WO2023172850A1

WO2023172850A1 - Stackable main printed circuit board

Info

Publication number: WO2023172850A1
Application number: PCT/US2023/063690
Authority: WO
Inventors: Dale Robert WOODEN
Original assignee: Weathered Security, Llc
Priority date: 2022-03-07
Filing date: 2023-03-03
Publication date: 2023-09-14

Abstract

A portable electronics system includes a printed circuit board ("PCB") having a stacking opening extending at least partially through the PCB; a second PCB having a second stacking opening extending at least partially through the second PCB; and a stacking member engageable with the stacking opening and the second stacking opening, wherein the stacking member is positioned between the PCB and the second PCB.

Description

STACKABLE MAIN PRINTED CIRCUIT BOARD

Cross-Reference to Related Applications

[0001] This application is related to and claim priority benefits from U.S. Provisional Patent Application No. 63/317,355, filed on March 7, 2022, entitled “STACKABLE MAIN PRINTED CIRCUIT BOARD,” the entirety of which is hereby incorporated by reference.

Technical Field

[0002] The present disclosure relates generally to circuit boards, and more specifically, but not by way of limitation to stackable circuit boards.

Background

[0003] A printed circuit board ("PCB”) is a circuit board which plays a role of electrically connecting predetermined electronic components and has a predetermined wiring pattern formed thereon. Conventionally, the connectors are arranged so that the electronic components extend out from the PCB resulting in a large overall volume of the PCB and connected electronic components.

Summary

[0004] The terms “invention,” “the invention,” “this invention” and “the present invention” used in this patent are intended to refer broadly to all of the subject matter of this patent and the patent claims below. Statements containing these terms should be understood not to limit the subject matter described herein or to limit the meaning or scope of the patent claims below. Embodiments of the invention covered by this patent are defined by the claims below, not this summary. This summary is a high-level overview of various aspects of the invention and introduces some of the concepts that are further described in the Detailed Description section below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used in isolation to determine the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification of this patent, any or all drawings and each claim. [0005] Various examples are described for devices and systems for a stackable circuit board. One example device includes a printed circuit board (“PCB”) having a PCB substrate that includes a conductive trace; and a stacking opening extending at least partially through the PCB substrate and engageable with a stacking member.

[0006] One example system includes a portable electronics system having a printed circuit board (“PCB”) that includes a stacking opening extending at least partially through the PCB; a second PCB that includes a second stacking opening extending at least partially through the second PCB; and a stacking member engageable with the stacking opening and the second stacking opening, where the stacking member is positioned between the PCB and the second PCB. [0007] One example system includes a portable electronics system having a motherboard that includes a printed circuit board (“PCB”) having a plurality of stacking openings extending through the PCB, where a stacking opening of the plurality of stacking openings is positioned at each corner of the PCB; a second PCB having a plurality of second stacking openings extending through the second PCB, where a second stacking opening of the plurality of second stacking openings is positioned at each corner of the second PCB; and a plurality of stacking rods, each stacking rod of the plurality of stacking rods having a first end portion, a second end portion, a central portion, a first ledge formed between the first end portion and the central portion, and a second ledge formed between the second end portion and the central portion; where the first end portion is inserted into a respective stacking opening of the plurality of stacking openings and the first ledge abuts a surface of the PCB; where the second end portion is inserted into a respective second stacking opening of the plurality of second stacking openings and the second ledge abuts a second surface of the PCB; where the plurality of stacking rods are positioned between the PCB and the second PCB; and where a distance between the PCB and the second PCB is less than 2 inches.

[0008] These illustrative examples are mentioned not to limit or define the scope of this disclosure, but rather to provide examples to aid understanding thereof. Illustrative examples are discussed in the Detailed Description, which provides further description. Advantages offered by various examples may be further understood by examining this specification.

Brief Description of the Drawings

[0009] The accompanying drawings, which are incorporated into and constitute a part of this specification, illustrate one or more certain examples and, together with the description of the example, serve to explain the principles and implementations of the certain examples.

