WO2024007185A1 - Procédé d'imagerie avec positionnement magnétique d'une source de rayonnement - Google Patents

Procédé d'imagerie avec positionnement magnétique d'une source de rayonnement Download PDF

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Publication number
WO2024007185A1
WO2024007185A1 PCT/CN2022/104067 CN2022104067W WO2024007185A1 WO 2024007185 A1 WO2024007185 A1 WO 2024007185A1 CN 2022104067 W CN2022104067 W CN 2022104067W WO 2024007185 A1 WO2024007185 A1 WO 2024007185A1
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Prior art keywords
radiation
source
image sensor
radiation source
scene
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PCT/CN2022/104067
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English (en)
Inventor
Peiyan CAO
Yurun LIU
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Shenzhen Xpectvision Technology Co., Ltd.
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Priority to PCT/CN2022/104067 priority Critical patent/WO2024007185A1/fr
Publication of WO2024007185A1 publication Critical patent/WO2024007185A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
    • A61B6/44—Constructional features of apparatus for radiation diagnosis
    • A61B6/4429—Constructional features of apparatus for radiation diagnosis related to the mounting of source units and detector units
    • A61B6/4452—Constructional features of apparatus for radiation diagnosis related to the mounting of source units and detector units the source unit and the detector unit being able to move relative to each other
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
    • A61B6/42—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment with arrangements for detecting radiation specially adapted for radiation diagnosis
    • A61B6/4208—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment with arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
    • A61B6/4233—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment with arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using matrix detectors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
    • A61B6/44—Constructional features of apparatus for radiation diagnosis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/24—Measuring radiation intensity with semiconductor detectors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
    • A61B6/52—Devices using data or image processing specially adapted for radiation diagnosis
    • A61B6/5211—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data
    • A61B6/5229—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data combining image data of a patient, e.g. combining a functional image with an anatomical image
    • A61B6/5235—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data combining image data of a patient, e.g. combining a functional image with an anatomical image combining images from the same or different ionising radiation imaging techniques, e.g. PET and CT
    • A61B6/5241—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data combining image data of a patient, e.g. combining a functional image with an anatomical image combining images from the same or different ionising radiation imaging techniques, e.g. PET and CT combining overlapping images of the same imaging modality, e.g. by stitching

Definitions

  • An image sensor or imaging sensor is a sensor that can detect a spatial intensity distribution of a radiation.
  • Radiation imaging is a radiography technique and can be used to reveal the internal structure of a non-uniformly composed and opaque object such as the human body.
  • An image sensor usually represents the detected image by electrical signals.
  • a semiconductor image sensor may include semiconductor radiation detectors that absorb radiation in wavelengths of interest. When a radiation particle is absorbed in the semiconductor radiation detector, multiple charge carriers (e.g., electrons and holes) are generated and swept under an electric field towards electrical contacts on the semiconductor radiation detectors.
  • Image sensors based on semiconductor devices may be classified into several types, including semiconductor charge-coupled devices (CCD) , complementary metal-oxide-semiconductor (CMOS) , N-type metal-oxide-semiconductor (NMOS) .
  • CCD semiconductor charge-coupled devices
  • CMOS complementary metal-oxide-semiconductor
  • NMOS N-type metal-oxide-semiconductor
  • CMOS complementary metal-oxide-semiconductor
  • NMOS N-type metal-oxide-semiconductor
  • a method comprising: positioning an image sensor to a first sensor position relative to a scene; while the image sensor is at the first sensor position, moving a radiation source along a track to a plurality of source positions and capturing a first set of partial images of the scene with the image sensor respectively using radiation from the radiation source when the radiation source is at the plurality of source positions, wherein the track comprises electromagnets configured to magnetically attract the radiation source to the plurality of source positions; moving the image sensor to a second sensor position relative to the scene along a first direction; while the image sensor is at the second sensor position, moving the radiation source along the track to the plurality of source positions and capturing a second set of partial images of the scene with the image sensor respectively using radiation from the radiation source when the radiation source is at the plurality of source positions; for each source position of the plurality of source positions, forming an image of the scene by stitching a partial image of the first set captured when the radiation source is at that each source position and a partial image of the second set captured when the radiation source
  • moving the radiation source to the plurality of source positions along the track comprises generating magnetic energy wells respectively at the plurality of source positions by selectively powering the electromagnets along the track.
