WO2024042729A1 - Processing control device and processing control program - Google Patents

Processing control device and processing control program Download PDF

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Publication number
WO2024042729A1
WO2024042729A1 PCT/JP2022/032294 JP2022032294W WO2024042729A1 WO 2024042729 A1 WO2024042729 A1 WO 2024042729A1 JP 2022032294 W JP2022032294 W JP 2022032294W WO 2024042729 A1 WO2024042729 A1 WO 2024042729A1
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WIPO (PCT)
Prior art keywords
program
switching
processing
model
control device
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PCT/JP2022/032294
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French (fr)
Japanese (ja)
Inventor
将伸 畑田
隆博 田中
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ファナック株式会社
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Priority to PCT/JP2022/032294 priority Critical patent/WO2024042729A1/en
Publication of WO2024042729A1 publication Critical patent/WO2024042729A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring

Definitions

  • the present disclosure relates to a processing control device that controls a processing system that performs processing.
  • Some processing systems process a workpiece, such as a steel plate, by irradiating the workpiece, such as a steel plate, with a laser output from a laser oscillator through a processing nozzle or the like.
  • a laser oscillator cannot output laser light in the initial state when the power is just turned on. Therefore, it is necessary to execute a predetermined start-up process to switch the laser oscillator from its initial state to a ready state in which it can output a laser.
  • the start-up process may differ depending on the model of the laser oscillator.
  • the shutdown process for returning the laser oscillator from the ready state to the initial state may also differ depending on the model of the laser oscillator.
  • a PLC programmable logic controller
  • the user uses the PLC to check the model of the laser oscillator each time the user starts or ends using the laser oscillator using a ladder or the like. It was necessary to selectively execute switching programs such as start-up programs and fall-down programs corresponding to the above. Further, similar problems may also occur in the case of various processing equipment other than laser oscillators.
  • the present disclosure has been made in view of the above circumstances, and aims to reduce the burden on users of selectively executing a switching program corresponding to the model of processing equipment each time they use the processing equipment. .
  • the processing control device of the present disclosure includes: A processing control device that controls a processing system that processes a workpiece using processing equipment, A switching program for switching the state of the processing equipment between an initial state in which a predetermined operation for processing the workpiece cannot be executed and a ready state in which the predetermined operation can be executed; a registration unit configured to allow registration; a storage unit that stores the registered switching program; a switching unit that reads and executes the switching program from the storage unit according to the use of the processing equipment; has.
  • the processing control program of the present disclosure includes: A processing control program that causes a computer to function as a processing control device that controls a processing system that processes a workpiece using processing equipment,
  • the computer further comprises: A user can register a switching program for switching the state of the processing equipment between an initial state in which a predetermined operation for processing the workpiece cannot be executed and a ready state in which the predetermined operation can be executed.
  • a registry configured with; a storage unit that stores the registered switching program; a switching unit that reads and executes the switching program from the storage unit according to use of the processing equipment; function as
  • FIG. 1 is a configuration diagram showing a laser processing control device according to a first embodiment.
  • FIG. 7 is a diagram illustrating startup processing of a comparative example.
  • FIG. 3 is a diagram illustrating startup processing of the present embodiment. It is a figure which shows the fall processing of a comparative example.
  • FIG. 7 is a diagram illustrating a shutdown process according to the present embodiment. It is a block diagram which shows the laser processing control apparatus of 2nd Embodiment.
  • FIG. 7 is a diagram illustrating startup processing of a comparative example.
  • FIG. 3 is a diagram illustrating startup processing of the present embodiment. It is a figure which shows the fall processing of a comparative example.
  • FIG. 7 is a diagram illustrating a shutdown process according to the present embodiment. It is a block diagram which shows the laser processing control apparatus of 3rd Embodiment. It is a figure showing start-up processing of a 4th embodiment. It is a figure which shows a fall process.
  • a laser processing control device 70 controls a laser processing system 90.
  • the laser processing system 90 includes a robot arm 91, a processing nozzle 92, and a laser oscillator 95.
  • the arm 91 movably holds a processing nozzle 92.
  • the laser oscillator 95 is connected to the processing nozzle 92 and inputs a laser beam to the processing nozzle 92 .
  • the processing nozzle 92 performs laser processing by irradiating a workpiece (not shown) with a laser input from a laser oscillator 95.
  • the laser oscillator 95 of this embodiment is a model A laser oscillator 95. Note that model A may be read as "first model".
  • the laser oscillator 95 cannot output laser in the initial state when the power is only turned on.
  • the state of the laser oscillator 95 that cannot output a laser will be referred to as an "initial state”
  • the state of the laser oscillator 95 that can output a laser will be referred to as a "ready state”.
  • the initial state is a state where cooling water is not flowing (a state where the chiller does not start) and a power saving state (a state where the LD power supply is not energized), so the laser oscillator 95 is in a state where it cannot output a laser, and in a ready state, cooling water is flowing, the temperature inside the refrigerator is stable, the power saving state is canceled, and laser oscillation is occurring, so the laser oscillator 95 is able to output a laser. It is in a state of
  • the period before starting the laser output from the laser oscillator 95 to the processing nozzle 92 will be referred to as "before the use of the laser oscillator 95", and the period after the laser output from the laser oscillator 95 to the processing nozzle 92 has ended will be referred to as "the laser oscillator 95".
  • the laser oscillator 95 After using 95. Before using the laser oscillator 95, it is necessary to execute a predetermined “startup process” to switch the laser oscillator from an initial state to a ready state. After using the laser oscillator 95, it is necessary to execute a predetermined “shut down process” to return the laser oscillator 95 from the ready state to the initial state.
  • the laser processing control device 70 is a robot control device, and is mainly composed of one computer and a laser processing control program loaded into the computer.
  • the laser processing control program may be mainly composed of a plurality of computers and a laser processing control program made up of respective programs read into the computers.
  • a computer includes a CPU, ROM, RAM, nonvolatile memory, and the like. The laser processing control program causes the computer to function as the laser processing control device 70 in cooperation with the computer.
  • the laser processing control device 70 includes a program command section 23 and a control section 30.
  • the program command unit 23 mainly includes a computer, its display, keyboard, mouse, and the like.
  • the program command section 23 is configured to be capable of inputting a machining program P and the like through a user's operation.
  • the program command section 23 is configured to be able to input the machining program P in a predetermined programming language such as NC language, C language, C++, Python, or the like.
  • the control unit 30 is mainly composed of a computer's CPU, RAM, etc.
  • the control unit 30 controls the laser processing system 90 by executing the processing program P input to the program command unit 23. Thereby, the control unit 30 causes the laser processing system 90 to perform laser processing.
  • the laser processing control device 70 further includes an automatic switching section 75 for switching the state of the laser oscillator 95 between the initial state and the ready state.
  • the automatic switching section 75 includes a registration section 24 , a model selection section 25 , a storage section 40 , and a switching section 50 .
  • the registration unit 24 is mainly composed of a computer, its display, keyboard, mouse, etc.
  • the registration unit 24 is configured to be able to register switching programs P1 and P2 for switching the state of the laser oscillator 95 for each model A, B, C, . . . of the laser oscillator 95 according to a user's operation.
  • the switching programs P1 and P2 include a "startup program P1" for switching the state of the laser oscillator 95 from the initial state to the ready state, and a "falling program P1" for switching the state of the laser oscillator 95 from the ready state to the initial state. program P2''.
  • the laser processing system 90 includes the laser oscillator 95 of model A, as described above. Therefore, in this embodiment, the user inputs at least the model A and the corresponding startup program P1a and shutdown program P2a by operating the registration unit 24.
  • the registration section 24 is configured to be able to input the switching programs P1 and P2 in the aforementioned predetermined programming language, that is, in a programming language that can be used when inputting the machining program P to the program command section 23.
  • the storage unit 40 is mainly composed of a portion of the computer that includes nonvolatile memory and the like.
  • the storage unit 40 stores the model of the laser oscillator 95 input by the user through the operation of the registration unit 24 and the corresponding switching programs P1 and P2. Further, the storage unit 40 stores a predetermined model and all or part of the corresponding switching programs P1 and P2 in advance when the laser processing control device 70 is new, that is, when it is shipped from a factory. You can leave it there.
  • the storage unit 40 not only stores the desired model and the corresponding switching programs P1 and P2 by the user's operation of the registration unit 24, but also stores the desired model and the corresponding switching programs P1 and P2 by the operation of the worker at the factory or the like.
  • the model and at least part of the corresponding switching programs P1 and P2 may be stored.
  • the switching programs P1 and P2 are registered by the user's operation of the registration unit 24, at least part of the switching programs P1 and P2 corresponding to the predetermined model of the laser oscillator 95 has already been stored in the storage unit 40. I remember. Therefore, the effort required by the user to register at least a portion of the switching programs P1 and P2 corresponding to the predetermined model can be reduced.
  • the model selection section 25 is mainly composed of a computer, its display, keyboard, mouse, etc.
  • the model selection unit 25 is configured to be able to select the model of the laser oscillator 95 by a user's operation. Specifically, in this embodiment, the user selects model A by operating the model selection section 25.
  • the switching unit 50 is mainly composed of a portion of the computer including the CPU, RAM, etc.
  • the switching unit 50 reads out and executes the switching programs P1 and P2 for the selected model from the storage unit 40 in accordance with the use of the laser oscillator 95 based on the execution of the processing program P. That is, in this embodiment, the switching programs P1 and P2 for model A are read and executed. Specifically, the switching unit 50 executes the start-up program P1a of the model A before starting laser processing, that is, before using the laser oscillator 95 of the model A. Then, after the laser processing is finished, that is, after the laser oscillator 95 of the model A is used, the switching unit 50 executes the shutdown program P2a of the model A.
  • the startup process performed in this embodiment will be described with reference to FIGS. 2 and 3. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC (programmable logic controller) into the laser processing control device 70, as in the comparative example shown in FIG. There is. Then, the user needs to use the PLC to selectively execute a start-up program corresponding to model A using a programming language such as ladder, each time before starting laser processing.
  • a PLC programmable logic controller
  • the automatic switching section 75 is provided, and the start-up program P1a of the model A is registered and stored in the storage section 40 by the user's operation of the registration section 24. ing. Then, model A is selected by the user's operation of the model selection section 25. Therefore, as shown in FIG. 3, before starting laser processing based on the processing program P, the switching section 50 automatically selects the model A from the storage section 40 in response to the startup request D1 from the control section 30. The start-up program P1a is read out and executed. As a result, startup processing for model A is automatically executed.
  • the laser processing control device 70 transmits a laser request Da1 requesting permission for control by itself to the laser oscillator 95. Upon receiving this, the laser oscillator 95 permits control on the condition that predetermined requirements are met, and transmits a laser allocation signal Ca2 to the laser processing control device 70. Upon receiving this, the laser processing control device 70 transmits a laser ON request Da3 to the laser oscillator 95. Upon receiving this, the laser oscillator 95 changes itself from the initial state to a ready state and transmits a laser ON signal Ca4 to the laser oscillator 95. Upon receiving this, the laser processing control device 70 transmits an analog control ON request Da5 requesting permission for its own analog control to the laser oscillator 95.
  • the laser oscillator 95 Upon receiving this, the laser oscillator 95 allows analog control on the condition that predetermined requirements are met, and transmits an analog control ON signal Ca6 to the laser processing control device 70, and also sends a laser preparation completion signal Ca7 to the laser processing controller 70. It is transmitted to the processing control device 70.
  • the start-up process of the laser oscillator 95 of model A is completed. Therefore, the user does not need to selectively execute a start-up program corresponding to model A every time before starting laser processing using a program language such as a ladder using a PLC.
