, the method comprising: providing a first carrier associated with a non-insulated conductive filament 1401; forming a first insulating layer 1402 over the non-insulated conductive filament, wherein the insulating layer defines a predetermined number of micro-apertures F disposed in a predetermined number of locations along the wire 1400; forming a second insulating layer 1403 over the first insulating layer 1402; and optionally marking the predetermined number of locations of the micro-apertures along the wire. Then, when needed, for example during the interlocking/braiding/embroidering etc, selectively removing a portion of the second insulation sleeve covering at least one of the predetermined number of micro-apertures using at least one of: a laser, a hot-air gun, a heating element, a sand paper, a blade or a combination comprising one or more of the foregoing, thus forming apertures F in the second insulating layer 1403.

[000153] In certain exemplary implementations, the methods and systems disclosed are used to grow, or sequentially propagate or populate cables with electronic components embedded therein as described herein. These cables, comprising one or more wires, strands or cords with electronic components can be assembled continuously and connected to form system on braided yarn (SOBY). In certain circumstances, and similar to pick-and-place stacks of chip packages, the filaments/yarns/cables already come with repeated functional circuits inside them (e.g. light sources, LEDs, voltaic cells, semiconductor particles, battcricsand the like or their combination), while in the process of interlocking/braiding these filaments to the structure these circuits or part of them can be connected to other such yarns or different yarns and electrical components described herein (e.g., capacitors, resistors and the like) in this application and thus creating whole systems on braided yarn (SOBY). Same yarn can provide points for integration into the system.

[000154] FIG.s 24A-24D showing an electrically and/or structurally functionalized strand, rope, and cable 100 that can be a system by itself and can be interlocked or assembled into a final system, the electrically and/or structurally functionalized strand, rope, and cable 100 connection point that can be used by the interlocking process as disclosed herein in order to integrate it electronically to the rest of the electrically and/or structurally functionalized strand, rope, and cable 100 and components in the functionalized system or filament. FIG. 24 A illustrates a strand 161 built out of multiple circuits 1610p, each circuit could be different than the other and could represent a certain component in an electronic system; the chain could also be built from repeatable electric circuits. Components like batteries, solar cells, memory cells, electrical components, Flip-chip, transistors, printed circuit boards (PCBs) with electronics on, implantable capsules that have electronic function all potentially should include connection spot. FIG. 24B illustrates the functional yarn 162, which could be insulated 1621, the interlocking process configured to identify where each component 1622q within the yarn 162 starts and where it ends, through external markers on the yarn or other features of the yarn or through yarn length; a filament is optionally connecting circuit components together to form the yarn. FIG. 24C illustrates the yarn 16 could be built from electric circuit that are built by growing of functional components 161, 162, 163; the end result will be a yarn 16 with multiple electronic circuits, an insulation 1001 will optionally be coated over the yarn 16; the functional circuit could be built in various methods like rigid or flexible semiconductors and microelectronics, organic vs inorganic microelectronics, lithography, deposition technologies, etching, electroplating, electroless plating, injection, printing, extrusion, spraying, and the like or their combination. The yarn will come in spools and be loaded into the machine. The yarn will also have connection places 1800k where external circuits and other yarns could connect; optionally growing of the circuits could be done over multitudes of conductive filaments where each such conductive filament could be used as a certain metal (e.g. conductive filaments for ground, voltages, data busses, clocks) these conductive filaments will have segments in the yarns where they will connect to the other components in the system through the interlocking process. FIG. 24D shows an example connection of one yarn with another circuit that is built from, for example braiding (e.g. capacitor, resistor, inductor, and the like or their combination) to another yarn or a conductive filaments during the interlocking process by accomplishing a short between a filament 1800K and each of yarns 180K at appropriate connection places, using shorting methods described above it is also possible instead of shorting to create a capacitor or coil or other electrical component and element at the point of connection between 1800K and 180K and thus connecting the filament 1800K through an electrical component to the yarn connection points, thus having the ability to create complex systems (e.g. a weaved TV, a woven solar- panel, leads of memory, a complete implantable lead with all electronics and battery laying within, woven hydrogen battery, woven air conditioner, and the like or their combination); it is also appreciated that additional interlocking of yarns could be applied on top of the functional yarns or on top of where the capsule are in order to potentially create insulation layers, thermal conductive layers, encapsulation layers that protects the capsule from leaks (in or out of the capsules).

[000155] Accordingly, provided herein is a method of forming a system on a braided yarn (SOBY), the braided yarn is comprised of at least one of: a strand, a rope, and a cable, wherein the plurality of predetermined filaments comprise at least one of: at least one strand having an integrated coil, at least one strand having an integrated capacitor, at least one strand having an integrated resistor, at least one strand having an integrated cored transformer, at least one strand having an integrated sensor, at least one strand having an external conductive contact terminal, at least one strand having an integrated printed circuit board, at least one strand having a grown (in other words, continuously integrated) electrical circuit, at least one electrode strand, and a cable comprising two or more of the foregoing, implemented in the CIS system disclosed herein, the method comprising: using a predetermined carriers, continuously forming a single yarn, the predetermined filament carriers configured to provide a predetermined functionality to the SOBY; and cutting the yarn at a predetermined length, configured to result in an operable SOBY.

[000156] Moreover, filaments, yarns or wires with different properties as illustrated for example in FIG. 25, can be formed to create region having different properties: e.g. using a filament that when reflowed becomes very rigid, thus we can create rigid areas in the created structure - this is combined with other filaments that become soft. This can be used to encapsulate and protect electronics from bending, kinks, pulling or crash. Alternatively, the same function is achieved by injecting glue that becomes very stiff over the area we want to protect; Filaments can also be calculated and interlocked in a specific pattern as they enter and exit the encapsulated or stiffened region as a means of strain relief. In addition, this encapsulation can be conducted over an external lead area or internal lead layer, so that the other layers in the lead still behave the same.

[000157] In addition, special connectors can be built through the interlocking/braiding process; each wire that is running through the body of the lead towards a connection terminal, can be identified by the machine, then the wire will be interlocked over a small insert that holds the body of the connector (see e.g., FIG. 26). For example, coiling the wire over an elongated PCB (see e.g., FIG. 26) insert where each terminal contact will have a place for coiling, optionally - after this coiling is done coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament is soldered over a pad or any contact or pin in the connector (see e.g., FIG.s 25A, 25B); alternatively, a mechanical stress or crimping could be put on the terminal to hold coiled filament, and/or twisted filament, and/or shorted filament, and/or bent filament wire terminal against the opposing metal and thus forming a strong connection.

[000158] In an exemplary implementation, the methods disclosed are implemented using the systems provided. As it stands; leads, catheters, electrodes, and/or probes are different products undergoing similar procedure, and could be formed interchangeably using the same weaving machine. The weaving machine is configured to assemble a variety of filaments and wires of different diameter together in an interlocking manner. These filaments can be, for example, stainless-steel, tungsten gold, nichrome, chromium, magnesium, carbon, silver, AgCl, platinum, nylon, TPU, etc. In the context of the disclosure, “Interlocking” and its derivatives mean - interlinking, entwining, coiling, braiding, weaving, sewing, knitting, embroidery etc.

[000159] In an exemplary implementation, the CIS is constructed in a vertical orientation, supplied by a vertical feed to ensure continuous production, centered between rotating upper (weaving) deck used to create contact points, and an interlocking rotation of the base (braiding) deck constructing a uniform jacket. However, adaptive adjustments can be made to build other constellations, i.e., horizontal direction constellation or any other direction. For example, the horizontal constellation is built with a horizontal feed, rotating upper and base decks are placed on either the left or right deck. Moreover, several CISs can be placed together to form a single cable through additional structures.

[000160] The term "communicate" (and its derivatives e.g., a first component "communicates with" or "is in communication with" a second component) and grammatical variations thereof are used to indicate a structural, functional, mechanical, electrical, or optical relationship, or any combination thereof, between two or more components or elements, for example, appropriate sensors in the sensor array). As such, the fact that one component is said to communicate with a second component is not intended to exclude the possibility that additional components can be present between, and/or operatively associated or engaged with, the first and second components. Furthermore, the term "electonic communication" that can be used to describe the communication between the fiducials and the sensor array in an exemplary implementation, means that one or more components of the sensor array and or fiducial(s) being in electronic communication with sensors in the sensor array and that ar e described herein are in wired or wireless communication or internet communication so that electronic signals and information can be exchanged between the components.

[000161] In the context of the disclosure, the term “short” means a low resistance closed electrically conductive path and further refers to the electrical properties of the filament(s) disregarding the electrical contribution by secondary windings if those are present. Achieving the short circuit can be done in many ways, as illustrated for example, in FIG.s 8A-8E, as well as FIG.s 9A-9E

[000162] Detailed exemplary implementations of the present technology are disclosed herein; however, it is to be understood that the disclosed exemplary implementations are merely exemplary, which can be embodied in various forms. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present technology in virtually any appropriately detailed structure. Further, the terms and phrases used herein are not intended to be limiting but rather to provide an understandable and enabling description.

[000163] The terms “first,” “second,” and the like, herein do not denote any order, quantity, or importance, but rather are used to denote one element from another. The terms “a”, “an” and “the” herein do not denote a limitation of quantity, and arc to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. The suffix “(s)” as used herein is intended to include both the singular and the plural of the term that it modifies, thereby including one or more of that term (e.g., the fiducial(s) includes one or more fiducial). Reference throughout the specification to “one exemplary implementation”, “another exemplary implementation”, “an exemplary implementation”, and so forth, means that a particular element (e.g., feature, structure, and/or characteristic) described in connection with the exemplary implementation is included in at least one exemplary implementation described herein, and may or may not be present in other exemplary implementations. In addition, it is to be understood that the described elements may be combined in any suitable manner in the various exemplary implementations.

