WO2023158550A1 - Dispositifs de conversion de couleur à points quantiques - Google Patents

Dispositifs de conversion de couleur à points quantiques Download PDF

Info

Publication number
WO2023158550A1
WO2023158550A1 PCT/US2023/011917 US2023011917W WO2023158550A1 WO 2023158550 A1 WO2023158550 A1 WO 2023158550A1 US 2023011917 W US2023011917 W US 2023011917W WO 2023158550 A1 WO2023158550 A1 WO 2023158550A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
metal material
examples
cavities
led
Prior art date
Application number
PCT/US2023/011917
Other languages
English (en)
Inventor
Mark Alejandro Quesada
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of WO2023158550A1 publication Critical patent/WO2023158550A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Definitions

  • the present disclosure relates to the production of color converter devices and, more particularly, to substrate materials and designs for color converters of lightemitting diode devices.
  • LEDs Light-emitting diodes
  • OLEDs organic light-emitting diodes
  • These LEDs can be integrated with color conversion elements such as quantum dots color converters (e.g., quantum dots color filters) to emit light of various colors, such as red light and green light.
  • the LEDs may emit blue light, which excites red and green quantum dots to emit red and green light, respectively.
  • FIG. 2 illustrates a prior art LED device 200 that includes a quantum dot (QD) color converter plate 202 integrated with a Complementary Metal- Oxide-Silicon (CMOS) backplane 204.
  • the CMOS backplane 204 which includes a first passivation layer 217, a second passivation layer 219, and a plurality of CMOS pixels 222, can drive blue micro-LED arrays 206.
  • QD color converter plate 202 includes a single glass substrate 208 as well as a photo lithographically patterned black matrix polymer layer 210 between red and green QD photo resists 212.
  • QD color converter plate 202 can be flip bonded to the blue micro-LED arrays 206, as illustrated by flip chip bumps 214.
  • the black matrix polymer layer 210 divides the red, green, and blue pixels of the LED device 200 and can block light leaking from areas between the pixels.
  • black matrix polymer layer 210 is typically prepared with metal oxide, carbon black, titanium black or organic pigment dispersed in a photoresist polymer, which have relatively higher light absorption properties.
  • the black matrix polymer layer 210 negatively impacts the overall optical efficiency of the LED device 200 by absorbing incident blue LED photons from blue micro-LED arrays 206.
  • LEDs are temperature sensitive. For example, absorbed heat may cause LEDs to be less efficient, or may even cause color shifts in the emitted light.
  • some device designs include substrates that absorb and direct heat away from the LEDs. These substrates include uniform sheets of glass and printed circuit board (PCB) layered structures. The heat may be directed to a heat sink, for example.
  • the color conversion elements are placed at far distances away from LED surfaces. These designs, however, may have drawbacks. For example, they may not direct enough heat away from color conversion elements thereby causing the above noted inefficiencies or shifts in emitted light, and may, in some instances, increase device thickness.
  • thermal considerations can limit the display brightness level, which is a key value metric for displays, such as micro-LED displays.
  • the embodiments disclosed herein are directed to apparatus and methods of laser sealed hermetic glass packages containing color converting elements with metal reflective walls, and that may reduce heat within color converters, such as quantum dots (QD) color converters (e.g., quantum dots color filters).
  • QD quantum dots
  • the apparatuses and methods described herein may employ a color converter hermetic glass structure that includes a metal portion filled with quantum dot materials, as well as top and bottom glass substrates positioned on either side of the metal portion, to provide thermal radiation properties designed to keep the internal color-converting quantum dots materials at lower operating temperatures.
  • Optical elements such as binary diffractive optical elements (DOEs) (e.g., thermally radiative photonic structures), optical metasurface elements, and silicon carbide (SiC) based optical elements (e.g., thermally radiative SiC photonic structures), may be deposited along the top glass substrate.
  • DOEs binary diffractive optical elements
  • SiC silicon carbide
  • the optical elements may operate by means of interference and diffraction to produce arbitrary distributions of light.
  • the bottom glass substrate may be coated with low emissivity material (e.g., a “low-E” coating) to reflect thermal radiation emanating from LED arrays.
  • the low emissivity material may have a thermal emissivity of between .02 and .05, inclusive, in some examples.
  • the embodiments may provide QD color converter plates that provide a reliable hermetic environment for quantum dot operation with highly reflective (and, e.g., poorly light absorbing) walls for more efficient and longer lived operation over conventional structures.
  • the embodiments promote more efficient color conversion by recycling reflected light (e.g., light in visible wavelengths) from pore walls, and provide a hermetic glass environment that accommodates color converting materials, including quantum dots.
  • the hermetic glass environment may further provide superior water vapor transmission rates (WVTRs) over conventional structures.
  • WVTRs water vapor transmission rates
  • a color converter plate includes a first glass substrate and a second glass substrate opposite the first glass substrate.
  • the color converter plate also includes a metal material disposed between the first glass substrate and the second glass substrate.
  • the metal material may be aluminum foil, for example, and includes a plurality of cavities.
  • the plurality of cavities may hold color converting material, such as a solution of quantum dots.
  • binary diffractive optical elements are deposited along a surface of the first glass substrate.
  • a surface of the second glass substrate is coated with a low emissivity material.
  • the color converter device may be packaged with light-emitting diode arrays within LED displays, for example.
  • a device may comprise a first glass substrate and a second glass substrate opposite the first glass substrate.
