WO2023224316A1 - Display area with transition layer - Google Patents

Display area with transition layer Download PDF

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Publication number
WO2023224316A1
WO2023224316A1 PCT/KR2023/006407 KR2023006407W WO2023224316A1 WO 2023224316 A1 WO2023224316 A1 WO 2023224316A1 KR 2023006407 W KR2023006407 W KR 2023006407W WO 2023224316 A1 WO2023224316 A1 WO 2023224316A1
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WO
WIPO (PCT)
Prior art keywords
layer
display area
opening
sub
area
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PCT/KR2023/006407
Other languages
French (fr)
Inventor
Jinsung Jung
Daeyoun Kim
Hong Yoon
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Corning Incorporated
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Publication date
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Publication of WO2023224316A1 publication Critical patent/WO2023224316A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the present disclosure relates generally to a display area and more particularly to a display area with a transition layer.
  • Micro-LED displays typically include arrays of microscopic light emitting diodes (LEDs), which form individual pixel elements. Such displays can exhibit improved attributes with respect to, for example flexibility, electrical consumption, brightness, contrast, sharpness, and reliability. Such displays can include an array of panels or tiles, wherein a seam or gap typically exits between adjacent panels or tiles. Such seam or gap may be undesirably visible to a viewer, particularly in the case of large-sized display applications. Use of a circular polarizer can minimize seam or gap visibility, but its relatively low optical transmittance can result in a loss of display brightness. According, a need exists for additional technologies that can minimize seam or gap visibility in tiled micro-LED displays while still providing acceptable display brightness.
  • LEDs microscopic light emitting diodes
  • the present disclosure provides generally a display area and more particularly a display area with a transition layer.
  • Embodiments disclosed herein include a display area.
  • the display area includes an optically transparent layer having a first major surface and an opposing second major surface.
  • the display area also includes a substrate having a major surface facing the second major surface of the transparent layer.
  • the display area includes a plurality of light sources positioned on the major surface of the substrate.
  • the display area also includes a transition layer between the optically transparent layer and the plurality of light sources.
  • the transition layer includes a layer of non-transparent material having at least one opening extending over an area between at least one of the plurality of light sources and the optically transparent layer.
  • the transition layer also includes a layer of a semi-transparent material extending across a portion of the at least one opening and having at least one sub-opening extending over a sub-area between at least one of the plurality of light sources and the optically transparent layer.
  • FIG. 1 is a perspective view of a display area comprising a plurality of tiles in accordance with embodiments disclosed herein;
  • FIG. 2 is an enlarged view of a tile of the plurality of tiles of FIG. 1 in accordance with embodiments disclosed herein;
  • FIG. 3 is an enlarged view of area 'A' of the tile of FIG. 2 comprising a plurality of pixels in accordance with embodiments disclosed herein;
  • FIG. 4 is an enlarged view of a pixel of FIG. 3, showing a plurality of chips and a non-transparent layer with an opening in accordance with embodiments disclosed herein;
  • FIG. 5 is cross-sectional view of a display area taken along the line 'B-B' of FIG. 4 in accordance with embodiments disclosed herein;
  • FIG. 6 is a perspective view of the display area of FIG. 4;
  • FIG. 7 is a cross-sectional view of a display area in accordance with embodiments disclosed herein.
  • FIG. 8 is a perspective view of the display area of FIG. 7.
  • Ranges can be expressed herein as from “about” one particular value, and/or to "about” another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, for example by use of the antecedent "about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
  • the term "transparent” refers to a material or layer having an optical transmittance of at least about 50 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
  • non-transparent refers to a material or layer having an optical transmittance of less than about 5 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
  • the term "semi-transparent" refers to a material having an optical transmittance of from about 5 percent to about 50 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
  • anti-reflective refers to a material, layer, or coating having a refractive index of greater than about 1.0 and less than about 1.4.
  • the term "tinted” refers to a material, layer, or coating that has been treated with an additional material, layer, or coating such that the transmission of light through the material, layer, or coating is less than the transmission of light through the same material, layer, or coating that has not been treated with the additional material, layer, or coating.
