WO2023142989A1 - Flexible printed circuit board and touch-control display apparatus - Google Patents
Flexible printed circuit board and touch-control display apparatus Download PDFInfo
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- WO2023142989A1 WO2023142989A1 PCT/CN2023/071210 CN2023071210W WO2023142989A1 WO 2023142989 A1 WO2023142989 A1 WO 2023142989A1 CN 2023071210 W CN2023071210 W CN 2023071210W WO 2023142989 A1 WO2023142989 A1 WO 2023142989A1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- G—PHYSICS
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- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present disclosure relates to but not limited to the field of display technology, and in particular refers to a flexible printed circuit board and a display touch device.
- the touch screen can be divided into Add on Mode, On Cell, In Cell, etc.
- the touch screen can be divided into capacitive, resistive, infrared, surface acoustic wave and so on.
- Capacitive On Cell type includes display panel, touch panel and flexible circuit board (Flexible Printed Circuit, referred to as FPC).
- the touch panel is set on the light-emitting side of the display panel, and the display panel and touch panel are connected to external devices through the flexible circuit board. .
- the present disclosure provides a flexible printed circuit board, including a main flexible board and a bridging flexible board, the main flexible board at least includes a first main pad, a second main pad, at least one first signal line and at least one A second signal line, the bridging flexible board at least includes a first bridging pad, a second bridging pad and at least one connection line; the first main pad includes at least two first soldering points, and the second The main pad includes at least two second pads, the first signal line is connected to a first pad, and the second signal line is connected to a second pad; the first bridge pad includes at least two a third welding point, the second bridging pad includes at least two fourth welding points, the first end of the connecting line is connected to a third welding point, the second end of the connecting line is connected to a fourth Solder point connection; the first solder point is connected to the third solder point through soldering, and the second soldering point is connected to the fourth soldering point through soldering; the flexible printed circuit board also includes
- the main flexible board includes a touch driving circuit and at least one terminal, the first end of the first signal line is connected to the terminal, and the second end of the first signal line is connected to the terminal.
- the first pad of the first main pad is connected, the first end of the second signal line is connected to the touch drive circuit, the second end of the second signal line is connected to the second main pad The second solder joint connection.
- the first main pad includes a plurality of first solder joints, the plurality of first solder joints are arranged in a matrix to form a solder joint array, and the plurality of first solder joints include the At least one first functional solder joint inside and at least one first non-functional solder joint located outside the array of solder joints, the first signal line is connected to the first functional solder joint, and the first The auxiliary line is connected to the first non-functional solder joint.
- the second main pad includes a plurality of second solder joints, and the plurality of second solder joints are arranged in a matrix to form a solder joint array, and the plurality of second solder joints include those located in the solder joint array. At least one second functional soldering point inside and at least one second non-functional soldering point located outside the array of soldering points, the second signal line is connected to the second functional soldering point, the first The auxiliary line is connected to the second non-functional solder joint.
- the first bridging pad includes a plurality of third solder joints, the plurality of third solder joints are arranged in a matrix to form a solder joint array, and the plurality of third solder joints include the At least one third functional soldering point inside and at least one third non-functional soldering point located outside the array of soldering points, the connection line is connected to the third functional soldering point, and the third auxiliary line Connect with the third non-functional solder joint.
- the second bridging pad includes a plurality of fourth pads, the plurality of fourth pads are arranged in a matrix to form a pad array, and the multiple fourth pads include a pad located in the pad array At least one fourth functional soldering point inside and at least one fourth non-functional soldering point located outside the array of soldering points, the connection line is connected to the fourth functional soldering point, and the fourth auxiliary line connected to the fourth non-functional solder joint.
- the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between; the connecting line is set in the connecting line area, the first bridge pad is set in the first pad area, and the second bridge pad is set in the second pad area; the A first connection point where the third auxiliary line is connected to the connection line is located in the connection line area, and/or a second connection point where the fourth auxiliary line is connected to the connection line is located in the connection line area.
- the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between, the connection line is arranged in the connection line area; the first pad area includes a first pad area and a first dispensing area, and the first pad area is provided with the first bridging pad, The first dispensing area is arranged on the periphery of the first welding spot area; the second pad area includes a second welding spot area and a second dispensing area, and the second welding spot area is provided with the first welding spot area.
- the second dispensing area is arranged on the periphery of the second welding point area; the first connection point where the third auxiliary line is connected to the connection line is located in the first dispensing area, And/or, the second connection point where the fourth auxiliary line is connected to the connecting line is located in the second dispensing area.
- the center-to-center distance between adjacent first welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent second welding points is 1.05 mm to 1.25 mm; and /or, the center-to-center distance between adjacent third welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent fourth welding points is 1.05 mm to 1.25 mm.
- the first bridging pad further includes at least one through hole disposed between the adjacent third pads; and/or, the second bridging pad It also includes at least one through hole, the through hole is arranged between the adjacent fourth welding points.
- the size of the through hole is less than or equal to 0.1 mm, and the size of the through hole refers to the maximum value of the distance between any two points on the edge of the through hole.
- the center distance between the through hole and the adjacent third welding spot is 0.55mm to 0.65mm; and/or, the center distance between the through hole and the adjacent fourth welding spot 0.55mm to 0.65mm.
- the bridging flexible board in a plane perpendicular to the flexible printed circuit board, is disposed on the main flexible board, and the bridging flexible board includes a first bridging flexible board disposed on the main flexible board The green oil layer, the first bridging conductive layer arranged on the side of the first bridging green oil layer away from the main flexible board, the bridging substrate layer arranged on the side of the first bridging conductive layer away from the main flexible board, The second bridging conductive layer arranged on the side of the bridging base material layer away from the main flexible board and the second bridging green oil layer arranged on the side of the second bridging conductive layer away from the main flexible board; A bridging conductive layer is only provided in the connecting line area of the bridging flexible board.
- the edge of the third solder joint close to the connecting line area and the edge of the first bridging conductive layer in the connecting line area close to the third solder joint The distance is greater than or equal to 1.0mm, and/or, the edge of the fourth solder joint near the connection line area is the same as the first bridging conductive layer in the connection line area close to the fourth solder joint.
- the distance between the edges of the sides is greater than or equal to 1.0 mm.
- the main flexible board includes a shielding layer, a cover layer disposed on the shielding layer, a first main conductive layer disposed on the side of the covering layer away from the shielding layer, a first main conductive layer disposed on the shielding layer,
- the first main conductive layer is away from the main substrate layer on the side of the shielding layer
- the second main conductive layer is arranged on the side of the main substrate layer away from the shielding layer
- the second main conductive layer is arranged on the side of the second main conductive layer.
- the main green oil layer on the side away from the shielding layer; the first bridging green oil layer of the bridging flexible board is in direct contact with the main green oil layer.
- the present disclosure also provides a display touch device, including a touch display panel and the aforementioned flexible printed circuit board, the touch display panel includes an active area and a binding area located on one side of the active area , the binding area includes a binding pin area, and the flexible printed circuit board is connected to the binding pin area.
- FIG. 1 is a schematic plan view of a display touch device
- FIG. 2 is a schematic plan view showing a binding area in a touch device
- FIG. 3 is a schematic plan view showing the edge area of a touch device
- FIG. 4 is a schematic cross-sectional structural view showing an effective area in a touch device
- FIG. 5 is a schematic diagram of a flexible printed circuit board binding connection
- FIG. 6 is a schematic plan view of the main flexible board in a flexible printed circuit board
- FIG. 7 is a schematic plan view of a bridging flexible board in a flexible printed circuit board
- FIG. 8 is a schematic plan view of a main flexible board according to an exemplary embodiment of the present disclosure.
- FIG. 9a is a schematic diagram of the arrangement of multiple solder joints in an exemplary pad of the present disclosure.
- FIG. 9b is a schematic diagram of the arrangement of multiple solder joints in another exemplary pad of the present disclosure.
- Fig. 10 is an enlarged view of area A in Fig. 8;
- Figure 11 is an enlarged view of area B in Figure 8.
- FIG. 12 is a schematic plan view of a bridging flexible board according to an exemplary embodiment of the present disclosure
- Figure 13 is an enlarged view of area C in Figure 12;
- Fig. 14 is an enlarged view of area D in Fig. 12;
- FIG. 15 is a schematic plan view of another bridging flexible board according to an exemplary embodiment of the present disclosure.
- Fig. 16 is a schematic plan view of another bridging flexible board according to an exemplary embodiment of the present disclosure.
- 17 is a schematic cross-sectional structure diagram of a flexible circuit board according to an exemplary embodiment of the present disclosure.
- Fig. 18 is a schematic cross-sectional structure diagram of another flexible circuit board according to an exemplary embodiment of the present disclosure.
- Fig. 19 is a schematic cross-sectional structure diagram of yet another flexible circuit board according to an exemplary embodiment of the present disclosure.
- Fig. 20 is a schematic cross-sectional structure diagram of yet another bridging flexible board according to an exemplary embodiment of the present disclosure.
- 51 the first driving signal line
- 52 the second driving signal line
- 60 auxiliary device
- 61 display signal line
- 70 connector
- 71 first auxiliary line
- connection line connection line
- 90 through hole
- 91 first connection point
- 101 substrate
- 102 drive circuit layer
- 103 light emitting structure layer
- 104 encapsulation structure layer
- 105 buffer layer
- 106 first metal grid layer
- 203 second fan-out area
- 204 anti-static area
- 205 driver chip area
- 206 binding pin area
- 210 connection line area
- 211 first pad area
- 211-1 the first solder joint area
- 211-2 the first dispensing area
- 212 the second pad area
- 212-1 the second solder joint area
- 212-2 the second dispensing area
- 300 the edge area
- 401 terminal area
- 402 circuit area
- 403 connection area
- 411 outer shielding layer
- 412 covering layer
- 413 first main conductive layer
- 414 the main substrate layer
- 415 the second main conductive layer
- 416 the main green oil layer
- the proportions of the drawings in the present disclosure can be used as a reference in the actual process, but are not limited thereto.
- the width-to-length ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to actual needs.
- the number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the numbers shown in the figure.
- the figures described in the present disclosure are only structural schematic diagrams, and one mode of the present disclosure is not limited to the accompanying drawings. The shape or value shown in the figure, etc.
- connection should be interpreted in a broad sense.
- it may be a fixed connection, or a detachable connection, or an integral connection; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirect connection through an intermediate piece, or an internal communication between two components.
- electrically connected includes the case where constituent elements are connected together through an element having some kind of electrical effect.
- the "element having some kind of electrical action” is not particularly limited as long as it can transmit and receive electrical signals between connected components.
- Examples of “elements having some kind of electrical function” include not only electrodes and wiring but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.
- triangle, rectangle, trapezoid, pentagon, or hexagon in this specification are not strictly defined, and may be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, etc., and there may be some small deformations caused by tolerances. There can be chamfers, arc edges, deformations, etc.
- parallel refers to a state where the angle formed by two straight lines is -10° to 10°, and therefore includes a state where the angle is -5° to 5°.
- perpendicular means a state in which the angle formed by two straight lines is 80° to 100°, and therefore also includes an angle of 85° to 95°.
- Capacitive On Cell type touch panels are mainly divided into mutual capacitance (Mutual Capacitance) structure and self capacitance (Self Capacitance) structure.
- the mutual capacitance structure is composed of the first touch electrode and the second touch electrode to form mutual capacitance.
- the self-capacitance structure is composed of the touch electrode and the human body to form self-capacitance, and the change of self-capacitance is used for position detection.
- the self-capacitive touch panel has a single-layer structure and has the characteristics of low power consumption and simple structure.
- the mutual-capacitance touch panel has a multi-layer structure and has the characteristics of multi-touch.
- the display touch device may include a display panel disposed on a base and a touch panel disposed on the display panel.
- the display panel may be a Liquid Crystal Display (LCD for short) panel, or an Organic Light Emitting Diode (OLED for short) display panel, or a plasma (PDP) display panel, or an electrophoretic display (EPD) display panel.
- the display panel may be an OLED display panel.
- OLED is an active light-emitting display device, which has the advantages of self-illumination, wide viewing angle, high contrast, low power consumption, and extremely high response speed.
- the existing OLED-based touch structure adopts the flexible multi-layer overlay surface type (FMLOC for short) structure, and the display structure and touch structure are all integrated on the substrate.
- the touch panel is set on the encapsulation layer of the OLED backplane to form an on-cell structure, which has the advantages of lightness, thinness and foldability, and can meet the needs of products such as flexible folding and narrow bezels.
- FIG. 1 is a schematic plan view of a display touch device.
- the touch panel is arranged on the display panel to form an FMLOC structure.
- the touch panel may include an active area (AA) 100 , a binding area 200 on one side of the active area 100 , and an edge area 300 on the other side of the active area 100 .
- the effective area can be either the touch area of the touch panel or the display area of the display panel. Both the touch area and the display area in the following description refer to the effective area.
- the active area 100 includes at least a plurality of touch electrodes regularly arranged
- the edge area 300 includes at least a plurality of touch leads
- the binding area 200 includes at least leads for connecting the touch leads to an external control device. foot.
- the touch panel may be a mutual capacitance structure.
- the active area 100 may include a plurality of first touch units 110 and a plurality of second touch units 120, the first touch units 110 have a line shape extending along the first direction D1, and the plurality of first touch units 110 extend along the first direction D1.
- the two directions D2 are arranged sequentially, the second touch units 120 have a line shape extending along the second direction D2, and the plurality of second touch units 120 are arranged sequentially along the first direction D1, and the first direction D1 intersects the second direction D2.
- Each first touch unit 110 may include a plurality of first touch electrodes 111 and first connecting parts 112 arranged in sequence along the first direction D1, the first touch electrodes 111 and the first connecting parts 112 are arranged alternately and connected in sequence .
- Each second touch unit 120 may include a plurality of second touch electrodes 121 arranged in sequence along the second direction D2, the plurality of second touch electrodes 121 are arranged at intervals, and adjacent second touch electrodes 121 pass through the second The connection parts 122 are connected to each other.
- the film layer where the second connecting portion 122 is located is different from the film layer where the first touch electrode 111 and the second touch electrode 121 are located.
- the first touch electrodes 111 and the second touch electrodes 121 are alternately arranged in a third direction D3, and the third direction D3 intersects the first direction D1 and the second direction D2.
- a plurality of first touch electrodes 111, a plurality of second touch electrodes 121 and a plurality of first connecting parts 112 can be arranged on the touch layer in the same layer, and can be formed by the same patterning process.
- the first touch electrodes 111 and the first connecting portion 112 may be an integral structure connected to each other.
- the second connection part 122 may be disposed on the bridging layer to connect adjacent second touch electrodes 121 to each other through via holes, and an insulating layer is disposed between the touch layer and the bridging layer.
- multiple first touch electrodes 111, multiple second touch electrodes 121 and multiple second connecting parts 122 can be arranged on the same layer on the touch layer, and the second touch electrodes 121 and the second The two connecting parts 122 may be an integral structure connected to each other, and the first connecting part 112 may be disposed on a bridging layer to connect adjacent first touch electrodes 111 to each other through via holes.
- the first touch electrodes may be driving (Tx) electrodes
- the second touch electrodes may be sensing (Rx) electrodes
- the first touch electrodes may be sensing (Rx) electrodes
- the second touch electrodes may be driving (Tx) electrodes.
- the shapes of the first touch electrodes and the second touch electrodes may include any one or more of the following: triangle, square, rectangle, rhombus, parallelogram, trapezoid, pentagon, hexagon , the present disclosure is not limited here.
- the first touch electrodes and the second touch electrodes may be in the form of transparent conductive electrodes.
- the first touch electrode and the second touch electrode may be in the form of a metal grid, the metal grid is formed by interweaving a plurality of metal wires, the metal grid includes a plurality of grid patterns, and the grid A pattern is a polygon formed by a plurality of metal lines.
- the first touch electrode and the second touch electrode in the form of a metal grid have the advantages of small resistance, small thickness, and fast response speed.
- FIG. 2 is a schematic plan view showing a binding area in a touch device.
- the binding area 200 may be located on one side of the active area 100, and along the direction (second direction D2) away from the active area 100, the binding area 200 may include sequentially arranged The first fan-out area 201 , the bending area 202 , the second fan-out area 203 , the anti-static area 204 , the driving chip area 205 and the binding pin area 206 .
- the first fan-out area 201 can be provided with a plurality of touch leads and signal transmission lines, and the signal transmission lines can at least include a first power supply line (VDD), a second power supply line (VSS) and a plurality of data transmission lines, and the plurality of data transmission lines are configured as
- the data line (Data Line) of the display panel is connected in a fan-out (Fanout) manner, and the first power line VDD and the second power line VSS are configured to connect to the high-level power line and the low-level power line of the display panel respectively.
- the bending area 202 can be provided with grooves, and the grooves are configured to bend the second fan-out area 203 , the antistatic area 204 , the driver chip area 205 and the binding pin area 206 to the back of the active area 100 .
- the second fan-out area 203 can be provided with a plurality of touch leads and a plurality of data transmission lines led out in a fan-out manner.
- the anti-static area 204 may be provided with an anti-static circuit configured to eliminate static electricity.
- the driver chip area 205 can be provided with a source driver circuit (Driver IC), and the source driver circuit is configured to be connected to a plurality of data transmission lines in the second fan-out area 203.
- the binding pin area 206 may be provided with at least a plurality of pins (which may be referred to as gold fingers), and the plurality of pins are configured to be bound and connected to a flexible printed circuit board (Flexible Printed Circuit board, FPC for short).
