WO2024055990A1

WO2024055990A1 - Filler for packaging material and preparation method therefor, magnetic plastic packaging material, and packaged device

Info

Publication number: WO2024055990A1
Application number: PCT/CN2023/118549
Authority: WO
Inventors: 喻志刚; 周俭军; 严文博; 王天鹏; 梁迪飞; 李维佳; 杨光; 邓龙江
Original assignee: 华为技术有限公司; 电子科技大学
Priority date: 2022-09-14
Filing date: 2023-09-13
Publication date: 2024-03-21
Also published as: CN117735970A

Abstract

Provided in the present application are a filler for a packaging material and a preparation method therefor, a magnetic plastic packaging material, and a packaged device. The filler for a packaging material comprises ferrite particles, which comprise a nickel-copper-zinc ferrite (NiaZnbCucFedO4) material, wherein the value range of a is 0.3-0.55, the value range of b is 0.45-0.55, the value range of c is 0-0.2, and the value range of d is 1.8-2; and in the ferrite particles, the number of particles having a particle size of 2-11 μm accounts for 50-70%. The filler has the advantages of a low relative density, a wide absorption frequency band and good high-temperature and low-temperature properties, such that the overall mass of a packaged device can be reduced, and the anti-electromagnetic interference frequency band and suitable temperature range of the packaged device are improved.

Description

Fillers for packaging materials and preparation methods thereof, magnetic plastic packaging materials and packaging devices

Cross-references to related applications

This application requires the priority of the Chinese patent application submitted to the China Patent Office on September 14, 2022, with the application number 202211117439.3 and the application name "Fillers for packaging materials and preparation methods thereof, magnetic plastic packaging materials and packaging devices", which The entire contents are incorporated herein by reference.

Technical field

The present application relates to the field of packaging, specifically to a filler for packaging materials and a preparation method thereof, magnetic plastic packaging materials and packaging devices.

Background technique

With the development of electronic technology, the development of integrated circuits and electronic products has shown a trend of high integration and micro-wiring. Chips have also shown a trend of large-scale, high-power, high-precision and multi-functionality. Therefore, Due to the decrease in distance and increase in power between the functional modules in the integrated circuit, the electromagnetic interference problem between the functional modules is becoming increasingly serious. Therefore, in order to reduce the electromagnetic interference between the functional modules, it is necessary to propose electronic packaging solutions. higher requirements. One of the existing solutions is to add ferrite, such as ferroferric oxide powder, into the molding resin, mix and stir evenly to obtain the required magnetic molding material. As a traditional magnetic absorbing material, ferric oxide has problems such as high relative density, narrow absorption band, poor particle dispersion, and poor high and low temperature performance, which can easily cause the overall quality of packaged devices to be high and easily cause the packaged devices to become damaged. The anti-electromagnetic interference frequency band and applicable temperature range are too narrow, and are not suitable for wide frequency bands and application environments with large temperature differences.

Contents of the invention

This application provides a filler for packaging materials and a preparation method thereof, a magnetic plastic packaging material and a packaging device to reduce the density of the magnetic packaging material, improve its absorption frequency band and high and low temperature performance, thereby reducing the overall quality of the packaging device and improving The anti-electromagnetic interference frequency band and applicable temperature range of the packaged device.

In a first aspect, the present application provides a filler for packaging materials, including ferrite particles, and the ferrite particles include nickel copper zinc ferrite (Ni _a Zn _b Cu _c Fe _d O ₄ ) material, wherein, The value range of a is 0.3-0.55, the value range of b is 0.45-0.55, the value range of c is 0-0.2, and the value range of d is 1.8-2; among the ferrite particles, the particle size The number of particles with a diameter of 2-11 μm accounts for 50-70%.

The filler of this application contains ferrite material with the molecular formula Ni _a Zn _b Cu _c Fe _d O ₄ , and the proportion of particles with a particle size of 2-11 μm in the ferrite particles is limited to 50-70 % range, so that the obtained filler has better magnetic loss performance between 0.5 and 6GHz, broadens the absorption frequency band of the filler, and enables the packaged device packaged using the filler to have a wider anti-electromagnetic interference frequency band. In addition, experiments have proven that the filler of the present application can provide anti-interference capability in a wider temperature range (such as -40°C ~ 125°C), thereby enabling the packaged devices using the filler to have a wider applicable temperature. This prevents the packaged devices from experiencing a significant attenuation of the diamagnetic properties due to temperature changes.

