WO2023233487A1 - Information processing device, search method, and search program - Google Patents

Information processing device, search method, and search program Download PDF

Info

Publication number
WO2023233487A1
WO2023233487A1 PCT/JP2022/022003 JP2022022003W WO2023233487A1 WO 2023233487 A1 WO2023233487 A1 WO 2023233487A1 JP 2022022003 W JP2022022003 W JP 2022022003W WO 2023233487 A1 WO2023233487 A1 WO 2023233487A1
Authority
WO
WIPO (PCT)
Prior art keywords
information
electronic
electronic component
identification
storage unit
Prior art date
Application number
PCT/JP2022/022003
Other languages
French (fr)
Japanese (ja)
Inventor
楊 鐘本
良彰 中嶋
Original Assignee
日本電信電話株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電信電話株式会社 filed Critical 日本電信電話株式会社
Priority to PCT/JP2022/022003 priority Critical patent/WO2023233487A1/en
Publication of WO2023233487A1 publication Critical patent/WO2023233487A1/en

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/50Information retrieval; Database structures therefor; File system structures therefor of still image data
    • G06F16/53Querying
    • G06F16/532Query formulation, e.g. graphical querying

Definitions

  • the present invention relates to an information processing device, a search method, and a search program.
  • BOM Bit of Materials
  • CAD Computer Aided Design
  • IoT device IoT device
  • OEM Finder technology finds similar OEM products from images and, if the OEM (Original Equipment Manufacturing) product has a vulnerability, notifies the OEM that the OEM's product also has a vulnerability (for example, , see Non-Patent Document 1).
  • the present invention has been made in view of the above, and an object of the present invention is to provide an information processing device, a search method, and a search program that can quickly deal with problems when a problem is discovered in an electronic component.
  • the information processing device of the present invention includes an identification unit that identifies first information regarding characteristics of electronic components included in the electronic board from image data of the electronic board; Using the first information identified by the identification unit, the second information is transferred from a first storage unit that stores first information regarding the characteristics of the electronic component set in advance and second information regarding the electronic component. a storage unit that acquires information and stores the acquired second information in a second storage unit in association with identification information for identifying an electronic board or an electronic component; and when the second information is received; and a search unit that searches the second storage unit for the identification information corresponding to the second information.
  • FIG. 1 is a block diagram showing an example of the configuration of a system according to an embodiment.
  • FIG. 2 is a block diagram illustrating the configuration of the information processing apparatus of this embodiment.
  • FIG. 3 is a diagram showing an example of information stored in the feature information DB.
  • FIG. 4 is a diagram showing an example of information stored in the parts information DB.
  • FIG. 5 is a diagram showing an example of information stored in the configuration information DB.
  • FIG. 6 is a diagram illustrating the processing of the identification unit.
  • FIG. 7 is a diagram illustrating the processing of the storage unit.
  • FIG. 8 is a flowchart illustrating an example of a processing procedure at the time of registration by the information processing apparatus according to the embodiment.
  • FIG. 8 is a flowchart illustrating an example of a processing procedure at the time of registration by the information processing apparatus according to the embodiment.
  • FIG. 9 is a flowchart illustrating an example of a processing procedure during a search performed by the information processing apparatus according to the embodiment.
  • FIG. 10 is a block diagram illustrating the configuration of an information processing device according to a modification.
  • FIG. 11 is a diagram illustrating an example of information stored in the configuration information DB according to the modification.
  • FIG. 12 is a diagram showing a computer that executes a program.
  • FIG. 1 is a block diagram showing an example of the configuration of a system according to an embodiment.
  • the system includes an information processing device 10 and a photographing device 20.
  • the information processing device 10 and the photographing device 20 are connected to each other via a network 30.
  • each device may communicate via any communication network, such as the Internet, LAN, or VPN (Virtual Private Network), regardless of whether it is wired or wireless.
  • the configuration shown in FIG. 1 is only an example, and the specific configuration and the number of each device are not particularly limited.
  • the information processing device 10 for example, acquires image data of an electronic board (a board on which electronic components are arranged) included in an IoT device and identifies the color, shape, etc. of the electronic components. Then, the information processing device 10 detects the electronic components to be configured by comparing them with the component information DB 13b that stores catalog information of electronic components, etc., and constructs the configuration information DB 13c. For example, when it is discovered that an electronic component is contaminated with vulnerability or malware, the information processing device 10 responds to a user's search request and searches for the presence of the target electronic component on an electronic board operated by the user. By replying with the result, the usage status of the electronic component can be quickly searched.
  • the photographing device 20 acquires image data and spatial data of the electronic board and transmits them to the information processing device 10.
  • the imaging device 20 uses a camera to capture image data of an electronic board, and uses a laser to measure spatial data.
  • the photographing device 20 may acquire only image data.
  • the photographing device 20 may be installed in a factory and automatically take an image of the electronic board, for example, or may take an image of the electronic board manually at any location.
  • FIG. 2 is a block diagram illustrating the configuration of the information processing apparatus of this embodiment.
  • the information processing device 10 of this embodiment includes a communication processing section 11, a control section 12, and a storage section 13.
  • the communication processing unit 11 is realized by a NIC (Network Interface Card) or the like, and controls communication via a telecommunication line such as a LAN (Local Area Network) or the Internet.
  • NIC Network Interface Card
  • LAN Local Area Network
  • the storage unit 13 stores data and programs necessary for various processing by the control unit 12, and has a feature information DB 13a, a parts information DB 13b, and a configuration information DB 13c.
  • the storage unit 13 is a semiconductor memory element such as a RAM (Random Access Memory) or a flash memory, or a storage device such as a hard disk or an optical disk.
  • the characteristic information DB 13a stores information regarding the characteristics of electronic components included in the electronic board. For example, as illustrated in FIG. 3, the feature information DB 13a identifies electronic components from image data and spatial data in association with "equipment ID” that uniquely identifies electronic boards and "component ID” that uniquely identifies electronic components. Identification information representing the characteristics of the electronic component (color, shape, logo mark, printed character string, etc.) and the registration date and time are stored. Note that "SIP” illustrated in FIG. 3 is an abbreviation for Single in-line Package, and "QFP” is an abbreviation for Quad Flat Package.
  • the component information DB 13b stores preset identification information (first information) and configuration information regarding electronic components (second information).
  • the parts information DB 13b stores "identification information" of electronic parts manually set from web pages and catalogs in association with "ID” that uniquely identifies electronic parts, and electronic parts.
  • ⁇ Configuration information'' that is detailed information about the ⁇ configuration information'' is stored.
  • the configuration information includes the manufacturer of the electronic component, the function of the electronic component, the start of manufacturing of the electronic component, the end of manufacturing of the electronic component, the model number of the electronic component, and the like.
  • the configuration information DB 13c stores configuration information in association with device IDs and component IDs. For example, as illustrated in FIG. 5, the configuration information DB 13c stores "registration date and time” and "configuration information” which is detailed information on electronic components in association with “equipment ID” and “component ID”. . Note that the configuration information DB 13c is not limited to storing "registration date and time” and “configuration information” in association with "device ID” and “parts ID”; "Registration date and time” and “configuration information” may be stored in association with any one of the following.
  • the control unit 12 has an internal memory for storing programs that define various processing procedures and required data, and executes various processes using these.
  • the control unit 12 includes an identification unit 12a, a storage unit 12b, and a search unit 12c.
  • the control unit 12 is an electronic circuit such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit), or an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).
  • the identification unit 12a identifies identification information regarding the characteristics of electronic components included in the electronic board from the image data of the electronic board. For example, the identification unit 12a selects any one of the color of the electronic component, the shape of the electronic component, the number of terminals of the electronic component, a logo mark written on the electronic component, and text written on the electronic component as the identification information. identify one or more.
  • the identification unit 12a acquires image data of an electronic board from the imaging device 20, specifies the area of the electronic component included in the electronic board from the image data, and Identify identification information.
  • the identification unit 12a may utilize image processing technology such as edge detection, for example, in order to identify the area of the electronic component.
  • the identification unit 12a may acquire not only image data but also spatial data. The identification unit 12a then stores the identified identification information in the feature information DB 13a in association with the device ID and the component ID.
