WO2024031973A1

WO2024031973A1 - Floor plan generation method and apparatus, and electronic device and storage medium

Info

Publication number: WO2024031973A1
Application number: PCT/CN2023/079375
Authority: WO
Inventors: 李伟; 胡洋
Original assignee: 如你所视(北京)科技有限公司
Priority date: 2022-08-08
Filing date: 2023-03-02
Publication date: 2024-02-15
Also published as: CN115330939A

Abstract

Disclosed in the embodiments of the present disclosure are a floor plan generation method and apparatus, and an electronic device and a storage medium. The method comprises: acquiring an initial plane wireframe diagram and a target three-dimensional point cloud model under a first coordinate system of a target house; on the basis of the target three-dimensional point cloud model, correcting the initial plane wireframe diagram to obtain a corrected plane wireframe diagram corresponding to the target house; on the basis of the corrected plane wireframe diagram and the target three-dimensional point cloud model, determining height information respectively corresponding to each functional room of the target house; and on the basis of the corrected plane wireframe diagram and the height information respectively corresponding to each functional room, generating a three-dimensional floor plan corresponding to the target house. Therefore, the accuracy of a floor plan is effectively improved, and the technical problems in the prior art of an obtained floor plan not being accurate enough, etc., are solved.

Description

House plan generation method, device, electronic equipment and storage medium

This disclosure requires the priority of the Chinese patent application submitted to the China Patent Office on August 8, 2022, with the application number CN202210946520.6 and the invention name "House plan generation method, device, electronic equipment and storage medium", and its entire contents incorporated by reference into this disclosure.

Technical field

The present disclosure relates to computer technology, and in particular to a method, device, electronic device and storage medium for generating a house plan.

Background technique

Houses are one of the important places in people's daily lives, and floor plans are one of the essential information for people to understand the houses. Therefore, it is very important to construct accurate house floor plans. In the related art, the house plan is usually drawn manually through manual measurement, and the house plan obtained based on this is often not accurate enough.

Contents of the invention

Embodiments of the present disclosure provide a method, device, electronic device, and storage medium for generating a house plan to solve technical problems such as insufficient accuracy of house plans in the prior art.

One aspect of an embodiment of the present disclosure provides a method for generating a house plan, including:

Obtain the initial plane wireframe and the target three-dimensional point cloud model in the first coordinate system of the target house;

Based on the target three-dimensional point cloud model, modify the initial plane wireframe to obtain a modified plane wireframe corresponding to the target house;

Based on the modified plane wireframe and the target three-dimensional point cloud model, determine the height information corresponding to each function of the target house;

Based on the modified plan wireframe and the height information corresponding to each of the functions, a three-dimensional floor plan corresponding to the target house is generated.

Another aspect of the embodiment of the present disclosure provides a device for generating a house plan, including:

The first acquisition module is used to acquire the initial plane wireframe and the target three-dimensional point cloud model in the first coordinate system of the target house;

The first processing module is used to modify the initial planar wireframe based on the target three-dimensional point cloud model to obtain a corrected planar wireframe corresponding to the target house;

The second processing module is used to determine the height information corresponding to each function of the target house based on the modified plane wireframe and the target three-dimensional point cloud model;

The third processing module is configured to generate a three-dimensional floor plan corresponding to the target house based on the modified plan wireframe and the height information corresponding to each of the functions.

Another aspect of the embodiments of the present disclosure provides a computer-readable storage medium on which computer program instructions are stored. When the computer program instructions are executed by a processor, the method described in any of the above embodiments of the disclosure is implemented.

Another aspect of the embodiments of the present disclosure provides an electronic device, where the electronic device includes:

Memory for storing computer program products;

A processor, configured to execute a computer program product stored in the memory, and when the computer program product is executed, implement the method described in any of the above embodiments of the present disclosure.

The household plan generation method, device, electronic equipment and storage medium provided by this disclosure correct the initial plan wireframe of the house through the three-dimensional point cloud model of the house to obtain a more accurate corrected plan wireframe, and can based on the correction The plane wireframe and the three-dimensional point cloud model automatically determine the height information between each function, so that the three-dimensional house plan of the house can be generated based on the corrected plane wireframe and the height information between each function, effectively improving the accuracy of the house plan and solving the existing problem. There are technical problems such as the floor plans obtained through technology are not accurate enough.

The technical solution of the present disclosure will be described in further detail below through the accompanying drawings and examples.

Description of drawings

The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the disclosure and, together with the description, serve to explain principles of the disclosure.

The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting any creative effort:

Figure 1 is an exemplary application scenario of the house plan generation method provided by the present disclosure;

Figure 2 is a schematic flowchart of a method for generating a house plan provided by an exemplary embodiment of the present disclosure;

Figure 3 is a schematic flowchart of a method for generating a house plan provided by another exemplary embodiment of the present disclosure;

Figure 4 is a schematic diagram of a modified plan wireframe diagram of a target house provided by an exemplary embodiment of the present disclosure;

Figure 5 is a three-dimensional wireframe schematic diagram of a functional room of the target house provided by an exemplary embodiment of the present disclosure;

Figure 6 is a schematic flowchart of step 2032 provided by an exemplary embodiment of the present disclosure;

Figure 7 is a schematic diagram of the principle of determining inter-function height information provided by an exemplary embodiment of the present disclosure;

Figure 8 is a schematic diagram of projection results provided by an exemplary embodiment of the present disclosure;

Figure 9 is a schematic flowchart of step 2022 provided by an exemplary embodiment of the present disclosure;

Figure 10 is a schematic structural diagram of a house plan generation device provided by an exemplary embodiment of the present disclosure;

Figure 11 is a schematic structural diagram of a house plan generation device provided by another exemplary embodiment of the present disclosure;

Figure 12 is a schematic structural diagram of an application embodiment of the electronic device of the present disclosure.