In an optional implementation manner, the real part of the magnetic permeability of the filler is in the range of 2-5, and the imaginary part of the magnetic permeability of the filler is in the range of 1.5-2. In an optional implementation, the filler has an absorbing frequency range of 0.5 to 6 GHz. Therefore, the filler can have the advantages of high magnetic permeability and wide wave absorption range.

In an optional implementation manner, in the filler, the mass proportion of ferrite particles in the filler is greater than or equal to 70%.

In an optional implementation, the filler also includes auxiliary materials, and the particle size of the auxiliary materials is 0.6-2 μm. Among them, the auxiliary material can be a non-magnetic material, and selecting a non-magnetic auxiliary material with a particle size of 0.6-2 μm can help improve the fluidity of the ferrite.

In an optional implementation, the auxiliary material includes at least one of the following elements: silicon, aluminum, or beryllium. Among them, silicon, aluminum or beryllium can be present in the filler in the form of oxides.

In a second aspect, this application provides a filler for packaging materials, including ferrite particles. Among the ferrite particles, the number of particles with a particle size of 2-11 μm accounts for 50-70%; wherein, the ferrite particles The particles include the following raw material components in terms of molar percentage: nickel oxide 15%-27.5%, zinc oxide 22.5%-27.5%, and the rest includes iron oxide.

In the filler of the present application, the ferrite particles are the main components of the ferrite particles, which are mainly composed of NiO, ZnO and Fe ₂ O _3. By controlling the Ni/Zn ratio, the anisotropy of the crystal of the ferrite particles can be adjusted. , the ferrite particles of this application are combined with specific components of NiO, ZnO and Fe ₂ O ₃ , and the proportion of particles with a particle size of 2-11 μm in the ferrite particles is limited to 50-70% Within the scope, the filler containing the ferrite particles can make it in the plastic packaging material on the premise of meeting the basic mechanical properties, electrical properties, thermal properties and processability It has good magnetic loss performance between 0.5 and 6GHz, broadens the absorption band of the filler, and enables packaged devices using this filler to have a wider anti-electromagnetic interference frequency band. In addition, experiments have proven that the filler of the present application can provide anti-interference capabilities in a wider temperature range, thereby having a wider applicable temperature for the packaged devices using the filler, and avoiding the antimagnetic properties of the packaged devices due to temperature changes. A larger attenuation occurs.

In an optional implementation, the raw material components of the ferrite particles further include copper oxide. By increasing the Cu content, the grain size of the ferrite can be increased and the sintering density can be increased, thereby further regulating the magnetic properties of the ferrite.

In an optional implementation, the sum of the molar content of the copper oxide and the molar content of the nickel oxide is 15%-27.5%. In an optional implementation, the molar content of the copper oxide is 7.5%-10%. In an optional implementation, the molar content of the nickel oxide is 15%-17.5%. The minimum molar content of NiO can be 15%. The ferrite particles of this component can have good resistance properties, the resistivity can be greater than or equal to 1×10 ¹³ Ω·cm, and have a low thermal expansion coefficient. And it has good magnetic loss performance in the wide frequency range of 0.5~6GHz.

In an optional implementation, the mass proportion of the ferrite particles in the filler is greater than or equal to 70%. In an optional implementation, the filler further includes an auxiliary material, and the particle size of the auxiliary material is 0.6-2 μm. Wherein, the auxiliary material includes but is not limited to at least one of silica, aluminum oxide, and beryllium oxide.

In a third aspect, the present application provides a preparation method of the filler of the present application, which preparation method includes:

Mixed raw materials containing nickel source, zinc source, iron source and optional copper source are sequentially sintered and pulverized to obtain the ferrite particles; among the ferrite particles, the particle size is 2-11 μm. The quantity ratio is 50-70%;

After mixing the ferrite and the auxiliary material, the filler of the packaging material is obtained.

The properties of the ferrite obtained by this preparation method are similar to those of the ferrite of the first aspect of the present application. For specific properties, reference may be made to the description of the ferrite of the first aspect of the present application, which will not be repeated here.

