WO2023206706A1 - Design rule check method and device - Google Patents

Design rule check method and device Download PDF

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Publication number
WO2023206706A1
WO2023206706A1 PCT/CN2022/096467 CN2022096467W WO2023206706A1 WO 2023206706 A1 WO2023206706 A1 WO 2023206706A1 CN 2022096467 W CN2022096467 W CN 2022096467W WO 2023206706 A1 WO2023206706 A1 WO 2023206706A1
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Prior art keywords
node
schematic diagram
layout
circuit
circuit schematic
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PCT/CN2022/096467
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French (fr)
Chinese (zh)
Inventor
范亚茹
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长鑫存储技术有限公司
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Publication of WO2023206706A1 publication Critical patent/WO2023206706A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/392Floor-planning or layout, e.g. partitioning or placement
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00Details relating to the type of the circuit
    • G06F2115/12Printed circuit boards [PCB] or multi-chip modules [MCM]

Definitions

  • Embodiments of the present disclosure relate to the field of semiconductor technology, and in particular, to a design rule checking method and device.
  • DRC design rule check
  • layout design will have some special requirements. For example, there will be high-voltage nodes in the circuit. These high-voltage nodes will have special rule requirements during layout design. Therefore, there is an urgent need to provide a new Design rule checking method to deal with some special needs in layout design, thereby improving the performance and yield of semiconductor devices.
  • Embodiments of the present disclosure provide a design rule checking method and device, which can improve the performance and yield of semiconductor devices.
  • embodiments of the present disclosure provide a design rule checking method, which method includes:
  • a design rule checking device which includes:
  • a determination module used to determine the position of the target node in the circuit schematic diagram, where the nodes in the circuit schematic diagram are the connection points between the devices in the circuit schematic diagram;
  • a positioning module configured to determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram;
  • the first checking module is used to obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target position in the circuit layout satisfy the layout design rules.
  • embodiments of the present disclosure provide an electronic device, including: at least one processor and a memory;
  • the memory stores computer execution instructions
  • the at least one processor executes the computer execution instructions stored in the memory, so that the at least one processor executes the design rule checking method provided in the first aspect.
  • embodiments of the present disclosure provide a computer-readable storage medium that stores computer-executable instructions.
  • a processor executes the computer-executable instructions, the design provided in the first aspect is implemented. Rule checking method.
  • an embodiment of the present disclosure provides a computer program product, including a computer program.
  • the computer program is executed by a processor, the design rule checking method as provided in the first aspect is implemented.
  • the design rule checking method and device determine the position of the target node in the circuit schematic diagram and determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram based on the position of the target node in the circuit schematic diagram. ; Obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target position in the circuit layout meet the layout design rules, which can cope with some special needs in layout design, thereby effectively improving the performance of semiconductor devices performance and yield.
  • Figure 1 is a schematic flowchart of steps of a design rule checking method provided in an embodiment of the present disclosure
  • Figure 2 is a schematic diagram of two circuit schematic diagrams provided in embodiments of the present disclosure.
  • Figure 3 is a circuit layout of a semiconductor device provided in an embodiment of the present disclosure.
  • Figure 4 is a schematic flowchart of steps of another design rule checking method provided in an embodiment of the present disclosure.
  • Figure 5 is a schematic diagram of a program module of a design rule checking device provided in an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present disclosure.
  • module refers to any known or later developed hardware, software, firmware, artificial intelligence, fuzzy logic or combination of hardware or/and software code capable of performing the functions associated with that element .
  • the embodiments of the present disclosure can be applied in the semiconductor field, for example, in the semiconductor layout design process.
  • DRC design rule check
  • embodiments of the present disclosure provide a design rule checking method, which determines the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram; obtains the target node corresponding layout design rules, and check whether the design parameters of the devices laid out at the target positions in the circuit layout meet the layout design rules. This can respond to some special needs in layout design, ensure the accuracy of layout design, and improve Semiconductor device performance and yield.
  • FIG. 1 is a schematic flow chart of a design rule checking method provided in an embodiment of the present disclosure.
  • the above design rule checking method includes:
  • the above-mentioned circuit schematic diagram can also be called an electronic circuit diagram or circuit diagram. It is a diagram drawn with agreed symbols to represent the circuit structure. It can reflect the electrical connection and working principle of each component in the electronic product. It is usually applied In designing and analyzing circuits. When analyzing a circuit, you can understand the working principle of the circuit by identifying the various circuit component symbols drawn on the circuit schematic diagram and the connections between them.
  • the circuit schematic diagram may be composed of component symbols, connections, nodes, etc.
  • the component symbol represents the component in the actual circuit. Its shape is not necessarily similar to the actual component, or even completely different, but it generally indicates the characteristics of the component, and the number of pins is consistent with the actual component.
  • the connection represents the wire in the actual circuit. Although it is a wire in the schematic diagram, in commonly used chips or printed circuit boards, it is often not a wire but a metal wire of various shapes. Nodes represent the mutual connection relationships between several component pins or several wires. All component pins and wires connected to the node, regardless of the number, are conductive.
  • the positions of each target node in the circuit schematic diagram that need to be checked by the design rule are first determined.
  • the above circuit schematic diagram may have one target node or multiple target nodes, which is not limited in the embodiments of the present disclosure.
  • circuit layout design is to map the circuit schematic or circuit description language to the physical description level, so that the designed circuit can be mapped to the wafer for production.
  • the circuit layout usually contains relevant physical information such as device type, device size, relative position between devices, and connection relationship between each device of the integrated circuit.
  • circuit schematic diagram after the above circuit schematic diagram is designed, its corresponding circuit layout can be generated based on the circuit schematic diagram.
  • the target node's target position in the circuit layout corresponding to the circuit schematic diagram is determined based on the position of the target node in the circuit schematic diagram.
  • layout design rules corresponding to each target node can be obtained in advance.
  • the layout design rules can include design parameters such as device size, relative positions between devices, and connection relationships between devices.
  • the design parameters of the device arranged at the target position satisfy the layout design rules corresponding to the target node.
  • the relative position spacing between devices arranged at the target location is less than the minimum spacing specified in the layout design rules corresponding to the target node, it can be determined that the design parameters of the devices arranged at the target location do not satisfy the layout design rules corresponding to the target node.
  • the layout design rules corresponding to the target node can also be modified based on the layout design rules corresponding to the target node.
  • the design parameters of the device enable the design parameters of the device arranged at the target position to meet the layout design rules corresponding to the target node, thereby improving the accuracy of the layout design.
  • the design rule checking method determines the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram; obtains the layout design rule corresponding to the target node, and checks the circuit Whether the design parameters of the device arranged at the target position in the layout meet the layout design rules can cope with some special needs in the layout design, thereby effectively improving the performance and yield of the semiconductor device.
  • corresponding marks can also be added to each node in the circuit schematic diagram in advance.
  • voltage marks can be added to each node, such as ultra-high voltage marks, high voltage marks, low voltage marks, etc.
  • the above-mentioned node design rules may be codes written according to circuit principles. This code will traverse the marks in the circuit schematic diagram and check the correctness of the position of each mark.
  • Mark 1 Indicates ultra-high voltage and is positive voltage
  • Mark 2 Indicates high voltage and is positive voltage
  • Mark 3 Indicates low voltage and is negative voltage.
  • the node design rules include: a node cannot add two positive voltage marks or two negative voltage marks at the same time; a node can add a positive voltage mark and a negative voltage mark at the same time.
  • FIG. 2 is a schematic diagram of two circuit schematic diagrams provided in embodiments of the present disclosure.
  • both the circuit schematic diagram (a) and the circuit schematic diagram (b) shown in FIG. 2 include multiple MOS transistors.
  • circuit schematic diagram (a) since node Q has both markers 2 and 3 added, it can be determined that the node Q in the circuit schematic diagram (a) does not meet the above node design rules; while the circuit schematic diagram (b) ) has both markers 3 and 1 added to the node Q, then it can be determined that each node in the circuit schematic diagram (b) satisfies the above node design rules.
  • the mark corresponding to the node is modified according to the node design rules, and the mark corresponding to each node is rechecked to see whether it satisfies the above node design rules until each node Until the corresponding markers meet the above node design rules.
  • the location of the target node in the circuit can be determined based on the position of the mark corresponding to the target node in the circuit schematic diagram. location in the schematic.
  • the position of the high-voltage node in the circuit schematic diagram can be determined based on the position of "Mark 2" in the circuit schematic diagram.
  • the design rule checking method adds corresponding marks to each node in the circuit schematic diagram, and checks whether the marks corresponding to each node satisfy the preset node design rules. When there is a mark that does not satisfy the node design rules, When a node is selected, the mark corresponding to the node is modified according to the node design rules, thereby ensuring that the marks added to each node meet the node design rules, and the target can be accurately determined based on the position of the mark corresponding to the target node in the circuit schematic diagram.
  • the location of a node in a circuit schematic is
  • the LVS tool can also be used to perform a consistency check on the above circuit schematic diagram and circuit layout.
  • the LVS (Layout Versus Schematics) tool is a tool used to verify whether the circuit layout and circuit schematic are consistent.
  • the error types that LVS can verify can be roughly divided into two categories: inconsistent points and mismatched devices.
  • the inconsistencies can be divided into node inconsistencies and device inconsistencies.
  • Node inconsistency means that there is a node in the circuit layout and the circuit schematic diagram.
  • the devices connected to the two nodes are similar, but not exactly the same.
  • Device inconsistency means that there is a device in the circuit layout and the circuit schematic.
  • the two devices are the same and the nodes connected are very similar, but not exactly the same.
  • mismatched devices refer to all devices that are present in the circuit schematic diagram but not in the circuit layout, or are present in the circuit layout but not in the circuit schematic diagram.
  • LVS can also verify the substrate type of the device (such as NMOS and PMOS in CMOS circuits) and some device parameters, which are not limited in the embodiments of the present disclosure.
  • the above-mentioned circuit layout when the above-mentioned circuit schematic diagram and circuit layout fail the consistency check of the LVS tool, the above-mentioned circuit layout can be modified according to the circuit schematic diagram, and the LVS tool can be reused to check the circuit schematic diagram and the modified The circuit layout is checked for consistency until the above-mentioned circuit schematic diagram and circuit layout pass the consistency check of the LVS tool.
  • the LVS tool can be used to determine the position of the target node in the circuit layout based on the position of the target node in the circuit schematic diagram. target location.
  • the design rule checking method provided by the embodiment of the present disclosure, after generating the corresponding circuit layout based on the above-mentioned circuit schematic diagram, uses the LVS tool to perform a consistency check on the above-mentioned circuit schematic diagram and circuit layout, which can ensure that the above-mentioned circuit schematic diagram is consistent with the above-mentioned circuit schematic diagram.
  • the consistency of the circuit layout, and then based on the position of the target node in the circuit schematic diagram, the target position of the target node in the circuit layout can be accurately determined.
  • the above target node is a high voltage node, and the high voltage node is equipped with a semiconductor device at a target position in the circuit layout.
  • the above-mentioned high-voltage node is a node whose operating voltage is close to the power supply voltage or higher than the power supply voltage.
  • the layout design rules can include the device width and device area of the above-mentioned semiconductor devices, as well as the different components of the above-mentioned semiconductor devices.
  • the distance, inclusion relationship, extension relationship, etc. between semiconductor structures are not limited in the embodiments of the present disclosure.
  • the layout design rules corresponding to the high-voltage nodes are more stringent than the layout design rules corresponding to the general nodes.
