WO2023231895A1

WO2023231895A1 - Camera module, control method and apparatus, and electronic device

Info

Publication number: WO2023231895A1
Application number: PCT/CN2023/096292
Authority: WO
Inventors: 王丹妹
Original assignee: 维沃移动通信有限公司
Priority date: 2022-05-31
Filing date: 2023-05-25
Publication date: 2023-12-07
Also published as: CN114928689A

Abstract

The present application discloses a camera module, a control method and apparatus, and an electronic device. The camera module comprises: a base; a lens arranged on the base; a substrate, the substrate and the lens being sequentially arranged in an optical axis direction of the lens, and the substrate being movably arranged on the base; a photosensitive chip, the photosensitive chip being arranged on the substrate, and located between the lens and the substrate; and a capacitor assembly, the capacitor assembly comprising a first capacitor plate and a second capacitor plate, the first capacitor plate being arranged on the substrate, the second capacitor plate being arranged on the base, and the first capacitor plate and the second capacitor plate being oppositely arranged.

Description

Camera modules, control methods, devices and electronic equipment

Cross-references to related applications

This application claims priority from Chinese Patent Application No. 202210614927.9 filed in China on May 31, 2022, the entire content of which is incorporated herein by reference.

Technical field

This application belongs to the field of terminal technology, and specifically relates to a camera module, control method, device and electronic equipment.

Background technique

For smartphones, camera capabilities have received more and more attention, so camera hardware module design is becoming more and more important. The closed-loop feedback system used in the related technology of mobile image sensor anti-shake technology (sensor shift) is implemented through Hall technology. The assembly process of Hall technology is complex and occupies a large internal volume of the camera hardware module, which can cause magnetic interference between cameras. It is greatly affected by temperature drift and the cost is relatively high.

Contents of the invention

The purpose of the embodiments of the present application is to provide a camera module, a control method, a device and an electronic device to solve the problem that the camera module is susceptible to magnetic interference and is greatly affected by temperature drift.

In a first aspect, embodiments of the present application provide a camera module, including:

base;

A lens, the lens is located on the base;

A base plate, the base plate and the lens are arranged sequentially in the direction of the optical axis of the lens, and the base plate is movably arranged on the base;

Photosensitive chip, the photosensitive chip is arranged on the substrate, and the photosensitive chip is located between the lens and the substrate;

Capacitor component, the capacitor component includes a first capacitor plate and a second capacitor plate, the first capacitor plate is disposed on the substrate, the second capacitor plate is disposed on the base, the first capacitor plate It is arranged opposite to the second capacitor plate.

In the second aspect, embodiments of the present application provide a method for controlling a camera module, which is applied to the camera module described in the above embodiments, including:

detecting changes in capacitance of the capacitor component;

The substrate is controlled to move according to the detected change in capacitance of the capacitor component, and the substrate drives the photosensitive chip to move to a target position.

In a third aspect, embodiments of the present application provide a control device for a camera module, which is applied to the camera module described in the above embodiments, including:

A detection module used to detect changes in capacitance of the capacitor component;

A control module is used to control the movement of the substrate according to the detected change in capacitance of the capacitor component, and the substrate drives the photosensitive chip to move to a target position.

In a fourth aspect, embodiments of the present application provide an electronic device, including a processor and a memory. The memory stores programs or instructions that can be run on the processor. When the program or instructions are executed by the processor, The steps of the method described in the above embodiments.

In the fifth aspect, embodiments of the present application provide a readable storage medium, which stores programs or instructions. When the programs or instructions are executed by a processor, the steps of the method described in the above embodiments are implemented. .

In a sixth aspect, embodiments of the present application provide an electronic device, including the camera module described in the above embodiments.

