WO2023242880A1

WO2023242880A1 - System and method for processing raw stones

Info

Publication number: WO2023242880A1
Application number: PCT/IN2023/050580
Authority: WO
Inventors: Rahul Mahendrakumar GAYWALA; Munjal Dhirajlal GAJJAR; Piyush Himmatbhai VAISHNANI; Nirav Jaysukhbhai Bhalala
Original assignee: Sahajanand Technologies Private Limited
Priority date: 2022-06-17
Filing date: 2023-06-17
Publication date: 2023-12-21

Abstract

Described herein is a method and system for processing raw gemstones in which a planner unit generates a 3D model of a raw gemstone, determines one or more cutting planes in the raw gemstone, marks the raw gemstone corresponding to the determined cutting planes and determines an optimum sticking position on the raw gemstone. The raw gemstone is securing to a gemstone holder in a sticking unit at the sticking position determined by the planner unit. A cutting sequence determination unit determines an optimum cutting sequence for cutting the gemstone, depending upon which the raw gemstone is cut into one or more pieces. The planner unit then generates a 3D model of each cut piece of the raw gemstone before performing further processing steps.

Description

SYSTEM AND METHOD FOR PROCESSING RAW STONES

TECHNICAL FIELD

The present subject matter, in general, relates to automatic processing of gemstones and, in particular, relates to a system and method for processing a raw gemstone to obtain one or more finished gemstones.

BACKGROUND

Gemstones are naturally occurring deposits of minerals and include, for example, diamonds, quartz, opals, sapphires, rubies, emeralds, and topaz. Typically, gemstones are found in their natural state and have highly irregular geometry. Many kinds of gemstones are available commercially, and their values differ from each other based on different properties associated with them. Typically, the commercial value of a gemstone depends upon multiple factors, such as weight, cut, clarity, color, luster and the manner in which the gemstone transmits, refracts, or reflects rays of light, which are also indicative of the grade of quality of the gemstone.

For assessing the quality of a diamond, the amount and type of impurities in a gemstone are determined at an atomic level within the crystal lattice of carbon atoms. The impurities may be in the form of structural imperfections, which may cause damage to a gemstone while processing the gemstone, thereby resulting in wastage of precious material of the gemstone. Such imperfections can include, for example, cracks, cleavages, knots, small included crystals of different orientations with respect to the rest of the stone, or other internal physical defects in some regions of the body of the gemstone. Based on the amount and type of impurities present in gemstones, the gemstones are generally graded into four basic types, namely type la, lb, Ila, and lib, and each grade is accordingly associated with a different range of commercial value.

In order to obtain the best properties of a raw gemstone having irregular dimensions, the raw gemstone undergoes a series of processes, like planning, estimating, measuring physical attributes, marking, cutting, bruting and polishing to arrive at its finished state. In certain cases, the processing steps may be performed on multiple machines, such as gemstone planner machine, gemstone cutting machine, and the like, collectively referred to as a gemstone processing system.

Usually, presence of structural imperfections within the gemstone is identified during planning phase in which the processing of the gemstone is planned. The planning operation is a process in which a raw gemstone is mapped to develop its three-dimensional (3D) model depicting deformities and cavities in the gemstone. The impurities, if any, present in the final gemstone, may degrade the value of the polished gemstone. In addition, the final gemstone may be required to be reprocessed for remove the impurities because a final gemstone with impurities, such as cavities, has little or no monetary value.

Once the planning process is complete, the gemstone is marked on its surface to indicate the references for further processing the gemstone. The markings can include table cutting marking, girdle bruiting marking, etc. Conventionally, the planning is done manually and on the basis of the planning, a laser is employed for marking the gemstone.

After the completion of the gemstone marking operation, the marked gemstone is taken to the gemstone cutting apparatus for setting and cutting operation. In addition, the 3D geometry and other cutting parameters may also be imported from the gemstone planning apparatus to the gemstone cutting apparatus for facilitating the cutting operation. For cutting, the raw gemstone is placed in the gemstone cutting apparatus and is set with respect to a cutting unit. In other words, the unprocessed raw gemstone is positioned in a predetermined orientation with respect to the cutting unit so that the cutting operation may commence. The setting of the raw gemstone in the cutting apparatus may be done manually or automatically by capturing multiple images of the raw gemstone by an image capturing device, such as a camera, installed inside the cutting unit and applying image processing techniques to identify the orientation of the raw gemstone with respect to the marking lines on the unprocessed gemstone. The raw gemstone undergoes multiple processes after cutting has been performed and finally, the gemstone is polished to obtain the processed gemstone.