  • the radiation source has a component configured to be attracted by the magnetic energy wells.
  • moving the radiation source to the plurality of source positions along the track comprises aligning the radiation source with the magnetic fields generated at the source positions.
  • moving the radiation source to the plurality of source positions along the track comprises sending currents through coils of the electromagnets selectively so that the radiation source is attracted to the each source position by an electromagnetic field generated by the electromagnets.
  • the track with electromagnets is configured to move with the image sensor along the first direction when the image sensor is moving to a second sensor position relative to the scene.
  • the image sensor comprises a plurality of radiation detectors.
  • each of the radiation detectors comprises an array of pixels.
  • the radiation detector is configured to count numbers of particles of radiation incident on the pixels, within a period of time.
  • the radiation is X-ray.
  • Fig. 1A schematically shows a method of imaging a scene by an image sensor using a radiation source at a plurality of source positions, according to an embodiment.
  • Fig. 1B schematically shows a method of moving the radiation source along a track to the plurality of source positions by electromagnets, according to an embodiment.
  • Fig. 1C schematically shows a perspective view of a method of capturing sets of partial images of the scene by the image sensor from a plurality of sensor positions, according to an embodiment.
  • Fig. 2 schematically shows a method of forming an image of the scene by stitching partial images captured when the radiation source is at different source positions and the image sensor is at different sensor positions, according to an embodiment.
  • Fig. 3 schematically shows the image sensor with plurality of radiation detectors that are hexagonal, right trapezoids, or triangle in shapes, according to an embodiment.
  • Fig. 4 schematically shows that the radiation detector has an array of pixels, according to an embodiment.
  • Fig. 5A schematically shows a cross-sectional view of the radiation detector, according to an embodiment.
  • Fig. 5B schematically shows a detailed cross-sectional view of the radiation detector, according to an embodiment.
  • Fig. 5C schematically shows an alternative detailed cross-sectional view of the radiation detector, according to an embodiment.
  • Fig. 6A and Fig. 6B each schematically show a component diagram of an electronic system of the radiation detector in Fig. 5A, Fig. 5B and Fig. 5C, according to an embodiment.
  • Fig. 7 schematically shows a temporal change of the electric current flowing through an electrode (upper curve) of a diode or an electric contact of a resistor of a radiation absorption layer exposed to radiation, the electric current caused by charge carriers generated by a radiation particle incident on the radiation absorption layer, and a corresponding temporal change of the voltage of the electrode (lower curve) , according to an embodiment.
  • Fig. 1A -Fig. 1C schematically show a method of imaging a scene 50 by an image sensor 9000 using a radiation source 500 at a plurality of source positions, according to an embodiment.
  • the radiation source 500 may be moved along a track 405 to a plurality of source positions.
  • the image sensor 9000 may capture a first set 1010 of partial images of the scene 50 respectively using radiation from the radiation source 500 when the radiation source is at the plurality of source positions, e.g. 9181, 9182.
  • Fig. 1A schematically shows a cross-section view of the image sensor 9000 and the radiation source 500 when the image sensor 9000 is positioned at the first sensor position 910 relative to the scene 50, according to an embodiment.
  • the image sensor 9000 may have radiation detectors 100 mounted on a radiation-receiving surface of the image sensor 9000.
  • Fig. 1A schematically shows the radiation source 500 is moved from a first source position 9181 to a second source position 9182 along the track 405, according to an embodiment.
  • the image sensor 9000 may remain at the first sensor position 910 relative to the scene 50 during this movement of the radiation source 500.