In the camera module in the embodiment of the present application, the capacitor component includes a first capacitor plate and a second capacitor plate. The first capacitor plate is disposed on the substrate, and the second capacitor plate is disposed on the base. The first capacitor plate and the second capacitor plate are arranged opposite to each other. During the movement of the substrate, the distance between the first capacitor plate and the second capacitor plate changes, causing the capacitance of the capacitor component to change. According to the change in the capacitance of the capacitor component, the relationship between the first capacitor plate and the second capacitor plate can be obtained. The relative position between the capacitor plates can then be used to obtain the position of the substrate, and the position of the photosensitive chip can be obtained through the position of the substrate. When the module jitters, the position of the first capacitor plate can be obtained according to the change in capacitance of the capacitor component, and the position of the photosensitive chip can be obtained according to the position of the first capacitor plate, so that the substrate can be driven to move, and the photosensitive chip can be driven to move to the appropriate position through the substrate. The position is so that the lens and the photosensitive chip are in a reasonable relative position to achieve the anti-shake effect. The camera module does not require Hall magnets and The Hall element has a simple assembly process, occupies a small module volume, does not cause magnetic interference between cameras, is less affected by temperature drift, has low cost, and improves the camera effect and experience.

Description of the drawings

Figure 1 is a schematic structural diagram of a camera module in an embodiment of the present application;

Figure 2 is a schematic diagram of the arrangement of the substrate and the capacitor plate in the embodiment of the present application;

Figure 3 is a schematic diagram of the second capacitor plate arrangement;

Figure 4 is a schematic diagram of the first capacitor plate arrangement;

Figure 5 is a schematic diagram of a capacitor.

Reference numerals base 10; accommodation cavity 11; support base 12;
Lens 20;
substrate 30;
photosensitive chip 40;
Capacitor component 50; first capacitor plate 51; second capacitor plate 52;
Connecting plate 60; first driving mechanism 61; second driving mechanism 62;
Bracket 70; placement groove 71; support table 72; optical filter 73.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

The terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It is to be understood that data so used are interchangeable under appropriate circumstances so that embodiments of the present application can be practiced in sequences other than those illustrated or described herein. In addition, "and/or" in the description and claims indicates at least one of the connected objects, and the character "/" generally indicates that the related objects are an "or" relation.

The camera module provided by the embodiment of the present application will be described in detail through specific embodiments and application scenarios as shown in FIGS. 1 to 5 below.

As shown in Figures 1 to 4, the camera module according to the embodiment of the present application includes: a base 10, a lens 20, a substrate 30, a photosensitive chip 40 and a capacitor component 50. The lens 20 is located on the base 10, and the lens 20 It can be movably installed on the base 10 , and the lens 20 can move along the optical axis direction of the lens 20 . The base plate 30 and the lens 20 can be arranged sequentially in the direction of the optical axis of the lens 20 . The base plate 30 and the lens 20 can be arranged at intervals in the direction of the optical axis of the lens 20 . The base plate 30 can be movably arranged on the base 10 . The base 10 can be provided with a receiving cavity, and the lens 20, the substrate 30, and the photosensitive chip 40 can be arranged in the receiving cavity. The lens 20, the substrate 30, and the photosensitive chip 40 can be protected through the receiving cavity. The photosensitive chip 40 can be disposed on the substrate 30. The photosensitive chip 40 is located between the lens 20 and the substrate 30. The light incident through the lens 20 can be transmitted to the photosensitive chip 40, and an image can be formed through the photosensitive chip 40.

The capacitor component 50 may include a first capacitor plate 51 and a second capacitor plate 52. The first capacitor plate 51 and the second capacitor plate 52 may be conductive material plates, such as metal plates. The capacitor component 50 can be disposed on a side of the substrate 30 away from the photosensitive chip 40. The first capacitor plate 51 can be disposed on the substrate 30, and the second capacitor plate 52 can be disposed on the base 10. The first capacitor plate 51 and the second capacitor plate 52 can be disposed on the base 10. The capacitor plates 52 are arranged oppositely, and a capacitor can be formed by the first capacitor plate 51 and the second capacitor plate 52 . The number of the first capacitor plate 51 and the second capacitor plate 52 may be one or more. Each first capacitor plate 51 and a corresponding second capacitor plate 52 are arranged opposite each other and may form one or more capacitors. The first capacitor plate 51 and the second capacitor plate 52 are arranged at intervals. The first capacitor plate 51 and the second capacitor plate 52 can be parallel to each other. The first capacitor plate 51 and the second capacitor plate 52 can be arranged in parallel with the substrate 30 .

