WO2023218131A1 - Building board system - Google Patents

Building board system Download PDF

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Publication number
WO2023218131A1
WO2023218131A1 PCT/FI2023/050261 FI2023050261W WO2023218131A1 WO 2023218131 A1 WO2023218131 A1 WO 2023218131A1 FI 2023050261 W FI2023050261 W FI 2023050261W WO 2023218131 A1 WO2023218131 A1 WO 2023218131A1
Authority
WO
WIPO (PCT)
Prior art keywords
build
board
build board
exemplary embodiments
boards
Prior art date
Application number
PCT/FI2023/050261
Other languages
French (fr)
Inventor
Teppei MORIMOTO
Original Assignee
T. Morimoto Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by T. Morimoto Oy filed Critical T. Morimoto Oy
Publication of WO2023218131A1 publication Critical patent/WO2023218131A1/en

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Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04CSTRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/44Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose
    • E04C2/52Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04CSTRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/02Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
    • E04C2/26Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
    • E04C2/284Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating
    • E04C2/292Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating composed of insulating material and sheet metal

Definitions

  • the invention relates to a Build board arrangement for implementing, for example, furniture and/or parts of buildings and/or vehicles and/or ships and/or other products or structures.
  • the furniture may be furniture used in offices, apartments, hospitals, schools, production lines, assembly lines, and/or restaurants, and/or short-term furniture implementations, for example, at trade fair.
  • Said parts of the buildings may be, for example, walls, ceilings, and/or floors.
  • Build board arrangements include boards made of, for example, gypsum, plywood, particle board and/or wood, which may be coated with, for example, various laminate, vinyl, metal, paper, paperboard or spray coatings. Said combinations of construction material and coating material are installed to provide the desired structure.
  • electrical devices and furniture are installed at the desired location in the furniture or objects in the operating environment with traditional screw connections, as a surface-mounted or flush-mounted housings. Cable installations complicate convertibility, i.e. design freedom that adds value in electrical design.
  • the state-of-the-art space elements are similar in structure to a conventional partition wall consisting of, for example, a frame made of wood or sheet metal, on the surface of which said panels are fixedly mounted and the space between the frames is filled with, for example, insulation wool or other insulating material.
  • Disadvantages of said structure are, for example, the sound bridges caused by the solid and hard frame material between the surface boards.
  • Another disadvantage is the lack of weak coupling, which means a flexible coupling between said materials and/or a structure, wherein the sound-conducting materials are not in direct contact between the outer surfaces and which prevents sound from conducting along hard surfaces.
  • One of the essential causes of a cold bridge is, for example, metal frames that conduct heat well.
  • Prior art technology does not know the perforation pattern advantageously arranged in the build board. If the conductor boards are holeless or nearly holeless boards, it can cause the following unfavorable characteristics: 1 ) an increase in the total mass of the overall structure, which, among other things, complicates the installation work and increases the manufacturing costs of the build board, 2) an increase in the capacitance values between the conductor boards, 3) complicates the work of attaching the build boards to the frame structure, because openings must be processed to the conductor boards, for example by drilling or already in the manufacturing process, so that the fastening means of the build boards do not hit the conductor boards and thus cause electrical contact with said fastening means, and the openings created in the conductor boards, for example by drilling, increase manufacturing and installation costs, among other things.
  • Prior art technology does not know a method for installing and/or attaching the boards of a build board arrangement to a frame made of metal thin board, which can be arranged, for example, on a wall, ceiling or floor.
  • the problem can be, for example, electricity-conducting screws or other fastening devices hitting the said electricity-conducting frame structure, in which case electricity can be unintentionally conducted into the frame structure. If, for example, two screws or other electrically conductive fastening means attached to different conductor boards hit the same electrically conductive frame structure, the result is, for example, a short circuit or other undesirable connection of two different conductors.
  • Prior art technology does not know a method for connecting the power supply cable to the structure board arrangement from any direction relative to the structure board.
  • the problem with the mentioned method is that connecting it is challenging, if the aesthetics are to be preserved in such a way that, for example, there is no junction box or other technically equivalent solution left on the visible surfaces.
  • the power supply cable is brought to the inside or surface of a desired wall or ceiling, for example, from where it is connected to a socket or other desired location or device.
  • connection components of build boards with a grounding board does not know a method for protecting the connection components of build boards with a grounding board. If the connecting component is installed at the junction of two build boards behind, for example, a skirting board or a ceiling board, and the mentioned are, for example, wood that can be pierced with, for example, a nail or a screw, hitting the wiring part of the connecting component causes electricity to be conducted to the said nail or screw, which can result in an electric shock to a person or animal.
  • Publication FI20145752 describes a system consisting of modular furniture elements that can be modified and has an integrated electrical network.
  • Said publication focuses on molded furniture parts, which are laborious and complicated to manufacture. In the case of electrically conductive structures, said publication focuses on structures other than sheet metal, which limit the possibility of free connection of electrical devices to different surfaces of the structure.
  • Said publication does not address the need for an electrified build board to operate independently without other build boards attached thereto.
  • Said publication does not take a position on a layered structure, which is a preferred embodiment for furniture and build board. This publication does not take a position and does not focus on solving the problem of technical challenges relevant to sound insulation and thermal insulation, for example.
  • Said publication does not take a position on the installation/attaching of a build board to an external structure which is not part of it, which is, for example, a wooden frame structure.
  • Publication FI20165157 describes the connection of electrical device and furniture to the surface of a modular furniture part with electrically conductive attaching means, but does not focus and solve any technical installation problems with which the electrical coupling and mechanical connection between the build boards can be implemented in an electrically safe and installation- friendly manner, for example in the case where the attaching and connection components cannot be installed inside the build board during installation.
  • Publication FI201665157 does not take a position on connecting an electrical device to the conductor layer.
  • FI201665157 considers only connection to the modular furniture part.
  • FI201665157 does not take a position on the order and electrical safety of the conductor plates and does not focus on solving electrical safety challenges.
  • the object of the invention is a new type of build board arrangement.
  • the build board arrangement is a layered board structure in which at least three conductor layers and insulating material layers are arranged between them, and the conductor layers comprise mutually identical perforations that reduce the capacitance between the conductor layers
  • the build board arrangement according to the invention can be used, for example, for the implementation of furniture and/or parts of buildings.
  • Said furniture may be, for example, furniture used in offices, apartments, hospitals, schools, production lines, assembly lines, and/or restaurants, and/or short-term furniture implementations, for example at trade fairs, or modifiable interior designs.
  • Said parts of the buildings may be, for example, furniture, walls, ceilings, and/or floors.
  • the advantage of the build board arrangement according to the invention is that due to its layered structure the electrical device can be freely installed in said system in places defined by its surface area.
  • the advantage of the Build board arrangement according to the invention is that the electrical device can be electrically safely connected to said system due to the arrangement of the conductor layers according to the invention.
  • Another advantage is that conventional objects, such as paintings, mounted on the surface of the Build board arrangement are attached, for example, with screws or nails, whereby said installation procedure according to the invention does not pose a risk of electric shock to its users.
  • Another advantage is that the manufacturing and installation costs of a Build board arrangement can be lower than in the case where the build boards and/or elements are manufactured by traditional methods, when the cost comparison takes into account the electrical installation work as well as the accessories.
  • Another advantage is that fixed cable installations can be eliminated, for example, from installations of convertible furniture and/or various structures, which makes it possible to implement a flexible operating model without disturbing fixed cable installations.
  • a conventional plate wall with, for example, a frame, insulation, surface boards and fixed cable installations can be replaced by a space element system according to the invention.
  • a conventional build board, such as gypsum board can be replaced by a build board arrangement according to the invention.
  • the build board arrangement and the space element system can be implemented according to the requirements of the structures, which are, for example, sound insulation, fire insulation, moisture insulation and the transmission of wireless data transmission.
  • the build board arrangement according to the invention reduces the increase of the capacitance value between the conductor boards.
  • Figure 1 is an exemplary embodiment of the invention showing a Build board arrangement
  • Figure 2 is an exemplary embodiment of the invention showing a Build board arrangement with insulation materials removed from the build board
  • Figure 3 is an exemplary embodiment of the invention, wherein the build board is cut at the attachment insulation means, and further shows an exemplary embodiment of the attachment insulation means
  • Fig. 4 is an exemplary embodiment of the invention, wherein the conductor layer is partially cut and the internal structure of the build board is illustrated,
  • Figure 5 is an exemplary embodiment of the invention, wherein an element structure obtained from build boards is illustrated,
  • FIG. 6 is an exemplary embodiment of the invention, wherein a weak coupling essential for a sound-insulated structure is illustrated,
  • Fig. 7 is an exploded view illustrating an exemplary embodiment of the invention, wherein the structure can be disassembled and assembled,
  • Fig. 8 is a sectional view illustrating an exemplary embodiment of the invention, wherein the build boards are attached to each other, and showing various forms of electrical and mechanical connection,
  • Figure 9 is an exemplary embodiment of the invention, wherein the build boards are connected to each other and attached to the frame structure,
  • Figure 10 is an exemplary embodiment of the invention illustrating the connection of elements to each other
  • Figure 11 is an exemplary embodiment of the invention illustrating the connection of the elements to each other via a mounting means
  • Fig. 12 is an exemplary embodiment of the invention, wherein the connection of the elements to each other and their attachment to the frame structure via an anchor fitting is illustrated.