  • the track 405 may comprise a plurality of electromagnets, i.e., 400A, 400B, 400C, which may be configured to magnetically attract the radiation source 500 to the plurality of source positions.
  • the radiation from the radiation source 500 may pass through different portions of the scene 50 or pass through the scene 50 from different directions, and be detected by the radiation detectors 100 of the image sensor 9000.
  • a first set 1010 of partial images of portions of the scene 50 may be captured respectively when the radiation source 500 is at the plurality of source positions, while the image sensor 9000 is at the first sensor position 910 relative to the scene 50.
  • the first set 1010 of partial images may comprise a partial image 1011 that the image sensor 9000 captures when the radiation source 500 is at the first source position 9181, and a partial image 1012 the image sensor 9000 captures when the radiation source 500 is at the second source position 9182.
  • Fig. 1B schematically shows examples of moving and positioning the radiation source 500 to the plurality of source positions along the track 405 by selectively powering the electromagnets, according to an embodiment.
  • the radiation source 500 has a component 507 that can interact with the magnetic field generated by the electromagnets.
  • the component may be a permanent magnet or an iron core.
  • the “iron core” does not necessarily include iron but may be a soft magnetic material (e.g., a ferromagnetic material or a ferrimagnetic material) .
  • B-A in Fig.
  • one electromagnet 400A at the source position 9181 may be powered on to generate a magnetic field to attract the component 507 of the radiation source 500 to move to the source position 9181 along the track 405.
  • the radiation source 500 may be moved to the source position 9181 by other means.
  • the radiation source 500 may be positioned at the source position 9181 by aligning the component 507 of the radiation source 500 with the magnetic field generated by the electromagnet 400A located at the source position 9181.
  • the magnetic field may form a magnetic energy well at the source position 9181 for the component 507.
  • the source positions of the radiation source 500 may not be the same as the positions of the electromagnets.
  • the electromagnets 400A and 400B may be both powered on at the same time.
  • a magnetic energy well may be formed in between two electromagnets 400A and 400B along the track 405, by two electromagnetic fields with opposite polarities generated by the electromagnets 400A and 400B.
  • the radiation source 500 positioned at the second source position 9182 may be not at the same positions as the electromagnets 400A and 400B.
  • Fig. 1C schematically shows that image sensor 9000 may move from the first sensor position 910 to a second sensor position 920 relative to the scene 50 along a first direction 905, according to an embodiment.
  • Fig. 1C also shows when the image sensor 9000 is at the first sensor position 910, the radiation source 500 may move along the track 405 to a plurality of source positions.
  • the image sensor 9000 may capture the first set 1010 of partial images of the scene 50 using radiation from the radiation source 500 when the radiation source is at the plurality of source positions (e.g., 9181, 9182, 9183) on the track 405, respectively.
  • the image sensor 9000 and the track 405 may be configured to move collectively along the first direction 905 as the image sensor 9000 moves to the second sensor position 920 relative to the scene 50.
  • the track 405 remains in place when the image sensor 9000 moves to the second sensor position 920 relative to the scene 50.
  • the radiation source 500 may again move along the track 405 to the plurality of source positions.
  • the image sensor 9000 may capture the second set 1020 of partial images of the scene 50 using radiation from the radiation source 500 when the radiation source is at the plurality of source positions (e.g., 9181, 9182, 9183) on the track 405, respectively.
  • Fig. 2 schematically shows capturing images of portions of the scene 50 by the image sensor 9000 from the plurality of sensor positions and the plurality of source positions, according to an embodiment.
  • the image sensor 9000 may move to two sensor positions relative to the scene 50, e.g., the first sensor position 910, and the second sensor position 920. Respectively at the sensor positions 910, 920, the image sensor 9000 may capture a first set 1010 of partial images (including 1011, 1012 and 1013) and a second set 1020 of partial images (including 1021, 1022 and 1023) of portions of the scene 50 when the radiation source 500 moves to the plurality of source positions (e.g., 9181, 9182, 9183) .
