WO2023222210A1 - Method for connecting printed circuit boards, multi-layer printed circuit board staple, electronic control unit and motor vehicle - Google Patents
Method for connecting printed circuit boards, multi-layer printed circuit board staple, electronic control unit and motor vehicle Download PDFInfo
- Publication number
- WO2023222210A1 WO2023222210A1 PCT/EP2022/063386 EP2022063386W WO2023222210A1 WO 2023222210 A1 WO2023222210 A1 WO 2023222210A1 EP 2022063386 W EP2022063386 W EP 2022063386W WO 2023222210 A1 WO2023222210 A1 WO 2023222210A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed circuit
- circuit boards
- circuit board
- layer
- needle terminal
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
- H01R12/613—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures by means of interconnecting elements
- H01R12/616—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures by means of interconnecting elements having contacts penetrating insulation for making contact with conductors, e.g. needle points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Definitions
- the invention relates to a method for electronically connecting several printed circuit boards of a multi-layer printed circuit board staple for an electronic control unit, to a multi-layer printed circuit board staple for an electronic control unit, to an electronic control unit comprising a multi-layer printed circuit board staple and to a motor vehicle comprising an electronic control unit.
- PCBs printed circuit boards
- Such terminals either require dedicated holes with accurate position and diameter within the PCBs or press fit pins are utilized.
- the challenge of reducing space in combination with establishing reliable electrical connection is not met.
- the press-fit terminals must meet specific requirements and are only available from a few suppliers.
- the PCBs must be manufactured with very accurate holes (position and diameter), so that the stacked PCBs of a multi-layer printed circuit board staple can be aligned with each other.
- a soldered board-to-board connection requires a specific soldering machine on the assembly line, which has to be adjusted beforehand during development (timeconsuming and costly).
- the present invention has the aim of simplifying the connection of printed circuit boards of a multilayer printed circuit board stack and, in particular, to execute it in a very space-saving manner. Therefore, it is an object of the present invention, to provide a method for electronically connecting several printed circuit boards of a multilayer printed circuit board staple for an electronic control unit, a multi-layer printed circuit board staple for an electronic control unit, an electronic control unit comprising a multi-layer printed circuit board staple and a motor vehicle comprising an electronic control unit, which realize the electronic connection between the printed circuit boards in an easy, cost-effective and space-saving manner.
- the object is solved by a method for electronically connecting several printed circuit boards of a multi-layer printed circuit board staple for an electronic control unit, the printed circuit boards of the multi-layer printed circuit board staple are stacked-up above each other, each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer, the printed circuit boards having no holes, wherein the method comprises followings steps:
- the multi-layer printed circuit board staple is built by several printed circuit boards. Several means at least two printed circuit boards, in particular three or more printed circuit boards. The printed circuit boards are stacked together in a row. Each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer, like a thin copper layer.
- the multi-layer printed circuit board staple always has an insulating layer followed by a conductive layer followed by an insulating layer, and so on. The printed circuit boards do not have holes when they are stacked together to a multi-layer printed circuit board staple.
- a needle terminal is introduced through at least two printed circuit boards of the several printed circuit boards of the multi-layer printed circuit board staple.
- the needle terminal deforms the material of the conductive layers in a way that the material of adjacent conductive layers is interconnected with each other, so that they form an electrically conductive connection with each other.
- the several printed circuit boards can be clamped together during the insertion.
- the conductive layer of one printed circuit board is preferably dielectric material.
- a dielectric material is a substance that is a poor conductor of electricity and is used as the insulating layer in the printed circuit board. Porcelain, glass, plastics and some metal oxides can be used.
- a thin conductive layer like a copper layer, is arranged.
- the multi-layer printed circuit board staple has two complementary functions.
- the first function is to affix electronic components in designated locations on the outer layers by means of soldering. Therefore, a solder mask can be arranged at the most outer layer.
- the second function is to provide electrical connections between the component's terminals in a controlled manner.
- Each of the conductive layers of the printed circuit boards is designed with an artwork pattern of conductors that provides electrical connections on that conductive layer.
- the conductive layers can further comprise vias that allow interconnections between adjacent printed circuit boards.
- the needle terminal is introduced into the multi-layer printed circuit board staple perpendicular to the printed circuit boards of the multi-layer printed circuit board staple.
- the needle terminal is not very thick, that is, it has a diameter of a few millimeters up to 1 centimeter.
- the terminal needle comprises an electrically conductive material, in particular consists of an electrically conductive material.
- the material of the needle terminal is slightly harder than the material of the printed circuit boards, so that it can be inserted through the printed circuit boards into the stack to connect the conductive layers with each other and with the needle terminal.
