WO2023218923A1

WO2023218923A1 - Electronic device

Info

Publication number: WO2023218923A1
Application number: PCT/JP2023/016069
Authority: WO
Inventors: 泰裕景山; 晋平山口
Original assignee: ソニーグループ株式会社
Priority date: 2022-05-10
Filing date: 2023-04-24
Publication date: 2023-11-16

Abstract

The present disclosure relates to electronic equipment configured such that a component can be more appropriately disposed. Provided is electronic equipment comprising a main substrate that is disposed in a second space within a housing, the second space being toward a different side of the housing from a first space toward where a battery part is disposed, a first antenna unit that is for performing communication using millimeter waves, and a vibration unit that vibrates the housing, wherein: the first antenna unit is disposed in a linear manner in a first direction on the same plane as the main substrate in the second space; and the first antenna unit, the vibration unit, and other components other than the first antenna unit and the vibration unit are disposed in the second space so as to be lined up in a second direction, which is perpendicular to the first direction. The present disclosure can be applied to, for example, the internal structure of a smartphone.

Description

Electronics

The present disclosure relates to an electronic device, and particularly to an electronic device that allows components to be more appropriately arranged.

In recent years, various studies have been conducted regarding the 5th Generation Mobile Communication System (5G). For example, in this mobile communication system, communication using radio signals at frequencies called millimeter waves (hereinafter also simply referred to as "millimeter waves") such as 28 GHz and 39 GHz can be used (see, for example, Patent Document 1).

While millimeter waves can increase the amount of information transmitted compared to ultra-high frequency waves, they have high straightness and have a narrow angular range in which communication can be performed. Therefore, electronic devices that perform communication using millimeter waves may support multiple directions by being equipped with a plurality of millimeter wave antenna modules.

Special Publication No. 2020-519082

It is necessary to place a large number of components, including multiple millimeter-wave antenna modules, inside the housing of an electronic device that communicates using millimeter waves, but since the space available for placement is limited, it is necessary to place the components appropriately. is required to be placed.

The present disclosure has been made in view of this situation, and is intended to enable components to be more appropriately arranged.

An electronic device according to one aspect of the present disclosure communicates using millimeter waves with a main board disposed in a second space that is a space on a side different from a first space on a side where a battery section is disposed in a housing. a first antenna section for vibrating the housing; and a vibration section for vibrating the housing, the first antenna section being arranged in a straight line in a first direction on the same plane as the main board in the second space. In the second space, the first antenna section, the vibrating section, and other components other than the first antenna section and the vibrating section are arranged in the first direction. These electronic devices are arranged side by side in a second orthogonal direction.

In the electronic device according to one aspect of the present disclosure, a main board disposed in a second space that is a space on a side different from the first space on the side where the battery section is disposed in the housing, and a communication device using millimeter waves. A first antenna section for performing this and a vibration section for vibrating the housing are provided. The first antenna section is arranged linearly in a first direction on the same plane as the main board in the second space, and the first antenna section and The vibrating section, the first antenna section, and other components other than the vibrating section are arranged side by side in a second direction orthogonal to the first direction.

1 is a diagram illustrating an example of an internal configuration of an embodiment of an electronic device to which the present disclosure is applied. FIG. 2 is a diagram showing a detailed arrangement example of an upper space of the internal configuration of the electronic device shown in FIG. 1; FIG. 3 is a diagram showing an example of a cross-sectional configuration around the vibrating section in FIG. 2; 3 is a diagram showing an example of a cross-sectional configuration of the audio jack of FIG. 2. FIG. FIG. 6 is a diagram illustrating positioning in the XY directions in the upper space. FIG. 6 is a diagram illustrating positioning in the Z direction in the upper space. It is a figure explaining the details of the positioning of a vibrating part in the XY direction. FIG. 6 is a diagram illustrating details of positioning of the vibrating unit and the front camera in the Z direction. It is a figure which shows the example of arrangement|positioning of the heat dissipation sheet in upper space. 3 is a diagram showing an example of a cross-sectional configuration in the X direction including the rear camera and millimeter wave antenna section of FIG. 2. FIG.