  • FIG. 3 is a circuit layout of a semiconductor device provided in an embodiment of the present disclosure.
  • Figure 3 is a circuit layout of a MOS device.
  • the MOS device includes an N+ doped region, a gate (GATE), a contact structure 1 and a contact structure 2, where the contact structure 1 and the contact structure 2 are to form the source and drain.
  • GATE gate
  • contact structure 1 and the contact structure 2 are to form the source and drain.
  • the minimum value of d1 that conforms to the layout design rules is 0.024 length units
  • the minimum value of d2 that conforms to the layout design rules is 0.027 length units.
  • the minimum values of d1 and d2 that comply with the layout design rules are both 0.04 length units.
  • d1 and d2 are the distances between the edge of the contact structure and the edge of the adjacent N+ doped region.
  • the distance between the gate and the contact structure 1 and the contact structure 2 is the same, but under high voltage conditions, the distance between the gate and the contact structure 1 needs to be greater than the distance from the contact structure 2.
  • the layout design rules corresponding to the high-voltage node after obtaining the layout design rules corresponding to the high-voltage node, it is checked whether the design parameters of the semiconductor devices arranged at the above-mentioned target positions in the circuit layout satisfy the layout design rules corresponding to the high-voltage node; if not, then according to the above The layout design rules corresponding to the high-voltage nodes modify the design parameters of the above-mentioned semiconductor devices in the circuit layout; if satisfied, the above-mentioned circuit layout can be output.
  • the design rule checking method provided by the embodiment of the present disclosure can better cope with the design of high-voltage nodes in layout design by using the layout design rules corresponding to high-voltage nodes to check the design parameters of devices arranged at target positions in the circuit layout. demand, thereby improving the performance and yield of semiconductor devices.
  • FIG. 4 is a schematic step flow diagram of another design rule checking method provided in an embodiment of the present disclosure.
  • the above design rule checking method includes:
  • a voltage mark can be added to each node, such as an ultra-high voltage mark, a high voltage mark, a low voltage mark, etc.
  • the above-mentioned nodes represent the mutual connection relationships between several component pins or several wires. All component pins and wires connected to the node, regardless of the number, are conductive.
  • preset node design rules are obtained, and based on the node design rules, it is checked whether the marks corresponding to each node are correct.
  • the above-mentioned node design rule may be a check code written according to the circuit principle.
  • the check code will traverse the marks in the circuit schematic diagram and check the correctness of the position of each mark.
  • the above node design rules may include: a node cannot add two positive voltage marks or two negative voltage marks at the same time; a node can add a positive voltage mark and a negative voltage mark at the same time, etc.
  • the LVS tool can be used to check the consistency of the above-mentioned circuit schematic diagram and circuit layout.
  • the above-mentioned circuit layout can be modified according to the circuit schematic diagram, and the LVS tool can be reused to check the consistency of the circuit schematic diagram and the modified circuit layout until When the above circuit schematic diagram and circuit layout pass the consistency check of the LVS tool, continue to execute S404.
  • the position of the target node in the circuit schematic diagram can be determined based on the position of the mark corresponding to the target node in the circuit schematic diagram.
  • the above circuit schematic diagram may have one target node or multiple target nodes, which is not limited in the embodiments of the present disclosure.
  • S405. Determine the target position of the target node in the circuit layout according to the position of the target node in the circuit schematic diagram.
  • the LVS tool can be used to determine the target position of the target node in the circuit layout based on the position of the target node in the circuit schematic diagram.
  • the position of the mark corresponding to the target node in the circuit schematic diagram can be first determined, and then the LVS tool is used to determine the target position corresponding to the position in the circuit layout.
  • the layout design rules corresponding to the target node can be obtained, and it is checked whether the design parameters of the devices arranged at the target position in the circuit layout meet the above layout design rules; if the design parameters of the devices arranged at the target position are satisfied If the above layout design rules are met, the above circuit layout will be output; if the design parameters of the devices laid out at the above target positions do not meet the above layout design rules, then the design parameters of the devices laid out at the above target positions in the circuit layout will be modified according to the above layout design rules. Finally, recheck whether the design parameters of the device placed at the target location are correct.
  • the target node may be a high-voltage node, and the high-voltage node is a node with an operating voltage close to or higher than the power supply voltage.
  • the layout design rules may include the device width and device area of the above-mentioned semiconductor device, as well as the distance, inclusion relationship and extension relationship between different semiconductor structures in the above-mentioned semiconductor device, etc., which are not limited in the embodiments of the present disclosure.
  • the layout design rules corresponding to the high-voltage nodes are more stringent than the layout design rules corresponding to the nodes.
  • node design rules can be used to ensure that the positions of all marks added in the circuit schematic diagram are correct.
  • the layout design engineer will design according to the corresponding marks and different layout design rules.
  • Circuit layout After the circuit layout is designed, use LVS to find the corresponding position in the circuit layout based on the position of the mark added in the circuit schematic diagram, and check whether the layout design at that position complies with the layout design rules.
  • the design rule checking method can accurately determine the location of the target node in the circuit schematic diagram based on the position of the mark corresponding to the target node in the circuit schematic diagram by adding marks to each node in the circuit schematic diagram. at the same time, use the LVS tool to check the consistency of the above-mentioned circuit schematic diagram and circuit layout, which can ensure the consistency between the above-mentioned circuit schematic diagram and the above-mentioned circuit layout, and then according to the position of the target node in the circuit schematic diagram, you can Accurately determine the target position of the target node in the circuit layout; use the layout design rules corresponding to the target node to check the design parameters of the devices placed at the target position in the circuit layout, which can better deal with the special nodes in the layout design. design requirements, thereby improving the performance and yield of semiconductor devices.
  • FIG. 5 is a schematic diagram of a program module of a design rule checking device provided in an embodiment of the present disclosure.
  • the design rule checking device includes:
  • the determination module 501 is used to determine the position of the target node in the circuit schematic diagram.
  • the nodes in the circuit schematic diagram are the connection points between the devices in the circuit schematic diagram.
  • the positioning module 502 is configured to determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram.
  • the first checking module 503 is used to obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target position in the circuit layout satisfy the layout design rules.
  • the above design rule checking device further includes a marking module and a second checking module.
  • the marking module is used to:
  • the second inspection module is used for:
  • the determining module 501 is specifically used to:
  • the position of the target node in the circuit schematic diagram is determined according to the position of the mark corresponding to the target node in the circuit schematic diagram.
  • the above-mentioned design rule checking device further includes a third checking module, used for:
  • circuit schematic diagram and the circuit layout pass the consistency check, continue to perform the step of determining the position of the target node in the circuit schematic diagram according to the position of the target node in the circuit schematic diagram. target location in the circuit layout.
  • the positioning module 502 is used to:
  • the LVS tool is used to determine the target position of the target node in the circuit layout according to the position of the target node in the circuit schematic diagram.
  • the target node is a high-voltage node, and the high-voltage node is equipped with a semiconductor device at a target position in the circuit layout;
  • the first inspection module 503 is also specifically used for:
  • the layout design rules corresponding to the high-voltage node include the value range of at least one of the following design parameters of the semiconductor device: device width, device area, and the The distance, inclusion relationship and extension relationship between different semiconductor structures in semiconductor devices.
  • the first inspection module 503 is specifically used to:
  • the circuit layout is output.
  • the design rule checking device determines the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram; obtains the layout design rule corresponding to the target node, and checks the circuit Whether the design parameters of the device arranged at the target position in the layout meet the layout design rules can cope with some special needs in the layout design, thereby effectively improving the performance and yield of the semiconductor device.
  • embodiments of the present disclosure also provide an electronic device, which includes at least one processor and a memory; wherein the memory stores computer execution instructions; the at least one processor The computer execution instructions stored in the memory are executed to implement each step in the design rule checking method as described in the above embodiment, which will not be described again in this embodiment.
  • FIG. 6 is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present disclosure.
  • the electronic device 60 of this embodiment includes: a processor 601 and a memory 602; wherein:
  • Memory 602 used to store computer execution instructions
  • the processor 601 is configured to execute computer execution instructions stored in the memory to implement various steps in the design rule checking method described in the above embodiments. For details, please refer to the relevant descriptions in the foregoing method embodiments.
  • the memory 602 can be independent or integrated with the processor 601 .
  • the device When the memory 602 is provided independently, the device also includes a bus 603 for connecting the memory 602 and the processor 601 .
  • embodiments of the present disclosure also provide a computer-readable storage medium, which stores computer-executable instructions.
  • the processor executes the computer-executed instructions, Instructions are issued to implement each step in the design rule checking method as described in the above embodiment, which will not be described again in this embodiment.
  • embodiments of the present disclosure also provide a computer program product, including a computer program.
  • the computer program When the computer program is executed by a processor, the design rules as described in the above embodiments are implemented. Each step in the inspection method will not be described again in this embodiment.
  • the disclosed devices and methods can be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of modules is only a logical function division. In actual implementation, there may be other division methods, for example, multiple modules may be combined or integrated. to another system, or some features can be ignored, or not implemented.
  • the coupling or direct coupling or communication connection between each other shown or discussed may be through some interfaces, indirect coupling or communication connection of devices or modules, and may be in electrical, mechanical or other forms.
  • modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place, or they may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • each functional module in various embodiments of the present disclosure can be integrated into a processing unit, or each module can exist physically alone, or two or more modules can be integrated into one unit.
  • the units integrated by the above modules can be implemented in the form of hardware or in the form of hardware plus software functional units.
  • the above integrated modules implemented in the form of software function modules can be stored in a computer-readable storage medium.
  • the above-mentioned software function modules are stored in a storage medium and include a number of instructions to cause a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor (English: processor) to execute the various embodiments of the present disclosure. Some steps of the method.
  • processor may be a central processing unit (English: Central Processing Unit, referred to as: CPU), or other general-purpose processor, digital signal processor (English: Digital Signal Processor, referred to as: DSP), or an application-specific integrated circuit (English: Application Specific Integrated Circuit, abbreviation: ASIC), etc.
  • a general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc. The steps of the method disclosed in conjunction with the present disclosure can be directly embodied as executed by a hardware processor, or executed by a combination of hardware and software modules in the processor.
  • the memory may include high-speed RAM memory, and may also include non-volatile storage NVM, such as at least one disk memory, which may also be a USB flash drive, a mobile hard disk, a read-only memory, a magnetic disk, or an optical disk.
  • NVM non-volatile storage
  • the bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc.
  • ISA Industry Standard Architecture
  • PCI Peripheral Component Interconnect
  • EISA Extended Industry Standard Architecture
  • the bus can be divided into address bus, data bus, control bus, etc.
  • the bus in the drawings of this disclosure is not limited to only one bus or one type of bus.
  • the above storage medium can be implemented by any type of volatile or non-volatile storage device or their combination, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable Except programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.
  • SRAM static random access memory
  • EEPROM electrically erasable programmable read-only memory
  • EPROM erasable except programmable read-only memory
  • PROM programmable read-only memory
  • ROM read-only memory
  • magnetic memory flash memory
  • flash memory magnetic disk or optical disk.
  • Storage media can be any available media that can be accessed by a general purpose or special purpose computer.
  • An exemplary storage medium is coupled to the processor such that the processor can read information from the storage medium and write information to the storage medium.
  • the storage medium can also be an integral part of the processor.
  • the processor and storage medium can be located in Application Specific Integrated Circuits (ASICs for short).
  • ASICs Application Specific Integrated Circuits
  • the processor and the storage medium can also exist as discrete components in the electronic device or the main control device.
