WO2023201811A1 - Mems麦克风 - Google Patents

Mems麦克风 Download PDF

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Publication number
WO2023201811A1
WO2023201811A1 PCT/CN2022/093437 CN2022093437W WO2023201811A1 WO 2023201811 A1 WO2023201811 A1 WO 2023201811A1 CN 2022093437 W CN2022093437 W CN 2022093437W WO 2023201811 A1 WO2023201811 A1 WO 2023201811A1
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Prior art keywords
mems microphone
chip
microphone chip
frequency response
mems
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PCT/CN2022/093437
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English (en)
French (fr)
Inventor
陈晓翔
章仰明
蔡东记
蒲景鑫
张睿
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AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Priority to JP2022575849A priority Critical patent/JP7535601B2/ja
Priority to US17/994,026 priority patent/US12267636B2/en
Publication of WO2023201811A1 publication Critical patent/WO2023201811A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model relates to an acoustic-electric conversion device, in particular to a MEMS microphone.
  • Micro-Electro-Mechanical System (MEMS) microphone is an acoustic-electric transducer manufactured based on MEMS technology. It has the characteristics of small size, good frequency response characteristics, and low noise. It is one of the essential devices for mobile terminals. one.
  • the existing MEMS microphone includes a MEMS microphone chip based on capacitance detection and an Application Specific Integrated Circuit (ASIC) chip.
  • the capacitance of the MEMS microphone chip will change accordingly with the input sound signal, and then the ASIC chip is used.
  • the changing capacitance signal is processed and output to realize the pickup of sound.
  • MEMS microphones are overloaded in this acoustic frequency band and cause noise.
  • the size of the noise is related to the power of the ultrasonic transceiver itself, the distance from the MEMS microphone, and the sensitivity of the MEMS microphone in this frequency band.
  • the standard 48KHz sampling of the audio hardware codec will filter sounds at frequencies of 24KHz and above, this distortion has been generated inside the MEMS microphone and extended to low frequencies, causing noise with small amplitude but obvious audibility, that is, poor anti-interference performance. , poor sensitivity.
  • the technical problem to be solved by this utility model is to provide a MEMS microphone with good anti-interference performance and good sensitivity.
  • the present invention provides a MEMS microphone, which includes a shell with a receiving space, a sound hole penetrating the shell, a MEMS microphone chip and an ASIC chip accommodated in the receiving space.
  • the MEMS microphone chip at least includes a first MEMS microphone chip and a second MEMS microphone chip.
  • the frequency response drop characteristics of the first MEMS microphone chip are different from the frequency response drop characteristics of the second MEMS microphone chip;
  • the MEMS microphone further It includes a subtractor, and the output signal of the first MEMS microphone chip and the output signal of the second MEMS microphone chip are input to the subtractor, and are subtracted by the subtractor and used as the input of the ASIC chip. Signal.
  • the frequency response drop characteristic of the first MEMS microphone chip is less than 1 KHz, and the frequency response drop characteristic of the second MEMS microphone chip ranges from 1 KHz to 30 KHz.
  • the first MEMS microphone chip and the second MEMS microphone chip are integrated into one body to form a MEMS microphone chip unit.
  • the first MEMS microphone chip and the second MEMS microphone chip have the same frequency response resonance peak.
  • the frequency response resonant peak of the first MEMS microphone chip is greater than the frequency response resonant peak of the second MEMS microphone chip.
  • the frequency response resonant peak of the first MEMS microphone chip is smaller than the frequency response resonant peak of the second MEMS microphone chip.
  • the frequency response resonant peak of the first MEMS microphone chip and the frequency response resonant peak of the second MEMS microphone chip are both greater than 20 KHz.
  • the subtractor is integrated in the ASIC chip.
  • the MEMS microphone of the present invention is configured with at least two MEMS microphone chips, and the frequency response drop characteristics of the two MEMS microphone chips are different.
  • the outputs of the two MEMS microphone chips are connected to the subtractor, and the frequency response drop characteristics of the two MEMS microphone chips are different.
  • the ultrasonic band signals cancel each other, while the other frequency band signals are retained, and then output to the ASIC chip for processing and then transmitted to the sound-generating device to achieve sound generation, thereby effectively improving the MEMS microphone anti-interference performance and improved sensitivity.