  • Figure 13 shows an exemplary embodiment of the invention, which illustrates identity of the perforation pattern of the build boards between at least two build boards.
  • Figure 14 shows an exemplary embodiment of the invention, illustrating attachment of the plates of the build board arrangement to a metal frame made of, for example, sheet metal.
  • Figure 15 shows an exemplary embodiment of the invention, which illustrates a method for connecting a power supply cable to the build board arrangement.
  • Figure 16 shows an exemplary embodiment of the invention, which illustrates a method for protecting connection components of build boards with an grounding shield.
  • the figure shows an exploded view, where the grounding shield and the connection component are positioned outwards away from the upper surface of the build board.
  • Electrical device which may also be electrical furniture, other electrically operating and/or electrically conductive device. May also mean power supply means.
  • Power supply means that supplies electricity to a Build board arrangement, build board, or element. It can also work to extract electricity from said structures.
  • a cable and its wires can be connected to the power supply. May include a strain relief slot.
  • Attachment means whose function is to connect electrically and attach mechanically.
  • Conductor layer whose function is to carry electricity and strengthen a structure.
  • the surface area of the conductor layer defines the locations for connecting the electrical device 101 to the surface of the build board 102, for example.
  • Insulation material layer whose function is to insulate the conductor layers 105 from each other, and/or provide the build board 102 with a property, such as sound or fire insulation.
  • External attachment means such as a screw or nail.
  • Antenna. 112 Fold which may be a shape edged in sheet metal or otherwise obtained, for example, by casting.
  • 119 Element which may be, for example, a space or building element 119.
  • Connection component which is, for example, plate-like or flat.
  • connection component comprises one or more of the following components:
  • Insulation opening where the insulation device is installed also functions as an electrical insulator between the conductor layer 101 and the fastening means 104.
  • Insulating means the function is to act as an electrical insulator between the conductor layer 101 and the fixing means 104. Installed in insulation opening 123.
  • Figure 1 shows an exemplary embodiment of the invention, wherein a build board 102 is a layered board structure having at least two conductor layers 105 and at least one insulation material layer 106, and at least two attachment means 104 for attaching an electrical device 101 to the build board 102 and electrically coupling to said at least two conductor layers 105, and at least one power supply means 103 arranged to supply power to the conductor layers 105 of the build board 102.
  • a build board 102 is a layered board structure having at least two conductor layers 105 and at least one insulation material layer 106, and at least two attachment means 104 for attaching an electrical device 101 to the build board 102 and electrically coupling to said at least two conductor layers 105, and at least one power supply means 103 arranged to supply power to the conductor layers 105 of the build board 102.
  • electricity is supplied to said conductor layers of the build board 102 via a power supply means 103.
  • Electrical wiring 129 of the electrical cable 128 are connected to said power supply means.
  • the build board arrangement can comprise only one build board 102, and an electrical supply means 103 or a switching component 121 , and an electrical device 101.
  • the layer plate structure mentioned is provided in such a way that at least two conductor layers 105 and at least one insulating material layer 106 are attached to each other by gluing.
  • said layers arranged within said layered board structure have the same external dimensions.
  • insulation material layer 106 is provided on at least one outer surface of said build board 102 parallel to its thickness, whose function is to cover the conductor layer 105.
  • the power supply means 103 is mounted on the edge of the build board 102.
  • the power supply means 103 is mounted on the surface of the build board 102 parallel to its thickness.
  • the electrical device 101 is mounted on the edge of the build board 102.
  • the electrical device 101 is mounted on the surface of the build board 102 parallel to its thickness.
  • the electrical device 101 is flush-mounted to the build board 102.
  • the conductor layer 105 is made of a sheet metal having a thickness of, for example, 0.1 mm to 4 mm.
  • the conductor layer 105 is made of, for example, carbon fiber.
  • Figure 2 shows an exemplary embodiment of the invention, wherein at least three conductor layers 105 are provided in the build board 102 and the protective earth of the power supply means 103 is connected to at least one of the outer conductor layers 105.
  • the live conductor layers 109 are disposed behind the earthed conductor layer 108 relative to the thickness of the build board 102 as viewed from its surface.
  • said attachment means 107 penetrates the build board 102, said attachment means first penetrates the earthed conductor layer 108 and then said attachment means impinges on the live conductor layer 109.
  • a short circuit is formed between the earthed conductor layer 108 and the live conductor layer 109 via the external attachment means 107. This short circuit triggers, for example, a circuit breaker or a residual current device.
  • the Build board arrangement with DC voltage includes 2-3 conductor layers. In some exemplary embodiments of the invention, the Build board arrangement with at least 100-250V AC voltage includes 2-4 conductor layers.
  • the Build board arrangement with at least 3-phase AC voltage includes 5-6 conductor layers.
  • the Build board arrangement with at least 100-250V AC voltage includes 2-4 conductor layers.
  • Figure 2 shows an exemplary embodiment of the invention, wherein an opening for wireless communication 110 is provided in the conductor layers 105 of the build board 102.
  • the Build board arrangement may include one or more build boards 102 whose material do not interfere with the wireless communication, said build board being a conventional build board replacing the electrically conductive build board 102 of the invention.
  • Figure 2 shows an exemplary embodiment of the invention, wherein an antenna 111 is provided in the opening for wireless communication 110, which wirelessly transmits a signal in the direction of said opening in the build board 102.
  • the antenna 111 includes means for receiving a wirelessly transmitted signal and transmitting the wireless signal.
  • the antenna 111 includes means for receiving a wirelessly transmitted signal and adapting the wireless signal to a wired format.
  • the antenna 111 includes means for receiving a wirelessly transmitted signal, amplifying the signal, and transmitting the wireless signal.
  • the antenna 111 includes means for receiving, amplifying, and converting the wirelessly transmitted signal to a wired format.
  • the antenna 111 is electrically operated.
  • the antenna 111 is integrated within the build board 102 and receives its operating voltage from the conductor layers 105 to which it is connected. In some exemplary embodiments of the invention, the antenna 111 is mounted at an opening formed in the surface of the build board 102.
  • Figure 2 shows an exemplary embodiment of the invention, wherein an insulation component 132 is provided on at least one edge surface of the build board 102 to cover the edge surfaces of the conductor layers 105 on the edge surface of the build board 102.
  • a material layer is provided on the insulation component’s 132 surface disposed against the edge surface of the build board 102, whose function is to double insulate the insulation component 132.
  • a material layer is provided in the structure of the insulation component 132, whose function is to prevent the external attachment means, such as a screw or nail, from penetrating through the insulation component.
  • the punching force of the external attachment means must not exceed 500N in the direction of the surface, which is achieved either by hitting the nail or by screwing the screw.
  • the insulating component 132 is a angle strip that is installed at the angle seam of the two build boards 102 .
  • the insulating component covers the exposed conductor layers 105 of the build boards 102.
  • an electrically conductive material layer is provided on the installation side of the insulating component 132, which covers the conductor layers 105 of the build board 102.
  • the insulating component 132 is provided with a shape or a separate component, which, when installed, is mechanically attached and electrically connected to only one conductor layer 105, through which the grounding is transferred to the electrically conductive material layer provided on the inner surface of the insulating component 132.
  • the insulating component 132 is attached to the edge of the build board 102 with, for example, adhesive tape, which acts as an electrical insulator for at least one conductor layer.
  • Figure 3 shows an exemplary embodiment of the invention, wherein the conductor layers 105 and the insulation material layer 106 of the build board 102 are attached together by attachment insulation means 114 extending through the build board 102 and arranged to provide electrical insulation between the conductor layers 105.
  • the structure of the build board 102 shown in the figure is cut at the attachment insulation means 114.
  • the attachment insulation means 114 is flexible electrically insulating material that allows the attachment insulation means to provide a weak coupling between the conductor layers 105 that prevents sound conduction between said conductor layers.
  • a thread is provided at least at one end of the attachment insulation means 114 towards the attachment surface of the conductor layer 105.
  • a collar 130 is provided at at least one end of the attachment insulation means 114 against which the conductor layer 105 is attached when the attachment insulation means 114 is attached by the attachment screw 113.
  • Figure 4 shows an exemplary embodiment of the invention, wherein the attachment insulation means disclosed in the invention has been replaced by at least one stiffening component 131 provided with a non-conductive material, which has a frame-like shape and whose function is to increase the rigidity of the structure.
  • the stiffening component 131 Through the stiffening component 131 , the conductor layers 105 are mechanically attached to each other, and said components and means provide electrical insulation between the conductor layers 105.
  • the space between the conductor layers 105 which is not filled by the stiffening component 131 , can be filled with a non-conductive insulation material.