[000164] In addition, for the purposes of the present disclosure, directional or positional terms such as "top", "bottom", "upper," "base," "side," "front," "frontal," "forward," "rear," "rearward," "back," "trailing," "above," "below," "left," "right," "horizontal," "vertical," "upward," "downward," "outer," "inner," "exterior," "interior," "intermediate," etc., are merely used for convenience in describing the various exemplary implementations of the present disclosure.

[000165] One or more components may be referred to herein as "configured to," "configured by," "configurable to," "operable/operative to," "adapted/adaptable," "able to," "conformable/conformed to," etc. The terms (e.g. "configured to") can generally encompass active-state components and/or inactive-state components and/or standby-state components, unless context requires otherwise.

[000166] Furthermore, in the context of the disclosure, the term "operable" means the system and/or the device and/or the program, or a certain element or step is fully functional, sized, adapted and calibrated, comprises elements for, and meets applicable operability requirements to perform a recited function when activated, coupled, implemented, actuated, effected, realized, or when an executable program is executed by at least one processor associated with the system and/or the device. In relation to systems and circuits, the term "operable" means the system and/or the circuit is fully functional and calibrated, comprises logic for, having the hardware and firmware necessary, as well as the circuitry for, and meets applicable operability requirements to perform a recited function when executed by at least one processor.

[000167] Likewise, the term ‘module’, as used herein, means, but is not limited to, a software or hardware component, such as a Field Programmable Gate-Array (FPGA) or Application-Specific Integrated Circuit (ASIC), which performs certain tasks. A module may advantageously be configured to reside on the addressable storage medium and configured to execute on one or more processors. Thus, a module may include, by way of example, components, such as software components, object-oriented software components, class components and task components, processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables. The functionality provided for in the components and modules may be combined into fewer components and modules or further separated into additional components and modules. [000168] Likewise, the term "module¹' shall also be taken to include any collection of systems or sub-systems that individually or jointly execute a set, or multiple sets, of instr uctions to perform one or more functions, whether associated with executable instructions or not. Also, the term "module” (or “system”) refers to a logical assembly arrangement of multiple devices, and is not restricted to an arrangement wherein all of the component devices are in the same housing.

[000169] Accordingly and in an exemplary implementation, provided herein is a cable interlocking system (CIS) comprising: a base deck, defining a plurality of tracks; a plurality of carriers, each carrier detachably coupled to a corresponding track on the base deck, wherein each carrier is adapted to accommodate a bobbin spooling: a predetermined filament, a predetermined strand, or a predetermined cable; and a collector module operable to collect the predetermined filament, the predetermined strand, or the predetermined cable, wherein the collector module is disposed at a given distance from the base deck, forming an interlocking axis, and wherein at least one of: the predetermined filaments, the predetermined strands, or the predetermined cables is configured to form an angle of between 0° and 180° relative to the interlocking axis, wherein (i), the collector module comprises: a collector powertrain; and at least one pulley, coupled to the collector powertrain, sized and configured to controllably roll the at least one of: the predetermined filaments, the predetermined strands, and the predetermined cables, and (ii) at least one core filament carrier, configured for feeding at least one core filament to at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, wherein the at least one core filament is coupled to the collector module; at least one lifting member, configured to engage at least one of the plurality of carriers and raise the at least one engaged earner to a predetermined position away from a base deck surface: and a heating tunnel, operable to selectively reflow a thermoplastic resin configured to undergo a reflow process, the system further comprising (iii) an interlocking platform; and a shuttle, operably coupled to the interlocking platform, configured to engage at least one of the carriers and interlock the predetermined filament, the predetermined strand, or the predetermined cable associated with the at least one carrier, (iv) further comprising a cutter, interposed between the at least one pulley and the interlocking platform, operable to cut the at least one of: the predetermined filaments; the predetermined strands, and the predetermined cables at a predetermined length, (v) a central processing module (CPM) in communication with the base deck, the interlocking platform, each of the plurality of carriers, the collector powertrain, and the at least one lifting member, the CPM comprising at least one processor in communication with a non-transitory memory device, storing thereon a set of executable instructions, wherein (vi) at least one carrier is a tension controlling carrier (TCC) comprising: a first adjustable biasing element coupled to the predetermined filament, the predetermined strand, or the predetermined cable, operable to control the tension on the predetermined filament, the predetermined strand, or the predetermined cable: the bobbin, adapted sized and configured to spool the predetermined filament, the predetermined strand, or the predetermined cable; a selector; and at least one pulley operably coupled to the selector, configured to engage the predetermined filament, the predetermined strand, or the predetermined cable, wherein the selector is operable to selectably couple to the first biasing element, further comprising (vii): a second biasing element having a different biasing force than the biasing force of the first biasing element, (viii) a sensor operable to maintain a predetermined tension on the predetermined filament, the predetermined strand, or the predetermined cable associated with the TCC, wherein (ix) the sensor operable to maintain the predetermined tension on the predetermined filament, the predetermined strand, or the predetermined cable, is operably coupled to at least one of: the at least one pulley, and the bobbin, wherein (x) maintaining the predetermined tension comprises at least one of: selectably translating the at least one pulley relative to the first or second biasing element then-engaged by the selector, and rotating the bobbin, further comprising (xi) a focused heat source, operable to heat at least one of: the predetermined filament, the predetermined strand, and the predetermined cable, (xii) the focused heat source is: a laser, a heated air dispenser, a radiative heating element, a conductive heating element, or a focused heat source comprising one or more of the foregoing, wherein (xiii) the interlocking axis is horizontal, or (xiv) vertical, and wherein (xv) at least one of the predetermined filaments, the predetermined strands, or the predetermined cables comprise an integrated coil, an integrated capacitor, an integrated resistor, at an integrated cored transformer, an integrated sensor, an external conductive contact terminal, an integrated printed circuit board, an electrode wire, and two or more of the foregoing.

[000170] In another exemplary implementation, provided herein is an embroider having a power train, coupled to a bobbin spooling at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires, the embroider further comprising: a needle operable to engage the at least one of: the filament, the predetermined strand, or the predetermined cable associated with a corresponding bobbin, the embroider (xvi) further comprising an additive dispenser, operable to dispense an additive agent onto at least one of: the predetermined filament, the predetermined strand, and the predetermined cable, wherein (xvii) the additive dispenser is a co-extruder, an additive vat, or a spout, each operable to dispense an additive agent onto at least a portion of the predetermined filament, the predetermined strand, or the predetermined cable, wherein (xviii) the additive agent is an adhesive, or an insulating liquid resin, wherein (xix) the additive dispenser is operable to dispense a thermoplastic powder, the embroider further comprising means for melting the powder onto the at least one of: the predetermined filament, the predetermined strand, and the predetermined cable, and (xx) the means for melting the powder is: a laser source, a focused heat source, an adhesive, a solvent, or means for melting the powder comprising one or more of the foregoing.

[000171] In yet another exemplary implementation, provided herein is a method of continuously integrating at least one of: a filament coil, a filament twist, and a shorted filament in a strand, the strand comprising a plurality of filaments, implemented in the CIS systems disclosed herein, the method comprising: decoupling a first predetermined filament from the collector module; drawing a portion of the first predetermined filament from a first carrier associated with the first predetermined filament; backfilling the drawn portion of the first predetermined filament into a first empty carrier forming a secondary carrier; positioning the first carrier, or the secondary carrier in a position detached from the base deck configured to enable forming the at least one of: the filament coil, the filament twist, and the filament short; using at least one of: the first carrier, and the secondary carrier, integrating the at least one of: the filament coil, the filament twist, and the shorted filament around at least one of a plurality of predetermined filaments coupled to the collector module; and repositioning the first carrier, or the secondary carrier to the base deck, wherein (xxi) the first predetermined filament is an electrically conductive filament, (xxii) further comprising a step of cutting the strand at a predetermined length, configured to comprise (in other words, encompass within) the at least one of: the filament coil, the filament twist, and the filament short, (xxiii) whereby the step of positioning further comprises using a robotic arm to position the at least one of: the first carrier, and the secondary winding carrier in a position configured to form the at least one of: the filament coil, the filament twist, and the filament short, and further comprising (xxiv) using the first carrier, or the secondary carrier, forming a plurality of primary windings structure; repositioning a second carrier to a position configured for forming a plurality of secondary coil windings; selectably causing the second carrier to form a predetermined number of windings of the predetermined filament associated with the second carrier around the windings formed by the predetermined filament associated with the first, or second carrier thereby forming an electromagnetic shielding coil having primary-secondary (PS) structure.

[000172] In an exemplary implementation, provided herein is a method for continuously forming at least one of: an adjustable strand, an adjustable rope, and an adjustable cable, each comprised of a plurality of filaments or wires, each of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable having a plurality of embedded contacts, each contact in communication with a corresponding terminal of a plurality of terminals, implemented in the CIS system disclosed herein, and comprising: positioning a first carrier storing a conductive filament having an insulated portion and a non-insulated portion in a position detached from the base deck configured to enable interlocking the conductive filament having the insulated portion and the non-insulated portion, which is associated with the first carrier; using the first carrier, continuously interlocking the conductive filament having the insulated portion and the non-insulated portion, wherein the non-insulated portion of the conductive filament is configured to extend radially from the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, forming a plurality of contact points and electrode terminals; repositioning the first carrier to the base deck; forming an insulating sleeve over the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; marking the location of the plurality of contact points and electrode terminals formed by the conductive filament having the insulated portion and the non-insulated portion, which is associated with the first carrier on an external surface of the insulating sleeve of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; upon determining an operational length of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, based on the marking, removing the insulating sleeve over a first contact point from the plurality of contacts sized and configured to form the proximal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; removing the insulating sleeve over at least one contact point from the plurality of contacts associated with the first contact point, configured to form a first terminal in a distal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; cutting the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable comprising the plurality of marked contact points and the exposed terminal; and insulating the proximal end, further comprising, (xxv) prior to the step of forming an insulating sleeve: positioning a second carrier storing a conductive filament having an insulated portion and a non-insulated portion in a position detached from the base deck configured to enable interlocking the conductive filament having the insulated portion and the non-insulated portion, which is associated with the second carrier; continuously interlocking the conductive filament having the insulated portion and the non-insulated portion, wherein the non-insulated portion of the conductive filament is configured to extend radially from the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; and repositioning the second carrier to the base deck, whereby the step of marking the location of the contact points on the external surface of the insulating sleeve further comprises: marking the location of the plurality of contacts formed by the conductive filament having the insulated portion and the non-insulated portion, which is associated with the first carrier on an external surface of the insulating sleeve of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; upon determining an operational length of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, based on the marking, removing the insulating sleeve over a second contact point from the plurality of contacts sized and configured to form the proximal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, the second contact point formed by the conductive filament having the insulated portion and the non-insulated portion, which is associated with the second carrier; and removing the insulating sleeve over at least one contact point from the plurality of contacts associated with the second contact point, configured to form a second terminal in the distal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, wherein (xxvi) the insulating sleeve is configured to allow coupling of the adjustable cord to at least one of: a device, a terminal, and an interposer, (xxvii) the marking is at least one of: a geometric shape corresponding to the region, a letter, and a number, the method (xxviii) further comprising: contacting a tissue, an organ, or a surface with the distal portion of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable comprising the terminal; selectively coupling the at least one of: the device, the terminal, and the interposer at the contact marking below the proximal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; and cutting the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable between the at least one of: the device, the terminal, and the inteiposer coupled at the selected marking, and the proximal end forming an exposed proximal end, and (xxix) reinsulating the exposed proximal end.