Detailed ways

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these examples do not limit the scope of the disclosure unless otherwise specifically stated.

Those skilled in the art can understand that terms such as "first" and "second" in the embodiments of the present disclosure are only used to distinguish different steps, devices or modules, etc., and do not represent any specific technical meaning, nor do they represent the differences between them. necessary logical sequence.

It should also be understood that in the embodiments of the present disclosure, "plurality" may refer to two or more than two, and "at least one" may refer to one, two, or more than two.

It should also be understood that any component, data or structure mentioned in the embodiments of the present disclosure can generally be understood to mean one or more unless there is an explicit limitation or contrary inspiration is given in the context.

In addition, the term "and/or" in this disclosure is only an association relationship describing associated objects, indicating that there can be three relationships, for example, A and/or B, which can mean: A alone exists, and A and B exist simultaneously. , there are three situations of B alone. In addition, the character "/" in this disclosure generally indicates that the related objects are in an "or" relationship.

It should also be understood that the description of various embodiments in this disclosure focuses on the differences between the various embodiments, and the similarities or similarities between the embodiments can be referred to each other. For the sake of brevity, they will not be repeated one by one.

At the same time, it should be understood that, for convenience of description, the dimensions of various parts shown in the drawings are not drawn according to actual proportional relationships.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application or uses.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered a part of the specification.

It should be noted that similar reference numerals and letters refer to similar items in the following figures, so that once an item is defined in one figure, it does not need further discussion in subsequent figures.

Embodiments of the present disclosure may be applied to electronic devices such as terminal devices, computer systems, servers, etc., which may operate with numerous other general or special purpose computing system environments or configurations. Examples of well-known terminal devices, computing systems, environments and/or configurations suitable for use with terminal devices, computer systems, servers and other electronic devices include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients Computers, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, networked personal computers, small computer systems, mainframe computer systems and distributed cloud computing technology environments including any of the above systems, etc.

Electronic devices such as terminal devices, computer systems, servers, etc. may be described in the general context of computer system executable instructions (such as program modules) being executed by the computer system. Generally, program modules may include routines, programs, object programs, components, logic, data structures, etc., that perform specific tasks or implement specific abstract data types. The computer system/server may be implemented in a distributed cloud computing environment where tasks are performed by remote processing devices linked through a communications network. In a distributed cloud computing environment, program modules may be located on local or remote computing system storage media including storage devices.

In the process of realizing the present disclosure, the inventor found that the house floor plan is one of the indispensable information for people to understand the house. Therefore, it is very important to construct an accurate house floor plan. In the existing technology, house floor plans are usually obtained by manual drawing based on manual measurements, and the house floor plans obtained based on this are often not accurate enough.

Figure 1 is an exemplary application scenario of the house plan generation method provided by the present disclosure.

In the field of real estate, in order to allow users to better understand house types, it is necessary to generate corresponding three-dimensional house plans for the houses. The user plan generation device is used to execute the house plan generation method of the present disclosure, which can be based on the pre-obtained house (hereinafter referred to as the target house). )'s target three-dimensional point cloud model corrects the pre-obtained initial floor plan of the house (i.e., initial plan wireframe) to obtain a more accurate plan wireframe of the target house (i.e., corrected plan wireframe), and then based on the corrected plan line The block diagram and the target 3D point cloud model determine the height information corresponding to each function of the target house. Based on the modified plane wireframe diagram and the height information corresponding to each function, a three-dimensional house plan corresponding to the target house is generated, and the three-dimensional house plan of the house is realized. The automatic generation of the house plan effectively improves the accuracy of the house plan and solves technical problems such as the insufficient accuracy of the three-dimensional house plan obtained by the existing technology.

Figure 2 is a schematic flowchart of a method for generating a house plan provided by an exemplary embodiment of the present disclosure. The method includes the following steps:

Step 201: Obtain the initial plane wireframe and the target three-dimensional point cloud model in the first coordinate system of the target house.

Among them, the target house can be any house that needs to generate a three-dimensional floor plan, and the initial plan wireframe can be a polygonal wireframe of the target house obtained by any method. For example, the manually drawn polygonal wireframe is mapped to the first coordinate system as the target house. Initial plane wireframe in world coordinate system. The target three-dimensional point cloud model may be a three-dimensional point cloud model obtained based on mapping the original three-dimensional point cloud data collected by scanning to the first coordinate system. The first coordinate system can be the world coordinate system, or it can be set as a relative coordinate system that has a certain mapping relationship with the world coordinate system according to actual needs. The first coordinate system can be set according to actual needs, as long as the initial plane wireframe diagram can be aligned with the target three-dimensional point cloud model. Just be in the same coordinate system. For example, a first coordinate system is established with the preset position of the target house as the origin, and an initial planar wireframe diagram and a target three-dimensional point cloud model of the target house in this first coordinate system are obtained. There is no specific limit.

For example, since the initial plane wireframe does not have height information, the initial plane wireframe can be mapped to the XOY plane of the first coordinate system to facilitate subsequent processing. The details can be set according to actual needs.

In an optional example, step 201 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the first acquisition module run by the processor.

Step 202: Modify the initial plane wireframe based on the target three-dimensional point cloud model to obtain a corrected plane wireframe corresponding to the target house.