  • Fig. 5 shows an exemplary embodiment of the invention having two exemplary assemblies shown in Fig. 3 or 4: a first assembly 1 15 and a second assembly 116, said assemblies being attached to each other by at least one stiffening component 131 forming a mechanical connection between said assemblies and an electrical insulation between said conductor layers 105.
  • the exemplary first assembly 115 and second assembly 116 shown in the figure are partially sectioned. In the figure, the arrows indicating the vertical movement illustrate the installation direction of said assemblies.
  • the first assembly 115 and the second assembly 116 which are attached to each other by at least four attachment insulation means 114, provide mechanical connection and electrical insulation between said assemblies.
  • the assembly is, for example, a building or space element including at least two of said exemplary assemblies shown in Figure 3 or 4, said assemblies being attached to each other by at least one stiffening component 131 and/or attachment insulation means of the invention.
  • Fig. 6 shows an exemplary embodiment of the invention, wherein the attachment insulation means 114 of the first assembly 115 and the second assembly 116 are in different locations as the other stiffening components 131 when viewed parallel to the thickness of the build board, attaching the first and second assemblies together. Said arrangement provides a weak coupling between said assemblies.
  • the attachment insulation means 114 of the first assembly 115 and the second assembly 116 are in different locations as the attachment insulation means of the invention when viewed parallel to the thickness of the build board, attaching said assemblies together. Said arrangement provides a weak coupling between said assemblies.
  • the stiffening component 131 is provided at the same location as the attachment insulation means mentioned in the invention when the build board is viewed parallel to its thickness.
  • An evading shape is provided on the surface of the stiffening component 131 against the conductor layer 105, which prevents the attachment insulation means 114 from being placed in the same position as the stiffening component 131 when the build board is viewed parallel to its thickness. Said arrangement provides a weak coupling between said assemblies.
  • Figure 7 shows an exemplary embodiment of the invention, wherein the assembly of the build board can be disassembled, assembled and the materials inside the build board exchanged without breaking the material.
  • the conductor layers 105 of the build board are attached to each other by means of attachment insulation means 114 and/or at least one of the stiffening components shown so that said conductor layers are not electrically connected to each other.
  • An insulation material layer 106 is mounted between the conductor layers 105.
  • the figure shows an exploded view of the assembly, wherein the insulation material layer 106 is cut at one of the attachment insulation means 114.
  • the conductor layers 105 are attached to the attachment insulation means 114 and/or to at least one stiffening component of the invention via attachment screws 113.
  • the materials of the build board assembly may be interchanged to achieve desired properties. Desired properties include sound insulation, fire insulation, thermal insulation and moisture insulation.
  • a magnetically adhesive surface material such as a laminate, vinyl, wood, or plywood board, is mounted on the surface of the build board parallel to its thickness.
  • Figure 8 shows an exemplary embodiment of the invention, wherein at least two build boards 102 are electrically connected to each other and said build boards are mechanically attached to the frame structure 130 via coupling screws 122.
  • the seam strip 127, the build boards 102 and one of the connection components 121 shown in the figure are cut at the central axis of the coupling screws 122.
  • connection components 121 are provided at the junction of the build boards 102, and each of said connection components 121 is attached via at least two coupling screws 122 through the build boards 102 to one conductor layer 105 and the frame structure 130 of each build board 102, forming electrical contact between the conductor layers 105 of the build boards 102, and at the same time said build boards are attached mechanically into the frame structure 130.
  • connection components 121 are provided at the junction of the build boards 102 between the frame structure 130 and the build boards 102.
  • connection components 121 are disposed on the surface of the build boards 102 away from the frame structure 130.
  • a seam strip 127 is provided on the surface of the build board 102, whose function is to cover the connection components 121 and the coupling screws 122.
  • a groove is longitudinally provided on the attaching surface of the seam strip 127, within which the connection components 121 and the coupling screws 122 are covered under the seam strip 127.
  • the build boards 102 can be connected to each other on at least two edges.
  • a wall is formed from at least four build boards 102. At least one of said build boards may be replaced, for example, by gypsum board. Said exemplary embodiment is suitable, for example, when the connection of an electrical device is not desired to said part of the build board to be replaced. Or said exemplary embodiment is suitable, for example, when providing an opening with the size of said build board for wireless data transmission.
  • Fig. 9 shows an exemplary embodiment of the invention according to Fig. 8, wherein the at least one conductor layer 105 and/or the insulation material layer 106 is provided with an insulation opening 123, whose function is to prevent transfer of electricity from the conductor layer 105 to the coupling screw 122.
  • an insulation means 124 is mounted in the insulation opening 123, whose function is to prevent the transfer of electricity from the conductor layer 105 to the coupling screw 122.
  • a coupling screw mounting hole 125 larger than the diameter of the head of the coupling screw 122, is provided on the build board 102 for mounting the coupling screw 122, and where an insulation plug 126 covering the head of the electrically conductive coupling screw 122 is installed after installing said coupling screw.
  • a penetration barrier material 120 may be formed at the end of the insulation plug 126 as viewed from its mounting direction to prevent an external attachment means, such as a screw or nail, from penetrating through it to the coupling screw 122.
  • the punching force of said external attachment means must not exceed, for example, 500N parallel to the surface, which is achieved either by hitting the nail or by screwing the screw.
  • At least two insulation openings 123 are provided in the conductor layers 105 of the build board 102 and the locations of the insulation openings are industrially marked on the surface of said build board, and said marking allows easy and quick installation without measurement and/or a separate tool.
  • the outer surface of the build board 102 of the Build board arrangement is flattened and painted during installation.
  • Figure 10 shows an exemplary embodiment of the invention, wherein an element 119, such as a building element or a space element, is provided from at least two build boards 102.
  • Said elements are, for example, fire-insulated, sound-insulated, moisture-insulated and heat-insulated, or have some combination of said properties.
  • the element 119 includes at least three conductor layers 105, as a result of which the first of the two build boards 102 of said element includes two conductor layers 105 and the second non-first build board includes one conductor layer 105.
  • the elements 119 are mountable to each other on at least two edges that form an electrical contact and a mechanical attachment between the elements 119.
  • the at least one conductor layer 105 provided within the element 119 is folded 112 from at least one edge to at least partially cover the edge surface of the insulation material layer 106 adjacent said conductor layer 105.
  • the fold of said conductor layer forms an electrical connection between the conductor layers 105 when said elements are provided in a butt joint against each other.
  • At least one edge of the element is provided with a groove 117 having two opposite inner surfaces formed from conductor layers 105.
  • Said groove can be provided with a coupling means 118 including an insulation material 133 and plate conductors 134 attached thereto to two opposite surfaces and connected to said plate conductors.
  • at least one edge of the element is provided with a key located at a groove 117, the two opposite inner surfaces of which are formed from conductor layers 105 whose length has been increased to form a key. The length of the insulation material layer has also been increased at the key between said conductor layers.
  • the insulation material 133 of the coupling means 118 is a resilient material, such as groats, which due to its resilient property, presses the plate conductors 134 against the conductor layers 105 in the groove 117.
  • the flexible insulation material 133 may be thicker with respect to said compression direction than the distance between the conductor layers 105 of said groove.
  • the elements 119 are in a butt joint. Through the at least one connection component 121 and the coupling screws 122, the elements 119 are mechanically attached to each other and the at least one conductor layers 105 of the elements 119 are electrically connected to each other.
  • the element with DC voltage includes 2-3 conductor layers.
  • the element with 100-250V AC voltage includes 2-4 conductor layers.
  • the element with 3-phase AC voltage includes 5-6 conductor layers.
  • the element includes at least one conductor layer for the uninterruptible power system.
  • Fig. 11 shows an exemplary embodiment of the invention, wherein at least two build boards 102 are connectable to each other via an installation means 136 having at least two conductor components 135 provided. Said conductor components press into the insulation material layers 106 of the build board 102, and each of said conductor components is electrically connected to the second conductive layer 105 of each said build board and make electrical contact between said build boards.
  • the arrow indicates the installation direction of the build board to the installation means 136.
  • the function of the installation means 136 is to insulate the build boards 102, for example, from the floor surface against which the installation means is positioned.
  • the installation means 136 is provided from a flexible material.
  • the installation means 136 is provided from a non-conductive material.
  • the installation means 136 is mounted against a build board, floor, wall, or ceiling surface.
  • Figure 12 shows an exemplary embodiment of the invention, wherein at least two build boards 102 are electrically and mechanically connected to each other by an anchor fitting 137.
  • Said anchor fitting attaches the build boards 102 to the frame structure 130.
  • At least one insulation opening 123 is provided in the at least one plate conductor of the frame structure 130 to prevent transfer of electricity from the anchor fitting 137 to the conductor layer 105.
  • At least one anchor fitting 137 penetrates a conductor layer, as a result of which electricity is connected between said build boards via the anchor fitting 137.
  • the conductor layer 105 is a soft electrically conductive material, such as aluminum, which can be penetrated by an anchor fitting 137.
  • the anchor fitting 137 is riveted within the surface plane of the build board 102 and is smoothed with, for example, mortar.
