WO2023202429A1 - Garbage recycling method and electronic device - Google Patents

Abstract

A garbage recycling method and an electronic device, relating to the field of operating systems, and capable of reducing system resources occupied by the whole machine when an electronic device executes GC, and ensuring the fluency and stability of the system. The method comprises: an electronic device collects statistics about a compression ratio of heap area data of each process, then adopts different delay policies according to the compression ratio of the heap area data and a load condition of a CPU, and delays execution of GC.

Description

Garbage recycling methods and electronic equipment

This application claims priority to the Chinese patent application submitted to the State Intellectual Property Office on April 19, 2022, with application number 202210409365.4 and application name "Waste Recycling Method and Electronic Equipment", the entire content of which is incorporated into this application by reference. middle.

Technical field

This application relates to the field of operating systems, and in particular to garbage collection methods and electronic devices.

Background technique

Various applications (APPs) or services (services) written using Java language, for example, can be installed on electronic devices. Because of the cross-platform and openness of the Java language, in order to achieve compatibility on multiple platforms, electronic devices need to create a Java virtual machine (virtual machine, JVM) when running an APP written in the Java language. There is Java in the JVM. Garbage collection (GC) thread. When the heap memory used by the APP or service is insufficient, the JVM will start the GC thread to perform GC. During the execution of the GC thread, the GC thread scans the heap area data allocated by the JVM to determine whether the heap area data is referenced. Among them, a large amount of scanning work will occupy a large amount of CPU resources.

In addition, when the electronic device is in a low-memory scenario, the kernel will also compress the heap area data according to the least recently used (Least Recently Used, LRU). Then, for the compressed heap area data, the GC thread needs to decompress the compressed heap area data before it can determine whether the decompressed heap area data is referenced. When the GC thread decompresses, it also needs to apply for additional memory from the system to store the data during the decompression process. It is understandable that the system memory is already very tight at this time, and the behavior of applying for memory during decompression further aggravates the system memory tension. Moreover, the decompression behavior of the GC thread also prolongs the overall time-consuming of memory recycling and increases the cost of CPU resources. It can be seen that the existing GC process will affect the smoothness and stability of the system operation and easily cause the system to crash.

Contents of the invention

The garbage collection method and electronic equipment provided by this application can reduce the system resources (including memory resources and CPU resources) occupied by the electronic equipment when executing GC, which is beneficial to ensuring the smoothness and stability of the system.

In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:

In the first aspect, this application provides a method for garbage collection GC. The method includes: an electronic device runs an application APP; when the APP process requests to allocate the first memory, the electronic device detects that the heap memory expected to be occupied by the process is divided by the target utilization. Whether the value is equal to or greater than the first threshold, where the heap memory expected to be occupied by the process includes the heap memory occupied by the process and the first memory; when the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the first threshold , the electronic device detects whether the heap data compression ratio corresponding to the process is equal to or greater than the second threshold; when the heap data compression ratio corresponding to the process is equal to or greater than the second threshold, and the current CPU load of the electronic device is greater than the third threshold, the electronic device The device delays the process to perform garbage collection.

It is understandable that when the electronic device is in a low-memory scenario, the kernel of the electronic device will compress the heap area data according to a certain strategy (such as LRU). Then, when the electronic device performs GC, it may be necessary to decompress the compressed heap area data. The decompression process not only consumes the system's memory, aggravates the system memory tension, but also consumes the system's CPU resources. It can be seen that if in a scenario with high CPU load (that is, the current CPU of electronic equipment Executing GC when the load is greater than the third threshold) can easily affect the fluency and stability of the system, and may even cause the system to crash. To this end, the electronic device counts the compression ratio of the heap data of each process, and then uses different delay strategies to delay the execution of GC based on the compression ratio of the heap data and the load of the CPU, thus improving the fluency and stability of the system. , to avoid system crash problems.

In a possible implementation, when the heap area data compression ratio corresponding to the process is equal to or greater than the second threshold, and the current CPU load of the electronic device is greater than the third threshold, the electronic device delays the process to perform garbage collection, including: when the process When the corresponding heap area data compression ratio is equal to or greater than the second threshold, and the current CPU load of the electronic device is greater than the third threshold, the electronic device increases the first threshold.

It is understandable that raising the first threshold means raising the upper limit of heap memory used by this process. In some scenarios, after raising the first threshold, the value of the heap memory expected to be occupied by the process divided by the target utilization can be smaller than the raised first threshold, and then the allocation of the first memory can be completed. In this scenario, the electronic device reduces the number of times the electronic device performs lightweight GC by raising the first threshold.

In some other scenarios, after the first threshold is raised, the value of the heap memory expected to be occupied by this process divided by the target utilization may still be equal to or greater than the first threshold after the raise. For example, other tasks of this process may also apply for allocation of heap memory during this time period, causing the value of the heap memory expected to be occupied by this process divided by the target utilization to still be equal to or greater than the first threshold after the increase. Then, the first memory allocation cannot be completed, and lightweight GC still needs to be executed to reclaim more memory. It can be seen that in this scenario, the electronic device also delays the opportunity for the electronic device to execute lightweight GC by raising the first threshold, thereby avoiding executing lightweight GC when the current CPU load is too heavy, which is conducive to ensuring the smoothness and stability of the system. stability.

In a possible implementation, after the electronic device raises the first threshold, the method further includes: the electronic device detects whether the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the raised first threshold; When the value of the heap memory expected to be occupied by the electronic device detection process divided by the target utilization is equal to or greater than the raised first threshold, the electronic device performs a lightweight GC.

It is understandable that, compared to full-weight GC, electronic devices performing lightweight GC occupy less memory resources and CPU resources themselves. Since the electronic device does not scan all the heap area data when executing lightweight GC, the scanned compressed data is also less, and the additional memory resources and CPU resources occupied by the compression behavior of the electronic device will not be too much, which is beneficial to Ensure system fluency and stability.

In a possible implementation, after the electronic device performs the lightweight GC, the method further includes: the electronic device detects whether the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the first threshold after the increase. ; When the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the raised first threshold, the electronic device raises the first threshold again.

That is to say, after the electronic device performs lightweight GC, if the current memory situation of the electronic device still cannot meet the demand, that is, the value of the heap memory expected to be occupied by this process divided by the target utilization is still equal to or greater than the first threshold, then The electronic device raises the first threshold again. By raising the first threshold again, the number of times the electronic device performs full-scale GC is again reduced, or the opportunity for the electronic device to perform full-scale GC is extended.

In a possible implementation, after the electronic device raises the first threshold again, the method further includes: when the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the first threshold after being raised again, The electronic device again detects the heap data compression ratio corresponding to the process; the electronic device adopts different strategies based on the heap data compression ratio corresponding to the process and delays the execution of full-scale garbage collection GC.