  • the switching unit 50 transmits a start-up completion notification C1 to the control unit 30. Thereby, the control unit 30 starts using the laser oscillator 95 of model A and starts laser processing.
  • the shutdown process performed in this embodiment will be described with reference to FIGS. 4 and 5. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC into the laser processing control device 70, as in the case of the comparative example shown in FIG. Then, the user needs to use the PLC to selectively execute a program for falling down corresponding to model A every time the laser processing is completed using a programming language such as ladder.
  • the switching section 50 automatically switches the storage section
  • the shutdown program P2a of model A is read out from 40 and executed.
  • the shutdown process for model A is automatically executed.
  • the laser processing control device 70 first turns off the analog control ON request Da5. Based on this, the laser oscillator 95 turns off the laser preparation completion signal Ca7, disables analog control, and turns off the analog control ON signal Ca6. After that, the laser processing control device 70 turns off the laser ON request Da3. Based on this, the laser processing control device 70 turns off the laser ON signal Ca4. After that, the laser processing control device 70 turns off the laser request Da1. Based on this, the laser processing control device 70 turns off the laser allocation signal Ca2.
  • the shutdown process of the laser oscillator 95 of model A is completed. Therefore, the user does not need to selectively execute a program for falling down corresponding to model A every time laser processing is completed using a program language such as ladder using a PLC.
  • the switching unit 50 transmits a shutdown completion notification C2 to the control unit 30. Thereby, the control unit 30 starts the next process based on the machining program P.
  • the start-up program P1a of the model A is automatically executed before the laser processing based on the processing program P is performed, and after the laser processing based on the processing program P is performed, the startup program P1a of the model A is automatically executed.
  • the lower program P2a is automatically executed.
  • the switching unit 50 reads and executes the switching programs P1 and P2 from the storage unit 40. That is, when laser processing is interrupted due to an emergency stop or when laser processing is interrupted due to a command other than a command based on the processing program, the switching unit 50 switches to the lowering mode corresponding to the selected model A.
  • the program P2a is read from the storage unit 40 and executed. Then, when the laser processing is restarted after the laser processing is interrupted, the switching section 50 reads out the start-up program P1a corresponding to the selected model A from the storage section 40 and executes it.
  • the switching unit 50 does not execute the start-up program P1a when the laser processing is disabled.
  • the execution of the program P1 is skipped.
  • the time when the laser processing is disabled includes, for example, when the user is in a teaching mode for teaching the laser processing system 90 an operation.
  • the registration unit 24 is configured to be able to register switching programs P1 and P2 for switching the state of the laser oscillator 95 by user operation, and the switching unit 50 selects the registered switching programs P1 and P2 for switching the state of the laser oscillator 95 according to the use of the laser oscillator 95.
  • the programs P1 and P2 are read from the storage unit 40 and executed. Therefore, there is no need to prepare a PLC for switching the state of the laser oscillator 95.
  • the switching unit 50 reads out the start-up program P1a corresponding to model A from the storage unit 40 and executes it. Therefore, the user does not need to selectively execute a start-up program corresponding to model A each time before using the laser oscillator 95 using a program language such as ladder using a PLC.
  • the switching unit 50 reads out the shutdown program P2a corresponding to model A from the storage unit 40 and executes it. Therefore, the user does not need to selectively execute a program for falling down corresponding to model A every time the laser oscillator 95 is used, using a program language such as ladder using a PLC.
  • the registration unit 24 is configured to be able to register switching programs P1, P2 for each model A, B, C, . . .
  • the switching programs P1 and P2 corresponding to the selected model are read out from the storage unit 40 and executed. Therefore, it is possible to cope with the case where a plurality of models A, B, C, etc. of the laser oscillator 95 to be used can be considered.
  • the switching unit 50 reads the switching programs P1 and P2 from the storage unit 40 and executes them in accordance with the use of the laser oscillator 95 based on the execution of the processing program P. Therefore, the start-up program P1 and the fall-down program P2 can be executed efficiently and at appropriate timing in synchronization with the machining program P.
  • the registration unit 24 is configured to be able to input the switching programs P1 and P2 using a programming language that allows the machining program P to be input to the program command unit 23. Therefore, even if the user cannot use a PLC programming language such as ladder, the user can cope with the situation.
  • the switching unit 50 reads the stop program P2 from the storage unit 40 and executes it when the laser processing is interrupted. Therefore, when laser processing is interrupted, the laser oscillator 95 can be turned off quickly.
  • the switching unit 50 reads the start-up program P1 from the storage unit 40 and executes it when restarting the laser processing after the interruption of the laser processing. Therefore, when laser processing is restarted, the laser oscillator 95 can be started up quickly.
  • the switching unit 50 skips execution of the start-up program P1 when the laser processing is disabled, in which an operation to disable the laser processing is performed. Therefore, the laser processing system 90 cannot irradiate the laser even if it makes a mistake, thereby ensuring greater safety.
  • the time when the laser processing is disabled includes the time when the teaching mode in which the user teaches the laser processing system 90 an operation is selected. Therefore, safety in the teaching mode can be further ensured.
  • the computer functions as the program command section 23 and the control section 30, as well as the automatic switching section 75, by cooperation between the computer and the laser processing control program. That is, the computer is made to function as the laser processing control device 70 of this embodiment. Therefore, this embodiment can be implemented using a computer.
  • the laser processing system 90 includes a model B laser oscillator 95 instead of the model A laser oscillator 95 shown in the first embodiment. Therefore, in this embodiment, the user selects model B by operating the model selection section 25. Note that model B may be read as "second model”.
  • the startup process performed in this embodiment will be described with reference to FIGS. 7 and 8. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC as in the case of the comparative example shown in FIG. Then, the user needs to use the PLC to selectively execute a start-up program corresponding to model B using a programming language such as a ladder program each time before starting laser processing.
  • a programming language such as a ladder program each time before starting laser processing.
  • the switching unit 50 before starting laser processing based on the processing program P, automatically switches the memory A start-up program P1b for model B is read out from the unit 40 and executed. As a result, startup processing for model B is automatically executed.
  • the laser oscillator 95 transmits a power-on signal Cb1 indicating that the power is on to the laser processing control device 70.
  • the laser processing control device 70 transmits a standby request Db2 to the laser oscillator 95.
  • the laser oscillator 95 changes itself from the initial state to a ready state and transmits a laser ready OK signal Cb3 and a standby OK signal Cb4 to the laser processing control device 70.
  • the laser processing control device 70 transmits an analog control request Db5 requesting permission for control by itself to the laser oscillator 95.
  • the laser oscillator 95 permits control on the condition that predetermined requirements are met, and transmits the laser ON signal Cb6 to the laser processing control device 70.
  • the start-up process of the laser oscillator 95 of model B is completed. Therefore, the user does not need to selectively execute the start-up program corresponding to model B every time before starting laser processing using a program language such as a ladder using a PLC.
  • the shutdown process performed in this embodiment will be described with reference to FIGS. 9 and 10. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC as in the case of the comparative example shown in FIG. Then, the user needs to use the PLC to selectively execute the fall program corresponding to model B using a program language such as a ladder program every time the laser processing is completed.
  • the switching section 50 automatically switches the storage section to The shutdown program P2b of model B is read out from 40 and executed. As a result, the shutdown process for model B is automatically executed.
  • the laser processing control device 70 first turns off the analog control request Db5. Based on this, the laser oscillator 95 turns off the laser ON signal Cb6. After that, the laser processing control device 70 turns off the standby request Db2. Based on this, the laser oscillator 95 sequentially turns off the standby OK signal Cb4, the laser ready OK signal Cb3, and the power-on signal Cb1. In this way, in this embodiment, a different fall process from that in the first embodiment is performed.
  • the shutdown process of the laser oscillator 95 of model B is completed. Therefore, the user does not need to selectively execute a program for falling down corresponding to model B every time laser processing is completed using a program language such as a ladder using a PLC.
  • the laser processing system 90 includes, in addition to the laser oscillator 95 of the model A shown in the first embodiment, the laser oscillator 95 of the model B shown in the second embodiment.
  • the processing nozzle 92 is configured to be able to selectively input and irradiate either the laser from the laser oscillator 95 of the model A or the laser from the laser oscillator 95 of the machine B.
  • two laser oscillators 95, 95 are connected to one processing nozzle 92, but separate processing nozzles 92, 92 may be provided for each laser oscillator 95, 95.
  • the laser processing control device 70 of this embodiment uses the laser oscillator 95 of model A and the laser oscillator 95 of model B depending on the purpose and the like.
  • the model selection section 25 is configured to be able to select a plurality of models as the model of the laser oscillator 95 to be used.
  • the user selects model A as one model of the laser oscillator 95 to be used, and selects model B as the other model of the laser oscillator 95 to use, by operating the model selection unit 25. select.
  • the switching unit 50 before using the laser oscillator 95 of the model A based on the execution of the machining program P, the switching unit 50 reads out the start-up program P1a of the model A from the storage unit 40 and executes the start-up program P1a of the laser oscillator of the model A.
  • the shutdown program P2a for model A is read out from the storage unit 40 and executed.
  • the switching unit 50 before using the laser oscillator 95 of the model B based on the execution of the machining program P, the switching unit 50 reads the start-up program P1b of the model B from the storage unit 40 and executes the start-up program P1b of the laser oscillator 95 of the model B.
  • the shutdown program P2b for model B is read out from the storage unit 40 and executed.
  • the switching unit 50 reads the switching programs P1a and P2a corresponding to the model A from the storage unit 40 in accordance with the use of the laser oscillator 95 of the model A based on the execution of the processing program P. Read and execute. Then, the switching unit 50 reads switching programs P1b and P2b corresponding to the model B from the storage unit 40 and executes them in accordance with the use of the laser oscillator 95 of the model B based on the execution of the machining program P. Therefore, it is possible to cope with the case where it is desired to switch and use a plurality of laser oscillators 95.
  • the coating system includes a coating device 95d of model ⁇ . Therefore, in this embodiment, the user selects the model ⁇ by operating the model selection section.
  • the switching unit 50 Before starting coating based on the machining program P, the switching unit 50 automatically reads out and executes the startup program P1d for the model ⁇ from the storage unit in response to a startup request D1 from the control unit 30. As a result, startup processing for model ⁇ is automatically executed.
  • the coating control device 70d sends a valve control ON request Dd1 to the coating device 95d requesting permission to control the valve of the coating device 95d by itself. Upon receiving this, the coating device 95d permits valve control on the condition that predetermined requirements are met, and transmits a valve control ON signal Cd2 to the coating control device 70d. Upon receiving this, the coating control device 70d transmits a sealing material filling request Dd3 to the coating device 95d. Upon receiving this, the coating device 95d fills the sealing material and transmits a sealing material filling completion signal Cd4 to the coating control device 70d. Upon receiving this, the coating control device 70d transmits a preparation pressure request Dd5 to the coating device 95d. Upon receiving this, the coating device 95d increases the internal pressure and transmits a preparation pressure completion signal Cd6 to the coating control device 70d.
  • the start-up process of the coating device 95d of model ⁇ is completed. Therefore, the user does not need to selectively execute the start-up program corresponding to the model ⁇ every time before starting coating using a program language such as a ladder using a PLC.
  • the switching unit 50 transmits a start-up completion notification C1 to the control unit 30.
  • the switching unit 50 automatically reads out the shutdown program P2d of the model ⁇ from the storage unit and executes it in response to the shutdown request D2 from the control unit 30. As a result, the shutdown process for model ⁇ is automatically executed.