- a flexible printed circuit board Flexible Printed Circuit board, FPC for short.
- FIG. 3 is a schematic diagram showing a planar structure of an edge region in a touch device.
- the edge area 300 may be located on other sides of the active area 100 .
- the first end of the sensing lead 31 is connected to the sensing electrode
- the second end of the sensing lead 31 extends to one side of the bonding area 200 along the edge region 300
- the first end of the driving lead 32 is connected to the driving electrode.
- the electrodes are connected, the second end of the driving wire 32 extends to the other side of the bonding area 200 , and the sensing wire 31 and the driving wire 32 together form a touch wire.
- FIG. 4 is a schematic cross-sectional structure diagram of an active area in a display touch device, illustrating the structure of three sub-pixels.
- the touch panel can be disposed on the display panel.
- the display panel may include a driving circuit layer 102 disposed on the base 101, a light emitting structure layer 103 disposed on the side of the driving circuit layer 102 away from the base 101, and a light emitting structure layer 103 disposed on a side away from the base 101.
- encapsulation structure layer 104 may be disposed on the display panel.
- each sub-pixel may include a plurality of transistors and storage capacitors constituting a pixel driving circuit.
- each pixel driving circuit includes a transistor and a storage capacitor as an example for illustration.
- the driving circuit layer 102 of each sub-pixel may include: a first insulating layer disposed on the substrate; an active layer disposed on the first insulating layer; a second insulating layer covering the active layer; The gate electrode and the first pole plate arranged on the second insulating layer; the third insulating layer covering the gate electrode and the first pole plate; the second pole plate arranged on the third insulating layer; the first pole plate covering the second pole plate
- Four insulation layers, the second insulation layer, the third insulation layer and the fourth insulation layer are provided with via holes, the via holes expose the active layer; the source electrode and the drain electrode arranged on the fourth insulation layer, the source electrode and the drain electrode
- the poles are respectively connected to the active layer through via holes; the flat layer covering the aforementioned structure has via holes opened on the flat layer, and the drain electrodes are exposed through the via holes.
- the active layer, the gate electrode, the source electrode and the drain electrode form a drive transistor, and the first plate and the second plate form a storage capacitor.
- the light emitting structure layer 103 may include an anode, a pixel definition layer, an organic light emitting layer, and a cathode.
- the anode is arranged on the flat layer, and is connected to the drain electrode of the driving transistor through the via hole opened on the flat layer;
- the pixel definition layer is arranged on the anode and the flat layer, and a pixel opening is arranged on the pixel definition layer, and the pixel opening exposes the anode, organic
- the light-emitting layer is connected to the anode through the pixel opening, and the cathode is connected to the organic light-emitting layer.
- the organic light-emitting layer may include an light-emitting layer (EML), and one or more of the following film layers: a hole injection layer (HIL), a hole transport layer (HTL), a hole blocking layer (HBL) ), electron blocking layer (EBL), electron transport layer (ETL) and electron injection layer (EIL).
- EML light-emitting layer
- HIL hole injection layer
- HTL hole transport layer
- HBL hole blocking layer
- EBL electron blocking layer
- ETL electron transport layer
- EIL electron injection layer
- EIL electron injection layer
- the encapsulation structure layer 104 may include a stacked first encapsulation layer, a second encapsulation layer, and a third encapsulation layer, the first encapsulation layer and the third encapsulation layer may use inorganic materials, and the second encapsulation layer may Organic materials are used, and the second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer, which can ensure that external water vapor cannot enter the light emitting structure layer 103 .
- the touch panel may include a buffer (Buffer) layer 105 disposed on the side of the encapsulation structure layer 104 away from the substrate 101, and disposed on the buffer layer 105 away from the substrate 101
- the first metal grid (1st Metal Mesh, TMA for short) layer 106 on one side is arranged on the insulating layer 107 on the side of the first metal mesh layer 106 away from the base 101, and is arranged on the second insulating layer 107 on the side away from the base 101.
- the second metal mesh (2st Metal Mesh, TMB for short) layer 108 is disposed on the protective layer 109 on the side of the second metal mesh layer 108 away from the substrate 101.
- the buffer layer 105 and the insulating layer 107 can use any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, Multiple layers or composite layers.
- the first metal grid layer 106 and the second metal grid layer 108 can use metal materials, such as any one of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo) Or more than one, or alloy materials of the above metals, the protective layer 109 can be made of organic materials.
- the first metal grid layer 106 may be called a bridging layer
- the second metal grid layer 108 may be called a touch layer
- a plurality of first touch electrodes, second touch electrodes and first touch electrodes The connecting part can be arranged on the touch layer in the same layer, and the second connecting part can be arranged on the bridging layer to connect adjacent second touch electrodes to each other through via holes.
- Fig. 5 is a schematic diagram of a binding connection of a flexible printed circuit board
- Fig. 6 is a schematic plan view of a main flexible board in a flexible printed circuit board
- Fig. 7 is a schematic plan view of a bridging flexible board in a flexible printed circuit board .
- the binding area 200 can be divided into a first side area, a middle area, and a second side area, and the binding area edge is the binding area.
- the fixed area is adjacent to the edge of one side of the touch area.
- the binding pin area 206 in the binding area 200 may include a first pin area located in a first side area, a middle pin area located in a middle area, and a second pin area located in a second side area.
- the pin area, the first pin area, the middle pin area and the second pin area all include a plurality of pins.
- a plurality of sensing leads 31 are introduced from the frame area to the left side of the binding area, extend to the first pin area on the left side of the binding area, and correspond to multiple pins in the first pin area connect.
- a plurality of driving leads 32 are introduced from the frame area to the right side of the binding area, extend to the second pin area on the right side of the binding area, and are correspondingly connected to a plurality of pins in the second pin area.
- a plurality of display leads 33 are introduced from the source driver circuit D-IC located in the middle of the bonding area to the middle pin area, and are correspondingly connected to multiple pins in the middle pin area.
- the flexible printed circuit board 40 may include a main flexible board 10 and a bridging flexible board 20 , a main pad may be arranged on the main flexible board 10 , and a bridging flexible board 20 may be A bridge pad is provided, and the bridge pad can be welded on the main pad by molten solder paste to form a double-layer bridge type flexible printed circuit board.
- the main flexible board 10 of the flexible printed circuit board 40 may be located on the side of the binding area 200 away from the active area 100, along the direction (second direction D2) away from the active area 100, the main flexible board 10 It may include a terminal area 401 , a circuit area 402 and a connection area 403 arranged in sequence.
- the terminal area 401 may include a plurality of terminals, and the plurality of terminals are correspondingly bound and connected to the plurality of pins in the binding pin area.
- Multiple terminals in the terminal area 401 can be regularly arranged along the first direction D1, and the terminal area 401 can be divided into a first terminal area, a middle terminal area and a second terminal area.
- the position of the first terminal area corresponds to the position of the first pin area of the binding area, and the multiple terminals in the first terminal area are correspondingly connected to the multiple pins in the first pin area.
- the position of the central terminal area corresponds to the position of the central pin area of the binding area, and multiple terminals in the central terminal area are correspondingly connected to multiple pins in the central area.
- the position of the second terminal area corresponds to the position of the second pin area of the binding area, and the multiple terminals of the second terminal area are correspondingly connected to the multiple pins of the second pin area.
- the circuit area 402 may at least include a first main pad 11, a second main pad 12, a touch driving circuit (Touch IC) 50, an auxiliary device 60, a plurality of sensing signal lines 41, a plurality of A first driving signal line 51 , a plurality of second driving signal lines 52 and a plurality of display signal lines 61 .
- the touch drive circuit 50 can be located on the left side of the circuit area 402
- the auxiliary device 60 can be located on the right side of the circuit area 402
- the first main pad 11 and the second main pad 12 can be located on the auxiliary device 60 away from the side of the terminal area 401 .
- the first main pad 11 and the second main pad 12 are configured to be connected to the bridging pads on the bridging flexible board 20
- the touch driving circuit 50 is configured to be connected to a plurality of sensing signal lines 41 Connected to a plurality of second driving signal lines 52
- the auxiliary device 60 is configured to be connected to a plurality of display signal lines 61 .
- connection area 403 may at least include a connector (Connector) 70 and a plurality of display signal lines 61 , and the connector 70 is configured to be connected to the plurality of display signal lines 61 .
- the width of the connection region 403 may be smaller than the width of the circuit region 402 , and the connection region 403 may be located on the right side of the circuit region 402 .
- the connector 70 may be located at an end of the connection area 403 away from the circuit area 402 .
- the connector may serve as an external connection port, and the connector may be a board-to-board (Board-to-board, BTB for short) connector.
- the first ends of the plurality of sensing signal lines 41 are correspondingly connected to the plurality of terminals in the first terminal area, through the plurality of terminals in the first terminal area and the plurality of pins in the first pin area and A plurality of induction leads 31 on the left side of the binding area are correspondingly connected.
- the second ends of the plurality of sensing signal lines 41 extend to the touch driving circuit 50 and are connected to the touch driving circuit 50, thereby realizing the connection between the touch driving circuit 50 and the plurality of sensing leads 31 in the binding area, so that the touch driving The circuit 50 can provide touch sensing signals to the plurality of sensing leads 31 . Since the first terminal area and the touch driving circuit 50 are located on the left side of the circuit area 402 , the plurality of sensing signal lines 41 can be directly connected to the touch driving circuit 50 .
- the first main pad 11 may include a plurality of first pads
- the second main pad 12 may include a plurality of second pads.
- the first ends of the plurality of first drive signal lines 51 are correspondingly connected to the plurality of terminals in the second terminal area, through the plurality of terminals in the second terminal area and the plurality of pins in the second pin area and the plurality of binding areas.
- the driving leads 32 are correspondingly connected.
- the second ends of the plurality of first driving signal lines 51 extend to the first main pad 11 and are correspondingly connected to the plurality of first pads on the first main pad 11 .
- the first ends of the plurality of second driving signal lines 52 are connected to the touch driving circuit 50, the second ends of the plurality of second driving signal lines 52 extend to the second main pad 12, and are connected to the second main pad 12.
- the plurality of second solder joints are correspondingly connected.
- the first driving signal line 51 and the second driving signal line 52 need to use a bridge
- the flexible boards 20 are connected to each other, extend from the right side of the circuit area 402 to the left side of the circuit area 402 and cross a plurality of display signal lines 61, so as to realize the connection between the touch driving circuit 50 and the plurality of driving leads 32 in the binding area, so that The touch driving circuit 50 provides touch driving signals to the plurality of driving wires 32 .
- the first ends of the plurality of display signal lines 61 are correspondingly connected to the plurality of terminals in the middle terminal area, and pass through the plurality of terminals in the middle terminal area and the plurality of pins in the middle pin area and the binding area
- a plurality of display leads 33 are correspondingly connected.
- a part shows that the second end of the signal line 61 extends directly from the circuit area 402 to the connection area 403, and is connected with the connector 70 located in the connection area;
- the connector 70 is connected, thus realizing the connection between the connector 70 and the plurality of display leads 33 in the binding area, so that the external control device provides display signals to the plurality of display leads 33 through the connector 70 .
- the bridging flexible board 20 is configured to be connected with the first main pad 11 and the second main pad 12 on the main flexible board 10 .
- the bridging flexible board 20 may at least include a first bridging pad 21, a second bridging pad 22 and a plurality of connection lines 81, the first bridging pad 21 may include a plurality of third soldering points, and the second bridging pad 22 may include A plurality of fourth welding points, the first ends of the plurality of connection lines 81 may correspond to the plurality of third welding points connected to the first bridge pads 21, and the second ends of the plurality of connection lines 81 may be correspondingly connected to the second bridge pads 22, realize the corresponding connection of the multiple third welding points and the multiple fourth welding points through the multiple connection lines 81.
- the plurality of third solder joints of the first bridge pad 21 and the multiple first solder joints of the first main pad 11 are correspondingly welded by molten solder paste
- the multiple solder joints of the second bridge pad 22 A fourth solder joint and a plurality of second solder joints of the second main pad 11 are correspondingly welded by molten solder paste, so that a plurality of first drive signal lines 51 and a plurality of second drive signal lines on the main flexible board 10 52 are correspondingly connected by bridging the flexible board 20 .
- solder joints are empty (Open NG) caused by solder joints or lack of tin.
- Open NG empty soldering
- one of the main reasons for empty soldering is the deformation of the area where the main pad and bridge pad are located on the flexible circuit board, resulting in two forms of solder joints, convex and concave, so that the main pad and bridge pad are deformed. The distance between the solder joints is different, and some solder paste solder joints are disconnected, resulting in empty soldering.
- the present disclosure provides a flexible printed circuit board.
- the flexible printed circuit board may include a main flexible board and a bridge flexible board, the main flexible board includes at least a first main pad, a second main pad, at least one first signal line and at least one second signal line, the bridging
- the flexible board at least includes a first bridge pad, a second bridge pad and at least one connection line.
- the first main pad includes at least two first pads
- the second main pad includes at least two second pads
- the first signal line is connected to one first pad
- the second The signal line is connected with a second soldering point.
- the first bridging pad includes at least two third pads
- the second bridging pad includes at least two fourth pads
- the first end of the connection line is connected to a third pad
- the The second end of the connecting wire is connected with a fourth welding point.
- the first soldering point is connected to the third soldering point through soldering
- the second soldering point is connected to the fourth soldering point through soldering.
- the flexible printed circuit board further includes any one or more of the first auxiliary line, the second auxiliary line, the third auxiliary line and the fourth auxiliary line; the first end of the first auxiliary line is connected to the first auxiliary line connected to the signal line, the second end of the first auxiliary line is connected to another first solder point; the first end of the second auxiliary line is connected to the second signal line, and the first end of the second auxiliary line
- the two ends are connected to another second welding point;
- the first end of the third auxiliary line is connected to the connecting line, and the second end of the third auxiliary line is connected to another third welding point;
- the first end of the third auxiliary line is connected to the other third welding point;
- the first ends of the four auxiliary wires are connected to the connection wires, and the second ends of the fourth auxiliary wires are connected to another fourth welding point.
- the main flexible board includes a touch driving circuit and at least one terminal, the first end of the first signal line is connected to the terminal, and the second end of the first signal line is connected to the terminal.
- the first pad of the first main pad is connected, the first end of the second signal line is connected to the touch drive circuit, the second end of the second signal line is connected to the second main pad The second solder joint connection.
- the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between; the connecting line is set in the connecting line area, the first bridge pad is set in the first pad area, and the second bridge pad is set in the second pad area; the A first connection point where the third auxiliary line is connected to the connection line is located in the connection line area, and/or a second connection point where the fourth auxiliary line is connected to the connection line is located in the connection line area.
- the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between, the connection line is arranged in the connection line area; the first pad area includes a first pad area and a first dispensing area, and the first pad area is provided with the first bridging pad, The first dispensing area is arranged on the periphery of the first welding spot area; the second pad area includes a second welding spot area and a second dispensing area, and the second welding spot area is provided with the first welding spot area.
- the second dispensing area is arranged on the periphery of the second welding point area; the first connection point where the third auxiliary line is connected to the connection line is located in the first dispensing area, And/or, the second connection point where the fourth auxiliary line is connected to the connecting line is located in the second dispensing area.
- the center-to-center distance between adjacent first welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent second welding points is 1.05 mm to 1.25 mm; and /or, the center-to-center distance between adjacent third welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent fourth welding points is 1.05 mm to 1.25 mm.
- the first bridging pad further includes at least one through hole disposed between the adjacent third pads; and/or, the second bridging pad It also includes at least one through hole, the through hole is arranged between the adjacent fourth welding points.
- the size of the through hole is less than or equal to 0.1 mm, and the size of the through hole refers to the maximum value of the distance between any two points on the edge of the through hole.
- the center distance between the through hole and the adjacent third welding spot is 0.55mm to 0.65mm; and/or, the center distance between the through hole and the adjacent fourth welding spot 0.55mm to 0.65mm.
- the bridging flexible board in a plane perpendicular to the flexible printed circuit board, is disposed on the main flexible board, and the bridging flexible board includes a first bridging flexible board disposed on the main flexible board The green oil layer, the first bridging conductive layer arranged on the side of the first bridging green oil layer away from the main flexible board, the bridging substrate layer arranged on the side of the first bridging conductive layer away from the main flexible board, The second bridging conductive layer arranged on the side of the bridging base material layer away from the main flexible board and the second bridging green oil layer arranged on the side of the second bridging conductive layer away from the main flexible board; A bridging conductive layer is only provided in the connecting line area of the bridging flexible board.
- the edge of the third solder joint close to the connecting line area and the edge of the first bridging conductive layer in the connecting line area close to the third solder joint The distance is greater than or equal to 1.0mm, and/or, the edge of the fourth solder joint near the connection line area is the same as the first bridging conductive layer in the connection line area close to the fourth solder joint.
- the distance between the edges of the sides is greater than or equal to 1.0 mm.
- the main flexible board includes a shielding layer, a cover layer disposed on the shielding layer, a first main conductive layer disposed on the side of the covering layer away from the shielding layer, a first main conductive layer disposed on the shielding layer,
- the first main conductive layer is away from the main substrate layer on the side of the shielding layer
- the second main conductive layer is arranged on the side of the main substrate layer away from the shielding layer
- the second main conductive layer is arranged on the side of the second main conductive layer.
