WO2023284812A1

WO2023284812A1 - Imaging system and imaging device

Info

Publication number: WO2023284812A1
Application number: PCT/CN2022/105644
Authority: WO
Inventors: 杨金华; 徐伟; 袁炜军
Original assignee: 杭州微影软件有限公司
Priority date: 2021-07-15
Filing date: 2022-07-14
Publication date: 2023-01-19
Also published as: CN215120992U

Abstract

Provided in the embodiments of the present disclosure are an imaging system and an imaging device. The imaging system comprises a supporting member, a lens assembly, a vibration reduction structure, and a first circuit board on which an image sensor is mounted, wherein the lens assembly is connected to one end of the supporting member; the vibration reduction structure comprises supporting bodies, vibration reduction layers and a connecting member; and at least two supporting bodies are provided, one vibration reduction layer is arranged between every two adjacent supporting bodies, the supporting body closest to the lens assembly is connected to the supporting member, the connecting member penetrates all the supporting bodies and the vibration reduction layers, the first circuit board is arranged on the side of the vibration reduction structure close to the lens assembly, the connecting member further penetrates the first circuit board, a first limiting portion is arranged at the end of the connecting member away from the lens assembly and abuts against the supporting body farthest away from the lens assembly, and a second limiting portion is arranged at the end of the connecting member close to the lens assembly and abuts against the first circuit board.

Description

Imaging system and imaging device

This disclosure claims the priority of the Chinese patent application with the application number 202121613375.7 and the title of the invention "imaging system and imaging device" submitted to the China Patent Office on July 15, 2021, the entire contents of which are incorporated by reference in this disclosure.

technical field

The present disclosure relates to the technical field of imaging systems, and in particular to an imaging system and an imaging device.

Background technique

With the development of technology, there are more and more types of electronic equipment with imaging devices (such as mobile phones, tablet computers, thermal imagers, etc.). While people are using this type of electronic equipment, they also put forward anti-vibration requirements for the electronic equipment, so as to protect the core components in the imaging device - the image sensor. In the imaging device in the related art, the shock absorbing structure adopted has a relatively large volume and weight, which makes the shock absorbing amplitude larger, and the larger amplitude makes the shock absorbing structure easily touch other components, thereby increasing the The possibility of damaging other components further affects the reliability of the imaging device.

Based on the problems existing in related technologies, it is necessary to develop an imaging device with a highly reliable vibration-reduction structure.

Contents of the invention

The purpose of the embodiments of the present disclosure is to provide an imaging system and an imaging device, an imaging system having a highly reliable vibration reduction structure. The specific technical scheme is as follows:

An embodiment of the present disclosure proposes an imaging system, including:

supporting item;

a lens assembly, the lens assembly is connected to one end of the support;

A vibration-damping structure, the vibration-damping structure includes a support body, a vibration-damping layer and a connector, there are at least two support bodies, and one vibration-damping layer is arranged between every two adjacent support bodies, A support body closest to the lens assembly is connected to the support member, and the connection member passes through all the support bodies and the vibration-damping layer;

The first circuit board of the image sensor is installed, the first circuit board is arranged on the side of the vibration damping structure close to the lens assembly, the connecting piece is also passed through the first circuit board, the The end of the connecting piece far away from the lens assembly is provided with a first limiting portion, the first limiting portion abuts against a support body farthest from the lens assembly, and the end of the connecting piece close to the lens assembly A second limiting portion is provided, and the second limiting portion abuts against the first circuit board.

According to the imaging system of the embodiment of the present disclosure, when the imaging system is subjected to an external impact, the vibration-damping layer in the vibration-damping structure undergoes compressive deformation. On the one hand, in the process of compressing and deforming the damping layer, the first circuit board moves relative to the support connected to the support, so that the impact energy on the support does not directly act on the first circuit board; on the other hand On the one hand, the shock-absorbing layer can convert impact kinetic energy into internal energy for release during compression and deformation. Thus, the image sensor is protected by the vibration-damping structure. In addition, compared with the external vibration reduction of the whole machine or the overall vibration reduction of the core module, the vibration reduction structure provided in the embodiments of the present disclosure is smaller in volume, thus making the vibration amplitude during the vibration reduction process relatively smaller In the vibration reduction process, it is possible to well avoid touching other components in the imaging device, thereby not causing damage to other components, thereby improving the reliability of the imaging device.

In addition, the imaging system according to the embodiment of the present disclosure may also have the following additional technical features:

In some embodiments of the present disclosure, there is no direct contact vibration transmission relationship between the first circuit board and the support member.