In the camera module in the embodiment of the present application, the capacitor component 50 is disposed on the side of the substrate 30 away from the photosensitive chip 40 , the first capacitor plate 51 is disposed on the substrate 30 , and the second capacitor plate 52 is disposed on the base 10 At positions corresponding to the first capacitor plate 51, the first capacitor plate 51 and the second capacitor plate 52 are arranged opposite each other to form a capacitor. During the movement of the substrate 30, the distance between the first capacitor plate 51 and the second capacitor plate 52 changes, causing the capacitance of the capacitor component 50 to change. According to the change in the capacitance of the capacitor component 50, the relationship between the first capacitor plate 51 and the second capacitor plate 52 can be obtained. The relative position between the second capacitor plates 52 can then be used to obtain the position of the substrate 30 , and the position of the photosensitive chip 40 can be obtained through the position of the substrate 30 . When the module jitters, the first capacitor plate can be obtained according to the change in capacitance of the capacitor component 50 51, the position of the photosensitive chip 40 is obtained according to the position of the first capacitive plate 51, so that the substrate 30 can be driven to move, and the photosensitive chip 40 can be driven to move to a suitable position through the substrate 30, so that the lens 20 and the photosensitive chip 40 are in a Reasonable relative position to achieve anti-shake effect. That is to say, the capacitor is used to feedback the position change of the photosensitive chip caused by the shaking of the camera module, and then it is controlled according to the change in position, so that the photosensitive chip moves to the appropriate position, so that the photosensitive chip and the lens are in a suitable position. relative position. The camera module does not require Hall magnets and Hall elements. The assembly process is simple, the module occupies a small volume, will not cause magnetic interference between cameras, is less affected by temperature drift, is low in cost, and improves the camera effect and body feel. The two capacitor plates of the capacitor are thin, which is beneficial to reducing the volume or size of the module, and can be applied to camera modules with long strokes. In this application, a signal acquisition feedback system is mainly designed by utilizing the working principle of capacitance. Then, after processing the collected signal (the amount of change in capacitance), the design of a capacitive closed-loop anti-shake system can be realized.

In some embodiments, each of the first capacitor plate 51 and the second capacitor plate 52 may have multiple. For example, the number of the first capacitor plate 51 and the second capacitor plate 52 may each be three, and the number of capacitors may be for three. A plurality of first capacitor plates 51 may be disposed along the circumferential direction of the substrate 30 , and each first capacitor plate 51 is disposed opposite a corresponding second capacitor plate 52 to form a capacitor. The plurality of capacitors can be arranged along the circumferential direction of the substrate 30, and the plurality of capacitors can be arranged at intervals along the circumferential direction of the substrate 30, so as to detect the position change of the substrate 30 through the capacitors at different positions and obtain the position of the substrate 30 more accurately. changes to adjust the position of the substrate 30 more accurately to achieve the anti-shake effect. The substrate 30 may be rectangular, and a first capacitor plate 51 may be provided at a corner of the substrate 30. The first capacitor plate 51 may form a capacitor with a corresponding second capacitor plate 52, for example, the first capacitor plate 51 and the second capacitor The number of plates 52 can be three, and the number of capacitors can be three. A first capacitor plate 51 is provided at three corners of the substrate 30, so that the first capacitor plate 51 is connected to a corresponding first capacitor plate 51. The two capacitor plates 52 form a capacitor to more accurately adjust the position of the substrate 30 to achieve an anti-shake effect.

In other embodiments, a plurality of first capacitor plates 51 can be arranged at intervals along the edge area of the substrate 30 . The first capacitor plates 51 are arranged at the edge area of the substrate 30 , so that the constituted capacitor can be arranged at the edge area of the substrate 30 , when the position of the substrate 30 changes, the change in capacitance can be more accurately obtained, and then the position change of the substrate 30 can be obtained more accurately, so that the position of the substrate 30 can be adjusted more accurately to achieve the anti-shake effect.