  • At least two insulation openings 123 are provided in the conductor layers 105 of the build board 102 and the locations of the insulation openings are industrially marked on the surface of said build board, and said marking allows easy and quick installation without measurement and/or a separate tool.
  • Figure 13 shows an exemplary embodiment of the invention, where the identity of the perforation patterns 145 of the conductor layers 105 between at least two conductor layers 105 is illustrated.
  • the size of the perforation pattern 145 is determined to be advantageous, for example, according to the size of the socket or electrical device 101 , so that installing the socket or electrical device 10 at the hole, i.e. the opening, is advantageous so that the fixing screws of the socket or electrical device 10 are not located at the hole in the perforation pattern 145.
  • the perforation pattern 145 of at least one conductor layer 105 differs from the perforation pattern 145 of at least one other conductor layer 105.
  • the size of the perforations 146 can vary from 20-40mm (length) x 20-40mm (width) without being limited to those dimensions.
  • Their shape can be rectangular, square, triangular, pentagonal, round, etc.
  • the thickness of the conductor layer 105 is, for example, 0.5 mm - 5 mm without being limited to those dimensions.
  • the conductor layer can be, for example, a conductor layeror a sprayed layer.
  • the perforation pattern 145 of the conductor layer 105 is arranged in such a way that at least two of its edges have openings for the installation of fastening screws for attaching the build board to, for example, a frame structure or another structure.
  • the purpose of said openings is to prevent electricity from being conducted to said fixing screws.
  • the function of the perforation pattern 145 is to reduce the mass of the conductor layer 105.
  • the function of the perforation pattern 145 is to reduce the manufacturing costs of the build board 102 by reducing the amount of required material.
  • the function of the perforation pattern 145 is to reduce the surface area of the conductor layer105, which reduces the converging surface area between the conductor plates 105 through the insulation material 133, which as a whole reduces the amount of capacitance formed between the conductor plates 105.
  • the perforation pattern 145 is dimensioned to reduce the capacitance value in such a way that the size of the holes is increased and/or the distance between the holes is reduced.
  • Figure 14 shows an exemplary embodiment of the invention, in which the build boards 102 of the build board arrangement are mounted and/or attached to a metal frame made of, for example, sheet metal.
  • the connecting screws 122 are preferably arranged so that they are not in the penetration direction at the metallic frame structure 144.
  • the insulating material layers 133 and the surface material layer 138 have been removed from the second build board 122.
  • At least two connecting screws 122 of the build board 102 each attach to the conductor layer 105 of the build board 102 and to the connecting plate 147. Via the connecting plate 147 and the connecting screw 122, electricity conducts from the conductor layer 105 of the first build board 102 through the mentioned parts to the conductor layer 105 of the second build board 102.
  • the power supply arrangement 140 is installed at the seam point of the build boards 102, and its function is to connect the build boards 102 electrically.
  • the power supply arrangement 140 is installed in a place other than the seam point of the build boards 102, and its function is only to supply electricity via the electric cable 128 to at least two conductor layers 105 of the build board 102.
  • Figure 15 shows an exemplary embodiment of the invention, where the electric cable 128 is brought through the build board 102 into the connection component 121. At least two electrical conductors 129 of the electrical cable 128 are connected to the connecting plate 147 via the connecting screw 122.
  • an opening is provided in the body part 149 of the connection component for bringing in the electric cable 128.
  • connection plate 147 At least two electrical conductors 129 of the electrical cable 128 are connected to the connection plate 147 by some connection mechanism, such as a screw connector, a plate connector.
  • the switching component is provided with a switching device such as, for example, a residual current device, a circuit breaker, a wirelessly controlled switch or a manually controlled mechanical switch.
  • the power supply arrangement 140 is installed at the seam point of the build boards 102, and its function is to connect the build boards 102 electrically.
  • the power supply arrangement 140 is installed at a place other than the seam point of the build boards 102, and its function is only to supply electricity via the electric cable 128 to at least two conductor layers 105 of the build board 102.
  • FIG 16 shows an exemplary embodiment of the invention, in which the connection plate 147 of the switching component 121 is protected by a protectively grounded grounding shield 141.
  • the grounding shield 141 is provided in the cover part 148 of the grounding shield of the switching component 121 .
  • the cover part of the grounding part is positioned and attached to the body part 149 of the connecting component.
  • the grounding shield 141 has the flexible shape property achieved, which via it is connected to the connection plate 147.
  • a separate component for example, a spring-powered switch part
  • the grounding shield 149 through which the grounding is connected from the connection plate 147 to the grounding shield 141.
  • the cover part 148 of the grounding shield 141 is, for example, a foot or ceiling molding that positions, i.e. attaches, the grounding shield 149 to the body part 149 of the switching component as mentioned.
  • grounding protection is provided for one of the following solutions: switching component 121 and/or electrical supply arrangement 140.
  • connection component 121 for example, a baseboard, ceiling molding, or decorative molding is mounted on top of the connection component 121 , which has been given a shape in which said connection component 121 remains hidden.
  • the grounding protection 141 is provided at the seam point installed at the angle of the two build boards 102.
  • the shape of the grounding shield 141 is at an advantageous angle with respect to the shape of the connection component 121 and with respect to the installation angle of the mentioned build boards 102.

Abstract

The invention relates to a build board arrangement having an electrical device (101), a build board (102), a power supply means (103), and attachment means (104) for attaching the electrical device (101) to the build board (102). Said build board (102) is a layered board structure provided with at least two conductor layers (105) and at least one insulation material layer (106), and at least two attachment means (104) arranged to attach the electrical device (101) to the build board (102) and to electrically connect to said at least two conductor layers (105), and at least one power supply means (103) arranged to supply power to the conductor layers (105) of the build board (102).

Description

Building board system
Technical field
The invention relates to a Build board arrangement for implementing, for example, furniture and/or parts of buildings and/or vehicles and/or ships and/or other products or structures. For example, the furniture may be furniture used in offices, apartments, hospitals, schools, production lines, assembly lines, and/or restaurants, and/or short-term furniture implementations, for example, at trade fair. Said parts of the buildings may be, for example, walls, ceilings, and/or floors.
Prior art
In the prior art, Build board arrangements include boards made of, for example, gypsum, plywood, particle board and/or wood, which may be coated with, for example, various laminate, vinyl, metal, paper, paperboard or spray coatings. Said combinations of construction material and coating material are installed to provide the desired structure. Generally in prior art, electrical devices and furniture are installed at the desired location in the furniture or objects in the operating environment with traditional screw connections, as a surface-mounted or flush-mounted housings. Cable installations complicate convertibility, i.e. design freedom that adds value in electrical design.
It is almost impossible to embed electrical wires in a panel-like build board, so the cables remain visible. The cables are visually messy and make cleaning and interior design difficult. The installation of electrical furniture and devices on the edge of the build board is challenging with traditional methods due to the installation of the cable and the space required by the connecting wires.
In the traditional electrical installation method, where the electrical device or furniture is flush-mounted, the structure of the installation accessories required does not take into account sound insulation and/or air leakage. Therefore, applications such as wall or ceiling structures have to be retrofitted .
The state-of-the-art space elements are similar in structure to a conventional partition wall consisting of, for example, a frame made of wood or sheet metal, on the surface of which said panels are fixedly mounted and the space between the frames is filled with, for example, insulation wool or other insulating material. Disadvantages of said structure are, for example, the sound bridges caused by the solid and hard frame material between the surface boards. Another disadvantage is the lack of weak coupling, which means a flexible coupling between said materials and/or a structure, wherein the sound-conducting materials are not in direct contact between the outer surfaces and which prevents sound from conducting along hard surfaces. One of the essential causes of a cold bridge is, for example, metal frames that conduct heat well.
Prior art technology does not know the perforation pattern advantageously arranged in the build board. If the conductor boards are holeless or nearly holeless boards, it can cause the following unfavorable characteristics: 1 ) an increase in the total mass of the overall structure, which, among other things, complicates the installation work and increases the manufacturing costs of the build board, 2) an increase in the capacitance values between the conductor boards, 3) complicates the work of attaching the build boards to the frame structure, because openings must be processed to the conductor boards, for example by drilling or already in the manufacturing process, so that the fastening means of the build boards do not hit the conductor boards and thus cause electrical contact with said fastening means, and the openings created in the conductor boards, for example by drilling, increase manufacturing and installation costs, among other things.
Prior art technology does not know a method for installing and/or attaching the boards of a build board arrangement to a frame made of metal thin board, which can be arranged, for example, on a wall, ceiling or floor. The problem can be, for example, electricity-conducting screws or other fastening devices hitting the said electricity-conducting frame structure, in which case electricity can be unintentionally conducted into the frame structure. If, for example, two screws or other electrically conductive fastening means attached to different conductor boards hit the same electrically conductive frame structure, the result is, for example, a short circuit or other undesirable connection of two different conductors.