Among them, the correction to the initial plane wireframe can be by vertically projecting the target three-dimensional point cloud model onto the plane where the initial plane wireframe is located, and based on the distance between each projection point and each wall line of the initial plane wireframe, find the vicinity of each wall line The projection point is used to fit the projection line. When the fitting result matches the corresponding wall line in the initial plane wireframe, the projection line is used as the corrected wall line corresponding to the wall line, and a modified plane wireframe is obtained based on this. Optionally, the distance between each point and each wall line in the initial plane wireframe diagram can also be determined directly based on the X and Y coordinates of the points in the target three-dimensional point cloud model within the same height range as the initial plane wireframe diagram, and then determine the distance between each point and the wall line in the initial plane wireframe diagram. Points near the wall line are fitted to a line segment. When the fitted line segment matches the corresponding wall line, the line segment is used as the corrected wall line corresponding to the wall line. Based on this, the corrected wall line corresponding to each wall line is determined. Based on the corrected wall line, determine the corrected plane wireframe. The specific correction method can be set according to actual needs, and is not limited in this embodiment.

In an optional example, step 202 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by the first processing module run by the processor.

Step 203: Based on the modified plane wireframe and the target three-dimensional point cloud model, determine the height information corresponding to each function of the target house.

Among them, functional rooms refer to the various spaces divided into the target house, such as bedrooms, living rooms, dining rooms, bathrooms, etc. The height information between functions can include the height of the top of the function room and the height of the ground. The height information can be determined based on the rule that the number of points on the top and the ground of the function room is greater than the number of points in the middle part of the target three-dimensional point cloud model. The height information can also be determined based on The height between the top of the function room and the ground is determined by the rule that the point density in the middle area of the horizontal plane is greater than the part between the top and the ground. The height information can also be determined in other possible ways, and can be set according to actual needs. This embodiment does not limit it.

In an optional example, step 203 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by a second processing module run by the processor.

Step 204: Generate a three-dimensional floor plan corresponding to the target house based on the revised plan wireframe and the height information corresponding to each function.

Among them, the three-dimensional house plan corresponding to the target house is a house plan that represents the three-dimensional spatial structure of the target house. After obtaining the corrected plan wireframe and the height information corresponding to each function, the corrected plan wireframe can be translated and stretched in the height direction. Determine the three-dimensional wireframes corresponding to each function. Based on the three-dimensional wireframes corresponding to each function, determine the three-dimensional house plan corresponding to the target house.

Optionally, the obtained three-dimensional wireframes between the functions of the target house can be fused according to the adjacent relationship of the modified planar wireframe to obtain a three-dimensional floor plan of the target house.

Optionally, the results of the three-dimensional wireframe fusion between various functions can also be combined with other elements of the target house (such as doors, windows, etc.) to generate a three-dimensional floor plan of the target house. The details can be set according to actual needs. For information determination of other elements, any implementable method can be used, and this disclosure does not limit it.

In an optional example, step 204 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by a third processing module run by the processor.

The household plan generation method provided by the embodiment of the present disclosure corrects the initial planar wireframe of the house through the three-dimensional point cloud model of the house to obtain a more accurate corrected planar wireframe, and can automatically based on the corrected planar wireframe and the three-dimensional point cloud model Determine the height information between each function, so that a three-dimensional floor plan of the house can be generated based on the revised plan wireframe and the height information between each function, effectively improving the accuracy of the floor plan and solving the problem of inaccurate floor plans obtained by existing technologies. question.

Figure 3 is a schematic flowchart of a method for generating a house plan provided by another exemplary embodiment of the present disclosure.

In an optional example, the height information includes the top height and the ground height. Step 204 generates a three-dimensional floor plan corresponding to the target house based on the modified plan wireframe and the height information corresponding to each function, including:

Step 2041: For any functional room, based on the modified plane wireframe diagram, determine the first wireframe information at the top height and the second wireframe information at the ground height corresponding to the functional room.

Among them, the top height may refer to the coordinates of the top of the function room in the Z-axis direction under the first coordinate system, and the ground height may refer to So it refers to the coordinate of the Z-axis direction of the ground between functions in the first coordinate system. The first wireframe information at least includes wall line information and wall line endpoint information at the top height of the functional room. The wall line information can be straight line description information. For example, taking the top and floor of the functional room parallel to the XOY axis, the wall The line information can be the parameters k and b that describe the straight line y=kx+b. k represents the slope of the straight line, and b represents the intercept of the straight line. Since the wall line represented here is parallel to the XOY plane, the Z coordinate of the wall line is a fixed value. The specific wall line information can be determined according to the actual situation, and is not limited in this embodiment. The wall line endpoint information is the wall line endpoint coordinates. For example, the two endpoints are (x1, y1, z1) and (x2, y2, z2). Similarly, the second wireframe information includes the wall line between the function at the height of the ground. Information and wall line endpoint information, the details will not be repeated.

In an optional example, step 2041 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the first processing unit of the third processing module run by the processor.

Step 2042: Determine a three-dimensional house plan based on the first wireframe information and the second wireframe information corresponding to each function.

After determining the first wireframe information and the second wireframe information corresponding to each function, the wall line vertices in the first wireframe information between each function can be connected to the corresponding wall line vertices in the second wireframe information to form The wall line in the Z-axis direction can be used to obtain the three-dimensional wire frames corresponding to each function, and then the three-dimensional wire frames corresponding to each function can be fused to obtain the three-dimensional floor plan of the target house.

Exemplarily, FIG. 4 is a schematic diagram of a revised plan wireframe diagram of a target house provided by an exemplary embodiment of the present disclosure. The revised plan wireframe diagram includes corrected wall lines and wall line endpoints corresponding to each function. Figure 5 is a three-dimensional wireframe schematic diagram of a functional room of a target house provided by an exemplary embodiment of the present disclosure. In this example, the plane wireframe between the functions is a rectangle, and the obtained three-dimensional wireframe between the functions is a cube. In practical applications, since the three-dimensional wire frame between functions is obtained based on the translation and stretching of the plane wire frame between the functions along the direction of the plane where the vertical plane wire frame is located, therefore, the section of the three-dimensional wire frame between functions at any height is different from the The flat wireframe shape is the same. The details will not be described again.