In the embodiment of the present application, the substrate 30 may be a circuit board, and the first capacitor plate 51 is electrically connected to the first connection part of the substrate 30. The camera module may also include: a connection board 60, and the connection board 60 may be a flexible circuit board. , one end of the connection plate 60 can be electrically connected to the second connection portion of the substrate 30, and the other end of the connection plate 60 can be electrically connected to the second capacitor plate 52. The connection between the substrate 30 and the second capacitor plate 52 can be realized through the connection plate 60. electrical connection. The connecting plate 60 can be a snake-shaped, straight-line, hollow-shaped or elastic connection structure.

Optionally, the areas of the orthographic projections of the first capacitive plate 51 and the corresponding second capacitive plate 52 on the substrate 30 are equal, and the orthogonal projections of the first capacitive plate 51 and the corresponding second capacitive plate 52 on the substrate 30 can be equal to each other. Overlapping, the orthographic projections of the first capacitive plate 51 and the corresponding second capacitive plate 52 on the substrate 30 can be completely overlapped, so that the change in capacitance of the capacitor can be accurately obtained, and thus the position change of the substrate 30 can be accurately obtained.

In the embodiment of the present application, the camera module may include at least one of a first driving mechanism 61 and a second driving mechanism 62 . As shown in FIG. 1 , the camera module may include: a first driving mechanism 61 , the first driving mechanism 61 is connected to the base plate 30 , and the first driving mechanism 61 is used to drive the base plate 30 to move. The first driving mechanism 61 may include a shape memory alloy part, and may drive the substrate 30 to move through the shape memory alloy part. The first driving mechanism 61 may include a piezoelectric material piece. The piezoelectric material piece can drive the substrate 30 to move. The movement of the substrate 30 drives the photosensitive chip 40 to move, so that the photosensitive chip 40 moves to an appropriate position to facilitate the contact between the lens 20 and the photosensitive chip. 40 are in a reasonable relative position to achieve the anti-shake effect.

In some embodiments, as shown in FIG. 1 , the camera module may also include: a second driving mechanism 62 , the second driving mechanism 62 is connected to the lens 20 , and the second driving mechanism 62 may be used to drive the lens 20 to move, for example, The second driving mechanism 62 is used to drive the lens 20 to move along the optical axis direction of the lens 20 . The second driving mechanism 62 may include a motor, through which the lens 20 can be driven to move along the optical axis direction of the lens 20, the distance between the lens 20 and the photosensitive chip 40 can be adjusted, and zooming can be achieved. The second driving mechanism 62 can be used to drive the lens 20 to move. When the module shakes, the second driving mechanism 62 can be used to drive the lens 20 to move. At the same time, the first driving mechanism 61 can be used to drive the substrate 30 to move. The movement of the substrate 30 drives the photosensitive chip 40 Move, so that the photosensitive chip 40 and the lens 20 move to a suitable relative position, so that the lens 20 and the photosensitive chip 40 are in a reasonable relative position, thereby achieving the anti-shake effect, which can be applied to dual optical image stabilization (Optical Image Stabilization, OIS) collaboration in the anti-shake system.

As shown in Figure 1, the camera module may also include: a support base 12. The support base 12 may be disposed on the base plate 30. The support base 12 may be disposed on a side of the base plate 30 close to the lens 20. The support base 12 may surround the base plate 30. circumferential setting. The second driving mechanism 62 can be fixedly arranged on the base 10 . The second driving mechanism 62 can include a motor. A first driving mechanism 61 can be provided between the second driving mechanism 62 and the support base 12 . The first driving mechanism 61 can drive The substrate 30 moves. The first driving mechanism 61 may include a shape memory alloy component, which can drive the substrate 30 to move through the shape memory alloy component. The movement of the substrate 30 drives the photosensitive chip 40 to move, so that the photosensitive chip 40 moves to an appropriate position to facilitate the contact between the lens 20 and the photosensitive chip. 40 are in a reasonable relative position to achieve the anti-shake effect.