Prior art technology does not know a method for connecting the power supply cable to the structure board arrangement from any direction relative to the structure board. The problem with the mentioned method is that connecting it is challenging, if the aesthetics are to be preserved in such a way that, for example, there is no junction box or other technically equivalent solution left on the visible surfaces. In a generally known technique, the power supply cable is brought to the inside or surface of a desired wall or ceiling, for example, from where it is connected to a socket or other desired location or device.
Commonly known technology does not know a method for protecting the connection components of build boards with a grounding board. If the connecting component is installed at the junction of two build boards behind, for example, a skirting board or a ceiling board, and the mentioned are, for example, wood that can be pierced with, for example, a nail or a screw, hitting the wiring part of the connecting component causes electricity to be conducted to the said nail or screw, which can result in an electric shock to a person or animal.
Publication FI20145752 describes a system consisting of modular furniture elements that can be modified and has an integrated electrical network. Said publication focuses on molded furniture parts, which are laborious and complicated to manufacture. In the case of electrically conductive structures, said publication focuses on structures other than sheet metal, which limit the possibility of free connection of electrical devices to different surfaces of the structure. Said publication does not address the need for an electrified build board to operate independently without other build boards attached thereto. Said publication does not take a position on a layered structure, which is a preferred embodiment for furniture and build board. This publication does not take a position and does not focus on solving the problem of technical challenges relevant to sound insulation and thermal insulation, for example. Said publication does not take a position on the installation/attaching of a build board to an external structure which is not part of it, which is, for example, a wooden frame structure.
Publication FI20165157 describes the connection of electrical device and furniture to the surface of a modular furniture part with electrically conductive attaching means, but does not focus and solve any technical installation problems with which the electrical coupling and mechanical connection between the build boards can be implemented in an electrically safe and installation- friendly manner, for example in the case where the attaching and connection components cannot be installed inside the build board during installation. Publication FI201665157 does not take a position on connecting an electrical device to the conductor layer. FI201665157 considers only connection to the modular furniture part. FI201665157 does not take a position on the order and electrical safety of the conductor plates and does not focus on solving electrical safety challenges.
Summary of the mvention
The object of the invention is a new type of build board arrangement. The build board arrangement is a layered board structure in which at least three conductor layers and insulating material layers are arranged between them, and the conductor layers comprise mutually identical perforations that reduce the capacitance between the conductor layers
The build board arrangement according to the invention can be used, for example, for the implementation of furniture and/or parts of buildings. Said furniture may be, for example, furniture used in offices, apartments, hospitals, schools, production lines, assembly lines, and/or restaurants, and/or short-term furniture implementations, for example at trade fairs, or modifiable interior designs. Said parts of the buildings may be, for example, furniture, walls, ceilings, and/or floors.
The advantage of the build board arrangement according to the invention is that due to its layered structure the electrical device can be freely installed in said system in places defined by its surface area. The advantage of the Build board arrangement according to the invention is that the electrical device can be electrically safely connected to said system due to the arrangement of the conductor layers according to the invention. Another advantage is that conventional objects, such as paintings, mounted on the surface of the Build board arrangement are attached, for example, with screws or nails, whereby said installation procedure according to the invention does not pose a risk of electric shock to its users. Another advantage is that the manufacturing and installation costs of a Build board arrangement can be lower than in the case where the build boards and/or elements are manufactured by traditional methods, when the cost comparison takes into account the electrical installation work as well as the accessories. Another advantage is that fixed cable installations can be eliminated, for example, from installations of convertible furniture and/or various structures, which makes it possible to implement a flexible operating model without disturbing fixed cable installations. Another advantage is that a conventional plate wall with, for example, a frame, insulation, surface boards and fixed cable installations can be replaced by a space element system according to the invention. Another advantage is that a conventional build board, such as gypsum board, can be replaced by a build board arrangement according to the invention. Another advantage is that the build board arrangement and the space element system can be implemented according to the requirements of the structures, which are, for example, sound insulation, fire insulation, moisture insulation and the transmission of wireless data transmission. One advantage is also that the build board arrangement according to the invention reduces the increase of the capacitance value between the conductor boards. One advantage is also that in the build board arrangement according to the invention, attaching the build boards to the frame structure is not laborious, because there is no need to separately create holes in the build boards, for example by drilling, so that the fastening means of the build boards do not hit the build boards and thus cause electrical contact with said fastening means. Another advantage is that when you don't have to create openings in the build boards separately, for example by drilling, manufacturing and installation costs are reduced. One advantage is also that thanks to the build board arrangement according to the invention, attaching and connecting electrical devices, such as sockets, is more free in terms of location
The various exemplary embodiments of the invention are characterized by what is set forth in the dependent claims.
Brief description of the drawings
Figure 1 is an exemplary embodiment of the invention showing a Build board arrangement, Figure 2 is an exemplary embodiment of the invention showing a Build board arrangement with insulation materials removed from the build board,
Figure 3 is an exemplary embodiment of the invention, wherein the build board is cut at the attachment insulation means, and further shows an exemplary embodiment of the attachment insulation means,
Fig. 4 is an exemplary embodiment of the invention, wherein the conductor layer is partially cut and the internal structure of the build board is illustrated,
Figure 5 is an exemplary embodiment of the invention, wherein an element structure obtained from build boards is illustrated,
Figure 6 is an exemplary embodiment of the invention, wherein a weak coupling essential for a sound-insulated structure is illustrated,
Fig. 7 is an exploded view illustrating an exemplary embodiment of the invention, wherein the structure can be disassembled and assembled,
Fig. 8 is a sectional view illustrating an exemplary embodiment of the invention, wherein the build boards are attached to each other, and showing various forms of electrical and mechanical connection,
Figure 9 is an exemplary embodiment of the invention, wherein the build boards are connected to each other and attached to the frame structure,
Figure 10 is an exemplary embodiment of the invention illustrating the connection of elements to each other,
Figure 11 is an exemplary embodiment of the invention illustrating the connection of the elements to each other via a mounting means,
Fig. 12 is an exemplary embodiment of the invention, wherein the connection of the elements to each other and their attachment to the frame structure via an anchor fitting is illustrated.
Figure 13 shows an exemplary embodiment of the invention, which illustrates identity of the perforation pattern of the build boards between at least two build boards.
Figure 14 shows an exemplary embodiment of the invention, illustrating attachment of the plates of the build board arrangement to a metal frame made of, for example, sheet metal. Figure 15 shows an exemplary embodiment of the invention, which illustrates a method for connecting a power supply cable to the build board arrangement.
Figure 16 shows an exemplary embodiment of the invention, which illustrates a method for protecting connection components of build boards with an grounding shield. The figure shows an exploded view, where the grounding shield and the connection component are positioned outwards away from the upper surface of the build board.
Description of the figure numbering
101 Electrical device which may also be electrical furniture, other electrically operating and/or electrically conductive device. May also mean power supply means.
102 Build board that is part of a Build board arrangement and can operate independently in a Build board arrangement. May act as part of a building and space element 119.
103 Power supply means that supplies electricity to a Build board arrangement, build board, or element. It can also work to extract electricity from said structures. A cable and its wires can be connected to the power supply. May include a strain relief slot.
104 Attachment means whose function is to connect electrically and attach mechanically.
105 Conductor layer whose function is to carry electricity and strengthen a structure. The surface area of the conductor layer defines the locations for connecting the electrical device 101 to the surface of the build board 102, for example.
106 Insulation material layer whose function is to insulate the conductor layers 105 from each other, and/or provide the build board 102 with a property, such as sound or fire insulation.
107 External attachment means, such as a screw or nail.
108 Protective earth conductor layer.
109 Live conductor layer.
110 Opening for wireless communication.
111 Antenna. 112 Fold which may be a shape edged in sheet metal or otherwise obtained, for example, by casting.
113 Attachment screw.
114 Attachment insulation means by which the conductor layers 105 are attached and whose function is to insulate the conductor layers 105 from each other.
115 First assembly.
116 Second assembly.
117 Groove.
118 Coupling means.
119 Element, which may be, for example, a space or building element 119.
120 Penetration barrier material.
121 Connection component, which is, for example, plate-like or flat.
The connection component comprises one or more of the following components:
- Grounding protection
- Connection plate 147
- Grounding shield cover part 148
- Body part 149 of the connection component
- Connection screw 122
122 Connecting screw, whose function is to fix mechanically and connect electrically.
123 Insulation opening where the insulation device is installed. Also functions as an electrical insulator between the conductor layer 101 and the fastening means 104.
124 Insulating means, the function is to act as an electrical insulator between the conductor layer 101 and the fixing means 104. Installed in insulation opening 123.
125 Connection screw mounting hole.
126 Insulation plug.
127 Seam list. 128 Electric cable.
129 Electrical conductors
130 Frame structure.
131 Stiffening component.
132 Insulation component.
133 Insulation material.
134 Plate conductors, which function as a conductor of electricity between the conductor layers 105 of the elements 119.
135 Conductor component.
136 Installation means.
137 Anchor fitting.
Description of the exemplary embodiments
Figure 1 shows an exemplary embodiment of the invention, wherein a build board 102 is a layered board structure having at least two conductor layers 105 and at least one insulation material layer 106, and at least two attachment means 104 for attaching an electrical device 101 to the build board 102 and electrically coupling to said at least two conductor layers 105, and at least one power supply means 103 arranged to supply power to the conductor layers 105 of the build board 102.