  • the device may further comprise a metal material disposed between the first glass substrate and the second glass substrate.
  • the metal material comprises a plurality of cavities.
  • the plurality of cavities may hold color converting material.
  • the plurality of cavities include the color converting material.
  • the color converting material comprises quantum dots.
  • the metal material comprises aluminum foil.
  • binary diffractive optical elements are deposited along a first surface (e.g., first side) of the first glass substrate.
  • a first surface of the second glass substrate is coated with a low emissivity material.
  • a second surface e.g., second side) of the first glass substrate is welded to a first surface of the metal material.
  • the second surface of the first glass substrate is opposite the first surface of the first glass substrate.
  • a second surface of the second glass substrate is welded to a second surface of the metal material.
  • the second surface of the second glass substrate is opposite the first surface of the second glass substrate.
  • an LED device comprises a color converter plate.
  • the color converter plate may comprise a first glass substrate and a second glass substrate opposite the first glass substrate.
  • the color converter plate may further comprise a metal material disposed between the first glass substrate and the second glass substrate.
  • the metal material comprises a plurality of cavities.
  • the plurality of cavities may hold color converting material.
  • the LED device may further include a plurality of LED arrays disposed between the metal material and the second glass substrate.
  • the plurality of cavities include the color converting material.
  • the color converting material comprises quantum dots material.
  • the metal material comprises aluminum foil.
  • binary diffractive optical elements are deposited along a first surface of the first glass substrate.
  • a first surface of the second glass substrate is coated with a low emissivity material.
  • a second surface of the first glass substrate is welded to a first surface of the metal material.
  • a second surface of the second glass substrate is welded to a second surface of the metal material.
  • a method such as by one or more processors executing instructions, includes disposing a metal material on a first glass substrate.
  • the metal material may comprise a plurality of cavities.
  • the method may also include filling the plurality of cavities with the color converting material.
  • the method may further include disposing a second glass substrate on the metal material.
  • the color converting material comprises quantum dots material.
  • the metal material comprises aluminum foil.
  • the method includes depositing binary diffractive optical elements along a first surface of the first glass substrate.
  • the method includes coating a first surface of the second glass substrate with a low emissivity material.
  • the method includes welding a second surface of the first glass substrate to the first surface of the metal material.
  • the method includes welding a second surface of the second glass substrate to the second surface of the metal material.
  • a non-transitory computer readable medium stores instructions that, when executed by one or more processors, cause the one or more processors to perform a method that includes disposing a metal material on a first glass substrate.
  • the metal material may comprise a plurality of cavities.
  • the method may also include filling the plurality of cavities with the color converting material.
  • the method may further include disposing a second glass substrate on the metal material.
  • the color converting material comprises quantum dots material.
  • the metal material comprises aluminum foil.
  • the method includes depositing binary diffractive optical elements along a first surface of the first glass substrate. In some examples, the method includes coating a first surface of the second glass substrate with a low emissivity material. In some examples, the method includes welding a second surface of the first glass substrate to the first surface of the metal material. In some examples, the method includes welding a second surface of the second glass substrate to the second surface of the metal material.
  • FIG. 1 illustrates a device in accordance with some examples.
  • FIG. 2 illustrates a prior art device.
  • FIGS. 3A, 3B, and 3C illustrate the assembly of a device in accordance with some examples.
  • FIG. 4A illustrates the assembly of a device in accordance with some examples.
  • FIGS. 4B and 4C illustrate observed properties of the device of FIG. 4A in accordance with some examples.
  • FIGS. 5 and 6 illustrate exemplary methods for generating devices with substrate structures in accordance with some examples.
  • FIG. 7 illustrates a system to assemble a device in accordance with some examples.
  • FIGS. 8 A and 8B illustrate the assembly of a device in accordance with some examples.
  • FIGS. 9 A, 9B, and 9C illustrate further assembly of the device of FIGS. 8 A and 8B in accordance with some examples.
  • FIGS. 10A, 10B, 10C, and 10D illustrate further assembly of the device of FIGS. 9A, 9B, and 9C in accordance with some examples.
  • FIGS. 11 A, 1 IB, and 11C illustrate an LED device in accordance with some examples.
  • FIG. 12 illustrates a display in accordance with some examples.
  • FIG. 1 illustrates a color converter plate 100 that includes a metal material 102 disposed between a first (e.g., top) glass substrate 104 and a second (e.g., bottom) glass substrate 106.
  • the metal material 102 provides highly reflective surfaces over a broad spectral range, such as over visible wavelengths.
  • the metal material 102 may include aluminum foil.
  • the metal material 102 may include chromium. The highly reflective surfaces may allow for more efficient conversion of incident blue photons compared to conventional color converters.
  • first glass substrate 104 and the second glass substrate 106 may be welded (e.g., laser welded) to a surface of the metal material 102.
  • first glass substrate 104 may be welded to the metal material 102 along portions of a first interface 110.
  • Second glass substrate 106 may be welded to the metal material 102 along portions of a second interface 112.
  • the metal material 102 may server as a framework onto which first glass substrate 104 and second glass substrate 106 may be attached.