  • the plurality of source positions e.g., 9181, 9182, 9183
  • the image sensor 9000 may form an image of the scene 50 by stitching a partial image of the first set captured when the radiation source is at that each source position and a partial image of the second set captured when the radiation source is at that each source position, for example, stitching partial images 1011 and 1021, partial images 1012 and 1022, partial images 1013 and 1023.
  • the image sensor 9000 may stitch the partial images of the first set 1010 and the partial images of the second set 1020 to form an image 1100 of the scene 50. Every portion of the scene 50 may be in at least one of the partial images captured when the image sensor 9000 is at the multiple positions. Namely, the images of the portions when stitched together may cover the entire scene 50.
  • the image sensor 9000 may comprise a plurality of radiation detectors 100. As shown in the example of Fig. 3, the radiation detectors may be provided with any suitable sizes and shapes. Some of the radiation detectors may be rectangular in shape, some of the radiation detectors may be hexagonal or right trapezoids in shapes.
  • the radiation detector 100 may comprise an array of pixels 150.
  • the array may be a rectangular array, a honeycomb array, a hexagonal array or any other suitable array.
  • Each pixel 150 may be configured to detect a radiation particle incident thereon, measure the energy of the radiation particle, or both.
  • each pixel 150 may be configured to count numbers of radiation particles incident thereon whose energy falls in a plurality of bins, within a period of time. All the pixels 150 may be configured to count the numbers of radiation particles incident thereon within a plurality of bins of energy within the same period of time.
  • Each pixel 150 may have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing the energy of an incident radiation particle into a digital signal.
  • ADC analog-to-digital converter
  • the pixels 150 may be configured to operate in parallel. For example, when one pixel 150 measures an incident radiation particle, another pixel 150 may be waiting for another radiation particle to arrive.
  • the pixels 150 may be but do not have to be individually addressable.
  • Fig. 5A schematically shows a cross-sectional view of the radiation detector 100, according to an embodiment.
  • the radiation detector 100 may comprise a radiation absorption layer 110 and an electronics layer 120 (e.g., an ASIC) for processing or analyzing electrical signals incident radiation generates in the radiation absorption layer 110.
  • the radiation detector 100 does not comprise a scintillator.
  • the radiation absorption layer 110 may comprise a semiconductor material such as, silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof.
  • the semiconductor may have a high mass attenuation coefficient for the radiation energy of interest.
  • the surface 103 of the radiation absorption layer 110 distal from the electronics layer 120 is configured to receive radiation from the radiation source 500.
  • the radiation may be X-ray.
  • the radiation absorption layer 110 may include one or more diodes (e.g., p-i-n or p-n) formed by a first doped region 111, one or more discrete regions 114 of a second doped region 113.
  • the second doped region 113 may be separated from the first doped region 111 by an optional the intrinsic region 112.
  • the discrete regions 114 are separated from one another by the first doped region 111 or the intrinsic region 112.
  • the first doped region 111 and the second doped region 113 have opposite types of doping (e.g., region 111 is p-type and region 113 is n-type, or region 111 is n-type and region 113 is p-type) .
  • each of the discrete regions 114 of the second doped region 113 forms a diode with the first doped region 111 and the optional intrinsic region 112.
  • the radiation absorption layer 110 may have a plurality of diodes having the first doped region 111 as a shared electrode.
  • the first doped region 111 may also have discrete portions.
  • the radiation particle When a radiation particle hits the radiation absorption layer 110 including diodes, the radiation particle may be absorbed and generate one or more charge carriers by a number of mechanisms.
  • a radiation particle may generate 10 to 100000 charge carriers.
  • the charge carriers may drift to the electrodes of one of the diodes under an electric field.
  • the field may be an external electric field.
  • the electric contact 119B may include discrete portions each of which is in electrical contact with the discrete regions 114.
