WO2024030579A1 - Systèmes et procédés de mélange de poudres dans des processus de fabrication additive - Google Patents

Systèmes et procédés de mélange de poudres dans des processus de fabrication additive Download PDF

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Publication number
WO2024030579A1
WO2024030579A1 PCT/US2023/029436 US2023029436W WO2024030579A1 WO 2024030579 A1 WO2024030579 A1 WO 2024030579A1 US 2023029436 W US2023029436 W US 2023029436W WO 2024030579 A1 WO2024030579 A1 WO 2024030579A1
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WO
WIPO (PCT)
Prior art keywords
powder
signal
powder mixture
mixture
sensing module
Prior art date
Application number
PCT/US2023/029436
Other languages
English (en)
Inventor
Joshua Thomas STAGGS
Zhi-wei LIN
Yoon Jung JEONG
Eric Peter Goodwin
Goldie Lynne GOLDSTEIN
Original Assignee
Nikon Corporation
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Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Publication of WO2024030579A1 publication Critical patent/WO2024030579A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/37—Process control of powder bed aspects, e.g. density
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80—Data acquisition or data processing
    • B22F10/85—Data acquisition or data processing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50—Means for feeding of material, e.g. heads
    • B22F12/58—Means for feeding of material, e.g. heads for changing the material composition, e.g. by mixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/307—Handling of material to be used in additive manufacturing
    • B29C64/321—Feeding
    • B29C64/336—Feeding of two or more materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/307—Handling of material to be used in additive manufacturing
    • B29C64/343—Metering

Definitions

  • Certain additive manufacturing such as three-dimensional (3D) printing
  • utilize directed energy for instance, from a laser or an electron beam
  • the powder is deposited only to selected locations, which are then heated by the energy source.
  • a 3D printed part is then built by repeating the process layer-by-layer to form a 3D printed part.
  • FIG. 1 shows a schematic depicting a first exemplary system for determining the condition of a powder mixture in an additive manufacturing process.
  • FIG. 2 shows a schematic depicting a second exemplary system for determining the condition of a powder mixture in an additive manufacturing process.
  • FIG. 3 shows a schematic depicting a third exemplary system for determining the condition of a powder mixture in an additive manufacturing process.
  • FIG. 4 shows a flowchart depicting an exemplary method for determining the condition of a powder mixture in an additive manufacturing process.
  • FIG. 5 shows a schematic depicting a side view of an exemplary processing machine that is used to fabricate/manufacture one or more three-dimensional objects (e.g., an additive manufacturing system) for use with any of the systems and methods of FIGs. 1-4.
  • exemplary processing machine that is used to fabricate/manufacture one or more three-dimensional objects (e.g., an additive manufacturing system) for use with any of the systems and methods of FIGs. 1-4.
  • FIG. 6 is a block diagram of a computer system used to perform portions of methods for determining the condition of a powder mixture in an additive manufacturing printing process.
  • FIG. 7 shows exemplary reflectivities of light as a function of wavelength for a variety of exemplary metals.
  • FIG. 8A shows an example of powder mixture images obtained using the systems and methods described herein with respect to FIG. I.
  • FIG. 8B shows an example of powder mixture composition determined from the images depicted in FIG. 8A.
  • FIG. 9 shows an example of powder mixture distributions for two different types of tubing used for flow paths in a powder dispensing module described herein with respect to FIG.
  • FIG. 10 shows an example of response times for altering a powder mixture using the powder dispensing module described herein with respect to FIG. 1.
  • the invention can be implemented in numerous ways, including as a process; an apparatus; a system; a composition of matter; a computer program product embodied on a computer readable storage medium; and/or a processor, such as a processor configured to execute instructions stored on and/or provided by a memory coupled to the processor.
  • these implementations, or any other form that the invention may take, may be referred to as techniques.
  • the order of the steps of disclosed processes may be altered within the scope of the invention.
  • a component such as a processor or a memory described as being configured to perform a task may be implemented as a general component that is temporarily configured to perform the task at a given time or a specific component that is manufactured to perform the task.
  • the term “processor” refers to one or more devices, circuits, and/or processing cores configured to process data, such as computer program instructions.
  • the term “or” shall convey both disjunctive and conjunctive meanings.
  • the phrase “A or B” shall be interpreted to include element A alone, element B alone, and the combination of elements A and B.
  • Recent work in additive manufacturing has allowed the production of additively manufactured metal parts having geometries that are difficult or impossible to manufacture using traditional subtractive manufacturing processes such as milling or lathing.
  • 3D printed metal parts may have material properties (such as tensile strength, density, and the like) that are substantially similar to those of metal parts manufactured using the traditional subtractive manufacturing processes.
  • Such additive manufacturing processes often utilize directed energy, such as laser light or an electron beam to selectively heat metal powders and thereby form layers of a metal part. In powder spraying processes, the metal powder is deposited only to selected locations, which are then heated by the energy source. A 3D printed metal part is then built by repeating either process layer-by- layer to form a 3D printed part.
  • powders such as powders composed of different metals
  • Such mixing may allow 3D printing of metal mixtures or alloys, for instance.
  • the powder mixture may be changed overtime, allowing 3D printing of parts that contain different materials (such as different metal mixtures or alloys) in different locations.
  • the systems and methods generally utilize a sensing module to detect a signal indicative of a condition (such as a composition) of a powder mixture that is prepared and dispensed by a powder dispensing module.
  • a controller receives the signal from the sensing module and monitors the condition of the powder mixture based upon the signal.
  • the controller alters the condition of the powder mixture based upon the signal.
  • the controller to outputs one or more commands to an additive manufacturing system to perform an additive manufacturing process using the powder dispensing module.
  • the system comprises: a sensing module configured to detect a condition of a powder mixture dispensed by a powder dispensing module; and a controller configured to: receive a signal from the sensing module; monitor the condition of the powder mixture based upon the signal; and to output a command to an additive manufacturing system to perform the additive manufacturing process using the powder dispensing module.
  • the condition comprises a composition of the powder mixture.
  • the sensing module is configured to output the signal to the controller based upon the condition.
  • the sensing module is selected from the group consisting of: an optical sensing module, an optical imaging sensing module, a color imaging sensing module, an optical scattering sensing module, an optical spectroscopy sensing module, an infrared (IR) spectroscopy sensing module, a Fourier transform IR (FTIR) spectroscopy sensing module, a fluorescence spectroscopy sensing module, and a Raman spectroscopy sensing module.
  • IR infrared
  • FTIR Fourier transform IR
  • the signal comprises at least one signal selected from the group consisting of: an optical signal, an optical imaging signal, a color imaging signal, an optical scatering signal, an optical spectroscopy signal, an IR spectroscopy signal, an FTIR spectroscopy signal, a fluorescence spectroscopy signal, and a Raman spectroscopy signal.
  • the sensing module is configured to detect the signal as the powder mixture is prepared within the powder dispensing module. In some embodiments, the sensing module is configured to detect the signal as the powder mixture is dispensed by the powder dispensing module. In some embodiments, the sensing module is configured to detect the signal after the powder mixture has been dispensed by the powder dispensing module.
  • the sensing module is configured to detect the signal from a surface to which the powder mixture has been dispensed by the powder dispensing module.
  • the powder mixture comprises at least one metal powder, ceramic powder, plastic powder, or organic powder.
  • the powder mixture comprises a mixture of at least a first metal, ceramic, plastic, or organic material and a second metal, ceramic, plastic, or organic material that is different from the first metal, ceramic, plastic, or organic material.
  • the signal is indicative of a ratio of the first metal, ceramic, plastic, or organic material to the second metal, ceramic, plastic, or organic material.
  • the system further comprises the powder dispensing module.
  • the powder dispensing module comprises: a plurality of powder feeders, each powder feeder configured to contain a powder of a plurality of powders; a powder mixing chamber configured to receive the plurality of powders from the plurality of powder feeders and to mix the plurality of powders to thereby form the powder mixture; and a powder dispensing nozzle configured to receive the powder mixture from the powder mixing chamber and to dispense the powder mixture.