<Internal configuration of the device>
FIG. 1 is a diagram illustrating an example of the internal configuration of an embodiment of an electronic device to which the present disclosure is applied.

In FIG. 1, the electronic device 10 is an electronic device such as a smartphone. Of the external surfaces that make up the electronic device 10, the surface on which the display is installed is referred to as the "front", and the surface opposite to the front is referred to as the "rear".When parts on the rear side such as the frame rear are removed, the rear side is referred to as the "front". Figure 1 shows the internal structure of the housing as seen from the front.

As shown in FIG. 1, a main board 101 that is electrically connected to each part and a battery part 102 that supplies power to each part are arranged inside the casing of the electronic device 10. Of the external surfaces that make up the electronic device 10, when the surface on the upper end side with respect to the front and rear surfaces is referred to as the "upper surface" and the surface on the lower end side as the "lower surface", the space on the upper surface side within the housing (hereinafter also referred to as upper space) is referred to as the "upper surface". The main board 101 is arranged in a space below the upper space within the housing (hereinafter also referred to as a lower space). In other words, the upper space can be said to be a space on the upper body side of the electronic device 10, and the lower space can be said to be a space on the lower body side of the electronic device 10.

Various parts such as rear cameras 111 to 113, ranging sensor 114, millimeter

wave antenna parts

121R and 121S, vibration part 122, front camera 123, top speaker 124, and audio jack 125 are arranged in the upper space inside the housing. , are connected to the main board 101.

The rear cameras 111 to 113 are cameras provided on the back of the electronic device 10. The rear cameras 111 to 113 capture still images and videos. For example, the rear camera 111 is configured with an ultra-wide-angle camera, the rear camera 112 is configured with a wide-angle camera, and the rear camera 113 is configured with a telephoto camera. The distance sensor 114 is a sensor provided on the back of the electronic device 10. For example, the ranging sensor 114 is configured with a ToF (Time of Flight) sensor.

The millimeter wave antenna section 121R and the millimeter wave antenna section 121S are each configured with a millimeter wave module (millimeter wave antenna module) including an antenna for communicating using millimeter waves (MMW). The millimeter wave antenna section 121R is provided on the back surface of the electronic device 10. Among the external surfaces that constitute the electronic device 10, when the side surface with respect to the front and back surfaces is referred to as the "side surface," the millimeter wave antenna section 121S is located on the side surface of the electronic device 10 (the left side surface when the back surface is the reference surface). provided. The electronic device 10 is provided with a plurality of millimeter wave antennas arranged linearly in a predetermined direction, thereby increasing the reception sensitivity of communication using millimeter waves.

The vibration unit 122 vibrates (the housing of) the electronic device 10. The vibrating section 122 is composed of a linear resonant actuator (LRA). By causing the vibration unit 122 to vibrate the housing, it is possible to notify the user of incoming calls, notifications, and the like.

The front camera 123 is a camera provided on the front of the electronic device 10. The front camera 123 allows the user using the electronic device 10 to take a picture of himself/herself.

The top speaker 124 is a speaker provided on the top side of the electronic device 10. The top speaker 124 outputs sounds when playing content such as music and videos, a ringtone, the voice of the other party during a call, and the like.

The audio jack 125 is a jack into which a plug at the end of a cable connected to earphones or headphones is inserted. The earphones or the like output the sound of content such as music or videos played by the electronic device 10 via a cable.

Various parts such as the connector 126 are arranged in the lower space within the housing. At the connector 126, an external card such as a SIM (Subscriber Identity Module) card or a memory card is attached to a card tray and connected. One or more types of external cards can be connected to the connector 126. Thereby, the electronic device 10 can read data from the external card and write data to the external card.