In some exemplary embodiments of the invention, electricity is supplied to said conductor layers of the build board 102 via a power supply means 103. Electrical wiring 129 of the electrical cable 128 are connected to said power supply means.
In some exemplary embodiments of the invention, the build board arrangement can comprise only one build board 102, and an electrical supply means 103 or a switching component 121 , and an electrical device 101.
In some exemplary embodiments of the invention, the layer plate structure mentioned is provided in such a way that at least two conductor layers 105 and at least one insulating material layer 106 are attached to each other by gluing.
In some exemplary embodiments of the invention, said layers arranged within said layered board structure have the same external dimensions. In some exemplary embodiments of the invention, insulation material layer 106 is provided on at least one outer surface of said build board 102 parallel to its thickness, whose function is to cover the conductor layer 105.
In some exemplary embodiments of the invention, the power supply means 103 is mounted on the edge of the build board 102.
In some exemplary embodiments of the invention, the power supply means 103 is mounted on the surface of the build board 102 parallel to its thickness.
In some exemplary embodiments of the invention, the electrical device 101 is mounted on the edge of the build board 102.
In some exemplary embodiments of the invention, the electrical device 101 is mounted on the surface of the build board 102 parallel to its thickness.
In some exemplary embodiments of the invention, the electrical device 101 is flush-mounted to the build board 102.
In some exemplary embodiments of the invention, the conductor layer 105 is made of a sheet metal having a thickness of, for example, 0.1 mm to 4 mm.
In some exemplary embodiments of the invention, the conductor layer 105 is made of, for example, carbon fiber.
Figure 2 shows an exemplary embodiment of the invention, wherein at least three conductor layers 105 are provided in the build board 102 and the protective earth of the power supply means 103 is connected to at least one of the outer conductor layers 105.
In some exemplary embodiments of the invention, the live conductor layers 109 are disposed behind the earthed conductor layer 108 relative to the thickness of the build board 102 as viewed from its surface. When the external attachment means 107 penetrates the build board 102, said attachment means first penetrates the earthed conductor layer 108 and then said attachment means impinges on the live conductor layer 109. As a result of said collision, a short circuit is formed between the earthed conductor layer 108 and the live conductor layer 109 via the external attachment means 107. This short circuit triggers, for example, a circuit breaker or a residual current device.
In some exemplary embodiments of the invention, the Build board arrangement with DC voltage includes 2-3 conductor layers. In some exemplary embodiments of the invention, the Build board arrangement with at least 100-250V AC voltage includes 2-4 conductor layers.
In some exemplary embodiments of the invention, the Build board arrangement with at least 3-phase AC voltage includes 5-6 conductor layers.
In some exemplary embodiments of the invention, the Build board arrangement with at least 100-250V AC voltage includes 2-4 conductor layers.
Figure 2 shows an exemplary embodiment of the invention, wherein an opening for wireless communication 110 is provided in the conductor layers 105 of the build board 102.
In some exemplary embodiments of the invention, the Build board arrangement may include one or more build boards 102 whose material do not interfere with the wireless communication, said build board being a conventional build board replacing the electrically conductive build board 102 of the invention.
Figure 2 shows an exemplary embodiment of the invention, wherein an antenna 111 is provided in the opening for wireless communication 110, which wirelessly transmits a signal in the direction of said opening in the build board 102.
In some exemplary embodiments of the invention, the antenna 111 includes means for receiving a wirelessly transmitted signal and transmitting the wireless signal.
In some exemplary embodiments of the invention, the antenna 111 includes means for receiving a wirelessly transmitted signal and adapting the wireless signal to a wired format.
In some exemplary embodiments of the invention, the antenna 111 includes means for receiving a wirelessly transmitted signal, amplifying the signal, and transmitting the wireless signal.
In some exemplary embodiments of the invention, the antenna 111 includes means for receiving, amplifying, and converting the wirelessly transmitted signal to a wired format.
In some exemplary embodiments of the invention, the antenna 111 is electrically operated.
In some exemplary embodiments of the invention, the antenna 111 is integrated within the build board 102 and receives its operating voltage from the conductor layers 105 to which it is connected. In some exemplary embodiments of the invention, the antenna 111 is mounted at an opening formed in the surface of the build board 102.
Figure 2 shows an exemplary embodiment of the invention, wherein an insulation component 132 is provided on at least one edge surface of the build board 102 to cover the edge surfaces of the conductor layers 105 on the edge surface of the build board 102.
In some exemplary embodiments of the invention, a material layer is provided on the insulation component’s 132 surface disposed against the edge surface of the build board 102, whose function is to double insulate the insulation component 132.
In some exemplary embodiments of the invention, a material layer is provided in the structure of the insulation component 132, whose function is to prevent the external attachment means, such as a screw or nail, from penetrating through the insulation component. For example, the punching force of the external attachment means must not exceed 500N in the direction of the surface, which is achieved either by hitting the nail or by screwing the screw.
In some exemplary embodiments of the invention, the insulating component 132 is a angle strip that is installed at the angle seam of the two build boards 102 . The insulating component covers the exposed conductor layers 105 of the build boards 102. In some exemplary embodiments of the invention, an electrically conductive material layer is provided on the installation side of the insulating component 132, which covers the conductor layers 105 of the build board 102.
In some exemplary embodiments of the invention, the insulating component 132 is provided with a shape or a separate component, which, when installed, is mechanically attached and electrically connected to only one conductor layer 105, through which the grounding is transferred to the electrically conductive material layer provided on the inner surface of the insulating component 132.
In some exemplary embodiments of the invention, the insulating component 132 is attached to the edge of the build board 102 with, for example, adhesive tape, which acts as an electrical insulator for at least one conductor layer.
Figure 3 shows an exemplary embodiment of the invention, wherein the conductor layers 105 and the insulation material layer 106 of the build board 102 are attached together by attachment insulation means 114 extending through the build board 102 and arranged to provide electrical insulation between the conductor layers 105. The structure of the build board 102 shown in the figure is cut at the attachment insulation means 114.
In some exemplary embodiments of the invention, the attachment insulation means 114 is flexible electrically insulating material that allows the attachment insulation means to provide a weak coupling between the conductor layers 105 that prevents sound conduction between said conductor layers.
In some exemplary embodiments of the invention, a thread is provided at least at one end of the attachment insulation means 114 towards the attachment surface of the conductor layer 105.
In some exemplary embodiments of the invention, a collar 130 is provided at at least one end of the attachment insulation means 114 against which the conductor layer 105 is attached when the attachment insulation means 114 is attached by the attachment screw 113.
Figure 4 shows an exemplary embodiment of the invention, wherein the attachment insulation means disclosed in the invention has been replaced by at least one stiffening component 131 provided with a non-conductive material, which has a frame-like shape and whose function is to increase the rigidity of the structure. Through the stiffening component 131 , the conductor layers 105 are mechanically attached to each other, and said components and means provide electrical insulation between the conductor layers 105. The space between the conductor layers 105, which is not filled by the stiffening component 131 , can be filled with a non-conductive insulation material.
Fig. 5 shows an exemplary embodiment of the invention having two exemplary assemblies shown in Fig. 3 or 4: a first assembly 1 15 and a second assembly 116, said assemblies being attached to each other by at least one stiffening component 131 forming a mechanical connection between said assemblies and an electrical insulation between said conductor layers 105. The exemplary first assembly 115 and second assembly 116 shown in the figure are partially sectioned. In the figure, the arrows indicating the vertical movement illustrate the installation direction of said assemblies.
In some exemplary embodiments of the invention, the first assembly 115 and the second assembly 116, which are attached to each other by at least four attachment insulation means 114, provide mechanical connection and electrical insulation between said assemblies.
In some exemplary embodiments of the invention, the assembly is, for example, a building or space element including at least two of said exemplary assemblies shown in Figure 3 or 4, said assemblies being attached to each other by at least one stiffening component 131 and/or attachment insulation means of the invention.
Fig. 6 shows an exemplary embodiment of the invention, wherein the attachment insulation means 114 of the first assembly 115 and the second assembly 116 are in different locations as the other stiffening components 131 when viewed parallel to the thickness of the build board, attaching the first and second assemblies together. Said arrangement provides a weak coupling between said assemblies.
In some exemplary embodiments of the invention, the attachment insulation means 114 of the first assembly 115 and the second assembly 116 are in different locations as the attachment insulation means of the invention when viewed parallel to the thickness of the build board, attaching said assemblies together. Said arrangement provides a weak coupling between said assemblies.
In some exemplary embodiments of the invention, the stiffening component 131 is provided at the same location as the attachment insulation means mentioned in the invention when the build board is viewed parallel to its thickness. An evading shape is provided on the surface of the stiffening component 131 against the conductor layer 105, which prevents the attachment insulation means 114 from being placed in the same position as the stiffening component 131 when the build board is viewed parallel to its thickness. Said arrangement provides a weak coupling between said assemblies.