In some embodiments of the present disclosure, the number of the support body is two, the number of the vibration-damping layer is one and is arranged between the two support bodies, and the connecting member passes through the two support bodies. The support body and the damping layer.

In some embodiments of the present disclosure, the vibration damping structure further includes a guide member, the guide member is disposed on a support body closest to the lens assembly, and the guide member is configured to limit the first circuit board Can only move in a first direction, the first direction is perpendicular to the support body.

In some embodiments of the present disclosure, the guide member includes at least two positioning posts, the positioning posts are parallel to the optical axis of the lens assembly, and the positioning post is provided on the first circuit board. Adaptive positioning holes.

In some embodiments of the present disclosure, the distances from the positioning posts to the optical axis are equal, and the positioning posts are uniformly distributed around the optical axis.

In some embodiments of the present disclosure, the number of the connecting parts is at least two, each of the connecting parts is parallel to the optical axis of the lens assembly, and the distance from each of the connecting parts to the optical axis is equal.

In some embodiments of the present disclosure, a first functional device is provided on the first circuit board, and the first functional device is provided on a side of the first circuit board away from the lens assembly, and the support Both the body and the damping layer are provided with through holes, and each of the through holes communicates with each other to form an escape passage, and the first functional device is arranged in the escape passage.

In some embodiments of the present disclosure, the imaging system further includes a second circuit board, the support member is a cylindrical structure, the vibration-damping structure is disposed in the inner cavity of the cylindrical structure, and the second The circuit board is connected to an end of the cylindrical structure away from the lens assembly.

In some embodiments of the present disclosure, a second functional device is provided on the second circuit board, and the second functional device is provided on a side of the second circuit board that is close to the lens assembly, and is farthest from There is a distance between a support body of the lens assembly and the second circuit board; through holes are provided on the support body and the vibration-damping layer, and each of the through holes communicates with each other to form an escape channel, so The second functional device is opposite to the avoidance channel.

In some embodiments of the present disclosure, the support body is a hard plate structure, and the vibration-damping layer is a damping rubber layer.

In some embodiments of the present disclosure, the support member is a cylindrical structure, the damping structure is arranged in the inner cavity of the cylindrical structure, and the inner wall of the cylindrical structure is provided with mounting ears, and the The vibration-damping structure is mounted on the mounting ears.

In some embodiments of the present disclosure, the connector includes a bolt and a nut, one end of the bolt is formed with a bolt head, the nut is fitted on the other end of the bolt, the bolt head and the nut One of the caps constitutes the first limiting portion, and the other of the bolt head and the nut constitutes the second limiting portion.

Embodiments of the second aspect of the present disclosure provide an imaging device, including the imaging system described in any one of the above embodiments.

According to the imaging device of the embodiment of the present disclosure, when the imaging system of the imaging system is subjected to an external impact, the vibration-damping layer in the vibration-damping structure undergoes compression deformation. On the one hand, in the process of compressing and deforming the damping layer, the first circuit board moves relative to the support connected to the support, so that the impact energy on the support does not directly act on the first circuit board; on the other hand On the one hand, the shock-absorbing layer can convert impact kinetic energy into internal energy for release during compression and deformation. Thus, the image sensor is protected by the vibration-damping structure. In addition, compared with the external vibration reduction of the whole machine or the overall vibration reduction of the core module, the vibration reduction structure provided in the embodiments of the present disclosure is smaller in volume, thus making the vibration amplitude during the vibration reduction process relatively smaller In the vibration reduction process, it is possible to well avoid touching other components in the imaging device, thereby not causing damage to other components, thereby improving the reliability of the imaging device.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following will briefly introduce the drawings that need to be used in the descriptions of the embodiments or related technologies. Obviously, the drawings in the following description are only For some disclosed embodiments, those skilled in the art can also obtain other embodiments according to these drawings.

FIG. 1 is an exploded view of an imaging system according to an embodiment of the present disclosure;

2 is a cross-sectional view of an imaging system according to an embodiment of the present disclosure;

3 is a cross-sectional view of the vibration-damping structure and the first circuit board according to an embodiment of the present disclosure (connectors are passed through the first circuit board and all supporting bodies and vibration-damping layers);

4 is a schematic structural diagram of a first circuit board according to an embodiment of the present disclosure (the image sensor is installed on the first circuit board);

FIG. 5 is a structural schematic diagram of a vibration damping structure according to an embodiment of the present disclosure;

FIG. 6 is a cross-sectional view of a vibration damping structure according to an embodiment of the present disclosure.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art based on the present disclosure belong to the protection scope of the present disclosure.

