WO2024060772A1 - Touch apparatus, contact pin, three-dimensional forming device and printing control method - Google Patents

Touch apparatus, contact pin, three-dimensional forming device and printing control method Download PDF

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Publication number
WO2024060772A1
WO2024060772A1 PCT/CN2023/104583 CN2023104583W WO2024060772A1 WO 2024060772 A1 WO2024060772 A1 WO 2024060772A1 CN 2023104583 W CN2023104583 W CN 2023104583W WO 2024060772 A1 WO2024060772 A1 WO 2024060772A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
pressing member
contact pin
print head
leveling
Prior art date
Application number
PCT/CN2023/104583
Other languages
French (fr)
Chinese (zh)
Inventor
王敬杰
唐亮
周承立
Original Assignee
深圳市纵维立方科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市纵维立方科技有限公司 filed Critical 深圳市纵维立方科技有限公司
Publication of WO2024060772A1 publication Critical patent/WO2024060772A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245Platforms or substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/35Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • B29C64/393Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes

Definitions

  • the present invention relates to the technical field of 3D printing, and in particular to a touch device, a stylus, a three-dimensional molding equipment and a printing control method.
  • Three-dimensional molding equipment also known as three-dimensional printer (3DP) is an additive manufacturing technology.
  • the principle of three-dimensional molding equipment is to put data and raw materials into the three-dimensional molding equipment, and the guide device drives the print head to spray layer by layer according to the model contour to achieve three-dimensional printing.
  • the stable adhesion of the first layer of the model to the printing platform is the basis for successful subsequent printing.
  • the initial relative distance between the nozzle and the printing platform plays an important role in the formation of the first layer of the model.
  • a leveling device located on one side of the nozzle is usually used to detect the height of the printing platform.
  • a leveling device is connected to the printing nozzle, and the printing platform pushes the stylus up.
  • the upper end is in contact with the metal shrapnel, and the metal shrapnel is in contact with the probe point on the circuit board, forming a reflow circuit and generating a signal to obtain the height of the printing platform.
  • the height of the printing platform is obtained by the leveling device, it is necessary to compensate the actual position of the nozzle based on the height difference between the stylus and the nozzle.
  • embodiments of the present invention provide a touch device, a stylus, a three-dimensional molding equipment and a printing control method to solve the problem that the three-dimensional molding equipment cannot automatically level.
  • the present invention mainly provides the following technical solutions:
  • the present invention provides a touch device for use in three-dimensional molding equipment.
  • the touch device includes: a connecting device, a pressing member, a first conductive device and a second conductive device.
  • the pressing member cooperates with the connecting device to move relative to the connecting device driven by an external force; the first conductive device is connected to the connecting device; the second conductive device is connected to the pressing member, and the movement of the pressing member relative to the connecting device at least includes a conduction position and a disconnection position , in the on position, the second conductive device is in electrical contact with the first conductive device; in the off position, the second conductive device is out of electrical contact with the first conductive device.
  • the present invention provides a three-dimensional molding equipment, including the touch device or touch pin described in this application.
  • the present invention also provides a printing control method, which includes: controlling the nozzle of the print head assembly to push the pressing member to generate a detection signal; obtaining the first height information of the print head assembly according to the detection signal; and controlling the leveling device to sense The preset point of the molding platform to generate a leveling signal; wherein the static height of the pressing member is set to be the same as the height of the preset point; the second height information of the print head assembly is obtained according to the leveling signal; according to the first The height information and the second height information determine the offset of the nozzle relative to the leveling device; the printing height of the print head assembly is determined based on the offset.
  • the stylus, the touch device, the printing control method and the three-dimensional molding equipment proposed by the embodiments of the present invention are provided with a movable pressing member.
  • the electrical current between the first conductive device and the second conductive device is changed.
  • Sexual contact status, the nozzle height can be obtained for leveling.
  • a leveling signal is generated based on the leveling device contacting the preset point, the height of the leveling device is obtained, and then the offset between the nozzle and the leveling device is obtained.
  • the printing height of the nozzle is determined based on the offset to achieve automatic leveling.
  • errors will occur when the nozzle and leveling device are installed, resulting in the height difference between the stylus and the nozzle being unable to be accurately obtained. It is necessary to manually adjust the distance between the bottom of the nozzle and the upper surface of the printing platform before starting printing, and manually determine the distance between the nozzle and the printing platform.
  • the offset between the stylus heights prevents automatic leveling.
  • the touch device is connected to the three-dimensional molding equipment, and the top surface of the pressing member is in the same plane as the preset point on the upper surface of the forming platform of the three-dimensional molding equipment.
  • the nozzle is The bottom end of the leveling device pushes the pressing member.
  • the pressing member generates a detection signal
  • the first height information of the print head assembly is obtained, and then the bottom end of the leveling device contacts the preset point of the forming platform.
  • the leveling device When the leveling device generates a leveling signal
  • obtain the second height information of the print head assembly determine the offset of the nozzle relative to the leveling device based on the first height information and the second height information, and then perform leveling detection through the leveling device, based on the platform height information and offset
  • the printing height of the print head assembly is controlled quantitatively, eliminating the need to manually adjust the initial position of the nozzle and the printing platform to achieve automatic leveling.
  • Figure 1 is a schematic structural diagram of a first contact pin provided by an embodiment of the present invention
  • Figure 2 is a schematic structural diagram of a second contact pin provided by an embodiment of the present invention.
  • Figure 3 is a schematic structural diagram of a third contact pin provided by an embodiment of the present invention.
  • Figure 4 is a schematic three-dimensional structural diagram of a touch device provided by an embodiment of the present invention.
  • Figure 5 is a schematic cross-sectional structural diagram of a touch device provided by an embodiment of the present invention.
  • Figure 6 is a schematic diagram of the explosion structure of a touch device provided by an embodiment of the present invention.
  • Figure 7 is a schematic structural diagram of the second substrate and contact pins in a touch device provided by an embodiment of the present invention.
  • Figure 8 is a schematic structural diagram of a conductive member in a touch device provided by an embodiment of the present invention.
  • Figure 9 is a schematic structural diagram of another touch device provided by an embodiment of the present invention from a first perspective
  • Figure 10 is a schematic structural diagram of another touch device provided by an embodiment of the present invention from a second perspective;
  • Figure 11 is a schematic diagram of the explosion structure of another touch device provided by an embodiment of the present invention.
  • Figure 12 is a schematic cross-sectional structural diagram from a first perspective of another touch device provided by an embodiment of the present invention.
  • FIG13 is a schematic cross-sectional view of another touch device provided by an embodiment of the present invention at a second viewing angle
  • Figure 14 is a schematic cross-sectional structural diagram of yet another touch device provided by an embodiment of the present invention from a third perspective;
  • FIG15 is a schematic structural diagram of a stereoscopic molding device provided by an embodiment of the present invention at a first viewing angle
  • Figure 16 is a schematic structural diagram of a three-dimensional molding equipment provided by an embodiment of the present invention from a second perspective;
  • Figure 17 is a schematic structural diagram of a three-dimensional molding equipment provided by an embodiment of the present invention from a third perspective;
  • FIG18 is a partial enlarged structural schematic diagram of area A in the three-dimensional molding device shown in FIG17;
  • Figure 19 is a schematic structural diagram of a three-dimensional molding equipment provided by an embodiment of the present invention from a fourth perspective;
  • Figure 20 is a partially enlarged structural schematic diagram of area B in the three-dimensional molding equipment shown in Figure 19;
  • Figure 21 is a flow chart of a printing control method provided by an embodiment of the present invention.
  • an embodiment of the present invention provides a contact pin 100, which is used in a touch device 1000 for leveling.
  • the contact pin 100 is used to electrically contact the conductive part.
  • the contact pin 100 includes a main body 101 and an end. The end is provided at one axial end of the main body 101. The end includes an outer peripheral surface 110 and a vertex 120 located on the outer peripheral surface 110; the contact pin 100 communicates with the conductive portion through the vertex 120. point contact, To be electrically connected with the conductive part.
  • the cross-sectional area of the end head may gradually decrease in the direction approaching the vertex 120 .
  • the conductive part can be of various types depending on the application scenarios of the stylus 100.
  • the conductive part can be a gasket or a contact made of conductive material.
  • the stylus 100 is made of conductive material, such as copper or aluminum.
  • a voltage is applied to both ends of the conductive part and the contact pin 100 respectively.
  • the contact pin 100 contacts the conductive part through the vertex 120, the contact pin 100 and the conductive part are electrically connected to generate a current.
  • the contact pin 100 reaches the vertex 120 When separated from the conductive part, the current disappears.
  • the stylus 100 includes a main body 101 and an end.
  • the main body 101 plays a role of supporting and extending.
  • the main body 101 can be in various shapes.
  • the main body is cylindrical and includes both axial ends.
  • the cross-section of the main body 101 can be uniform in the axial direction, or as shown in Figures 1 to 3, the cross-sectional area of the main body 101 at one end connected to the end is larger than the cross-sectional area at the other end opposite to the end, ensuring that the end While the cross-sectional area is sufficient, the weight and space occupied of the main body 101 are reduced.
  • the end is disposed at one axial end of the main body 101.
  • the end in order to ensure that the contact pin 100 is evenly stressed, the end is coaxially disposed with the main body 101.
  • the tip is in point contact with the conductive part through the vertex 120, so that the tip can be separated from the conductive part when it is slightly away from the conductive part, and the tip area can be avoided to be too large to be between the conductive part and the conductive part.
  • the surface contact forms a capacitance, which prevents the contact pin 100 from having to move a certain distance before being electrically disconnected from the conductive part, so that the terminal can be electrically disconnected from the conductive part by physical separation.
  • the outer peripheral surface 110 is the outer surface of the end, and the end is surrounded by the outer peripheral surface 110, as shown in Figure 1.
  • the outer peripheral surface 110 can be a spherical surface, and the outer peripheral surface 110 is easy to process and has good stability; or, as shown in Figure 2,
  • the outer peripheral surface 110 is a tapered surface, which makes the points around the vertex 120 further away from the conductive part, increases the accuracy and strength of the contact pin 100, and avoids electrical connection between the points around the vertex and the conductive part; or, as shown in Figure 3
  • the outer peripheral surface 110 is a cone surface, with a plurality of depressions 130 distributed in the circumferential direction of the cone surface, and the depressions 130 extend to the apex 120 in the direction of the cone surface's generatrix, which further ensures the structural strength of the contact pin 100 while further making the top point 120 . Points around point 120 are further away from the conductive portion, making apex 120 more prominent and increasing the sensitivity of the stylus.
  • the embodiment of the present invention also provides a touch device 1000 for use in three-dimensional molding equipment.
  • the touch device 1000 includes a connection device 200, a pressing member 300, a first conductive device and a The second conductive device, wherein: the connection device 200, can be used to connect with the three-dimensional molding equipment, such as direct connection or indirect connection through other components.
  • the pressing member 300 cooperates with the connecting device 200 to move relative to the connecting device 200 driven by external force. Specifically, the pressing member 300 can be slidably connected with the connecting device 200.
  • the first conductive device is connected to the connecting device 200; the second conductive device is connected to the pressing member 300, and the pressing member 300 moves relative to the connecting device 200 including at least the conducting position and the disconnecting position.
  • the conducting position the second The conductive device is in electrical contact with the first conductive device.
  • the second conductive device is out of electrical contact with the first conductive device to generate a detection signal.
  • the triggering method of the off position is not limited, for example, the pressing member 300 is touched by the nozzle or the leveling device of the three-dimensional molding equipment to be in the off position.
  • the specific structure of the first conductive device and the second conductive device is not limited. For example, they can be two conductive sheets in contact with each other.
  • the embodiment of the present application is illustrated by taking one of the first conductive device and the second conductive device as a conductive member 400 and the other as a contact pin 100. If the conductive member 400 is connected to the connecting device 200, the contact pin 100 is connected to the pressing member 300, and if the conductive member 400 is connected to the pressing member 300, the contact pin 100 is connected to the connecting device 200.
  • the conductive member 400 is connected to the connection device 200 and the contact pin 100 is connected to the pressing member 300 for description, but this solution is not limited.
  • the structure of the sliding connection between the pressing member 300 and the connecting device 200 is not limited. Such as the structure of chute and slide rail, such as the structure of pulley and slide rail, etc.
  • the connecting device 200 is provided with a chute 210; the pressing member 300 is disposed in the chute 210. Give examples.
  • the conductive member 400 is connected to the connection device 200, and when the contact pin 100 is connected to the pressing member 300, the conductive member 400 can be used to electrically connect with the control device of the three-dimensional molding equipment.
  • the contact pin 100 is connected to the pressing member 300.
  • the pressing member 300 includes a conduction position and a disconnection position. In the conduction position, the contact pin 100 is in electrical contact with the conductive member 400 and is electrically conductive.
  • the pressing member 300 is When the nozzle or the leveling device of the three-dimensional molding equipment is touched to be in the disconnection position, the contact pin 100 is electrically disconnected from the conductive member 400 to generate a detection signal.
  • the contact pin 100 may be the aforementioned contact pin, and the conductive member 400 may be the aforementioned conductive part.
  • the pressing member 300 can be installed at multiple positions of the three-dimensional forming equipment, such as the base 40 or the guide frame 50 .
  • the pressing member 300 is connected to the forming platform 30 .
  • the chute 210 is a vertically extending groove with a top opening at the top of the connecting device 200.
  • the pressing member 300 includes an opposite top surface and a bottom end.
  • the pressing member 300 is movably connected to the chute 210 from the bottom end. The surface is located outside the top opening of the chute 210, and the bottom end of the pressing member 300 is spaced a certain distance from the bottom of the chute 210, so that the pressing member 300 can move in the vertical direction.
  • a tool with a flat surface such as a square metal plate or wooden board, can be used.
  • the flat surface of the tool contacts the upper surface of the forming platform 30 and the preset point, and at the same time, the top surface of the pressing member 300 contacts the flat surface of the tool to fix it.
  • the fact that the top surface and the preset point are in the same plane can be understood to mean that the top surface and the preset point are at the same height during printing.
  • the stylus 100 and the conductive member 400 When in use, voltage is applied to the stylus 100 and the conductive member 400 respectively, and the stylus 100 and the conductive member 400 are electrically connected to the control device of the three-dimensional molding equipment.
  • the pressing member 300 in the natural state will be in the conducting position, that is, the stylus 100 and the conductive member 400 are in contact and electrically connected, and a continuous current signal can be obtained.
  • the nozzle 10 drops to the top surface of the contact pressing member 300, it starts to push the pressing member 300 down, and the top 120 of the stylus 100 is separated from the conductive member 400, and the pressing member 300 changes from the conducting position to the disconnecting position, and the current signal stops.
  • the stop signal of the current signal is used as a detection signal, and the control device obtains the first height information of the print head assembly when the detection signal is obtained. Since the top surface and the preset point are in the same plane, and the displacement of the pressing member 300 from the on position to the off position is very small, the first height information can be regarded as the height of the print head assembly when the nozzle 10 touches the preset point, and then the leveling device can be used to sense the preset point, and the second height information of the print head assembly can be obtained according to the leveling signal generated by the leveling device, that is, the height of the print head assembly when the nozzle 10 and the leveling device touch the same point on the forming platform 30 is obtained respectively, and the offset of the nozzle 10 and the leveling device can be obtained by the difference between the first height information and the second height information.
  • the stylus 100 is in point contact with the conductive member 400, so that the displacement of the pressing member 300 from the on position to the off position is very small, and this displacement does not affect the success rate of the printed model.
  • the preset point is a point on the upper surface of the forming platform 30 close to the touch device 1000.
  • the preset point can be any point, or a detection point when the leveling device performs leveling detection.
  • the preset point can be a detection point closest to the touch device 1000 among the detection points of the leveling device, or a detection point with preset coordinates.
  • the leveling device can be a leveling device in various forms, such as the stylus-type leveling device mentioned in the background technology, or a distance sensor for long-distance measurement.
  • the disconnection position of the pressing member 300 refers to the position at which the contact pin 100 and the conductive member 400 change from electrical conduction to electrical disconnection. It is the critical position at the moment of electrical disconnection.
  • the pressing member 300 In addition to the on position and the off position, other positions may also be included, for example, the pressing member 300 may continue to move downward from the off position.
  • the leveling device can be controlled to sense a preset point to generate a detection signal, or the leveling device can be controlled to sense the pressing member 300 to generate a detection signal.
  • the method of controlling the leveling device to sense the preset point or the pressing member 300 may be contact sensing through probe touching or the like, or non-contact sensing through a sensor.
  • the stylus, the touch device, the printing control method and the three-dimensional molding equipment proposed by the embodiments of the present invention are provided with a movable pressing member.
  • the conduction between the conductive member and the stylus is changed. status, obtain the height of the nozzle, generate a leveling signal based on the leveling device contacting the preset point, obtain the height of the leveling device, and then obtain the offset between the nozzle and the leveling device, determine the printing height of the nozzle based on the offset, and achieve Automatic leveling.
  • errors will occur when the nozzle and leveling device are installed, resulting in the height difference between the stylus and the nozzle being unable to be accurately obtained.
  • the touch device is connected to the three-dimensional molding equipment, and the top surface of the pressing member is in the same plane as the preset point on the upper surface of the forming platform of the three-dimensional molding equipment.
  • the nozzle is The bottom end of the leveling device pushes the pressing member.
  • the pressing member generates a detection signal
  • the first height information of the print head assembly is obtained, and then the bottom end of the leveling device contacts the preset point of the forming platform.
  • the leveling device When the leveling device generates a leveling signal
  • obtain the second height information of the print head assembly determine the offset of the nozzle relative to the leveling device based on the first height information and the second height information, and then perform leveling detection through the leveling device, based on the platform height information and offset
  • the printing height of the print head assembly is controlled quantitatively, eliminating the need to manually adjust the initial position of the nozzle and the printing platform to achieve automatic leveling.
  • the touch device further includes a first elastic member 500 , which is in direct or indirect contact with the pressing member 300 .
  • the first elastic member 500 is used to push the pressing member 300 toward the pressing member 300 .
  • a force is applied to move the pressing member 300 from the off position to the on position.
  • the first elastic member 500 may be disposed between the pressing member 300 and the connecting device 200 .
  • the first elastic member 500 is disposed between the bottom of the pressing member 300 and the bottom of the sliding groove 210 .
  • the first elastic member 500 can be a variety of elastic components such as springs and foam.
  • the first elastic member 500 allows the pressing member 300 to remain in the guide position when the pressing member 300 is not pushed by the nozzle 10 or when the thrust of the nozzle 10 disappears. Pass location. In the conduction position, the elastic force of the first elastic member 500 and the pressure of the conductive member 400 on the contact pin 100 reach a force balance.
  • the first elastic member 500 also causes the contact pin 100 to squeeze the conductive member 400 to ensure that the conductive member 400 is in contact with the conductive member 400 .
  • the effect of current stabilization between contact pins 100 It's understandable, and it's okay Without the first elastic member 500 , there can be a certain friction force between the pressing member 300 and the connecting device 200 .
  • the user moves the pressing member 300 so that the contact pin 100 contacts the conductive member 400 to conduct electricity.
  • the pressing member 300 is not subject to external force. , it is sufficient to ensure that the contact pin 100 can still be in contact with the conductive member 400
  • At least one mounting hole 310 is provided at one end of the pressing member 300 relative to the bottom of the chute 210 .
  • One end of the first elastic member 500 is inserted into the mounting hole 310 .
  • the other end is connected to the groove wall of the chute 210 .
  • the number of mounting holes 310 may be two, and the two mounting holes 310 are distributed on both radial sides of the contact pin 100.
  • the springs can be movably inserted into the mounting holes 310, and one end is connected to the mounting hole 310.
  • the bottom surface of the hole 310 is in contact with the groove wall of the chute 210, and the other end is connected with the groove wall of the chute 210. It can be a fixed connection or abutment.
  • the other end of the spring is in contact with the bottom of the chute 210 to ensure that the spring position is stable and will not slide. position and easy to install.
  • the pressing member 300 includes a relief hole 320 .
  • the contact pin 100 is disposed in the pressing member 300 .
  • the contact pin 100 passes through the pressing member 300 , and the apex 120 of the contact pin 100 protrudes from the bottom wall of the relief hole 320 .
  • the conductive member 400 includes a first substrate 410 and a first conductive sheet 420.
  • the first substrate 410 is fixedly connected to the connection device 200.
  • the first substrate 410 is at least partially located in the relief hole 320.
  • the pressing member 300 can be relative to the third conductor through the relief hole 320.
  • a substrate 410 is movable, the first conductive sheet 420 is disposed on the first substrate 410 , and the first conductive sheet 420 is located in the relief hole 320 .
  • the contact pin 100 corresponds to the first conductive sheet 420 and is used for contacting or disengaging from the first conductive sheet 420 .
  • the relief hole 320 has an opening on at least one side of the pressing member 300.
  • the first substrate 410 has a plate-like structure.
  • the height of the relief hole 320 in the vertical direction is higher than the thickness of the first substrate 410, so that the first substrate 410 does not move, and the pressing member 300 can move up and down.
  • the pressing member 300 is processed with a through hole, which passes through the bottom end of the pressing member 300 and the relief hole 320.
  • the contact pin 100 is connected to the through hole and fixed with the pressing member 300.
  • the apex 120 of the contact pin 100 protrudes. on the side wall of the relief hole 320.
  • the contact pin 100 abuts the first conductive piece 420 on the first substrate 410, and the contact pin 100 is electrically connected with the first conductive piece 420.
  • the first substrate 410 moves within the relief hole 320 so that the contact pin 100 is electrically disconnected from the first conductive piece 420 .
  • the arrangement of the relief hole 320 makes the overall structure of the touch device 1000 compact, reducing the volume and weight of the pressing member 300, and the contact pin 100 is connected to the pressing member 300, making the contact pin 100 more stable and preventing the contact pin 100 from shaking.
  • the relief hole 320 may have various forms. In one embodiment, the relief hole 320 passes through the pressing member 300 , the first substrate 410 passes through the relief hole 320 , and both ends of the first substrate 410 are connected to The device 200 is fixedly connected so that the position of the first substrate 410 is stable and will not move due to the collision of the stylus 100, thus ensuring the sensitivity of the stylus 100.
