WO2024001175A1

WO2024001175A1 - Terminal, connector, and electronic device

Info

Publication number: WO2024001175A1
Application number: PCT/CN2023/073004
Authority: WO
Inventors: 吴生玉; 刘潇璇
Original assignee: 中兴通讯股份有限公司
Priority date: 2022-06-28
Filing date: 2023-01-18
Publication date: 2024-01-04
Also published as: CN117353063A

Abstract

The present application provides a terminal, a connector (200), and an electronic device. The terminal comprises: chip connecting ends (110), configured to be connected to a pad in a chip; substrate connecting ends (120), configured to be connected to a pad in a circuit board; and a terminal body, comprising at least two elastically deformable connecting arms (130), the chip connecting ends (110) being respectively connected to the substrate connecting ends (120) by means of the connecting arms (130).

Description

Terminals, connectors and electronic equipment

Cross-references to related applications

This application is filed based on the Chinese patent application with application number 202210739659.3 and the filing date is June 28, 2022, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated into this application as a reference.

Technical field

The present application relates to the field of electronic technology, and in particular to a terminal, a connector and an electronic device.

Background technique

At present, highly densely designed integrated circuit chips such as central processing units are often packaged using grid arrays, ball grid arrays or plane grid arrays to achieve the purpose of being light, thin and short. During the product development process, if integrated circuit chips such as central processing units are directly welded to the circuit board, these integrated circuit chips will not be able to be flexibly replaced according to research and development requirements. In order to solve this problem, the related art proposes to use a connector to connect the integrated circuit chip and the circuit board. By arranging conductive terminals in the connector, when the integrated circuit chip is placed in the connector, the pins of the integrated circuit chip can be electrically connected to the circuit board through the conductive terminals. When the integrated circuit chip needs to be replaced, the original chip is removed from the connector. of the integrated circuit chip and place the new integrated circuit chip.

In the related art, although the conductive terminals in the connector can realize the electrical connection between the integrated circuit chip and the circuit board, such conductive terminals only have one signal transmission path, especially the conductive terminals used for ground return flow. The signal transmission path cannot effectively reduce the crosstalk between high-speed signal pairs, which easily leads to poor signal transmission quality.

Contents of the invention

Embodiments of the present application provide a terminal, a connector and an electronic device.

In a first aspect, embodiments of the present application provide a terminal, including: a chip connection end, used to connect a pad in a chip; a substrate connection end, used to connect a pad in a circuit board; a terminal body, including at least two Elastically deformable connecting arms, the chip connecting ends are respectively connected to the substrate connecting ends through each of the connecting arms.

In a second aspect, an embodiment of the present application further provides a connector, including: a terminal receiving slot is provided, and the terminal as described in the first aspect is disposed in the terminal receiving slot.

In a third aspect, embodiments of the present application further provide an electronic device, including the connector described in the second aspect.

Description of drawings

Figure 1 is a schematic structural diagram of a terminal provided by an embodiment of the present application;

Figure 2 is a schematic structural diagram of a terminal provided by another embodiment of the present application;

Figure 3 is a schematic diagram of the angle formed between adjacent connecting arms provided by an embodiment of the present application;

Figure 4 is a schematic structural diagram of a terminal provided by another embodiment of the present application;

Figure 5 is a schematic structural diagram of a terminal provided by another embodiment of the present application;

Figure 6 is a schematic structural diagram of a terminal provided by another embodiment of the present application;

Figure 7 is a schematic diagram of the simulation results of the signal integrity of the terminal provided by an embodiment of the present application;

Figure 8 is a schematic structural diagram of a connector provided by an embodiment of the present application;

Figure 9 is a cross-sectional view along line A-A in Figure 8;

Figure 10 is a partial enlarged view of C in Figure 9;

Figure 11 is a partial enlarged view of the top view at D in Figure 10;

Figure 12 is a partial enlarged view of B in Figure 8;

Fig. 13 is a schematic structural diagram of another embodiment of Fig. 12.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described in detail below with reference to the drawings and embodiments. It should be understood that the embodiments described here are only used to explain the present application and are not used to limit the present application.