However, the processing steps performed in conventional systems are time consuming and labour intensive owing to the fact that many processes are still dependent on the skills of the operator and the decision time of the operator often leads to a processing machine to remain idle, thereby affecting productivity of the system and increase in the cost. In addition, as the steps involve a substantial degree of skill on the manual labour, any error or misjudgments may lead to low quality of the final processed gemstone. For example, the table line and its relative marking line detection is done manually by setting and rotating the gemstone at various degrees to fetch the starting point of cutting the table portion of the gemstone for initiating the cutting process. Such manual setting increases the setting time and hence, the number of gemstones processed in a given period of time is substantially low. In addition, since the assessment is subjective and varies from person to person, the consistency in centering and adjustment of the gemstone is very less. In some cases, a small hammer is employed to manually adjust a gemstone to set it at a required position. However, the hammering requires a high degree of skill and may ultimately affect the life of the rotary spindle of the cutting machine. Moreover, the existing gemstone processing systems are configured to process one gemstone at a time and the user operating said systems is forced to sit idle to constantly monitor the operation while the processing of gemstone is in progress or during determination of sequence of cutting.

Therefore, there is a well felt need of a system and method for processing gemstones that address the aforementioned deficiencies and inadequacies in the industry.

SUMMARY

An object of the present subject matter is to eliminate the need to keep one or more gemstone processing units idle during determination of the sequence of cutting.

Another object of the present subject matter is to enhance the efficiency and throughput of a gemstone processing system.

Yet another object of the present subject matter is to substantially reduce the operating and service cost of a gemstone processing system.

Yet another object of the present subject matter is to substantially reduce the manual intervention of a user for gemstone processing. Yet another object of the present subject matter is to substantially reduce the human error during processing of raw gemstones.

Yet another object of the present subject matter is to substantially reduce the setting time of the raw gemstone in the cutting unit.

Yet another object of the present subject matter is to reduce the dependency on skilled operator and decision time during processing of raw gemstones.

Yet another object of the present subject matter is to ensure high quality of processing of raw gemstones.

Yet another object of the present subject matter is to improve consistency in centering and adjustment during processing of raw gemstones.

The present subject matter relates to a method for processing raw gemstones, the method comprises the steps of generating, by a planner unit, a 3D model of a raw gemstone; determining, by the planner unit, one or more cutting planes in the raw gemstone; marking, by the planner unit, the raw gemstone corresponding to the determined cutting planes; securing, in a sticking unit, the raw gemstone to a gemstone holder; determining, in a cutting sequence determination unit, an optimum cutting sequence for cutting the gemstone; cutting the raw gemstone into one or more pieces; and generating, by the planner unit, a 3D model of each cut piece of the raw gemstone before performing further processing steps.

In an embodiment, the step of securing the raw gemstone to a gemstone holder in the sticking unit is preceded by the step of determining, by the planner unit, an optimum sticking position on the raw gemstone, that is, the location on the raw gemstone at which the gemstone holder is to be stuck.

In another embodiment, the step of determining the optimum sticking position of the raw gemstone is performed either manually by the user or automatically based on the cutting planes determined by the planner unit.

In yet another embodiment, the step of determining optimum cutting sequence comprises measuring the raw gemstone and plotting a cutting line. In yet another embodiment, the step of determining optimum cutting sequence comprises the step of selecting three points by the user.

In yet another embodiment, the step of determining optimum cutting sequence comprises determining automatic sequence of cutting upon importing planning data from the planner unit into the cutting sequence determination unit with re-measuring option such that all cutting lines and planning results are fetched from the planner unit to the cutting sequence determination unit automatically.

In yet another embodiment, the method further comprises the steps of shaping and polishing.

Also described herein is a system for processing raw gemstones, the system comprises a planner unit configured to generate a 3D model of a raw gemstone, determine one or more cutting planes in the raw gemstone and perform marking on the raw gemstone corresponding to the determined cutting planes; a sticking unit for securing the raw gemstone to a gemstone holder; a cutting sequence determination unit configured for determining the cutting sequence of the raw gemstone for optimum cutting of the raw gemstone; and a cutting unit for cutting the raw gemstone into one or more pieces based on the sequence determined by the cutting sequence determination unit.