In an optional example, step 2042 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by the second processing unit of the third processing module run by the processor.

In an optional example, step 203 determines the height information corresponding to each function of the target house based on the modified plane wireframe and the target three-dimensional point cloud model, including:

Step 2031: Based on the modified plane wireframe, the first point cloud data corresponding to each function is extracted from the target three-dimensional point cloud model.

Among them, the target three-dimensional point cloud model includes the point cloud data of each functional room in the target room in the first coordinate system. The point cloud data of the functional room includes the collected coordinates of the points on the wall, top, and ground of the functional room. The modified plan wireframe includes the partition information between each function. For example, the modified plan wireframe is represented by a two-level data structure. The first level is the identification between functions, such as the function ID, and the second level is the wall line information between functions. Wall line endpoint information, the specific representation method is not limited. Combining the correspondence between the functions of the target 3D point cloud model and the modified plane wireframe diagram, the point clouds corresponding to each function can be extracted from the target 3D point cloud model based on the X coordinates and Y coordinates of the functions of the modified plane wireframe diagram. The data is called the first point cloud data.

For example, taking the corrected plane wireframe diagram as being located on the XOY plane as an example, the ground of the target house represented by the target three-dimensional point cloud model is parallel to the XOY plane, or is set in the XOY plane corresponding to the modified plane wireframe diagram, then according to the modified plane wireframe diagram By translating the area formed by the X coordinate and Y coordinate between each function along the Z axis, it can be determined whether the X coordinate and Y coordinate of each point in the target 3D point cloud model belongs to the range between each function. Based on this, the target 3D point cloud can be obtained The first point cloud data corresponding to each function is extracted from the model. In practical applications, the corrected plane wireframe does not need to be set to the XOY plane of the first coordinate system. It can be any plane. The specific processing principle is similar to the above, based on the parallelism between the target three-dimensional point cloud model ground and the corrected plane wireframe. Based on the principle of consistency between the functions of the target 3D point cloud model and the functions of the modified plane wireframe, the first point cloud data corresponding to each function is extracted. The specific principles will not be described again.

In an optional example, step 2031 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the third processing unit of the second processing module run by the processor.

Step 2032: Based on the first point cloud data corresponding to each function, determine the top height and ground height corresponding to each function.

Since the first point cloud data of each functional room can include point data of the top, floor, and surrounding walls of the functional room, it can be determined based on the distribution characteristics of the points belonging to the top of the first point cloud data of the functional room. and ground points. Based on this, the top height and ground height can be determined. The top height may refer to the Z-axis coordinate corresponding to the top, and the ground height may refer to the Z-axis coordinate corresponding to the ground. The specific method of determining the top height and ground height can be set according to actual needs.

In an optional example, step 2032 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by the fourth processing unit of the second processing module run by the processor.

Figure 6 is a schematic flowchart of step 2032 provided by an exemplary embodiment of the present disclosure.

In an optional example, step 2032 determines the top height and ground height corresponding to each function based on the first point cloud data corresponding to each function, including:

Step 20321: For any function room, determine the number of points included in multiple height ranges based on the first point cloud data corresponding to the function room.

Among them, the number and specific range of height ranges can be set according to actual needs. For example, the height range can be every 1 centimeter as a height range, and the number of height ranges is determined based on the distribution height of the midpoint of the first point cloud data.

In an optional example, step 20321 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the fourth processing unit of the second processing module run by the processor.

Step 20322: Based on the number of points included in each height range, determine the corresponding top height and ground height between functions.

Since the top height range includes points across the top, the ground height range includes points across the entire ground. Other height ranges only include points on the wall. Based on the different number of point distributions at the top, bottom and middle height of the functional room, it can be determined that there are significantly more points in the two height ranges. Combined with the upper and lower relationship between the heights of the two ranges, It can be determined which height is the top and which height is the ground, thereby determining the top height and ground height of the functional room.

Exemplarily, FIG. 7 is a schematic diagram of the inter-function height information determination principle provided by an exemplary embodiment of the present disclosure. This example still takes the ground point of the target three-dimensional point cloud model as parallel to the XOY plane of the first coordinate system. The first point cloud data between functions is divided into n height ranges along the Z-axis direction, and the included values within each height range are calculated. The number of points, determine the two range heights with the largest number of points, as the top height and the ground height.

In an optional example, step 20322 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the fourth processing unit of the second processing module run by the processor.

In an optional example, step 202 corrects the initial plan wireframe based on the target three-dimensional point cloud model to obtain a corrected plan wireframe corresponding to the target house, including:

Step 2021: Vertically project the target three-dimensional point cloud model onto the plane where the initial planar wireframe is located, and obtain a projection result. The projection result includes the coordinates of each projection point projected onto the plane where the initial planar wireframe is located.

Among them, since the initial plane wireframe map is parallel to the ground of the target 3D point cloud model, the target 3D point cloud model can be vertically projected directly onto the plane where the initial plane wireframe map is located, and the projection result of the target 3D point cloud model can be obtained. , the projection points included in the projection results are the points where each point in the target three-dimensional point cloud model is vertically projected to the plane of the initial planar wireframe.

For example, when the initial plane wireframe is located on the XOY plane of the first coordinate system, the Z coordinate of each point in the target three-dimensional point cloud model can be set to 0, and the projection point corresponding to each point can be obtained.

Illustratively, FIG. 8 is a schematic diagram of projection results provided by an exemplary embodiment of the present disclosure.

In an optional example, step 2021 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by the fifth processing unit of the first processing module run by the processor.

Step 2022: Modify the initial planar wireframe according to the projection results to obtain a modified planar wireframe.