In the embodiment of the present application, the base 10 may have a receiving cavity 11, and the substrate 30 and the lens 20 may be disposed in the receiving cavity 11. The receiving cavity 11 can protect the substrate 30, the lens 20 and the photosensitive chip 40 from external damage. impact and damage. The base 10 can be formed of a steel sheet, and the substrate 30, the lens 20 and the photosensitive chip 40 can be protected through the accommodation cavity 11 on the base 10. The second capacitor plate 52 can be adhered to the bottom wall of the accommodation cavity 11 with glue. One end of the connection plate 60 and the second connection portion of the substrate 30 can be electrically connected through conductive glue. The other end of the connection plate 60 can be electrically connected with the second capacitor plate. 52 can be electrically connected through conductive glue, and the electrical connection between the substrate 30 and the second capacitor plate 52 can be achieved through the connecting plate 60 . The substrate 30 can be a circuit board. When designing the circuit board directly, a copper sheet of a certain size and shape is designed on the bottom metal layer of the circuit board, and a green oil window design is performed in the production process drawing to expose the copper sheet. as the first capacitor plate 51.

Optionally, as shown in FIG. 1 , the camera module may also include: a filter 73 . The filter 73 may be disposed between the lens 20 and the photosensitive chip 40 . The filter 73 may filter out unwanted light. . The filter 73 may be disposed at the bottom of the lens 20 .

As shown in Figure 1, the camera module may also include: a bracket 70. The bracket 70 may be disposed on the substrate 30. The bracket 70 may have a placement slot 71. The photosensitive chip 40 may be disposed in the placement slot 71. The photosensitive chip 40 may be disposed On the bottom wall of the placement groove 71, a support platform 72 can be provided on the inner wall of the placement groove 71. The support platform 72 can extend along the circumferential direction of the inner wall of the placement groove 71, and the optical filter 73 can be disposed on the support platform 72. On the top, the filter 73 can be supported by the support stand 72 . The optical filter 73 and the photosensitive chip 40 can be arranged at intervals, and the optical filter 73 and the photosensitive chip 40 can be parallel to each other. The optical filter 73 is arranged on the support platform 72 to seal the placement groove 71, and the optical filter 73 can also be protected. Protect the photosensitive chip 40 to prevent the photosensitive chip 40 from being damaged.

In some embodiments, the camera module further includes a detection module, which can be used to detect changes in the capacitance of the capacitor component 50 . The change in capacitance of the capacitor component 50 can be detected by the detection module, and then the position change of the substrate 30 can be obtained according to the change in capacitance of the capacitor component 50, so as to facilitate the adjustment of the position of the substrate 30 when the module shakes, through the movement of the substrate 30 The photosensitive chip 40 is driven to move, so that the photosensitive chip 40 moves to a suitable position, so that the lens 20 and the photosensitive chip 40 are in a reasonable relative position, thereby achieving the anti-shake effect.

In some embodiments, the camera module may further include: a first driving mechanism 61 , the first driving mechanism 61 is connected to the base plate 30 , and the first driving mechanism 61 is used to drive the base plate 30 to move. The camera module may also include a control module. The control module may be used to send a control signal to the first driving mechanism 61 according to the change in capacitance of the capacitive component 50 detected by the detection module. The first driving mechanism 61 receives the control signal. The substrate 30 is driven to move, and the substrate 30 drives the photosensitive chip 40 to move to a target position so that the lens 20 and the photosensitive chip 40 are in a reasonable relative position, thereby achieving the anti-shake effect.

In the application process, as shown in Figure 5, the first capacitor plate 51 and the second capacitor plate 52 can form a capacitor. The first capacitor plate 51 and the second capacitor plate 52 are arranged in parallel and spaced apart from each other. The first capacitor plate 51 and the second capacitor plate 52 can form a capacitor. The second capacitor plate 52 is a metal plate with the same shape and size. The length of the first capacitor plate 51 is a and the width is b. The distance between the first capacitor plate 51 and the second capacitor plate 52 is d. 51 and the second capacitor plate 52 can be connected through wires and power supply.

