WO2024016701A1

WO2024016701A1 - Precision water jet guided laser cutter head

Info

Publication number: WO2024016701A1
Application number: PCT/CN2023/082880
Authority: WO
Inventors: 蒋习锋; 倪善才
Original assignee: 济南金威刻激光科技股份有限公司
Priority date: 2022-07-18
Filing date: 2023-03-21
Publication date: 2024-01-25
Also published as: CN115213571A; AU2023219871B2; AU2023219871A1

Abstract

A precision water jet guided laser cutter head (1), having a surface thereof provided with a placement recess (2). A connection plate (3) is slidably connected to the inner wall of the placement recess (2); the inside of the connection plate (3) is provided with slots (12); fixing plates (13) are slidably connected to the inner walls of the slots (12); the surface of each fixing plate (13) is slidably sleeved with a second spring (14); two ends of the second spring (14) are respectively fixedly connected to the surface of the fixing plate (13) and the inner wall of the slot (12); the inside of the precision water jet guided laser cutter head (1) is provided with fixing grooves (15); the surfaces of the fixing plates (13) are slidably fastened on the inner walls of the fixing grooves (15); rolling balls (16) are rotatably connected to the surfaces of the fixing plates (13); an adjustment column (17) is rotatably connected to the inside of the connection plate (3). By means of the connection between the device and the connection plate, the operation modes of separation and connection between the connection plate and the precision water jet guided laser cutter head are simplified, and the operation efficiency of disassembling and fixing between the connection plate and the precision water jet guided laser cutter head is greatly improved, thereby ensuring the processing efficiency of replacing a wafer on the precision water jet guided laser cutter head.

Description

A water-guided laser precision cutting head

The present invention claims the priority of the Chinese patent application submitted to the China Patent Office on July 18, 2022, with the application number 202210842593.0 and the invention name "A water-guided laser precision cutting head", the entire content of which is incorporated into the present invention by reference. middle.

Technical field

The invention relates to the technical field of water-guided laser cutting heads, and in particular to a water-guided laser precision cutting head.

Background technique

Water-guided laser focuses the laser and then introduces it into the micro-water column. Using the principle of total reflection at the interface between the micro-water column and the air, the laser will be transmitted along the water column, and the product to be processed will be processed within the range where the water column remains stable, so that The heat generated by the accumulation and conduction of laser energy is taken away by water, which can avoid thermal damage and burning of the laser around the cutting path of the product, thus making the cutting path clear.

After consulting the literature, it is known that for most of the existing water-guided laser cutting machines, the water-guided laser precision cutting head basically meets the efficiency of precision instrument processing operations during use. However, for the water-guided laser precision cutting head During use, it is usually necessary to regularly replace the wafer inside the water-guided laser precision cutting head. Most of the existing chip placement frames are usually fixed with multi-point bolts when docking with the water-guided laser precision cutting head. When the operator replaces the wafer, the operator needs to use tools to disassemble and fix the bolts. This method is not only cumbersome and complicated to operate, but also reduces the efficiency of wafer replacement to a certain extent, thereby reducing the use of water-guided laser precision cutting heads. issues such as efficiency.

Contents of the invention

The purpose of the present invention is to at least solve one of the technical problems existing in the prior art, and provide a water-guided laser precision cutting head that can solve the problem when the wafer placement frame is docked with the water-guided laser precision cutting head. Multi-point bolts are usually used for fixation, and when the operator replaces the wafer, the operator needs to use tools to disassemble and fix the bolts. This method is not only cumbersome and complicated in operation, but also reduces the efficiency of wafer replacement to a certain extent. , thereby reducing the efficiency of the water-guided laser precision cutting head.