In an embodiment, the planner unit is configured to determine an optimum sticking position on the raw gemstone, that is, the location on the raw gemstone at which the gemstone holder is to be stuck depending upon the defined cutting planes.

In another embodiment, the planner unit is configured to re-plan each separated piece of the raw gemstone separately after cutting the raw gemstone into one or more separated pieces.

In yet another embodiment, the planner unit comprises a rotatable gemstone mounting stage for rotating the raw gemstone, an illumination device for illuminating the raw gemstone, an image capturing device for capturing a plurality of images of the raw gemstone upon illuminating said raw gemstone, a laser assembly for marking the raw gemstone by a laser beam, an optical means for focusing the laser beam from the laser assembly on the raw gemstone for marking the raw gemstone, and a first processing unit. In yet another embodiment, the first processing unit is configured to generate the 3D profile of the raw gemstone, operate the laser assembly, perform marking operation on the raw gemstone, determine the sticking position of the raw gemstone, mark the location on the raw gemstone that is to be stuck to the holder, and generate 3D profiles of the separated pieces of the raw gemstone after cutting operation has been performed.

In yet another embodiment, the first processing unit is connected to the image capturing device for obtaining and processing the plurality of images taken by the image capturing device and generating a 3-dimensional model of the raw gemstone as well as of each separated piece of the gemstone.

In yet another embodiment, the cutting sequence determination unit comprises a rotatable platform for mounting the gemstone holder containing the raw gemstone, an illumination unit comprising a light source for illuminating the gemstone, an image capturing device for capturing one or more images of the raw gemstone mounted on the gemstone holder and a second processing unit.

In yet another embodiment, the second processing unit is configured to receive the images from the image capturing device and measure the dimensions of the raw gemstone.

In yet another embodiment, the second processing unit is configured to mark symbols such as T, V, Y on the image of the raw gemstone captured by the cutting sequence determination unit to identify more than one part of the raw gemstone to be cut.

In yet another embodiment, the second processing unit is configured to superimpose the image of the raw gemstone captured by the image capturing device of the cutting sequence determination unit on the image of the gemstone imported from the planner unit and based on this superimposition, the second processing unit is configured to determine the cutting sequence.

In yet another embodiment, the second processing unit is configured to transform 3D coordinates of the raw gemstone measured in the planner unit to a new orientation based on the selection of different symbols. In yet another embodiment, the system further comprises a shaping machine comprising a 4P unit configured to perform shaping of table, crown, girdle and pavilion of the gemstone.

In yet another embodiment, the system further comprises a polishing unit for polishing each piece of the cut gemstone after the shaping operation is complete.

BRIEF DESCRIPTION OF ACCOMPANYING DRAWINGS

The present invention, both as to its organization and manner of operation, together with further objects and advantages, may best be understood by reference to the following description, taken in connection with the accompanying drawings. These and other details of the present invention will be described in connection with the accompanying drawings, which are furnished only by way of illustration and not in limitation of the invention, and in which drawings:

Figure 1 illustrates a flow chart of a method for processing a raw gemstone in accordance with one embodiment of the present subject matter.

Figure 2 illustrates a block diagram of a system for processing a raw gemstone in accordance with one embodiment of the present subject matter.

Figure 3 illustrates a block diagram of a planner unit in accordance with one embodiment of the present subject matter.

Figure 4 illustrates a block diagram for a cutting sequence determination unit in accordance with one embodiment of the present subject matter.

Figure 5 illustrates a perspective view of a gemstone holder in accordance with one embodiment of the present subject matter.

DETAILED DESCRIPTION

The following presents a detailed description of various embodiments of the present subject matter with reference to the accompanying drawings.

The embodiments of the present subject matter are described in detail with reference to the accompanying drawings. However, the present subject matter is not limited to these embodiments which are only provided to explain more clearly the present subject matter to a person skilled in the art of the present disclosure. In the accompanying drawings, like reference numerals are used to indicate like components.

The specification may refer to "an", "one", "different" or "some" embodiment(s) in several locations. This does not necessarily imply that each such reference is to the same embodiment(s), or that the feature only applies to a single embodiment. Single features of different embodiments may also be combined to provide other embodiments.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless expressly stated otherwise. It will be further understood that the terms "includes", "comprises", "including" and/or "comprising" when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "attached" or "connected" or "coupled" or "mounted" to another element, it can be directly attached or connected or coupled to the other element or intervening elements may be present. As used herein, the term "and/or" includes any and all combinations and arrangements of one or more of the associated listed items.