  • the system further comprises a plurality of flow controllers, each flow controller coupled to a powder feeder of the plurality of powder feeders and to the powder mixing chamber, each flow controller configured to control a flow rate of a powder of the plurality of powders from the corresponding powder feeder to the powder mixing chamber.
  • the controller is configured to alter the condition of the powder mixture based upon the signal. In some embodiments, the controller is configured to alter the composition of the powder mixture based upon the signal. In some embodiments, the controller is configured to alter the composition of the powder mixture by altering at least one flow rate associated with at least one flow controller of the plurality of flow controllers.
  • the method generally comprises: detecting a signal indicative of a condition of a powder mixture prepared and dispensed by a powder dispensing module; monitoring the condition of the powder mixture based upon the signal; and performing an additive manufacturing process using the powder dispensing module.
  • the condition comprises a composition of the powder mixture.
  • the signal comprises at least one signal selected from the group consisting of: an optical signal, an optical imaging signal, a color imaging signal, an optical scattering signal, an optical spectroscopy signal, an IR spectroscopy signal, an FTIR spectroscopy signal, a fluorescence spectroscopy signal, and a Raman spectroscopy signal.
  • the signal is detected as the powder mixture is prepared within the powder dispensing module. In some embodiments, the signal is detected as the powder mixture is dispensed by the powder dispensing module. In some embodiments, the signal is detected after the powder mixture has been dispensed by the powder dispensing module. In some embodiments, the signal is detected from a surface to which the powder mixture has been dispensed by the powder dispensing module. In some embodiments, the powder mixture comprises at least one metal powder, ceramic powder, plastic powder, or organic powder. In some embodiments, the powder mixture comprises a mixture of at least a first metal, ceramic, plastic, or organic material and a second metal, ceramic, plastic, or organic material that is different from the first metal ceramic, plastic, or organic material.
  • the signal is indicative of a ratio of the first metal, ceramic, plastic, or organic material to the second metal, ceramic, plastic, or organic material.
  • the powder dispensing module comprises: a plurality of powder feeders, each powder feeder configured to contain a powder of a plurality of powders; a powder mixing chamber configured to receive the plurality of powders from the plurality of powder feeders and to mix the plurality of powders to thereby form the powder mixture; and a powder dispensing nozzle configured to receive the powder mixture from the powder mixing chamber and to dispense the powder mixture.
  • the powder dispensing module further comprises a plurality of flow controllers, each flow controller coupled to a powder feeder of the plurality of powder feeders and to the powder mixing chamber, each flow controller configured to control a flow rate of a powder of the plurality of powders from the powder feeder to the powder mixing chamber.
  • the method further comprises altering the condition of the powder mixture based upon the signal.
  • the method further comprises altering the composition of the powder mixture based upon the signal.
  • the method further comprises altering the composition of the powder mixture by altering at least one flow rate associated with at least one flow controller of the plurality of flow controllers.
  • FIG. 1 shows a schematic depicting a first exemplary system 100 for determining the condition (such as the composition or homogeneity) of a powder mixture in an additive manufacturing process.
  • the system comprises a powder dispensing module 110.
  • the powder dispensing module 110 is a component of an additive manufacturing system (not shown in FIG. I).
  • the powder dispensing module 110 is configured to prepare and dispense a powder mixture 112 (depicted as gray circles in FIG. 1).
  • the powder mixture 112 comprises at least one metal or at least one alloy or oxide thereof.
  • the at least one metal is selected from the group consisting of: lithium, beryllium, sodium, magnesium, aluminum, potassium, calcium, scandium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, gallium, rubidium, strontium, yttrium, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, silver, cadmium, indium, tin, cesium, barium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, hafnium, tantalum, tungsten, rhenium, osmium, iridium, platinum, gold, thallium, lead, or
  • the powder mixture comprises at least one ceramic.
  • the at least one ceramic is selected from the group consisting of: alumina, aluminum nitride, zirconia, a carbide, a nitride, magnesium oxide, zirconium oxide, and a glass.
  • the powder mixture comprises at least one plastic.
  • the at least one plastic is selected from the group consisting of: polyethylene (PE), low-density PE (LDPE), high-density PE (HDPE), polypropylene (PP), polystyrene (PS), high impact polystyrene (HIPS), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polyurethane (PUR), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), a PC-ABS blend, a PE-ABS blend, polymethyl methacrylate (PMMA), polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), polyetherimide (PEI), polyvinylidene fluoride or polyvinylidene fluoride (PVDF), styrene butadiene rubber (SBR), a polyimide, a polysulfone, and a polyamide-imide.
  • the powder mixture comprises
  • the powder mixture 112 comprises grains (not shown in FIG. 1) having a characteristic size (such as a length, width, height, diameter, major axis, or minor axis) of at least about 10 micrometers (pm) or more, and/or at most about 200 pm or less, or a characteristic size that is within a range defined by any two of the preceding values.
  • the powder mixture 112 is dispersed within a carrier gas.
  • the carrier gas is selected from the group consisting of: air, nitrogen, argon, helium, and carbon dioxide.
  • the powder dispensing module 110 comprises a first powder feeder 114 and a second powder feeder 116.
  • the first powder feeder 114 is configured to contain a first powder 118 (depicted as white circles in FIG. 1).
  • the second powder feeder 116 is configured to contain a second powder 120 (depicted as black circles in FIG. 1).
  • the first powder 118 comprises any metal (or alloy or oxide thereof), ceramic, plastic, or organic material described herein.
  • the second powder 120 comprises any metal (or alloy or oxide thereof, ceramic, plastic, or organic material described herein.
  • the first powder 118 is dispersed within a first carrier gas.
  • the second powder 120 is dispersed within a second carrier gas.
  • the first or second carrier gas comprises any carrier gas described herein.
  • the first and second carrier gases are the same. In some embodiments, the first and second carrier gases are different.
  • the powder dispensing module 110 comprises a powder mixing chamber 122.
  • the powder mixing chamber 122 is configured to receive the first powder 1 18 from the first powder feeder 1 14 and to receive the second powder 120 from the second powder feeder 116.
  • the powder mixing chamber 122 is configured to mix the first powder 118 and the second powder 120 to thereby form the powder mixture 112.
  • the powder mixing chamber 122 is configured to receive the first powder 118 from the first powder feeder 114 via a first flow path 124 and to receive the second powder 120 from the second powder feeder 116 via a second flow path 126.
  • the first flow path 124 comprises a first flow controller and first tubing.
  • the first flow controller is configured to control a first flow rate of the first powder 118 from the first powder feeder 114 to the powder mixing chamber 122.
  • the second flow path 126 comprises a second flow controller and second tubing.
  • the second flow controller is configured to control a second flow rate of the second powder 120 from the second powder feeder 116 to the powder mixing chamber 122. In some embodiments, altering the first flow rate or the second flow rate alters the composition of the powder mixture 112.
  • the powder dispensing module 110 comprises a powder dispensing nozzle 128.
  • the powder dispensing nozzle 128 is configured to receive the powder mixture 112 from the powder mixing chamber 122.
  • the powder dispensing nozzle 128 is configured to dispense the powder mixture 112.
  • the powder dispensing nozzle 128 is configured to dispense the powder mixture 112 to a 3D printing build platform of a 3D printing system (not show n in FIG. 1).
  • the powder dispensing module 110 may comprise any number of powder feeders, powders, flow paths, flow controllers, and powder dispensing nozzles.
  • the powder dispensing module 110 may comprise at least about 2 or more powder feeders, powders, flow' paths, flow controllers, or powder dispensing nozzles, and/or at most about 10 pow'der feeders, powders, flow paths, flow controllers, or powder dispensing nozzles, or a number of powder feeders, powders, flow paths, flow controllers, or pow der dispensing nozzles that is within a range defined by any two of the preceding values.
  • the system 100 comprises a sensing module 130.
  • the sensing module 130 comprises a light source 132.
  • the light source 132 comprises at least one light emitting diode (LED).
  • the light source comprises at least one superluminescent diode (SLD).
  • the light source 132 comprises at least one laser light source.