  • the relief hole 320 passes through the pressing member 300 , the relief hole 320 is located in the slide groove 210 , the first base plate 410 passes through the relief hole 320 , and both ends of the first base plate 410 are in contact with the slide groove 210 respectively.
  • the inner wall of 210 is fixedly connected, making the touch device 1000 simple in appearance, and preventing the first conductive piece 420 and the contact pin 100 from being exposed to the environment for a long time and being susceptible to environmental pollution, such as failure by molten resin splashing.
  • the relief hole 320 is located in the chute 210.
  • the chute 210 includes a top opening.
  • the connecting device 200 is provided with a mounting notch 211 that passes through the top opening.
  • the first base plate 410 is fixedly connected to the mounting notch 211.
  • the relief hole 320 can pass through the pressing member 300 .
  • the relief hole 320 has openings on both sides of the pressing member 300 in the horizontal direction.
  • a screw hole is provided on the mounting notch 211.
  • two through holes 430 are provided on the first base plate 410.
  • Two fixing bolts 212 are inserted into the through holes 430 and connected to the screw holes, so that Both ends of the first base plate 410 are fixed to the installation notches 211 to facilitate installation and ensure the stability of the first base plate 410 .
  • the first conductive sheet 420 is worn for a long time, there is no need to remove the pressing member 300, and only the first substrate 410 is required to be disassembled, making disassembly and assembly easy.
  • the first conductive sheet 420 may be disposed at an intermediate position between the two through holes 430 .
  • the first conductive piece 420 can be arranged in a variety of ways, as long as it can be in contact with the contact pin 100 and electrically conductive. The following are three specific arrangements:
  • the first conductive sheet 420 is disposed on the surface of the first substrate 410 opposite to the contact pin 100 .
  • the vertex 120 of the contact pin 100 is used to make point contact with the first conductive sheet 420 .
  • the piece 420 slightly protrudes from the first substrate 410, and the point contact makes the stylus 100 more sensitive.
  • the first substrate 410 is provided with a groove on one side relative to the contact pin 100.
  • the first conductive piece 420 is provided on the groove wall and extends to the opening edge of the groove.
  • the outer peripheral surface 110 of the contact pin 100 The size is larger than the size of the groove, the vertex 120 of the contact pin 100 is used to extend into the groove, and the outer peripheral surface 110 of the contact pin 100 is used to make line contact with the first conductive sheet 420 .
  • the apex 120 of the contact pin 100 is not in contact with the groove, and only the outer peripheral surface 110 is in contact with the opening edge of the groove, so that the outer peripheral surface 110 is in line contact with the first conductive sheet 420. Compared with point contact, the stability of line contact is stronger. , if the contact pin 100 is tilted or the position of the pressing member 300 is tilted, the electrical connection between the contact pin 100 and the first conductive piece 420 can still be ensured, and the opening edge of the groove serves to limit the radial limit of the contact pin 100. Prevent the stylus 100 from shaking.
  • the first substrate 410 is provided with a through hole 411, and the first conductive sheet 420 is provided on the wall of the through hole 411 and extends to the opening of the side of the through hole 411 relative to the contact pin 100.
  • the size of the edge and outer peripheral surface 110 is larger than the size of the groove.
  • the vertex 120 of the contact pin 100 is used to extend into the through hole 411 , and the outer peripheral surface 110 of the contact pin 100 is used to make line contact with the first conductive sheet 420 .
  • the through hole 411 replaces the groove to prevent the apex 120 of the contact pin 100 from touching the bottom of the groove. It can be understood that the inner diameter of the through hole 411 should be smaller than the maximum outer diameter of the end of the contact pin 100 .
  • the touch device further includes a second substrate 140 , a second conductive sheet 150 is provided on the second substrate 140 , and the contact pin 100 is connected by a second end opposite to the outer peripheral surface 110 .
  • Second basis The board 140 is connected, and the second end is electrically connected to the second conductive sheet 150 .
  • the second substrate 140 is connected to the pressing member 300 .
  • the second substrate 140 is used to electrically connect to the control device of the three-dimensional molding equipment, so that the contact pin 100 is electrically connected to the control device of the three-dimensional molding equipment through the second conductive sheet 150 and the second substrate 140 . sexual connection.
  • the second substrate 140 can be connected to the bottom surface of the pressing member 300 through bolts, and the second end surface of the contact pin 100 is electrically connected to the second conductive piece 150 of the second substrate 140.
  • the second substrate 140 is provided with There is a mounting hole, the second conductive sheet 150 is arranged on the hole wall of the mounting hole, the contact pin 100 passes through the mounting hole from the second end surface, and the side wall of the contact pin 100 is electrically connected to the second conductive sheet 150 to increase the The contact pin 100 and the second conductive piece 150 are connected for the purpose of strength and stability.
  • the top end of the pressing member 300 includes a heat insulating member 600 , and the heat insulating member 600 is used to contact the nozzle 10 .
  • the pressing member 300 is provided with a plug hole extending vertically downward, and the heat insulating member 600 includes a heat insulating top surface and a plug connector located at one end of the heat insulating top surface.
  • the plug connector of the heat insulating member 600 is inserted into the plug hole, so that the heat insulating member 600 is connected to the pressing member 300.
  • the heat insulating top surface is made of a heat insulating material, such as rubber.
  • the heat insulating top surface prevents the high-temperature nozzle 10 from directly contacting the part of the pressing member 300 that is not resistant to high temperatures, and prevents the local melting of the pressing member 300 from affecting the signal change position, thereby avoiding affecting the sensitivity.
  • the top surface of the pressing member 300 refers to the top surface of the heat insulating member 600, that is, the top surface of the heat insulating member 600 and the preset point position on the forming platform 30 are in the same plane.
  • the touch device further includes a position adjustment component.
  • the connection state between the position adjustment component and the connection device 200 includes a first connection state and a second connection state.
  • the position adjustment component cooperates with the connection device 200 so that the connection device 200 moves relative to the position adjustment component when driven by an external force; in the second connection state, the connection device 200 is fixed relative to the position adjustment component.
  • the position adjustment component is used to adjust and fix the height of the connection device 200.
  • the position adjustment assembly includes a housing 700, a first fixing part 800 and a second fixing part 900.
  • the housing 700 is used to connect with the three-dimensional molding equipment, and the connecting device 200 is movably connected to the housing 700.
  • the first fixing part 800 is used to connect with the pressing part 300 and the connecting device 200 to fix or loosen the relative position of the pressing part 300 and the connecting device 200 .
  • the second fixing part 900 is used to connect the connecting device 200 and the housing 700 to fix or loosen the relative positions of the connecting device 200 and the housing 700 so that the top surface of the pressing part 300 is connected to the top surface of the forming platform 30 of the three-dimensional forming equipment.
  • the preset points on the surface are in the same plane.
  • the first fixing part 800 is used to fix the pressing part 300 in the conductive position.
  • a position adjustment component is provided to adjust the position of the top surface of the pressing member 300 .
  • a tool with a flat surface such as a flat plate
  • the position adjustment component makes the position fixing of the connecting device 200 more accurate and convenient, and avoids the problem of inaccurate position of the connecting device 200 and inaccurate top surface height of the pressing member 300 if the connecting device 200 is directly bolted to the three-dimensional molding equipment.
  • a slide groove 210 is provided on the connecting device 200 ; the pressing member 300 is disposed in the slide groove 210 ; the connecting device 200 is located in the shell 700 , and the pressing member 300 passes through the shell 700 and is partially exposed outside the shell 700 .
  • the connecting device 200 is provided with a first fixing screw hole 220 , and the first fixing through hole 220 passes through the outer wall of the connecting device 200 , that is, through the outer surface of the connecting device 200 and the chute 210 .
  • the first fixing member 800 is a first bolt. The first bolt is used to be screwed to the first fixing screw hole 220 . The end of the first bolt is used to squeeze the pressing member 300 to fix the pressing member 300 .
  • the touch device 1000 may also include a first gasket 810.
  • the pressing member 300 is provided with an installation groove corresponding to the first fixing screw hole 220.
  • the first gasket 810 is embedded in the installation groove, and the first bolt is extruded through the first gasket 810.
  • the pressing member 300 is used to avoid directly pressing the pressing member 300 and causing wear of the pressing member 300 .
  • the first bolt adjustment operation is simple, does not increase the structural complexity of the pressing part 300, and facilitates processing.
  • the housing 700 includes an inner cavity, a detection opening 710 and a fixation opening 720 that are connected to the inner cavity.
  • the connecting device 200 is located in the inner cavity and can move in the inner cavity.
  • the pressing member 300 extends out of the inner cavity through the detection opening 710.
  • the fixing member relief opening 720 is a long through hole, and the adjustment head of the first fixing member 800 is located in the fixing member relief opening 720.
  • the connecting device 200 is in sliding contact with the side wall of the inner cavity, so that the connecting device 200 is stable without shaking when moving relative to the housing 700.
  • the fixing member relief opening 720 is a long through hole extending in the vertical direction.
  • the first bolt The nut of the first bolt is located in the fixing part relief opening 720.
  • the fixing member relief opening 720 can also be used as a guide rail for the movement of the nut of the first bolt, thereby guiding the movement of the connecting device 200 .
  • the housing 700 is provided with a second fixing screw hole 730 that penetrates the outer wall of the housing 700 , that is, penetrates the outer surface of the housing 700 and the inner wall of the inner cavity.
  • pieces 900 denotes a second bolt.
  • the second bolt is used to be screwed to the second fixing screw hole 730 .
  • the end of the second bolt is used to squeeze the connecting device 200 to fix the connecting device 200 .
  • the touch device 1000 also includes a second gasket 910.
  • the connection device 200 is provided with an installation groove corresponding to the second fixing screw hole 730.
  • the second gasket 910 is embedded in the installation groove, and the second bolt is extruded and connected through the second gasket 910.
  • the device 200 avoids directly squeezing the connection device 200 to cause wear of the connection device 200 .
  • the second bolt has the same fixing principle as the first bolt.
  • the position adjustment assembly 700 further includes a second elastic component 740.
  • the second elastic component 740 is disposed between the connecting device 200 and the housing 700.
  • the second elastic component 740 is used to apply the connecting device 200 to the connecting device 200. 200 moves toward the detection opening 710.
  • the bottom end of the connecting device 200 is separated from the bottom surface of the inner cavity by an end distance.
  • the second elastic component 740 allows the connecting device 200 to be in a position of contact with the top surface of the inner cavity when it is not fixed by the second bolt, that is, the connecting device 200 When not fixed by the second bolt, the position of the top surface of the pressing member 300 is the highest position.
  • the top surface of the pressing member 300 is squeezed by the tool, the pressing member 300 and the connecting device 200 move downward in the inner cavity at the same time, and the second elastic component 740 is compressed.
  • the pressure on the top surface of the pressing member 300 is released, and under the elastic force of the second elastic component 740, the pressing member 300 and the connecting device 200 move upward to the highest position at the same time.
  • the second elastic component 740 allows the positions of the pressing member 300 and the connecting device 200 to be repeatedly adjusted, and allows the top surface of the pressing member 300 to be pressed against the plane of the tool, so that the top surface of the pressing member 300 is accurately positioned.
  • the bottom end of the connecting device 200 is provided with at least one positioning post 230.
  • the housing includes a positioning post relief hole 750 corresponding to the positioning post 230.
  • the second elastic component One end of the second elastic member 740 is connected to the positioning post 230, and the other end of the second elastic member 740 is in contact with the housing 700.
  • the positioning post 230 is movably inserted into the positioning post relief hole 750.
  • the second elastic component 740 is sleeved on the positioning post 230 , and the size of the second elastic component 740 is larger than the size of the positioning post relief hole 750 .
  • the second elastic component 740 is a spring
  • the second elastic component 740 is sleeved on the positioning post 230.
  • the number of the positioning post 230 and the positioning post relief hole 750 is two.
  • the connecting device 200 moves downward, the positioning post 230 Inserted into the positioning post relief hole 750, on the one hand, it guides the moving direction of the connecting device 200 to prevent the connecting device 200 from shaking; on the other hand, it limits the second elastic member 740 to prevent the second elastic member 740 from shaking and slipping.
  • the housing 700 includes a shell 760 and a bottom plate 770.
  • the shell 760 is a cavity structure.
  • the shell 760 includes a bottom opening.
  • the shell 760 is connected to the bottom plate 770 through the bottom opening to form an inner cavity.
  • the detection opening 710 Set on the housing 760.
  • the bottom plate 770 is provided with a positioning protrusion 751.
  • the positioning protrusion 751 is used to insert into the housing 760 from the bottom opening and abut against the inner wall of the housing 760.
  • the housing 760 is used to connect with the three-dimensional forming equipment.
  • the housing 760 is provided with a connecting head 761, which extends in a direction perpendicular to the movement of the pressing member 300.
  • the connecting head 761 is used to connect with the lower surface of the forming platform 30 of the three-dimensional forming equipment.
  • an embodiment of the present invention also provides a three-dimensional molding equipment, including the aforementioned touch device 1000 or stylus 100.
  • the three-dimensional molding equipment may also include other components, which are not limited in this application.
  • the three-dimensional forming equipment may also include a base 40 , a guide mechanism 50 , a print head assembly, a forming platform 30 and a leveling device 20 .
  • the print head assembly includes a nozzle 10 .
  • the print head assembly and the forming platform 30 are respectively connected to the base 40 through the guide mechanism 50.
  • the touching device 1000 is connected to the forming platform 30.
  • the top surface of the touching device 1000 is in the same plane as the preset point of the forming platform 30.
  • the leveling device 20 is connected to the print head assembly.
  • the leveling device 20 is used to sense a preset point or the pressing member 300 of the touch device 1000 to generate a leveling signal.
  • the nozzle 10 is used to push the pressing member 300 .
  • the guide mechanism 50 includes an X-axis guide frame, a Y-axis guide frame and a Z-axis guide frame.
  • the forming platform 30 is installed on the base 40 through the Y-axis guide frame.
  • the Z-axis guide frame is installed on both sides of the forming platform 30.
  • the end is slidingly connected to the Z-axis guide frame, and the print head assembly is connected to the X-axis guide frame.
  • the print head assembly is set up above the forming platform 30 through the X-axis guide frame and the Z-axis guide frame, and the nozzle 10 is opposite to the forming platform 30 .
  • the guide mechanism 50 drives the nozzle 10 and the forming platform 30 to move relative to each other, so that the nozzle 10 sprays printing consumables layer by layer on the forming platform 30 .
  • the guide mechanism 50 is used to drive the print head assembly to move, so that the nozzle 10 touches the touch device 1000, and drives the leveling device 20 to sense the preset point or the touch device 1000, so as to realize the adjustment of the nozzle 10 and the touch device 1000. Obtaining the offset between flat devices 20.
  • the guide mechanism 50 is also used to drive the print head assembly to move, so that the leveling device 20 senses the detection point, and then performs leveling detection of the forming platform 30 to obtain height information on the surface of the forming platform 30 .
  • the specific implementation method will be explained in detail later.
  • the connection between the touch device 1000 and the forming platform 30 can be a direct connection or an indirect connection.
  • the touch device 1000 is connected to the base 40 or the guide mechanism 50.
  • the touch device 1000 will not follow the forming process.
  • the platform 30 moves.
  • the forming platform 30 is controlled to move to the leveling position and correspond to the touch device 1000 .
  • the specific structure of the leveling device 20 can be various.
  • the leveling device 20 is a non-contact leveling.
  • the leveling device 20 is a sensor provided on the print head assembly.
  • the sensor can be a remote inductive distance sensor.
  • the device senses a preset point or the position of the sensing pressing member 300 to generate a leveling signal, for example, a leveling signal is generated at a distance of 5 mm from the preset point or the top of the sensing pressing member 300 .
  • the leveling device 20 is a contact leveling device.
  • the contact leveling device 20 mainly includes a fixing part, a detecting part, a sensing device and a driving device for moving the detecting part.
  • the detecting part includes a detection position and a storage position, and a driving device. It is connected with the fixing part and the detecting part.
  • the driving part is used to drive the detecting part to move in the vertical direction to switch between the storage position and the detecting position.
  • the sensing device is fixedly connected to the fixing part.
  • the detecting part can be a leveling device that is movably connected to the fixing part. probe.
  • the guide mechanism 50 drives the print head assembly to move downward, so that the detection part contacts the leveling detection point, and the print head assembly continues to move downward, so that the detection part moves relative to the fixed part under the push of the forming platform 30.
  • the control device obtains the actual height of the print head assembly when the leveling signal is generated, that is, the height of the print head assembly relative to the zero point at this time.
  • Multiple detection points are evenly arranged on the forming platform 30 , and the above-mentioned leveling detection process is performed on each detection point to obtain platform height information of a plane parallel to the forming platform 30 .
  • the printing height of the print head assembly is adjusted according to the height information of the printing platform surface and the offset between the nozzle 10 and the leveling device 20 to ensure that the nozzle 10 of the print head and the upper surface of the forming platform 30 are always maintained. Always height to achieve automatic leveling.
  • the three-dimensional forming equipment further includes a cleaning assembly 60 connected to the forming platform 30 for cleaning the bottom end of the nozzle 10 before using the touching device 1000 .
  • the print head assembly will be heated, or The print head assembly and the forming platform 30 are heated simultaneously. After the print head assembly is printed once, there will be printing filament residue in the nozzle 10 and the throat connected to the nozzle 10. When the print head assembly is reheated, the remaining printing filament will melt by heat and overflow to the outside of the nozzle 10 under the action of gravity. , if the consumables are agglomerated at the bottom opening of the nozzle 10, the nozzle 10 cannot be directly touched.
  • the cleaning assembly 60 includes a bracket 61 and a brush 62.
  • One end of the bracket 61 is connected to the forming platform 30.
  • the other end of the bracket 61 extends and is suspended in a direction away from the forming platform 30.
  • the brush 62 is fixed on the bracket. 61 on the hanging end.
  • the guide mechanism 50 drives the print head assembly to move so that the nozzle 10 is opposite to the brush 62, moves the print head assembly downward so that the bottom end of the nozzle 10 contacts the brush 62, and moves the nozzle 10 repeatedly to clean the nozzle 10.
  • the brush 62 can also be other cleaning parts, such as foam.
  • an embodiment of the present invention also provides a printing control method, which is implemented using any of the aforementioned three-dimensional molding equipment, including:
  • controlling the nozzle of the print head assembly to push the pressing member to generate a detection signal includes:
  • the electrical signal passes through the first conductive device and the second conductive device, and its state is the first signal. If the first conductive device and the second conductive device are out of electrical contact, the electrical signal cannot pass through the first conductive device and the second conductive device. Then the signal will change, and the three-dimensional molding equipment can be considered to have generated a detection signal.
  • the print head assembly is controlled to move so that the bottom end of the nozzle pushes the pressing member to generate the inspection Before measuring the signal, you can include:
  • the control device of the three-dimensional molding equipment When detecting that the contact pin 100 and the conductive member 400 are electrically disconnected, that is, out of electrical contact, the control device of the three-dimensional molding equipment obtains the actual height of the print head assembly, that is, the height of the print head assembly relative to the zero point at this time, as the third A height information h1.
  • obtaining the first height information of the print head assembly according to the detection signal may include:
  • the position coordinates of the print head assembly and the molding platform are determined.
  • the detection signal is generated, the current coordinates of the print head assembly can be obtained.
  • the height coordinate of the current coordinate corresponding to the detection signal is the printing The first height information of the header component.
  • S13 Control the leveling device to sense the preset point of the forming platform to generate a leveling signal, where the static height of the pressing member is set to be the same as the height of the preset point.
  • Printhead assembly movement can be controlled so that the leveling device moves synchronously with the printhead assembly.
  • the static height is the height before the pressing member is pushed.
  • the static height of the pressing member is set to be the same as the height of the preset point, so that the leveling accuracy can be as high as possible.
  • the preset point is a point on the forming platform 30 close to the touch device 1000.
  • the preset point is the point closest to the touch device 1000 among the points 5 mm away from the edge of the side of the forming platform 30 relative to the touch device 1000.
  • the preset point can also be the point closest to the touch device 1000 among the leveling detection points. For example, if 16 monitoring points are evenly distributed on the forming platform 30, the point closest to the touch device 1000 is selected as the preset point.
  • the process of controlling the movement of the print head assembly so that the leveling device 20 senses the preset point of the forming platform can be regarded as a leveling detection point. During the leveling detection process, the leveling device 20 senses a preset point and generates a leveling signal.
  • the leveling device 20 may also be configured to sense the pressing member and generate a leveling signal.
  • controlling the leveling device to sense the preset point position of the forming platform to generate a leveling signal may include:
  • the signal from the leveling device will change.
  • the three-dimensional molding equipment can adjust the signal according to the signal from the leveling device. A change has occurred, confirm that the control leveling device senses the preset point of the forming platform.
  • the control device of the three-dimensional molding equipment obtains the actual height of the print head assembly when the leveling signal is generated, that is, the height of the print head assembly relative to the zero point at this time, and then obtains the second height information h2.
  • obtaining the second height information of the print head assembly according to the leveling signal may include:
  • the current coordinates of the print head assembly are obtained according to the leveling signal; and the second height information of the print head assembly is obtained according to the current coordinates corresponding to the leveling signal.
  • the position coordinates of the print head assembly and the molding platform are determined.
  • the leveling signal is obtained, the current coordinates of the print head assembly can be obtained, and the height coordinates of the current coordinates corresponding to the leveling signal are obtained. That is the second height information of the print head assembly.
  • S15 Determine the offset of the nozzle relative to the leveling device based on the first height information and the second height information.
  • the contact pin 100 will move downward for a certain distance to separate from the conductive member 400. This distance is called the separation distance b.
  • the separation distance b is usually very small and can be ignored in the calculation of the offset.
  • the breakaway distance b can be measured experimentally to increase the leveling accuracy, and the actual offset can be the first
  • Printing height is the height of the print head during printing. When printing each layer of the model, the printing height of each layer is different. Determine the printing height of the print head assembly based on the offset, that is, print the model based on the offset.