It should be noted that although a logical sequence is shown in the flowchart, in some cases, the steps shown or described may be performed in an order different from that in the flowchart. In the description of the specification, claims and the above drawings, plural (or multiple) means two or more, greater than, less than, exceeding, etc. are understood to exclude the number, and above, below, within, etc. are understood to include the number. If there are descriptions of "first", "second", etc., they are only used for the purpose of distinguishing technical features and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the indicated technical features. The sequence relationship of technical features.

The present application provides a terminal, a connector and an electronic device by providing at least two elastically deformable connecting arms, and the chip connection end is connected to the substrate connection end through each connection arm. At this time, each connection arm can A signal transmission path is formed that connects the chip connection end and the substrate connection end, so that there are multiple signal transmission paths between the chip connection end and the substrate connection end, which effectively improves the return path of high-speed signals, thus reducing the crosstalk between high-speed signal pairs. This can improve the quality of signal transmission.

In related technology, in the LGA (Land Grid Array, grid array package) terminal of the CPC (Co-packaging cable) Socket (socket), the structure and signal of all Ground (ground) terminals The structure of the terminals all adopt the same dual LGA structure. There is only one signal transmission path for the current of the terminal. It is difficult to reduce the crosstalk between high-speed signal pairs, resulting in poor signal transmission quality. Among them, the ICN (Integrated Crosstalk Noise) of the current terminal , integrated crosstalk noise) is greater than 1.80mv, and it is difficult to meet the required standard, that is, the ICN of the terminal is <1.80mv. Especially for the current Pitch (center distance) defined by CPO (Co-Packaging Optical) Socket, CPC Socket, and OIF (Optical Module Universal Protocol) (that is, Pitch is 0.9mm (X) * 0.6mm (Y)) , smaller than the current mainstream CPU (Central Processing Unit, Central Processing Unit) Socket Pitch (i.e. 1.0mm*1.0mm), and Pitch will affect the crosstalk between high-speed signal terminals. Therefore, as Pitch continues to decrease, high-speed Crosstalk problems between signal terminals are also becoming increasingly difficult to improve.

Based on the above analysis, the embodiments of the present application will be described below with reference to the accompanying drawings.

In one embodiment, the terminal may include a chip connection end, a substrate connection end and a terminal body, wherein the chip connection end may be used to connect a pad in the chip, the substrate connection end may be used to connect a pad in the circuit board, and the terminal The main body includes at least two elastically deformable connecting arms, and the chip connecting end is connected to the substrate connecting end through each connecting arm.

In this embodiment, at least two elastically deformable connecting arms are provided, and the chip connection end is connected to the substrate connection end through each connection arm. At this time, each connection arm can form a connection between the chip connection end and the substrate. terminal signal The transmission path enables multiple signal transmission paths between the chip connection end and the substrate connection end, which effectively improves the return path of high-speed signals, thereby reducing crosstalk between high-speed signal pairs and improving the quality of signal transmission.

It can be understood that there are multiple signal transmission paths between the chip connection end and the substrate connection end, so that the energy of the electromagnetic field can be effectively released, reducing the electromagnetic field energy coupling between adjacent high-speed signal pairs, thereby reducing the high-speed signal Crosstalk between pairs.

It can be understood that the high-speed signal enters the chip connection end from the pad in the chip, flows through at least two elastically deformable connection arms, then flows out from the substrate connection end, and finally reaches the pad in the circuit board, thus realizing the chip Electrical connection to the circuit board. In addition, high-speed signals are unevenly distributed on the terminals. A large number of high-speed signals gather on the surface of the terminals, and there are fewer high-speed signals toward the center of the terminals. This phenomenon is called the skin effect.

In one embodiment, as shown in FIGS. 1 and 2 , the terminal includes a chip connection end 110 , a substrate connection end 120 and a terminal body. The terminal body includes two elastically deformable connecting arms 130 . The chip connection end 110 respectively Each connecting arm 130 is connected to the substrate connection end 120, so that there are two signal transmission paths between the chip connection end 110 and the substrate connection end 120, which effectively improves the return path of high-speed signals, thereby reducing the crosstalk between high-speed signal pairs. , improving the quality of signal transmission.