  • the storage unit 12b uses the identification information identified by the identification unit 12a to acquire configuration information from a component information DB 13b that stores identification information regarding characteristics of electronic components set in advance and configuration information regarding electronic components.
  • the configured configuration information is stored in the configuration information DB 13c in association with the device ID and component ID.
  • the storage unit 12b stores any one or more of the manufacturer of the electronic component, the model number of the electronic component, the function of the electronic component, the manufacturing start time, and the manufacturing end time of the electronic component as the configuration information in the component information DB 13b.
  • the acquired configuration information is stored in the configuration information DB 13c in association with the device ID and component ID.
  • the storage unit 12b collates data in the parts information DB 13b and feature information DB 13a, and creates data in the configuration information DB 13c. For example, the storage unit 12b calculates the similarity between the identification information identified by the identification unit 12a and the identification information stored in the parts information DB 13b, and if the similarity is equal to or higher than a predetermined threshold, the storage unit 12b calculates the similarity between the identification information identified by the identification unit 12a and the identification information stored in the parts information DB 13b. The configuration information corresponding to the identification information stored in the DB 13b is acquired, and the acquired configuration information is stored in the configuration information DB 13c in association with the device ID and the component ID.
  • the search unit 12c searches the configuration information DB 13c for the device ID or component ID corresponding to the configuration information. For example, when a user discovers a vulnerability in an IoT device having an electronic board or discovers that it is contaminated with malware, the user inputs configuration information such as the target electronic component manufacturer and model number. The search unit 12c receives input of configuration information and outputs whether the electronic board (IoT device) uses the component.
  • FIG. 8 is a flowchart illustrating an example of a processing procedure at the time of registration by the information processing apparatus according to the embodiment.
  • FIG. 9 is a flowchart illustrating an example of a processing procedure during a search performed by the information processing apparatus according to the embodiment.
  • the identification unit 12a of the information processing device 10 acquires the image data of the electronic board (Yes at step S101)
  • the identification unit 12a of the information processing device 10 extracts identification information of the electronic components included in the electronic board from the image data of the electronic board. Identification (step S102).
  • the storage unit 12b uses the identified identification information to acquire configuration information from the component information DB 13b (step S103), and stores the acquired configuration information in the configuration information DB 13c in association with the device ID and the component ID. (Step S104).
  • the search unit 12c of the information processing device 10 receives the specification of the model number, manufacturer, etc. (Yes at step S201), the search unit 12c configures the device ID and parts ID corresponding to the specified information.
  • the information DB 13c is searched (step S202).
  • the search unit 12c outputs the searched device ID and component ID as the search result (step S203).
  • the search unit 12c searches the configuration information DB 13c by specifying conditions, and since "chip 2" is hit, the electronic board (IoT device) with the device ID "device 1" uses the corresponding component "chip 2". Output what is being done.
  • the information processing apparatus 10 identifies identification information regarding the characteristics of the electronic components included in the electronic board from the image data of the electronic board. Then, the information processing device 10 uses the identified identification information to acquire configuration information from the component information DB 13b that stores preset identification information and configuration information regarding electronic components, and uses the acquired configuration information to identify the device ID. and is stored in the configuration information DB 13c in association with the component ID. Subsequently, when receiving the configuration information, the information processing device 10 searches the configuration information DB 13c for the device ID or component ID corresponding to the configuration information. Therefore, the information processing device 10 can quickly deal with a problem when a problem is discovered in the electronic component.
  • the information processing device 10 identifies the color and shape of an electronic component included in an electronic board (a board on which electronic components are arranged) included in an IoT device, and collates it with the component information DB 13b that stores catalog information of electronic components. Detects the electronic components that it consists of. If it is discovered that an electronic component is vulnerable or has been contaminated with malware, the information processing device 10 can quickly search for whether or not the electronic component is used in an electronic board included in the IoT device.
  • the information processing device 10 users can understand the IoT devices they use at the level of electronic components, and can respond more quickly when vulnerabilities in electronic components or malware contamination is discovered. This will improve the user's security level.
  • the information processing device can store the combinations and number of electronic components used in electronic devices, share them among users, and detect abnormalities in order to eliminate counterfeit and inferior electronic components. By doing so, it may be possible to estimate whether the electronic component is a counterfeit product or an inferior product.
  • the information processing device 10A may further include an estimation unit 12d, as illustrated in FIG.
  • the estimating unit 12d determines that when electronic components of the same type are used in different electronic boards, the information regarding manufacturing included in each configuration information of the electronic components of the same type stored in the configuration information DB 13c is unknown. If the ratio is greater than or equal to a predetermined number, the electronic component is estimated to be of inferior quality.
  • the configuration information DB 13c may manage data for each user, as illustrated in FIG. 11.
  • the configuration information DB 13c stores data tables in which "device ID”, “component ID”, “registration date and time”, and "configuration information" are associated with each other for users A, B, and C. ing.
  • the processing of the estimation unit 12d will be explained using the example of FIG. For example, as illustrated in FIG. 11, it is assumed that users A, B, and C use the same types of electronic devices 1, 2, and 3. However, when looking at the configuration information of the electronic device, the serial number etc. that only user C identified from the image of the chip 1 was not a valid number or was a random number, so the production start date is unknown.
  • the estimating unit 12d detects that there is a possibility that the electronic device is an inferior product or a counterfeit product by calculating the percentage of unknown configuration information for the same electronic device. Note that, for example, the estimating unit 12d can determine whether the number is made up or not by searching for the serial number via a website to determine whether the product is a genuine product.
  • FIG. 12 is a diagram showing a computer that executes the program.
  • the computer 1000 includes, for example, a memory 1010, a CPU 1020, a hard disk drive interface 1030, a disk drive interface 1040, a serial port interface 1050, a video adapter 1060, and a network interface 1070. However, each of these parts is connected by a bus 1080.
  • the memory 1010 includes a ROM (Read Only Memory) 1011 and a RAM 1012, as illustrated in FIG.
  • the ROM 1011 stores, for example, a boot program such as BIOS (Basic Input Output System).
  • BIOS Basic Input Output System
  • Hard disk drive interface 1030 is connected to hard disk drive 1031, as illustrated in FIG.
  • Disk drive interface 1040 is connected to disk drive 1041, as illustrated in FIG.
  • a removable storage medium such as a magnetic disk or an optical disk is inserted into the disk drive 1041.
  • the serial port interface 1050 is connected to, for example, a mouse 1051 and a keyboard 1052, as illustrated in FIG.
  • Video adapter 1060 is connected to display 1061, for example, as illustrated in FIG.
  • the hard disk drive 1031 stores, for example, an OS 1091, an application program 1092, a program module 1093, and program data 1094. That is, the above program is stored, for example, in the hard disk drive 1031 as a program module in which commands to be executed by the computer 1000 are written.
  • the various data described in the above embodiments are stored as program data in, for example, the memory 1010 or the hard disk drive 1031. Then, the CPU 1020 reads out the program module 1093 and program data 1094 stored in the memory 1010 and the hard disk drive 1031 to the RAM 1012 as necessary, and executes various processing procedures.
  • program module 1093 and program data 1094 related to the program are not limited to being stored in the hard disk drive 1031, but may be stored in a removable storage medium, for example, and read by the CPU 1020 via a disk drive or the like.
  • the program module 1093 and program data 1094 related to the program are stored in another computer connected via a network (LAN (Local Area Network), WAN (Wide Area Network), etc.), and are transmitted via the network interface 1070. It may be read by the CPU 1020.
  • LAN Local Area Network
  • WAN Wide Area Network

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Data Mining & Analysis (AREA)
  • Databases & Information Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)

Abstract

An information processing device (10) identifies, from image data of an electronic substrate, identification information related to the feature of an electronic component included in the electronic substrate. Then, the information processing device (10) acquires, using the identified identification information, configuration information from a component information DB (13b) that stores preset identification information and configuration information related to the electronic component, and saves the acquired configuration information in a configuration information DB (13c) in association with the device ID and the component ID. Next, in response to receiving configuration information, the information processing device (10) searches the configuration information DB (13c) for the device ID or the component ID corresponding to the configuration information.