  • the printing height of the print head assembly is determined based on the offset, including:
  • leveling detection of the forming platform 30 is performed, specifically by controlling the movement of the print head assembly so that the leveling device 20 senses multiple detection points on the forming platform 30 and generates a plane parallel to the forming platform 30 platform height information. If multiple coordinates are preset, for example, 16 coordinates are preset, that is, corresponding to 16 leveling detection points of the forming platform 30.
  • the guide mechanism 50 drives the print head assembly to move downward, so that the leveling device 20 Sense the leveling detection point, generate a leveling signal, obtain the actual height of the print head assembly according to the leveling signal, and then control the device to obtain the actual height of the print head assembly at each detection point, that is, obtain a plane parallel to the surface of the forming platform 30 height information.
  • the print height of the printhead assembly based on the offset and platform height information.
  • the actual height of the print head assembly at a detection point is d
  • the thickness of the first layer of the model is L.
  • the thickness L is a preset value.
  • the first height information is obtained by pushing the pressing member through the nozzle to generate a detection signal
  • the second height information is obtained by sensing the preset point of the forming platform through the leveling device to generate a leveling signal. According to The first height information and the second height information determine the position of the nozzle relative to the leveling device.
  • Offset realize the automatic acquisition of the offset of the nozzle relative to the leveling device, and then perform leveling detection through the leveling device, and control the printing height of the print head assembly according to the platform height information and offset, so that the bottom of the nozzle is in line with the molding
  • the distance between the platforms is accurate and does not change during the printing process, allowing the model to be accurately formed, eliminating the need to manually adjust the initial position of the nozzle and the printing platform, and achieving automatic leveling.
  • the method before controlling the leveling device to move from the detection position to the storage position, the method further includes:
  • the nozzle 10 and the forming platform 30 When the nozzle 10 and the forming platform 30 are heated, thermal expansion and contraction will occur, causing the position of the bottom of the nozzle 10 and/or the position and shape of the top surface of the forming platform 30 to change. For example, the bottom of the nozzle 10 will become lower.
  • Detecting the offset and heating the forming platform 30 and/or the print head assembly can make the detection environment of the forming platform 30 and the print head assembly close to the working environment during the actual printing process, making the offset detection and leveling detection more accurate. Accurate, ensuring that the position of the print head assembly is more accurate during the printing process.
  • the print head assembly is controlled to move so that the bottom end of the nozzle contacts the cleaning assembly, and the print head assembly is controlled to move repeatedly within a preset area corresponding to the cleaning assembly.
  • an embodiment of the present invention also provides a storage medium on which a computer program is stored.
  • the computer program is executed by a processor, the above printing control method shown in Figure 21 is implemented.
  • the technical solution of this application can be embodied in the form of a software product.
  • the software product can be stored in a non-volatile storage medium, which can be a CD-ROM, U disk, mobile hard disk, etc., and includes a number of instructions. So that a computer device can be a personal computer, a server, or a network device, etc. to execute the methods of each implementation scenario of the present application.
  • Embodiments of the present application also provide a three-dimensional molding device, which includes a storage medium and a processor; the storage medium is used to store a computer program; and the processor is used to execute the computer program to implement the above as shown in Figure 21 Print control methods.
  • the three-dimensional forming device can also include a user interface, a network interface, a camera, a Radio Frequency, an RF circuit, a sensor, an audio circuit, a WI-FI module, etc.
  • the user interface may include a display screen, an input unit such as a keyboard, etc.
  • the optional user interface may also include a USB interface, a card reader interface, etc.
  • Optional network interfaces can include standard wired interfaces, wireless interfaces such as Bluetooth interfaces, WI-FI interfaces, etc.
  • a three-dimensional molding device does not constitute a limitation on the three-dimensional molding device. It may include more or fewer components, or combine certain components, or arrange different components. .
  • the storage medium may also include an operating system and a network communication module.
  • An operating system is a program that manages and saves the hardware and software resources of a computer device and supports the operation of information processing programs and other software and/or programs.
  • the network communication module is used to implement communication between components within the storage medium, as well as communication with other hardware and software in the physical device.

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Abstract

Disclosed in the present invention is a touch apparatus, a contact pin, a three-dimensional forming device and a printing control method. A pressing piece is pushed by means of a nozzle, such that the conduction state of a conductive piece and the contact pin is changed, the height of the nozzle is obtained, so as to obtain the offset of the nozzle and a leveling apparatus, and thereby achieving automatic leveling.

Description

触碰装置、触针、立体成型设备及打印控制方法Touch device, stylus, three-dimensional molding equipment and printing control method 技术领域Technical field
本发明涉及3D打印技术领域,尤其涉及触碰装置、触针、立体成型设备及打印控制方法。The present invention relates to the technical field of 3D printing, and in particular to a touch device, a stylus, a three-dimensional molding equipment and a printing control method.
背景技术Background technique
立体成型设备又称三维打印机(3DP),是一种累积制造技术。立体成型设备的原理是把数据和原料放进立体成型设备中,导向装置驱动打印头根据模型轮廓逐层喷涂实现立体打印。模型第一层稳定的粘附在打印平台上,是后续打印成功的基础,喷嘴和打印平台的初始相对距离对模型第一层的形成具有重要作用。Three-dimensional molding equipment, also known as three-dimensional printer (3DP), is an additive manufacturing technology. The principle of three-dimensional molding equipment is to put data and raw materials into the three-dimensional molding equipment, and the guide device drives the print head to spray layer by layer according to the model contour to achieve three-dimensional printing. The stable adhesion of the first layer of the model to the printing platform is the basis for successful subsequent printing. The initial relative distance between the nozzle and the printing platform plays an important role in the formation of the first layer of the model.
现有技术中,通常采用位于喷嘴一侧的调平装置进行打印平台高度的检测,如公开号为CN216127742U的专利中,在打印喷头上连接调平装置,打印平台推动触针上升,触针的上端与金属弹片接触,金属弹片与电路板上的探点接触,形成回流电路,生成信号,以获取打印平台的高度。但由于打印平台的高度是由调平装置获取的,这就需要根据触针与喷嘴的高度差对喷嘴的实际位置进行补偿,然而喷嘴与调平装置安装时会产生误差,导致触针与喷嘴的高度差无法准确获取,且不同的立体成型设备的调平装置距离喷嘴的高度差可能不同,需要在打印开始前手动调整喷嘴底端与打印平台上表面的距离,人为确定喷嘴与触针高度之间的偏移量,导致无法实现自动调平。 In the prior art, a leveling device located on one side of the nozzle is usually used to detect the height of the printing platform. For example, in the patent with publication number CN216127742U, a leveling device is connected to the printing nozzle, and the printing platform pushes the stylus up. The upper end is in contact with the metal shrapnel, and the metal shrapnel is in contact with the probe point on the circuit board, forming a reflow circuit and generating a signal to obtain the height of the printing platform. However, since the height of the printing platform is obtained by the leveling device, it is necessary to compensate the actual position of the nozzle based on the height difference between the stylus and the nozzle. However, errors will occur during the installation of the nozzle and the leveling device, causing the stylus and the nozzle to The height difference cannot be accurately obtained, and the height difference between the leveling device and the nozzle of different three-dimensional molding equipment may be different. It is necessary to manually adjust the distance between the bottom of the nozzle and the upper surface of the printing platform before starting printing, and manually determine the height of the nozzle and stylus. The offset between them makes it impossible to achieve automatic leveling.
发明内容Contents of the invention
有鉴于此,本发明实施例提供触碰装置、触针、立体成型设备及打印控制方法,解决立体成型设备无法自动调平的问题。In view of this, embodiments of the present invention provide a touch device, a stylus, a three-dimensional molding equipment and a printing control method to solve the problem that the three-dimensional molding equipment cannot automatically level.
为达到上述目的,本发明主要提供如下技术方案:In order to achieve the above objectives, the present invention mainly provides the following technical solutions:
一方面,本发明提供一种触碰装置,应用于立体成型设备,触碰装置包括:连接装置、按压件、第一导电装置及第二导电装置。按压件与连接装置配合,以在外力驱动下相对连接装置移动;第一导电装置与连接装置连接;第二导电装置与按压件连接,按压件相对连接装置移动至少包括导通位置和断开位置,导通位置时,第二导电装置与第一导电装置电性接触;断开位置时,第二导电装置与第一导电装置脱离电性接触。On the one hand, the present invention provides a touch device for use in three-dimensional molding equipment. The touch device includes: a connecting device, a pressing member, a first conductive device and a second conductive device. The pressing member cooperates with the connecting device to move relative to the connecting device driven by an external force; the first conductive device is connected to the connecting device; the second conductive device is connected to the pressing member, and the movement of the pressing member relative to the connecting device at least includes a conduction position and a disconnection position , in the on position, the second conductive device is in electrical contact with the first conductive device; in the off position, the second conductive device is out of electrical contact with the first conductive device.
再一方面,本发明提供一种立体成型设备,包括本申请叙述的触碰装置,或触针。In another aspect, the present invention provides a three-dimensional molding equipment, including the touch device or touch pin described in this application.
又一方面,本发明还提供一种打印控制方法,包括:控制打印头组件的喷嘴推动按压件,以生成检测信号;根据检测信号获取打印头组件的第一高度信息;控制调平装置感测成型平台的预设点位,以生成调平信号;其中,按压件的静态高度被设置为与预设点位的高度相同;根据调平信号获取打印头组件的第二高度信息;根据第一高度信息和第二高度信息确定喷嘴相对调平装置的偏移量;根据偏移量确定打印头组件的打印高度。In another aspect, the present invention also provides a printing control method, which includes: controlling the nozzle of the print head assembly to push the pressing member to generate a detection signal; obtaining the first height information of the print head assembly according to the detection signal; and controlling the leveling device to sense The preset point of the molding platform to generate a leveling signal; wherein the static height of the pressing member is set to be the same as the height of the preset point; the second height information of the print head assembly is obtained according to the leveling signal; according to the first The height information and the second height information determine the offset of the nozzle relative to the leveling device; the printing height of the print head assembly is determined based on the offset.
本发明实施例提出的触针、触碰装置、打印控制方法及立体成型设备,通过设置可活动的按压件,当喷嘴底端推动按压件时,改变第一导电装置与第二导电装置的电性接触状态,可以获取喷嘴高度,以进行调平。The stylus, the touch device, the printing control method and the three-dimensional molding equipment proposed by the embodiments of the present invention are provided with a movable pressing member. When the bottom end of the nozzle pushes the pressing member, the electrical current between the first conductive device and the second conductive device is changed. Sexual contact status, the nozzle height can be obtained for leveling.
根据调平装置接触预设点位生成调平信号,获取调平装置的高度,继而得到喷嘴与调平装置的偏移量,根据偏移量确定喷嘴的打印高度,实现自动调平。 现有技术中,喷嘴与调平装置安装时会产生误差,导致触针与喷嘴的高度差无法准确获取,需要在打印开始前手动调整喷嘴底端与打印平台上表面的距离,人为确定喷嘴与触针高度之间的偏移量,导致无法实现自动调平。与现有技术相比,本申请文件中,触碰装置与立体成型设备连接,且按压件的顶面与立体成型设备的成形平台的上表面的预设点位处于同一平面内,先使喷嘴的底端推动按压件,当按压件生成检测信号时,获取打印头组件的第一高度信息,再使调平装置的底端接触成形平台的预设点位,当调平装置生成调平信号时,获取打印头组件的第二高度信息,根据第一高度信息和第二高度信息确定喷嘴相对调平装置的偏移量,而后通过调平装置进行调平检测,根据平台高度信息和偏移量控制打印头组件的打印高度,实现无需手动调整喷嘴与打印平台的初始位置,实现自动调平。A leveling signal is generated based on the leveling device contacting the preset point, the height of the leveling device is obtained, and then the offset between the nozzle and the leveling device is obtained. The printing height of the nozzle is determined based on the offset to achieve automatic leveling. In the existing technology, errors will occur when the nozzle and leveling device are installed, resulting in the height difference between the stylus and the nozzle being unable to be accurately obtained. It is necessary to manually adjust the distance between the bottom of the nozzle and the upper surface of the printing platform before starting printing, and manually determine the distance between the nozzle and the printing platform. The offset between the stylus heights prevents automatic leveling. Compared with the prior art, in this application document, the touch device is connected to the three-dimensional molding equipment, and the top surface of the pressing member is in the same plane as the preset point on the upper surface of the forming platform of the three-dimensional molding equipment. First, the nozzle is The bottom end of the leveling device pushes the pressing member. When the pressing member generates a detection signal, the first height information of the print head assembly is obtained, and then the bottom end of the leveling device contacts the preset point of the forming platform. When the leveling device generates a leveling signal When, obtain the second height information of the print head assembly, determine the offset of the nozzle relative to the leveling device based on the first height information and the second height information, and then perform leveling detection through the leveling device, based on the platform height information and offset The printing height of the print head assembly is controlled quantitatively, eliminating the need to manually adjust the initial position of the nozzle and the printing platform to achieve automatic leveling.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明实施例提供的第一种触针的结构示意图;Figure 1 is a schematic structural diagram of a first contact pin provided by an embodiment of the present invention;
图2为本发明实施例提供的第二种触针的结构示意图;Figure 2 is a schematic structural diagram of a second contact pin provided by an embodiment of the present invention;
图3为本发明实施例提供的第三种触针的结构示意图;Figure 3 is a schematic structural diagram of a third contact pin provided by an embodiment of the present invention;
图4为本发明实施例提供的一种触碰装置的立体结构示意图;Figure 4 is a schematic three-dimensional structural diagram of a touch device provided by an embodiment of the present invention;
图5为本发明实施例提供的一种触碰装置的剖视结构示意图;Figure 5 is a schematic cross-sectional structural diagram of a touch device provided by an embodiment of the present invention;
图6为本发明实施例提供的一种触碰装置的爆炸结构示意图;Figure 6 is a schematic diagram of the explosion structure of a touch device provided by an embodiment of the present invention;
图7为本发明实施例提供的一种触碰装置中第二基板和触针的结构示意图;Figure 7 is a schematic structural diagram of the second substrate and contact pins in a touch device provided by an embodiment of the present invention;
图8为本发明实施例提供的一种触碰装置中导电件的结构示意图;Figure 8 is a schematic structural diagram of a conductive member in a touch device provided by an embodiment of the present invention;
图9为本发明实施例提供的另一种触碰装置在第一视角的结构示意图;Figure 9 is a schematic structural diagram of another touch device provided by an embodiment of the present invention from a first perspective;
图10为本发明实施例提供的另一种触碰装置在第二视角的结构示意图; Figure 10 is a schematic structural diagram of another touch device provided by an embodiment of the present invention from a second perspective;
图11为本发明实施例提供的另一种触碰装置的爆炸结构示意图;Figure 11 is a schematic diagram of the explosion structure of another touch device provided by an embodiment of the present invention;
图12为本发明实施例提供的另一种触碰装置在第一视角的剖视结构示意图;Figure 12 is a schematic cross-sectional structural diagram from a first perspective of another touch device provided by an embodiment of the present invention;
图13为本发明实施例提供的另一种触碰装置在第二视角的剖视结构示意图;FIG13 is a schematic cross-sectional view of another touch device provided by an embodiment of the present invention at a second viewing angle;
图14为本发明实施例提供的再一种触碰装置在第三视角的剖视结构示意图;Figure 14 is a schematic cross-sectional structural diagram of yet another touch device provided by an embodiment of the present invention from a third perspective;
图15为本发明实施例提供的一种立体成型设备在第一视角的结构示意图;FIG15 is a schematic structural diagram of a stereoscopic molding device provided by an embodiment of the present invention at a first viewing angle;
图16为本发明实施例提供的一种立体成型设备在第二视角的结构示意图;Figure 16 is a schematic structural diagram of a three-dimensional molding equipment provided by an embodiment of the present invention from a second perspective;
图17为本发明实施例提供的一种立体成型设备在第三视角的结构示意图;Figure 17 is a schematic structural diagram of a three-dimensional molding equipment provided by an embodiment of the present invention from a third perspective;
图18为图17中所示立体成型设备中A区域的局部放大结构示意图;FIG18 is a partial enlarged structural schematic diagram of area A in the three-dimensional molding device shown in FIG17;
图19为本发明实施例提供的一种立体成型设备在第四视角的结构示意图;Figure 19 is a schematic structural diagram of a three-dimensional molding equipment provided by an embodiment of the present invention from a fourth perspective;
图20为图19中所示立体成型设备中B区域的局部放大结构示意图;Figure 20 is a partially enlarged structural schematic diagram of area B in the three-dimensional molding equipment shown in Figure 19;
图21为本发明实施例提供的一种打印控制方法的流程图。Figure 21 is a flow chart of a printing control method provided by an embodiment of the present invention.
具体实施方式Detailed ways
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对依据本发明提出的触碰装置等其具体实施方式、结构、特征及其功效,详细说明如后。In order to further elaborate on the technical means and effects adopted by the present invention to achieve the intended inventive purpose, the specific implementation, structure, characteristics and effects of the touch device proposed according to the present invention are described below in conjunction with the drawings and preferred embodiments. , detailed description is as follows.
一方面,如图1-3所示,本发明实施例提供了一种触针100,应用于用于调平的触碰装置1000,触针100用于通过与导电部接触而与导电部电性导通,触针100包括主体101和端头,端头设置于主体101轴向的一端,端头包括外周面110和位于外周面110上的顶点120;触针100通过顶点120与导电部点接触, 以与导电部电性导通。On the one hand, as shown in Figures 1-3, an embodiment of the present invention provides a contact pin 100, which is used in a touch device 1000 for leveling. The contact pin 100 is used to electrically contact the conductive part. The contact pin 100 includes a main body 101 and an end. The end is provided at one axial end of the main body 101. The end includes an outer peripheral surface 110 and a vertex 120 located on the outer peripheral surface 110; the contact pin 100 communicates with the conductive portion through the vertex 120. point contact, To be electrically connected with the conductive part.
其中,端头的横截面面积在靠近顶点120的方向上可以逐渐减小。导电部根据触针100的应用场景不同可以为多种,如导电部可以为导电材质的垫片或触头等,触针100采用导电材质制备而成,如采用铜或铝等材料。使用时,在导电部和触针100的两端分别施加电压,在触针100通过顶点120与导电部接触时,触针100与导电部电性导通,产生电流,当触针100顶点120与导电部脱离时,电流消失,通过检测电流存在与否即可实现触针100与导电部相对位置的检测。触针100包括主体101和端头,主体101起到支撑和延长的作用,主体101可以为多种形状,如主体呈柱状,包括轴向的两端。主体101的横截面可以在轴向方向上均匀,或者如图1-图3所示,主体101在连接端头的一端横截面积大于相背端头的另一端的横截面积,保证端头的横截面积足够的同时,减小主体101的重量和所占空间。端头设置于主体101轴向的一端,一种实施方式中,为保证触针100受力均匀,端头与主体101同轴设置。为提高触针100的敏感性,端头通过顶点120与导电部点接触,使得端头在轻微远离导电部时即可与导电部脱离,且可以避免端头面积过大以与导电部之间面接触形成电容,避免触针100需要移动一段距离后才能与导电部电性断开,从而端头与导电部物理脱离即可实现电性断开。Wherein, the cross-sectional area of the end head may gradually decrease in the direction approaching the vertex 120 . The conductive part can be of various types depending on the application scenarios of the stylus 100. For example, the conductive part can be a gasket or a contact made of conductive material. The stylus 100 is made of conductive material, such as copper or aluminum. During use, a voltage is applied to both ends of the conductive part and the contact pin 100 respectively. When the contact pin 100 contacts the conductive part through the vertex 120, the contact pin 100 and the conductive part are electrically connected to generate a current. When the contact pin 100 reaches the vertex 120 When separated from the conductive part, the current disappears. By detecting the presence or absence of the current, the relative position of the stylus 100 and the conductive part can be detected. The stylus 100 includes a main body 101 and an end. The main body 101 plays a role of supporting and extending. The main body 101 can be in various shapes. For example, the main body is cylindrical and includes both axial ends. The cross-section of the main body 101 can be uniform in the axial direction, or as shown in Figures 1 to 3, the cross-sectional area of the main body 101 at one end connected to the end is larger than the cross-sectional area at the other end opposite to the end, ensuring that the end While the cross-sectional area is sufficient, the weight and space occupied of the main body 101 are reduced. The end is disposed at one axial end of the main body 101. In one embodiment, in order to ensure that the contact pin 100 is evenly stressed, the end is coaxially disposed with the main body 101. In order to improve the sensitivity of the stylus 100, the tip is in point contact with the conductive part through the vertex 120, so that the tip can be separated from the conductive part when it is slightly away from the conductive part, and the tip area can be avoided to be too large to be between the conductive part and the conductive part. The surface contact forms a capacitance, which prevents the contact pin 100 from having to move a certain distance before being electrically disconnected from the conductive part, so that the terminal can be electrically disconnected from the conductive part by physical separation.
外周面110为端头的外表面,端头由外周面110围成,如图1所示,外周面110可以为球面,外周面110易于加工且稳定性好;或者,如图2所示,外周面110为锥面,使得顶点120周围的各点距离导电部更远,增加触针100的精度和强度,避免顶点周围的各点与导电部之间产生电性连接;或者,如图3所示,外周面110为锥面,锥面的周向上分布有多个凹陷130,且凹陷130在锥面的母线方向延伸至顶点120,在保证触针100结构强度的同时,进一步使得顶 点120周围的各点距离导电部更远,使得顶点120更加突出,增加触针的敏感性。The outer peripheral surface 110 is the outer surface of the end, and the end is surrounded by the outer peripheral surface 110, as shown in Figure 1. The outer peripheral surface 110 can be a spherical surface, and the outer peripheral surface 110 is easy to process and has good stability; or, as shown in Figure 2, The outer peripheral surface 110 is a tapered surface, which makes the points around the vertex 120 further away from the conductive part, increases the accuracy and strength of the contact pin 100, and avoids electrical connection between the points around the vertex and the conductive part; or, as shown in Figure 3 As shown, the outer peripheral surface 110 is a cone surface, with a plurality of depressions 130 distributed in the circumferential direction of the cone surface, and the depressions 130 extend to the apex 120 in the direction of the cone surface's generatrix, which further ensures the structural strength of the contact pin 100 while further making the top point 120 . Points around point 120 are further away from the conductive portion, making apex 120 more prominent and increasing the sensitivity of the stylus.
