WO2023167087A1 - Cooling member, cooler, cooling device, and cooling member manufacturing method - Google Patents

Cooling member, cooler, cooling device, and cooling member manufacturing method Download PDF

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Publication number
WO2023167087A1
WO2023167087A1 PCT/JP2023/006574 JP2023006574W WO2023167087A1 WO 2023167087 A1 WO2023167087 A1 WO 2023167087A1 JP 2023006574 W JP2023006574 W JP 2023006574W WO 2023167087 A1 WO2023167087 A1 WO 2023167087A1
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Prior art keywords
electrolytic
working fluid
metal foil
electrolytic metal
heating element
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PCT/JP2023/006574
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French (fr)
Japanese (ja)
Inventor
昌司 森
正 関口
侑也 林田
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国立大学法人九州大学
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Publication of WO2023167087A1 publication Critical patent/WO2023167087A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a cooling member, a cooler, a cooling device, and a method for manufacturing the cooling member.
  • a cooler that uses a boiling method that cools a heating element from the outside with a working fluid such as water is known.
  • Boiling methods include the pool boiling method and the forced flow boiling method. Among them, the cooling mechanism for the heating element by the pool boiling method will be described.
  • a conventional pool boiling type cooler generally comprises a container and a working fluid contained in the container, and the container has a contact portion with a heating element to be cooled. When heat is generated in the heating element and transferred to the working fluid through the contact portion, the working fluid in the vicinity of the contact portion boils. When vapor is generated by boiling, the working fluid is supplied to the contact portion due to the difference in gas-liquid density. The newly supplied working fluid thus evaporates further and removes heat from the heating element.
  • the pool boiling type cooler does not require an external power source for circulating the liquid unlike the forced flow boiling type cooler, so it is advantageous in terms of compactness and energy saving.
  • Patent Document 1 In order to address such a problem, in Patent Document 1, separate porous bodies are laminated to form two layers, which are provided between the heating element and the water in the cooling container, and the capillary action of the porous bodies causes the water to cool. is supplied to the heating element, and the steam generated thereby is discharged into the water in the container, thereby improving the conventional critical heat flux with a simple structure.
  • the cooling member is configured by integrally forming two layers of electrolytic metal foils with different average pore sizes, and the electrolytic metal foil with a relatively small average pore size and the average pore size are relatively small. It was found that by providing the relatively large electrolytic metal foils in this order from the heating element side, the critical heat flux is improved and a cooler having a good cooling effect can be obtained.
  • the two layers of electrolytic metal foil supply the working fluid to the surface of the heating element by capillary action when they are provided in a container containing the working fluid so as to face the heating element.
  • the cooling member according to (1) comprising a working fluid supply section and a steam discharge section for discharging steam generated on the surface of the heating element to the working fluid side.
  • a boiling type cooler for cooling a heating element, a container containing a working fluid; a cooling member according to any one of (1) to (3) provided in the container so as to face the surface of the heating element; with
  • the cooling member is a cooler in which an electrolytic metal foil having a relatively small average pore size and an electrolytic metal foil having a relatively large average pore size are provided in this order from the heating element side.
  • a working fluid introducer provided so as to be laminated on the side of the working fluid of the electrolytic metal foil having a relatively large average pore diameter, and introducing the working fluid to the electrolytic metal foil having a relatively large average pore diameter.
  • the cooler according to (4) further comprising: (6) the cooler according to (4) or (5); a condenser connected to the vessel of the cooler to liquefy vaporized working fluid; cooling system. (7) forming a first layer of electrolytic metal foil having a relatively small average pore size by electrolytic deposition, and subsequently forming a second layer of electrolytic metal foil having a relatively large average pore size by electrolytic deposition; A method of manufacturing a cooling member in which the electrolytic metal foil composed of two layers of porous bodies with different average pore diameters is integrally formed by forming on the electrolytic metal foil.
  • a cooling member it is possible to provide a cooling member, a cooler, a cooling device, and a method of manufacturing a cooling member that have a good cooling effect.
  • FIG. 3 is a schematic diagram of a boiling-type cooler 10 according to another embodiment of the present invention
  • 1 is a plan view of a porous body having a honeycomb structure
  • FIG. 3 is a schematic diagram of a boiling-type cooler 10 according to another embodiment of the present invention
  • 1 is a schematic diagram of a cooling device 20 having a cooler 10 according to an embodiment of the invention
  • FIG. It is a schematic diagram of the electrolytic deposition apparatus which concerns on a test example.
  • (A) is an SEM cross-sectional observation photograph from directly above an electrolytic copper foil produced by applying a current of 3 A for 5 minutes
  • (B) is a two-layer electrolytic copper foil produced under the conditions of (3) in the test example. It is a SEM cross-sectional observation photograph from directly above. It is an SEM cross-sectional observation photograph of a cross section of a two-layer electrolytic copper foil produced under the condition (3) of the test example. It is a schematic diagram of the pool boiling test apparatus of a test example. It is a boiling curve obtained by a test example.
  • FIG. 1 is a schematic diagram of a cooling member 14 according to an embodiment of the present invention and a boil-type cooler 10 including the cooling member 14 .
  • the cooler 10 includes a container 12 containing a working fluid 11 , and a cooling member 14 provided in the container 12 so as to be in contact with the working fluid 11 and to face the surface of the heating element 13 .
  • the working fluid 11 for example, liquids having surface tension such as water, low-temperature fluids, refrigerants, and organic solvents can be used.
  • electric An insulating fluid can also be suitably used.
  • the cooling member 14 is composed of a porous material. Since the cooling member 14 is made of a porous material, the working fluid 11 can be supplied to the surface of the heating element 13 by capillary action. Also, the pores of the porous body can serve as boiling nuclei near the surface of the heating element 13 .
  • the porous body of the cooling member 14 is made of a porous electrolytic metal foil. More specifically, the cooling member 14 has a structure in which two layers of electrolytic metal foils with different average pore sizes are integrally formed, and the electrolytic metal foil 22 with a relatively small average pore size and the electrolytic metal foil 22 with a relatively small average pore size A relatively large electrolytic metal foil 23 is provided in this order from the heating element 13 side.
  • the first layer of the electrolytic metal foil 22 supplies the working fluid to the vicinity of the surface of the heating element 13 by capillary action when the working fluid evaporates near the surface of the heating element 13, but there is a limit mechanism of liquid supply by capillary force.
  • the capillary length that is, the thickness of the first layer of electrolytic metal foil 22
  • the limit ie, the limit heat flux.
  • vapor masses are formed on the surface of the heating element 13 under high heat flux conditions, and the volume of the vapor mass increases with time, and eventually the vapor masses are cut off from the surface of the heating element 13 .
  • a liquid film of finite thickness generally called a macro liquid film
  • the heat flux at this time is called the critical heat flux.
  • the thickness of the first electrodeposited metal foil 22 is preferably thin because of the limit mechanism of liquid supply by capillary force (capillary limit mechanism) as described above. Drying of the liquid tends to occur in the vicinity of the surface of the electrolytic metal foil 22, and the critical heat flux becomes small.
  • the porous body provided in the vicinity of the surface of the heating element 13 is the electrolytic metal foil 22 having a relatively small average pore diameter, and thereon (on the working fluid side) a relatively large average pore diameter That is, an electrolytic metal foil 23 having a relatively high working fluid permeability is provided.
  • the working fluid is abundantly supplied toward the first-layer electrolytic metal foil 22 between the first-layer electrolytic metal foil 22 and the vapor mass above it. Since the metal foil 23 exists, even if the thickness of the first electrodeposited metal foil 22 is reduced, the occurrence of liquid drying is suppressed, and the critical heat flux can be prevented from being reduced.
  • the thickness of the electrolytic metal foil 23 of the second layer is preferable to increase the thickness of the electrolytic metal foil 23 of the second layer because the larger the amount of liquid supplied to the electrolytic metal foil 23 of the second layer, the better.
  • the thickness of the second-layer electrolytic metal foil 23 is preferably about 1 to 2 mm or more.
  • the types of the electrolytic metal foils 22 and 23 are not particularly limited as long as they can be made porous by gas bubbles during electrolytic deposition as described later. Electrolytic copper foil, electrolytic copper alloy foil, electrolytic aluminum foil, Electrolytic aluminum alloy foil, electrolytic nickel foil, electrolytic nickel alloy foil, electrolytic iron foil, electrolytic iron alloy foil and the like can be used, and electrolytic copper foil and electrolytic copper alloy foil are particularly preferred.
  • the copper component of the base material includes Sn, Ag, Au, Co, Cr, Fe, In, Ni, P, Si, Te, Ti, Zn, B, Mn and Zr.
  • the copper alloy may be constituted by containing 0.001 to 4.0% by mass of one or more of them in total.
  • an oxide film may be formed on the surfaces of the electrolytic metal foils 22 and 23 . When the oxide film is formed, the wettability is improved, so that the working fluid can be supplied smoothly.
  • the cooling member 14 has a structure in which two layers of electrolytic metal foils 22 and 23 with different average pore diameters are integrally formed.
  • integrated formation means that the first layer of the electrolytic metal foil 22 is first formed by electrolytic deposition under predetermined electrolytic conditions, and then the second layer is formed by changing the electrolytic conditions. of the electrolytic metal foil 23 is formed.
  • Such an integrally formed electrolytic metal foil can be easily confirmed by observing the cross section of two layers of electrolytic metal foil, and is simply formed by stacking two layers of separately formed electrolytic metal foils. It can be easily distinguished from laminates.
  • one electrolytic metal foil and the other electrolytic metal foil are only superimposed.
  • the boundary is identified as a very sharp line, and the two layers of electrolytic metal foil are not chemically bonded at the interface.
  • the second layer of electrolytic metal foil is electrolytically deposited on the first electrolytic metal foil.
  • the second-layer electrolytic metal foil has a structure in which the second-layer electrolytic metal foil is deposited on the surface of the first-layer electrolytic metal foil. For this reason, it is possible to easily distinguish between the structure of a laminate in which two layers of separately formed electrolytic metal foils are laminated and the structure in which the two layers of electrolytic metal foils 22 and 23 according to the present invention are integrally formed. can.
  • the electrodeposited metal foils 22 and 23 become porous due to the influence of air bubbles generated during electrolytic deposition in the manufacturing method.
  • the pore sizes of the electrolytic metal foils 22 and 23, which are porous bodies, can be adjusted by the electrolysis conditions.
  • the average pore diameters of the electrolytic metal foils 22 and 23 can be obtained by measuring the diameters of arbitrary 10 pores, for example, from SEM observation photographs of cross sections, and calculating the average value thereof.
  • the first layer of electrolytic metal foil 22 provided on the heating element 13 side typically has an average pore size of 75 to 150 ⁇ m.
  • the second-layer electrolytic metal foil 23 provided on the working fluid 11 side has an average pore diameter relatively larger than that of the first-layer electrolytic metal foil 22, typically 300 to 450 ⁇ m.