Description

情報処理装置、検索方法及び検索プログラムInformation processing device, search method and search program
 本発明は、情報処理装置、検索方法及び検索プログラムに関する。 The present invention relates to an information processing device, a search method, and a search program.
 近年、サプライチェーンの弱点を狙ったサイバー攻撃が顕在化、高度化している。企業がIoT(Internet of Things)機器を利用する際には、リスクマネジメントが一層重要となる。このため、脆弱性やマルウェア混入が発覚した際には利用している機器が原因となるソフトウェアやハードウェアを使用しているかを速やかに確認し、対処を行う必要がある。 In recent years, cyber attacks targeting weaknesses in the supply chain have become more obvious and sophisticated. Risk management becomes even more important when companies use IoT (Internet of Things) devices. Therefore, when a vulnerability or malware infection is discovered, it is necessary to promptly check whether the device being used uses the software or hardware that causes the problem, and take countermeasures.
 また、上述したようなリスクマネジメントを行う方法として、ある製品を作成した際の部品の構成表であり、CAD(Computer Aided Design)ソフトウェア等で出力されるBOM(Bill of Materials)や、IoT機器の画像から類似するOEM製品を見つけ、OEM(Original Equipment Manufacturing)元の製品に脆弱性がある場合、OEM先の製品にも脆弱性があることを通知するOEM Finderの技術が知られている(例えば、非特許文献1参照)。 In addition, as a method of risk management as described above, BOM (Bill of Materials), which is a composition table of parts when creating a certain product and is output by CAD (Computer Aided Design) software, etc., and IoT device There is a known OEM Finder technology that finds similar OEM products from images and, if the OEM (Original Equipment Manufacturing) product has a vulnerability, notifies the OEM that the OEM's product also has a vulnerability (for example, , see Non-Patent Document 1).
 しかしながら、従来の技術では、電子部品に問題が発覚した場合に素早く対処することができないという課題があった。例えば、BOMの技術では、メーカー側の情報提供が必要になるが、メーカー側は自身のノウハウ流出を懸念するため情報の提供が困難であり、電子部品に問題が発覚した場合に素早く対応することが難しかった。また、例えば、OEM Finderの技術では、製品の外観レベルでしか構成を把握できないため、チップレベルの構成物の情報は把握できず、電子部品に問題が発覚した場合に素早く対応することが難しかった。 However, with the conventional technology, there was a problem in that it was not possible to quickly deal with a problem when a problem was discovered with an electronic component. For example, BOM technology requires the manufacturer to provide information, but it is difficult for manufacturers to provide information because they are concerned about their own know-how being leaked, and it is difficult to quickly respond if a problem is discovered with an electronic component. was difficult. Also, for example, with OEM Finder's technology, it is only possible to understand the configuration at the external appearance level of the product, so information about the components at the chip level cannot be grasped, making it difficult to respond quickly if a problem is discovered with an electronic component. .
 本発明は、上記に鑑みてなされたものであって、電子部品に問題が発覚した場合に素早く対処することができる情報処理装置、検索方法及び検索プログラムを提供することを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to provide an information processing device, a search method, and a search program that can quickly deal with problems when a problem is discovered in an electronic component.
 上述した課題を解決し、目的を達成するために、本発明の情報処理装置は、電子基板の画像データから該電子基板に含まれる電子部品の特徴に関する第一の情報を識別する識別部と、前記識別部によって識別された第一の情報を用いて、予め設定された電子部品の特徴に関する第一の情報と電子部品に関する第二の情報とを記憶する第一の記憶部から当該第二の情報を取得し、取得した第二の情報を、電子基板または電子部品を識別する識別情報に対応付けて第二の記憶部に格納する格納部と、前記第二の情報を受け付けた場合に、当該第二の情報に対応する前記識別情報を前記第二の記憶部から検索する検索部とを有することを特徴とする。 In order to solve the above-mentioned problems and achieve the objects, the information processing device of the present invention includes an identification unit that identifies first information regarding characteristics of electronic components included in the electronic board from image data of the electronic board; Using the first information identified by the identification unit, the second information is transferred from a first storage unit that stores first information regarding the characteristics of the electronic component set in advance and second information regarding the electronic component. a storage unit that acquires information and stores the acquired second information in a second storage unit in association with identification information for identifying an electronic board or an electronic component; and when the second information is received; and a search unit that searches the second storage unit for the identification information corresponding to the second information.
 本発明によれば、電子部品に問題が発覚した場合に素早く対処することが可能である。 According to the present invention, when a problem is discovered in an electronic component, it is possible to quickly deal with it.
図1は、実施の形態に係るシステムの構成の一例を示すブロック図である。FIG. 1 is a block diagram showing an example of the configuration of a system according to an embodiment. 図2は、本実施形態の情報処理装置の構成を例示するブロック図である。FIG. 2 is a block diagram illustrating the configuration of the information processing apparatus of this embodiment. 図3は、特徴情報DBに記憶される情報の一例を示す図である。FIG. 3 is a diagram showing an example of information stored in the feature information DB. 図4は、部品情報DBに記憶される情報の一例を示す図である。FIG. 4 is a diagram showing an example of information stored in the parts information DB. 図5は、構成情報DBに記憶される情報の一例を示す図である。FIG. 5 is a diagram showing an example of information stored in the configuration information DB. 図6は、識別部の処理を説明する図である。FIG. 6 is a diagram illustrating the processing of the identification unit. 図7は、格納部の処理を説明する図である。FIG. 7 is a diagram illustrating the processing of the storage unit. 図8は、実施形態の情報処理装置による登録時の処理手順の一例を示すフローチャートである。FIG. 8 is a flowchart illustrating an example of a processing procedure at the time of registration by the information processing apparatus according to the embodiment. 図9は、実施形態の情報処理装置による検索時の処理手順の一例を示すフローチャートである。FIG. 9 is a flowchart illustrating an example of a processing procedure during a search performed by the information processing apparatus according to the embodiment. 図10は、変形例に係る情報処理装置の構成を例示するブロック図である。FIG. 10 is a block diagram illustrating the configuration of an information processing device according to a modification. 図11は、変形例に係る構成情報DBに記憶される情報の一例を示す図である。FIG. 11 is a diagram illustrating an example of information stored in the configuration information DB according to the modification. 図12は、プログラムを実行するコンピュータを示す図である。FIG. 12 is a diagram showing a computer that executes a program.
 以下に、本願に係る情報処理装置、検索方法及び検索プログラムの実施の形態を図面に基づいて詳細に説明する。また、本発明は、以下に説明する実施の形態により限定されるものではない。 Below, embodiments of an information processing device, a search method, and a search program according to the present application will be described in detail based on the drawings. Further, the present invention is not limited to the embodiments described below.
[システムの構成]
 実施の形態に係る情報処理装置を含むシステムの構成を説明する。図1は、実施の形態に係るシステムの構成の一例を示すブロック図である。図1に示すように、システムは、情報処理装置10と撮影装置20とを有する。情報処理装置10と撮影装置20とは、ネットワーク30を介して互いに接続されている。なお、図1に示すネットワークの形態について、各装置は、有線または無線を問わず、インターネット、LANやVPN(Virtual Private Network)などの任意の通信網を介して通信してよい。また、図1に示す構成は一例にすぎず、具体的な構成や各装置の数は特に限定されない。
[System configuration]
The configuration of a system including an information processing device according to an embodiment will be described. FIG. 1 is a block diagram showing an example of the configuration of a system according to an embodiment. As shown in FIG. 1, the system includes an information processing device 10 and a photographing device 20. The information processing device 10 and the photographing device 20 are connected to each other via a network 30. Regarding the network configuration shown in FIG. 1, each device may communicate via any communication network, such as the Internet, LAN, or VPN (Virtual Private Network), regardless of whether it is wired or wireless. Further, the configuration shown in FIG. 1 is only an example, and the specific configuration and the number of each device are not particularly limited.
 情報処理装置10は、例えば、IoT機器に含まれる電子基板(電子部品が配置された基板)の画像データを取得して電子部品の色、形状等を識別する。そして、情報処理装置10は、電子部品のカタログ情報等を保存した部品情報DB13bと照合することで構成する電子部品を検出して、構成情報DB13cを構築する。そして、例えば、情報処理装置10は、脆弱性やマルウェア混入が電子部品にあったと発覚した場合に、利用者の検索要求に応じて、利用者が運用する電子基板に対象の電子部品が存在するかの結果を返答することで、その電子部品の利用状況を素早く検索可能にする。 The information processing device 10, for example, acquires image data of an electronic board (a board on which electronic components are arranged) included in an IoT device and identifies the color, shape, etc. of the electronic components. Then, the information processing device 10 detects the electronic components to be configured by comparing them with the component information DB 13b that stores catalog information of electronic components, etc., and constructs the configuration information DB 13c. For example, when it is discovered that an electronic component is contaminated with vulnerability or malware, the information processing device 10 responds to a user's search request and searches for the presence of the target electronic component on an electronic board operated by the user. By replying with the result, the usage status of the electronic component can be quickly searched.