[0010] FIGS. 1A-1B are top perspective views of a stackable motherboard according to certain embodiments of the present disclosure.

[0011] FIGS. 2A-2B are top perspective views of the stackable motherboard of FIGS. 1A-1B with external devices connected to the stackable motherboard.

[0012] FIGS. 3A-3B are top perspective views of a stackable motherboard stacked with other printed circuit boards (“PCB”) according to certain embodiments of the present disclosure.

[0013] FIG. 4 is a side perspective view of a stackable motherboard stacked with other printed circuit boards (“PCB’^:) according to certain embodiments of the present disclosure.

[0014] FIG. 5A is a top plan view of a stackable motherboard according to certain embodiments of the present disclosure.

[0015] FIG. 5B is a bottom plan view of a stackable motherboard according to certain embodiments of the present disclosure.

Detailed Description

[0016] The subject matter of embodiments of the present invention is described here with specificity to meet statutory requirements, but this description is not necessarily intended to limit the scope of the claims. The claimed subject matter may be embodied in other ways, may include different elements or steps, and may be used in conjunction with other existing or future technologies. This description should not be interpreted as implying any particular order or arrangement among or between various steps or elements except when the order of individual steps or arrangement of elements is explicitly described. [0017] As used herein, directional and spatial terms such as “right,” “left,” “top,” “bottom,” “front,” “rear,” “horizontal,” “vertical,” “horizontally,” “vertically,” and “upward” are not intended to be binding terms.

[0018] Certain aspects and features of the present disclosure relate to stackable printed circuit boards. The embodiments of the present disclosure described below are not intended to be exhaustive or to limit the disclosure to the precise forms described herein. Rather, the embodiments described herein are chosen so that a person of skill in the art can appreciate and understand the principles and practices of the present disclosure.

[0019] Embodiments are described herein in the context of a main printed circuit board (“PCB”), e.g., a motherboard, suitable for use in a portable electronics system. However, similar features may be incorporated into a general PCB. Those of ordinary skill in the art will realize that the following description is illustrative only and is not intended to be in any way limiting. Reference will now be made in detail to implementations of examples as illustrated in the accompanying drawings. The same reference indicators will be used throughout the drawings and the following description to refer to the same or like items.

[0020] In the interest of clarity, not all of the routine features of the examples described herein are shown and described. It will, of course, be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions must be made in order to achieve the developer's specific goals, such as compliance with application- and business- related constraints, and that these specific goals will vary from one implementation to another and from one developer to another.

[0021] In an illustrative example, a stackable motherboard may be formed with a plurality of connecting ports positioned along an edge of and/or at an offset distance from the edge of the stackable motherboard. Various antennas and/or other electronic device may be connected to the stackable motherboard via the plurality of connecting ports.

[0022] The stackable motherboard may also include stacking openings extending through the stackable motherboard at various locations that are engageable with stacking rods. These stacking rods may be inserted into the stacking openings such that multiple stackable motherboards and/or other PCBs may be stacked on top of each other. The illustrative stackable motherboard may operate as part of a network sniffer diagnostic tool that can monitor network traffic for information, intercept data packets as they travel across a network, etc.

[0023] FIGS. 1A-5B show a stackable motherboard, according to certain embodiments. Referring now to FIGS. 1A-1B, FIGS. 1A-1B show a top perspective view of an example stackable motherboard 100. The stackable motherboard 100 is patterned with conductive traces that provide appropriate electrical paths interconnecting various electronic components.

[0024] In some embodiments, the stackable motherboard 100 is substantially rectangular shaped. However, the stackable motherboard 100 may be any suitable shape, e.g., triangular, trapezoidal, circular, etc. Additionally, a length and a width of the stackable motherboard 100 may be substantially the same or may be different. For example, both the length and width of the stackable motherboard 100 may be between 6 inches and 7 inches, may be between 5 inches and 8 inches, may be between 4 inches and 9 inches, etc. Where the length and width of the stackable motherboard 100 are not the same, the length may be between 6 inches and 7 inches, may be between 5 inches and 8 inches, may be between 4 inches and 9 inches, etc. and the width may be 6.5625 inches, may be between 6 inches and 7 inches, may be between 5 inches and 8 inches, may be between 4 inches and 9 inches, etc.