另一方面,如图4-6所示,本发明实施例还提供了一种触碰装置1000,应用于立体成型设备,触碰装置1000包括连接装置200、按压件300、第一导电装置和第二导电装置,其中:连接装置200,可以用于与立体成型设备连接,如直接连接或通过其他元器件间接连接。按压件300,与连接装置200配合,以在外力驱动下相对连接装置200移动,具体地,按压件300可以与连接装置200滑动连接。第一导电装置,第一导电装置与连接装置200连接;第二导电装置与按压件300连接,按压件300相对连接装置200移动至少包括导通位置和断开位置,导通位置时,第二导电装置与第一导电装置电性接触,断开位置时,第二导电装置与第一导电装置脱离电性接触,以生成检测信号。On the other hand, as shown in Figures 4-6, the embodiment of the present invention also provides a touch device 1000 for use in three-dimensional molding equipment. The touch device 1000 includes a connection device 200, a pressing member 300, a first conductive device and a The second conductive device, wherein: the connection device 200, can be used to connect with the three-dimensional molding equipment, such as direct connection or indirect connection through other components. The pressing member 300 cooperates with the connecting device 200 to move relative to the connecting device 200 driven by external force. Specifically, the pressing member 300 can be slidably connected with the connecting device 200. The first conductive device is connected to the connecting device 200; the second conductive device is connected to the pressing member 300, and the pressing member 300 moves relative to the connecting device 200 including at least the conducting position and the disconnecting position. In the conducting position, the second The conductive device is in electrical contact with the first conductive device. When in the disconnected position, the second conductive device is out of electrical contact with the first conductive device to generate a detection signal.
其中,第二导电装置与第一导电装置电性接触,则第二导电装置与第一导电装置之间可以通过电流,实现了电性导通。断开位置的触发方式不作限定,如按压件300被立体成型设备的喷嘴或调平装置触碰以处于断开位置。Wherein, if the second conductive device is in electrical contact with the first conductive device, current can pass between the second conductive device and the first conductive device, thereby achieving electrical conduction. The triggering method of the off position is not limited, for example, the pressing member 300 is touched by the nozzle or the leveling device of the three-dimensional molding equipment to be in the off position.
第一导电装置和第二导电装置的具体结构不作限定。如可以是两个相互接触的导电片等。本申请实施例以第一导电装置和第二导电装置其中一个为导电件400,另一个为触针100进行举例说明。其中,若导电件400与连接装置200连接,则触针100与按压件300连接,若导电件400与按压件300连接,则触针100与连接装置200连接。The specific structure of the first conductive device and the second conductive device is not limited. For example, they can be two conductive sheets in contact with each other. The embodiment of the present application is illustrated by taking one of the first conductive device and the second conductive device as a conductive member 400 and the other as a contact pin 100. If the conductive member 400 is connected to the connecting device 200, the contact pin 100 is connected to the pressing member 300, and if the conductive member 400 is connected to the pressing member 300, the contact pin 100 is connected to the connecting device 200.
本实施例中,以导电件400与连接装置200连接,触针100与按压件300连接进行说明,但并不限定该方案。其中,按压件300与连接装置200滑动连接的结构不作限定。如通过滑槽和滑轨的结构,如通过滑轮和滑轨的结构等。本实施例中,以连接装置200上设置有滑槽210;按压件300设置于滑槽210内 进行举例说明。In this embodiment, the conductive member 400 is connected to the connection device 200 and the contact pin 100 is connected to the pressing member 300 for description, but this solution is not limited. The structure of the sliding connection between the pressing member 300 and the connecting device 200 is not limited. Such as the structure of chute and slide rail, such as the structure of pulley and slide rail, etc. In this embodiment, the connecting device 200 is provided with a chute 210; the pressing member 300 is disposed in the chute 210. Give examples.
导电件400与连接装置200连接,触针100与按压件300连接时,导电件400可以用于与立体成型设备的控制装置电性连接。触针100,触针100与按压件300连接,按压件300包括导通位置和断开位置,导通位置时,触针100与导电件400电性接触而电性导通,按压件300被立体成型设备的喷嘴或调平装置触碰以处于断开位置时,触针100与导电件400电性断开,以生成检测信号。The conductive member 400 is connected to the connection device 200, and when the contact pin 100 is connected to the pressing member 300, the conductive member 400 can be used to electrically connect with the control device of the three-dimensional molding equipment. The contact pin 100 is connected to the pressing member 300. The pressing member 300 includes a conduction position and a disconnection position. In the conduction position, the contact pin 100 is in electrical contact with the conductive member 400 and is electrically conductive. The pressing member 300 is When the nozzle or the leveling device of the three-dimensional molding equipment is touched to be in the disconnection position, the contact pin 100 is electrically disconnected from the conductive member 400 to generate a detection signal.
其中,触针100可以为前述的触针,导电件400为前述导电部。按压件300可安装于立体成型设备的多个位置,如底座40或导向架50上。一种实施方式中,按压件300与成形平台30连接。滑槽210为竖直方向延伸的槽,在连接装置200的顶端具有顶端开口,按压件300包括相背的顶面和底端,按压件300由底端活动穿接于滑槽210内,顶面位于滑槽210的顶端开口的外侧,按压件300的底端与滑槽210的槽底间隔一段距离,使得按压件300可在竖直方向上移动。调整触碰装置1000整体的安装位置,使得按压件300处于导通位置时,按压件300的顶面与成形平台30的上表面的预设点位处于同一平面内,触碰装置1000固定时,可借助具有平面的工具,如方形金属板或木板等,工具的平面抵接成形平台30上表面且抵接预设点位,且同时使得按压件300的顶面与工具的平面抵接,固定触碰装置1000,使得顶面与预设点位处于同一平面内。顶面与预设点位处于同一平面内可以理解为在打印时,顶面与预设点位处于同一高度。The contact pin 100 may be the aforementioned contact pin, and the conductive member 400 may be the aforementioned conductive part. The pressing member 300 can be installed at multiple positions of the three-dimensional forming equipment, such as the base 40 or the guide frame 50 . In one embodiment, the pressing member 300 is connected to the forming platform 30 . The chute 210 is a vertically extending groove with a top opening at the top of the connecting device 200. The pressing member 300 includes an opposite top surface and a bottom end. The pressing member 300 is movably connected to the chute 210 from the bottom end. The surface is located outside the top opening of the chute 210, and the bottom end of the pressing member 300 is spaced a certain distance from the bottom of the chute 210, so that the pressing member 300 can move in the vertical direction. Adjust the overall installation position of the touch device 1000 so that when the pressing member 300 is in the conductive position, the top surface of the pressing member 300 and the preset point on the upper surface of the forming platform 30 are in the same plane. When the touching device 1000 is fixed, A tool with a flat surface, such as a square metal plate or wooden board, can be used. The flat surface of the tool contacts the upper surface of the forming platform 30 and the preset point, and at the same time, the top surface of the pressing member 300 contacts the flat surface of the tool to fix it. Touch the device 1000 so that the top surface and the preset point are in the same plane. The fact that the top surface and the preset point are in the same plane can be understood to mean that the top surface and the preset point are at the same height during printing.
使用时,触针100与导电件400分别施加电压,触针100与导电件400与立体成型设备的控制装置电性连接。自然状态下的按压件300将处于导通位置,即触针100与导电件400接触而电性导通,可获得连续的电流信号,当喷嘴10下降到接触按压件300的顶面后,开始推动按压件300下降,触针100的顶点120与导电件400脱离,按压件300由导通位置变为断开位置,电流信号停止, 电流信号的停止信号作为检测信号,控制装置在获取到检测信号时获取打印头组件的第一高度信息。由于顶面与预设点位处于同一平面内,且按压件300由导通位置变为断开位置的位移量非常小,可以将第一高度信息看成是喷嘴10触碰预设点位时打印头组件的高度,继而可以使用调平装置感测预设点位,根据调平装置生成的调平信号获取打印头组件的第二高度信息,即分别获得了喷嘴10和调平装置触碰成形平台30上同一点时打印头组件的高度,通过第一高度信息和第二高度信息的差值,即可得到喷嘴10和调平装置的偏移量。其中,触针100与导电件400点接触,使得按压件300由导通位置变为断开位置的位移量非常小,该位移量不影响打印模型的成功率。预设点位为成形平台30上表面靠近触碰装置1000的区域中的一点,预设点位可以为任一点,或者为调平装置进行调平检测时的一个检测点,预设点位可以是调平装置的检测点中距离触碰装置1000最近的一个检测点,或预设坐标的检测点。调平装置可以为多种形式的调平装置,如背景技术中提及的触针式的调平装置,也可以为远距离式测量的距离传感器。When in use, voltage is applied to the stylus 100 and the conductive member 400 respectively, and the stylus 100 and the conductive member 400 are electrically connected to the control device of the three-dimensional molding equipment. The pressing member 300 in the natural state will be in the conducting position, that is, the stylus 100 and the conductive member 400 are in contact and electrically connected, and a continuous current signal can be obtained. When the nozzle 10 drops to the top surface of the contact pressing member 300, it starts to push the pressing member 300 down, and the top 120 of the stylus 100 is separated from the conductive member 400, and the pressing member 300 changes from the conducting position to the disconnecting position, and the current signal stops. The stop signal of the current signal is used as a detection signal, and the control device obtains the first height information of the print head assembly when the detection signal is obtained. Since the top surface and the preset point are in the same plane, and the displacement of the pressing member 300 from the on position to the off position is very small, the first height information can be regarded as the height of the print head assembly when the nozzle 10 touches the preset point, and then the leveling device can be used to sense the preset point, and the second height information of the print head assembly can be obtained according to the leveling signal generated by the leveling device, that is, the height of the print head assembly when the nozzle 10 and the leveling device touch the same point on the forming platform 30 is obtained respectively, and the offset of the nozzle 10 and the leveling device can be obtained by the difference between the first height information and the second height information. Among them, the stylus 100 is in point contact with the conductive member 400, so that the displacement of the pressing member 300 from the on position to the off position is very small, and this displacement does not affect the success rate of the printed model. The preset point is a point on the upper surface of the forming platform 30 close to the touch device 1000. The preset point can be any point, or a detection point when the leveling device performs leveling detection. The preset point can be a detection point closest to the touch device 1000 among the detection points of the leveling device, or a detection point with preset coordinates. The leveling device can be a leveling device in various forms, such as the stylus-type leveling device mentioned in the background technology, or a distance sensor for long-distance measurement.
可以理解的是,按压件300的断开位置指的是触针100与导电件400由电性导通变为电性断开时刻的位置,是电性断开一刻的临界位置,按压件300除导通位置和断开位置外,还可以包括其他位置,如按压件300可以由断开位置继续向下移动。此外,可以控制调平装置感测预设点位生成检测信号,也可以控制调平装置感测按压件300生成检测信号。控制调平装置感测预设点位或按压件300的方法可以是通过探针触碰等进行接触式感测,或者通过传感器进行非接触式感测。It can be understood that the disconnection position of the pressing member 300 refers to the position at which the contact pin 100 and the conductive member 400 change from electrical conduction to electrical disconnection. It is the critical position at the moment of electrical disconnection. The pressing member 300 In addition to the on position and the off position, other positions may also be included, for example, the pressing member 300 may continue to move downward from the off position. In addition, the leveling device can be controlled to sense a preset point to generate a detection signal, or the leveling device can be controlled to sense the pressing member 300 to generate a detection signal. The method of controlling the leveling device to sense the preset point or the pressing member 300 may be contact sensing through probe touching or the like, or non-contact sensing through a sensor.
本发明实施例提出的触针、触碰装置、打印控制方法及立体成型设备,通过设置可活动的按压件,当喷嘴底端推动按压件时,改变导电件与触针的导通 状态,获取喷嘴高度,根据调平装置接触预设点位生成调平信号,获取调平装置的高度,继而得到喷嘴与调平装置的偏移量,根据偏移量确定喷嘴的打印高度,实现自动调平。现有技术中,喷嘴与调平装置安装时会产生误差,导致触针与喷嘴的高度差无法准确获取,需要在打印开始前手动调整喷嘴底端与打印平台上表面的距离,人为确定喷嘴与触针高度之间的偏移量,导致无法实现自动调平。与现有技术相比,本申请文件中,触碰装置与立体成型设备连接,且按压件的顶面与立体成型设备的成形平台的上表面的预设点位处于同一平面内,先使喷嘴的底端推动按压件,当按压件生成检测信号时,获取打印头组件的第一高度信息,再使调平装置的底端接触成形平台的预设点位,当调平装置生成调平信号时,获取打印头组件的第二高度信息,根据第一高度信息和第二高度信息确定喷嘴相对调平装置的偏移量,而后通过调平装置进行调平检测,根据平台高度信息和偏移量控制打印头组件的打印高度,实现无需手动调整喷嘴与打印平台的初始位置,实现自动调平。The stylus, the touch device, the printing control method and the three-dimensional molding equipment proposed by the embodiments of the present invention are provided with a movable pressing member. When the bottom end of the nozzle pushes the pressing member, the conduction between the conductive member and the stylus is changed. status, obtain the height of the nozzle, generate a leveling signal based on the leveling device contacting the preset point, obtain the height of the leveling device, and then obtain the offset between the nozzle and the leveling device, determine the printing height of the nozzle based on the offset, and achieve Automatic leveling. In the existing technology, errors will occur when the nozzle and leveling device are installed, resulting in the height difference between the stylus and the nozzle being unable to be accurately obtained. It is necessary to manually adjust the distance between the bottom of the nozzle and the upper surface of the printing platform before starting printing, and manually determine the distance between the nozzle and the printing platform. The offset between the stylus heights prevents automatic leveling. Compared with the prior art, in this application document, the touch device is connected to the three-dimensional molding equipment, and the top surface of the pressing member is in the same plane as the preset point on the upper surface of the forming platform of the three-dimensional molding equipment. First, the nozzle is The bottom end of the leveling device pushes the pressing member. When the pressing member generates a detection signal, the first height information of the print head assembly is obtained, and then the bottom end of the leveling device contacts the preset point of the forming platform. When the leveling device generates a leveling signal When, obtain the second height information of the print head assembly, determine the offset of the nozzle relative to the leveling device based on the first height information and the second height information, and then perform leveling detection through the leveling device, based on the platform height information and offset The printing height of the print head assembly is controlled quantitatively, eliminating the need to manually adjust the initial position of the nozzle and the printing platform to achieve automatic leveling.
一种实施方式中,如图5-6所示,触碰装置还包括第一弹性件500,第一弹性件500与按压件300直接或间接接触,第一弹性件500用于向按压件300施加使按压件300由断开位置向导通位置移动的力。In one embodiment, as shown in FIGS. 5-6 , the touch device further includes a first elastic member 500 , which is in direct or indirect contact with the pressing member 300 . The first elastic member 500 is used to push the pressing member 300 toward the pressing member 300 . A force is applied to move the pressing member 300 from the off position to the on position.
具体的,如第一弹性件500可以设置于按压件300和连接装置200之间。如第一弹性件500设置于按压件300的底部和滑槽210的槽底之间。Specifically, the first elastic member 500 may be disposed between the pressing member 300 and the connecting device 200 . For example, the first elastic member 500 is disposed between the bottom of the pressing member 300 and the bottom of the sliding groove 210 .
第一弹性件500可以为弹簧、泡棉等多种弹性部件,第一弹性件500使得按压件300在没有受到喷嘴10的推动时,或者喷嘴10的推力消失时,按压件300可以保持在导通位置。导通位置时,第一弹性件500的弹力和触针100受到的导电件400的压力达到力平衡,第一弹性件500还起到使得触针100挤压导电件400,保证导电件400与触针100之间电流稳定的作用。可以理解,也可以 不设置第一弹性件500,可以使得按压件300和连接装置200之间具有一定的摩擦力,用户将按压件300移动以使触针100与导电件400接触导电,在按压件300不受外力时,保证触针100能与导电件400依旧接触导电即可。The first elastic member 500 can be a variety of elastic components such as springs and foam. The first elastic member 500 allows the pressing member 300 to remain in the guide position when the pressing member 300 is not pushed by the nozzle 10 or when the thrust of the nozzle 10 disappears. Pass location. In the conduction position, the elastic force of the first elastic member 500 and the pressure of the conductive member 400 on the contact pin 100 reach a force balance. The first elastic member 500 also causes the contact pin 100 to squeeze the conductive member 400 to ensure that the conductive member 400 is in contact with the conductive member 400 . The effect of current stabilization between contact pins 100. It's understandable, and it's okay Without the first elastic member 500 , there can be a certain friction force between the pressing member 300 and the connecting device 200 . The user moves the pressing member 300 so that the contact pin 100 contacts the conductive member 400 to conduct electricity. The pressing member 300 is not subject to external force. , it is sufficient to ensure that the contact pin 100 can still be in contact with the conductive member 400 and conduct electricity.
一种实施方式中,如图5所示,按压件300相对滑槽210的槽底的一端设置有至少一个安装孔310,第一弹性件500的一端插入安装孔310,第一弹性件500的另一端与滑槽210的槽壁连接。In one embodiment, as shown in FIG. 5 , at least one mounting hole 310 is provided at one end of the pressing member 300 relative to the bottom of the chute 210 . One end of the first elastic member 500 is inserted into the mounting hole 310 . The other end is connected to the groove wall of the chute 210 .
安装孔310的数量可以为两个,两个安装孔310在触针100的径向两侧分布,当第一弹性件500为两个弹簧时,弹簧可活动的插入安装孔310,一端与安装孔310的孔底面抵接,另一端与滑槽210的槽壁连接,可以为固定连接或者抵接,如弹簧的另一端与滑槽210的槽底抵接,保证弹簧位置稳定不会滑动移位,且方便安装。The number of mounting holes 310 may be two, and the two mounting holes 310 are distributed on both radial sides of the contact pin 100. When the first elastic member 500 is two springs, the springs can be movably inserted into the mounting holes 310, and one end is connected to the mounting hole 310. The bottom surface of the hole 310 is in contact with the groove wall of the chute 210, and the other end is connected with the groove wall of the chute 210. It can be a fixed connection or abutment. For example, the other end of the spring is in contact with the bottom of the chute 210 to ensure that the spring position is stable and will not slide. position and easy to install.
一种实施方式中,如图4-8所示,按压件300包括让位孔320。触针100设置于按压件300内,如触针100穿接于按压件300,且触针100的顶点120突出于让位孔320的底壁。导电件400包括第一基板410和第一导电片420,第一基板410与连接装置200固定连接,第一基板410至少部分位于让位孔320内,按压件300可通过让位孔320相对第一基板410活动,第一导电片420设置于第一基板410上,且第一导电片420位于让位孔320内。触针100与第一导电片420对应,以用于与第一导电片420接触或脱离。In one embodiment, as shown in FIGS. 4-8 , the pressing member 300 includes a relief hole 320 . The contact pin 100 is disposed in the pressing member 300 . For example, the contact pin 100 passes through the pressing member 300 , and the apex 120 of the contact pin 100 protrudes from the bottom wall of the relief hole 320 . The conductive member 400 includes a first substrate 410 and a first conductive sheet 420. The first substrate 410 is fixedly connected to the connection device 200. The first substrate 410 is at least partially located in the relief hole 320. The pressing member 300 can be relative to the third conductor through the relief hole 320. A substrate 410 is movable, the first conductive sheet 420 is disposed on the first substrate 410 , and the first conductive sheet 420 is located in the relief hole 320 . The contact pin 100 corresponds to the first conductive sheet 420 and is used for contacting or disengaging from the first conductive sheet 420 .
让位孔320在按压件300的至少一侧具有开口,第一基板410为板状结构,让位孔320在竖直方向上的高度高于第一基板410的厚度,使得第一基板410不动,而按压件300可以上下移动。按压件300上加工穿接孔,穿接孔贯通按压件300的底端和让位孔320,触针100穿接在穿接孔上,并与按压件300固定,触针100的顶点120突出于让位孔320的侧壁。当按压件300在导通位置时, 触针100抵接在第一基板410上的第一导电片420,触针100与第一导电片420电性导通,当按压件300由导通位置移动到断开位置时,第一基板410在让位孔320内移动,使得触针100与第一导电片420电断开。让位孔320的设置使得触碰装置1000整体结构紧凑,减轻按压件300体积和重量,且触针100穿接在按压件300上,使得触针100更加稳定,避免触针100晃动。The relief hole 320 has an opening on at least one side of the pressing member 300. The first substrate 410 has a plate-like structure. The height of the relief hole 320 in the vertical direction is higher than the thickness of the first substrate 410, so that the first substrate 410 does not move, and the pressing member 300 can move up and down. The pressing member 300 is processed with a through hole, which passes through the bottom end of the pressing member 300 and the relief hole 320. The contact pin 100 is connected to the through hole and fixed with the pressing member 300. The apex 120 of the contact pin 100 protrudes. on the side wall of the relief hole 320. When the pressing member 300 is in the conductive position, The contact pin 100 abuts the first conductive piece 420 on the first substrate 410, and the contact pin 100 is electrically connected with the first conductive piece 420. When the pressing member 300 moves from the conductive position to the off position, the first substrate 410 moves within the relief hole 320 so that the contact pin 100 is electrically disconnected from the first conductive piece 420 . The arrangement of the relief hole 320 makes the overall structure of the touch device 1000 compact, reducing the volume and weight of the pressing member 300, and the contact pin 100 is connected to the pressing member 300, making the contact pin 100 more stable and preventing the contact pin 100 from shaking.