 撮影装置20は、電子基板の画像データおよび空間データを取得し、情報処理装置10に送信する。例えば、撮影装置20は、カメラにより電子基板の画像データを撮像し、レーザにより空間データを測定する。なお、撮影装置20は、画像データのみを取得してもよい。なお、撮影装置20は、例えば、工場に設置されていて自動で電子基板を撮像等してもよいし、任意の場所で電子基板を手動で撮像等するようにしてもよい。 The photographing device 20 acquires image data and spatial data of the electronic board and transmits them to the information processing device 10. For example, the imaging device 20 uses a camera to capture image data of an electronic board, and uses a laser to measure spatial data. Note that the photographing device 20 may acquire only image data. Note that the photographing device 20 may be installed in a factory and automatically take an image of the electronic board, for example, or may take an image of the electronic board manually at any location.
[情報処理装置の構成]
 図2は、本実施形態の情報処理装置の構成を例示するブロック図である。図2に例示するように、本実施形態の情報処理装置10は、通信処理部11、制御部12、および記憶部13を有する。
[Configuration of information processing device]
FIG. 2 is a block diagram illustrating the configuration of the information processing apparatus of this embodiment. As illustrated in FIG. 2, the information processing device 10 of this embodiment includes a communication processing section 11, a control section 12, and a storage section 13.
 通信処理部11は、NIC(Network Interface Card)等で実現され、LAN(Local Area Network)やインターネットなどの電気通信回線を介して通信を制御する。 The communication processing unit 11 is realized by a NIC (Network Interface Card) or the like, and controls communication via a telecommunication line such as a LAN (Local Area Network) or the Internet.
 記憶部13は、制御部12による各種処理に必要なデータおよびプログラムを格納し、特徴情報DB13a、部品情報DB13bおよび構成情報DB13cを有する。例えば、記憶部13は、RAM(Random Access Memory)、フラッシュメモリ(Flash Memory)等の半導体メモリ素子、又は、ハードディスク、光ディスク等の記憶装置などである。 The storage unit 13 stores data and programs necessary for various processing by the control unit 12, and has a feature information DB 13a, a parts information DB 13b, and a configuration information DB 13c. For example, the storage unit 13 is a semiconductor memory element such as a RAM (Random Access Memory) or a flash memory, or a storage device such as a hard disk or an optical disk.
 特徴情報DB13aは、電子基板に含まれる電子部品の特徴に関する情報を記憶する。例えば、図3に例示するように、特徴情報DB13aは、電子基板を一意に識別する「機器ID」および電子部品を一意に識別する「部品ID」に対応付けて、画像データおよび空間データから識別された電子部品の特徴(色、形状、ロゴマーク、印字文字列等)である識別情報と、登録日時とを記憶する。なお、図3に例示する「SIP」とは、Single in-line Package、「QFP」とは、Quad Flat Packageの略称である。 The characteristic information DB 13a stores information regarding the characteristics of electronic components included in the electronic board. For example, as illustrated in FIG. 3, the feature information DB 13a identifies electronic components from image data and spatial data in association with "equipment ID" that uniquely identifies electronic boards and "component ID" that uniquely identifies electronic components. Identification information representing the characteristics of the electronic component (color, shape, logo mark, printed character string, etc.) and the registration date and time are stored. Note that "SIP" illustrated in FIG. 3 is an abbreviation for Single in-line Package, and "QFP" is an abbreviation for Quad Flat Package.
 部品情報DB13bは、予め設定された識別情報(第一の情報)と電子部品に関する構成情報(第二の情報)とを記憶する。例えば、図4に例示するように、部品情報DB13bは、電子部品を一意に識別する「ID」に対応付けて、Webページやカタログから人手によって設定された電子部品の「識別情報」および電子部品の詳細な情報である「構成情報」を記憶する。ここで、構成情報とは、電子部品の製造者、電子部品の機能、電子部品の製造開始および電子部品の製造終了、電子部品の型番等である。 The component information DB 13b stores preset identification information (first information) and configuration information regarding electronic components (second information). For example, as illustrated in FIG. 4, the parts information DB 13b stores "identification information" of electronic parts manually set from web pages and catalogs in association with "ID" that uniquely identifies electronic parts, and electronic parts. ``Configuration information'' that is detailed information about the ``configuration information'' is stored. Here, the configuration information includes the manufacturer of the electronic component, the function of the electronic component, the start of manufacturing of the electronic component, the end of manufacturing of the electronic component, the model number of the electronic component, and the like.
 構成情報DB13cは、機器IDおよび部品IDに対応付けて構成情報を記憶する。例えば、図5に例示するように、構成情報DB13cは、「機器ID」および「部品ID」に対応付けて、「登録日時」と、電子部品の詳細な情報である「構成情報」を記憶する。なお、構成情報DB13cは、「機器ID」および「部品ID」に対応付けて、「登録日時」および「構成情報」を記憶する場合に限定されるものではなく、「機器ID」または「部品ID」のいずれかに対応付けて、「登録日時」および「構成情報」を記憶してもよい。 The configuration information DB 13c stores configuration information in association with device IDs and component IDs. For example, as illustrated in FIG. 5, the configuration information DB 13c stores "registration date and time" and "configuration information" which is detailed information on electronic components in association with "equipment ID" and "component ID". . Note that the configuration information DB 13c is not limited to storing "registration date and time" and "configuration information" in association with "device ID" and "parts ID"; "Registration date and time" and "configuration information" may be stored in association with any one of the following.
 制御部12は、各種の処理手順などを規定したプログラムおよび所要データを格納するための内部メモリを有し、これらによって種々の処理を実行する。例えば、制御部12は、識別部12a、格納部12bおよび検索部12cを有する。ここで、制御部12は、CPU(Central Processing Unit)やMPU(Micro Processing Unit)などの電子回路やASIC(Application Specific Integrated Circuit)やFPGA(Field Programmable Gate Array)などの集積回路である。 The control unit 12 has an internal memory for storing programs that define various processing procedures and required data, and executes various processes using these. For example, the control unit 12 includes an identification unit 12a, a storage unit 12b, and a search unit 12c. Here, the control unit 12 is an electronic circuit such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit), or an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).
 識別部12aは、電子基板の画像データから該電子基板に含まれる電子部品の特徴に関する識別情報を識別する。例えば、識別部12aは、識別情報として、電子部品の色、電子部品の形状、電子部品の端子の数、電子部品に記載されたロゴマークおよび電子部品に記載されたテキストのうち、いずれか一つまたは複数を識別する。 The identification unit 12a identifies identification information regarding the characteristics of electronic components included in the electronic board from the image data of the electronic board. For example, the identification unit 12a selects any one of the color of the electronic component, the shape of the electronic component, the number of terminals of the electronic component, a logo mark written on the electronic component, and text written on the electronic component as the identification information. identify one or more.
 図6に例示するように、例えば、識別部12aは、電子基板の画像データを撮影装置20から取得し、当該画像データから該電子基板に含まれる電子部品の領域を特定し、特定した領域から識別情報を識別する。なお、識別部12aは、電子部品の領域を特定するために、例えば、エッジ検出等の画像処理技術を活用してもよい。また、識別部12aは、画像データだけでなく、空間データも取得してもよい。そして、識別部12aは、機器IDおよび部品IDに対応付けて、識別した識別情報を特徴情報DB13aに格納する。 As illustrated in FIG. 6, for example, the identification unit 12a acquires image data of an electronic board from the imaging device 20, specifies the area of the electronic component included in the electronic board from the image data, and Identify identification information. Note that the identification unit 12a may utilize image processing technology such as edge detection, for example, in order to identify the area of the electronic component. Furthermore, the identification unit 12a may acquire not only image data but also spatial data. The identification unit 12a then stores the identified identification information in the feature information DB 13a in association with the device ID and the component ID.
 格納部12bは、識別部12aによって識別された識別情報を用いて、予め設定された電子部品の特徴に関する識別情報と電子部品に関する構成情報とを記憶する部品情報DB13bから構成情報を取得し、取得した構成情報を、機器IDおよび部品IDに対応付けて構成情報DB13cに格納する。 The storage unit 12b uses the identification information identified by the identification unit 12a to acquire configuration information from a component information DB 13b that stores identification information regarding characteristics of electronic components set in advance and configuration information regarding electronic components. The configured configuration information is stored in the configuration information DB 13c in association with the device ID and component ID.
 例えば、格納部12bは、構成情報として、電子部品の製造者、電子部品の型番、電子部品の機能、電子部品の製造開始時期および製造終了時期のうち、いずれか一つまたは複数を部品情報DB13bから取得し、取得した構成情報を、機器IDおよび部品IDに対応付けて構成情報DB13cに格納する。 For example, the storage unit 12b stores any one or more of the manufacturer of the electronic component, the model number of the electronic component, the function of the electronic component, the manufacturing start time, and the manufacturing end time of the electronic component as the configuration information in the component information DB 13b. The acquired configuration information is stored in the configuration information DB 13c in association with the device ID and component ID.