  • a material with transformable transparency refers to a material that undergoes a change in light transparency upon exposure to heat and/or light.
  • the term "reflectance value” refers to the fraction or percentage of light emitted from light sources of a display area that is reflected back to the light sources.
  • FIG 1 shows a perspective view of a display area 100 comprising a plurality of tiles 104 in accordance with embodiments disclosed herein.
  • plurality of tiles 104 are positioned in a M ⁇ N array on base plate 102.
  • Tiles 104 can, for example, be components of a mirco-LED display and while FIG. 1 shows a display area 100 comprising 20 tiles 104, embodiments disclosed herein include display areas comprising any number of tiles 104.
  • FIG. 2 shows an enlarged view of a tile 104 of the plurality of tiles 104 of FIG. 1 in accordance with embodiments disclosed herein.
  • tile can have a rectangular shape, with an X dimension ranging, for example, from about 50 millimeters to about 500 millimeters, such as from about 100 millimeters to about 300 millimeters, including about 200 millimeters, and a Y dimension ranging, for example, from about 40 millimeters to about 400 millimeters, such as from about 80 millimeters to about 250 millimeters, including about 150 millimeters.
  • FIG. 3 shows an enlarged view of area 'A' of the tile of FIG. 2 comprising a plurality of pixels 200 in accordance with embodiments disclosed herein.
  • a lateral distance between immediately adjacent pixels 200 is defined as a pixel pitch.
  • the pixel pitch can be from about 100 micrometers to about 500 micrometers, such as from about 200 to about 400 micrometers.
  • FIG. 4 shows an enlarged view of a pixel 200 of FIG. 3, showing a plurality of chips 204 (e.g., LED chips) and a transition layer 210 extending over the plurality of chips 204.
  • a plurality of chips 204 e.g., LED chips
  • One or more of the plurality of chips 204 may, for example, comprise a red-green-blue (RGB) chip (e.g., a RGB LED chip).
  • RGB red-green-blue
  • a display area 100 can extend around a chip 204.
  • FIG. 4 shows display area 100 extending around one chip 204, embodiments disclosed herein include those in which display area 100 extends around a plurality of chips 204.
  • FIG. 5 shows a cross-sectional view of a display area 100 taken along the line 'B-B' of FIG. 4 in accordance with embodiments disclosed herein.
  • Display area 100 includes an optically transparent layer 208 comprising a first major surface 208a and an opposing second major surface 208b.
  • Display area 100 also includes a substrate 202 comprising a major surface 202a facing the second major surface 208b of the transparent layer 208.
  • At least one light source 204 e.g., a RGB LED chip
  • a transition layer 210 extends between the transparent layer 208 and the at least one light source 204.
  • Transition layer 210 includes a layer of non-transparent material 210a that comprises an opening 212 extending over an area between at least one light source 204 and optically transparent layer 208. Transition layer 210 also includes a layer of a semi-transparent material 210b extending across a portion of opening 212 and comprising at least one sub-opening 214 extending over a sub-area between at least one light source 204 and optically transparent layer 208. Specifically, FIG. 5 shows three sub-openings 214 extending over areas between components of light source 204 and optically transparent layer 208. And while FIG. 5 shows three sub-openings 214, embodiments disclosed herein can include those having greater or fewer sub-openings 214 within opening 212.
  • FIG. 6 shows a perspective view of the display area 100 of FIG. 4.
  • layer of semi-transparent material 210b extends around a periphery of opening 212 of layer of non-transparent material 210a and also extends around a periphery of each sub-opening 214.
  • layer of semi-transparent material 210b extends around an inner periphery of opening 212 while extending around outer peripheries of each sub-opening 214.
  • each sub-opening 214 extends within opening 212, wherein layer of semi-transparent material 210b extends across area of opening 212 not covered by areas of sub-openings 214.
  • the sub-area over which one or more sub-openings 214 extend comprises a percentage of the area over which opening 212 extends.
  • embodiments disclosed herein include those in which wherein sub-area over which the at least one sub-opening 214 extends comprises from about 20% to about 80%, such as from about 30% to about 70%, and further such as from about 40% to about 60% of the area over which opening 212 extends.