In order to achieve the above object, the present invention provides the following technical solution: a water-guided laser precision cutting head, including a water-guided laser precision cutting head. The surface of the water-guided laser precision cutting head is provided with a placement groove, and the inner wall of the placement groove is slidingly connected. There is a docking plate, and a slot is provided on the inside of the docking plate. A fixed plate is slidably connected to the inner wall of the slot. A second spring is slidably connected to the surface of the fixed plate. Both ends of the second spring are fixedly connected to the surface of the fixed plate and the fixed plate. There is a fixing groove on the inner wall of the slot, and the inside of the water-guided laser precision cutting head. The surface of the fixing plate is slidingly connected to the inner wall of the fixing slot. The surface of the fixing plate is connected with a rolling ball, and the inner side of the docking plate is connected with an adjusting column. .

Preferably, a placement frame is fixedly connected to the surface of the docking plate, and the shape of the inside of the placement frame is a concave shape.

Preferably, a wafer is arranged inside the placement frame, and a positioning ring is slidably connected to the inside of the placement frame, and the positioning ring is located on the upper side of the wafer.

Preferably, a positioning plate is fixedly connected to the surface of the positioning ring, a chute is provided on the surface of the positioning plate, a clamping plate is slidingly connected to the inner wall of the chute, a first spring is fixedly connected to the surface of the clamping plate, and the first spring is away from the clamping plate. One end of the plate is fixedly connected to the inner wall of the chute.

Preferably, a docking groove is provided on the surface of the placement frame, and the docking groove is L-shaped.

Preferably, the surface of the positioning plate is slidingly connected to the inner wall of the docking groove, a clamping slot is provided on the inside of the placement frame, and the surface of the clamping plate is slidably connected to the inner wall of the clamping slot.

Preferably, the shape of the adjusting post is an arc shape.

Preferably, the surface of the adjustment column is fixedly sleeved with a torsion spring, and the surface of the torsion spring is fixedly connected to the inside of the docking plate.

Compared with the prior art, the beneficial effects of the present invention are:

(1) For this water-guided laser precision cutting head, when the operator releases the adjusting column, the adjusting column is driven to reset by the torsion force of the torsion spring, and the adjusting column pushes the rolling ball in the groove to the arc surface and then fixes it. The plate is pushed by the adjusting column and slides out from the inside of the docking plate into the inner wall of the fixing groove. This method improves the tediousness of traditional chip replacement, which requires the operator to disassemble and fix the bolts on the docking plate at multiple points. This device connects the water-guided laser precision cutting head to the docking plate, which not only simplifies the separation and docking operations between the docking plate and the water-guided laser precision cutting head, but also greatly improves the efficiency of the docking plate and the water-guided laser precision cutting head. The operational efficiency of disassembling and fixing the heads ensures the processing efficiency of replacing the wafers on the water-guided laser precision cutting head.

(2) When the water guide laser precision cutting head drives the positioning plate into the inner wall of the docking groove through the positioning ring, the placing frame will squeeze the clamping plate into the inner wall of the chute until the positioning ring drives the positioning plate to the inner wall of the docking groove. After the inner wall rotates to the predetermined position, the clamping plate matches the slot, and the clamping plate is pushed into the inner wall of the slot by the elasticity of the compressed first spring. This method ensures that the positioning ring clamps the wafer. It can form a convenient fixation during positioning, thereby reducing the difficulty of quickly forming a stable clamping effect on the wafer when the traditional wafer is directly placed inside the placement frame and then clamped through the positioning ring, thus improving the stability of the wafer inside the placement frame. To ensure the stability of clamping placement.

(3) This water-guided laser precision cutting head, by utilizing the concave shape of the placement frame, can have a good limiting effect when the wafer is placed inside the placement frame, thereby making it convenient for the positioning ring to position and clamp the wafer. sex.

(4) When the water guide laser precision cutting head is docked with the inner wall of the docking groove through the positioning plate on the positioning ring, the L-shape of the docking groove can make the positioning ring pass through the positioning plate to form a good limiting effect. This ensures that when the positioning ring is rotated and adjusted inside the placement frame to fix the wafer, the L-shape of the docking groove can be used to achieve compact positioning and clamping between the positioning ring and the wafer.