The figures depict a simplified structure only showing some elements and functional entities, all being logical units whose implementation may differ from what is shown.

Figure 1 illustrates a flow diagram of a method 100 for processing a raw gemstone in accordance with one embodiment of the present subject matter. In an embodiment, a raw gemstone in its natural irregular state may be divided into two or more final gemstones depending upon the geometry of final gemstones to be achieved. In another embodiment, a single final gemstone may be achieved from the processing of a raw gemstone. The first step in the method 100 for processing a raw gemstone comprises a planning step 102 in which the planning data in the form of a 3-dimensional model or 3-dimensional profile of a raw gemstone is generated in a planner unit.

Once the three-dimensional model of the raw gemstone is generated, the cutting planes in the raw gemstone are determined 104 by the planner unit and markings corresponding to the cutting planes are performed 106 on the raw gemstone by the same planner unit, in a preferred embodiment.

Once the marking 106 of the raw gemstone is complete, the marked raw gemstone is secured 108 on a gemstone holder in a sticking unit. In a preferred embodiment, the marked gemstone is stuck to the gemstone holder by means of glue or any other suitable means. The sticking unit is a unit at which the raw gemstone is stuck on the gemstone holder for further processing. In a preferred embodiment, the sticking position of the raw gemstone, i.e., the location on the raw gemstone at which the gemstone holder is to be stuck is determined and marked by the planner unit depending upon the cutting planes to ensure optimum cutting of the raw gemstone in subsequent cutting step. However, in another embodiment, the sticking position of the raw gemstone or the location on the raw gemstone that is to be stuck to the holder may be decided by the user based on the markings on the raw gemstone so as to obtain optimum cutting of the raw gemstone.

Once the gemstone is stuck to the gemstone holder at the appropriate position and before performing the cutting operation on the raw gemstone, re-planning 110 of the raw gemstone is performed to determine optimum sequence of cutting of the raw gemstone in a cutting sequence determination unit based on the markings on the raw gemstone. In an embodiment, the cutting sequence may be determined by the user in the cutting sequence determination unit by measuring the raw gemstone and plotting a cutting line. In a preferred embodiment, each plane in this step 110 is determined by selecting three points manually by the user. In another preferred embodiment, the cutting sequence determination unit is configured to determine the cutting sequence automatically. In an embodiment, the automatic sequence of cutting can be determined when the raw gemstone is measured and each cutting line is selected by picking 3 points. In another embodiment, the automatic sequence of cutting can be determined upon importing planning data from the planner unit into the cutting sequence determination unit with re-measuring option such that all cutting lines and planning results are fetched from the planner unit to the cutting sequence determination unit automatically. Therefore, the present invention is configured to plan the optimum cutting sequence of the raw gemstone either manually or automatically. After the cutting sequence has been planned, the raw gemstone is cut 112 into one or more separated pieces by a cutting unit such that each piece of the raw gemstone separated from the gemstone holder can be subsequently processed to obtain final gemstones with pre-determined configuration and clarity.

After cutting, each separated piece of the cut raw gemstone is re-planned separately in the planner unit to generate 114 a 3D profile of each separated piece. Each separated piece of the cut raw gemstone then undergoes shaping step 116, preferably in a shaping unit, followed by polishing step 118 in a polishing unit. In a preferred embodiment, shaping of the separated pieces of the gemstone is performed on a 4P machine and the polishing unit may be operated manually or automatically.

The present subject matter also provides a system 200 for processing raw gemstones. The system according to the present invention comprises a plurality of components. For example, and by no way limiting the scope of the present invention, the system 200 comprises a planner unit 202, a sticking unit 204, a cutting sequence determination unit 206, a cutting unit 208, a shaping unit 210 and a polishing unit 212. In an embodiment, the planner unit 202 is configured to plan a raw gemstone, create its 3D profile and mark said raw gemstone. The planner unit 202 is also configured to re-plan each separated piece of the raw gemstone separately after the cutting operation on the raw gemstone has been performed in the cutting unit 208. In another preferred embodiment, the planner machine 202 is configured to determine the optimum sticking position of the raw gemstone or the location on the gemstone that is to be stuck to the gemstone holder depending upon the defined cutting planes to ensure that optimum cutting of the gemstone can be performed in the cutting unit 208.