  • FIG. 7 shows a cross-sectional view of a display area 100' in accordance with embodiments disclosed herein.
  • Display area 100' extends across adjacent tiles 104 with seam 106 extending therebetween.
  • Display area 100' includes optically transparent layer 208, substrates 202, and light sources 204 (e.g., RGB LED chips) positioned on substrates 202, wherein FIG. 7 shows a substrate 202 and a light source 204 of each tile 104 positioned on opposing sides of seam 106.
  • a transition layer 210 extends between the transparent layer 208 and the light sources 204.
  • Transition layer 210 includes a layer of non-transparent material 210a that comprises openings 212 extending over areas between light sources 204 and optically transparent layer 208.
  • Layer of non-transparent material 210a also extends across seam 106.
  • Transition layer 210 also includes layers of a semi-transparent material 210b extending across portions of openings 212 and comprising sub-openings 214 extending over sub-areas between light source 204 and optically transparent layer 208.
  • seam 106 can have a width such that the closet distance (or gap) between adjacent tiles 104 ranges from about 25 micrometers to about 200 micrometers, such as from about 50 micrometers to about 100 micrometers.
  • FIG. 8 shows a perspective view of the display area 100' of FIG. 7.
  • Display area includes four openings 212 extending within layer of non-transparent material 210a with sub-openings 214 extending within each opening 212 and layers of semi-transparent material 210b extending around a periphery of each opening 212 and also extending around a periphery of each sub-opening 214.
  • each layer of semi-transparent material 210b extends around an inner periphery of each opening 212 while extending around an outer periphery of each sub-opening 214.
  • openings 212 and sub-openings 214 are shown in FIGS.
  • openings 212 and/or sub-openings 214 have other areas, such as other polygonal areas (e.g., triangular, etc.), circular areas, or elliptical areas.
  • optically transparent layer 208 comprises at least one material selected from glass materials, polymeric materials, ceramic materials, and sapphire. In certain exemplary embodiments, optically transparent layer 208 comprises glass.
  • transition layer 210 can be adhered to optically transparent layer 208 according to methods known to persons having ordinary skill in the art, such as by lamination and solution coating, such as slot-die, bar coating, screen printing, inkjet printing, or spin-coating.
  • layer of non-transparent material 210a comprises a black film, such as a carbon particle contained polymer resin.
  • Layer of non-transparent material 210a may also comprise an absorbing/polarizing film, such as dye-doped liquid crystal or guest-host liquid crystal film.
  • layer of non-transparent material 210a may have an optical transmittance of from about 0 percent to about 5 percent, such as from about 1 percent to about 4 percent, and further such as from about 2 percent to about 3 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
  • layer of semi-transparent material 210b comprises a tinted film and/or a material with transformable transparency. In certain exemplary embodiments, layer of semi-transparent material 210b comprises a circular polarizing film.
  • layer of semi-transparent material 210b may have an optical transmittance of from about 5 percent to about 50 percent, such as from about 10 percent to about 45 percent, and further such as from about 15 percent to about 40 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
  • display area 100 or 100' may also comprise one or more additional optically transparent or semi-transparent layers.
  • layer(s) may, for example, comprise at least one material selected from glass materials, polymeric materials, ceramic materials, and sapphire, which may or may not be tinted and/or have transformable transparency.
  • layer(s) may comprise at least one tinting material selected from, for example, dyed tints, metalized tints, hybrid tents, carbon tints, and ceramic tints, as known to persons having ordinary skill in the art.
  • display area 100 or 100' may comprise one or more layers comprising an anti-reflective material.
  • a layer comprising an anti-reflective material may be adhered to optically transparent layer 208, such as adhered to first major surface 208a of optically transparent layer 208.
  • Layer comprising an anti-reflective material may, for example, comprise at least one material selected from magnesium fluoride, fluoropolymers, mesoporous silica nanoparticles, thin interference films, and layers with engineered surfaces, such as nanopatterned glasses.
  • Embodiments disclosed herein can, for example, enable display areas, such as micro-LED displays comprising a plurality of tiles having reduced seam or gap visibility. Such displays can also exhibit other desirable attributes such as an optical transmittance of greater than about 80%, a reflectance of less than about 5%, a haze of less than about 5%, and a viewing angle of ⁇ 90°.