- the main green oil layer on the side away from the shielding layer; the first bridging green oil layer of the bridging flexible board is in direct contact with the main green oil layer.
- FIG. 8 is a schematic plan view of a main flexible board in the flexible printed circuit board of an exemplary embodiment of the present disclosure.
- the main flexible board may at least include a first main pad 11, a second main pad 12, a touch driving circuit 50, an auxiliary device 60, a plurality of terminals, a plurality of sensing signal lines 41, a plurality of A first driving signal line 51 , a plurality of second driving signal lines 52 and a plurality of display signal lines 61 .
- a plurality of terminals may be regularly arranged along the first direction D1, and the plurality of terminals are configured to be correspondingly connected to a plurality of pins in the binding area.
- the first main pad 11 may include a plurality of first pads configured to be correspondingly connected to a plurality of first driving signal lines 51 .
- the second main pad 12 may include a plurality of second pads configured to be correspondingly connected to a plurality of second driving signal lines 52 .
- the first driving signal line 51 may serve as a first signal line of the present disclosure
- the second driving signal line 52 may serve as a second signal line of the present disclosure.
- the first ends of the plurality of display signal lines 61 are correspondingly connected to a plurality of terminals, and the second ends of the plurality of display signal lines 61 are connected to a connector (not shown).
- the display signal line 61 may be directly connected to the connector, or may be connected to the connector through the auxiliary device 60 , which is not limited in this disclosure.
- the main flexible board may not be provided with auxiliary devices, and the disclosure is not limited herein.
- the first ends of the plurality of sensing signal lines 41 are correspondingly connected to a plurality of terminals, and the second ends of the plurality of sensing signal lines 41 extend to the touch driving circuit 50 and are connected to the touch driving circuit 50 .
- the first ends of the plurality of first driving signal lines 51 are correspondingly connected to a plurality of terminals
- the second ends of the plurality of first driving signal lines 51 extend to the first main pad 11, and are connected to the first A plurality of first pads on the main pad 11 are correspondingly connected.
- the first ends of the plurality of second driving signal lines 52 are connected to the touch driving circuit 50
- the second ends of the plurality of second driving signal lines 52 extend to the second main pad 12, and are connected to the second main pad 12.
- the plurality of second solder joints are correspondingly connected.
- a plurality of first pads on the first main pad 11 are correspondingly connected to a plurality of second pads on the second main pad 12 through a bridging flexible board to realize multiple first drive signals
- the line 51 is correspondingly connected to the second driving signal line 52 and straddles a plurality of display signal lines 61 .
- Fig. 9a is a schematic diagram of the arrangement of multiple welding points in an exemplary pad of the present disclosure.
- the pad may include 25 solder points, and the 25 solder points may be arranged in a manner of 7 rows and 7 columns to form a solder point array.
- Row 1, Row 3, Row 5, and Row 7 all include four solder joints arranged in sequence along the first direction D1
- Row 2, Row 4, and Row 6 include four solder joints along the first direction D1.
- the three solder joints are arranged in sequence, and the solder joints in two adjacent rows are arranged alternately.
- the first column, the third column, the fifth column and the seventh column all include four solder joints arranged in sequence along the second direction D2, and the second column, the fourth column and the sixth column all include four welding points along the second direction D2 Three solder points are arranged in sequence, and the solder points in two adjacent columns are arranged alternately.
- solder joints located inside the solder joint array may be referred to as functional solder joints, and the solder joints located outside the solder joint array may be referred to as non-functional solder joints.
- functional solder joints may include: solder joints 2-2, solder joints 2-4, solder joints 2-6, solder joints 3-3, solder joints 3-5, solder joints 4-2, solder joints 4-4 , solder joint 4-6, solder joint 5-3, solder joint 5-5, solder joint 6-2, solder joint 6-4 and solder joint 6-6.
- the non-functional solder joints may include: solder joints 1-1, solder joints 1-3, solder joints 1-5, solder joints 1-7, solder joints 3-1, solder joints 3-7, and solder joints 5 -1, solder joint 5-7, solder joint 7-1, solder joint 7-3, solder joint 7-5 and solder joint 7-7.
- Fig. 9b is a schematic diagram of the arrangement of multiple solder joints in another exemplary solder pad of the present disclosure.
- the pad can include 25 solder joints, and the 25 solder joints can be arranged in 7 rows and 7 columns to form a solder joint array.
- the number of solder joints and the solder joint array of the pad are the same as those shown in Figure 9a
- the discs are basically similar, the difference is that the positions of the 25 welding points in FIG. 9b are mirror-symmetrical to the positions of the 25 welding points in FIG. 9a with respect to the second direction D2.
- the shape of the solder joints can be circular, square, rectangular or polygonal, etc., and the size of the solder joints can be less than or equal to 0.5mm.
- the size of the solder joints refers to the distance between any two points on the edge of the solder joints. The maximum distance of .
- the diameter of the solder joint may be about 0.25 mm, 0.3 mm, 0.35 mm, and so on.
- the first center-to-center distance L1 between two adjacent welding points in the first direction D1 may be about 1.05mm to 1.25mm, and between two adjacent welding points in the second direction D2
- the first center-to-center distance L1 may be about 1.05 mm to 1.25 mm, and the first center-to-center distance L1 is the distance between the geometric center of one solder joint and the geometric center of another solder joint.
- the number and arrangement of solder points on the first main pad and the second main pad can be set according to actual needs, which is not limited in the present disclosure.
- the first main pads may be arranged with the first solder joints in the arrangement shown in FIG. 9 a
- the second main pads may be arranged with the second solder joints in the arrangement shown in FIG. 9 b .
- the main flexible board may further include at least one first auxiliary line 71, the first end of the first auxiliary line 71 is connected to the first driving signal line 51, the second end of the first auxiliary line 71 is connected to the second A first solder joint of the main pad 11 is connected.
- the plurality of first solder joints may include at least one first functional solder joint located inside the solder joint array and at least one first non-functional solder joint located outside the solder joint array.
- a first end of the first driving signal line 51 is connected to a terminal, and a second end of the first driving signal line 51 is connected to a first functional pad.
- a first end of the first auxiliary line 71 is connected to the first driving signal line 51 , and a second end of the first auxiliary line 71 is connected to at least one first non-functional solder joint.
- FIG. 10 is an enlarged view of area A in FIG. 8 .
- the five first driving signal lines may include a first driving sub-line 51-1, a second driving sub-line 51-2, a third driving sub-line 51-3, and a fourth driving sub-line 51-4.
- the five first auxiliary lines may include the first auxiliary sub-line 71-1, the second auxiliary sub-line 71-2, the third auxiliary sub-line 71-3, the fourth auxiliary sub-line 71-4 and the fifth auxiliary strand 71-5.
- the first end of the first driving sub-line 51-1 is connected to a terminal, and the second end of the first driving sub-line 51-1 extends toward the first main pad 11, and is connected to the first main pad 11.
- the functional pads 3 - 3 in the third row and third column on the pad 11 are connected.
- the first end of the first auxiliary sub-line 71-1 is connected to the first driving sub-line 51-1, and the second end of the first auxiliary sub-line 71-1 extends toward the first main pad 11, and is connected to the first main pad 11
- the non-functional solder joints 1-1 in the first row and first column on the pad 11 are connected.
- the first driving sub-line can be connected to the two first pads on the first main pad by using the first auxiliary sub-line to form a "two (pad) to one (signal line)" connection.
- the first end of the second driving sub-line 51-2 is connected to a terminal, and the second end of the second driving sub-line 51-2 extends toward the first main pad 11, and is connected to the first main pad 11.
- the functional pads 3-5 in the third row and fifth column on the pad 11 are connected.
- the first end of the second auxiliary sub-line 71-2 is connected to the second driving sub-line 51-2, and the second end of the second auxiliary sub-line 71-2 extends toward the first main pad 11 and is connected to the first main pad 11.
- the non-functional solder joints 1-7 in row 1 and column 7 on pad 11 are connected. In this way, the second driving sub-line can be connected to the two first pads on the first main pad by using the second auxiliary sub-line to form a "two-to-one" connection.
- the first end of the third driving sub-line 51-3 is connected to a terminal, and the second end of the third driving sub-line 51-3 extends toward the first main pad 11, and is connected to the first main pad 11.
- the functional pads 4-4 in the fourth row and fourth column on the pad 11 are connected.
- the first end of the third auxiliary sub-line 71-3 is connected to the third driving sub-line 51-3, and the second end of the third auxiliary sub-line 71-3 extends toward the first main pad 11, and is connected to the first main pad 11
- the non-functional solder joints 3-7 on the third row and seventh column on the pad 11 are connected.
- the third driving sub-line can be connected to the two first pads on the first main pad by using the third auxiliary sub-line to form a "two-to-one" connection.
- the first end of the fourth driving sub-line 51-4 is connected to a terminal, and the second end of the fourth driving sub-line 51-4 extends toward the first main pad 11, and is connected to the first main pad 11.
- the functional pads 5 - 5 in the fifth row and fifth column on the pad 11 are connected.
- the first end of the fourth auxiliary sub-line 71-4 is connected to the fourth driving sub-line 51-4, and the second end of the fourth auxiliary sub-line 71-4 extends toward the first main pad 11, and is connected to the first main pad 11.
- the non-functional solder joints 7-7 in row 7 and column 7 on pad 11 are connected. In this way, the fourth driving sub-line can be connected to the two first pads on the first main pad by using the fourth auxiliary sub-line to form a "two-to-one" connection.
- the first end of the fifth driving sub-line 51-5 is connected to a terminal, and the second end of the fifth driving sub-line 51-5 extends toward the first main pad 11, and is connected to the first main pad 11.
- the functional pads 5 - 3 in the fifth row and third column on the pad 11 are connected.
- the first end of the fifth auxiliary sub-line 71-5 is connected to the fifth driving sub-line 51-5, and the second end of the fifth auxiliary sub-line 71-5 extends toward the first main pad 11, and is connected to the first main pad 11.
- the non-functional solder joint 7-1 in the 7th row and 1st column on the pad 11 is connected. In this way, the fifth driving sub-line can be connected to the two first pads on the first main pad by using the fifth auxiliary sub-line to form a "two-to-one" connection.
- At least one functional soldering point may be provided between the functional soldering point connected to the first driving signal line and the non-functional soldering point connected to the auxiliary line connected to the first driving signal line .
- the main flexible board may further include at least one second auxiliary line 72, the first end of the second auxiliary line 72 is connected to the second driving signal line 52, the second end of the second auxiliary line 72 is connected to the first The second solder joints of the two main pads 12 are connected.
- the plurality of second solder joints may include at least one second functional solder joint located inside the solder joint array and at least one second non-functional solder joint located outside the solder joint array.
- the first end of the second driving signal line 52 is connected to the touch driving circuit, and the second end of the second driving signal line 52 is connected to a second functional pad.
- a first end of the second auxiliary line 72 is connected to the second driving signal line 52 , and a second end of the second auxiliary line 72 is connected to at least one second non-functional solder joint.
- FIG. 11 is an enlarged view of area B in FIG. 8 .
- the five second driving signal lines may include a sixth driving sub-line 52-6, a seventh driving sub-line 52-7, an eighth driving sub-line 52-8, and a ninth driving sub-line 52-9.
- the five second auxiliary lines may include the sixth auxiliary sub-line 72-6, the seventh auxiliary sub-line 72-7, the eighth auxiliary sub-line 72-8, the ninth auxiliary sub-line 72-9 and the tenth auxiliary sub-line 72-10.
- the first end of the sixth driving sub-line 52-6 is connected to the touch driving circuit, and the second end of the sixth driving sub-line 52-6 extends toward the second main pad 12, and is connected to the second main pad 12.
- the functional pads 3 - 3 in the third row and third column on the two main pads 12 are connected.
- the first end of the sixth auxiliary sub-line 72-6 is connected to the sixth driving sub-line 52-6, and the second end of the sixth auxiliary sub-line 72-6 extends toward the second main pad 12, and is connected to the second main pad 12.
- the non-functional solder joints 1-1 on the first row and first column on the pad 12 are connected. In this way, the sixth driving sub-line is connected to the two second pads on the second main pad by using the sixth auxiliary sub-line to form a "two-to-one" connection.
- the first end of the seventh driving sub-line 52-7 is connected to the touch driving circuit
- the second end of the seventh driving sub-line 52-7 extends toward the second main pad 12, and is connected to the second main pad 12.
- the functional pads 3-5 in the third row and fifth column on the two main pads 12 are connected.
- the first end of the seventh auxiliary sub-line 72-7 is connected to the seventh driving sub-line 52-7
- the second end of the seventh auxiliary sub-line 72-7 extends toward the second main pad 12, and is connected to the second main pad 12.
- the non-functional solder joints 1-7 in row 1 and column 7 on pad 12 are connected. In this way, the seventh driving sub-line is connected to the two second pads on the second main pad by using the seventh auxiliary sub-line to form a "two-to-one" connection.
- the first end of the eighth driving sub-line 52-8 is connected to the touch driving circuit, and the second end of the eighth driving sub-line 52-8 extends toward the second main pad 12, and is connected to the second main pad 12.
- the functional pads 4-4 on the 4th row and 4th column on the two main pads 12 are connected.
- the first end of the eighth auxiliary sub-line 72-8 is connected to the eighth driving sub-line 52-8, and the second end of the eighth auxiliary sub-line 72-8 extends toward the second main pad 12, and is connected to the second main pad 12.
- the non-functional solder joints 3-7 in row 3 and column 7 on pad 12 are connected. In this way, the eighth driving sub-line can be connected to the two second pads on the second main pad by using the eighth auxiliary sub-line to form a "two-to-one" connection.
- the first end of the ninth driving sub-line 52-9 is connected to the touch driving circuit
- the second end of the ninth driving sub-line 52-9 extends toward the second main pad 12, and is connected to the second main pad 12.
- the functional pads 5-5 in the fifth row and fifth column on the two main pads 12 are connected.
- the first end of the ninth auxiliary sub-line 72-9 is connected to the ninth driving sub-line 52-9
- the second end of the ninth auxiliary sub-line 72-9 extends toward the second main pad 12, and is connected to the second main pad 12.
- the non-functional solder joints 7-7 in row 7 and column 7 on pad 12 are connected. In this way, the ninth driving sub-line can be connected to the two second pads on the second main pad by using the ninth auxiliary sub-line to form a "two-to-one" connection.
- the first end of the tenth driving sub-line 52-10 is connected to the touch driving circuit, and the second end of the tenth driving sub-line 52-10 extends toward the second main pad 12, and is connected to the second main pad 12.
- the functional pads 5 - 3 in the fifth row and third column on the two main pads 12 are connected.
- the first end of the tenth auxiliary sub-line 72-10 is connected to the tenth driving sub-line 52-10, and the second end of the tenth auxiliary sub-line 72-10 extends toward the second main pad 12, and is connected to the second main pad 12.
- the non-functional solder joint 7-1 on the 7th row and 1st column on the pad 12 is connected. In this way, the tenth driving sub-line can be connected to the two second pads on the second main pad by using the tenth auxiliary sub-line to form a "two-to-one" connection.
- At least one functional soldering point may be provided between the functional soldering point connected to the second driving signal line and the non-functional soldering point connected to the auxiliary line connected to the second driving signal line .
- the driving signal line as the main transmission line is connected to the functional pad on the pad, and the auxiliary line as the transmission branch line is connected to the non-functional pad on the pad. Since the non-functional solder joints on the pads of the existing structure are usually idle, auxiliary lines can be set to connect the non-functional solder joints.
- the connection structure of two solder points corresponding to one signal line is formed by setting signal wires on the main flexible plate to connect functional solder joints, and setting auxiliary wires to connect non-functional solder joints. If there is an empty solder joint in one solder joint, signal transmission can also be guaranteed, which improves the reliability of signal transmission through the pad.
- each driving sub-line can be provided with n auxiliary sub-lines, and the driving sub-line can be connected to n+1 solder points on the pad by using n auxiliary sub-lines to form an "n+1 to one ", n is a positive integer greater than 1.
- each driving sub-line can be provided with an auxiliary sub-line, and the driving sub-line can be connected to two pads on the pad by using one auxiliary sub-line to form a "two-to-one" connection.
- each driving sub-line can be provided with two auxiliary sub-lines, and the driving sub-line can be connected to three solder points on the pad by using the two auxiliary sub-lines to form a "three-to-one" connection Way.
- the number of auxiliary sub-lines disposed on the plurality of driving sub-lines may be the same or may be different, which is not limited by the present disclosure.
- FIG. 12 is a schematic plan view of a bridging flexible board in a flexible printed circuit board according to an exemplary embodiment of the present disclosure.
- the bridging flexible board may at least include a first bridging pad 21 , a second bridging pad 22 and a plurality of connection lines 81 .
- the first bridging pad 21 may include a plurality of third pads
- the second bridging pad 22 may include a plurality of fourth pads, the first ends of the multiple connecting lines 81 and the multiple first ends of the first bridging pad 21
- the three welding points are correspondingly connected
- the second ends of the plurality of connection lines 81 are correspondingly connected with the plurality of fourth welding points of the second bridge pad 22 .
- the first bridging pad 21 can adopt the arrangement shown in FIG. 9a to arrange the third solder joints, including 25 solder joints, and the 25 solder joints can be arranged in 7 rows and 7 columns. array of solder joints.
- the bridging flexible board may further include at least one third auxiliary line 73 and at least one fourth auxiliary line 74 .