  • Electrolytic metal foils 22 and 23 are, as shown in FIG. A steam discharge part 17 that discharges to the fluid 11 side may be provided.
  • An example of the porous electrolytic metal foil having the working fluid supply portion 16 and the vapor discharge portion 17 is a porous electrolytic metal foil having a honeycomb structure, as shown in the plan view of FIG. .
  • the working fluid supply part 16 of the first-layer electrolytic metal foil 22 supplies the working fluid 11 to the vicinity of the surface of the heating element 13 by capillary action of the grid-like porous body portion around the holes of the honeycomb structure. .
  • the vapor discharge portion 17 of the first-layer electrolytic metal foil 22 discharges the vapor generated by the heat from the heating element 13 to the second-layer electrolytic metal foil 23 side through the holes of the honeycomb structure.
  • the holes of the honeycomb structure function as a steam discharge part 17 for discharging the steam discharged from the electrolytic metal foil 22 of the first layer to the side of the working fluid 11 .
  • the second-layer electrolytic metal foil 23 has a higher permeability of the working fluid 11 than the first-layer electrolytic metal foil 22 and has a function of retaining the working fluid 11. It functions so that the working fluid 11 is rapidly supplied to the electrolytic metal foil 22 of the first layer even while the coalesced bubbles remain in the upper part.
  • the shape of the holes of the honeycomb structure of the electrolytic metal foils 22 and 23 can be various shapes such as polygonal, circular, and elliptical. Indicates the radius of the circle. Since the contact area of the porous body with the surface of the heating element 13 becomes large, the hole radius of the honeycomb structure for releasing the steam generated at the contact portion into the water should be small. can. In addition, since the pressure loss when passing through the porous bottom can be reduced, the gap between the holes of the honeycomb structure for releasing the steam generated at the contact portion into the water is preferably small, for example, 100 to 1000 ⁇ m. be able to.
  • FIG. 2 illustrates the working fluid supply portion 16 and the steam discharge portion 17 so as to be perpendicular to the surface of the lower heating element 13 and the upper side of the working fluid 11 side
  • the working fluid supply portion 16 and the steam discharge portion 17 are perpendicular to each other. is configured so that, for example, a curved path or a bent path is provided instead of being perpendicular to each other as long as it provides a path between the surface facing the surface of the heating element 13 and the surface on the side of the working fluid 11. may have been
  • the cooler 10 is provided so as to be laminated on the working fluid 11 side of the second layer electrolytic metal foil 23 of the cooling member 14, and the working fluid 11 is electrolyzed in the second layer. It is preferable to further include a working fluid introducing body 18 having a working fluid introducing portion 19 leading to the metal foil 23 .
  • the thickness of the electrolytic metal foils 22 and 23 of the cooling member 14 should be thin from the viewpoint of the capillary limit mechanism. There is a problem that the heat flux becomes small. On the other hand, as shown in FIG.
  • the working fluid introduction body 18 for introducing the working fluid 11 to the electrolytic metal foils 22 and 23 on the electrolytic metal foils 22 and 23 (on the working fluid side), electrolysis can be performed. Between the metal foils 22, 23 and the vapor mass above them, the working fluid 11 is abundantly supplied toward the electrolytic metal foils 22, 23 and the working fluid 11 is retained above the electrolytic metal foils 22, 23. A fluid introducer 18 is present. Therefore, even if the thickness of the electrolytic metal foils 22 and 23 is reduced, it is possible to suppress the occurrence of liquid depletion and prevent the critical heat flux from becoming small. In addition, it is preferable to increase the thickness of the working fluid introducer 18 because the larger the liquid supply amount of the working fluid introducer 18 is, the better. Specifically, for example, when the thickness of each of the electrolytic metal foils 22 and 23 is reduced to about 100 ⁇ m, the thickness of the working fluid introduction body 18 is preferably about 1 mm or more.
  • the working fluid introduction body 18 may have a plurality of holes penetrating in the height direction, and the plurality of holes may constitute the working fluid introduction part 19 . Moreover, the plurality of holes that constitute the working fluid introduction part 19 may have a circular or polygonal cross section.
  • the material constituting the working fluid introducer 18 may be a porous material or a non-porous material.
  • a material for forming the working fluid introduction member 18 metal such as stainless steel and Teflon (registered trademark), resin, or the like can be used.
  • the working fluid introduction body 18 by forming the working fluid introduction body 18 from metal, the wettability of the working fluid introduction body 18 is improved and the hydrophilicity is improved, so that a larger amount of the working fluid 11 is taken in and supplied to the surface of the heating element 13. It becomes possible to
  • cooling can be performed by immersing the entire heating element 13 in the working fluid 11, or partially immersing the heating element 13 from the liquid surface of the working fluid 11.
  • the heating element 13 may take various forms, such as a floating state or a state placed on the bottom surface of the container 12, depending on the circumstances.
  • cooling member 14 By attaching the cooling member 14, cooling can be performed in the same manner as in the above example.
  • a cooling member having a configuration in which two layers of electrolytic metal foils having different average pore diameters are integrally formed is produced using an electrolytic deposition apparatus.
  • the anode and cathode of the electrolytic deposition apparatus are electrically connected to a power supply.
  • a plating solution for a predetermined metal is provided in the electrolytic bath.
  • the amount of plating solution in the electrolytic bath is not particularly limited, but may be 200 to 400 mL.
  • metal ions contained in the plating solution in the electrolytic bath receive electrons on the cathode and the metal is deposited.
  • hydrogen ions contained in the plating solution in the electrolytic bath receive electrons on the cathode and become hydrogen gas.
  • the deposition reaction of these metals and the generation of hydrogen gas occur simultaneously, the hydrogen gas partially hinders the deposition reaction of the metal, and a porous structure of the metal is formed on the surface of the cathode.
  • the current value and, if necessary, the deposition reaction time are adjusted while the plating solution in the electrolytic bath remains unchanged.
  • a second layer of electrolytic metal foil is similarly formed (electrodeposited) on the first layer of electrolytic metal foil.
  • hydrogen gas can be generated more actively by increasing the current value during the electrolysis as compared to that during the production of the first electrodeposited metal foil. Therefore, the average pore diameter of the second-layer electrolytic metal foil can be made relatively larger than the average pore diameter of the first-layer electrolytic metal foil.
  • a current density of 0.38 to 0.46 A/cm 2 is applied for 4 to 6 minutes, and the average pore size is relatively small.
  • a low current of 0.3 A is preferably applied for 30 minutes in order to increase the strength of the electrolytic metal foil, which is a porous body.
  • the integrally formed two-layer electrolytic metal foil is peeled off from the cathode.
  • a container is provided so that the surface thereof becomes a part of the wall surface of the container, and the two layers of electrolytic metal foils are arranged so that the first electrolytic metal foil having a relatively small average pore diameter is It is placed on the surface of the heating element so as to face the surface of the desired heating element.
  • a honeycomb-structured working fluid introducing member made of stainless steel or the like may be further disposed on the second layer of the electrolytic metal foil.
  • the container is then filled with the desired working fluid. In this way, a boiling type cooler for cooling the heating element can be manufactured.
  • the working fluid may be placed in the container before placing the electrolytic copper foil.
  • FIG. 5 shows a schematic diagram of a cooling device 20 comprising a cooler 10 according to an embodiment of the invention.
  • the cooling device 20 comprises a cooler 10 and a condenser 21 connected to the container 12 .
  • the condenser 21 the vaporized working fluid 11 is condensed and returned to the container 12 .
  • the cooling device 20 does not require an external power source such as a pump, and is excellent in compactness and energy saving as a whole device.
  • the cooler 10 and the cooling device 20 of the present invention can be applied to various electronic devices, nuclear reactor pressure vessels, and other general thermal devices having high heat generation densities.
  • high-performance capillary pump loops, semiconductor lasers, data center server cooling, CFC-cooled chopper controllers, and power electronic equipment can be considered.
  • it can be applied to a water-cooling jacket installed on the side or bottom of a fire-resistant wall for externally cooling the fire-resistant wall of a large refuse incinerator or the like to reduce damage.
  • the electrolytic deposition apparatus had an anode (copper plate) and a cathode (disc-shaped copper plate with a diameter of 30 mm), each of which was electrically connected to a DC power supply.
  • Each copper plate had a purity of 99.96%, a thickness of 0.3 mm, and a distance between electrodes of 2 cm.
  • 200 mL of a plating solution containing 0.4 mol/L of CuSO 4 and 1.5 mol/L of H 2 SO 4 was prepared as a copper sulfate plating bath.
  • disc-shaped electrolytic copper foils with a diameter of 30 mm were produced under the following conditions (1) to (5). did.
  • a single-layer electrolytic copper foil was produced by applying a current of 3 A for 4 minutes.
  • a single-layer electrolytic copper foil was produced by applying a current of 3 A for 12 minutes.
  • a current of 3 A was applied for 5 minutes to prepare a first layer of electrolytic copper foil, and then a current of 6 A was applied for 5 minutes to integrally form a second layer of electrolytic copper foil on the first layer of electrolytic copper foil. .
  • a current of 3 A was applied for 5 minutes to prepare a first layer of electrolytic copper foil, and then a current of 6 A was applied for 10 minutes to integrally form a second layer of electrolytic copper foil on the first layer of electrolytic copper foil. .
  • a current of 3 A was applied for 5 minutes to prepare a first layer of electrolytic copper foil, and then a current of 6 A was applied for 15 minutes to integrally form a second layer of electrolytic copper foil on the first layer of electrolytic copper foil.
  • copper and hydrogen are generated according to the chemical reaction formula shown above according to the number of flowing electrons, the experiment was conducted in the constant current mode. The applied voltage varied with the copper deposits.
  • FIG. 7(A) shows an SEM cross-sectional observation photograph from directly above of the electrolytic copper foil produced by applying a current of 3 A for 5 minutes.
  • FIG. 7(B) shows a SEM cross-sectional observation photograph taken from directly above the two-layer electrolytic copper foil produced under the conditions of (3) above.
  • the pore diameter of the porous electrodeposited copper foil formed at a current of 3A is about 150 ⁇ m, while the porous electrodeposited copper foils formed at a current of 3.0A and 6.0A, respectively, have a pore diameter of about 150 ⁇ m. It can be seen that the pore diameter is as large as about 250 ⁇ m. Therefore, it can be seen that if the current value during electrolytic deposition is large, the pore size of the porous material becomes relatively large, and as a result, the average pore size becomes relatively large.
  • FIG. 8 shows an SEM cross-sectional observation photograph of the two-layer electrolytic copper foil produced under the conditions of (3) above.
  • the first electrodeposited copper foil and the second electrodeposited copper foil are integrally formed by electrolytic deposition, the boundary line between them is unclear. For this reason, it can be seen that the integrally formed two-layer electrolytic copper foil can be easily distinguished from a laminate formed by simply stacking two layers of separately formed electrolytic metal foils.