  • the coating control device 70d turns off the preparation pressure request Dd5. Based on this, the coating device 95d lowers the internal pressure and turns off the preparation pressure completion signal Cd6. Thereafter, the coating control device 70d turns off the valve control ON request Dd1. Based on this, the coating device 95d cancels permission for valve control and turns off the valve control ON signal Cd2.
  • the process of shutting down the coating device 95d of model ⁇ is completed. Therefore, the user does not have to use a PLC to selectively execute a program for falling down corresponding to the model ⁇ every time coating is completed using a programming language such as ladder.
  • the switching unit 50 transmits a shutdown completion notification C2 to the control unit 30.
  • the switching unit 50 automatically recognizes the model of the laser oscillator 95 connected to the processing nozzle 92 from the connection status etc.
  • the switching programs P1 and P2 corresponding to the recognized model may be executed. According to this configuration, even the effort required by the user to select the model of the laser oscillator 95 by operating the model selection section 25 can be reduced.
  • the processing system is a laser processing system in the first to third embodiments, and a coating system in the fourth embodiment, but may be a system that performs or includes other processing.
  • Other processing includes processing other than laser processing, such as cutting, pressing, tensioning, heating, and pressurization, such as removing a part of the workpiece, cutting it, breaking it, deforming it, or altering its quality. Examples include processing that adds additives to the workpiece, and processing other than coating that adds additives to the workpiece.

Abstract

The purpose of the present disclosure is to mitigate the burden on a user who, whenever a processing machine is used, selectively executes a switching program corresponding to the type of the processing machine. A laser processing control device according to the present disclosure controls a processing system for using a processing machine to process a workpiece, the laser processing control device having a registration unit, a storage unit, and a switching unit. The registration unit is configured to be able to register, by means of a manipulation by a user, a switching program for switching the state of the processing machine between an initial state in which a prescribed operation for processing the workpiece cannot be executed and a preparation completed state in which the prescribed operation can be executed. The storage unit stores the registered switching program. The switching unit reads out and executes the switching program from the storage unit in accordance with the usage of the processing machine.

Description

加工制御装置および加工制御プログラムProcessing control device and processing control program
 本開示は、加工を行う加工システムを制御する加工制御装置に関する。 The present disclosure relates to a processing control device that controls a processing system that performs processing.
 加工システムの中には、例えば、レーザ発振器から出力されるレーザを、加工ノズル等から鋼板等のワークに照射して、ワークをレーザ加工するものがある。 Some processing systems process a workpiece, such as a steel plate, by irradiating the workpiece, such as a steel plate, with a laser output from a laser oscillator through a processing nozzle or the like.
特開2007-30031号公報Japanese Patent Application Publication No. 2007-30031
 レーザ発振器は、電源を投入しただけの初期状態では、レーザを出力することはできない。そのため、所定の立上げ処理を実行して、レーザ発振器を初期状態からレーザを出力可能な準備完了状態に切り換える必要がある。ただし、その立上げ処理は、レーザ発振器の機種によって異なる場合がある。また、レーザ発振器を、準備完了状態から初期状態に戻す立下げ処理についても、レーザ発振器の機種によって異なる場合がある。 A laser oscillator cannot output laser light in the initial state when the power is just turned on. Therefore, it is necessary to execute a predetermined start-up process to switch the laser oscillator from its initial state to a ready state in which it can output a laser. However, the start-up process may differ depending on the model of the laser oscillator. Further, the shutdown process for returning the laser oscillator from the ready state to the initial state may also differ depending on the model of the laser oscillator.
 そのため、レーザ加工制御装置にPLC(プログラマブル・ロジック・コントローラ)等を導入しておき、ユーザが、そのPLCを用いてラダー等によって、レーザ発振器の使用の開始や終了の都度、当該レーザ発振器の機種に対応する立上用プログラムや立下用プログラム等の切換プログラムを、選択的に実行させる必要があった。また、同様の問題は、レーザ発振器以外の各種加工機器の場合においても起こり得る。 Therefore, a PLC (programmable logic controller) or the like is introduced into the laser processing control device, and the user uses the PLC to check the model of the laser oscillator each time the user starts or ends using the laser oscillator using a ladder or the like. It was necessary to selectively execute switching programs such as start-up programs and fall-down programs corresponding to the above. Further, similar problems may also occur in the case of various processing equipment other than laser oscillators.
 本開示は、上記事情に鑑みてなされたものであり、加工機器の使用の都度、ユーザが、当該加工機器の機種に対応する切換プログラムを選択的に実行させる負担を軽減することを目的とする。 The present disclosure has been made in view of the above circumstances, and aims to reduce the burden on users of selectively executing a switching program corresponding to the model of processing equipment each time they use the processing equipment. .
 本開示の加工制御装置は、
 加工機器を用いてワークを加工する加工システムを制御する加工制御装置であって、
 前記加工機器の状態を、前記ワークを加工するための所定の動作を実行不能な初期状態と前記所定の動作を実行可能な準備完了状態との間で切り換えるための切換プログラムを、ユーザによる操作によって登録可能に構成された登録部と、
 登録された前記切換プログラムを記憶する記憶部と、
 前記加工機器の使用に応じて前記記憶部から前記切換プログラムを読み出して実行する切換部と、
 を有する。
The processing control device of the present disclosure includes:
A processing control device that controls a processing system that processes a workpiece using processing equipment,
A switching program for switching the state of the processing equipment between an initial state in which a predetermined operation for processing the workpiece cannot be executed and a ready state in which the predetermined operation can be executed; a registration unit configured to allow registration;
a storage unit that stores the registered switching program;
a switching unit that reads and executes the switching program from the storage unit according to the use of the processing equipment;
has.
 本開示の加工制御プログラムは、
 コンピュータを、加工機器を用いてワークを加工する加工システムを制御する加工制御装置として、機能させる加工制御プログラムであって、
 前記コンピュータを、さらに、
 前記加工機器の状態を、前記ワークを加工するための所定の動作を実行不能な初期状態と前記所定の動作を実行可能な準備完了状態との間で切り換えるための切換プログラムを、ユーザによって登録可能に構成された登録部と、
 登録された前記切換プログラムを記憶する記憶部と、
 前記加工機器の使用に応じて前記記憶部から前記切換プログラムを読み出して実行する切換部と、
 として機能させる。
The processing control program of the present disclosure includes:
A processing control program that causes a computer to function as a processing control device that controls a processing system that processes a workpiece using processing equipment,
The computer further comprises:
A user can register a switching program for switching the state of the processing equipment between an initial state in which a predetermined operation for processing the workpiece cannot be executed and a ready state in which the predetermined operation can be executed. a registry configured with;
a storage unit that stores the registered switching program;
a switching unit that reads and executes the switching program from the storage unit according to use of the processing equipment;
function as
 本開示によれば、加工機器の使用の都度、ユーザが、当該加工機器の機種に対応する切換プログラムを選択的に実行させる負担を軽減することができる。 According to the present disclosure, it is possible to reduce the burden on the user of selectively executing a switching program corresponding to the model of the processing equipment each time the processing equipment is used.
第1実施形態のレーザ加工制御装置を示す構成図である。FIG. 1 is a configuration diagram showing a laser processing control device according to a first embodiment. 比較例の立上げ処理を示す図である。FIG. 7 is a diagram illustrating startup processing of a comparative example. 本実施形態の立上げ処理を示す図である。FIG. 3 is a diagram illustrating startup processing of the present embodiment. 比較例の立下げ処理を示す図である。It is a figure which shows the fall processing of a comparative example. 本実施形態の立下げ処理を示す図である。FIG. 7 is a diagram illustrating a shutdown process according to the present embodiment. 第2実施形態のレーザ加工制御装置を示す構成図である。It is a block diagram which shows the laser processing control apparatus of 2nd Embodiment. 比較例の立上げ処理を示す図である。FIG. 7 is a diagram illustrating startup processing of a comparative example. 本実施形態の立上げ処理を示す図である。FIG. 3 is a diagram illustrating startup processing of the present embodiment. 比較例の立下げ処理を示す図である。It is a figure which shows the fall processing of a comparative example. 本実施形態の立下げ処理を示す図である。FIG. 7 is a diagram illustrating a shutdown process according to the present embodiment. 第3実施形態のレーザ加工制御装置を示す構成図である。It is a block diagram which shows the laser processing control apparatus of 3rd Embodiment. 第4実施形態の立上げ処理を示す図である。It is a figure showing start-up processing of a 4th embodiment. 立下げ処理を示す図である。It is a figure which shows a fall process.
 以下、本開示の実施形態について、図面を参照しつつ説明する。ただし、本開示は、以下の実施形態に何ら限定されるものではなく、本開示の趣旨を逸脱ない範囲内で適宜変更して実施できる。 Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, the present disclosure is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the spirit of the present disclosure.
 [第1実施形態]
 まず、図1~図5を参照しつつ、第1実施形態について説明する。図1に示すように、レーザ加工制御装置70は、レーザ加工システム90を制御する。レーザ加工システム90は、ロボットのアーム91と加工ノズル92とレーザ発振器95とを備える。アーム91は、加工ノズル92を移動可能に保持している。レーザ発振器95は、加工ノズル92に接続されており、加工ノズル92にレーザを入力する。加工ノズル92は、レーザ発振器95から入力したレーザをワーク(図示せず)に照射することによってレーザ加工を行う。具体的には、本実施形態のレーザ発振器95は、機種Aのレーザ発振器95である。なお、機種Aは、「第1機種」と読み替えてもよい。
[First embodiment]
First, a first embodiment will be described with reference to FIGS. 1 to 5. As shown in FIG. 1, a laser processing control device 70 controls a laser processing system 90. The laser processing system 90 includes a robot arm 91, a processing nozzle 92, and a laser oscillator 95. The arm 91 movably holds a processing nozzle 92. The laser oscillator 95 is connected to the processing nozzle 92 and inputs a laser beam to the processing nozzle 92 . The processing nozzle 92 performs laser processing by irradiating a workpiece (not shown) with a laser input from a laser oscillator 95. Specifically, the laser oscillator 95 of this embodiment is a model A laser oscillator 95. Note that model A may be read as "first model".
 レーザ発振器95は、電源を投入しただけの初期状態では、レーザを出力することはできない。以下、レーザを出力不能なレーザ発振器95の状態を「初期状態」といい、レーザを出力可能なレーザ発振器95の状態を「準備完了状態」という。具体的には、例えば、初期状態は、冷却水が流れていない状態(チラーが起動しない状態)であり、また省電力状態(LD電源が通電していない状態)であることから、レーザ発振器95がレーザを出力不能な状態であり、準備完了状態は、冷却水が流れて庫内温度が安定し、省電力状態が解除されレーザ発振が起こっていることから、レーザ発振器95がレーザを出力可能な状態である。 The laser oscillator 95 cannot output laser in the initial state when the power is only turned on. Hereinafter, the state of the laser oscillator 95 that cannot output a laser will be referred to as an "initial state", and the state of the laser oscillator 95 that can output a laser will be referred to as a "ready state". Specifically, for example, the initial state is a state where cooling water is not flowing (a state where the chiller does not start) and a power saving state (a state where the LD power supply is not energized), so the laser oscillator 95 is in a state where it cannot output a laser, and in a ready state, cooling water is flowing, the temperature inside the refrigerator is stable, the power saving state is canceled, and laser oscillation is occurring, so the laser oscillator 95 is able to output a laser. It is in a state of
 以下、レーザ発振器95から加工ノズル92へのレーザ出力を開始する前を、「レーザ発振器95の使用前」といい、レーザ発振器95から加工ノズル92へのレーザ出力を終了した後を、「レーザ発振器95の使用後」という。レーザ発振器95の使用前には、所定の「立上げ処理」を実行して、レーザ発振器を初期状態から準備完了状態に切り換える必要がある。そして、レーザ発振器95の使用後には、所定の「立下げ処理」を実行して、レーザ発振器95を準備完了状態から初期状態から戻す必要がある。 Hereinafter, the period before starting the laser output from the laser oscillator 95 to the processing nozzle 92 will be referred to as "before the use of the laser oscillator 95", and the period after the laser output from the laser oscillator 95 to the processing nozzle 92 has ended will be referred to as "the laser oscillator 95". After using 95. Before using the laser oscillator 95, it is necessary to execute a predetermined "startup process" to switch the laser oscillator from an initial state to a ready state. After using the laser oscillator 95, it is necessary to execute a predetermined "shut down process" to return the laser oscillator 95 from the ready state to the initial state.