  • the laser light source comprises at least one continuous wave (CW) laser light source.
  • the laser light source comprises at least one pulsed laser light source.
  • the laser light source comprises a point laser light source, a light laser light source, or a fan laser light source.
  • the laser light source comprises at least one gas laser, (typically, excimer laser (e.g., argon fluoride (ArF) excimer laser)).
  • the laser light source comprises at least one dye laser.
  • the laser light source comprises at least one metal-vapor laser.
  • the laser light source comprises at least one solid-state laser.
  • the laser light source comprises at least one semiconductor laser or diode laser.
  • the light 134 comprises incoherent light. In some embodiments, the light 134 comprises laser light. In some embodiments, the laser light comprises CW laser light. In some embodiments, the laser light comprises pulsed laser light. In some embodiments, the laser pulses have a wavelength that is within the ultraviolet (UV), visible, or infrared (IR) portion of the electromagnetic spectrum. In some embodiments, the light 134 has at least one wavelength of at least about 100 nanometers (nm) or more. In some embodiments, the light 134 has at least one wavelength of at most about 11 pm or less.
  • UV ultraviolet
  • IR infrared
  • the sensing module 130 need not include a light source.
  • the light 134 may comprise ambient light.
  • the light 134 interacts with the powder mixture 112. In the example shown, the light 134 is at least partially reflected or scattered by the powder mixture 112. In some embodiments, the light 134 is at least partially absorbed by the powder mixture 112. In some embodiments, the light 134 causes the powder mixture 112 to fluoresce.
  • an optical detector 136 receives the light 134 following its interaction with the powder mixture 112.
  • the optical detector 136 comprises a photodiode array.
  • the optical detector 136 comprises a camera.
  • the optical detector 136 comprises a charge coupled device (CCD) camera.
  • the optical detector 136 comprises a complementary metal oxide semiconductor (CMOS) camera.
  • the optical detector 136 is located off-axis from the light source 132.
  • the optical detector 136 (and thus the sensing module 130) is configured to detect a signal 138 associated with the light 134 following its interaction with the powder mixture 112.
  • the signal 138 is indicative of a condition of the powder mixture 112. In some embodiments, the signal 138 is indicative of a ratio of the first powder 118 to the second powder 120 (or of a ratio of any powder described herein to any other powder described herein). In some embodiments, the signal 138 is selected from the group consisting of: an optical imaging signal, a color imaging signal, an optical scattering signal, an optical spectroscopy signal, an infrared (IR) spectroscopy signal, a Fourier transform IR (FTIR) spectroscopy signal, a fluorescence spectroscopy signal, and a Raman spectroscopy signal.
  • IR infrared
  • FTIR Fourier transform IR
  • the sensing module 130 is configured to detect the signal 138 after the powder mixture 112 has been dispensed by the powder dispensing module 110.
  • the system 100 comprises a surface 140 to which the powder mixture 112 may be directed.
  • the surface 140 comprises a sticky or adhesive surface to which the powder mixture 112 sticks or adheres.
  • the sensing module 130 is configured to detect the signal 138 from the powder mixture 112 after it has stuck or adhered to the surface 140.
  • the surface 140 is coupled to a conveyor 142 that moves the surface 140 with respect to the sensing module 130.
  • the powder mixture 112 changes due to noise or to accidental or intentional alterations to the condition of the powder mixture 112.
  • the surface 140 serves as a record of how the powder mixture 112 changes over time.
  • the system 100 comprises a controller 150.
  • the controller 150 is configured to receive the signal 138 from the sensing module 130.
  • the controller 150 is configured to monitor, measure, or determine the condition of the powder mixture 112 based upon the signal 138.
  • FIGs. 5-9 show examples of powder mixture composition measurements.
  • the controller 150 is configured to alter the condition of the powder mixture 112.
  • the controller 150 is coupled to the first flow controller or the second flow controller (or to any flow controller described herein).
  • the controller 150 is configured to alter the condition of the powder mixture 112 by altering the first flow rate or the second flow rate (or any flow rate described herein).
  • the controller 150 is coupled to the additive manufacturing system (not shown in FIG. 1 ). In some embodiments, the controller 150 is configured to output one or more commands to the additive manufacturing system (not shown in FIG. 1) to perform an additive manufacturing process using the powder dispensing module 110. In some embodiments, the controller 150 comprises the computer system 600 described herein with respect to FIG. 6.
  • the system 100 may comprise any number of controllers, such as at least about 1 or more controllers, and/or at most about 10 controllers, or a number of controllers that is within a range defined by any two of the preceding values.
  • each controller is coupled to a single component of the system 100.
  • any number of the first powder feeder 114, the second powder feeder 116, any additional powder feeders described herein, and the sensing module 130 are each coupled to and controlled by a single controller.
  • any number of the first powder feeder 114, the second powder feeder 116, and any additional powder feeders described herein are each coupled to and controlled by a first controller, and the sensing module 130 is coupled to and controlled by a second controller, and so forth.
  • the system 100 may comprise any number of controllers coupled to and configured to control any number of components of the system 100.
  • FIG. 2 shows a schematic depicting a second exemplary system 200 for determining the condition (such as the composition or homogeneity) of a powder mixture in an additive manufacturing process.
  • the system 200 comprises many elements of the system 100 described herein with respect to FIG. 1.
  • the system 200 comprises the powder dispensing module 110, the first powder feeder 114, the second powder feeder 116, the powder mixing chamber 122, the first flow path 124, the second flow path 126, the powder dispensing nozzle 128, the sensing module 130, the light source 132, the optical detector 136, and the controller 150.
  • the powder dispensing module 110 is configured to prepare and dispense the powder mixture 112 as described herein with respect to FIG.
  • the powder dispensing module 110 is a component of an additive manufacturing system (not shown in FIG. 2).
  • the first powder feeder 114 is configured to contain the first powder 118 as described herein with respect to FIG. 1.
  • the second powder feeder 116 is configured to contain the second powder 120 as described herein with respect to FIG. 1.
  • the powder mixing chamber is configured to receive the first powder 118 from the first powder feeder 114, to receive the second powder 120 from the second powder feeder 116, and to mix the first powder 118 and the second powder 120 to thereby form the powder mixture 112 as described herein with respect to FIG. 1.
  • a first flow controller of the first flow path 124 is configured to control a first flow rate of the first powder 118 from the first powder feeder 114 to the powder mixing chamber 122 as described herein with respect to FIG. 1.
  • a second flow controller of the second flow path 126 is configured to control a second flow rate of the second powder 120 from the second powder feeder 116 to the powder mixing chamber 122 as described herein with respect to FIG. 1.
  • the powder dispensing nozzle 128 is configured to receive the powder mixture 112 from the powder mixing chamber 122 and to dispense the powder mixture 112 as described herein with respect to FIG. 1.
  • the sensing module 130 comprises the light source 132 and the optical detector 134 as described herein with respect to FIG.
  • the lights source is configured to direct light 134 at the powder mixture 112 as described herein with respect to FIG. 1.
  • the light 134 is configured to interact with the powder mixture 112 as described herein with respect to FIG. 1.
  • the optical detector 136 is configured to receive the light 134 following its interaction with the powder mixture 112 and to detect the signal 138 as described herein with respect to FIG. 1.
  • the controller 150 is configured to receive the signal 138 from the sensing module 130 and to monitor, measure, or determine the condition of the powder mixture 112 based upon the signal 138 as described herein with respect to FIG. 1.
  • the controller 150 is configured to alter the condition of the powder mixture 112 as described herein with respect to FIG. 1.
  • the controller 150 is configured to output one or more commands to the additive manufacturing system (not shown in FIG. 2) to perform an additive manufacturing process using the pow der dispensing module 110.
  • the sensing module 130 of system 200 is not configured to detect the signal 138 after the powder mixture 112 has been dispensed by the powder dispensing module 110. Instead, the sensing module 130 of system 200 is not configured to detect the signal 138 after the powder mixture 112 has been dispensed by the powder dispensing module 110. Instead, the sensing module
  • the 130 of system 200 is configured to detect the signal 138 as the powder mixture 112 is being dispensed by the powder dispensing module 110.