That is to say, the embodiment of the present application proposes a method for detecting the compression ratio of heap area data, so that the GC thread of the electronic device core can sense the compression level of the heap area data (that is, the compression ratio of the heap area data), thereby facilitating the heap area data compression ratio according to the heap area data compression ratio. The compression level of area data enables efficient GC control. When the compression levels of heap area data are different, different strategies are adopted based on the current CPU load of the electronic device to reduce the number of times the electronic device performs GC (lightweight GC and full-weight GC) or delay the execution of GC (lightweight GC) by the electronic device. level GC and full-scale GC) to prevent electronic equipment from executing GC under high CPU load. Therefore, this application reduces the system resources (including memory resources and CPU resources) occupied by the electronic device when executing GC, which is beneficial to ensuring the smoothness and stability of the system.

In one possible implementation, the electronic device adopts different strategies according to the heap data compression ratio corresponding to the process to delay the execution of full-scale garbage collection GC, including: when the heap data compression ratio corresponding to the process is in the first interval , the electronic device performs full-scale GC to avoid the peak period of CPU load; when the heap data compression ratio corresponding to the process is in the second interval, the electronic device performs full-scale GC when the CPU is idle; when the heap data compression ratio corresponding to the process When the compression ratio is in the third range, the electronic device freezes the process, and after receiving the instruction to unfreeze the process, unfreezes the process and executes a full-scale GC.

In a possible implementation, after the electronic device raises the first threshold, the method further includes: when the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the raised first threshold, the electronic device The heap data compression ratio corresponding to the process is detected again; the electronic device adopts different strategies based on the heap data compression ratio corresponding to the process to delay the execution of full-scale garbage collection GC.

In one possible implementation, the electronic device adopts different strategies according to the heap data compression ratio corresponding to the process to delay the execution of full-scale garbage collection GC, including: when the heap data compression ratio corresponding to the process is in the first interval , the electronic device performs full-scale GC to avoid the peak period of CPU load; when the heap data compression ratio corresponding to the process is in the second interval, the electronic device performs full-scale GC when the CPU is idle; when the heap data compression ratio corresponding to the process When the compression ratio is in the third range, the electronic device freezes the process, and after receiving the instruction to unfreeze the process, unfreezes the process and executes a full-scale GC.

In a possible implementation manner, the method further includes: when the process applies for heap memory, the electronic device marks the heap memory applied for by the process.

In a possible implementation, the method further includes: when the electronic device compresses the heap data of the process, the electronic device records the data amount of the compressed heap data.

In one possible implementation, the heap area data compression ratio of a process is the ratio of the data amount of compressed heap area data in the process to the data amount of all heap area data in the process.

In a second aspect, an electronic device is provided, including: a processor, a memory and a touch screen. The memory, the touch screen are coupled to the processor. The memory is used to store computer program code. The computer program code includes a computer program. Instructions, when the processor reads the computer instructions from the memory, so that the electronic device executes the method described in the above aspect and any possible implementation manner thereof.

A third aspect is to provide a device, which is included in an electronic device and has the function of realizing the behavior of the electronic device in any of the above aspects and possible implementation methods. This function can be implemented by hardware, or it can be implemented by hardware executing corresponding software. The hardware or software includes at least one module or unit corresponding to the above functions. For example, a detection module or unit, a determination module or unit, a processing module or unit, etc.

In the fourth aspect, a computer-readable storage medium is provided, including computer instructions. When the computer instructions are stored in a computer When running on the sub-device, the electronic device is caused to perform the method described in the above aspect and any possible implementation manner.

In a fifth aspect, a computer program product is provided. When the computer program product is run on a computer, it causes the computer to execute the method described in the above aspects and any of the possible implementations.

A sixth aspect provides a chip system, including a processor. When the processor executes instructions, the processor executes the method described in the above aspects and any of the possible implementations.

The technical effects achieved by the electronic equipment provided by the second aspect, the device provided by the third aspect, the computer-readable storage medium provided by the fourth aspect, the computer program product provided by the fifth aspect, and the chip system provided by the sixth aspect , please refer to the technical effects described in the above first aspect and any possible implementation of the first aspect, which will not be described again here.

Description of the drawings

Figure 1 is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present application;

Figure 2 is a schematic diagram of the software structure of an electronic device provided by an embodiment of the present application;

Figure 3 is a schematic flowchart of an electronic device performing GC according to an embodiment of the present application;

Figure 4 is a schematic flowchart of another electronic device performing GC according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a chip system provided by an embodiment of the present application.

Detailed ways

In the description of the embodiments of this application, unless otherwise stated, "/" means or, for example, A/B can mean A or B; "and/or" in this article is just a linkage describing related objects. Relationship means that three relationships can exist. For example, A and/or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

Hereinafter, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

In the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concept in a concrete manner.

The embodiment of the present application provides a method of garbage collection GC, which can be applied to electronic devices installed with one or more APPs. Illustratively, the electronic device in the embodiment of the present application may be a mobile phone, a tablet computer, a personal computer (PC), a personal digital assistant (PDA), a smart watch, a netbook, a wearable electronic device, an enhanced Reality technology (augmented reality, AR) equipment, virtual reality (VR) equipment, vehicle-mounted equipment, smart screens, smart cars, smart speakers, robots, etc. This application does not place special restrictions on the specific forms of this electronic equipment.

FIG. 1 shows a schematic structural diagram of an electronic device 100 .

The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2 , mobile communication module 150, wireless communication module 160, audio module 170, Yang Speaker 170A, receiver 170B, microphone 170C, headphone interface 170D, sensor module 180, button 190, motor 191, indicator 192, camera 193, display screen 194, and subscriber identification module (subscriber identification module, SIM) card interface 195, etc. . The sensor module 180 may include a pressure sensor 180A, a gyro sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, and ambient light. Sensor 180L, bone conduction sensor 180M, etc.

It can be understood that the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on the electronic device 100 . In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figures, or some components may be combined, some components may be separated, or some components may be arranged differently. The components illustrated may be implemented in hardware, software, or a combination of software and hardware.

The processor 110 may include one or more processing units. For example, the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processing unit (GPU), and an image signal processor. (image signal processor, ISP), controller, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural network processor (neural-network processing unit, NPU), etc. Among them, different processing units can be independent devices or integrated in one or more processors.

The controller can generate operation control signals based on the instruction operation code and timing signals to complete the control of fetching and executing instructions.

The processor 110 may also be provided with a memory for storing instructions and data. In some embodiments, the memory in processor 110 is cache memory. This memory may hold instructions or data that have been recently used or recycled by processor 110 . If the processor 110 needs to use the instructions or data again, it can be called directly from the memory. Repeated access is avoided and the waiting time of the processor 110 is reduced, thus improving the efficiency of the system.