A block diagram of the planner unit 202 is depicted in Figure 2 in accordance with one embodiment of the present subject matter. In a preferred embodiment, the planner unit 202 comprises a plurality of components. For example and by no way limiting the scope of the present subject matter, the planner unit 202 comprises a rotatable gemstone mounting stage 301, an illumination device 302, an image capturing device 303, a laser assembly 304, an optical means 305 and a first processing unit 306. In a preferred embodiment, the gemstone mounting stage 301 of the planner unit 202 comprises but is not limited to a rotatable platform or a turntable that is configured to support and rotate the raw gemstone G about a central vertical axis X of the gemstone mounting stage 301. One or more motors (not shown) may be provided for enabling rotation of the gemstone mounting stage 301 during operation. The gemstone mounting stage 301 of the planner unit 202 supports the raw gemstone G such that the raw gemstone G rotates with the rotation of the gemstone mounting stage 301. In a preferred embodiment, the raw gemstone G is centered, i.e., located at the center of the gemstone mounting stage 301 such that upon rotation of the gemstone mounting stage 301 about its vertical central axis X, the raw gemstone G also rotates about the axis X of the gemstone mounting stage.

In an embodiment, the illumination device 302 of the planner unit 202 is configured to illuminate the gemstone G. In a preferred embodiment, the illumination device 302 is provided on one side of the gemstone mounting stage 301 for illuminating the raw gemstone G such that when the raw gemstone G is placed on the gemstone mounting stage 301 and the illumination device 302 triggered, all the surfaces of the gemstone G are appropriately illuminated. In an embodiment, the illumination device 302 comprises a collimated light source or alternately an ordinary light source.

In an embodiment, the image capturing device 303 of the planner unit 202 is configured to capture a plurality of images of the raw gemstone G so that a 3D profile of said raw gemstone G can be generated by the first processing unit 306. The image capturing device 303 is also configured to capture a plurality of images of the separated pieces of the cut raw gemstone after the cutting operation has been performed so that 3D profiles of the respective separated pieces of the raw gemstone can be generated by the first processing unit 306. As shown in Figure 2, the image capturing device 303 is mounted on the other side of the gemstone mounting stage 301 that is diametrically opposite to the illumination device 302. In a preferred embodiment, the image capturing device 303 comprises a camera that is configured to take a plurality of images of the raw gemstone as well as a plurality of images of the separated pieces of the raw gemstone when said raw gemstone or its separated pieces are respectively rotated with the rotation of the gemstone mounting stage 301.

In an embodiment, the laser assembly 304 of the planner unit 202 comprises a laser source that is configured to generate a laser beam for marking the raw gemstone G. An optical means 305 comprising a plurality of lenses is provided between the laser assembly 304 and the gemstone mounting stage 301 for focusing the laser beam on the raw gemstone G for marking the gemstone.

In a preferred embodiment, the first processing unit 306 is configured to generate the 3D profile of the raw gemstone G, operate the laser assembly 304, perform marking operation on the raw gemstone G, determine the sticking position of the raw gemstone G or the location on the gemstone that is to be stuck to the gemstone holder depending upon the defined cutting planes to ensure that optimum cutting of the gemstone can be performed in the cutting unit 208, mark the location on the raw gemstone G that is to be stuck to the holder in the sticking unit 204, and generate the 3D profiles of the separated pieces of the raw gemstone G after cutting operation has been performed. In an embodiment, the first processing unit 306 of the planner unit 202 is connected to the image capturing device 303 for obtaining and processing the plurality of images taken by the image capturing device 303 and generating 3-dimensional model of the raw gemstone G or each separated piece of the gemstone.

It is understood that various methods may be employed by the planner unit 202 to determine the geometry of the raw gemstone by three-dimensional profiling techniques. One such method is to create a volumetric model of the raw gemstone.