In one embodiment, the connection end of the substrate can be connected to the pad in the circuit board through a conductive material, where the conductive material can be conductive rubber, conductive silver glue, solder balls, or metal springs, which are not limited here.

In one embodiment, the connection methods of the substrate connection end and the pad in the circuit board and the connection method of the chip connection end and the pad in the chip can be various, such as welding (such as laser welding) or injection molding, etc. There are no restrictions here.

In one embodiment, the included angle formed between adjacent connecting arms may be an acute angle, a right angle or an obtuse angle, where the included angle is an included angle formed between adjacent connecting arms in the horizontal direction, which is not discussed here. limit. For example, as shown in Figure 3, the angle formed between two adjacent connecting arms is a right angle.

In one embodiment, the shape and size of the substrate connection end and the chip connection end are not limited and can be set according to the actual situation. The shape of the substrate connection end and the chip connection end can both be smooth arc or smooth arc. , smooth plane or other shapes to reduce the sliding friction generated when the chip connection end contacts the pad in the chip, thereby reducing damage to the chip connection end and the pad in the chip and ensuring the stability of the electrical connection. The shape of the substrate connection end and the chip connection end may be the same or different. The shapes of the connection ends of different substrates may be the same or different. Similarly, the shapes of the connection terminals of different chips can be the same or different. In addition, the size of the substrate connection end and the chip connection end correspond to the size of the terminal, and are not limited here.

In one embodiment, the height of the terminal may be below 1.5 mm, such as 1.5 mm, 1.3 mm or other values, which are not limited here.

In one embodiment, the number of chip connection terminals is multiple, but the number of chip connection terminals is not more than the number of connection arms. For example, the number of chip connection terminals is one, and the number of connecting arms is two, or the number of connecting arms is two or more; another example, the number of chip connection terminals is two or more, and the number of connecting arms is two. or the number of connecting arms is more than two, wherein the number of connecting arms corresponding to each chip connection end may be the same or different, and is not limited here.

In one embodiment, the number of connecting terminals of the substrate is multiple, and the number of connecting terminals of the substrate is no more than the number of connecting arms. For example, the number of connecting terminals on the substrate is one, and the number of connecting arms is two, or the number of connecting arms is two or more; another example, the number of connecting terminals on the substrate is two or more, and the number of connecting arms is two. or the number of connecting arms is more than two, wherein the number of connecting arms corresponding to each substrate connection end may be the same or different, in There is no restriction on this.

In one embodiment, the number of chip connection terminals, the number of substrate connection terminals, and the number of connection arms may be the same or different. For example, assume that the number of chip connection terminals is one, the number of substrate connection terminals is also one, and the number of connection arms is two or more; or, the number of chip connection terminals is one, the number of substrate connection terminals is two or more , the number of connection arms is two or more, and the number of substrate connection terminals is equal to or less than the number of connection arms; or, the number of chip connection terminals is two or more, the number of substrate connection terminals is one, and the number of connection arms The number is two or more, and the number of chip connection terminals is equal to or less than the number of connection arms; or, the number of chip connection terminals is two or more, the number of substrate connection terminals is two or more, and the number of connection arms The number is two or more, and the number of substrate connection terminals is not equal to the number of chip connection terminals, the number of substrate connection terminals is not more than the number of connection arms, and the number of chip connection terminals is not more than the number of connection arms; or, the chip The numbers of the connection terminals and the substrate connection terminals are consistent with the number of the connection arms. The chip connection terminals, the substrate connection terminals and the connection arms correspond one to one and will not be listed one by one here.

In one embodiment, the number of chip connection terminals and substrate connection terminals is consistent with the number of connection arms. The chip connection terminals, the substrate connection terminals and the connection arms correspond one to one. The adjacent connection arms are connected through connection parts. There is no restriction on this. For example, as shown in FIG. 1 , the number of chip connection terminals 110 , the number of substrate connection terminals 120 and the number of connection arms 130 are all two, and the two connection arms 130 are connected through the connection part 140 . Therefore, the chip connection There are two signal transmission paths between the terminal 110 and the substrate connection terminal 120.