 図7に例示するように、例えば、格納部12bは、部品情報DB13bと特徴情報DB13aのデータを照合し、構成情報DB13cのデータを作成します。例えば、格納部12bは、識別部12aによって識別された識別情報と、部品情報DB13bに記憶された識別情報との類似度を算出し、当該類似度が所定の閾値以上の場合には、部品情報DB13bに記憶された識別情報に対応する構成情報を取得し、取得した構成情報を、機器IDおよび部品IDに対応付けて構成情報DB13cに格納する。 As illustrated in FIG. 7, for example, the storage unit 12b collates data in the parts information DB 13b and feature information DB 13a, and creates data in the configuration information DB 13c. For example, the storage unit 12b calculates the similarity between the identification information identified by the identification unit 12a and the identification information stored in the parts information DB 13b, and if the similarity is equal to or higher than a predetermined threshold, the storage unit 12b calculates the similarity between the identification information identified by the identification unit 12a and the identification information stored in the parts information DB 13b. The configuration information corresponding to the identification information stored in the DB 13b is acquired, and the acquired configuration information is stored in the configuration information DB 13c in association with the device ID and the component ID.
 検索部12cは、構成情報を受け付けた場合に、当該構成情報に対応する機器IDまたは部品IDを構成情報DB13cから検索する。例えば、利用者が、電子基板を有するIoT機器の脆弱性を発見した場合やマルウェアの混入を発覚した場合に、対象となる電子部品製造者や型番等の構成情報を入力する。検索部12cは、構成情報の入力を受け付け、電子基板(Iot機器)がその部品を利用しているかを出力する。 When receiving configuration information, the search unit 12c searches the configuration information DB 13c for the device ID or component ID corresponding to the configuration information. For example, when a user discovers a vulnerability in an IoT device having an electronic board or discovers that it is contaminated with malware, the user inputs configuration information such as the target electronic component manufacturer and model number. The search unit 12c receives input of configuration information and outputs whether the electronic board (IoT device) uses the component.
 例えば、図5の例を用いて説明すると、製造物Bの2020年から製造したCPUに不正回路が混入していたことが発覚した場合、検索部12cは、構成情報DB13cに条件を指定して検索し、「チップ2」がヒットするため、機器ID「機器1」の電子基板(Iot機器)が該当部品「チップ2」を利用していることを出力する。 For example, to explain using the example of FIG. Since "chip 2" is found in the search, it is output that the electronic board (IoT device) with the device ID "device 1" uses the corresponding component "chip 2."
[情報処理装置10の処理手順]
 次に、図8および図9を用いて、情報処理装置10が実行する処理の処理手順の一例について説明する。図8は、実施形態の情報処理装置による登録時の処理手順の一例を示すフローチャートである。図9は、実施形態の情報処理装置による検索時の処理手順の一例を示すフローチャートである。
[Processing procedure of information processing device 10]
Next, an example of a processing procedure of processing executed by the information processing device 10 will be described using FIGS. 8 and 9. FIG. 8 is a flowchart illustrating an example of a processing procedure at the time of registration by the information processing apparatus according to the embodiment. FIG. 9 is a flowchart illustrating an example of a processing procedure during a search performed by the information processing apparatus according to the embodiment.
 図8に例示するように、情報処理装置10の識別部12aは、電子基板の画像データを取得すると(ステップS101肯定)、電子基板の画像データから該電子基板に含まれる電子部品の識別情報を識別する(ステップS102)。 As illustrated in FIG. 8, when the identification unit 12a of the information processing device 10 acquires the image data of the electronic board (Yes at step S101), the identification unit 12a of the information processing device 10 extracts identification information of the electronic components included in the electronic board from the image data of the electronic board. Identification (step S102).
 そして、格納部12bは、識別された識別情報を用いて、部品情報DB13bから構成情報を取得し(ステップS103)、取得した構成情報を、機器IDおよび部品IDに対応付けて構成情報DB13cに格納する(ステップS104)。 Then, the storage unit 12b uses the identified identification information to acquire configuration information from the component information DB 13b (step S103), and stores the acquired configuration information in the configuration information DB 13c in association with the device ID and the component ID. (Step S104).
 また、図9に例示するように、情報処理装置10の検索部12cは、型番や製造者等の指定を受け付けると(ステップS201肯定)、指定された情報に対応する機器IDおよび部品IDを構成情報DB13cから検索する(ステップS202)。そして、検索部12cは、検索結果として、検索した機器IDおよび部品IDを出力する(ステップS203)。例えば、検索部12cは、構成情報DB13cに条件を指定して検索し、「チップ2」がヒットするため、機器ID「機器1」の電子基板(Iot機器)が該当部品「チップ2」を利用していることを出力する。 Further, as illustrated in FIG. 9, when the search unit 12c of the information processing device 10 receives the specification of the model number, manufacturer, etc. (Yes at step S201), the search unit 12c configures the device ID and parts ID corresponding to the specified information. The information DB 13c is searched (step S202). Then, the search unit 12c outputs the searched device ID and component ID as the search result (step S203). For example, the search unit 12c searches the configuration information DB 13c by specifying conditions, and since "chip 2" is hit, the electronic board (IoT device) with the device ID "device 1" uses the corresponding component "chip 2". Output what is being done.
[実施の形態の効果]
 このように、実施形態に係る情報処理装置10は、電子基板の画像データから該電子基板に含まれる電子部品の特徴に関する識別情報を識別する。そして、情報処理装置10は、識別した識別情報を用いて、予め設定された識別情報と電子部品に関する構成情報とを記憶する部品情報DB13bから構成情報を取得し、取得した構成情報を、機器IDおよび部品IDに対応付けて構成情報DB13cに格納する。続いて、情報処理装置10は、構成情報を受け付けた場合に、当該構成情報に対応する機器IDまたは部品IDを構成情報DB13cから検索する。このため、情報処理装置10は、電子部品に問題が発覚した場合に素早く対処することが可能である。
[Effects of embodiment]
In this manner, the information processing apparatus 10 according to the embodiment identifies identification information regarding the characteristics of the electronic components included in the electronic board from the image data of the electronic board. Then, the information processing device 10 uses the identified identification information to acquire configuration information from the component information DB 13b that stores preset identification information and configuration information regarding electronic components, and uses the acquired configuration information to identify the device ID. and is stored in the configuration information DB 13c in association with the component ID. Subsequently, when receiving the configuration information, the information processing device 10 searches the configuration information DB 13c for the device ID or component ID corresponding to the configuration information. Therefore, the information processing device 10 can quickly deal with a problem when a problem is discovered in the electronic component.
 例えば、情報処理装置10では、IoT機器に含まれる電子基板(電子部品が配置された基板)に含まれる電子部品の色・形状を識別し、電子部品のカタログ情報を保存した部品情報DB13bと照合することで構成する電子部品を検出する。そして、情報処理装置10は、脆弱性やマルウェア混入が電子部品にあったと発覚した場合に、IoT機器に含まれる電子基板において、その電子部品の利用有無を素早く検索することが可能である。 For example, the information processing device 10 identifies the color and shape of an electronic component included in an electronic board (a board on which electronic components are arranged) included in an IoT device, and collates it with the component information DB 13b that stores catalog information of electronic components. Detects the electronic components that it consists of. If it is discovered that an electronic component is vulnerable or has been contaminated with malware, the information processing device 10 can quickly search for whether or not the electronic component is used in an electronic board included in the IoT device.
 これにより、情報処理装置10によれば、利用者は自身が利用するIoT機器を電子部品のレベルで把握することができ、電子部品の脆弱性やマルウェア混入が発覚した際はより素早く対処することができるようになり、利用者のセキュリティレベルが向上する。 As a result, according to the information processing device 10, users can understand the IoT devices they use at the level of electronic components, and can respond more quickly when vulnerabilities in electronic components or malware contamination is discovered. This will improve the user's security level.
[変形例]
 なお、情報処理装置は、変形例として、電子部品の模倣品、粗悪品排除のため、電子機器に利用される電子部品の組合せや利用数を保持し、利用者間で共有し、異常検知を行うことで電子部品の模倣品や粗悪品を推定するようにしてもよい。
[Modified example]
In addition, as a modified example, the information processing device can store the combinations and number of electronic components used in electronic devices, share them among users, and detect abnormalities in order to eliminate counterfeit and inferior electronic components. By doing so, it may be possible to estimate whether the electronic component is a counterfeit product or an inferior product.
 変形例として、例えば、情報処理装置10Aは、図10に例示するように、推定部12dをさらに有してもよい。推定部12dは、異なる電子基板において同一種類の電子部品がそれぞれ用いられている場合に、構成情報DB13cに記憶された当該同一種類の電子部品の各構成情報に含まれる製造に関する情報が不明である割合が全体に対して所定数以上である場合には、当該電子部品を粗悪品であると推定する。 As a modification, for example, the information processing device 10A may further include an estimation unit 12d, as illustrated in FIG. The estimating unit 12d determines that when electronic components of the same type are used in different electronic boards, the information regarding manufacturing included in each configuration information of the electronic components of the same type stored in the configuration information DB 13c is unknown. If the ratio is greater than or equal to a predetermined number, the electronic component is estimated to be of inferior quality.
 例えば、変形例に係る構成情報DB13cは、図11に例示するように、利用者ごとに、データを管理してもよい。図11の例では、構成情報DB13cは、利用者A、B、Cについて、「機器ID」、「部品ID」、「登録日時」および「構成情報」が対応付けられたデータテーブルをそれぞれ記憶している。 For example, the configuration information DB 13c according to the modification may manage data for each user, as illustrated in FIG. 11. In the example of FIG. 11, the configuration information DB 13c stores data tables in which "device ID", "component ID", "registration date and time", and "configuration information" are associated with each other for users A, B, and C. ing.