  • Metal material 102 may include cavities 120 (e.g., “pores”) to hold a solution 130 that includes color conversion elements 132.
  • the cavities 120 are concave extending towards the second glass substrate 106.
  • the cavities 120 may be patterned along metal material 102. The pattern may match a pattern of LEDs, such as a pitch of LED arrays (e.g., pLED arrays), below the second glass substrate 106.
  • the color conversion material 130 may include, for example, fluorophores (e.g., pi-orbital organic molecules with singlet or triplet transitions, phosphors (e.g., transition metal elements exhibiting transitions epitomized by ligand field theoretical descriptions, inorganic compounds exhibiting band structures (e.g., chalcogenides), or nano-phosphors (e.g., QDs or perovskites).
  • fluorophores e.g., pi-orbital organic molecules with singlet or triplet transitions
  • phosphors e.g., transition metal elements exhibiting transitions epitomized by ligand field theoretical descriptions, inorganic compounds exhibiting band structures (e.g., chalcogenides), or nano-phosphors (e.g., QDs or perovskites).
  • the color conversion material 130 may be a solution that includes QDs (e.g., core-type QDs, core-shell QDs, alloyed QDs).
  • the cores of the QDs are made of cadmium selenide (CdSe), cadmium telluride (CdTe), indium phosphide (InP), or zinc selenide (ZnSe), among other examples.
  • the cavities 120 can maintain the isolation of RGB pixels, thereby reducing pixel-to-pixel crosstalk, with sidewalls 140 reflecting back emissions from the color conversion elements 132. As a result, usable photons that otherwise may be lost to black matrix-type absorption are preserved (e.g., the number of lost usable photons are decreased).
  • the cavities 120 may act as highly reflective hermetic volumes, and may be filled with a QD solution 130 within a nitrogen glove box to minimize trapped oxygen or moisture.
  • the metal material 102 may include aluminum foil that has a cavity 120 density between 1800 cavity/cm 3 and 2200 (e.g., 2000 cavity/cm 3 density), a cavity 120 diameter between 15 pm and 25 pm (e.g., 20 pm diameter cavity pattern), and a thickness between 10 pm and 20 pm (e.g., 15 pm thickness).
  • the cavities 120 may be of any suitable shape to hold the solution 130.
  • binary diffractive optical elements may be deposited along a top surface 150 of the first glass substrate 104.
  • the binary DOEs may include, for example, a silicon carbide (SiC) thermally radiative binary material (e.g., thermally radiative SiC photonic structures).
  • SiC silicon carbide
  • the binary DOEs may diffract surface thermal photons laterally away from the top surface 150 of the first glass substrate 104.
  • a bottom surface 152 of second glass substrate 106 may be coated with a low emissivity material (e.g., “low-E” coating), thereby reflecting infrared photons emanating from LED arrays.
  • the bottom surface 152 of the second glass substrate is attached to one or more LEDS, such as pLED arrays.
  • the pattern of the plurality of cavities 120 may match a pattern of the LEDs along the bottom surface 152 of second glass substrate 106.
  • FIGS. 3A, 3B, and 3C illustrate the assembly of a color converter plate 300.
  • a bottom glass substrate 302 is positioned to receive a metal material 310 along a first surface 304.
  • the bottom glass substrate 302 may be plain glass, and may include a low emissivity coating at least along a second surface 306 opposite the first surface 304 to reflect thermal radiation.
  • the bottom glass substrate 302 includes a low emissivity coating along each of the first surface 304 and the second surface 306.
  • the metal material 310 may include a plurality of cavities 320 to hold a color conversion solution as described herein.
  • the metal material 310 may include, for example, aluminum foil.
  • the bottom glass substrate 302 may be attached to the metal material 310 by welding.
  • a laser such as a 355 nm, ⁇ 10 ns pulse width, 100 pm diameter focal spot laser, may be used to weld first surface 304 of the bottom glass substrate 302 to a first surface 312 of the metal material 310.
  • the focal spot laser may be configured to provide the laser using a ⁇ 50 mm/sec sweep rate.
  • the first surface 304 of the bottom glass substrate 302 is welded to the first surface 312 of the metal material 310 along a first interface perimeter 322, which can provide strong glass-metal seals suitable for long lived hermetic operation.
  • additional welds may be provided by sweeping the laser along any of one or more gap regions between adjacent cavities 120 to confer enhanced strength and ensure a more robust hermetic package.
  • FIG. 3B illustrates the filling of cavities 320 with a solution 330 that includes color conversion elements 332.
  • the color conversion elements 332 may include quantum dots, such as red and green quantum dots.
  • the solution 330 may be poured onto a second surface 340 of the metal material 310, where the second surface 340 includes the plurality of cavities 320.
  • a squeegee 350 is used to spread the solution 330 over the plurality of cavities 320.
  • a spin coater is used to apply (e.g., spray) the solution 330 onto the second surface 340 of the metal material 310 thereby filling the plurality of cavities 320.
  • FIG. 3C illustrates a top glass substrate 360 being attached to metal material 310.
  • the top glass substrate 360 may be positioned over the second surface 340 of the metal material 310, and may be attached to the second surface 340 by welding.
  • the above mentioned laser may be used to weld a first surface 362 of the top glass substrate 360 to the second surface 340 of the metal material 310.
  • the first surface 362 of the top glass substrate 360 is welded to the second surface 340 of the metal material 310 along a second interface perimeter 364, which can provide strong glass-metal seals suitable for long lived hermetic operation.
  • additional welds may be provided by sweeping the laser along any of one or more gap regions between adjacent cavities 120 to confer enhanced strength and ensure a more robust hermetic package.
  • the laser is communicatively coupled to a controller that configures and controls the laser to perform the welding.
  • the controller may include one or more processors that execute instructions to configure and control the laser to perform the welding.