 レーザ加工制御装置70は、本実施形態ではロボット制御装置であって、一台のコンピュータと、それに読み込まれたレーザ加工制御プログラムと、を主体に構成されている。ただし、これに代えて、複数台のコンピュータと、それらに読み込まれたそれぞれのプログラムからなるレーザ加工制御プログラムと、を主体に構成されていてもよい。コンピュータは、CPU、ROM,RAM、不揮発性メモリ等を備える。レーザ加工制御プログラムは、コンピュータとの協働で当該コンピュータをレーザ加工制御装置70として機能させる。 In this embodiment, the laser processing control device 70 is a robot control device, and is mainly composed of one computer and a laser processing control program loaded into the computer. However, instead of this, the laser processing control program may be mainly composed of a plurality of computers and a laser processing control program made up of respective programs read into the computers. A computer includes a CPU, ROM, RAM, nonvolatile memory, and the like. The laser processing control program causes the computer to function as the laser processing control device 70 in cooperation with the computer.
 レーザ加工制御装置70は、プログラム指令部23と制御部30とを有する。プログラム指令部23は、コンピュータ、そのディスプレイ、キーボード、マウス等を主体に構成されている。プログラム指令部23は、ユーザによる操作によって、加工プログラムP等を入力可能に構成されている。具体的には、プログラム指令部23は、例えば、NC言語、C言語、C++、Python等の所定のプログラム言語によって、加工プログラムPを入力可能に構成されている。 The laser processing control device 70 includes a program command section 23 and a control section 30. The program command unit 23 mainly includes a computer, its display, keyboard, mouse, and the like. The program command section 23 is configured to be capable of inputting a machining program P and the like through a user's operation. Specifically, the program command section 23 is configured to be able to input the machining program P in a predetermined programming language such as NC language, C language, C++, Python, or the like.
 制御部30は、コンピュータのCPU,RAM等を主体に構成されている。制御部30は、プログラム指令部23に入力された加工プログラムPを実行することによって、レーザ加工システム90を制御する。それによって、制御部30は、レーザ加工システム90にレーザ加工を実施させる。 The control unit 30 is mainly composed of a computer's CPU, RAM, etc. The control unit 30 controls the laser processing system 90 by executing the processing program P input to the program command unit 23. Thereby, the control unit 30 causes the laser processing system 90 to perform laser processing.
 前述の通り、レーザ発振器95は、電源を投入しただけの初期状態では、レーザを出力することはできない。そのことから、レーザ加工制御装置70は、さらに、レーザ発振器95の状態を初期状態と準備完了状態との間で切り換えるための自動切換部75を有する。自動切換部75は、登録部24と機種選択部25と記憶部40と切換部50とを有する。 As mentioned above, the laser oscillator 95 cannot output laser in the initial state where the power is only turned on. Therefore, the laser processing control device 70 further includes an automatic switching section 75 for switching the state of the laser oscillator 95 between the initial state and the ready state. The automatic switching section 75 includes a registration section 24 , a model selection section 25 , a storage section 40 , and a switching section 50 .
 登録部24は、コンピュータ、そのディスプレイ、キーボード、マウス等を主体に構成されている。登録部24は、ユーザによる操作によって、レーザ発振器95の状態を切り換える切換プログラムP1,P2を、レーザ発振器95の機種A,B,C・・・毎に、登録可能に構成されている。切換プログラムP1,P2は、レーザ発振器95の状態を初期状態から準備完了状態に切り換えるための「立上用プログラムP1」と、レーザ発振器95の状態を準備状態から初期状態に戻すための「立下用プログラムP2」とを含む。ユーザは、登録部24の操作によって、レーザ発振器95の機種と、それに対応する切換プログラムP1,P2とを入力することができ、それによって、レーザ発振器95の機種に紐づけて、対応する切換プログラムP1,P2を登録することができる。 The registration unit 24 is mainly composed of a computer, its display, keyboard, mouse, etc. The registration unit 24 is configured to be able to register switching programs P1 and P2 for switching the state of the laser oscillator 95 for each model A, B, C, . . . of the laser oscillator 95 according to a user's operation. The switching programs P1 and P2 include a "startup program P1" for switching the state of the laser oscillator 95 from the initial state to the ready state, and a "falling program P1" for switching the state of the laser oscillator 95 from the ready state to the initial state. program P2''. By operating the registration unit 24, the user can input the model of the laser oscillator 95 and the corresponding switching programs P1 and P2. P1 and P2 can be registered.
 具体的には、本実施形態では、前述の通り、レーザ加工システム90が、機種Aのレーザ発振器95を備える。そのことから、本実施形態では、ユーザは、登録部24の操作によって、少なくとも機種Aと、それに対応する立上用プログラムP1aおよび立下用プログラムP2aとを入力する。登録部24は、切換プログラムP1,P2を、前述の所定のプログラム言語で、つまり、加工プログラムPをプログラム指令部23に入力する際に使用可能なプログラム言語で、入力可能に構成されている。 Specifically, in this embodiment, the laser processing system 90 includes the laser oscillator 95 of model A, as described above. Therefore, in this embodiment, the user inputs at least the model A and the corresponding startup program P1a and shutdown program P2a by operating the registration unit 24. The registration section 24 is configured to be able to input the switching programs P1 and P2 in the aforementioned predetermined programming language, that is, in a programming language that can be used when inputting the machining program P to the program command section 23.
 記憶部40は、コンピュータにおける不揮発性メモリ等を含む部分を主体に構成されている。記憶部40は、ユーザが登録部24の操作によって入力したレーザ発振器95の機種と、それに対応する切換プログラムP1,P2とを記憶する。さらに、記憶部40は、レーザ加工制御装置70の新品時、すなわち工場等からの出荷時の状態において、予め所定の機種と、それに対応する切換プログラムP1,P2の全部又は一部とが記憶されていてもよい。つまり、記憶部40は、ユーザによる登録部24の操作によって、所望の機種とそれに対応する切換プログラムP1,P2とが記憶されるのみならず、さらに工場等での作業員の操作によって、予め所定の機種とそれに対応する切換プログラムP1,P2の少なくとも一部とが記憶されていてもよい。この場合、ユーザによる登録部24の操作によって切換プログラムP1,P2が登録される前の状態において、既に記憶部40が、レーザ発振器95の所定の機種に対応する切換プログラムP1,P2の少なくとも一部を記憶している。そのため、ユーザが当該所定の機種に対応する切換プログラムP1,P2の当該少なくとも一部を登録する手間を軽減できる。 The storage unit 40 is mainly composed of a portion of the computer that includes nonvolatile memory and the like. The storage unit 40 stores the model of the laser oscillator 95 input by the user through the operation of the registration unit 24 and the corresponding switching programs P1 and P2. Further, the storage unit 40 stores a predetermined model and all or part of the corresponding switching programs P1 and P2 in advance when the laser processing control device 70 is new, that is, when it is shipped from a factory. You can leave it there. In other words, the storage unit 40 not only stores the desired model and the corresponding switching programs P1 and P2 by the user's operation of the registration unit 24, but also stores the desired model and the corresponding switching programs P1 and P2 by the operation of the worker at the factory or the like. The model and at least part of the corresponding switching programs P1 and P2 may be stored. In this case, before the switching programs P1 and P2 are registered by the user's operation of the registration unit 24, at least part of the switching programs P1 and P2 corresponding to the predetermined model of the laser oscillator 95 has already been stored in the storage unit 40. I remember. Therefore, the effort required by the user to register at least a portion of the switching programs P1 and P2 corresponding to the predetermined model can be reduced.
 機種選択部25は、コンピュータ、そのディスプレイ、キーボード、マウス等を主体に構成されている。機種選択部25は、ユーザによる操作によって、レーザ発振器95の機種を選択可能に構成されている。具体的には、本実施形態では、ユーザは、機種選択部25の操作によって、機種Aを選択する。 The model selection section 25 is mainly composed of a computer, its display, keyboard, mouse, etc. The model selection unit 25 is configured to be able to select the model of the laser oscillator 95 by a user's operation. Specifically, in this embodiment, the user selects model A by operating the model selection section 25.
 切換部50は、コンピュータにおけるCPU,RAM等を含む部分を主体に構成されている。切換部50は、加工プログラムPの実行に基づくレーザ発振器95の使用に応じて、記憶部40から、選択されている機種の切換プログラムP1,P2を読み出して実行する。つまり、本実施形態では、機種Aの切換プログラムP1,P2を読み出して実行する。具体的には、切換部50は、レーザ加工の開始前に、つまり機種Aのレーザ発振器95の使用前に、機種Aの立上用プログラムP1aを実行する。そして、切換部50は、レーザ加工の終了後に、つまり機種Aのレーザ発振器95の使用後に、機種Aの立下用プログラムP2aを実行する。 The switching unit 50 is mainly composed of a portion of the computer including the CPU, RAM, etc. The switching unit 50 reads out and executes the switching programs P1 and P2 for the selected model from the storage unit 40 in accordance with the use of the laser oscillator 95 based on the execution of the processing program P. That is, in this embodiment, the switching programs P1 and P2 for model A are read and executed. Specifically, the switching unit 50 executes the start-up program P1a of the model A before starting laser processing, that is, before using the laser oscillator 95 of the model A. Then, after the laser processing is finished, that is, after the laser oscillator 95 of the model A is used, the switching unit 50 executes the shutdown program P2a of the model A.
 次に、図2,図3を参照しつつ、本実施形態で行う立上げ処理について説明する。仮に、レーザ加工制御装置70が、自動切換部75を有しない場合、図2に示す比較例の場合のように、レーザ加工制御装置70にPLC(プログラマブル・ロジック・コントローラ)を導入しておく必要がある。そして、ユーザが、そのPLCを用いてラダー等のプログラム言語によって、レーザ加工の開始前ごとに、機種Aに対応する立上用のプログラムを選択的に実行させる必要がある。 Next, the startup process performed in this embodiment will be described with reference to FIGS. 2 and 3. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC (programmable logic controller) into the laser processing control device 70, as in the comparative example shown in FIG. There is. Then, the user needs to use the PLC to selectively execute a start-up program corresponding to model A using a programming language such as ladder, each time before starting laser processing.
 それに対して、本実施形態では、前述の通り、自動切換部75を有しており、ユーザによる登録部24の操作によって、機種Aの立上用プログラムP1aが登録されて記憶部40に記憶されている。そして、ユーザによる機種選択部25の操作によって機種Aが選択されている。そのことから、図3に示すように、加工プログラムPに基づくレーザ加工の開始前には、制御部30からの立上げ要求D1に応じて、自動で切換部50が、記憶部40から機種Aの立上用プログラムP1aを読み出して実行する。それによって、自動で機種Aの立上げ処理が実行される。 In contrast, in this embodiment, as described above, the automatic switching section 75 is provided, and the start-up program P1a of the model A is registered and stored in the storage section 40 by the user's operation of the registration section 24. ing. Then, model A is selected by the user's operation of the model selection section 25. Therefore, as shown in FIG. 3, before starting laser processing based on the processing program P, the switching section 50 automatically selects the model A from the storage section 40 in response to the startup request D1 from the control section 30. The start-up program P1a is read out and executed. As a result, startup processing for model A is automatically executed.