- the needle terminal perforates the at least two printed circuit boards during the introduction of the needle terminal through the at least two printed circuit boards and deforms the conductive layers of the at least two printed circuit boards to make the electrical connection between the at least two printed circuit boards and the needle terminal. That means, the needle terminal makes small holes in the several printed circuit boards and thereby deforms in particular the conductive layers such that an electronic connection is established between the several conductive layers. Perforating involves a kind of puncturing the printed circuit boards with the needle terminal.
- the needle terminal is punched through the at least two printed circuit boards, in particular through all printed circuit boards of the multi-layer printed circuit board staple.
- the needle terminal is subjected to a certain pressure in order to be pushed through the printed circuit boards of the multi-layer printed circuit board staple.
- the needle terminal is tapered to his end, which is introduced first through the printed circuit boards.
- the end of the needle terminal can be cone-shaped.
- the tapered end can comprise a material, which is harder than the rest of the body of the needle terminal. This enables an easy introduction of the needle terminal through the printed circuit boards.
- the needle terminal is hollow. This makes it even easier to insert the needle terminal through the printed circuit boards and to establish the electrical connection between the conductive layers of the several printed circuit boards.
- the needle terminal is introduced, in particular punched, through all printed circuit boards to electronically connect the conductive layers of all printed circuit boards with each other and with the needle terminal.
- the needle terminal After being introduced, in particular being punched, through the printed circuit boards of the multi-layer printed circuit board staple the needle terminal can remain in the multi-layer printed circuit board staple to ensure the electrical connection between the conductive layers of the several printed circuit boards.
- a multi-layer printed circuit board staple for an electronic control unit comprises several printed circuit boards.
- the several printed circuit boards of the multi-layer printed circuit board staple are stacked-up above each other.
- Each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer.
- the several printed circuit boards having no holes.
- the conductive layers of at least two of the several printed circuit boards of the multilayer printed circuit board staple are electronically connected with each other by a needle terminal, which is introduced through the at least two printed circuit boards of the several printed circuit boards.
- Such a multi-layer printed circuit board staple enables in an easy, cost-effective and space-saving manner an electronic connection between at least two of the printed circuit boards, preferably all printed circuit boards of the multi-layer printed circuit board staple. Therefore, the inventive multi-layer printed circuit board staple brings up the same advantages that have been discussed in detail with respect to the inventive method according to the first aspect of the invention.
- the multi-layer printed circuit board staple is built by several printed circuit boards. Several means at least two printed circuit boards, in particular three or more printed circuit boards. The printed circuit boards are stacked together in a row. Each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer, like a thin copper layer.
- the multi-layer printed circuit board staple always has an insulating layer followed by a conductive layer followed by an insulating layer, and so on.
- the inserted needle terminal connects the different conductive layer of the printed circuit boards electrically with each other. No board-to-board terminals are used.
- the multi-layer printed circuit board staple makes the “board-to-board connection” simpler having a needle terminal punched into the printed circuit boards of the multi-layer printed circuit board staple. In particular, the electronic connection is established in the printed circuit boards made without holes.
- the needle terminal is punched through the at least two printed circuit boards of the several printed circuit boards to make the electrical connection between the at least two printed circuit boards and the needle terminal.
- the needle terminal is introduced, in particular punched, through all printed circuit boards to electrically connect the conductive layers of all printed circuit boards with each other and with the needle terminal.
- the needle terminal can be tapered to his end and/or the needle terminal can be hollow. That means the end of the needle terminal can be cone-shaped.
- the tapered end can comprise a material, which is harder than the rest of the body of the needle terminal. Such a design of the needle terminal makes it even easier to insert the needle terminal through the printed circuit boards and to establish the electrical connection between the conductive layers of the several printed circuit boards.
- the conductive layers of the printed circuit boards are copper layers.
- an electronic control unit comprising a multi-layer printed circuit board staple according to the aspects described before.
- An electronic control unit comprising such a multi-layer printed circuit board staple enables a compact design of the electronic control unit, which can be a compact steering ECU for a motor vehicle.
- a motor vehicle in particular an electric vehicle, comprising an electronic control unit according to aspect described before.
- inventive electronic control unit and the motor vehicle bring up the same advantages that have been discussed in detail with respect to the inventive method and the inventive multi-layer printed circuit board staple according to the first two aspects of the invention.
- Terminals pitch can be very small. Low insertion force due to needle terminal shape and thin conductive layers, in particular thin copper layers, thickness.
- Electronic control units can be provided which are integrated and compact in dimension.