In an optional implementation, the mixed raw materials further include the steps of primary ball milling, pre-sintering and secondary ball milling before sintering.

In an optional implementation, the time of one ball milling is 3-4 hours. Through one-time ball milling, each raw material can be formed into small particles with a certain distribution, which can increase the specific surface area of each raw material particle, improve the reactivity of each raw material during the pre-sintering process, and promote the solid phase reaction.

In an optional implementation, the pre-sintering temperature is 800-920°C, and the pre-sintering time is 4-6 hours. Through pre-sintering, preliminary solid-state reactions can occur in each raw material oxide, reducing the shrinkage of the material during sintering, improving the compressibility of the material, and helping to improve the performance of the ferrite.

In an optional implementation, the secondary ball milling time is 10-12 hours. Through secondary ball milling, the pre-sintered blanks with uneven grain size distribution and incomplete solid-phase reaction can be ground into fine pieces to obtain the powder particle size required for molding. At the same time, the secondary ball milling can further separate the pre-sintered materials. It increases the surface area of its particles to reach the contact surface required during sintering, improves sintering activity, and promotes product densification and grain growth.

In an optional implementation, the sintering temperature is 920-950°C, and the sintering time is 4-6 hours. Through sintering treatment, the material after secondary ball milling can undergo a solid-phase reaction, bonding the internal particles to each other, expelling gas, and improving the density and properties of the material.

In an optional implementation, the preparation method further includes the step of crushing the sintered material, and the particle size D50 of the ferrite obtained after crushing is 3.5-7 μm. Ferrite with this particle size is more conducive to improving the dispersion of ferrite.

In a fourth aspect, the application provides a magnetic molding material. The magnetic molding material includes a molding resin and the filler of the third aspect of the application. The mass proportion of the filler in the magnetic molding material is 75%-92 %.

The magnetic plastic packaging material of the present application can be used for packaging chips, radio frequency modules or electronic components to improve the anti-electromagnetic interference capabilities of chips, radio frequency modules or electronic components.

In a fifth aspect, the present application provides a packaged device, which is packaged using the magnetic plastic packaging material of the fourth aspect of the present application. Among them, packaged devices include but are not limited to chips, radio frequency modules or electronic components.

The technical effects that can be achieved by the above-mentioned third aspect and the fifth aspect can be described with reference to the corresponding effects in the above-mentioned first aspect, and will not be repeated here.

Among them, the data in the above possible implementation methods of this application, such as the mole percentage of each component, the particle size of ferrite, temperature, time and other data, when measuring, the values within the engineering measurement error range should be understood as Within the scope limited by this application.

Description of drawings

Figure 1 is a schematic structural diagram of a packaged device according to an embodiment;

Figure 2 is a process flow chart for the preparation of magnetic plastic packaging materials according to an embodiment;

FIG3 is a schematic structural diagram of a magnetic plastic packaging material according to an embodiment;

Figure 4 is a real part test chart of the magnetic permeability of the magnetic plastic packaging material of Example 1;

Figure 5 is a test chart of the imaginary part of the magnetic permeability of the magnetic plastic packaging material of Example 1.

Reference number:

10-Packaging device; 11-Packaging shell;

20-magnetic plastic sealing material; 21-ferrite particles; 22-auxiliary material particles; 23-plastic sealing resin.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

The terminology used in the following examples is for the purpose of describing specific embodiments only and is not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "the" are intended to also Expressions such as "one or more" are included unless the context clearly indicates otherwise.

Reference in this specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Therefore, the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in other embodiments", etc. appearing in different places in this specification are not necessarily References are made to the same embodiment, but rather to "one or more but not all embodiments" unless specifically stated otherwise. The terms “including,” “includes,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized.

Magnetic absorbing material: refers to a magnetic material that absorbs or significantly weakens the electromagnetic waves received on its surface to reduce the interference of electromagnetic waves.

Magnetic permeability: It is the relative magnetic permeability actually tested in engineering applications. The relative magnetic permeability is the ratio of the absolute magnetic permeability of the material and the magnetic constant (also known as the vacuum magnetic permeability). The absolute magnetic permeability refers to the magnetic material. The ratio of magnetic induction intensity to magnetic field intensity.

Absorbing frequency band: The electromagnetic wave frequency range in which the absorbing material can absorb or weaken electromagnetic wave energy.