 具体的には、機種Aの立上げ処理では、まず、レーザ加工制御装置70が、自身による制御の許可を要求するレーザ要求Da1をレーザ発振器95に送信する。レーザ発振器95は、これを受信すると、所定の要件を満たしていることを条件に制御を許可して、レーザ割当済み信号Ca2をレーザ加工制御装置70に送信する。レーザ加工制御装置70は、これを受信すると、レーザON要求Da3をレーザ発振器95に送信する。レーザ発振器95は、これを受信すると、自身を初期状態から準備完了状態にして、レーザON信号Ca4をレーザ発振器95に送信する。レーザ加工制御装置70は、これを受信すると、自身によるアナログ制御の許可を要求するアナログ制御ON要求Da5をレーザ発振器95に送信する。レーザ発振器95は、これを受信すると、所定の要件を満たしていることを条件にアナログ制御を許可してアナログ制御ON信号Ca6をレーザ加工制御装置70に送信すると共に、レーザ準備完了信号Ca7をレーザ加工制御装置70に送信する。 Specifically, in the start-up process for model A, first, the laser processing control device 70 transmits a laser request Da1 requesting permission for control by itself to the laser oscillator 95. Upon receiving this, the laser oscillator 95 permits control on the condition that predetermined requirements are met, and transmits a laser allocation signal Ca2 to the laser processing control device 70. Upon receiving this, the laser processing control device 70 transmits a laser ON request Da3 to the laser oscillator 95. Upon receiving this, the laser oscillator 95 changes itself from the initial state to a ready state and transmits a laser ON signal Ca4 to the laser oscillator 95. Upon receiving this, the laser processing control device 70 transmits an analog control ON request Da5 requesting permission for its own analog control to the laser oscillator 95. Upon receiving this, the laser oscillator 95 allows analog control on the condition that predetermined requirements are met, and transmits an analog control ON signal Ca6 to the laser processing control device 70, and also sends a laser preparation completion signal Ca7 to the laser processing controller 70. It is transmitted to the processing control device 70.
 以上によって、機種Aのレーザ発振器95の立上げ処理が完了する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、レーザ加工の開始前ごとに、機種Aに対応する立上用のプログラムを選択的に実行させる必要がない。 With the above steps, the start-up process of the laser oscillator 95 of model A is completed. Therefore, the user does not need to selectively execute a start-up program corresponding to model A every time before starting laser processing using a program language such as a ladder using a PLC.
 立上げ処理の完了後には、切換部50が、立上げ完了通知C1を制御部30に送信する。それによって、制御部30は、機種Aのレーザ発振器95の使用を開始して、レーザ加工を開始する。 After the start-up process is completed, the switching unit 50 transmits a start-up completion notification C1 to the control unit 30. Thereby, the control unit 30 starts using the laser oscillator 95 of model A and starts laser processing.
 次に、図4,図5を参照しつつ、本実施形態で行う立下げ処理について説明する。仮に、レーザ加工制御装置70が、自動切換部75を有しない場合、図4に示す比較例の場合のように、レーザ加工制御装置70にPLCを導入しておく必要がある。そして、ユーザが、そのPLCを用いてラダー等のプログラム言語によって、レーザ加工の終了後ごとに、機種Aに対応する立下用のプログラムを選択的に実行させる必要がある。 Next, the shutdown process performed in this embodiment will be described with reference to FIGS. 4 and 5. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC into the laser processing control device 70, as in the case of the comparative example shown in FIG. Then, the user needs to use the PLC to selectively execute a program for falling down corresponding to model A every time the laser processing is completed using a programming language such as ladder.
 それに対して、本実施形態では、図5に示すように、加工プログラムPに基づくレーザ加工の終了後には、制御部30からの立下げ要求D2に応じて、自動で切換部50が、記憶部40から機種Aの立下用プログラムP2aを読み出して実行する。それによって、自動で機種Aの立下げ処理が実行される。 In contrast, in this embodiment, as shown in FIG. 5, after the laser processing based on the processing program P is completed, the switching section 50 automatically switches the storage section The shutdown program P2a of model A is read out from 40 and executed. As a result, the shutdown process for model A is automatically executed.
 具体的には、機種Aの立下げ処理では、まず、レーザ加工制御装置70は、アナログ制御ON要求Da5をOFFにする。これに基づいて、レーザ発振器95は、レーザ準備完了信号Ca7をOFFにすると共に、アナログ制御を不許可にして、アナログ制御ON信号Ca6をOFFにする。その後、レーザ加工制御装置70は、レーザON要求Da3をOFFにする。これに基づいて、レーザ加工制御装置70は、レーザON信号Ca4をOFFにする。その後、レーザ加工制御装置70は、レーザ要求Da1をOFFにする。これに基づいて、レーザ加工制御装置70は、レーザ割当済み信号Ca2をOFFにする。 Specifically, in the shutdown process for model A, the laser processing control device 70 first turns off the analog control ON request Da5. Based on this, the laser oscillator 95 turns off the laser preparation completion signal Ca7, disables analog control, and turns off the analog control ON signal Ca6. After that, the laser processing control device 70 turns off the laser ON request Da3. Based on this, the laser processing control device 70 turns off the laser ON signal Ca4. After that, the laser processing control device 70 turns off the laser request Da1. Based on this, the laser processing control device 70 turns off the laser allocation signal Ca2.
 以上によって、機種Aのレーザ発振器95の立下げ処理が完了する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、レーザ加工の終了後ごとに、機種Aに対応する立下用のプログラムを選択的に実行させる必要がない。 With the above steps, the shutdown process of the laser oscillator 95 of model A is completed. Therefore, the user does not need to selectively execute a program for falling down corresponding to model A every time laser processing is completed using a program language such as ladder using a PLC.
 立下げ処理の完了後には、切換部50が、立下げ完了通知C2を制御部30に送信する。それによって、制御部30は、加工プログラムPに基づく次の処理を開始する。 After completion of the shutdown process, the switching unit 50 transmits a shutdown completion notification C2 to the control unit 30. Thereby, the control unit 30 starts the next process based on the machining program P.
 以上の通り、本実施形態では、加工プログラムPに基づくレーザ加工の実施前に、機種Aの立上用プログラムP1aが自動で実施され、加工プログラムPに基づくレーザ加工の実施後に、機種Aの立下用プログラムP2aが自動で実施される。 As described above, in this embodiment, the start-up program P1a of the model A is automatically executed before the laser processing based on the processing program P is performed, and after the laser processing based on the processing program P is performed, the startup program P1a of the model A is automatically executed. The lower program P2a is automatically executed.
 また、加工プログラムPに基づくレーザ加工の実施の前後以外にも、例えば、以下の場合には、切換部50は、記憶部40から切換プログラムP1,P2を読み出して実行する。すなわち、緊急停止によってレーザ加工が中断された際や、加工プログラムに基づく指令以外の指令によってレーザ加工が中断された際には、切換部50は、選択されている機種Aに対応する立下用プログラムP2aを記憶部40から読み出して実行する。そして、切換部50は、レーザ加工の中断後のレーザ加工の再開時に、選択されている機種Aに対応する立上用プログラムP1aを記憶部40から読み出して実行する。 In addition to before and after laser processing based on the processing program P, for example, in the following cases, the switching unit 50 reads and executes the switching programs P1 and P2 from the storage unit 40. That is, when laser processing is interrupted due to an emergency stop or when laser processing is interrupted due to a command other than a command based on the processing program, the switching unit 50 switches to the lowering mode corresponding to the selected model A. The program P2a is read from the storage unit 40 and executed. Then, when the laser processing is restarted after the laser processing is interrupted, the switching section 50 reads out the start-up program P1a corresponding to the selected model A from the storage section 40 and executes it.
 他方、以上に示した立上用プログラムP1aを実施すべき状況のうちのいずれかであっても、切換部50は、レーザ加工を無効にすべき操作がなされているレーザ加工無効時には、立上用プログラムP1の実行をスキップする。そのレーザ加工無効時は、例えば、ユーザがレーザ加工システム90に動作を教える教示モードである時を含む。 On the other hand, even in any of the situations in which the start-up program P1a shown above should be executed, the switching unit 50 does not execute the start-up program P1a when the laser processing is disabled. The execution of the program P1 is skipped. The time when the laser processing is disabled includes, for example, when the user is in a teaching mode for teaching the laser processing system 90 an operation.
 以下に、本実施形態の構成および効果をまとめる。 The configuration and effects of this embodiment are summarized below.
 登録部24は、レーザ発振器95の状態を切り換える切換プログラムP1,P2を、ユーザによる操作によって登録可能に構成されており、切換部50は、レーザ発振器95の使用に応じて、登録されている切換プログラムP1,P2を記憶部40から読み出して実行する。そのため、レーザ発振器95の状態を切り換えるためのPLCを用意する必要がない。 The registration unit 24 is configured to be able to register switching programs P1 and P2 for switching the state of the laser oscillator 95 by user operation, and the switching unit 50 selects the registered switching programs P1 and P2 for switching the state of the laser oscillator 95 according to the use of the laser oscillator 95. The programs P1 and P2 are read from the storage unit 40 and executed. Therefore, there is no need to prepare a PLC for switching the state of the laser oscillator 95.
 具体的には、切換部50は、機種Aのレーザ発振器95の使用前に、機種Aに対応する立上用プログラムP1aを記憶部40から読み出して実行する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、レーザ発振器95の使用前ごとに、機種Aに対応する立上用のプログラムを選択的に実行させる必要がない。 Specifically, before the laser oscillator 95 of model A is used, the switching unit 50 reads out the start-up program P1a corresponding to model A from the storage unit 40 and executes it. Therefore, the user does not need to selectively execute a start-up program corresponding to model A each time before using the laser oscillator 95 using a program language such as ladder using a PLC.
 また、切換部50は、レーザ発振器95の使用後に、機種Aに対応する立下用プログラムP2aを記憶部40から読み出して実行する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、レーザ発振器95の使用後ごとに、機種Aに対応する立下用のプログラムを選択的に実行させる必要がない。 Furthermore, after the laser oscillator 95 is used, the switching unit 50 reads out the shutdown program P2a corresponding to model A from the storage unit 40 and executes it. Therefore, the user does not need to selectively execute a program for falling down corresponding to model A every time the laser oscillator 95 is used, using a program language such as ladder using a PLC.
 登録部24は、レーザ発振器95の機種A,B,C・・・毎に切換プログラムP1,P2を登録可能に構成されており、切換部50は、ユーザによる機種選択部25の操作によって選択された機種に対応する切換プログラムP1,P2を、記憶部40から読み出して実行する。そのため、使用するレーザ発振器95の機種A,B,C・・・が複数考えられる場合にも、対応できる。 The registration unit 24 is configured to be able to register switching programs P1, P2 for each model A, B, C, . . . The switching programs P1 and P2 corresponding to the selected model are read out from the storage unit 40 and executed. Therefore, it is possible to cope with the case where a plurality of models A, B, C, etc. of the laser oscillator 95 to be used can be considered.