  • Figure 1 is a structural block diagram of the first embodiment of the MEMS microphone of the present invention
  • Figure 2 is a performance curve when the frequency response resonance peaks of the first MEMS microphone chip and the second MEMS microphone chip of the MEMS microphone of the present utility model are the same.
  • Figure 2(a) is the performance curve before signal processing
  • Figure 2(b) It is the performance curve of signal processing;
  • Figure 3 is a performance curve when the frequency response resonant peak of the first MEMS microphone chip of the MEMS microphone of the present invention is greater than the frequency response resonant peak of the second MEMS microphone chip.
  • Figure 3(a) is the performance curve before signal processing.
  • Figure 3(a) is the performance curve before signal processing.
  • 3(b) is the performance curve of signal processing;
  • Figure 4 is a performance curve when the frequency response resonant peak of the first MEMS microphone chip of the MEMS microphone of the present invention is smaller than the frequency response resonant peak of the second MEMS microphone chip.
  • Figure 4(a) is the performance curve before signal processing.
  • Figure 4(a) is the performance curve before signal processing.
  • 4(b) is the performance curve of signal processing;
  • Figure 5 is a structural block diagram of the second embodiment of the MEMS microphone of the present invention.
  • the present invention provides a MEMS microphone 100, which includes a housing 1 with a receiving space, a sound hole penetrating the housing 1, and a MEMS microphone chip 2 contained in the receiving space. And ASIC chip 3, subtractor 4.
  • the MEMS microphone chip 3 includes at least two. In this embodiment, it includes a first MEMS microphone chip 21 and a second MEMS microphone chip 22 .
  • the frequency response roll-off characteristics (roll of) of the first MEMS microphone chip 21 are different from the frequency response roll-off characteristics of the second MEMS microphone chip 22 .
  • the frequency response drop characteristic (roll of) is defined as: the sensitivity corresponding to the frequency point is 3 dB lower than the 1KHz sensitivity, that is, the frequency response curve attenuates the 3dB frequency point.
  • the output signal of the first MEMS microphone chip 21 and the output signal of the second MEMS microphone chip 22 are both input to the subtractor 4, and are subtracted by the subtractor 4 as the output signal of the ASIC chip 3. input signal. That is to say, the first MEMS microphone chip 21 and the second MEMS microphone chip 22 can be directly connected to the subtractor 4, or can be connected to the subtractor 4 after other signal processing (such as signal amplification, filtering, etc.).
  • the output end of the first MEMS microphone chip 21 and the output end of the second MEMS microphone chip 22 are respectively connected to the first input end and the second input end of the subtractor 4,
  • the output terminal of the subtractor 4 is connected to the input terminal of the ASIC chip 3 .
  • the subtractor 4 is integrated into the ASIC chip 3, which can effectively reduce the volume occupied by the MEMS microphone and is conducive to miniaturization.
  • the frequency response drop characteristic of the first MEMS microphone chip 21 is less than 1 KHz
  • the frequency response drop characteristic of the second MEMS microphone chip 22 ranges from 1 KHz to 30 KHz. After the two signals are subtracted, the ultrasonic band signals cancel each other out, while other frequency band signals remain.
  • the frequency response formant of the first MEMS microphone chip 21 and the frequency response formant of the second MEMS microphone chip 22 are both greater than 20 KHz. .
  • the first MEMS microphone chip 21 and the second MEMS microphone chip 22 have the same frequency response resonance peak.
  • Figure 2(a) is the performance curve before signal processing
  • Figure 2(b) is the performance curve after signal processing. It can be seen that after the two signals are subtracted, the ultrasonic band signals cancel each other out, while the other Frequency band signals are retained.
  • the frequency response resonance peak of the first MEMS microphone chip 21 is greater than the frequency response resonance peak of the second MEMS microphone chip 22 .
  • Figure 3(a) is the performance curve before signal processing
  • Figure 3(b) is the performance curve after signal processing. It can be seen that after the two signals are subtracted, the ultrasonic band signals cancel each other out, while the other Frequency band signals are retained.
  • the frequency response resonance peak of the first MEMS microphone chip 21 is smaller than the frequency response resonance peak of the second MEMS microphone chip 22 .