Most of the imaging devices in the related art adopt the external vibration reduction of the whole machine and the overall vibration reduction of the core module, which makes the volume and weight of the vibration reduction structure in the imaging device larger, resulting in a larger vibration amplitude during the shock reduction process, and a larger The large vibration amplitude makes it easy for the damping structure to touch other components, thereby increasing the possibility of damaging other components, thereby reducing the reliability of the imaging device. According to the general shock reduction theory, the amplitude after shock reduction is positively correlated with the weight of the object to be reduced, so it is necessary to reduce the weight of the object to be reduced, reduce the shock amplitude, and improve the reliability of the imaging device.

As shown in FIGS. 1 to 3 , an embodiment of the first aspect of the present disclosure proposes an imaging system 100 . The imaging system 100 includes a support 110 , a lens assembly 120 , a vibration reduction structure 130 , a first circuit board 140 and an image sensor 150 . Specifically, the lens assembly 120 is connected to one end of the supporting member 110 . The vibration-damping structure 130 includes a support body 131, a vibration-damping layer 132, and a connector 133. There are at least two support bodies 131, and a vibration-damping layer 132 is arranged between every two adjacent support bodies 131, which is closest to the lens assembly 120. One supporting body 131 is connected to the supporting member 110 , and the connecting member 133 passes through all the supporting body 131 and the damping layer 132 . The image sensor 150 is installed on the first circuit board 140, the first circuit board 140 is arranged on the side of the vibration-damping structure 130 close to the lens assembly 120, the connecting piece 133 is also passed through the first circuit board 140, and the connecting piece 133 is far away from One end of the lens assembly 120 is provided with a first limiting portion 1331, the first limiting portion 1331 abuts against a support body 131 farthest from the lens assembly 120, and the end of the connecting piece 133 close to the lens assembly 120 is provided with a second limiting portion 1332 , the second limiting portion 1332 abuts against the first circuit board 140 . It can be understood that the image sensor 150 is opposite to the lens assembly 120 .

According to the imaging system 100 of the embodiment of the present disclosure, when the imaging system 100 is subjected to an external impact, the vibration-damping layer 132 in the vibration-damping structure 130 undergoes compressive deformation. On the one hand, during the compressive deformation process of the damping layer 132, the first circuit board 140 moves relative to the support body 131 connected to the support member 110, so that the impact energy on the support member 110 will not directly act on the first circuit board 140. The circuit board 140; on the other hand, the vibration-absorbing layer 132 can convert the impact kinetic energy into internal energy for release during the process of compression and deformation. Thus, the image sensor 150 is protected by the vibration damping structure 130 . In addition, compared with the external vibration reduction of the whole machine or the overall vibration reduction of the core module, the vibration reduction structure 130 provided in the embodiment of the present disclosure is smaller in volume, thus making the vibration amplitude during the vibration reduction process relatively smaller. Small, can well avoid touching other components in the imaging device during the vibration reduction process, thereby not causing damage to other components, thereby improving the reliability of the imaging device.

On the other hand, in the imaging system 100 in the embodiment of the present disclosure, the connecting piece 133 passes through the first circuit board 140 and all the supporting body 131 and the shock absorbing layer 132, and the first limiting portion 1331 on the connecting piece 133 is connected to the The support body 131 farthest from the lens assembly 120 is against the second stopper 1332 on the connector 133 and the first circuit board 140, and the vibration can be reduced by adjusting the first stopper 1331 or the second stopper 1332 The vibration-damping layer 132 in the structure 130 has a pre-compression amount, so that the first circuit board 140 can be kept on a supporting body 131 of the vibration-damping structure 130 closest to the lens assembly 120. It will quickly return to this position, so that the position of the first circuit board 140 on which the image sensor 150 is installed remains stable in the impact direction, thereby maintaining the position of the imaging system 100 with high reliability, which can effectively avoid the image virtual focus problem.

It can be understood that the image sensor 150 in the embodiment of the present disclosure may be an infrared image sensor or a visible light image sensor, which is not limited in the present disclosure.