Moles: The unit of quantity of a substance, which is the ratio of the mass of the substance/the molar mass of the substance.

Existing magnetic absorbing materials, such as ferroferric oxide, have a relatively high density, which is not conducive to reducing the overall quality of packaged devices; in addition, their absorption frequency band is narrow and their anti-interference ability against electromagnetic waves of different frequency bands is poor, which makes The application range of packaged devices is single, which reduces its frequency band application range; furthermore, ferroferric oxide has poor high and low temperature performance. When used at higher temperatures and lower temperatures, the anti-interference performance will be significantly reduced.

In order to solve the above technical problems, this application provides a filler for packaging materials. The filler in the embodiment of the present application includes ferrite particles, and the ferrite particles include a material with a molecular formula of Ni _a Zn _b Cu _c Fe _d O ₄ , where O is oxygen, and in the molecular formula of the ferrite particles, The number of atoms of O is 4; Ni is nickel, and the value range of a is 0.3-0.55; Zn is zinc, and the value range of b is 0.45-0.55; Cu is copper, and the value range of c is 0-0.2; Fe is iron, and the value range of d is 1.8-2; among them, "molecular formula" should be understood as the elemental composition of ferrite. In one embodiment, among the ferrite particles, the number of particles with a particle size of 2-11 μm accounts for 50-70%.

The filler with the above molecular formula can have a real part of magnetic permeability of 2-5 and an imaginary part of magnetic permeability of 1.5-2. At the same time, the ferrite's wave absorption frequency range can be 0.5 ~ 6GHz.

Among the ferrite particles in the embodiments of the present application, the number of particles with a particle size of 2-11 μm accounts for 50-70%. For example, the proportion of particles with a particle size of 2-11 μm may be 50%-55%, 55%-60%, 60%-65% or 65%-70%.

In order to improve the molding performance of the filler, in an optional embodiment, the filler also includes auxiliary materials. In one embodiment, the auxiliary material may be a non-magnetic material. In one embodiment, the auxiliary material may be in granular form. Based on the mass of the filler, the proportion of ferrite particles is greater than or equal to 70%, and the proportion of auxiliary materials is less than or equal to 30%. In one embodiment, the auxiliary material may include, for example, at least one of the following elements: silicon Si, and/or aluminum Al, and/or beryllium Bi. Silicon, aluminum or beryllium can be present in the filler in the form of oxides. Among them, the particle size of the auxiliary material can be 0.6-2 μm. By adding auxiliary materials with specific particle sizes, it can help to improve the fluidity of ferrite, thereby improving the dispersion of ferrite particles, that is to say, improving the uniformity of ferrite particles in the filler. The particles are more evenly distributed in the filler.

Based on the same technical concept, embodiments of the present application also provide a filler, wherein the filler includes ferrite particles, and among the ferrite particles, the number of particles with a particle size of 2-11 μm accounts for 50 -70%; wherein, the ferrite particles may include the following raw material components: nickel oxide NiO 15mol%-27.5mol%, zinc oxide ZnO 22.5mol%-27.5mol%, and the remainder includes iron oxide Fe ₂ O ₃ . In one embodiment, in addition to ferrite particles, the filler of the present application may also include auxiliary materials, such as silicon dioxide SiO ₂ , and/or at least one of aluminum oxide Al ₂ O ₃ and/or beryllium oxide BiO.

Among them, based on the mole number of ferrite particles, the mole percentage of NiO in the ferrite particles is typically but not limited to 15 mol%, 15.5 mol%, 16 mol%, 16.5 mol%, 17 mol%, 17.5 mol% , 18mol%, 18.5mol%, 19mol%, 20mol%, 21mol%, 22mol%, 23mol%, 24mol%, 25mol%, 26mol%, 27mol% or 27.5mol%. Wherein, the lower limit of the molar percentage of NiO in the ferrite particles can be any of the above values and the intermediate value between any two values, for example, it can be 15 mol%, 15.5 mol%, 16 mol%, 16.5 mol% or any two of the above values. The upper limit of the molar percentage of NiO can be any of the above values and the intermediate value between any two values, for example, it can be 17mol%, 17.5mol%, 20mol%, 22mol%, 24mol%, 26mol%, 27.5mol% or more The value between any two values.

