WO2024032525A1

WO2024032525A1 - Light modulation layer of spectrum chip, and spectrum chip

Info

Publication number: WO2024032525A1
Application number: PCT/CN2023/111391
Authority: WO
Inventors: 曹金磊; 王宇; 黄志雷
Original assignee: 北京与光科技有限公司
Priority date: 2022-08-09
Filing date: 2023-08-07
Publication date: 2024-02-15

Abstract

The present application relates to a light modulation layer of a spectrum chip, and the spectrum chip comprising same. The light modulation layer of the spectrum chip comprises one or more structural units. Each structural unit comprises a plurality of structural subunits, and the number, shape and structure of micro-nano structures of each structural subunit in each structural unit are consistent among the plurality of structural subunits. The positions of the micro-nano structures in the structural subunits correspondingly arranged, and a rotation angle θ is formed between every two of the plurality of structural subunits in each structural unit, and satisfies equation (I), wherein m and n are positive integers. In this way, the sensitivity of the transmission spectrum of the spectrum chip to polarization can be solved.

Description

The light modulation layer of the spectrum chip and the spectrum chip

Technical field

The present application relates to the field of spectrum technology, and more specifically, to a light modulation layer of a spectrum chip and a spectrum chip including the same.

Background technique

The interaction between light and matter, such as absorption, scattering, fluorescence, Raman, etc., will produce a specific spectrum, and the spectrum of each substance is unique. Therefore, spectral information can be said to be the “fingerprint” of all things. The spectrometer can directly detect the spectral information of a substance and obtain the existence status and material composition of the measured target. It is one of the important testing instruments in the fields of material characterization and chemical analysis.

Spectrometers often have different responses to incident light of different polarizations. In actual use, since the polarization state of the light to be measured cannot be known in advance, polarizers need to be added to the optical path. This not only increases the cost, but also makes it difficult to miniaturize. ization and performance stability cannot be guaranteed.

Therefore, it is desirable to provide an improved spectroscopic chip for eliminating the effects of polarization.

Contents of the invention

Embodiments of the present application provide a light modulation layer of a spectrum chip and a spectrum chip including the same, which solves the sensitivity of the transmission spectrum of the spectrum chip to polarization by including structural units with sub-structural units having predetermined angles.

According to one aspect of the present application, a light modulation layer of a spectrum chip is provided, including: one or more structural units, each structural unit includes n sub-structural units, and each sub-structural unit within each structural unit The number, shape, and structure of the micro-nano structures are consistent for the plurality of sub-structural units, and the positions of the micro-nano structures relative to the sub-structural units correspond to each other, and n in each structural unit There is a rotation angle θ between every two sub-structural units in the sub-structural unit, which satisfies:

where m and n are positive integers.

In the light modulation layer of the above spectrum chip, m is equal to 1, and n is greater than or equal to 2.

In the light modulation layer of the above-mentioned spectrum chip, each sub-structural unit includes at least one micro-nano structure.

In the light modulation layer of the above spectrum chip, each sub-structural unit includes at least two micro-nano structures, and the micro-nano structures are irregularly arranged.

In the light modulation layer of the above spectrum chip, the structural unit includes a first sub-structural unit and a second sub-structural unit, and the second sub-structural unit is formed by rotating the first sub-structural unit 90 degrees.

According to another aspect of the present application, a light modulation layer of a spectrum chip is provided, including: n structural units, each structural unit having a plurality of micro-nano structural units, and the micro-nano structural units are arranged according to periodic rules. The structural unit is implemented as a photonic crystal, and the arrangement of the micro-nano structural units of each structural unit is consistent for the n structural units, and the multiple micro-nano structural units are relative to the structure. The positions of the units correspond to each other, and there is a rotation angle θ between the multiple micro-nano structural units of each two structural units in the n structural units, which satisfies:

where m and n are positive integers.

In the light modulation layer of the above spectrum chip, the rotation angle θ between the multiple micro-nano structural units of each two structural units in the n structural units includes: the multiple micro-nano structural units of the two structural units. The nanostructure unit has a rotation angle θ as a whole.

In the light modulation layer of the above-mentioned spectrum chip, for the incomplete structure at the edge of each structural unit, remove micro-nano structures with an area of less than or equal to 50%, and/or remove micro-nano structures with an area of greater than or equal to 50%. The structure is complemented or left alone.

In the light modulation layer of the above spectrum chip, the micro-nano structural unit includes a micro-nano structure, the micro-nano structure constitutes a lattice, the lattice has a lattice translation vector, in the structural unit according to the The lattice translation vector densely tiles the multiple micro-nano structural units.

In the light modulation layer of the above-mentioned spectrum chip, the micro-nano structural unit includes a plurality of micro-nano structures, the multiple micro-nano structures constitute a lattice, and the lattice has a lattice translation vector. In the structural unit The plurality of micro-nano structural units are densely packed according to the lattice translation vector.

In the light modulation layer of the above spectrum chip, the plurality of micro-nano structures include the same type of micro-nano structures and/or different types of micro-nano structures.

In the light modulation layer of the above spectrum chip, the rotation angle θ between the multiple micro-nano structural units of each two structural units in the n structural units includes: the multiple micro-nano structural units of the two structural units. There is a rotation angle θ between each micro-nano structural unit in the nanostructural unit.

In the light modulation layer of the above spectrum chip, the micro-nano structural unit includes one or more micro-nano structures.

In the light modulation layer of the above spectrum chip, the micro-nano structural unit includes a plurality of micro-nano structures, and the micro-nano structural unit is at least three-dimensional rotationally symmetrical.

In the light modulation layer of the above spectrum chip, the plurality of micro-nano structures in the micro-nano structural unit are rotated by 60° or 90° with each other.

According to another aspect of the present application, a spectrum chip is provided, including: a light modulation layer as described above; and an image sensor, the light modulation layer is disposed on the photosensitive path of the image sensor, and the structure Cells correspond to physical pixels of the image sensor.

In the spectrum chip as described above, further comprising: a light-transmitting layer located between the light modulation layer and the image sensor, the light-transmitting layer being formed on the surface of the image sensor and having Flat upper surface.

The spectrum chip as described above further includes: a protective layer located on the upper surface of the light modulation layer for protecting the light modulation layer.

In the spectrum chip as described above, the micro-nano structure of the structural unit of the light modulation layer is a modulation hole, and the modulation hole is at least partially filled with a filling material.

In the spectrum chip as described above, the light modulation layer includes a first light modulation layer and a second light modulation layer as the light modulation layer as described above, and the first light modulation layer and the second light modulation layer The modulation layer is disposed on the photosensitive path of the image sensor, and the structural units of the first light modulation layer and the second light modulation layer correspond to physical pixels of the image sensor.

In the spectrum chip as described above, further comprising: a light-transmitting layer located between the image sensor and the second light modulation layer, the light-transmitting layer being formed on the surface of the image sensor and has a flat upper surface.

In the spectrum chip as described above, it further includes: a connection layer located between the first light modulation layer and the second light modulation layer and used to connect the first light modulation layer and the second light modulation layer. The second light modulation layer.

The spectrum chip as described above further includes: a protective layer located on the upper surface of the first light modulation layer for protecting the first light modulation layer.

In the spectrum chip as described above, the micro-nano structure of the structural unit of the first light modulation layer and the second light modulation layer is a modulation hole, and the modulation hole is at least partially filled with a filling material.