In one embodiment, the number of chip connection terminals is one, the number of substrate connection terminals is two, the number of connection arms is two, and adjacent connection arms are connected through connection parts, which are not limited here.

In another embodiment, as shown in FIGS. 4 and 5 , the number of the substrate connection end 120 is one, the number of the chip connection end 110 is two, the number of the connection arms 130 is two, and the adjacent connection arms 130 are They are connected through the connecting part 140, and the substrate connection end 120 is connected to the pad in the circuit board through the solder ball 150, which is not limited here. Among them, the contact method between the terminal and the circuit board in Figure 4 is changed from LGA to BGA (Ball Grid Array, ball grid array) implementation.

In one embodiment, adjacent connection arms connected to the same chip connection end and the same substrate connection end may be independent of each other (ie not connected), but connected to different chip connection ends and/or different substrate connections. Adjacent connecting arms at the ends can be connected through connecting parts, which is not limited here. For example, the number of the connecting arms 130 is two, and the two connecting arms 130 are connected to the same chip connection end 110 and the same substrate connection end 120. The structural diagram of the terminal can be as shown in Figure 6, which is not shown here. Make restrictions.

In one embodiment, as shown in FIG. 1 , the connecting arm 130 includes an elastically deformable first cantilever beam 160 . The first cantilever beam 160 is connected to the chip connection end 110 . Since the elastically deformable first cantilever beam 160 has good Therefore, the contact force between the chip connection terminal 110 and the pad in the chip is good, which can ensure the stability of the electrical contact between the chip connection terminal 110 and the chip.

In one embodiment, as shown in FIG. 1 , the connecting arm 130 includes an elastically deformable second cantilever beam 170 . The second cantilever beam 170 is connected to the substrate connection end 120 . Since the elastically deformable second cantilever beam 170 has good Therefore, the contact force between the substrate connection end 120 and the pad in the circuit board is good, which can ensure the stability of the electrical contact between the substrate connection end 120 and the circuit board.

In one embodiment, as shown in FIG. 1 , the first cantilever beams 160 of adjacent connecting arms 130 may be overlapped, that is, the first cantilever beam 160 of one connecting arm 130 is located at the first cantilever beam 160 of the other connecting arm 130 . Above the cantilever beam 160, similarly, the second cantilever beams 170 of adjacent connecting arms 130 can be overlapped, that is, the second cantilever beam 170 of one of the connecting arms 130 can be overlapped. The arm beam 170 is located above the second cantilever beam 170 connecting the other arm 130, which is not limited here.

In one embodiment, at least one connecting arm is provided with a retaining portion for assembling the terminal. For example, as shown in FIG. 1 , the terminal body of the terminal includes two elastically deformable connecting arms 130 , and both connecting arms 130 are provided with holding parts, namely a first holding part 180 and a second holding part 190 . There is no restriction on this.

In one embodiment, the lengths of the connecting arm, the first cantilever beam and the second cantilever beam are not limited and can be set according to actual requirements.

In one embodiment, the terminal can be integrally formed, that is, the terminal is made of only one kind of material, which is a conductive material; or the chip connection end, the substrate connection end and the connection arm of the terminal are all made of conductive material, The connecting parts between adjacent connecting arms can be made of other materials, such as plastic, ceramics or glass, which are not limited here.

In one embodiment, the shape of the terminal is not limited to the shape of the terminal in all the above figures. Taking the cross section of the terminal as an example, when the number of connecting arms is greater than or equal to three, the cross section of the terminal can be a polygon, such as a triangle, Square, rectangle, rhombus, pentagon or other shapes are not listed here one by one. It can be understood that the cross-sectional shape of the terminal is related to the number of connecting arms.