  • the aforementioned program can be stored in a computer-readable storage medium.
  • the steps including the above-mentioned method embodiments are executed; and the aforementioned storage media include: ROM, RAM, magnetic disks, optical disks and other media that can store program codes.

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Abstract

A design rule check method and device, relating to the technical field of semiconductors. The method comprises: determining the position of a target node in a circuit schematic diagram; according to the position of the target node in the circuit schematic diagram, determining a target position of the target node in a circuit layout corresponding to the circuit schematic diagram; and obtaining a layout design rule corresponding to the target node, and checking whether design parameters of a device arranged at the target position in the circuit layout satisfy the layout design rule. The method can effectively improve the performance and yield of a semiconductor device.

Description

设计规则检查方法及设备Design rule checking methods and equipment
本公开要求于2022年04月24日提交中国专利局、申请号为202210434358.X、申请名称为“设计规则检查方法及设备”的中国专利申请的优先权,其全部内容通过引用结合在本公开中。This disclosure claims priority to the Chinese patent application filed with the China Patent Office on April 24, 2022, with application number 202210434358. middle.
技术领域Technical field
本公开实施例涉及半导体技术领域,尤其涉及一种设计规则检查方法及设备。Embodiments of the present disclosure relate to the field of semiconductor technology, and in particular, to a design rule checking method and device.
背景技术Background technique
目前,一般的芯片设计都会采用签核(sign off)流程,即设计完成时,通过设计规则检查(design rule check,简称DRC),来检查当前设计是否违反设计规则。At present, general chip design uses a sign-off process, that is, when the design is completed, a design rule check (DRC) is used to check whether the current design violates the design rules.
然而,为了提高半导体器件的性能和良率,版图设计会有一些特殊的要求,例如电路中会出现有高压节点,这些高压节点在版图设计时会有特殊的规则要求,因此亟需提供一种新的设计规则检查方法,来应对版图设计中的一些特殊需求,进而提高半导体器件的性能和良率。However, in order to improve the performance and yield of semiconductor devices, layout design will have some special requirements. For example, there will be high-voltage nodes in the circuit. These high-voltage nodes will have special rule requirements during layout design. Therefore, there is an urgent need to provide a new Design rule checking method to deal with some special needs in layout design, thereby improving the performance and yield of semiconductor devices.
发明内容Contents of the invention
本公开实施例提供了一种设计规则检查方法及设备,可以提高半导体器件的性能和良率。Embodiments of the present disclosure provide a design rule checking method and device, which can improve the performance and yield of semiconductor devices.
第一方面,本公开实施例提供了一种设计规则检查方法,该方法包括:In a first aspect, embodiments of the present disclosure provide a design rule checking method, which method includes:
确定电路原理图中目标节点的位置,所述电路原理图中的节点为所述电路原理图中各器件之间的连接点;Determine the position of the target node in the circuit schematic diagram, where the nodes in the circuit schematic diagram are the connection points between the devices in the circuit schematic diagram;
根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置;Determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram;
获取所述目标节点对应的版图设计规则,并检查所述电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则。Obtain the layout design rule corresponding to the target node, and check whether the design parameters of the device arranged at the target position in the circuit layout satisfy the layout design rule.
第二方面,本公开实施例提供了一种设计规则检查装置,该装置包括:In a second aspect, embodiments of the present disclosure provide a design rule checking device, which includes:
确定模块,用于确定电路原理图中目标节点的位置,所述电路原理图中的节点为所述电路原理图中各器件之间的连接点;A determination module, used to determine the position of the target node in the circuit schematic diagram, where the nodes in the circuit schematic diagram are the connection points between the devices in the circuit schematic diagram;
定位模块,用于根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置;A positioning module, configured to determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram;
第一检查模块,用于获取所述目标节点对应的版图设计规则,并检查所述电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则。The first checking module is used to obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target position in the circuit layout satisfy the layout design rules.
第三方面,本公开实施例提供了一种电子设备,包括:至少一个处理器和存储器;In a third aspect, embodiments of the present disclosure provide an electronic device, including: at least one processor and a memory;
所述存储器存储计算机执行指令;The memory stores computer execution instructions;
所述至少一个处理器执行所述存储器存储的计算机执行指令,使得所述至少一个处理器执行如第一方面提供的设计规则检查方法。The at least one processor executes the computer execution instructions stored in the memory, so that the at least one processor executes the design rule checking method provided in the first aspect.
第四方面,本公开实施例提供了一种计算机可读存储介质,该计算机可读存储介质中存储有计算机执行指令,当处理器执行所述计算机执行指令时,实现如第一方面提供的设计规则检查方法。In a fourth aspect, embodiments of the present disclosure provide a computer-readable storage medium that stores computer-executable instructions. When a processor executes the computer-executable instructions, the design provided in the first aspect is implemented. Rule checking method.
第五方面,本公开实施例提供了一种计算机程序产品,包括计算机程序,该计算机程序被处理器执行时,实现如第一方面提供的设计规则检查方法。In a fifth aspect, an embodiment of the present disclosure provides a computer program product, including a computer program. When the computer program is executed by a processor, the design rule checking method as provided in the first aspect is implemented.
本公开实施例提供的设计规则检查方法及设备,通过确定电路原理图中目标节点的位置,根据目标节点在电路原理图中的位置,确定目标节点在电路原理图对应的电路版图中的目标位置;获取目标节点对应的版图设计规则,并检查电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则,可以应对版图设计中的一些特殊需求,从而有效提高半导体器件的性能和良率。The design rule checking method and device provided by the embodiments of the present disclosure determine the position of the target node in the circuit schematic diagram and determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram based on the position of the target node in the circuit schematic diagram. ; Obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target position in the circuit layout meet the layout design rules, which can cope with some special needs in layout design, thereby effectively improving the performance of semiconductor devices performance and yield.
附图说明Description of the drawings
图1为本公开实施例中提供的一种设计规则检查方法的步骤流程示意图;Figure 1 is a schematic flowchart of steps of a design rule checking method provided in an embodiment of the present disclosure;
图2为本公开实施例中提供的两种电路原理图标记示意图;Figure 2 is a schematic diagram of two circuit schematic diagrams provided in embodiments of the present disclosure;
图3为本公开实施例中提供的一种半导体器件的电路版图;Figure 3 is a circuit layout of a semiconductor device provided in an embodiment of the present disclosure;
图4为本公开实施例中提供的另一种设计规则检查方法的步骤流程示意图;Figure 4 is a schematic flowchart of steps of another design rule checking method provided in an embodiment of the present disclosure;
图5为本公开实施例中提供的一种设计规则检查装置的程序模块示意图;Figure 5 is a schematic diagram of a program module of a design rule checking device provided in an embodiment of the present disclosure;
图6为本公开实施例提供的一种电子设备的硬件结构示意图。FIG. 6 is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present disclosure.
具体实施方式Detailed ways
为使本公开实施例的目的、技术方案和优点更加清楚,下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。此外,虽然本公开中公开内容按照示范性一个或几个实例来介绍,但应理解,可以就这些公开内容的各个方面也可以单独构成一个完整实施方式。In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments These are some embodiments of the present disclosure, but not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this disclosure. In addition, although the disclosure in this disclosure is introduced in terms of one or several exemplary examples, it should be understood that each aspect of the disclosure may also individually constitute a complete embodiment.
需要说明的是,本公开中对于术语的简要说明,仅是为了方便理解接下来描述的实施方式,而不是意图限定本公开的实施方式。除非另有说明,这些术语应当按照其普通和通常的含义理解。It should be noted that the brief description of terms in this disclosure is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of the disclosure. Unless otherwise stated, these terms should be understood according to their ordinary and usual meaning.
本公开中说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似或同类的对象或实体,而不必然意味着限定特定的顺序或先后次序,除非另外注明。应该理解这样使用的用语在适当情况下可以互换,例如能够根据本公开实施例图示或描述中给出那些以外的顺序实施。The terms "first", "second", etc. in the description and claims of this disclosure and the above-mentioned drawings are used to distinguish similar or similar objects or entities, and do not necessarily mean to limit a specific order or sequence. Unless otherwise noted. It is to be understood that the terms so used are interchangeable under appropriate circumstances and, for example, the embodiments of the present disclosure can be implemented in an order other than that illustrated or described.
此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖但不排他的包含,例如,包含了一系列组件的产品或设备不必限于清楚地列出的那些组件,而是可包括没有清楚地列出的或对于这些产品或设备固有的其它组件。In addition, the terms "including" and "having" and any variations thereof are intended to cover but not exclusively include, for example, a product or device that includes a range of components need not be limited to those components explicitly listed, but may include There are other components not expressly listed or inherent to these products or devices.
本公开实施例中使用的术语“模块”,是指任何已知或后来开发的硬件、软件、固件、人工智能、模糊逻辑或硬件或/和软件代码的组合,能够执行与该元件相关的功能。The term "module" as used in embodiments of the present disclosure refers to any known or later developed hardware, software, firmware, artificial intelligence, fuzzy logic or combination of hardware or/and software code capable of performing the functions associated with that element .
本公开实施例可以应用于半导体领域,例如可以应用于半导体版图设计环节中。The embodiments of the present disclosure can be applied in the semiconductor field, for example, in the semiconductor layout design process.
在半导体领域中,一般的芯片设计都会采用签核(sign off)流程,即芯片设计完成后,会通过设计规则检查(design rule check,简称DRC),来检查当前的设计是否违反设计规则。In the semiconductor field, general chip design uses a sign-off process. That is, after the chip design is completed, it will go through a design rule check (DRC) to check whether the current design violates the design rules.
普通的版图设计通过LVS和一般的DRC,即可保证设计的电路图和版图一致,从而保证半导体器件的功能可以正常实现。然而,为了提高半导体器件的性能和良率,版图设计会有一些特殊的要求,例如电路中会出现有高压节点,这些高压节点在版图设计时会有特殊的规则要求,因此亟需提供一种新的设计规则检查方法,来应对版图设计中的一些特殊需求,进而提高半导体器件的性能和良率。Ordinary layout design through LVS and general DRC can ensure that the designed circuit diagram and layout are consistent, thereby ensuring that the functions of the semiconductor device can be realized normally. However, in order to improve the performance and yield of semiconductor devices, layout design will have some special requirements. For example, there will be high-voltage nodes in the circuit. These high-voltage nodes will have special rule requirements during layout design. Therefore, there is an urgent need to provide a new Design rule checking method to deal with some special needs in layout design, thereby improving the performance and yield of semiconductor devices.
面对上述技术问题,本公开实施例提供了一种设计规则检查方法,根据目标节点在电路原理图中的位置,确定目标节点在电路原理图对应的电路版图中的目标位置;获取目标节点对应的版图设计规则,并检查电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则,由此可以对应对版图设计中的一些特殊需求,确保版图设计的准确性,提高半导体器件的性能和良率。Faced with the above technical problems, embodiments of the present disclosure provide a design rule checking method, which determines the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram; obtains the target node corresponding layout design rules, and check whether the design parameters of the devices laid out at the target positions in the circuit layout meet the layout design rules. This can respond to some special needs in layout design, ensure the accuracy of layout design, and improve Semiconductor device performance and yield.
参照图1,图1为本公开实施例中提供的一种设计规则检查方法的步骤流程示意图。在本公开一些实施例中,上述设计规则检查方法包括:Referring to FIG. 1 , FIG. 1 is a schematic flow chart of a design rule checking method provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, the above design rule checking method includes:
S101、确定电路原理图中目标节点的位置。S101. Determine the position of the target node in the circuit schematic diagram.