In the spectrum chip as described above, the light-transmitting layer, the connecting layer and the protective layer are formed of a first material, and the first light modulation layer and the second light modulation layer are formed of a second material. , and the first refractive index of the first material is lower than the second refractive index of the second material.

In the spectrum chip as described above, the light modulation layer includes three or more light modulation layers as the light modulation layer as described above, and the three or more light modulation layers are disposed on the photosensitive path of the image sensor. on, and the structural units of the three or more light modulation layers correspond to physical pixels of the image sensor.

In the spectrum chip as described above, it includes: a non-modulation area and a modulation area arranged on the photosensitive path of the image sensor, the non-modulation area does not have the above structural unit, and the modulation area has the above The structural units or combinations thereof.

The light modulation layer of the spectrum chip and the spectrum chip including the same provided by the embodiments of the present application solve the sensitivity of the transmission spectrum of the spectrum chip to polarization by including structural units with sub-structural units having predetermined angles.

Description of drawings

Various other advantages and benefits of the present application will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings in the description are only for the purpose of illustrating preferred embodiments and are not considered to be limitations of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts. Also throughout the drawings, the same parts are designated by the same reference numerals.

Figure 1 illustrates a schematic diagram of a spectrum chip according to an embodiment of the present application.

FIG. 2 illustrates a schematic diagram of a first configuration example of a structural unit of a spectrum chip according to the first embodiment of the present application.

FIG. 3 illustrates a schematic diagram of a second configuration example of the structural unit of the spectrum chip according to the first embodiment of the present application.

FIG. 4 illustrates a schematic diagram of a third configuration example of the structural unit of the spectrum chip according to the first embodiment of the present application.

Figure 5 illustrates the structural unit and the physical image on the image sensor according to the first embodiment of the present application. Examples of correspondences between elements.

FIG. 6 illustrates a schematic diagram of a preferred configuration of structural units of a spectrum chip according to the first embodiment of the present application.

7A to 7C illustrate schematic diagrams of simulation verification of eliminating the influence of light polarization of the preferred configuration of the structural unit shown in FIG. 6 .

FIG. 8 illustrates a schematic diagram of a preferred configuration of the light modulation layer of the spectrum chip according to the first embodiment of the present application.

9A to 9C illustrate a schematic diagram of the cropping design of multiple structural units in the light modulation layer of the spectrum chip according to the second embodiment of the present application.

Figure 10 illustrates a schematic diagram of a structural unit obtained by the cutting design shown in Figures 9A to 9C.

FIG. 11 illustrates a schematic diagram of the optimized arrangement of micro-nano structures in the structural unit shown in FIG. 10 .

FIG. 12 illustrates a schematic diagram of a micro-nano structure unit including a micro-nano structure according to the second embodiment of the present application.

FIG. 13 illustrates a schematic diagram of a micro-nano structural unit including a plurality of micro-nano structures according to the second embodiment of the present application.

Figure 14 illustrates a schematic diagram of densely paving multiple micro-nano structural units based on lattice translation vectors according to the second embodiment of the present application.

Figure 15 illustrates a schematic diagram of a single micro-nano structural unit rotating to form a structural unit according to the second embodiment of the present application.

Figure 16 illustrates a schematic diagram of a single micro-nano structure rotating to form a structural unit according to the second embodiment of the present application.

FIG. 17 illustrates a schematic diagram of a structural unit composed of three micro-nano structural units with a lattice translation vector rotated by 60° according to the second embodiment of the present application.

FIG. 18 illustrates a schematic diagram of a structural unit composed of two micro-nano structural units with a lattice translation vector rotated by 90° according to the second embodiment of the present application.

19A to 19C respectively illustrate schematic diagrams of three-dimensional, four-dimensional and six-dimensional rotationally symmetric micro-nano structural units according to the second embodiment of the present application.

FIG. 20 illustrates a schematic diagram of a first example of a stacked structure of a spectrum chip according to an embodiment of the present application.

FIG. 21 illustrates a second example of a stacked structure of a spectrum chip according to an embodiment of the present application. intention.

Figure 22 illustrates a schematic diagram of the configuration of two light modulation layers of a spectrum chip according to an embodiment of the present application.

FIG. 23 illustrates a schematic diagram of a third example of a stacked structure of a spectrum chip according to an embodiment of the present application.

FIG. 24 illustrates a schematic diagram of a fourth example of a stacked structure of a spectrum chip according to an embodiment of the present application.

FIG. 25 illustrates a schematic diagram of a fifth example of a stacked structure of a spectrum chip according to an embodiment of the present application.

FIG. 26 illustrates a schematic diagram of a sixth example of a stacked structure of a spectrum chip according to an embodiment of the present application.

Detailed ways

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the example embodiments described here.

Application Overview

With the development of computer technology, a new type of spectrometer has emerged in recent years: computational reconstruction spectrometer, which approximates or even reconstructs the spectrum of incident light through calculation. Computationally reconstructed spectrometers can relatively better solve the problem of reduced detection performance due to miniaturization.

In computationally reconstructed spectroscopic devices (including spectrometers), the spectrum chip is the core component. Figure 1 illustrates a schematic diagram of a spectrum chip according to an embodiment of the present application. As shown in FIG. 1 , the spectrum chip 100 in the embodiment of the present application includes a light modulation layer 110 , an image sensor 120 and a data processing unit 130 . The light modulation layer 110 is located on the photosensitive path of the image sensor 120 and is used to perform broad spectrum modulation of incident light to obtain a modulated light signal. The image sensor 120 is configured to receive the modulated optical signal, and process the modulated optical signal to obtain original spectral information of the measured target. For example, the image sensor 120 may be a CMOS image sensor (CIS), CCD, array light detector, etc. In addition, the spectrum chip 100 also includes a data processing unit 130. The data processing unit 130 can be a processing unit such as an MCU, CPU, GPU, FPGA, NPU, ASIC, etc., which can process data generated by the image sensor.

The light modulation layer 110 usually includes a plurality of structural units arranged in a specific pattern, and the structural units are arranged in a certain period. Furthermore, each structural unit is composed of at least one micro-nano structure, and the micro-nano structure can be implemented as a structure such as a hole, a column, or a line.

Next, the working principle of the spectrum chip will be explained. That is, after the image sensor measures the spectral response, it is transmitted to the data processing unit for recovery calculation. The process is described in detail as follows:

The intensity signals of the incident light at different wavelengths λ are recorded as They are different from each other. Generally speaking, the light modulation layer can be recorded as Ti(λ)(i=1,2,3,...,m). There are corresponding physical pixels below each structural unit to detect the light intensity bi modulated by the light modulation layer. In the specific embodiment of the present application, one physical pixel is used, that is, one physical pixel corresponds to one structural unit, but it is not limited to this. In other embodiments, a group of multiple physical pixels may also correspond to one structural unit. . Therefore, in the computational spectrum device according to the embodiment of the present application, at least two structural units constitute a "spectral pixel" (it can be understood that multiple structural units and corresponding image sensors constitute a spectral pixel). It should be noted that the effective transmission spectrum of the light modulation layer (the transmission spectrum used for spectral recovery is called the effective transmission spectrum) number of Ti (λ) and the number of structural units may not be consistent. The transmission spectrum of the light filter structure According to the needs of identification or recovery, it is manually set, tested, or calculated according to certain rules (for example, the transmission spectrum of each structural unit mentioned above through testing is the effective transmission spectrum), so the effective transmission spectrum of the light modulation layer The number may be less than the number of structural units, or may even be greater than the number of structural units; in this variant embodiment, a certain transmission spectrum curve is not necessarily determined by one structural unit. Furthermore, the present invention can use at least one spectral pixel to restore the spectrum.