In some embodiments of the present disclosure, there is no direct contact vibration transmission relationship between the first circuit board 140 and the support member 110 . Specifically, the first circuit board 140 is installed together with the vibration-damping structure 130 through the connecting piece 133 , and under the limitation of the connecting piece 133 , the first circuit board 140 leans against a supporting body 131 closest to the lens assembly 120 . There is no direct connection relationship between the first circuit board 140 and the support member 110 , but the connection is made through the vibration-damping structure 130 . When the imaging system 100 is subjected to an external impact, the vibration generated by the support member 110 will cause the deformation of the vibration-damping layer 132 , and the vibration energy can be released through the deformation of the vibration-damping layer 132 . That is to say, the vibration of the support member 110 will not be directly transmitted to the first circuit board 140, but will be transmitted to the first circuit board 140 after being damped by the vibration-damping structure 130. The first circuit board 140 is protected, and then the image sensor 150 on the first circuit board 140 is protected.

In some embodiments of the present disclosure, as shown in FIG. 2 and FIG. 6 , the number of support bodies 131 is two, the number of vibration-damping layers 132 is one and is arranged between the two support bodies 131 , and the connector 133 passes through It is provided on the two supporting bodies 131 and the damping layer 132 . This is conducive to further reducing the volume and weight of the vibration-damping structure 130, thereby reducing the volume and weight of the shock-absorbing object including the entire imaging system 100, thereby reducing the shock-absorbing amplitude and improving the reliability of the imaging system 100 .

In some other embodiments of the present disclosure, the number of support bodies 131 may also be more than two, for example, three, four or more. When the number of support bodies 131 is three, the number of vibration-damping layers 132 is two; when the number of support bodies 131 is four, the number of vibration-damping layers 132 is three, and so on.

In some embodiments of the present disclosure, as shown in FIG. 1 , the damping structure 130 further includes a guide member 134, which is arranged on a support body 131 closest to the lens assembly 120, and the guide member 134 is configured to limit the first The circuit board 140 can only move along a first direction, wherein the first direction is perpendicular to the supporting body 131 . Understandably, the first direction is the impact direction. Thus, it can effectively prevent the first circuit board 140 installed with the image sensor 150 from moving parallel to the direction of the support body 131 when the imaging system 100 is impacted, so as to ensure that the image does not shift, so that the damping structure 130 The vibration is more accurate, and the installation is simpler and more reliable.

In some embodiments of the present disclosure, as shown in FIGS. The positioning hole 1342 adapted to the positioning column 1341 . Thus, under the limiting action of the two positioning posts 1341 and the two positioning holes 1342, the first circuit board 140 can be prevented from rotating when it moves along the first direction, and the stability of the first circuit board 140 moving along the first direction can be improved. sex.

In some embodiments of the present disclosure, the distances from the positioning posts 1341 to the optical axis of the lens assembly 120 are equal, and the positioning posts are uniformly distributed around the optical axis, so that the first circuit board 140 can be positioned along the first When the first circuit board 140 moves in the first direction, the force is uniform everywhere, thereby further improving the stability of the first circuit board 140 moving in the first direction.

In some embodiments of the present disclosure, there are at least two connecting pieces 133, each connecting piece 133 is parallel to the optical axis of the lens assembly 120, and the distances from each connecting piece 133 to the optical axis are equal, thereby reducing vibration The layer 132 is always compressively deformed along the direction parallel to the optical axis of the lens assembly 120 , so as to achieve accurate vibration reduction and shock isolation for the first circuit board 140 on which the image sensor 150 is installed, thereby ensuring the imaging accuracy of the imaging system 100 .

In some embodiments of the present disclosure, as shown in FIG. 3 , the connector 133 includes a bolt 133-1 and a nut 133-2, one end of the bolt 133-1 is formed with a bolt head 133-3, and the nut 133-2 fits At the other end of the bolt 133-1, one of the bolt head 133-3 and the nut 133-2 constitutes a first limiter 1331, and the other one of the bolt head 133-3 and the nut 133-2 constitutes a second limiter. bit part 1332. Thus, the vibration-damping layer 132 in the vibration-damping structure 130 can be pre-compressed by pre-tightening the nut 133-2, so that the first circuit board 140 can be kept at the position of the vibration-damping structure 130 closest to the lens assembly. On a supporting body 131 of 120, even if there is a displacement caused by vibration and shock, it will quickly return to this position, and it is less affected by the attenuation of the damping material performance, so that the first circuit board 140 installed with the image sensor 150 is in the impact direction. The position is kept stable, so that the reliability of the position of the imaging system 100 is kept high, which can effectively avoid the problem of image virtual focus.

In some embodiments of the present disclosure, through holes for the bolts 133-1 to pass through are formed on the first circuit board 140 and the support body 131, so as to facilitate the connection piece 133 to pass through the first circuit board 140 and the support body 131. And the damping layer 132.