 切換部50は、加工プログラムPの実行に基づくレーザ発振器95の使用に応じて、切換プログラムP1,P2を記憶部40から読み出して実行する。そのため、加工プログラムPに同期させて、効率的に適切なタイミングで、立上用プログラムP1および立下用プログラムP2を実行できる。 The switching unit 50 reads the switching programs P1 and P2 from the storage unit 40 and executes them in accordance with the use of the laser oscillator 95 based on the execution of the processing program P. Therefore, the start-up program P1 and the fall-down program P2 can be executed efficiently and at appropriate timing in synchronization with the machining program P.
 登録部24は、加工プログラムPをプログラム指令部23に入力可能なプログラム言語によって、切換プログラムP1,P2を入力可能に構成されている。そのため、ユーザは、ラダー等のPLC用のプログラム言語を使用できない場合であっても、対応できる。 The registration unit 24 is configured to be able to input the switching programs P1 and P2 using a programming language that allows the machining program P to be input to the program command unit 23. Therefore, even if the user cannot use a PLC programming language such as ladder, the user can cope with the situation.
 切換部50は、レーザ加工が中断された際に、立下用プログラムP2を記憶部40から読み出して実行する。そのため、レーザ加工の中断時には、速やかにレーザ発振器95を立下げることができる。 The switching unit 50 reads the stop program P2 from the storage unit 40 and executes it when the laser processing is interrupted. Therefore, when laser processing is interrupted, the laser oscillator 95 can be turned off quickly.
 切換部50は、レーザ加工の中断後のレーザ加工の再開時に、立上用プログラムP1を記憶部40から読み出して実行する。そのため、レーザ加工の再開時には、速やかにレーザ発振器95を立ち上げることができる。 The switching unit 50 reads the start-up program P1 from the storage unit 40 and executes it when restarting the laser processing after the interruption of the laser processing. Therefore, when laser processing is restarted, the laser oscillator 95 can be started up quickly.
 切換部50は、レーザ加工を無効にすべき操作がなされているレーザ加工無効時には、立上用プログラムP1の実行をスキップする。そのため、レーザ加工システム90は、間違ってもレーザを照射することができず、これによって、より安全性を確保することができる。 The switching unit 50 skips execution of the start-up program P1 when the laser processing is disabled, in which an operation to disable the laser processing is performed. Therefore, the laser processing system 90 cannot irradiate the laser even if it makes a mistake, thereby ensuring greater safety.
 具体的には、そのレーザ加工無効時は、ユーザがレーザ加工システム90に動作を教える教示モードが選択されている時を含む。そのため、教示モードでの安全性を、より確保することができる。 Specifically, the time when the laser processing is disabled includes the time when the teaching mode in which the user teaches the laser processing system 90 an operation is selected. Therefore, safety in the teaching mode can be further ensured.
 本実施形態では、コンピュータとレーザ加工制御プログラムとの協働によって、コンピュータを、プログラム指令部23および制御部30として機能させると共に、自動切換部75としても機能させる。つまり、コンピュータを、本実施形態のレーザ加工制御装置70として機能させる。そのため、コンピュータを利用して、本実施形態を実現できる。 In this embodiment, the computer functions as the program command section 23 and the control section 30, as well as the automatic switching section 75, by cooperation between the computer and the laser processing control program. That is, the computer is made to function as the laser processing control device 70 of this embodiment. Therefore, this embodiment can be implemented using a computer.
 [第2実施形態]
 次に図6~図10を参照しつつ、第2実施形態について説明する。以下の実施形態については、第1実施形態をベースにこれと異なる点を中心に説明し、第1実施形態と同一又は類似の点については、説明を適宜省略する。
[Second embodiment]
Next, a second embodiment will be described with reference to FIGS. 6 to 10. The following embodiments will be described based on the first embodiment, focusing on points different from the first embodiment, and descriptions of the same or similar points as the first embodiment will be omitted as appropriate.
 図6に示すように、本実施形態では、レーザ加工システム90が、第1実施形態で示した機種Aのレーザ発振器95に代えて、機種Bのレーザ発振器95を備えている。そのため、本実施形態では、ユーザは、機種選択部25の操作によって、機種Bを選択する。なお、機種Bは、「第2機種」と読み替えてもよい。 As shown in FIG. 6, in this embodiment, the laser processing system 90 includes a model B laser oscillator 95 instead of the model A laser oscillator 95 shown in the first embodiment. Therefore, in this embodiment, the user selects model B by operating the model selection section 25. Note that model B may be read as "second model".
 次に、図7,図8を参照しつつ、本実施形態で行う立上げ処理について説明する。仮に、レーザ加工制御装置70が、自動切換部75を有しない場合、図7に示す比較例の場合のように、PLCを導入しておく必要がある。そして、ユーザが、そのPLCを用いてラダー等のプログラム言語によって、レーザ加工の開始前ごとに、機種Bに対応する立上用のプログラムを選択的に実行させる必要がある。 Next, the startup process performed in this embodiment will be described with reference to FIGS. 7 and 8. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC as in the case of the comparative example shown in FIG. Then, the user needs to use the PLC to selectively execute a start-up program corresponding to model B using a programming language such as a ladder program each time before starting laser processing.
 それに対して、本実施形態では、図8に示すように、加工プログラムPに基づくレーザ加工の開始前には、制御部30からの立上げ要求D1に応じて、自動で切換部50が、記憶部40から機種Bの立上用プログラムP1bを読み出して実行する。それによって、自動で機種Bの立上げ処理が実行される。 In contrast, in this embodiment, as shown in FIG. 8, before starting laser processing based on the processing program P, the switching unit 50 automatically switches the memory A start-up program P1b for model B is read out from the unit 40 and executed. As a result, startup processing for model B is automatically executed.
 具体的には、機種Bの立上げ処理では、まず、レーザ発振器95が、パワーオンであることを示すパワーオン信号Cb1をレーザ加工制御装置70に送信する。レーザ加工制御装置70は、これを受信すると、スタンバイ要求Db2をレーザ発振器95に送信する。レーザ発振器95は、これを受信すると、自身を初期状態から準備完了状態にして、レーザレディOK信号Cb3およびスタンバイOK信号Cb4をレーザ加工制御装置70に送信する。レーザ加工制御装置70は、これを受信すると、自身による制御の許可を要求するアナログ制御要求Db5をレーザ発振器95に送信する。レーザ発振器95は、これを受信すると、所定の要件を満たすことを条件に制御を許可して、レーザON信号Cb6をレーザ加工制御装置70に送信する。 Specifically, in the start-up process for model B, first, the laser oscillator 95 transmits a power-on signal Cb1 indicating that the power is on to the laser processing control device 70. Upon receiving this, the laser processing control device 70 transmits a standby request Db2 to the laser oscillator 95. Upon receiving this, the laser oscillator 95 changes itself from the initial state to a ready state and transmits a laser ready OK signal Cb3 and a standby OK signal Cb4 to the laser processing control device 70. Upon receiving this, the laser processing control device 70 transmits an analog control request Db5 requesting permission for control by itself to the laser oscillator 95. Upon receiving this, the laser oscillator 95 permits control on the condition that predetermined requirements are met, and transmits the laser ON signal Cb6 to the laser processing control device 70.
 以上によって、機種Bのレーザ発振器95の立上げ処理が完了する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、レーザ加工の開始前ごとに、機種Bに対応する立上用のプログラムを選択的に実行させる必要がない。 With the above steps, the start-up process of the laser oscillator 95 of model B is completed. Therefore, the user does not need to selectively execute the start-up program corresponding to model B every time before starting laser processing using a program language such as a ladder using a PLC.
 次に、図9,図10を参照しつつ、本実施形態で行う立下げ処理について説明する。仮に、レーザ加工制御装置70が、自動切換部75を有しない場合、図9に示す比較例の場合のように、PLCを導入しておく必要がある。そして、ユーザが、そのPLCを用いてラダー等のプログラム言語によって、レーザ加工の終了後ごとに、機種Bに対応する立下用のプログラムを選択的に実行させる必要がある。 Next, the shutdown process performed in this embodiment will be described with reference to FIGS. 9 and 10. If the laser processing control device 70 does not have the automatic switching section 75, it is necessary to introduce a PLC as in the case of the comparative example shown in FIG. Then, the user needs to use the PLC to selectively execute the fall program corresponding to model B using a program language such as a ladder program every time the laser processing is completed.
 それに対して、本実施形態では、図10に示すように、加工プログラムPに基づくレーザ加工の終了後には、制御部30からの立下げ要求D2に応じて、自動で切換部50が、記憶部40から機種Bの立下用プログラムP2bを読み出して実行する。それによって、自動で機種Bの立下げ処理が実行される。 In contrast, in this embodiment, as shown in FIG. 10, after the laser processing based on the processing program P is completed, the switching section 50 automatically switches the storage section to The shutdown program P2b of model B is read out from 40 and executed. As a result, the shutdown process for model B is automatically executed.
 具体的には、機種Bの立下げ処理では、まず、レーザ加工制御装置70が、アナログ制御要求Db5をOFFにする。これに基づいて、レーザ発振器95が、レーザON信号Cb6をOFFにする。その後、レーザ加工制御装置70が、スタンバイ要求Db2をOFFにする。これに基づいて、レーザ発振器95が、スタンバイOK信号Cb4、レーザレディOK信号Cb3、パワーオン信号Cb1を順にOFFにする。このように、本実施形態では、第1実施形態の場合とは異なる立下げ処理が実施される。 Specifically, in the shutdown process for model B, the laser processing control device 70 first turns off the analog control request Db5. Based on this, the laser oscillator 95 turns off the laser ON signal Cb6. After that, the laser processing control device 70 turns off the standby request Db2. Based on this, the laser oscillator 95 sequentially turns off the standby OK signal Cb4, the laser ready OK signal Cb3, and the power-on signal Cb1. In this way, in this embodiment, a different fall process from that in the first embodiment is performed.
 以上によって、機種Bのレーザ発振器95の立下げ処理が完了する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、レーザ加工の終了後ごとに、機種Bに対応する立下用のプログラムを選択的に実行させる必要がない。 With the above steps, the shutdown process of the laser oscillator 95 of model B is completed. Therefore, the user does not need to selectively execute a program for falling down corresponding to model B every time laser processing is completed using a program language such as a ladder using a PLC.
 以上の通り、本実施形態によれば、レーザ発振器95が機種Bである場合においても、第1実施形態の場合と同様の効果が得られる。 As described above, according to this embodiment, even when the laser oscillator 95 is model B, the same effects as in the first embodiment can be obtained.
 [第3実施形態]
 次に図11を参照しつつ、第3実施形態について説明する。本実施形態では、レーザ加工システム90が、第1実施形態で示した機種Aのレーザ発振器95に加えて、第2実施形態で示した機種Bのレーザ発振器95をも備えている。そして、加工ノズル92は、機種Aのレーザ発振器95からのレーザおよび機Bのレーザ発振器95からのレーザのいずれについても、択一的に入力して照射可能に構成されている。なお、図では、一の加工ノズル92に2つのレーザ発振器95,95が接続されているが、レーザ発振器95,95毎に別々の加工ノズル92,92が設けられていてもよい。
[Third embodiment]
Next, a third embodiment will be described with reference to FIG. 11. In this embodiment, the laser processing system 90 includes, in addition to the laser oscillator 95 of the model A shown in the first embodiment, the laser oscillator 95 of the model B shown in the second embodiment. The processing nozzle 92 is configured to be able to selectively input and irradiate either the laser from the laser oscillator 95 of the model A or the laser from the laser oscillator 95 of the machine B. In the figure, two laser oscillators 95, 95 are connected to one processing nozzle 92, but separate processing nozzles 92, 92 may be provided for each laser oscillator 95, 95.