Since the target three-dimensional point cloud model includes the coordinates of points on the walls, tops and floors of each function room of the target house, after being projected onto the plane where the initial planar wireframe is located, the projection point density of the wall part is relatively large, so it can Based on the positional relationship between the projection point and each wall line in the initial plane wireframe diagram, the projection point belonging to the wall is determined, thereby fitting the projected wall line. The initial plane wireframe is corrected based on the projected wall lines to obtain the modified plane wireframe.

In an optional example, step 2022 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by the sixth processing unit of the first processing module run by the processor.

Figure 9 is a schematic flowchart of step 2022 provided by an exemplary embodiment of the present disclosure.

In an optional example, step 2022 corrects the initial planar wireframe according to the projection result to obtain a modified planar wireframe, including:

Step 20221: Based on the projection results, determine the distances between each projection point and each original wall line in the initial plane wireframe diagram.

Since the projection result includes the coordinates of each projection point projected onto the plane where the initial plane wireframe diagram is located, the initial plane wireframe diagram includes wall line information and wall line endpoint information of each original wall line. Therefore, based on the distance from the point to the straight line The calculation principle can determine the distance from each projection point to each original wall line in the initial plane wireframe diagram. The specific principle will not be described again.

In an optional example, step 20221 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the sixth processing unit of the first processing module run by the processor.

Step 20222: For any original wall line, based on the distance of each projection point to the original wall line, determine the target projection point whose distance from the original wall line is less than the first distance threshold.

There is a corresponding relationship between the functions of the target 3D point cloud model and the initial plane wireframe diagram. Therefore, the projection points of the target 3D point cloud model on the plane where the initial plane wireframe diagram is located have the characteristics of dense distribution of wall line points, and will be distributed on the initial plane line. The corresponding wall line in the block diagram is nearby. Therefore, the corresponding relationship between the projection point and the original wall line can be determined based on the distance from the projection point to the original wall line.

In an optional example, step 20222 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the sixth processing unit of the first processing module run by the processor.

Step 20223: Determine the corrected wall line corresponding to the original wall line based on each target projection point.

After determining the target projection point corresponding to any original wall line, the projected wall line corresponding to the original wall line can be fitted based on each target projection point corresponding to the original wall line, based on the comparison between the projected wall line and the original wall line As a result, the corrected wall line corresponding to the original wall line is determined. The comparison results include matching and non-matching results, which can be determined according to the preset comparison rules. The comparison rules can be set according to actual needs, such as the projected wall line and the original wall line. The angle between the wall lines is less than the angle threshold, the distance from the endpoint of the original wall line to the projected wall line is less than the distance threshold, the overlap between the projected wall line and the original wall line is greater than the coincidence threshold, etc., there are no specific restrictions, so Ensure the accuracy of projected wall lines. When the projected wall line and the original wall line meet the comparison rules, it can be determined that the projected wall line matches the original wall line, otherwise it is determined that the projected wall line and the original wall line do not match. When the projected wall line matches the original wall line, the projected wall line is used as the corrected wall line corresponding to the original wall line; otherwise, the original wall line is used as the corrected wall line.

In an optional example, step 20223 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the sixth processing unit of the first processing module run by the processor.

Step 20224: Based on the end points of the original wall line, determine the end points of the modified wall line.

Specifically, the endpoint of the original wall line can be vertically projected onto the straight line of the corrected wall line to determine the endpoint of the corrected wall line, thereby obtaining the corrected wall line segment.

In an optional example, step 20224 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the sixth processing unit of the first processing module run by the processor.

Step 20225: Determine the corrected plane wireframe based on the corrected wall lines corresponding to each original wall line and the end points of the corrected wall lines.

Specifically, the corrected wall line segments can be determined based on the end points of the corrected wall line and the corrected wall line corresponding to the original wall line, and then the intersection points of the straight lines of the adjacent corrected wall line segments can be obtained to obtain each corrected wall line segment. The final endpoint of the wall line makes each corrected wall line form a complete polygon corresponding to the functions, and the complete polygons corresponding to each function form a corrected plan wireframe corresponding to the target house.

In an optional example, step 20225 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the sixth processing unit of the first processing module run by the processor.

This disclosure uses the projection of the target three-dimensional point cloud model on the plane where the initial plan wireframe is located to correct the initial plan wireframe, which can improve the accuracy of the plan house plan, and then generate a three-dimensional house plan based on the corrected plan wireframe, ensuring that the generated Accuracy of three-dimensional floor plans.

In an optional example, step 201 obtains the initial plane wireframe and the target three-dimensional point cloud model in the first coordinate system of the target house, including:

Step 2011: Obtain planar wireframe information and original three-dimensional point cloud data of the target house.

Among them, the planar wireframe information of the target house can include the length information of each wall in each function room of the target house, the adjacent relationship between the walls and other related information. The details can be set according to actual needs, as long as the target can be determined. The polygonal structure of the house floor plan is enough. The original three-dimensional point cloud data may be the three-dimensional point cloud data of the target house obtained based on any implementable measuring device. The measuring device may be, for example, a laser-based scanning device, and is not specifically limited.

In an optional example, step 2011 may be executed by the processor calling corresponding instructions stored in the memory, or may be executed by the acquisition unit of the first acquisition module run by the processor.

Step 2012: Based on the plane wireframe information, determine the initial plane wireframe of the target house in the first coordinate system.

In order to facilitate the correction of the initial plane wireframe, the plane wireframe information of the target house and the original three-dimensional point cloud data are unified into the first coordinate system. The first coordinate system can be set according to actual needs, for example, it can be the world coordinate system, It can also be other coordinate systems that set the relative coordinate origin, and there is no specific limit. After the first coordinate system is determined, an initial plan wireframe diagram of the target house in the first coordinate system is determined based on the plan wireframe information of the target house. The initial plan wireframe diagram may include the layout of each function of the target house in the first coordinate system. The original wall line information and the original wall line endpoint information under the original wall line information include the straight line representation parameters of the original wall line in the first coordinate system, and the original wall line endpoint information includes the endpoint coordinates of the original wall line in the first coordinate system , thereby obtaining the initial planar wireframe diagram composed of polygons of the target house in the first coordinate system, which is used as the plan floor plan of the target house.