  • Figure 4(a) is the performance curve before signal processing
  • Figure 4(b) is the performance curve after signal processing. It can be seen that after the two signals are subtracted, the ultrasonic band signals cancel each other out, while the other frequency band signals are retained.
  • the present utility model also provides another embodiment, which is basically the same as the above-mentioned embodiment, and the same parts will not be repeated. The difference is: as shown in Figure 5, the first MEMS microphone chip and the second MEMS microphone chip The MEMS microphone chip unit 20 is integrated into one body, thereby effectively reducing the volume occupied by the MEMS microphone and facilitating miniaturization.
  • the MEMS microphone of the present invention is configured with at least two MEMS microphone chips, and the frequency response drop characteristics of the two MEMS microphone chips are different.
  • the outputs of the two MEMS microphone chips are connected to the subtractor, and the After the two-channel signals output by the two MEMS microphone chips are subtracted by the subtractor, the ultrasonic band signals cancel each other out, while the other frequency band signals are retained, and then output to the ASIC chip for processing and then sent to the sound-generating device for sound generation, thereby effectively improving the MEMS microphone anti-interference performance and improved sensitivity.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Circuit For Audible Band Transducer (AREA)

Abstract

本实用新型提供一种MEMS麦克风，包括具有收容空间的壳体、贯穿所述壳体的声孔、收容于所述收容空间内的MEMS麦克风芯片和ASIC芯片以及减法器，所述MEMS麦克风芯片至少包括第一MEMS麦克风芯片和第二MEMS麦克风芯片，所述第一MEMS麦克风芯片的频率响应跌落特性与所述第二MEMS麦克风芯片的频率响应跌落特性相异；所述第一MEMS麦克风芯片的输出信号及所述第二MEMS麦克风芯片的输出信号皆输出至所述减法器，并经减法器进行减法处理后输出至所述ASIC芯片。与相关技术相比，本实用新型MEMS麦克风抗干扰性能好且灵敏度好。

Description

MEMS麦克风 技术领域
本实用新型涉及一种声电转换装，尤其涉及一种MEMS麦克风。
 背景技术
微机电系统(Micro-Electro-Mechanical System，MEMS)麦克风是基于MEMS技术制造的声电换能器，其具有体积小、频响特性好、噪声低等特点，是移动终端必不可少的器件之一。