  • the light source 132 of sensing module 130 is configured to direct the light 134 to a region outside of the powder dispensing nozzle 128 and the optical detector 136 is configured to receive the signal 138 from the powder mixture 112 after the powder mixture 112 has left the powder dispensing nozzle 128.
  • the powder dispensing module 110 may comprise any number of powder feeders, powders, flow paths, flow controllers, and powder dispensing nozzles.
  • the powder dispensing module 110 may comprise at least about 2 or more powder feeders, powders, flow paths, flow controllers, or powder dispensing nozzles, and/or at most about 10 or less powder feeders, powders, flow paths, flow controllers, or powder dispensing nozzles, or a number of powder feeders, powders, flow paths, flow controllers, or powder dispensing nozzles that is within a range defined by any two of the preceding values.
  • the system 200 may comprise any number of controllers, such as at least about 1 or more, and/or at most about 10 or less controllers, or a number of controllers that is within a range defined by any two of the preceding values.
  • each controller is coupled to a single component of the system 200.
  • any number of the first powder feeder 114, the second powder feeder 116, any additional powder feeders described herein, and the sensing module 130 are each coupled to and controlled by a single controller.
  • any number of the first powder feeder 114, the second powder feeder 116, and any additional powder feeders described herein are each coupled to and controlled by a first controller, and the sensing module 130 is coupled to and controlled by a second controller, and so forth.
  • the system 200 may comprise any number of controllers coupled to and configured to control any number of components of the system 200.
  • FIG. 3 shows a schematic depicting a third exemplary system 300 for determining the condition (such as the composition or homogeneity) of a powder mixture in an additive manufacturing process.
  • the system 300 comprises many elements of the system 100 described herein with respect to FIG. 1.
  • the system 300 comprises the powder dispensing module 110, the first powder feeder 114, the second powder feeder 116, the powder mixing chamber 122, the first flow path 124, the second flow path 126, the powder dispensing nozzle 128, the sensing module 130, the light source 132, the optical detector 136, and the controller 150.
  • the powder dispensing module 110 is configured to prepare and dispense the powder mixture 112 as described herein with respect to FIG.
  • the powder dispensing module 110 is a component of an additive manufacturing system (not shown in FIG. 3).
  • the first powder feeder 114 is configured to contain the first powder 1 18 as described herein with respect to FIG. 1.
  • the second powder feeder 116 is configured to contain the second powder 120 as described herein with respect to FIG. 1.
  • the powder mixing chamber is configured to receive the first powder 118 from the first powder feeder 114, to receive the second powder 120 from the second powder feeder 116, and to mix the first powder 118 and the second powder 120 to thereby form the powder mixture 112 as described herein with respect to FIG. 1.
  • a first flow controller of the first flow path 124 is configured to control a first flow rate of the first powder 118 from the first powder feeder 114 to the powder mixing chamber 122 as described herein with respect to FIG. 1.
  • a second flow controller of the second flow path 126 is configured to control a second flow rate of the second powder 120 from the second powder feeder 116 to the powder mixing chamber 122 as described herein with respect to FIG. 1.
  • the powder dispensing nozzle 128 is configured to receive the powder mixture 112 from the powder mixing chamber 122 and to dispense the powder mixture 112 as described herein with respect to FIG. 1.
  • the sensing module 130 comprises the light source 132 and the optical detector 134 as described herein with respect to FIG.
  • the lights source is configured to direct light 134 at the powder mixture 112 as described herein with respect to FIG. 1.
  • the light 134 is configured to interact with the powder mixture 112 as described herein with respect to FIG. 1.
  • the optical detector 136 is configured to receive the light 134 following its interaction with the powder mixture 112 and to detect the signal 138 as described herein with respect to FIG. 1.
  • the controller 150 is configured to receive the signal 138 from the sensing module 130 and to monitor, measure, or determine the condition of the powder mixture 112 based upon the signal 138 as described herein with respect to FIG. 1
  • the controller 1 0 is configured to alter the condition of the powder mixture 1 12 as described herein with respect to FIG. 1
  • the controller 150 is configured to output one or more commands to the additive manufacturing system (not shown in FIG. 3) to perform an additive manufacturing process using the powder dispensing module 110.
  • the sensing module 130 of system 300 is not configured to detect the signal 138 after the powder mixture 112 has been dispensed by the powder dispensing module 110. Instead, the sensing module 130 of system 300 is configured to detect the signal 138 as the powder mixture 112 is being prepared within the powder dispensing module 110.
  • the light source 132 of sensing module 130 is configured to direct the light 134 to a region within the powder mixing chamber 122 and the optical detector 136 is configured to receive the signal
  • the light source 132 of sensing module 130 is configured to direct the light 134 to a region between the powder mixing chamber 122 and the powder dispensing nozzle 128 and the optical detector 136 is configured to receive the signal 138 from the powder mixture 112 as the powder mixture 112 travels between the powder mixing chamber 122 and the powder dispensing nozzle 128.
  • the light source 132 of sensing module 130 is configured to direct the light 134 to a region within the powder dispensing nozzle 128 and the optical detector 136 is configured to receive the signal 138 from the powder mixture 112 as the powder mixture 112 is situated within the powder dispensing nozzle 128.
  • the powder dispensing module 110 may comprise any number of powder feeders, powders, flow paths, flow controllers, and powder dispensing nozzles.
  • the powder dispensing module 1 10 may comprise at least about 2 or more powder feeders, powders, flow paths, flow controllers, or powder dispensing nozzles, and/or at most about 10 or less powder feeders, powders, flow paths, flow controllers, or powder dispensing nozzles, or a number of powder feeders, powders, flow paths, flow controllers, or powder dispensing nozzles that is within a range defined by any two of the preceding values.
  • the system 300 may comprise any number of controllers, such as at least about I or more controllers, and/or at most about 10 or less controllers, or a number of controllers that is within a range defined by any two of the preceding values.
  • each controller is coupled to a single component of the system 300.
  • any number of the first powder feeder 114, the second powder feeder 116, any additional powder feeders described herein, and the sensing module 130 are each coupled to and controlled by a single controller.
  • any number of the first powder feeder 114, the second powder feeder 116, and any additional powder feeders described herein are each coupled to and controlled by a first controller, and the sensing module 130 is coupled to and controlled by a second controller, and so forth.
  • the system 300 may comprise any number of controllers coupled to and configured to control any number of components of the system 300.
  • FIG. 4 shows a flowchart depicting an exemplary method 400 for determining the condition (such as the composition or homogeneity) of a powder mixture in an additive manufacturing process.
  • a signal indicative of a condition of a powder mixture prepared by a powder dispensing module is detected at 410.
  • the powder mixture comprises any powder mixture described herein with respect to FIGs. 1-3.
  • the powder dispensing module comprises any powder dispensing module described herein with respect to FIGs. 1-3.
  • the signal comprises any signal described herein with respect to FIGs. 1 -3.
  • the signal is detected using any sensing module described herein with respect to FIGs. 1-3.
  • the condition of the powder mixture is monitored based upon the signal.
  • the condition of the powder mixture is monitored using any controller described herein with respect to FIGs. 1-3.
  • the condition of the powder mixture is altered based upon the signal.
  • an additive manufacturing process is performed using the powder dispensing module.
  • method 400 is repeated a plurality of times to repeatedly monitor or alter the condition of the powder mixture over time. In some embodiments, method 400 is repeated at least about 1 or more times, and/or at most about 1,000,000 or less times. In some embodiments, method 400 is repeated a number of times that is within a range defined by any two of the preceding values.
  • the method 140 may be implemented using any of the systems described herein, such as any of systems 100, 200, and 300 described herein with respect to FIGs. 1-3, respectively.
  • FIG. 5 is a simplified, side schematic view of an implementation of a processing machine 500 that is used to fabricate/manufacture one or more three-dimensional objects 511.
  • the processing machine 500 may be an additive manufacturing system such as a three-dimensional printer in which a material 512 (illustrated as small circles) is joined, melted, solidified, and/or fused together to manufacture one or more three-dimensional object(s) 511.