让位孔320的形式可以为多种,在一种实施方式中,让位孔320贯通于按压件300,第一基板410穿过让位孔320,且第一基板410的两端分别与连接装置200固定连接,使得第一基板410的位置稳定,不会由于触针100的抵触而发生移动,保证触针100的敏感性。The relief hole 320 may have various forms. In one embodiment, the relief hole 320 passes through the pressing member 300 , the first substrate 410 passes through the relief hole 320 , and both ends of the first substrate 410 are connected to The device 200 is fixedly connected so that the position of the first substrate 410 is stable and will not move due to the collision of the stylus 100, thus ensuring the sensitivity of the stylus 100.
另一种实施方式中,让位孔320贯通于按压件300,让位孔320位于滑槽210内,第一基板410穿过让位孔320,且第一基板410的两端分别与滑槽210的内壁固定连接,使得触碰装置1000外观简洁,且避免第一导电片420和触针100长期裸露在外容易受到环境污染,如受到熔融树脂喷溅等失效。In another embodiment, the relief hole 320 passes through the pressing member 300 , the relief hole 320 is located in the slide groove 210 , the first base plate 410 passes through the relief hole 320 , and both ends of the first base plate 410 are in contact with the slide groove 210 respectively. The inner wall of 210 is fixedly connected, making the touch device 1000 simple in appearance, and preventing the first conductive piece 420 and the contact pin 100 from being exposed to the environment for a long time and being susceptible to environmental pollution, such as failure by molten resin splashing.
再一种实施方式中,让位孔320位于滑槽210内,滑槽210包括顶端开口,连接装置200上设置有贯通顶端开口的安装豁口211,第一基板410与安装豁口211固定连接。In another embodiment, the relief hole 320 is located in the chute 210. The chute 210 includes a top opening. The connecting device 200 is provided with a mounting notch 211 that passes through the top opening. The first base plate 410 is fixedly connected to the mounting notch 211.
如图4和图6所示,让位孔320可以贯通于按压件300,让位孔320在按压件300水平方向两侧具有开口,安装豁口211为两个,分别与让位孔320的两侧开口对应,安装豁口211上设置有螺孔,如图8所示,第一基板410上设置有两个通孔430,通过两个固定螺栓212插入通孔430并连接在螺孔上,使得第一基板410的两端与安装豁口211固定,实现方便安装和保证第一基板410稳定性的目的。此外,当第一导电片420久用磨损时,无需将按压件300移出,仅需拆卸第一基板410即可,实现拆装方便。 As shown in FIGS. 4 and 6 , the relief hole 320 can pass through the pressing member 300 . The relief hole 320 has openings on both sides of the pressing member 300 in the horizontal direction. There are two installation gaps 211 , which are respectively connected with the two sides of the relief hole 320 . Corresponding to the side opening, a screw hole is provided on the mounting notch 211. As shown in Figure 8, two through holes 430 are provided on the first base plate 410. Two fixing bolts 212 are inserted into the through holes 430 and connected to the screw holes, so that Both ends of the first base plate 410 are fixed to the installation notches 211 to facilitate installation and ensure the stability of the first base plate 410 . In addition, when the first conductive sheet 420 is worn for a long time, there is no need to remove the pressing member 300, and only the first substrate 410 is required to be disassembled, making disassembly and assembly easy.
第一导电片420可设置于两个通孔430之间的中间位置。第一导电片420的设置方式可以为多种,旨在可以与触针100接触电性导通即可,以下举例三种具体设置方式:The first conductive sheet 420 may be disposed at an intermediate position between the two through holes 430 . The first conductive piece 420 can be arranged in a variety of ways, as long as it can be in contact with the contact pin 100 and electrically conductive. The following are three specific arrangements:
其一,如图8所示,第一导电片420设置于第一基板410相对于触针100一侧的表面,触针100的顶点120用于与第一导电片420点接触,第一导电片420略突出于第一基板410,点接触使得触针100的敏感度更高。First, as shown in FIG. 8 , the first conductive sheet 420 is disposed on the surface of the first substrate 410 opposite to the contact pin 100 . The vertex 120 of the contact pin 100 is used to make point contact with the first conductive sheet 420 . The piece 420 slightly protrudes from the first substrate 410, and the point contact makes the stylus 100 more sensitive.
其二,第一基板410相对于触针100的一侧设置有凹槽,第一导电片420设置在凹槽的槽壁上,且延伸至凹槽的开口边沿,触针100的外周面110的尺寸大于凹槽的尺寸,触针100的顶点120用于伸入凹槽内,触针100的外周面110用于与第一导电片420线接触。Second, the first substrate 410 is provided with a groove on one side relative to the contact pin 100. The first conductive piece 420 is provided on the groove wall and extends to the opening edge of the groove. The outer peripheral surface 110 of the contact pin 100 The size is larger than the size of the groove, the vertex 120 of the contact pin 100 is used to extend into the groove, and the outer peripheral surface 110 of the contact pin 100 is used to make line contact with the first conductive sheet 420 .
触针100的顶点120与凹槽不接触,仅外周面110与凹槽的开口边沿接触,使得外周面110与第一导电片420线接触,相比于点接触,线接触的稳定性更强,如触针100发生倾斜或按压件300位置倾斜时,仍能保证触针100和第一导电片420电性连接,且凹槽的开口边沿起到对触针100径向上限位的作用,避免触针100晃动。The apex 120 of the contact pin 100 is not in contact with the groove, and only the outer peripheral surface 110 is in contact with the opening edge of the groove, so that the outer peripheral surface 110 is in line contact with the first conductive sheet 420. Compared with point contact, the stability of line contact is stronger. , if the contact pin 100 is tilted or the position of the pressing member 300 is tilted, the electrical connection between the contact pin 100 and the first conductive piece 420 can still be ensured, and the opening edge of the groove serves to limit the radial limit of the contact pin 100. Prevent the stylus 100 from shaking.
其三,如图14所示,第一基板410上设置有通孔411,第一导电片420设置在通孔411的孔壁上,且延伸至通孔411相对于触针100一侧的开口边沿,外周面110的尺寸大于凹槽的尺寸,触针100的顶点120用于伸入通孔411内,触针100的外周面110用于与第一导电片420线接触。Third, as shown in Figure 14, the first substrate 410 is provided with a through hole 411, and the first conductive sheet 420 is provided on the wall of the through hole 411 and extends to the opening of the side of the through hole 411 relative to the contact pin 100. The size of the edge and outer peripheral surface 110 is larger than the size of the groove. The vertex 120 of the contact pin 100 is used to extend into the through hole 411 , and the outer peripheral surface 110 of the contact pin 100 is used to make line contact with the first conductive sheet 420 .
通孔411代替凹槽,避免触针100的顶点120触碰凹槽的槽底。可以理解的是,通孔411的内径应小于触针100端头的最大外径。The through hole 411 replaces the groove to prevent the apex 120 of the contact pin 100 from touching the bottom of the groove. It can be understood that the inner diameter of the through hole 411 should be smaller than the maximum outer diameter of the end of the contact pin 100 .
一种实施方式中,如图7所示,触碰装置还包括第二基板140,第二基板140上设置有第二导电片150,触针100由相背于外周面110的第二端与第二基 板140连接,且第二端与第二导电片150电性连接。第二基板140与按压件300连接,第二基板140用于与立体成型设备的控制装置电性连接,使得触针100通过第二导电片150和第二基板140与立体成型设备的控制装置电性连接。In one embodiment, as shown in FIG. 7 , the touch device further includes a second substrate 140 , a second conductive sheet 150 is provided on the second substrate 140 , and the contact pin 100 is connected by a second end opposite to the outer peripheral surface 110 . Second basis The board 140 is connected, and the second end is electrically connected to the second conductive sheet 150 . The second substrate 140 is connected to the pressing member 300 . The second substrate 140 is used to electrically connect to the control device of the three-dimensional molding equipment, so that the contact pin 100 is electrically connected to the control device of the three-dimensional molding equipment through the second conductive sheet 150 and the second substrate 140 . sexual connection.
第二基板140可以通过螺栓连接在按压件300的底面上,触针100的第二端面与第二基板140的第二导电片150电性连接,一种实施方中,第二基板140上设置有安装孔,第二导电片150设置在安装孔的孔壁上,触针100由第二端面穿接于安装孔,触针100的侧壁与第二导电片150电性连接,起到增加触针100与第二导电片150连接强度和稳定性的目的。The second substrate 140 can be connected to the bottom surface of the pressing member 300 through bolts, and the second end surface of the contact pin 100 is electrically connected to the second conductive piece 150 of the second substrate 140. In one embodiment, the second substrate 140 is provided with There is a mounting hole, the second conductive sheet 150 is arranged on the hole wall of the mounting hole, the contact pin 100 passes through the mounting hole from the second end surface, and the side wall of the contact pin 100 is electrically connected to the second conductive sheet 150 to increase the The contact pin 100 and the second conductive piece 150 are connected for the purpose of strength and stability.
一种实施方式中,如图4-5所示,按压件300的顶端包括隔热件600,隔热件600用于与喷嘴10接触。In one embodiment, as shown in FIGS. 4-5 , the top end of the pressing member 300 includes a heat insulating member 600 , and the heat insulating member 600 is used to contact the nozzle 10 .
按压件300上设置有竖直向下延伸的插接孔,隔热件600包括隔热顶面和位于隔热顶面一端的插接头,隔热件600的插接头插入插接孔内,使得隔热件600与按压件300连接。隔热顶面采用隔热材质制备而成,如采用橡胶。在打印头组件高度检测的过程中,通常需要对打印头组件进行加热,以使得打印头组件处于打印环境中,高度检测更加准确,打印头组件加热使得喷嘴10温度升高,隔热顶面避免高温的喷嘴10直接接触按压件300的不耐高温的部位,避免按压件300的局部融化从而影响信号变化位置,避免影响影响灵敏度。其中,按压件300的顶端包括隔热件600时,按压件300的顶面指的是隔热件600的顶面,即隔热件600的顶面与成形平台30上的预设点位处于同一平面内。The pressing member 300 is provided with a plug hole extending vertically downward, and the heat insulating member 600 includes a heat insulating top surface and a plug connector located at one end of the heat insulating top surface. The plug connector of the heat insulating member 600 is inserted into the plug hole, so that the heat insulating member 600 is connected to the pressing member 300. The heat insulating top surface is made of a heat insulating material, such as rubber. In the process of detecting the height of the print head assembly, it is usually necessary to heat the print head assembly so that the print head assembly is in a printing environment and the height detection is more accurate. The heating of the print head assembly increases the temperature of the nozzle 10. The heat insulating top surface prevents the high-temperature nozzle 10 from directly contacting the part of the pressing member 300 that is not resistant to high temperatures, and prevents the local melting of the pressing member 300 from affecting the signal change position, thereby avoiding affecting the sensitivity. Among them, when the top of the pressing member 300 includes the heat insulating member 600, the top surface of the pressing member 300 refers to the top surface of the heat insulating member 600, that is, the top surface of the heat insulating member 600 and the preset point position on the forming platform 30 are in the same plane.
一种实施方式中,如图9-14所示,触碰装置还包括位置调整组件,位置调整组件与连接装置200的连接状态包括第一连接状态和第二连接状态,第一连接状态时,位置调整组件与连接装置200配合,以在外力驱动下连接装置200相对位置调整组件移动;第二连接状态时,连接装置200相对位置调整组件固 定连接,位置调整组件用于调整并固定连接装置200的高度。In one embodiment, as shown in Figures 9-14, the touch device further includes a position adjustment component. The connection state between the position adjustment component and the connection device 200 includes a first connection state and a second connection state. In the first connection state, The position adjustment component cooperates with the connection device 200 so that the connection device 200 moves relative to the position adjustment component when driven by an external force; in the second connection state, the connection device 200 is fixed relative to the position adjustment component. The position adjustment component is used to adjust and fix the height of the connection device 200.
位置调整组件包括壳体700、第一固定件800和第二固定件900,壳体700用于与立体成型设备连接,连接装置200与壳体700活动连接。第一固定件800用于与按压件300和连接装置200连接,以固定或松动按压件300与连接装置200的相对位置。第二固定件900用于与连接装置200与壳体700连接,以固定或松动连接装置200与壳体700的相对位置,以使按压件300的顶面与立体成型设备的成形平台30的上表面的预设点位处于同一平面内。The position adjustment assembly includes a housing 700, a first fixing part 800 and a second fixing part 900. The housing 700 is used to connect with the three-dimensional molding equipment, and the connecting device 200 is movably connected to the housing 700. The first fixing part 800 is used to connect with the pressing part 300 and the connecting device 200 to fix or loosen the relative position of the pressing part 300 and the connecting device 200 . The second fixing part 900 is used to connect the connecting device 200 and the housing 700 to fix or loosen the relative positions of the connecting device 200 and the housing 700 so that the top surface of the pressing part 300 is connected to the top surface of the forming platform 30 of the three-dimensional forming equipment. The preset points on the surface are in the same plane.
具体地,第一固定件800用于将按压件300固定在导通位置。Specifically, the first fixing part 800 is used to fix the pressing part 300 in the conductive position.
为保证按压件300的顶面与成形平台30上的预设点位处于同一平面内,且方便连接装置200与立体成型设备连接,设置位置调整组件进行按压件300的顶面位置的调整。调整第一固定件800将按压件300固定在导通位置,调整第二固定件900,使得连接装置200和按压件300可作为一个整体相对壳体700移动;将壳体700固定在成形平台30上,使得按压件300的顶面高于成形平台30上表面;使用具有平面的工具,如平板,工具的平面抵接成形平台30上表面且抵接预设点位,同时工具的平面抵压按压件300的顶面,使得连接装置200和按压件300整体向下移动到顶面与成形平台30的预设点位位于同一平面;调整第二固定件900,使得连接装置200与壳体700固定,进而固定按压件300顶面的位置。调整第一固定件800,使得按压件300与连接装置200可相互移动,此时按压件300的顶面与成形平台30的预设点位依旧位于同一平面,可以便于进行后续的高度检测。位置调整组件使得连接装置200位置固定更加准确方便,避免如将连接装置200直接螺栓固定在立体成型设备导致连接装置200位置不准确,导致按压件300的顶面高度不准确的问题。 In order to ensure that the top surface of the pressing member 300 is in the same plane as the preset point on the forming platform 30 and to facilitate the connection between the connecting device 200 and the three-dimensional forming equipment, a position adjustment component is provided to adjust the position of the top surface of the pressing member 300 . Adjust the first fixing part 800 to fix the pressing part 300 in the conductive position, and adjust the second fixing part 900 so that the connecting device 200 and the pressing part 300 can move relative to the housing 700 as a whole; fix the housing 700 on the forming platform 30 so that the top surface of the pressing member 300 is higher than the upper surface of the forming platform 30; use a tool with a flat surface, such as a flat plate, the flat surface of the tool contacts the upper surface of the forming platform 30 and the preset point, and at the same time, the flat surface of the tool contacts the upper surface of the forming platform 30. Press the top surface of the member 300 so that the connecting device 200 and the pressing member 300 move downward as a whole until the top surface is on the same plane as the preset point of the forming platform 30; adjust the second fixing member 900 so that the connecting device 200 and the housing 700 are fixed. , thereby fixing the position of the top surface of the pressing member 300 . Adjust the first fixing member 800 so that the pressing member 300 and the connecting device 200 can move relative to each other. At this time, the top surface of the pressing member 300 and the preset point of the forming platform 30 are still on the same plane, which facilitates subsequent height detection. The position adjustment component makes the position fixing of the connecting device 200 more accurate and convenient, and avoids the problem of inaccurate position of the connecting device 200 and inaccurate top surface height of the pressing member 300 if the connecting device 200 is directly bolted to the three-dimensional molding equipment.
一种实施方式中,连接装置200上设置有滑槽210;按压件300设置于滑槽210内;连接装置200位于壳体700内,按压件300穿过壳体700并部分外露于壳体700。In one embodiment, a slide groove 210 is provided on the connecting device 200 ; the pressing member 300 is disposed in the slide groove 210 ; the connecting device 200 is located in the shell 700 , and the pressing member 300 passes through the shell 700 and is partially exposed outside the shell 700 .
一种实施方式中,如图11所示,连接装置200上设置有第一固定螺孔220,第一固定通孔220贯通连接装置200的外壁,即贯通连接装置200外侧面和滑槽210的内壁,第一固定件800为第一螺栓,第一螺栓用于螺接于第一固定螺孔220,第一螺栓的端部用于挤压按压件300,以固定按压件300。In one embodiment, as shown in FIG. 11 , the connecting device 200 is provided with a first fixing screw hole 220 , and the first fixing through hole 220 passes through the outer wall of the connecting device 200 , that is, through the outer surface of the connecting device 200 and the chute 210 . On the inner wall, the first fixing member 800 is a first bolt. The first bolt is used to be screwed to the first fixing screw hole 220 . The end of the first bolt is used to squeeze the pressing member 300 to fix the pressing member 300 .
触碰装置1000还可以包括第一垫片810,按压件300上对应第一固定螺孔220处设置有安装槽,第一垫片810嵌入安装槽,第一螺栓通过第一垫片810挤压按压件300,避免直接挤压按压件300导致按压件300磨损。第一螺栓调节操作简单,且没有增加按压件300结构复杂度,方便加工。The touch device 1000 may also include a first gasket 810. The pressing member 300 is provided with an installation groove corresponding to the first fixing screw hole 220. The first gasket 810 is embedded in the installation groove, and the first bolt is extruded through the first gasket 810. The pressing member 300 is used to avoid directly pressing the pressing member 300 and causing wear of the pressing member 300 . The first bolt adjustment operation is simple, does not increase the structural complexity of the pressing part 300, and facilitates processing.
一种实施方式中,如图10所示,壳体700包括内腔以及与内腔连通的检测开口710和固定件让位口720,连接装置200位于内腔内,且可在内腔中移动,按压件300通过检测开口710伸出至内腔外,固定件让位口720为长条形通孔,第一固定件800的调节头位于固定件让位口720内。In one embodiment, as shown in FIG. 10 , the housing 700 includes an inner cavity, a detection opening 710 and a fixation opening 720 that are connected to the inner cavity. The connecting device 200 is located in the inner cavity and can move in the inner cavity. The pressing member 300 extends out of the inner cavity through the detection opening 710. The fixing member relief opening 720 is a long through hole, and the adjustment head of the first fixing member 800 is located in the fixing member relief opening 720.
连接装置200与内腔的侧壁滑动抵接,使得连接装置200相对壳体700移动时稳定不会晃动,固定件让位口720为竖直方向上延伸的长条形通孔,第一螺栓的螺帽位于固定件让位口720内,连接装置200相对壳体700移动时,第一螺栓的螺帽在固定件让位口720内移动,通过固定件让位口720可进行第一螺栓的调节。此外,固定件让位口720也可以作为第一螺栓的螺帽移动的导轨,进而对连接装置200的移动起到导向作用。The connecting device 200 is in sliding contact with the side wall of the inner cavity, so that the connecting device 200 is stable without shaking when moving relative to the housing 700. The fixing member relief opening 720 is a long through hole extending in the vertical direction. The first bolt The nut of the first bolt is located in the fixing part relief opening 720. When the connecting device 200 moves relative to the housing 700, the nut of the first bolt moves in the fixing part relief opening 720. The first bolt can be carried out through the fixing part relief opening 720. adjustment. In addition, the fixing member relief opening 720 can also be used as a guide rail for the movement of the nut of the first bolt, thereby guiding the movement of the connecting device 200 .
一种实施方式中,壳体700上设置有第二固定螺孔730,第二固定螺孔730贯通于壳体700的外壁,即贯通于壳体700外侧面和内腔的内壁,第二固定件 900为第二螺栓,第二螺栓用于螺接于第二固定螺孔730,第二螺栓的端部用于挤压连接装置200,以固定连接装置200。In one embodiment, the housing 700 is provided with a second fixing screw hole 730 that penetrates the outer wall of the housing 700 , that is, penetrates the outer surface of the housing 700 and the inner wall of the inner cavity. pieces 900 denotes a second bolt. The second bolt is used to be screwed to the second fixing screw hole 730 . The end of the second bolt is used to squeeze the connecting device 200 to fix the connecting device 200 .
触碰装置1000还包括第二垫片910,连接装置200上对应第二固定螺孔730处设置有安装槽,第二垫片910嵌入安装槽,第二螺栓通过第二垫片910挤压连接装置200,避免直接挤压连接装置200导致连接装置200磨损。第二螺栓与第一螺栓的固定原理相同。The touch device 1000 also includes a second gasket 910. The connection device 200 is provided with an installation groove corresponding to the second fixing screw hole 730. The second gasket 910 is embedded in the installation groove, and the second bolt is extruded and connected through the second gasket 910. The device 200 avoids directly squeezing the connection device 200 to cause wear of the connection device 200 . The second bolt has the same fixing principle as the first bolt.
一种实施方式中,位置调整组件700还包括第二弹性部件740,第二弹性部件740设置于连接装置200和壳体700之间,第二弹性部件740用于向连接装置200施加使连接装置200向检测开口710移动的弹力。In one embodiment, the position adjustment assembly 700 further includes a second elastic component 740. The second elastic component 740 is disposed between the connecting device 200 and the housing 700. The second elastic component 740 is used to apply the connecting device 200 to the connecting device 200. 200 moves toward the detection opening 710.
连接装置200的底端与内腔的底面间隔一端距离,第二弹性部件740使得连接装置200在没有被第二螺栓固定时,处于与内腔的顶面抵接的位置,即使得连接装置200在没有被第二螺栓固定时,按压件300的顶面的位置为最高位置。在进行按压件300的顶面高度的调整过程中,按压件300的顶面受到工具的挤压,按压件300和连接装置200同时在内腔中向下移动,第二弹性部件740压缩。当需要重新调整按压件300的顶面位置时,撤销按压件300的顶面的压力,在第二弹性部件740的弹力作用下,按压件300和连接装置200同时向上移动到最高位置。第二弹性部件740使得按压件300和连接装置200的位置可以反复调整,且使得按压件300的顶面可以与工具的平面挤压贴合,使得按压件300的顶面位置准确。The bottom end of the connecting device 200 is separated from the bottom surface of the inner cavity by an end distance. The second elastic component 740 allows the connecting device 200 to be in a position of contact with the top surface of the inner cavity when it is not fixed by the second bolt, that is, the connecting device 200 When not fixed by the second bolt, the position of the top surface of the pressing member 300 is the highest position. During the adjustment of the height of the top surface of the pressing member 300, the top surface of the pressing member 300 is squeezed by the tool, the pressing member 300 and the connecting device 200 move downward in the inner cavity at the same time, and the second elastic component 740 is compressed. When the position of the top surface of the pressing member 300 needs to be readjusted, the pressure on the top surface of the pressing member 300 is released, and under the elastic force of the second elastic component 740, the pressing member 300 and the connecting device 200 move upward to the highest position at the same time. The second elastic component 740 allows the positions of the pressing member 300 and the connecting device 200 to be repeatedly adjusted, and allows the top surface of the pressing member 300 to be pressed against the plane of the tool, so that the top surface of the pressing member 300 is accurately positioned.