Figure 7 shows an exemplary embodiment of the invention, wherein the assembly of the build board can be disassembled, assembled and the materials inside the build board exchanged without breaking the material. The conductor layers 105 of the build board are attached to each other by means of attachment insulation means 114 and/or at least one of the stiffening components shown so that said conductor layers are not electrically connected to each other. An insulation material layer 106 is mounted between the conductor layers 105. The figure shows an exploded view of the assembly, wherein the insulation material layer 106 is cut at one of the attachment insulation means 114.
In some exemplary embodiments of the invention, the conductor layers 105 are attached to the attachment insulation means 114 and/or to at least one stiffening component of the invention via attachment screws 113.
In some exemplary embodiments of the invention, the materials of the build board assembly may be interchanged to achieve desired properties. Desired properties include sound insulation, fire insulation, thermal insulation and moisture insulation.
In some exemplary embodiments of the invention, a magnetically adhesive surface material, such as a laminate, vinyl, wood, or plywood board, is mounted on the surface of the build board parallel to its thickness.
Figure 8 shows an exemplary embodiment of the invention, wherein at least two build boards 102 are electrically connected to each other and said build boards are mechanically attached to the frame structure 130 via coupling screws 122. The seam strip 127, the build boards 102 and one of the connection components 121 shown in the figure are cut at the central axis of the coupling screws 122.
In some exemplary embodiments of the invention, at least two connection components 121 are provided at the junction of the build boards 102, and each of said connection components 121 is attached via at least two coupling screws 122 through the build boards 102 to one conductor layer 105 and the frame structure 130 of each build board 102, forming electrical contact between the conductor layers 105 of the build boards 102, and at the same time said build boards are attached mechanically into the frame structure 130.
In some exemplary embodiments of the invention, the connection components 121 are provided at the junction of the build boards 102 between the frame structure 130 and the build boards 102.
In some exemplary embodiments of the invention, the connection components 121 are disposed on the surface of the build boards 102 away from the frame structure 130. In some exemplary embodiments of the invention, a seam strip 127 is provided on the surface of the build board 102, whose function is to cover the connection components 121 and the coupling screws 122.
In some exemplary embodiments of the invention, a groove is longitudinally provided on the attaching surface of the seam strip 127, within which the connection components 121 and the coupling screws 122 are covered under the seam strip 127.
In some exemplary embodiments of the invention, the build boards 102 can be connected to each other on at least two edges.
In some exemplary embodiments of the invention, for example, a wall is formed from at least four build boards 102. At least one of said build boards may be replaced, for example, by gypsum board. Said exemplary embodiment is suitable, for example, when the connection of an electrical device is not desired to said part of the build board to be replaced. Or said exemplary embodiment is suitable, for example, when providing an opening with the size of said build board for wireless data transmission.
Fig. 9 shows an exemplary embodiment of the invention according to Fig. 8, wherein the at least one conductor layer 105 and/or the insulation material layer 106 is provided with an insulation opening 123, whose function is to prevent transfer of electricity from the conductor layer 105 to the coupling screw 122.
In some exemplary embodiments of the invention, an insulation means 124 is mounted in the insulation opening 123, whose function is to prevent the transfer of electricity from the conductor layer 105 to the coupling screw 122.
In some exemplary embodiments of the invention, a coupling screw mounting hole 125, larger than the diameter of the head of the coupling screw 122, is provided on the build board 102 for mounting the coupling screw 122, and where an insulation plug 126 covering the head of the electrically conductive coupling screw 122 is installed after installing said coupling screw.
In some exemplary embodiments of the invention, a penetration barrier material 120 may be formed at the end of the insulation plug 126 as viewed from its mounting direction to prevent an external attachment means, such as a screw or nail, from penetrating through it to the coupling screw 122. The punching force of said external attachment means must not exceed, for example, 500N parallel to the surface, which is achieved either by hitting the nail or by screwing the screw.
In some exemplary embodiments of the invention, during the industrial manufacturing process at least two insulation openings 123 are provided in the conductor layers 105 of the build board 102 and the locations of the insulation openings are industrially marked on the surface of said build board, and said marking allows easy and quick installation without measurement and/or a separate tool.
In some exemplary embodiments of the invention, the outer surface of the build board 102 of the Build board arrangement is flattened and painted during installation.
Figure 10 shows an exemplary embodiment of the invention, wherein an element 119, such as a building element or a space element, is provided from at least two build boards 102. Said elements are, for example, fire-insulated, sound-insulated, moisture-insulated and heat-insulated, or have some combination of said properties.
In some exemplary embodiments of the invention, the element 119 includes at least three conductor layers 105, as a result of which the first of the two build boards 102 of said element includes two conductor layers 105 and the second non-first build board includes one conductor layer 105.
In some exemplary embodiments of the invention, the elements 119 are mountable to each other on at least two edges that form an electrical contact and a mechanical attachment between the elements 119.
In some exemplary embodiments of the invention, the at least one conductor layer 105 provided within the element 119 is folded 112 from at least one edge to at least partially cover the edge surface of the insulation material layer 106 adjacent said conductor layer 105. The fold of said conductor layer forms an electrical connection between the conductor layers 105 when said elements are provided in a butt joint against each other.
In some exemplary embodiments of the invention, at least one edge of the element is provided with a groove 117 having two opposite inner surfaces formed from conductor layers 105. Said groove can be provided with a coupling means 118 including an insulation material 133 and plate conductors 134 attached thereto to two opposite surfaces and connected to said plate conductors. In some exemplary embodiments of the invention, at least one edge of the element is provided with a key located at a groove 117, the two opposite inner surfaces of which are formed from conductor layers 105 whose length has been increased to form a key. The length of the insulation material layer has also been increased at the key between said conductor layers.
In some exemplary embodiments of the invention, the insulation material 133 of the coupling means 118 is a resilient material, such as groats, which due to its resilient property, presses the plate conductors 134 against the conductor layers 105 in the groove 117. The flexible insulation material 133 may be thicker with respect to said compression direction than the distance between the conductor layers 105 of said groove.
In some exemplary embodiments of the invention, the elements 119 are in a butt joint. Through the at least one connection component 121 and the coupling screws 122, the elements 119 are mechanically attached to each other and the at least one conductor layers 105 of the elements 119 are electrically connected to each other.
In some exemplary embodiments of the invention, the element with DC voltage includes 2-3 conductor layers.
In some exemplary embodiments of the invention, the element with 100-250V AC voltage includes 2-4 conductor layers.
In some exemplary embodiments of the invention, the element with 3-phase AC voltage includes 5-6 conductor layers.
In some exemplary embodiments of the invention, the element includes at least one conductor layer for the uninterruptible power system.
Fig. 11 shows an exemplary embodiment of the invention, wherein at least two build boards 102 are connectable to each other via an installation means 136 having at least two conductor components 135 provided. Said conductor components press into the insulation material layers 106 of the build board 102, and each of said conductor components is electrically connected to the second conductive layer 105 of each said build board and make electrical contact between said build boards. In the figure, the arrow indicates the installation direction of the build board to the installation means 136.
In some exemplary embodiments of the invention, the function of the installation means 136 is to insulate the build boards 102, for example, from the floor surface against which the installation means is positioned. In some exemplary embodiments of the invention, the installation means 136 is provided from a flexible material.
In some exemplary embodiments of the invention, the installation means 136 is provided from a non-conductive material.
In some exemplary embodiments of the invention, the installation means 136 is mounted against a build board, floor, wall, or ceiling surface.
Figure 12 shows an exemplary embodiment of the invention, wherein at least two build boards 102 are electrically and mechanically connected to each other by an anchor fitting 137. Said anchor fitting attaches the build boards 102 to the frame structure 130. At least one insulation opening 123 is provided in the at least one plate conductor of the frame structure 130 to prevent transfer of electricity from the anchor fitting 137 to the conductor layer 105. At least one anchor fitting 137 penetrates a conductor layer, as a result of which electricity is connected between said build boards via the anchor fitting 137.
In some exemplary embodiments of the invention, the conductor layer 105 is a soft electrically conductive material, such as aluminum, which can be penetrated by an anchor fitting 137.
In some exemplary embodiments of the invention, the anchor fitting 137 is riveted within the surface plane of the build board 102 and is smoothed with, for example, mortar.
In some exemplary embodiments of the invention, during the industrial manufacturing process at least two insulation openings 123 are provided in the conductor layers 105 of the build board 102 and the locations of the insulation openings are industrially marked on the surface of said build board, and said marking allows easy and quick installation without measurement and/or a separate tool.
Figure 13 shows an exemplary embodiment of the invention, where the identity of the perforation patterns 145 of the conductor layers 105 between at least two conductor layers 105 is illustrated.
In some exemplary embodiments of the invention, the size of the perforation pattern 145 is determined to be advantageous, for example, according to the size of the socket or electrical device 101 , so that installing the socket or electrical device 10 at the hole, i.e. the opening, is advantageous so that the fixing screws of the socket or electrical device 10 are not located at the hole in the perforation pattern 145. In some exemplary embodiments of the invention, the perforation pattern 145 of at least one conductor layer 105 differs from the perforation pattern 145 of at least one other conductor layer 105.