其中,上述电路原理图也可以称之为电子电路图或电路图,它是用约定的符号绘制的一种表示电路结构的图形,可以反映电子产品中各元器件的电气连接情况和工作原理,通常应用于设计、分析电路中。在分析电路时,通过识别电路原理图上所绘制的各种电路元件符号,以及它们之间的连接方式,就可以了解电路的工作原理。Among them, the above-mentioned circuit schematic diagram can also be called an electronic circuit diagram or circuit diagram. It is a diagram drawn with agreed symbols to represent the circuit structure. It can reflect the electrical connection and working principle of each component in the electronic product. It is usually applied In designing and analyzing circuits. When analyzing a circuit, you can understand the working principle of the circuit by identifying the various circuit component symbols drawn on the circuit schematic diagram and the connections between them.
在一些实施例中,电路原理图可以由元件符号、连线、节点等组成。元件符号表示实际电路中的元器件,它的形状与实际的元件不一定相似,甚至完全不一样,但是它一般都表示出了元器件的特点,而且引脚的数目都和实际元件保持一致。连线表示的是实际电路中的导线,在原理图中虽然是一根线,但在常用的芯片或印刷电路板中往往不是线而是各种形状的金属导线。节点表示几个元器件引脚或几条导线之间相互的连接关系。所有和节点相连的元器件引脚、导线,不论数目多少,都是导通的。In some embodiments, the circuit schematic diagram may be composed of component symbols, connections, nodes, etc. The component symbol represents the component in the actual circuit. Its shape is not necessarily similar to the actual component, or even completely different, but it generally indicates the characteristics of the component, and the number of pins is consistent with the actual component. The connection represents the wire in the actual circuit. Although it is a wire in the schematic diagram, in commonly used chips or printed circuit boards, it is often not a wire but a metal wire of various shapes. Nodes represent the mutual connection relationships between several component pins or several wires. All component pins and wires connected to the node, regardless of the number, are conductive.
在一种可行的实施方式中,在进行设计规则检查时,先确定电路原理图中需要进行设计规则检查的各个目标节点的位置。可选的,上述电路原理图中可以具有一个目标节点,也可以具有多个目标节点,本公开实施例中不做限制。In a feasible implementation manner, when performing the design rule check, the positions of each target node in the circuit schematic diagram that need to be checked by the design rule are first determined. Optionally, the above circuit schematic diagram may have one target node or multiple target nodes, which is not limited in the embodiments of the present disclosure.
S102、根据目标节点在电路原理图中的位置,确定目标节点在电路原理图对应的电路版图中的目标位置。S102. According to the position of the target node in the circuit schematic diagram, determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram.
其中,上述电路版图也可以称之为集成电路版图,电路版图设计是将电路原理图或电路描述语言映射到物理描述层面,从而可以将设计好的电路映射到晶圆上生产。Among them, the above-mentioned circuit layout can also be called an integrated circuit layout. Circuit layout design is to map the circuit schematic or circuit description language to the physical description level, so that the designed circuit can be mapped to the wafer for production.
其中,电路版图中通常包含集成电路的器件类型、器件尺寸、器件之间的相对位置以及各个器件之间的连接关系等相关物理信息。Among them, the circuit layout usually contains relevant physical information such as device type, device size, relative position between devices, and connection relationship between each device of the integrated circuit.
在本公开一些实施例中,在上述电路原理图设计完成之后,可以基于该电路原理图生成其对应的电路版图。In some embodiments of the present disclosure, after the above circuit schematic diagram is designed, its corresponding circuit layout can be generated based on the circuit schematic diagram.
当确定上述电路原理图中目标节点的位置之后,基于目标节点在上述电路原理图中的位置,确定出目标节点在上述电路原理图对应的电路版图中的目标位置。After determining the position of the target node in the circuit schematic diagram, the target node's target position in the circuit layout corresponding to the circuit schematic diagram is determined based on the position of the target node in the circuit schematic diagram.
S103、获取目标节点对应的版图设计规则,并检查电路版图中目标位置处布设的器件的设计参数是否满足所述版图设计规则。S103. Obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target positions in the circuit layout meet the layout design rules.
在本公开一些实施例中,可以预先获取各个目标节点对应的版图设计规则,该版图设计规则可以包括如器件尺寸、器件之间的相对位置以及各个器件之间的连接关系等设计参数。In some embodiments of the present disclosure, layout design rules corresponding to each target node can be obtained in advance. The layout design rules can include design parameters such as device size, relative positions between devices, and connection relationships between devices.
在确定出目标节点在电路版图中的目标位置之后,即可检查该目标位置处布设的器件的设计参数是否满足目标节点对应的版图设计规则。After determining the target position of the target node in the circuit layout, it can be checked whether the design parameters of the device arranged at the target position satisfy the layout design rules corresponding to the target node.
例如,当目标位置处布设的器件之间相对位置的间距小于目标节点对应的版图设计规则中规定的最小间距时,可以确定目标位置处布设的器件的设计参数不满足目标节点对应的版图设计规则。For example, when the relative position spacing between devices arranged at the target location is less than the minimum spacing specified in the layout design rules corresponding to the target node, it can be determined that the design parameters of the devices arranged at the target location do not satisfy the layout design rules corresponding to the target node. .
在本公开一些实施例中,当检查出上述目标位置处布设的器件的设计参数不满足目标节点对应的版图设计规则时,还可以基于目标节点对应的版图设计规则,修改上述目标位置处布设的器件的设计参数,使得上述目标位置处布设的器件的设计参数能够满足目标节点对应的版图设计规则, 由此来提高版图设计的准确性。In some embodiments of the present disclosure, when it is checked that the design parameters of the device arranged at the target position do not meet the layout design rules corresponding to the target node, the layout design rules corresponding to the target node can also be modified based on the layout design rules corresponding to the target node. The design parameters of the device enable the design parameters of the device arranged at the target position to meet the layout design rules corresponding to the target node, thereby improving the accuracy of the layout design.
本公开实施例提供的设计规则检查方法,根据目标节点在电路原理图中的位置,确定目标节点在电路原理图对应的电路版图中的目标位置;获取目标节点对应的版图设计规则,并检查电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则,由此可以对应对版图设计中的一些特殊需求,从而有效提高半导体器件的性能和良率。The design rule checking method provided by the embodiment of the present disclosure determines the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram; obtains the layout design rule corresponding to the target node, and checks the circuit Whether the design parameters of the device arranged at the target position in the layout meet the layout design rules can cope with some special needs in the layout design, thereby effectively improving the performance and yield of the semiconductor device.
基于上述实施例中所描述的内容,在本公开一些实施例中,还可以预先在电路原理图中的各个节点添加对应的标记。例如,可以根据电路原理图中的各节点的电压特性,在各个节点添加电压标记,如超高压标记、高压标记、低压标记等。Based on the content described in the above embodiments, in some embodiments of the present disclosure, corresponding marks can also be added to each node in the circuit schematic diagram in advance. For example, according to the voltage characteristics of each node in the circuit schematic diagram, voltage marks can be added to each node, such as ultra-high voltage marks, high voltage marks, low voltage marks, etc.
在本公开一些实施例中,在电路原理图中的各个节点添加对应的标记之后,还可以检查各个节点对应的标记是否满足预设的节点设计规则,即检查各个节点添加的标记是否正确。In some embodiments of the present disclosure, after adding corresponding marks to each node in the circuit schematic diagram, you can also check whether the marks corresponding to each node satisfy the preset node design rules, that is, check whether the marks added to each node are correct.
在本公开一些实施例中,上述节点设计规则可以是根据电路原理编写出来的代码,这个代码会遍历电路原理图中的标记,并检查每个标记的位置的正确性。In some embodiments of the present disclosure, the above-mentioned node design rules may be codes written according to circuit principles. This code will traverse the marks in the circuit schematic diagram and check the correctness of the position of each mark.
假设电路原理图中可以添加以下三种标记:Assume that the following three markers can be added to the circuit schematic:
标记1:表示超高电压,且为正电压;标记2:表示高电压,且为正电压;标记3:表示低电压,且为负电压。Mark 1: Indicates ultra-high voltage and is positive voltage; Mark 2: Indicates high voltage and is positive voltage; Mark 3: Indicates low voltage and is negative voltage.
且假设节点设计规则包括:一个节点不能同时添加两个正电压标记或者同时添加两个负电压标记;一个节点可以同时添加一个正电压标记和一个负电压标记。And it is assumed that the node design rules include: a node cannot add two positive voltage marks or two negative voltage marks at the same time; a node can add a positive voltage mark and a negative voltage mark at the same time.
参照图2,图2为本公开实施例中提供的两种电路原理图标记示意图。Referring to FIG. 2 , FIG. 2 is a schematic diagram of two circuit schematic diagrams provided in embodiments of the present disclosure.
示例性的,图2中所示的电路原理图(a)与电路原理图(b)中均包括多个MOS管。For example, both the circuit schematic diagram (a) and the circuit schematic diagram (b) shown in FIG. 2 include multiple MOS transistors.
其中,在电路原理图(a)中,由于节点Q同时添加了标记2和标记3,因此,可以确定电路原理图(a)中的节点Q不满足上述节点设计规则;而电路原理图(b)中的节点Q同时添加了标记3和标记1,则可以确定电路原理图(b)中的各节点均满足上述节点设计规则。Among them, in the circuit schematic diagram (a), since node Q has both markers 2 and 3 added, it can be determined that the node Q in the circuit schematic diagram (a) does not meet the above node design rules; while the circuit schematic diagram (b) ) has both markers 3 and 1 added to the node Q, then it can be determined that each node in the circuit schematic diagram (b) satisfies the above node design rules.
在本公开一些实施例中,当存在标记不满足节点设计规则的节点时, 根据节点设计规则,修改该节点对应的标记,并重新检查各个节点对应的标记是否满足上述节点设计规则,直至各个节点对应的标记均满足上述节点设计规则为止。In some embodiments of the present disclosure, when there is a node whose mark does not meet the node design rules, the mark corresponding to the node is modified according to the node design rules, and the mark corresponding to each node is rechecked to see whether it satisfies the above node design rules until each node Until the corresponding markers meet the above node design rules.
在本公开一些实施例中,在确定电路原理图中的各个节点上添加的标记均满足节点设计规则时,即可根据目标节点对应的标记在电路原理图中的位置,确定出目标节点在电路原理图中的位置。In some embodiments of the present disclosure, when it is determined that the marks added to each node in the circuit schematic diagram meet the node design rules, the location of the target node in the circuit can be determined based on the position of the mark corresponding to the target node in the circuit schematic diagram. location in the schematic.
例如,可以根据“标记2”在电路原理图中的位置,确定出高电压节点在电路原理图中的位置。For example, the position of the high-voltage node in the circuit schematic diagram can be determined based on the position of "Mark 2" in the circuit schematic diagram.
本公开实施例提供的设计规则检查方法,通过在电路原理图中的各个节点添加对应的标记,并检查各个节点对应的标记是否满足预设的节点设计规则,当存在标记不满足节点设计规则的节点时,根据节点设计规则,修改该节点对应的标记,从而能够确保各个节点添加的标记均满足节点设计规则,进而可以根据目标节点对应的标记在电路原理图中的位置,准确的确定出目标节点在电路原理图中的位置。The design rule checking method provided by the embodiment of the present disclosure adds corresponding marks to each node in the circuit schematic diagram, and checks whether the marks corresponding to each node satisfy the preset node design rules. When there is a mark that does not satisfy the node design rules, When a node is selected, the mark corresponding to the node is modified according to the node design rules, thereby ensuring that the marks added to each node meet the node design rules, and the target can be accurately determined based on the position of the mark corresponding to the target node in the circuit schematic diagram. The location of a node in a circuit schematic.