The relationship between the spectral distribution of incident light and the measured values of the image sensor can be expressed by the following formula:
bi＝∫x(λ)*Ti(λ)*R(λ)dλ

After further discretization, we get:
bi＝Σ(x(λ)*Ti(λ)*R(λ))

where R(λ) is the response of the image sensor, recorded as:
Ai(λ)=Ti(λ)*R(λ)

Then the above formula can be expanded into matrix form:

Among them, bi(i=1,2,3,…,m) is the response of the image sensor after the light to be measured passes through the light modulation layer, which corresponds to the measured light intensity of the image sensor corresponding to m structural units. When a physical When a pixel corresponds to a structural unit, it can be understood as the measured light intensity corresponding to m "physical pixels", which is a vector with a length of m. A (can be understood as the transmission spectrum curve) is the light response of the system to different wavelengths, which is determined by two factors: the transmittance of the light modulation layer and the quantum efficiency of the image sensor. A is a matrix, and each row vector corresponds to the response of a structural unit to incident light of different wavelengths. Here, the incident light is sampled discretely and uniformly, with a total of n sampling points. The number of columns of A is the same as the number of sampling points of the incident light. Here, x(λ) is the intensity of the incident light at different wavelengths λ, which is the spectrum of the incident light to be measured.

Based on the above implementation method, by arraying the spectral pixels, a snapshot-type spectral imaging device can be realized.

The micro-nano structure (photonic crystal structure or non-photonic crystal structure) on the spectrum chip controls the transmittance of the spectrum chip at different wavelengths of the external light source. In the process of calculating the transmittance of a photonic crystal structure at different wavelengths, due to the complexity of the light source, it is inevitably necessary to consider the polarization of the incident light.

First embodiment

Based on this, in order to prevent the polarization of incident light, in the spectrum chip according to the embodiment of the present application, the light modulation layer is designed. Specifically, the light modulation layer includes one or more structural units, and each structural unit includes n identical sub-structural units, for example, denoted as sub-structural units A ₁ , A ₂ , A ₃ , ..., A _{n -1} , A _n , wherein each substructural unit has at least one micro-nano structure. Here, the same sub-structural units means that the number, shape and structure of the micro-nano structures of the sub-structural units are consistent, and the positions of the micro-nano structures in the sub-structural units also correspond to each other, that is, the two are in After rotating at a predetermined angle, they can basically overlap. The micro-nano structures may be regularly arranged according to periodicity, or may be arranged irregularly. Furthermore, for n sub-structural units A ₁ , A ₂ , A ₃ , ..., A _n-1 , A _n , there is a rotation relationship of θ angle between sub-structural unit A _n and sub-structural unit A _n-1 (in this article In the application embodiment, the direction of rotation is not limited, it can be clockwise or counterclockwise), and the following relationship is satisfied:

where m and n are positive integers.

It should be noted that how the n sub-structural units are arranged within the structural unit will not affect the anti-polarization effect, that is, there is a rotation angle θ between every two sub-structural units in the n sub-structural units, and the rotation angle θ satisfy:

where m and n are positive integers.

That is, the embodiment of the present application provides a light modulation layer of a spectrum chip. The light modulation layer includes one or more structural units, each structural unit includes a plurality of sub-structural units, and the The number, shape, and structure of the micro-nano structures of each sub-structural unit are consistent for the multiple sub-structural units, and the positions of the micro-nano structures relative to the sub-structural units correspond to each other, and each structure There is a rotation angle θ between every two sub-structural units in the unit, which satisfies:

where m and n are positive integers.

FIG. 2 illustrates a schematic diagram of a first configuration example of a structural unit of a spectrum chip according to an embodiment of the present application. As shown in Figure 2, where n=4 and m=2.

Next, the anti-polarization principle of the structural unit of the spectrum chip according to the embodiment of the present application will be described.

When the structural unit has n sub-structural units A ₁ , A ₂ , A ₃ , ..., _An-1 , _An , it is assumed that the vertical incident light electric field intensity is E=E ₀ +E _θ , where E ₀ and E _θ are For the electric field intensity component, for substructural unit A ₁ , the transmittance for E ₀ and E _θ can be written as T(λ)=T ₀ +T _θ , where T _θ refers to the incident light transmittance under θ angle polarization.

Assuming that there is a θ angle counterclockwise rotation correspondence between sub-structural unit A _n and A _n-1 , then for sub-structural unit A _n , the transmittance satisfies T _n (λ)=T _(n-1)θ +T _nθ , Note that the θ in T _nθ here are all relative to the substructural unit A ₁ .

Then for multiple sub-structural units, the sum of the total transmittance is:
T _total =E ₀ ×[T ₀ (A ₁ )+(T _θ (A ₂ )+T _2θ (A ₃ )+…+T _(n-1)θ (A _n )]+E _θ ×
[T _θ (A ₁ )+T _2θ (A ₂ )+T _3θ (A ₃ )+…+T _nθ (A _n )]

If you want the result to be polarization independent, you need to satisfy

Since polarized light itself has symmetry, for any structure, the maximum repeatable rotation angle is 180°, which results in θ=180°/n, n is greater than or equal to 2, or θ=m×180°/n, n>m, m, n are positive integers.

Therefore, for n sub-structural units A ₁ , A ₂ , A ₃ , ..., A _n-1 , A _n , when there is a θ angle rotation correspondence between sub-structural unit A _n and sub-structural unit A _n-1 , θ=180°/n, or θ=m×180°/n, n>m, m, n is a positive integer. The influence of polarization on the transmission spectrum can be eliminated by adding the transmittance. Furthermore, for multiple sub-structural units A ₁ , A ₂ , A ₃ , ..., An _-1 , _An , they can also be randomly arranged and do not have to be arranged in order. That is to say, the essence of the spectrum chip according to the embodiment of the present application is that the transmission spectra corresponding to multiple sub-structural units of the structural unit are added together to achieve polarization independence. In some examples, the rotation angle is θ=180°/n, or θ=m×180°/n, which can be understood as an equivalent change. For example, the above-mentioned Figure 2 can be understood as a rotation angle θ = 180°/2, that is, Figure 2 illustrates two sub-structural units, and each sub-structural unit further includes two secondary sub-structural units; it can also be understood as a rotation The angle θ=2×180°/4, that is, it includes four sub-structural units.

It is worth noting that in the embodiment of the present application, multiple sub-structural units can be of multiple types, and as long as different types of sub-structural units comply with the above-mentioned rotation angle relationship, polarization-independent can be achieved, which is essentially the same as the above description. The principles of this application are consistent. That is to say, Figure 2 can also be understood as two types of secondary sub-structural units respectively forming sub-structural units, and then forming the final structural unit, so that polarization independence can be achieved.

Considering the difficulty of design and process, preferably, the rotation angle θ=180°/n, where n is greater than or equal to 2, that is, m=1. For example, as shown in Figure 3, if there are three sub-structural units, the rotation angle θ=60°, where each sub-structural unit includes multiple micro-nano structures. For another example, as shown in Figure 4, if there are three structural units, the rotation angle θ=60°, where each sub-structural unit includes at least two types of micro-nano structures, and the micro-nano structures may be irregularly arranged. Here, FIG. 3 illustrates a schematic diagram of a second configuration example of a structural unit of a spectrum chip according to an embodiment of the present application. Moreover, FIG. 4 illustrates a schematic diagram of a third configuration example of a structural unit of a spectrum chip according to an embodiment of the present application.