[000173] In another exemplary implementation, provided herein is a method of continuously integrating at least one of: a coiled filament, a twisted filament pair, and a shorted filament pair in at least one of a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS systems disclosed herein; the method comprises: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; removing insulation over a portion of the first insulated conductive filament thereby forming an exposed portion on the first insulated conductive filament; removing insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; using the first carrier and the second carrier, contacting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament positioning the first carrier, or the secondary carrier in a position detached from the base deck configured to enable forming the at least one of: the coiled filament, and the twisted filament pair; using at least one of: the first carrier, and the second carrier, forming the at least one of: the coiled filament, and the twisted filament pair around at least one filament coupled to the collector module; and repositioning the at least one of: the first carrier, and the second carrier to the base deck, (xxx) further comprising a step of cutting the strand at a predetermined length and (xxxi) wherein each of the first insulated conductive filament and the second insulated conductive filament comprise an interrupted insulating sleeve forming an insulated portion, and an exposed portion.

[000174] In yet another exemplary implementation, provided herein is a method of continuously forming a woven strand having at least one coiled portion implemented in some of the CIS systems disclosed herein, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; removing the insulation over a portion of the first insulated conductive filament forming an exposed portion on the first insulated conductive filament; removing the insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; shorting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament; weaving the shorted portion across a predetermined number of predetermined filaments coupled to the collector module; positioning the first carrier, or the second carrier in a position detached from the base deck configured to enable forming the at least one coiled portion; using the first carrier, or the second carrier, forming at least one winding of the first predetermined conductive filament, or the second predetermined conductive filament around a predetermined number of the predetermined filaments coupled to the collector module, (xxxii) wherein the step of using at least one of: the first carrier, or the second carrier, forming the at least one coil, is replaced with a step of weaving the first predetermined conductive filament, or the second predetermined conductive filament in a predetermined pattern through a predetermined number of the predetermined filaments coupled to the collector module, further comprising, (xxxiii) before the step of weaving the shorted portion, forming a woven fabric of a portion of the predetermined filaments, (xxxiii) wherein the at least one winding is formed in parallel of the collection direction by the collector module and (xxxiv) further comprising, before the step of weaving the shorted portion, forming a woven fabric of a portion of the predetermined filaments.

[000175] In an exemplary implementation, provided herein is a method of continuously integrating at least one capacitor in at least one of a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS systems disclosed herein, the method comprising: providing a first carrier, adapted to accommodate a bobbin of a strand comprising a first and a second conductive filament, each conductive filament coated with a dielectric coating; positioning the first carrier, in a position detached from the base deck configured to enable forming at least one winding; and using the first carrier forming the at least one winding of the strand comprising the first and the second conductive filament, thereby continuously forming the at least one of: the strand, the rope, and the cable having the at least one integrated capacitor, (xxxv) having a predetermined number of windings around at least one of the plurality of predetermined filaments coupled to the collector module; and (xxxvi) further comprising a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated capacitor.

[000176] In another exemplary implementation, provided herein is a method of continuously integrating at least one capacitor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS systems disclosed herein the method comprising: providing a first earner associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; providing a third carrier associated with a dielectric filament; positioning the first carri ct . or the second carrier, in a position detached from the base deck configured to enable forming at least one winding using the first, or second conductive filament; using the first carrier, or the second carrier, forming at least one winding of the first insulated conductive filament, or the second insulated conductive filament around at least one filament coupled to the collector module; repositioning the first carrier, or the second movable carrier to the base deck; positioning the third earner, in a position detached from the base deck configured to enable forming at least one winding of the dielectric filament; using the third carrier, forming at least one winding of the dielectric filament around the winding formed by the first or second conductive filaments; repositioning the third carrier to the base deck; positioning the first carrier, or the second carrier, in a position detached from the base deck configured to enable forming at least one winding using the first, or second insulated conductive filament; using the first carrier, or the second carrier, forming at least one winding of the first insulated conductive filament, or the second insulated conductive filament around the winding formed by the dielectric filament; and repositioning the first carrier, or the second carrier to the base deck, thereby continuously forming the wire having at least one integrated capacitor, (xxxvii) wherein the diameter of the dielectric filament is different than the diameter of the first or second insulated conductive filaments, wherein (xxxviii) the winding formed around the at least one filament coupled to the collector module is formed using the first carrier and the coil formed around the dielectric coil is formed using the second carrier, (xxxix) further comprising a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated capacitor within the at least one of: the strand, the rope, and the cable respectively, and wherein (xl) the winding formed around the at least one filament coupled to the collector module is wound in a clockwise direction and the winding around the dielectric coil is wound in an anti-clockwise direction.

[000177] In yet another exemplary implementation, provided herein is a method of continuously integrating at least one resistor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS systems disclosed herein, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament, wherein the second insulated conductive filament has a different resistivity than the first insulated conductive filament; removing the insulation over a portion of the first insulated conductive filament forming an exposed portion on the first insulated conductive filament; removing the insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; contacting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament, thereby creating a short between the first insulated conductive filament, and the second insulated conductive filament; positioning the first carrier, in a position detached from the base deck configured to enable forming at least one of: a winding, a wrinkle, and a wave of the first insulated filament; using the first carrier, forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament around a portion of the second insulated filament, or adjacent to the second insulated filament; and repositioning the first carrier to the base deck, (xli) wherein the step of contacting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament comprises: positioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament; using the first carrier, forming the winding in a predetermined direction of the first insulated conductive filament using only the exposed portion on the first insulated conductive filament; repositioning the first carrier to the base deck; positioning the second carrier, in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament; using the second carrier, forming the winding in a direction opposite to the predetermined direction of the first insulated conductive filament using only the exposed portion on the second insulated conductive filament, wherein the coil formed of the exposed portion of second insulated conductive filament abuts the exposed portion of the first insulated conductive filament, and further comprising (xlii) a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated resistor within the at least one of: the strand, the rope, and the cable respectively.

[000178] In an exemplary implementation, provided herein is a method of continuously integrating at least one cored transformer in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS systems disclosed herein, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a second carrier associated with a second insulated conductive filament; providing an elongated core; positioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around the elongated core; using the first carrier, forming at least one winding of the first insulated conductive filament around the elongated core; repositioning the first carrier to the base deck; positioning the second carrier in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the second insulated conductive filament around the elongated core; using the second carrier, forming at least one winding of the second insulated conductive filament around the elongated core; and repositioning the second carrier to the base deck, further comprising (xliii) a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated cored transformer within the at least one of: the strand, the rope, and the cable respectively.

[000179] In another exemplary implementation, provided herein is method of continuously integrating at least one sensor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS systems disclosed herein, the method comprising: providing a first carrier associated with a first insulated conductive filament; providing a sensor, wherein the sensor comprises at least one contact region; positioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around at least one contact region; using the first carrier, forming at least one winding of the first insulated conductive filament around the at least one contact region; and repositioning the first carrier to the base deck, wherein (xliv) the sensor further comprises a second contact region, further comprising, following the step of repositioning the first carrier to the base deck: providing a second carrier associated with a second insulated conductive filament; positioning the second earner in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the second insulated conductive filament around the elongated core; using the second carrier, forming at least one winding of the second insulated conductive filament around the second contact region of the sensor; and repositioning the second carrier to the base deck, and (xlv) further comprising a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated sensor within the at least one of: the strand, the rope, and the cable respectively.

[000180] In yet another exemplary implementation, provided herein is a method of continuously coating a filament or at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments with an additive agent, implemented in the embroiders disclosed herein, the method comprising: providing a first bobbin associated with a first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable positioning the dispenser in a position configured to dispense the agent onto the first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable; dispensing the agent onto the first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable, wherein (xlvi) the additive agent is an adhesive, further comprising (xlvii): using the additive dispenser, coating at least one of the plurality of the predetermined filaments with the adhesive, wherein (xlviii) the additive is an insulating liquid, the method further comprising: providing a bobbin spooling a conductive non-insulated filament to the dispenser; using the additive dispenser, selectively coating at least a portion of the non-insulated conductive filament with the insulating liquid; and forming at least partially insulated filament portion, wherein (xlix) the additive dispenser is a co-extruder and the insulating liquid is a thermoplastic resin melt, wherein the co-extruder is operable to selectively extrude a sheath of the thermoplastic resin around the portion of the non-insulated conductive filament, further comprising (1): providing a fabric to the embroider; coupling the conductive noninsulated filament to the embroider needle; and using the additive dispenser to selectively insulate the conductive non-insulatcd filament, forming an insulated and non-insulatcd pattern on the fabric, and wherein (li) the pattern formed on the fabric is operable as an electric circuit.