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Abstract

A display area includes an optically transparent layer, a substrate, a plurality of light sources, and a transition layer between the optically transparent layer and the plurality of light sources. The transition layer includes a layer of non-transparent material having at least one opening extending over an area between at least one of the plurality of light sources and the optically transparent layer and a layer of a semi-transparent material extending across a portion of the at least one opening and having at least one sub-opening extending over a sub-area between at least one of the plurality of light sources and the optically transparent layer.

Description

DISPLAY AREA WITH TRANSITION LAYER
<Cross Reference to Related Application>
This application claims the benefit of priority under 35 U.S.C. § 119 of Korean Patent Application Serial No. 10-2022-0059828 filed on May 16, 2022, the content of which is relied upon and incorporated herein by reference in its entirety.
The present disclosure relates generally to a display area and more particularly to a display area with a transition layer.
Micro-LED displays typically include arrays of microscopic light emitting diodes (LEDs), which form individual pixel elements. Such displays can exhibit improved attributes with respect to, for example flexibility, electrical consumption, brightness, contrast, sharpness, and reliability. Such displays can include an array of panels or tiles, wherein a seam or gap typically exits between adjacent panels or tiles. Such seam or gap may be undesirably visible to a viewer, particularly in the case of large-sized display applications. Use of a circular polarizer can minimize seam or gap visibility, but its relatively low optical transmittance can result in a loss of display brightness. According, a need exists for additional technologies that can minimize seam or gap visibility in tiled micro-LED displays while still providing acceptable display brightness.
The present disclosure provides generally a display area and more particularly a display area with a transition layer.
Embodiments disclosed herein include a display area. The display area includes an optically transparent layer having a first major surface and an opposing second major surface. The display area also includes a substrate having a major surface facing the second major surface of the transparent layer. In addition, the display area includes a plurality of light sources positioned on the major surface of the substrate. The display area also includes a transition layer between the optically transparent layer and the plurality of light sources. The transition layer includes a layer of non-transparent material having at least one opening extending over an area between at least one of the plurality of light sources and the optically transparent layer. The transition layer also includes a layer of a semi-transparent material extending across a portion of the at least one opening and having at least one sub-opening extending over a sub-area between at least one of the plurality of light sources and the optically transparent layer.
Additional features and advantages of the embodiments disclosed herein will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the disclosed embodiments as described herein, including the detailed description which follows, the claims, as well as the appended drawings.
It is to be understood that both the foregoing general description and the following detailed description present embodiments intended to provide an overview or framework for understanding the nature and character of the claimed embodiments. The accompanying drawings are included to provide further understanding and are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure, and together with the description serve to explain the principles and operations thereof.
FIG. 1 is a perspective view of a display area comprising a plurality of tiles in accordance with embodiments disclosed herein;
FIG. 2 is an enlarged view of a tile of the plurality of tiles of FIG. 1 in accordance with embodiments disclosed herein;
FIG. 3 is an enlarged view of area 'A' of the tile of FIG. 2 comprising a plurality of pixels in accordance with embodiments disclosed herein;
FIG. 4 is an enlarged view of a pixel of FIG. 3, showing a plurality of chips and a non-transparent layer with an opening in accordance with embodiments disclosed herein;
FIG. 5 is cross-sectional view of a display area taken along the line 'B-B' of FIG. 4 in accordance with embodiments disclosed herein;
FIG. 6 is a perspective view of the display area of FIG. 4;
FIG. 7 is a cross-sectional view of a display area in accordance with embodiments disclosed herein; and
FIG. 8 is a perspective view of the display area of FIG. 7.
Reference will now be made in detail to the present preferred embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Ranges can be expressed herein as from "about" one particular value, and/or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, for example by use of the antecedent "about," it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
Directional terms as used herein - for example up, down, right, left, front, back, top, bottom - are made only with reference to the figures as drawn and are not intended to imply absolute orientation.
Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order, nor that with any apparatus specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred, in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of embodiments described in the specification.