In some embodiments, processor 110 may include one or more interfaces. Interfaces may include integrated circuit (inter-integrated circuit, I2C) interface, integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, pulse code modulation (pulse code modulation, PCM) interface, universal asynchronous receiver and transmitter (universal asynchronous receiver/transmitter (UART) interface, mobile industry processor interface (MIPI), general-purpose input/output (GPIO) interface, subscriber identity module (SIM) interface, and /or universal serial bus (USB) interface, etc. It can be understood that the interface connection relationships between the modules illustrated in the embodiment of the present invention are only schematic illustrations and do not constitute a structural limitation of the electronic device 100 . In other embodiments of the present application, the electronic device 100 may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.

The charging management module 140 is used to receive charging input from the charger. Among them, the charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from the wired charger through the USB interface 130 . In some wireless charging embodiments, the charging management module 140 may receive wireless charging input through the wireless charging coil of the electronic device 100 . While the charging management module 140 charges the battery 142, it can also provide power to the electronic device through the power management module 141.

The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. Power management module 141 receives input from battery 142 and/or charge management module 140 for processor 110, internal memory 121, The display screen 194, the camera 193, the wireless communication module 160, etc. are powered. The power management module 141 can also be used to monitor battery capacity, battery cycle times, battery health status (leakage, impedance) and other parameters. In some other embodiments, the power management module 141 may also be provided in the processor 110 . In other embodiments, the power management module 141 and the charging management module 140 may also be provided in the same device.

The wireless communication function of the electronic device 100 can be implemented through the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor and the baseband processor.

Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 may be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example: Antenna 1 can be reused as a diversity antenna for a wireless LAN. In other embodiments, antennas may be used in conjunction with tuning switches.

The mobile communication module 150 can provide solutions for wireless communication including 2G/3G/4G/5G applied on the electronic device 100 . The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves through the antenna 1, perform filtering, amplification and other processing on the received electromagnetic waves, and transmit them to the modem processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves through the antenna 1 for radiation. In some embodiments, at least part of the functional modules of the mobile communication module 150 may be disposed in the processor 110 . In some embodiments, at least part of the functional modules of the mobile communication module 150 and at least part of the modules of the processor 110 may be provided in the same device.

A modem processor may include a modulator and a demodulator. Among them, the modulator is used to modulate the low-frequency baseband signal to be sent into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After the low-frequency baseband signal is processed by the baseband processor, it is passed to the application processor. The application processor outputs sound signals through audio devices (not limited to speaker 170A, receiver 170B, etc.), or displays images or videos through display screen 194. In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be independent of the processor 110 and may be provided in the same device as the mobile communication module 150 or other functional modules.

The wireless communication module 160 can provide applications on the electronic device 100 including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) network), Bluetooth (bluetooth, BT), and global navigation satellites. System (global navigation satellite system, GNSS), frequency modulation (frequency modulation, FM), near field communication technology (near field communication, NFC), infrared technology (infrared, IR) and other wireless communication solutions. The wireless communication module 160 may be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2 , frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 110 . The wireless communication module 160 can also receive the signal to be sent from the processor 110, frequency modulate it, amplify it, and convert it into electromagnetic waves through the antenna 2 for radiation.

The electronic device 100 implements display functions through a GPU, a display screen 194, an application processor, and the like. The GPU is an image processing microprocessor and is connected to the display screen 194 and the application processor. GPUs are used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or alter display information.

The display screen 194 is used to display images, videos, etc. Display 194 includes a display panel. The display panel can use a liquid crystal display (LCD), an organic light-emitting diode (organic light-emitting diode, OLED), active matrix organic light emitting diode or active matrix organic light emitting diode (active-matrix organic light emitting diode, AMOLED), flexible light-emitting diode (flex light-emitting diode, FLED), Miniled, MicroLed, Micro -oLed, quantum dot light emitting diodes (QLED), etc. In some embodiments, the electronic device 100 may include 1 or N display screens 194, where N is a positive integer greater than 1.

The electronic device 100 can implement the shooting function through an ISP, a camera 193, a video codec, a GPU, a display screen 194, an application processor, and the like.

The ISP is used to process the data fed back by the camera 193. Camera 193 is used to capture still images or video. Digital signal processors are used to process digital signals. In addition to digital image signals, they can also process other digital signals. For example, when the electronic device 100 selects a frequency point, the digital signal processor is used to perform Fourier transform on the frequency point energy. Video codecs are used to compress or decompress digital video. Electronic device 100 may support one or more video codecs. In this way, the electronic device 100 can play or record videos in multiple encoding formats, such as moving picture experts group (MPEG) 1, MPEG2, MPEG3, MPEG4, etc.

The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 through the external memory interface 120 to implement the data storage function. Such as saving music, videos, etc. files in external memory card.

Internal memory 121 may be used to store computer executable program code, which includes instructions. The internal memory 121 may include a program storage area and a data storage area. Among them, the stored program area can store an operating system, at least one application program required for a function (such as a sound playback function, an image playback function, etc.). The storage data area may store data created during use of the electronic device 100 (such as audio data, phone book, etc.). In addition, the internal memory 121 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc. The processor 110 executes various functional applications and data processing of the electronic device 100 by executing instructions stored in the internal memory 121 and/or instructions stored in a memory provided in the processor.

The electronic device 100 can implement audio functions through the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headphone interface 170D, and the application processor. Such as music playback, recording, etc.

The buttons 190 include a power button, a volume button, etc. Key 190 may be a mechanical key. It can also be a touch button. The electronic device 100 may receive key inputs and generate key signal inputs related to user settings and function control of the electronic device 100 .

The software system of the electronic device 100 may adopt a layered architecture, an event-driven architecture, a microkernel architecture, a microservice architecture, or a cloud architecture. For example, the software system of the electronic device 100 may be the Hongmeng system, Android system, etc. This embodiment of the present invention takes the Android system with a layered architecture as an example to illustrate the software structure of the electronic device 100 .

FIG. 2 is a software structure block diagram of the electronic device 100 according to the embodiment of the present invention.

The layered architecture divides the software into several layers, and each layer has clear roles and division of labor. The layers communicate through software interfaces. In some embodiments, the Android system is divided into five layers, from top to bottom: application layer (referred to as application layer), application framework layer (referred to as framework layer), Android Runtime (Android Runtime) and system library. Hardware Abstraction Layer (HAL) and kernel layer.

(1)Application layer

The application layer can include a series of application packages. As shown in Figure 2, the application package can include camera, gallery, calendar, calling, map, navigation, WLAN, Bluetooth, music, video, short message and other applications.

(2)Frame layer

The framework layer provides application programming interface (API) and programming framework for applications in the application layer. The framework layer includes some predefined functions.