In some embodiments of the present disclosure, the supporting body 131 may adopt a plate-like structure, which mainly plays a role of supporting and stabilizing, and does not have a vibration-damping effect, and may be made of a hard material.

In some embodiments of the present disclosure, the vibration-damping layer 132 can be a damping rubber layer, which is less rigid and easy to deform, and has certain local damping characteristics. It can convert impact kinetic energy into internal energy and release it during compression deformation, so that the The structure 130 can restore the state before the vibration in a relatively short period of time to achieve precise vibration reduction and shock isolation, so that the imaging system 100 can be stabilized as soon as possible after a vibration or shock, improving the stability of the imaging system 100 and ensuring the accuracy of use. In addition, by adjusting different stiffnesses and damping ratio parameters of the vibration-damping layer 132, the vibration-damping structure 130 can be used according to a specified amplitude range and a specified shock-absorbing target, greatly increasing the design verification period.

In some embodiments of the present disclosure, the first circuit board 140 is provided with a first functional device 141, the first functional device 141 is provided on the side of the first circuit board 140 away from the lens assembly 120, the support body 131 and the vibration damping The layers 132 are provided with through holes, and the through holes communicate with each other to form the avoidance channel 135 , and the first functional device 141 is disposed in the avoidance channel 135 . In this embodiment, the first circuit board 140 is provided with a first functional device 141 , and the first functional device 141 may be a heat dissipation device or a component with other functions. The through holes on the support body 131 and the vibration-damping layer 132 communicate with each other to form an avoidance channel 135, and the first functional device 141 is arranged in the avoidance channel 135. In this way, the support body 131 and the vibration-damping layer 132 can pass through the first functional device 141. form a protective effect. In addition, when the first circuit board 140 moves relative to the supporting body 131 , the first functional device 141 on the first circuit board 140 will not contact the external structure, thereby preventing the first functional device 141 from being damaged.

In some embodiments of the present disclosure, as shown in FIG. 2 , the imaging system 100 further includes a second circuit board 160, the support member 110 is a cylindrical structure, and the vibration-damping structure 130 is disposed in the inner cavity of the cylindrical structure. The second circuit board 160 is connected to the end of the cylindrical structure away from the lens assembly 120, thereby making the entire imaging system 100 compact in structure, reducing unnecessary structures, small in size and weight, reducing shock absorbing amplitude, and improving reliability.

In some embodiments of the present disclosure, a second functional device 161 is disposed on the second circuit board 160, and the second functional device 161 is disposed on the side of the second circuit board 160 close to the lens assembly 120, farthest from the lens assembly 120 There is a distance between a support body 131 and the second circuit board 160; through holes are provided on the support body 131 and the damping layer 132, and each through hole communicates with each other to form an avoidance channel 135, and the second functional device 161 and the avoidance channel 135 relative. In this embodiment, the second circuit board 160 is provided with a second functional device 161, and the second functional device 161 may be a heat dissipation device or a component with other functions. The through holes on the support body 131 and the vibration-damping layer 132 communicate with each other to form an avoidance channel 135, and the second functional device 161 is opposite to the avoidance channel 135. Such arrangement can ensure that the vibration-damping structure 130 will not touch the second channel during vibration deformation. The circuit board 160, thereby improving the use safety of the second circuit board 160.

In some embodiments of the present disclosure, as shown in FIG. 2 , the support member 110 is a cylindrical structure, the vibration-damping structure 130 is disposed in the inner cavity of the cylindrical structure, and the inner wall of the cylindrical structure is provided with mounting ears 111 to reduce The vibration structure 130 is mounted on the mounting ear 111. The setting of the mounting ear 111 facilitates the installation of the vibration-damping structure 130. Specifically, a support body 131 close to the first circuit board 140 is installed on the mounting ear 111, and is offset against the mounting ear 111, thus, the vibration-damping structure 130 Installed in the inner cavity of the cylindrical structure.

Embodiments of the second aspect of the present disclosure provide an imaging device, including the imaging system 100 in any of the above embodiments.