In an optional example, step 2012 may be executed by the processor calling a corresponding instruction stored in the memory, or may be executed by the determination unit of the first acquisition module run by the processor.

Step 2013: Convert the original three-dimensional point cloud data to the first coordinate system to obtain the target three-dimensional point cloud model of the target house in the first coordinate system.

The conversion of the original three-dimensional point cloud data to the first coordinate system can be based on the mapping relationship between the coordinate system of the original three-dimensional point cloud data and the first coordinate system. The mapping relationship can be determined in combination with the initial planar wireframe diagram, for example, based on the coordinate system of the target house. Any preset position is used as a reference to ensure that the point corresponding to the preset position in the initial plane wireframe diagram and the point corresponding to the preset position in the target three-dimensional point cloud model are the same point in the first coordinate system, and it is guaranteed that the initial plane wireframe diagram The horizontal direction of each function is consistent with that of each function of the target 3D point cloud model. The specific mapping principle will not be described again.

In an optional example, step 2013 may be performed by the processor calling corresponding instructions stored in the memory, or may be performed by the conversion unit of the first acquisition module run by the processor.

The disclosed house plan generation method can combine the manually drawn initial floor plan and the scanned three-dimensional point cloud model to first obtain a more accurate floor plan, and then extract the layout of each function of the house based on the three-dimensional point cloud model. Height information converts the two-dimensional floor plan into a three-dimensional house plan, ensuring the accurate heights between different functions of the house, realizing the accurate and automatic generation of the three-dimensional house plan, and effectively improving the accuracy of the three-dimensional house plan.

Any of the house plan generation methods provided by the embodiments of the present disclosure can be executed by any appropriate device with data processing capabilities, including but not limited to: terminal devices and servers. Alternatively, any of the house plan generation methods provided in the embodiments of the present disclosure can be executed by the processor. For example, the processor executes any of the house plan generation methods mentioned in the embodiments of the present disclosure by calling corresponding instructions stored in the memory. No further details will be given below.

Those of ordinary skill in the art can understand that all or part of the steps to implement the above method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, It includes the steps of the above method embodiment; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk and other various media that can store program codes.

Figure 10 is a schematic structural diagram of a house plan generating device provided by an exemplary embodiment of the present disclosure. The installation of this embodiment The device can be used to implement corresponding method embodiments of the present disclosure. The device shown in Figure 10 includes: a first acquisition module 501, a first processing module 502, a second processing module 503 and a third processing module 504.

The first acquisition module 501 is used to acquire the initial plane wireframe and the target three-dimensional point cloud model in the first coordinate system of the target house; the first processing module 502 is used to acquire the target three-dimensional point cloud model based on the first acquisition module 501 , correct the initial plan wireframe to obtain a corrected plan wireframe corresponding to the target house; the second processing module 503 is used to determine the target house based on the corrected plan wireframe obtained by the first processing module 502 and the target three-dimensional point cloud model. Height information corresponding to each function; the third processing module 504 is used to generate a three-dimensional house plan corresponding to the target house based on the modified plan wireframe and height information corresponding to each function.

Figure 11 is a schematic structural diagram of a house plan generating device provided by another exemplary embodiment of the present disclosure.

In an optional example, the height information includes top height and ground height; the third processing module 504 includes: a first processing unit 5041 and a second processing unit 5042.

The first processing unit 5041 is configured to determine the first wireframe information at the top height and the second wireframe information at the ground height corresponding to the functional room based on the modified planar wireframe diagram for any functional room; the second processing unit 5042, Used to determine the three-dimensional house plan based on the first wireframe information and the second wireframe information corresponding to each function.

In an optional example, the second processing module 503 includes: a third processing unit 5031 and a fourth processing unit 5032.

The third processing unit 5031 is used to extract the first point cloud data corresponding to each function from the target three-dimensional point cloud model based on the modified plane wireframe; the fourth processing unit 5032 is used to extract the first point cloud data corresponding to each function based on the corresponding The first point cloud data determines the top height and ground height corresponding to each function.

In an optional example, the fourth processing unit 5032 is specifically configured to: for any function room, determine the number of points included in multiple height ranges based on the first point cloud data corresponding to the function room; based on each height range The number of points included respectively determines the corresponding top height and ground height between functions.

In an optional example, the first processing module 502 includes: a fifth processing unit 5021 and a sixth processing unit 5022.

The fifth processing unit 5021 is used to vertically project the target three-dimensional point cloud model onto the plane where the initial planar wireframe diagram is located, and obtain a projection result. The projection result includes the coordinates of each projection point projected onto the plane where the initial planar wireframe diagram is located; sixth The processing unit 5022 is configured to perform correction processing on the initial planar wireframe diagram according to the projection results to obtain a modified planar wireframe diagram.

In an optional example, the sixth processing unit 5022 is specifically configured to: based on the projection results, determine the distance between each projection point and each original wall line in the initial plan wireframe diagram; for any original wall line, based on each projection point The distance to the original wall line is determined to determine the target projection point whose distance from the original wall line is less than the first distance threshold; based on each target projection point, the corrected wall line corresponding to the original wall line is determined; based on the endpoint of the original wall line, the corrected wall line is determined The endpoints of the wall lines; determine the corrected plane wireframe based on the corrected wall lines corresponding to each original wall line and the endpoints of the corrected wall lines.