As shown in Figure 2, the framework layer can include activity manager, window manager, content provider, view system, phone manager, resource manager, notification manager, etc.

Among them, the activity manager is responsible for the startup of all APP processes, the startup of the four major components of the APP (such as activity, service, broadcast receiver, content provider), the interface between APPs and within the APP. switching and the life cycle of various components. A window manager is used to manage window programs. The window manager can obtain the display size, determine whether there is a status bar, lock the screen, capture the screen, etc. Content providers are used to store and retrieve data and make this data accessible to applications. Said data can include videos, images, audio, calls made and received, browsing history and bookmarks, phone books, etc. The view system includes visual controls, such as controls that display text, controls that display pictures, etc. A view system can be used to build applications. The display interface can be composed of one or more views. For example, a display interface including a text message notification icon may include a view for displaying text and a view for displaying pictures. The phone manager is used to provide communication functions of the electronic device 100 . For example, call status management (including connected, hung up, etc.). The resource manager provides various resources to applications, such as localized strings, icons, pictures, layout files, video files, etc. The notification manager allows applications to display notification information in the status bar, which can be used to convey notification-type messages and can automatically disappear after a short stay without user interaction. For example, the notification manager is used to notify download completion, message reminders, etc. The notification manager can also be notifications that appear in the status bar at the top of the system in the form of charts or scroll bar text, such as notifications for applications running in the background, or notifications that appear on the screen in the form of conversation windows. For example, text information is prompted in the status bar, a beep sounds, the electronic device vibrates, the indicator light flashes, etc.

3. Android Runtime and system libraries

As shown in Figure 2, Android Runtime includes core libraries and virtual machines. Android Runtime is responsible for the scheduling and management of the Android system.

The core library contains two parts: one is the functional functions that need to be called by the Java language, and the other is the core library of Android.

The application layer and framework layer run in virtual machines. The virtual machine executes the java files of the application layer and framework layer into binary files. The virtual machine is used to perform object life cycle management, stack management, thread management, security and exception management, and garbage collection and other functions.

The electronic device 100 runs APP1 as an example for explanation. When the electronic device 100 runs APP1, one or more processes of APP1 will usually be started (such as process 1 corresponding to the interface of APP1, process 2 corresponding to the background service of APP1). Each process will correspond to a virtual machine, and each process will correspond to a virtual machine. Each process contains a GC thread. The GC thread is responsible for monitoring the usage of the virtual machine heap memory corresponding to this process, and determining whether to start the GC process based on the usage of the virtual machine heap memory corresponding to this process. It is understandable that in some scenarios, when the user switches APP1 to run in the background, the electronic device may still keep running processes corresponding to one or more background services of APP1. These processes continue to occupy the memory of the electronic device, and these processes It is still possible to continue to apply for new heap memory, etc.

Usually, when APP1 starts a process, it will set the upper limit of the heap memory usage of the process (recorded as threshold 1), which is the maximum heap memory threshold that this process can use. When the heap memory allocated by the kernel for the process divided by the heap memory target utilization is greater than or equal to the threshold 1, the process will start the GC thread to reclaim the heap memory of the process. It can be understood that there is an appropriate ratio between the heap memory that has been used (or occupied) after each GC and the maximum heap memory that this process can use (including the heap memory that has been used by this process and the free heap memory). (That is, the target utilization rate of heap memory, usually 0.75, which can be referred to as the target utilization rate), can reduce the number of GC as much as possible. The target heap memory utilization can be a default value, or it can be set uniformly by the operating system for all processes, or it can also be set by the operating system separately for different APPs or different processes. The embodiments of this application do not limit this. .

In some technical solutions, the GC performed by the GC thread can include lightweight GC (such as Background Young GC) and full-scale GC (Full GC). Among them, when scanning the heap area data, the lightweight GC only scans the data in the heap memory applied for by this process in the period from the last GC execution to before the GC is triggered this time (hereinafter referred to as the heap area data). Full-scale GC scans all heap area data requested by this process. As shown in Figure 3, it is a schematic diagram of an electronic device performing a GC process, which specifically includes:

301. Receive a memory allocation request from the process.

302. Determine whether the value of the heap memory expected to be occupied by this process divided by the target utilization (the value is represented by "heap memory expected to be occupied by this process/target utilization" in Figure 3) is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 303 is executed. If it is less than the threshold value 1, then step 314 is executed.

Every time a process applies to allocate memory, it will trigger a check of the heap memory occupied by the process. It should be noted that the heap memory expected to be occupied by this process in this step includes the heap memory actually occupied by this process and the heap memory requested by this process this time. In other words, at this time, judging whether the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1 is equivalent to judging whether the heap memory occupied by this process and the heap memory occupied by this process can be used by this process if the heap memory requested this time is allocated to the process. Whether the maximum heap memory (including the heap memory occupied by this process and the free heap memory) can still maintain the goal of not being higher than the target utilization. If it is higher than the target utilization, the lightweight GC is triggered, that is, step 303 is executed. If it is not higher than the target utilization, the memory can be allocated, that is, step 314 is performed.

303. Trigger lightweight GC.

The electronic device scans the heap memory newly requested by this process within a specific time period to determine whether the data in the heap memory has been referenced recently. Then the electronic device can use a strategy such as LRU to reclaim the heap memory that has been least recently referenced. Then, the free heap memory available to this process increases. The specific time period refers to the time period from the last time the electronic device executed GC (including lightweight GC and full-scale GC) to the time before the current execution of lightweight GC.

It is understandable that lightweight GC scans less heap area data and consumes less CPU resources.

304. Try to allocate memory.

305. Determine again whether the value of the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 306 is executed. If it is less than the threshold value 1, then step 314 is executed.

306. Increase threshold 1.

It is understandable that after executing lightweight GC, this process reclaims some heap memory. If this memory allocation request still cannot be completed at this time, increase the threshold to 1. It is understandable that raising the threshold by 1 means that the upper limit of heap memory used by this process has been raised, and then it is possible to complete this memory allocation request.

307. Try to allocate memory again.

308. Determine again whether the value of the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 309 is executed. If it is less than the threshold value 1, then step 314 is executed.

It should be noted that in some scenarios, there may be multiple tasks running in parallel in this process, and then multiple tasks may apply to allocate heap memory at the same time or one after another. Then when this task executes this memory allocation request, the upper limit of heap memory usage of this process is increased by raising the threshold 1, that is, the maximum heap memory, but other tasks may be allocated the required heap memory in advance (that is, this process The occupied heap memory increases), causing the heap memory expected to be occupied by this process at this time (the memory allocated by this task and the heap memory already occupied by this process) divided by the target utilization to still be higher than the threshold 1, still This memory allocation request for this task cannot be completed.