一种实施方式中,如图12-14所示,连接装置200的底端设置有至少一个定位柱230,壳体上包括与定位柱230相对应的定位柱让位孔750,第二弹性部件740的一端与定位柱230连接,第二弹性部件740的另一端与壳体700抵接,连接装置200相对壳体700移动时,定位柱230活动穿插于定位柱让位孔750。 具体的,第二弹性部件740套设在定位柱230上,第二弹性部件740的尺寸大于定位柱让位孔750的尺寸。In one embodiment, as shown in Figures 12-14, the bottom end of the connecting device 200 is provided with at least one positioning post 230. The housing includes a positioning post relief hole 750 corresponding to the positioning post 230. The second elastic component One end of the second elastic member 740 is connected to the positioning post 230, and the other end of the second elastic member 740 is in contact with the housing 700. When the connecting device 200 moves relative to the housing 700, the positioning post 230 is movably inserted into the positioning post relief hole 750. Specifically, the second elastic component 740 is sleeved on the positioning post 230 , and the size of the second elastic component 740 is larger than the size of the positioning post relief hole 750 .
第二弹性部件740为弹簧时,第二弹性部件740套接在定位柱230上,定位柱230和定位柱让位孔750的数量均为两个,连接装置200向下移动时,定位柱230插入定位柱让位孔750内,一方面对连接装置200移动方向起到导向作用,避免连接装置200晃动,另一方面,对第二弹性部件740限位,避免第二弹性部件740晃动打滑。When the second elastic component 740 is a spring, the second elastic component 740 is sleeved on the positioning post 230. The number of the positioning post 230 and the positioning post relief hole 750 is two. When the connecting device 200 moves downward, the positioning post 230 Inserted into the positioning post relief hole 750, on the one hand, it guides the moving direction of the connecting device 200 to prevent the connecting device 200 from shaking; on the other hand, it limits the second elastic member 740 to prevent the second elastic member 740 from shaking and slipping.
一种实施方式中,壳体700包括外壳760和底板770,外壳760为空腔结构,外壳760包括底端开口,外壳760通过底端开口和底板770连接,以围合成内腔,检测开口710设置于外壳760上。底板770上设置有定位凸起751,定位凸起751用于由底端开口插入外壳760,并与外壳760的内壁抵接。外壳760用于与立体成型设备连接。外壳760上设置有连接头761,连接头761在垂直于按压件300移动的方向上延伸,连接头761用于与立体成型设备的成形平台30的下表面连接。In one embodiment, the housing 700 includes a shell 760 and a bottom plate 770. The shell 760 is a cavity structure. The shell 760 includes a bottom opening. The shell 760 is connected to the bottom plate 770 through the bottom opening to form an inner cavity. The detection opening 710 Set on the housing 760. The bottom plate 770 is provided with a positioning protrusion 751. The positioning protrusion 751 is used to insert into the housing 760 from the bottom opening and abut against the inner wall of the housing 760. The housing 760 is used to connect with the three-dimensional forming equipment. The housing 760 is provided with a connecting head 761, which extends in a direction perpendicular to the movement of the pressing member 300. The connecting head 761 is used to connect with the lower surface of the forming platform 30 of the three-dimensional forming equipment.
安装时,先将按压件300装入连接装置200的滑槽210内,再将连接装置200由外壳760的底端开口装入外壳760的空腔中,最后盖合底板770,定位凸起751与外壳760的抵接作用使得底板770连接在外壳760上,再采用螺栓固定底板770和外壳760,定位凸起751与外壳760的抵接起到对底板770和外壳760初步的固定作用,方便螺栓连接,且保证底板770不会错位晃动。定位柱让位孔750设置在底板770上。During installation, first put the pressing member 300 into the chute 210 of the connecting device 200, then put the connecting device 200 into the cavity of the casing 760 from the bottom opening of the casing 760, and finally cover the bottom plate 770 and position the locating protrusion 751. The contact with the shell 760 makes the base plate 770 connected to the shell 760, and then bolts are used to fix the base plate 770 and the shell 760. The contact between the positioning protrusion 751 and the shell 760 serves to initially fix the base plate 770 and the shell 760, which is convenient. Bolt the connection and ensure that the bottom plate 770 will not be dislocated or shaken. The positioning post relief hole 750 is provided on the bottom plate 770 .
再一方面,如图15-20所示,本发明实施例还提供了一种立体成型设备,包括前述的触碰装置1000或触针100。立体成型设备还可以包括其他元器件,本申请不作限定。 On the other hand, as shown in Figures 15-20, an embodiment of the present invention also provides a three-dimensional molding equipment, including the aforementioned touch device 1000 or stylus 100. The three-dimensional molding equipment may also include other components, which are not limited in this application.
具体的,如立体成型设备还可以包括底座40、导向机构50、打印头组件、成形平台30和调平装置20,打印头组件包括喷嘴10。打印头组件和成形平台30分别通过导向机构50与底座40连接,触碰装置1000与成形平台30连接,触碰装置1000的顶面与成形平台30的预设点位处于同一平面内。调平装置20与打印头组件连接,调平装置20用于感测预设点位或感测触碰装置1000的按压件300,以生成调平信号,喷嘴10用于推动按压件300。Specifically, the three-dimensional forming equipment may also include a base 40 , a guide mechanism 50 , a print head assembly, a forming platform 30 and a leveling device 20 . The print head assembly includes a nozzle 10 . The print head assembly and the forming platform 30 are respectively connected to the base 40 through the guide mechanism 50. The touching device 1000 is connected to the forming platform 30. The top surface of the touching device 1000 is in the same plane as the preset point of the forming platform 30. The leveling device 20 is connected to the print head assembly. The leveling device 20 is used to sense a preset point or the pressing member 300 of the touch device 1000 to generate a leveling signal. The nozzle 10 is used to push the pressing member 300 .
导向机构50包括X轴导向架、Y轴导向架和Z轴导向架,成形平台30通过Y轴导向架安装在底座40上,Z轴导向架架设在成形平台30两侧,X轴导向架两端与Z轴导向架滑动连接,打印头组件与X轴导向架连接,打印头组件通过X轴导向架和Z轴导向架架设在成形平台30上方,喷嘴10与成形平台30相对。打印过程中,导向机构50带动喷嘴10和成形平台30相对移动,以使喷嘴10在成形平台30上逐层喷涂打印耗材。在调平过程中,导向机构50用于带动打印头组件移动,使得喷嘴10触碰触碰装置1000,以及带动调平装置20感测预设点位或者触碰装置1000,实现喷嘴10和调平装置20之间偏移量的获取。此外,导向机构50还用于带动打印头组件移动,使得调平装置20感测检测点,再进行成形平台30的调平检测,实现成形平台30表面的高度信息的获取。具体实现方法将在后文中进行详细说明。The guide mechanism 50 includes an X-axis guide frame, a Y-axis guide frame and a Z-axis guide frame. The forming platform 30 is installed on the base 40 through the Y-axis guide frame. The Z-axis guide frame is installed on both sides of the forming platform 30. The end is slidingly connected to the Z-axis guide frame, and the print head assembly is connected to the X-axis guide frame. The print head assembly is set up above the forming platform 30 through the X-axis guide frame and the Z-axis guide frame, and the nozzle 10 is opposite to the forming platform 30 . During the printing process, the guide mechanism 50 drives the nozzle 10 and the forming platform 30 to move relative to each other, so that the nozzle 10 sprays printing consumables layer by layer on the forming platform 30 . During the leveling process, the guide mechanism 50 is used to drive the print head assembly to move, so that the nozzle 10 touches the touch device 1000, and drives the leveling device 20 to sense the preset point or the touch device 1000, so as to realize the adjustment of the nozzle 10 and the touch device 1000. Obtaining the offset between flat devices 20. In addition, the guide mechanism 50 is also used to drive the print head assembly to move, so that the leveling device 20 senses the detection point, and then performs leveling detection of the forming platform 30 to obtain height information on the surface of the forming platform 30 . The specific implementation method will be explained in detail later.
触碰装置1000与成形平台30连接可以为直接连接,也可以为间接连接,如触碰装置1000连接在底座40上或者是导向机构50上,在打印过程中,触碰装置1000不会跟随成形平台30移动,在调平过程中,控制成形平台30移动到调平位置,并与触碰装置1000相对应即可。The connection between the touch device 1000 and the forming platform 30 can be a direct connection or an indirect connection. For example, the touch device 1000 is connected to the base 40 or the guide mechanism 50. During the printing process, the touch device 1000 will not follow the forming process. The platform 30 moves. During the leveling process, the forming platform 30 is controlled to move to the leveling position and correspond to the touch device 1000 .
调平装置20的具体结构可以为多种,如调平装置20为非接触式调平,调平装置20为设置在打印头组件上的传感器,传感器可以为远程感应式距离传感 器,感测预设点位或感测按压件300的位置以生成调平信号,如在距离预设点位或感测按压件300顶端5毫米生成调平信号。或者,调平装置20为接触式调平,接触式的调平装置20主要包括固定件、探测件、感应器件和用于移动探测件的驱动器件,探测件包括检测位置和收纳位置,驱动器件与固定件和探测件连接,驱动件用于驱动探测件在竖直方向上移动进行收纳位置和检测位置的切换,感应器件与固定件固定连接,探测件可以为与固定件活动连接的调平探针。在调平检测过程中,导向机构50带动打印头组件向下移动,使得探测件接触调平检测点,打印头组件继续向下移动,使得探测件在成形平台30的推动下相对固定件移动,继而与感应器件相互作用,生成调平信号,控制装置获取调平信号生成时打印头组件的实际高度,即此时打印头组件相对于零点的高度。在成形平台30上均匀设置多个检测点,分别对每一个检测点执行上述调平检测过程,进而获得与成形平台30平行的平面的平台高度信息。在打印过程中,根据打印平台表面的高度信息以及喷嘴10和调平装置20之间偏移量进行打印头组件打印高度的调整,以保证打印头的喷嘴10与成形平台30的上表面始终保持一直高度,实现自动调平。The specific structure of the leveling device 20 can be various. For example, the leveling device 20 is a non-contact leveling. The leveling device 20 is a sensor provided on the print head assembly. The sensor can be a remote inductive distance sensor. The device senses a preset point or the position of the sensing pressing member 300 to generate a leveling signal, for example, a leveling signal is generated at a distance of 5 mm from the preset point or the top of the sensing pressing member 300 . Alternatively, the leveling device 20 is a contact leveling device. The contact leveling device 20 mainly includes a fixing part, a detecting part, a sensing device and a driving device for moving the detecting part. The detecting part includes a detection position and a storage position, and a driving device. It is connected with the fixing part and the detecting part. The driving part is used to drive the detecting part to move in the vertical direction to switch between the storage position and the detecting position. The sensing device is fixedly connected to the fixing part. The detecting part can be a leveling device that is movably connected to the fixing part. probe. During the leveling detection process, the guide mechanism 50 drives the print head assembly to move downward, so that the detection part contacts the leveling detection point, and the print head assembly continues to move downward, so that the detection part moves relative to the fixed part under the push of the forming platform 30. Then it interacts with the sensing device to generate a leveling signal, and the control device obtains the actual height of the print head assembly when the leveling signal is generated, that is, the height of the print head assembly relative to the zero point at this time. Multiple detection points are evenly arranged on the forming platform 30 , and the above-mentioned leveling detection process is performed on each detection point to obtain platform height information of a plane parallel to the forming platform 30 . During the printing process, the printing height of the print head assembly is adjusted according to the height information of the printing platform surface and the offset between the nozzle 10 and the leveling device 20 to ensure that the nozzle 10 of the print head and the upper surface of the forming platform 30 are always maintained. Always height to achieve automatic leveling.
一种实施方式中,立体成型设备还包括清洁组件60,清洁组件60与成形平台30连接,用于在使用触碰装置1000前对喷嘴10的底端进行清洁。In one embodiment, the three-dimensional forming equipment further includes a cleaning assembly 60 connected to the forming platform 30 for cleaning the bottom end of the nozzle 10 before using the touching device 1000 .
为保证喷嘴10和调平装置20之间偏移量检测的准确性,使得打印头组件的检测环境贴近于实际打印过程中的工作环境,在检测过程中,将对打印头组件进行加热,或者将打印头组件和成形平台30同时进行加热。打印头组件一次打印后,喷嘴10和与喷嘴10连接的喉管内将会有打印耗材残留,当对打印头组件重新加热时,残留的打印耗材将受热融化并在重力作用下溢出到喷嘴10外部,如在喷嘴10的底端开口处将会产生耗材结块,使得喷嘴10无法直接触碰 触碰装置1000,将影响喷嘴10和调平装置20之间偏移量检测结果。通过设置清洁组件60,在打印头组件加热后,在检测开始前,对喷嘴10底端溢出的打印耗材进行清洁,可以保证喷嘴10直接触碰触碰装置1000,避免检测结果不准确。一种实施方式中,清洁组件60包括支架61和毛刷62,支架61的一端与成形平台30连接,支架61的另一端在远离成形平台30的方向延伸并悬置,毛刷62固定在支架61的悬置端上。导向机构50带动打印头组件移动,使得喷嘴10与毛刷62相对,向下移动打印头组件,使得喷嘴10底端接触毛刷62,反复移动喷嘴10,起到对喷嘴10的清洁。毛刷62也可以为其他清洁件,如泡棉等。In order to ensure the accuracy of the offset detection between the nozzle 10 and the leveling device 20 and make the detection environment of the print head assembly close to the working environment during the actual printing process, during the detection process, the print head assembly will be heated, or The print head assembly and the forming platform 30 are heated simultaneously. After the print head assembly is printed once, there will be printing filament residue in the nozzle 10 and the throat connected to the nozzle 10. When the print head assembly is reheated, the remaining printing filament will melt by heat and overflow to the outside of the nozzle 10 under the action of gravity. , if the consumables are agglomerated at the bottom opening of the nozzle 10, the nozzle 10 cannot be directly touched. Touching the device 1000 will affect the detection result of the offset between the nozzle 10 and the leveling device 20 . By arranging the cleaning component 60, after the print head assembly is heated and before the detection starts, the printing consumables overflowing from the bottom of the nozzle 10 can be cleaned to ensure that the nozzle 10 directly contacts the contact device 1000 to avoid inaccurate detection results. In one embodiment, the cleaning assembly 60 includes a bracket 61 and a brush 62. One end of the bracket 61 is connected to the forming platform 30. The other end of the bracket 61 extends and is suspended in a direction away from the forming platform 30. The brush 62 is fixed on the bracket. 61 on the hanging end. The guide mechanism 50 drives the print head assembly to move so that the nozzle 10 is opposite to the brush 62, moves the print head assembly downward so that the bottom end of the nozzle 10 contacts the brush 62, and moves the nozzle 10 repeatedly to clean the nozzle 10. The brush 62 can also be other cleaning parts, such as foam.
又一方面,如图21所示,本发明实施例还提供了一种打印控制方法,利用前述任一项的立体成型设备实现,包括:On the other hand, as shown in Figure 21, an embodiment of the present invention also provides a printing control method, which is implemented using any of the aforementioned three-dimensional molding equipment, including:
S11:控制打印头组件的喷嘴推动按压件,以生成检测信号。S11: Control the nozzle of the print head assembly to push the pressing member to generate a detection signal.
控制打印头组件移动,使得喷嘴10与按压件300的顶端相对,继续控制打印头组件向下移动,使得喷嘴10的底端与按压件300的顶端接触,喷嘴10继续向下移动一段距离,触针100将向下移动而与导电件400脱离电性接触,由电性导通状态变为断开状态,继而生成检测信号。Control the movement of the print head assembly so that the nozzle 10 is opposite to the top of the pressing member 300. Continue to control the print head assembly to move downward so that the bottom end of the nozzle 10 is in contact with the top of the pressing member 300. The nozzle 10 continues to move downward for a certain distance. The needle 100 will move downward to break away from electrical contact with the conductive member 400, change from the electrical conduction state to the disconnection state, and then generate a detection signal.
可以理解,控制打印头组件的喷嘴推动按压件,以生成检测信号,包括:It can be understood that controlling the nozzle of the print head assembly to push the pressing member to generate a detection signal includes:
控制打印头组件的喷嘴推动按压件,以使与按压件连接的第一导电装置,与第二导电装置脱离电性接触;其中,与第一导电装置、第二导电装置对应的信号线路发生变化,则生成检测信号。Control the nozzle of the print head assembly to push the pressing member so that the first conductive device connected to the pressing member is out of electrical contact with the second conductive device; wherein, the signal lines corresponding to the first conductive device and the second conductive device change , then a detection signal is generated.
电信号经过第一导电装置和第二导装置,其状态为第一信号,若第一导电装置、第二导装置脱离电性接触,则电信号不能经过第一导电装置和第二导装置,则该信号会发生变化,立体成型设备则可以认为生成了检测信号。The electrical signal passes through the first conductive device and the second conductive device, and its state is the first signal. If the first conductive device and the second conductive device are out of electrical contact, the electrical signal cannot pass through the first conductive device and the second conductive device. Then the signal will change, and the three-dimensional molding equipment can be considered to have generated a detection signal.
可以理解,在控制打印头组件移动,以使喷嘴的底端推动按压件,生成检 测信号之前,可以包括:It can be understood that the print head assembly is controlled to move so that the bottom end of the nozzle pushes the pressing member to generate the inspection Before measuring the signal, you can include:
控制打印头组件和成形平台移动,以使打印头组件和成形平台归零。Control the movement of the print head assembly and the forming platform to zero the print head assembly and the forming platform.
S12:根据检测信号获取打印头组件的第一高度信息h1。S12: Obtain the first height information h1 of the print head assembly according to the detection signal.
立体成型设备的控制装置在检测到触针100与导电件400电性断开,即脱离电性接触时,获取打印头组件的实际高度,即此时打印头组件相对于零点的高度,作为第一高度信息h1。When detecting that the contact pin 100 and the conductive member 400 are electrically disconnected, that is, out of electrical contact, the control device of the three-dimensional molding equipment obtains the actual height of the print head assembly, that is, the height of the print head assembly relative to the zero point at this time, as the third A height information h1.
其中,根据检测信号获取打印头组件的第一高度信息,可以包括:Wherein, obtaining the first height information of the print head assembly according to the detection signal may include:
根据检测信号获得打印头组件的当前坐标;根据检测信号对应的当前坐标,获取打印头组件的第一高度信息;Obtain the current coordinates of the print head assembly according to the detection signal; obtain the first height information of the print head assembly according to the current coordinates corresponding to the detection signal;
立体成型设备运行时,其打印头组件、成型平台的位置坐标是确定的,在生成检测信号时,则可以获取到打印头组件的当前坐标,检测信号对应的当前坐标的高度坐标,即为打印头组件的第一高度信息。When the three-dimensional molding equipment is running, the position coordinates of the print head assembly and the molding platform are determined. When the detection signal is generated, the current coordinates of the print head assembly can be obtained. The height coordinate of the current coordinate corresponding to the detection signal is the printing The first height information of the header component.
S13:控制调平装置感测成型平台的预设点位,以生成调平信号,其中,按压件的静态高度被设置为与预设点位的高度相同。S13: Control the leveling device to sense the preset point of the forming platform to generate a leveling signal, where the static height of the pressing member is set to be the same as the height of the preset point.
可以控制打印头组件移动,以使调平装置与打印头组件同步移动。Printhead assembly movement can be controlled so that the leveling device moves synchronously with the printhead assembly.
静态高度,即按压件被推动前的高度。按压件的静态高度被设置为与预设点位的高度相同,可以尽可能的使得调平的精度高。The static height is the height before the pressing member is pushed. The static height of the pressing member is set to be the same as the height of the preset point, so that the leveling accuracy can be as high as possible.
预设点位为成形平台30上靠近触碰装置1000的一点,如成形平台30的规格为150毫米*150毫米,预设点位为距离成形平台30相对触碰装置1000一侧边沿5毫米的点中距离触碰装置1000最近的一点。预设点位还可以是调平检测点中距离触碰装置1000最近的一点,如成形平台30上均匀分布16个监测点,选取其中距离触碰装置1000最近的一点做为预设点位。控制打印头组件移动以使调平装置20感测成形平台的预设点位的过程可以看作是对一个调平检测点的 调平检测过程,调平装置20感测预设点位,生成调平信号。The preset point is a point on the forming platform 30 close to the touch device 1000. For example, if the specification of the forming platform 30 is 150 mm*150 mm, the preset point is the point closest to the touch device 1000 among the points 5 mm away from the edge of the side of the forming platform 30 relative to the touch device 1000. The preset point can also be the point closest to the touch device 1000 among the leveling detection points. For example, if 16 monitoring points are evenly distributed on the forming platform 30, the point closest to the touch device 1000 is selected as the preset point. The process of controlling the movement of the print head assembly so that the leveling device 20 senses the preset point of the forming platform can be regarded as a leveling detection point. During the leveling detection process, the leveling device 20 senses a preset point and generates a leveling signal.
或者,还可以为使调平装置20感测按压件,生成调平信号。Alternatively, the leveling device 20 may also be configured to sense the pressing member and generate a leveling signal.