Regarding the terminal provided in the above embodiment, the performance test results of the terminal are described in detail below with examples: Test result 1:

As shown in Table 1, Table 1 shows the crosstalk noise between differential signals of the terminals in the present application (that is, the terminals that include at least two signal transmission paths) and the terminals in the related art (that is, the terminals that have only a single signal transmission path). Comparative results of crosstalk noise between differential signals. Among them, the differential signal A represents the differential signal of the terminal in this application, the differential signal B represents the differential signal of the terminal in the related art, and Diff 1_4, Diff 1_6, Diff 1_8, Diff 1_10, Diff 1_12, Diff 1_16, and Diff 1_18 respectively represent The crosstalk measurement amplitude corresponding to different differential signals. ICM represents the crosstalk measurement amplitude corresponding to 8 pairs of differential signals, and the unit of crosstalk measurement amplitude is mv.

Table 1

It can be seen from Table 1 that the crosstalk measurement amplitude of each pair of differential signals of the terminals in this application is lower than the crosstalk measurement amplitude of each pair of differential signals of the terminals in the related art. Finally, the ICN ratio of the terminals in this application is related to The ICN of the terminals in the technology is reduced by approximately 0.4858mv. It can be seen that the terminal in this application can reduce crosstalk between high-speed signal pairs and improve the quality of signal transmission.

Test result two:

As shown in Figure 7, Figure 7 shows the simulation results of the signal integrity of the terminal. The ordinate shows the amplitude (Magnitude), the abscissa shows the frequency, and the dotted line represents the terminal in the related technology (that is, only a single signal transmission path), the solid line represents the terminal in the present application (that is, the terminal including at least two signal transmission paths). When the frequency is 28GHz, the far-end crosstalk of the terminal in the present application is higher than that of the terminal in the related art. The far-end crosstalk is 3.5364dB less. When the frequency is 42GHz, the far-end crosstalk of the terminal in this application is 5.9835dB less than the far-end crosstalk of the terminal in the related art. It can be seen that the terminal in this application can reduce crosstalk between high-speed signal pairs and improve the quality of signal transmission.

In addition, referring to Figures 8, 9 and 10, another embodiment of the present application also provides a connector 200. The connector 200 is provided with a terminal receiving groove, and the terminal receiving groove is provided with a terminal as in any of the above embodiments. terminal. The connector 200 has the beneficial effects brought by the terminals in any of the above embodiments. For example, in the terminal, at least two elastically deformable connecting arms are provided, and the chip connecting end 110 is connected to the substrate connecting end 120 through each connecting arm. At this time, each connecting arm can form a connected chip connecting end 110 The signal transmission path between the chip connection terminal 110 and the substrate connection terminal 120 enables multiple signal transmission paths between the chip connection terminal 110 and the substrate connection terminal 120, which effectively improves the return path of high-speed signals, thereby reducing the crosstalk between high-speed signal pairs, thereby reducing crosstalk between high-speed signal pairs. It can improve the quality of signal transmission.

In one embodiment, as shown in FIG. 11 , which is a partial enlarged view of the terminals in FIG. 8 , each terminal is connected to the terminal receiving groove through a holding part (such as the first holding part 180 and the second holding part 190 ). Assembly is not limited here. It can be understood that the assembly between each terminal and the terminal receiving groove can achieve an interference fit.

In one embodiment, as shown in FIG. 12 , the connector may include three types of terminals, namely a first ground terminal 220 , a second ground terminal 210 and a signal terminal 230 . The first ground terminal 220 includes at least two elastically deformable terminals. The second ground terminal 210 is a terminal with only one connecting arm (ie, a terminal with at least two signal transmission paths), and the second ground terminal 210 is a terminal with only one connecting arm (ie, a terminal with only one signal transmission path), which is not limited here. Correspondingly, FIG. 13 is a schematic diagram of a connector including only the second ground terminal 210 and the signal terminal 230 in the related art.

In one embodiment, the connector further includes a HSG (Housing, plastic body), and the HSG is provided with a terminal receiving slot, which is not limited here.

In one implementation, the signal transmission speed of the terminal may be 112Gbps, 224Gbps, or a higher signal transmission speed, which is not limited here.