现有技术的MEMS麦克风包含基于电容检测的MEMS麦克风芯片和专用集成电路(Application Specific Integrated Circuit，ASIC)芯片，MEMS麦克风芯片的电容会随着输入声音信号的不同产生相应的变化，再利用ASIC芯片对变化的电容信号进行处理和输出从而实现对声音的拾取。
 技术问题
然而，随着大功率超声波收发器的广泛应用，导致MEMS麦克风在该声波频段出现过载引起杂音。该杂音的大小与超声波收发器本身功率大小、距离MEMS麦克风的距离、MEMS麦克风在该频段的灵敏度有关系。虽然音频硬件codec标准的48KHz采样会过滤24KHz及以上的频率的声音，但是该失真已经在MEMS麦克风内部产生并延伸到低频，引起幅值虽小但是听感明显的噪音，即抗干扰性能较差，灵敏度差。
因此，有必要提供一种新的MEMS麦克风解决上述问题。
 技术解决方案
本实用新型需要解决的技术问题是提供一种抗干扰性能好且灵敏度好的MEMS麦克风。
为解决上述技术问题，本实用新型提供了一种MEMS麦克风，包括具有收容空间的壳体、贯穿所述壳体的声孔、收容于所述收容空间内的MEMS麦克风芯片和ASIC芯片，所述MEMS麦克风芯片至少包括第一MEMS麦克风芯片和第二MEMS麦克风芯片，所述第一MEMS麦克风芯片的频率响应跌落特性与所述第二MEMS麦克风芯片的频率响应跌落特性相异；所述MEMS麦克风还包括减法器，所述第一MEMS麦克风芯片的输出信号及所述第二MEMS麦克风芯片的输出信号皆输入至所述减法器，并经所述减法器进行减法处理后作为所述ASIC芯片的输入信号。
优选的，所述第一MEMS麦克风芯片的频率响应跌落特性小于1KHz，所述第二MEMS麦克风芯片的频率响应跌落特性范围为1KHz～30KHz。
优选的，所述第一MEMS麦克风芯片与所述第二MEMS麦克风芯片集成于一体呈MEMS麦克风芯片单元。
优选的，所述第一MEMS麦克风芯片和所述第二MEMS麦克风芯片的频率响应共振峰相同。
优选的，所述第一MEMS麦克风芯片的频率响应共振峰大于所述第二MEMS麦克风芯片的频率响应共振峰。
优选的，所述第一MEMS麦克风芯片的频率响应共振峰小于所述第二MEMS麦克风芯片的频率响应共振峰。
优选的，所述第一MEMS麦克风芯片的频率响应共振峰以及所述第二MEMS麦克风芯片的频率响应共振峰均大于20KHz。
优选的，所述减法器集成于所述ASIC芯片内。
 有益效果
与相关技术相比，本实用新型的MEMS麦克风通过设置至少两个MEMS麦克风芯片，且使得两个MEMS麦克风芯片的频率响应跌落特性相异，两个MEMS麦克风芯片的输出均连接至减法器，将两个MEMS麦克风芯片输出的两路信号经减法器实现减法运算后，超声频段信号相互抵消，而其它频段信号保留，再输出至ASIC芯片处理后传送至发声器件实现发声，从而有效提高的MEMS麦克风的抗干扰性能并改善了灵敏度。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型MEMS麦克风实施方式一的结构框图；
图2为本实用新型MEMS麦克风的第一MEMS麦克风芯片与第二MEMS麦克风芯片的频率响应共振峰相同时的性能曲线，其中图2(a)为信号处理前的性能曲线，图2(b)为信号处理如果的性能曲线；
图3为本实用新型MEMS麦克风的第一MEMS麦克风芯片的频率响应共振峰大于第二MEMS麦克风芯片的频率响应共振峰时的性能曲线，其中图3(a)为信号处理前的性能曲线，图3(b)为信号处理如果的性能曲线；
图4为本实用新型MEMS麦克风的第一MEMS麦克风芯片的频率响应共振峰小于第二MEMS麦克风芯片的频率响应共振峰时的性能曲线，其中图4(a)为信号处理前的性能曲线，图4(b)为信号处理如果的性能曲线；
图5为本实用新型MEMS麦克风实施方式二的结构框图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请同时参图1所示，本实用新型提供了一种MEMS麦克风100，包括具有收容空间的壳体1、贯穿所述壳体1的声孔、收容于所述收容空间内的MEMS麦克风芯片2和ASIC芯片3、减法器4。
所述MEMS麦克风芯片3至少包括两个，本实施方式中，包括第一MEMS麦克风芯片21和第二MEMS麦克风芯片22。
其中，所述第一MEMS麦克风芯片21的频率响应跌落特性（roll of）与所述第二MEMS麦克风芯片22的频率响应跌落特性相异。
其中频率响应跌落特性（roll of）定义为：其频点对应灵敏度相比1KHz灵敏度低3 dB，即频响曲线衰减3dB频率点。
所述第一MEMS麦克风芯片21的输出信号及所述第二MEMS麦克风芯片22的输出信号皆输入至所述减法器4，并经所述减法器4进行减法处理后作为所述ASIC芯片3的输入信号。也就是说，第一MEMS麦克风芯片21和所述第二MEMS麦克风芯片22可以直接连接至减法器4，也可以通过其它信号处理（如信号放大、滤波等）后连接至减法器4。