  • the processing machine 500 includes: (i) a build chamber 514 that defines a build space 514A; (ii) a build platform 516 that supports the object 511 while it is being built; (iii) a printer head 518 including a material supply 520 having one or more material directors 520A, and an energy source 522 (illustrated as a box in phantom) that generates an energy beam 522A (illustrated with an arrow); (iv) a measurement system 524 (illustrated as a box); (v) a control system 526 (illustrated as a box) that cooperate to make each three-dimensional object 511.
  • each of these components of the processing machine 500 may be varied pursuant to the teachings provided herein. Moreover, it should be noted that the positions of the components of the processing machine 500 may be different than that illustrated in FIG. 5. Further, it should be noted that the processing machine 500 may include more components or fewer components than illustrated in FIG. 5.
  • the processing machine 500 is a Directed Energy Deposition system C'DED system”), and the energy source 522 is controlled to melt the upper part or the upper surface of the material 511 to produce a melt pool on the upper part and the material 512 is supplied to the melt pool by the material director(s) 520A to build the object 511 more.
  • the material director(s) 520A deposit the material 512 that is fused together, and the energy source 522 is controlled to melt the material 512 at approximately the same time as the material 512 is being deposited by the material director(s) 520 A to build the obj ect 511.
  • a three- dimensional obj ect model of the obj ect 511 is made with CAD software.
  • the obj ect model can be provided to the control system 526, which subsequently controls the printer head 518 to print a plurality of sequential build layers 530 (illustrated with solid lines) used to build the obj ect 511.
  • control system 526 controls the printer head 518 in a fashion that improves the accuracy of one or more of the build layers 530. As a result thereof, the build object 511 will be more accurate.
  • the type of three-dimensional object(s) 511 manufactured with the processing machine 500 may be almost any shape or geometry.
  • the three-dimensional object 511 may be a metal part, or another type of object, for example, a resin (plastic) part or a ceramic part, etc.
  • the three-dimensional object 51 1 may also be referred to as a “part ”
  • the object 511 can be referred to as a “partially built object” while the material is being added, or as a “built object” when the object is formed.
  • object 511 is illustrated as still being printed. More specifically, in the simplified illustration of FIG. 5, the DED system 500 has printed seventeen, sequential build layers 530. However, the number of build layers 530 will depend upon the design of the object 511 and other factors. As alternative, non-exclusive examples, the obj ect 511 can be built using at least 10 or more adjacent build layers 530. [0060] In FIG. 5, for ease of discussion, the build layers 530 can be labeled as a first build layer 530a, a second build layer 530b, a third build layer 530c, a fourth build layer 530d, etc., moving from the botom to the top of the object 511.
  • each build layer 530 can be varied pursuant to the teachings provided herein.
  • each build layer 511 can have an X axis dimension measured along X axis, a Y axis dimension measured along the Y axis, and aZ axis dimension (“height”) measured along the Z axis.
  • the value of the X axis dimension and the Y axis dimension for each build layer 530 can be varied as required to match the corresponding dimensions of the object model.
  • the type of material 512 joined and/or fused together may be varied to suit the desired properties of the object(s) 511.
  • the material 512 may include small metal particles for metal three-dimensional printing.
  • the material 512 may be metallic material, non-metal material, a plastic, polymer, glass, ceramic material, or any other material known to people skilled in the art.
  • the material 512 may also be referred to as “powder” in certain implementations.
  • the processing machine can be a wire feed system in which the material is a wire or filament that is melted to form the object 511.
  • the build chamber 514 defines the build space 514A in which the object(s) 511 are formed.
  • the build chamber 514 is generally rigid box shaped, and forms a generally rectangular shaped, sealed, build space 514A.
  • the build chamber 514 encloses the build platform 516, the pnnter head 518, and the measurement system 524, in addition to the object 511 that is being built.
  • the build platform 516 is coupled to the botom
  • the printer head 518 is coupled to the top of the build chamber 514.
  • the build chamber 514 can have a different configuration (e.g., cylindrical shaped); and/or (ii) the build platform 516 and the printer head 518 can be positioned at different locations.
  • the build chamber 514 can include a chamber environmental controller 514B (illustrated as a box) that creates a controlled environment in the build chamber 514.
  • the chamber environmental controller 514B creates a vacuum environment in the build chamber 514.
  • the chamber environmental controller 514B can create a non-vacuum environment such as inert gas (e.g., helium gas, nitrogen gas, or argon gas) environment in the build chamber 514.
  • the chamber environmental controller 514B can selectively and individually create a non-oxidizing atmosphere in the chamber 514.
  • the chamber environmental controller 514B can control a temperature in the build chamber 514.
  • the chamber environmental controller 514B can include one or more heaters, coolers, vacuum pumps or fluid pumps to control the environment.
  • the build chamber 514 can include one or more doors (not shown) and/or load lock chambers (not shown) which allow access to the build space 514A to remove the build object 51 1 , for example.
  • the build platform 516 (directly or indirectly) supports the material 512 while each build layer 530 is being formed.
  • the build platform 516 includes a platform frame 516A, and a frame mover 516B (illustrated as a box) that selectively moves the platform frame 516A relative to the build chamber 514.
  • the build platform 516 can be designed without the frame mover 516B.
  • each object 511 is built directly in/on the build platform frame 516A.
  • one or more objects 511 can be built onto a movable build frame 528 (“build plate”) which is supported by and/or selectively coupled to the platform frame 516A.
  • a single object 511 is built on each build frame 528.
  • two or more objects 511 can be built on each build frame 528.
  • the build frame 528 supports the material 512 while each object 511 is being formed.
  • each build frame 528 can be made of the same material as the material 512 used to build the obj ect 511 or another suitable material.
  • the build frame 528 includes one or more frame features (not shown) that allow for the build frame 528 to be selectively coupled to the platform frame 516A.
  • the object 511 is fused (e.g., welded) to the build frame 528 during the three-dimensional printing process. Alternatively, for example, the object 511 is not fused to the build frame 528 during the three-dimensional printing process.
  • the build frame 528 is generally flat shaped, e.g., flat disk shaped.
  • the build frame 528 can include side walls (not shown) that extend upward, or other features.
  • the platform frame 516A supports the build frame 528, and the platform frame 516A can optionally include one or more platform features (not shown) that selectively engage and selectively retain the build frame 528.
  • the frame mover 516B can include one or more actuators.
  • the frame mover 516B can move the platform frame 516A and the build frame 528 up and down, back and forth and/or in rotation as necessary relative to the other components of the processing machine 500.
  • the other components of the processing machine 500 can be moved relative to the build frame 528.
  • the printer head 518 is controlled by the control system 526 to sequentially print the build layers 530 to form the object 511.
  • the design of the printer head 518 can be varied pursuant to the teachings provided herein.
  • the printer head 518 includes a head frame 518 A, a printer mover 518B, the material supply 520, and the energy source 522.
  • the printer head 518 can be designed to include more or fewer components than are illustrated in FIG. 5.
  • the head frame 518A retains at least portion of the material supply 520 and the energy source 522. Further, at least a portion of the measurement system 524 can optionally be secured to and move with the head frame 518A.
  • the head frame 518A is illustrated as being generally rectangular shaped. Alternatively, the head frame 518 can have a different configuration.
  • the printer mover 518B selectively moves and positions the head frame 518A with the material director(s) 520A, and at least a portion of the energy source 522.
  • the printer mover 518B can be designed and controlled to move the printer head 518 with six degrees of freedom (along and about the X, Y, and Z axes) relative to the build frame 528 and the build chamber 514 during the printing process for each build layer 530.
  • the printer mover 518B can be designed and controlled to move the printer head 518 with less than six degrees of freedom (e.g., three degrees of freedom).
  • the printer mover 518B can include one or more linear motors, one or more rotary motors and/or one or more other actuators
  • the printer mover 518B can move the printer head 518 in two degrees of freedom (e.g., along the X and Y axes) and the frame mover 516B can move the platform frame 516A in one degree of freedom (e.g., along the Z axis).