基于上述实施例中所描述的内容,在本公开一些实施例中,在基于上述电路原理图生成对应的电路版图之后,还可以利用LVS工具,对上述电路原理图和电路版图进行一致性检查。Based on what is described in the above embodiments, in some embodiments of the present disclosure, after generating the corresponding circuit layout based on the above circuit schematic diagram, the LVS tool can also be used to perform a consistency check on the above circuit schematic diagram and circuit layout.
其中,LVS(Layout Versus Schematics)工具是一种用来验证电路版图和电路原理图是否一致的一种工具。Among them, the LVS (Layout Versus Schematics) tool is a tool used to verify whether the circuit layout and circuit schematic are consistent.
其中,LVS可以验证的错误类型大体可以分为两类:不一致的点和失配器件。其中,不一致的点可分为节点不一致和器件不一致。节点不一致是指电路版图和电路原理图中各有一节点,这两个节点所连器件的情况相似,但是又不完全相同。器件不一致是指电路版图和电路原理图中各有一器件,这两个器件相同,所连接的节点情况很相似,但又不完全相同。其中,失配器件是指所有的器件在电路原理图中有而在电路版图中没有,或在电路版图中有而在电路原理图中没有。Among them, the error types that LVS can verify can be roughly divided into two categories: inconsistent points and mismatched devices. Among them, the inconsistencies can be divided into node inconsistencies and device inconsistencies. Node inconsistency means that there is a node in the circuit layout and the circuit schematic diagram. The devices connected to the two nodes are similar, but not exactly the same. Device inconsistency means that there is a device in the circuit layout and the circuit schematic. The two devices are the same and the nodes connected are very similar, but not exactly the same. Among them, mismatched devices refer to all devices that are present in the circuit schematic diagram but not in the circuit layout, or are present in the circuit layout but not in the circuit schematic diagram.
另外,LVS也还可以验证器件的衬底类型(例如CMOS电路中的NMOS和PMOS)和一些器件参数,本公开实施例中不做限制。In addition, LVS can also verify the substrate type of the device (such as NMOS and PMOS in CMOS circuits) and some device parameters, which are not limited in the embodiments of the present disclosure.
在本公开一些实施例中,当上述电路原理图和电路版图未通过LVS工具的一致性检查时,可以根据电路原理图修改上述电路版图,并重新利用 LVS工具,对电路原理图和修改后的电路版图进行一致性检查,直至上述电路原理图和电路版图通过LVS工具的一致性检查。In some embodiments of the present disclosure, when the above-mentioned circuit schematic diagram and circuit layout fail the consistency check of the LVS tool, the above-mentioned circuit layout can be modified according to the circuit schematic diagram, and the LVS tool can be reused to check the circuit schematic diagram and the modified The circuit layout is checked for consistency until the above-mentioned circuit schematic diagram and circuit layout pass the consistency check of the LVS tool.
在本公开一些实施例中,在上述电路原理图和电路版图通过LVS工具的一致性检查之后,可以利用LVS工具,基于目标节点在电路原理图中的位置,确定出目标节点在电路版图中的目标位置。In some embodiments of the present disclosure, after the above-mentioned circuit schematic diagram and circuit layout pass the consistency check of the LVS tool, the LVS tool can be used to determine the position of the target node in the circuit layout based on the position of the target node in the circuit schematic diagram. target location.
本公开实施例提供的设计规则检查方法,在基于上述电路原理图生成对应的电路版图之后,通过利用LVS工具,对上述电路原理图和电路版图进行一致性检查,可以保障上述电路原理图与上述电路版图的一致性,进而根据目标节点在电路原理图中的位置,可以准确确定出目标节点在电路版图中的目标位置。The design rule checking method provided by the embodiment of the present disclosure, after generating the corresponding circuit layout based on the above-mentioned circuit schematic diagram, uses the LVS tool to perform a consistency check on the above-mentioned circuit schematic diagram and circuit layout, which can ensure that the above-mentioned circuit schematic diagram is consistent with the above-mentioned circuit schematic diagram. The consistency of the circuit layout, and then based on the position of the target node in the circuit schematic diagram, the target position of the target node in the circuit layout can be accurately determined.
基于上述实施例中所描述的内容,在本公开一些实施例中,假设上述目标节点为高压节点,且该高压节点在电路版图中的目标位置布设有半导体器件。Based on the content described in the above embodiments, in some embodiments of the present disclosure, it is assumed that the above target node is a high voltage node, and the high voltage node is equipped with a semiconductor device at a target position in the circuit layout.
其中,上述高压节点为工作电压接近电源电压或高于电源电压的节点。Wherein, the above-mentioned high-voltage node is a node whose operating voltage is close to the power supply voltage or higher than the power supply voltage.
在对上述目标位置处布设的器件的设计参数进行检查之前,可以预先获取高压节点对应的版图设计规则,该版图设计规则中可以包括上述半导体器件的器件宽度、器件面积,以及上述半导体器件中不同半导体结构之间的距离、包含关系与延伸关系等,本公开实施例中不做限制。Before checking the design parameters of the devices arranged at the above target positions, the layout design rules corresponding to the high-voltage nodes can be obtained in advance. The layout design rules can include the device width and device area of the above-mentioned semiconductor devices, as well as the different components of the above-mentioned semiconductor devices. The distance, inclusion relationship, extension relationship, etc. between semiconductor structures are not limited in the embodiments of the present disclosure.
在本公开一些实施例中,上述高压节点对应的版图设计规则相较于一般节点对应的版图设计规则更加严格。In some embodiments of the present disclosure, the layout design rules corresponding to the high-voltage nodes are more stringent than the layout design rules corresponding to the general nodes.
示例性的,参照图3,图3为本公开实施例中提供的一种半导体器件的电路版图。Illustratively, refer to FIG. 3 , which is a circuit layout of a semiconductor device provided in an embodiment of the present disclosure.
如图3所示,图3为一种MOS器件的电路版图,该MOS器件包括N+掺杂区、栅极(GATE)、接触结构1及接触结构2,其中,接触结构1与接触结构2用于形成源极与漏极。As shown in Figure 3, Figure 3 is a circuit layout of a MOS device. The MOS device includes an N+ doped region, a gate (GATE), a contact structure 1 and a contact structure 2, where the contact structure 1 and the contact structure 2 are to form the source and drain.
其中,正常情况下,d1符合版图设计规则的最小取值为0.024个长度单位,d2符合版图设计规则的最小取值为0.027个长度单位。而在高电压情况下,d1与d2符合版图设计规则的最小取值则均为0.04个长度单位。Among them, under normal circumstances, the minimum value of d1 that conforms to the layout design rules is 0.024 length units, and the minimum value of d2 that conforms to the layout design rules is 0.027 length units. In the case of high voltage, the minimum values of d1 and d2 that comply with the layout design rules are both 0.04 length units.
其中,d1与d2为接触结构的边缘与临近的N+掺杂区的边缘之间的间距。Among them, d1 and d2 are the distances between the edge of the contact structure and the edge of the adjacent N+ doped region.
另外,正常情况下,栅极距离接触结构1与接触结构2的距离相同,但是在高电压情况下,栅极距离接触结构1的距离需要大于与接触结构2的距离。In addition, under normal circumstances, the distance between the gate and the contact structure 1 and the contact structure 2 is the same, but under high voltage conditions, the distance between the gate and the contact structure 1 needs to be greater than the distance from the contact structure 2.
在本公开一些实施例中,在获取高压节点对应的版图设计规则之后,检查电路版图中上述目标位置布设的半导体器件的设计参数是否满足高压节点对应的版图设计规则;若不满足,则根据上述高压节点对应的版图设计规则修改电路版图中上述半导体器件的设计参数;若满足,则可以输出上述电路版图。In some embodiments of the present disclosure, after obtaining the layout design rules corresponding to the high-voltage node, it is checked whether the design parameters of the semiconductor devices arranged at the above-mentioned target positions in the circuit layout satisfy the layout design rules corresponding to the high-voltage node; if not, then according to the above The layout design rules corresponding to the high-voltage nodes modify the design parameters of the above-mentioned semiconductor devices in the circuit layout; if satisfied, the above-mentioned circuit layout can be output.
本公开实施例提供的设计规则检查方法,通过利用高压节点对应的版图设计规则,对电路版图中目标位置处布设的器件的设计参数进行检查,可以更好的应对版图设计中对于高压节点的设计需求,进而提高半导体器件的性能和良率。The design rule checking method provided by the embodiment of the present disclosure can better cope with the design of high-voltage nodes in layout design by using the layout design rules corresponding to high-voltage nodes to check the design parameters of devices arranged at target positions in the circuit layout. demand, thereby improving the performance and yield of semiconductor devices.
基于上述实施例中描述的内容,参照图4,图4为本公开实施例中提供的另一种设计规则检查方法的步骤流程示意图。在本公开一些实施例中,上述设计规则检查方法包括:Based on the contents described in the above embodiments, refer to FIG. 4 , which is a schematic step flow diagram of another design rule checking method provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, the above design rule checking method includes:
S401、在电路原理图中的各个节点添加对应的标记。S401. Add corresponding marks to each node in the circuit schematic diagram.
示例性的,可以根据电路原理图中的各节点的电压特性,在各个节点添加电压标记,如超高压标记、高压标记、低压标记等。For example, according to the voltage characteristics of each node in the circuit schematic diagram, a voltage mark can be added to each node, such as an ultra-high voltage mark, a high voltage mark, a low voltage mark, etc.
其中,上述节点表示几个元器件引脚或几条导线之间相互的连接关系。所有和节点相连的元器件引脚、导线,不论数目多少,都是导通的。Among them, the above-mentioned nodes represent the mutual connection relationships between several component pins or several wires. All component pins and wires connected to the node, regardless of the number, are conductive.
S402、检查各个标记的位置是否正确。S402. Check whether the position of each mark is correct.
在本公开一些实施例中,在电路原理图中的各个节点添加对应的标记之后,获取预设的节点设计规则,根据该节点设计规则,检查各个节点对应的标记是否正确。In some embodiments of the present disclosure, after adding corresponding marks to each node in the circuit schematic diagram, preset node design rules are obtained, and based on the node design rules, it is checked whether the marks corresponding to each node are correct.
当存在标记不正确的节点时,根据节点设计规则,修改该节点对应的标记,并重新检查各个节点对应的标记是否正确,直至各个节点对应的标记均满足上述节点设计规则时,继续执行S403。When there is a node with an incorrect mark, modify the mark corresponding to the node according to the node design rules, and recheck whether the mark corresponding to each node is correct, until the mark corresponding to each node satisfies the above node design rules, continue to execute S403.
在本公开一些实施例中,上述节点设计规则可以是根据电路原理编写的检查代码,该检查代码会遍历电路原理图中的标记,并检查每个标记的位置的正确性。In some embodiments of the present disclosure, the above-mentioned node design rule may be a check code written according to the circuit principle. The check code will traverse the marks in the circuit schematic diagram and check the correctness of the position of each mark.
示例性的,上述节点设计规则可以包括:一个节点不能同时添加两个正电压标记或者同时添加两个负电压标记;一个节点可以同时添加一个正电压标记和一个负电压标记等。For example, the above node design rules may include: a node cannot add two positive voltage marks or two negative voltage marks at the same time; a node can add a positive voltage mark and a negative voltage mark at the same time, etc.