309. Trigger full-scale GC.

310. Lower the threshold 1.

It should be noted that the full-scale GC scans more data in the heap area, which releases more heap memory and increases the free heap memory. Therefore, after executing the full-scale GC, the electronic device can lower the threshold 1 in a timely manner. Ensure heap memory utilization.

311. Try to allocate memory again.

312. Determine again whether the value of the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 313 is executed. If it is less than the threshold value 1, then step 314 is executed.

313. Trigger the memory overflow (out of memory, OOM) mechanism.

When the OOM mechanism is triggered, the electronic device cleans up all processes that have applied for heap memory, and this process ends.

314. Allocate memory.

It can be seen that in this technical solution, the electronic device can reduce the number of GC executions and minimize the CPU resources occupied by GC executions by executing GCs of different magnitudes step by step and combining it with the method of raising the threshold 1. .

System libraries can include multiple functional modules. For example: surface manager (surface manager), media libraries (Media Libraries), 3D graphics processing libraries (for example: OpenGL ES), 2D graphics engines (for example: SGL), etc.

Among them, the surface manager is used to manage the display subsystem and provides the integration of 2D and 3D layers for multiple applications. The media library supports playback and recording of a variety of commonly used audio and video formats, as well as static image files, etc. The media library can support a variety of audio and video encoding formats, such as: MPEG4, H.264, MP3, AAC, AMR, JPG, PNG, etc. The 3D graphics processing library is used to implement 3D graphics drawing, image rendering, composition, and layer processing. 2D Graphics Engine is a drawing engine for 2D drawing.

(4)HAL

HAL, used to abstract hardware. HAL hides the hardware interface details of a specific platform and provides a virtual hardware platform for the operating system, making it hardware-independent and portable on multiple platforms. In other words, all hardware-related operations required by the upper layer require calling HAL-related APIs, such as audio and video interfaces, GPS interfaces, call interfaces, Wi-Fi interfaces, and other interfaces.

(5) Kernel layer

The kernel layer is the layer between hardware and software.

The kernel layer includes memory management modules, processes/threads, audio and video drivers, GPS drivers, display drivers, Wi-Fi drivers, etc. Among them, the memory management module is used to realize the allocation and recycling of system memory, compress heap area data, etc.

The technical solutions involved in the following embodiments can be implemented in electronic devices with the above hardware architecture and software architecture. Implemented in 100.

Considering that when the electronic device is in a low memory scenario (that is, the available memory of the electronic device is lower than the threshold 2), the kernel of the electronic device will compress the heap area data according to a certain strategy (such as LRU). Then, when the electronic device performs GC, it may be necessary to decompress the compressed heap area data. The decompression process not only consumes the system's memory, aggravates the system memory tension, but also consumes the system's CPU resources. It can be seen that if GC is executed under a high CPU load scenario, it is easy to affect the fluency and stability of the system, and may even cause the system to crash. To this end, embodiments of the present application provide a GC method. The electronic device counts the compression ratio of the heap area data of each process, and then uses different delay strategies to delay execution according to the compression ratio of the heap area data and the load of the CPU. GC, thereby improving the fluency and stability of the system and avoiding system crashes.

As shown in Figure 4, a schematic flow chart of a GC method is provided for an embodiment of the present application. The method includes:

401. The APP process requests to allocate the first memory.

For example, a certain task in the APP process requests to allocate the first memory. The first memory requested to be allocated can be the memory of the specified size for the task, or it can be the memory of the default size of the system. This application embodiment does not limit this. .

402. Determine whether the value of the heap memory expected to be occupied by this process divided by the target utilization (the value is represented by the heap memory expected to be occupied by this process/target utilization in Figure 4) is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 403 is executed. If it is less than the threshold value 1, then step 417 is executed.

Every time the APP process applies for memory allocation, it will trigger a check of the heap memory occupied by this process. It should be noted that the heap memory expected to be occupied by this process in this step includes the heap memory actually occupied by this process and the heap memory applied for this time. That is, the size of the heap memory expected to be occupied by this process = the size of the heap memory actually occupied by this process + the size of the first memory. In other words, at this time, judging whether the heap memory expected to be occupied by this process divided by the target utilization value is less than the threshold 1 is equivalent to judging whether the heap memory occupied by this process and the heap memory occupied by this process can be used by this process if the first memory requested this time is allocated to the process. Whether the proportion of the maximum heap memory (including the heap memory occupied by this process and the free heap memory) can still maintain the ideal utilization (ie, the target utilization). If the target utilization can be maintained, that is, not higher than the target utilization, memory can be allocated, that is, step 417 is performed. If the ideal utilization cannot be maintained, that is, higher than the target utilization, you need to further adopt different delayed GC strategies based on the heap area data compression ratio and CPU load, that is, perform step 403 and subsequent steps.

403. Check whether the heap area data compression ratio is equal to or greater than threshold 3. If the heap area data compression ratio is less than the threshold 3, lightweight GC is triggered, that is, step 407 is executed. If the heap area data compression ratio is equal to or greater than the threshold 3, the current CPU load is further determined, that is, step 404 is performed.

Among them, the heap area data compression ratio refers to the ratio of the size of the compressed heap area data in this process to the size of all heap area data in this process (including compressed heap area data and uncompressed heap area data).

It should be noted that when a process applies to allocate virtual machine heap memory, it will map the kernel-mode memory to user-mode memory by calling a memory allocator (such as the mmap allocator) and mark it as anonymous page memory. Among them, anonymous page memory refers to the memory that is dynamically allocated during the running of the application process and does not have a file name tag. In the embodiment of the present application, when a process calls a memory allocator (such as a mmap allocator) to allocate anonymous page memory, the anonymous page memory allocated by the process can be marked to facilitate the kernel layer to identify the anonymous page memory as heap memory. Subsequent calculation of heap area data compression ratio. In a specific implementation, when a process applies to allocate virtual machine heap memory, for example, it marks the vma_name field in the anonymous page memory as the first value. When the field of vma_name is the first value When, it indicates that the anonymous page is heap memory. In this way, the kernel can identify the heap area data based on the vma_name field. For example, the kernel can set a parameter Object1 to count the amount of heap area data allocated by this process (for example, the unit is pages).

In addition, the kernel can also set another parameter Object2, which is used to count the amount of compressed heap area data in this process (for example, the unit is pages). The initial value of Object2 is 0. When the kernel compresses memory data, it can determine whether the currently compressed data is heap area data based on the vma_name field. It should also be noted that the kernel compresses memory data in units of pages. Therefore, when the kernel determines that the compressed memory data is heap area data, Object2 is incremented by one. In this way, the kernel can count the size of the compressed heap data, and then calculate the heap data compression ratio. That is, the heap area data compression ratio = Object2 divided by Object1.

