WO2023177922A3 - Circuit package for connecting to an electro-photonic memory fabric - Google Patents

Circuit package for connecting to an electro-photonic memory fabric Download PDF

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Publication number
WO2023177922A3
WO2023177922A3 PCT/US2023/015680 US2023015680W WO2023177922A3 WO 2023177922 A3 WO2023177922 A3 WO 2023177922A3 US 2023015680 W US2023015680 W US 2023015680W WO 2023177922 A3 WO2023177922 A3 WO 2023177922A3
Authority
WO
WIPO (PCT)
Prior art keywords
electro
memory fabric
circuit package
eams
control systems
Prior art date
Application number
PCT/US2023/015680
Other languages
French (fr)
Other versions
WO2023177922A2 (en
Inventor
David Lazovsky
Philip Winterbottom
Martinus Bos
Subal Sahni
Original Assignee
Celestial Ai Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/807,694 external-priority patent/US20220405566A1/en
Priority claimed from US17/903,455 external-priority patent/US20230297237A1/en
Priority claimed from US18/123,170 external-priority patent/US20240145328A1/en
Priority claimed from US18/123,161 external-priority patent/US20230296838A1/en
Application filed by Celestial Ai Inc. filed Critical Celestial Ai Inc.
Publication of WO2023177922A2 publication Critical patent/WO2023177922A2/en
Publication of WO2023177922A3 publication Critical patent/WO2023177922A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/06—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
    • G06N3/067—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using optical means
    • G06N3/0675—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using optical means using electro-optical, acousto-optical or opto-electronic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Abstract

The present disclosure relates to thermal control systems, photonic memory fabrics, and electro-absorption modulators (EAMs). For example, the thermal control systems efficiently move data in a memory fabric based on utilizing and controlling thermally controlling optical components. As another example, the EAMs are instances of optical modulators used to efficiently move data within digital circuits while maintaining thermally-stable optical modulation across a wide temperature range.
PCT/US2023/015680 2022-03-18 2023-03-20 Circuit package for connecting to an electro-photonic memory fabric WO2023177922A2 (en)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US202263321453P 2022-03-18 2022-03-18
US63/321,453 2022-03-18
US17/807,694 US20220405566A1 (en) 2021-06-18 2022-06-17 Multi-chip electro-photonic network
US17/807,694 2022-06-17
US17/903,455 US20230297237A1 (en) 2022-03-18 2022-09-06 Photonic memory fabric for system memory interconnection
US17/903,455 2022-09-06
US202263420330P 2022-10-28 2022-10-28
US202263420323P 2022-10-28 2022-10-28
US63/420,323 2022-10-28
US63/420,330 2022-10-28
US18/123,161 2023-03-17
US18/123,170 2023-03-17
US18/123,170 US20240145328A1 (en) 2022-10-28 2023-03-17 Thermal control of an optical component
US18/123,161 US20230296838A1 (en) 2022-03-18 2023-03-17 Circuit package for connecting to an electro-photonic memory fabric

Publications (2)

Publication Number Publication Date
WO2023177922A2 WO2023177922A2 (en) 2023-09-21
WO2023177922A3 true WO2023177922A3 (en) 2023-10-19

Family

ID=88024297

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2023/015680 WO2023177922A2 (en) 2022-03-18 2023-03-20 Circuit package for connecting to an electro-photonic memory fabric

Country Status (1)

Country Link
WO (1) WO2023177922A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100266295A1 (en) * 2007-12-21 2010-10-21 Sun Microsystems, Inc. Optical-signal-path routing in a multi-chip system
US20170194310A1 (en) * 2016-01-04 2017-07-06 Infinera Corporation Photonic integrated circuit package
US11165509B1 (en) * 2020-06-05 2021-11-02 Marvell Asia Pte, Ltd. Method for co-packaging light engine chiplets on switch substrate
US20220004029A1 (en) * 2020-07-06 2022-01-06 Lightelligence, Inc. Optoelectronic computing platform
US20220044092A1 (en) * 2020-08-06 2022-02-10 Celestial Ai Inc. Coherent photonic computing architectures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100266295A1 (en) * 2007-12-21 2010-10-21 Sun Microsystems, Inc. Optical-signal-path routing in a multi-chip system
US20170194310A1 (en) * 2016-01-04 2017-07-06 Infinera Corporation Photonic integrated circuit package
US11165509B1 (en) * 2020-06-05 2021-11-02 Marvell Asia Pte, Ltd. Method for co-packaging light engine chiplets on switch substrate
US20220004029A1 (en) * 2020-07-06 2022-01-06 Lightelligence, Inc. Optoelectronic computing platform
US20220044092A1 (en) * 2020-08-06 2022-02-10 Celestial Ai Inc. Coherent photonic computing architectures

Also Published As

Publication number Publication date
WO2023177922A2 (en) 2023-09-21

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