WO2023207181A1 - 信号转接装置及信号传输系统 - Google Patents

信号转接装置及信号传输系统 Download PDF

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Publication number
WO2023207181A1
WO2023207181A1 PCT/CN2022/142383 CN2022142383W WO2023207181A1 WO 2023207181 A1 WO2023207181 A1 WO 2023207181A1 CN 2022142383 W CN2022142383 W CN 2022142383W WO 2023207181 A1 WO2023207181 A1 WO 2023207181A1
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WO
WIPO (PCT)
Prior art keywords
signal transmission
signal
switching device
plane
circuit board
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PCT/CN2022/142383
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English (en)
French (fr)
Inventor
孔令钦
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苏州元脑智能科技有限公司
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Publication of WO2023207181A1 publication Critical patent/WO2023207181A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H01R13/05—Resilient pins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present application relates to the field of integrated circuit technology, and specifically to a signal switching device and a signal transmission system.
  • high-speed signal systems such as servers and switches have become more and more complex, making their design more and more difficult.
  • the most critical part is the way the chip is processed on the circuit board, such as the routing and optimization of high-speed signals, low-voltage and high-current power supply design, etc.
  • the fan-out of the chip's high-speed signals and the power plane design determine the number of circuit board layers, determine the cost and complexity of the system solution, and also determine the electrical performance of the system.
  • the pins of high-speed signals are drilled into the inner layer, and the strip lines are divided into different wiring layers and transmitted to various locations on the motherboard. Each depth signal of the chip occupies one wiring layer.
  • This application provides signal switching devices, including:
  • the shielding block includes a first plane and a second plane arranged oppositely;
  • At least one set of signal transmission lines is arranged inside the shielding block, the two ends of the signal transmission lines extend to the first plane and the second plane respectively, and one end of the signal transmission line close to the first plane is electrically connected to the circuit board;
  • the connector is connected to the second plane and is electrically connected to an end of the signal transmission line close to the second plane.
  • one end of the signal transmission line (2) close to the first plane (101) is electrically connected to the bottom surface of the circuit board (4).
  • the shielding block is a solid block structure made of shielding material.
  • the shielding material is graphite, boron-containing material or concrete.
  • each group of signal transmission lines there are multiple groups of signal transmission lines, and the distance between each group of signal transmission lines gradually increases from the first plane to the second plane.
  • the signal transmission lines (2) are arranged in a distributed manner from the pins of the chip (5) to the connector (3).
  • the shielding block is a trapezoidal platform.
  • one end of the signal transmission line is connected to the pins of the chip through the via hole on the circuit board, and the distribution position of one end of the signal transmission line on the first plane is consistent with the distribution position of the pins of the chip.
  • a set of signal transmission lines includes a first ground line, a second ground line, a first signal line and a second signal line, and are not connected to each other.
  • connection terminal is included, one end of the connection terminal is fixedly connected to the shielding block, and is electrically connected to an end of the signal transmission line close to the first plane, and the other end of the connection terminal is inserted into the via hole.
  • connection terminal (6) is made of hard material.
  • connection terminal is a fisheye terminal.
  • the signal transmission line (2) is also used to connect the high-speed signal pins of the chip (5).
  • each signal transmission line (2) is connected to a corresponding connector (3).
  • the type of the signal transmission line (2) is set based on the properties of the hardware device for high-speed signal transmission.
  • the number of signal transmission lines (2) is set based on the properties of the hardware device for high-speed signal transmission.
  • This application also provides a signal transmission system, including:
  • At least two chips are spaced on one side of the circuit board
  • At least two signal switching devices as described above are correspondingly arranged on the other side of the circuit board, and each signal switching device is electrically connected to a chip;
  • the signal switching device is disposed on a side of the circuit board facing away from the chip, and the signal switching device and the circuit board are fixedly connected through fasteners.
  • fasteners include screws.
  • the signal switching device is disposed on a side of the circuit board facing away from the chip, a chip socket is connected between the circuit board and the chip, and the signal switching device and the chip socket are fixedly connected through fasteners.