  • the charge carriers may drift in directions such that the charge carriers generated by a single radiation particle are not substantially shared by two different discrete regions 114 ( “not substantially shared” here means less than 2%, less than 0.5%, less than 0.1%, or less than 0.01%of these charge carriers flow to a different one of the discrete regions 114 than the rest of the charge carriers) .
  • Charge carriers generated by a radiation particle incident around the footprint of one of these discrete regions 114 are not substantially shared with another of these discrete regions 114.
  • a pixel 150 associated with a discrete region 114 may be an area around the discrete region 114 in which substantially all (more than 98%, more than 99.5%, more than 99.9%, or more than 99.99%of) charge carriers generated by a radiation particle incident therein at an angle of incidence of 0° flow to the discrete region 114. Namely, less than 2%, less than 1%, less than 0.1%, or less than 0.01%of these charge carriers flow beyond the pixel.
  • the radiation absorption layer 110 may include a resistor of a semiconductor material such as, silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof, but does not include a diode.
  • the semiconductor may have a high mass attenuation coefficient for the radiation energy of interest.
  • a radiation particle When a radiation particle hits the radiation absorption layer 110 including a resistor but not diodes, it may be absorbed and generate one or more charge carriers by a number of mechanisms.
  • a radiation particle may generate 10 to 100000 charge carriers.
  • the charge carriers may drift to the electric contacts 119A and 119B under an electric field.
  • the field may be an external electric field.
  • the electric contact 119B includes discrete portions.
  • the charge carriers may drift in directions such that the charge carriers generated by a single radiation particle are not substantially shared by two different discrete portions of the electric contact 119B ( “not substantially shared” here means less than 2%, less than 0.5%, less than 0.1%, or less than 0.01%of these charge carriers flow to a different one of the discrete portions than the rest of the charge carriers) .
  • a pixel 150 associated with a discrete portion of the electric contact 119B may be an area around the discrete portion in which substantially all (more than 98%, more than 99.5%, more than 99.9%or more than 99.99%of) charge carriers generated by a radiation particle incident at an angle of incidence of 0° therein flow to the discrete portion of the electric contact 119B. Namely, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01%of these charge carriers flow beyond the pixel associated with the one discrete portion of the electric contact 119B.
  • the electronics layer 120 may include an electronic system 121 suitable for processing or interpreting signals generated by radiation particles incident on the radiation absorption layer 110.
  • the electronic system 121 may include an analog circuitry such as a filter network, amplifiers, integrators, and comparators, or a digital circuitry such as a microprocessor, and memory.
  • the electronic system 121 may include components shared by the pixels or components dedicated to a single pixel.
  • the electronic system 121 may include an amplifier dedicated to each pixel and a microprocessor shared among all the pixels.
  • the electronic system 121 may be electrically connected to the pixels by vias 131. Space among the vias may be filled with a filler material 130, which may increase the mechanical stability of the connection of the electronics layer 120 to the radiation absorption layer 110. Other bonding techniques are possible to connect the electronic system 121 to the pixels without using vias.
  • Fig. 6A and Fig. 6B each schematically show a component diagram of the electronic system 121, according to an embodiment.
  • the electronic system 121 may include a first voltage comparator 301, a second voltage comparator 302, a counter 320, a switch 305, an optional voltmeter 306 and a controller 310.
  • the first voltage comparator 301 is configured to compare the voltage of at least one of the electric contacts 119B to a first threshold.
  • the first voltage comparator 301 may be configured to monitor the voltage directly, or calculate the voltage by integrating an electric current flowing through the electrical contact 119B over a period of time.
  • the first voltage comparator 301 may be controllably activated or deactivated by the controller 310.
  • the first voltage comparator 301 may be a continuous comparator. Namely, the first voltage comparator 301 may be configured to be activated continuously and monitor the voltage continuously.
  • the first voltage comparator 301 may be a clocked comparator.