In the electronic device 10, by arranging the connector 126 in the lower space within the housing, the vibrating section 122 can be arranged in the upper space. That is, when adopting a configuration in which the connector 126 is mounted on the main board 101 and placed in the upper space within the housing of the electronic device 10 as an internal configuration different from the internal configuration shown in FIG. A configuration in which the vibrating section 122 is arranged in the lower space instead of the upper space is assumed. On the other hand, in the internal configuration shown in FIG. 1, in order to maximize the mounting area of the main board 101, the connector 126 is moved to the lower space and the shape of the vibrating part 122 is appropriately shaped. The portion 122 can be placed in the upper space.

<Parts arrangement in the upper space>
FIG. 2 is a diagram showing a detailed example of the arrangement of the upper space of the internal configuration of the electronic device 10 of FIG. 1.

As shown in FIG. 2, in the upper space, the millimeter wave antenna section 121R, the vibration section 122, the front camera 123, the top speaker 124, and the audio jack 125 are arranged together at predetermined intervals. densely arranged.

Here, by arranging the vibrating section 122 and the front camera 123 side by side in the Y direction (vertical direction in the figure), the vibrating section 122, the front camera 123, the top speaker 124, and the audio jack 125 can be arranged in the Y direction. The sizes of the parts are approximately the same, and the arrangement of the five parts mentioned above is realized. The five components mentioned above are the millimeter wave antenna section 121R, the vibration section 122, the front camera 123, the top speaker 124, and the audio jack 125.

When the vibrating unit 122 and the front camera 123 are arranged side by side in the Y direction, a flexible printed circuit (FPC) 131 of the front camera 123 passes through the top surface of the vibrating unit 122 and is connected to the main board 101. . The flexible substrate 131 has a substantially L-shape (inverted L-shape) extending from the Y direction to the X direction, and is connected to the main substrate 101 near the vibrating section 122 (on the left side in the figure).

By making the flexible substrate 131 substantially L-shaped and connecting it near the vibrating section 122, components can be arranged closely. In particular, the vibrating section 122 can be placed close to the front camera 123. In order to bring the distance between the vibrating section 122 and the front camera 123 as close as possible, it is desirable to increase the angle at which the front camera 123 is installed.

Furthermore, when arranging the millimeter wave antenna section 121R, by making the shape of the flexible substrate 131 substantially L-shaped, the position of the millimeter wave antenna section 121R can be brought as close as possible to the vibrating section 122. Note that when the flexible substrate 131 passes through the top surface of the millimeter wave antenna section 121R, the performance of communication using millimeter waves is affected. Therefore, the shape of the flexible substrate 131 is such that it avoids the millimeter wave antenna section 121R.

Note that when adopting a configuration in which the vibrating section 122 is arranged in the lower space instead of the upper space as an internal configuration different from the internal configuration shown in FIG. 1, the flexible substrate 131 of the front camera 123 is straight and A configuration in which it is connected to the main board 101 via the shortest distance is assumed. However, if this connection configuration is also adopted in the case of a configuration in which the vibrating section 122 is arranged in the upper space, it is not possible to realize a layout in which each component is crowded together as shown in FIG. 2.

FIG. 3 is a diagram showing an example of a cross-sectional configuration around the vibrating section 122 shown in FIG. 2. As shown in FIG. 3, the main housing 151, the main board 101, and the frame rear 152 are stacked and fixed with screws 161. The main board 101, the main casing 151, and the frame rear 152 each have a predetermined shape, and by stacking them, a space is formed within the casing, and the vibrating section 122 is fixed in the space. Frame rear 152 is configured as a part of the housing.

A flexible board 131 of the front camera 123 passes through the top surface of the vibrating unit 122, and a buffer member 153 and a buffer member 154 are provided so as to sandwich a portion of the approximately L-shaped flexible board 131. The buffer member 153 is made of a cushioning material attached to the vibrating section 122 or the like. The buffer member 154 is made of a cushioning material attached to the frame rear 152.