  • Figure 1 shows a schematic structural diagram of an embodiment of a signal switching device according to one or more embodiments of the present application
  • Figure 2 shows a schematic structural diagram of another embodiment of a signal switching device according to one or more embodiments of the present application
  • Figure 3 shows a schematic structural diagram of the signal switching device and the circuit board plugging in one or more embodiments of the present application
  • Figure 4 shows a schematic structural diagram of an embodiment of a signal transmission system according to one or more embodiments of the present application.
  • connection should be understood in a broad sense.
  • connection or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components.
  • the present application provides a signal transfer device, including a shielding block 1, at least one set of signal transmission lines 2 and connectors 3; the shielding block 1 includes a first plane 101 and a second plane 102 arranged oppositely; at least one set of signal The transmission line 2 is arranged inside the shielding block 1. Both ends of the signal transmission line 2 extend to the first plane 101 and the second plane 102 respectively. One end of the signal transmission line 2 close to the first plane 101 is electrically connected to the circuit board 4; the connector 3 is connected on the second plane 102 and is electrically connected to one end of the signal transmission line 2 close to the second plane 102 .
  • the shielding block is a solid block structure made of shielding material.
  • the shielding material can be graphite, boron-containing materials, concrete, etc.
  • this application is not limited to the chip 5 that can use the signal switching device for high-speed signal transmission.
  • Other components that require high-speed signal transmission are applicable to the embodiments of the application.
  • each group of signal transmission lines 2 There are multiple groups of signal transmission lines 2 , and the distance between each group of signal transmission lines 2 gradually increases from the first plane 101 to the second plane 102 .
  • the connector 3 occupies a large area at the bottom of the shielding block 1, when there are multiple groups of signal transmission lines 2, multiple connectors 3 need to be provided for connection.
  • the pins at the bottom of the chip 5 are relatively dense. , therefore the signal transmission line 2 drawn from the pin needs to be connected to the corresponding connector 3.
  • the signal transmission line 2 is distributed from the pin of the chip 5 to the connector 3, so the distance between each two groups of the signal transmission line 2 is from The first plane 101 gradually increases toward the second plane 102, gradually widening the distance between each group of signal transmission lines 2, with the purpose of widening the pin spacing, so as to smoothly connect to the pins of each connector 3, and gradually widening the distance between each group of signal transmission lines 2.
  • the distance between the group signal transmission lines 2 can prevent mutual signal crosstalk.
  • Shielding block 1 is a trapezoidal platform.
  • the shielding block 1 is a trapezoidal platform, which can reduce the overall occupied area of the signal switching device and save costs.
  • One end of the signal transmission line 2 is connected to the pins of the chip 5 through the via holes on the circuit board 4 , and the distribution position of one end of the signal transmission line 2 on the first plane 101 is consistent with the distribution position of the pins of the chip 5 .
  • the distribution position of one end of the signal transmission line 2 on the first plane 101 is consistent with the distribution position of the pins of the chip 5, which can reduce the wiring of the signal transmission line 2 and can be directly connected to the pins at the bottom of the chip 5 , increasing connection stability and saving costs, and the corresponding pins can be directly found for plugging during connection, which improves convenience.
  • a set of signal transmission lines 2 includes a first ground line 201, a second ground line 202, a first signal line 203 and a second signal line 204, and are not connected to each other.
  • a set of signal transmission lines 2 includes a first ground line 201, a second ground line 202, a first signal line 203 and a second signal line 204, and are not connected to each other. Since they are interspersed between the shielding blocks 1, Therefore, the interference between the signal transmission lines 2 can be reduced. It should be noted that the set of signal transmission lines 2 is not limited to the first ground line 201, the second ground line 202, the first signal line 203 and the second signal line 204. Specifically The number and type of signal transmission lines 2 can be set according to actual conditions. For example, the type and quantity of signal transmission lines 2 can be set with reference to the attributes of hardware devices that require high-speed signal transmission.
  • the signal switching device also includes a connecting terminal 6.