As mentioned above, when the kernel compresses the heap data and the electronic device performs GC (including lightweight GC and full-weight GC), the compressed heap data will be decompressed. However, the decompression operation requires additional application for memory. resources and consume more CPU resources. For this purpose, the process or system can set a threshold of 3. When the compression ratio of the heap area data is not high (that is, the compression ratio of the heap area data is less than the threshold 3), then the additional memory resources requested by the electronic device for performing the decompression action and the CPU resources consumed are not high, and will not affect the system. of normal operation. Then the electronic device can directly execute the lightweight GC, that is, step 407 is executed. When the compression ratio of the heap area data is high (that is, the heap area data compression ratio is equal to or greater than the threshold 3), the electronic device needs to further determine the current CPU load, that is, step 404 is performed.

404. Determine whether the CPU load exceeds threshold 4.

If the CPU load (also called CPU occupancy) exceeds threshold 4 (for example, 40%), it indicates that the current CPU load is too heavy, and it is not appropriate to execute lightweight GC immediately. You can delay the execution of lightweight GC by raising the threshold 1. , that is, step 405 is executed. If the CPU load does not exceed threshold 4, lightweight GC can be performed directly, that is, step 407 is performed.

405. Increase threshold 1.

In one embodiment, the electronic device may use a stepwise method to increase the value of threshold 1. In this embodiment, the electronic device may adopt a default set step size and a preset number of times, or receive a step size and a preset number of times set by the user. For example, the electronic device can first increase the threshold 1 once in steps (for example, 2M), and then determine whether the value of the heap memory expected to be occupied by the process divided by the target utilization is less than the increased threshold 1. If it is still equal to or greater than the raised threshold 1, raise the threshold 1 again in steps (for example, raise it again by 2M, and the cumulative raise has been 4M). When the number of times the electronic device is raised is less than the preset number (for example, 3 times), it is again judged whether the value of the heap memory expected to be occupied by the process divided by the target utilization is less than the raised threshold 1, and if it is still equal to or greater than the raised threshold 1 , raise the threshold 1 again. If the number of times the electronic device is adjusted up is equal to the preset number, step 406 is executed. It should be noted that during any process of raising the threshold 1, if it is detected that the heap memory expected to be occupied by this process divided by the target utilization is less than the adjusted threshold 1, it will stop raising the threshold 1 again and directly allocate the first memory, that is, perform step 417.

406. Determine whether the value of the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 407 is executed. If it is less than the threshold value 1, then step 417 is executed.

It can be understood that raising the threshold by 1 means raising the upper limit of heap memory used by this process. In some scenarios, after raising the threshold 1, the value of the heap memory expected to be occupied by this process divided by the target utilization can be smaller than the raised threshold 1, and then the allocation of the first memory can be completed. In this scenario, the electronic device raises the threshold 1 The method reduces the number of times electronic equipment performs lightweight GC.

In some other scenarios, after raising the threshold 1, the value of the heap memory expected to be occupied by this process divided by the target utilization may still be equal to or greater than the raised threshold 1. For example, other tasks of this process may also apply for heap memory allocation during this time period, causing the value of the heap memory expected to be occupied by this process divided by the target utilization to still be equal to or greater than the increased threshold of 1. Then, the first memory allocation cannot be completed, and lightweight GC still needs to be executed to reclaim more memory. It can be seen that in this scenario, the electronic device also delays the timing of the electronic device to perform lightweight GC by raising the threshold 1, avoiding the execution of lightweight GC when the current CPU load is too heavy, which is conducive to ensuring the smoothness and stability of the system. sex.

407. Execute lightweight GC.

The electronic device scans the heap memory newly requested by this process within a specific time period to determine whether the data in the heap memory has been referenced recently. Then the electronic device can use a strategy such as LRU to reclaim the heap memory that has been least recently referenced. The specific time period refers to the time period from the last time the electronic device executed GC (including lightweight GC and full-scale GC) to the time before the current execution of lightweight GC.

It is understandable that, compared to full-weight GC, electronic devices performing lightweight GC occupy less memory resources and CPU resources themselves. Since the electronic device does not scan all the heap area data when executing lightweight GC, the scanned compressed data is also less, and the additional memory resources and CPU resources occupied by the compression behavior of the electronic device will not be too much, which is beneficial to Ensure system fluency and stability.

408. Determine whether the value of the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 409 is executed. If it is less than the threshold value 1, then step 417 is executed.

409. Increase threshold 1.

That is to say, after the electronic device performs lightweight GC, if the current memory situation of the electronic device still cannot meet the demand, that is, the value of the heap memory expected to be occupied by this process divided by the target utilization is still equal to or greater than the threshold 1, then the electronic device The device increases threshold 1 again. By raising the threshold 1 again, the number of times the electronic device performs full-scale GC is again reduced, or the opportunity for the electronic device to perform full-scale GC is extended.

410. Determine whether the value of the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 411 is executed. If it is less than the threshold value 1, then step 417 is executed.

In some scenarios, after raising the threshold 1, the value of the heap memory expected to be occupied by this process divided by the target utilization can be smaller than the raised threshold 1, and then the allocation of the first memory can be completed. In this scenario, the electronic device reduces the need for the electronic device to perform a full-scale GC by raising the threshold value 1.

In some other scenarios, after raising the threshold 1, the value of the heap memory expected to be occupied by this process divided by the target utilization may still be equal to or greater than the raised threshold 1. For example, there may be multiple parallel tasks in this process, and then multiple tasks may apply for heap memory allocation at the same time or one after another. Then when this task executes this memory allocation request, the upper limit of heap memory usage of this process is increased by raising the threshold 1, that is, the maximum heap memory, but other tasks may be allocated the required heap memory in advance (that is, this process The occupied heap memory increases), causing the heap memory expected to be occupied by this process at this time (the memory allocated by this task and the heap memory already occupied by this process) divided by the target utilization to still be higher than the threshold 1, still This memory allocation request for this task cannot be completed. Then, it is still necessary to perform lightweight GC to reclaim more memory. It can be seen that in this scenario, the electronic device also delays the opportunity for the electronic device to perform full-scale GC by raising the threshold 1.

411. Check the data compression ratio of the heap area.

That is to say, at this time, the electronic device has performed a lightweight GC, and after raising the threshold to 1, if the memory of the electronic device still cannot meet the demand, the electronic device cannot immediately perform a full-scale GC. This is because the electronic device occupies a large amount of memory resources and CPU resources when executing full-scale GC, and because the electronic device needs to scan all heap area data. When the amount of compressed data in the heap area is large, the additional memory resources and CPU resources required by the electronic device for decompression will increase the memory tension of the system, affect the stability and fluency of system operation, and even cause the system to crash. . This application will use different strategies to delay the electronic device from performing full-scale GC according to the compression ratio of the heap area data, that is, perform any of the following steps 412, 413 or 414a respectively.