That is, in the light modulation layer of the spectrum chip according to the embodiment of the present application, m is equal to 1, and n is greater than or equal to 2.

Moreover, in the light modulation layer of the spectrum chip according to the embodiment of the present application, each sub-structural unit includes at least one micro-nano structure.

In addition, in the light modulation layer of the spectrum chip according to the embodiment of the present application, each sub-structural unit includes at least two micro-nano structures, and the micro-nano structures may be irregularly arranged.

It should be noted that, since each structural unit of the light modulation layer needs to correspond to the physical pixel of the image sensor, and is generally regularly arranged on the photosensitive path of the image sensor, in the embodiment of the present application, generally speaking, Each structural unit will be a rectangle. Generally speaking, the first sub-structural unit and the second sub-structural unit will be implemented as a rectangle or a square. FIG. 5 illustrates an example of the corresponding relationship between structural units and physical pixels on the image sensor according to an embodiment of the present application. As shown in Figure 5, taking one structural unit corresponding to four physical pixels (PD) as an example, it can be seen that each structural unit is composed of a first sub-structural unit and a second sub-structural unit. Among them, the micro-nano structure patterns of individual structural units are consistent, but their sizes or positions are different, and their corresponding transmission spectra are also different. It can be understood that the correlation of the transmission spectrum curve corresponding to each structural unit is relatively low.

However, in the embodiment of the present application, due to the rotation angle θ of the sub-structural units, the periodic regular arrangement may no longer be possible, as shown in Figures 2 and 3. However, those skilled in the art can understand that since the light modulation layer of the spectrum chip does not need to completely include a modulation part composed of structural units, it may also include a non-modulation part without structural units. Therefore, the spectrum chip according to the embodiment of the present application The configuration of structural units is feasible.

Figure 6 illustrates a schematic diagram of a preferred configuration of structural units of a spectrum chip according to an embodiment of the present application.

As shown in Figure 6, in this preferred configuration, each structural unit includes a first sub-structural unit and a second sub-structural unit, and the second sub-structural unit is formed by rotating the first sub-structural unit 90°, It can be understood that after the first sub-structural unit is obtained in the design, the first sub-structural unit is rotated 90° to obtain the second sub-structural unit, and then the first sub-structural unit and the second sub-structural unit are merged to obtain the structure. unit. It should be noted that the first sub-structural unit and the second sub-structural unit are composed of at least one micro-nano structure, and the micro-nano structure can be implemented as a modulated hole (through hole, blind hole or combination thereof), modulated hole columns and/or modulation lines, etc.

The principle of the above substructure unit configuration to eliminate polarization is as follows:

Assume that the incident light is: E=E _∥ +E _⊥ , where E _∥ is the incident light component with the polarization direction parallel to the X direction, and E _⊥ is the incident light component with the polarization direction perpendicular to the X direction, that is, parallel to the Y direction. Further assume that the transmittance of structure A is T(λ)=T _∥ (λ)+T _⊥ (λ), where T _∥ is the transmittance of incident light with the polarization direction parallel to the X direction, and T _⊥ is the polarization direction perpendicular to the X direction. Incident light transmittance.

Then, the transmitted light of the first sub-structural unit A is:

The structure of the second sub-structural unit B is rotated 90° relative to the first sub-structural unit A. The transmitted light of the second sub-structural unit B is:

Therefore, the sum of the structurally transmitted light of the first sub-structural unit A and the second sub-structural unit B is:

It can be seen that the results are independent of polarization.

Therefore, when the transmission spectra corresponding to a 90-degree rotation between the two sub-structural units are added, the obtained result has nothing to do with the polarization direction of the incident light, and the resulting transmission spectrum excludes the influence of the polarization of the incident light. That is, the structural unit composed of the corresponding two sub-structural units can eliminate the problem of incident light polarization.

That is, in the light modulation layer of the spectrum chip according to the embodiment of the present application, the structural unit includes a first sub-structural unit and a second sub-structural unit formed based on a 90-degree rotation of the first sub-structural unit.

7A to 7C illustrate schematic diagrams of simulation verification of eliminating the influence of light polarization of the preferred configuration of the structural unit shown in FIG. 6 . As shown in Figure 7A to Figure 7C, in the simulation verification, the polarization direction is changed from 0 to 90°, and 5 points are taken. Summarizing the five transmission spectra into the same graph, we obtain the transmission spectrum of the first sub-structural unit A under different polarization conditions, as shown in Figure 7A, and the transmission spectrum of the second sub-structural unit B under different polarization conditions, as shown in Figure 7B shown. After adding the transmission spectrum of the first sub-structural unit A and the transmission spectrum of the first sub-structural unit B, the different polarization angle transmission spectra of the new structural unit formed by the first sub-structural unit A and the second sub-structural unit B are obtained, such as As shown in Figure 7C. It can be seen that the design scheme of the structural unit according to the embodiment of the present application can significantly remove the influence caused by the polarization of the incident light.

Moreover, as mentioned above, the light modulation layer of the spectrum chip may include multiple structural units. FIG. 8 illustrates a schematic diagram of a preferred configuration of a light modulation layer of a spectrum chip according to an embodiment of the present application. As shown in Figure 8, the light modulation layer includes a plurality of structural units, and each structural unit includes two sub-structural units, namely a first sub-structural unit and a second sub-structural unit, where the first sub-structural unit is Rotate 90° to obtain the second sub-structural unit, and then combine the first sub-structural unit and the second sub-structural unit to obtain the structural unit. Moreover, in this example, the sub-structural unit is a square, and the structural unit may be a regular rectangle.

Second embodiment

Based on this, in order to prevent the polarization of incident light, in the spectrum chip according to the embodiment of the present application, the light modulation layer is designed. Specifically, the light modulation layer includes n identical structural units, for example, denoted as structural units A ₁ , A ₂ , A ₃ ,..., _An-1 , _An , where each structural unit has multiple Micro-nano structural units. Here, the same structural unit means that the arrangement of the micro-nano structural units of the structural unit is consistent, and the positions of the micro-nano structural units in the structural unit also correspond to each other, that is, the two are basically basically the same after rotating at a predetermined angle. Can overlap. Wherein, the consistent arrangement of the micro-nano structural units of the structural unit means that the number, shape and structure of the micro-nano structural units included in each structural unit are basically the same.

Moreover, in the spectrum chip according to the embodiment of the present application, the micro-nano structural units are arranged according to periodic rules, that is, the structural units are implemented as photonic crystals. Further, for n structural units A ₁ , A ₂ , A ₃ , ..., A _n-1 , A _n , each of the two structural units, such as the micro-nano structural unit of structural unit A _n and structural unit A _n-1 There is a rotation relationship of θ angle (in the embodiment of the present application, the direction of rotation is not limited, it can be clockwise or counterclockwise), and the following relationship is satisfied:

where m and n are positive integers.

That is, the embodiment of the present application provides a light modulation layer of a spectrum chip. The light modulation layer includes n structural units. Each structural unit has a plurality of micro-nano structural units. The micro-nano structural units follow periodic rules. Arranged so that the structural units are implemented as photonic crystals, and the number, shape, and structure of the micro-nano structural units of each structural unit are consistent for the n structural units, and the multiple micro-nano structures The positions of the units relative to the structural units correspond to each other, and there is a rotation angle θ between the multiple micro-nano structural units of every two structural units in the n structural units, satisfying:

where m and n are positive integers.