Working characteristics of the capacitor: Capacitance C=εS/4πkd, where ε represents the dielectric constant of the medium, k represents the electrostatic force constant; S represents the facing area of the two capacitor plates, S=a*b;

d represents the vertical distance between the two capacitor plates;

Changing S or d can cause a change in capacitance C ΔC. According to the plate capacitance, the change in the distance d between the two capacitor plates can be converted into a change in the electrical characteristic capacitance C. According to the change in the capacitance C, the change in the distance d between the capacitor plates can be obtained, so that the position change of the substrate 30 can be obtained. When the module shakes, the position of the substrate 30 can be adjusted. The movement of the substrate 30 drives the photosensitive chip 40 to move, so that the photosensitive chip 40 moves to a suitable position, so that the lens 20 and the photosensitive chip 40 are in a reasonable relative position. Anti-shake function, the closed-loop feedback work of the anti-shake system can be realized through the capacitor. The closed-loop feedback system with capacitor has simple structural design, fewer components, does not affect the module space, simple process, low cost, no magnetic interference problem, and no temperature drift problem.

During the application process, the camera module can achieve closed-loop anti-shake by having capacitive feedback position changes. The specific workflow can be as follows:

Turn on the camera module to take pictures;

In the camera preview mode, firstly, determine the initial position of the substrate in the module; secondly, whether the photo scene is clear, if it is clear, directly take the photo and record it, if not, proceed to the next step;

Through the image system anti-shake algorithm, the position of the substrate in the corresponding module is searched and recorded when the picture is clear;

The controller driver chip can issue instructions to the drive mechanism based on the clearly recorded position of the substrate;

After receiving the instruction, the driving mechanism gives the substrate a certain amount of control, so that the substrate reaches the instruction position;

The closed-loop feedback system can feed back the current distance between the two capacitive plates to the comparator, which can be compared through the comparator;

After receiving the feedback amount, the imaging system determines whether the substrate has moved to the command position; if it has reached the command position, it will complete the photo; if it has not reached the command position, it will re-execute the above work steps.

The control method of the camera module in the embodiment of the present application is applied to the camera module described in the above embodiment. The control method may include:

Detect changes in capacitance of the capacitor component 50;

The substrate 30 is controlled to move according to the detected change in capacitance of the capacitor component 50, and the substrate 30 drives the photosensitive chip 40 to move to a target position.

According to the change in capacitance of the capacitor component 50, the position change of the substrate 30 can be obtained, which is convenient for adjusting the position of the substrate 30 when the module shakes. The movement of the substrate 30 drives the photosensitive chip 40 to move, so that the photosensitive chip 40 moves to an appropriate position. So that the lens 20 and the photosensitive chip 40 are in a reasonable relative position, thereby achieving the anti-shake effect.

The control device of the camera module in the embodiment of the present application is applied to the camera module described in the above embodiment. The control device includes:

A detection module used to detect changes in capacitance of the capacitor component 50;

The control module is used to control the movement of the substrate 30 according to the detected change in capacitance of the capacitor component 50, and the substrate 30 drives the photosensitive chip 40 to move to a target position.

The control module can obtain the position change of the substrate 30 based on the change in capacitance of the capacitor component 50, It is convenient to adjust the position of the substrate 30 when the module shakes. The movement of the substrate 30 drives the photosensitive chip 40 to move, so that the photosensitive chip 40 moves to a suitable position, so that the lens 20 and the photosensitive chip 40 are in a reasonable relative position, thereby Achieve anti-shake effect.

The electronic device in the embodiment of the present application includes a processor and a memory. The memory stores programs or instructions that can be run on the processor. When the program or instructions are executed by the processor, the implementation described in the above embodiments is achieved. steps of the control method.

In the readable storage medium according to the embodiment of the present application, programs or instructions are stored on the readable storage medium. When the program or instructions are executed by the processor, the steps of the control method described in the above embodiments are implemented.