- a first end of the third auxiliary line 73 is connected to the connection line 81 , and a second end of the third auxiliary line 73 is connected to the third pad of the first bridge pad 21 .
- a first end of the fourth auxiliary line 74 is connected to the connection line 81 , and a second end of the third auxiliary line 73 is connected to the fourth soldering point of the second bridge pad 22 .
- the plurality of third solder joints may include at least one third functional solder joint located inside the solder joint array and at least one third non-functional solder joint located outside the solder joint array
- the plurality of fourth The solder joints may include at least one fourth functional solder joint located inside the solder joint array and at least one fourth non-functional solder joint located outside the solder joint array.
- a first end of the connecting wire 81 is connected to a third functional soldering point of the first bridge pad 21
- a second end of the connecting wire 81 is connected to a fourth functional soldering point of the second bridge pad 22 .
- a first end of the third auxiliary line 73 is connected to the connection line 81 , and a second end of the third auxiliary line 73 is connected to at least one third non-functional soldering point of the first bridge pad 21 .
- a first end of the fourth auxiliary line 74 is connected to the connection line 81 , and a second end of the fourth auxiliary line 74 is connected to a fourth non-functional solder point of the second bridge pad 22 .
- FIG. 13 is an enlarged view of area C in FIG. 12
- FIG. 14 is an enlarged view of area D in FIG. 12 .
- the five connection lines may include a first connection sub-line 81-1, a second connection sub-line 81-2, a third connection sub-line 81-3, and a fourth connection sub-line 81-4 and the fifth connecting sub-line 81-5
- the five third auxiliary lines may include the eleventh auxiliary sub-line 73-11, the twelfth auxiliary sub-line 73-12, the thirteenth auxiliary sub-line 73-13, the tenth auxiliary sub-line
- the five fourth auxiliary lines may include the sixteenth auxiliary sub-line 74-16, the seventeenth auxiliary sub-line 74-17, the eighteenth auxiliary sub-line A sub-line 74-18, a nineteenth auxiliary sub-line 74-19 and a twentieth auxiliary sub-line 74-20.
- the first end of the first connection sub-line 81-1 is connected to the functional pad 3-3 in the third row and third column on the first bridge pad 21, and the first connection sub-line 81-1
- the second end of 1 is connected to the functional pad 3 - 3 in the third row and third column on the second bridge pad 22 .
- the first end of the eleventh auxiliary sub-line 73-11 is connected to the first connecting sub-line 81-1, and the second end of the eleventh auxiliary sub-line 73-11 extends toward the first bridge pad 21, and is connected to the first The non-functional pads 1 - 1 in the first row and the first column on the bridge pad 21 are connected.
- the first end of the sixteenth auxiliary sub-line 74-16 is connected to the first connection sub-line 81-1, and the second end of the sixteenth auxiliary sub-line 74-16 extends toward the second bridge pad 22, and is connected to the second The non-functional pads 1 - 1 in the first row and the first column on the bridge pad 22 are connected.
- the first end of the first connection sub-wire can be connected to the two third pads on the first bridge pad by using the eleventh auxiliary sub-wire to form a "two-to-one" connection mode.
- the second end of the second terminal can be connected to the two fourth pads on the second bridging pad by using the sixteenth auxiliary sub-wire to form a "two-to-one" connection.
- the first end of the second connection sub-line 81-2 is connected to the functional pad 3-5 in the third row and fifth column on the first bridge pad 21, and the second connection sub-line 81-2
- the second end of 2 is connected to the functional pad 3 - 5 in row 3 and column 5 on the second bridge pad 22 .
- the first end of the twelfth auxiliary sub-line 73-12 is connected to the second connection sub-line 81-2, and after the second end of the twelfth auxiliary sub-line 73-12 extends toward the first bridge pad 21, it is connected to the first The non-functional pads 1-7 in the first row and the seventh column on the bridge pad 21 are connected.
- the first end of the seventeenth auxiliary sub-line 74-17 is connected to the second connection sub-line 81-2, and the second end of the seventeenth auxiliary sub-line 74-17 extends toward the second bridge pad 22, and then connects with the second bridge pad 22.
- the non-functional solder joints 1-7 in row 1 and column 7 on pad 22 are connected.
- the first end of the second connection sub-wire can be connected to the two third pads on the first bridge pad by using the twelfth auxiliary sub-wire, forming a "two-to-one" connection.
- the second end of the second connection sub-wire can be connected to the two fourth pads on the second bridge pad by using the seventeenth auxiliary sub-wire to form a "two-to-one" connection.
- the first end of the third connection sub-line 81-3 is connected to the functional pad 4-4 in the fourth row and fourth column on the first bridge pad 21, and the third connection sub-line 81-3
- the second end of 3 is connected to the functional pad 4 - 4 in the fourth row and fourth column on the second bridge pad 22 .
- the first end of the thirteenth auxiliary sub-line 73-13 is connected to the third connecting sub-line 81-3, and after the second end of the thirteenth auxiliary sub-line 73-13 extends toward the first bridge pad 21, it is connected to the first The non-functional solder joints 3 - 7 in the third row and seventh column on the bridge pad 21 are connected.
- the first end of the eighteenth auxiliary sub-line 74-18 is connected to the third connection sub-line 81-3, and the second end of the eighteenth auxiliary sub-line 74-18 extends toward the second bridge pad 22, and connects with the second The non-functional pads 3 - 7 in the third row and seventh column on the bridging pad 22 are connected.
- the first end of the third connecting sub-wire can be connected to the two third pads on the first bridge pad by using the thirteenth auxiliary sub-wire, forming a "two-to-one" connection.
- the second end of the third connection sub-wire 81-3 can be connected to the two fourth pads on the second bridge pad by using the eighteenth auxiliary sub-wire, forming a "two-to-one" connection.
- the first end of the fourth connection sub-wire 81-4 is connected to the functional pad 5-5 in the fifth row and fifth column on the first bridge pad 21, and the fourth connection sub-wire 81-4
- the second end of 4 is connected to the functional pad 5 - 5 in row 5 and column 5 on the second bridge pad 22 .
- the first end of the fourteenth auxiliary sub-line 73-14 is connected to the fourth connecting sub-line 81-4, and after the second end of the fourteenth auxiliary sub-line 73-14 extends toward the first bridge pad 21, it is connected to the first The non-functional solder joints 7 - 7 in the seventh row and seventh column on the bridge pad 21 are connected.
- the first end of the nineteenth auxiliary sub-line 74-19 is connected to the fourth connecting sub-line 81-4, and after the second end of the nineteenth auxiliary sub-line 74-19 extends toward the second bridge pad 22, it is connected to the second The non-functional pads 7 - 7 in the seventh row and seventh column on the bridging pad 22 are connected.
- the first end of the fourth connection sub-wire can be connected to the two third pads on the first bridge pad by using the fourteenth auxiliary sub-wire, forming a "two-to-one" connection.
- the second end of the fourth connection sub-wire can be connected to the two fourth pads on the second bridge pad by using the nineteenth auxiliary sub-wire to form a "two-to-one" connection.
- the first end of the fifth connection sub-line 81-5 is connected to the functional pad 5-3 in the fifth row and third column on the first bridge pad 21, and the fifth connection sub-line 81-5
- the second end of 5 is connected to the functional pad 5 - 3 in row 5 and column 3 on the second bridge pad 22 .
- the first end of the fifteenth auxiliary sub-line 73-15 is connected to the fifth connection sub-line 81-5, and the second end of the fifteenth auxiliary sub-line 73-15 extends toward the first bridging pad 21, and is The non-functional solder joint 7 - 1 in row 7 and column 1 on the bridge pad 21 is connected.
- the first end of the twentieth auxiliary sub-line 74-20 is connected to the fifth connection sub-line 81-5, and after the second end of the twentieth auxiliary sub-line 74-20 extends toward the second bridge pad 22, it is connected to the second The non-functional pads 7 - 1 in row 7 and column 1 on the bridge pad 22 are connected.
- the first end of the fifth connection sub-wire can be connected to the two third pads on the first bridge pad by using the fifteenth auxiliary sub-wire to form a "two-to-one" connection.
- the second end of the fifth connection sub-wire 81 - 5 can be connected to the two fourth pads on the second bridge pad by using the twentieth auxiliary sub-wire to form a "two-to-one" connection.
- At least one functional soldering point may be provided between the functional soldering point connected with the connecting wire and the non-functional soldering point connected with the auxiliary wire connected to the connecting wire.
- connection line as the main transmission line is connected to the functional pads on the pad
- auxiliary line as the branch line is connected to the non-functional pads on the pad. Since the non-functional solder joints on the pads of the existing structure are usually idle, auxiliary lines can be set to connect the non-functional solder joints.
- connecting wires on the bridging flexible plate to connect functional soldering points
- auxiliary wires to connect non-functional soldering points
- each connection sub-line can be provided with n auxiliary sub-lines, and the driving sub-line can be connected to n+1 solder points on the pad by using n auxiliary sub-lines to form an "n+1 to one ", n is a positive integer greater than 1.
- each connection sub-line can be provided with an auxiliary sub-line, and the connection sub-line can be connected to two solder points on the pad by using one auxiliary sub-line to form a "two-to-one" connection mode.
- each connection sub-line can be provided with two auxiliary sub-lines, and the connection sub-line can be connected with three solder points on the pad by using the two auxiliary sub-lines to form a "three-to-one" connection Way.
- the number of auxiliary sub-lines provided on the plurality of connecting sub-lines may be the same or different, which is not limited in the present disclosure.
- a signal line is connected to a functional soldering point of the main pad, and a connecting line is connected to a functional soldering point of the bridge pad, and the bridge After the functional soldering point of the pad is welded to the functional soldering point of the main pad, the signal lines on the main flexible board are connected through the bridging flexible board.
- the connection relationship between the first driving signal line and the second driving signal line on the main flexible board is: the first driving signal line is connected to the pad 3-3 on the first main pad, and the pad on the first main pad is connected to 3-3.
- the point 3-3 is connected to the solder point 3-3 on the first bridge pad, the solder point 3-3 on the first bridge pad is connected to the first end of the connecting line, and the second end of the connecting line is connected to the second bridge
- the solder point 3-3 on the pad is connected, the solder point 3-3 on the second bridge pad is connected to the solder point 3-3 on the second main pad, and the solder point 3-3 on the second main pad Connect with the second driving signal line.
- the present disclosure provides a flexible printed circuit board, at least one signal line is connected to a functional pad of the main pad, and at least one auxiliary line connected to the signal line is connected to a non-functional pad of the main pad
- at least one connection line is connected to a functional pad of the bridge pad
- at least one auxiliary line connected to the connection line is connected to a non-functional pad of the bridge pad.
- the connection relationship between the first driving signal line and the second driving signal line on the main flexible board is: the first driving signal line is connected to the pad 3-3 on the first main pad, and the auxiliary line of the first driving signal line Connect to pad 1-1 on the first main pad.
- the solder point 3-3 on the first main pad is connected to the solder point 3-3 on the first bridge pad, and the solder point 1-1 on the first main pad is connected to the solder point 1 on the first bridge pad.
- -1 connection The soldering point 3-3 on the first bridge pad is connected to the first end of the connecting wire, and the soldering point 1-1 on the first bridge pad is connected to the auxiliary wire of the connecting wire.
- connection line The second end of the connection line is connected to the solder point 3-3 on the second bridge pad, and the auxiliary line of the connection line is connected to the solder point 1-1 on the second bridge pad.
- the solder point 3-3 on the second bridge pad is connected to the solder point 3-3 on the second main pad, and the solder point 1-1 on the second bridge pad is connected to the solder point 1 on the second main pad.
- the pad 3-3 on the second main pad is connected to the second driving signal line, and the pad 1-1 on the second main pad is connected to the auxiliary line of the second driving signal line.
- the bridging flexible board may include a connection line area 210 , a first pad area 211 and a second pad area 212 , and the connection line area 210 may be disposed on the first pad area. Between the pad area 211 and the second pad area 212 .
- connection line region 210 may be provided with a plurality of connection lines 81, the shape of the connection lines 81 may be a straight line or a broken line extending along the first direction D1, and the plurality of connection lines 81 may be arranged in the second direction D2. Set in sequence.
- the first ends of the plurality of connection lines 81 extend to the first pad area 211 and are connected to the plurality of third pads correspondingly, and the second ends of the plurality of connection lines 81 extend to the second pad area 212 to connect with the plurality of third pads.
- Four solder joints correspond to connections.
- the first pad area 211 may include a first pad area 211-1 and a first dispensing area 211-2, and the first pad area 211-1 is configured to set a first bridging pad , the first dispensing area 211-2 can be arranged on the periphery of the first solder joint area 211-1, and the surface of the first dispensing area 211-2 is dispensed by a glue dispenser, and the first dispensing area 211- 2 to form a dispensing layer.
- the second pad area 212 may include a second pad area 212-1 and a second glue dispensing area 212-2, and the second pad area 212-1 is configured to set a second bridging pad , the second dispensing area 212-2 can be arranged on the periphery of the second solder joint area 212-1, and the surface of the second dispensing area 212-2 is dispensed by a glue dispenser, and in the second dispensing area 212- 2 to form a dispensing layer.
- the first pad area 211-1 and the second pad area 212-1 may be referred to as Ball Grid Array (BGA for short) areas.
- BGA Ball Grid Array
- the first connection point 91 where the third auxiliary line 73 is connected to the connection line 81 may be located in the first glue dispensing area 211-2. Since the first glue dispensing area is provided with a dispensing layer, the first glue dispensing area is not easily deformed. By setting the first connection point in the first glue dispensing area in the present disclosure, the deformation can be avoided from affecting the third connection point, and the connection is improved. reliability.
- the second connection point 92 where the fourth auxiliary line 74 is connected to the connection line 81 may be located in the second glue dispensing area 212-2. Since the second glue dispensing area is provided with a dispensing layer, the second glue dispensing area is not easy to be deformed. By setting the second connection point in the second glue dispensing area in the present disclosure, the deformation can be avoided from affecting the second connection point, and the connection is improved. reliability.
- FIG. 15 is a schematic plan view of another bridging flexible board in the flexible printed circuit board of the exemplary embodiment of the present disclosure.
- the structure of the bridging flexible board in this exemplary embodiment is basically similar to the structure of the bridging flexible board shown in FIG.
- the connection point 91 may be located in the connection line area 210
- the second connection point 92 where the fourth auxiliary line 74 is connected to the connection line 81 may be located in the connection line area 210 .
- connection line area is far away from the BGA area, the surface of the connection line area is relatively flat, and the present disclosure can prevent deformation from affecting the first connection by arranging the first connection point and the second connection point in the connection line area. point and a second connection point, improving connection reliability.
- FIG. 16 is a schematic plan view of another bridging flexible board in the flexible printed circuit board according to an exemplary embodiment of the present disclosure, illustrating the structure of the first pad area 211 and part of the connection line area 210 .
- the structure of the bridging flexible board in this exemplary embodiment is basically similar to the structure of the bridging flexible board shown in Figure 12, the difference is that the bridging flexible board is also provided with at least one through hole 90 .
- the via hole 90 may be disposed in the first pad area, and/or, may be disposed in the BGA area of the second pad area.
- the via hole 90 may be located between adjacent third pads, and/or, may be located between adjacent fourth pads.
- the shape of the through hole 90 may include any one or more of the following: triangle, square, rectangle, rhombus, parallelogram, trapezoid, pentagon, hexagon, the present disclosure is not limited here .
- the size of the through hole 90 may be less than or equal to 0.1 mm, and the size of the through hole refers to the maximum value of the distance between any two points on the edge of the through hole.
- the diameter of the through hole may be about 0.05 mm, 0.08 mm, or 0.1 mm.
- the second center-to-center distance L2 between the through hole 90 and the adjacent third solder joint may be about 0.55 mm to 0.65 mm, and/or, the through hole 90 and the adjacent fourth solder joint
- the second center-to-center distance L2 may be about 0.55 mm to 0.65 mm, and the second center-to-center distance L2 is the distance between the geometric center of the through hole and the geometric center of the solder joint.
- the adjacent third welding points or the adjacent fourth welding points may be adjacent in the first direction D1, or may be adjacent in the second direction D2.
- FIG. 17 is a schematic cross-sectional structure diagram of a flexible circuit board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view along the line A-A in FIG. 16 .
- the bridge flexible board 20 in a plane perpendicular to the flexible circuit board, the bridge flexible board 20 is arranged on the main flexible board 10, and the bridge flexible board 20 may include a bridge shielding layer 420 arranged on the main flexible board 10, a bridge shield layer 420 arranged on the bridge The shielding layer 420 is away from the first bridging green oil layer 421 on the side of the main flexible board 10, the first bridging conductive layer 422 is set on the side of the first bridging green oil layer 421 away from the main flexible board 10, and the first bridging conductive layer 422 is set on the side away from the main flexible board 10.
- the bridging substrate layer 423 on one side of the main flexible board 10, the second bridging conductive layer 424 arranged on the side of the bridging substrate layer 423 away from the main flexible board 10, and the second bridging conductive layer 424 arranged on the side away from the main flexible board 10 The second bridging green oil layer 425.
- the first pad region 211 (or the second pad region 212) is provided with a plurality of solder joint vias, and the bridge shielding layer 420, the first bridge green oil layer 421, the second solder joint via hole A bridging conductive layer 422, a bridging base material layer 423, a second bridging conductive layer 424, and a second bridging green oil layer 425 are removed, and solder joint vias are configured to accommodate solder 93 to form solder joints, so that the bridging flexible board 20 and the second bridging green oil layer 425 are removed.