  • the material supply 520 supplies the material 512 that is used to build the object(s) 511 in the build chamber 514.
  • the material supply 520 can deposit the material 512 to the melt pool while energy source 522 melts the upper portion of object 511 to produce the melt pool to form each of the build layers 530.
  • the material supply 520 can include a material hopper (not shown) that retains the material 512, and one or more material directors 520A that direct the material 512 to the correct location to form each build layer 530.
  • each of the material directors 520A can be a nozzle which directs the material 512 at the desired location.
  • the material supply 520 can be wire feed system which feeds the material 512 as wire from each material director 520A.
  • the material directors 520A are mounted on the printer head 518 and connected by a conduit (e.g., a flexible hose) or other mechanism to direct the material 512 from a material supply (e.g., a powder hopper or spool of wire) which is not mounted on the printer head 518.
  • a conduit e.g., a flexible hose
  • a material supply e.g., a powder hopper or spool of wire
  • the number of material directors 520A can be varied. In FIG. 5, the material supply 520 is illustrated as having two material directors 520 A. Alternatively, the material supply 520 can be designed to include more than two or just one material director 520A.
  • the material 512 in the material supply 520, the material 512 is mixed into a carrier gas, and this mixture is directed from the one or more material directors 520 A.
  • the carrier gas can be nitrogen or another inert gas.
  • the energy source 522 irradiates and melts the material 512 with the energy beam 522A to form each build layer 530. Stated in another fashion, the energy source 522 heats and melts the material 512 to form the object 530. In certain implementations, the energy source 522 may irradiate the beam 522A to a surface of the object 511 to generate a melt pool on surface of the object 511. The material supply 520 may supply the material 512 into the melt pool generated by the beam 522 A.
  • the energy source 522 includes a beam generator 522B that generates (i) an electron beam 522A, (ii) a laser beam 522A, (iii) an ion beam 522 A, or (iv) an electric arc 522 A.
  • the beam generator 522B is illustrated as being positioned within and movable with the head frame 518A.
  • the beam generator 522B can be positioned away from the head frame 518 A, and the energy beam 522A steered to exit from the head frame 518 A.
  • the measurement system 524 inspects and monitors each of the build layers 530 while each object 511 is being built.
  • the measurement system 524 may include one or more elements such as a uniform illumination device, fringe illumination device, optical sensors, cameras that function at one or more wavelengths, lens, interferometer, or photodetector, or a non-optical measurement system such as an ultrasonic, eddy current, or capacitive sensor. Further, as discussed in more detail below, the measurement system 524 can include one or more thermal cameras and/or optical sensors.
  • the control system 526 controls and directs power to the components of the processing machine 500 to build the three-dimensional object 511 from the computer-aided design (CAD) object model, by successively adding the build layers 530.
  • the control system 526 may include one or more processors 526A and one or more electronic storage devices 526B.
  • the control system 526 functions as a device that controls the operation of the processing machine 500 by executing one or more computer programs.
  • the computer program(s) causes the control system 526 to perform the required operations. That is, this computer program is a computer program for making the control system 526 function so that the processing machine 500 will perform the operations provided herein.
  • a computer program executed by the CPU may be recorded in a memory (that is, a recording medium) included in the control system 526, or an arbitrary storage medium built in the control system 526 or externally attachable to the control system 526, for example, a hard disk or a semiconductor memory.
  • the CPU may download a computer program to be executed from a device external to the control system 526 via the network interface.
  • control system 526 may not be disposed inside the processing machine 500, and may be arranged as a server or the like outside the processing machine 10, for example.
  • the control system 526 and the processing machine 500 may be connected via a communication line such as a wired communications (cable communications), a wireless communications, or a network.
  • a communication line such as a wired communications (cable communications), a wireless communications, or a network.
  • wired communications cable communications
  • wireless communications wireless communications
  • a network In case of physically connecting with wired, it is possible to use serial connection or parallel connection. Further, when connecting radio waves may be used.
  • the control system 526 and the processing machine 500 may be configured to be able to transmit and receive various types of information via a communication line or a network. Further, the control system 526 may be capable of transmitting information such as commands and control parameters to the processing machine 500 via the communication line and the network.
  • the processing machine 500 may include a receiving device (receiver) that receives information such as commands and control parameters from the control system 526 via the communication line or the network.
  • a receiving device that receives information such as commands and control parameters from the control system 526 via the communication line or the network.
  • a recording medium for recording the computer program executed by the CPU a storage medium such as a disk medium, a magnetic medium, a semiconductor memory and a medium capable of storing other programs.
  • the program includes a form distributed by downloading through a network line such as the Internet.
  • the recording medium includes a device capable of recording a program, for example, a general-purpose or dedicated device mounted in a state in which the program can be executed in the form of software, firmware or the like.
  • each processing and function included in the program may be executed by program software that can be executed by a computer, or processing of each part may be executed by hardware such as a predetermined gate array (FPGA, ASIC) or program software, and a partial hardware module that realizes a part of hardw are elements may be implemented in a mixed form.
  • the control system 526 includes a first computer 526C that utilizes slicing software to divide the object model into a plurality of potential slices before building the three-dimensional object begins, and a second computer 526D which is used to control operation of the build platform 516 and the printer head 518 using the pre-computed potential slices.
  • the computers 526C, 526D are illustrated side by side. Alternatively, the computers 526C, 526D can be remote from each other.
  • any of systems 100, 200, and described herein with respect to FIGs. 1-3, respectively, or the method 400 described herein with respect to FIG. 4, may be utilized in conjunction with the processing machine 500 of FIG. 5. Additionally, systems are disclosed that can be used to perform the method 400 of FIG. 4, or any one, two, or three of operations 410, 420, and 430.
  • the systems comprise one or more processors and memory coupled to the one or more processors.
  • the one or more processors are configured to implement one or more operations of method 400.
  • the memory is configured to provide the one or more processors with instructions corresponding to the operations of method 400.
  • the instructions are embodied in a tangible computer readable storage medium.
  • FIG. 6 is a block diagram of a computer system 600 used in some embodiments to perform portions of methods for determining the condition of a powder mixture in a 3D printing process (such as any one, two, or three of operation 410, 420, or 430 of method 400 as described herein with respect to FIG 4).
  • the computer system may be utilized as a component in systems for determining the condition of a powder mixture in a 3D printing process described herein.
  • FIG. 6 illustrates one embodiment of a general purpose computer system. Other computer system architectures and configurations can be used for carrying out the processing of the present invention.
  • Computer system 600 made up of various subsystems described below, includes at least one microprocessor subsystem 601.
  • the microprocessor subsystem comprises at least one central processing unit (CPU) or graphical processing unit (GPU).
  • the microprocessor subsystem can be implemented by a single-chip processor or by multiple processors.
  • the microprocessor subsystem is a general purpose digital processor which controls the operation of the computer system 600. Using instructions retrieved from memory 604, the microprocessor subsystem controls the reception and manipulation of input data, and the output and display of data on output devices.
  • the microprocessor subsystem 601 is coupled bi-directionally with memory 604, which can include a first primary storage, typically a random access memory (RAM), and a second primary storage area, typically a read-only memory (ROM).
  • RAM random access memory
  • ROM read-only memory
  • primary storage can be used as a general storage area and as scratch-pad memory, and can also be used to store input data and processed data. It can also store programming instructions and data, in the form of data objects and text objects, in addition to other data and instructions for processes operating on microprocessor subsystem. Also as well known in the art, primary storage typically includes basic operating instructions, program code, data and objects used by the microprocessor subsystem to perform its functions. Primary storage devices 604 may include any suitable computer-readable storage media, described below, depending on whether, for example, data access needs to be bi-directional or uni-directional. The microprocessor subsystem 601 can also directly and very rapidly retrieve and store frequently needed data in a cache memory (not shown).
  • a removable mass storage device 605 provides additional data storage capacity for the computer system 600, and is coupled either bi-directionally (read/write) or uni-directionally (read only) to microprocessor subsystem 601.