In a preferred embodiment, the sticking unit 204 is configured to optimally secure or stick the planned and marked raw gemstone G on a gemstone holder so that subsequent operations can be performed on said raw gemstone G without any error that may occur due to misalignment or incorrect orientation of the raw gemstone. The sticking unit is a unit at which the raw gemstone is stuck on the gemstone holder for further processing. In a preferred embodiment, the sticking position of the raw gemstone, i.e., the location on the raw gemstone at which the gemstone holder is to be stuck is determined and marked by the planner unit depending upon the cutting planes to ensure optimum cutting of the raw gemstone in subsequent cutting step. However, in another embodiment, the sticking position of the raw gemstone or the location on the raw gemstone that is to be stuck to the holder may be decided by the user based on the markings on the raw gemstone so as to obtain optimum cutting of the raw gemstone. In a preferred embodiment, a perspective view of the gemstone holder H is depicted in Figure 5. The gemstone holder H of the present embodiment may be referred to as an elongated die that holds the raw gemstone G. In an embodiment, as shown in Figure 5, the gemstone holder H comprises a tapered or curved bottom end Hl along its length. In other words, the gemstone holder H is tapered along its length or has a curve at the bottom, as shown in Figure 5, for the ease of placement of the gemstone holder H in the cutting unit 208. In another embodiment, the gemstone holder H may comprise other configuration or a combination of multiple configurations for easy placement of the gemstone holder H in the cutting unit 208. In yet another embodiment, the gemstone holder H comprises a rotary indexing member H2 for accurate angular positioning of the gemstone holder H during positioning of the gemstone holder H in the cutting unit. In a preferred embodiment, the gemstone holder H further comprises a gemstone seat H3 on which the raw gemstone is secured, preferably stuck, in the sticking unit 204. In a preferred embodiment, the gemstone seat H3 is provided at the upper end of the gemstone holder H and the raw gemstone G may be glued at the top of the gemstone seat H3 in an orientation that enables optimum cutting of the raw gemstone during cutting operation.

Figure 4 illustrates a block diagram for the cutting sequence determination unit 206 in accordance with one embodiment of the present subject matter. The cutting sequence determination unit 206 is configured to scan the raw gemstone G mounted on the gemstone holder H for determining the sequence of cutting of the raw gemstone G before the cutting operation is performed. In different embodiments, the cutting sequence determination unit 206 can be configured such that the sequence of cutting of the raw gemstone G can either be determined manually by the user or automatically by the cutting sequence determination unit 206. In an embodiment, the cutting sequence determination unit 206 comprises but is not limited to a rotatable platform 401 for mounting the gemstone holder H containing the raw gemstone G, an illumination unit 402 comprising a light source, an image capturing device 403, such as a camera, for capturing one or more images of the raw gemstone G mounted on the gemstone holder H, and a second processing unit 404.

In an embodiment, the cutting sequence determination unit 206 is configured to generate one or more images of the raw gemstone G mounted on the gemstone holder H with the help of the image capturing device 403. Thereafter, the second processing unit 404 of the cutting sequence determination unit 206 receives the images from the image capturing device 403 and measures the dimensions of the raw gemstone G. In the manual cutting sequence determination method, the planes are determined by selecting three points on each plane manually by the user in an embodiment. In another embodiment, the automatic sequence of cutting can be determined when the gemstone is manually measured and each cutting line is selected manually by picking 3 points. In yet another embodiment, an automatic method of cutting sequence determination is performed in which the 3D profile of the gemstone generated in the planner unit 202 is fed into the cutting sequence determination unit 206. Then, the second processing unit 404 marks symbols such as T, V, Y on the image of the raw gemstone G captured by the cutting sequence determination unit 206 to identify more than one part of the raw gemstone to be cut. Thereafter, the second processing unit 404 superimposes the image of the raw gemstone G captured by the image capturing device 403 of the cutting sequence determination unit 206 on the image of the gemstone imported from the planner unit 202 and based on this superimposition, the second processing unit 404 determines the cutting sequence. In an embodiment, 3D coordinates of the raw gemstone measured in the planner unit 202 is "transformed" to new orientation by the second processing unit 404 based on the selection of different symbols. The step of transformation to new orientation comprises rotating or moving linearly to match both the 3D models. In another embodiment, the "re-matching" process can be done automatically by the second processing unit 404 without selection of any symbols. The process of re-matching comprises putting one 3D model exactly over the 2nd 3D model such that both the 3D models match exactly. In such embodiment, a raw gemstone G is measured in the cutting sequence determination unit 206 and data corresponding to said raw gemstone G imported from the planner unit 202 is selected and re-match process is performed.

According to a preferred embodiment, the first processing unit and the second processing unit individually comprise one or more processors. In an embodiment, the processor can be a single processing unit or a number of units, all of which could also include multiple computing units. The processor may be implemented as one or more microprocessors, microcomputers, microcontrollers, digital signal processors, central processing units, state machines, logic circuitries, and/or any devices that manipulate signals based on operational instructions. Among other capabilities, the processor is configured to fetch and execute computer-readable instructions and data stored in a memory. The functions of the processors may be provided through the use of dedicated hardware as well as hardware capable of executing software in association with appropriate software.