 図11の例を用いて、推定部12dの処理を説明する。例えば、図11に例示するように、利用者A、B、Cで同じ種類の電子機器1、2、3を利用しているとする。しかし、電子機器の構成情報を見ると、利用者Cだけチップ1の画像から識別したシリアル番号等が有効な番号ではない、あるいはでたらめな番号であったため、製造開始時期が不明である。推定部12dは、同じ電子機器に対して構成情報が不明である割合を算出することで、粗悪品や模倣品である可能性があると検知する。なお、例えば、推定部12dは、番号がでたらめかどうかは、シリアル番号をWebサイト経由で検索することで正規品かどうかの情報を調べることが可能である。 The processing of the estimation unit 12d will be explained using the example of FIG. For example, as illustrated in FIG. 11, it is assumed that users A, B, and C use the same types of electronic devices 1, 2, and 3. However, when looking at the configuration information of the electronic device, the serial number etc. that only user C identified from the image of the chip 1 was not a valid number or was a random number, so the production start date is unknown. The estimating unit 12d detects that there is a possibility that the electronic device is an inferior product or a counterfeit product by calculating the percentage of unknown configuration information for the same electronic device. Note that, for example, the estimating unit 12d can determine whether the number is made up or not by searching for the serial number via a website to determine whether the product is a genuine product.
 例えば、上記の例の場合、推定部12dは、構成情報DB13cの各チップの製造者が利用者間で同じであるが、「チップ1」の製造開始時期の割合は{2021/1/1: 2/3,不明: 1/3}となり、不明である割合が閾値T=1/3以上であるため、機器3のチップ1の製造開始時期に異常があり、模倣品や粗悪品であるとして検知することが可能である。 For example, in the case of the above example, the estimating unit 12d calculates that although the manufacturer of each chip in the configuration information DB 13c is the same among users, the ratio of the manufacturing start time of "chip 1" is {2021/1/1: 2/3, unknown: 1/3}, and the unknown ratio is greater than the threshold T = 1/3, so there is an abnormality in the manufacturing start time of chip 1 of device 3, and it is considered to be a counterfeit or inferior product. It is possible to detect it.
〔システム構成等〕
 上記実施形態に係る図示した各装置の各構成要素は機能概念的なものであり、必ずしも物理的に図示のごとく構成されていることを要しない。すなわち、各装置の分散・統合の具体的形態は図示のものに限られず、その全部または一部を、各種の負荷や使用状況などに応じて、任意の単位で機能的または物理的に分散・統合して構成することができる。さらに、各装置にて行なわれる各処理機能は、その全部または任意の一部が、CPUおよび当該CPUにて解析実行されるプログラムにて実現され、あるいは、ワイヤードロジックによるハードウェアとして実現され得る。
[System configuration, etc.]
The components of the illustrated devices according to the above embodiments are functional and conceptual, and do not necessarily need to be physically configured as illustrated. In other words, the specific form of distributing and integrating each device is not limited to what is shown in the diagram, and all or part of the devices can be functionally or physically distributed or integrated in arbitrary units depending on various loads and usage conditions. Can be integrated and configured. Furthermore, all or any part of each processing function performed by each device may be realized by a CPU and a program that is analyzed and executed by the CPU, or may be realized as hardware using wired logic.
 また、上記実施形態において説明した各処理のうち、自動的に行われるものとして説明した処理の全部または一部を手動的に行うこともでき、あるいは、手動的に行われるものとして説明した処理の全部または一部を公知の方法で自動的に行うこともできる。この他、上記文書中や図面中で示した処理手順、制御手順、具体的名称、各種のデータやパラメータを含む情報については、特記する場合を除いて任意に変更することができる。 Furthermore, among the processes described in the above embodiments, all or part of the processes described as being performed automatically can be performed manually, or the processes described as being performed manually can be performed manually. All or part of the process can also be performed automatically using known methods. In addition, information including processing procedures, control procedures, specific names, and various data and parameters shown in the above documents and drawings may be changed arbitrarily, unless otherwise specified.
〔プログラム〕
 また、上記実施形態において説明した情報処理装置が実行する処理をコンピュータが実行可能な言語で記述したプログラムを作成することもできる。この場合、コンピュータがプログラムを実行することにより、上記実施形態と同様の効果を得ることができる。さらに、かかるプログラムをコンピュータ読み取り可能な記録媒体に記録して、この記録媒体に記録されたプログラムをコンピュータに読み込ませて実行することにより上記実施形態と同様の処理を実現してもよい。
〔program〕
Further, it is also possible to create a program in which the processing executed by the information processing apparatus described in the above embodiment is written in a language executable by a computer. In this case, when the computer executes the program, the same effects as in the above embodiment can be obtained. Furthermore, the same processing as in the above embodiments may be realized by recording such a program on a computer-readable recording medium and having the computer read and execute the program recorded on this recording medium.
 図12は、プログラムを実行するコンピュータを示す図である。図12に例示するように、コンピュータ1000は、例えば、メモリ1010と、CPU1020と、ハードディスクドライブインタフェース1030と、ディスクドライブインタフェース1040と、シリアルポートインタフェース1050と、ビデオアダプタ1060と、ネットワークインタフェース1070とを有し、これらの各部はバス1080によって接続される。 FIG. 12 is a diagram showing a computer that executes the program. As illustrated in FIG. 12, the computer 1000 includes, for example, a memory 1010, a CPU 1020, a hard disk drive interface 1030, a disk drive interface 1040, a serial port interface 1050, a video adapter 1060, and a network interface 1070. However, each of these parts is connected by a bus 1080.
 メモリ1010は、図12に例示するように、ROM(Read Only Memory)1011及びRAM1012を含む。ROM1011は、例えば、BIOS(Basic Input Output System)等のブートプログラムを記憶する。ハードディスクドライブインタフェース1030は、図12に例示するように、ハードディスクドライブ1031に接続される。ディスクドライブインタフェース1040は、図12に例示するように、ディスクドライブ1041に接続される。例えば、磁気ディスクや光ディスク等の着脱可能な記憶媒体が、ディスクドライブ1041に挿入される。シリアルポートインタフェース1050は、図12に例示するように、例えば、マウス1051、キーボード1052に接続される。ビデオアダプタ1060は、図12に例示するように、例えばディスプレイ1061に接続される。 The memory 1010 includes a ROM (Read Only Memory) 1011 and a RAM 1012, as illustrated in FIG. The ROM 1011 stores, for example, a boot program such as BIOS (Basic Input Output System). Hard disk drive interface 1030 is connected to hard disk drive 1031, as illustrated in FIG. Disk drive interface 1040 is connected to disk drive 1041, as illustrated in FIG. For example, a removable storage medium such as a magnetic disk or an optical disk is inserted into the disk drive 1041. The serial port interface 1050 is connected to, for example, a mouse 1051 and a keyboard 1052, as illustrated in FIG. Video adapter 1060 is connected to display 1061, for example, as illustrated in FIG.
 ここで、図12に例示するように、ハードディスクドライブ1031は、例えば、OS1091、アプリケーションプログラム1092、プログラムモジュール1093、プログラムデータ1094を記憶する。すなわち、上記のプログラムは、コンピュータ1000によって実行される指令が記述されたプログラムモジュールとして、例えば、ハードディスクドライブ1031に記憶される。 Here, as illustrated in FIG. 12, the hard disk drive 1031 stores, for example, an OS 1091, an application program 1092, a program module 1093, and program data 1094. That is, the above program is stored, for example, in the hard disk drive 1031 as a program module in which commands to be executed by the computer 1000 are written.
 また、上記実施形態で説明した各種データは、プログラムデータとして、例えば、メモリ1010やハードディスクドライブ1031に記憶される。そして、CPU1020が、メモリ1010やハードディスクドライブ1031に記憶されたプログラムモジュール1093やプログラムデータ1094を必要に応じてRAM1012に読み出し、各種処理手順を実行する。 Further, the various data described in the above embodiments are stored as program data in, for example, the memory 1010 or the hard disk drive 1031. Then, the CPU 1020 reads out the program module 1093 and program data 1094 stored in the memory 1010 and the hard disk drive 1031 to the RAM 1012 as necessary, and executes various processing procedures.
 なお、プログラムに係るプログラムモジュール1093やプログラムデータ1094は、ハードディスクドライブ1031に記憶される場合に限られず、例えば着脱可能な記憶媒体に記憶され、ディスクドライブ等を介してCPU1020によって読み出されてもよい。あるいは、プログラムに係るプログラムモジュール1093やプログラムデータ1094は、ネットワーク(LAN(Local Area Network)、WAN(Wide Area Network)等)を介して接続された他のコンピュータに記憶され、ネットワークインタフェース1070を介してCPU1020によって読み出されてもよい。 Note that the program module 1093 and program data 1094 related to the program are not limited to being stored in the hard disk drive 1031, but may be stored in a removable storage medium, for example, and read by the CPU 1020 via a disk drive or the like. . Alternatively, the program module 1093 and program data 1094 related to the program are stored in another computer connected via a network (LAN (Local Area Network), WAN (Wide Area Network), etc.), and are transmitted via the network interface 1070. It may be read by the CPU 1020.
 以上、本発明者によってなされた発明を適用した実施形態について説明したが、本実施形態による本発明の開示の一部をなす記述および図面により本発明は限定されることはない。すなわち、本実施形態に基づいて当業者等によりなされる他の実施形態、実施例および運用技術等は全て本発明の範疇に含まれる。 Although embodiments to which the invention made by the present inventor is applied have been described above, the present invention is not limited by the description and drawings that form part of the disclosure of the present invention by this embodiment. That is, all other embodiments, examples, operational techniques, etc. made by those skilled in the art based on this embodiment are included in the scope of the present invention.
 10、10A 情報処理装置
 11 通信処理部
 12 制御部
 12a 識別部
 12b 格納部
 12c 検索部
 12d 推定部
 13 記憶部
 13a 特徴情報DB
 13b 部品情報DB
 13c 構成情報DB
10, 10A Information processing device 11 Communication processing section 12 Control section 12a Identification section 12b Storage section 12c Search section 12d Estimation section 13 Storage section 13a Feature information DB
13b Parts information DB
13c Configuration information DB