In one embodiment, the terminal can be set on a connector with a signal transmission speed of 112Gbps, 224Gbps or higher, where the connector can be a CPU Socket, a CPO Socket, a CPC Socket, or an NPC (Near Packaging cable, cable close to the package) Socket or other similar high-speed system connectors, there are no restrictions here.

In one embodiment, the connector can be soldered to the circuit board through solder balls, and the chip can be connected to the contacts of the connector (that is, the chip connection end) to facilitate the disassembly of the chip, which is not limited here.

In one embodiment, the terminal receiving groove may have a variety of shapes, and the shape of the terminal receiving groove may be adapted to the shape of the terminal. Taking the cross section of the terminal receiving groove as an example, the cross section of the terminal receiving groove may be polygonal, For example, triangles, squares, rectangles, rhombuses or other shapes are not listed here.

It is worth noting that the terminals in all the above embodiments can be ground terminals or signal terminals, which are not limited here.

In addition, an embodiment of the present application also provides an electronic device. The electronic device includes the connector of the above embodiment. The connector is provided with a terminal receiving slot, and the terminal receiving slot is provided with a terminal as in any of the above embodiments. . Therefore, the electronic device has the beneficial effects brought by the terminal in any of the above embodiments, that is, in the terminal, at least two elastically deformable connecting arms are provided, and the chip connection end is connected to the terminal through each connecting arm respectively. At this time, each connecting arm can form a signal transmission path connecting the chip connection end and the substrate connection end, so that there are multiple signal transmission paths between the chip connection end and the substrate connection end, effectively improving the high-speed signal transmission The return path can therefore reduce the crosstalk between high-speed signal pairs, improve the quality of signal transmission, and thereby increase the signal transmission bandwidth of the electronic device.

Those of ordinary skill in the art can understand that all or some steps and systems in the methods disclosed above can be implemented Software, firmware, hardware and appropriate combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit . Such software may be distributed on computer-readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). As is known to those of ordinary skill in the art, the term computer storage media includes volatile and nonvolatile media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. removable, removable and non-removable media. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disk (DVD) or other optical disk storage, magnetic cassettes, tapes, disk storage or other magnetic storage devices, or may Any other medium used to store the desired information and that can be accessed by a computer. Additionally, it is known to those of ordinary skill in the art that communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media .

Claims

A terminal consisting of:

Chip connection terminal, used to connect the pads in the chip;

The substrate connection terminal is used to connect the pads in the circuit board;

The terminal body includes at least two elastically deformable connection arms, and the chip connection end is connected to the substrate connection end through each of the connection arms.
The terminal according to claim 1, wherein the number of the chip connection terminals is multiple, and the number of the chip connection terminals is no more than the number of the connection arms.
The terminal according to claim 2, wherein the connecting arm includes an elastically deformable first cantilever beam, and the first cantilever beam is connected to the chip connection end.
The terminal according to claim 3, wherein the first cantilever beams of adjacent connecting arms are overlapped.
The terminal according to claim 1, wherein the number of the substrate connection terminals is multiple, and the number of the substrate connection terminals is no more than the number of the connection arms.
The terminal according to claim 5, wherein the connecting arm includes an elastically deformable second cantilever beam, and the second cantilever beam is connected to the substrate connection end.
The terminal according to claim 6, wherein the second cantilever beams of adjacent connecting arms are overlapped.
The terminal according to claim 1, wherein the adjacent connecting arms form an included angle of one of the following angles:

acute angle; or

right angle; or

Obtuse angle.
The terminal according to claim 1, wherein the number of the chip connection end and the substrate connection end is consistent with the number of the connection arms, and the chip connection end, the substrate connection end and the connection arm In one-to-one correspondence, adjacent connecting arms are connected through connecting portions.
The terminal according to claim 1, wherein at least one of the connecting arms is provided with a retaining portion, the retaining portion being used to assemble the terminal.
A connector includes a terminal receiving slot, and the terminal according to any one of claims 1 to 10 is disposed in the terminal receiving slot.
An electronic device including the connector as claimed in claim 11.