  • One end of the connecting terminal 6 is fixedly connected to the shielding block 1 and is electrically connected to an end of the signal transmission line 2 close to the first plane 101.
  • the other end of the connecting terminal 6 is inserted into the via hole. .
  • connection terminal 6 is made of hard material.
  • One end of the connection terminal 6 is fixedly connected to the shielding block 1 and is electrically connected to an end of the signal transmission line 2 close to the first plane 101 .
  • the other end of the connection terminal 6 is inserted into the via hole. , can facilitate the insertion between the entire signal switching device and the via hole of the circuit board 4, and can prevent the soft nature of the signal connecting wire itself from causing breakage or the instability of high-speed signals due to rubbing.
  • Connection terminal 6 is a fisheye terminal.
  • connection terminal 6 is a fisheye terminal. Since the fisheye terminal itself can expand and contract, the connection terminal 6 can be squeezed and contracted to be inserted into the via hole of the circuit board 4, and then expanded in the via hole. The fisheye terminal can be tightly snapped into the via hole of the circuit board 4 .
  • This application also provides a signal transmission system, including:
  • At least two chips 5 are arranged at intervals on one side of the circuit board 4;
  • At least two signal switching devices as described above are correspondingly arranged on the other side of the circuit board 4, and each signal switching device is electrically connected to a chip 5;
  • the two ends of the connecting cable 7 are respectively connected to two signal switching devices corresponding to the two unused chips 5 .
  • the high-speed signal pins of the chips 5 do not need to be drilled into the inner layer of the circuit board 4, and the strip lines do not need to be routed in different ways.
  • the line layer is transmitted to various positions of the circuit board 4.
  • the connecting device is connected to the chip 5 or other components that require high-speed signal transmission through the connecting cable 7, so that there is no need to set up a high-speed signal wiring layer on the circuit board 4, which can eliminate near-end crosstalk and greatly improve the signal integrity of the system, and High-speed signals can be connected arbitrarily through connector 3.
  • the loss of connector 3 is lower than the loss of wiring on circuit board 4, which can make the system solution design more flexible.
  • the signal switching device is arranged on the side of the circuit board 4 facing away from the chip 5, and the signal switching device and the circuit board 4 are fixedly connected through fasteners.
  • the signal switching device and the circuit board 4 are fixedly connected through fasteners.
  • the fasteners include screws and other accessories that can achieve a fixing effect, preventing the signal switching device from falling off and improving the stability of the signal switching device. .
  • the signal switching device is arranged on the side of the circuit board 4 facing away from the chip 5.
  • a chip socket is connected between the circuit board 4 and the chip 5, and the signal switching device and the chip socket are fixedly connected through fasteners.
  • the signal switching device and the chip socket can be fixedly installed on the circuit board 4 through fasteners without adding new fixing fasteners. parts, saving costs.
  • the shielding block is a trapezoidal platform, which can reduce the overall occupied area of the signal switching device and save costs.
  • the trapezoidal block structure can gradually open up the distance between each group of signal transmission lines. The purpose of the distance is to widen the pin spacing to facilitate smooth connection to the pins of each connector, and gradually widening the distance between each group of signal transmission lines can prevent signal crosstalk between each other.
  • connection terminal can transmit the high-speed signal transmitted from the chip through the circuit board via hole to the signal transmission line, and the connection terminal can facilitate the removal and insertion of the entire signal transfer device and facilitate installation.
  • connection terminal is made of hard material, one end of which is fixedly connected to the shielding block, and is electrically connected to the end of the signal transmission line close to the first plane.
  • the other end of the connection terminal is plugged into the via hole, which facilitates the connection between the entire signal transfer device and
  • the insertion between circuit board vias can prevent the soft nature of the signal connection wire itself from causing breakage or the instability of high-speed signals caused by rubbing.