  • the one or more processors may execute the instructions to issue commands to the laser to cause the laser to weld the bottom glass substrate 302 to the metal material 310, and to weld the top glass substrate 360 to the metal material 310, as described herein.
  • FIG. 4A illustrates a color converter plate 400 that includes a metal material 402 disposed between a first (e.g., top) glass substrate 404 and a second (e.g., bottom) glass substrate 406.
  • the metal material 402 provides highly reflective surfaces over a broad spectral range, such as over visible wavelengths.
  • the metal material 402 may include aluminum foil.
  • the metal material 402 may include chromium.
  • the highly reflective surfaces may allow for more efficient conversion of incident blue photons compared to conventional color converters.
  • Metal material 402 may include cavities 420 to hold a solution 430 that includes color conversion elements 432, such as red and green quantum dots.
  • first glass substrate 404 and the second glass substrate 406 may be welded (e.g., laser welded) to a surface of the metal material 402.
  • first glass substrate 404 may be welded to the metal material along portions of a first interface 410.
  • Second glass substrate 406 may be welded to the metal material along portions of a second interface 412.
  • the metal material 402 may server as a framework onto which first glass substrate 404 and second glass substrate 406 may be attached.
  • binary diffractive optical elements (DOEs) 454 may be deposited along a top surface 450 of the first glass substrate 404.
  • the binary diffractive optical elements (DOEs) 454 may include silicon carbide (SiC) thermally radiative binary material e.g., thermally radiative SiC photonic structures), for example.
  • the binary DOEs 454 may, in some examples, have a pitch of 6.1 pm and a height of 1 pm.
  • the binary DOEs 454 may diffract surface thermal photons laterally away from the top surface 450 of the first glass substrate 404, as indicated by arrows 455.
  • FIG. 4B illustrates a graph 480 with temperature along a first axis 482 and wavelength along a second axis 484.
  • the surface thermal photon wavelengths associated with LED surface temperatures may be predicted using Wien’s Law, and is indicated in the graph 480 by line 486.
  • the commensurate wavelengths range from 7 pm - 10 pm, as indicated by area 488 of graph 480.
  • the binary DOEs 454 are equidistant from each other. In other examples, the binary DOEs 454 are in a checkerboard pattern, such that at least one portion of each binary DOE 454 is in contact with portions of three other binary DOEs 454.
  • a bottom surface 452 of second glass substrate 406 may be coated with a low emissivity material, thereby reflecting infrared photons emanating from LED arrays.
  • the bottom surface 452 of the second glass substrate is attached to one or more LEDS, such as pLED arrays.
  • the pattern of the plurality of cavities 420 may match a pattern of the LEDs, for example.
  • FIG. 4C illustrates a graph 490 with wavelength on a first axis 492 and transmission spectra along a second axis 494.
  • Line 496 indicates an emissivity “transmission” spectra of a 6.1 pm SiC checkerboard pattern illustrating the thermal wavelengths that will transmit - via coupling - into the diffraction orders and space above the first glass substrate 404 of FIG. 4A. This thermal transmission depletes the surface of thermal phonons, in effect cooling the surface, forming a thermal gradient for heat flow from the substrate interior to the surface.
  • FIG. 5 illustrates an exemplary method 500 to form a color converter plate, such as the color converter plate 100 of FIG. 1.
  • a metal material such as aluminum foil
  • the metal material comprises a plurality of cavities for holding color converting material.
  • metal material 102 comprising cavities 120 may be disposed on second glass substrate 106.
  • the plurality of cavities are filled with the color converting material.
  • the cavities 120 may be filled with solution 130 that includes color conversion elements 132.
  • the color conversion elements 132 may include red and green quantum dots, for example.
  • a second glass substrate is disposed on the metal material.
  • first glass substrate 104 may be disposed on metal material 102.
  • each of the first glass substrate and the second glass substrate are welded to the metal material.
  • the first glass substrate may be welded to a first surface of the metal material along portions of a first interface perimeter
  • the second glass substrate may be welded to a second surface opposite the first surface of the metal material along portions of a second interface perimeter. The method then ends.
  • FIG. 6 illustrates an exemplary method 600 to form a color converter plate, such as the color converter plate 400 of FIG. 4.
  • a first surface of an aluminum foil is welded to a first surface of a first glass substrate.
  • the aluminum foil includes a second surface with a plurality of cavities.
  • bottom glass substrate 402 may be laser welded to the first surface 412 of the metal material 410.
  • the plurality of cavities are filled with a quantum dot material.
  • the plurality of cavities may be filled with the solution 430 that includes color conversion elements 432.
  • the color conversion elements 432 may include red and green quantum dots, for example.
  • the second surface of the aluminum foil is welded to a first surface of a second glass substrate.
  • top glass substrate 460 may be laser welded to the second surface 440 of the metal material 410.
  • a plurality of binary diffractive optical elements are disposed on a second surface of the first glass substrate.
  • binary DOEs 454 may be deposited along a top surface 450 of the first glass substrate 404.
  • a second surface of the second glass substrate is coated with a low emissivity material.
  • a bottom surface 452 of second glass substrate 406 may be coated with a low emissivity material.
  • the plurality of binary diffractive optical elements are disposed on the second surface of the first glass substrate before the first glass substrate is welded to the metal material. In some examples, the plurality of binary diffractive optical elements are disposed on the second surface of the first glass substrate after the first glass substrate is welded to the metal material. In some examples, the second surface of the second glass substrate is coated with the low emissivity material before the second glass substrate is welded to the metal material. In some examples, the second surface of the second glass substrate is coated with the low emissivity material after the second glass substrate is welded to the metal material. The method then ends.