- Fig. 1 shows a multi-layer printed circuit board staple before introduction of needle terminal
- Fig. 2 shows a first step of the method according to the invention, wherein the needle terminal approaches the multi-layer printed circuit board staple,
- Fig. 3 shows a second step of the method according to the invention, wherein the needle terminal starts perforating the multi-layer printed circuit board staple
- Fig. 4 shows a multi-layer printed circuit board staple according to the invention, wherein the needle terminal completely perforated the printed circuit boards of the multi-layer printed circuit board staple and the electrical connection is fully made between the printed circuit boards and the needle terminal
- Fig. 5 shows an electronic control unit comprising a multi-layer printed circuit board staple according to the invention
- Fig. 6 shows a motor vehicle with an electronic control unit according to the invention.
- Fig. 1 shows a multi-layer printed circuit board staple 1 before introduction of needle terminal 30.
- the multi-layer printed circuit board staple 1 comprises several printed circuit boards 10, which are are stacked-up above each other.
- Each printed circuit board 10 comprises an insulating layer 12 and at least on one side of the insulating layer 12 a conductive layer 14.
- the several printed circuit boards 10 having no holes.
- the conductive layer 14 can be cooper layer.
- an area 20 is shown, where the conductive layer 14 of the several printed circuit boards 10 of the multi-layer printed circuit board staple 1 need to be connected with each other.
- conductors 50 like vias, can be arranged.
- Fig. 2 shows a first step of the method according to the invention, wherein the needle terminal 30 approaches the multi-layer printed circuit board staple 1.
- the needle terminal 30 approaches the multi-layer printed circuit board staple 1 in the area 20 shown in Fig. 1 .
- the needle terminal 30 comprise a main body 32 and an end 34.
- the end 34 of the needle terminal 30 can be tapered.
- the needle terminal 30 can be hollow.
- solder masks 40 are shown, which are placed at the outer sides of the multi-layer printed circuit board staple 1 . These solder masks 40 are used to place electronic components onto the conductive layers 14 of the outer printed circuit boards 10 of the multi-layer printed circuit board staple 1 .
- Fig. 3 shows a second step of the method according to the invention, wherein the needle terminal 30 is introduced through the first printed circuit boards 10 of the multilayer printed circuit board staple 1 .
- the needle terminal 30 starts perforating the multi- layer printed circuit board staple 1 , thereby deforming the printed circuit boards 10 to establish an electronic connection between the conductive layers 14 of the several printed circuit boards 10 of the multi-layer printed circuit board staple 1 .
- Fig. 4 shows a multi-layer printed circuit board staple 1 according to the invention, wherein the needle terminal 30 completely perforated the printed circuit boards 10 of the multi-layer printed circuit board staple 1 and the electrical connection is fully made between the printed circuit boards 10 and the needle terminal 30.
- Fig. 5 shows an electronic control unit 60 comprising a multi-layer printed circuit board staple 1 according to the invention.
- the needle terminal 30 is remained within the multi-layer printed circuit board staple 1 of the electronic control unit 60.
- the end 34 of the needle terminal 30 has been removed. Therefore, the needle terminal 30 can comprise a predetermined breaking point in the area of the transition between the end 34 and the main body 32 of the needle terminal 30.
- Fig. 6 shows a motor vehicle 70 with an electronic control unit 60 according to the invention.
- a needle terminal 30 By introducing a needle terminal 30 through the printed circuit boards 10 of the multilayer printed circuit board staple 1 shown in Figs. 1 to 5 an electronic connection between the printed circuit boards 10 of the multi-layer printed circuit board staple 1 can be realized in an easy, cost-effective and space-saving manner.
- Using a needle terminal 30 allows a compact design of the multi-layer printed circuit board staple 1 without changing the outer dimensions of the multi-layer printed circuit board staple 1 .
- the arrangement of the several printed circuit boards 10 to each other can be done in an easy and fast way, because the printed circuit boards 10 do not need to be aligned with each other using holes.
- This invention makes the “board-to-board connection” simpler using a needle terminal 30 introduced into the multi-layer printed circuit board staple 1 .
- the printed circuit boards 10, that means, the insulating layers 12 and conductive layers 14, are deformed by the needle terminal 30 during insertion of the needle terminal 30 and the electrical connection is made between the conductive layers 14 of the printed circuit boards 10 of the multi-layer printed circuit board
Abstract
The invention relates to a method for electronically connecting several printed circuit boards (10) of a multi-layer printed circuit board staple (1) for an electronic control unit (60), to a multi-layer printed circuit board staple (1) for an electronic control unit (60), to an electronic control unit (60) comprising a multi-layer printed circuit board staple (1) and to a motor vehicle (70) comprising an electronic control unit (60).