  • the connecting terminal is a fisheye terminal. Since the fisheye terminal itself can expand and contract, the connecting terminal can be squeezed and inserted into the via hole of the circuit board. Then, by expanding in the via hole, the fisheye terminal can be tightly connected. in the vias of the circuit board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本申请提供了信号转接装置，包括：屏蔽块，包括相对设置的第一平面和第二平面；至少一组信号传输线，设置在屏蔽块的内部，信号传输线的两端分别延伸至第一平面和第二平面，信号传输线靠近第一平面的一端与电路板电连接；连接器，连接在第二平面上，并与信号传输线靠近第二平面的一端电连接。芯片的高速信号的管脚无需通过打孔到电路板的内层，走带状线也不需要分不同的走线层传输到电路板各个位置，通过在电路板底面电连接信号转接装置，将芯片的高速信号全部通过引到转接器，然后通过转接器进行高速信号传输，电路板上无需设置高速信号布线层，可消除近端串扰，改善系统的信号完整性，并且高速信号可以通过连接器任意连接。

Description

信号转接装置及信号传输系统
相关申请的交叉引用
本申请要求于2022年4月29日提交中国专利局，申请号为202210462601.9，申请名称为“信号转接装置及信号传输系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及集成电路技术领域，具体涉及一种信号转接装置及信号传输系统。
背景技术
随着数字技术的突飞猛进，服务器、交换机等高速信号系统变得越来越复杂，设计难度越来越大。其中最关键的部分就是芯片在电路板上的处理方式，比如高速信号的布线和优化，低电压大电流的电源设计方案等等。芯片高速信号的扇出和电源平面设计决定了电路板层数，决定了系统方案的成本和复杂度，同时也决定了系统的电气性能。高速信号的管脚通过打孔到内层，走带状线分不同的走线层传输到主板各个位置，芯片的每个深度的信号都要占用1个走线层。目前业界大尺寸芯片通常有6～8个深度，也就是需要6～8个高速信号层，加上上下两个参考地面平面，电路板的层数经常到达20层以上。以上只是高速信号部分，对于尺寸较大的芯片，功耗也相对较高。芯片电源方案经常也要占据6层以上电源层，这就使得电路板层数变得更高，加工的难度和成本都会大幅度增加，并且目前的芯片扇出设计方法还会存近端串扰的问题，对于高速系统而言，电路板的材料都要选用低损耗的高级板材，层数越多成本越高，大大增加了系统方案的复杂度，使得产品的市场竞争力不足。为了解决以上这些问题，我们需要寻求更好的芯片信号扇出方式，从根源解决问题。
发明内容
本申请提供了信号转接装置，包括：
屏蔽块，包括相对设置的第一平面和第二平面；
至少一组信号传输线，设置在屏蔽块的内部，信号传输线的两端分别延伸至第一平面和 第二平面，信号传输线靠近第一平面的一端与电路板电连接；和
连接器，连接在第二平面上，并与信号传输线靠近第二平面的一端电连接。
进一步地，信号传输线(2)靠近第一平面(101)的一端与电路板(4)的底面电连接。
进一步地，屏蔽块为由屏蔽材料制成的实体块状结构。
进一步地，屏蔽材料为石墨、含硼材料或混凝土。
进一步地，信号传输线具有多组，每两组所述信号传输线之间的距离从第一平面向第二平面逐渐增大。
进一步地，信号传输线(2)从芯片(5)的管脚到连接器(3)呈分散式排列。
进一步地，屏蔽块为梯形台。
进一步地，信号传输线的一端通过电路板上的过孔与芯片的管脚连接，且信号传输线的一端在第一平面上的分布位置与芯片的管脚的分布位置一致。
进一步地，一组信号传输线包括第一接地线、第二接地线、第一信号线和第二信号线，且互不相连。