By sandwiching the flexible substrate 131 in the Z direction between the

buffer members

153 and 154, the flexible substrate 131 can be vibrated in a configuration in which the vibration unit 122 and the front camera 123 are arranged side by side in the Y direction as shown in FIG. Even when passing through the top surface of the vibrating portion 122, the vibration by the vibrating portion 122 can be effectively transmitted.

FIG. 4 is a diagram showing an example of the cross-sectional configuration of the audio jack 125 shown in FIG. 2. As shown in FIG. 4, the flexible board 132 of the audio jack 125 is connected to the front side of the main board 101.

By connecting the flexible board 132 of the audio jack 125 to the front side, which is the surface where the display 103 is provided, instead of to the back side of the main board 101, the space in which components can be placed on the back side of the main board 101 can be increased. Can be done. As a result, a space for arranging the millimeter-wave antenna section 121R is secured on the back side of the main board 101, and the millimeter-wave antenna section 121R is crowded together with the vibration section 122, front camera 123, top speaker 124, and audio jack 125. It can be placed as follows.

Note that when adopting a configuration in which the flexible board 132 of the audio jack 125 is connected to the back side of the main board 101 as an internal configuration different from that shown in FIG. Sufficient space for arranging the millimeter wave antenna section 121R cannot be secured near the jack 125, and components including the millimeter wave antenna section 121R cannot be arranged closely.

<Positioning method>
When arranging the vibrating unit 122 and the front camera 123 side by side in the Y direction in the upper space of the housing, the arrangement positions in the X direction and Y direction as shown in FIG. 5 and the arrangement position in the Z direction as shown in FIG. is determined, for example, as follows.

That is, as shown in FIG. 5, in the X direction, from the right side with the back surface as the reference plane, there is the outer part of the main board 101, the audio jack 125, and then the vibrating part 122 and the front side lined up in the Y direction. The position is determined so that the camera 123 is placed. The position of the front camera 123 in the Y direction is determined depending on the space in which the front camera 123 is installed. Here, as shown in FIG. 7, the outer peripheral portion and the terminal portion of the vibrating portion 122 are held and fixed by the protrusions 151a to 151e of the main housing 151.

Furthermore, as shown in FIG. 8, in the Z direction, the vibrating section 122 is attached to the main housing 151 with an adhesive tape 155, and then suppressed by the frame rear 152. As described above, the flexible substrate 131 of the front camera 123 passes through the top surface of the vibrating section 122, and the structure is such that the flexible substrate 131 of the front camera 123 is buffered and suppressed in the Z direction by the

buffer members

153 and 154. Note that the buffer member 154 is attached to the frame rear 152 with an adhesive tape 156. The front camera 123 is fixed to the frame rear 152 via a buffer member 157 such as a gasket.

<Arrangement of heat dissipation members>
As shown in FIGS. 1 and 2, in the electronic device 10, the rear cameras 111 to 113 and the distance measurement sensor 114 are arranged in the Y direction on the back side in the upper space of the housing, and the distance measurement sensor 114 is arranged on the left side in the Y direction. It has a configuration in which a millimeter wave antenna section 121S provided in a straight line is arranged adjacent to each other. These components (modules) generate a large amount of heat and are laid out with large heat sources adjacent to each other, so it is necessary to optimize the heat dissipation structure.

In the electronic device 10, by providing a heat dissipation sheet having a substantially L-shape as a heat dissipation member that transfers the heat of the rear cameras 111 to 113, the ranging sensor 114, and the millimeter wave antenna section 121S to the heat dissipation component, A more appropriate heat dissipation structure has been realized.