  • FIG. 9 shows a schematic diagram of the pool boiling test apparatus.
  • the surface of the heating element was at the same height as the bottom of the pool, and the diameter of the surface of the heating element in contact with the working fluid was 30 mm.
  • Electrodeposited copper foils prepared under the conditions (1) to (5) by the above-described electrolytic deposition method were fixed on the surface of the copper block by soldering.
  • a copper block on which no electrolytic copper foil was provided was treated as a "bare surface” and similarly used as an experimental object. Heating was provided by a cartridge heater embedded in the bottom of the copper block.
  • a K-type sheath thermocouple with a diameter of 0.5 mm is placed on the central axis of the cylindrical portion of the copper block at positions 10 mm (TC1), 15 mm (TC2), 20 mm (TC3), and 25 mm (TC4) below the surface of the heating element. was installed, and the heat transfer surface temperature was calculated from the measured values of these thermocouples, and the heat flux on the surface of the heating element was calculated from the indicated temperature difference, the set distance, and the thermal conductivity of copper by Fourier's equation.
  • the pool was made of Pyrex (registered trademark) glass with an inner diameter of 87 mm, and internal boiling was observed.
  • the working fluid was distilled water, the water depth was 60 mm, and the system pressure was 0.1 MPa.
  • the generated vapor was condensed in a cooler and returned to the container.
  • heating was performed while increasing the voltage applied to the cartridge heater by about 5 V (in steps of about 0.10 MW/m 2 ). Steady state was assumed to be reached and measurements were taken. The above operation was repeated until a steady state could not be maintained and the wall temperature began to rise rapidly, causing burnout. When burnout occurred, the heating was stopped immediately, and the heat flux just before that was taken as the critical heat flux.
  • FIG. 10 shows boiling curves obtained by the above experiment.
  • Electrodeposited copper foil having a two-layer integrated structure formed by electrolytic deposition at current values of 3 A and 6 A has a greater heat removal capacity than a single-layer electrolytic copper foil electrodeposited at a current value of 3 A.
  • the factors for this are the electrolytic copper foil in the lower layer, which has fine pores in the porous body and more dendritic copper deposits are in contact with the surface of the heating element, and the structure with large gaps through which steam is easily discharged, but the liquid retention It is thought that the two-layer integrated structure with the upper electrodeposited copper foil, which has high performance, prevented the liquid from drying up on the surface of the heating element.
  • the electrodeposited copper foil with the two-layer integrated structure it was possible to achieve a maximum heat flux of 400 W/cm 2 , about four times that of the bare surface.
  • Cooler 11 Working fluid 12 Container 13 Heating element 14 Cooling member 16 Working fluid supply unit 17 Steam discharge unit 18 Working fluid introduction member 19 Working fluid introduction unit 20 Cooling device 21 Capacitor 22 Electrolytic metal foil with relatively small average pore diameter (Electrodeposited copper foil for the first layer) 23 Electrolytic metal foil with relatively large average pore diameter (second-layer electrolytic copper foil)

Abstract

Provided are a cooling member having a favorable cooling effect, a cooler, a cooling device, and a cooling member manufacturing method. The cooling member comprises integrally formed electrolytic metal foils constituted by a double-layer porous material, each layer having different mean pore sizes.

Description

冷却部材、冷却器、冷却装置及び冷却部材の製造方法Cooling member, cooler, cooling device, and method for manufacturing cooling member
 本発明は、冷却部材、冷却器、冷却装置及び冷却部材の製造方法に関するものである。 The present invention relates to a cooling member, a cooler, a cooling device, and a method for manufacturing the cooling member.
 発熱体を外部から水等の作動流体で冷却する沸騰方式を用いた冷却器が知られている。沸騰方式には、プール沸騰方式と、強制流動沸騰方式がある。このうち、プール沸騰方式による発熱体の冷却機構について説明する。従来のプール沸騰方式による冷却器は、一般に、容器と、容器内に収容された作動流体とを備え、容器は、冷却対象である発熱体との接触部を有する。発熱体において熱が発生し、接触部を通して作動流体に熱が伝わると、接触部の近傍に存在する作動流体が沸騰する。沸騰により蒸気が生じると気液の密度差により接触部に作動流体が供給される。こうして新たに供給された作動流体がさらに蒸発し、発熱体から熱を除去する。プール沸騰方式による冷却器は、強制流動沸騰方式のような液体を循環させるための外部動力源が不要であるため、コンパクト性および省エネルギー性に有利である。 A cooler that uses a boiling method that cools a heating element from the outside with a working fluid such as water is known. Boiling methods include the pool boiling method and the forced flow boiling method. Among them, the cooling mechanism for the heating element by the pool boiling method will be described. A conventional pool boiling type cooler generally comprises a container and a working fluid contained in the container, and the container has a contact portion with a heating element to be cooled. When heat is generated in the heating element and transferred to the working fluid through the contact portion, the working fluid in the vicinity of the contact portion boils. When vapor is generated by boiling, the working fluid is supplied to the contact portion due to the difference in gas-liquid density. The newly supplied working fluid thus evaporates further and removes heat from the heating element. The pool boiling type cooler does not require an external power source for circulating the liquid unlike the forced flow boiling type cooler, so it is advantageous in terms of compactness and energy saving.
 しかしながら、接触部に大きな熱流束が加えられると、作動流体の蒸発量が増加し、接触部が蒸気に覆われ始める。接触部が完全に蒸気に覆われて乾燥状態となり、接触部へ作動流体が供給されなくなると、冷却器の冷却能力は著しく劣化する。この状態の熱流束を「限界熱流束(CHF:Critical Heat Flux)」という。 However, when a large heat flux is applied to the contact area, the amount of evaporation of the working fluid increases and the contact area begins to be covered with steam. When the contact portion is completely covered with steam and becomes dry, and the working fluid is no longer supplied to the contact portion, the cooling capacity of the cooler significantly deteriorates. The heat flux in this state is called "critical heat flux (CHF)".
 このような問題に対し、特許文献1では、別個の多孔質体を積層させて二層とし、これを発熱体と冷却容器内の水との間に設けて、多孔質体の毛細管現象により水を発熱体へ供給しつつ、それにより発生した蒸気を容器内の水中へ排出する構造とすることで、簡易な構造で従来の限界熱流束を向上させている。 In order to address such a problem, in Patent Document 1, separate porous bodies are laminated to form two layers, which are provided between the heating element and the water in the cooling container, and the capillary action of the porous bodies causes the water to cool. is supplied to the heating element, and the steam generated thereby is discharged into the water in the container, thereby improving the conventional critical heat flux with a simple structure.
特開2016-40505号公報JP 2016-40505 A
 しかしながら、近年の電子素子等の発熱体の発熱密度の増加に対応するためには、冷却器の更なる冷却効果の向上が望まれている。 However, in order to cope with the recent increase in the heat generation density of heat generating bodies such as electronic devices, it is desired to further improve the cooling effect of the cooler.
 本発明は、このような問題を解決すべく、良好な冷却効果を有する冷却部材、冷却器、冷却装置及び冷却部材の製造方法を提供することを課題とする。 In order to solve such problems, it is an object of the present invention to provide a cooling member, a cooler, a cooling device, and a method of manufacturing a cooling member that have a good cooling effect.
 本発明者らは研究を重ねたところ、冷却部材を平均細孔径が異なる二層の電解金属箔が一体形成された構成とし、平均細孔径が相対的に小さい電解金属箔及び平均細孔径が相対的に大きい電解金属箔を発熱体側からこの順で設けることで、限界熱流束が向上し、良好な冷却効果を有する冷却器が得られることを見出した。 As a result of repeated studies, the present inventors have found that the cooling member is configured by integrally forming two layers of electrolytic metal foils with different average pore sizes, and the electrolytic metal foil with a relatively small average pore size and the average pore size are relatively small. It was found that by providing the relatively large electrolytic metal foils in this order from the heating element side, the critical heat flux is improved and a cooler having a good cooling effect can be obtained.
 上記課題は、以下のように特定される本発明によって解決される。
(1)平均細孔径が異なる二層の多孔質体で構成された電解金属箔が一体形成されてなる冷却部材。
(2)前記二層の電解金属箔は、作動流体を収容する容器内において、発熱体に対向するように設けられたときに、それぞれ毛細管現象により前記作動流体を前記発熱体の表面に供給する作動流体供給部と、前記発熱体の表面で発生した蒸気を前記作動流体側へ排出する蒸気排出部とを備える(1)に記載の冷却部材。
(3)前記二層の電解金属箔は、それぞれハニカム構造を有している(2)に記載の冷却部材。
(4)発熱体を冷却するための沸騰方式による冷却器であって、
 作動流体を収容する容器と、
 前記容器内において、前記発熱体の表面に対向するように設けられた(1)~(3)のいずれかに記載の冷却部材と、
を備え、
 前記冷却部材は、前記平均細孔径が相対的に小さい電解金属箔及び前記平均細孔径が相対的に大きい電解金属箔が前記発熱体側からこの順で設けられている冷却器。
(5)前記平均細孔径が相対的に大きい電解金属箔の前記作動流体側に積層するように設けられ、前記作動流体を前記平均細孔径が相対的に大きい電解金属箔に導く作動流体導入体を更に備えた(4)に記載の冷却器。
(6)(4)または(5)に記載の冷却器と、
 前記冷却器の前記容器に接続され、蒸発した作動流体を液化するコンデンサと、
を備えた冷却装置。
(7)電解析出によって平均細孔径が相対的に小さい一層目の電解金属箔を形成し、続いて電解析出によって平均細孔径が相対的に大きい二層目の電解金属箔を前記一層目の電解金属箔上に形成することで、平均細孔径が異なる二層の多孔質体で構成された電解金属箔が一体形成されてなる冷却部材を製造する方法。
The above problems are solved by the present invention specified as follows.
(1) A cooling member integrally formed with an electrolytic metal foil composed of two layers of porous bodies having different average pore diameters.
(2) The two layers of electrolytic metal foil supply the working fluid to the surface of the heating element by capillary action when they are provided in a container containing the working fluid so as to face the heating element. The cooling member according to (1), comprising a working fluid supply section and a steam discharge section for discharging steam generated on the surface of the heating element to the working fluid side.
(3) The cooling member according to (2), wherein each of the two layers of electrolytic metal foil has a honeycomb structure.
(4) A boiling type cooler for cooling a heating element,
a container containing a working fluid;
a cooling member according to any one of (1) to (3) provided in the container so as to face the surface of the heating element;
with
The cooling member is a cooler in which an electrolytic metal foil having a relatively small average pore size and an electrolytic metal foil having a relatively large average pore size are provided in this order from the heating element side.
(5) A working fluid introducer provided so as to be laminated on the side of the working fluid of the electrolytic metal foil having a relatively large average pore diameter, and introducing the working fluid to the electrolytic metal foil having a relatively large average pore diameter. The cooler according to (4), further comprising:
(6) the cooler according to (4) or (5);
a condenser connected to the vessel of the cooler to liquefy vaporized working fluid;
cooling system.