- the main flexible board 10 is connected.
- the first pad region 211 may be provided with at least one through hole 90, the through hole 90 may be located between the solder vias, and the bridge shield in the through hole 90 Layer 420, first bridging green oil layer 421, first bridging conductive layer 422, bridging substrate layer 423, second bridging conductive layer 424, and second bridging green oil layer 425 are removed.
- the through hole 90 is configured as a gas circulation channel to discharge the gas between the solder 93 during the vacuum reflow process, improve the exhaust efficiency during the reflow process, and reduce the air bubbles in the solder and between the solder , to reduce the occurrence of false welding.
- the first bridge conductive layer 422 may be called a ground copper layer
- the second bridge conductive layer 424 may be called a wiring layer.
- the main flexible board 10 may include an outer shielding layer 411, a cover layer 412 disposed on the outer shielding layer 411, a first main conductive layer 413 disposed on the side of the covering layer 412 away from the outer shielding layer 411, a set
- the main substrate layer 414 on the side of the first main conductive layer 413 away from the outer shielding layer 411, the second main conductive layer 415 arranged on the side of the main substrate layer 414 away from the outer shielding layer 411, and the second main conductive layer 415 arranged on the side of the second main conductive layer 415 is the main green oil layer 416 on the side away from the outer shielding layer 411 and the main shielding layer 417 is arranged on the side of the main green oil layer 416 away from the outer shielding layer 411 .
- the main shielding layer 417 and the main green oil layer 416 are provided with a plurality of main board via holes, the main shielding layer 417 and the main green oil layer 416 in the main board via holes are removed, and the position of the main board via holes is the same as that of the bridge
- the positions of the via holes on the solder joints on the flexible board 20 are corresponding, and the via holes bridging the solder joints on the flexible board 20 can expose the second main conductive layer 415, so that the solder 93 filled in the via holes of the solder joints will bridge the flexible board 20 Connect with the main flexible board 10.
- FIG. 18 is a schematic cross-sectional view of another flexible circuit board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view along the line A-A in FIG. 16 .
- the main structure of the flexible circuit board in this exemplary embodiment is basically similar to that shown in FIG. remove.
- the bridging flexible board 20 may include a first bridging green oil layer 421 disposed on the main flexible board 10 , and a first bridging conductive layer 422 disposed on the side of the first bridging green oil layer 421 away from the main flexible board 10 , the bridging substrate layer 423 arranged on the side of the first bridging conductive layer 422 away from the main flexible board 10, the second bridging conductive layer 424 arranged on the side of the bridging substrate layer 423 away from the main flexible board 10, and the second bridging conductive layer 424 arranged on the second bridge
- the conductive layer 424 is away from the second bridging green oil layer 425 on the side of the main flexible board 10 .
- the main flexible board 10 may include an outer shielding layer 411, a cover layer 412 disposed on the outer shielding layer 411, a first main conductive layer 413 disposed on the side of the covering layer 412 away from the outer shielding layer 411, a set The main substrate layer 414 on the side of the first main conductive layer 413 away from the outer shielding layer 411, the second main conductive layer 415 arranged on the side of the main substrate layer 414 away from the outer shielding layer 411, and the second main conductive layer 415 arranged on the side of the second main conductive layer 415 away from the main green oil layer 416 on the side of the outer shielding layer 411.
- the first pad area 211 (or the second pad area 212) is provided with a plurality of solder joint vias, and the first pad area 211 (or the second pad area 212) may be provided with at least A through hole 90.
- the main flexible board usually includes a main shielding film, and the main shielding film is arranged on the side of the main green oil layer away from the outer shielding layer, and the bridging flexible board usually includes a bridging shielding film, and the bridging shielding film is arranged on the first
- the side of the bridging green oil layer close to the main flexible board forms a structure in which the bridging shielding film is in contact with the main shielding film.
- the flexible circuit board proposed in this exemplary embodiment removes the main shielding film of the main flexible board and the bridging shielding film of the bridging flexible board, forming a direct contact between the main green oil layer of the main flexible board and the first bridging green oil layer of the bridging flexible board.
- the structure can not only reduce the overall thickness of the flexible circuit board, but also prevent the deformation caused by the cohesive pulling of the shielding film, improve the surface flatness, and improve the bonding degree of the main flexible board and the bridge flexible board.
- the overall thickness of the flexible circuit board in this exemplary embodiment after removing the main shielding film and the bridging shielding film can be reduced by about 12 ⁇ m to 20 ⁇ m. Since there is no functional connection between the main flexible board and the bridging flexible board except for the first pad area and the second pad area, removing the main shielding film and the bridging shielding film will not affect the shielding function.
- FIG. 19 is a schematic cross-sectional view of yet another flexible circuit board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view along the line A-A in FIG. 16 .
- the main structure of the flexible circuit board in this exemplary embodiment is basically similar to that shown in FIG. layer is removed.
- the bridging flexible board 20 may include a bridging shielding layer 420 disposed on the main flexible board 10, a first bridging green oil layer 421 disposed on the side of the bridging shielding layer 420 away from the main flexible board 10, a first bridging green oil layer 421 disposed on the second A bridging green oil layer 421 away from the first bridging conductive layer 422 on the side of the main flexible board 10, a bridging substrate layer 423 arranged on the side of the first bridging conductive layer 422 away from the main flexible board 10, a bridging substrate layer 423 arranged on the side away from the bridging substrate layer 423
- the first bridging conductive layer 422 is only disposed on the connection line region 210, the first bridging conductive layer 422 of the first pad region 211 (or the second pad region 212) is removed, and only the solder joints remain
- the via copper ring at the via hole is configured to ensure the connection reliability between the bridging flexible board 20 and the main flexible board 10 .
- the solder joint in the first pad area 211 (or the second pad area 212 ) close to the connection line area 210 is connected to the side of the first bridge conductive layer 422 in the connection line area 210 close to the solder joint.
- the distance L3 between the edges can be greater than or equal to 1.0 mm, so as to reduce the level difference near the first pad area 211 (or the second pad area 212 ) and improve the flatness of this area.
- the first pad area 211 (or the second pad area 212) is provided with a plurality of solder joint vias, and the first pad area 211 (or the second pad area 212) may be provided with at least A through hole 90, the structure of the main flexible board is basically the same as the structure of the main flexible board shown in FIG. 17 .
- an opening is usually provided in the pad area, the ground copper layer in the opening is removed, the ground copper layer outside the opening is retained, and a plurality of solder joints are arranged in the ground copper opening.
- the minimum distance between the opening edges of the ground copper is about 0.3mm.
- the flexible circuit board in this exemplary embodiment improves soldering reliability, reduces the risk of failure, and improves product yield.
- this exemplary embodiment effectively reduces the overall thickness of the flexible circuit board.
- this exemplary embodiment removes the ground copper layer in the pad area, and the overall thickness of the flexible circuit board can be reduced. The reduction is about 8 ⁇ m to about 12 ⁇ m.
- FIG. 20 is a schematic cross-sectional view of another bridging flexible board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view taken along the line A-A in FIG. 16 .
- the main structure of the flexible circuit board in this exemplary embodiment is basically similar to that shown in FIG. Removal, the ground copper layer of the first pad region 211 (or the second pad region 212 ) is removed.
- the bridging flexible board 20 may include a first bridging green oil layer 421 disposed on the main flexible board 10 , and a first bridging conductive layer 422 disposed on the side of the first bridging green oil layer 421 away from the main flexible board 10 , the bridging substrate layer 423 arranged on the side of the first bridging conductive layer 422 away from the main flexible board 10, the second bridging conductive layer 424 arranged on the side of the bridging substrate layer 423 away from the main flexible board 10, and the second bridging conductive layer 424 arranged on the second bridge
- the conductive layer 424 is away from the second bridging green oil layer 425 on the side of the main flexible board 10 .
- the main flexible board 10 may include an outer shielding layer 411, a cover layer 412 disposed on the outer shielding layer 411, a first main conductive layer 413 disposed on the side of the covering layer 412 away from the outer shielding layer 411, a set The main substrate layer 414 on the side of the first main conductive layer 413 away from the outer shielding layer 411, the second main conductive layer 415 arranged on the side of the main substrate layer 414 away from the outer shielding layer 411, and the second main conductive layer 415 arranged on the side of the second main conductive layer 415 away from the main green oil layer 416 on the side of the outer shielding layer 411.
- the main green oil layer 416 is provided with a plurality of green oil via holes, the main green oil layer 416 in the green oil via holes is removed, and the positions of the green oil via holes are in line with the solder joints on the bridging flexible board 20 The positions of the via holes are corresponding, and the solder joint via holes on the bridging flexible board 20 can expose the second main conductive layer 415 , so that the solder 93 filled in the solder joint via holes connects the bridging flexible board 20 to the main flexible board 10 .
- the first pad area 211 (or the second pad area 212) is provided with a plurality of solder joint vias, and the first bridge green oil layer 421 and the first bridge conductive layer 422 in the solder joint vias , the bridging substrate layer 423, the second bridging conductive layer 424 and the second bridging green oil layer 425 are removed, and the solder joint vias are configured to accommodate the solder 93 to form solder joints, so that the bridging flexible board 20 is connected to the main flexible board 10 .
- the first pad region 211 (or the second pad region 212 ) may be provided with at least one through hole 90 , and the through hole 90 may be located between the pad via holes.
- the through hole 90 is configured as a gas circulation channel to discharge the gas between the solder 93 during the vacuum reflow process, improve the exhaust efficiency during the reflow process, and reduce the air bubbles in the solder and between the solder , to reduce the occurrence of false welding.
- the first bridging conductive layer 422 is only disposed on the connection line region 210, the first bridging conductive layer 422 of the first pad region 211 (or the second pad region 212) is removed, and only the solder joints remain
- the via copper ring at the via hole is configured to ensure the connection reliability between the bridging flexible board 20 and the main flexible board 10 .
- the solder joint in the first pad area 211 (or the second pad area 212 ) close to the connection line area 210 is connected to the side of the first bridge conductive layer 422 in the connection line area 210 close to the solder joint.
- the distance L3 between the edges can be greater than or equal to 1.0 mm, so as to reduce the level difference near the first pad area 211 (or the second pad area 212 ) and improve the flatness of this area.
- the flexible circuit board in this exemplary embodiment improves soldering reliability, reduces the risk of failure, and improves product yield.
- the present exemplary embodiment minimizes the overall thickness of the flexible circuit board by removing the main shielding film of the main flexible board and the bridging shielding film of the bridging flexible board, and removing the ground copper layer in the pad area, compared with Compared with the existing flexible circuit board structure, the overall thickness of the flexible circuit board in this exemplary embodiment can be reduced by about 20 ⁇ m to 32 ⁇ m.
- Exemplary embodiments of the present disclosure also provide a display touch device, including a touch display panel and the aforementioned flexible printed circuit board, the touch display panel may include an active area and a binding on one side of the active area The binding area may include a binding pin area, and the flexible printed circuit board is connected to the binding pin area.
- the display touch device of the present disclosure may be any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital camera, a digital photo frame, and a navigator.
- a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital camera, a digital photo frame, and a navigator.
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Abstract
A flexible printed circuit board and a touch-control display apparatus. The flexible printed circuit board comprises a main flexible board and a bridging flexible board, wherein the main flexible board comprises a first main pad, a second main pad, a first signal line and a second signal line, and the bridging flexible board comprises a first bridging pad and a second bridging pad; the first main pad comprises at least two first solder joints, the second main pad comprises at least two second solder joints, the first bridging pad comprises at least two third solder joints, and the second bridging pad comprises at least two fourth solder joints; and the first solder joints are connected to the third solder joints, and the second solder joints are connected to the fourth solder joints. The flexible printed circuit board further comprises an auxiliary line, wherein a first signal line is connected to one first solder joint, a second signal line is connected to one second solder joint, and the auxiliary line is connected to one first solder joint or second solder joint.
Description
本申请要求于2022年1月29日提交CNIPA、申请号为202210112906.7、发明名称为“柔性印刷电路板和显示触控装置”的中国专利申请的优先权,其内容应理解为通过引用的方式并入本申请中。This application claims the priority of the Chinese patent application filed with CNIPA on January 29, 2022, with the application number 202210112906.7, and the title of the invention is "Flexible Printed Circuit Board and Display Touch Device", the content of which should be understood as being incorporated by reference. included in this application.
本公开涉及但不限于显示技术领域,尤其是指一种柔性印刷电路板和显示触控装置。The present disclosure relates to but not limited to the field of display technology, and in particular refers to a flexible printed circuit board and a display touch device.
随着显示技术的飞速发展,触控屏(Touch Screen)已经逐渐遍及人们的生活中。按照组成结构,触控屏可以分为外挂式(Add on Mode)、覆盖表面式(On Cell)、内嵌式(In Cell)等。按照工作原理,触控屏可以分为电容式、电阻式、红外线式、表面声波式等。电容式On Cell类型包括显示面板、触控面板和柔性线路板(Flexible Printed Circuit,简称FPC),触控面板设置在显示面板的出光侧,显示面板和触控面板通过柔性线路板与外部装置连接。With the rapid development of display technology, touch screen (Touch Screen) has gradually spread in people's life. According to the structure, the touch screen can be divided into Add on Mode, On Cell, In Cell, etc. According to the working principle, the touch screen can be divided into capacitive, resistive, infrared, surface acoustic wave and so on. Capacitive On Cell type includes display panel, touch panel and flexible circuit board (Flexible Printed Circuit, referred to as FPC). The touch panel is set on the light-emitting side of the display panel, and the display panel and touch panel are connected to external devices through the flexible circuit board. .
发明内容Contents of the invention
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims.
一方面,本公开提供了一种柔性印刷电路板,包括主柔性板和桥接柔性板,所述主柔性板至少包括第一主焊盘、第二主焊盘、至少一条第一信号线和至少一条第二信号线,所述桥接柔性板至少包括第一桥接焊盘、第二桥接焊盘和至少一条连接线;所述第一主焊盘包括至少二个第一焊点,所述第二主焊盘包括至少二个第二焊点,所述第一信号线与一个第一焊点连接,所述 第二信号线与一个第二焊点连接;所述第一桥接焊盘包括至少二个第三焊点,所述第二桥接焊盘包括至少二个第四焊点,所述连接线的第一端与一个第三焊点连接,所述连接线的第二端与一个第四焊点连接;所述第一焊点与所述第三焊点通过焊锡连接,所述第二焊点与所述第四焊点通过焊锡连接;所述柔性印刷电路板还包括第一辅助线、第二辅助线、第三辅助线和第四辅助线中的任意一条或多条;所述第一辅助线的第一端与所述第一信号线连接,所述第一辅助线的第二端与另一个第一焊点连接;所述第二辅助线的第一端与所述第二信号线连接,所述第二辅助线的第二端与另一个第二焊点连接;所述第三辅助线的第一端与所述连接线连接,所述第三辅助线的第二端与另一个第三焊点连接;所述第四辅助线的第一端与所述连接线连接,所述第四辅助线的第二端与另一个第四焊点连接。In one aspect, the present disclosure provides a flexible printed circuit board, including a main flexible board and a bridging flexible board, the main flexible board at least includes a first main pad, a second main pad, at least one first signal line and at least one A second signal line, the bridging flexible board at least includes a first bridging pad, a second bridging pad and at least one connection line; the first main pad includes at least two first soldering points, and the second The main pad includes at least two second pads, the first signal line is connected to a first pad, and the second signal line is connected to a second pad; the first bridge pad includes at least two a third welding point, the second bridging pad includes at least two fourth welding points, the first end of the connecting line is connected to a third welding point, the second end of the connecting line is connected to a fourth Solder point connection; the first solder point is connected to the third solder point through soldering, and the second soldering point is connected to the fourth soldering point through soldering; the flexible printed circuit board also includes a first auxiliary line , any one or more of the second auxiliary line, the third auxiliary line and the fourth auxiliary line; the first end of the first auxiliary line is connected to the first signal line, and the first end of the first auxiliary line The two ends are connected to another first welding point; the first end of the second auxiliary line is connected to the second signal line, and the second end of the second auxiliary line is connected to another second welding point; The first end of the third auxiliary line is connected to the connection line, the second end of the third auxiliary line is connected to another third welding point; the first end of the fourth auxiliary line is connected to the connection line connected, the second end of the fourth auxiliary line is connected to another fourth welding point.
在示例性实施方式中,所述主柔性板包括触控驱动电路和至少一个端子,所述第一信号线的第一端与所述端子连接,所述第一信号线的第二端与所述第一主焊盘的第一焊点连接,所述第二信号线的第一端与所述触控驱动电路连接,所述第二信号线的第二端与所述第二主焊盘的第二焊点连接。In an exemplary embodiment, the main flexible board includes a touch driving circuit and at least one terminal, the first end of the first signal line is connected to the terminal, and the second end of the first signal line is connected to the terminal. The first pad of the first main pad is connected, the first end of the second signal line is connected to the touch drive circuit, the second end of the second signal line is connected to the second main pad The second solder joint connection.