When there are n structural units A ₁ , A ₂ , A ₃ ,..., A _n-1 , A _n , it is assumed that the electric field intensity of the vertically incident light is E=E ₀ +E _θ , where E ₀ and E _θ are the electric field intensity Component, for structural unit A ₁ , the transmittance for E ₀ and E _θ can be written as T(λ)=T ₀ +T _θ , where T _θ refers to the incident light transmittance under θ angle polarization.

Assuming that there is a θ angle counterclockwise rotation correspondence between structural unit A _n and A _n-1 , then for structural unit A _n , the transmittance satisfies T _n (λ)=T _(n-1)θ +T _nθ , note that, Here, the θ in T _nθ are relative to the structural unit A ₁ .

Then for multiple structural units, the sum of the total transmittance is:
T _total =E ₀ ×[T ₀ (A ₁ )+(T _θ (A ₂ )+T _2θ (A ₃ )+…+T _(n-1)θ (A _n )]+E _θ ×
[T _θ (A ₁ )+T _2θ (A ₂ )+T _3θ (A ₃ )+…+T _nθ (A _n )]

If you want the result to be polarization independent, you need to satisfy

Therefore, for n structural units A ₁ , A ₂ , A ₃ , ..., A _n-1 , A _n , when there is a θ angle rotation correspondence between the micro-nano structural units between the structural unit A _n and the structural unit A _n-1 When the relationship is θ=180°/n, or θ=m×180°/n, n>m, m, n is a positive integer, the influence of polarization on the transmission spectrum can be eliminated by adding the transmittance. Furthermore, for multiple structural units A ₁ , A ₂ , A ₃ , ..., An _-1 , _An , they can also be randomly arranged and do not have to be arranged in order. That is to say, the essence of the spectrum chip according to the embodiment of the present application is that the transmission spectra corresponding to the structural units are added together to achieve polarization independence. In some examples, the rotation angle is θ=180°/n, or θ=m×180°/n, which can be understood as an equivalent change.

In the embodiment of the present application, the rotation angle θ between the multiple micro-nano structural units of each two structural units among the n structural units can be the multiple micro-nano structures of the two structural units. The unit as a whole has a rotation angle θ, or each micro-nano structural unit in the plurality of micro-nano structural units of the two structural units has a rotation angle θ.

That is, in the light modulation layer of the spectrum chip according to the embodiment of the present application, the rotation angle θ between the multiple micro-nano structural units of each two structural units among the n structural units includes: the two The plurality of micro-nano structural units of the structural unit have a rotation angle θ as a whole.

Moreover, in the light modulation layer of the spectrum chip according to the embodiment of the present application, the rotation angle θ between the multiple micro-nano structural units of each two structural units in the n structural units includes: the two structures There is a rotation angle θ between each of the plurality of micro-nano structural units of the unit.

Here, the case where the plurality of micro-nano structural units of the two structural units as a whole has a rotation angle θ will be described first.

In the embodiment of the present application, the n structural units as a whole have polarization-independent capabilities. However, considering that the structural units need to be matched with the image sensor to form a spectrum chip, a more regular shape is generally required, such as a rectangle, a square, a hexagon, etc. A structure that can be densely paved. Therefore, as shown in Figures 9A to 9C, in this embodiment of the present application, it can be considered that a selection box is set for the micro-nano structural units of n structural units with an overall rotation relationship, and the selection box can be implemented as any Shapes, such as squares, rectangles, triangles, polygons and other arbitrary shapes, cut the corresponding n structural units through the selection box (shown as a dotted line in the figure) to obtain structural units A ₁ , A ₂ , A ₃ ,…, An _-1 , _An , in this way, the structural units _A1 , _A2 , _A3 ,..., _An-1 , _An can be polarization independent as a whole. 9A to 9C illustrate a schematic diagram of the cropping design of multiple structural units in the light modulation layer of the spectrum chip according to the second embodiment of the present application, that is, the three structural units are rotated by 60° in sequence, and then use selection boxes to respectively By cutting out new structural units A ₁ , A ₂ and A ₃ , the structural units A ₁ , A ₂ and A ₃ as a whole can be polarization independent.

Further, FIG. 10 illustrates a schematic diagram of a structural unit obtained through the cutting design shown in FIGS. 9A to 9C . As shown in Figure 10, there are three structural units, and the number, shape, and structure of the micro-nano structural units in the three structural units are the same, and they are obtained by rotating 60° in sequence. Wherein, the micro-nano structural units of the three structural units are all arranged periodically.

Moreover, as shown in Figure 10, when rotating the multiple micro-nano structural units included in the structural unit, there may be incomplete micro-nano structures at the edges of the structural units. In this case, the area of the unit may be less than or equal to 50% of the micro-nano structures are removed. Optionally, the micro-nano structures with an area greater than or equal to 50% are supplemented and improved or not processed, as shown in Figure 11. FIG. 11 illustrates a schematic diagram of the optimized arrangement of micro-nano structures in the structural unit shown in FIG. 10 .

That is, in the light modulation layer of the spectrum chip according to the embodiment of the present application, for the incomplete structure at the edge of each structural unit, the micro-nano structure with an area of less than or equal to 50% is removed, and/or, Micro-nano structures with an area greater than or equal to 50% are supplemented or left alone. Due to the correction of the incomplete structure, the corresponding sub-structural units are different, but it can be regarded that the corresponding sub-structural units still have a rotation angle θ relationship between the sub-structural units.

In the embodiment of the present application, since the incomplete structure at the edge of each structural unit needs to be removed or supplemented, this causes the number of micro-nano structures included in each structural unit to change, and the number of micro-nano structures at the edge changes. The structure and shape of micro-nano structures also change. However, in this application In the embodiment, except for the above changes caused by the removal or supplementation of incomplete structures at the edges, the number, shape and structure of the micro-nano structural units included in the structural units should be exactly the same. Therefore, in this case, even if the incomplete structure at the edge is removed or supplemented, it is considered that the arrangement of the micro-nano structural units of the structural unit is consistent.

Further, in the embodiment of the present application, for the n structural units, each structural unit has the same outline, and the structural unit includes a plurality of micro-nano structural units, and the micro-nano structural units are arranged in a certain period. . Among them, each micro-nano structural unit has a corresponding lattice translation vector, and the lattice translation vector includes a linearly independent vector in space. That is, starting from a set of points, the entire micro-nano structure can be generated through the lattice translation vector. unit, that is, the micro-nano structural units are densely packed along the lattice translation vector to form the structural unit. Furthermore, there is a θ angle rotation relationship between the lattice translation vectors of the micro-nano structural units of different structural units (the present invention The direction of rotation is not limited, it can be clockwise or counterclockwise), where θ=m*180°/n, n>m, m, n are positive integers. Among them, the micro-nano structural unit can be implemented as a micro-nano structure. As shown in Figure 5, a micro-nano structure constitutes a micro-nano structural unit. The corresponding arrow represents the vector direction, and the rectangular frame can be understood as a crystal lattice. In addition, the micro-nano structural unit can also be multiple identical micro-nano structures, or multiple different types of micro-nano structures, as shown in Figure 6. The corresponding arrows represent vector directions, and the square frame can be understood as a crystal lattice.

Here, FIG. 12 illustrates a schematic diagram of a micro-nano structural unit including one micro-nano structure according to the second embodiment of the present application. Moreover, FIG. 13 illustrates a schematic diagram of a micro-nano structural unit including a plurality of micro-nano structures according to the second embodiment of the present application.