其中,控制调平装置感测成型平台的预设点位,以生成调平信号,可以包括:Among them, controlling the leveling device to sense the preset point position of the forming platform to generate a leveling signal may include:
控制调平装置移动,以感测成型平台的预设点位;其中,若调平装置的信号发生变化,则生成调平信号。Control the movement of the leveling device to sense the preset point of the forming platform; if the signal of the leveling device changes, a leveling signal is generated.
当调平装置与成型平台之间的距离达到预设距离,或者调平装置与成型平台接触到一定程度,则调平装置的发出的信号会发生变化,立体成型设备可以根据调平装置的信号发生了变化,确认控制调平装置感测到了成型平台的预设点位。When the distance between the leveling device and the molding platform reaches a preset distance, or the leveling device contacts the molding platform to a certain extent, the signal from the leveling device will change. The three-dimensional molding equipment can adjust the signal according to the signal from the leveling device. A change has occurred, confirm that the control leveling device senses the preset point of the forming platform.
S14:根据调平信号获取打印头组件的第二高度信息h2;S14: Obtain the second height information h2 of the print head assembly according to the leveling signal;
立体成型设备的控制装置获取调平信号生成时打印头组件的实际高度,即此时打印头组件相对于零点的高度,进而得到第二高度信息h2。The control device of the three-dimensional molding equipment obtains the actual height of the print head assembly when the leveling signal is generated, that is, the height of the print head assembly relative to the zero point at this time, and then obtains the second height information h2.
其中,根据调平信号获取打印头组件的第二高度信息,可以包括:Wherein, obtaining the second height information of the print head assembly according to the leveling signal may include:
根据调平信号获得打印头组件的当前坐标;根据调平信号对应的当前坐标,获取打印头组件的第二高度信息。The current coordinates of the print head assembly are obtained according to the leveling signal; and the second height information of the print head assembly is obtained according to the current coordinates corresponding to the leveling signal.
立体成型设备运行时,其打印头组件、成型平台的位置坐标是确定的,在获取到调平信号时,则可以获取到打印头组件的当前坐标,调平信号对应的当前坐标的高度坐标,即为打印头组件的第二高度信息。When the three-dimensional molding equipment is running, the position coordinates of the print head assembly and the molding platform are determined. When the leveling signal is obtained, the current coordinates of the print head assembly can be obtained, and the height coordinates of the current coordinates corresponding to the leveling signal are obtained. That is the second height information of the print head assembly.
S15:根据第一高度信息和第二高度信息确定喷嘴相对调平装置的偏移量。S15: Determine the offset of the nozzle relative to the leveling device based on the first height information and the second height information.
值得说明的是,触针100为与导电件400脱离将向下移动一段距离,这一距离称为脱离距离b,脱离距离b通常非常小,在偏移量的计算中可以忽略不计。或者,脱离距离b可以通过实验测得,以增加调平精度,实际偏移量可为第一 高度信息h1和第二高度信息h2确定的偏移量加上脱离距离b,如偏移量H=h1-h2+b。It is worth mentioning that the contact pin 100 will move downward for a certain distance to separate from the conductive member 400. This distance is called the separation distance b. The separation distance b is usually very small and can be ignored in the calculation of the offset. Alternatively, the breakaway distance b can be measured experimentally to increase the leveling accuracy, and the actual offset can be the first The offset determined by the height information h1 and the second height information h2 is added to the separation distance b, such as offset H=h1-h2+b.
S16:根据偏移量确定打印头组件的打印高度。S16: Determine the printing height of the print head assembly based on the offset.
打印高度,即打印过程中的打印头所处于的高度。打印每层模型时的每层的打印高度不同。根据偏移量确定打印头组件的打印高度,即根据偏移量打印模型。Printing height is the height of the print head during printing. When printing each layer of the model, the printing height of each layer is different. Determine the printing height of the print head assembly based on the offset, that is, print the model based on the offset.
其中,根据偏移量确定打印头组件的打印高度,包括:Among them, the printing height of the print head assembly is determined based on the offset, including:
控制打印头组件移动,以使调平装置感测成形平台上的多个检测点,生成与成形平台平行的平面的平台高度信息;Control the movement of the print head assembly so that the leveling device senses multiple detection points on the forming platform and generates platform height information of a plane parallel to the forming platform;
根据偏移量和平台高度信息确定打印头组件的打印高度。Determine the print height of the printhead assembly based on the offset and platform height information.
在确定偏移量之后,进行成形平台30的调平检测,具体为控制打印头组件移动,以使调平装置20感测成形平台30上的多个检测点,生成与成形平台30平行的平面的平台高度信息。如预设有多个坐标,如预设16个坐标,即对应成形平台30的16个调平检测点,对于每一个检测点,导向机构50带动打印头组件向下移动,使得调平装置20感测调平检测点,生成调平信号,根据调平信号获取打印头组件的实际高度,再控制装置获取每个检测点处打印头组件的实际高度,即获得与成形平台30表面平行的平面的高度信息。After the offset is determined, leveling detection of the forming platform 30 is performed, specifically by controlling the movement of the print head assembly so that the leveling device 20 senses multiple detection points on the forming platform 30 and generates a plane parallel to the forming platform 30 platform height information. If multiple coordinates are preset, for example, 16 coordinates are preset, that is, corresponding to 16 leveling detection points of the forming platform 30. For each detection point, the guide mechanism 50 drives the print head assembly to move downward, so that the leveling device 20 Sense the leveling detection point, generate a leveling signal, obtain the actual height of the print head assembly according to the leveling signal, and then control the device to obtain the actual height of the print head assembly at each detection point, that is, obtain a plane parallel to the surface of the forming platform 30 height information.
根据偏移量和平台高度信息确定打印头组件的打印高度。调平检测时,对于一个检测点处打印头组件的实际高度为d,模型第一层厚度为L,该厚度L为预设值,打印模型第一层时,在该点处,打印头组件的打印高度应为d+H+L。Determine the print height of the printhead assembly based on the offset and platform height information. During leveling detection, the actual height of the print head assembly at a detection point is d, and the thickness of the first layer of the model is L. The thickness L is a preset value. When printing the first layer of the model, at that point, the print head assembly The printing height should be d+H+L.
本发明实施例提出的打印控制方法,通过喷嘴推动按压件生成检测信号而获取第一高度信息,通过调平装置感测成形平台的预设点位生成调平信号而获得第二高度信息,根据第一高度信息和第二高度信息确定喷嘴相对调平装置的 偏移量,实现对喷嘴相对调平装置偏移量的自动获取,而后通过调平装置进行调平检测,根据平台高度信息和偏移量控制打印头组件的打印高度,使得喷嘴底端与成型平台的距离准确,且在打印过程中距离不变,使得模型精准成形,实现无需手动调整喷嘴与打印平台的初始位置,实现自动调平。In the printing control method proposed by the embodiment of the present invention, the first height information is obtained by pushing the pressing member through the nozzle to generate a detection signal, and the second height information is obtained by sensing the preset point of the forming platform through the leveling device to generate a leveling signal. According to The first height information and the second height information determine the position of the nozzle relative to the leveling device. Offset, realize the automatic acquisition of the offset of the nozzle relative to the leveling device, and then perform leveling detection through the leveling device, and control the printing height of the print head assembly according to the platform height information and offset, so that the bottom of the nozzle is in line with the molding The distance between the platforms is accurate and does not change during the printing process, allowing the model to be accurately formed, eliminating the need to manually adjust the initial position of the nozzle and the printing platform, and achieving automatic leveling.
一种实施方式中,在控制调平装置从检测位置移动到收纳位置之前还包括:In one embodiment, before controlling the leveling device to move from the detection position to the storage position, the method further includes:
对成形平台和/或打印头组件加热。Apply heat to the build platform and/or printhead assembly.
喷嘴10和成形平台30受热将发生热胀冷缩效应,使得喷嘴10的底端的位置和/或成形平台30的顶面位置和形状改变,如喷嘴10的底端将变得更低,为了精准的检测偏移量,对成形平台30和/或打印头组件加热,可使得成形平台30和打印头组件的检测环境贴近于实际打印过程中的工作环境,使得偏移量检测和调平检测更加准确,保证打印过程中打印头组件的位置更加准确。When the nozzle 10 and the forming platform 30 are heated, thermal expansion and contraction will occur, causing the position of the bottom of the nozzle 10 and/or the position and shape of the top surface of the forming platform 30 to change. For example, the bottom of the nozzle 10 will become lower. For accuracy Detecting the offset and heating the forming platform 30 and/or the print head assembly can make the detection environment of the forming platform 30 and the print head assembly close to the working environment during the actual printing process, making the offset detection and leveling detection more accurate. Accurate, ensuring that the position of the print head assembly is more accurate during the printing process.
控制打印头组件移动以使喷嘴的底端接触清洁组件,控制打印头组件在清洁组件对应的预设区域内反复移动。The print head assembly is controlled to move so that the bottom end of the nozzle contacts the cleaning assembly, and the print head assembly is controlled to move repeatedly within a preset area corresponding to the cleaning assembly.
使用清洁组件60清洁由于喷嘴10受热溢出的残留耗材,避免喷嘴10无法直接接触触碰装置1000导致检测不准的问题。Use the cleaning component 60 to clean the residual consumables that have overflowed due to the heat of the nozzle 10, to avoid the problem of inaccurate detection caused by the nozzle 10 being unable to directly contact the touch device 1000.
基于上述如图21所示方法,相应的,本发明实施例还提供了一种存储介质,其上存储有计算机程序,计算机程序被处理器执行时实现上述如图21所示的打印控制方法。Based on the above method shown in Figure 21, correspondingly, an embodiment of the present invention also provides a storage medium on which a computer program is stored. When the computer program is executed by a processor, the above printing control method shown in Figure 21 is implemented.
基于这样的理解,本申请的技术方案可以以软件产品的形式体现出来,该软件产品可以存储在一个非易失性存储介质可以是CD-ROM,U盘,移动硬盘等中,包括若干指令用以使得一台计算机设备可以是个人计算机,服务器,或者网络设备等执行本申请各个实施场景的方法。Based on this understanding, the technical solution of this application can be embodied in the form of a software product. The software product can be stored in a non-volatile storage medium, which can be a CD-ROM, U disk, mobile hard disk, etc., and includes a number of instructions. So that a computer device can be a personal computer, a server, or a network device, etc. to execute the methods of each implementation scenario of the present application.
基于上述如图21所示的方法,以及虚拟装置实施例,为了实现上述目的, 本申请实施例还提供了一种立体成型装置,该立体成型装置包括存储介质和处理器;存储介质,用于存储计算机程序;处理器,用于执行计算机程序以实现上述如图21所示的打印控制方法。Based on the above method shown in Figure 21 and the virtual device embodiment, in order to achieve the above purpose, Embodiments of the present application also provide a three-dimensional molding device, which includes a storage medium and a processor; the storage medium is used to store a computer program; and the processor is used to execute the computer program to implement the above as shown in Figure 21 Print control methods.
可选地,该立体成型装置还可以包括用户接口、网络接口、摄像头、射频Radio Frequency,RF电路,传感器、音频电路、WI-FI模块等等。用户接口可以包括显示屏Display、输入单元比如键盘Keyboard等,可选用户接口还可以包括USB接口、读卡器接口等。网络接口可选的可以包括标准的有线接口、无线接口如蓝牙接口、WI-FI接口等。Optionally, the three-dimensional forming device can also include a user interface, a network interface, a camera, a Radio Frequency, an RF circuit, a sensor, an audio circuit, a WI-FI module, etc. The user interface may include a display screen, an input unit such as a keyboard, etc. The optional user interface may also include a USB interface, a card reader interface, etc. Optional network interfaces can include standard wired interfaces, wireless interfaces such as Bluetooth interfaces, WI-FI interfaces, etc.
本领域技术人员可以理解,本实施例提供的一种立体成型装置结构并不构成对该立体成型装置的限定,可以包括更多或更少的部件,或者组合某些部件,或者不同的部件布置。Those skilled in the art can understand that the structure of a three-dimensional molding device provided in this embodiment does not constitute a limitation on the three-dimensional molding device. It may include more or fewer components, or combine certain components, or arrange different components. .
存储介质中还可以包括操作系统、网络通信模块。操作系统是管理和保存计算机设备硬件和软件资源的程序,支持信息处理程序以及其它软件和/或程序的运行。网络通信模块用于实现存储介质内部各组件之间的通信,以及与该实体设备中其它硬件和软件之间通信。The storage medium may also include an operating system and a network communication module. An operating system is a program that manages and saves the hardware and software resources of a computer device and supports the operation of information processing programs and other software and/or programs. The network communication module is used to implement communication between components within the storage medium, as well as communication with other hardware and software in the physical device.
以上,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。 The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, and all of them should be covered. within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims (29)

  1. 一种触碰装置(1000),其特征在于,应用于立体成型设备,所述触碰装置(1000)包括:A touch device (1000), characterized in that it is used in three-dimensional molding equipment, and the touch device (1000) includes:
    连接装置(200);Connecting device(200);
    按压件(300),与连接装置(200)配合,以在外力驱动下相对所述连接装置(200)移动;A pressing member (300) cooperates with the connecting device (200) to move relative to the connecting device (200) under the driving force of an external force;
    第一导电装置,所述第一导电装置与所述连接装置(200)连接,a first conductive device, the first conductive device being connected to the connecting device (200),
    第二导电装置,所述第二导电装置与所述按压件(300)连接,所述按压件(300)相对所述连接装置(200)移动至少包括导通位置和断开位置,所述导通位置时,所述第二导电装置与所述第一导电装置电性接触;所述断开位置时,所述第二导电装置与所述第一导电装置脱离电性接触。A second conductive device, the second conductive device is connected to the pressing member (300), and the pressing member (300) moves relative to the connecting device (200) including at least a conduction position and a disconnection position. In the on position, the second conductive device is in electrical contact with the first conductive device; in the off position, the second conductive device is out of electrical contact with the first conductive device.
  2. 根据权利要求1所述的触碰装置,其特征在于,所述触碰装置还包括:The touch device according to claim 1, characterized in that the touch device further includes:
    所述连接装置(200)上设置有滑槽(210);The connecting device (200) is provided with a chute (210);
    所述按压件(300)设置于所述滑槽(210)内;The pressing member (300) is arranged in the chute (210);
    所述第一导电装置和所述第二导电装置其中一个为导电件(400),另一个为触针(100)。One of the first conductive device and the second conductive device is a conductive member (400), and the other is a contact pin (100).
  3. 根据权利要求2所述的触碰装置,其特征在于,所述触碰装置还包括:The touch device according to claim 2, characterized in that the touch device further includes:
    所述触针(100)用于通过与所述导电件(400)电性接触而与所述导电件(400)电性导通,The contact pin (100) is used to electrically conduct with the conductive member (400) by electrically contacting the conductive member (400),
    所述触针(100)包括主体(101)和端头,所述端头设置于所述主体(101)轴向的一端,所述端头包括外周面(110)和位于所述外周面(110)上的顶点(120);The contact pin (100) includes a main body (101) and an end head. The end head is provided at one axial end of the main body (101). The end head includes an outer peripheral surface (110) and a terminal located on the outer peripheral surface (110). Vertex (120) on 110);
    所述触针(100)通过所述顶点(120)与所述导电件(400)点接触,以与所述导电件(400)电性导通。 The contact pin (100) makes point contact with the conductive member (400) through the vertex (120), so as to be electrically connected with the conductive member (400).
  4. 根据权利要求3所述的触碰装置,其特征在于,所述端头的横截面面积在靠近所述顶点(120)的方向上逐渐减小;The touch device according to claim 3, characterized in that the cross-sectional area of the end gradually decreases in a direction approaching the apex (120);
    所述外周面(110)为球面;The outer peripheral surface (110) is a spherical surface;
    或者,所述外周面(110)为锥面;Alternatively, the outer peripheral surface (110) is a tapered surface;
    或者,所述外周面(110)为锥面,所述锥面的周向上分布有多个凹陷(130),且所述凹陷(130)在所述锥面的母线方向延伸至所述顶点(120)。Alternatively, the outer circumferential surface (110) is a cone surface, with a plurality of depressions (130) distributed in the circumferential direction of the cone surface, and the depressions (130) extend to the vertex (130) in the generatrix direction of the cone surface ( 120).
  5. 根据权利要求2所述的触碰装置,其特征在于,所述触碰装置还包括:The touch device according to claim 2, characterized in that the touch device further includes:
    第一弹性件(500),所述第一弹性件(500)与所述按压件(300)直接或间接接触,所述第一弹性件(500)用于向所述按压件(300)施加使所述按压件(300)由断开位置向导通位置移动的力。A first elastic member (500). The first elastic member (500) is in direct or indirect contact with the pressing member (300). The first elastic member (500) is used to apply force to the pressing member (300). The force that moves the pressing member (300) from the off position to the on position.
  6. 根据权利要求5所述的触碰装置,其特征在于,The touch device according to claim 5, characterized in that:
    所述第一弹性件(500)设置于所述按压件和所述固定装置之间;The first elastic member (500) is provided between the pressing member and the fixing device;
    或者,所述第一弹性件(500)设置于所述按压件(300)的底部和所述滑槽(210)的槽底之间;Alternatively, the first elastic member (500) is provided between the bottom of the pressing member (300) and the bottom of the chute (210);
    或者,所述按压件(300)相对所述滑槽(210)的槽底的一端设置有至少一个安装孔(310),所述第一弹性件(500)的一端插入所述安装孔(310),所述第一弹性件(500)的另一端与所述滑槽(210)的槽壁连接。Alternatively, the pressing member (300) is provided with at least one mounting hole (310) at one end relative to the bottom of the chute (210), and one end of the first elastic member (500) is inserted into the mounting hole (310). ), the other end of the first elastic member (500) is connected to the groove wall of the chute (210).
  7. 根据权利要求2所述的触碰装置,其特征在于,The touch device according to claim 2, characterized in that:
    所述按压件(300)包括让位孔(320);The pressing member (300) includes a relief hole (320);
    所述触针(100)设置于所述按压件(300)内,且所述触针(100)的顶点(120)突出于所述让位孔(320)的底壁;The contact pin (100) is arranged in the pressing member (300), and the apex (120) of the contact pin (100) protrudes from the bottom wall of the relief hole (320);
    所述导电件(400)包括第一基板(410)和第一导电片(420),所述第一基板(410)与所述连接装置(200)固定连接,所述第一基板(410)至少部分 位于所述让位孔(320)内,所述按压件(300)可通过所述让位孔(320)相对所述第一基板(410)活动,所述第一导电片(420)设置于所述第一基板(410)上,且所述第一导电片(420)位于所述让位孔(320)内;The conductive component (400) includes a first substrate (410) and a first conductive sheet (420). The first substrate (410) is fixedly connected to the connection device (200). The first substrate (410) at least partially Located in the relief hole (320), the pressing member (300) can move relative to the first substrate (410) through the relief hole (320), and the first conductive sheet (420) is disposed on On the first substrate (410), and the first conductive sheet (420) is located in the relief hole (320);
    所述触针(100)与所述第一导电片(420)对应,以用于与第一导电片(420)接触或脱离。The contact pin (100) corresponds to the first conductive sheet (420) and is used for contacting or disengaging from the first conductive sheet (420).
  8. 根据权利要求7所述的触碰装置,其特征在于,The touch device according to claim 7, characterized in that:
    所述让位孔(320)贯通于所述按压件(300),所述第一基板(410)穿过所述让位孔(320),且所述第一基板(410)的两端分别与所述连接装置(200)固定连接;The relief hole (320) penetrates the pressing member (300), the first substrate (410) passes through the relief hole (320), and the two ends of the first substrate (410) are respectively Fixedly connected to the connecting device (200);
    或者,所述让位孔(320)贯通于所述按压件(300),所述让位孔(320)位于所述滑槽(210)内,所述第一基板(410)穿过所述让位孔(320),且所述第一基板(410)的两端分别与所述滑槽(210)的内壁固定连接;Alternatively, the relief hole (320) passes through the pressing member (300), the relief hole (320) is located in the slide groove (210), and the first substrate (410) passes through the A relief hole (320) is provided, and both ends of the first base plate (410) are fixedly connected to the inner wall of the chute (210) respectively;
    或者,所述让位孔(320)位于所述滑槽(210)内,所述滑槽(210)包括顶端开口,所述连接装置(200)上设置有贯通所述顶端开口的安装豁口(211),所述第一基板(410)与所述安装豁口(211)固定连接。Alternatively, the relief hole (320) is located in the chute (210), the chute (210) includes a top opening, and the connecting device (200) is provided with an installation gap (200) that passes through the top opening. 211), the first substrate (410) is fixedly connected to the installation gap (211).
  9. 根据权利要求7所述的触碰装置,其特征在于,The touch device according to claim 7, characterized in that:
    所述触针(100)用于通过与所述导电件(400)接触而与所述导电件(400)电性导通,The contact pin (100) is used to electrically conduct with the conductive member (400) by contacting the conductive member (400),
    所述触针(100)包括主体(101)和端头,所述端头设置于所述主体(101)轴向的一端,所述端头包括外周面(110)和位于所述外周面(110)上的顶点(120);The contact pin (100) includes a main body (101) and an end head. The end head is provided at one axial end of the main body (101). The end head includes an outer peripheral surface (110) and a terminal located on the outer peripheral surface (110). Vertex (120) on 110);
    所述触针(100)通过所述顶点(120)与所述导电件(400)点接触,以与所述导电件(400)电性导通; The contact pin (100) is in point contact with the conductive member (400) through the vertex (120) so as to be electrically connected to the conductive member (400);
    所述第一导电片(420)设置于所述第一基板(410)相对于所述触针(100)一侧的表面,所述触针(100)的顶点(120)用于与所述第一导电片(420)点接触;The first conductive piece (420) is disposed on the surface of the first substrate (410) opposite to the contact pin (100), and the vertex (120) of the contact pin (100) is used to contact the contact pin (100). The first conductive piece (420) is in point contact;
    或者,所述第一基板(410)相对于所述触针(100)的一侧设置有凹槽,所述第一导电片(420)设置在所述凹槽的槽壁上,且延伸至所述凹槽的开口边沿,所述外周面(110)的尺寸大于所述凹槽的尺寸,所述触针(100)的顶点(120)用于伸入所述凹槽内,所述触针(100)的外周面(110)用于与所述第一导电片(420)线接触;Alternatively, the first substrate (410) is provided with a groove on one side relative to the contact pin (100), and the first conductive piece (420) is provided on the groove wall and extends to The opening edge of the groove, the size of the outer peripheral surface (110) is larger than the size of the groove, the apex (120) of the contact pin (100) is used to extend into the groove, and the contact pin (100) is used to extend into the groove. The outer peripheral surface (110) of the needle (100) is used to make line contact with the first conductive sheet (420);
    或者,所述第一基板(410)上设置有通孔(411),所述第一导电片(420)设置在所述通孔(411)的孔壁上,且延伸至所述通孔(411)相对于触针(100)一侧的开口边沿,所述外周面(110)的尺寸大于所述凹槽的尺寸,所述触针(100)的顶点(120)用于伸入通孔(411)内,所述触针(100)的外周面(110)用于与所述第一导电片(420)线接触。Alternatively, the first substrate (410) is provided with a through hole (411), and the first conductive sheet (420) is provided on the wall of the through hole (411) and extends to the through hole (411). 411) Relative to the edge of the opening on one side of the contact pin (100), the size of the outer peripheral surface (110) is larger than the size of the groove, and the apex (120) of the contact pin (100) is used to extend into the through hole. (411), the outer peripheral surface (110) of the contact pin (100) is used to make line contact with the first conductive sheet (420).