Among them, based on the mole number of ferrite particles, the mole percentage of ZnO in the ferrite particles is typically but not limited to 22.5 mol%, 23 mol%, 23.5 mol%, 24 mol%, 24.5 mol%, 25 mol% , 25.5mol%, 26mol%, 26.5mol%, 27mol% or 27.5mol%. Wherein, the lower limit of the molar percentage of ZnO in the ferrite particles can be any of the above values and the intermediate value between any two values, for example, it can be 22.5 mol%, 23 mol%, 23.5 mol%, 24 mol% or any two of the above values. The upper limit of the molar percentage of ZnO can be any of the above values and the intermediate value between any two values, for example, it can be 25.5 mol%, 26 mol%, 26.5 mol%, 27 mol%, 27.5 mol% or any two of the above values. numerical value.

Among them, in an optional embodiment of the present application, the raw material composition of the ferrite particles may also include CuO. Among them, CuO replaces NiO in the ferrite at an equal molar ratio. When ferrite particles contain CuO, the minimum molar content of NiO is 15%. That is, when the ferrite contains CuO, the total molar content of CuO and NiO is in the range of 15%-27.5%, and at the same time, the minimum molar content of NiO is 15%.

In an optional embodiment, the molar content of CuO is 7.5 mol%-10 mol%. In an optional embodiment, in terms of molar percentage, the ferrite particles include the following raw material components: NiO 15%-17.5%, ZnO 22.5%-27.5%, CuO 7.5%-10%, and the rest is Fe ₂ O ₃ . The mole percentage of CuO in the ferrite is typically, but not limited to, 7.5 mol%, 8 mol%, 8.5 mol%, 9 mol%, 9.5 mol% or 10 mol% based on the mole number of ferrite particles. Wherein, the lower limit of the molar percentage of CuO in the ferrite particles can be any of the above values and the intermediate value between any two values, for example, it can be 7.5 mol%, 7.6 mol%, 7.7 mol%, 7.8 mol%, 7.9 mol% , 8 mol% or the value of any two values above; the upper limit of the mole percentage of CuO can be any of the above values and the intermediate value of any two values, for example, it can be 9 mol%, 9.1 mol%, 9.2 mol%, 9.3 mol%, 9.4mol%, 9.5mol%, 9.6mol%, 9.7mol%, 9.8mol%, 9.9mol%, 10mol% or any two of the above values.

The composition of the filler in the embodiment of the present application has been explained above, and the preparation method of the filler in the embodiment of the present application will be explained below.

The preparation method of the filler in the embodiment of the present application may include the following steps S11-S12:

S11. The mixed raw materials containing nickel source, zinc source, iron source and optional copper source are sintered and pulverized in sequence to obtain the ferrite particles; among the ferrite particles, the particle size is 2-11 μm. The number of particles accounts for 50-70%. Wherein, the nickel source is a substance containing nickel element, for example, it can be nickel element, nickel oxide, etc. The zinc source can be zinc element, zinc oxide, etc. The iron source can be iron element, iron oxide, etc.

S12. After mixing the ferrite and the optional auxiliary material, a filler of the packaging material is obtained.

Wherein, before sintering the mixed raw materials, the steps of primary ball milling, pre-sintering and secondary ball milling are also included.

Among them, the time for one ball milling can be 3-4 hours (unit: h). For example, the time of one ball milling may be 3h-3.5h or 3.5h-4h.

The pre-sintering temperature is 800-920℃, and the pre-sintering time is 4-6h. For example, the pre-sintering temperature may be 800°C, 810°C, 820°C, 830°C, 840°C, 850°C, 860°C, 870°C, 880°C, 890°C or 900°C or any two adjacent ones above. Temperature within the numerical range; the pre-sintering time can be 4h, 4.5h, 5h, 5.5h or 6h or a time within any two adjacent numerical ranges above.

The secondary ball milling time can be 10-12 hours. For example, the time of secondary ball milling can be 10h, 11h or 12h or a time within any two adjacent numerical ranges above.

The sintering temperature can be 920-950°C, and the sintering time can be 4-6h. For example, the sintering temperature can be 920°C, 925°C, 930°C, 935°C, 940°C, 945°C or 950°C or a temperature within any two adjacent numerical ranges above; the sintering time can be 4 hours , 4.5h, 5h, 5.5h or 6h or a time within any two adjacent numerical ranges above.