Description
Method for connecting printed circuit boards, multi-layer printed circuit board staple, electronic control unit and motor vehicle
Description
The invention relates to a method for electronically connecting several printed circuit boards of a multi-layer printed circuit board staple for an electronic control unit, to a multi-layer printed circuit board staple for an electronic control unit, to an electronic control unit comprising a multi-layer printed circuit board staple and to a motor vehicle comprising an electronic control unit.
Space reduction is a need of customers and market. Making electronic systems integrated and compact is challenging plus complex. In electronic systems like electronic control units, several printed circuit boards (PCBs) are placed close to each other, which are connected to each other via terminals for communication. Such terminals either require dedicated holes with accurate position and diameter within the PCBs or press fit pins are utilized. However, in both these state-of-the-art solutions, the challenge of reducing space in combination with establishing reliable electrical connection is not met.
If a press-fit board-to-board connection is being considered, the press-fit terminals must meet specific requirements and are only available from a few suppliers. In addition, the PCBs must be manufactured with very accurate holes (position and diameter), so that the stacked PCBs of a multi-layer printed circuit board staple can be aligned with each other.
A soldered board-to-board connection requires a specific soldering machine on the assembly line, which has to be adjusted beforehand during development (timeconsuming and costly).
The present invention has the aim of simplifying the connection of printed circuit boards of a multilayer printed circuit board stack and, in particular, to execute it in a very space-saving manner. Therefore, it is an object of the present invention, to
provide a method for electronically connecting several printed circuit boards of a multilayer printed circuit board staple for an electronic control unit, a multi-layer printed circuit board staple for an electronic control unit, an electronic control unit comprising a multi-layer printed circuit board staple and a motor vehicle comprising an electronic control unit, which realize the electronic connection between the printed circuit boards in an easy, cost-effective and space-saving manner.
This problem is solved by the claims. Therefore, this object is solved by a method for electronically connecting several printed circuit boards of a multi-layer printed circuit board staple for an electronic control unit according to claim 1 , by a multi-layer printed circuit board staple for an electronic control unit according to claim 7, by an electronic control unit comprising a multi-layer printed circuit board staple according to claim 12 and by a motor vehicle according to claim 14. Further details of the invention unfold from the further claims as well as the description and the drawings. Thereby, the features and details described in connection with the method of the invention apply in connection with the multi-layer printed circuit board staple of the invention, the electronic control unit and the motor vehicle of the invention and the other way around, so that regarding the disclosure of the individual aspects of the invention it is or can be referred to one another.
According to a first aspect of the invention, the object is solved by a method for electronically connecting several printed circuit boards of a multi-layer printed circuit board staple for an electronic control unit, the printed circuit boards of the multi-layer printed circuit board staple are stacked-up above each other, each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer, the printed circuit boards having no holes, wherein the method comprises followings steps:
- electronically connecting the conductive layers of at least two printed circuit boards of the several printed circuit boards by introducing a needle terminal through the at least two printed circuit boards of the several printed circuit boards.
The multi-layer printed circuit board staple is built by several printed circuit boards. Several means at least two printed circuit boards, in particular three or more printed circuit boards. The printed circuit boards are stacked together in a row. Each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer, like a thin copper layer. The multi-layer printed circuit board staple always has an insulating layer followed by a conductive layer followed by an insulating layer, and so on. The printed circuit boards do not have holes when they are stacked together to a multi-layer printed circuit board staple. This make it easy and cost-effective to produce the printed circuit boards and thus the multi-layer printed circuit board staple. The connect the different conductive layers of the multi-layer printed circuit board staple with each other a needle terminal used. In particular, a needle terminal is introduced through at least two printed circuit boards of the several printed circuit boards of the multi-layer printed circuit board staple. Thereby the needle terminal deforms the material of the conductive layers in a way that the material of adjacent conductive layers is interconnected with each other, so that they form an electrically conductive connection with each other. To establish a good insertion of the needle terminal, the several printed circuit boards can be clamped together during the insertion.
By introducing a needle terminal through the printed circuit boards an electronic connection between the adjacent printed circuit boards of the multi-layer printed circuit board staple can be realized in an easy, cost-effective and space-saving manner. Using a needle terminal allows a compact design of the multi-layer printed circuit board staple. The arrangement of the several printed circuit boards to each other can be done in an easy and fast way, because the printed circuit boards do not need to be aligned with each other using holes. This invention makes the “board-to-board connection” simpler using a needle terminal introduced into the multi-layer printed circuit board staple, where no holes are arranged in the printed circuit boards. The printed circuit boards, that means, the insulating layers and the conductive layers, are deformed by the needle terminal during insertion and the electrical connection is made between the conductive layers.