S403、确定LVS检查是否报错。S403. Determine whether the LVS check reports an error.
在本公开一些实施例中,可以利用LVS工具,对上述电路原理图和电路版图进行一致性检查。当上述电路原理图和电路版图未通过LVS工具的一致性检查时,可以根据电路原理图修改上述电路版图,并重新利用LVS工具,对电路原理图和修改后的电路版图进行一致性检查,直至上述电路原理图和电路版图通过LVS工具的一致性检查时,继续执行S404。In some embodiments of the present disclosure, the LVS tool can be used to check the consistency of the above-mentioned circuit schematic diagram and circuit layout. When the above-mentioned circuit schematic diagram and circuit layout fail the consistency check of the LVS tool, the above-mentioned circuit layout can be modified according to the circuit schematic diagram, and the LVS tool can be reused to check the consistency of the circuit schematic diagram and the modified circuit layout until When the above circuit schematic diagram and circuit layout pass the consistency check of the LVS tool, continue to execute S404.
S404、确定目标节点在电路原理图中的位置。S404. Determine the position of the target node in the circuit schematic diagram.
在本公开一些实施例中,可以根据目标节点对应的标记在电路原理图中的位置,确定出目标节点在电路原理图中的位置。In some embodiments of the present disclosure, the position of the target node in the circuit schematic diagram can be determined based on the position of the mark corresponding to the target node in the circuit schematic diagram.
可选的,上述电路原理图中可以具有一个目标节点,也可以具有多个目标节点,本公开实施例中不做限制。Optionally, the above circuit schematic diagram may have one target node or multiple target nodes, which is not limited in the embodiments of the present disclosure.
S405、根据目标节点在电路原理图中的位置,确定出目标节点在电路版图中的目标位置。S405. Determine the target position of the target node in the circuit layout according to the position of the target node in the circuit schematic diagram.
在本公开一些实施例中,可以利用LVS工具,基于目标节点在电路原理图中的位置,确定出目标节点在电路版图中的目标位置。In some embodiments of the present disclosure, the LVS tool can be used to determine the target position of the target node in the circuit layout based on the position of the target node in the circuit schematic diagram.
在本公开一些实施例中,可以先确定目标节点对应的标记在电路原理图中的位置,然后利用LVS工具,确定该位置在电路版图中对应的目标位置。In some embodiments of the present disclosure, the position of the mark corresponding to the target node in the circuit schematic diagram can be first determined, and then the LVS tool is used to determine the target position corresponding to the position in the circuit layout.
S406、检查目标位置处布设的器件的设计参数是否正确。S406. Check whether the design parameters of the device arranged at the target position are correct.
在本公开一些实施例中,可以获取目标节点对应的版图设计规则,并检查电路版图中目标位置处布设的器件的设计参数是否满足上述版图设计规则;若上述目标位置处布设的器件的设计参数满足上述版图设计规则,则输出上述电路版图;若上述目标位置处布设的器件的设计参数不满足上述版图设计规则,则根据上述版图设计规则修改电路版图中上述目标位置处布设的器件的设计参数后,重新检查目标位置处布设的器件的设计参数是否正确。In some embodiments of the present disclosure, the layout design rules corresponding to the target node can be obtained, and it is checked whether the design parameters of the devices arranged at the target position in the circuit layout meet the above layout design rules; if the design parameters of the devices arranged at the target position are satisfied If the above layout design rules are met, the above circuit layout will be output; if the design parameters of the devices laid out at the above target positions do not meet the above layout design rules, then the design parameters of the devices laid out at the above target positions in the circuit layout will be modified according to the above layout design rules. Finally, recheck whether the design parameters of the device placed at the target location are correct.
在本公开一些实施例中,上述目标节点可以为高压节点,该高压节点 为工作电压接近电源电压或高于电源电压的节点。In some embodiments of the present disclosure, the target node may be a high-voltage node, and the high-voltage node is a node with an operating voltage close to or higher than the power supply voltage.
可选的,版图设计规则中可以包括上述半导体器件的器件宽度、器件面积,以及上述半导体器件中不同半导体结构之间的距离、包含关系与延伸关系等,本公开实施例中不做限制。Optionally, the layout design rules may include the device width and device area of the above-mentioned semiconductor device, as well as the distance, inclusion relationship and extension relationship between different semiconductor structures in the above-mentioned semiconductor device, etc., which are not limited in the embodiments of the present disclosure.
在本公开一些实施例中,上述高压节点对应的版图设计规则相较于节点对应的版图设计规则更加严格。In some embodiments of the present disclosure, the layout design rules corresponding to the high-voltage nodes are more stringent than the layout design rules corresponding to the nodes.
可以理解的是,在电路原理图中的各个节点添加对应的标记后,电路版图中并不会体现该标记,因此普通的DRC检查并不能保证版图的正确性。It is understandable that after adding corresponding marks to each node in the circuit schematic diagram, the marks will not be reflected in the circuit layout, so ordinary DRC checks cannot guarantee the correctness of the layout.
在本公开实施例中,利用节点设计规则,可以确保电路原理图中添加的所有标记的位置是正确的,版图设计工程师在版图设计时,会根据相应的标记,按照不同的版图设计规则去设计电路版图。在电路版图设计完之后,根据电路原理图中添加的标记的位置,利用LVS找到电路版图中相应的位置,并检查该位置的版图设计是否符合版图设计规则。In the embodiment of the present disclosure, node design rules can be used to ensure that the positions of all marks added in the circuit schematic diagram are correct. When designing the layout, the layout design engineer will design according to the corresponding marks and different layout design rules. Circuit layout. After the circuit layout is designed, use LVS to find the corresponding position in the circuit layout based on the position of the mark added in the circuit schematic diagram, and check whether the layout design at that position complies with the layout design rules.
本公开实施例提供的设计规则检查方法,通过在电路原理图中的各个节点添加标记的方式,可以根据目标节点对应的标记在电路原理图中的位置,准确的确定出目标节点在电路原理图中的位置;同时,利用LVS工具,对上述电路原理图和电路版图进行一致性检查,可以保障上述电路原理图与上述电路版图的一致性,进而根据目标节点在电路原理图中的位置,可以准确确定出目标节点在电路版图中的目标位置;利用目标节点对应的版图设计规则,对电路版图中目标位置处布设的器件的设计参数进行检查,可以更好的应对版图设计中对于特殊节点的设计需求,进而提高半导体器件的性能和良率。The design rule checking method provided by the embodiment of the present disclosure can accurately determine the location of the target node in the circuit schematic diagram based on the position of the mark corresponding to the target node in the circuit schematic diagram by adding marks to each node in the circuit schematic diagram. at the same time, use the LVS tool to check the consistency of the above-mentioned circuit schematic diagram and circuit layout, which can ensure the consistency between the above-mentioned circuit schematic diagram and the above-mentioned circuit layout, and then according to the position of the target node in the circuit schematic diagram, you can Accurately determine the target position of the target node in the circuit layout; use the layout design rules corresponding to the target node to check the design parameters of the devices placed at the target position in the circuit layout, which can better deal with the special nodes in the layout design. design requirements, thereby improving the performance and yield of semiconductor devices.
基于上述实施例中所描述的内容,本公开实施例中还提供一种设计规则检查装置。参照图5,图5为本公开实施例中提供的一种设计规则检查装置的程序模块示意图,该设计规则检查装置包括:Based on the contents described in the above embodiments, embodiments of the present disclosure also provide a design rule checking device. Referring to Figure 5, Figure 5 is a schematic diagram of a program module of a design rule checking device provided in an embodiment of the present disclosure. The design rule checking device includes:
确定模块501,用于确定电路原理图中目标节点的位置,所述电路原理图中的节点为所述电路原理图中各器件之间的连接点。The determination module 501 is used to determine the position of the target node in the circuit schematic diagram. The nodes in the circuit schematic diagram are the connection points between the devices in the circuit schematic diagram.
定位模块502,用于根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置。The positioning module 502 is configured to determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram.
第一检查模块503,用于获取所述目标节点对应的版图设计规则,并检查所述电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则。The first checking module 503 is used to obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target position in the circuit layout satisfy the layout design rules.
在本公开一些实施例中,上述设计规则检查装置还包括标记模块与第二检查模块。In some embodiments of the present disclosure, the above design rule checking device further includes a marking module and a second checking module.
所述标记模块用于:The marking module is used to:
在所述电路原理图中的各个节点添加对应的标记。Add corresponding labels to each node in the circuit schematic diagram.
所述第二检查模块用于:The second inspection module is used for:
检查所述各个节点对应的标记是否满足预设的节点设计规则;当存在标记不满足所述节点设计规则的第一节点时,根据所述节点设计规则,修改所述第一节点对应的标记,并重新检查所述各个节点对应的标记是否满足所述节点设计规则,直至所述各个节点对应的标记均满足所述节点设计规则。Check whether the mark corresponding to each node satisfies the preset node design rule; when there is a first node whose mark does not meet the node design rule, modify the mark corresponding to the first node according to the node design rule, And recheck whether the tags corresponding to each node satisfy the node design rules, until the tags corresponding to each node satisfy the node design rules.
在本公开一些实施例中,确定模块501具体用于:In some embodiments of the present disclosure, the determining module 501 is specifically used to:
根据所述目标节点对应的标记在所述电路原理图中的位置,确定所述目标节点在所述电路原理图中的位置。The position of the target node in the circuit schematic diagram is determined according to the position of the mark corresponding to the target node in the circuit schematic diagram.
在本公开一些实施例中,上述设计规则检查装置还包括第三检查模块,用于:In some embodiments of the present disclosure, the above-mentioned design rule checking device further includes a third checking module, used for:
利用LVS工具,对所述电路原理图和所述电路版图进行一致性检查;Use the LVS tool to check the consistency of the circuit schematic diagram and the circuit layout;
当所述电路原理图和所述电路版图未通过所述一致性检查时,根据所述电路原理图修改所述电路版图,并重新利用所述LVS工具,对所述电路原理图和所述电路版图进行一致性检查;When the circuit schematic diagram and the circuit layout fail the consistency check, modify the circuit layout according to the circuit schematic diagram, and reuse the LVS tool to check the circuit schematic diagram and the circuit Check the layout for consistency;
当所述电路原理图和所述电路版图通过所述一致性检查时,继续执行所述根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置。When the circuit schematic diagram and the circuit layout pass the consistency check, continue to perform the step of determining the position of the target node in the circuit schematic diagram according to the position of the target node in the circuit schematic diagram. target location in the circuit layout.
在本公开一些实施例中,定位模块502用于:In some embodiments of the present disclosure, the positioning module 502 is used to:
利用所述LVS工具,根据所述目标节点在所述电路原理图中的位置,确定出所述目标节点在所述电路版图中的目标位置。The LVS tool is used to determine the target position of the target node in the circuit layout according to the position of the target node in the circuit schematic diagram.
在本公开一些实施例中,所述目标节点为高压节点,所述高压节点在所述电路版图中的目标位置布设有半导体器件;In some embodiments of the present disclosure, the target node is a high-voltage node, and the high-voltage node is equipped with a semiconductor device at a target position in the circuit layout;
第一检查模块503具体还用于:The first inspection module 503 is also specifically used for:
获取所述高压节点对应的版图设计规则,所述高压节点对应的版图设计规则中包括所述半导体器件以下设计参数中的至少一种设计参数的取值范围:器件宽度、器件面积,以及所述半导体器件中不同半导体结构之间的距离、包含关系与延伸关系。Obtain the layout design rules corresponding to the high-voltage node. The layout design rules corresponding to the high-voltage node include the value range of at least one of the following design parameters of the semiconductor device: device width, device area, and the The distance, inclusion relationship and extension relationship between different semiconductor structures in semiconductor devices.