As used herein, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a" component includes aspects having two or more such components, unless the context clearly indicates otherwise.
As used herein, the term "transparent" refers to a material or layer having an optical transmittance of at least about 50 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
As used herein, the term "non-transparent" refers to a material or layer having an optical transmittance of less than about 5 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
As used herein, the term "semi-transparent" refers to a material having an optical transmittance of from about 5 percent to about 50 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
As used herein, the term "anti-reflective" refers to a material, layer, or coating having a refractive index of greater than about 1.0 and less than about 1.4.
As used herein, the term "tinted" refers to a material, layer, or coating that has been treated with an additional material, layer, or coating such that the transmission of light through the material, layer, or coating is less than the transmission of light through the same material, layer, or coating that has not been treated with the additional material, layer, or coating.
As used herein, the term "a material with transformable transparency" refers to a material that undergoes a change in light transparency upon exposure to heat and/or light.
As used herein, the term "reflectance value" refers to the fraction or percentage of light emitted from light sources of a display area that is reflected back to the light sources.
FIG 1 shows a perspective view of a display area 100 comprising a plurality of tiles 104 in accordance with embodiments disclosed herein. As shown in FIG. 1, plurality of tiles 104 are positioned in a MХN array on base plate 102. Tiles 104 can, for example, be components of a mirco-LED display and while FIG. 1 shows a display area 100 comprising 20 tiles 104, embodiments disclosed herein include display areas comprising any number of tiles 104.
FIG. 2 shows an enlarged view of a tile 104 of the plurality of tiles 104 of FIG. 1 in accordance with embodiments disclosed herein. While not limited to any particular geometry, in certain exemplary embodiments, tile can have a rectangular shape, with an X dimension ranging, for example, from about 50 millimeters to about 500 millimeters, such as from about 100 millimeters to about 300 millimeters, including about 200 millimeters, and a Y dimension ranging, for example, from about 40 millimeters to about 400 millimeters, such as from about 80 millimeters to about 250 millimeters, including about 150 millimeters.
FIG. 3 shows an enlarged view of area 'A' of the tile of FIG. 2 comprising a plurality of pixels 200 in accordance with embodiments disclosed herein. A lateral distance between immediately adjacent pixels 200 (shown as distance 'P' in FIG. 3) is defined as a pixel pitch. In certain exemplary embodiments, the pixel pitch can be from about 100 micrometers to about 500 micrometers, such as from about 200 to about 400 micrometers.
FIG. 4 shows an enlarged view of a pixel 200 of FIG. 3, showing a plurality of chips 204 (e.g., LED chips) and a transition layer 210 extending over the plurality of chips 204. One or more of the plurality of chips 204 may, for example, comprise a red-green-blue (RGB) chip (e.g., a RGB LED chip). As shown in FIG. 4, a display area 100 can extend around a chip 204. And while FIG. 4 shows display area 100 extending around one chip 204, embodiments disclosed herein include those in which display area 100 extends around a plurality of chips 204.
FIG. 5 shows a cross-sectional view of a display area 100 taken along the line 'B-B' of FIG. 4 in accordance with embodiments disclosed herein. Display area 100 includes an optically transparent layer 208 comprising a first major surface 208a and an opposing second major surface 208b. Display area 100 also includes a substrate 202 comprising a major surface 202a facing the second major surface 208b of the transparent layer 208. At least one light source 204 (e.g., a RGB LED chip) of a plurality of light sources (e.g., LEDs) is positioned on the major surface 202a of the substrate 202. In addition, a transition layer 210 extends between the transparent layer 208 and the at least one light source 204. Transition layer 210 includes a layer of non-transparent material 210a that comprises an opening 212 extending over an area between at least one light source 204 and optically transparent layer 208. Transition layer 210 also includes a layer of a semi-transparent material 210b extending across a portion of opening 212 and comprising at least one sub-opening 214 extending over a sub-area between at least one light source 204 and optically transparent layer 208. Specifically, FIG. 5 shows three sub-openings 214 extending over areas between components of light source 204 and optically transparent layer 208. And while FIG. 5 shows three sub-openings 214, embodiments disclosed herein can include those having greater or fewer sub-openings 214 within opening 212.