(5) This water-guided laser precision cutting head sets a rotating rolling ball on the surface of the fixed plate. When the adjusting column adjusts the position of the fixed plate, the fixed plate can be lowered by the rolling ball on the surface of the fixed plate. The friction resistance caused by the direct contact between the plate and the adjusting column, and the increase in the distance between the fixed plate and the adjusting column The adjusting column has a smooth sliding effect when adjusting.

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings and examples:

Figure 1 is a schematic structural diagram of a water-guided laser precision cutting head of the present invention;

Figure 2 is a schematic structural diagram of the placement frame of the present invention;

Figure 3 is a schematic plan view of a water-guided laser precision cutting head of the present invention;

Figure 4 is a schematic structural diagram of the placement frame of the present invention;

Figure 5 is a schematic diagram of the planar structure of the adjusting column of the present invention.

Reference signs: 1 water guide laser precision cutting head, 2 placement slot, 3 docking plate, 4 placement frame, 5 chip, 6 positioning ring, 7 positioning plate, 8 chute, 9 clamping plate, 10 first spring, 11 docking slot, 12 card slot, 13 fixed plate, 14 second spring, 15 fixed slot, 16 rolling ball, 17 adjusting column, 18 torsion spring.

Detailed ways

This section will describe the specific embodiments of the present invention in detail. The preferred embodiments of the present invention are shown in the accompanying drawings. The function of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand the present invention. Each technical feature and overall technical solution of the invention shall not be construed as limiting the scope of protection of the invention.

In the description of the present invention, it should be understood that orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or position relationships shown in the drawings and are only In order to facilitate the description of the present invention and simplify the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In the description of the present invention, greater than, less than, more than, etc. are understood to exclude the original number, and above, below, within, etc. are understood to include the original number. If there is a description of first and second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the order of indicated technical features. relation.

In the description of the present invention, unless otherwise explicitly limited, words such as setting, installation, and connection should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meaning of the above words in the present invention in combination with the specific content of the technical solution.

Please refer to Figures 1-5. The present invention provides a technical solution: a water-guided laser precision cutting head, including a water-guided laser precision cutting head 1. The surface of the water-guided laser precision cutting head 1 is provided with a placement groove 2. The placement groove A docking plate 3 is slidably connected to the inner wall of 2, and a placement frame 4 is fixedly connected to the surface of the docking plate 3. The shape of the inside of the placement frame 4 is a concave shape. A chip 5 is provided on the inside of the placement frame 4, and the inside of the placement frame 4 is slidably connected. There is a positioning ring 6. The positioning ring 6 is located on the upper side of the wafer 5. The surface of the positioning ring 6 is fixedly connected with a positioning plate 7. The surface of the positioning plate 7 is provided with a chute 8. The inner wall of the chute 8 is slidingly connected with a clamping plate 9. A first spring 10 is fixedly connected to the surface of the clamping plate 9. One end of the first spring 10 away from the clamping plate 9 is fixedly connected to the inner wall of the chute 8. A docking slot 11 is provided on the surface of the placement frame 4. The docking slot 11 is in the shape of L. shape, the surface of the positioning plate 7 is slidably connected to the inner wall of the docking groove 11, and a slot 12 is provided on the inside of the placing frame 4. The surface of the clamping plate 9 is slidably connected to the inner wall of the slot 12. shape, the wafer 5 can have a good limiting effect when placed inside the placing frame 4, thereby facilitating the convenience of positioning and clamping the wafer 5 by the positioning ring 6.

Furthermore, when the positioning plate 7 on the positioning ring 6 is docked with the inner wall of the docking groove 11, the L-shape of the docking groove 11 can make the positioning ring 6 pass through the positioning plate 7 to form a good limiting effect, thereby ensuring the positioning. When the ring 6 is rotated and adjusted inside the placement frame 4 to fix the wafer 5 , the L-shape of the docking groove 11 can be used to achieve compact positioning and clamping between the positioning ring 6 and the wafer 5 .