在示例性实施方式中,所述第一主焊盘包括多个第一焊点,多个第一焊点以矩阵方式排列成焊点阵列,多个第一焊点包括位于所述焊点阵列内侧的至少一个第一功能性焊点和位于所述焊点阵列外侧的至少一个第一非功能性焊点,所述第一信号线与所述第一功能性焊点连接,所述第一辅助线与所述第一非功能性焊点连接。In an exemplary embodiment, the first main pad includes a plurality of first solder joints, the plurality of first solder joints are arranged in a matrix to form a solder joint array, and the plurality of first solder joints include the At least one first functional solder joint inside and at least one first non-functional solder joint located outside the array of solder joints, the first signal line is connected to the first functional solder joint, and the first The auxiliary line is connected to the first non-functional solder joint.
在示例性实施方式中,所述第二主焊盘包括多个第二焊点,多个第二焊点以矩阵方式排列成焊点阵列,多个第二焊点包括位于所述焊点阵列内侧的至少一个第二功能性焊点和位于所述焊点阵列外侧的至少一个第二非功能性焊点,所述第二信号线与所述第二功能性焊点连接,所述第一辅助线与所述第二非功能性焊点连接。In an exemplary embodiment, the second main pad includes a plurality of second solder joints, and the plurality of second solder joints are arranged in a matrix to form a solder joint array, and the plurality of second solder joints include those located in the solder joint array. At least one second functional soldering point inside and at least one second non-functional soldering point located outside the array of soldering points, the second signal line is connected to the second functional soldering point, the first The auxiliary line is connected to the second non-functional solder joint.
在示例性实施方式中,所述第一桥接焊盘包括多个第三焊点,多个第三焊点以矩阵方式排列成焊点阵列,多个第三焊点包括位于所述焊点阵列内侧的至少一个第三功能性焊点和位于所述焊点阵列外侧的至少一个第三非功能性焊点,所述连接线与所述第三功能性焊点连接,所述第三辅助线与所述第 三非功能性焊点连接。In an exemplary embodiment, the first bridging pad includes a plurality of third solder joints, the plurality of third solder joints are arranged in a matrix to form a solder joint array, and the plurality of third solder joints include the At least one third functional soldering point inside and at least one third non-functional soldering point located outside the array of soldering points, the connection line is connected to the third functional soldering point, and the third auxiliary line Connect with the third non-functional solder joint.
在示例性实施方式中,所述第二桥接焊盘包括多个第四焊点,多个第四焊点以矩阵方式排列成焊点阵列,多个第四焊点包括位于所述焊点阵列内侧的至少一个第四功能性焊点和位于所述焊点阵列外侧的至少一个第四非功能性焊点,所述连接线与所述第四功能性焊点连接,所述第四辅助线与所述第四非功能性焊点连接。In an exemplary embodiment, the second bridging pad includes a plurality of fourth pads, the plurality of fourth pads are arranged in a matrix to form a pad array, and the multiple fourth pads include a pad located in the pad array At least one fourth functional soldering point inside and at least one fourth non-functional soldering point located outside the array of soldering points, the connection line is connected to the fourth functional soldering point, and the fourth auxiliary line connected to the fourth non-functional solder joint.
在示例性实施方式中,所述桥接柔性板包括连接线区、第一焊盘区和第二焊盘区,所述连接线区设置在所述第一焊盘区和第二焊盘区之间;所述连接线设置在所述连接线区,所述第一桥接焊盘设置在所述第一焊盘区,所述第二桥接焊盘设置在所述第二焊盘区;所述第三辅助线与所述连接线连接的第一连接点位于所述连接线区,和/或,所述第四辅助线与所述连接线连接的第二连接点位于所述连接线区。In an exemplary embodiment, the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between; the connecting line is set in the connecting line area, the first bridge pad is set in the first pad area, and the second bridge pad is set in the second pad area; the A first connection point where the third auxiliary line is connected to the connection line is located in the connection line area, and/or a second connection point where the fourth auxiliary line is connected to the connection line is located in the connection line area.
在示例性实施方式中,所述桥接柔性板包括连接线区、第一焊盘区和第二焊盘区,所述连接线区设置在所述第一焊盘区和第二焊盘区之间,所述连接线设置在所述连接线区;所述第一焊盘区包括第一焊点区和第一点胶区,所述第一焊点区设置所述第一桥接焊盘,所述第一点胶区设置在所述第一焊点区的外围;所述第二焊盘区包括第二焊点区和第二点胶区,所述第二焊点区设置所述第二桥接焊盘,所述第二点胶区设置在所述第二焊点区的外围;所述第三辅助线与所述连接线连接的第一连接点位于所述第一点胶区,和/或,所述第四辅助线与所述连接线连接的第二连接点位于所述第二点胶区。In an exemplary embodiment, the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between, the connection line is arranged in the connection line area; the first pad area includes a first pad area and a first dispensing area, and the first pad area is provided with the first bridging pad, The first dispensing area is arranged on the periphery of the first welding spot area; the second pad area includes a second welding spot area and a second dispensing area, and the second welding spot area is provided with the first welding spot area. Two bridging pads, the second dispensing area is arranged on the periphery of the second welding point area; the first connection point where the third auxiliary line is connected to the connection line is located in the first dispensing area, And/or, the second connection point where the fourth auxiliary line is connected to the connecting line is located in the second dispensing area.
在示例性实施方式中,相邻的第一焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第二焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第三焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第四焊点之间的中心距为1.05mm至1.25mm。In an exemplary embodiment, the center-to-center distance between adjacent first welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent second welding points is 1.05 mm to 1.25 mm; and /or, the center-to-center distance between adjacent third welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent fourth welding points is 1.05 mm to 1.25 mm.
在示例性实施方式中,所述第一桥接焊盘还包括至少一个通孔,所述通孔设置在所述相邻的第三焊点之间;和/或,所述第二桥接焊盘还包括至少一个通孔,所述通孔设置在所述相邻的第四焊点之间。In an exemplary embodiment, the first bridging pad further includes at least one through hole disposed between the adjacent third pads; and/or, the second bridging pad It also includes at least one through hole, the through hole is arranged between the adjacent fourth welding points.
在示例性实施方式中,所述通孔的尺寸小于或等于0.1mm,所述通孔的尺寸是指通孔边缘上任意两点之间距离的最大值。In an exemplary embodiment, the size of the through hole is less than or equal to 0.1 mm, and the size of the through hole refers to the maximum value of the distance between any two points on the edge of the through hole.
在示例性实施方式中,所述通孔与相邻第三焊点之间的中心距为0.55mm至0.65mm;和/或,所述通孔与相邻第四焊点之间的中心距为0.55mm至0.65mm。In an exemplary embodiment, the center distance between the through hole and the adjacent third welding spot is 0.55mm to 0.65mm; and/or, the center distance between the through hole and the adjacent fourth welding spot 0.55mm to 0.65mm.
在示例性实施方式中,在垂直于柔性印刷电路板的平面内,所述桥接柔性板设置在所述主柔性板上,所述桥接柔性板包括设置在所述主柔性板上的第一桥接绿油层、设置在所述第一桥接绿油层远离所述主柔性板一侧的第一桥接导电层、设置在所述第一桥接导电层远离所述主柔性板一侧的桥接基材层、设置在所述桥接基材层远离所述主柔性板一侧的第二桥接导电层以及设置在所述第二桥接导电层远离所述主柔性板一侧的第二桥接绿油层;所述第一桥接导电层仅设置在所述桥接柔性板的连接线区。In an exemplary embodiment, in a plane perpendicular to the flexible printed circuit board, the bridging flexible board is disposed on the main flexible board, and the bridging flexible board includes a first bridging flexible board disposed on the main flexible board The green oil layer, the first bridging conductive layer arranged on the side of the first bridging green oil layer away from the main flexible board, the bridging substrate layer arranged on the side of the first bridging conductive layer away from the main flexible board, The second bridging conductive layer arranged on the side of the bridging base material layer away from the main flexible board and the second bridging green oil layer arranged on the side of the second bridging conductive layer away from the main flexible board; A bridging conductive layer is only provided in the connecting line area of the bridging flexible board.
在示例性实施方式中,所述第三焊点靠近所述连接线区一侧的边缘与所述连接线区中所述第一桥接导电层靠近所述第三焊点一侧的边缘之间的距离大于或等于1.0mm,和/或,所述第四焊点靠近所述连接线区一侧的边缘与所述连接线区中所述第一桥接导电层靠近所述第四焊点一侧的边缘之间的距离大于或等于1.0mm。In an exemplary embodiment, between the edge of the third solder joint close to the connecting line area and the edge of the first bridging conductive layer in the connecting line area close to the third solder joint The distance is greater than or equal to 1.0mm, and/or, the edge of the fourth solder joint near the connection line area is the same as the first bridging conductive layer in the connection line area close to the fourth solder joint The distance between the edges of the sides is greater than or equal to 1.0 mm.
在示例性实施方式中,所述主柔性板包括屏蔽层、设置在所述屏蔽层上的覆盖层、设置在所述覆盖层远离所述屏蔽层一侧的第一主导电层、设置在所述第一主导电层远离所述屏蔽层一侧的主基材层、设置在所述主基材层远离所述屏蔽层一侧的第二主导电层以及设置在所述第二主导电层远离所述屏蔽层一侧的主绿油层;所述桥接柔性板的第一桥接绿油层与所述主绿油层直接接触。In an exemplary embodiment, the main flexible board includes a shielding layer, a cover layer disposed on the shielding layer, a first main conductive layer disposed on the side of the covering layer away from the shielding layer, a first main conductive layer disposed on the shielding layer, The first main conductive layer is away from the main substrate layer on the side of the shielding layer, the second main conductive layer is arranged on the side of the main substrate layer away from the shielding layer, and the second main conductive layer is arranged on the side of the second main conductive layer. The main green oil layer on the side away from the shielding layer; the first bridging green oil layer of the bridging flexible board is in direct contact with the main green oil layer.
另一方面,本公开还提供了一种显示触控装置,包括触控显示面板以及前述的柔性印刷电路板,所述触控显示面板包括有效区域和位于所述有效区域一侧的绑定区域,所述绑定区域包括绑定引脚区,所述柔性印刷电路板与所述绑定引脚区连接。On the other hand, the present disclosure also provides a display touch device, including a touch display panel and the aforementioned flexible printed circuit board, the touch display panel includes an active area and a binding area located on one side of the active area , the binding area includes a binding pin area, and the flexible printed circuit board is connected to the binding pin area.
在阅读理解了附图和详细描述后,可以明白其他方面。Other aspects will become apparent upon reading and understanding the drawings and detailed description.
附图用来提供对本公开技术方案的进一步理解,并且构成说明书的一部分,与本公开的实施例一起用于解释本公开的技术方案,并不构成对本公开的技术方案的限制。附图中各部件的形状和大小不反映真实比例,目的只是示意说明本公开内容。The accompanying drawings are used to provide a further understanding of the technical solutions of the present disclosure, and constitute a part of the specification, and are used together with the embodiments of the present disclosure to explain the technical solutions of the present disclosure, and do not constitute limitations to the technical solutions of the present disclosure. The shapes and sizes of the various components in the drawings do not reflect true scale, but are only intended to illustrate the present disclosure.
图1为一种显示触控装置的平面结构示意图;FIG. 1 is a schematic plan view of a display touch device;
图2为一种显示触控装置中绑定区域的平面结构示意图;FIG. 2 is a schematic plan view showing a binding area in a touch device;
图3为一种显示触控装置中边缘区域的平面结构示意图;FIG. 3 is a schematic plan view showing the edge area of a touch device;
图4为一种显示触控装置中有效区域的剖面结构示意图;FIG. 4 is a schematic cross-sectional structural view showing an effective area in a touch device;
图5为一种柔性印刷电路板绑定连接的示意图;5 is a schematic diagram of a flexible printed circuit board binding connection;
图6为一种柔性印刷电路板中主柔性板的平面结构示意图;6 is a schematic plan view of the main flexible board in a flexible printed circuit board;
图7为一种柔性印刷电路板中桥接柔性板的平面结构示意图;7 is a schematic plan view of a bridging flexible board in a flexible printed circuit board;
图8为本公开示例性实施例一种主柔性板的平面结构示意图;8 is a schematic plan view of a main flexible board according to an exemplary embodiment of the present disclosure;
图9a为本公开示例性一种焊盘中多个焊点的排布示意图;FIG. 9a is a schematic diagram of the arrangement of multiple solder joints in an exemplary pad of the present disclosure;
图9b为本公开示例性另一种焊盘中多个焊点的排布示意图;FIG. 9b is a schematic diagram of the arrangement of multiple solder joints in another exemplary pad of the present disclosure;
图10为图8中A区域的放大图;Fig. 10 is an enlarged view of area A in Fig. 8;
图11为图8中B区域的放大图;Figure 11 is an enlarged view of area B in Figure 8;
图12为本公开示例性实施例一种桥接柔性板的平面结构示意图;12 is a schematic plan view of a bridging flexible board according to an exemplary embodiment of the present disclosure;
图13为图12中C区域的放大图;Figure 13 is an enlarged view of area C in Figure 12;
图14为图12中D区域的放大图;Fig. 14 is an enlarged view of area D in Fig. 12;
图15为本公开示例性实施例另一种桥接柔性板的平面结构示意图;15 is a schematic plan view of another bridging flexible board according to an exemplary embodiment of the present disclosure;
图16为本公开示例性实施例又一种桥接柔性板的平面结构示意图;Fig. 16 is a schematic plan view of another bridging flexible board according to an exemplary embodiment of the present disclosure;
图17为本公开示例性实施例一种柔性电路板的剖面结构示意图;17 is a schematic cross-sectional structure diagram of a flexible circuit board according to an exemplary embodiment of the present disclosure;
图18为本公开示例性实施例另一种柔性电路板的剖面结构示意图;Fig. 18 is a schematic cross-sectional structure diagram of another flexible circuit board according to an exemplary embodiment of the present disclosure;
图19为本公开示例性实施例又一种柔性电路板的剖面结构示意图;Fig. 19 is a schematic cross-sectional structure diagram of yet another flexible circuit board according to an exemplary embodiment of the present disclosure;
图20为本公开示例性实施例又一种桥接柔性板的剖面结构示意图。Fig. 20 is a schematic cross-sectional structure diagram of yet another bridging flexible board according to an exemplary embodiment of the present disclosure.
附图标记说明:Explanation of reference signs:
10—主柔性板; 11—第一主焊盘; 12—第二主焊盘;10—the main flexible board; 11—the first main pad; 12—the second main pad;
20—桥接柔性板; 21—第一桥接焊盘; 22—第二桥接焊盘;20—bridge flexible board; 21—first bridge pad; 22—second bridge pad;
31—感应引线; 32—驱动引线; 33—显示引线;31—sensing lead; 32—drive lead; 33—display lead;
40—柔性印刷电路板; 41—感应信号线; 50—触控驱动电路;40—flexible printed circuit board; 41—sensing signal line; 50—touch drive circuit;
51—第一驱动信号线; 52—第二驱动信号线; 60—辅助器件;51—the first driving signal line; 52—the second driving signal line; 60—auxiliary device;
61—显示信号线; 70—连接器; 71—第一辅助线;61—display signal line; 70—connector; 71—first auxiliary line;
72—第二辅助线; 73—第三辅助线; 74—第四辅助线;72—second auxiliary line; 73—third auxiliary line; 74—fourth auxiliary line;
81—连接线; 90—通孔; 91—第一连接点;81—connection line; 90—through hole; 91—first connection point;
92—第二连接点; 93—焊锡; 100—有效区域;92—second connection point; 93—solder; 100—effective area;
101—基底; 102—驱动电路层; 103—发光结构层;101—substrate; 102—drive circuit layer; 103—light emitting structure layer;
104—封装结构层; 105—缓冲层; 106—第一金属网格层;104—encapsulation structure layer; 105—buffer layer; 106—first metal grid layer;
107—绝缘层; 108—第二金属网格层; 109—保护层;107—insulation layer; 108—the second metal grid layer; 109—protective layer;
110—第一触控单元; 111—第一触控电极; 112—第一连接部;110—the first touch unit; 111—the first touch electrode; 112—the first connection part;
120—第二触控单元; 121—第二触控电极; 122—第二连接部;120—the second touch unit; 121—the second touch electrode; 122—the second connection part;
200—绑定区域; 201—第一扇出区; 202—弯折区;200—binding area; 201—first fan-out area; 202—bending area;
203—第二扇出区; 204—防静电区; 205—驱动芯片区;203—second fan-out area; 204—anti-static area; 205—driver chip area;
206—绑定引脚区; 210—连接线区; 211—第一焊盘区;206—binding pin area; 210—connection line area; 211—first pad area;
211-1—第一焊点区; 211-2—第一点胶区; 212—第二焊盘区;211-1—the first solder joint area; 211-2—the first dispensing area; 212—the second pad area;
212-1—第二焊点区; 212-2—第二点胶区; 300—边缘区域;212-1—the second solder joint area; 212-2—the second dispensing area; 300—the edge area;
401—端子区; 402—电路区; 403—连接区;401—terminal area; 402—circuit area; 403—connection area;
411—外屏蔽层; 412—覆盖层; 413—第一主导电层;411—outer shielding layer; 412—covering layer; 413—first main conductive layer;
414—主基材层; 415—第二主导电层; 416—主绿油层;414—the main substrate layer; 415—the second main conductive layer; 416—the main green oil layer;
417—主屏蔽层。 420—桥接屏蔽层; 421—第一桥接绿油层;417—main shielding layer.
422—第一桥接导电层; 424—第二桥接导电层;422—the first bridging conductive layer; 424—the second bridging conductive layer;
425—第二桥接绿油层。425—Second bridging green oil layer.