(7) forming a first layer of electrolytic metal foil having a relatively small average pore size by electrolytic deposition, and subsequently forming a second layer of electrolytic metal foil having a relatively large average pore size by electrolytic deposition; A method of manufacturing a cooling member in which the electrolytic metal foil composed of two layers of porous bodies with different average pore diameters is integrally formed by forming on the electrolytic metal foil.
 本発明によれば、良好な冷却効果を有する冷却部材、冷却器、冷却装置及び冷却部材の製造方法を提供することができる。 According to the present invention, it is possible to provide a cooling member, a cooler, a cooling device, and a method of manufacturing a cooling member that have a good cooling effect.
本発明の実施形態に係る沸騰方式による冷却器10の模式図である。It is a schematic diagram of the cooler 10 by a boiling system which concerns on embodiment of this invention. 本発明の別の実施形態に係る沸騰方式による冷却器10の模式図である。FIG. 3 is a schematic diagram of a boiling-type cooler 10 according to another embodiment of the present invention; ハニカム構造を有する多孔質体の平面図である。1 is a plan view of a porous body having a honeycomb structure; FIG. 本発明の別の実施形態に係る沸騰方式による冷却器10の模式図である。FIG. 3 is a schematic diagram of a boiling-type cooler 10 according to another embodiment of the present invention; 本発明の実施形態に係る冷却器10を備えた冷却装置20の模式図である。1 is a schematic diagram of a cooling device 20 having a cooler 10 according to an embodiment of the invention; FIG. 試験例に係る電解析出装置の模式図である。It is a schematic diagram of the electrolytic deposition apparatus which concerns on a test example. (A)は3Aの電流を5分間流して作製した電解銅箔の真上からのSEM断面観察写真であり、(B)は試験例の(3)の条件で作製した二層の電解銅箔の真上からのSEM断面観察写真である。(A) is an SEM cross-sectional observation photograph from directly above an electrolytic copper foil produced by applying a current of 3 A for 5 minutes, and (B) is a two-layer electrolytic copper foil produced under the conditions of (3) in the test example. It is a SEM cross-sectional observation photograph from directly above. 試験例の(3)の条件で作製した二層の電解銅箔の断面のSEM断面観察写真である。It is an SEM cross-sectional observation photograph of a cross section of a two-layer electrolytic copper foil produced under the condition (3) of the test example. 試験例のプール沸騰試験装置の模式図である。It is a schematic diagram of the pool boiling test apparatus of a test example. 試験例によって得られた沸騰曲線である。It is a boiling curve obtained by a test example.
 次に本発明を実施するための形態を、図面を参照しながら詳細に説明する。本発明は以下の実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で、当業者の通常の知識に基づいて、適宜設計の変更、改良等が加えられることが理解されるべきである。 Next, embodiments for carrying out the present invention will be described in detail with reference to the drawings. It is understood that the present invention is not limited to the following embodiments, and that design changes, improvements, etc., can be made as appropriate based on the ordinary knowledge of those skilled in the art without departing from the scope of the present invention. should.
 <冷却部材及び冷却器>
 図1は、本発明の実施形態に係る冷却部材14、及び、冷却部材14を備えた沸騰方式による冷却器10の模式図である。冷却器10は、作動流体11を収容する容器12と、容器12内において、作動流体11と接するように且つ発熱体13の表面に対向するように設けられた冷却部材14とを備える。
<Cooling member and cooler>
FIG. 1 is a schematic diagram of a cooling member 14 according to an embodiment of the present invention and a boil-type cooler 10 including the cooling member 14 . The cooler 10 includes a container 12 containing a working fluid 11 , and a cooling member 14 provided in the container 12 so as to be in contact with the working fluid 11 and to face the surface of the heating element 13 .
 作動流体11としては、例えば水、低温流体、冷媒、有機溶媒等の表面張力を有する液体を用いることができる。また、近年の電子素子等の発熱体の発熱密度の増加に対応するため、フッ化炭素(FC)、フロン(CFC)、代替フロン(HCFC又はHFCなど)、純水、超純水等の電気絶縁性流体も好適に用いることができる。 As the working fluid 11, for example, liquids having surface tension such as water, low-temperature fluids, refrigerants, and organic solvents can be used. In addition, in order to cope with the recent increase in heat generation density of heat generating elements such as electronic elements, electric An insulating fluid can also be suitably used.
 冷却部材14は多孔質体で構成されている。冷却部材14が多孔質体で構成されていることにより、毛細管現象により発熱体13の表面に作動流体11を供給することができる。また、多孔質体の細孔が発熱体13の表面付近における沸騰の核となり得る。 The cooling member 14 is composed of a porous material. Since the cooling member 14 is made of a porous material, the working fluid 11 can be supplied to the surface of the heating element 13 by capillary action. Also, the pores of the porous body can serve as boiling nuclei near the surface of the heating element 13 .
 冷却部材14の多孔質体は、多孔質の電解金属箔で形成されている。より具体的には、冷却部材14は、平均細孔径が異なる二層の電解金属箔が一体形成された構成を有し、平均細孔径が相対的に小さい電解金属箔22及び平均細孔径が相対的に大きい電解金属箔23が発熱体13側からこの順で設けられている。一層目の電解金属箔22は、発熱体13の表面付近に作動流体の蒸発が起これば毛細管現象により発熱体13の表面付近に作動流体を供給するが、毛管力による液体供給の限界メカニズムを考慮すれば、毛細管の長さ(すなわち、一層目の電解金属箔22の厚さ)は薄いほうがよりその限界、すなわち限界熱流束を高くすることができる。一方、高熱流束条件下の発熱体13の表面上では蒸気塊が形成されるが、その蒸気塊の体積は時間と共に増大し、やがて発熱体13の表面から切断離脱する。この蒸気塊と接触部近傍をより詳細に説明すれば、蒸気塊と接触部の間(すなわち蒸気塊の底部)には、有限厚さの液膜(一般に、マクロ液膜と呼ばれる)が存在する。このような高熱流束条件下においては、蒸気塊がマクロ液膜上に滞留している間に蒸気塊底部のマクロ液膜が蒸発消耗し尽くすときにバーンアウトが発生する。このときの熱流束が限界熱流束と呼ばれる。一層目の電解金属箔22の厚さは、上述の通り毛管力による液体供給の限界メカニズム(毛管限界メカニズム)から薄いほうがよいが、薄過ぎてマクロ液膜の厚さと同程度であると、一層目の電解金属箔22の表面近傍で液枯れが生じやすく、限界熱流束が小さくなる。 The porous body of the cooling member 14 is made of a porous electrolytic metal foil. More specifically, the cooling member 14 has a structure in which two layers of electrolytic metal foils with different average pore sizes are integrally formed, and the electrolytic metal foil 22 with a relatively small average pore size and the electrolytic metal foil 22 with a relatively small average pore size A relatively large electrolytic metal foil 23 is provided in this order from the heating element 13 side. The first layer of the electrolytic metal foil 22 supplies the working fluid to the vicinity of the surface of the heating element 13 by capillary action when the working fluid evaporates near the surface of the heating element 13, but there is a limit mechanism of liquid supply by capillary force. Considering this, the smaller the capillary length (that is, the thickness of the first layer of electrolytic metal foil 22), the higher the limit, ie, the limit heat flux. On the other hand, vapor masses are formed on the surface of the heating element 13 under high heat flux conditions, and the volume of the vapor mass increases with time, and eventually the vapor masses are cut off from the surface of the heating element 13 . To explain the vapor mass and the vicinity of the contact portion in more detail, a liquid film of finite thickness (generally called a macro liquid film) exists between the vapor mass and the contact portion (that is, the bottom of the vapor mass). . Under such high heat flux conditions, burnout occurs when the macro-liquid film at the bottom of the vapor mass evaporates away while the vapor mass remains on the macro-liquid film. The heat flux at this time is called the critical heat flux. The thickness of the first electrodeposited metal foil 22 is preferably thin because of the limit mechanism of liquid supply by capillary force (capillary limit mechanism) as described above. Drying of the liquid tends to occur in the vicinity of the surface of the electrolytic metal foil 22, and the critical heat flux becomes small.
 そこで、本発明では、発熱体13の表面付近に設ける多孔質体を平均細孔径が相対的に小さい電解金属箔22とし、その上に(作動流体側に)、平均細孔径が相対的に大きい、すなわち、作動流体の透過率が相対的に大きい電解金属箔23を設けている。このような構成によれば、一層目の電解金属箔22とその上方の蒸気塊との間に、作動流体を一層目の電解金属箔22に向かって潤沢に液体を供給する二層目の電解金属箔23が存在するため、一層目の電解金属箔22の厚さを薄くしても、液枯れの発生が抑制され、限界熱流束が小さくなることを防ぐことができる。また、二層目の電解金属箔23の液供給量は多いほど好ましいため、二層目の電解金属箔23の厚みも大きくするのが好ましい。具体的には、例えば、一層目の電解金属箔22の厚さを100μm程度と薄くする場合、二層目の電解金属箔23の厚さは1~2mm以上程度とするのが好ましい。 Therefore, in the present invention, the porous body provided in the vicinity of the surface of the heating element 13 is the electrolytic metal foil 22 having a relatively small average pore diameter, and thereon (on the working fluid side) a relatively large average pore diameter That is, an electrolytic metal foil 23 having a relatively high working fluid permeability is provided. According to such a configuration, the working fluid is abundantly supplied toward the first-layer electrolytic metal foil 22 between the first-layer electrolytic metal foil 22 and the vapor mass above it. Since the metal foil 23 exists, even if the thickness of the first electrodeposited metal foil 22 is reduced, the occurrence of liquid drying is suppressed, and the critical heat flux can be prevented from being reduced. Further, it is preferable to increase the thickness of the electrolytic metal foil 23 of the second layer because the larger the amount of liquid supplied to the electrolytic metal foil 23 of the second layer, the better. Specifically, for example, when the thickness of the first-layer electrolytic metal foil 22 is reduced to about 100 μm, the thickness of the second-layer electrolytic metal foil 23 is preferably about 1 to 2 mm or more.