 つまり、本実施形態のレーザ加工制御装置70は、用途等に応じて、機種Aのレーザ発振器95と機種Bのレーザ発振器95とを使い分ける。そのことから、機種選択部25は、使用するレーザ発振器95の機種として、複数の機種を選択可能に構成されている。具体的には、本実施形態では、ユーザは、機種選択部25の操作によって、使用するレーザ発振器95の一の機種として機種Aを選択し、使用するレーザ発振器95の他の機種として機種Bを選択する。 In other words, the laser processing control device 70 of this embodiment uses the laser oscillator 95 of model A and the laser oscillator 95 of model B depending on the purpose and the like. For this reason, the model selection section 25 is configured to be able to select a plurality of models as the model of the laser oscillator 95 to be used. Specifically, in this embodiment, the user selects model A as one model of the laser oscillator 95 to be used, and selects model B as the other model of the laser oscillator 95 to use, by operating the model selection unit 25. select.
 この場合、切換部50は、加工プログラムPの実施に基づく機種Aのレーザ発振器95の使用前に、機種Aの立上用プログラムP1aを記憶部40から読み出して実施し、当該機種Aのレーザ発振器95の使用後に、機種Aの立下用プログラムP2aを記憶部40から読み出して実施する。そして、切換部50は、加工プログラムPの実施に基づく機種Bのレーザ発振器95の使用前に、機種Bの立上用プログラムP1bを記憶部40から読み出して実施し、当該機種Bのレーザ発振器95の使用後に、機種Bの立下用プログラムP2bを記憶部40から読み出して実施する。 In this case, before using the laser oscillator 95 of the model A based on the execution of the machining program P, the switching unit 50 reads out the start-up program P1a of the model A from the storage unit 40 and executes the start-up program P1a of the laser oscillator of the model A. 95, the shutdown program P2a for model A is read out from the storage unit 40 and executed. Then, before using the laser oscillator 95 of the model B based on the execution of the machining program P, the switching unit 50 reads the start-up program P1b of the model B from the storage unit 40 and executes the start-up program P1b of the laser oscillator 95 of the model B. After using the program, the shutdown program P2b for model B is read out from the storage unit 40 and executed.
 以上の通り、本実施形態によれば、切換部50は、加工プログラムPの実行に基づく機種Aのレーザ発振器95の使用に応じて、記憶部40から機種Aに対応する切換プログラムP1a,P2aを読み出して実行する。そして、切換部50は、加工プログラムPの実行に基づく機種Bのレーザ発振器95の使用に応じて、記憶部40から機種Bに対応する切換プログラムP1b,P2bを読み出して実行する。そのため、複数のレーザ発振器95を切り換えて使用したい場合に対応できる。 As described above, according to the present embodiment, the switching unit 50 reads the switching programs P1a and P2a corresponding to the model A from the storage unit 40 in accordance with the use of the laser oscillator 95 of the model A based on the execution of the processing program P. Read and execute. Then, the switching unit 50 reads switching programs P1b and P2b corresponding to the model B from the storage unit 40 and executes them in accordance with the use of the laser oscillator 95 of the model B based on the execution of the machining program P. Therefore, it is possible to cope with the case where it is desired to switch and use a plurality of laser oscillators 95.
 [第4実施形態]
 次に図12,13を参照しつつ、第4実施形態について説明する。本実施形態では、レーザ加工システムに代わりに、ワークに塗装を行う塗工システムを有し、レーザ加工制御装置70の代わりに、当該塗工システムを制御する塗工制御装置70dを有する。
[Fourth embodiment]
Next, a fourth embodiment will be described with reference to FIGS. 12 and 13. In this embodiment, instead of the laser processing system, there is provided a coating system that paints the workpiece, and instead of the laser processing control device 70, there is provided a coating control device 70d that controls the coating system.
 塗工システムは、機種αの塗布装置95dを備えている。そのため、本実施形態では、ユーザは、機種選択部の操作によって、機種αを選択する。 The coating system includes a coating device 95d of model α. Therefore, in this embodiment, the user selects the model α by operating the model selection section.
 次に、図12を参照しつつ、本実施形態で行う立上げ処理について説明する。加工プログラムPに基づく塗布の開始前には、制御部30からの立上げ要求D1に応じて、自動で切換部50が、記憶部から機種αの立上用プログラムP1dを読み出して実行する。それによって、自動で機種αの立上げ処理が実行される。 Next, the startup process performed in this embodiment will be described with reference to FIG. 12. Before starting coating based on the machining program P, the switching unit 50 automatically reads out and executes the startup program P1d for the model α from the storage unit in response to a startup request D1 from the control unit 30. As a result, startup processing for model α is automatically executed.
 具体的には、機種αの立上げ処理では、まず、塗工制御装置70dが、自身による塗布装置95dのバルブの制御の許可を要求するバルブ制御ON要求Dd1を塗布装置95dに送信する。塗布装置95dは、これを受信すると、所定の要件を満たすことを条件に、バルブ制御を許可して、バルブ制御ON信号Cd2を塗工制御装置70dに送信する。塗工制御装置70dは、これを受信すると、シール材充填要求Dd3を塗布装置95dに送信する。塗布装置95dは、これを受信すると、シール材を充填して、シール材充填完了信号Cd4を塗工制御装置70dに送信する。塗工制御装置70dは、これを受信すると、準備圧要求Dd5を塗布装置95dに送信する。塗布装置95dは、これを受信すると、内部の圧力を上昇させて、準備圧完了信号Cd6を塗工制御装置70dに送信する。  Specifically, in the start-up process for model α, first, the coating control device 70d sends a valve control ON request Dd1 to the coating device 95d requesting permission to control the valve of the coating device 95d by itself. Upon receiving this, the coating device 95d permits valve control on the condition that predetermined requirements are met, and transmits a valve control ON signal Cd2 to the coating control device 70d. Upon receiving this, the coating control device 70d transmits a sealing material filling request Dd3 to the coating device 95d. Upon receiving this, the coating device 95d fills the sealing material and transmits a sealing material filling completion signal Cd4 to the coating control device 70d. Upon receiving this, the coating control device 70d transmits a preparation pressure request Dd5 to the coating device 95d. Upon receiving this, the coating device 95d increases the internal pressure and transmits a preparation pressure completion signal Cd6 to the coating control device 70d. 
 以上によって、機種αの塗布装置95dの立上げ処理が完了する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、塗工の開始前ごとに、機種αに対応する立上用のプログラムを選択的に実行させる必要がない。立上げ処理の完了後には、切換部50が、立上げ完了通知C1を制御部30に送信する。 With the above steps, the start-up process of the coating device 95d of model α is completed. Therefore, the user does not need to selectively execute the start-up program corresponding to the model α every time before starting coating using a program language such as a ladder using a PLC. After the start-up process is completed, the switching unit 50 transmits a start-up completion notification C1 to the control unit 30.
 次に、図13を参照しつつ、本実施形態で行う立下げ処理について説明する。加工プログラムPに基づく塗工の終了後には、制御部30からの立下げ要求D2に応じて、自動で切換部50が、記憶部から機種αの立下用プログラムP2dを読み出して実行する。それによって、自動で機種αの立下げ処理が実行される。 Next, the shutdown process performed in this embodiment will be described with reference to FIG. 13. After the coating based on the machining program P is completed, the switching unit 50 automatically reads out the shutdown program P2d of the model α from the storage unit and executes it in response to the shutdown request D2 from the control unit 30. As a result, the shutdown process for model α is automatically executed.
 具体的には、機種αの立下げ処理では、まず、塗工制御装置70dが、準備圧要求Dd5をOFFにする。これに基づいて、塗布装置95dが内部の圧力を下げて、準備圧完了信号Cd6をOFFにする。その後、塗工制御装置70dが、バルブ制御ON要求Dd1をOFFにする。これに基づいて、塗布装置95dが、バルブ制御の許可を解除して、バルブ制御ON信号Cd2をOFFにする。 Specifically, in the shutdown process for model α, first, the coating control device 70d turns off the preparation pressure request Dd5. Based on this, the coating device 95d lowers the internal pressure and turns off the preparation pressure completion signal Cd6. Thereafter, the coating control device 70d turns off the valve control ON request Dd1. Based on this, the coating device 95d cancels permission for valve control and turns off the valve control ON signal Cd2.
 以上によって、機種αの塗布装置95dの立下げ処理が完了する。そのため、ユーザは、PLCを用いてラダー等のプログラム言語によって、塗工の終了後ごとに、機種αに対応する立下用のプログラムを選択的に実行させる必要がない。立下げ処理の完了後には、切換部50が、立下げ完了通知C2を制御部30に送信する。 Through the above steps, the process of shutting down the coating device 95d of model α is completed. Therefore, the user does not have to use a PLC to selectively execute a program for falling down corresponding to the model α every time coating is completed using a programming language such as ladder. After completion of the shutdown process, the switching unit 50 transmits a shutdown completion notification C2 to the control unit 30.
 以上の通り、本実施形態によれば、加工システムが塗工システムであり、加工機器が塗布装置95dである場合においても、第1実施形態の場合と同様の効果が得られる。 As described above, according to this embodiment, even when the processing system is a coating system and the processing equipment is the coating device 95d, the same effects as in the first embodiment can be obtained.
 [他の実施形態]
 以上に示した実施形態は、例えば次のように変更できる。登録部24の操作によって、立上用プログラムP1および立下用プログラムP2のうちの一方のみを登録しておき、他方に対応する処理ついては、比較例の場合と同じように、PLCによって行うようにしてもよい。
[Other embodiments]
The embodiment shown above can be modified as follows, for example. By operating the registration unit 24, only one of the startup program P1 and the shutdown program P2 is registered, and the processing corresponding to the other is performed by the PLC as in the case of the comparative example. It's okay.
 ユーザによる機種選択部25の操作によって、レーザ発振器95の機種を選択する代わりに、切換部50が、加工ノズル92に接続されたレーザ発振器95の機種を、接続状況等から自動で認識して、当該認識した機種に対応する切換プログラムP1,P2を実行するようにしてもよい。この構成によれば、ユーザが機種選択部25の操作によってレーザ発振器95の機種を選択する手間さえも軽減できる。 Instead of selecting the model of the laser oscillator 95 by the user's operation of the model selection unit 25, the switching unit 50 automatically recognizes the model of the laser oscillator 95 connected to the processing nozzle 92 from the connection status etc. The switching programs P1 and P2 corresponding to the recognized model may be executed. According to this configuration, even the effort required by the user to select the model of the laser oscillator 95 by operating the model selection section 25 can be reduced.
 加工システムは、第1~第3実施形態では、レーザ加工システムであり、第4実施形態では、塗工システムであるが、その他の加工を行う又は含むシステムであってもよい。その他の加工としては、例えば切削、押圧、引張、加熱、加圧等のレーザ加工以外の加工であって、ワークを一部除去したり、切断したり、破断させたり、変形させたり、変質させたりする加工や、塗工以外の加工であってワークに付加物を付加する加工等が挙げられる。 The processing system is a laser processing system in the first to third embodiments, and a coating system in the fourth embodiment, but may be a system that performs or includes other processing. Other processing includes processing other than laser processing, such as cutting, pressing, tensioning, heating, and pressurization, such as removing a part of the workpiece, cutting it, breaking it, deforming it, or altering its quality. Examples include processing that adds additives to the workpiece, and processing other than coating that adds additives to the workpiece.