  • FIG. 7 illustrates an exemplary system 700 to assemble a color converter plate, such as the color converter plate 100 of FIG. 1.
  • the system 700 a controller 701, a laser system 720, a spin coater 730, and a color converter plate, such as the color converter plate 100 of FIG. 1.
  • the controller 701 includes one or more processors 702, a memory 704, and in some examples, a transceiver 706.
  • the one or more processors 702 may include, for example, one or more central processing units (CPUs), microcontrollers, general processing units (GPUs), or any other processing devices.
  • the memory 704 may include instructions that can be accessed and executed by the one or more processors 702.
  • memory 704 may be a non-transitory computer readable medium storing the instructions, such as an EPROM, an EEPROM, or any other suitable memory.
  • Transceiver 706 may provide for communications over a wired or wireless network. For example, the transceiver may transmit data to, and receive data from, each of the laser system 720 and the spin coater 730.
  • Controller 701 may transmit commands to laser system 720 to weld a first glass substrate to a metal material.
  • controller 701 may transmit commands to laser system 720 to weld second glass substrate 106 to metal material 102 along portions of the second interface 112.
  • Controller 701 may transmit commands to spin coater 730 to disperse a solution onto the metal material to fill the plurality of cavities.
  • controller 701 may transmit commands to spin coater 730 to have solution 130, which may include color conversion elements 132, dispersed onto metal material 102 to fill cavities 120.
  • Controller 701 may transmit commands to the spin coater 730 to start, and to stop, the application of the solution.
  • controller 701 may transmit additional commands to laser system 720 to weld a second glass substrate to the metal material.
  • controller 701 may transmit commands to laser system 720 to weld first glass substrate 104 to metal material 102 along portions of the first interface 110.
  • controller 701 transmits additional commands to laser system 720 to sweep the laser along any of one or more gap regions between adjacent cavities 120 to confer enhanced strength and ensure a more robust hermetic package.
  • FIGS. 8 A and 8B illustrate the assembly of a color converter plate 800, which includes performing photolithographic processes on a glass substrate 802 using a hole-patterned mask 804 that has a plurality of holes 806.
  • the plurality of holes 807 such as 1 mm radii holes, may be distributed in a pattern.
  • the holes 807 may be distributed in a pattern that includes a predetermined number of holes (e.g., dots) per inch, such as 10 holes per inch (e.g., 10 dpi).
  • the hole-patterned mask 804 may also include a rim 808 of a particular width.
  • the rim 808 may have a width in the range of 2 mm to 10 mm, such as 5 mm.
  • the glass substrate 802 is square-shaped with sides anywhere between 50 mm and 150 mm, such as with sides of 100 mm.
  • the mask 806 is a metal, such as aluminum, and is laser bonded to the glass substrate 802.
  • photolithography is performed on the glass substrate 802 to apply a metal, such as chromium (Cr), throughout the hole-patterned mask 804 to form a metal layer 820.
  • a metal such as chromium (Cr)
  • Cr chromium
  • chromium may be applied to the hole-patterned mask 804 using any suitable photolithography process, which results in a chromium layer 820 over portions of the glass substrate 802.
  • an electroplating process is applied to the metal layer 820 to expand the metal layer 820 to a predetermined height 822.
  • any suitable electroplating process may be applied to the chromium layer 820 that results from the photolithography process to expand the chromium layer 820 to a height 822 of between 2 pm and 25 pm, such as 20 pm.
  • a rim along the periphery of color converter plate 800 may be added by masking the interior and sputtering additional metal, serving both as a platform to bond a top glass plate, as well as a frame with which to center the hole-patterned mask 804.
  • LED arrays may provide light from a backside 812 of color converter plate 800.
  • FIGS. 9A, 9B, and 9C illustrate further assembly of the color converter plate 800 to assemble a photoresist-filled color converter plate 900.
  • a photoresist mask 902 that includes a plurality of holes 906 and a plurality of blocked holes 904 is positioned on the hole-patterned mask 804.
  • the photoresist mask 902 may be aluminum, for example, and may be positioned on the hole-patterned mask 804 with wetting. The wetting may ensure blockage of the blocked holes 904.
  • the dimensions of the photoresist mask 902 are similar to, or the same as, the dimensions of the hole- patterned mask 804.
  • each of the photoresist mask 902 and the hole- patterned mask 804 may be square-shaped and have sides of 100 mm.
  • the plurality of holes 906 may allow for passage of a solution, such as a photoresist, and the plurality of blocked holes 904 may block passage of the solution.
  • a solution 930 that includes color conversion elements 932 may be poured (e.g., from a container) onto a top surface of the photoresist mask 902, where the plurality of holes 906 allow passage of the solution 930 to the metal layer 820, while the plurality of blocked holes 904 block passage of the solution 930 to the metal layer 820.
  • the color conversion elements 932 are red quantum dots.
  • a squeegee 350 is used to spread the solution 930 over the top surface of the photoresist mask 902.
  • a spin coater e.g., spin coater 730
  • applies e.g., spray
  • the solution 930 onto the top surface of the photoresist mask 902.
  • the above process may be repeated using a photoresist mask 902 with a differing pattern of the plurality of holes 906 and plurality of blocked holes 904 thereby allowing additional solution 930 to pass through to a different portion of the plurality of holes 806 of the hole-patterned mask 804.
  • a first solution 930 that includes red quantum dots, but not any other color quantum dots may be applied to a first photoresist mask 902 with a first pattern of the plurality of holes 906 and plurality of blocked holes 904, thereby filling a first portion of the plurality of holes 806 of the hole-patterned mask 804.