That is, in the light modulation layer of the spectrum chip according to the embodiment of the present application, the micro-nano structural unit includes a micro-nano structure, the micro-nano structure constitutes a lattice, the lattice has a lattice translation vector, in In the structural unit, the plurality of micro-nano structural units are densely packed according to the lattice translation vector.

In addition, in the light modulation layer of the spectrum chip according to the embodiment of the present application, the micro-nano structural unit includes a plurality of micro-nano structures, the multiple micro-nano structures constitute a lattice, and the lattice has a lattice translation vector , in the structural unit, the plurality of micro-nano structural units are densely paved according to the lattice translation vector.

Furthermore, in the light modulation layer of the above spectrum chip, the plurality of micro-nano structures include the same type of micro-nano structures and/or different types of micro-nano structures.

Here, what needs to be understood is that if the outline of each structural unit is the same, the micro-nano structural units are densely packed according to the lattice translation vector. There may be edges of the structural units that make individual micro-nano structures incomplete in the structural units. This The micro-nano structures with an area of less than or equal to 50% can be removed, and the micro-nano structures with an area of greater than or equal to 50% can optionally be supplemented or left untreated.

Figure 14 illustrates a schematic diagram of densely paving multiple micro-nano structural units based on lattice translation vectors according to the second embodiment of the present application. As shown in Figure 14, for the micro-nano structural unit shown in Figure 12, the second structural unit is rotated 60° relative to the lattice translation vector of the micro-nano structural unit corresponding to the first structural unit, and the third structural unit is rotated relative to the second The lattice translation vector of the micro-nano structural unit corresponding to the structural unit is rotated by 60°. Wherein, the micro-nano structural units are arranged along the lattice translation vector, and the dense paving corresponds to the entire structural unit.

In addition, as mentioned above, in the embodiment of the present application, each micro-nano structural unit in the plurality of micro-nano structural units of the two structural units may have a rotation angle θ between them.

For example, for the micro-nano structural unit shown in Figure 13, the lattice composed of multiple micro-nano structural units has multi-dimensional rotational symmetry (when the structural unit is understood as a photonic crystal, it can be considered that the lattice of the micro-nano structural unit has multi-dimensional rotation. symmetry), such as four-dimensional rotational symmetry. That is to say, the crystal lattice of a micro-nano structural unit composed of multiple micro-nano structures is square and has four-dimensional rotational symmetry. At this time, if the structural unit is composed of multiple micro-nano structural units, the crystal lattice of a single micro-nano structural unit can be The grid translation vector can be rotated 90°, as shown in Figure 15. Figure 15 illustrates a schematic diagram of a single micro-nano structural unit rotating to form a structural unit according to the second embodiment of the present application.

Moreover, as shown in Figure 16, if a micro-nano structural unit is composed of a single micro-nano structure, the lattice translation vector of the micro-nano structural unit is rotated by 90°, that is, the single micro-nano junction is rotated by 90°. For example, Multiple micro-nano structures arranged regularly in a periodic manner constitute the structural unit. Figure 16 illustrates a schematic diagram of a single micro-nano structure rotating to form a structural unit according to the second embodiment of the present application.

In addition, if the lattice of the micro-nano structural unit has six-dimensional rotational symmetry, it can be implemented as three micro-nano structural units constituting the structural unit, in which the lattice translation vector is rotated by 60°. If the structural unit is composed of two micro-nano structural units, the lattice translation vector is rotated 90°, as shown in Figures 17 and 18. FIG. 17 illustrates a schematic diagram of a structural unit composed of three micro-nano structural units with a lattice translation vector rotated by 60° according to the second embodiment of the present application. FIG. 18 illustrates a schematic diagram of a structural unit composed of two micro-nano structural units with a lattice translation vector rotated by 90° according to the second embodiment of the present application.

That is, when the micro-nano structural units and their corresponding crystal lattices are arranged in at least three-dimensional rotational symmetry, the structural units composed of multiple micro-nano structural units are polarization independent. Figure 19A to Figure 19C respectively The figure shows a schematic diagram of three-dimensional, four-dimensional and six-dimensional rotationally symmetric micro-nano structural units according to the second embodiment of the present application.

Example Spectral Chip

The spectrum chip according to the embodiment of the present application may include the light modulation layer and the image sensor according to the embodiment of the present application as described above, wherein the light modulation layer is disposed on the photosensitive path of the image sensor. Here, the structural unit of the light modulation layer may have the configuration of the structural unit of the light modulation layer according to the embodiment of the present application as described above, which will not be described again here.

That is, the spectrum chip according to the embodiment of the present application includes the light modulation layer of the spectrum chip as described above, and an image sensor. The light modulation layer is disposed on the photosensitive path of the image sensor, and the structural unit is connected to the light sensing path of the image sensor. corresponds to the physical pixels of the image sensor. Moreover, in the following examples, a structural unit composed of two sub-structural units is taken as an example, but this does not limit the application. The structural unit of the light modulation layer of the spectrum chip according to the embodiment of the present application may include multiple sub-structural units, and , the structural unit conforms to the above design, and can achieve polarization independence.

FIG. 20 illustrates a schematic diagram of a first example of a stacked structure of a spectrum chip according to an embodiment of the present application. As shown in Figure 20, the spectrum chip 200 according to the embodiment of the present application includes a light modulation layer 210 and an image sensor 220. The light modulation layer 210 is disposed on the photosensitive path of the image sensor 220. The light modulation layer 210 It includes at least one structural unit, and the structural unit includes n sub-structural units. Each of the sub-structural units includes at least one micro-nano structure. The micro-nano structure can be a modulation hole, a modulation column or a modulation line. Taking the modulation hole as an example, it can be a round hole, a square hole, or a triangular hole. , polygonal holes or irregular holes (similar to modulation columns).

The spectrum chip may further include a light-transmitting layer 230 located between the light modulation layer 210 and the image sensor 220. The light-transmitting layer 230 is formed on the surface of the image sensor 220, and Having a flat upper surface, the light modulation layer 210 is formed on the flat upper surface of the light-transmitting layer 230 . The flat upper surface of the light-transmitting layer 230 is beneficial to the processing of the light modulation layer 210 to a certain extent.

That is, the spectrum chip according to the embodiment of the present application further includes a light-transmitting layer located between the light modulation layer and the image sensor, and the light-transmitting layer is formed on the surface of the image sensor and Has a flat upper surface.

FIG. 21 illustrates a schematic diagram of a second example of a stacked structure of a spectrum chip according to an embodiment of the present application.

As shown in FIG. 21 , the spectrum chip according to the embodiment of the present application may also include a protective layer 240 in addition to the light modulation layer 210 , the image sensor 220 and the light-transmitting layer 230 . The protective layer 240 is located on the upper surface of the light modulation layer 210 to protect the light modulation layer 210 . Moreover, when the micro-nano structure of the structural unit of the light modulation layer 210 is implemented as a modulation hole, the modulation hole may be at least partially filled with a filling material.

That is, the spectrum chip according to the embodiment of the present application further includes a protective layer located on the upper surface of the light modulation layer for protecting the light modulation layer.

Moreover, in the spectrum chip according to the embodiment of the present application, the micro-nano structure of the structural unit of the light modulation layer is a modulation hole, and the modulation hole is at least partially filled with a filling material.