在本公开一些实施例中,第一检查模块503具体用于:In some embodiments of the present disclosure, the first inspection module 503 is specifically used to:
检查所述电路版图中所述半导体器件的设计参数是否满足所述高压节点对应的版图设计规则;Check whether the design parameters of the semiconductor device in the circuit layout meet the layout design rules corresponding to the high-voltage node;
当所述电路版图中所述半导体器件的设计参数不满足所述高压节点对应的版图设计规则时,根据所述高压节点对应的版图设计规则修改所述电路版图中所述半导体器件的设计参数;When the design parameters of the semiconductor device in the circuit layout do not meet the layout design rules corresponding to the high-voltage node, modify the design parameters of the semiconductor device in the circuit layout according to the layout design rules corresponding to the high-voltage node;
当所述电路版图中所述半导体器件的设计参数满足所述高压节点对应的版图设计规则时,输出所述电路版图。When the design parameters of the semiconductor device in the circuit layout satisfy the layout design rules corresponding to the high-voltage node, the circuit layout is output.
本公开实施例提供的设计规则检查装置,根据目标节点在电路原理图中的位置,确定目标节点在电路原理图对应的电路版图中的目标位置;获取目标节点对应的版图设计规则,并检查电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则,由此可以对应对版图设计中的一些特殊需求,从而有效提高半导体器件的性能和良率。The design rule checking device provided by the embodiment of the present disclosure determines the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram; obtains the layout design rule corresponding to the target node, and checks the circuit Whether the design parameters of the device arranged at the target position in the layout meet the layout design rules can cope with some special needs in the layout design, thereby effectively improving the performance and yield of the semiconductor device.
需要说明的是,本公开实施例中确定模块501、定位模块502及第一检查模块503具体执行的内容可以参阅图1至图4所示实施例中相关内容,此处不做赘述。It should be noted that, for the specific execution content of the determination module 501, the positioning module 502 and the first inspection module 503 in the embodiment of the present disclosure, please refer to the relevant content in the embodiment shown in Figures 1 to 4, and will not be described again here.
进一步的,基于上述实施例中所描述的内容,本公开实施例中还提供了一种电子设备,该电子设备包括至少一个处理器和存储器;其中,存储器存储计算机执行指令;上述至少一个处理器执行存储器存储的计算机执行指令,以实现如上述实施例中描述的设计规则检查方法中的各个步骤,本实施例此处不再赘述。Further, based on the content described in the above embodiments, embodiments of the present disclosure also provide an electronic device, which includes at least one processor and a memory; wherein the memory stores computer execution instructions; the at least one processor The computer execution instructions stored in the memory are executed to implement each step in the design rule checking method as described in the above embodiment, which will not be described again in this embodiment.
为了更好的理解本公开实施例,参照图6,图6为本公开实施例提供的一种电子设备的硬件结构示意图。In order to better understand the embodiment of the present disclosure, refer to FIG. 6 , which is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present disclosure.
如图6所示,本实施例的电子设备60包括:处理器601以及存储器602;其中:As shown in Figure 6, the electronic device 60 of this embodiment includes: a processor 601 and a memory 602; wherein:
存储器602,用于存储计算机执行指令; Memory 602, used to store computer execution instructions;
处理器601,用于执行存储器存储的计算机执行指令,以实现上述实施例中描述的设计规则检查方法中的各个步骤,具体可以参见前述方法实施例中的相关描述。The processor 601 is configured to execute computer execution instructions stored in the memory to implement various steps in the design rule checking method described in the above embodiments. For details, please refer to the relevant descriptions in the foregoing method embodiments.
可选地,存储器602既可以是独立的,也可以跟处理器601集成在一起。Optionally, the memory 602 can be independent or integrated with the processor 601 .
当存储器602独立设置时,该设备还包括总线603,用于连接所述存储器602和处理器601。When the memory 602 is provided independently, the device also includes a bus 603 for connecting the memory 602 and the processor 601 .
进一步的,基于上述实施例中所描述的内容,本公开实施例中还提供了一种计算机可读存储介质,该计算机可读存储介质中存储有计算机执行指令,当处理器执行所述计算机执行指令时,以实现如上述实施例中描述的设计规则检查方法中的各个步骤,本实施例此处不再赘述。Further, based on the content described in the above embodiments, embodiments of the present disclosure also provide a computer-readable storage medium, which stores computer-executable instructions. When the processor executes the computer-executed instructions, Instructions are issued to implement each step in the design rule checking method as described in the above embodiment, which will not be described again in this embodiment.
进一步的,基于上述实施例中所描述的内容,本公开实施例中还提供了一种计算机程序产品,包括计算机程序,该计算机程序被处理器执行时,实现如上述实施例中描述的设计规则检查方法中的各个步骤,本实施例此处不再赘述。Further, based on the content described in the above embodiments, embodiments of the present disclosure also provide a computer program product, including a computer program. When the computer program is executed by a processor, the design rules as described in the above embodiments are implemented. Each step in the inspection method will not be described again in this embodiment.
在本公开所提供的几个实施例中,应该理解到,所揭露的设备和方法,可以通过其它的方式实现。例如,以上所描述的设备实施例仅仅是示意性的,例如,所述模块的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个模块可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或模块的间接耦合或通信连接,可以是电性,机械或其它的形式。In the several embodiments provided in this disclosure, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of modules is only a logical function division. In actual implementation, there may be other division methods, for example, multiple modules may be combined or integrated. to another system, or some features can be ignored, or not implemented. On the other hand, the coupling or direct coupling or communication connection between each other shown or discussed may be through some interfaces, indirect coupling or communication connection of devices or modules, and may be in electrical, mechanical or other forms.
所述作为分离部件说明的模块可以是或者也可以不是物理上分开的,作为模块显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place, or they may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
另外,在本公开各个实施例中的各功能模块可以集成在一个处理单元中,也可以是各个模块单独物理存在,也可以两个或两个以上模块集成在一个单元中。上述模块集成的单元既可以采用硬件的形式实现,也可以采 用硬件加软件功能单元的形式实现。In addition, each functional module in various embodiments of the present disclosure can be integrated into a processing unit, or each module can exist physically alone, or two or more modules can be integrated into one unit. The units integrated by the above modules can be implemented in the form of hardware or in the form of hardware plus software functional units.
上述以软件功能模块的形式实现的集成的模块,可以存储在一个计算机可读取存储介质中。上述软件功能模块存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可以是个人计算机,服务器,或者网络设备等)或处理器(英文:processor)执行本公开各个实施例所述方法的部分步骤。The above integrated modules implemented in the form of software function modules can be stored in a computer-readable storage medium. The above-mentioned software function modules are stored in a storage medium and include a number of instructions to cause a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor (English: processor) to execute the various embodiments of the present disclosure. Some steps of the method.
应理解,上述处理器可以是中央处理单元(英文:Central Processing Unit,简称:CPU),还可以是其他通用处理器、数字信号处理器(英文:Digital Signal Processor,简称:DSP)、专用集成电路(英文:Application Specific Integrated Circuit,简称:ASIC)等。通用处理器可以是微处理器或者该处理器也可以是任何常规的处理器等。结合本公开所公开的方法的步骤可以直接体现为硬件处理器执行完成,或者用处理器中的硬件及软件模块组合执行完成。It should be understood that the above-mentioned processor may be a central processing unit (English: Central Processing Unit, referred to as: CPU), or other general-purpose processor, digital signal processor (English: Digital Signal Processor, referred to as: DSP), or an application-specific integrated circuit (English: Application Specific Integrated Circuit, abbreviation: ASIC), etc. A general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc. The steps of the method disclosed in conjunction with the present disclosure can be directly embodied as executed by a hardware processor, or executed by a combination of hardware and software modules in the processor.
存储器可能包含高速RAM存储器,也可能还包括非易失性存储NVM,例如至少一个磁盘存储器,还可以为U盘、移动硬盘、只读存储器、磁盘或光盘等。The memory may include high-speed RAM memory, and may also include non-volatile storage NVM, such as at least one disk memory, which may also be a USB flash drive, a mobile hard disk, a read-only memory, a magnetic disk, or an optical disk.
总线可以是工业标准体系结构(Industry Standard Architecture,ISA)总线、外部设备互连(Peripheral Component,PCI)总线或扩展工业标准体系结构(Extended Industry Standard Architecture,EISA)总线等。总线可以分为地址总线、数据总线、控制总线等。为便于表示,本公开附图中的总线并不限定仅有一根总线或一种类型的总线。The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into address bus, data bus, control bus, etc. For ease of presentation, the bus in the drawings of this disclosure is not limited to only one bus or one type of bus.
上述存储介质可以是由任何类型的易失性或非易失性存储设备或者它们的组合实现,如静态随机存取存储器(SRAM),电可擦除可编程只读存储器(EEPROM),可擦除可编程只读存储器(EPROM),可编程只读存储器(PROM),只读存储器(ROM),磁存储器,快闪存储器,磁盘或光盘。存储介质可以是通用或专用计算机能够存取的任何可用介质。The above storage medium can be implemented by any type of volatile or non-volatile storage device or their combination, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable Except programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. Storage media can be any available media that can be accessed by a general purpose or special purpose computer.
一种示例性的存储介质耦合至处理器,从而使处理器能够从该存储介质读取信息,且可向该存储介质写入信息。当然,存储介质也可以是处理器的组成部分。处理器和存储介质可以位于专用集成电路(Application Specific Integrated Circuits,简称:ASIC)中。当然,处理器和存储介质也可 以作为分立组件存在于电子设备或主控设备中。An exemplary storage medium is coupled to the processor such that the processor can read information from the storage medium and write information to the storage medium. Of course, the storage medium can also be an integral part of the processor. The processor and storage medium can be located in Application Specific Integrated Circuits (ASICs for short). Of course, the processor and the storage medium can also exist as discrete components in the electronic device or the main control device.
本领域普通技术人员可以理解:实现上述各方法实施例的全部或部分步骤可以通过程序指令相关的硬件来完成。前述的程序可以存储于一计算机可读取存储介质中。该程序在执行时,执行包括上述各方法实施例的步骤;而前述的存储介质包括:ROM、RAM、磁碟或者光盘等各种可以存储程序代码的介质。Persons of ordinary skill in the art can understand that all or part of the steps to implement the above method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, the steps including the above-mentioned method embodiments are executed; and the aforementioned storage media include: ROM, RAM, magnetic disks, optical disks and other media that can store program codes.
最后应说明的是:以上各实施例仅用以说明本公开的技术方案,而非对其限制;尽管参照前述各实施例对本公开进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本公开各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present disclosure, but not to limit it; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or substitutions do not deviate from the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present disclosure. scope.

Claims (17)

  1. 一种设计规则检查方法,所述方法包括:A design rule checking method, the method includes:
    确定电路原理图中目标节点的位置,所述电路原理图中的节点为所述电路原理图中各器件之间的连接点;Determine the position of the target node in the circuit schematic diagram, where the nodes in the circuit schematic diagram are the connection points between the devices in the circuit schematic diagram;
    根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置;Determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram;
    获取所述目标节点对应的版图设计规则,并检查所述电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则。Obtain the layout design rule corresponding to the target node, and check whether the design parameters of the device arranged at the target position in the circuit layout satisfy the layout design rule.