Further, when the positioning ring 6 drives the positioning plate 7 into the inner wall of the docking groove 11, the placement frame 4 presses the clamping plate 9 into the inner wall of the chute 8 until the positioning ring 6 drives the positioning plate 7 to enter the inner wall of the docking groove 11. After the inner wall rotates to a predetermined position, the clamping plate 9 matches the clamping slot 12, and the clamping plate 9 is pushed into the inner wall of the clamping slot 12 by the elasticity of the compressed first spring 10. This way ensures the positioning ring. 6. When clamping and positioning the wafer 5, it can form a convenient fixation, thereby reducing the need for traditional wafer 5 to be placed directly inside the placement frame 4 and then placed and clamped through the positioning ring 6. It can quickly form a stable clamping effect on the wafer 5, thereby improving the stability of clamping and placing the wafer 5 inside the placement frame 4.

Further, a slot 12 is provided on the inside of the docking plate 3. The inner wall of the slot 12 is slidably connected to a fixed plate 13. The surface of the fixed plate 13 is slidably sleeved with a second spring 14. Both ends of the second spring 14 are fixedly connected respectively. On the surface of the fixing plate 13 and the inner wall of the slot 12, a fixing slot 15 is provided on the inside of the water-guided laser precision cutting head 1. The surface of the fixing plate 13 is slidably engaged with the inner wall of the fixing slot 15, and the surface of the fixing plate 13 is rotationally connected. There is a rolling ball 16, and an adjusting column 17 is rotatably connected to the inner side of the docking plate 3. The shape of the adjusting column 17 is an arc shape. A torsion spring 18 is fixedly connected to the surface of the adjusting column 17, and the surface of the torsion spring 18 is fixedly connected to the docking plate 3. When the operator replaces the wafer 5, when the operator controls the adjustment column 17 to rotate on the inside of the docking plate 3, the adjustment column 17 drives the torsion spring 18 to twist. At this time, the adjustment column 17 moves the surface The contacting roller ball 16 enters the concave arc surface through the arc surface. At this time, the adjusting column 17 gradually no longer squeezes the fixed plate 13, and the fixed plate 13 is driven by the tension of the second spring 14. Reset, and then the fixing plate 13 slides out from the inner wall of the fixing groove 15. At this time, the operator pulls out the placing frame 4 on the docking plate 3 from the inside of the water-guided laser precision cutting head 1 and replaces the wafer 5. At this time, the wafer 5 is replaced. The docking plate 3 and the placing frame 4 are butted on the inner wall of the placing groove 2, and then the operator releases the adjusting column 17, and the adjusting column 17 is driven to reset by the torsion force of the torsion spring 18, and the adjusting column 17 moves the roller in the groove. The ball 16 is pushed to the arc surface, and then the fixing plate 13 is pushed by the adjusting column 17 and slides out from the inside of the docking plate 3 into the inner wall of the fixing groove 15. This method improves the traditional wafer 5 replacement that requires the operator to adjust the docking plate 3 before and after. The multi-point disassembly and fixation of bolts is cumbersome, and then the water-guided laser precision cutting head 1 and the docking plate 3 are connected through this device, which not only simplifies the separation between the docking plate 3 and the water-guided laser precision cutting head 1 The docking operation method also greatly improves the operating efficiency of disassembly and fixation between the docking plate 3 and the water-guided laser precision cutting head 1, thereby ensuring that the wafer 5 on the water-guided laser precision cutting head 1 can be replaced. Processing efficiency.

Further, by arranging a rotating rolling ball 16 on the surface of the fixed plate 13, when adjusting When the segment column 17 adjusts the position of the fixed plate 13, the frictional resistance caused by the direct contact between the fixed plate 13 and the adjusting column 17 can be reduced by the rolling ball 16 on the surface of the fixed plate 13, and the cooperation between the fixed plate 13 and the adjusting column 17 can be improved. It has a smooth sliding effect when adjusting.