[000181] In an exemplary implementation, provided herein is a method of forming at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, each of the at least one of: the strand, the rope, and the cable having a predetermined three-dimensional (3D) structure, implemented in certain implementations of the CIS systems disclosed herein, the method comprising: providing a first carrier associated with a shape memory filament; selectively heating the shape memory filament at predetermined position while in the process of interlocking the shape memory filament, wherein (lii) the system further comprises at least on pulley configured to introduce a built-in strain onto the shape memory filament, wherein (liii) a core filament in the at least one core filament carrier is a ni tinol filament, while the method further comprises (liv): using the focused heat source, selectively heating the nitinol core filament at predetermined position while in the process of interlocking the at least one of: the strand, the rope, and the cable.

[000182] In another exemplary implementation, provided herein is a method of forming at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, each of the at least one of: the strand, the rope, and the cable having a predetermined structure, implemented in the CIS systems disclosed herein, the method comprising: using the at least one core filament carrier, providing the core filament to the collector module, wherein the core filament is comprised of a material configured to enhance a conductivity of the at least one of: the strand, the rope, and the cable; using a first sub-portion of the plurality of the carriers, forming a structural layer over the core filament; using a second sub-portion of the plurality of the carriers, forming a biocompatibility layer over the structural layer; using a third sub-portion of the plurality of the carriers, forming a charge injection layer over the biocompatibility layer; and forming an insulating layer over the charge injection layer. The method of claim 69 wherein the step of forming the charge injection layer is omitted and the insulating layer is formed on the biocompatibility layer, wherein (Iv) the step of forming the structural layer is omitted and the biocompatibility layer is formed over the core filament, (Ivi) the conductivity-enhancing filament, is formed of silver (Ag), copperchromium (Cu-Cr) alloy, carbon-nanotubes (CNT) doped with KAuBi‘4, or an alloy comprising conductivity enhancing particles selected from: carbides and nitrides of 4A group elements, 5A group elements, 6A group elements, 7A group elements, silicon and boron, or a conductivity enhancing particles combination of one or more of the foregoing, wherein (Ivii) the structural layer is comprised of a resilient thermoplastic resin that is: thermoplastic poly(urethane) (TPU), poly(dimethyl-sulfate) (PDMS), poly(ethylene-ether-ketone) (PEEK), and wherein (Iviii) the biocompatibility layer is comprised of polyethylene glycol, polypropylene glycol, polyoxyethylene, polytrimethylene glycol, polylactic acid and derivatives thereof, polyacrylic acid and derivatives thereof, poly(amino acid), polyurethane, polyphosphazene, poly(L-lysine), polyalkylene oxide, polysaccharide, dextran, polyvinyl pyrrolidone, polyvinyl alcohol, polyacryl amide, copolymers thereof, and terpolymers thereof. [000183] In yet another exemplary implementation, provided herein is a method of continuously forming an electrode in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, implemented in the CIS systems disclosed herein, the method, wherein a first sub-portion of the plurality of the predetermined filaments comprising a first conductive filament, is coupled to the collector module, the method comprising: providing a first carrier associated with a second conductive filament; positioning the first carrier in a position detached from the base deck configured to enable forming at least one of: a filament winding, a twisted filament, and a shorted filament; continuously forming at least one winding around the first sub-portion of the plurality of the predetermined filaments comprising the at least one conductive filament at a predetermined position along the at least one of: the strand, the rope, and the cable, the at least one winding forming at least one contact point on the at least one of: the strand, the rope, and the cable; repositioning the first carrier to the base deck; using the base deck, with a second sub-portion of the plurality of the predetermined filaments, forming an external braided sleeve around the first sub-portion of the plurality of the predetermined filaments comprising the at least one conductive filament, while exposing a portion of the at least one contact points at a predetermined radial position along the electrode formed in the at least one of: the strand, the rope, and the cable; cutting the electrode formed in the at least one of: the strand, the rope, and the cable comprising the at least one radially exposed contact point forming the wire electrode having a proximal end and a distal end; and optionally insulating the proximal end, the method further comprising (lix) coupling a needle to the distal end of the electrode formed in the at least one of: the strand, the rope, and the cable, wherein (lx) the step of continuously forming at least one winding around the first sub-portion of the plurality of the predetermined filaments, further comprises forming a plurality of contact points and wherein a portion of the plurality of contact points along the longitudinal axis of the electrode formed in the at least one of: the strand, the rope, and the cable towards the proximal end, and a portion of the contact points along the longitudinal axis towards the distal end of the electrode formed in the at least one of: the strand, the rope, and the cable forming a plurality of connection terminals, each contact point and each contact terminal further comprises a structural underlayer, sized and configured to provide rigidity to each of: the contact points, and the connection terminals, wherein (Ixi) structural underlayer is comprised of poly(carbonate), or poly(ethylene-ether ketone)(PEEK), poly(carbonate-sulfate) copolymer or a thermoplastic polymer having a glass transition temperature over 60 °C, (Ixii) the electrode formed in the at least one of: the strand, the rope, and the cable is further comprised of: a filled core filament, or a tube core filament of a thermoplastic polymer; the first sub-portion of the plurality of the predetermined filaments comprising at least one conductive filament; the external braid sleeve; a structural layer; the plurality of contacts; and the plurality of connection terminals, (Ixiii) the thermoplastic polymer is PEDF, ETFE, PTFE, Poly(imide) or a copolymer comprising at least one of the foregoing, wherein (Ixiv) the filled core filament, or the tube core filament, the first sub-portion of the plurality of the predetermined filaments comprising at least one conductive filament, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals are each formed of a non-reflow material, wherein (Ixiv) the structural layer is adapted for reflow, or (Ixv) the structural layer is adapted for reflow by at least one of: providing a thermoplastic polymer for the structural layer having a lower glass transition temperature (Tg), or melting temperature (Tm), than each of the filled core filament, or the tube core filament, the plurality of predetermined filaments, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals, adding a plasticizer, and controlling the molecula' weight average ((Af^)^) of the thermoplastic polymer forming the structural layer, the method further comprising (Ixvi) subjecting the electrode wire to a reflow process configured to elevate the temperature above the Tg of the thermoplastic polymer forming the structural layer and below the Tg, and Tm of each of the filled core filament, or the tube core filament, the first sub-portion of the plurality of the predetermined filaments comprising at least one conductive filament, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals, and wherein (Ixvii) the thermoplastic polymer forming the structural layer is thermoplastic poly(urethane) (TPU), or semi-crystalline poly(ether-block-amine) (pebax), also (Ixviii) provided herein is at least one of: a strand, a rope, and a cable, each comprising a plurality of the strand electrodes formed by the method, wherein each the strand electrodes comprises plurality of contact points, and the plurality of contact terminals; and the distal end of the plurality of the strand electrodes extend beyond the distal end of the at least one of: the rope, and the cable each forming a macro-electrode, forming branching micro strand electrodes coupled to a single macro electrode comprised of the at least one of: the rope, and the cable, (Ixix) the method providing full coverage stimulation or full coverage sensing, comprising: penetrating a first portion of at least one of: an organ and a tissue in need thereof with at least one of the macro-electrode disclosed; leading the branched micro electrodes to a second portion of the at least one of: the organ and the tissue; using the plurality of contacts on the macro electrode, providing a signal configured for at least one of: produce a response in the at least one of: the organ and the tissue, and stimulate the second portion of the at least one of: the organ and the tissue, wherein (Ixx) at least one micro electrode is an RF ablation electrode, a leaser ablation fiber, a fiber optic for sensing or analytics, a distal LED electrode, a potentiostat electrode, or an electrode comprising a photonic sensor. [000184] In an exemplary implementation, provided herein is a method of integrating at least one strain relief region disposed in a predetermined location in a structured electrode, the at least one strain relief region configured to impart onto the structured electrode a predetermined stiffness profile, implemented in the CIS systems disclosed herein, the method, the method comprising: providing the core filament to the collector module; providing a first sub-portion of the plurality of the carriers, forming a coiled layer over the core filament; providing a second subportion of the plurality of the carriers, forming a removable structural layer on at least one predetermined location over the coiled layer; forming an insulating layer over at least the structural layer; cutting the structured electrode at a predetermined length comprising the at least one predetermined location of the removable structural layer; and removing the structural layer, wherein (Ixxi) order of the steps of forming a coiled layer and the step of forming the removable structural layer arc interchanged, wherein (Ixxii) the removable structural layer is replaced with a heat- shrinkable tube disposed on at least one predetermined location over the coiled layer, and the step of removing the removable structural layer is replaced with a step of exposing the cut structured electrode to heat configured to shrink the heat-shrinkable tube, and wherein (Ixxiii) the second sub-portion of the plurality of predetermined filaments is comprised of thermoplastic filaments configured to undergo reflow process and step of removing comprises subjecting the cut electrode wire to the reflow process. [000185] In another exemplary implementation provided herein is a method of imparting a predetermined stiffness profile to at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, implemented in the CIS systems disclosed herein, the method, the method comprising: providing a first carrier associated with a thermoplastic filament configured to undergo reflow upon application of heat; positioning the first carrier in a position detached from the base deck configured to enable forming at least one of: a filament winding, and a filament coil; continuously forming a plurality of windings around a portion of a plurality of the predetermined filaments comprising at least one conductive filament at a predetermined position along the at least one of: the strand, the rope, and the cable the windings forming a plurality of external reflow regions on the at least one of: the strand, the rope, and the cable; repositioning the first carrier to the base deck; providing a second carrier associated with a thermoplastic filament configured not to undergo reflow upon application of heat; positioning the second carrier, in a position detached from the base deck configured to enable forming at least one of: the filament winding, and the filament coil; continuously forming a plurality of windings around the portion of the plurality of the predetermined filaments comprising the at least one conductive filament between at least two adjacent external reflow regions on the at least one of: the strand, the rope, and the cable; repositioning the second earner to the base deck; cutting the at least one of: the strand, the rope, and the cable comprising the plurality of reflow regions and the non-reflow windings between the at least two external reflow regions; and using the heating tunnel, removing the reflow regions, thereby imparting the predetermined stiffness profile to the at least one of: the strand, the rope, and the cable.