  10. 根据权利要求7所述的触碰装置,其特征在于,The touch device according to claim 7, characterized in that:
    所述触碰装置还包括第二基板(140),所述第二基板(140)上设置有第二导电片(150),所述触针(100)由相背于所述外周面(110)的第二端与所述第二基板(140)连接,且所述第二端与所述第二导电片(150)电性连接,所述第二基板(140)用于与所述立体成型设备的控制装置电性连接。The touch device also includes a second substrate (140), a second conductive sheet (150) is provided on the second substrate (140), and the contact pin (100) is formed from an angle opposite to the outer peripheral surface (110). ) is connected to the second substrate (140), and the second end is electrically connected to the second conductive sheet (150). The second substrate (140) is used to connect with the three-dimensional The control device of the molding equipment is electrically connected.
  11. 根据权利要求1所述的触碰装置,其特征在于,The touch device according to claim 1, characterized in that
    所述按压件(300)的顶端包括隔热件(600),所述隔热件(600)用于与所述喷嘴(10)接触。The top end of the pressing member (300) includes a heat insulating member (600), and the heat insulating member (600) is used to contact the nozzle (10).
  12. 根据权利要求1-11任一项所述的触碰装置,其特征在于,所述触碰装置还包括: The touch device according to any one of claims 1 to 11, characterized in that the touch device further comprises:
    位置调整组件,所述位置调整组件与所述连接装置(200)的连接状态包括第一连接状态和第二连接状态,所述第一连接状态时,所述位置调整组件与连接装置(200)配合,以在外力驱动下所述连接装置(200)相对所述位置调整组件移动;所述第二连接状态时,所述连接装置(200)相对所述位置调整组件固定连接;Position adjustment component. The connection state between the position adjustment component and the connection device (200) includes a first connection state and a second connection state. In the first connection state, the position adjustment component and the connection device (200) Cooperate, so that the connecting device (200) moves relative to the position adjusting component when driven by an external force; in the second connection state, the connecting device (200) is fixedly connected relative to the position adjusting component;
    所述位置调整组件包括壳体(700)、第一固定件(800)和第二固定件(900),所述连接装置(200)与所述壳体(700)活动连接;The position adjustment assembly includes a housing (700), a first fixing part (800) and a second fixing part (900), and the connecting device (200) is movably connected to the housing (700);
    所述第一固定件(800)用于与所述按压件(300)和所述连接装置(200)连接,以固定或松动所述按压件(300)与所述连接装置(200)的相对位置;The first fixing part (800) is used to connect with the pressing part (300) and the connecting device (200) to fix or loosen the relative position between the pressing part (300) and the connecting device (200). Location;
    所述第二固定件(900)用于与所述连接装置(200)与所述壳体(700)连接,以固定或松动所述连接装置(200)与所述壳体(700)的相对位置。The second fixing member (900) is used to connect the connecting device (200) and the housing (700) to fix or loosen the relative position between the connecting device (200) and the housing (700). Location.
  13. 根据权利要求12所述的触碰装置,其特征在于:所述连接装置(200)上设置有滑槽(210);The touch device according to claim 12, characterized in that: the connecting device (200) is provided with a chute (210);
    所述按压件(300)设置于所述滑槽(210)内;The pressing member (300) is disposed in the sliding groove (210);
    所述连接装置(200)位于所述壳体(700)内,所述按压件(300)穿过所述壳体(700)并部分外露于所述壳体(700)。The connecting device (200) is located inside the shell (700), and the pressing member (300) passes through the shell (700) and is partially exposed outside the shell (700).
  14. 根据权利要求12所述的触碰装置,其特征在于:所述第一固定件(800)用于将所述按压件(300)固定在所述导通位置;The touch device according to claim 12, characterized in that: the first fixing part (800) is used to fix the pressing part (300) in the conductive position;
    所述连接装置(200)上设置有第一固定螺孔(220),所述第一固定通孔(220)贯通所述连接装置(200)的外壁,所述第一固定件(800)为第一螺栓,所述第一螺栓用于螺接于所述第一固定螺孔(220),所述第一螺栓的端部用于挤压所述按压件(300),以固定所述按压件(300)。The connecting device (200) is provided with a first fixing screw hole (220), the first fixing through hole (220) penetrates the outer wall of the connecting device (200), and the first fixing piece (800) is The first bolt is used to be screwed to the first fixing screw hole (220). The end of the first bolt is used to squeeze the pressing member (300) to fix the pressing member. pieces(300).
  15. 根据权利要求12所述的触碰装置,其特征在于, The touch device according to claim 12, characterized in that:
    所述壳体(700)包括内腔以及与所述内腔连通的检测开口(710)和固定件让位口(720),所述连接装置(200)位于所述内腔内,且可在所述内腔中移动,所述按压件(300)通过所述检测开口(710)伸出至内腔外,所述固定件让位口(720)为长条形通孔,所述第一固定件(800)的调节头位于所述固定件让位口(720)内。The housing (700) includes an inner cavity, a detection opening (710) and a fixing member release opening (720) connected to the inner cavity. The connecting device (200) is located in the inner cavity and can be connected to the inner cavity. When moving in the inner cavity, the pressing member (300) extends out of the inner cavity through the detection opening (710), the fixing member release opening (720) is a long through hole, and the first fixing member The adjusting head of the component (800) is located in the fixing component clearance opening (720).
  16. 根据权利要求15所述的触碰装置,其特征在于,The touch device according to claim 15, characterized in that:
    所述壳体上设置有第二固定螺孔(730),所述第二固定螺孔(730)贯通于所述壳体的外壁,所述第二固定件(900)为第二螺栓,所述第二螺栓用于螺接于所述第二固定螺孔(730),所述第二螺栓的端部用于挤压所述连接装置(200),以固定所述连接装置(200)。The housing is provided with a second fixing screw hole (730), the second fixing screw hole (730) penetrates the outer wall of the housing, and the second fixing member (900) is a second bolt, so The second bolt is used to be screwed to the second fixing screw hole (730), and the end of the second bolt is used to squeeze the connecting device (200) to fix the connecting device (200).
  17. 根据权利要求15所述的触碰装置,其特征在于,The touch device according to claim 15, characterized in that:
    所述位置调整组件(700)还包括第二弹性部件(740),所述第二弹性部件(740)设置于所述连接装置(200)和所述壳体(700)之间,所述第二弹性部件(740)用于向所述连接装置(200)施加使所述连接装置(200)向所述检测开口(710)移动的弹力。The position adjustment assembly (700) also includes a second elastic component (740) disposed between the connecting device (200) and the housing (700). The two elastic components (740) are used to apply an elastic force to the connecting device (200) to move the connecting device (200) toward the detection opening (710).
  18. 根据权利要求17所述的触碰装置,其特征在于,The touch device according to claim 17, characterized in that:
    所述连接装置(200)的底端设置有至少一个定位柱(230),所述壳体上包括与所述定位柱(230)相对应的定位柱让位孔(750),所述第二弹性部件(740)的一端与所述定位柱(230)连接,所述第二弹性部件(740)的另一端与所述壳体(700)抵接,所述连接装置(200)相对所述壳体(700)移动时,所述定位柱(230)活动穿插于所述定位柱让位孔(750);The bottom end of the connecting device (200) is provided with at least one positioning post (230), and the housing includes a positioning post relief hole (750) corresponding to the positioning post (230). The second One end of the elastic component (740) is connected to the positioning post (230), the other end of the second elastic component (740) is in contact with the housing (700), and the connecting device (200) is opposite to the When the housing (700) moves, the positioning post (230) is movable and inserted into the positioning post relief hole (750);
    所述第二弹性部件(740)套设在所述定位柱(230)上,所述第二弹性部件(740)的尺寸大于所述定位柱让位孔(750)的尺寸。 The second elastic component (740) is sleeved on the positioning post (230), and the size of the second elastic component (740) is larger than the size of the positioning post relief hole (750).
  19. 根据权利要求15所述的触碰装置,其特征在于,The touch device according to claim 15, characterized in that:
    所述壳体(700)包括外壳(760)和底板(770),所述外壳(760)为空腔结构,所述外壳(760)包括底端开口,所述外壳(760)通过所述底端开口和所述底板(770)连接,以围合成所述内腔,所述检测开口(710)设置于所述外壳(760)上;The housing (700) includes a housing (760) and a bottom plate (770). The housing (760) is a cavity structure. The housing (760) includes a bottom opening. The housing (760) passes through the bottom. The end opening is connected to the bottom plate (770) to enclose the inner cavity, and the detection opening (710) is provided on the outer shell (760);
    所述底板(770)上设置有定位凸起(751),所述定位凸起(751)用于由所述底端开口插入所述外壳(760),并与所述外壳(760)的内壁抵接;The bottom plate (770) is provided with a positioning protrusion (751). The positioning protrusion (751) is used to insert into the housing (760) from the bottom opening and connect with the inner wall of the housing (760). Abut;
    所述外壳(760)上设置有连接头(761),所述连接头(761)在垂直于所述按压件(300)移动的方向上延伸。The housing (760) is provided with a connecting head (761), and the connecting head (761) extends in a direction perpendicular to the movement of the pressing member (300).
  20. 一种触针(100),其特征在于,应用于用于调平的触碰装置(1000),所述触针(100)用于通过与导电件接触而与所述导电件电性导通,A contact pin (100), characterized in that it is used in a touch device (1000) for leveling, and the contact pin (100) is used to electrically conduct with the conductive member by contacting the conductive member. ,
    所述触针(100)包括主体(101)和端头,所述端头设置于所述主体(101)轴向的一端,所述端头包括外周面(110)和位于所述外周面(110)上的顶点(120);The contact pin (100) includes a main body (101) and an end head. The end head is provided at one axial end of the main body (101). The end head includes an outer peripheral surface (110) and a terminal located on the outer peripheral surface (110). Vertex (120) on 110);
    所述触针(100)通过所述顶点(120)与所述导电件点接触,以与所述导电件电性导通。The contact pin (100) makes point contact with the conductive member through the vertex (120), so as to be electrically connected with the conductive member.
  21. 根据权利要求20所述的触针,其特征在于,所述端头的横截面面积在靠近所述顶点(120)的方向上逐渐减小;The stylus of claim 20, wherein the cross-sectional area of the tip gradually decreases in a direction approaching the apex (120);
    所述外周面(110)为球面;The outer peripheral surface (110) is a spherical surface;
    或者,所述外周面(110)为锥面;Alternatively, the outer peripheral surface (110) is a conical surface;
    或者,所述外周面(110)为锥面,所述锥面的周向上分布有多个凹陷(130),且所述凹陷(130)在所述锥面的母线方向延伸至所述顶点(120)。Alternatively, the outer circumferential surface (110) is a cone surface, with a plurality of depressions (130) distributed in the circumferential direction of the cone surface, and the depressions (130) extend to the vertex (130) in the generatrix direction of the cone surface ( 120).
  22. 一种立体成型设备,其特征在于,包括如权利要求1-18中任一项所述 的触碰装置(1000),或权利要求20-21任一项所述的触针(100)。A three-dimensional molding equipment, characterized in that it includes as described in any one of claims 1-18 The touch device (1000), or the stylus (100) according to any one of claims 20-21.
  23. 根据权利要求22所述的立体成型设备,其特征在于,所述立体成型设备还包括底座(40)、导向机构(50)、打印头组件、成形平台(30)和调平装置(20),所述打印头组件包括所述喷嘴(10);The three-dimensional forming equipment according to claim 22, characterized in that the three-dimensional forming equipment further includes a base (40), a guide mechanism (50), a print head assembly, a forming platform (30) and a leveling device (20), The printhead assembly includes the nozzle (10);
    所述打印头组件和所述成形平台(30)分别通过所述导向机构(50)与所述底座(40)连接;The print head assembly and the forming platform (30) are respectively connected to the base (40) through the guide mechanism (50);
    所述触碰装置(1000)与所述成形平台(30)连接,当所述按压件(300)处于所述导通位置时,所述按压件(300)的顶面与所述立体成型设备的成形平台(30)的上表面的预设点位处于同一平面内;The contact device (1000) is connected to the forming platform (30). When the pressing member (300) is in the conductive position, the top surface of the pressing member (300) is in contact with the three-dimensional forming equipment. The preset points on the upper surface of the forming platform (30) are in the same plane;
    所述调平装置(20)与所述打印头组件连接,所述调平装置(20)用于感测所述预设点位或感测所述触碰装置(1000)的按压件(300),以生成调平信号,所述喷嘴(10)用于推动所述按压件(300)。The leveling device (20) is connected to the print head assembly. The leveling device (20) is used to sense the preset point or the pressing member (300) of the touch device (1000). ) to generate a leveling signal, and the nozzle (10) is used to push the pressing member (300).
  24. 根据权利要求23所述的立体成型设备,其特征在于,所述立体成型设备还包括:The three-dimensional molding equipment according to claim 23, characterized in that the three-dimensional molding equipment further includes:
    清洁组件(60),所述清洁组件(60)与所述成形平台(30)连接,用于在使用所述触碰装置(1000)前对所述喷嘴(10)的底端进行清洁。Cleaning assembly (60), the cleaning assembly (60) is connected to the forming platform (30), and is used to clean the bottom end of the nozzle (10) before using the touching device (1000).
  25. 一种打印控制方法,其特征在于,包括:A printing control method, characterized by comprising:
    控制打印头组件的喷嘴推动按压件,以生成检测信号;Control the nozzle of the print head assembly to push the pressing member to generate a detection signal;
    根据所述检测信号获取所述打印头组件的第一高度信息;Acquire first height information of the print head assembly according to the detection signal;
    控制调平装置感测成型平台的预设点位,以生成调平信号;其中,所述按压件的静态高度被设置为与所述预设点位的高度相同;Control the leveling device to sense a preset point of the molding platform to generate a leveling signal; wherein the static height of the pressing member is set to be the same as the height of the preset point;
    根据所述调平信号获取所述打印头组件的第二高度信息;Obtain second height information of the print head assembly according to the leveling signal;
    根据所述第一高度信息和所述第二高度信息确定所述喷嘴相对所述调平装 置的偏移量;The relative position of the nozzle to the leveling device is determined based on the first height information and the second height information. offset;
    根据所述偏移量确定所述打印头组件的打印高度。The print height of the print head assembly is determined based on the offset.
  26. 根据权利要求25所述的打印控制方法,其特征在于,The printing control method according to claim 25, characterized in that:
    所述根据所述偏移量确定所述打印头组件的打印高度,包括:Determining the printing height of the print head assembly according to the offset includes:
    控制打印头组件移动,以使所述调平装置感测所述成形平台上的多个检测点,生成与所述成形平台平行的平面的平台高度信息;Control the movement of the print head assembly so that the leveling device senses multiple detection points on the forming platform and generates platform height information of a plane parallel to the forming platform;
    根据所述偏移量和所述平台高度信息确定所述打印头组件的打印高度。The print height of the print head assembly is determined based on the offset and the platform height information.
  27. 根据权利要求25所述的打印控制方法,其特征在于,The printing control method according to claim 25, characterized in that:
    所述控制打印头组件移动,以使所述打印头组件的底端推动所述按压件,生成检测信号之前,还包括:Controlling the movement of the print head assembly so that the bottom end of the print head assembly pushes the pressing member and before generating a detection signal also includes:
    对所述成形平台和/或所述打印头组件加热;heating the forming platform and/or the printhead assembly;
    在所述对所述成形平台和/或所述打印头组件加热之后,还包括:After the heating of the forming platform and/or the print head assembly, the method further includes:
    控制所述打印头组件移动以使所述喷嘴的底端接触所述清洁组件;Controlling movement of the printhead assembly so that the bottom end of the nozzle contacts the cleaning assembly;
    控制所述打印头组件在所述清洁组件对应的预设区域内反复移动。The print head assembly is controlled to move repeatedly within a preset area corresponding to the cleaning assembly.
  28. 根据权利要求25所述的打印控制方法,其特征在于,The printing control method according to claim 25, characterized in that:
    所述控制打印头组件的喷嘴推动按压件,以生成检测信号,包括:The control of the nozzle of the print head assembly to push the pressing member to generate a detection signal includes:
    控制打印头组件的喷嘴推动按压件,以使与所述按压件连接的第一导电装置,与第二导电装置脱离电性接触;其中,与所述第一导电装置、所述第二导电装置对应的信号线路发生变化,则生成所述检测信号;Control the nozzle of the print head assembly to push the pressing member so that the first conductive device connected to the pressing member is out of electrical contact with the second conductive device; wherein, the first conductive device and the second conductive device are If the corresponding signal line changes, the detection signal is generated;
    所述根据所述检测信号获取所述打印头组件的第一高度信息,包括:Obtaining the first height information of the print head assembly according to the detection signal includes:
    根据所述检测信号获得所述打印头组件的当前坐标;Obtain the current coordinates of the print head assembly according to the detection signal;
    根据所述检测信号对应的当前坐标,获取所述打印头组件的第一高度信息;Obtain the first height information of the print head assembly according to the current coordinates corresponding to the detection signal;
    所述控制调平装置感测成型平台的预设点位,以生成调平信号,包括: The control leveling device senses the preset point of the forming platform to generate a leveling signal, including:
    控制调平装置移动,以感测成型平台的预设点位;其中,若所述调平装置的信号发生变化,则生成调平信号;Control the movement of the leveling device to sense the preset point of the forming platform; wherein, if the signal of the leveling device changes, a leveling signal is generated;
    所述根据所述调平信号获取所述打印头组件的第二高度信息,包括:Obtaining the second height information of the print head assembly according to the leveling signal includes:
    根据所述调平信号获得所述打印头组件的当前坐标;Obtain the current coordinates of the print head assembly according to the leveling signal;
    根据所述调平信号对应的当前坐标,获取所述打印头组件的第二高度信息。According to the current coordinates corresponding to the leveling signal, the second height information of the print head assembly is obtained.
  29. 一种存储介质,其上存储有计算机程序,其特征在于,所述计算机程序被处理器执行时实现权利要求25-28中任一项所述的打印控制方法。 A storage medium on which a computer program is stored, characterized in that when the computer program is executed by a processor, the printing control method according to any one of claims 25-28 is implemented.
PCT/CN2023/104583 2022-09-21 2023-06-30 Touch apparatus, contact pin, three-dimensional forming device and printing control method WO2024060772A1 (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103552243A (en) * 2013-10-17 2014-02-05 东莞市拓斯普达机械科技有限公司 Method for calibrating molding plane and nozzle movement plane
CN107116787A (en) * 2017-06-16 2017-09-01 浙江大学 The leveling system and its range unit and leveling method of a kind of 3 D-printing platform
CN112248433A (en) * 2020-10-30 2021-01-22 深圳市创想三维科技有限公司 Automatic leveling device, 3D printer and leveling method
CN112659555A (en) * 2020-11-30 2021-04-16 深圳市创想三维科技有限公司 Leveling device and method for electromagnetic 3D printer
CN113650294A (en) * 2021-10-20 2021-11-16 深圳市越疆科技有限公司 Automatic leveling zero-setting device and printer
CN114559663A (en) * 2022-01-27 2022-05-31 深圳市纵维立方科技有限公司 Leveling device and 3D printer
EP4046776A1 (en) * 2020-12-21 2022-08-24 Shenzhen Creality 3D Technology Co., Ltd. Automatic leveling device for 3d printer, and 3d printer
CN218876288U (en) * 2022-09-21 2023-04-18 深圳市纵维立方科技有限公司 Touch device, contact pin and three-dimensional forming equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103552243A (en) * 2013-10-17 2014-02-05 东莞市拓斯普达机械科技有限公司 Method for calibrating molding plane and nozzle movement plane
CN107116787A (en) * 2017-06-16 2017-09-01 浙江大学 The leveling system and its range unit and leveling method of a kind of 3 D-printing platform
CN112248433A (en) * 2020-10-30 2021-01-22 深圳市创想三维科技有限公司 Automatic leveling device, 3D printer and leveling method
CN112659555A (en) * 2020-11-30 2021-04-16 深圳市创想三维科技有限公司 Leveling device and method for electromagnetic 3D printer
EP4046776A1 (en) * 2020-12-21 2022-08-24 Shenzhen Creality 3D Technology Co., Ltd. Automatic leveling device for 3d printer, and 3d printer
CN113650294A (en) * 2021-10-20 2021-11-16 深圳市越疆科技有限公司 Automatic leveling zero-setting device and printer
CN114559663A (en) * 2022-01-27 2022-05-31 深圳市纵维立方科技有限公司 Leveling device and 3D printer
CN218876288U (en) * 2022-09-21 2023-04-18 深圳市纵维立方科技有限公司 Touch device, contact pin and three-dimensional forming equipment

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