进一步地，还包括连接端子，连接端子的一端与屏蔽块固定连接，并与信号传输线靠近第一平面的一端电连接，连接端子的另一端插接在过孔内。
进一步地，连接端子(6)为硬质材质。
进一步地，连接端子为鱼眼端子。
进一步地，信号传输线(2)还用于与芯片(5)的高速信号的管脚连接。
进一步地，信号传输线(2)为多组，连接器(3)为多个，各信号传输线(2)与对应的连接器(3)连接。
进一步地，信号传输线(2)的种类基于高速信号传输的硬件设备的属性设置。
进一步地，信号传输线(2)的数量基于高速信号传输的硬件设备的属性设置。
本申请还提供了信号传输系统，包括：
电路板；
至少两个芯片，间隔设置在电路板的一面；
至少两个如上述所述的信号转接装置，对应设置在电路板的另一面，每个信号转接装置与一个芯片电连接；和
连接线缆，两端分别与不同的两个芯片对应的两个信号转接装置连接。
进一步地，信号转接装置设置在电路板背向芯片的一面，且信号转接装置与电路板通过 紧固件固定连接。
进一步地，紧固件包括螺钉。
进一步地，信号转接装置设置在电路板背向芯片的一面，电路板与芯片之间连接有芯片插座，且信号转接装置与芯片插座通过紧固件固定连接。
附图说明
为了更清楚地说明本申请具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1示出了本申请一个或多个实施例信号转接装置的一实施例的结构示意图；
图2示出了本申请一个或多个实施例信号转接装置的另一实施例的结构示意图；
图3示出了本申请一个或多个实施例信号转接装置与电路板插接的结构示意图；
图4示出了本申请一个或多个实施例信号传输系统的一实施例的结构示意图。
附图标记说明：
1、屏蔽块；101、第一平面；102、第二平面；2、信号传输线；201、第一接地线；202、第二接地线；203、第一信号线；204、第二信号线；3、连接器；4、电路板；5、芯片；6、连接端子；7、连接线缆。
具体实施方式
下面将结合附图对本申请的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相 连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
此外，下面所描述的本申请不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
参照图1，本申请提供了信号转接装置，包括屏蔽块1、至少一组信号传输线2和连接器3；屏蔽块1包括相对设置的第一平面101和第二平面102；至少一组信号传输线2设置在屏蔽块1的内部，信号传输线2的两端分别延伸至第一平面101和第二平面102，信号传输线2靠近第一平面101的一端与电路板4电连接；连接器3连接在第二平面102上，并与信号传输线2靠近第二平面102的一端电连接。
利用本实施例的技术方案，通过在电路板4底面电连接信号转接装置，将芯片5的高速信号全部通过信号传输线2引到转接器，然后通过转接器与需要进行高速信号传输的芯片5或者其他元器件进行连接，这样芯片5的高速信号的管脚无需通过打孔到电路板4的内层，走带状线也不需要分不同的走线层传输到电路板4各个位置，电路板4上就无需设置高速信号布线层，可以消除近端串扰，大大改善系统的信号完整性，并且高速信号可以通过连接器3任意连接，同时连接器3的损耗低于电路板4走线的损耗，可以使得系统方案设计更加灵活，且信号传输线2穿过屏蔽块1，可以减少信号传输线2之间的信号互扰。
具体地实施方式中，屏蔽块为由屏蔽材料制成的实体块状结构，优选地，屏蔽材料可以为石墨、含硼材料、混凝土等。
需要说明的是，本申请不止针对芯片5可使用该信号转接装置进行高速信号传输，其他需进行高速信号传输的元器件均适用于本申请实施例。
信号传输线2具有多组，每两组所述信号传输线2之间的距离从第一平面101向第二平面102逐渐增大。