 電解金属箔22、23の種類は、後述のように電解析出の際に気泡によって多孔質化が可能なものであれば特に限定されず、電解銅箔、電解銅合金箔、電解アルミ箔、電解アルミ合金箔、電解ニッケル箔、電解ニッケル合金箔、電解鉄箔、電解鉄合金箔等を用いることができ、特に電解銅箔、電解銅合金箔が好ましい。また、電解銅合金箔としては、母材の銅成分に、Sn、Ag、Au、Co、Cr、Fe、In、Ni、P、Si、Te、Ti、Zn、B、Mn及びZrの中の一種以上を合計で0.001~4.0質量%含有することで銅合金を構成していてもよい。また、電解金属箔22、23の表面に酸化膜が形成されていてもよい。酸化膜が形成されていると、濡れ性が向上するため、作動流体の供給がスムーズになる。 The types of the electrolytic metal foils 22 and 23 are not particularly limited as long as they can be made porous by gas bubbles during electrolytic deposition as described later. Electrolytic copper foil, electrolytic copper alloy foil, electrolytic aluminum foil, Electrolytic aluminum alloy foil, electrolytic nickel foil, electrolytic nickel alloy foil, electrolytic iron foil, electrolytic iron alloy foil and the like can be used, and electrolytic copper foil and electrolytic copper alloy foil are particularly preferred. Further, as the electrolytic copper alloy foil, the copper component of the base material includes Sn, Ag, Au, Co, Cr, Fe, In, Ni, P, Si, Te, Ti, Zn, B, Mn and Zr. The copper alloy may be constituted by containing 0.001 to 4.0% by mass of one or more of them in total. Moreover, an oxide film may be formed on the surfaces of the electrolytic metal foils 22 and 23 . When the oxide film is formed, the wettability is improved, so that the working fluid can be supplied smoothly.
 冷却部材14は、平均細孔径が異なる二層の電解金属箔22、23が一体形成された構成を有している。ここで、「一体形成」とは、詳細は後述するが、所定の電解条件による電解析出により、まず一層目の電解金属箔22が形成された後、続けて電解条件を変えて二層目の電解金属箔23が形成されていることを示す。このように電解金属箔が一体形成されているものは、二層の電解金属箔の断面観察によって容易に確認することができ、また、単純に別々に形成した電解金属箔を二層重ねてなる積層体と容易に区別することができる。具体的には、別々に形成した電解金属箔を二層重ねてなる積層体は、一方の電解金属箔と他方の電解金属箔とが重ねて設けられているだけであるため、断面においてそれらの境界が非常に明瞭な線となって識別され、さらにそれら二層の電解金属箔は境界面において化学的に何ら結合していない。これに対し、本発明のように二層の電解金属箔が一体形成された構成の場合、一層目の電解金属箔上に二層目の電解金属箔が電解析出することで形成されるため、断面においてそれらの境界は、別々に形成した電解金属箔を二層重ねてなる積層体と比較すると不明瞭な線となっている可能性が高い。また、二層目の電解金属箔が一層目の電解金属箔の表面に析出した組織となっている。このため、別々に形成した電解金属箔を二層重ねてなる積層体の構成と、本発明に係る二層の電解金属箔22、23が一体形成された構成とは、容易に区別することができる。 The cooling member 14 has a structure in which two layers of electrolytic metal foils 22 and 23 with different average pore diameters are integrally formed. Here, although the details will be described later, the term "integral formation" means that the first layer of the electrolytic metal foil 22 is first formed by electrolytic deposition under predetermined electrolytic conditions, and then the second layer is formed by changing the electrolytic conditions. of the electrolytic metal foil 23 is formed. Such an integrally formed electrolytic metal foil can be easily confirmed by observing the cross section of two layers of electrolytic metal foil, and is simply formed by stacking two layers of separately formed electrolytic metal foils. It can be easily distinguished from laminates. Specifically, in a laminate formed by stacking two layers of separately formed electrolytic metal foils, one electrolytic metal foil and the other electrolytic metal foil are only superimposed. The boundary is identified as a very sharp line, and the two layers of electrolytic metal foil are not chemically bonded at the interface. On the other hand, in the case of the structure in which two layers of electrolytic metal foil are integrally formed as in the present invention, the second layer of electrolytic metal foil is electrolytically deposited on the first electrolytic metal foil. , there is a high possibility that the boundary between them in the cross section is an indistinct line when compared with a laminate formed by stacking two layers of separately formed electrolytic metal foils. In addition, the second-layer electrolytic metal foil has a structure in which the second-layer electrolytic metal foil is deposited on the surface of the first-layer electrolytic metal foil. For this reason, it is possible to easily distinguish between the structure of a laminate in which two layers of separately formed electrolytic metal foils are laminated and the structure in which the two layers of electrolytic metal foils 22 and 23 according to the present invention are integrally formed. can.
 平均細孔径が異なる二層の電解金属箔22、23が一体形成されているため、一層目と二層目の電解金属箔間に気泡が入り込まない。このため、単純に別々に形成した電解金属箔を二層重ねてなる積層体に対して、一層目と二層目の電解金属箔間の作動流体の受渡しがスムーズに進む。 Since the two layers of electrolytic metal foils 22 and 23 with different average pore diameters are integrally formed, air bubbles do not enter between the first and second layers of electrolytic metal foil. For this reason, in a laminated body formed by stacking two layers of separately formed electrolytic metal foils, the delivery of the working fluid between the first and second layers of the electrolytic metal foil proceeds smoothly.
 電解金属箔22、23は、後述のように、その製造方法において電解析出の際に発生する気泡の影響で析出する金属箔が多孔質化する。電解析出時の電流値が小さいほど生成される気泡のサイズが小さくなり、析出する金属箔も細孔を有する緻密な多孔質体となる。このように、多孔質体である電解金属箔22、23の細孔のサイズは、電解条件によって調整可能である。電解金属箔22、23の平均細孔径は、それぞれ、断面のSEM観察写真によって、例えば任意の10個の細孔の径を測定し、その平均値を算出することで得られる。発熱体13側に設けられる一層目の電解金属箔22は、平均細孔径が典型的には75~150μmである。作動流体11側に設けられる二層目の電解金属箔23は、平均細孔径が一層目の電解金属箔22と比較して相対的に大きく、典型的には300~450μmである。 As will be described later, the electrodeposited metal foils 22 and 23 become porous due to the influence of air bubbles generated during electrolytic deposition in the manufacturing method. The smaller the current value during electrolytic deposition, the smaller the size of the bubbles generated, and the deposited metal foil also becomes a dense porous body having fine pores. Thus, the pore sizes of the electrolytic metal foils 22 and 23, which are porous bodies, can be adjusted by the electrolysis conditions. The average pore diameters of the electrolytic metal foils 22 and 23 can be obtained by measuring the diameters of arbitrary 10 pores, for example, from SEM observation photographs of cross sections, and calculating the average value thereof. The first layer of electrolytic metal foil 22 provided on the heating element 13 side typically has an average pore size of 75 to 150 μm. The second-layer electrolytic metal foil 23 provided on the working fluid 11 side has an average pore diameter relatively larger than that of the first-layer electrolytic metal foil 22, typically 300 to 450 μm.
 電解金属箔22、23は、それぞれ、図2に示すように、毛細管現象により作動流体11を発熱体13の表面に供給する作動流体供給部16と、発熱体13の表面で発生した蒸気を作動流体11側へ排出する蒸気排出部17とを備えてもよい。このような作動流体供給部16と蒸気排出部17とを備える多孔質体の電解金属箔としては、図3の平面図に示すように、ハニカム構造を有する多孔質体の電解金属箔が挙げられる。この場合、一層目の電解金属箔22の作動流体供給部16は、ハニカム構造の孔の周囲の格子状の多孔質体部分の毛細管現象により、発熱体13の表面付近に作動流体11を供給する。一層目の電解金属箔22の蒸気排出部17は、発熱体13からの熱により発生した蒸気を、ハニカム構造の孔から二層目の電解金属箔23側へ排出する。このように作動流体11の供給と蒸気の排出を別個の経路を用いて行うことにより、蒸気が接触部を覆ってしまい限界熱流束が制限されるという問題の発生を抑制することができる。また二層目の電解金属箔23は、一層目の電解金属箔22と同様に、ハニカム構造の孔の周囲の格子状の多孔質体部分が一層目の電解金属箔22に作動流体11を供給する作動流体供給部16として機能し、ハニカム構造の孔が一層目の電解金属箔22から排出された蒸気を作動流体11側へ排出する蒸気排出部17として機能する。そして、二層目の電解金属箔23は、一層目の電解金属箔22に比べて作動流体11の透過率が大きく、作動流体11を保持する機能を有し、二層目の電解金属箔23上部で合体気泡が滞留する間にも、速やかに一層目の電解金属箔22への作動流体11の供給が行われるように機能する。 Electrolytic metal foils 22 and 23 are, as shown in FIG. A steam discharge part 17 that discharges to the fluid 11 side may be provided. An example of the porous electrolytic metal foil having the working fluid supply portion 16 and the vapor discharge portion 17 is a porous electrolytic metal foil having a honeycomb structure, as shown in the plan view of FIG. . In this case, the working fluid supply part 16 of the first-layer electrolytic metal foil 22 supplies the working fluid 11 to the vicinity of the surface of the heating element 13 by capillary action of the grid-like porous body portion around the holes of the honeycomb structure. . The vapor discharge portion 17 of the first-layer electrolytic metal foil 22 discharges the vapor generated by the heat from the heating element 13 to the second-layer electrolytic metal foil 23 side through the holes of the honeycomb structure. By supplying the working fluid 11 and discharging the steam using separate paths in this way, it is possible to suppress the occurrence of the problem that the steam covers the contact portion and limits the critical heat flux. In the second-layer electrolytic metal foil 23, the working fluid 11 is supplied to the first-layer electrolytic metal foil 22 by the lattice-like porous body portion around the holes of the honeycomb structure, similarly to the first-layer electrolytic metal foil 22. The holes of the honeycomb structure function as a steam discharge part 17 for discharging the steam discharged from the electrolytic metal foil 22 of the first layer to the side of the working fluid 11 . The second-layer electrolytic metal foil 23 has a higher permeability of the working fluid 11 than the first-layer electrolytic metal foil 22 and has a function of retaining the working fluid 11. It functions so that the working fluid 11 is rapidly supplied to the electrolytic metal foil 22 of the first layer even while the coalesced bubbles remain in the upper part.
 電解金属箔22、23のハニカム構造の孔の形状は、多角形状、円形状、楕円形状等、種々の形状とすることが可能であるが、孔半径は、そのような種々の孔形状における外接円の半径を示す。多孔質体の発熱体13の表面への接触面積が大きくなるため接触部で発生した蒸気を水中へ逃がすためのハニカム構造の孔半径は小さいほうがよく、例えば、孔半径100~2000μmとすることができる。また、多孔質底部を通過する場合の圧力損失を小さくできるため、接触部で発生した蒸気を水中へ逃がすためのハニカム構造の孔と孔の間隔は小さい方がよく、例えば、100~1000μmとすることができる。 The shape of the holes of the honeycomb structure of the electrolytic metal foils 22 and 23 can be various shapes such as polygonal, circular, and elliptical. Indicates the radius of the circle. Since the contact area of the porous body with the surface of the heating element 13 becomes large, the hole radius of the honeycomb structure for releasing the steam generated at the contact portion into the water should be small. can. In addition, since the pressure loss when passing through the porous bottom can be reduced, the gap between the holes of the honeycomb structure for releasing the steam generated at the contact portion into the water is preferably small, for example, 100 to 1000 μm. be able to.