  2. 根据权利要求1所述的方法,其中,所述确定电路原理图中目标节点的位置之前,还包括:The method according to claim 1, wherein before determining the position of the target node in the circuit schematic diagram, it further includes:
    在所述电路原理图中的各个节点添加对应的标记;Add corresponding marks to each node in the circuit schematic diagram;
    检查所述各个节点对应的标记是否满足预设的节点设计规则;Check whether the tags corresponding to each node meet the preset node design rules;
    当存在标记不满足所述节点设计规则的第一节点时,根据所述节点设计规则,修改所述第一节点对应的标记,并重新检查所述各个节点对应的标记是否满足所述节点设计规则,直至所述各个节点对应的标记均满足所述节点设计规则。When there is a first node whose mark does not satisfy the node design rule, modify the mark corresponding to the first node according to the node design rule, and recheck whether the mark corresponding to each node satisfies the node design rule. , until the marks corresponding to each node satisfy the node design rules.
  3. 根据权利要求2所述的方法,其中,所述确定电路原理图中目标节点的位置,包括:The method according to claim 2, wherein determining the position of the target node in the circuit schematic diagram includes:
    根据所述目标节点对应的标记在所述电路原理图中的位置,确定所述目标节点在所述电路原理图中的位置。The position of the target node in the circuit schematic diagram is determined according to the position of the mark corresponding to the target node in the circuit schematic diagram.
  4. 根据权利要求2所述的方法,其中,所述根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置之前,还包括:The method according to claim 2, wherein before determining the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram, include:
    利用LVS工具,对所述电路原理图和所述电路版图进行一致性检查;Use the LVS tool to check the consistency of the circuit schematic diagram and the circuit layout;
    当所述电路原理图和所述电路版图未通过所述一致性检查时,根据所述电路原理图修改所述电路版图,并重新利用所述LVS工具,对所述电路原理图和所述电路版图进行一致性检查;When the circuit schematic diagram and the circuit layout fail the consistency check, modify the circuit layout according to the circuit schematic diagram, and reuse the LVS tool to check the circuit schematic diagram and the circuit Check the layout for consistency;
    当所述电路原理图和所述电路版图通过所述一致性检查时,继续执行所述根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置。When the circuit schematic diagram and the circuit layout pass the consistency check, continue to perform the step of determining the position of the target node in the circuit schematic diagram according to the position of the target node in the circuit schematic diagram. target location in the circuit layout.
  5. 根据权利要求4所述的方法,其中,所述根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置,包括:The method according to claim 4, wherein determining the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram includes:
    利用所述LVS工具,根据所述目标节点在所述电路原理图中的位置,确定出所述目标节点在所述电路版图中的目标位置。The LVS tool is used to determine the target position of the target node in the circuit layout according to the position of the target node in the circuit schematic diagram.
  6. 根据权利要求1至5任一项所述的方法,其中,所述目标节点为高压节点,所述高压节点在所述电路版图中的目标位置布设有半导体器件;The method according to any one of claims 1 to 5, wherein the target node is a high-voltage node, and the high-voltage node is equipped with a semiconductor device at a target position in the circuit layout;
    所述获取所述目标节点对应的版图设计规则,包括:The obtaining the layout design rules corresponding to the target node includes:
    获取所述高压节点对应的版图设计规则,所述高压节点对应的版图设计规则中包括所述半导体器件以下设计参数中的至少一种设计参数的取值范围:器件宽度、器件面积,以及所述半导体器件中不同半导体结构之间的距离、包含关系与延伸关系。Obtain the layout design rules corresponding to the high-voltage node. The layout design rules corresponding to the high-voltage node include the value range of at least one of the following design parameters of the semiconductor device: device width, device area, and the The distance, inclusion relationship and extension relationship between different semiconductor structures in semiconductor devices.
  7. 根据权利要求6所述的方法,其中,所述检查所述电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则,包括:The method according to claim 6, wherein the checking whether the design parameters of the devices arranged at the target position in the circuit layout satisfy the layout design rules includes:
    检查所述电路版图中所述半导体器件的设计参数是否满足所述高压节点对应的版图设计规则;Check whether the design parameters of the semiconductor device in the circuit layout meet the layout design rules corresponding to the high-voltage node;
    当所述电路版图中所述半导体器件的设计参数不满足所述高压节点对应的版图设计规则时,根据所述高压节点对应的版图设计规则修改所述电路版图中所述半导体器件的设计参数;When the design parameters of the semiconductor device in the circuit layout do not meet the layout design rules corresponding to the high-voltage node, modify the design parameters of the semiconductor device in the circuit layout according to the layout design rules corresponding to the high-voltage node;
    当所述电路版图中所述半导体器件的设计参数满足所述高压节点对应的版图设计规则时,输出所述电路版图。When the design parameters of the semiconductor device in the circuit layout satisfy the layout design rules corresponding to the high-voltage node, the circuit layout is output.
  8. 一种设计规则检查装置,所述装置包括:A design rule checking device, the device includes:
    确定模块,用于确定电路原理图中目标节点的位置,所述电路原理图中的节点为所述电路原理图中各器件之间的连接点;A determination module, used to determine the position of the target node in the circuit schematic diagram, where the nodes in the circuit schematic diagram are the connection points between the devices in the circuit schematic diagram;
    定位模块,用于根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置;A positioning module, configured to determine the target position of the target node in the circuit layout corresponding to the circuit schematic diagram according to the position of the target node in the circuit schematic diagram;
    第一检查模块,用于获取所述目标节点对应的版图设计规则,并检查所述电路版图中所述目标位置处布设的器件的设计参数是否满足所述版图设计规则。The first checking module is used to obtain the layout design rules corresponding to the target node, and check whether the design parameters of the devices arranged at the target position in the circuit layout satisfy the layout design rules.
  9. 根据权利要求8所述的装置,其中,还包括标记模块与第二检查模 块;所述标记模块用于:The device according to claim 8, further comprising a marking module and a second inspection module; the marking module is used for:
    在所述电路原理图中的各个节点添加对应的标记;Add corresponding marks to each node in the circuit schematic diagram;
    所述第二检查模块用于:The second inspection module is used for:
    检查所述各个节点对应的标记是否满足预设的节点设计规则;Check whether the tags corresponding to each node meet the preset node design rules;
    当存在标记不满足所述节点设计规则的第一节点时,根据所述节点设计规则,修改所述第一节点对应的标记,并重新检查所述各个节点对应的标记是否满足所述节点设计规则,直至所述各个节点对应的标记均满足所述节点设计规则。When there is a first node whose mark does not satisfy the node design rule, modify the mark corresponding to the first node according to the node design rule, and recheck whether the mark corresponding to each node satisfies the node design rule. , until the marks corresponding to each node satisfy the node design rules.
  10. 根据权利要求9所述的装置,其中,所述确定模块具体用于:The device according to claim 9, wherein the determining module is specifically configured to:
    根据所述目标节点对应的标记在所述电路原理图中的位置,确定所述目标节点在所述电路原理图中的位置。The position of the target node in the circuit schematic diagram is determined according to the position of the mark corresponding to the target node in the circuit schematic diagram.
  11. 根据权利要求9所述的装置,其中,还包括第三检查模块,用于:The device according to claim 9, further comprising a third inspection module for:
    利用LVS工具,对所述电路原理图和所述电路版图进行一致性检查;Use the LVS tool to check the consistency of the circuit schematic diagram and the circuit layout;
    当所述电路原理图和所述电路版图未通过所述一致性检查时,根据所述电路原理图修改所述电路版图,并重新利用所述LVS工具,对所述电路原理图和所述电路版图进行一致性检查;When the circuit schematic diagram and the circuit layout fail the consistency check, modify the circuit layout according to the circuit schematic diagram, and reuse the LVS tool to check the circuit schematic diagram and the circuit Check the layout for consistency;
    当所述电路原理图和所述电路版图通过所述一致性检查时,继续执行所述根据所述目标节点在所述电路原理图中的位置,确定所述目标节点在所述电路原理图对应的电路版图中的目标位置。When the circuit schematic diagram and the circuit layout pass the consistency check, continue to perform the step of determining the position of the target node in the circuit schematic diagram according to the position of the target node in the circuit schematic diagram. target location in the circuit layout.
  12. 根据权利要求11所述的装置,其中,所述定位模块用于:The device according to claim 11, wherein the positioning module is used for:
    利用所述LVS工具,根据所述目标节点在所述电路原理图中的位置,确定出所述目标节点在所述电路版图中的目标位置。The LVS tool is used to determine the target position of the target node in the circuit layout according to the position of the target node in the circuit schematic diagram.
  13. 根据权利要求8至12任一项所述的装置,其中,所述目标节点为高压节点,所述高压节点在所述电路版图中的目标位置布设有半导体器件;The device according to any one of claims 8 to 12, wherein the target node is a high-voltage node, and the high-voltage node is equipped with a semiconductor device at a target position in the circuit layout;
    所述第一检查模块具体还用于:The first inspection module is also specifically used for:
    获取所述高压节点对应的版图设计规则,所述高压节点对应的版图设计规则中包括所述半导体器件以下设计参数中的至少一种设计参数的取值范围:器件宽度、器件面积,以及所述半导体器件中不同半导体结构之间的距离、包含关系与延伸关系。Obtain the layout design rules corresponding to the high-voltage node. The layout design rules corresponding to the high-voltage node include the value range of at least one of the following design parameters of the semiconductor device: device width, device area, and the The distance, inclusion relationship and extension relationship between different semiconductor structures in semiconductor devices.
  14. 根据权利要求13所述的装置,其中,所述第一检查模块具体用于:The device according to claim 13, wherein the first inspection module is specifically used for:
    检查所述电路版图中所述半导体器件的设计参数是否满足所述高压节点对应的版图设计规则;Check whether the design parameters of the semiconductor device in the circuit layout meet the layout design rules corresponding to the high-voltage node;
    当所述电路版图中所述半导体器件的设计参数不满足所述高压节点对应的版图设计规则时,根据所述高压节点对应的版图设计规则修改所述电路版图中所述半导体器件的设计参数;When the design parameters of the semiconductor device in the circuit layout do not meet the layout design rules corresponding to the high-voltage node, modify the design parameters of the semiconductor device in the circuit layout according to the layout design rules corresponding to the high-voltage node;
    当所述电路版图中所述半导体器件的设计参数满足所述高压节点对应的版图设计规则时,输出所述电路版图。When the design parameters of the semiconductor device in the circuit layout satisfy the layout design rules corresponding to the high-voltage node, the circuit layout is output.
  15. 一种电子设备,包括:至少一个处理器和存储器;An electronic device including: at least one processor and memory;
    所述存储器存储计算机执行指令;The memory stores computer execution instructions;
    所述至少一个处理器执行所述存储器存储的计算机执行指令,使得所述至少一个处理器执行如权利要求1至7任一项所述的设计规则检查方法。The at least one processor executes the computer execution instructions stored in the memory, so that the at least one processor executes the design rule checking method according to any one of claims 1 to 7.
  16. 一种计算机可读存储介质,所述计算机可读存储介质中存储有计算机执行指令,当处理器执行所述计算机执行指令时,实现如权利要求1至7任一项所述的设计规则检查方法。A computer-readable storage medium in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the design rule checking method as described in any one of claims 1 to 7 is implemented. .
  17. 一种计算机程序产品,包括计算机程序,所述计算机程序被处理器执行时,实现权利要求1至7任一项所述的设计规则检查方法。A computer program product includes a computer program that, when executed by a processor, implements the design rule checking method described in any one of claims 1 to 7.
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