In embodiments of the invention, the size of the perforations 146, i.e. the holes, can vary from 20-40mm (length) x 20-40mm (width) without being limited to those dimensions. Their shape can be rectangular, square, triangular, pentagonal, round, etc. The thickness of the conductor layer 105 is, for example, 0.5 mm - 5 mm without being limited to those dimensions. The conductor layer can be, for example, a conductor layeror a sprayed layer.
In some exemplary embodiments of the invention, the perforation pattern 145 of the conductor layer 105 is arranged in such a way that at least two of its edges have openings for the installation of fastening screws for attaching the build board to, for example, a frame structure or another structure. The purpose of said openings is to prevent electricity from being conducted to said fixing screws.
In some exemplary embodiments of the invention, the function of the perforation pattern 145 is to reduce the mass of the conductor layer 105.
In some exemplary embodiments of the invention, the function of the perforation pattern 145 is to reduce the manufacturing costs of the build board 102 by reducing the amount of required material.
In some exemplary embodiments of the invention, the function of the perforation pattern 145 is to reduce the surface area of the conductor layer105, which reduces the converging surface area between the conductor plates 105 through the insulation material 133, which as a whole reduces the amount of capacitance formed between the conductor plates 105.
In some exemplary embodiments of the invention, the perforation pattern 145 is dimensioned to reduce the capacitance value in such a way that the size of the holes is increased and/or the distance between the holes is reduced.
Figure 14 shows an exemplary embodiment of the invention, in which the build boards 102 of the build board arrangement are mounted and/or attached to a metal frame made of, for example, sheet metal. The connecting screws 122 are preferably arranged so that they are not in the penetration direction at the metallic frame structure 144. In Figure 14, the insulating material layers 133 and the surface material layer 138 have been removed from the second build board 122.
In some exemplary embodiments of the invention, at least two connecting screws 122 of the build board 102 each attach to the conductor layer 105 of the build board 102 and to the connecting plate 147. Via the connecting plate 147 and the connecting screw 122, electricity conducts from the conductor layer 105 of the first build board 102 through the mentioned parts to the conductor layer 105 of the second build board 102.
In some exemplary embodiments of the invention, the power supply arrangement 140 is installed at the seam point of the build boards 102, and its function is to connect the build boards 102 electrically.
In some other exemplary embodiments of the invention, the power supply arrangement 140 is installed in a place other than the seam point of the build boards 102, and its function is only to supply electricity via the electric cable 128 to at least two conductor layers 105 of the build board 102.
Figure 15 shows an exemplary embodiment of the invention, where the electric cable 128 is brought through the build board 102 into the connection component 121. At least two electrical conductors 129 of the electrical cable 128 are connected to the connecting plate 147 via the connecting screw 122.
In some exemplary embodiments of the invention, an opening is provided in the body part 149 of the connection component for bringing in the electric cable 128.
In some exemplary embodiments of the invention, at least two electrical conductors 129 of the electrical cable 128 are connected to the connection plate 147 by some connection mechanism, such as a screw connector, a plate connector.
In some exemplary embodiments of the invention, the switching component is provided with a switching device such as, for example, a residual current device, a circuit breaker, a wirelessly controlled switch or a manually controlled mechanical switch. In some exemplary embodiments of the invention, the power supply arrangement 140 is installed at the seam point of the build boards 102, and its function is to connect the build boards 102 electrically.
In some exemplary embodiments of the invention, the power supply arrangement 140 is installed at a place other than the seam point of the build boards 102, and its function is only to supply electricity via the electric cable 128 to at least two conductor layers 105 of the build board 102.
Figure 16 shows an exemplary embodiment of the invention, in which the connection plate 147 of the switching component 121 is protected by a protectively grounded grounding shield 141. The grounding shield 141 is provided in the cover part 148 of the grounding shield of the switching component 121 . The cover part of the grounding part is positioned and attached to the body part 149 of the connecting component. The grounding shield 141 has the flexible shape property achieved, which via it is connected to the connection plate 147.
In some exemplary embodiments of the invention, a separate component (for example, a spring-powered switch part) is provided for the grounding shield 149, through which the grounding is connected from the connection plate 147 to the grounding shield 141.
In some exemplary embodiments of the invention, the cover part 148 of the grounding shield 141 is, for example, a foot or ceiling molding that positions, i.e. attaches, the grounding shield 149 to the body part 149 of the switching component as mentioned.
In some exemplary embodiments of the invention, grounding protection is provided for one of the following solutions: switching component 121 and/or electrical supply arrangement 140.
In some exemplary embodiments of the invention, for example, a baseboard, ceiling molding, or decorative molding is mounted on top of the connection component 121 , which has been given a shape in which said connection component 121 remains hidden.
In some exemplary embodiments of the invention, the grounding protection 141 is provided at the seam point installed at the angle of the two build boards 102. The shape of the grounding shield 141 is at an advantageous angle with respect to the shape of the connection component 121 and with respect to the installation angle of the mentioned build boards 102.

Claims

Claims
1 . Build board arrangement, characterized in that the build board arrangement is a layer board arrangement in which are arranged at least three conductor layers (105) and insulation material layers (106) between them, and the conductor layers (105) comprise mutually identical perforation openings that reduce the capacitance between the conductor layers.
2. A build board arrangement according to claim 1 , characterized in that at least one of the conductor layers (105) is holeless.
3. A build board arrangement according to one of claims 1 to 2, characterized in that at least one outer conductor layer is holeless.
4. A build board arrangement according to one of the patent claims 1 to 3, characterized in that at least one conductor layer (105) has perforation openings that differ from at least one other conductor layer (105).
5. A build board arrangement according to one of claims 1 to 4, characterized in that a surface material layer (138) is formed in at least one layer (105,106).
6. A build board arrangement according to one of claims 1 to 5, comprising:
- at least two build boards (102) and
- at least one electrical device (101 ), characterized in that
- at least two build boards (102) are electrically connected to each other, and
- at least one electrical device (101 ) is connected to the build board (102), and
- electricity is supplied to at least one build board (102).
7. A build board arrangement according to claim 6, characterized in that the build boards (102) are connected to each other via a connection component (121 ).
8. A build board arrangement according to one of claims 6 to 7, characterized in that electricity is supplied to the build board (102) by means of an electrical supply means (103).
9. A build board arrangement according to one of claims 6 to 8, characterized in that electricity is supplied to the build board (102) by an electricity supply arrangement (140).
10. A build board arrangement according to one of claims 7 or 9, characterized in that at least one of the following is protected by a grounding shield (141 ):
- connection component (121 ), and
- power supply arrangement (140).
11. A build board arrangement according to one of claims 1 to 10, characterized in that an insulating component (132) is provided on at least one edge surface of the build board (102), which covers the edge surfaces of the conductor layers (105) on the edge surface of the build board (102).
12. The build board arrangement according to one of claims 1 to 11 , characterized in that the insulating component (132) is a angle strip that is installed in the angle seam of two build boards, so that the insulating component (132) covers at least the conductor layers (105) at the edge of the second build board (102).
13. A build board arrangement according to one of claims 6 to 12, characterized in that at least one conductor layer (105) is provided with an isolation opening (123) that prevents conduction of electricity from the conductor layer (105) to the connecting screw (122).
14. Build board arrangement according to claim 13, characterized in that insulating means (124) are installed in the insulating opening (123), the function of which is to prevent conduction of electricity from the conductor layer (105) to the connecting screw (122).
PCT/FI2023/050261 2022-05-13 2023-05-12 Building board system WO2023218131A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20225426 2022-05-13
FI20225426 2022-05-13

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009047768A2 (en) * 2007-10-09 2009-04-16 Powermat Ltd. Inductive power providing system
WO2016030580A1 (en) * 2014-08-29 2016-03-03 Absolute Module Oy Modular furniture arrangement
WO2017149197A1 (en) * 2016-02-29 2017-09-08 Absolute Module Oy Modular furniture arrangement comprising electrically and mechanically connectable module furniture parts
WO2018025230A1 (en) * 2016-08-05 2018-02-08 Lym S.R.L. Illumination system
CN111101646A (en) * 2019-12-12 2020-05-05 叶绍彬 Ecological environment-friendly integrated house wallboard and preparation process thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009047768A2 (en) * 2007-10-09 2009-04-16 Powermat Ltd. Inductive power providing system
WO2016030580A1 (en) * 2014-08-29 2016-03-03 Absolute Module Oy Modular furniture arrangement
WO2017149197A1 (en) * 2016-02-29 2017-09-08 Absolute Module Oy Modular furniture arrangement comprising electrically and mechanically connectable module furniture parts
WO2018025230A1 (en) * 2016-08-05 2018-02-08 Lym S.R.L. Illumination system
CN111101646A (en) * 2019-12-12 2020-05-05 叶绍彬 Ecological environment-friendly integrated house wallboard and preparation process thereof

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