 図2には作動流体供給部16及び蒸気排出部17が下方の発熱体13の表面及び上方の作動流体11側に直交するように図示してあるが、作動流体供給部16及び蒸気排出部17は、発熱体13の表面に対向する面と作動流体11側の面との間の経路をそれぞれ与えるものであれば、直交せずに、例えば、湾曲した経路や折れ曲がった経路となるように構成されていてもよい。 Although FIG. 2 illustrates the working fluid supply portion 16 and the steam discharge portion 17 so as to be perpendicular to the surface of the lower heating element 13 and the upper side of the working fluid 11 side, the working fluid supply portion 16 and the steam discharge portion 17 are perpendicular to each other. is configured so that, for example, a curved path or a bent path is provided instead of being perpendicular to each other as long as it provides a path between the surface facing the surface of the heating element 13 and the surface on the side of the working fluid 11. may have been
 冷却器10は、図4の断面模式図に示すように、冷却部材14の二層目の電解金属箔23の作動流体11側に積層するように設けられ、作動流体11を二層目の電解金属箔23に導く作動流体導入部19を有する作動流体導入体18を更に備えることが好ましい。冷却部材14の電解金属箔22、23の厚さは、毛管限界メカニズムの観点からは薄いほうがよいが、マクロ液膜の厚さより薄いと電解金属箔22、23内部で液枯れが生じやすく、限界熱流束が小さくなるという問題がある。これに対し、図4に示すように、電解金属箔22、23の上に(作動流体側に)、作動流体11を電解金属箔22、23に導く作動流体導入体18を設けることで、電解金属箔22、23とその上方の蒸気塊との間に、作動流体11を電解金属箔22、23に向かって潤沢に供給し且つ作動流体11を電解金属箔22、23の上方で保持する作動流体導入体18が存在する。このため、電解金属箔22、23の厚さを薄くしても、液枯れの発生が抑制され、限界熱流束が小さくなることを防ぐことができる。また、作動流体導入体18の液供給量は多いほど好ましいため、作動流体導入体18の厚みも大きくするのが好ましい。具体的には、例えば、電解金属箔22、23の厚さをそれぞれ100μm程度と薄くする場合、作動流体導入体18の厚さは1mm以上程度とするのが好ましい。 As shown in the schematic cross-sectional view of FIG. 4, the cooler 10 is provided so as to be laminated on the working fluid 11 side of the second layer electrolytic metal foil 23 of the cooling member 14, and the working fluid 11 is electrolyzed in the second layer. It is preferable to further include a working fluid introducing body 18 having a working fluid introducing portion 19 leading to the metal foil 23 . The thickness of the electrolytic metal foils 22 and 23 of the cooling member 14 should be thin from the viewpoint of the capillary limit mechanism. There is a problem that the heat flux becomes small. On the other hand, as shown in FIG. 4, by providing a working fluid introduction body 18 for introducing the working fluid 11 to the electrolytic metal foils 22 and 23 on the electrolytic metal foils 22 and 23 (on the working fluid side), electrolysis can be performed. Between the metal foils 22, 23 and the vapor mass above them, the working fluid 11 is abundantly supplied toward the electrolytic metal foils 22, 23 and the working fluid 11 is retained above the electrolytic metal foils 22, 23. A fluid introducer 18 is present. Therefore, even if the thickness of the electrolytic metal foils 22 and 23 is reduced, it is possible to suppress the occurrence of liquid depletion and prevent the critical heat flux from becoming small. In addition, it is preferable to increase the thickness of the working fluid introducer 18 because the larger the liquid supply amount of the working fluid introducer 18 is, the better. Specifically, for example, when the thickness of each of the electrolytic metal foils 22 and 23 is reduced to about 100 μm, the thickness of the working fluid introduction body 18 is preferably about 1 mm or more.
 作動流体導入体18は、それぞれ高さ方向に貫通する複数の孔を有し、複数の孔が作動流体導入部19を構成してもよい。また、作動流体導入部19を構成する複数の孔は、断面が円形状又は多角形状であってもよい。 The working fluid introduction body 18 may have a plurality of holes penetrating in the height direction, and the plurality of holes may constitute the working fluid introduction part 19 . Moreover, the plurality of holes that constitute the working fluid introduction part 19 may have a circular or polygonal cross section.
 作動流体導入体18を構成する材料は、孔質材であってもよく、非孔質材であってもよい。作動流体導入体18を構成する材料としては、ステンレス、テフロン(登録商標)等の金属や樹脂等を用いて形成することができる。特に、作動流体導入体18を金属で形成することで、作動流体導入体18の濡れ性が向上し、親水性が良好となるため、作動流体11をより多く取り込んで発熱体13の表面へ供給することが可能となる。 The material constituting the working fluid introducer 18 may be a porous material or a non-porous material. As a material for forming the working fluid introduction member 18, metal such as stainless steel and Teflon (registered trademark), resin, or the like can be used. In particular, by forming the working fluid introduction body 18 from metal, the wettability of the working fluid introduction body 18 is improved and the hydrophilicity is improved, so that a larger amount of the working fluid 11 is taken in and supplied to the surface of the heating element 13. It becomes possible to
 また、本発明の別の態様としては、発熱体13全体を作動流体11中に浸漬する、または発熱体13の一部を作動流体11の液面から一部浸漬して冷却を行うこともできる。この場合には、発熱体13は浮遊した状態、容器12底面に載置された状態など場合により種々の形態をとるが、要は作動流体11に浸漬されている部分に多孔質体で構成された冷却部材14を取り付けることにより、前記例と同様にして冷却を行うことができる。 Further, as another aspect of the present invention, cooling can be performed by immersing the entire heating element 13 in the working fluid 11, or partially immersing the heating element 13 from the liquid surface of the working fluid 11. . In this case, the heating element 13 may take various forms, such as a floating state or a state placed on the bottom surface of the container 12, depending on the circumstances. By attaching the cooling member 14, cooling can be performed in the same manner as in the above example.
 <冷却部材及び冷却器の製造方法>
 次に、本発明の実施形態に係る冷却部材及び冷却器の製造方法について説明する。
 まず、平均細孔径が異なる二層の電解金属箔が一体形成された構成を有する冷却部材を、電解析出装置を用いて作製する。具体的には、電解析出装置のアノード及びカソードを電源装置に電気的に接続する。電解浴には、所定の金属に係るめっき液を設ける。電解浴のめっき液量は特に限定されないが、200~400mLとしてもよい。
 この状態で電解を行うと、電解浴のめっき液に含まれる金属イオンがカソード上で電子を受け取り当該金属が析出する。一方、電解浴のめっき液に含まれる水素イオンがカソード上で電子を受け取り水素ガスとなる。これらの金属の析出反応と水素ガスの発生とが同時に起こり、水素ガスによって金属の析出反応が部分的に妨げられ、金属の多孔質構造がカソードの表面に形成される。
<Method for Manufacturing Cooling Member and Cooler>
Next, a method for manufacturing a cooling member and a cooler according to an embodiment of the present invention will be described.
First, a cooling member having a configuration in which two layers of electrolytic metal foils having different average pore diameters are integrally formed is produced using an electrolytic deposition apparatus. Specifically, the anode and cathode of the electrolytic deposition apparatus are electrically connected to a power supply. A plating solution for a predetermined metal is provided in the electrolytic bath. The amount of plating solution in the electrolytic bath is not particularly limited, but may be 200 to 400 mL.
When electrolysis is performed in this state, metal ions contained in the plating solution in the electrolytic bath receive electrons on the cathode and the metal is deposited. On the other hand, hydrogen ions contained in the plating solution in the electrolytic bath receive electrons on the cathode and become hydrogen gas. The deposition reaction of these metals and the generation of hydrogen gas occur simultaneously, the hydrogen gas partially hinders the deposition reaction of the metal, and a porous structure of the metal is formed on the surface of the cathode.
 このようにして一層目の電解金属箔をカソード上に形成(電解析出)させた後、続いて、電解浴のめっき液はこのままとし、電流値と、更に必要であれば析出反応時間とを変更して、同様にして二層目の電解金属箔を当該一層目の電解金属箔上に形成(電解析出)させる。このようにすることで、一層目の電解金属箔と二層目の電解金属箔とが一体形成される。また、上述の電解の際の電流値を一層目の電解金属箔の作製時より大きくすることで、水素ガスの発生をより活発にすることができる。そのため、二層目の電解金属箔の平均細孔径を一層目の電解金属箔の平均細孔径に対して相対的に大きくすることができる。例えば、平均細孔径が相対的に小さい一層目の電解金属箔の析出反応では、0.38~0.46A/cm2の電流密度で電流を4~6分間流し、平均細孔径が相対的に大きい二層目の電解金属箔の析出反応では、0.80~0.88A/cm2の電流密度で電流を4~6分間以上流すことが好ましい。 After forming (electrodepositing) the first layer of electrolytic metal foil on the cathode in this manner, the current value and, if necessary, the deposition reaction time are adjusted while the plating solution in the electrolytic bath remains unchanged. Instead, a second layer of electrolytic metal foil is similarly formed (electrodeposited) on the first layer of electrolytic metal foil. By doing so, the first-layer electrolytic metal foil and the second-layer electrolytic metal foil are integrally formed. In addition, hydrogen gas can be generated more actively by increasing the current value during the electrolysis as compared to that during the production of the first electrodeposited metal foil. Therefore, the average pore diameter of the second-layer electrolytic metal foil can be made relatively larger than the average pore diameter of the first-layer electrolytic metal foil. For example, in the deposition reaction of the first electrodeposited metal foil with a relatively small average pore size, a current density of 0.38 to 0.46 A/cm 2 is applied for 4 to 6 minutes, and the average pore size is relatively small. In the deposition reaction of the large second layer of electrolytic metal foil, it is preferable to apply current at a current density of 0.80 to 0.88 A/cm 2 for 4 to 6 minutes or more.
 この後、多孔質体である電解金属箔の強度を高めるために、0.3Aの低電流を30分間流すことが好ましい。
 次に、カソードから、一体形成された二層の電解金属箔を剥離させる。
 最後に、850~950℃で30分~1時間焼結させることが好ましい。
Thereafter, a low current of 0.3 A is preferably applied for 30 minutes in order to increase the strength of the electrolytic metal foil, which is a porous body.
Next, the integrally formed two-layer electrolytic metal foil is peeled off from the cathode.
Finally, it is preferable to sinter at 850-950° C. for 30 minutes to 1 hour.