  • the first photoresist mask 902 may then be removed and replaced with a second photoresist mask 902 that includes a second pattern of the plurality of holes 906 and plurality of blocked holes 904.
  • a second solution 930 that includes blue quantum dots, but not any other color quantum dots, may be applied to the second photoresist mask 902 thereby filling a second portion of the plurality of holes 806 of the hole-patterned mask 804.
  • the second photoresist mask 902 may then be removed and replaced with a third photoresist mask 902 that includes a third pattern of the plurality of holes 906 and plurality of blocked holes 904.
  • a third solution 930 that includes green quantum dots, but not any other color quantum dots, may be applied to the third photoresist mask 902 thereby filling a third portion of the plurality of holes 806 of the hole-patterned mask 804.
  • each of the first, second, and third photoresist masks 902 include a plurality of holes 906 within alternating rows (e.g., each photoresist mask 902 may include a plurality of holes 806 within every third row, where the rows with the a plurality of holes 906 alternate between the first, second, and third masks 902).
  • FIG. 9C illustrates the resulting photoresist-filled color converter plate 900.
  • FIGS. 10 A, 10B, 10C, and 10D illustrate further assembly of the photoresist- filled color converter plate 900 to assemble a sealed color converter plate 1000.
  • FIG. 10A illustrates the photoresist-filled color converter plate 900.
  • FIG. 10B illustrates a top glass substrate 1002 that may be placed over the photoresist-filled color converter plate 900.
  • the photoresist-filled color converter plate 900 includes a bottom glass substrate 1003 (e.g., the glass substrate 802) and the metal layer 820.
  • the top glass substrate 1002 has similar, or the same, dimensions as the photoresist-filled color converter plate 900.
  • each of the photoresist-filled color converter plate 900 and the top glass substrate 1002 may be square-shaped with sides approximately 10 mm in length.
  • FIG. 10C illustrates the sealing of the top glass substrate 1002 to the photoresist-filled color converter plate 900 using a laser beam 1004 provided by a laser system, such as laser system 720 (laser system not shown in FIG. 10C).
  • a laser system such as laser system 720 (laser system not shown in FIG. 10C).
  • the top glass substrate 1002 and the photoresist-filled color converter plate 900 may be placed in a nitrogen glove box (e.g., to prevent oxygen and moisture from entering the assembly), and may be hermetically sealed by providing the laser beam 1004 along portions of a perimeter 1008 of the top glass substrate 1002 and the metal layer 820 (e.g., chromium layer 820) portion of the photoresist-filled color converter plate 900.
  • the laser beam 1004 is applied along all portions of the perimeter 1008.
  • FIG. 10D illustrates the resulting sealed color converter plate 1000.
  • FIGS. 11 A, 1 IB, and 11C illustrate an LED device 1100 that includes a top glass substrate 1102, a metal material 1104, an LED array 1106, and a backplane layer 1108.
  • the backplane layer 1108 may be a complementary metal-oxide semiconductor (CMOS) based backplane layer.
  • the metal material 1104 may be made of one or more metal layers including a layer of aluminum, and may include a plurality of cavities 1103 for holding color converting material as described herein.
  • the cavities 1103 may hold green quantum dots 1120, blue quantum dots 1122, and red quantum dots 1124.
  • the LED array 1106 may be a pLED array, for example, and may disposed between the metal layer 1106 and a bottom glass substrate 1140.
  • the metal layer 1104 may be deposited within a cavity 1150 of the top glass substrate 1102. Further, LED device 1100 may include metal leads 1130 (e.g., metal traces) to allow, for example, for a power connection. As illustrated in FIG. 11 A, the cavities 1103 are patterned to have a pitch 1125 that matches a pitch 1107 of LED array 1106.
  • FIG. 11B illustrates a rim 1132 along which the top glass substrate 1102 may be laser welded to the metal material 1104.
  • metal material 1104 may be made of several layers, including a first material layer 1134, a second material layer 1135, a third material layer 1136, and a fourth material layer 1137.
  • first material layer 1134 may be made of aluminum and have a depth in the range from 2 pm to 3 pm (e.g., 2.1 pm), inclusive.
  • the second material layer 1135 may be made of Chromium and have a depth in the range from 18 pm to 25 pm (e.g., 20 pm), inclusive.
  • the third material layer 1136 may be made of aluminum oxide (AI2O3) and have a depth in the range from 175 pm to 250 pm (e.g., 200 pm), inclusive.
  • the fourth material layer 1137 may also be made of aluminum and have a depth in the range from 175 pm to 250 pm (e.g., 200 pm), inclusive.
  • FIG. 11C illustrates an example where the top glass substrate 1102 is laser welded to the bottom glass substrate 1140 along a rim 1142.
  • FIG. 12 illustrates a device 1200 with a display 1202.
  • the device 1200 may be a television or monitor, for example.
  • the display 1202 includes the LED device 1100 of FIGS. 11 A, 1 IB, and 11C.
  • the top glass substrate 1102 is illustrated on the outside (e.g., the viewing side) of the display 1202, whereas the bottom glass substrate 1140 is on the inside of display 1202.
  • a color converter plate includes a first glass substrate and a second glass substrate opposite the first glass substrate.
  • the color converter plate also includes a metal material disposed between the first glass substrate and the second glass substrate.
  • the metal material may be aluminum foil, for example, and includes a plurality of cavities for holding color converting material, such as a solution of quantum dots.
  • binary diffractive optical elements are deposited along a surface of the first glass substrate.
  • a surface of the second glass substrate is coated with a low emissivity material.
  • the color converter device may be hermetically packaged and include light-emitting diode arrays to be used within LED displays, for example.
  • a device comprises a first glass substrate and a second glass substrate opposite the first glass substrate.
  • the device also comprises a metal material disposed between the first glass substrate and the second glass substrate.
  • the metal material comprises a plurality of cavities for holding color converting material.