  • Storage 605 may also include computer-readable media such as magnetic tape, flash memory, signals embodied on a carrier wave, PC-CARDS, portable mass storage devices, holographic storage devices, and other storage devices.
  • a fixed mass storage 609 can also provide additional data storage capacity. The most common example of mass storage 609 is a hard disk drive.
  • Mass storage 605 and 609 generally store additional programming instructions, data, and the like that typically are not in active use by the processing subsystem. It will be appreciated that the information retained within mass storage 605 and 609 may be incorporated, if needed, in standard fashion as part of primary storage 604 (e.g. RAM) as virtual memory.
  • bus 606 can be used to provide access other subsystems and devices as well.
  • these can include a display monitor 608, a network interface 607, a keyboard 602, and a pointing device 603, as well as an auxiliary input/output device interface, a sound card, speakers, and other subsystems as needed.
  • the pointing device 603 may be a mouse, stylus, track ball, or tablet, and is useful for interacting with a graphical user interface.
  • the network interface 607 allows the processing subsystem 601 to be coupled to another computer, computer network, or telecommunications network using a network connection as shown.
  • the processing subsystem 601 might receive information, e g., data objects or program instructions, from another network, or might output information to another network in the course of performing the above-described method steps.
  • Information often represented as a sequence of instructions to be executed on a processing subsystem, may be received from and outputted to another network, for example, in the form of a computer data signal embodied in a carrier wave.
  • An interface card or similar device and appropriate software implemented by processing subsystem 601 can be used to connect the computer system 600 to an external network and transfer data according to standard protocols.
  • method embodiments of the present invention may execute solely upon processing subsystem 601, or may be performed across a network such as the Internet, intranet networks, or local area networks, in conjunction with a remote processing subsystem that shares a portion of the processing.
  • Additional mass storage devices may also be connected to processing subsystem 601 through network interface 607.
  • auxiliary I/O device interface (not show n) can be used in conjunction with computer system 600.
  • the auxiliary I/O device interface can include general and customized interfaces that allow the processing subsystem 601 to send and, more typically, receive data from other devices such as microphones, touch-sensitive displays, transducer card readers, tape readers, voice or handwriting recognizers, biometrics readers, cameras, portable mass storage devices, and other computers.
  • embodiments of the present invention further relate to computer storage products with a computer readable medium that contains program code for performing various computer-implemented operations.
  • the computer-readable medium is any data storage device that can store data which can thereafter be read by a computer system.
  • the media and program code may be those specially designed and constructed for the purposes of the present invention, or they may be of the kind well known to those of ordinary skill in the computer software arts.
  • Examples of computer-readable media include, but are not limited to, all the media mentioned above: magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROM disks; magneto-optical media such as floptical disks; and specially configured hardware devices such as application-specific integrated circuits (ASICs), programmable logic devices (PLDs), and ROM and RAM devices.
  • the computer-readable medium can also be distributed as a data signal embodied in a carrier wave over a network of coupled computer systems so that the computer-readable code is stored and executed in a distributed fashion.
  • Examples of program code include both machine code, as produced, for example, by a compiler, or files containing higher level code that may be executed using an interpreter.
  • bus 606 is illustrative of any interconnection scheme serving to link the subsystems. Other computer architectures having different configurations of subsystems may also be utilized.
  • FIG. 7 shows exemplary reflectivities of light as a function of wavelength for a variety of exemplary metals.
  • the reflectivities of copper (Cu), molybdenum (Mo), rhodium (Rh), stainless steel (SS), and tungsten (W) are provided.
  • the metals have significantly different reflectivities.
  • Cu and SS have significantly different reflectivities.
  • measuring the reflectivity of a mixture of Cu and SS in this wavelength range allows the composition of the mixture (i.e., the ratio of Cu and SS and in the powder mixture) to be determined.
  • the red channel of a color imaging camera was used with broadband illumination by a light source.
  • FIG. 8A shows an example of powder mixture images obtained using the systems and methods described herein with respect to FIG. 1.
  • the surface of FIG. 1 was moved relative to the powder dispensing module of FIG. 1 and a powder mixture consisting of Cu and SS was delivered to the surface.
  • the powder mixture was imaged using the color imaging technique described herein with respect to FIG. 7.
  • each sub-region of the image depicted in FIG. 8A corresponds to the powder mixture at a point in time.
  • FIG. 8B shows an example of powder mixture composition determined from the images depicted in FIG. 8A.
  • the powder mixture composition is expressed as the ratio of the amount of Cu to the sum of the amounts of Cu and SS in the powder mixture (i.e., [Cu]/([Cu]+[SS], where [Cu] denotes the amount of Cu in the powder mixture and [SS] denotes the amount of SS in the powder mixture).
  • the ratio varied from a low of about 44% to a high of about 72%.
  • the mean ratio was about 56.25%, with a standard deviation of about 6.40%.
  • the standard deviation of the ratio may be utilized as a measure of the powder mixture homogeneity.
  • the systems and methods described herein may be used to determine the efficiency with which a powder mixture is mixed in the mixing chamber described herein with respect to FIG. 1.
  • FIG. 9 shows an example of powder mixture distributions for two different types of tubing used for flow paths in a powder dispensing module described herein with respect to FIG. 1.
  • tubing having a 2.5 millimeter (mm) inner diameter (ID) exhibited a lower standard deviation than tubing having a 4 mm ID.
  • mm millimeter
  • ID inner diameter
  • a powder dispensing module utilizing the 2.5 mm ID tubing exhibits more efficient mixing than a powder dispensing module utilizing the 4 mm tubing.
  • FIG. 10 shows an example of response times for altering a powder mixture using the powder dispensing module described herein with respect to FIG. 1.
  • powder mixture ratios were determined using the moving surface described herein with respect to FIG. 1. Since the surface moved at a constant velocity, the position of the powder mixture on the surface is related to the time after which a command to change the powder mixture composition is receive.
  • the images described herein with respect to FIG. 6 can thus serve as a measurement of the response time required for the powder mixture composition to change in response to a command.
  • Response times for a variety of powder dispensing systems using single or dual nozzles, a variety of tubing lengths, and a variety of tubing IDs). In each case, the powder mixture started with a composition having 0% Cu and ended with a composition having 100% Cu.
  • Embodiment 1 A system for performing an additive manufacturing process, the system comprising: a sensing module configured to detect a condition of a powder mixture dispensed by a powder dispensing module; and a controller configured to: receive a signal from the sensing module; monitor the condition of the powder mixture based upon the signal; and to output a command to an additive manufacturing system to perform the additive manufacturing process using the powder dispensing module.
  • Embodiment 2 The system of Embodiment 1, wherein the condition comprises a composition of the powder mixture.
  • Embodiment 3 The system of Embodiment 1 or 2, wherein the sensing module is configured to output the signal to the controller based upon the condition.
  • Embodiment 4 The system of any one of Embodiments 1-3, wherein the sensing module is selected from the group consisting of: an optical sensing module, an optical imaging sensing module, a color imaging sensing module, an optical scattering sensing module, an optical spectroscopy sensing module, an infrared (IR) spectroscopy sensing module, a Fourier transform IR (FTIR) spectroscopy sensing module, a fluorescence spectroscopy sensing module, and a Raman spectroscopy sensing module.
  • the sensing module is selected from the group consisting of: an optical sensing module, an optical imaging sensing module, a color imaging sensing module, an optical scattering sensing module, an optical spectroscopy sensing module, an infrared (IR) spectroscopy sensing module, a Fourier transform IR (FTIR) spectroscopy sensing module, a fluorescence spectroscopy sensing module, and a Raman spectroscopy sensing module.
  • Embodiment 5 The system of Embodiment 4, wherein the signal comprises at least one signal selected from the group consisting of: an optical signal, an optical imaging signal, a color imaging signal, an optical scattering signal, an optical spectroscopy signal, an IR spectroscopy signal, an FTIR spectroscopy signal, a fluorescence spectroscopy signal, and a Raman spectroscopy signal.