 次に、所望の発熱体に対し、その表面を容器の壁面の一部分となるように容器を設け、上記二層の電解金属箔を、平均細孔径が相対的に小さい一層目の電解金属箔が所望の発熱体の表面に対向するように、発熱体の表面上に配置する。なお、必要であれば、二層目の電解金属箔上に、更にステンレスなどで形成されたハニカム構造の作動流体導入体を配置してもよい。
 次に、容器内に所望の作動流体を入れる。
 このようにして、発熱体を冷却するための沸騰方式による冷却器を作製することができる。なお、作動流体は、電解銅箔を設置する前に、容器内に入れておいてもよい。
Next, for the desired heating element, a container is provided so that the surface thereof becomes a part of the wall surface of the container, and the two layers of electrolytic metal foils are arranged so that the first electrolytic metal foil having a relatively small average pore diameter is It is placed on the surface of the heating element so as to face the surface of the desired heating element. If necessary, a honeycomb-structured working fluid introducing member made of stainless steel or the like may be further disposed on the second layer of the electrolytic metal foil.
The container is then filled with the desired working fluid.
In this way, a boiling type cooler for cooling the heating element can be manufactured. In addition, the working fluid may be placed in the container before placing the electrolytic copper foil.
 二層の電解金属箔を、それぞれ図3に示したハニカム構造に形成する場合は、電解析出の際、カソードの表面に、ハニカム構造の孔となる位置に、それぞれ樹脂等の絶縁性膜を置いて、当該位置だけ電解析出させないように制御する。このようにして、絶縁性膜が置かれていない部分が孔を取り囲むような形状となり、ハニカム構造の電解金属箔を作製することができる。 When forming two layers of electrolytic metal foil into the honeycomb structure shown in FIG. It is controlled so that electrolytic deposition does not occur only at that position. In this way, the portion where the insulating film is not placed surrounds the hole, and an electrolytic metal foil having a honeycomb structure can be produced.
 <冷却装置>
 図5は、本発明の実施形態に係る冷却器10を備えた冷却装置20の模式図を示している。冷却装置20は、冷却器10と、容器12に接続されたコンデンサ21とを備える。コンデンサ21において、蒸発した作動流体11が液化されて、容器12に戻る。冷却装置20は、ポンプなどの外部動力源を必要とせず、装置全体としてのコンパクト性および省エネルギー性が優れている。
<Cooling device>
FIG. 5 shows a schematic diagram of a cooling device 20 comprising a cooler 10 according to an embodiment of the invention. The cooling device 20 comprises a cooler 10 and a condenser 21 connected to the container 12 . In the condenser 21 the vaporized working fluid 11 is condensed and returned to the container 12 . The cooling device 20 does not require an external power source such as a pump, and is excellent in compactness and energy saving as a whole device.
 <用途>
 本発明の冷却器10及び冷却装置20は、種々の電子機器、原子炉圧力容器、その他の高発熱密度を有する熱機器全般に適用可能である。たとえば、キャピラリーポンプループの高性能化、半導体レーザ、データセンターのサーバの冷却、フロン冷却式チョッパ制御装置、パワー電子機器等が考えられる。または、大型ごみ焼却炉等の耐火壁を外部から冷却して損傷を軽減するための、耐火壁側部や耐火壁底部に設置する水冷ジャケットに適用可能である。
<Application>
The cooler 10 and the cooling device 20 of the present invention can be applied to various electronic devices, nuclear reactor pressure vessels, and other general thermal devices having high heat generation densities. For example, high-performance capillary pump loops, semiconductor lasers, data center server cooling, CFC-cooled chopper controllers, and power electronic equipment can be considered. Alternatively, it can be applied to a water-cooling jacket installed on the side or bottom of a fire-resistant wall for externally cooling the fire-resistant wall of a large refuse incinerator or the like to reduce damage.
 以下に本発明を実施例でさらに詳細に説明するが、本発明はこれらに限定されるものではない。 The present invention will be described in more detail below with examples, but the present invention is not limited to these.
 <試験例1>
 -電解銅箔の作製-
 電解析出装置を図6に示す。電解析出装置は、アノード(銅板)とカソード(直径30mmの円板状の銅板)とを備え、それぞれDC電源に電気的に接続した。いずれの銅板とも、純度99.96%で厚さ0.3mmであり、電極間距離は2cmとした。
 また、CuSO4:0.4mol/L及びH2SO4:1.5mol/Lのめっき液を200mL調製し、硫酸銅めっき浴とした。
<Test Example 1>
- Production of electrolytic copper foil -
An electrolytic deposition apparatus is shown in FIG. The electrolytic deposition apparatus had an anode (copper plate) and a cathode (disc-shaped copper plate with a diameter of 30 mm), each of which was electrically connected to a DC power supply. Each copper plate had a purity of 99.96%, a thickness of 0.3 mm, and a distance between electrodes of 2 cm.
Also, 200 mL of a plating solution containing 0.4 mol/L of CuSO 4 and 1.5 mol/L of H 2 SO 4 was prepared as a copper sulfate plating bath.
 この硫酸銅めっき浴に電流を流すと、カソードでは以下の反応(A)及び(B)が同時に起こる。すなわち、銅の析出反応と水素ガスの発生が同時に起こり、水素ガスによって銅の析出反応が部分的に妨げられ、銅の多孔質構造がカソード表面に形成される。
  Cu2+ + 2e- → Cu  (A)
  2H+ + 2e- → H2  (B)
When an electric current is passed through this copper sulfate plating bath, the following reactions (A) and (B) occur simultaneously at the cathode. That is, the deposition reaction of copper and the generation of hydrogen gas occur simultaneously, the deposition reaction of copper is partially hindered by the hydrogen gas, and a porous structure of copper is formed on the cathode surface.
Cu 2+ + 2e → Cu (A)
2H + + 2e - → H 2 (B)
 まず、直流電源装置(日本スタビライザー工業株式会社製、最大電圧18V、最大電流100A)を用いて、以下の(1)~(5)の条件で直径30mmの円板状の電解銅箔をそれぞれ作製した。
 (1)3Aの電流を4分間流して単層の電解銅箔を作製した。
 (2)3Aの電流を12分間流して単層の電解銅箔を作製した。
 (3)3Aの電流を5分間流して一層目の電解銅箔を作製し、続いて6Aの電流を5分間流して二層目の電解銅箔を一層目の電解銅箔上に一体形成した。
 (4)3Aの電流を5分間流して一層目の電解銅箔を作製し、続いて6Aの電流を10分間流して二層目の電解銅箔を一層目の電解銅箔上に一体形成した。
 (5)3Aの電流を5分間流して一層目の電解銅箔を作製し、続いて6Aの電流を15分間流して二層目の電解銅箔を一層目の電解銅箔上に一体形成した。
 なお、流れた電子の数量に応じて、銅と水素が上記で示した化学反応式の通り生成されるため、実験は定電流モードで行った。印加電圧は銅の析出物によって変化した。
First, using a DC power supply (manufactured by Nippon Stabilizer Industry Co., Ltd., maximum voltage 18 V, maximum current 100 A), disc-shaped electrolytic copper foils with a diameter of 30 mm were produced under the following conditions (1) to (5). did.
(1) A single-layer electrolytic copper foil was produced by applying a current of 3 A for 4 minutes.
(2) A single-layer electrolytic copper foil was produced by applying a current of 3 A for 12 minutes.
(3) A current of 3 A was applied for 5 minutes to prepare a first layer of electrolytic copper foil, and then a current of 6 A was applied for 5 minutes to integrally form a second layer of electrolytic copper foil on the first layer of electrolytic copper foil. .
(4) A current of 3 A was applied for 5 minutes to prepare a first layer of electrolytic copper foil, and then a current of 6 A was applied for 10 minutes to integrally form a second layer of electrolytic copper foil on the first layer of electrolytic copper foil. .
(5) A current of 3 A was applied for 5 minutes to prepare a first layer of electrolytic copper foil, and then a current of 6 A was applied for 15 minutes to integrally form a second layer of electrolytic copper foil on the first layer of electrolytic copper foil. .
Since copper and hydrogen are generated according to the chemical reaction formula shown above according to the number of flowing electrons, the experiment was conducted in the constant current mode. The applied voltage varied with the copper deposits.
 次に、多孔質体の強度を高めるために、(1)~(5)の条件で得られた電解銅箔に対し、更に、それぞれ0.3Aの低電流を30分間流した。
 次に、得られた電解銅箔をカソードから剥離させて、真空炉(フルテック株式会社製、最高温度1200℃、炉内サイズ:直径43mm×高さ60mm)内で、950℃で30分間焼結させた。
Next, in order to increase the strength of the porous body, a low current of 0.3 A was applied to each of the electrolytic copper foils obtained under the conditions (1) to (5) for 30 minutes.
Next, the resulting electrolytic copper foil is peeled off from the cathode and sintered at 950°C for 30 minutes in a vacuum furnace (manufactured by Furutec Co., Ltd., maximum temperature 1200°C, furnace size: diameter 43 mm x height 60 mm). let me
 3Aの電流を5分間流して作製した電解銅箔について、真上からのSEM断面観察写真を図7(A)に示す。また、上記(3)の条件で作製した二層の電解銅箔の真上からのSEM断面観察写真を図7(B)に示す。これらの図を対比すると、3Aの電流で形成した多孔質の電解銅箔の孔径が150μm程度なのに対して、3.0A及び6.0Aの電流でそれぞれ作製した多孔質の電解銅箔の場合は孔径が250μm程度と大きくなっていることがわかる。このため、電解析出の際の電流値が大きければ、多孔質の孔径が相対的に大きくなり、その結果平均細孔径が相対的に大きくなることがわかる。 Fig. 7(A) shows an SEM cross-sectional observation photograph from directly above of the electrolytic copper foil produced by applying a current of 3 A for 5 minutes. FIG. 7(B) shows a SEM cross-sectional observation photograph taken from directly above the two-layer electrolytic copper foil produced under the conditions of (3) above. Comparing these figures, the pore diameter of the porous electrodeposited copper foil formed at a current of 3A is about 150 μm, while the porous electrodeposited copper foils formed at a current of 3.0A and 6.0A, respectively, have a pore diameter of about 150 μm. It can be seen that the pore diameter is as large as about 250 μm. Therefore, it can be seen that if the current value during electrolytic deposition is large, the pore size of the porous material becomes relatively large, and as a result, the average pore size becomes relatively large.
 上記(3)の条件で作製した二層の電解銅箔のSEM断面観察写真を図8に示す。図8から分かるように、一層目の電解銅箔と二層目の電解銅箔は電解析出によって一体形成されているため、それらの境界線が不明瞭である。このため、当該一体形成された二層の電解銅箔は、単純に別々に形成した電解金属箔を二層重ねてなる積層体に対して容易に区別することができることがわかる。 FIG. 8 shows an SEM cross-sectional observation photograph of the two-layer electrolytic copper foil produced under the conditions of (3) above. As can be seen from FIG. 8, since the first electrodeposited copper foil and the second electrodeposited copper foil are integrally formed by electrolytic deposition, the boundary line between them is unclear. For this reason, it can be seen that the integrally formed two-layer electrolytic copper foil can be easily distinguished from a laminate formed by simply stacking two layers of separately formed electrolytic metal foils.