  • the plurality of cavities include the color converting material.
  • the color converting material comprises quantum dots.
  • the quantum dots comprise red and green quantum dots.
  • the metal material comprises aluminum foil.
  • a first side of the aluminum foil comprises the plurality of cavities.
  • the plurality of cavities are concave.
  • the device comprises optical elements deposited along the first glass substrate.
  • the optical elements comprise one or more of binary diffractive optical elements and thermally radiative SiC photonic structures.
  • the optical elements are deposited in a pattern to match a pitch of light emitting diode arrays.
  • the device comprises a low emissivity material coated over the second glass substrate. In some examples, the device comprises a plurality of metallic leads.
  • a light-emitting diode (LED) display comprises a first glass substrate and a second glass substrate opposite the first glass substrate.
  • the LED display also comprises a metal material disposed between the first glass substrate and the second glass substrate.
  • the metal material comprises a plurality of cavities for holding color converting material.
  • the plurality of cavities include the color converting material.
  • the color converting material comprises quantum dots.
  • the quantum dots comprise red and green quantum dots.
  • the metal material comprises aluminum foil.
  • a first side of the aluminum foil comprises the plurality of cavities.
  • the plurality of cavities are concave.
  • the LED display comprises optical elements deposited on the first glass substrate.
  • the optical elements comprise one or more of binary diffractive optical elements and thermally radiative SiC photonic structures.
  • the optical elements are deposited in a pattern to match a pitch of light emitting diode arrays.
  • the LED display comprises a low emissivity material coated over the second glass substrate.
  • the device comprises a plurality of metallic leads.
  • a method comprises disposing a metal material on a first glass substrate, where the metal material comprises a plurality of cavities for holding color converting material. The method also comprises filling the plurality of cavities with the color converting material. Further, the method comprises disposing a second glass substrate on the metal material.
  • the plurality of cavities include the color converting material.
  • the color converting material comprises quantum dots.
  • the quantum dots comprise red and green quantum dots.
  • the metal material comprises aluminum foil.
  • a first side of the aluminum foil comprises the plurality of cavities.
  • the plurality of cavities are concave.
  • the method comprises depositing binary diffractive optical elements along the first glass substrate.
  • the binary diffractive optical elements comprise thermally radiative SiC photonic structures.
  • the binary diffractive optical elements are deposited in a pattern to match a pitch of light emitting diode arrays.
  • the method comprises applying a coat of low emissivity material over the second glass substrate.
  • a non-transitory computer readable medium stores instructions that, when executed by one or more processors, cause the one or more processors to perform a method that includes disposing a metal material on a first glass substrate, where the metal material comprises a plurality of cavities for holding color converting material. The method also comprises filling the plurality of cavities with the color converting material. Further, the method comprises disposing a second glass substrate on the metal material.
  • the plurality of cavities include the color converting material.
  • the color converting material comprises quantum dots.
  • the quantum dots comprise red and green quantum dots.
  • the metal material comprises aluminum foil.
  • a first side of the aluminum foil comprises the plurality of cavities.
  • the plurality of cavities are concave.
  • the method comprises depositing binary diffractive optical elements along the first glass substrate.
  • the binary diffractive optical elements comprise thermally radiative SiC photonic structures.
  • the binary diffractive optical elements are deposited in a pattern to match a pitch of light emitting diode arrays.
  • the method comprises applying a coat of low emissivity material over the second glass substrate.
  • a color converter plate includes a first glass substrate, and a metal layer disposed along a perimeter of the first glass substrate.
  • the device also includes a mask positioned on the metal layer, wherein the mask includes a plurality of openings to hold a solution of color conversion elements.
  • the device further includes a second glass substrate positioned over the mask and sealed to the mask.
  • alternating rows of the plurality of openings of the mask include quantum dots of a varying type (e.g., color).
  • the second glass substrate is laser-welded to the mask.
  • a hermetic glass package contains active and passive elements introduced during assembly to include LED arrays, embedded or otherwise.
  • the methods and system described herein can be at least partially embodied in the form of computer-implemented processes and apparatus for practicing those processes.
  • the disclosed methods may also be at least partially embodied in the form of tangible, non-transitory machine-readable storage media encoded with computer program code.
  • the steps of the methods can be embodied in hardware, in executable instructions executed by a processor (e.g., software), or a combination of the two.
  • the media may include, for example, RAMs, ROMs, CD-ROMs, DVD-ROMs, BD- ROMs, hard disk drives, flash memories, or any other non-transitory machine-readable storage medium.
  • the computer When the computer program code is loaded into and executed by a computer, the computer becomes an apparatus for practicing the method.
  • the methods may also be at least partially embodied in the form of a computer into which computer program code is loaded or executed, such that, the computer becomes a special purpose computer for practicing the methods.
  • the computer program code segments When implemented on a general-purpose processor, the computer program code segments configure the processor to create specific logic circuits.
  • the methods may alternatively be at least partially embodied in application specific integrated circuits for performing the methods.