为使本公开的目的、技术方案和优点更加清楚明白,下文中将结合附图对本公开的实施例进行详细说明。注意,实施方式可以以多个不同形式来实施。所属技术领域的普通技术人员可以很容易地理解一个事实,就是方式和内容可以在不脱离本公开的宗旨及其范围的条件下被变换为各种各样的形式。因此,本公开不应该被解释为仅限定在下面的实施方式所记载的内容中。在不冲突的情况下,本公开中的实施例及实施例中的特征可以相互任意组合。为了保持本公开实施例的以下说明清楚且简明,本公开省略了部分已知功能和已知部件的详细说明。本公开实施例附图只涉及到与本公开实施例涉及到的结构,其他结构可参考通常设计In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. Note that an embodiment may be embodied in many different forms. Those skilled in the art can easily understand the fact that the means and contents can be changed into various forms without departing from the gist and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited only to the contents described in the following embodiments. In the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined arbitrarily with each other. In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of some known functions and known components. The accompanying drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, other structures can refer to the general design
本公开中的附图比例可以作为实际工艺中的参考,但不限于此。例如:沟道的宽长比、各个膜层的厚度和间距、各个信号线的宽度和间距,可以根据实际需要进行调整。显示基板中像素的个数和每个像素中子像素的个数也不是限定为图中所示的数量,本公开中所描述的附图仅是结构示意图,本公开的一个方式不局限于附图所示的形状或数值等。The proportions of the drawings in the present disclosure can be used as a reference in the actual process, but are not limited thereto. For example, the width-to-length ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the numbers shown in the figure. The figures described in the present disclosure are only structural schematic diagrams, and one mode of the present disclosure is not limited to the accompanying drawings. The shape or value shown in the figure, etc.
本说明书中的“第一”、“第二”、“第三”等序数词是为了避免构成要素的混同而设置,而不是为了在数量方面上进行限定的。Ordinal numerals such as "first", "second", and "third" in this specification are provided to avoid confusion of constituent elements, and are not intended to limit the number.
在本说明书中,为了方便起见,使用“中部”、“上”、“下”、“前”、“后”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示方位或位置关系的词句以参照附图说明构成要素的位置关系,仅是为了便于描述本说明书和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。构成要素的位置关系根据描述各构成要素的方向适当地改变。因此,不局限于在说明书中说明的词句,根据情况可以适当地更换。In this specification, for convenience, "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner" are used , "external" and other words indicating the orientation or positional relationship are used to illustrate the positional relationship of the constituent elements with reference to the drawings, which are only for the convenience of describing this specification and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation , are constructed and operate in a particular orientation and therefore are not to be construed as limitations on the present disclosure. The positional relationship of the constituent elements changes appropriately according to the direction in which each constituent element is described. Therefore, it is not limited to the words and phrases described in the specification, and may be appropriately replaced according to circumstances.
在本说明书中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解。例如,可以是固定连接,或可拆卸连接,或一体地连接;可以是机械连接,或电连接;可以是直接相连,或通过中间件间接相连,或两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本公开中的具体含义。In this specification, unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be interpreted in a broad sense. For example, it may be a fixed connection, or a detachable connection, or an integral connection; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirect connection through an intermediate piece, or an internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present disclosure in specific situations.
在本说明书中,“电连接”包括构成要素通过具有某种电作用的元件连接在一起的情况。“具有某种电作用的元件”只要可以进行连接的构成要素间的电信号的授受,就对其没有特别的限制。“具有某种电作用的元件”的例子不仅包括电极和布线,而且还包括晶体管等开关元件、电阻器、电感器、电容器、其它具有各种功能的元件等。In this specification, "electrically connected" includes the case where constituent elements are connected together through an element having some kind of electrical effect. The "element having some kind of electrical action" is not particularly limited as long as it can transmit and receive electrical signals between connected components. Examples of "elements having some kind of electrical function" include not only electrodes and wiring but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.
本说明书中三角形、矩形、梯形、五边形或六边形等并非严格意义上的,可以是近似三角形、矩形、梯形、五边形或六边形等,可以存在公差导致的一些小变形,可以存在导角、弧边以及变形等。The triangle, rectangle, trapezoid, pentagon, or hexagon in this specification are not strictly defined, and may be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, etc., and there may be some small deformations caused by tolerances. There can be chamfers, arc edges, deformations, etc.
在本说明书中,“平行”是指两条直线形成的角度为-10°以上且10°以下的状态,因此,也包括该角度为-5°以上且5°以下的状态。另外,“垂直”是指两条直线形成的角度为80°以上且100°以下的状态,因此,也包括85°以上且95°以下的角度的状态。In the present specification, "parallel" refers to a state where the angle formed by two straight lines is -10° to 10°, and therefore includes a state where the angle is -5° to 5°. In addition, "perpendicular" means a state in which the angle formed by two straight lines is 80° to 100°, and therefore also includes an angle of 85° to 95°.
本公开中的“约”,是指不严格限定界限,允许工艺和测量误差范围内的数值。"About" in the present disclosure refers to a numerical value that is not strictly limited, and is within the range of process and measurement errors.
电容式On Cell类型的触控面板主要分为互容式(Mutual Capacitance)结构和自容式(Self Capacitance)结构,互容式结构是由第一触控电极和第二触控电极构成互电容,利用互电容的变化进行位置检测,自容式结构是由触控电极与人体构成自电容,利用自电容的变化进行位置检测。自容式触控面板为单层结构,具有功耗低和结构简单等特点,互容式触控面板为多层结构,具有多点触控等特点。Capacitive On Cell type touch panels are mainly divided into mutual capacitance (Mutual Capacitance) structure and self capacitance (Self Capacitance) structure. The mutual capacitance structure is composed of the first touch electrode and the second touch electrode to form mutual capacitance. , using the change of mutual capacitance for position detection, the self-capacitance structure is composed of the touch electrode and the human body to form self-capacitance, and the change of self-capacitance is used for position detection. The self-capacitive touch panel has a single-layer structure and has the characteristics of low power consumption and simple structure. The mutual-capacitance touch panel has a multi-layer structure and has the characteristics of multi-touch.
显示触控装置可以包括设置在基底上的显示面板和设置在所述显示面板上的触控面板。显示面板可以是液晶显示(Liquid Crystal Display,简称LCD)面板,或者可以是有机发光二极管(Organic Light Emitting Diode,简称OLED)显示面板,或者可以是等离子体(PDP)显示面板,或者可以是电泳显示(EPD)显示面板。在示例性实施方式中,显示面板可以是OLED显示面板。OLED为主动发光显示器件,具有自发光、广视角、高对比度、低耗电、极高反应速度等优点。随着显示技术的不断发展,以OLED为发光器件、由薄膜晶体管(Thin Film Transistor,简称TFT)进行信号控制的柔性显示装置(Flexible Display)已成为目前显示领域的主流产品。根据柔性折叠、窄边框等产品需 求,现有基于OLED的触控结构采用柔性多层覆盖表面式(Flexible Multi Layer On Cell,简称FMLOC)结构形式,显示结构和触控结构全部集成在基底上,触控面板设置在OLED背板的封装层上,形成覆盖表面式(On Cell)结构,具有轻薄、可折叠等优点,可以满足柔性折叠、窄边框等产品需求。The display touch device may include a display panel disposed on a base and a touch panel disposed on the display panel. The display panel may be a Liquid Crystal Display (LCD for short) panel, or an Organic Light Emitting Diode (OLED for short) display panel, or a plasma (PDP) display panel, or an electrophoretic display (EPD) display panel. In exemplary embodiments, the display panel may be an OLED display panel. OLED is an active light-emitting display device, which has the advantages of self-illumination, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, flexible display devices (Flexible Display), which use OLED as a light-emitting device and are signal-controlled by Thin Film Transistor (TFT for short), have become mainstream products in the display field. According to product requirements such as flexible folding and narrow frame, the existing OLED-based touch structure adopts the flexible multi-layer overlay surface type (FMLOC for short) structure, and the display structure and touch structure are all integrated on the substrate. The touch panel is set on the encapsulation layer of the OLED backplane to form an on-cell structure, which has the advantages of lightness, thinness and foldability, and can meet the needs of products such as flexible folding and narrow bezels.
图1为一种显示触控装置的平面结构示意图,触控面板设置在显示面板上,形成FMLOC结构形式。在平行于触控面板的平面内,触控面板可以包括有效区域(AA)100、位于有效区域100一侧的绑定区域200以及位于有效区域100其它侧的边缘区域300。对于叠设的显示面板和触控面板,有效区域既可以是触控面板的触控区域,或者可以是显示面板的显示区域,以下描述中的触控区域和显示区域均是指有效区域。在示例性实施方式中,有效区域100至少包括规则排布的多个触控电极,边缘区域300至少包括多条触控引线,绑定区域200至少包括将触控引线连接至外部控制装置的引脚。FIG. 1 is a schematic plan view of a display touch device. The touch panel is arranged on the display panel to form an FMLOC structure. In a plane parallel to the touch panel, the touch panel may include an active area (AA) 100 , a binding area 200 on one side of the active area 100 , and an edge area 300 on the other side of the active area 100 . For the stacked display panel and touch panel, the effective area can be either the touch area of the touch panel or the display area of the display panel. Both the touch area and the display area in the following description refer to the effective area. In an exemplary embodiment, the active area 100 includes at least a plurality of touch electrodes regularly arranged, the edge area 300 includes at least a plurality of touch leads, and the binding area 200 includes at least leads for connecting the touch leads to an external control device. foot.
在示例性实施方式中,触控面板可以为互容式结构。有效区域100可以包括多个第一触控单元110和多个第二触控单元120,第一触控单元110具有沿第一方向D1延伸的线形状,多个第一触控单元110沿第二方向D2依次排列,第二触控单元120具有沿第二方向D2延伸的线形状,多个第二触控单元120沿第一方向D1依次排列,第一方向D1与第二方向D2交叉。每个第一触控单元110可以包括沿第一方向D1依次排列的多个第一触控电极111和第一连接部112,第一触控电极111和第一连接部112交替设置且依次连接。每个第二触控单元120可以包括沿第二方向D2依次排列的多个第二触控电极121,多个第二触控电极121间隔设置,相邻的第二触控电极121通过第二连接部122彼此连接。在示例性实施方式中,第二连接部122所在的膜层不同于第一触控电极111和第二触控电极121所在的膜层。第一触控电极111和第二触控电极121在第三方向D3上交替布置,第三方向D3与第一方向D1和第二方向D2交叉。In exemplary embodiments, the touch panel may be a mutual capacitance structure. The active area 100 may include a plurality of first touch units 110 and a plurality of second touch units 120, the first touch units 110 have a line shape extending along the first direction D1, and the plurality of first touch units 110 extend along the first direction D1. The two directions D2 are arranged sequentially, the second touch units 120 have a line shape extending along the second direction D2, and the plurality of second touch units 120 are arranged sequentially along the first direction D1, and the first direction D1 intersects the second direction D2. Each first touch unit 110 may include a plurality of first touch electrodes 111 and first connecting parts 112 arranged in sequence along the first direction D1, the first touch electrodes 111 and the first connecting parts 112 are arranged alternately and connected in sequence . Each second touch unit 120 may include a plurality of second touch electrodes 121 arranged in sequence along the second direction D2, the plurality of second touch electrodes 121 are arranged at intervals, and adjacent second touch electrodes 121 pass through the second The connection parts 122 are connected to each other. In an exemplary embodiment, the film layer where the second connecting portion 122 is located is different from the film layer where the first touch electrode 111 and the second touch electrode 121 are located. The first touch electrodes 111 and the second touch electrodes 121 are alternately arranged in a third direction D3, and the third direction D3 intersects the first direction D1 and the second direction D2.
在示例性实施方式中,多个第一触控电极111、多个第二触控电极121和多个第一连接部112可以同层设置在触控层,并且可以通过同一次图案化工艺形成,第一触控电极111和第一连接部112可以为相互连接的一体结构。第二连接部122可以设置在桥接层,通过过孔使相邻的第二触控电极121相 互连接,触控层与桥接层之间设置有绝缘层。在一些可能的实现方式中,多个第一触控电极111、多个第二触控电极121和多个第二连接部122可以同层设置在触控层,第二触控电极121和第二连接部122可以为相互连接的一体结构,第一连接部112可以设置在桥接层,通过过孔使相邻的第一触控电极111相互连接。In an exemplary embodiment, a plurality of first touch electrodes 111, a plurality of second touch electrodes 121 and a plurality of first connecting parts 112 can be arranged on the touch layer in the same layer, and can be formed by the same patterning process. In other words, the first touch electrodes 111 and the first connecting portion 112 may be an integral structure connected to each other. The second connection part 122 may be disposed on the bridging layer to connect adjacent second touch electrodes 121 to each other through via holes, and an insulating layer is disposed between the touch layer and the bridging layer. In some possible implementation manners, multiple first touch electrodes 111, multiple second touch electrodes 121 and multiple second connecting parts 122 can be arranged on the same layer on the touch layer, and the second touch electrodes 121 and the second The two connecting parts 122 may be an integral structure connected to each other, and the first connecting part 112 may be disposed on a bridging layer to connect adjacent first touch electrodes 111 to each other through via holes.
在示例性实施方式中,第一触控电极可以是驱动(Tx)电极,第二触控电极可以是感应(Rx)电极。或者,第一触控电极可以是感应(Rx)电极,第二触控电极可以是驱动(Tx)电极。In exemplary embodiments, the first touch electrodes may be driving (Tx) electrodes, and the second touch electrodes may be sensing (Rx) electrodes. Alternatively, the first touch electrodes may be sensing (Rx) electrodes, and the second touch electrodes may be driving (Tx) electrodes.
在示例性实施方式中,第一触控电极和第二触控电极的形状可以包括如下任意一种或多种:三角形、正方形、矩形、菱形、平行四边形、梯形、五边形、六边形,本公开在此不做限定。In an exemplary embodiment, the shapes of the first touch electrodes and the second touch electrodes may include any one or more of the following: triangle, square, rectangle, rhombus, parallelogram, trapezoid, pentagon, hexagon , the present disclosure is not limited here.
在一示例性实施方式中,第一触控电极和第二触控电极可以是透明导电电极形式。在另一示例性实施方式中,第一触控电极和第二触控电极可以是金属网格形式,金属网格由多条金属线交织形成,金属网格包括多个网格图案,网格图案是由多条金属线构成的多边形。金属网格式的第一触控电极和第二触控电极具有电阻小、厚度小和反应速度快等优点。In an exemplary embodiment, the first touch electrodes and the second touch electrodes may be in the form of transparent conductive electrodes. In another exemplary embodiment, the first touch electrode and the second touch electrode may be in the form of a metal grid, the metal grid is formed by interweaving a plurality of metal wires, the metal grid includes a plurality of grid patterns, and the grid A pattern is a polygon formed by a plurality of metal lines. The first touch electrode and the second touch electrode in the form of a metal grid have the advantages of small resistance, small thickness, and fast response speed.
图2为一种显示触控装置中绑定区域的平面结构示意图。如图2所示,在示例性实施方式中,绑定区域200可以位于有效区域100的一侧,沿着远离有效区域100的方向(第二方向D2),绑定区域200可以包括依次设置的第一扇出区201、弯折区202、第二扇出区203、防静电区204、驱动芯片区205和绑定引脚区206。第一扇出区201可以设置多条触控引线和信号传输线,信号传输线可以至少包括第一电源线(VDD)、第二电源线(VSS)和多条数据传输线,多条数据传输线被配置为以扇出(Fanout)走线方式连接显示面板的数据线(Data Line),第一电源线VDD和第二电源线VSS配置为分别连接显示面板的高电平电源线和低电平电源线。弯折区202可以设置凹槽,凹槽配置为使第二扇出区203、防静电区204、驱动芯片区205和绑定引脚区206弯折到有效区域100的背面。第二扇出区203可以设置多条触控引线和以扇出走线方式引出的多条数据传输线。防静电区204可以设置防静电电路,防静电电路被配置为消除静电。驱动芯片区205可以设置源驱动电路(Driver IC),源驱动电路被配置为与第二扇出区203的多条数据传输线连接。绑定引脚区206可以至少设置多个引脚(可称为金手指),多个引脚被配置为与柔性印刷电路板(Flexible Printed Circuit board,简称FPC)绑定连接。FIG. 2 is a schematic plan view showing a binding area in a touch device. As shown in FIG. 2 , in an exemplary embodiment, the binding area 200 may be located on one side of the active area 100, and along the direction (second direction D2) away from the active area 100, the binding area 200 may include sequentially arranged The first fan-out area 201 , the bending area 202 , the second fan-out area 203 , the anti-static area 204 , the driving chip area 205 and the binding pin area 206 . The first fan-out area 201 can be provided with a plurality of touch leads and signal transmission lines, and the signal transmission lines can at least include a first power supply line (VDD), a second power supply line (VSS) and a plurality of data transmission lines, and the plurality of data transmission lines are configured as The data line (Data Line) of the display panel is connected in a fan-out (Fanout) manner, and the first power line VDD and the second power line VSS are configured to connect to the high-level power line and the low-level power line of the display panel respectively. The bending area 202 can be provided with grooves, and the grooves are configured to bend the second fan-out area 203 , the antistatic area 204 , the driver chip area 205 and the binding pin area 206 to the back of the active area 100 . The second fan-out area 203 can be provided with a plurality of touch leads and a plurality of data transmission lines led out in a fan-out manner. The anti-static area 204 may be provided with an anti-static circuit configured to eliminate static electricity. The driver chip area 205 can be provided with a source driver circuit (Driver IC), and the source driver circuit is configured to be connected to a plurality of data transmission lines in the second fan-out area 203. The binding pin area 206 may be provided with at least a plurality of pins (which may be referred to as gold fingers), and the plurality of pins are configured to be bound and connected to a flexible printed circuit board (Flexible Printed Circuit board, FPC for short).