  • the first threshold may be 5-10%, 10%-20%, 20-30%, 30-40%or 40-50%of the maximum voltage one incident particle of radiation may generate on the electric contact 119B.
  • the maximum voltage may depend on the energy of the incident particle of radiation, the material of the radiation absorption layer 110, and other factors.
  • the first threshold may be 50 mV, 100 mV, 150 mV, or 200 mV.
  • the second voltage comparator 302 is configured to compare the voltage to a second threshold.
  • the second voltage comparator 302 may be configured to monitor the voltage directly or calculate the voltage by integrating an electric current flowing through the diode or the electrical contact over a period of time.
  • the second voltage comparator 302 may be a continuous comparator.
  • the second voltage comparator 302 may be controllably activate or deactivated by the controller 310. When the second voltage comparator 302 is deactivated, the power consumption of the second voltage comparator 302 may be less than 1%, less than 5%, less than 10%or less than 20%of the power consumption when the second voltage comparator 302 is activated.
  • the absolute value of the second threshold is greater than the absolute value of the first threshold.
  • of a real number x is the non-negative value of x without regard to its sign.
  • the second threshold may be 200%-300%of the first threshold.
  • the second threshold may be at least 50%of the maximum voltage one incident particle of radiation may generate on the electric contact 119B.
  • the second threshold may be 100 mV, 150 mV, 200 mV, 250 mV or 300 mV.
  • the second voltage comparator 302 and the first voltage comparator 301 may be the same component.
  • the system 121 may have one voltage comparator that can compare a voltage with two different thresholds at different times.
  • the first voltage comparator 301 or the second voltage comparator 302 may include one or more op-amps or any other suitable circuitry.
  • the first voltage comparator 301 or the second voltage comparator 302 may have a high speed to allow the electronic system 121 to operate under a high flux of incident particles of radiation. However, having a high speed is often at the cost of power consumption.
  • the counter 320 is configured to register at least a number of particles of radiation incident on the pixel 150 encompassing the electric contact 119B.
  • the counter 320 may be a software component (e.g., a number stored in a computer memory) or a hardware component (e.g., a 4017 IC and a 7490 IC) .
  • the controller 310 may be a hardware component such as a microcontroller and a microprocessor.
  • the controller 310 is configured to start a time delay from a time at which the first voltage comparator 301 determines that the absolute value of the voltage equals or exceeds the absolute value of the first threshold (e.g., the absolute value of the voltage increases from below the absolute value of the first threshold to a value equal to or above the absolute value of the first threshold) .
  • the absolute value is used here because the voltage may be negative or positive, depending on whether the voltage of the cathode or the anode of the diode or which electrical contact is used.
  • the controller 310 may be configured to keep deactivated the second voltage comparator 302, the counter 320 and any other circuits the operation of the first voltage comparator 301 does not require, before the time at which the first voltage comparator 301 determines that the absolute value of the voltage equals or exceeds the absolute value of the first threshold.
  • the time delay may expire before or after the voltage becomes stable, i.e., the rate of change of the voltage is substantially zero.
  • the phase “the rate of change of the voltage is substantially zero” means that temporal change of the voltage is less than 0.1%/ns.
  • the phase “the rate of change of the voltage is substantially non-zero” means that temporal change of the voltage is at least 0.1%/ns.
  • the controller 310 may be configured to activate the second voltage comparator during (including the beginning and the expiration) the time delay. In an embodiment, the controller 310 is configured to activate the second voltage comparator at the beginning of the time delay.
  • the term “activate” means causing the component to enter an operational state (e.g., by sending a signal such as a voltage pulse or a logic level, by providing power, etc. ) .
  • the term “deactivate” means causing the component to enter a non-operational state (e.g., by sending a signal such as a voltage pulse or a logic level, by cut off power, etc. ) .
  • the operational state may have higher power consumption (e.g., 10 times higher, 100 times higher, 1000 times higher) than the non-operational state.