FIG. 6 shows a perspective view of the display area 100 of FIG. 4. As can be seen from FIG. 6, layer of semi-transparent material 210b extends around a periphery of opening 212 of layer of non-transparent material 210a and also extends around a periphery of each sub-opening 214. Specifically, layer of semi-transparent material 210b extends around an inner periphery of opening 212 while extending around outer peripheries of each sub-opening 214. Accordingly, each sub-opening 214 extends within opening 212, wherein layer of semi-transparent material 210b extends across area of opening 212 not covered by areas of sub-openings 214.
Alternatively stated, the sub-area over which one or more sub-openings 214 extend comprises a percentage of the area over which opening 212 extends. For example, embodiments disclosed herein include those in which wherein sub-area over which the at least one sub-opening 214 extends comprises from about 20% to about 80%, such as from about 30% to about 70%, and further such as from about 40% to about 60% of the area over which opening 212 extends.
FIG. 7 shows a cross-sectional view of a display area 100' in accordance with embodiments disclosed herein. Display area 100' extends across adjacent tiles 104 with seam 106 extending therebetween. Display area 100' includes optically transparent layer 208, substrates 202, and light sources 204 (e.g., RGB LED chips) positioned on substrates 202, wherein FIG. 7 shows a substrate 202 and a light source 204 of each tile 104 positioned on opposing sides of seam 106. In addition, a transition layer 210 extends between the transparent layer 208 and the light sources 204. Transition layer 210 includes a layer of non-transparent material 210a that comprises openings 212 extending over areas between light sources 204 and optically transparent layer 208. Layer of non-transparent material 210a also extends across seam 106. Transition layer 210 also includes layers of a semi-transparent material 210b extending across portions of openings 212 and comprising sub-openings 214 extending over sub-areas between light source 204 and optically transparent layer 208.
In certain exemplary embodiments, seam 106 can have a width such that the closet distance (or gap) between adjacent tiles 104 ranges from about 25 micrometers to about 200 micrometers, such as from about 50 micrometers to about 100 micrometers.
FIG. 8 shows a perspective view of the display area 100' of FIG. 7. Display area includes four openings 212 extending within layer of non-transparent material 210a with sub-openings 214 extending within each opening 212 and layers of semi-transparent material 210b extending around a periphery of each opening 212 and also extending around a periphery of each sub-opening 214. Specifically, each layer of semi-transparent material 210b extends around an inner periphery of each opening 212 while extending around an outer periphery of each sub-opening 214. And while openings 212 and sub-openings 214 are shown in FIGS. 5-8 as having rectangular areas, embodiments disclosed herein include those in which openings 212 and/or sub-openings 214 have other areas, such as other polygonal areas (e.g., triangular, etc.), circular areas, or elliptical areas.
In certain exemplary embodiments, optically transparent layer 208 comprises at least one material selected from glass materials, polymeric materials, ceramic materials, and sapphire. In certain exemplary embodiments, optically transparent layer 208 comprises glass.
In certain exemplary embodiments, transition layer 210 can be adhered to optically transparent layer 208 according to methods known to persons having ordinary skill in the art, such as by lamination and solution coating, such as slot-die, bar coating, screen printing, inkjet printing, or spin-coating.
In certain exemplary embodiments, layer of non-transparent material 210a comprises a black film, such as a carbon particle contained polymer resin. Layer of non-transparent material 210a may also comprise an absorbing/polarizing film, such as dye-doped liquid crystal or guest-host liquid crystal film.
In certain exemplary embodiments, layer of non-transparent material 210a may have an optical transmittance of from about 0 percent to about 5 percent, such as from about 1 percent to about 4 percent, and further such as from about 2 percent to about 3 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
In certain exemplary embodiments, layer of semi-transparent material 210b comprises a tinted film and/or a material with transformable transparency. In certain exemplary embodiments, layer of semi-transparent material 210b comprises a circular polarizing film.
In certain exemplary embodiments, layer of semi-transparent material 210b may have an optical transmittance of from about 5 percent to about 50 percent, such as from about 10 percent to about 45 percent, and further such as from about 15 percent to about 40 percent over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers).