The conductive layer of one printed circuit board is preferably dielectric material. A dielectric material is a substance that is a poor conductor of electricity and is used as the insulating layer in the printed circuit board. Porcelain, glass, plastics and some metal oxides can be used. On one or on both sides of the conductive layer a thin conductive layer, like a copper layer, is arranged.
The multi-layer printed circuit board staple has two complementary functions. The first function is to affix electronic components in designated locations on the outer layers by means of soldering. Therefore, a solder mask can be arranged at the most outer layer. The second function is to provide electrical connections between the component's terminals in a controlled manner. Each of the conductive layers of the printed circuit boards is designed with an artwork pattern of conductors that provides electrical connections on that conductive layer. The conductive layers can further comprise vias that allow interconnections between adjacent printed circuit boards.
According to a preferred embodiment of the method, the needle terminal is introduced into the multi-layer printed circuit board staple perpendicular to the printed circuit boards of the multi-layer printed circuit board staple.
The needle terminal is not very thick, that is, it has a diameter of a few millimeters up to 1 centimeter. The terminal needle comprises an electrically conductive material, in particular consists of an electrically conductive material. Preferably, the material of the needle terminal is slightly harder than the material of the printed circuit boards, so that it can be inserted through the printed circuit boards into the stack to connect the conductive layers with each other and with the needle terminal.
According to a preferred embodiment of the method, the needle terminal perforates the at least two printed circuit boards during the introduction of the needle terminal through the at least two printed circuit boards and deforms the conductive layers of the at least two printed circuit boards to make the electrical connection between the at least two printed circuit boards and the needle terminal. That means, the needle terminal makes small holes in the several printed circuit boards and thereby deforms
in particular the conductive layers such that an electronic connection is established between the several conductive layers. Perforating involves a kind of puncturing the printed circuit boards with the needle terminal.
Further, according to a preferred embodiment of the method, the needle terminal is punched through the at least two printed circuit boards, in particular through all printed circuit boards of the multi-layer printed circuit board staple. The needle terminal is subjected to a certain pressure in order to be pushed through the printed circuit boards of the multi-layer printed circuit board staple.
According to a preferred embodiment of the method, the needle terminal is tapered to his end, which is introduced first through the printed circuit boards. The end of the needle terminal can be cone-shaped. The tapered end can comprise a material, which is harder than the rest of the body of the needle terminal. This enables an easy introduction of the needle terminal through the printed circuit boards. In one preferred embodiment, the needle terminal is hollow. This makes it even easier to insert the needle terminal through the printed circuit boards and to establish the electrical connection between the conductive layers of the several printed circuit boards.
Further, according to a preferred embodiment of the method, the needle terminal is introduced, in particular punched, through all printed circuit boards to electronically connect the conductive layers of all printed circuit boards with each other and with the needle terminal.
After being introduced, in particular being punched, through the printed circuit boards of the multi-layer printed circuit board staple the needle terminal can remain in the multi-layer printed circuit board staple to ensure the electrical connection between the conductive layers of the several printed circuit boards.
In accordance with another aspect of the invention, a multi-layer printed circuit board staple for an electronic control unit is provided. The multi-layer printed circuit board staple comprises several printed circuit boards. The several printed circuit boards of
the multi-layer printed circuit board staple are stacked-up above each other. Each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer. The several printed circuit boards having no holes. The conductive layers of at least two of the several printed circuit boards of the multilayer printed circuit board staple are electronically connected with each other by a needle terminal, which is introduced through the at least two printed circuit boards of the several printed circuit boards. Such a multi-layer printed circuit board staple enables in an easy, cost-effective and space-saving manner an electronic connection between at least two of the printed circuit boards, preferably all printed circuit boards of the multi-layer printed circuit board staple. Therefore, the inventive multi-layer printed circuit board staple brings up the same advantages that have been discussed in detail with respect to the inventive method according to the first aspect of the invention.
As described above, the multi-layer printed circuit board staple is built by several printed circuit boards. Several means at least two printed circuit boards, in particular three or more printed circuit boards. The printed circuit boards are stacked together in a row. Each printed circuit board comprises an insulating layer and at least on one side of the insulating layer a conductive layer, like a thin copper layer. The multi-layer printed circuit board staple always has an insulating layer followed by a conductive layer followed by an insulating layer, and so on. The inserted needle terminal connects the different conductive layer of the printed circuit boards electrically with each other. No board-to-board terminals are used. The multi-layer printed circuit board staple makes the “board-to-board connection” simpler having a needle terminal punched into the printed circuit boards of the multi-layer printed circuit board staple. In particular, the electronic connection is established in the printed circuit boards made without holes.