In an optional example, the first acquisition module 501 includes: an acquisition unit 5011, a determination unit 5012, and a conversion unit 5013.

The acquisition unit 5011 is used to obtain the plane wireframe information and the original three-dimensional point cloud data of the target house; the determination unit 5012 is used to determine the initial plane wireframe of the target house in the first coordinate system based on the plane wireframe information; the conversion unit 5013, used to convert the original three-dimensional point cloud data into the first coordinate system to obtain the target three-dimensional point cloud model of the target house in the first coordinate system.

In addition, embodiments of the present disclosure also provide an electronic device, including:

A memory is used to store a computer program product; a processor is used to execute the computer program product stored in the memory, and when the computer program product is executed, the method for generating a house plan according to any of the above embodiments of the present disclosure is implemented. .

Figure 12 is a schematic structural diagram of an application embodiment of the electronic device of the present disclosure. As shown in Figure 12, an electronic device includes one or more processors and memory.

The processor may be a central processing unit (CPU) or other device with data processing capabilities and/or instruction execution capabilities. A processing unit in the form of an electronic device that can control other components in the electronic device to perform desired functions.

Memory may store one or more computer program products, and the memory may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and/or cache memory (cache). The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program products may be stored on the computer-readable storage medium, and the processor may run the computer program products to implement the above-described floor plan generation method and/or Other desired features.

In one example, the electronic device may further include an input device and an output device, and these components are interconnected through a bus system and/or other forms of connection mechanisms (not shown).

In addition, the input device may also include, for example, a keyboard, a mouse, and the like.

The output device can output various information to the outside, including determined distance information, direction information, etc. The output devices may include, for example, displays, speakers, printers, and communication networks and remote output devices to which they are connected, among others.

Of course, for simplicity, only some of the components in the electronic device related to the present disclosure are shown in FIG. 12 , and components such as buses, input/output interfaces, etc. are omitted. In addition to this, the electronic device may include any other suitable components depending on the specific application.

In addition to the above methods and devices, embodiments of the present disclosure may also be a computer program product, which includes computer program instructions that, when executed by a processor, cause the processor to perform the steps described in the above part of this specification. Steps in methods for generating house plans according to various embodiments of the present disclosure.

The computer program product may be written with program code for performing operations of embodiments of the present disclosure in any combination of one or more programming languages, including object-oriented programming languages such as Java, C++, etc. , also includes conventional procedural programming languages, such as the "C" language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server execute on.

In addition, embodiments of the present disclosure may also be a computer-readable storage medium having computer program instructions stored thereon. The computer program instructions, when executed by a processor, cause the processor to perform the steps described in the above part of this specification according to the present invention. The steps in the house plan generation method of various embodiments are disclosed.

The computer-readable storage medium may be any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may include, for example, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination thereof. More specific examples (non-exhaustive list) of readable storage media include: electrical connection with one or more conductors, portable disk, hard disk, random access memory (RAM), read only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the above.

The basic principles of the present disclosure have been described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, advantages, effects, etc. mentioned in the present disclosure are only examples and not limitations. These advantages, advantages, effects, etc. cannot be considered to be Each embodiment of the present disclosure must have. In addition, the specific details disclosed above are only for the purpose of illustration and to facilitate understanding, and are not limiting. The above details do not limit the present disclosure to be implemented by using the above specific details.

Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on its differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple. For relevant details, please refer to the description of the method embodiment. Just make it clear.

The block diagrams of the devices, devices, equipment, and systems involved in the present disclosure are only illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, devices, equipment, and systems may be connected, arranged, and configured in any manner. Words such as "includes," "includes," "having," etc. are open-ended terms that mean "including, but not limited to," and may be used interchangeably therewith. As used herein, the words "or" and "and" refer to the words "and/or" and are used interchangeably therewith unless the context clearly dictates otherwise. As used herein, the word "such as" refers to the phrase "such as, but not limited to," and may be used interchangeably therewith.

The methods and apparatus of the present disclosure may be implemented in many ways. For example, the methods and devices of the present disclosure may be implemented through software, hardware, firmware, or any combination of software, hardware, and firmware. The above order for the steps of the methods is for illustration only, and the steps of the methods of the present disclosure are not limited to the order specifically described above unless otherwise specifically stated. Furthermore, in some embodiments, the present disclosure may also be implemented as programs recorded in recording media, and these programs include machine-readable instructions for implementing methods according to the present disclosure. Thus, the present disclosure also covers recording media storing programs for executing methods according to the present disclosure.

It should also be noted that in the devices, equipment and methods of the present disclosure, each component or each step can be decomposed and/or recombined. These decompositions and/or recombinations should be considered equivalent versions of the present disclosure.

The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for the purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present disclosure to the form disclosed herein. Although various example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

A method for generating a house plan, which is characterized by including:

Obtain the initial plane wireframe and the target three-dimensional point cloud model in the first coordinate system of the target house;

Based on the target three-dimensional point cloud model, modify the initial plane wireframe to obtain a modified plane wireframe corresponding to the target house;

Based on the modified plane wireframe and the target three-dimensional point cloud model, determine the height information corresponding to each function of the target house;

Based on the modified plan wireframe and the height information corresponding to each of the functions, a three-dimensional floor plan corresponding to the target house is generated.
The method according to claim 1, characterized in that the height information includes a top height and a ground height; and the generated height information is based on the modified plane wireframe diagram and the corresponding height information between each of the functions. The three-dimensional house plan corresponding to the target house includes:

For any of the functional rooms, determine the first wireframe information at the top height and the second wireframe information at the ground height corresponding to the functional room based on the modified plane wireframe diagram;