  • the controller 310 itself may be deactivated until the output of the first voltage comparator 301 activates the controller 310 when the absolute value of the voltage equals or exceeds the absolute value of the first threshold.
  • the controller 310 may be configured to cause at least one of the number registered by the counter 320 to increase by one, if, during the time delay, the second voltage comparator 302 determines that the absolute value of the voltage equals or exceeds the absolute value of the second threshold.
  • the controller 310 may be configured to cause the optional voltmeter 306 to measure the voltage upon expiration of the time delay.
  • the controller 310 may be configured to connect the electric contact 119B to an electrical ground, so as to reset the voltage and discharge any charge carriers accumulated on the electric contact 119B.
  • the electric contact 119B is connected to an electrical ground after the expiration of the time delay.
  • the electric contact 119B is connected to an electrical ground for a finite reset time period.
  • the controller 310 may connect the electric contact 119B to the electrical ground by controlling the switch 305.
  • the switch may be a transistor such as a field-effect transistor (FET) .
  • the system 121 has no analog filter network (e.g., a RC network) . In an embodiment, the system 121 has no analog circuitry.
  • analog filter network e.g., a RC network
  • the voltmeter 306 may feed the voltage it measures to the controller 310 as an analog or digital signal.
  • the electronic system 121 may include an integrator 309 electrically connected to the electric contact 119B, wherein the integrator is configured to collect charge carriers from the electric contact 119B.
  • the integrator 309 can include a capacitor in the feedback path of an amplifier.
  • the amplifier configured as such is called a capacitive transimpedance amplifier (CTIA) .
  • CTIA has high dynamic range by keeping the amplifier from saturating and improves the signal-to-noise ratio by limiting the bandwidth in the signal path.
  • Charge carriers from the electric contact 119B accumulate on the capacitor over a period of time ( “integration period” ) . After the integration period has expired, the capacitor voltage is sampled and then reset by a reset switch.
  • the integrator 309 can include a capacitor directly connected to the electric contact 119B.
  • the first voltage comparator 301 determines that the absolute value of the voltage equals or exceeds the absolute value of the first threshold V1, and the controller 310 starts the time delay TD1 and the controller 310 may deactivate the first voltage comparator 301 at the beginning of TD1. If the controller 310 is deactivated before t 1 , the controller 310 is activated at t 1 . During TD1, the controller 310 activates the second voltage comparator 302. The term “during” a time delay as used here means the beginning and the expiration (i.e., the end) and any time in between. For example, the controller 310 may activate the second voltage comparator 302 at the expiration of TD1.
  • the controller 310 waits for stabilization of the voltage to stabilize.
  • the voltage stabilizes at time t e , when all charge carriers generated by the particle of radiation drift out of the radiation absorption layer 110.
  • the time delay TD1 expires.
  • the controller 310 causes the voltmeter 306 to digitize the voltage and determines which bin the energy of the particle of radiation falls in. The controller 310 then causes the number registered by the counter 320 corresponding to the bin to increase by one. In the example of Fig.
  • time t s is after time t e ; namely TD1 expires after all charge carriers generated by the particle of radiation drift out of the radiation absorption layer 110.
  • TD1 can be empirically chosen to allow sufficient time to collect essentially all charge carriers generated by a particle of radiation but not too long to risk have another incident particle of radiation. Namely, TD1 can be empirically chosen so that time t s is empirically after time t e .
  • Time t s is not necessarily after time t e because the controller 310 may disregard TD1 once V2 is reached and wait for time t e . The rate of change of the difference between the voltage and the contribution to the voltage by the dark current is thus substantially zero at t e .
  • the controller 310 may be configured to deactivate the second voltage comparator 302 at expiration of TD1 or at t 2 , or any time in between.
  • the voltage at time t e is proportional to the amount of charge carriers generated by the particle of radiation, which relates to the energy of the particle of radiation.
  • the controller 310 may be configured to determine the energy of the particle of radiation, using the voltmeter 306.