Claims (8)

  1.  電子基板の画像データから該電子基板に含まれる電子部品の特徴に関する第一の情報を識別する識別部と、
     前記識別部によって識別された第一の情報を用いて、予め設定された電子部品の特徴に関する第一の情報と電子部品に関する第二の情報とを記憶する第一の記憶部から当該第二の情報を取得し、取得した第二の情報を、電子基板または電子部品を識別する識別情報に対応付けて第二の記憶部に格納する格納部と、
     前記第二の情報を受け付けた場合に、当該第二の情報に対応する前記識別情報を前記第二の記憶部から検索する検索部と
     を有することを特徴とする情報処理装置。
    an identification unit that identifies first information regarding characteristics of electronic components included in the electronic board from image data of the electronic board;
    Using the first information identified by the identification unit, the second information is transferred from a first storage unit that stores first information regarding the characteristics of the electronic component set in advance and second information regarding the electronic component. a storage unit that acquires information and stores the acquired second information in a second storage unit in association with identification information for identifying an electronic board or an electronic component;
    An information processing device comprising: a search unit that searches the second storage unit for the identification information corresponding to the second information when the second information is received.
  2.  前記識別部は、前記第一の情報として、前記電子部品の色、前記電子部品の形状、前記電子部品の端子の数、前記電子部品に記載されたロゴマークおよび前記電子部品に記載されたテキストのうち、いずれか一つまたは複数を識別することを特徴とする請求項1に記載の情報処理装置。 The identification unit includes, as the first information, the color of the electronic component, the shape of the electronic component, the number of terminals of the electronic component, a logo mark written on the electronic component, and text written on the electronic component. The information processing apparatus according to claim 1, wherein one or more of the information processing apparatuses are identified.
  3.  前記識別部は、前記電子基板の画像データを取得し、当該画像データから該電子基板に含まれる電子部品の領域を特定し、特定した領域から前記第一の情報を識別することを特徴とする請求項1に記載の情報処理装置。 The identification unit is characterized in that it acquires image data of the electronic board, identifies an area of electronic components included in the electronic board from the image data, and identifies the first information from the identified area. The information processing device according to claim 1.
  4.  前記格納部は、前記第二の情報として、前記電子部品の製造者、前記電子部品の型番、前記電子部品の機能、前記電子部品の製造開始時期および製造終了時期のうち、いずれか一つまたは複数を前記第一の記憶部から取得し、取得した第二の情報を、前記識別情報に対応付けて第二の記憶部に格納することを特徴とする請求項1に記載の情報処理装置。 The storage unit stores, as the second information, any one or more of a manufacturer of the electronic component, a model number of the electronic component, a function of the electronic component, a manufacturing start time, and a manufacturing end time of the electronic component. The information processing apparatus according to claim 1, wherein a plurality of pieces of information are acquired from the first storage unit, and the acquired second information is stored in the second storage unit in association with the identification information.
  5.  前記格納部は、前記識別部によって識別された第一の情報と、前記第一の記憶部に記憶された第一の情報との類似度を算出し、当該類似度が所定の閾値以上の場合には、前記第一の記憶部に記憶された第一の情報に対応する第二の情報を取得し、取得した第二の情報を、前記識別情報に対応付けて第二の記憶部に格納することを特徴とする請求項1に記載の情報処理装置。 The storage unit calculates a degree of similarity between the first information identified by the identification unit and the first information stored in the first storage unit, and if the degree of similarity is equal to or higher than a predetermined threshold value, acquires second information corresponding to the first information stored in the first storage unit, and stores the acquired second information in the second storage unit in association with the identification information; The information processing device according to claim 1, characterized in that:
  6.  異なる電子基板において同一種類の電子部品がそれぞれ用いられている場合に、前記第二の記憶部に記憶された当該同一種類の電子部品の各第二の情報に含まれる製造に関する情報が不明である割合が全体に対して所定数以上である場合には、当該電子部品を粗悪品であると推定する推定部をさらに有することを特徴とする請求項1に記載の情報処理装置。 When electronic components of the same type are used on different electronic boards, the information regarding manufacturing included in each second information of the electronic components of the same type stored in the second storage section is unknown. 2. The information processing apparatus according to claim 1, further comprising an estimating unit that estimates that the electronic component is an inferior product if the proportion is a predetermined number or more with respect to the whole.
  7.  情報処理装置によって実行される検索方法であって、
     電子基板の画像データから該電子基板に含まれる電子部品の特徴に関する第一の情報を識別する識別工程と、
     前記識別工程によって識別された第一の情報を用いて、予め設定された電子部品の特徴に関する第一の情報と電子部品に関する第二の情報とを記憶する第一の記憶部から当該第二の情報を取得し、取得した第二の情報を、電子基板または電子部品を識別する識別情報に対応付けて第二の記憶部に格納する格納工程と、
     前記第二の情報を受け付けた場合に、当該第二の情報に対応する前記識別情報を前記第二の記憶部から検索する検索工程と
     を含むことを特徴とする検索方法。
    A search method executed by an information processing device, comprising:
    an identification step of identifying first information regarding characteristics of electronic components included in the electronic board from image data of the electronic board;
    Using the first information identified in the identification step, the second information is stored from a first storage unit that stores first information regarding the characteristics of the electronic component set in advance and second information regarding the electronic component. a storage step of acquiring information and storing the acquired second information in a second storage unit in association with identification information for identifying an electronic board or an electronic component;
    A search method comprising: when the second information is received, the second storage unit is searched for the identification information corresponding to the second information.
  8.  電子基板の画像データから該電子基板に含まれる電子部品の特徴に関する第一の情報を識別する識別ステップと、
     前記識別ステップによって識別された第一の情報を用いて、予め設定された電子部品の特徴に関する第一の情報と電子部品に関する第二の情報とを記憶する第一の記憶部から当該第二の情報を取得し、取得した第二の情報を、電子基板または電子部品を識別する識別情報に対応付けて第二の記憶部に格納する格納ステップと、
     前記第二の情報を受け付けた場合に、当該第二の情報に対応する前記識別情報を前記第二の記憶部から検索する検索ステップと
     をコンピュータに実行させることを特徴とする検索プログラム。
    an identification step of identifying first information regarding characteristics of electronic components included in the electronic board from image data of the electronic board;
    Using the first information identified in the identification step, the second information is stored from the first storage section that stores the first information regarding the characteristics of the electronic component set in advance and the second information regarding the electronic component. a storing step of acquiring information and storing the acquired second information in a second storage unit in association with identification information for identifying an electronic board or an electronic component;
    A search program that causes a computer to execute a search step of searching the second storage unit for the identification information corresponding to the second information when the second information is received.
PCT/JP2022/022003 2022-05-30 2022-05-30 Information processing device, search method, and search program WO2023233487A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/022003 WO2023233487A1 (en) 2022-05-30 2022-05-30 Information processing device, search method, and search program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/022003 WO2023233487A1 (en) 2022-05-30 2022-05-30 Information processing device, search method, and search program