FIG. 9 is a diagram showing an example of the arrangement of heat dissipation sheets in the upper space of the internal configuration of the electronic device 10. FIG. 9 shows the internal configuration of the electronic device 10, with parts such as the main board 101, rear cameras 111 to 113, ranging sensor 114, and millimeter wave antenna section 121S removed, and the position where the heat dissipation sheet 181 is placed. ing. As shown by the dotted area in the figure, one heat dissipation sheet 181 is arranged in a substantially L-shape from the left side surface to the bottom surface within the housing. The bottom surface here is a surface on which components such as the main board 101, rear cameras 111 to 113, and distance measurement sensor 114 are arranged.

FIG. 10 is a diagram showing an example of a cross-sectional configuration in the X direction including the rear camera 112 and the millimeter wave antenna section 121S shown in FIGS. 1 and 2. As shown in FIG. 10, a heat dissipation sheet 181 having a substantially L-shape is arranged for the rear camera 112 provided on the back side and the millimeter wave antenna section 121S provided on the left side. The heat dissipation structure is completed by one heat dissipation sheet 181 by serving not only the heat dissipation structure of the rear camera 112 but also the heat dissipation structure of the adjacent rear camera 112.

The cross-sectional configuration example in FIG. 10 shows a cross-sectional configuration example of the rear camera 112 and the millimeter wave antenna section 121S, but as shown in FIG. and distance measuring sensor 114. That is, one heat dissipation sheet 181 serves not only as a heat dissipation structure for the millimeter wave antenna section 121S but also for the rear camera 111, the rear camera 112, and the distance measurement sensor 114. Note that in the configurations shown in FIGS. 9 and 10, the rear camera 113 adopts a heat dissipation structure different from the heat dissipation structure using the heat dissipation sheet 181 due to its structure. , depending on the structure of other cameras, it may be included in the heat dissipation structure using the heat dissipation sheet 181.

Note that when adopting a configuration in which the millimeter wave antenna section 121S is arranged on the side surface of the lower space instead of the side surface of the upper space as an internal configuration different from the internal configuration shown in FIG. On the other hand, since the millimeter wave antenna section 121S is arranged adjacent to each other, the degree of freedom in the size and arrangement of the battery section 102 is limited. On the other hand, as shown in FIG. 1, FIG. 2, FIG. 9, and FIG. At the same time, since efficient heat countermeasures are taken by the single heat dissipation sheet 181, the degree of freedom in the size and arrangement of the battery section 102 can be increased in the lower space. In particular, the capacity of the battery section 102 can be increased by increasing its size.

As described above, the electronic device 10 communicates using millimeter waves with the main board 101 located in the upper space, which is a space on a side different from the lower space on the side where the battery section 102 is arranged in the housing. A millimeter wave antenna section 121R is provided, a vibration section 122 for vibrating the housing, and a front camera 123 on the front side are provided. The millimeter wave antenna section 121R, the vibration section 122, and the front camera 123 are arranged in a line in the Y direction in the upper space. Furthermore, in the upper space, the millimeter wave antenna section 121R, the vibration section 122, the front camera 123, the top speaker 124, and the audio jack 125 are arranged together at predetermined intervals.

That is, in the electronic device 10, in order to maximize the mounting area of the main board 101, the position of the connector 126 is moved from the main board 101 in the upper space to the lower space, and the millimeter wave antenna section 121R and The vibrating section 122, the front camera 123, the top speaker 124, and the audio jack 125 are arranged efficiently in the upper space. In particular, the electronic device 10 adopts a layout in which the vibrating section 122 and the front camera 123 are arranged side by side in the Y direction (vertical direction), which contributes to improving the efficiency of the layout. In this way, in the electronic device 10, components can be arranged more appropriately.

<Modified example>
In the above description, in the electronic device 10, the millimeter wave antenna section 121R, the vibration section 122, and the front camera 123 are arranged side by side in the Y direction in the upper space of the housing. Other parts may be placed instead. That is, in the upper space, the millimeter wave antenna section 121R, the vibrating section 122, and other components are arranged side by side in the Y direction. The other components include top speaker 124 or audio jack 125. Here, the Y direction is a direction perpendicular to the X direction, where the direction in which the millimeter wave antenna section 121R is linearly arranged is the X direction.