具体的，本实施方式中，所述第一MEMS麦克风芯片21的输出端及所述第二MEMS麦克风芯片22的输出端分别与所述减法器4的第一输入端和第二输入端连接，所述减法器4的输出端连接至所述ASIC芯片3的输入端。第一MEMS麦克风芯片21和第二MEMS麦克风芯片22分别产生的两路信号通过减法器4进行减法运算后，超声频段信号相互抵消，而其它频段信号保留。
更优的，所述减法器4集成于所述ASIC芯片3内，可有效减少对MEMS麦克风的体积占用，有利于微型化。
本实施方式中，具体的，所述第一MEMS麦克风芯片21的频率响应跌落特性小于1KHz，所述第二MEMS麦克风芯片22的频率响应跌落特性范围为1KHz～30KHz。两路信号通过减法运算后，超声频段信号相互抵消，而其它频段信号保留，所述第一MEMS麦克风芯片21的频率响应共振峰以及所述第二MEMS麦克风芯片22的频率响应共振峰均大于20KHz。
所述第一MEMS麦克风芯片21和所述第二MEMS麦克风芯片22的频率响应共振峰相同。如图2所示，其中图2(a)为信号处理前的性能曲线，图2(b)为信号处理如果的性能曲线，可见两路信号通过减法运算后，超声频段信号相互抵消，而其它频段信号保留。
所述第一MEMS麦克风芯片21的频率响应共振峰大于所述第二MEMS麦克风芯片22的频率响应共振峰。如图3所示，其中图3(a)为信号处理前的性能曲线，图3(b)为信号处理如果的性能曲线，可见两路信号通过减法运算后，超声频段信号相互抵消，而其它频段信号保留。
所述第一MEMS麦克风芯片21的频率响应共振峰小于所述第二MEMS麦克风芯片22的频率响应共振峰。如图4所示，其中图4(a)为信号处理前的性能曲线，图4(b)为信号处理如果的性能曲线。可见两路信号通过减法运算后，超声频段信号相互抵消，而其它频段信号保留。
本实用新型还提供另一种实施方式，其与上述实施方式基本相同，相同部分不再赘述，不同的是：如图5所示，所述第一MEMS麦克风芯片与所述第二MEMS麦克风芯片集成于一体呈MEMS麦克风芯片单元20，从而可有效减少对MEMS麦克风的体积占用，有利于微型化。
与相关技术相比，本实用新型的MEMS麦克风通过设置至少两个MEMS麦克风芯片，且使得两个MEMS麦克风芯片的频率响应跌落特性相异，两个MEMS麦克风芯片的输出均连接至减法器，将两个MEMS麦克风芯片输出的两路信号经减法器实现减法运算后，超声频段信号相互抵消，而其它频段信号保留，再输出至ASIC芯片处理后传送至发声器件实现发声，从而有效提高的MEMS麦克风的抗干扰性能并改善了灵敏度。
以上所述仅为本实用新型的实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (8)

  1. 一种MEMS麦克风，包括具有收容空间的壳体、贯穿所述壳体的声孔、收容于所述收容空间内的MEMS麦克风芯片和ASIC芯片，其特征在于，所述MEMS麦克风芯片至少包括第一MEMS麦克风芯片和第二MEMS麦克风芯片，所述第一MEMS麦克风芯片的频率响应跌落特性与所述第二MEMS麦克风芯片的频率响应跌落特性相异；所述MEMS麦克风还包括减法器，所述第一MEMS麦克风芯片的输出信号及所述第二MEMS麦克风芯片的输出信号皆输入至所述减法器，并经所述减法器进行减法处理后作为所述ASIC芯片的输入信号。
  2. 根据权利要求1所述的MEMS麦克风，其特征在于，所述第一MEMS麦克风芯片的频率响应跌落特性小于1KHz，所述第二MEMS麦克风芯片的频率响应跌落特性范围为1KHz～30KHz。
  3. 根据权利要求2所述的MEMS麦克风，其特征在于，所述第一MEMS麦克风芯片与所述第二MEMS麦克风芯片集成于一体呈MEMS麦克风芯片单元。
  4. 根据权利要求2所述的MEMS麦克风，其特征在于，所述第一MEMS麦克风芯片和所述第二MEMS麦克风芯片的频率响应共振峰相同。
  5. 根据权利要求2所述的MEMS麦克风，其特征在于，所述第一MEMS麦克风芯片的频率响应共振峰大于所述第二MEMS麦克风芯片的频率响应共振峰。
  6. 根据权利要求2所述的MEMS麦克风，其特征在于，所述第一MEMS麦克风芯片的频率响应共振峰小于所述第二MEMS麦克风芯片的频率响应共振峰。
  7. 根据权利要求4-6任意一项所述的MEMS麦克风，其特征在于，所述第一MEMS麦克风芯片的频率响应共振峰以及所述第二MEMS麦克风芯片的频率响应共振峰均大于20KHz。
  8. 根据权利要求1所述的MEMS麦克风，其特征在于，所述减法器集成于所述ASIC芯片内。
PCT/CN2022/093437 2022-04-21 2022-05-18 Mems麦克风 Ceased WO2023201811A1 (zh)

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