In an embodiment of the present application, in the method for preparing ferrite particles, the particle size D50 of the ferrite obtained after crushing is 3.5-7 μm.

Based on the same purpose of the invention, embodiments of the present application also provide a magnetic plastic sealing material. The magnetic plastic sealing material includes the filler of the embodiment of the present application, wherein the mass proportion of the filler in the magnetic plastic sealing material is 75%-92%. . The magnetic molding material also includes molding resin, such as epoxy resin, which acts as a bonding agent for the filler. The mass proportion of the resin material in the magnetic molding material may be, for example, 8%-25%. In addition to this, the magnetic molding material can also include coupling agents, reinforcing agents, pigments and other additions.

Based on the same purpose of the invention, the present application also provides a packaged device. Figure 1 is a schematic structural diagram of a packaged device. As shown in Figure 1, the packaged device 10 may include a packaging shell 11 and a device disposed inside the packaging shell 11. Functional device, wherein the packaging shell 11 can be packaged using the magnetic plastic sealing material of the embodiment of the present application, wherein the present invention can be used. The packaged device of the embodiment of the present application may have the advantages of light package weight, wide applicable frequency bandwidth, and wide applicable temperature range.

The ferrite of the present application will be further described in detail below with reference to specific examples and comparative examples.

Example 1

This embodiment is a magnetic plastic sealing material. Figure 2 is a schematic diagram of the preparation process of the magnetic plastic sealing material of one embodiment. Figure 3 is a schematic structural diagram of the magnetic plastic sealing material of one embodiment. Referring to Figures 2 and 3 together, the preparation process of the magnetic plastic sealing material includes the following steps:

Step S1, provide raw materials: NiO, ZnO, CuO, Fe ₂ O ₃ are used as raw materials, the contents are as follows, NiO: 16 mol%, ZnO: 25 mol%, CuO: 9 mol%, and the balance is Fe ₂ O ₃ ;

Step S2, mixing of raw materials: ball-mill the raw materials obtained in step S1 for 3-4 hours. The slurry obtained after ball-milling is placed in an oven for drying. After drying, it is crushed to obtain a uniformly mixed powder;

Step S3: Pre-calcin the uniformly mixed powder obtained in Step S2 at a pre-calcination temperature of 800-920°C and a pre-calcination time of 4-6 hours. After natural cooling, crush it to obtain pre-burned material;

Step S4: Perform secondary ball milling on the calcined material obtained in step S3. The ball milling time is 10-12 hours. The slurry obtained after ball milling is put into an oven to dry. After drying, the powder is crushed and then sintered. The sintering temperature is 920-950°C, the sintering time is 4-6 hours, and the ferrite block is obtained after natural cooling;

Step S5: Perform a coarse crushing of the ferrite block obtained in Step S4, and pass the obtained coarsely crushed powder into fine powder through a mechanical crusher with a particle size distribution D50=2-11 to obtain ferrite particles; Among them, the number of particles with a particle size of 2-11 μm accounts for 50%.

Step S6: Fully mix the ferrite particles 21 obtained in step S5 and the non-ferrite (for example, fumed silica) particles 22 to obtain a filler. As shown in Figure 3, in the filler, the ferrite particles 21 are The mass proportion is 83%, and the mass proportion of fumed silica particles is 17%;

Step S7: Use the obtained filler as a filler for the magnetic molding material to prepare the magnetic molding material: Referring to Figure 3, combine the filler (ferrite particles 21 and non-ferrite particles 22) with the molding resin 23 and optional additives, etc. Mix and prepare the magnetic plastic packaging material 20 through a plastic packaging material preparation process, such as a molding process, wherein the mass proportion of the filler in the magnetic plastic packaging material 20 is 90%, and the total mass proportion of the plastic packaging resin 23 and additives is 10% .

Figure 4 is a test chart of the real part of the magnetic permeability of the magnetic plastic packaging material in the embodiment of the present application, and Figure 5 is a test chart of the imaginary part of the magnetic permeability of the magnetic plastic packaging material of Example 1. Among them, the abscissa represents frequency, and the ordinate represents magnetic performance. It can be seen from Figure 4 and Figure 5 that the magnetic plastic packaging material has a wide operating frequency up to 5GHz and has high magnetic properties in the 3GHz range. The real part of the magnetic permeability is greater than 2 and the imaginary part is greater than 1.5. The peak value of the imaginary part of the magnetic permeability is where The frequency is the optimal operating frequency.