In an embodiment, the first processing unit and the second processing unit may individually include one or more modules. The module(s) may include routines, programs, objects, components, data structures, etc., which perform particular tasks or implement particular abstract data types. In an embodiment, the first processing unit and the second processing unit may include one or more interfaces having a variety of machine readable instructions-based interfaces and hardware interfaces that allow the first processing unit and the second processing unit to interact with different entities. The memory may be coupled to the processor and may, among other capabilities, provide data and instructions for generating different requests. In an embodiment, the memory can include any computer-readable medium known in the art including, for example, volatile memory, such as static random access memory (SRAM) and dynamic random access memory (DRAM), and/or non-volatile memory, such as read only memory (ROM), erasable programmable ROM, flash memories, hard disks, optical disks, and magnetic tapes. The data serves, amongst other things, as a repository for storing data that may be fetched, processed, received, or generated by one or more of the module(s).

In an embodiment, the processing units of the planner unit and the cutting sequence determination unit are separate from each other and perform the respective steps separately in the planner unit and the cutting sequence determination unit. In another embodiment, the planner unit and the cutting sequence determination unit comprise a common processing unit.

In a preferred embodiment, the cutting unit 208 comprises an automatic cutting unit that is configured to perform cutting operation on the raw gemstone G to divide the raw gemstone into multiple pieces or gemstones having same or different sizes for producing multiple gemstones from said raw gemstone G based on the sequence determined by the cutting sequence determination unit 206. In another embodiment, the cutting unit 208 may be configured to remove undesired material from the raw gemstone G when a single gemstone is desired from the raw gemstone. For operation, the planning data from the cutting sequence determination unit 206 is fed into the cutting machine 208 for performing the cutting operation in a preferred embodiment.

In an embodiment, the shaping unit 210 may comprise a 4P unit that is configured to perform shaping of table, crown, girdle and pavilion of the gemstone. In another embodiment, the shaping unit 210 may comprise an automatic shaping unit comprising but not limited to at least one conveyor for feeding gemstones in the shaping machine 210, at least one channel for guiding the gemstones inside the shaping machine 210 and at least one robotic arm for transferring the gemstone G from the channel to the fixture located in the shaping machine 210 for performing the shaping operation and for transferring the gemstone from the fixture to the output bin after the shaping operation has been performed. In an embodiment, the polishing unit 212 may be a manual polishing unit or an automatic polishing unit that is configured to polish each piece of the cut gemstone after the shaping operation is complete.

The method and system according to the present subject matter eliminates the need to keep one or more gemstone processing units idle while the sequence of cutting is being determined, thereby resulting in enhanced efficiency and throughput of the gemstone processing system. The present invention also ensures reduced operating and service cost of gemstone processing system. Further, manual intervention of the user for gemstone processing is substantially reduced, thereby reducing the human errors substantially. Furthermore, the cutting sequence determination unit ensures that the setting time of the raw gemstone in the cutting unit is substantially reduced.

While the preferred embodiments of the present invention have been described hereinabove, it should be understood that various changes, adaptations, and modifications may be made therein without departing from the spirit of the invention and the scope of the appended claims. It will be obvious to a person skilled in the art that the present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects only as illustrative and not restrictive.

Claims

We Claim:

1. A method for processing raw gemstones, the method comprising the steps of: generating, by a planner unit, a 3D model of a raw gemstone; determining, by the planner unit, one or more cutting planes in the raw gemstone; marking, by the planner unit, the raw gemstone corresponding to the determined cutting planes; securing, in a sticking unit, the raw gemstone to a gemstone holder; determining, in a cutting sequence determination unit, an optimum cutting sequence for cutting the gemstone; cutting the raw gemstone into one or more pieces; and generating, by the planner unit, a 3D model of each cut piece of the raw gemstone before performing further processing steps.

2. The method for processing raw gemstones as claimed in claim 1, wherein the step of securing the raw gemstone to a gemstone holder in the sticking unit is preceded by the step of determining, by the planner unit, an optimum sticking position on the raw gemstone, that is, the location on the raw gemstone at which the gemstone holder is to be stuck.