 -プール沸騰試験-
 図9に、プール沸騰試験装置の模式図を示す。発熱体の表面はプール底面と同じ高さで、作動流体と接する発熱体の表面の直径は30mmであった。銅ブロック表面に上述の電解析出法により(1)~(5)の条件で作製した電解銅箔を、それぞれはんだで固定した。また、銅ブロック表面に電解銅箔を設けないものを「裸面」として同様に実験対象とした。
 加熱は銅ブロックの底部に埋め込んだカートリッジヒーターにより行った。発熱体の表面から下方へそれぞれ10mm(TC1)、15mm(TC2)、20mm(TC3)、25mm(TC4)の位置の銅ブロックの円柱部の中心軸上に直径0.5mmのK型シース熱電対を設置し、これらの熱電対の測定値を外装して伝熱面温度を、指示温度差、設定距離及び銅の熱伝導率からフーリエの式より発熱体の表面の熱流束を算定した。
 プールは、内径87mmのパイレックス(登録商標)ガラス製で内部沸騰様相が観察できた。作動流体は蒸留水、水深は60mm、システム圧は0.1MPaで、予備ヒーターで発熱体の表面周囲の液体を加熱して飽和温度を維持した。発生した蒸気は冷却器で凝縮させて容器内に戻した。
 実験は、カートリッジヒーターに印加する電圧を約5Vずつ(約0.10MW/m2刻み)増加させながら加熱を行い、TC1及びTC2の温度変化が、10分間で0.25K以下となった場合に定常状態に達したとみなし、測定を行った。以上の操作を、定常状態が維持できなくなり、壁温が急上昇を開始して、バーンアウトが発生するまで繰り返した。またバーンアウトが発生した場合には、直ちに加熱を中止し、その直前の熱流束を限界熱流束とした。
-Pool Boiling Test-
FIG. 9 shows a schematic diagram of the pool boiling test apparatus. The surface of the heating element was at the same height as the bottom of the pool, and the diameter of the surface of the heating element in contact with the working fluid was 30 mm. Electrodeposited copper foils prepared under the conditions (1) to (5) by the above-described electrolytic deposition method were fixed on the surface of the copper block by soldering. In addition, a copper block on which no electrolytic copper foil was provided was treated as a "bare surface" and similarly used as an experimental object.
Heating was provided by a cartridge heater embedded in the bottom of the copper block. A K-type sheath thermocouple with a diameter of 0.5 mm is placed on the central axis of the cylindrical portion of the copper block at positions 10 mm (TC1), 15 mm (TC2), 20 mm (TC3), and 25 mm (TC4) below the surface of the heating element. was installed, and the heat transfer surface temperature was calculated from the measured values of these thermocouples, and the heat flux on the surface of the heating element was calculated from the indicated temperature difference, the set distance, and the thermal conductivity of copper by Fourier's equation.
The pool was made of Pyrex (registered trademark) glass with an inner diameter of 87 mm, and internal boiling was observed. The working fluid was distilled water, the water depth was 60 mm, and the system pressure was 0.1 MPa. The generated vapor was condensed in a cooler and returned to the container.
In the experiment, heating was performed while increasing the voltage applied to the cartridge heater by about 5 V (in steps of about 0.10 MW/m 2 ). Steady state was assumed to be reached and measurements were taken. The above operation was repeated until a steady state could not be maintained and the wall temperature began to rise rapidly, causing burnout. When burnout occurred, the heating was stopped immediately, and the heat flux just before that was taken as the critical heat flux.
 図10に、上記実験によって得られた沸騰曲線を示す。電流値3Aで電解析出させた単層の電解銅箔よりも電流値3A及び6Aでそれぞれ電解析出させて二層の一体化構造とした電解銅箔の方がより大きな除熱能力を有していることがわかる。この要因として、多孔質体の孔が細かく発熱体の表面により多くの樹状の銅析出物が接している下層の電解銅箔と、蒸気が排出されやすい大きな隙間を有する構造ではあるが液保持能力が高い上層の電解銅箔とによる二層の一体化構造としたことで、発熱体の表面の液枯れを防ぐことができたと考えられる。当該二層の一体化構造の電解銅箔を用いることで、裸面の最大約4倍の400W/cm2の限界熱流束を達成することができた。 FIG. 10 shows boiling curves obtained by the above experiment. Electrodeposited copper foil having a two-layer integrated structure formed by electrolytic deposition at current values of 3 A and 6 A has a greater heat removal capacity than a single-layer electrolytic copper foil electrodeposited at a current value of 3 A. I know you are. The factors for this are the electrolytic copper foil in the lower layer, which has fine pores in the porous body and more dendritic copper deposits are in contact with the surface of the heating element, and the structure with large gaps through which steam is easily discharged, but the liquid retention It is thought that the two-layer integrated structure with the upper electrodeposited copper foil, which has high performance, prevented the liquid from drying up on the surface of the heating element. By using the electrodeposited copper foil with the two-layer integrated structure, it was possible to achieve a maximum heat flux of 400 W/cm 2 , about four times that of the bare surface.
10 冷却器
11 作動流体
12 容器
13 発熱体
14 冷却部材
16 作動流体供給部
17 蒸気排出部
18 作動流体導入体
19 作動流体導入部
20 冷却装置
21 コンデンサ
22 平均細孔径が相対的に小さい電解金属箔(一層目の電解銅箔)
23 平均細孔径が相対的に大きい電解金属箔(二層目の電解銅箔)
10 Cooler 11 Working fluid 12 Container 13 Heating element 14 Cooling member 16 Working fluid supply unit 17 Steam discharge unit 18 Working fluid introduction member 19 Working fluid introduction unit 20 Cooling device 21 Capacitor 22 Electrolytic metal foil with relatively small average pore diameter (Electrodeposited copper foil for the first layer)
23 Electrolytic metal foil with relatively large average pore diameter (second-layer electrolytic copper foil)

Claims (7)

  1.  平均細孔径が異なる二層の多孔質体で構成された電解金属箔が一体形成されてなる冷却部材。 A cooling member integrally formed with an electrolytic metal foil composed of two layers of porous bodies with different average pore diameters.
  2.  前記二層の電解金属箔は、作動流体を収容する容器内において、発熱体に対向するように設けられたときに、それぞれ毛細管現象により前記作動流体を前記発熱体の表面に供給する作動流体供給部と、前記発熱体の表面で発生した蒸気を前記作動流体側へ排出する蒸気排出部とを備える請求項1に記載の冷却部材。 When the two layers of electrolytic metal foils are provided in a container containing a working fluid so as to face the heating element, the working fluid is supplied to the surface of the heating element by capillary action. 2. The cooling member according to claim 1, further comprising: a portion, and a steam discharge portion for discharging steam generated on the surface of the heating element toward the working fluid.
  3.  前記二層の電解金属箔は、それぞれハニカム構造を有している請求項2に記載の冷却部材。 The cooling member according to claim 2, wherein each of the two layers of electrolytic metal foil has a honeycomb structure.
  4.  発熱体を冷却するための沸騰方式による冷却器であって、
     作動流体を収容する容器と、
     前記容器内において、前記発熱体の表面に対向するように設けられた請求項1~3のいずれか一項に記載の冷却部材と、
    を備え、
     前記冷却部材は、前記平均細孔径が相対的に小さい電解金属箔及び前記平均細孔径が相対的に大きい電解金属箔が前記発熱体側からこの順で設けられている冷却器。
    A boiling type cooler for cooling a heating element,
    a container containing a working fluid;
    a cooling member according to any one of claims 1 to 3, provided in the container so as to face the surface of the heating element;
    with
    The cooling member is a cooler in which an electrolytic metal foil having a relatively small average pore size and an electrolytic metal foil having a relatively large average pore size are provided in this order from the heating element side.
  5.  前記平均細孔径が相対的に大きい電解金属箔の前記作動流体側に積層するように設けられ、前記作動流体を前記平均細孔径が相対的に大きい電解金属箔に導く作動流体導入体を更に備えた請求項4に記載の冷却器。 It further comprises a working fluid introduction member provided so as to be laminated on the working fluid side of the electrolytic metal foil having a relatively large average pore diameter, and introducing the working fluid to the electrolytic metal foil having a relatively large average pore diameter. 5. A cooler according to claim 4.
  6.  請求項4または5に記載の冷却器と、
     前記冷却器の前記容器に接続され、蒸発した作動流体を液化するコンデンサと、
    を備えた冷却装置。
    a cooler according to claim 4 or 5;
    a condenser connected to the vessel of the cooler to liquefy vaporized working fluid;
    cooling system with
  7.  電解析出によって平均細孔径が相対的に小さい一層目の電解金属箔を形成し、続いて電解析出によって平均細孔径が相対的に大きい二層目の電解金属箔を前記一層目の電解金属箔上に形成することで、平均細孔径が異なる二層の多孔質体で構成された電解金属箔が一体形成されてなる冷却部材を製造する方法。 A first layer of electrolytic metal foil having a relatively small average pore size is formed by electrolytic deposition, and then a second layer of electrolytic metal foil having a relatively large average pore size is formed by electrolytic deposition. A method for manufacturing a cooling member integrally formed with an electrolytic metal foil composed of two layers of porous bodies having different average pore diameters by forming the foil on the foil.
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JPS63273790A (en) * 1987-05-06 1988-11-10 Mitsubishi Metal Corp Heat transfer body and manufacture thereof
JP2013243249A (en) * 2012-05-21 2013-12-05 Denso Corp Heat transfer surface for ebullient cooling and ebullient cooling device
JP2014219150A (en) * 2013-05-08 2014-11-20 富士通株式会社 Sheet-like heat pipe and method of manufacturing the same, and electronic equipment
JP2016040505A (en) * 2014-08-12 2016-03-24 国立大学法人横浜国立大学 Cooler, cooling device using the same, and cooling method of heating element
JP2017219269A (en) * 2016-06-08 2017-12-14 国立大学法人横浜国立大学 Cooling method of heating element
WO2019194089A1 (en) * 2018-04-02 2019-10-10 日本電気株式会社 Electronic apparatus
JP2020197314A (en) * 2019-05-31 2020-12-10 大日本印刷株式会社 Vapor chamber, electronic device, and metal sheet for vapor chamber

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63273790A (en) * 1987-05-06 1988-11-10 Mitsubishi Metal Corp Heat transfer body and manufacture thereof
JP2013243249A (en) * 2012-05-21 2013-12-05 Denso Corp Heat transfer surface for ebullient cooling and ebullient cooling device
JP2014219150A (en) * 2013-05-08 2014-11-20 富士通株式会社 Sheet-like heat pipe and method of manufacturing the same, and electronic equipment
JP2016040505A (en) * 2014-08-12 2016-03-24 国立大学法人横浜国立大学 Cooler, cooling device using the same, and cooling method of heating element
JP2017219269A (en) * 2016-06-08 2017-12-14 国立大学法人横浜国立大学 Cooling method of heating element
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JP2020197314A (en) * 2019-05-31 2020-12-10 大日本印刷株式会社 Vapor chamber, electronic device, and metal sheet for vapor chamber

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