Example 2

This embodiment is a magnetic plastic sealing material. The difference from Example 1 is that the raw material composition is different. The raw material composition of the ferrite in the magnetic plastic sealing material of this embodiment is as follows: NiO, ZnO, CuO, Fe ₂ O ₃ are used as The contents of the raw materials are as follows: NiO: 15 mol%, ZnO: 27.5 mol%, CuO: 10 mol%, and the balance is Fe ₂ O ₃ . The rest of the preparation process is as described in Example 1.

Example 3

This embodiment is a magnetic plastic sealing material. The difference from Example 1 is that the raw material composition is different. The raw material composition of the ferrite in the magnetic plastic sealing material of this embodiment is as follows: NiO, ZnO, CuO, Fe ₂ O ₃ are used as raw materials, The contents are as follows: NiO: 16.5 mol%, ZnO: 25 mol%, CuO: 8 mol%, and the balance is Fe ₂ O ₃ . The rest of the preparation process is as described in Example 1.

Example 4

This embodiment is a magnetic plastic sealing material. The difference from Embodiment 1 is that the particle size of ferrite is different. In this embodiment, the number of particles with a particle size of 2-11 μm accounts for 70%.

Comparative example 1

This embodiment is a magnetic plastic sealing material. The difference from Embodiment 1 is that the particle size of ferrite is different. In this embodiment, the number of particles with a particle size of 2-11 μm accounts for 40%.

Comparative example 2

This embodiment is a magnetic plastic sealing material. The difference from Embodiment 1 is that the particle size of ferrite is different. In this embodiment, the number of particles with a particle size of 2-11 μm accounts for 85%.

Comparative example 3

This comparative example is a magnetic plastic sealing material with the following raw material composition: NiO, ZnO, CuO, and Fe ₂ O ₃ are used as raw materials, and the contents are as follows: NiO: 10 mol%, ZnO: 15 mol%, CuO: 5 mol%, and the balance is Fe ₂ O ₃ . The rest of the preparation process is as described in Example 1.

Comparative example 4

This comparative example is a magnetic plastic sealing material. The difference from Example 1 is that the raw material composition is different. The raw material composition of the magnetic plastic sealing material in this embodiment is as follows: NiO, ZnO, CuO, Fe ₂ O ₃ are used as raw materials, and the content is as follows , NiO: 20 mol%, ZnO: 30 mol%, CuO: 15 mol%, and the balance is Fe ₂ O ₃ . The rest of the preparation process is as described in Example 1.

Comparative example 5

This embodiment is a magnetic plastic sealing material. The difference from Example 1 is that the raw material composition is different. The raw material composition of the magnetic plastic sealing material in this embodiment is as follows: NiO, ZnO, CuO, Fe ₂ O ₃ are used as raw materials, and the contents are as follows , NiO: 30 mol%, ZnO: 15 mol%, CuO: 5 mol%, and the balance is Fe ₂ O ₃ . The rest of the preparation process is as described in Example 1.

Comparative example 6

This embodiment is a magnetic plastic sealing material. The difference from Example 1 is that the raw material composition is different. The raw material composition of the magnetic plastic sealing material in this embodiment is as follows: NiO, ZnO, CuO, Fe ₂ O ₃ are used as raw materials, and the contents are as follows , NiO: 10 mol%, ZnO: 25 mol%, CuO: 17 mol%, and the balance is Fe ₂ O ₃ . The rest of the preparation process is as described in Example 1.

Various performance parameters of the magnetic plastic sealing materials of each embodiment and comparative example were tested respectively, and the test results are listed in Table 1.

Table 1

It can be seen from the test data in Table 1 that the maximum values of the real part of the magnetic permeability and the imaginary part of the magnetic permeability of each magnetic plastic packaging material of the embodiments of the present application are higher than those of Comparative Examples 1-6. It should be noted that when the ratio of raw material components in the ferrite is not within the range limited by this application, the magnetic properties of the corresponding magnetic plastic packaging material cannot achieve the effects of this application.