[0025] The stackable motherboard 100 includes at least one connector 114 coupled to the stackable motherboard 100. In some embodiments, the connector 114 may be a USB port, including USB 2.0 or USB 3.0, Type N, UHF, TNC, Reverse Polarity TNC, BNC, SMA, Reverse Polarity SMA, SFA, uFL, Wi-Fi module card, antenna adaptor, or any other suitable port. The connector 114 may be electrically connected to the various other electronic components of the stackable motherboard 100 via the conductive traces extending throughout the stackable motherboard 100. Additionally, different types of ports may be used as connectors 114 for a single stackable motherboard 100, e.g., a plurality of UHF, TNC, and SMA connectors on a single stackable motherboard 100. [0026] The at least one connector 114 may be coupled to the stackable motherboard 100 along at least one edge of the stackable motherboard 100. The positioning of the at least one connector 114 along the at least one edge enables multiple different types of antennas 118 and other external devices 120 to be coupled to the at least one connector 114, as shown in FIGS. 2A and 2B, based on the type of connector 114. According to certain embodiments, up to 16 different antennas 118 and/or external devices 120 may be connected to a single stackable motherboard 100. The antennas 118 and external devices 418 connected to the stackable motherboard 300 may all be of the same type, e.g.. all radio antennas, or may be a mix of multiple types, e.g., a radio antenna and a USB dongle.

[0027] In some embodiments, the stackable motherboard 100 may include a plurality of stacking openings 116. Each stacking opening 116 may extend at least partially through the stackable motherboard 100 and may be positioned at any suitable location on the stackable motherboard 100. In some embodiments, a grommet may be inserted into the stacking openings 116. Additionally, at least one of the stacking opening 116 or the grommet may be threaded.

[0028] The stacking opening 116 may be engageable with a stacking member, e.g., a rod. The rod may have at least one end portion and a central portion. In some embodiments, the at least one end portion has a diameter that is smaller than a diameter of the central portion, and the change in diameter between the end portion and the central portion of the rod may form a ledge. Additionally, the at least one end portion of the rod may be threaded.

[0029] In certain embodiments, as shown in FIG. 4, a first stackable motherboard 100 is stackable with at least one second stackable motherboard 100, or any other suitable board, e.g., a multi-dock printed circuit board 400, using a plurality of the rods or standoffs, e.g., rods 402, so that the first stackable motherboard 100 is arranged above the at least one second stackable motherboard 100. One of the at least one end portions of the rod may be insertable into one of the stacking openings 116 in the stackable motherboard 100. For example, a threaded end portion of the rod may be screwed into a threaded stacking opening 116. In further embodiments, the rods may be snap-fit or friction-fit within the stacking openings 116. Each rod may be insertable into a corresponding stacking opening 116 until the ledge of the rod abuts one of a first surface of the stackable motherboard 100, the second surface of the stackable motherboard 100, or the grommet. Additionally, a first stackable motherboard 100 may be stackable with other PCB devices and other suitable boards that have corresponding stacking openings.

[0030] Referring now to FIGS. 3A and 3B, FIGS. 3A and 3B show another stackable motherboard 300 according to certain embodiments. The stackable motherboard 300 may include the same or similar features, such as a plurality of connectors 314 and a plurality of stacking openings 316, as are described above in relation to FIGS. 1A and IB.

[0031] In some embodiments, a plurality of the connectors 314 are not located at an edge of the stackable motherboard 300 and are instead arranged at an offset distance away from the edge of the stackable motherboard 300. These connectors 314 may be compatible with a uFL or SFA antenna to reduce the size profile of the stackable motherboard 300.