在本实施例中，由于连接器3占用屏蔽块1底部的面积较大，当信号传输线2具有多组时，相应的需要设置多个连接器3进行连接，但是芯片5底部的管脚较为密集，因此从管脚引出的信号传输线2需要连接相应的连接器3，信号传输线2从芯片5的管脚到连接器3呈分散式排列，因此每两组所述信号传输线2之间的距离从第一平面101向第二平面102逐渐增大，逐渐拉开各组信号传输线2之间的距离，目的是拉开pin间距，以便顺利连接到各个连接器3的管脚，并且逐渐拉开各组信号传输线2之间的距离可以防止相互之间信号串扰。
屏蔽块1为梯形台。
在本实施例中，由于连接器3占用屏蔽块1底部的面积较大，因此屏蔽块1为梯形台可以减少信号转接装置整体的占用面积，也可以节省成本。
信号传输线2的一端通过电路板4上的过孔与芯片5的管脚连接，且信号传输线2的一端在第一平面101上的分布位置与芯片5的管脚的分布位置一致。
在本实施例中，信号传输线2的一端在第一平面101上的分布位置与芯片5的管脚的分布位置一致可以减少信号传输线2的走线，可以直接与芯片5底部的管脚进行连接，增加连接稳定性，也节约了成本，并且在连接时也可直接找到对应的管脚进行插接，提高了便利性。
一组信号传输线2包括第一接地线201、第二接地线202、第一信号线203和第二信号线204，且互不相连。
在本实施例中，一组信号传输线2包括第一接地线201、第二接地线202、第一信号线203和第二信号线204，且互不相连，由于穿插在屏蔽块1之间，因此可以减少信号传输线2之间的干扰，需要说明的是，一组信号传输线2不仅仅限于第一接地线201、第二接地线202、第一信号线203和第二信号线204，具体的信号传输线2的数量以及种类可以根据实际情况进行设定，例如可参照需要进行高速信号传输的硬件设备的属性进行设置信号传输线2的种类以及数量。
本信号转接装置还包括连接端子6，连接端子6的一端与屏蔽块1固定连接，并与信号传输线2靠近第一平面101的一端电连接，连接端子6的另一端插接在过孔内。
在本实施例中，连接端子6为硬质材质，其一端与屏蔽块1固定连接，并与信号传输线2靠近第一平面101的一端电连接，连接端子6的另一端插接在过孔内，可以方便整个信号转接装置与电路板4过孔之间的插接，并且可以防止信号连接线自身的柔软性质导致断裂或者由于揉搓造成高速信号的不稳定性。
连接端子6为鱼眼端子。
在本实施例中，连接端子6为鱼眼端子，由于鱼眼端子自身可以膨胀收缩，可以使得该连接端子6挤压收缩插入到电路板4的过孔中，然后通过在过孔中膨胀使得鱼眼端子可以紧密卡接在电路板4的过孔中。
本申请还提供了信号传输系统，包括：
电路板4；
至少两个芯片5，间隔设置在电路板4的一面；
至少两个如上述所述的信号转接装置，对应设置在电路板4的另一面，每个信号转接装置与一个芯片5电连接；
连接线缆7，两端分别与不用的两个芯片5对应的两个信号转接装置连接。
利用本申请的技术方案，当两个芯片5需要进行高速信号传输时，芯片5的高速信号的管脚无需通过打孔到电路板4的内层，走带状线也不需要分不同的走线层传输到电路板4各个位置，通过在电路板4底面电连接信号转接装置，将芯片5的高速信号全部通过信号传输线2引到信号转接装置，然后将芯片5底部连接的信号转接装置通过连接线缆7与需要进行高速信号传输的芯片5或者其他元器件连接，这样电路板4上就无需设置高速信号布线层，可以消除近端串扰，大大改善系统的信号完整性，并且高速信号可以通过连接器3任意连接，同时连接器3的损耗低于电路板4走线的损耗，可以使得系统方案设计更加灵活。
信号转接装置设置在电路板4背向芯片5的一面，且信号转接装置与电路板4通过紧固件固定连接。
在本实施例中，信号转接装置与电路板4通过紧固件固定连接，紧固件包括螺钉等可实现固定作用的配件，防止信号转接装置脱落，提高了信号转接装置的稳定性。
信号转接装置设置在电路板4背向芯片5的一面，电路板4与芯片5之间连接有芯片插座，且信号转接装置与芯片插座通过紧固件固定连接。
在本实施例中，当电路板4与芯片5之间连接有芯片插座时，可通过紧固件将信号转接装置与芯片插座一同固定安装在电路板4上，无需增加新的固定紧固件，节约了成本。
本申请具有以下优点：