[000186] In yet another exemplary implementation, provided herein is a method of forming micro-contacts on a strand comprising at least one filament implemented in the CIS systems disclosed herein, the method comprising: providing a first carrier associated with a non-insulated conductive filament; forming a first insulating layer over the non-insulated conductive filament, wherein the insulating layer defines a predetermined number of microapertures disposed in a predetermined number of locations along the wire; forming a second insulating layer over the first insulating layer; and optionally marking the predetermined number of locations of the micro-apertures externally along the wire, (Ixxiv) the method further comprising selectively removing a portion of the second insulation sleeve covering at least one of the predetermined number of micro-apertures, and wherein (Ixxv) the step of selectively removing comprising using the focused heat source.

[000187] In an exemplary implementation, provided herein is a method of forming a system on a braided yarn (SOBY), the braided yarn is comprised of at least one of: a strand, a rope, and a cable, wherein the plurality of predetermined filaments comprise at least one of: at least one strand having an integrated coil, at least one strand having an integrated capacitor, at least one strand having an integrated resistor, at least one strand having an integrated cored transformer, at least one strand having an integrated sensor, at least one strand having an external conductive contact terminal, at least one strand having an integrated printed circuit board, at least one electrode strand, and a cable comprising two or more of the foregoing, implemented in the CIS systems disclosed herein, the method comprising: using a plurality of carriers, continuously forming a single yarn, the predetermined filament carriers configured to provide a predetermined functionality to the SOBY; and cutting the yarn at a predetermined length, configured to result in an operable SOBY.

[000188] In another exemplary implementation, provided herein is an interlocked brain depth electrode comprising an implantable distal end, the implantable distal end comprising: at least one electrophysiological electrode, at least one electrochemical chemical electrode, each having an inner diameter of more than 0.6mm and an outer diameter of less than 0.8mm, wherein (Ixxvi) the implantable distal end is tapered, (Ixxvii) further comprising at least one fiber optic element, (Ixxviii) at least two encapsulated systems.

[000189] In yet another exemplary implementation, provided herein is an embroidered EEG recording cap formed by the embroidery methods disclosed herein, having insulated conductive wires embroidered on top of the EEG cap cloth where portions of the wire are exposed forming an electrode surface and other portions are exposed forming a connection terminal, wherein (Ixxix) the wire used is a silver wire, portion of the wire constituting the contact side is treated (e.g., by electrodeposition) to have a surface of AgCl.

[000190] In an exemplary implementation, provided herein is an interlocked functional cable incorporating at least one segment where two insulated conductive wires are exposed and shorted together along the cable body. [000191] In another exemplary implementation, provided herein is an interlocked lead formed using the CIS systems disclosed herein, having a plurality of insulated connection terminals along its proximal end, further comprising at least a capacitor, a coil, a resistor, a short, an electromechanical sensor, and electrochemical sensor and an electrophysiological sensor.: Cuttings the interlocked lead at a certain position and using a tipping tool to insulate the lead cat proximal end; and Connecting to the interlocked lead with a mating connector that puncture the insulation layer covering the terminals.

[000192] While in the foregoing specifications the CIS was used to create elements from at least one filament, where it was illustrated by a short is first accomplished, and then the element is created (e.g. coil, capacitor, twist, .. . etc.), it will be apparent to those skilled in the art that order of which the element is built is not important (i.e. building of the element could happen before building the short); this is also true to any other element described throughout this specification.

[000193] While in the foregoing specification the continuous additive manufacturing methods, systems and devices for forming functional strands, ropes and cables have been described in relation to certain preferred exemplary implementations, and many details are set forth for purpose of illustration, it will be apparent to those skilled in the art that the disclosure can be susceptible to additional exemplary implementations and that certain of the details described in this specification and as are more fully delineated in the following claims can be varied considerably without departing from the basic principles of this invention.

Claims

What is Claimed:

1. A cable interlocking system (CIS) comprising: a) a base deck, defining a plurality of tracks; b) a plurality of carriers, each carrier detachably coupled to a corresponding track on the base deck, wherein each carrier is adapted to accommodate a bobbin spooling: a predetermined filament, a predetermined strand, or a predetermined cable; and c) a collector module operable to collect the predetermined filament, the predetermined strand, or the predetermined cable, wherein the collector module is disposed at a given distance from the base deck, forming an interlocking axis, and wherein at least one of: the predetermined filaments, the predetermined strands, or the predetermined cables is configured to form an angle of between 0° and 180° relative to the interlocking axis.

2. The CIS of claim 1, wherein the collector module comprises: a) a collector powertrain; and b) at least one pulley, coupled to the collector powertrain, sized and configured to controllably roll the at least one of: the predetermined filaments, the predetermined strands, and the predetermined cables.

3. The CIS of claim 2, further comprising: a) at least one core filament carrier, configured for feeding at least one core filament to at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, wherein the at least one core filament is coupled to the collector module; b) at least one lifting member, configured to engage at least one of the plurality of carriers and raise the at least one engaged carrier to a predetermined position away from a base deck surface

4. The CIS of one of the claims 1-3, further comprising: a) an interlocking platform; and b) a shuttle, operably coupled to the interlocking platform, configured to engage at least one of the earners and interlock the predetermined filament, the predetermined strand, or the predetermined cable associated with the at least one carrier.

5. The CIS of one of the claims 1-3, further comprising a heating tunnel, operable to selectively reflow a thermoplastic resin configured to undergo a reflow process..