[0032] Referring now to FIGS. 5A and 5B, FIGS. 5A and 5B show another stackable motherboard 500 according to certain embodiments. The stackable motherboard 500 may include the same or similar features, such as a plurality of connectors and a plurality of stacking openings, as are described above in relation to FIGS. 1A-4. In some embodiments, the stackable motherboard 500 has a length and width each ranging between 7 inches and 8 inches. In total, the stackable motherboard 500 may have 48 connectors 514, which may be the same or similar to the connectors 114, coupled to a first surface 502 and/or a second surface 504 of the stackable motherboard 500. For example, the first surface 502 may include 8 Wi-Fi module cards 506 and 16 antenna adaptors 508, and the second surface 504 may include 8 additional Wi-Fi module cards 506 and 16 additional antenna adaptors 508.

[0033] The connectors 514 used enable multiple Wi-Fi, Bluetooth, etc. radios to be connected to the motherboard 500 without needing specific Peripheral Component Interconnect (“PCI”) plugs. The connectors 514 used also enable connections with the radios and other external devices that result in a low profile and overall volume of the motherboard 500. The low profile of the motherboard 500 permits multiple motherboard 500, or other similar PCB boards, to be stacked while at least doubling or quadrupling the number of connectors 514 compared to a previous stacked system of a similar size. For example, a first motherboard 500 and a second motherboard 500 may be stacked using a plurality of stacking openings and a plurality of stacking members with a distance between the stacked first motherboard 500 and the stacked second motherboard 500 being less than 1 inch, less than 2 inches, less than 3 inches, between 1 inch and 1.5 inches, between 1 inch and 2 inches, between 1 inch and 2.5 inches, or between 1 inch and 3 inches.

[0034] The foregoing description of some examples has been presented only for the purpose of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Numerous modifications and adaptations thereof will be apparent to those skilled in the art without departing from the spirit and scope of the disclosure.

[0035] Reference herein to an example or implementation means that a particular feature, structure, operation, or other characteristic described in connection with the example may be included in at least one implementation of the disclosure. The disclosure is not restricted to the particular examples or implementations described as such. The appearance of the phrases “in one example,” “in an example,” “in one implementation,” or “in an implementation,” or variations of the same in various places in the specification does not necessarily refer to the same example or implementation. Any particular feature, structure, operation, or other characteristic described in this specification in relation to one example or implementation may be combined with other features, structures, operations, or other characteristics described in respect of any other example or implementation.

[0036] Use herein of the word “or” is intended to cover inclusive and exclusive OR conditions. In other words, A or B or C includes any or all of the following alternative combinations as appropriate for a particular usage: A alone; B alone; C alone; A and B only; A and C only; B and C only; and A and B and C. [0037] In the following, further examples are described to facilitate the understanding of the invention (and in some aspects, features of an apparatus or system described in one or more of these examples may be utilized in a method described in one of the other examples or vice versa). These examples are not meant to be mutually exclusive, exhaustive, or restrictive; and the disclosure is not limited to these examples but rather encompasses all possible modifications and variations within the scope of the issued claims and their equivalents.

[0038] Example 1 is a printed circuit board (“PCB”), which may incorporate features of any of the subsequent example(s), comprising: a PCB substrate comprising a conductive trace; and a stacking opening extending at least partially through the PCB substrate and engageable with a stacking member.

[0039] Example 2 is the PCB of example(s) 1 or any preceding or subsequent example(s) or combination of examples, further comprising at least one connector coupled to the PCB, wherein the at least one connector is coupleable to an external device.

[0040] Example 3 is the PCB of example(s) 2 or any preceding or subsequent example(s) or combination of examples, wherein the at least one connector is positioned at least one of along an edge of the PCB or at an offset distance from the edge of the PCB.

[0041] Example 4 is the PCB of example(s) 1 or any preceding or subsequent example(s) or combination of examples, wherein the stacking opening is threaded.

[0042] Example 5 is the PCB of example(s) 1 or any preceding or subsequent example(s) or combination of examples, wherein the stacking opening comprises a grommet.

[0043] Example 6 is the PCB of example(s) 1 or any preceding or subsequent example(s) or combination of examples, wherein at least one end portion of the stacking member is insertable into the stacking opening.