Since the rear cameras 111 to 113 include image sensors, they can also be said to be sensor units. That is, each of the rear cameras 111 to 113 and the ranging sensor 114 is an example of a sensor section, and in the electronic device 10, one or more sensor sections can be provided on the back side. When a plurality of sensor sections are arranged in the upper space within the housing, the heat dissipation sheet 181 is arranged for at least some of the sensor sections together with the millimeter wave antenna section 121S on the left side.

Although the vibrating section 122 has been described as being composed of a linear resonant actuator (LRA), other methods such as an eccentric motor (ERM) or a method using a piezo element may be adopted. do not have.

The electronic device 10 is not limited to a smartphone, but may be a small portable device such as a tablet terminal, a mobile phone, a wearable device, or a notebook PC. Furthermore, the electronic device 10 may be an independent device or an internal block constituting one device.

As used herein, "connection" means electrical connection. In addition, "component" refers to a module (module component) that combines several parts into one according to function and location, so "component" described in this specification may be read as "module". I don't mind.

Note that the embodiments of the present disclosure are not limited to the embodiments described above, and various changes can be made without departing from the gist of the present disclosure. For example, the "configuration in which five components are placed together" explained under the heading "Component arrangement in the upper space" and the "structure in which one heat dissipation sheet is arranged in an L-shape" explained under the heading "Arrangement of heat dissipation members" The term "configuration arranged in the shape of a mold" can of course be implemented by combining these configurations as described above, and it is also possible to implement each configuration independently. Moreover, the effects described in this specification are merely examples and are not limited, and other effects may also be present.

Furthermore, the present disclosure can have the following configuration.

(1)
a main board disposed in a second space that is a space on a side different from the first space on the side where the battery section is disposed within the casing;
a first antenna section for communicating using millimeter waves;
a vibrating section that vibrates the housing;
The first antenna section is arranged linearly in a first direction on the same plane as the main board in the second space,
In the second space, the first antenna section, the vibrating section, and other parts excluding the first antenna section and the vibrating section are arranged in a second direction perpendicular to the first direction. Electronic devices arranged side by side.
(2)
It also has a front camera, speakers, and audio jack.
In the second space, on the first surface side of the main board, the first antenna section, the vibration section, the front camera, the speaker, and the audio jack are arranged at predetermined intervals. The electronic device according to (1) above, which is arranged as follows.
(3)
The other component is the front camera,
The electronic device according to (2), wherein the first antenna section, the vibration section, and the front camera are arranged in this order in the second direction, which is the direction away from the battery section.
(4)
The electronic device according to (3), wherein the flexible board of the front camera passes through the top surface of the vibrating section and is connected to the main board.
(5)
The flexible board has a substantially L-shape extending from the second direction to the first direction on the same plane as the main board, and is connected to the main board near the vibrating section. ) Electronic devices listed in ).
(6)
The flexible substrate is sandwiched between buffer members on the top surface of the vibrating section in a third direction of an axis perpendicular to a plane including the axis in the first direction and the axis in the second direction. 4) or the electronic device described in (5).
(7)
The electronic device according to (2) or (3), wherein the audio jack is connected to a second surface of the main board, which is a surface opposite to the first surface.
(8)
Equipped with an additional display,
The first surface is a surface on the back side,
The electronic device according to (7), wherein the second surface is a front surface on which the display is provided.
(9)
a second antenna section for communicating using millimeter waves;
further comprising one or more sensor sections,
The second antenna section is arranged on a side surface of the housing in the second space,
The sensor section is arranged on a third surface of the second space that is a surface on a side where the main board is arranged,
The electronic device according to (1), further comprising a heat dissipation member that transfers heat from the second antenna section and the sensor section.
(10)
The electronic device according to (9), wherein the heat radiating member is a single heat radiating sheet having a substantially L-shape, and is arranged from a side surface of the housing to the third surface.
(11)
The electronic device according to (10), wherein the heat dissipation sheet is arranged for at least some of the sensor parts when a plurality of the sensor parts are arranged.
(12)
The electronic device according to any one of (9) to (11), wherein the sensor section is a rear camera or a distance measurement sensor.
(13)
The second space is a space on the upper end side of the housing,
The electronic device according to (1), wherein the first space is a space closer to the lower end of the housing than the second space.
(14)
further comprising a connector to which one or more types of external cards are connected,
The electronic device according to (13), wherein the connector is arranged on the first space side.