Preferred is a multi-layer printed circuit board staple, wherein the needle terminal is punched through the at least two printed circuit boards of the several printed circuit boards to make the electrical connection between the at least two printed circuit boards and the needle terminal. In particular, the needle terminal is introduced, in
particular punched, through all printed circuit boards to electrically connect the conductive layers of all printed circuit boards with each other and with the needle terminal. The needle terminal can be tapered to his end and/or the needle terminal can be hollow. That means the end of the needle terminal can be cone-shaped. The tapered end can comprise a material, which is harder than the rest of the body of the needle terminal. Such a design of the needle terminal makes it even easier to insert the needle terminal through the printed circuit boards and to establish the electrical connection between the conductive layers of the several printed circuit boards.
According to a preferred embodiment of the multi-layer printed circuit board staple, the conductive layers of the printed circuit boards are copper layers.
In accordance with another aspect of the invention, an electronic control unit is provided comprising a multi-layer printed circuit board staple according to the aspects described before. An electronic control unit comprising such a multi-layer printed circuit board staple enables a compact design of the electronic control unit, which can be a compact steering ECU for a motor vehicle.
In accordance with the last aspect of the invention, a motor vehicle, in particular an electric vehicle, is provided, comprising an electronic control unit according to aspect described before.
Therefore, the inventive electronic control unit and the motor vehicle bring up the same advantages that have been discussed in detail with respect to the inventive method and the inventive multi-layer printed circuit board staple according to the first two aspects of the invention.
Some advantages of the invention are:
No specific holes in the printed circuit boards are necessary. Simple design of needle terminal.
Terminals pitch can be very small.
Low insertion force due to needle terminal shape and thin conductive layers, in particular thin copper layers, thickness.
If needed, not all the conductive layers have to be connected to the needle terminal.
Electronic control units can be provided which are integrated and compact in dimension.
Further measures improving the inventive concept can be drawn from the following description of preferred embodiments, which are schematically shown in the drawings. The features and advantages, which can be drawn from the claims, from the description and from the drawings, might be considered essential alone or in combination with each other.
The present invention is discussed in more detail with respect to the accompanying drawings, in which
Fig. 1 shows a multi-layer printed circuit board staple before introduction of needle terminal,
Fig. 2 shows a first step of the method according to the invention, wherein the needle terminal approaches the multi-layer printed circuit board staple,
Fig. 3 shows a second step of the method according to the invention, wherein the needle terminal starts perforating the multi-layer printed circuit board staple,
Fig. 4 shows a multi-layer printed circuit board staple according to the invention, wherein the needle terminal completely perforated the printed circuit boards of the multi-layer printed circuit board staple and the electrical connection is fully made between the printed circuit boards and the needle terminal,
Fig. 5 shows an electronic control unit comprising a multi-layer printed circuit board staple according to the invention, and
Fig. 6 shows a motor vehicle with an electronic control unit according to the invention.
In the drawings, elements and features having the same function and operating principle are labeled with the same reference signs
Fig. 1 shows a multi-layer printed circuit board staple 1 before introduction of needle terminal 30. The multi-layer printed circuit board staple 1 comprises several printed circuit boards 10, which are are stacked-up above each other. Each printed circuit board 10 comprises an insulating layer 12 and at least on one side of the insulating layer 12 a conductive layer 14. The several printed circuit boards 10 having no holes. The conductive layer 14 can be cooper layer. In Fig. 1 an area 20 is shown, where the conductive layer 14 of the several printed circuit boards 10 of the multi-layer printed circuit board staple 1 need to be connected with each other. Within the insulating layers 12 of the printed circuit boards 10, conductors 50, like vias, can be arranged.
Fig. 2 shows a first step of the method according to the invention, wherein the needle terminal 30 approaches the multi-layer printed circuit board staple 1. The needle terminal 30 approaches the multi-layer printed circuit board staple 1 in the area 20 shown in Fig. 1 . The needle terminal 30 comprise a main body 32 and an end 34. The end 34 of the needle terminal 30 can be tapered. Further, the needle terminal 30 can be hollow. In Fig. 2 solder masks 40 are shown, which are placed at the outer sides of the multi-layer printed circuit board staple 1 . These solder masks 40 are used to place electronic components onto the conductive layers 14 of the outer printed circuit boards 10 of the multi-layer printed circuit board staple 1 .