[0044] Example 7 is the PCB of example(s) 6 or any preceding or subsequent example(s) or combination of examples, wherein the stacking member comprises a rod.

[0045] Example 8 is the PCB of example(s) 1 or any preceding or subsequent example(s) or combination of examples, further comprising a plurality of stacking openings, wherein each corner of the PCB substrate comprises at least one of the plurality of stacking openings.

[0046] Example 9 is a portable electronics system, which may incorporate features of any of the preceding or subsequent example(s), comprising: a printed circuit board (“PCB”) comprising a stacking opening extending at least partially through the PCB; a second PCB comprising a second stacking opening extending at least partially through the second PCB; and a stacking member engageable with the stacking opening and the second stacking opening, wherein the stacking member is positioned between the PCB and the second PCB.

[0047] Example 10 is the portable electronics system of example(s) 9 or any preceding or subsequent example(s) or combination of examples, wherein a distance between the PCB and the second PCB is less than 2 inches.

[0048] Example 11 is the portable electronics system of example(s) 9 or any preceding or subsequent example(s) or combination of examples, wherein the PCB further comprises at least one connector coupled to the PCB, wherein the at least one connector is coupleable to an external device.

[0049] Example 12 is the portable electronics system of example(s) 11 or any preceding or subsequent example(s) or combination of examples, wherein the at least one connector is positioned at least one of along an edge of the PCB or at an offset distance from the edge of the PCB.

[0050] Example 13 is the portable electronics system of example(s) 9 or any preceding or subsequent example(s) or combination of examples, wherein at least one of the stacking opening or the second stacking opening is threaded.

[0051] Example 14 is the portable electronics system of example(s) 9 or any preceding or subsequent example(s) or combination of examples, wherein at least one of the stacking opening and the second stacking opening comprises a grommet.

[0052] Example 15 is the portable electronics system of example(s) 9 or any preceding or subsequent example(s) or combination of examples, wherein the PCB further comprises a plurality of stacking openings, wherein each corner of the PCB comprises at least one of the plurality of stacking openings. [0053] Example 16 is the portable electronics system of example(s) 9 or any preceding or subsequent example(s) or combination of examples, wherein at least one first end portion of the stacking member is insertable into the stacking opening and at least one second end portion of the stacking member is insertable into the second stacking opening.

[0054] Example 17 is the portable electronics system of example(s) 16 or any preceding or subsequent example(s) or combination of examples, wherein the stacking member comprises a rod.

[0055] Example 18 is the portable electronics system of example(s) 16 or any preceding or subsequent example(s) or combination of examples, wherein the stacking member comprises a central portion having a diameter that is larger than a diameter of at least one of the at least one first end portion and the at least one second end portion.

[0056] Example 19 is the portable electronics system of example(s) 18 or any preceding or subsequent example(s) or combination of examples, wherein the central portion comprises at least one ledge that abuts a surface of at least one of the PCB or the second PCB.

[0057] Example 20 is a portable electronics system, which may incorporate features of any of the preceding example(s), comprising: a motherboard comprising a printed circuit board (“PCB”) comprising a plurality of stacking openings extending through the PCB, wherein a stacking opening of the plurality of stacking openings is positioned at each corner of the PCB: a second PCB comprising a plurality of second stacking openings extending through the second PCB, wherein a second stacking opening of the plurality of second stacking openings is positioned at each corner of the second PCB; and a plurality of stacking rods, each stacking rod of the plurality of stacking rods comprising: a first end portion, a second end portion, a central portion, a first ledge formed between the first end portion and the central portion, and a second ledge formed between the second end portion and the central portion; wherein the first end portion is inserted into a respective stacking opening of the plurality of stacking openings and the first ledge abuts a surface of the PCB; wherein the second end portion is inserted into a respective second stacking opening of the plurality of second stacking openings and the second ledge abuts a second surface of the PCB; wherein the plurality of stacking rods are positioned between the PCB and the second PCB; and wherein a distance between the PCB and the second PCB is less than 2 inches.