Figure 22 illustrates a schematic diagram of the configuration of two light modulation layers of a spectrum chip according to an embodiment of the present application. As shown in Figure 22, a spectrum chip according to an embodiment of the present application includes multiple light modulation layers, such as two light modulation layers, located on the photosensitive path of the image sensor. Specifically, the spectrum chip 300 includes a first light modulation layer 310 and a second light modulation layer 320. The first light modulation layer 310 and the second light modulation layer 320 are sequentially formed on the photosensitive surface of the image sensor 330. On the path, the incident light passes through the first light modulation layer 310 and the second light modulation layer 320 in sequence and is modulated before reaching the image sensor 330 .

At this time, it should be noted that the structural unit can be understood as the corresponding areas of the first light modulation layer 310 and the second light modulation layer 320 jointly form a structural unit. For example, four physical pixels correspond to one structural unit. For example, four physical pixels correspond to one structural unit. The modulation areas of the first light modulation layer 310 and the second light modulation layer 320 corresponding to the pixels constitute a structural unit, that is, the incident light passes through the modulation area of the first light modulation layer 310 and enters the modulation area of the second light modulation layer 320, After being modulated to reach the corresponding four physical pixels, the corresponding modulation area of the first light modulation layer 310 and the second light modulation layer 320 can be defined as a structural unit. Multiple light modulation layers will work together to affect the transmission spectrum of the corresponding structural unit, so the design of the multi-layer light modulation layer makes the transmission spectrum richer. At the same time, the process difficulty can be reduced to a certain extent, especially the depth requirements for the modulation holes will be reduced, making the etching or nanoimprinting effect better.

And, as mentioned above, taking the structural unit of the light modulation layer as an example including a first sub-structural unit and a second sub-structural unit, the second sub-structural unit is rotated 90 degrees based on the first sub-structural unit. degree formed. It should be noted that the structural unit is composed of a first light modulation layer and a second light modulation layer, so both the first sub-structural unit and the second sub-structural unit are composed of a first light modulation layer and a second light modulation layer. The light modulation layer is composed together. That is, each light modulation layer of the first sub-structural unit needs to be rotated 90° to obtain the second sub-structural unit. It can be the first sub-structural unit and the second sub-structural unit are in a 90° relationship with each other; it may also refer to a 90° relationship between the micro-nano structure of the first sub-structural unit and the micro-nano structure unit of the second sub-structural unit.

That is, in the spectrum chip according to the embodiment of the present application, the light modulation layer includes a first light modulation layer and a second light modulation layer as the light modulation layer of the spectrum chip as described above, and the first light modulation layer The first light modulation layer and the second light modulation layer are disposed on the photosensitive path of the image sensor, and the structural units of the first light modulation layer and the second light modulation layer are in phase with the physical pixels of the image sensor. correspond.

Further, the same as the above example, the spectrum chip may further include a light-transmitting layer 340, the light-transmitting layer 340 is located between the image sensor 330 and the second light modulation layer 320, the light-transmitting layer 340 forms On the surface of the image sensor 330 and having a flat upper surface, the second light modulation layer 320 is formed on the flat upper surface of the light-transmitting layer 340 . The flat upper surface of the light-transmitting layer 340 is beneficial to the processing of the second light modulation layer 320 to a certain extent.

The spectrum chip may further include a connection layer 350 located between the first light modulation layer 310 and the second light modulation layer 320 for connecting the first light modulation layer 310 and the second light modulation layer 320 . As for the second light modulation layer 320, the connection layer 350 has a flat upper surface. Further, the spectrum chip includes a protective layer 360 located on the upper surface of the first light modulation layer 310 to protect the first light modulation layer 310 . Preferably, when the micro-nano structures corresponding to the first light modulation layer 310 and the second light modulation layer 320 are modulation holes, the modulation holes are filled, and the filling material can be a low refractive index material, so The low refractive index material can also be understood as a material with a refractive index lower than that of the light modulation layer, as shown in Figure 23. FIG. 23 illustrates a schematic diagram of a third example of a stacked structure of a spectrum chip according to an embodiment of the present application.

In addition, the spectrum chip according to the embodiment of the present application further includes a protective layer 360, which is located on the upper surface of the first light modulation layer and used to protect the first light modulation layer.

In addition, in the spectrum chip according to the embodiment of the present application, the micro-nano structure of the structural unit of the first light modulation layer and the second light modulation layer is a modulation hole, and the modulation hole is at least partially filled. Material filling.

Further, the light-transmitting layer 340 , the connection layer 350 and the protective layer 360 may be made of the same material, and the refractive index of the corresponding material is lower than that of the first light modulation layer 310 and the second light modulation layer 320 refractive index.

That is, in the spectrum chip according to the embodiment of the present application, the light-transmitting layer 340, the connection layer 350 and the protective layer 360 are formed of the first material, the first light modulation layer 310 and the The second light modulation layer 320 is formed of a second material, and the first refractive index of the first material is lower than the second refractive index of the second material.

In yet another example, the spectrum chip 400 may include more light modulation layers, for example, three light modulation layers, that is, a first light modulation layer 410, a second light modulation layer 420, and a third light modulation layer 430. , as shown in Figure 24. In addition, the spectrum chip 500 may also include four light modulation layers, that is, a first light modulation layer 510, a second light modulation layer 520, a third light modulation layer 530 and a fourth light modulation layer 540, as shown in Figure 25 Show. The composition and design principle of its structural unit are similar to the above-mentioned example containing two light modulation layers. The second sub-structural unit is obtained by rotating the first sub-structural unit 90°, and then the first sub-structural unit and the second sub-structural unit form a Structural units. FIG. 24 illustrates a schematic diagram of a fourth example of a stacked structure of a spectrum chip according to an embodiment of the present application. Figure 25 illustrates a schematic diagram of a fifth example of a stacked structure of a spectrum chip according to an embodiment of the present application.

That is, in the spectrum chip according to the embodiment of the present application, the light modulation layer includes more than three light modulation layers as the light modulation layer of the spectrum chip as described above, and the three or more light modulation layers are provided On the photosensitive path of the image sensor, and the structural units of the three or more light modulation layers correspond to the physical pixels of the image sensor, that is, the incident light passes through the structural units of each light modulation layer in sequence Then, it is modulated and received by the corresponding physical pixel. It should be noted that the structural unit corresponding to the spectrum chip can be composed of two sub-structural units, or can be composed of multiple sub-structural units. Its structural design complies with the description of the above embodiments, which can achieve polarization independence.

In another example, the spectrum chip 600 can include a non-modulation area 601 and a modulation area 602. The non-modulation area is not provided with structural units, and the modulation area can be provided with the same structural units as above or a combination thereof, such as As shown in Figure 26. FIG. 26 illustrates a schematic diagram illustrating a sixth example of a stacked structure of a spectrum chip according to an embodiment of the present application. Here, the configuration of each layer in Fig. 24, Fig. 25 and Fig. 26 is the same as that of Fig. 23 as described above, and will not be described again here.

That is, the spectrum chip according to the embodiment of the present application includes a non-modulation area and a modulation area arranged on the photosensitive path of the image sensor. The non-modulation area does not have the structural unit as described above, and the modulation area has Structural units as described above or combinations thereof.

It is worth noting that in the embodiment of the present application, the spectrum chip generally includes multiple structural units, and each structural unit is distributed on the photosensitive path of the image sensor. Moreover, in the embodiment of the present application, each structural unit includes multiple sub-structural units, and there is a predetermined angle θ between each sub-structural unit. That is, the sub-structural unit should be able to connect with another sub-structure after being rotated by the predetermined angle θ. unit phase overlapping. Preferably, in the embodiment of the present application, the sub-structural unit is rotated 90°. Moreover, in the multi-layer light modulation layer embodiment, the sub-structural unit is rotated by a predetermined angle θ in each light modulation layer. It can also be a predetermined angle θ between the micro-nano structural units of the sub-structural units.