6. The CIS of one of the claims 1-3, further comprising a central processing module (CPM) in communication with the base deck, the interlocking platform, each of the plurality of carriers, the collector powertrain, and the at least one lifting member, the CPM comprising at least one processor in communication with a non-transitory memory device, storing thereon a set of executable instructions. The CIS of claim 1, wherein at least one carrier is a tension controlling carrier (TCC) comprising: a) a first adjustable biasing element coupled to the predetermined filament, the predetermined strand, or the predetermined cable, operable to control the tension on the predetermined filament, the predetermined strand, or the predetermined cable: b) the bobbin, adapted sized and configured to spool the predetermined filament, the predetermined strand, or the predetermined cable; c) a selector; and d) at least one pulley operably coupled to the selector, configured to engage the predetermined filament, the predetermined strand, or the predetermined cable, wherein the selector is operable to selectably couple to the first biasing element. The TCC of claim 7, further comprising: a second biasing clement having a different biasing force than the biasing force of the first biasing element. The TCC of claim 7, further comprising: a sensor operable to maintain a predetermined tension on the predetermined filament, the predetermined strand, or the predetermined cable associated with the TCC. The TCC of claim 9, wherein the sensor operable to maintain the predetermined tension on the predetermined filament, the predetermined strand, or the predetermined cable, is operably coupled to at least one of: the at least one pulley, and the bobbin. The TCC of claim 7, wherein maintaining the predetermined tension comprises at least one of: selectably translating the at least one pulley relative to the first or second biasing element then- engaged by the selector, and rotating the bobbin. An embroider having a power train, coupled to a bobbin spooling at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires, the embroider further comprising: a needle operable to engage the at least one of: the filament, the predetermined strand, or the predetermined cable associated with a corresponding bobbin. The embroider of claim 12, further comprising an additive dispenser, operable to dispense an additive agent onto at least one of: the predetermined filament, the predetermined strand, and the predetermined cable. The embroider of claim 13, wherein the additive dispenser is a co-extruder, an additive vat, sprayer, dip coater or a spout, each operable to dispense an additive agent onto at least a portion of the predetermined filament, the predetermined strand, or the predetermined cable. The embroider of claim 14, wherein the additive agent is an adhesive, capacitive substance, mixed capacitive with conductance substance, a conductive substance, or an insulating liquid resin. The embroider of claim 13, wherein the additive dispenser is operable to dispense a thermoplastic powder, the embroider further comprising means for melting the powder onto the at least one of: the predetermined filament, the predetermined strand, and the predetermined cable. The embroider of claim 16, wherein the means for melting the powder is: a laser source, a focused heat source, an adhesive, a solvent, or means for melting the powder comprising one or more of the foregoing. The CIS of one of the claims 1-3, further comprising a focused heat source, operable to heat at least one of: the predetermined filament, the predetermined strand, and the predetermined cable. The CIS of claim 18, wherein the focused heat source is: a laser, a heated air dispenser, a radiative heating element, a conductive heating element, or a focused heat source comprising one or more of the foregoing. The CIS of one of the claims 1-3, wherein the interlocking axis is horizontal. The CIS of one of the claims 1-3, wherein the interlocking axis is vertical. The CIS of any one of claims 1-11, and 18-21, wherein at least one of the predetermined filaments, the predetermined strands, or the predetermined cables comprise an integrated coil, an integrated capacitor, an integrated resistor, at an integrated cored transformer, an integrated sensor, an integrated complex element, an external conductive contact terminal, an integrated printed circuit board, an electrode wire, and two or more of the foregoing. A method of continuously integrating at least one of: a filament coil, a filament twist, and a shorted filament in a strand, the strand comprising a plurality of filaments, implemented in the CIS system of any one of claims 1-19 comprising: a) decoupling a first predetermined filament from the collector module; b) drawing a portion of the first predetermined filament from a first carrier associated with the first predetermined filament; c) backfilling the drawn portion of the first predetermined filament into a first empty carrier forming a secondary carrier; d) positioning the first carrier, or the secondary carrier in a position detached from the base deck configured to enable forming the at least one of: the filament coil, the filament twist, and the filament short; e) using at least one of: the first carrier, and the secondary carrier, integrating the at least one of: the filament coil, the filament twist, and the shorted filament around at least one of a plurality of predetermined filaments coupled to the collector module; and f) repositioning the first carrier, or the secondary carrier to the base deck. The method of claim 23, wherein the first predetermined filament is an electrically conductive filament. The method of claim 23, further comprising a step of cutting the strand at a predetermined length, configured to comprise the at least one of: the filament coil, the filament twist, and the filament short. The method of claim 23, whereby the step of positioning further comprises using a robotic arm to position the at least one of: the first carrier, and the secondary winding carrier in a position configured to form the at least one of: the filament coil, the filament twist, and the filament short. The method of claim 23, further comprising: a) using the first carrier, or the secondary carrier, forming a plurality of primary windings structure; b) repositioning a second carrier to a position configured for forming a plurality of secondary coil windings; c) selectably causing the second carrier to form a predetermined number of windings of the predetermined filament associated with the second carrier around the windings formed by the predetermined filament associated with the first, or second carrier thereby forming an electromagnetic shielding coil having primary-secondary (PS) structure. A method for continuously forming at least one of: an adjustable strand, an adjustable rope, and an adjustable cable, each comprised of a plurality of filaments or wires, each of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable having a plurality of embedded contacts, each contact in communication with a corresponding terminal of a plurality of terminals, implemented in the CIS system of any one of claims 1-11, and 18-21 comprising: a) positioning a first carrier storing a conductive filament having an insulated portion and a non-insulated portion in a position detached from the base deck configured to enable interlocking the conductive filament having the insulated portion and the non-insulated portion, which is associated with the first carrier; b) using the first carrier, continuously interlocking the conductive filament having the insulated portion and the non-insulated portion, wherein the non-insulated portion of the conductive filament is configured to extend radially from the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, forming a plurality of contact points and electrode terminals; c) repositioning the first carrier to the base deck; d) forming an insulating sleeve over the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; e) marking the location of the plurality of contact points and electrode terminals formed by the conductive filament having the insulated portion and the noninsulated portion, which is associated with the first carrier on an external surface of the insulating sleeve of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; f) upon determining an operational length of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, based on the marking, removing the insulating sleeve over a first contact point from the plurality of contacts sized and configured to form the proximal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; g) removing the insulating sleeve over at least one contact point from the plurality of contacts associated with the fir st contact point, configured to form a first terminal in a distal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; h) cutting the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable comprising the plurality of marked contact points and the exposed terminal; and i) insulating the proximal end. he method of claim 28, further comprising, prior to the step of forming an insulating sleeve: a) positioning a second carrier storing a conductive filament having an insulated portion and a non-insulated portion in a position detached from the base deck configured to enable interlocking the conductive filament having the insulated portion and the non-insulated portion, which is associated with the second carrier; b) continuously interlocking the conductive filament having the insulated portion and the non-insulated portion, wherein the non-insulated portion of the conductive filament is configured to extend radially from the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; and c) repositioning the second carrier to the base deck, whereby the step of marking the location of the contact points on the external surface of the insulating sleeve further comprises: i. marking the location of the plurality of contacts formed by the conductive filament having the insulated portion and the non-insulated portion, which is associated with the first carrier on an external surface of the insulating sleeve of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; ii. upon determining an operational length of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, based on the marking, removing the insulating sleeve over a second contact point from the plurality of contacts sized and configured to form the proximal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable, the second contact point formed by the conductive filament having the insulated portion and the non-insulated portion, which is associated with the second carrier; and iii. removing the insulating sleeve over at least one contact point from the plurality of contacts associated with the second contact point, configured to form a second terminal in the distal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable. The method of claim 28, wherein the insulating sleeve is configured to allow coupling of the adjustable cord to at least one of: a device, a terminal, and an interposer. The method of claim 28 wherein the marking is at least one of: a geometric shape corresponding to the region, a letter, and a number. The method of claim 30, further comprising: a) contacting a tissue, an organ, or a surface with the distal portion of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable comprising the terminal; b) selectively coupling the at least one of: the device, the terminal, and the inteiposer at the contact marking below the proximal end of the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable; and c) cutting the at least one of: the adjustable strand, the adjustable rope, and the adjustable cable between the at least one of: the device, the terminal, and the interposer coupled at the selected marking, and the proximal end forming an exposed proximal end. The method of claim 32, further comprising reinsulating the exposed proximal end. A method of continuously integrating at least one of: a coiled filament, a twisted filament pair, and a shorted filament pair in at least one of a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system of any one of claims 1-11, and 18-21, whereby the method comprises: a) providing a first carrier associated with a first insulated conductive filament; b) providing a second carrier associated with a second insulated conductive filament; c) removing insulation over a portion of the first insulated conductive filament thereby forming an exposed portion on the first insulated conductive filament; d) removing insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; e) using the first carrier and the second carrier, contacting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament f) positioning the first carrier, or the secondary carrier in a position detached from the base deck configured to enable forming the at least one of: the coiled filament, and the twisted filament pair; g) using at least one of: the first carrier, and the second carrier, forming the at least one of: the coiled filament, and the twisted filament pair around at least one filament coupled to the collector module; and h) repositioning the at least one of: the first carrier, and the second carrier to the base deck. The method of claim 34, where twisted filament pair is accomplished by the two carriers remaining on the base deck on twisting tracks instead of detaching one of the carriers from the base deck . The method of any one of the claims 34 or 35, wherein each of the first insulated conductive filament and the second insulated conductive filament comprise an interrupted insulating sleeve forming an insulated portion, and an exposed portion. A method of continuously forming a woven strand having at least one coiled portion implemented in the CIS system of any one of claims 1-11, and 18-21 comprising: a) providing a first carrier associated with a first insulated conductive filament; b) providing a second carrier associated with a second insulated conductive filament; c) removing the insulation over a portion of the first insulated conductive filament forming an exposed portion on the first insulated conductive filament; d) removing the insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; e) shorting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament; f) weaving the shorted portion across a predetermined number of predetermined filaments coupled to the collector module; g) positioning the first carrier, or the second carrier in a position detached from the base deck configured to enable forming the at least one coiled portion; h) using the first carrier, or the second carrier, forming at least one winding of the first predetermined conductive filament, or the second predetermined conductive filament around a predetermined number of the predetermined filaments coupled to the collector module. The method of claim 37, wherein the step of using at least one of: the first carrier, or the second carrier, forming the at least one coil, is replaced with a step of weaving the first predetermined conductive filament, or the second predetermined conductive filament in a predetermined pattern through a predetermined number of the predetermined filaments coupled to the collector module. The method of any one of the claims 37 or 38, further comprising, before the step of using or weaving the shorted portion, forming a woven fabric of a portion of the predetermined filaments. The method of claim 39, wherein the at least one winding is formed in parallel of the collection direction by the collector module. The method of claim 40, further comprising, before the step of weaving the shorted portion, forming a woven fabric of a portion of the predetermined filaments. A method of continuously integrating at least one capacitor in at least one of a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system of any one of claims 1-11, and 18-21 comprising: a) providing a first carrier, adapted to accommodate a bobbin of a strand comprising a first and a second conductive filament, each conductive filament coated with a dielectric coating; b) positioning the first carrier, in a position detached from the base deck configured to enable forming at least one winding; and c) using the first carrier forming the at least one winding of the strand comprising the first and the second conductive filament, thereby continuously forming the at least one of: the strand, the rope, and the cable having the at least one integrated capacitor. The method of claim 42, having a predetermined number of windings around at least one of the plurality of predetermined filaments coupled to the collector module. The method of claim 42, further comprising a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated capacitor. A method of continuously integrating at least one capacitor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system of any one of claims 3-11, and 18-21 comprising: a) providing a first carrier associated with a first insulated conductive filament; b) providing a second carrier associated with a second insulated conductive filament; c) providing a third carrier associated with a dielectric filament; d) positioning the first carrier, or the second carrier, in a position detached from the base deck configured to enable forming at least one winding using the first, or second conductive filament; e) using the first carrier, or the second carrier, forming at least one winding of the first insulated conductive filament, or the second insulated conductive filament around at least one filament coupled to the collector module; f) repositioning the first carrier, or the second movable carrier to the base deck; g) positioning the third carrier, in a position detached from the base deck configured to enable forming at least one winding of the dielectric filament; h) using the third carrier, forming at least one winding of the d i cl ec trie filament around the winding formed by the first or second conductive filaments; i) repositioning the third earner to the base deck; j) positioning the first carrier, or the second carrier, in a position detached from the base deck configured to enable forming at least one winding using the first, or second insulated conductive filament; k) using the first carrier, or the second carrier, forming at least one winding of the first insulated conductive filament, or the second insulated conductive filament around the winding formed by the dielectric filament; and l) repositioning the first carrier, or the second carrier to the base deck, thereby continuously forming the wire having at least one integrated capacitor. The method of claim 45, wherein the diameter of the dielectric filament is different than the diameter of the first or second insulated conductive filaments. The method of claim 45, wherein the winding formed around the at least one filament coupled to the collector module is formed using the first carrier and the coil formed around the dielectric coil is formed using the second earner. The method of claim 45, further comprising a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated capacitor within the at least one of: the strand, the rope, and the cable respectively. The method of claim 45, wherein the winding formed around the at least one filament coupled to the collector module is wound in a clockwise direction and the winding around the dielectric coil is wound in an anti-clockwise direction. A method of continuously integrating at least one resistor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system of any one of claims 3-11, and 18-21 comprising: a)providing a first carrier associated with a first insulated conductive filament; b) providing a second carrier associated with a second insulated conductive filament, wherein the second insulated conductive filament has a different resistivity than the first insulated conductive filament; c)removing the insulation over a portion of the fu st insulated conductive filament forming an exposed portion on the first insulated conductive filament; d) removing the insulation over a portion of the second insulated conductive filament forming an exposed portion on the second insulated conductive filament; e)contacting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament, thereby creating a short between the first insulated conductive filament, and the second insulated conductive filament; f) positioning the first carrier, in a position detached from the base deck configured to enable forming at least one of: a winding, a wrinkle, and a wave of the first insulated filament; g) using the first carrier, forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament around a portion of the second insulated filament, or adjacent to the second insulated filament; and h) repositioning the first carrier to the base deck. The method of claim 50, wherein the step of contacting the exposed portion on the first insulated conductive filament with the exposed portion on the second insulated conductive filament comprises: ajpositioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament; b) using the first carrier, forming the winding in a predetermined direction of the first insulated conductive filament using only the exposed portion on the first insulated conductive filament; cjrepositioning the first carrier to the base deck; d) positioning the second earner, in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the first insulated conductive filament; ejusing the second carrier, forming the winding in a direction opposite to the predetermined direction of the first insulated conductive filament using only the exposed portion on the second insulated conductive filament, wherein the coil formed of the exposed portion of second insulated conductive filament abuts the exposed portion of the first insulated conductive filament. The method of claim 50, further comprising a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated resistor within the at least one of: the strand, the rope, and the cable respectively. A method of continuously integrating at least one cored transformer in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system of any one of claims 3-11, and 18-21 comprising: a) providing a first carrier associated with a first insulated conductive filament; b) providing a second carrier associated with a second insulated conductive filament; c) providing an elongated core; d) positioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around the elongated core; e) using the first carrier, forming at least one winding of the first insulated conductive filament around the elongated core; f) repositioning the first carrier to the base deck; g) positioning the second earner in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the second insulated conductive filament around the elongated core; h) using the second carrier, forming at least one winding of the second insulated conductive filament around the elongated core; and i) repositioning the second carrier to the base deck. The method of claim 53, further comprising a step of cutting the at least one of: the str and, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated cored transformer within the at least one of: the strand, the rope, and the cable respectively. A method of continuously integrating at least one sensor in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments, implemented in the CIS system of any one of claims 1-11, and 18-21 comprising: a) providing a first carrier associated with a first insulated conductive filament; b) providing a sensor, wherein the sensor comprises at least one contact region; c) positioning the first carrier in a position detached from the base deck configured to enable forming the at least one of: a winding, a wrinkle, and a wave of the first insulated conductive filament around at least one contact region; d) using the first carrier, forming at least one winding of the first insulated conductive filament around the at least one contact region; and e) repositioning the first carrier to the base deck.