  • the controller 310 After TD1 expires or digitization by the voltmeter 306, whichever later, the controller 310 connects the electric contact 119B to an electric ground for a reset period RST to allow charge carriers accumulated on the electric contact 119B to flow to the ground and reset the voltage. After RST, the electronic system 121 is ready to detect another incident particle of radiation. If the first voltage comparator 301 has been deactivated, the controller 310 can activate it at any time before RST expires. If the controller 310 has been deactivated, it may be activated before RST expires.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medical Informatics (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)

Abstract

Un procédé comprend : le positionnement d'un capteur d'image (9000) à une première position de capteur (910); puis le déplacement d'une source de rayonnement (500) le long d'une piste (405) vers une pluralité de positions de source (9181, 9182, 9183) et capturer un premier ensemble (1010) d'images partielles de la scène (50) avec le capteur d'image (9000) respectivement, la piste (405) comprenant des électroaimants (400A, 400B, 400C) configurés pour attirer magnétiquement la source de rayonnement (500) vers la pluralité de positions de source (9181, 9182, 9183); déplacer le capteur d'image (9000) vers une seconde position de capteur (920) le long d'une première direction (905); puis le déplacement de la source de rayonnement (500) le long de la piste (405) vers la pluralité de positions de source (9181, 9182, 9183) et la capture d'un second ensemble (1020) d'images partielles; pour chaque position de source de la pluralité de positions de source (9181, 9182, 9183), la formation d'une image de la scène (50) par assemblage d'une image partielle du premier ensemble (1010) et d'une image partielle du second ensemble (1020).
PCT/CN2022/104067 2022-07-06 2022-07-06 Procédé d'imagerie avec positionnement magnétique d'une source de rayonnement WO2024007185A1 (fr)

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US20030095624A1 (en) * 2001-11-21 2003-05-22 Eberhard Jeffrey Wayne Dose management system for mammographic tomosynthesis
CN104902803A (zh) * 2012-11-08 2015-09-09 奥姆里·埃默迪 腔内照明装置
CN109996494A (zh) * 2016-12-20 2019-07-09 深圳帧观德芯科技有限公司 具有x射线检测器的图像传感器
CN110382759A (zh) * 2016-12-22 2019-10-25 分形编织公司 用于操纵材料的装置和方法
CN110461234A (zh) * 2017-03-20 2019-11-15 Dr科技股份有限公司 射线照相设备及使用射线照相设备的射线照相方法
CN112638257A (zh) * 2018-09-19 2021-04-09 深圳帧观德芯科技有限公司 成像方法
CN112702950A (zh) * 2018-09-07 2021-04-23 深圳帧观德芯科技有限公司 用辐射成像对象的装置和方法
TW202221360A (zh) * 2020-11-25 2022-06-01 大陸商深圳幀觀德芯科技有限公司 成像方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030095624A1 (en) * 2001-11-21 2003-05-22 Eberhard Jeffrey Wayne Dose management system for mammographic tomosynthesis
CN104902803A (zh) * 2012-11-08 2015-09-09 奥姆里·埃默迪 腔内照明装置
CN109996494A (zh) * 2016-12-20 2019-07-09 深圳帧观德芯科技有限公司 具有x射线检测器的图像传感器
CN110382759A (zh) * 2016-12-22 2019-10-25 分形编织公司 用于操纵材料的装置和方法
CN110461234A (zh) * 2017-03-20 2019-11-15 Dr科技股份有限公司 射线照相设备及使用射线照相设备的射线照相方法
CN112702950A (zh) * 2018-09-07 2021-04-23 深圳帧观德芯科技有限公司 用辐射成像对象的装置和方法
CN112638257A (zh) * 2018-09-19 2021-04-09 深圳帧观德芯科技有限公司 成像方法
TW202221360A (zh) * 2020-11-25 2022-06-01 大陸商深圳幀觀德芯科技有限公司 成像方法

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