The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, advantages, effects, etc. mentioned in this application are only examples and not limitations. These advantages, advantages, effects, etc. cannot be considered to be Each embodiment of this application must have. In addition, the specific details disclosed above are only for the purpose of illustration and to facilitate understanding, and are not limiting. The above details do not limit the application to be implemented using the above specific details.

The block diagrams of the devices, devices, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, devices, equipment, and systems may be connected, arranged, and configured in any manner. Words such as "includes," "includes," "having," etc. are open-ended terms that mean "including, but not limited to," and may be used interchangeably therewith. As used herein, the words "or" and "and" refer to the words "and/or" and are used interchangeably therewith unless the context clearly dictates otherwise. As used herein, the word "such as" refers to the phrase "such as, but not limited to," and may be used interchangeably therewith.

It should also be pointed out that in the device, equipment and method of the present application, each component or each step can be decomposed and/or recombined. These decompositions and/or recombinations shall be considered equivalent versions of this application.

The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, this application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for the purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the form disclosed herein. Although various example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

A light modulation layer of a spectrum chip, characterized by including:

One or more structural units, each structural unit includes n sub-structural units, and the number, shape, and structure of the micro-nano structures of each sub-structural unit in each structural unit are consistent with the plurality of sub-structural units. , and the positions of the micro-nano structures relative to the sub-structural units correspond to each other, and there is a rotation angle θ between every two sub-structural units in the n sub-structural units within each structural unit, satisfying:

where m and n are positive integers.
The light modulation layer of the spectrum chip according to claim 1, wherein m is equal to 1 and n is greater than or equal to 2.
The light modulation layer of the spectrum chip according to claim 1, wherein each sub-structural unit includes at least one micro-nano structure.
The light modulation layer of the spectrum chip according to claim 1, wherein each sub-structural unit includes at least two micro-nano structures, and the micro-nano structures are irregularly arranged.
The light modulation layer of the spectrum chip according to claim 1, wherein the structural unit includes a first sub-structural unit and a second sub-structural unit, and the second sub-structural unit is based on the first sub-structural unit 90 degree rotation.
A light modulation layer of a spectrum chip, characterized by including:

n structural units, each structural unit has a plurality of micro-nano structural units, the micro-nano structural units are arranged according to periodic rules so that the structural units are implemented as photonic crystals, and each of the structural units has micro-nano structural units. The arrangement of the nanostructural units is consistent for the n structural units, and the positions of the plurality of micro-nano structural units relative to the structural units correspond to each other, and every two structural units in the n structural units There is a rotation angle θ between the multiple micro-nano structural units, which satisfies:

where m and n are positive integers.
The light modulation layer of the spectrum chip according to claim 6, wherein the rotation angle θ between the multiple micro-nano structural units of every two structural units in the n structural units includes:

The plurality of micro-nano structural units of the two structural units have a rotation angle θ as a whole.
The light modulation layer of the spectrum chip according to claim 7, wherein, for the incomplete structure at the edge of each structural unit, the micro-nano structural units with an area of less than or equal to 50% are removed, and/or the area is More than or equal to 50% of the micro-nano structural units are supplemented or not processed.
The light modulation layer of the spectrum chip according to claim 7, wherein the micro-nano structural unit includes a micro-nano structure, the micro-nano structure constitutes a lattice, the lattice has a lattice translation vector, and in the In the structural unit, the plurality of micro-nano structural units are densely packed according to the lattice translation vector.
The light modulation layer of the spectrum chip according to claim 7, wherein the micro-nano structural unit includes a plurality of micro-nano structures, the plurality of micro-nano structures constitute a lattice, and the lattice has a lattice translation vector, In the structural unit, the plurality of micro-nano structural units are densely packed according to the lattice translation vector.
The light modulation layer of a spectrum chip according to claim 10, wherein the plurality of micro-nano structures include the same type of micro-nano structures and/or different types of micro-nano structures.
The light modulation layer of the spectrum chip according to claim 6, wherein the rotation angle θ between the plurality of micro-nano structural units of each two structural units in the n structural units includes: the two structural units There is a rotation angle θ between each of the plurality of micro-nano structural units.
The light modulation layer of the spectrum chip according to claim 12, wherein the micro-nano structure unit includes one or more micro-nano structures.
The light modulation layer of the spectrum chip according to claim 6, wherein the micro-nano structural unit includes a plurality of micro-nano structures, and the micro-nano structural unit is at least three-dimensional rotationally symmetrical.
The light modulation layer of the spectrum chip according to claim 14, wherein the plurality of micro-nano structures in the micro-nano structure unit are rotated by 60° or 90° to each other.
A spectrum chip is characterized by including:

The light modulation layer according to any one of claims 1 to 15; and,

Image sensor, the light modulation layer is disposed on the photosensitive path of the image sensor, and the structural unit corresponds to the physical pixel of the image sensor.
The spectrum chip according to claim 16, further comprising:

A light-transmitting layer is located between the light modulation layer and the image sensor. The light-transmitting layer is formed on the surface of the image sensor and has a flat upper surface.
The spectrum chip according to claim 16, further comprising: a protective layer located on the upper surface of the light modulation layer for protecting the light modulation layer.
The spectrum chip according to claim 16, wherein the micro-nano structure of the structural unit of the light modulation layer is a modulation hole, and the modulation hole is at least partially filled with a filling material.
The spectrum chip according to claim 16, wherein the light modulation layer includes a first light modulation layer and a second light modulation layer as the light modulation layer according to any one of claims 1 to 15, said The first light modulation layer and the second light modulation layer are disposed on the photosensitive path of the image sensor, and the structural units of the first light modulation layer and the second light modulation layer are in contact with the image sensor. corresponding to the physical pixels.
The spectrum chip according to claim 20, further comprising: a light-transmitting layer located between the image sensor and the second light modulation layer, the light-transmitting layer being formed on the image sensor. surface and has a flat upper surface.
The spectrum chip according to claim 20, further comprising: a connection layer located between the first light modulation layer and the second light modulation layer for connecting the first light modulation layer and the second light modulation layer. the second light modulation layer.
The spectrum chip according to claim 20, further comprising: a protective layer located on the upper surface of the first light modulation layer for protecting the first light modulation layer.
The spectrum chip according to claim 20, wherein the micro-nano structure of the structural unit of the first light modulation layer and the second light modulation layer is a modulation hole, and the modulation hole is at least partially filled with material filling.
The spectrum chip according to any one of claims 21 to 23, the light-transmitting layer, or the connecting layer, or the protective layer is formed of a first material, the first light modulation layer and the third The two light modulation layers are formed of a second material, and the first refractive index of the first material is lower than the second refractive index of the second material.
The spectrum chip according to claim 16, wherein the light modulation layer includes three or more light modulation layers as the light modulation layer according to any one of claims 1 to 15, the three or more light modulation layers The light modulation layer is disposed on the photosensitive path of the image sensor, and the structural units of the three or more light modulation layers correspond to physical pixels of the image sensor.
The spectrum chip according to claim 16, comprising: a non-modulation area and a modulation area arranged on the photosensitive path of the image sensor, the non-modulation area does not have the structure according to any one of claims 1 to 15. Structural unit, and the modulation region has the structural unit according to any one of claims 1 to 15 or a combination thereof.