For the specific method of detecting the heap area data compression ratio, please refer to the description of relevant content in step 403, which will not be described again here.

412. When the heap area data compression ratio is low, for example, when the heap area data compression ratio is less than the threshold 5, avoid executing full-scale GC during the peak period of CPU load.

In some embodiments, when it is detected that the heap area data compression ratio is low (for example, in interval 1, interval 1 is, for example, less than threshold 5, and threshold 5 is, for example, 30%), the load of the CPU is continued to be detected. When the CPU load is too heavy, for example, the CPU load is greater than the threshold 7 (which can be the same as the threshold 4 in step 404, or greater than the threshold 4 in step 404), the execution of the full-scale GC is suspended to avoid execution during the peak period of the CPU load. Full-scale GC ensures system fluency and stability. The load of the CPU is continuously detected. When the CPU load is lower than the threshold 7, the electronic device can perform full-scale GC. It is understandable that the peak period of CPU load includes the time period when the CPU starts the APP, or the time period when the CPU performs heavy load tasks (such as face unlocking tasks, image recognition tasks, speech semantic recognition tasks, graphics rendering tasks, etc.). Or the time period when the CPU performs a large number of tasks at the same time, etc.

In other embodiments, when it is detected that the heap area data compression ratio is low (for example, less than the threshold 5, and the threshold 5 is, for example, 30%), the electronic device can also directly delay the time to execute the full-scale GC. The length of the delay can be based on The foreground process or core process currently running on the electronic device is determined. It should be noted that the embodiments of the present application do not specifically limit the specific solution for delaying the execution of full-scale GC.

413. When the heap area data compression ratio is medium, such as when the heap area data compression ratio is equal to or greater than the threshold 5 and less than the threshold 6, a full-scale GC is executed when the CPU is idle.

When it is detected that the heap area data compression ratio is low (for example, it is located in interval 2, for example, interval 2 is between threshold 5 and threshold 6, threshold 5 is, for example, 30%, and threshold 6 is, for example, 50%), continue to detect the load of the CPU. When the CPU load is heavy, for example, the CPU load is greater than threshold 8 (threshold 8 is less than threshold 7), the execution of full-scale GC is suspended. The electronic device can execute full-scale GC when the CPU is idle to ensure the smoothness and stability of the system. . Among them, CPU idle refers to the time that the CPU waits for the I/O device to complete the I/O request after issuing the I/O request.

414a. When the heap area data compression ratio is high, such as when the heap area data compression ratio is equal to or greater than the threshold 6, freeze the process.

When it is detected that the heap data compression ratio is high (for example, in interval 3, and interval 3 is, for example, equal to or greater than threshold 6, and threshold 6 is, for example, 50%), if the electronic device continues to perform full-scale GC, the heap area data that needs to be decompressed The amount is also large, and it requires a large amount of memory resources and CPU resources due to the decompression behavior, which will seriously affect the fluency and stability of the system, and even cause the system to crash. Therefore, in this scenario, the electronic device directly freezes this process, suspends this process from the source of memory allocation, and performs full-scale GC (of course, this process cannot perform lightweight GC). In a specific implementation, the kernel of the electronic device can set the status of the process to stopped in the process list and save the process. The context of the process so that it can be unfrozen later.

It is understandable that what is usually frozen is the background process, so the user cannot perceive that the process is frozen, and the user experience will not be affected.

414b. After receiving the instruction to unfreeze the process, unfreeze the process and execute a full-scale GC.

In some scenarios, when the electronic device receives the instruction to unfreeze the process, it unfreezes the process and performs a full-scale GC. Among them, instructions for unfreezing this process include, but are not limited to, instructions for the user to switch the APP corresponding to this process to run in the foreground.

Optionally, after step 412, step 413, and step 414b, when the electronic device performs a full-level GC, the electronic device can also lower the threshold 1. This is because the full-scale GC scans more data in the heap area and releases more heap memory, which increases the free heap memory. Therefore, after executing the full-scale GC, the electronic device can lower the threshold 1 in a timely manner to ensure Heap memory utilization.

415. Determine whether the value of the heap memory expected to be occupied by this process divided by the target utilization is less than the threshold 1. If it is equal to or greater than the threshold value 1, then step 416 is executed. If it is less than the threshold value 1, then step 417 is executed.

416. Trigger the memory overflow mechanism.

When the memory overflow mechanism is triggered, the electronic device cleans up all processes that have applied for heap memory, and the process ends.

417. Allocate the first memory.

In summary, the embodiments of this application propose a method for detecting the compression ratio of heap area data, so that the GC thread of the electronic device core can perceive the compression level of the heap area data (ie, the compression ratio of the heap area data), thereby facilitating the heap area data compression ratio according to the heap area data compression ratio. Data compression level for efficient GC control. When the compression levels of heap area data are different, different strategies are adopted based on the current CPU load of the electronic device to reduce the number of times the electronic device performs GC (lightweight GC and full-weight GC) or delay the execution of GC (lightweight GC) by the electronic device. level GC and full-scale GC) to prevent electronic equipment from executing GC under high CPU load. Therefore, this application reduces the system resources (including memory resources and CPU resources) occupied by the electronic device when executing GC, which is beneficial to ensuring the smoothness and stability of the system.

It should also be noted that the above-mentioned steps 401 to 417 are only one example provided by the embodiment of the present application. In other embodiments, some of the above-mentioned steps 401 to 417 may be omitted by default, or the execution order between the steps may be changed. It can be changed, or other combinations of steps can be made if the solutions are not inconsistent. For example, in some embodiments, step 405 may be omitted, or step 407 may be omitted, or step 409 may be omitted. For another example, in some other embodiments, step 403 can be replaced by step 411, and the electronic device can use different strategies to delay GC according to the heap area data compression ratio. For example, when the heap area data compression ratio is low, lightweight GC can be performed directly. When the heap area data compression is relatively high, the method of raising the threshold 1 is used to delay the execution of lightweight GC. Other changes or substitutions within the technical scope disclosed in this application are covered by the protection scope of this application, and will not be listed here.

An embodiment of the present application also provides a chip system. As shown in FIG. 5 , the chip system includes at least one processor 1101 and at least one interface circuit 1102 . The processor 1101 and the interface circuit 1102 may be interconnected by wires. For example, interface circuitry 1102 may be used to receive signals from other devices, such as the memory of electronic device 100 . As another example, interface circuit 1102 may be used to send signals to other devices (eg, processor 1101). For example, the interface circuit 1102 can read instructions stored in the memory and send the instructions to the processor 1101. When the instructions are executed by the processor 1101, the electronic device can be caused to perform various steps performed by the electronic device 100 (such as a mobile phone) in the above embodiments. Of course, the chip system may also include other discrete devices. The embodiments of this application There is no specific limit on this.