Abstract

L'invention concerne des appareils et des procédés destinés à des matériaux de substrats et des conceptions qui fournissent une chaleur réduite à l'intérieur de dispositifs convertisseurs de couleur. Selon certains exemples, une plaque de convertisseur de couleur comprend un premier substrat de verre et un second substrat de verre en regard du premier substrat de verre. La plaque de convertisseur de couleur comprend également un matériau métallique disposé entre le premier substrat de verre et le second substrat de verre. Le matériau métallique peut être une feuille d'aluminium, par exemple, et comprend une pluralité de cavités pour contenir un matériau de conversion de couleur, tel qu'une solution de points quantiques. Selon certains exemples, des éléments optiques de diffraction binaires sont déposés le long d'une surface du premier substrat de verre. Selon certains exemples, une surface du second substrat de verre est revêtue d'un matériau à faible émissivité. Le dispositif convertisseur de couleur peut être conditionné avec des réseaux de diodes électroluminescentes (DEL) au sein d'écrans d'affichage à DEL, par exemple.
PCT/US2023/011917 2022-02-18 2023-01-31 Dispositifs de conversion de couleur à points quantiques WO2023158550A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202263311574P 2022-02-18 2022-02-18
US63/311,574 2022-02-18

Publications (1)

Publication Number Publication Date
WO2023158550A1 true WO2023158550A1 (fr) 2023-08-24

Family

ID=87578820

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2023/011917 WO2023158550A1 (fr) 2022-02-18 2023-01-31 Dispositifs de conversion de couleur à points quantiques

Country Status (1)

Country Link
WO (1) WO2023158550A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170025584A1 (en) * 2014-04-01 2017-01-26 Corning Precision Materials Co., Ltd. Color-converting substrate for light-emitting diode and method for producing same
US20170047487A1 (en) * 2014-04-17 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having features for reducing the visual impact of interior components
KR20170066782A (ko) * 2015-12-07 2017-06-15 주식회사 제이케이리서치 배리어 기능을 가지는 반도체 광원 및 이의 제조방법
US20210202765A1 (en) * 2019-12-26 2021-07-01 Samsung Electronics Co., Ltd. Quantum dot complex and display apparatus including the same
US20210407438A1 (en) * 2019-03-17 2021-12-30 Leia Inc. Dual view zone backlight, dual-mode display, and method employing directional emitters

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170025584A1 (en) * 2014-04-01 2017-01-26 Corning Precision Materials Co., Ltd. Color-converting substrate for light-emitting diode and method for producing same
US20170047487A1 (en) * 2014-04-17 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having features for reducing the visual impact of interior components
KR20170066782A (ko) * 2015-12-07 2017-06-15 주식회사 제이케이리서치 배리어 기능을 가지는 반도체 광원 및 이의 제조방법
US20210407438A1 (en) * 2019-03-17 2021-12-30 Leia Inc. Dual view zone backlight, dual-mode display, and method employing directional emitters
US20210202765A1 (en) * 2019-12-26 2021-07-01 Samsung Electronics Co., Ltd. Quantum dot complex and display apparatus including the same

Similar Documents

Publication Publication Date Title
US20230101190A1 (en) Semiconductor continuous array layer
JP7414886B2 (ja) 発光素子及びその製造方法
US10903265B2 (en) Pixelated-LED chips and chip array devices, and fabrication methods
US10686159B2 (en) OLED devices having improved efficiency
US8049233B2 (en) Light-emitting device
JP7278421B2 (ja) 凹部内の色変換層のインシトゥ硬化
TWI733466B (zh) 封裝與顯示模組
US11721786B2 (en) Micro light-emitting diode displays having color correction films applied thereto
KR20090002835A (ko) 질화물계 발광 소자 및 그 제조방법
CN1666576A (zh) 使用反馈增强型发光二极管的显示器件
CN116314244A (zh) 像素阵列封装结构
WO2021166772A1 (fr) Dispositif électroluminescent et procédé de fabrication de dispositif électroluminescent
US11515297B2 (en) Micro light-emitting diode displays having colloidal or graded index quantum dot films
EP4141975A1 (fr) Module électroluminescent ayant une pluralité de pixels unitaires, son procédé de fabrication et dispositif d'affichage le comprenant
CN110568654A (zh) 量子点彩膜及显示装置
WO2023158550A1 (fr) Dispositifs de conversion de couleur à points quantiques
US20140061667A1 (en) Semiconductor chip, display comprising a plurality of semiconductor chips and methods for the production thereof
CN110364611B (zh) 一种基于量子点的封装结构及显示器
CN107240594B (zh) 发光二极管设备及其制造方法
TW202410384A (zh) 量子點色彩轉換裝置
TW202332085A (zh) 包括量子點顏色轉換材料的發光裝置及其製造方法
KR100782460B1 (ko) 레이저 조사 장치 및 이를 이용한 유기전계발광소자의제조방법
KR20170112868A (ko) Led 장치 및 그 제조 방법
US20240055570A1 (en) Light emitting device with light-altering material layer, and fabrication method utilizing sealing template
CN210837804U (zh) 一种封装结构及显示器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23756761

Country of ref document: EP

Kind code of ref document: A1