Fig. 3 shows a second step of the method according to the invention, wherein the needle terminal 30 is introduced through the first printed circuit boards 10 of the multilayer printed circuit board staple 1 . The needle terminal 30 starts perforating the multi-
layer printed circuit board staple 1 , thereby deforming the printed circuit boards 10 to establish an electronic connection between the conductive layers 14 of the several printed circuit boards 10 of the multi-layer printed circuit board staple 1 .
Fig. 4 shows a multi-layer printed circuit board staple 1 according to the invention, wherein the needle terminal 30 completely perforated the printed circuit boards 10 of the multi-layer printed circuit board staple 1 and the electrical connection is fully made between the printed circuit boards 10 and the needle terminal 30.
Fig. 5 shows an electronic control unit 60 comprising a multi-layer printed circuit board staple 1 according to the invention. The needle terminal 30 is remained within the multi-layer printed circuit board staple 1 of the electronic control unit 60. The end 34 of the needle terminal 30 has been removed. Therefore, the needle terminal 30 can comprise a predetermined breaking point in the area of the transition between the end 34 and the main body 32 of the needle terminal 30.
Fig. 6 shows a motor vehicle 70 with an electronic control unit 60 according to the invention.
By introducing a needle terminal 30 through the printed circuit boards 10 of the multilayer printed circuit board staple 1 shown in Figs. 1 to 5 an electronic connection between the printed circuit boards 10 of the multi-layer printed circuit board staple 1 can be realized in an easy, cost-effective and space-saving manner. Using a needle terminal 30 allows a compact design of the multi-layer printed circuit board staple 1 without changing the outer dimensions of the multi-layer printed circuit board staple 1 . The arrangement of the several printed circuit boards 10 to each other can be done in an easy and fast way, because the printed circuit boards 10 do not need to be aligned with each other using holes. This invention makes the “board-to-board connection” simpler using a needle terminal 30 introduced into the multi-layer printed circuit board staple 1 . The printed circuit boards 10, that means, the insulating layers 12 and conductive layers 14, are deformed by the needle terminal 30 during insertion of the needle terminal 30 and the electrical connection is made between the conductive
layers 14 of the printed circuit boards 10 of the multi-layer printed circuit board staple 1.
Reference signs list
1 layer printed circuit board staple
10 printed circuit board
12 insulating layer
14 conductive layer
20 area for introducing a needle terminal
30 needle terminal
32 main body of needle terminal
34 end of needle terminal
40 solder masks
50 conductors
60 electronic control unit
70 motor vehicle
Claims
1 . Method for electronically connecting several printed circuit boards (10) of a multi-layer printed circuit board staple (1 ) for an electronic control unit (60), the printed circuit boards (10) of the multi-layer printed circuit board staple (1 ) are stacked-up above each other, each printed circuit board (10) comprises an insulating layer (12) and at least on one side of the insulating layer (12) a conductive layer (14), the printed circuit boards (10) having no holes, the method comprising followings steps:
- electronically connecting the conductive layers (14) of at least two printed circuit boards (10) of the several printed circuit boards (10) by introducing a needle terminal (30) through the at least two printed circuit boards (10) of the several printed circuit boards (10).
2. Method according to claim 1 , wherein the needle terminal (30) perforates the at least two printed circuit boards (10) during the introduction of the needle terminal (30) through the at least two printed circuit boards (10) and deforms the conductive layers (14) of the at least two printed circuit boards (10) to make the electrical connection between the at least two printed circuit boards (10) and the needle terminal (30).
3. Method according to any of the previous claims, wherein the needle terminal (30) is punched through the at least two printed circuit boards (10).
Method according to any of the previous claims, wherein the needle terminal (30) is tapered to his end (34), which is introduced first through the at least two printed circuit boards (10) of the several printed circuit boards (10). Method according to any of the previous claims, wherein the needle terminal (30) is hollow. Method according to any of the previous claims, wherein the needle terminal (30) is introduced, in particular punched, through all printed circuit boards (10) to electrically connect the conductive layers (14) of all printed circuit boards (10) with each other and with the needle terminal (30). Multi-layer printed circuit board staple (1 ) for an electronic control unit (60), the several printed circuit boards (10) of the multi-layer printed circuit board staple (1 ) are stacked-up above each other, each printed circuit board (10) comprises an insulating layer (12) and at least on one side of the insulating layer (12) a conductive layer (14), the several printed circuit boards (10) having no holes, wherein the conductive layers (14) of at least two of the several printed circuit boards (10) of the multi-layer printed circuit board staple (1 ) are electronically connected with each other by a needle terminal (30), which is introduced through the at least two printed circuit boards (10) of the several printed circuit boards (10). Multi-layer printed circuit board staple (1 ) according to claim 7, wherein the needle terminal (30) is punched through the at least two printed circuit boards (10) of the several printed circuit boards (10) to make the electrical connection between the at least two printed circuit boards (10) and the needle terminal (30).