In addition, from the comparative data of Example 1, Example 4, Comparative Example 1 and Comparative Example 2, it can be seen that when the number of particles with a particle size of 2-11 μm in ferrite accounts for 50-70%, In addition, the magnetic loss performance of the obtained magnetic plastic packaging material is slightly lower than that of Example 1 and Example 4, which shows that the particle size of ferrite can affect the magnetic properties of the magnetic plastic packaging material.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field will Technicians can easily think of changes or substitutions within the technical scope disclosed in this application, and they should all be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A filler for packaging materials, characterized in that it includes ferrite particles, and the ferrite particles include nickel copper zinc ferrite (Ni a Zn b Cu c Fe d O 4 ) material, where a is The value range is 0.3-0.55, the value range of b is 0.45-0.55, the value range of c is 0-0.2, and the value range of d is 1.8-2; among the ferrite particles, the particle size is 2- The proportion of 11 μm particles is 50-70%.
The filler according to claim 1, characterized in that the real part of the magnetic permeability of the filler is 2-5, and the imaginary part of the magnetic permeability of the filler is 1.5-2.
The filler according to claim 1 or 2, characterized in that the absorbing frequency range of the filler is 0.5 to 6 GHz.
The filler according to any one of claims 1 to 3, characterized in that the mass proportion of the ferrite particles in the filler is greater than or equal to 70%.
The filler according to any one of claims 1 to 4, characterized in that the filler further includes an auxiliary material, and the particle size of the auxiliary material is 0.6-2 μm.
The filler according to claim 5, characterized in that the auxiliary material includes at least one of the following elements: silicon, aluminum or beryllium.
A filler for packaging materials, characterized in that it includes ferrite particles, and among the ferrite particles, the number of particles with a particle size of 2-11 μm accounts for 50-70%; wherein,

The ferrite particles include the following raw material components in terms of molar percentage: nickel oxide 15%-27.5%, zinc oxide 22.5%-27.5%, and the remainder includes ferric oxide.
The filler according to claim 7, wherein the raw material components of the ferrite particles further include copper oxide.
The filler according to claim 8, characterized in that the sum of the molar content of the copper oxide and the molar content of the nickel oxide is 15%-27.5%.
The filler according to claim 8 or 9, characterized in that the molar content of the copper oxide is 7.5%-10%.
The filler according to claim 10, characterized in that the molar content of the nickel oxide is 15%-17.5%.
The filler according to any one of claims 7 to 11, wherein the mass proportion of the ferrite particles in the filler is greater than or equal to 70%.
The filler according to any one of claims 7 to 12, characterized in that the filler further includes an auxiliary material, and the particle size of the auxiliary material is 0.6-2 μm.
The filler according to claim 13, wherein the auxiliary material includes at least one of silica, aluminum oxide, and beryllium oxide.
A method for preparing the filler according to any one of claims 1 to 14, characterized in that it includes:

Mixed raw materials containing nickel source, zinc source, iron source and optional copper source are sequentially sintered and pulverized to obtain the ferrite particles; among the ferrite particles, the particle size is 2-11 μm. The quantity ratio is 50-70%;

After mixing the ferrite and the optional auxiliary material, the filler of the encapsulating material is obtained.
The preparation method according to claim 15, characterized in that, before sintering the mixed raw materials, it further includes the steps of primary ball milling, pre-sintering and secondary ball milling.
The preparation method according to claim 16, characterized in that the time of the first ball milling is 3-4 hours.
The preparation method according to claim 16 or 17, characterized in that the pre-sintering temperature is 800-920°C, and the pre-sintering time is 4-6 hours.
The preparation method according to any one of claims 16 to 18, characterized in that the secondary ball milling time is 10 to 12 hours.
The preparation method according to any one of claims 15 to 19, characterized in that the sintering temperature is 920-950°C, and the sintering time is 4-6 hours.
The preparation method according to any one of claims 15 to 20, characterized in that the particle size D50 of the ferrite particles obtained after crushing is 3.5-7 μm.
A magnetic molding material, characterized in that it includes a molding resin and the filler according to any one of claims 1 to 14, and the mass proportion of the filler in the magnetic molding material is 75%-92% .
A packaged device, characterized in that the packaged device is packaged using the magnetic plastic sealing material as claimed in claim 22.