 24  登録部
 25  機種選択部
 30  制御部
 40  記憶部
 50  切換部
 70  レーザ加工制御装置
 70d 塗工制御装置
 90  レーザ加工システム
 95  レーザ発振器
 95d 塗布装置
 P   加工プログラム
 P1  立上用プログラム
 P2  立下用プログラム
 S1  初期状態
 S2  準備完了状態

 
24 Registration section 25 Model selection section 30 Control section 40 Storage section 50 Switching section 70 Laser processing control device 70d Coating control device 90 Laser processing system 95 Laser oscillator 95d Coating device P Processing program P1 Start-up program P2 Stop-down program S1 Initial state S2 Ready state

Claims (15)

  1.  加工機器を用いてワークを加工する加工システムを制御する加工制御装置であって、
     前記加工機器の状態を、前記ワークを加工するための所定の動作を実行不能な初期状態と前記所定の動作を実行可能な準備完了状態との間で切り換えるための切換プログラムを、ユーザによる操作によって登録可能に構成された登録部と、
     登録された前記切換プログラムを記憶する記憶部と、
     前記加工機器の使用に応じて前記記憶部から前記切換プログラムを読み出して実行する切換部と、
     を有する加工制御装置。
    A processing control device that controls a processing system that processes a workpiece using processing equipment,
    A switching program for switching the state of the processing equipment between an initial state in which a predetermined operation for processing the workpiece cannot be executed and a ready state in which the predetermined operation can be executed; a registration section configured to allow registration;
    a storage unit that stores the registered switching program;
    a switching unit that reads and executes the switching program from the storage unit according to the use of the processing equipment;
    A processing control device with
  2.  前記加工機器は、レーザ発振器であり、
     前記加工システムは、前記レーザ発振器から出力されるレーザを用いて前記ワークをレーザ加工するレーザ加工システムであり、
     前記初期状態は、レーザを出力不能な状態であり、
     前記準備完了状態は、レーザを出力可能な状態である、
     請求項1に記載の加工制御装置。
    The processing equipment is a laser oscillator,
    The processing system is a laser processing system that laser-processes the workpiece using a laser output from the laser oscillator,
    The initial state is a state in which the laser cannot be output,
    The ready state is a state in which a laser can be output.
    The processing control device according to claim 1.
  3.  前記切換プログラムは、前記加工機器の状態を前記初期状態から前記準備完了状態に切り換えるための立上用プログラムを含み、
     前記切換部は、前記加工機器の使用前に、前記記憶部から前記立上用プログラムを読み出して実行する、
     請求項1又は2に記載の加工制御装置。
    The switching program includes a start-up program for switching the state of the processing equipment from the initial state to the ready state,
    The switching unit reads and executes the start-up program from the storage unit before using the processing equipment.
    The processing control device according to claim 1 or 2.
  4.  前記切換プログラムは、前記加工機器の状態を前記準備完了状態から前記初期状態に切り換えるための立下用プログラムを含み、
     前記切換部は、前記加工機器の使用後に、前記記憶部から前記立下用プログラムを読み出して実行する、
     請求項1~3のいずれか1つに記載の加工制御装置。
    The switching program includes a shutdown program for switching the state of the processing equipment from the ready state to the initial state,
    The switching unit reads and executes the shutdown program from the storage unit after using the processing equipment.
    The processing control device according to any one of claims 1 to 3.
  5.  前記切換プログラムは、前記加工機器の状態を前記初期状態から前記準備完了状態に切り換えるための立上用プログラムと、前記加工機器の状態を前記準備完了状態から前記初期状態に切り換えるための立下用プログラムとを含み、
     前記切換部は、前記加工機器の使用前に、前記記憶部から前記立上用プログラムを読み出して実行し、前記加工機器の使用後に、前記記憶部から前記立下用プログラムを読み出して実行する、
     請求項1又は2に記載の加工制御装置。
    The switching program includes a startup program for switching the state of the processing equipment from the initial state to the ready state, and a startup program for switching the state of the processing equipment from the ready state to the initial state. includes a program,
    The switching unit reads and executes the startup program from the storage unit before using the processing equipment, and reads and executes the shutdown program from the storage unit after using the processing equipment.
    The processing control device according to claim 1 or 2.
  6.  前記登録部は、前記加工機器の機種毎に前記切換プログラムを登録可能に構成されており、
     ユーザによって前記加工機器の機種を選択可能に構成された機種選択部を有し、
     前記切換部は、前記機種選択部によって選択された機種に対応する前記切換プログラムを、前記記憶部から読み出して実行する、
     請求項1~5のいずれか1つに記載の加工制御装置。
    The registration unit is configured to be able to register the switching program for each model of the processing equipment,
    a model selection unit configured to allow a user to select a model of the processing equipment;
    The switching unit reads the switching program corresponding to the model selected by the model selection unit from the storage unit and executes it.
    The processing control device according to any one of claims 1 to 5.
  7.  ユーザによる操作によって加工プログラムを入力可能に構成されたプログラム指令部と、入力された前記加工プログラムに基づいて前記加工システムを制御する制御部と、を有し、
     前記切換部は、前記加工プログラムの実行に基づく前記加工機器の使用に応じて、前記記憶部から前記切換プログラムを読み出して実行する、
     請求項1~6のいずれか1つに記載の加工制御装置。
    comprising a program command unit configured to be able to input a machining program by a user's operation, and a control unit that controls the machining system based on the input machining program,
    The switching unit reads the switching program from the storage unit and executes the switching program in accordance with the use of the processing equipment based on the execution of the processing program.
    The processing control device according to any one of claims 1 to 6.
  8.  前記登録部は、前記加工プログラムを前記プログラム指令部に入力する際に使用可能なプログラム言語によって、前記切換プログラムを入力可能に構成されている、
     請求項7に記載の加工制御装置。
    The registration unit is configured to be able to input the switching program in a program language that can be used when inputting the machining program to the program command unit.
    The processing control device according to claim 7.
  9.  前記記憶部には、第1機種に対応する前記切換プログラムと、前記第1機種とは異なる第2機種に対応する前記切換プログラムとが記憶され、
     前記加工プログラムの実行によって、前記第1機種の前記加工機器と前記第2機種の前記加工機器とが使用され、
     前記切換部は、前記加工プログラムの実行に基づく前記第1機種の前記加工機器の使用に応じて、前記記憶部から前記第1機種に対応する前記切換プログラムを読み出して実行し、前記加工プログラムの実行に基づく前記第2機種の前記加工機器の使用に応じて、前記記憶部から前記第2機種に対応する前記切換プログラムを読み出して実行する、
     請求項7又は8に記載の加工制御装置。
    The storage unit stores the switching program corresponding to a first model and the switching program corresponding to a second model different from the first model,
    By executing the processing program, the processing equipment of the first model and the processing equipment of the second model are used,
    The switching unit reads out and executes the switching program corresponding to the first model from the storage unit in accordance with the use of the processing equipment of the first model based on execution of the processing program, and executes the switching program corresponding to the first model. reading out and executing the switching program corresponding to the second model from the storage unit in accordance with the use of the processing equipment of the second model based on execution;
    The processing control device according to claim 7 or 8.
  10.  前記切換プログラムは、前記加工機器の状態を前記準備完了状態から前記初期状態に切り換えるための立下用プログラムを含み、
     前記切換部は、加工が中断又は終了した際に、前記記憶部から前記立下用プログラムを読み出して実行する、
     請求項1~9のいずれか1つに記載の加工制御装置。
    The switching program includes a shutdown program for switching the state of the processing equipment from the ready state to the initial state,
    The switching unit reads and executes the fall program from the storage unit when machining is interrupted or completed.
    The processing control device according to any one of claims 1 to 9.
  11.  前記切換プログラムは、前記加工機器の状態を前記初期状態から前記準備完了状態に切り換えるための立上用プログラムを含み、
     前記切換部は、加工の中断後の加工の再開時に、前記記憶部から前記立上用プログラムを読み出して実行する、
     請求項1~10のいずれか1つ記載の加工制御装置。
    The switching program includes a start-up program for switching the state of the processing equipment from the initial state to the ready state,
    The switching unit reads and executes the startup program from the storage unit when restarting machining after interruption of machining.
    A processing control device according to any one of claims 1 to 10.
  12.  前記切換プログラムは、前記加工機器の状態を前記初期状態から前記準備完了状態に切り換えるための立上用プログラムを含み、
     前記切換部は、加工を無効にすべき操作がなされている加工無効時には、前記立上用プログラムの実行をスキップする、請求項1~11のいずれか1つに記載の加工制御装置。
    The switching program includes a start-up program for switching the state of the processing equipment from the initial state to the ready state,
    12. The machining control device according to claim 1, wherein the switching unit skips execution of the start-up program when machining is invalidated when an operation to invalidate machining is performed.
  13.  前記加工無効時は、ユーザが前記加工システムに動作を教える教示モードである時を含む、請求項12に記載の加工制御装置。 The machining control device according to claim 12, wherein the time when the machining is invalid includes a time when the user is in a teaching mode in which the machining system is taught an operation.
  14.  ユーザによる前記登録部の操作によって前記切換プログラムが登録される前の状態において、前記記憶部が、前記加工機器の所定の機種に対応する前記切換プログラムの少なくとも一部を記憶している、請求項1~13のいずれか1つに記載の加工制御装置。 2. The storage unit stores at least a part of the switching program corresponding to a predetermined model of the processing equipment in a state before the switching program is registered by a user's operation of the registration unit. 14. The processing control device according to any one of 1 to 13.
  15.  コンピュータを、加工機器を用いてワークを加工する加工システムを制御する加工制御装置として、機能させる加工制御プログラムであって、
     前記コンピュータを、さらに、
     前記加工機器の状態を、前記ワークを加工するための所定の動作を実行不能な初期状態と前記所定の動作を実行可能な準備完了状態との間で切り換えるための切換プログラムを、ユーザによって登録可能に構成された登録部と、
     登録された前記切換プログラムを記憶する記憶部と、
     前記加工機器の使用に応じて前記記憶部から前記切換プログラムを読み出して実行する切換部と、
     として機能させる加工制御プログラム。

     
    A processing control program that causes a computer to function as a processing control device that controls a processing system that processes a workpiece using processing equipment,
    The computer further comprises:
    A user can register a switching program for switching the state of the processing equipment between an initial state in which a predetermined operation for processing the workpiece cannot be executed and a ready state in which the predetermined operation can be executed. a registry configured with;
    a storage unit that stores the registered switching program;
    a switching unit that reads and executes the switching program from the storage unit according to the use of the processing equipment;
    A processing control program that functions as a

PCT/JP2022/032294 2022-08-26 2022-08-26 Processing control device and processing control program WO2024042729A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03155486A (en) * 1989-11-10 1991-07-03 Mitsubishi Electric Corp Numerical controller
JPH09271966A (en) * 1996-04-04 1997-10-21 Amada Co Ltd Method and device for operating laser beam machine
JP2006521933A (en) * 2003-03-31 2006-09-28 ハイパーサーム インコーポレイテッド Centralized control architecture for laser material processing systems
JP2007030031A (en) * 2005-07-29 2007-02-08 Fanuc Ltd Robot laser machining system
JP2020188234A (en) * 2019-05-17 2020-11-19 住友重機械工業株式会社 Control device of pulse laser oscillator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03155486A (en) * 1989-11-10 1991-07-03 Mitsubishi Electric Corp Numerical controller
JPH09271966A (en) * 1996-04-04 1997-10-21 Amada Co Ltd Method and device for operating laser beam machine
JP2006521933A (en) * 2003-03-31 2006-09-28 ハイパーサーム インコーポレイテッド Centralized control architecture for laser material processing systems
JP2007030031A (en) * 2005-07-29 2007-02-08 Fanuc Ltd Robot laser machining system
JP2020188234A (en) * 2019-05-17 2020-11-19 住友重機械工業株式会社 Control device of pulse laser oscillator

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