An embodiment of the present application also provides a device, which is included in an electronic device and has the function of realizing the behavior of the electronic device in any of the methods in the above embodiments. This function can be implemented by hardware, or it can be implemented by hardware executing corresponding software. The hardware or software includes at least one module or unit corresponding to the above functions. For example, a detection module or unit, a determination module or unit, a processing module or unit, etc.

Embodiments of the present application also provide a computer storage medium that includes computer instructions. When the computer instructions are run on an electronic device, the electronic device causes the electronic device to perform any of the methods in the above embodiments.

Embodiments of the present application also provide a computer program product. When the computer program product is run on a computer, it causes the computer to perform any of the methods in the above embodiments.

It can be understood that, in order to implement the above functions, the above-mentioned electronic devices include hardware structures and/or software modules corresponding to each function. Persons skilled in the art should easily realize that, in conjunction with the units and algorithm steps of each example described in the embodiments disclosed herein, the embodiments of the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is performed by hardware or computer software driving the hardware depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementations should not be considered to be beyond the scope of the embodiments of the present invention.

Embodiments of the present application can divide the above-mentioned electronic equipment into functional modules according to the above-mentioned method examples. For example, each functional module can be divided corresponding to each function, or two or more functions can be integrated into one processing module. The above integrated modules can be implemented in the form of hardware or software function modules. It should be noted that the division of modules in the embodiment of the present invention is schematic and is only a logical function division. In actual implementation, there may be other division methods.

Through the above description of the embodiments, those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above functional modules is used as an example. In actual applications, the above functions can be allocated as needed. It is completed by different functional modules, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. For the specific working processes of the systems, devices and units described above, reference can be made to the corresponding processes in the foregoing method embodiments, which will not be described again here.

Each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit. The above integrated units can be implemented in the form of hardware or software functional units.

If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present application are essentially or contribute to the existing technology, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage device. The medium includes several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the methods described in various embodiments of this application. The aforementioned storage media include: flash memory, mobile hard disk, read-only memory, random access memory, magnetic disk or optical disk and other media that can store program codes.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be covered by the protection scope of the present application. . Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (14)

1. A garbage collection GC method, characterized in that the method includes:

   Electronic devices run application apps;

   When the process of the APP requests to allocate the first memory, the electronic device detects whether the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the first threshold, wherein the heap memory expected to be occupied by the process is The memory includes the heap memory occupied by the process and the first memory;

   When the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the first threshold, the electronic device detects whether the heap area data compression ratio corresponding to the process is equal to or greater than the second threshold;

   When the heap area data compression ratio corresponding to the process is equal to or greater than the second threshold, and the current CPU load of the electronic device is greater than the third threshold, the electronic device delays the process to perform garbage collection.
2. The method according to claim 1, characterized in that when the heap area data compression ratio corresponding to the process is equal to or greater than a second threshold, and the current CPU load of the electronic device is greater than a third threshold, the Electronic devices delay the process from performing garbage collection, including:

   When the heap data compression ratio corresponding to the process is equal to or greater than the second threshold, and the current CPU load of the electronic device is greater than the third threshold, the electronic device increases the first threshold.
3. The method of claim 2, wherein after the electronic device increases the first threshold, the method further includes:

   The electronic device detects whether the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the increased first threshold;

   When the electronic device detects that the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the raised first threshold, the electronic device executes a lightweight GC.
4. The method according to claim 3, characterized in that, after the electronic device performs lightweight GC, the method further includes:

   The electronic device detects whether the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the increased first threshold;

   When the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the raised first threshold, the electronic device raises the first threshold again.
5. The method of claim 4, wherein after the electronic device raises the first threshold again, the method further includes:

   When the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the first threshold after being raised again, the electronic device detects the heap area data compression ratio corresponding to the process again;

   The electronic device adopts different strategies according to the heap area data compression ratio corresponding to the process to delay the execution of full-scale garbage collection GC.
6. The method according to claim 5, characterized in that the electronic device adopts different strategies according to the heap area data compression ratio corresponding to the process to delay the execution of full-scale garbage collection GC, including:

   When the heap area data compression ratio corresponding to the process is in the first interval, the electronic device avoids the peak period of CPU load and executes full-scale GC;

   When the heap area data compression ratio corresponding to the process is in the second interval, the electronic device executes a full-scale GC when the CPU is idle;

   When the heap data compression ratio corresponding to the process is in the third interval, the electronic device freezes the process, and after receiving an instruction to unfreeze the process, unfreezes the process and executes a full-scale GC.
7. The method of claim 2, wherein after the electronic device increases the first threshold, the method further includes:

   When the value of the heap memory expected to be occupied by the process divided by the target utilization is equal to or greater than the raised first threshold, the electronic device detects the heap area data compression ratio corresponding to the process again;

   The electronic device adopts different strategies according to the heap area data compression ratio corresponding to the process to delay the execution of full-scale garbage collection GC.
8. The method according to claim 7, characterized in that the electronic device adopts different strategies according to the heap area data compression ratio corresponding to the process to delay the execution of full-scale garbage collection GC, including:

   When the heap area data compression ratio corresponding to the process is in the first interval, the electronic device avoids the peak period of CPU load and executes full-scale GC;

   When the heap area data compression ratio corresponding to the process is in the second interval, the electronic device executes a full-scale GC when the CPU is idle;

   When the heap data compression ratio corresponding to the process is in the third interval, the electronic device freezes the process, and after receiving an instruction to unfreeze the process, unfreezes the process and executes a full-scale GC.
9. The method according to any one of claims 1-8, characterized in that, the method further includes:

   When the process applies for heap memory, the electronic device marks the heap memory applied for by the process.
10. The method of claim 9, further comprising:

    When the electronic device compresses the heap data of the process, the electronic device records the data amount of the compressed heap data.
11. The method according to any one of claims 1-10, characterized in that,

    The heap area data compression ratio of the process is the ratio of the data amount of the compressed heap area data in the process to the data amount of all heap area data in the current process.
12. An electronic device, characterized by comprising: a processor, a memory and a touch screen, the memory, the touch screen are coupled to the processor, the memory is used to store computer program code, the computer program code includes computer instructions , when the processor reads the computer instructions from the memory, so that the electronic device executes the garbage collection GC method according to any one of claims 1-11.
13. A computer-readable storage medium, characterized by comprising computer instructions that, when the computer instructions are run on an electronic device, cause the electronic device to perform the garbage collection GC according to any one of claims 1-11 Methods.
14. A chip system, characterized in that it includes one or more processors. When the one or more processors execute instructions, the one or more processors execute the method according to any one of claims 1-11. The garbage collection GC method described above.