1、利用本申请的技术方案，通过在电路板底面电连接信号转接装置，将芯片的高速信号全部通过信号传输线引到转接器，然后通过转接器与需要进行高速信号传输的芯片或者其他元器件进行连接，这样芯片的高速信号的管脚无需通过打孔到电路板的内层，走带状线也不需要分不同的走线层传输到电路板各个位置，电路板上就无需设置高速信号布线层，可以消除近端串扰，大大改善系统的信号完整性，并且高速信号可以通过连接器任意连接，同时连接器的损耗低于电路板走线的损耗，可以使得系统方案设计更加灵活，且信号传输线穿过屏蔽块，可以减少信号传输线之间的信号互扰。
2、由于连接器占用屏蔽块底部的面积较大，因此屏蔽块为梯形台可以减少信号转接装置整体的占用面积，也可以节省成本，梯形块结构可以逐渐拉开各组信号传输线之间的距离，目的是拉开pin间距，以便顺利连接到各个连接器的管脚，并且逐渐拉开各组信号传输线之间的距离可以防止相互之间信号串扰。
3、连接端子可以将芯片通过电路板过孔上传输来的高速信号传输到信号传输线，并且设置连接端子可以方便信号转接装置整体的拔插，方便安装。
4、连接端子为硬质材质，其一端与屏蔽块固定连接，并与信号传输线靠近第一平面的一端电连接，连接端子的另一端插接在过孔内，可以方便整个信号转接装置与电路板过孔之间的插接，并且可以防止信号连接线自身的柔软性质导致断裂或者由于揉搓造成高速信号的不稳定性。
5、连接端子为鱼眼端子，由于鱼眼端子自身可以膨胀收缩，可以使得该连接端子挤压收缩插入到电路板的过孔中，然后通过在过孔中膨胀使得鱼眼端子可以紧密卡接在电路板的过孔中。
显然，上述实施例仅仅是为清楚地说明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本申请创造的保护范围之中。

Claims (20)

  1. 一种信号转接装置，其特征在于，包括：
    屏蔽块(1)，包括相对设置的第一平面(101)和第二平面(102)；
    至少一组信号传输线(2)，设置在所述屏蔽块(1)的内部，所述信号传输线(2)的两端分别延伸至所述第一平面(101)和所述第二平面(102)，所述信号传输线(2)靠近所述第一平面(101)的一端与电路板(4)电连接；和
    连接器(3)，连接在所述第二平面(102)上，并与所述信号传输线(2)靠近所述第二平面(102)的一端电连接。
  2. 根据权利要求1所述的信号转接装置，其特征在于，所述信号传输线(2)靠近所述第一平面(101)的一端与电路板(4)的底面电连接。
  3. 根据权利要求1所述的信号转接装置，其特征在于，所述屏蔽块(1)为由屏蔽材料制成的实体块状结构。
  4. 根据权利要求3所述的信号转接装置，其特征在于，所述屏蔽材料为石墨、含硼材料或混凝土。
  5. 根据权利要求1所述的信号转接装置，其特征在于，所述信号传输线(2)具有多组，每两组所述信号传输线(2)之间的距离从所述第一平面(101)向所述第二平面(102)逐渐增大。
  6. 根据权利要求5所述的信号转接装置，其特征在于，所述信号传输线(2)从芯片(5)的管脚到连接器(3)呈分散式排列。
  7. 根据权利要求5所述的信号转接装置，其特征在于，所述屏蔽块(1)为梯形台。
  8. 根据权利要求1-7中任一项所述的信号转接装置，其特征在于，所述信号传输线(2)的一端通过所述电路板(4)上的过孔与芯片(5)的管脚连接，且所述信号传输线(2)的一端在所述第一平面(101)上的分布位置与所述芯片(5)的管脚的分布位置一致。
  9. 根据权利要求8所述的信号转接装置，其特征在于，所述一组信号传输线(2)包括第一接地线(201)、第二接地线(202)、第一信号线(203)和第二信号线(204)，且互不相连。
  10. 根据权利要求8所述的信号转接装置，其特征在于，还包括连接端子(6)，所述连接端子(6)的一端与所述屏蔽块(1)固定连接，并与所述信号传输线(2)靠近所述第一平面(101)的一端电连接，所述连接端子(6)的另一端插接在所述过孔内。
  11. 根据权利要求10所述的信号转接装置，其特征在于，所述连接端子(6)为硬质 材质。
  12. 根据权利要求10所述的信号转接装置，其特征在于，所述连接端子(6)为鱼眼端子。
  13. 根据权利要求1所述的信号转接装置，其特征在于，所述信号传输线(2)还用于与芯片(5)的高速信号的管脚连接。