[0058] Different arrangements of the components depicted in the drawings or described above, as well as components and steps not shown or described are possible. Similarly, some features and sub-combinations are useful and may be employed without reference to other features and sub -combinations.

Embodiments of the invention have been described for illustrative and not restrictive purposes, and alternative embodiments will become apparent to readers of this patent. Accordingly, the present invention is not limited to the embodiments described above or depicted in the drawings, and various embodiments and modifications may be made without departing from the scope of the claims below.

Claims

Claims That which is claimed is:

1. A printed circuit board (“PCB”) comprising: a PCB substrate comprising a conductive trace; and a stacking opening extending at least partially through the PCB substrate and engageable with a stacking member.

2. The PCB of claim 1, further comprising at least one connector coupled to the PCB, wherein the at least one connector is coupleable to an external device.

3. The PCB of claim 2, wherein the at least one connector is positioned at least one of along an edge of the PCB or at an offset distance from the edge of the PCB.

4. The PCB of claim 1, wherein the stacking opening is threaded.

5. The PCB of claim 1, wherein the stacking opening comprises a grommet.

6. The PCB of claim 1, wherein at least one end portion of the stacking member is insertable into the stacking opening.

7. The PCB of claim 6, wherein the stacking member comprises a rod.

8. The PCB of claim 1, further comprising a plurality of stacking openings, wherein each corner of the PCB substrate comprises at least one of the plurality of stacking openings.

9. A portable electronics system comprising: a printed circuit board (“PCB”) comprising a stacking opening extending at least partially through the PCB; a second PCB comprising a second stacking opening extending at least partially through the second PCB; and a stacking member engageable with the stacking opening and the second stacking opening, wherein the stacking member is positioned between the PCB and the second PCB.

10. The portable electronics system of claim 9, wherein a distance between the PCB and the second PCB is less than 2 inches.

11. The portable electronics system of claim 9, wherein the PCB further comprises at least one connector coupled to the PCB, wherein the at least one connector is coupleable to an external device.

12. The portable electronics system of claim 11, wherein the at least one connector is positioned at least one of along an edge of the PCB or at an offset distance from the edge of the PCB.

13. The portable electronics system of claim 9, wherein at least one of the stacking opening or the second stacking opening is threaded.

14. The portable electronics system of claim 9, wherein at least one of the stacking opening and the second stacking opening comprises a grommet.

15. The portable electronics system of claim 9, wherein the PCB further comprises a plurality of stacking openings, wherein each corner of the PCB comprises at least one of the plurality of stacking openings.

16. The portable electronics system of claim 9, wherein at least one first end portion of the stacking member is insertable into the stacking opening and at least one second end portion of the stacking member is insertable into the second stacking opening.

17. The portable electronics system of claim 16, wherein the stacking member comprises a rod.

18. The portable electronics system of claim 16, wherein the stacking member comprises a central portion having a diameter that is larger than a diameter of at least one of the at least one first end portion and the at least one second end portion.

19. The portable electronics system of claim 18, wherein the central portion comprises at least one ledge that abuts a surface of at least one of the PCB or the second PCB.

20. A portable electronics system comprising: a motherboard comprising a printed circuit board (“PCB”) comprising a plurality of stacking openings extending through the PCB, wherein a stacking opening of the plurality of stacking openings is positioned at each corner of the PCB; a second PCB comprising a plurality of second stacking openings extending through the second PCB, wherein a second stacking opening of the plurality of second stacking openings is positioned at each corner of the second PCB; and a plurality of stacking rods, each stacking rod of the plurality of stacking rods comprising: a first end portion, a second end portion, a central portion, a first ledge formed between the first end portion and the central portion, and a second ledge formed between the second end portion and the central portion; wherein the first end portion is inserted into a respective stacking opening of the plurality of stacking openings and the first ledge abuts a surface of the PCB; wherein the second end portion is inserted into a respective second stacking opening of the plurality of second stacking openings and the second ledge abuts a second surface of the PCB; wherein the plurality of stacking rods are positioned between the

PCB and the second PCB; and wherein a distance between the PCB and the second PCB is less than 2 inches.