3. The method for processing raw gemstones as claimed in claim 2, wherein the step of determiningthe optimum sticking position of the raw gemstone is performed either manually by the user or automatically based on the cutting planes determined by the planner unit.

4. The method for processing raw gemstones as claimed in any one of previous claims, wherein the step of determining optimum cutting sequence comprises measuring the raw gemstone and plotting a cutting line.

5. The method for processing raw gemstones as claimed in any one or previous claims, wherein the step of determining optimum cutting sequence comprises the step of selecting three points by the user.

6. The method for processing raw gemstones as claimed in any one or previous claims, wherein the step of determining optimum cutting sequence comprises determining automatic sequence of cutting upon importing planning data from the planner unit into the cutting sequence determination unit with re-measuring option such that all cutting lines and planning results are fetched from the planner unit to the cutting sequence determination unit automatically.

7. The method for processing raw gemstones as claimed in any one or previous claims further comprising the steps of shaping and polishing.

8. A system for processing raw gemstones, the system comprising: a planner unit configured to generate a 3D model of a raw gemstone, determine one or more cutting planes in the raw gemstone and perform marking on the raw gemstone corresponding to the determined cutting planes; a sticking unit for securing the raw gemstone to a gemstone holder; a cutting sequence determination unit configured for determining the cutting sequence of the raw gemstone for optimum cutting of the raw gemstone; and a cutting unit for cutting the raw gemstone into one or more pieces based on the sequence determined by the cutting sequence determination unit.

9. The system as claimed in claim 8, wherein the planner unit is configured to determine an optimum sticking position on the raw gemstone, that is, the location on the raw gemstone at which the gemstone holder is to be stuck depending upon the defined cutting planes.

10. The system as claimed in claims 8 or 9, wherein the planner unit is configured to re-plan each separated piece of the raw gemstone separately after cutting the raw gemstone into one or more separated pieces.

11. The system as claimed in any one of claims 8 to 10, wherein the planner unit comprises a rotatable gemstone mounting stage for rotating the raw gemstone, an illumination device for illuminating the raw gemstone, an image capturing device for capturing a plurality of images of the raw gemstone upon illuminating said raw gemstone, a laser assembly for marking the raw gemstone by a laser beam, an optical means for focusing the laser beam from the laser assembly on the raw gemstone for marking the raw gemstone, and a first processing unit.

12. The system as claimed in claim 11, wherein the first processing unit is configured to generate the 3D profile of the raw gemstone, operate the laser assembly, perform marking operation on the raw gemstone, determine the sticking position of the raw gemstone, mark the location on the raw gemstone that is to be stuck to the holder, and generate 3D profiles of the separated pieces of the raw gemstone after cutting operation has been performed.

13. The system as claimed in claims 11 or 12, wherein the first processing unit is connected to the image capturing device for obtaining and processing the plurality of images taken by the image capturing device and generating a 3-dimensional model of the raw gemstone as well as of each separated piece of the gemstone.

14. The system as claimed in any one of claims 8 to 13, wherein the cutting sequence determination unit comprises a rotatable platform for mounting the gemstone holder containing the raw gemstone, an illumination unit comprising a light source for illuminating the gemstone, an image capturing device for capturing one or more images of the raw gemstone mounted on the gemstone holder and a second processing unit.

15. The system as claimed in claim 14, wherein the second processing unit is configured to receive the images from the image capturing device and measure the dimensions of the raw gemstone.

16. The system as claimed in claim 14 or 15, wherein the second processing unit is configured to mark symbols such as T, V, Y on the image of the raw gemstone captured by the cutting sequence determination unit to identify more than one part of the raw gemstone to be cut.

17. The system as claimed in claims 14 to 16, wherein the second processing unit is configured to superimpose the image of the raw gemstone captured by the image capturing device of the cutting sequence determination unit on the image of the gemstone imported from the planner unit and based on this superimposition, the second processing unit is configured to determine the cutting sequence.

18. The system as claimed in claim 16, wherein the second processing unit is configured to transform 3D coordinates of the raw gemstone measured in the planner unit to a new orientation based on the selection of different symbols.

19. The system as claimed in claims 8 to 18 further comprises a shaping machine comprising a 4P unit configured to perform shaping of table, crown, girdle and pavilion of the gemstone.

20. The system as claimed in claim 19 further comprises a polishing unit for polishing each piece of the cut gemstone after the shaping operation is complete.