The electronic device in the embodiment of the present application includes the camera module described in the above embodiment. Electronic equipment with the camera module described in the above embodiments is conducive to miniaturization, is less susceptible to magnetic interference, is less affected by temperature drift, has low cost, and has good camera effects and experience.

The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above-mentioned specific implementations. The above-mentioned specific implementations are only illustrative and not restrictive. Those of ordinary skill in the art will Inspired by this application, many forms can be made without departing from the purpose of this application and the scope protected by the claims, all of which fall within the protection of this application.

Claims

A camera module including:

base;

A lens, the lens is located on the base;

A base plate, the base plate and the lens are arranged sequentially in the direction of the optical axis of the lens, and the base plate is movably arranged on the base;

Photosensitive chip, the photosensitive chip is arranged on the substrate, and the photosensitive chip is located between the lens and the substrate;

Capacitor component, the capacitor component includes a first capacitor plate and a second capacitor plate, the first capacitor plate is disposed on the substrate, the second capacitor plate is disposed on the base, the first capacitor plate and The second capacitor plates are arranged oppositely.
The camera module according to claim 1, wherein each of the first capacitive plate and the second capacitive plate has a plurality of first capacitive plates, and the plurality of first capacitive plates are arranged along the circumferential direction of the substrate, each The first capacitor plate is arranged opposite to the corresponding second capacitor plate.
The camera module according to claim 2, wherein a plurality of the first capacitive plates are spaced apart along an edge area of the substrate.
The camera module of claim 1, wherein the substrate is a circuit board, the first capacitor plate is electrically connected to the first connection portion of the substrate, and the camera module further includes:

A connection board, the connection board is a flexible circuit board, one end of the connection board is electrically connected to the second connection portion of the substrate, and the other end of the connection board is electrically connected to the second capacitor plate.
The camera module according to claim 1, wherein the orthogonal projection areas of the first capacitive plate and the corresponding second capacitive plate on the substrate are equal, and the first capacitive plate and the corresponding second capacitive plate have the same area. The orthographic projections of the second capacitor plate on the substrate coincide with each other.
The camera module according to claim 1, further comprising:

At least one of a first driving mechanism and a second driving mechanism, wherein the first driving mechanism is connected to the substrate, and the first driving mechanism is used to drive the substrate to move;

The second driving mechanism is connected with the lens, and the second driving mechanism is used to drive the lens to move.
The camera module according to claim 1, wherein the base has a receiving cavity, and the substrate and the lens are arranged in the receiving cavity.
The camera module according to claim 1, further comprising:

Optical filter, the optical filter is arranged between the lens and the photosensitive chip.
The camera module according to claim 8, further comprising:

Bracket, the bracket is arranged on the base plate, the bracket has a placement groove, the photosensitive chip is placed in the placement groove, a support platform is provided on the inner wall of the placement groove, the light filter Set on the support platform.
The camera module according to claim 1, further comprising:

A detection module is used to detect changes in capacitance of the capacitor component.
The camera module according to claim 10, further comprising:

A first driving mechanism, the first driving mechanism is connected to the substrate, and the first driving mechanism is used to drive the substrate to move.
A control method for a camera module, applied to the camera module according to any one of claims 1 to 11, the method includes:

Detect changes in capacitance of capacitive components;

The movement of the substrate is controlled according to the detected change in capacitance of the capacitive component, and the substrate drives the photosensitive chip to move to a target position.
A control device for a camera module, applied to the camera module according to any one of claims 1 to 11, the device comprising:

Detection module, used to detect changes in capacitance of capacitor components;

A control module is used to control the movement of the substrate according to the detected change in capacitance of the capacitor component, and the substrate drives the photosensitive chip to move to a target position.
An electronic device, including a processor and a memory, wherein the memory stores programs or instructions that can be run on the processor, and when the programs or instructions are executed by the processor, the method of claim 12 is implemented A step of.
A readable storage medium on which a program or instructions are stored, wherein the steps of the method of claim 12 are implemented when the program or instructions are executed by a processor.
An electronic device including the camera module according to any one of claims 1 to 11.