The three-dimensional house plan is determined based on the first wireframe information and the second wireframe information corresponding to each of the functions.
The method according to claim 1, characterized in that, based on the modified plane wireframe and the target three-dimensional point cloud model, determining the height information corresponding to each function of the target house includes:

Based on the modified plane wireframe, extract the first point cloud data corresponding to each of the functions from the target three-dimensional point cloud model;

Based on the first point cloud data corresponding to each of the functions, the top height and ground height corresponding to each of the functions are determined.
The method of claim 3, wherein determining the top height and ground height corresponding to each function based on the first point cloud data corresponding to each function includes:

For any of the function rooms, based on the first point cloud data corresponding to the function room, determine the number of points included in the multiple height ranges respectively;

Based on the number of points included in each height range, the corresponding top height and ground height between the functions are determined.
The method according to claim 1, characterized in that, based on the target three-dimensional point cloud model, modifying the initial planar wireframe to obtain a corrected planar wireframe corresponding to the target house includes:

Vertically project the target three-dimensional point cloud model onto the plane where the initial planar wireframe diagram is located, and obtain a projection result. The projection result includes the coordinates of each projection point projected onto the plane where the initial planar wireframe diagram is located;

The initial plane wireframe is modified according to the projection result to obtain the modified plane wireframe.
The method according to claim 5, characterized in that: performing correction processing on the initial planar wireframe diagram according to the projection result to obtain the modified planar wireframe diagram includes:

Based on the projection result, determine the distance from each projection point to each original wall line in the initial plane wireframe diagram;

For any of the original wall lines, based on the distance from each of the projection points to the original wall line, determine a target projection point whose distance from the original wall line is less than a first distance threshold;

Determine the corrected wall line corresponding to the original wall line based on each of the target projection points;

Based on the endpoints of the original wall lines, determine the endpoints of the modified wall lines;

The corrected plane wireframe is determined based on the corrected wall lines corresponding to each of the original wall lines and the end points of the corrected wall lines.
The method according to any one of claims 1 to 6, characterized in that: obtaining the first coordinate system of the target house The initial plan wireframe and target 3D point cloud model below include:

Obtain the plane wireframe information and original three-dimensional point cloud data of the target house;

Based on the planar wireframe information, determine the initial planar wireframe of the target house in the first coordinate system;

The original three-dimensional point cloud data is converted into the first coordinate system to obtain the target three-dimensional point cloud model of the target house in the first coordinate system.
A device for generating house plans, which is characterized in that it includes:

The first acquisition module is used to acquire the initial plane wireframe and the target three-dimensional point cloud model in the first coordinate system of the target house;

The first processing module is used to modify the initial planar wireframe based on the target three-dimensional point cloud model to obtain a corrected planar wireframe corresponding to the target house;

The second processing module is used to determine the height information corresponding to each function of the target house based on the modified plane wireframe and the target three-dimensional point cloud model;

The third processing module is configured to generate a three-dimensional floor plan corresponding to the target house based on the modified plan wireframe and the height information corresponding to each of the functions.
The device according to claim 8, wherein the height information includes top height and ground height; the third processing module includes:

A first processing unit configured to determine, for any of the functional rooms, the first wireframe information at the top height and the second wireframe information at the ground height corresponding to the functional room based on the modified plane wireframe diagram. box information;

The second processing unit is configured to determine the three-dimensional house plan based on the first wire frame information and the second wire frame information respectively corresponding to each of the functions.
The device according to claim 8, characterized in that the second processing module includes:

A third processing unit, configured to extract the first point cloud data corresponding to each of the functions from the target three-dimensional point cloud model based on the modified plane wireframe;

The fourth processing unit is configured to determine the top height and ground height corresponding to each of the functions based on the first point cloud data corresponding to each of the functions.
The device according to claim 10, characterized in that the fourth processing unit is specifically used for:

For any of the function rooms, based on the first point cloud data corresponding to the function room, determine the number of points included in multiple height ranges; determine the number of points included in each of the height ranges based on the number of points included in each of the height ranges. The corresponding top height and ground height between the above functions.
The device according to claim 8, wherein the first processing module includes:

The fifth processing unit is used to vertically project the target three-dimensional point cloud model onto the plane where the initial planar wireframe diagram is located, and obtain a projection result. The projection result includes each projection onto the plane where the initial planar wireframe diagram is located. The coordinates of the projection point;

A sixth processing unit is configured to perform correction processing on the initial planar wireframe diagram according to the projection result to obtain the modified planar wireframe diagram.
The device according to claim 12, characterized in that the sixth processing unit is specifically used for:

Based on the projection results, determine the distance from each projection point to each original wall line in the initial plane wireframe diagram; for any of the original wall lines, based on the distance from each projection point to the original wall line distance, determine the target projection point whose distance from the original wall line is less than the first distance threshold; determine the corrected wall line corresponding to the original wall line based on each of the target projection points; based on the endpoint of the original wall line, Determine the end points of the corrected wall lines; determine the corrected plane wireframe based on the corrected wall lines corresponding to each of the original wall lines and the end points of the corrected wall lines.
The device according to any one of claims 8-13, characterized in that the first acquisition module includes:

An acquisition unit is used to acquire the planar wireframe information and original three-dimensional point cloud data of the target house;

A determination unit configured to determine the initial planar wireframe of the target house in the first coordinate system based on the planar wireframe information;

A conversion unit configured to convert the original three-dimensional point cloud data into the first coordinate system to obtain the target three-dimensional point cloud model of the target house in the first coordinate system.
An electronic device, characterized by including:

Memory for storing computer program products;

A processor, configured to execute a computer program product stored in the memory, and when the computer program product is executed, implement the method described in any one of claims 1 to 7 above.
A computer-readable storage medium on which computer program instructions are stored, characterized in that when the computer program instructions are executed by a processor, the method described in any one of claims 1-7 is implemented.