56. The method of claim 55, wherein the sensor further comprises a second contact region, further comprising, following the step of repositioning the first earner to the base deck: a) providing a second carrier associated with a second insulated conductive filament; b) positioning the second carrier in a position detached from the base deck configured to enable forming the at least one of: the winding, the wrinkle, and the wave of the second insulated conductive filament around the elongated core; c) using the second carrier, forming at least one winding of the second insulated conductive filament around the second contact region of the sensor; and d) repositioning the second carrier to the base deck.

57. The method of claim 55, further comprising a step of cutting the at least one of: the strand, the rope, and the cable at a predetermined length, configured to comprise the at least one integrated sensor within the at least one of: the strand, the rope, and the cable respectively.

58. A method of continuously coating a filament or at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments with an additive agent, implemented in the embroider of any one of claims 12-17 comprising: a) providing a first bobbin associated with a first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable b) positioning the at least one dispenser in a position configured to dispense the agent onto the first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable; c) dispensing the agent onto the first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable.

59. The method of claim 58, wherein the additive agent is one of: an adhesive, a capacitive substance, or a mixed capacitive and conductive substance.

60. The method of claim 59, further comprising: using the at least additive dispenser, coating at least one of the plurality of the predetermined filaments with the adhesive.

61. The method of claim 60 wherein the additive is an insulating liquid, the method further comprising: a) providing a bobbin spooling a conductive non-insulated filament to at least one dispenser; b) using the at least additive dispenser, selectively coating at least a portion of the non-insulated conductive filament with the insulating liquid; and c) forming at least partially insulated filament portion.

62. The method of claim 60, wherein the at least additive dispenser is a co-extruder and the insulating liquid is a thermoplastic resin melt, wherein the co-extruder is operable to selectively extrude a sheath of the thermoplastic resin around the portion of the non-insulated conductive filament.