In certain exemplary embodiments, display area 100 or 100' may also comprise one or more additional optically transparent or semi-transparent layers. Such layer(s) may, for example, comprise at least one material selected from glass materials, polymeric materials, ceramic materials, and sapphire, which may or may not be tinted and/or have transformable transparency. When tinted, such layer(s) may comprise at least one tinting material selected from, for example, dyed tints, metalized tints, hybrid tents, carbon tints, and ceramic tints, as known to persons having ordinary skill in the art.
In certain exemplary embodiments, display area 100 or 100' may comprise one or more layers comprising an anti-reflective material. For example, a layer comprising an anti-reflective material may be adhered to optically transparent layer 208, such as adhered to first major surface 208a of optically transparent layer 208. Layer comprising an anti-reflective material may, for example, comprise at least one material selected from magnesium fluoride, fluoropolymers, mesoporous silica nanoparticles, thin interference films, and layers with engineered surfaces, such as nanopatterned glasses.
Embodiments disclosed herein can, for example, enable display areas, such as micro-LED displays comprising a plurality of tiles having reduced seam or gap visibility. Such displays can also exhibit other desirable attributes such as an optical transmittance of greater than about 80%, a reflectance of less than about 5%, a haze of less than about 5%, and a viewing angle of ±90°.
It will be apparent to those skilled in the art that various modifications and variations can be made to embodiment of the present disclosure without departing from the spirit and scope of the disclosure. Thus, it is intended that the present disclosure cover such modifications and variations provided they come within the scope of the appended claims and their equivalents.

Claims (12)

  1. A display area comprising:
    an optically transparent layer comprising a first major surface and an opposing second major surface;
    a substrate comprising a major surface facing the second major surface of the transparent layer;
    a plurality of light sources positioned on the major surface of the substrate; and
    a transition layer between the optically transparent layer and the plurality of light sources, the transition layer comprising:
    a layer of non-transparent material comprising at least one opening extending over an area between at least one of the plurality of light sources and the optically transparent layer; and
    a layer of a semi-transparent material extending across a portion of the at least one opening and comprising at least one sub-opening extending over a sub-area between at least one of the plurality of light sources and the optically transparent layer.
  2. The display area of claim 1, wherein the layer of semi-transparent material extends around at least a periphery of the at least one opening.
  3. The display area of claim 2, wherein the at least one sub-opening comprises a plurality of sub-openings and the layer of semi-transparent material extends around a periphery of each sub-opening.
  4. The display area of claim 1, wherein the display area comprises a plurality of tiles arranged in an array, a seam extends between adjacent tiles of the plurality of tiles, and the layer of non-transparent material extends across the seam.
  5. The display area of claim 1, wherein the optically transparent layer comprises glass.
  6. The display area of claim 1, wherein the plurality of light sources comprise light emitting diodes (LEDs).
  7. The display area of claim 6, wherein the opening extends over an area comprising a red-green-blue (RGB) LED chip.
  8. The display area of claim 1, wherein the transition layer is adhered to the optically transparent layer.
  9. The display area of claim 1, wherein the layer of non-transparent material comprises a black film or an absorbing/polarizing film.
  10. The display area of claim 1, wherein the layer of semi-transparent material comprises a circular polarizing film.
  11. The display area of claim 1, wherein the sub-area over which the at least one sub-opening extends comprises from about 20% to about 80% of the area over which the at least one opening extends.
  12. An electronic device comprising the display area of claims 1 or 4.
PCT/KR2023/006407 2022-05-16 2023-05-11 Display area with transition layer WO2023224316A1 (en)

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JP2021009937A (en) * 2019-07-01 2021-01-28 大日本印刷株式会社 Light emitting diode substrate with sealing member, display device, tiling display device, and sealing material sheet for light emitting diode substrate
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US20200295120A1 (en) * 2019-03-12 2020-09-17 X Display Company Technology Limited Tiled displays with black-matrix support screens
JP2021009937A (en) * 2019-07-01 2021-01-28 大日本印刷株式会社 Light emitting diode substrate with sealing member, display device, tiling display device, and sealing material sheet for light emitting diode substrate

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