Multi-layer printed circuit board staple (1 ) according to any of the previous claims 7 and 8, wherein the needle terminal (30) is tapered to his end (34) and/or wherein the needle terminal (30) is hollow. Multi-layer printed circuit board staple (1 ) according to any of the previous claims 7 to 9, wherein the needle terminal (30) is introduced, in particular punched, through all printed circuit boards (10) to electrically connect the conductive layers (14) of all printed circuit boards (10) with each other and with the needle terminal (30). Multi-layer printed circuit board staple according to any of the previous claims 7 to 10, wherein the conductive layers (14) of the printed circuit boards (10) are copper layers. Electronic control unit (60) comprising a multi-layer printed circuit board staple (1 ) according to any of the previous claims 7 to 11 . Electronic control unit (60) according to claim 12, wherein the electronic control unit (60) is a compact steering ECU for a motor vehicle (70). Motor vehicle (70), in particular electric vehicle, comprising an electronic control unit (60) according to claims 12 or 13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2022/063386 WO2023222210A1 (en) | 2022-05-18 | 2022-05-18 | Method for connecting printed circuit boards, multi-layer printed circuit board staple, electronic control unit and motor vehicle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2022/063386 WO2023222210A1 (en) | 2022-05-18 | 2022-05-18 | Method for connecting printed circuit boards, multi-layer printed circuit board staple, electronic control unit and motor vehicle |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023222210A1 true WO2023222210A1 (en) | 2023-11-23 |
Family
ID=82058434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2022/063386 WO2023222210A1 (en) | 2022-05-18 | 2022-05-18 | Method for connecting printed circuit boards, multi-layer printed circuit board staple, electronic control unit and motor vehicle |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2023222210A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196770A (en) * | 2000-01-12 | 2001-07-19 | Omron Corp | Control unit |
US20030099099A1 (en) * | 2001-11-27 | 2003-05-29 | Kenji Aoki | Printed wiring board having connecting terminals for electrically connecting conductor layers, circuit module having printed wiring board, and manufacturing method for printed wiring board |
-
2022
- 2022-05-18 WO PCT/EP2022/063386 patent/WO2023222210A1/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196770A (en) * | 2000-01-12 | 2001-07-19 | Omron Corp | Control unit |
US20030099099A1 (en) * | 2001-11-27 | 2003-05-29 | Kenji Aoki | Printed wiring board having connecting terminals for electrically connecting conductor layers, circuit module having printed wiring board, and manufacturing method for printed wiring board |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI245469B (en) | Connecting structure of printed wiring board | |
US6849074B2 (en) | Disposable surgical devices | |
US3932932A (en) | Method of making multilayer printed circuit board | |
US4815990A (en) | Flexible circuit having termination features and method of making the same | |
EP1915037A1 (en) | Bending-type rigid printed wiring board and process for producing the same | |
US20050256523A1 (en) | Disposable surgical devices | |
US6031728A (en) | Device and method for interconnection between two electronic devices | |
JP3822123B2 (en) | Multilayer printed wiring board | |
US7288722B2 (en) | Packaging structure and packaging method of electronic components | |
WO2023222210A1 (en) | Method for connecting printed circuit boards, multi-layer printed circuit board staple, electronic control unit and motor vehicle | |
JP2007087960A (en) | Connection part between flat cable and wiring circuit body and connection method of flat cable and wiring circuit body | |
EP1272019A4 (en) | Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof | |
US6291780B1 (en) | Method and device for connecting FPCs | |
CN113811075A (en) | Circuit board with multilayer structure and manufacturing method thereof | |
JPH0677623A (en) | Electronic circuit device and manufacture thereof | |
JP2006222057A (en) | Connection structure of flexible flat electric structure body | |
JPH07283500A (en) | Electric connection structure in circuit board | |
JP2004063956A (en) | Printed board and manufacturing method thereof | |
JPH03252192A (en) | Hybrid integrated circuit component and assembly thereof | |
US6739881B2 (en) | High integration electronic assembly and method | |
JP3202836B2 (en) | Manufacturing method of multilayer printed wiring board | |
CN112888199A (en) | Method for forming pin jack of multilayer PCB | |
CN112888163A (en) | Circuit board and manufacturing method thereof | |
DE10234222A1 (en) | Electrical contact element for connecting conductor path structures of circuit board and circuit foil, has pressure region with lateral pressure tongues holding conductor path structures in contact | |
JP2014232785A (en) | Printed wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22730388 Country of ref document: EP Kind code of ref document: A1 |