63. The method of claim 60, further comprising: a) providing a fabric to the embroider; b) coupling the conductive non-insulated filament to the embroider needle and c) using the at-least additive dispenser to selectively insulate the conductive non-insulated filament, forming an insulated and non-insulated pattern on the fabric The method of claim 63, wherein the pattern formed on the fabric is operable as an electric circuit. A method of forming at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, each of the at least one of: the strand, the rope, and the cable having a predetermined three-dimensional (3D) structure, implemented in the CIS system of any one of claims 1-11 and 18-21 comprising: a) providing a first carrier associated with a shape memory filament; b) selectively heating the shape memory filament at predetermined position while in the process of interlocking the shape memory filament. The method of Claim 65, wherein the system further comprises at least on pulley configured to introduce a built-in strain onto the shape memory filament. The method of claim 65, wherein a core filament in the at least one core filament carrier is a nitinol filament. The method of claim 67, wherein the method comprises: using the focused heat source, selectively heating the nitinol core filament at predetermined position while in the process of interlocking the at least one of: the strand, the rope, and the cable. A filament, a strand, a rope, or a cable, each comprised of multiple layers, each of the at least one of: the strand, the rope, and the cable having a predetermined structure, where the layers comprising: a) a core layer comprised of a material configured to enhance a conductivity of the at least one of: the filaments, strand, the rope, and the cable; b) a structural layer over the core filament; c) a biocompatibility layer over the structural layer; d) a charge injection layer over the biocompatibility layer; and e) an insulating layer over the charge injection layer. The filament of claim 69 wherein the charge injection layer is omitted and the insulating layer is formed on the biocompatibility layer. The filament of claim 69, wherein the structural layer is omitted and the biocompatibility layer is formed over the core filament. The filament of claim 69, wherein the conductivity-enhancing layer, is formed of silver (Ag), copper-chromium (Cu-Cr) alloy, carbon-nanotubes (CNT) doped with KAuBi‘4, or an alloy comprising conductivity enhancing particles selected from: carbides and nitrides of 4A group elements, 5A group elements, 6A group elements, 7A group elements, silicon and boron, or a conductivity enhancing particles combination of one or more of the foregoing. The filament of claim 69, wherein the structural layer is comprised of platinum, nitinol, stainless steel, a resilient thermoplastic resin that is: thermoplastic poly(urethane) (TPU), poly(dimethyl- sulfate) (PDMS), poly(ethylene-ether-ketone) (PEEK). The filaement of claim 69, wherein the biocompatibility layer is comprised of platinum, platinum iridium, carbon black, titanium oxide, titanium dioxide, polyethylene glycol, polypropylene glycol, polyoxyethylene, polytrimethylene glycol, polylactic acid and derivatives thereof, polyacrylic acid and derivatives thereof, poly(amino acid), polyurethane, polyphosphazene, poly(L-lysine), polyalkylene oxide, polysaccharide, dextran, polyvinyl pyrrolidone, polyvinyl alcohol, polyacryl amide, copolymers thereof, and terpolymers thereof. A method of continuously forming an electrode lead in at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, implemented in the CIS system of any one of claims 1-11, and 18-21, wherein a first sub-portion of the plurality of the predetermined filaments comprising a first conductive filament, is coupled to the collector module, the method comprising: a) providing a first carrier associated with a second conductive filament; b) positioning the first carrier in a position detached from the base deck configured to enable forming at least one of: a filament winding, a twisted filament, and a shorted filament; c) continuously forming at least one winding around the first sub-portion of the plurality of the predetermined filaments comprising the at least one conductive filament at a predetermined position along the at least one of: the strand, the rope, and the cable, the at least one winding forming at least one contact point on the at least one of: the strand, the rope, and the cable; d) repositioning the first carrier to the base deck; e) using the base deck, with a second sub-portion of the plurality of the predetermined filaments, forming an external braided sleeve around the first sub-portion of the plurality of the predetermined filaments comprising the at least one conductive filament, while exposing a portion of the at least one contact points at a predetermined radial position along the electrode formed in the at least one of: the strand, the rope, and the cable; f) cutting the electrode formed in the at least one of: the strand, the rope, and the cable comprising the at least one radially exposed contact point forming the wire electrode having a proximal end and a distal end; and g) optionally insulating the proximal end. The method of claim 75, further comprising coupling a needle to the distal end of the electrode formed in the at least one of: the strand, the rope, and the cable. The method of claim 76, wherein the step of continuously forming at least one winding around the first sub-portion of the plurality of the predetermined filaments, further comprises forming a plurality of contact points and wherein a portion of the plurality of contact points along the longitudinal axis of the electrode formed in the at least one of: the strand, the rope, and the cable towards the proximal end, and a portion of the contact points along the longitudinal axis towards the distal end of the electrode formed in the at least one of: the strand, the rope, and the cable forming a plurality of connection terminals, each contact point and each contact terminal further comprises a structural underlayer, sized and configured to provide rigidity to each of: the contact points, and the connection terminals. The method of claim 77, wherein structural underlayer is comprised of poly(carbonate), or poly(cthylcnc-cthcr kctonc)(PEEK), poly(carbonatc-sulfatc) copolymer, Polyvinylidcnc fluoride (PVDF), rigid Nylon, or a thermoplastic polymer having a glass transition temperature over 60 °C. The method of claim 77, wherein the electrode formed in the at least one of: the strand, the rope, and the cable is further comprised of: a) a filled core filament, or a tube core filament of a thermoplastic polymer; b) the first sub-portion of the plurality of the predetermined filaments comprising at least one conductive filament; c) the external braid sleeve; d) a structural layer; e) the plurality of contacts; and f) the plurality of connection terminals. The method of claim 79, wherein the thermoplastic polymer is PEDF, ETFE, PTFE, PVDF, TPU, Poly(imide) or a copolymer comprising at least one of the foregoing. The method of claim 79, wherein the filled core filament, or the tube core filament, the first subportion of the plurality of the predetermined filaments comprising at least one conductive filament, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals are each formed of a non-reflow material. The method of claim 81, wherein the structural layer is adapted for reflow. The method of claim 82, wherein the structural layer is adapted for reflow by at least one of: providing a thermoplastic polymer for the structural layer having a lower glass transition temperature (Tg), or melting temperature (Tm), than each of the filled core filament, or the tube core filament, the plurality of predetermined filaments, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals, adding a plasticizer, and controlling the molecular weight average ((Mw' w) of the thermoplastic polymer forming the structural layer. The method of claim 81, further comprising subjecting the electrode lead to a reflow process configured to elevate the temperature above the Tg of the thermoplastic polymer forming the structural layer and below the Tg, and Tm of each of the filled core filament, or the tube core filament, the first sub-portion of the plurality of the predetermined filaments comprising at least one conductive filament, the external braid sleeve, the plurality of contacts, and the plurality of connection terminals. The method of claim 81, wherein the thermoplastic polymer forming the structural layer is thermoplastic poly(urethane) (TPU), PVDF, Nylon, or semi-crystalline poly(ether-block-amine) (Pebax). At least one of: a strand, a rope, and a cable, each comprising a plurality of the strand electrodes formed by the method of claim 79, wherein each the strand electrodes comprises plurality of contact points, and the plurality of contact terminals; and the distal end of the plurality of the strand electrodes extend beyond the distal end of the at least one of: the rope, and the cable each forming a macro-electrode, forming branching micro strand electrodes coupled to a single macro electrode comprised of the at least one of: the rope, and the cable. A method of providing full coverage stimulation or full coverage sensing, comprising: a) penetrating a first portion of at least one of: an organ and a tissue in need thereof with at least of the macro-electrode of claim 85; b) leading the branched micro electrodes to a second portion of the at least one of: the organ and the tissue; c) using the plurality of contacts on the macro electrode, providing a signal configured for at least one of: produce a response in the at least one of: the organ and the tissue, and stimulate the second portion of the at least one of: the organ and the tissue. The method of claim 87, wherein at least one micro electrode is an RF ablation electrode, a leaser ablation fiber, a fiber optic for sensing or analytics, a distal LED electrode, a potentiostat electrode, or an electrode comprising a photonic sensor. A method of integrating at least one strain relief region disposed in a predetermined location in a structured electrode, the at least one strain relief region configured to impart onto the structured electrode a predetermined relief profile, implemented in the CIS system of any one of claims 1- 11, and 18-21, the method comprising: a) providing the core filament to the collector module; b) providing a first sub-portion of the plurality of the carriers, forming a coiled layer over the core filament; c) providing a second sub-portion of the plurality of the earners, forming a removable structural layer on at least one predetermined location over the coiled layer; d) forming an insulating layer over at least the structural layer; e) cutting the structured electrode at a predetermined length comprising the at least one predetermined location of the removable structural layer; and f) removing the structural layer. The method of claim 89, wherein order of the steps of forming a coiled layer and the step of forming the removable structural layer are interchanged. The method of claim 90, wherein the removable structural layer is replaced with a heat-shrinkable tube disposed on at least one predetermined location over the coiled layer, and the step of removing the removable structural layer is replaced with a step of exposing the cut structured electrode to heat configured to shrink the heat-shrinkable tube. The method of claim 89, wherein the second sub-portion of the plurality of predetermined filaments is comprised of thermoplastic filaments configured to undergo reflow process and step of removing comprises subjecting the cut electrode wire to the reflow process. A method of imparting a predetermined stiffness profile to at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or filaments, implemented in the CIS system of any one of claims 1-11, and 18-21, the method comprising: a) providing a first earner associated with a thermoplastic filament configured to undergo reflow upon application of heat; b) positioning the first carrier in a position detached from the base deck configured to enable forming at least one of: a filament winding, and a filament coil; c) continuously forming a plurality of windings around a portion of a plurality of the predetermined filaments comprising at least one conductive filament at a predetermined position along the at least one of: the strand, the rope, and the cable the windings forming a plurality of external reflow regions on the at least one of: the strand, the rope, and the cable; d) repositioning the first carrier to the base deck; e) providing a second carrier associated with a thermoplastic filament configured not to undergo reflow upon application of heat; f) positioning the second earner, in a position detached from the base deck configured to enable forming at least one of: the filament winding, and the filament coil; g) continuously forming a plurality of windings around the portion of the plurality of the predetermined filaments comprising the at least one conductive filament between at least two adjacent external reflow regions on the at least one of: the strand, the rope, and the cable; h) repositioning the second carrier to the base deck; i) cutting the at least one of: the strand, the rope, and the cable comprising the plurality of reflow regions and the non-reflow windings between the at least two external reflow regions; and j) using the heating tunnel, removing the reflow regions, thereby imparting the predetermined stiffness profile to the at least one of: the strand, the rope, and the cable. A method of forming micro-contacts on a strand comprising at least one filament implemented in the CIS system of any one of claims 3-11, and 18-21 comprising: a) providing a first carrier associated with a non-insulated conductive filament; b) forming a first insulating layer over the non-insulated conductive filament, wherein the insulating layer defines a predetermined number of micro-apertures disposed in a predetermined number of locations along the wire; c) forming a second insulating layer over the first insulating layer; and d) optionally marking the predetermined number of locations of the microapertures externally along the wire. The method of claim 94, further comprising selectively removing a portion of the second insulation sleeve covering at least one of the predetermined number of micro-apertures. The method of claim 95, wherein the step of selectively removing comprising using the focused heat source. A method of forming a system on a braided yarn (SOBY), the braided yarn is comprised of at least one of: a strand, a rope, and a cable, wherein the plurality of predetermined filaments comprise at least one of: at least one strand having an integrated coil, at least one strand having an integrated capacitor, at least one strand having an integrated resistor, at least one strand having an integrated cored transformer, at least one strand having an integrated sensor, at least one strand having an external conductive contact terminal, at least one strand having an integrated printed circuit board, at least one electrode strand, at least one strand having a complex element, at least one strand having and integrated silicon circuit, and a cable comprising two or more of the foregoing, implemented in the CIS system of any one of claims 1-11, and 18-21, the method comprising: a) using a plurality of earners, continuously forming a single yarn, the predetermined filament carriers configured to provide a predetermined functionality to the SOBY; and b) cutting the yarn at a predetermined length, configured to result in an operable SOBY. A method according to claim 97, further comprising forming a complex circuit from at least two of wires, strands, leads or cables comprising of exposing segments of at least of the wires, strands, leads, ropes, or cables and using and additional exposed to short the two of wires, strands, leads of cables at the exposed segments. An interlocked brain depth electrode comprising an implantable distal end, the implantable distal end comprising: at least one electrophysiological electrode, at least one electrochemical chemical electrode, having an inner diameter of more than 0.6mm and an outer diameter of less than 0.8mm. . The interlocked brain depth electrode of claim 98, wherein the implantable distal end is tapered. . The interlocked brain depth electrode of claim 99 or 100 further comprising at least one fiber optic element. . The interlocked brain depth electrode of claim 99, further comprising at least two encapsulated system. . An embroidered EEG recording cap formed by the method of any one of claims 58-64, having insulated conductive wires embroidered on top of the EEG cap cloth where portions of the wire are exposed forming an electrode surface and other portions are exposed forming a connection terminal. . An embroidered EEG recording cap formed by the method of any one of claims 58-64, having insulated conductive wires embroidered on top of the EEG cap cloth where portions of the wire arc coated with capacitive substances forming an electrode surface, and other portions arc exposed forming a connection terminal. . The embroidered EEG cap according to claim 103 or 104, wherein the wire used is a silver wire or metalized filament with silver, portion of the wire constituting the contact side is treated to have a surface of AgCl. . An interlocked functional cable incorporating at least one segment where two insulated conductive wires are exposed and shorted together along the cable body. . An interlocked lead formed using the CIS system of any one of claims 1-11, and 18-21 having a plurality of insulated connection terminals along its proximal end. . An method of connecting to a certain position in the interlocked lead according to claim 105, comprising: a) Cuttings the interlocked lead at a certain position and using a tipping tool to insulate the lead cat proximal end; and b) Connecting to the interlocked lead with a mating connector that puncture the insulation layer covering the terminals. . An interlocked lead that comprises at least two of the following a resistor, contact, capacitor, inductor, complex element, electrophysiological contact, electrochemical sensing contact, shorted portions, and an electromechanical contact and has a diameter of 0.3mm that is formed using any of the systems of any of the claims 1-22 through any of the methods of claims 23-85, and claims 87-97.

110. A method of continuously coating a filament or at least one of: a strand, a rope, and a cable, each comprised of a plurality of wires or the filaments with an additive agent, implemented in the CIS system of any one of claims 1-11 or claims 18-22 comprising: a) providing a first earner or bobbin associated with a first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable b) positioning the at least one dispenser in a position configured to dispense the agent onto the first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable; c) dispensing the agent onto the first at least one of: the predetermined filament, the predetermined strand, and the predetermined cable.

111. The method of claim 110, wherein the additive agent is one of: an adhesive, a capacitive substance, or a mixed capacitive and conductive substance.

112. The method of claim 111, further comprising: using the at least additive dispenser, coating at least one of the plurality of the predetermined filaments with the adhesive.

113. The method of claim 112 wherein the additive is an insulating liquid, the method further comprising: a) providing a bobbin spooling a conductive non-insulatcd filament to a dispenser; b) using the at least additive dispenser, selectively coating at least a portion of the non-insulated conductive filament with the insulating liquid; and c) forming at least partially insulated filament portion.

114. The method of claim 111, wherein the at least additive dispenser is a co-extruder and the insulating liquid is a thermoplastic resin melt, wherein the co-extruder is operable to selectively extrude a sheath of the thermoplastic resin around the portion of the non-insulated conductive filament.