Working principle: A water-guided laser precision cutting head drives the positioning plate 7 into the inner wall of the docking groove 11 through the positioning ring 6. At this time, the placing frame 4 squeezes the clamping plate 9 into the inner wall of the chute 8 until the positioning ring 6 After the positioning plate 7 is driven to rotate to a predetermined position on the inner wall of the docking groove 11, the clamping plate 9 matches the clamping slot 12, and the clamping plate 9 is pushed into the inner wall of the clamping slot 12 by the elasticity of the compressed first spring 10. When the operator replaces the wafer 5, when the operator controls the adjusting column 17 to rotate inside the docking plate 3, the adjusting column 17 drives the torsion spring 18 to twist. At this time, the adjusting column 17 makes the surface contact The rolling ball 16 enters the concave arc surface through the arc surface. At this time, the adjusting column 17 gradually no longer squeezes the fixed plate 13, and the fixed plate 13 is reset by the tension of the second spring 14. Then the fixing plate 13 slides out from the inner wall of the fixing groove 15. At this time, the operator pulls out the placement frame 4 on the docking plate 3 from the inside of the water-guided laser precision cutting head 1 and replaces the wafer 5, and then docks again. The plate 3 and the placing frame 4 are butted on the inner wall of the placing groove 2, and then the operator releases the adjusting column 17, and the adjusting column 17 is driven to reset by the torsion force of the torsion spring 18, and the adjusting column 17 moves the rolling ball 16 in the groove. Pushed to the arc surface, the fixing plate 13 is pushed by the adjusting column 17 to slide out of the inside of the docking plate 3 and into the inner wall of the fixing groove 15 .

The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the technical field, various modifications can be made without departing from the purpose of the present invention. kind of change.

Claims

A water-guided laser precision cutting head, including a water-guided laser precision cutting head (1), characterized in that: the surface of the water-guided laser precision cutting head (1) is provided with a placement groove (2), and the placement groove (2) A docking plate (3) is slidably connected to the inner wall of the docking plate (3), a slot (12) is provided on the inside of the docking plate (3), a fixing plate (13) is slidably connected to the inner wall of the slot (12), and the surface of the fixing plate (13) slides A second spring (14) is sleeved, and both ends of the second spring (14) are fixedly connected to the surface of the fixing plate (13) and the inner wall of the slot (12), and the inner side of the water-guided laser precision cutting head (1) A fixing slot (15) is provided, and the surface of the fixing plate (13) is slidably engaged with the inner wall of the fixing slot (15). A rolling ball (16) is rotatably connected to the surface of the fixing plate (13), and the inner side of the docking plate (3) An adjusting column (17) is rotatably connected.
A water-guided laser precision cutting head according to claim 1, characterized in that: a placement frame (4) is fixedly connected to the surface of the docking plate (3), and the shape of the inside of the placement frame (4) is a concave shape. .
A water-guided laser precision cutting head according to claim 2, characterized in that: a wafer (5) is provided inside the placement frame (4), and a positioning ring (6) is slidably connected to the inside of the placement frame (4). ), the positioning ring (6) is located on the upper side of the wafer (5).
A water-guided laser precision cutting head according to claim 3, characterized in that: a positioning plate (7) is fixedly connected to the surface of the positioning ring (6), and a chute (7) is provided on the surface of the positioning plate (7). 8), the inner wall of the chute (8) is slidingly connected with a clamping plate (9), the surface of the clamping plate (9) is fixedly connected with a first spring (10), and the first spring (10) is away from one end of the clamping plate (9) Fixedly connected to the inner wall of the chute (8).
A water-guided laser precision cutting head according to claim 3, characterized in that: a docking groove (11) is provided on the surface of the placement frame (4), and the docking groove (11) is L-shaped.
A water-guided laser precision cutting head according to claim 5, characterized in that: the surface of the positioning plate (7) is slidingly connected to the inner wall of the docking groove (11), and a clamp is provided on the inside of the placement frame (4). slot (12), and the surface of the clamping plate (9) is slidably clamped on the inner wall of the clamping slot (12).
A water guide laser precision cutting head according to claim 1, characterized in that: The shape of the adjusting column (17) is an arc shape.
A water-guiding laser precision cutting head according to claim 7, characterized in that: the surface of the adjustment column (17) is fixedly connected to a torsion spring (18), and the surface of the torsion spring (18) is fixedly connected to the butt joint. inside of plate (3).