  • the signal comprises at least one signal selected from the group consisting of: an optical signal, an optical imaging signal, a color imaging signal, an optical scattering signal, an optical spectroscopy signal, an IR spectroscopy signal, an FTIR spectroscopy signal, a fluorescence spectroscopy signal, and a Raman spectroscopy signal.
  • Embodiment 6 The system of any one of Embodiments 1-5, wherein the sensing module is configured to detect the signal as the powder mixture is prepared within the powder dispensing module.
  • Embodiment 7 The system of any one of Embodiments 1-5, wherein the sensing module is configured to detect the signal as the powder mixture is dispensed by the powder dispensing module.
  • Embodiment 8 The system of any one of Embodiments 1-5, wherein the sensing module is configured to detect the signal after the powder mixture has been dispensed by the powder dispensing module.
  • Embodiment 9 The system of Embodiment 8, wherein the sensing module is configured to detect the signal from a surface to which the powder mixture has been dispensed by the powder dispensing module.
  • Embodiment 10 The system of any one of Embodiments 1-9, wherein the powder mixture comprises at least one metal powder, ceramic powder, plastic powder, or organic powder.
  • Embodiment 11 The system of Embodiment 10, wherein the powder mixture comprises a mixture of at least a first metal, ceramic, plastic, or organic material and a second metal, ceramic, plastic, or organic material that is different from the first metal, ceramic, plastic, or organic material.
  • Embodiment 12 The system of Embodiment 11, wherein the signal is indicative of a ratio of the first metal, ceramic, plastic, or organic material to the second metal, ceramic, plastic, or organic material.
  • Embodiment 13 The system of any one of Embodiments 1-12, further comprising the powder dispensing module.
  • Embodiment 14 The system of Embodiment 13, wherein the powder dispensing module comprises: a plurality of powder feeders, each powder feeder configured to contain a powder of a plurality of powders; a powder mixing chamber configured to receive the plurality of powders from the plurality of powder feeders and to mix the plurality of powders to thereby form the powder mixture; and a powder dispensing nozzle configured to receive the powder mixture from the powder mixing chamber and to dispense the powder mixture.
  • Embodiment 15 The system of Embodiment 14, further comprising a plurality of flow controllers, each flow controller coupled to a powder feeder of the plurality of powder feeders and to the powder mixing chamber, each flow controller configured to control a flow rate of a powder of the plurality of powders from the corresponding powder feeder to the powder mixing chamber.
  • Embodiment 16 The system of Embodiment 15, wherein the controller is configured to alter the condition of the powder mixture based upon the signal.
  • Embodiment 17 The system of Embodiment 16, wherein the controller is configured to alter the composition of the powder mixture based upon the signal.
  • Embodiment 18 The system of Embodiment 17, wherein the controller is configured to alter the composition of the powder mixture by altering at least one flow rate associated with at least one flow controller of the plurality of flow controllers.
  • Embodiment 19 A method for performing an additive manufacturing process, the method comprising: detecting a signal indicative of a condition of a powder mixture prepared and dispensed by a powder dispensing module; monitoring the condition of the powder mixture based upon the signal; and performing an additive manufacturing process using the powder dispensing module.
  • Embodiment 20 The method of Embodiment 19, wherein the condition comprises a composition of the powder mixture.
  • Embodiment 21 The method of Embodiment 19 or 20, wherein the signal comprises at least one signal selected from the group consisting of: an optical signal, an optical imaging signal, a color imaging signal, an optical scattering signal, an optical spectroscopy signal, an IR spectroscopy signal, an FTIR spectroscopy signal, a fluorescence spectroscopy signal, and a Raman spectroscopy signal.
  • the signal comprises at least one signal selected from the group consisting of: an optical signal, an optical imaging signal, a color imaging signal, an optical scattering signal, an optical spectroscopy signal, an IR spectroscopy signal, an FTIR spectroscopy signal, a fluorescence spectroscopy signal, and a Raman spectroscopy signal.
  • Embodiment 22 The method of any one of Embodiments 19-21, wherein the signal is detected as the powder mixture is prepared within the powder dispensing module.
  • Embodiment 23 The method of any one of Embodiments 19-21, wherein the signal is detected as the powder mixture is dispensed by the powder dispensing module.
  • Embodiment 24 The method of any one of Embodiments 19-21, wherein the signal is detected after the powder mixture has been dispensed by the powder dispensing module.
  • Embodiment 25 The method of Embodiment 24, wherein the signal is detected from a surface to which the powder mixture has been dispensed by the powder dispensing module.
  • Embodiment 26 The method of any one of Embodiments 19-25, wherein the powder mixture comprises at least one metal powder, ceramic powder, plastic powder, or organic powder.
  • Embodiment 27 The method of Embodiment 26, wherein the powder mixture comprises a mixture of at least a first metal, ceramic, plastic, or organic material and a second metal, ceramic, plastic, or organic material that is different from the first metal ceramic, plastic, or organic material.
  • Embodiment 28 The method of Embodiment 27, wherein the signal is indicative of a ratio of the first metal, ceramic, plastic, or organic material to the second metal, ceramic, plastic, or organic material.
  • Embodiment 29 The method of any one of Embodiments 19-28, wherein the powder dispensing module comprises: a plurality of powder feeders, each powder feeder configured to contain a powder of a plurality of powders; a powder mixing chamber configured to receive the plurality of powders from the plurality of powder feeders and to mix the plurality of powders to thereby form the powder mixture; and a powder dispensing nozzle configured to receive the powder mixture from the powder mixing chamber and to dispense the powder mixture.
  • Embodiment 30 The method of Embodiment 29, wherein the powder dispensing module further comprises a plurality of flow controllers, each flow controller coupled to a powder feeder of the plurality of powder feeders and to the powder mixing chamber, each flow controller configured to control a flow rate of a powder of the plurality of powders from the powder feeder to the powder mixing chamber.
  • Embodiment 31 The method of Embodiment 30, further comprising altering the condition of the powder mixture based upon the signal.
  • Embodiment 32 The method of Embodiment 31 , further comprising altering the composition of the powder mixture based upon the signal.
  • Embodiment 33 The method of Embodiment 32, further comprising altering the composition of the powder mixture by altering at least one flow rate associated with at least one flow controller of the plurality of flow controllers.

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
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Abstract

Le problème de détermination de la composition ou de l'homogénéité de mélanges de poudres, ou de détermination du temps de réponse requis pour modifier les mélanges de poudres, est adressé par des systèmes et des procédés de surveillance ou de modification de la composition de mélanges de poudres dans des procédés d'impression 3D. Les systèmes et les procédés utilisent généralement un module de détection pour détecter un signal indiquant une composition d'un mélange de poudre qui est préparé et distribué par un module de distribution de poudre. Un dispositif de commande reçoit ensuite le signal provenant du module de détection et surveille la composition du mélange de poudres sur la base du signal. Dans certains cas, le dispositif de commande modifie la composition du mélange de poudres sur la base du signal.
PCT/US2023/029436 2022-08-05 2023-08-03 Systèmes et procédés de mélange de poudres dans des processus de fabrication additive WO2024030579A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190184641A1 (en) * 2017-07-28 2019-06-20 Hewlett-Packard Development Company, L.P. Three-dimensional printer with feeders
US20190315064A1 (en) * 2016-11-02 2019-10-17 Aurora Labs Limited 3D Printing Method and Apparatus
US20210053294A1 (en) * 2018-09-26 2021-02-25 Hewlett-Packard Development Company, L.P. Mix of build materials
US20210354397A1 (en) * 2020-05-13 2021-11-18 The Boeing Company System and method for additively manufacturing an object

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190315064A1 (en) * 2016-11-02 2019-10-17 Aurora Labs Limited 3D Printing Method and Apparatus
US20190184641A1 (en) * 2017-07-28 2019-06-20 Hewlett-Packard Development Company, L.P. Three-dimensional printer with feeders
US20210053294A1 (en) * 2018-09-26 2021-02-25 Hewlett-Packard Development Company, L.P. Mix of build materials
US20210354397A1 (en) * 2020-05-13 2021-11-18 The Boeing Company System and method for additively manufacturing an object

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