Publications (1)

Publication Number Publication Date
WO2023233487A1 true WO2023233487A1 (en) 2023-12-07

Family

ID=89025886

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/022003 WO2023233487A1 (en) 2022-05-30 2022-05-30 Information processing device, search method, and search program

Country Status (1)

Country Link
WO (1) WO2023233487A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0816640A (en) * 1994-06-28 1996-01-19 Fujitsu Ltd Component data management processor
JPH09126727A (en) * 1995-10-27 1997-05-16 Nec Corp Inspection data preparing device
JP2021056752A (en) * 2019-09-30 2021-04-08 シライ電子工業株式会社 Board information provision system and server device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0816640A (en) * 1994-06-28 1996-01-19 Fujitsu Ltd Component data management processor
JPH09126727A (en) * 1995-10-27 1997-05-16 Nec Corp Inspection data preparing device
JP2021056752A (en) * 2019-09-30 2021-04-08 シライ電子工業株式会社 Board information provision system and server device

Similar Documents

Publication Publication Date Title
US11588841B2 (en) Generating malicious network traffic detection models using cloned network environments
EP3178011B1 (en) Method and system for facilitating terminal identifiers
US11483214B2 (en) Synchronizing data between cloud manager and providers
CN107302527B (en) Equipment anomaly detection method and device
KR101948721B1 (en) Method and apparatus for examining forgery of file by using file hash value
KR20190128260A (en) Systems and Methods for Automatic Device Detection
WO2018159362A1 (en) Log analysis apparatus, log analysis method, and log analysis program
US20190327258A1 (en) Cloud-based security testing interface with security scanners
WO2018131199A1 (en) Combining device, combining method and combining program
JP6557334B2 (en) Access classification device, access classification method, and access classification program
CN108154031B (en) Method, device, storage medium and electronic device for identifying disguised application
US10412101B2 (en) Detection device, detection method, and detection program
WO2016014014A1 (en) Remedial action for release of threat data
US11042637B1 (en) Measuring code sharing of software modules based on fingerprinting of assembly code
JP7378089B2 (en) Unauthorized communication detection device, unauthorized communication detection method, and manufacturing system
CN109815702A (en) Safety detection method, device and the equipment of software action
JP7156642B2 (en) Identification processing device, identification processing program, and identification processing method
WO2023233487A1 (en) Information processing device, search method, and search program
CN113961984B (en) Host computing system and method for host computing system
JP6258189B2 (en) Specific apparatus, specific method, and specific program
JP6683655B2 (en) Detection device and detection method
JPWO2018131200A1 (en) Analysis device, analysis method and analysis program
WO2023233489A1 (en) Information processing device, detection method, and detection program
AU2019298538A1 (en) Generation device, generation method, and generation program
WO2019142335A1 (en) Security design device, security design method, and security design program

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22944776

Country of ref document: EP

Kind code of ref document: A1