10 Electronic equipment, 101 Main board, 102 Battery unit, 103 Display, 111 to 113 Rear camera, 114 Distance sensor, 121R, 121S Millimeter wave antenna unit, 122 Vibration unit, 123 Front camera, 124 Top speaker, 125 Audio jack, 126 Connector, 131, 132 Flexible board, 151 Main housing, 152 Frame rear, 153, 154, 157 Buffer member, 155, 156 Adhesive tape, 161 Screw, 181 Heat dissipation sheet

Claims

a main board disposed in a second space that is a space on a side different from the first space on the side where the battery section is disposed within the casing;
a first antenna section for communicating using millimeter waves;
a vibrating section that vibrates the housing;
The first antenna section is arranged linearly in a first direction on the same plane as the main board in the second space,
In the second space, the first antenna section, the vibrating section, and other parts excluding the first antenna section and the vibrating section are arranged in a second direction perpendicular to the first direction. Electronic devices arranged side by side.
It also has a front camera, speakers, and audio jack.
In the second space, on the first surface side of the main board, the first antenna section, the vibration section, the front camera, the speaker, and the audio jack are arranged at predetermined intervals. The electronic device according to claim 1, wherein the electronic device is arranged as follows.
The other component is the front camera,
The electronic device according to claim 2, wherein the first antenna section, the vibration section, and the front camera are arranged in this order in the second direction, which is a direction away from the battery section.
The electronic device according to claim 3, wherein the flexible board of the front camera passes through the top surface of the vibrating section and is connected to the main board.
The flexible board has a substantially L-shape extending from the second direction to the first direction on the same plane as the main board, and is connected to the main board near the vibrating section. Electronic devices listed in .
The flexible substrate is sandwiched between buffer members on the top surface of the vibrating section in a third direction of an axis perpendicular to a plane including the axis in the first direction and the axis in the second direction. 4. The electronic device according to 4.
The electronic device according to claim 3, wherein the audio jack is connected to a second surface of the main board, which is a surface opposite to the first surface.
Equipped with an additional display,
The first surface is a surface on the back side,
The electronic device according to claim 7, wherein the second surface is a front surface on which the display is provided.
a second antenna section for communicating using millimeter waves;
further comprising one or more sensor sections,
The second antenna section is arranged on a side surface of the housing in the second space,
The sensor section is arranged on a third surface of the second space that is a surface on a side where the main board is arranged,
The electronic device according to claim 1, further comprising a heat dissipation member that transfers heat from the second antenna section and the sensor section.
The electronic device according to claim 9, wherein the heat dissipation member is a single heat dissipation sheet having a substantially L-shape, and is arranged from a side surface of the casing to the third surface.
The electronic device according to claim 10, wherein the heat dissipation sheet is arranged for at least some of the sensor sections when a plurality of the sensor sections are arranged.
The electronic device according to claim 11, wherein the sensor section is a rear camera or a distance measurement sensor.
The second space is a space on the upper end side of the housing,
The electronic device according to claim 1, wherein the first space is a space closer to a lower end within the housing than the second space.
further comprising a connector to which one or more types of external cards are connected,
The electronic device according to claim 13, wherein the connector is arranged on the first space side.