According to the imaging device of the embodiment of the present disclosure, when the imaging system 100 of the imaging system 100 is subjected to an external impact, the vibration-damping layer 132 in the vibration-damping structure 130 undergoes compression deformation. On the one hand, during the compressive deformation process of the damping layer 132, the first circuit board 140 moves relative to the support body 131 connected to the support member 110, so that the impact energy on the support member 110 will not directly act on the first circuit board 140. The circuit board 140; on the other hand, the vibration-absorbing layer 132 can convert the impact kinetic energy into internal energy for release during the process of compression and deformation. Thus, the image sensor 150 is protected by the vibration damping structure 130 . In addition, compared with the external vibration reduction of the whole machine or the overall vibration reduction of the core module, the vibration reduction structure 130 provided in the embodiment of the present disclosure is smaller in volume, thus making the vibration amplitude during the vibration reduction process relatively smaller. Small, can well avoid touching other components in the imaging device during the vibration reduction process, thereby not causing damage to other components, thereby improving the reliability of the imaging device.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. any such actual relationship or order exists between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

Each embodiment of the present disclosure is described in a related manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments.

The above descriptions are only preferred embodiments of the present disclosure, and are not intended to limit the protection scope of the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present disclosure are included in the protection scope of the present disclosure.

Claims

An imaging system comprising:

supporting item;

a lens assembly, the lens assembly is connected to one end of the support;

A vibration-damping structure, the vibration-damping structure includes a support body, a vibration-damping layer and a connector, there are at least two support bodies, and one vibration-damping layer is arranged between every two adjacent support bodies, A support body closest to the lens assembly is connected to the support member, and the connection member passes through all the support bodies and the vibration-damping layer;

A first circuit board equipped with an image sensor, the first circuit board is arranged on the side of the vibration damping structure close to the lens assembly, the connecting piece is also passed through the first circuit board, the The end of the connecting piece far away from the lens assembly is provided with a first limiting portion, the first limiting portion abuts against a support body farthest from the lens assembly, and the end of the connecting piece close to the lens assembly A second limiting portion is provided, and the second limiting portion abuts against the first circuit board.
The imaging system according to claim 1, wherein there is no vibration transmission relationship in a direct contact manner between the first circuit board and the support member.
The imaging system according to claim 1, wherein the number of the support body is two, the number of the vibration-damping layer is one and is arranged between the two support bodies, and the connecting member passes through Two of the support body and the vibration damping layer.
The imaging system according to claim 1, wherein the vibration reduction structure further comprises a guide member disposed on a support closest to the lens assembly, and the guide member is configured to limit the first A circuit board can only move along a first direction, and the first direction is perpendicular to the supporting body.
The imaging system according to claim 4, wherein the guide member comprises at least two positioning columns, the positioning columns are parallel to the optical axis of the lens assembly, and the first circuit board is provided with the Positioning holes that match the positioning posts.
The imaging system according to claim 5, wherein the distances from each of the positioning columns to the optical axis are equal, and each of the positioning columns is uniformly distributed around the optical axis.
The imaging system according to claim 1, wherein the number of the connecting parts is at least two, each of the connecting parts is parallel to the optical axis of the lens assembly, and the distance between each of the connecting parts and the optical axis is equal distance.
The imaging system according to claim 1, wherein a first functional device is provided on the first circuit board, and the first functional device is provided on a side of the first circuit board away from the lens assembly, Both the support body and the damping layer are provided with through holes, and the through holes communicate with each other to form an escape channel, and the first functional device is arranged in the escape channel.
The imaging system according to claim 1, wherein the imaging system further comprises a second circuit board, the support member is a cylindrical structure, and the vibration damping structure is arranged in the inner cavity of the cylindrical structure, the The second circuit board is connected to an end of the cylindrical structure away from the lens assembly.
The imaging system according to claim 9, wherein a second functional device is arranged on the second circuit board, and the second functional device is arranged on a side of the second circuit board close to the lens assembly , there is a distance between a support body farthest from the lens assembly and the second circuit board;

Both the support body and the damping layer are provided with through holes, and the through holes communicate with each other to form an escape passage, and the second functional device is opposite to the escape passage.
The imaging system according to claim 1, wherein the support body is a hard plate structure, and the vibration damping layer is a damping rubber layer.
The imaging system according to claim 1, wherein the support member is a cylindrical structure, the damping structure is arranged in the inner cavity of the cylindrical structure, and mounting ears are provided on the inner wall of the cylindrical structure , the damping structure is installed on the mounting ear.
The imaging system according to claim 1, wherein the connecting member comprises a bolt and a nut, one end of the bolt is formed with a bolt head, the nut is fitted on the other end of the bolt, and the bolt head and One of the nuts constitutes the first limiting portion, and the other of the bolt head and the nut constitutes the second limiting portion.
An imaging device, comprising: the imaging system according to any one of claims 1 to 13.