  14. 根据权利要求1所述的信号转接装置，其特征在于，所述信号传输线(2)为多组，连接器(3)为多个，各信号传输线(2)与对应的连接器(3)连接。
  15. 根据权利要求1所述的信号转接装置，其特征在于，所述信号传输线(2)的种类基于高速信号传输的硬件设备的属性设置。
  16. 根据权利要求1所述的信号转接装置，其特征在于，所述信号传输线(2)的数量基于高速信号传输的硬件设备的属性设置。
  17. 一种信号传输系统，其特征在于，包括：
    电路板(4)；
    至少两个芯片(5)，间隔设置在所述电路板(4)的一面；
    至少两个如权利要求1-7任一项所述的信号转接装置，对应设置在所述电路板(4)的另一面，每个所述信号转接装置与一个所述芯片(5)电连接；和
    连接线缆(7)，两端分别与不同的两个所述芯片(5)对应的两个所述信号转接装置连接。
  18. 根据权利要求17所述的信号传输系统，其特征在于，所述信号转接装置设置在所述电路板(4)背向芯片(5)的一面，且所述信号转接装置与所述电路板(4)通过紧固件固定连接。
  19. 根据权利要求18所述的信号传输系统，其特征在于，所述紧固件包括螺钉。
  20. 根据权利要求17所述的信号传输系统，其特征在于，所述信号转接装置设置在所述电路板(4)背向芯片(5)的一面，所述电路板(4)与所述芯片(5)之间连接有芯片插座，且所述信号转接装置与所述芯片插座通过紧固件固定连接。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140041937A1 (en) * 2009-01-30 2014-02-13 Brian Keith Lloyd High Speed Bypass Cable Assembly
CN109634003A (zh) * 2019-02-21 2019-04-16 厦门天马微电子有限公司 一种显示面板及显示装置
CN110808499A (zh) * 2019-10-12 2020-02-18 华为机器有限公司 公端连接器、母端连接器、连接器组件以及通信设备
CN113395819A (zh) * 2020-03-13 2021-09-14 华为技术有限公司 一种线缆组件、信号传输结构和电子设备
CN114566842A (zh) * 2022-04-29 2022-05-31 苏州浪潮智能科技有限公司 信号转接装置及信号传输系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210007033U (zh) * 2019-01-02 2020-01-31 立讯精密工业股份有限公司 高速连接器板端结构及其高速连接器
CN113840451A (zh) * 2020-06-24 2021-12-24 中兴通讯股份有限公司 印刷电路板及具有该印刷电路板的电子设备
CN213124816U (zh) * 2020-08-31 2021-05-04 深圳市立荣凯科技有限公司 一种用于高数据传输速率的连接器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140041937A1 (en) * 2009-01-30 2014-02-13 Brian Keith Lloyd High Speed Bypass Cable Assembly
CN109634003A (zh) * 2019-02-21 2019-04-16 厦门天马微电子有限公司 一种显示面板及显示装置
CN110808499A (zh) * 2019-10-12 2020-02-18 华为机器有限公司 公端连接器、母端连接器、连接器组件以及通信设备
CN113395819A (zh) * 2020-03-13 2021-09-14 华为技术有限公司 一种线缆组件、信号传输结构和电子设备
CN114566842A (zh) * 2022-04-29 2022-05-31 苏州浪潮智能科技有限公司 信号转接装置及信号传输系统

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