图3为一种显示触控装置中边缘区域的平面结构示意图。如图3所示,在示例性实施方式中,除了绑定区域200所在的一侧,边缘区域300可以位于有效区域100的其它侧。在示例性实施方式中,以第一触控电极111是感应(Rx)电极、第二触控电极121是驱动(Tx)电极为例,边缘区域300中可以设置有多条感应引线31和多条驱动引线32。在示例性实施方式中,感应引线31的第一端与感应电极连接,感应引线31的第二端沿着边缘区域300延伸到绑定区域200的一侧,驱动引线32的第一端与驱动电极连接,驱动引线32的第二端延伸到绑定区域200的另一侧,感应引线31和驱动引线32一起组成触控引线。FIG. 3 is a schematic diagram showing a planar structure of an edge region in a touch device. As shown in FIG. 3 , in an exemplary embodiment, besides the side where the binding area 200 is located, the edge area 300 may be located on other sides of the active area 100 . In an exemplary embodiment, taking the first touch electrode 111 as a sensing (Rx) electrode and the second touch electrode 121 as a driving (Tx) electrode as an example, multiple sensing leads 31 and multiple drive leads 32. In an exemplary embodiment, the first end of the sensing lead 31 is connected to the sensing electrode, the second end of the sensing lead 31 extends to one side of the bonding area 200 along the edge region 300 , and the first end of the driving lead 32 is connected to the driving electrode. The electrodes are connected, the second end of the driving wire 32 extends to the other side of the bonding area 200 , and the sensing wire 31 and the driving wire 32 together form a touch wire.
图4为一种显示触控装置中有效区域的剖面结构示意图,示意了三个子像素的结构。如图4所示,在垂直于显示触控装置的平面上,触控面板可以设置在显示面板上。在示例性实施方式中,显示面板可以包括设置在基底101上的驱动电路层102、设置在驱动电路层102远离基底101一侧的发光结构层103以及设置在发光结构层103远离基底101一侧的封装结构层104。FIG. 4 is a schematic cross-sectional structure diagram of an active area in a display touch device, illustrating the structure of three sub-pixels. As shown in FIG. 4 , on a plane perpendicular to the display touch device, the touch panel can be disposed on the display panel. In an exemplary embodiment, the display panel may include a driving circuit layer 102 disposed on the base 101, a light emitting structure layer 103 disposed on the side of the driving circuit layer 102 away from the base 101, and a light emitting structure layer 103 disposed on a side away from the base 101. encapsulation structure layer 104 .
在示例性实施方式中,基底可以是柔性基底,或者可以是刚性基底。每个子像素的驱动电路层102可以包括构成像素驱动电路的多个晶体管和存储电容,图4中以每个像素驱动电路包括一个晶体管和一个存储电容为例进行示意。在示例性实施方式中,每个子像素的驱动电路层102可以包括:设置在基底上的第一绝缘层;设置在第一绝缘层上的有源层;覆盖有源层的第二绝缘层;设置在第二绝缘层上的栅电极和第一极板;覆盖栅电极和第一极板的第三绝缘层;设置在第三绝缘层上的第二极板;覆盖第二极板的第四绝缘层,第二绝缘层、第三绝缘层和第四绝缘层上开设有过孔,过孔暴露出有源层;设置在第四绝缘层上的源电极和漏电极,源电极和漏电极分别通过过孔与有源层连接;覆盖前述结构的平坦层,平坦层上开设有过孔,过孔暴露出漏电极。有源层、栅电极、源电极和漏电极组成驱动晶体管,第一极板和第二极板组成存储电容。In exemplary embodiments, the substrate may be a flexible substrate, or may be a rigid substrate. The driving circuit layer 102 of each sub-pixel may include a plurality of transistors and storage capacitors constituting a pixel driving circuit. In FIG. 4 , each pixel driving circuit includes a transistor and a storage capacitor as an example for illustration. In an exemplary embodiment, the driving circuit layer 102 of each sub-pixel may include: a first insulating layer disposed on the substrate; an active layer disposed on the first insulating layer; a second insulating layer covering the active layer; The gate electrode and the first pole plate arranged on the second insulating layer; the third insulating layer covering the gate electrode and the first pole plate; the second pole plate arranged on the third insulating layer; the first pole plate covering the second pole plate Four insulation layers, the second insulation layer, the third insulation layer and the fourth insulation layer are provided with via holes, the via holes expose the active layer; the source electrode and the drain electrode arranged on the fourth insulation layer, the source electrode and the drain electrode The poles are respectively connected to the active layer through via holes; the flat layer covering the aforementioned structure has via holes opened on the flat layer, and the drain electrodes are exposed through the via holes. The active layer, the gate electrode, the source electrode and the drain electrode form a drive transistor, and the first plate and the second plate form a storage capacitor.
在示例性实施方式中,发光结构层103可以包括阳极、像素定义层、有机发光层和阴极。阳极设置在平坦层上,通过平坦层上开设的过孔与驱动晶体管的漏电极连接;像素定义层设置在阳极和平坦层上,像素定义层上设置有像素开口,像素开口暴露出阳极,有机发光层通过像素开口与阳极连接,阴极与有机发光层连接。在示例性实施方式中,有机发光层可以包括发光层(EML),以及包括如下一个或多个膜层:空穴注入层(HIL)、空穴传输层(HTL)、空穴阻挡层(HBL)、电子阻挡层(EBL)、电子传输层(ETL)和电子注入层(EIL)。在阳极和阴极的电压驱动下,利用有机材料的发光特性根据需要的灰度发光。In exemplary embodiments, the light emitting structure layer 103 may include an anode, a pixel definition layer, an organic light emitting layer, and a cathode. The anode is arranged on the flat layer, and is connected to the drain electrode of the driving transistor through the via hole opened on the flat layer; the pixel definition layer is arranged on the anode and the flat layer, and a pixel opening is arranged on the pixel definition layer, and the pixel opening exposes the anode, organic The light-emitting layer is connected to the anode through the pixel opening, and the cathode is connected to the organic light-emitting layer. In an exemplary embodiment, the organic light-emitting layer may include an light-emitting layer (EML), and one or more of the following film layers: a hole injection layer (HIL), a hole transport layer (HTL), a hole blocking layer (HBL) ), electron blocking layer (EBL), electron transport layer (ETL) and electron injection layer (EIL). Driven by the voltage of the anode and the cathode, the luminescence characteristics of organic materials are used to emit light according to the required grayscale.
在示例性实施方式中,封装结构层104可以包括叠设的第一封装层、第二封装层和第三封装层,第一封装层和第三封装层可采用无机材料,第二封装层可采用有机材料,第二封装层设置在第一封装层和第三封装层之间,可以保证外界水汽无法进入发光结构层103。In an exemplary embodiment, the encapsulation structure layer 104 may include a stacked first encapsulation layer, a second encapsulation layer, and a third encapsulation layer, the first encapsulation layer and the third encapsulation layer may use inorganic materials, and the second encapsulation layer may Organic materials are used, and the second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer, which can ensure that external water vapor cannot enter the light emitting structure layer 103 .
在示例性实施方式中,在垂直于显示触控装置的平面上,触控面板可以包括设置在封装结构层104远离基底101一侧的缓冲(Buffer)层105,设置在缓冲层105远离基底101一侧的第一金属网格(1st Metal Mesh,简称TMA)层106,设置在第一金属网格层106远离基底101一侧的绝缘层107,设置在绝缘层107远离基底101一侧的第二金属网格(2st Metal Mesh,简称TMB)层108,设置在第二金属网格层108远离基底101一侧的保护层109。In an exemplary embodiment, on a plane perpendicular to the display touch device, the touch panel may include a buffer (Buffer) layer 105 disposed on the side of the encapsulation structure layer 104 away from the substrate 101, and disposed on the buffer layer 105 away from the substrate 101 The first metal grid (1st Metal Mesh, TMA for short) layer 106 on one side is arranged on the insulating layer 107 on the side of the first metal mesh layer 106 away from the base 101, and is arranged on the second insulating layer 107 on the side away from the base 101. The second metal mesh (2st Metal Mesh, TMB for short) layer 108 is disposed on the protective layer 109 on the side of the second metal mesh layer 108 away from the substrate 101.
在示例性实施方式中,缓冲层105和绝缘层107可以采用硅氧化物(SiOx)、硅氮化物(SiNx)和氮氧化硅(SiON)中的任意一种或多种,可以是单层、多层或复合层。第一金属网格层106和第二金属网格层108可以采用金属材料,如银(Ag)、铜(Cu)、铝(Al)、钛(Ti)和钼(Mo)中的任意一种或多种,或上述金属的合金材料,保护层109可以采用有机材料。In an exemplary embodiment, the buffer layer 105 and the insulating layer 107 can use any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, Multiple layers or composite layers. The first metal grid layer 106 and the second metal grid layer 108 can use metal materials, such as any one of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo) Or more than one, or alloy materials of the above metals, the protective layer 109 can be made of organic materials.
在示例性实施方式中,第一金属网格层106可以称为桥接层,第二金属网格层108可以称为触控层,多个第一触控电极、第二触控电极和第一连接部可以同层设置在触控层,第二连接部可以设置在桥接层,通过过孔使相邻的第二触控电极相互连接。In an exemplary embodiment, the first metal grid layer 106 may be called a bridging layer, the second metal grid layer 108 may be called a touch layer, and a plurality of first touch electrodes, second touch electrodes and first touch electrodes The connecting part can be arranged on the touch layer in the same layer, and the second connecting part can be arranged on the bridging layer to connect adjacent second touch electrodes to each other through via holes.
图5为一种柔性印刷电路板绑定连接的示意图,图6为一种柔性印刷电路板中主柔性板的平面结构示意图,图7为一种柔性印刷电路板中桥接柔性板的平面结构示意图。在示例性实施方式中,沿着平行于绑定区域边缘的方向(第一方向D1),绑定区域200可以划分为第一侧区域、中部区域和第二侧区域,绑定区域边缘是绑定区域邻近触控区域一侧的边缘。以下描述中所说的绑定区域左侧是指绑定区域的第一侧区域,绑定区域右侧是指绑定区域的第二侧区域,绑定区域中部是指绑定区域左侧与绑定区域右侧之间的中部区域。在示例性实施方式中,绑定区域200中的绑定引脚区206可以包括位于第一侧区域的第一引脚区、位于中部区域的中部引脚区和位于第二侧区域的第二引脚区,第一引脚区、中部引脚区和第二引脚区均包括多个引脚。Fig. 5 is a schematic diagram of a binding connection of a flexible printed circuit board, Fig. 6 is a schematic plan view of a main flexible board in a flexible printed circuit board, and Fig. 7 is a schematic plan view of a bridging flexible board in a flexible printed circuit board . In an exemplary embodiment, along a direction (first direction D1) parallel to the edge of the binding area, the binding area 200 can be divided into a first side area, a middle area, and a second side area, and the binding area edge is the binding area. The fixed area is adjacent to the edge of one side of the touch area. The left side of the binding area mentioned in the following description refers to the first side area of the binding area, the right side of the binding area refers to the second side area of the binding area, and the middle part of the binding area refers to the area on the left side of the binding area. The middle area between the right side of the binding area. In an exemplary embodiment, the binding pin area 206 in the binding area 200 may include a first pin area located in a first side area, a middle pin area located in a middle area, and a second pin area located in a second side area. The pin area, the first pin area, the middle pin area and the second pin area all include a plurality of pins.
在示例性实施方式中,多条感应引线31从边框区域引入到绑定区域左侧,在绑定区域左侧延伸到第一引脚区,并与第一引脚区的多个引脚对应连接。多条驱动引线32从边框区域引入到绑定区域右侧,在绑定区域右侧延伸到第二引脚区,并与第二引脚区的多个引脚对应连接。多条显示引线33从位于绑定区域中部的源驱动电路D-IC引入到中部引脚区,并与中部引脚区的多个引脚对应连接。In an exemplary embodiment, a plurality of sensing leads 31 are introduced from the frame area to the left side of the binding area, extend to the first pin area on the left side of the binding area, and correspond to multiple pins in the first pin area connect. A plurality of driving leads 32 are introduced from the frame area to the right side of the binding area, extend to the second pin area on the right side of the binding area, and are correspondingly connected to a plurality of pins in the second pin area. A plurality of display leads 33 are introduced from the source driver circuit D-IC located in the middle of the bonding area to the middle pin area, and are correspondingly connected to multiple pins in the middle pin area.
如图5至图7所示,在示例性实施方式中,柔性印刷电路板40可以包括主柔性板10和桥接柔性板20,主柔性板10上可以设置主焊盘,桥接柔性板20上可以设置桥接焊盘,桥接焊盘可以通过熔融态锡膏焊接在主焊盘上,形成双层桥接式柔性印刷电路板。As shown in FIGS. 5 to 7 , in an exemplary embodiment, the flexible printed circuit board 40 may include a main flexible board 10 and a bridging flexible board 20 , a main pad may be arranged on the main flexible board 10 , and a bridging flexible board 20 may be A bridge pad is provided, and the bridge pad can be welded on the main pad by molten solder paste to form a double-layer bridge type flexible printed circuit board.
在示例性实施方式中,柔性印刷电路板40的主柔性板10可以位于绑定区域200远离有效区域100的一侧,沿着远离有效区域100的(第二方向D2)方向,主柔性板10可以包括依次设置的端子区401、电路区402和连接区403。In an exemplary embodiment, the main flexible board 10 of the flexible printed circuit board 40 may be located on the side of the binding area 200 away from the active area 100, along the direction (second direction D2) away from the active area 100, the main flexible board 10 It may include a terminal area 401 , a circuit area 402 and a connection area 403 arranged in sequence.
在示例性实施方式中,端子区401可以包括多个端子,多个端子与绑定引脚区的多个引脚对应绑定连接。端子区401中的多个端子可以沿着第一方向D1规则排布,端子区401可以划分为第一端子区、中部端子区和第二端子区。第一端子区的位置与绑定区域的第一引脚区的位置相对应,第一端子区的多个端子与第一引脚区的多个引脚对应连接。中部端子区的位置与绑定区域的中部引脚区的位置相对应,中部端子区的多个端子与中部区域的多个 引脚对应连接。第二端子区的位置与绑定区域的第二引脚区的位置相对应,第二端子区的多个端子与第二引脚区的多个引脚对应连接。In an exemplary embodiment, the terminal area 401 may include a plurality of terminals, and the plurality of terminals are correspondingly bound and connected to the plurality of pins in the binding pin area. Multiple terminals in the terminal area 401 can be regularly arranged along the first direction D1, and the terminal area 401 can be divided into a first terminal area, a middle terminal area and a second terminal area. The position of the first terminal area corresponds to the position of the first pin area of the binding area, and the multiple terminals in the first terminal area are correspondingly connected to the multiple pins in the first pin area. The position of the central terminal area corresponds to the position of the central pin area of the binding area, and multiple terminals in the central terminal area are correspondingly connected to multiple pins in the central area. The position of the second terminal area corresponds to the position of the second pin area of the binding area, and the multiple terminals of the second terminal area are correspondingly connected to the multiple pins of the second pin area.
在示例性实施方式中,电路区402可以至少包括第一主焊盘11、第二主焊盘12、触控驱动电路(Touch IC)50、辅助器件60、多条感应信号线41、多条第一驱动信号线51、多条第二驱动信号线52和多条显示信号线61。沿着第一方向D1,触控驱动电路50可以位于电路区402的左侧,辅助器件60可以位于电路区402的右侧,第一主焊盘11和第二主焊盘12可以位于辅助器件60远离端子区401的一侧。在示例性实施方式中,第一主焊盘11和第二主焊盘12被配置为与桥接柔性板20上的桥接焊盘连接,触控驱动电路50被配置为与多条感应信号线41和多条第二驱动信号线52连接,辅助器件60被配置为与多条显示信号线61连接。In an exemplary embodiment, the circuit area 402 may at least include a first main pad 11, a second main pad 12, a touch driving circuit (Touch IC) 50, an auxiliary device 60, a plurality of sensing signal lines 41, a plurality of A first driving signal line 51 , a plurality of second driving signal lines 52 and a plurality of display signal lines 61 . Along the first direction D1, the touch drive circuit 50 can be located on the left side of the circuit area 402, the auxiliary device 60 can be located on the right side of the circuit area 402, and the first main pad 11 and the second main pad 12 can be located on the auxiliary device 60 away from the side of the terminal area 401 . In an exemplary embodiment, the first main pad 11 and the second main pad 12 are configured to be connected to the bridging pads on the bridging flexible board 20 , and the touch driving circuit 50 is configured to be connected to a plurality of sensing signal lines 41 Connected to a plurality of second driving signal lines 52 , the auxiliary device 60 is configured to be connected to a plurality of display signal lines 61 .
在示例性实施方式中,连接区403可以至少包括连接器(Connector)70和多条显示信号线61,连接器70被配置为与多条显示信号线61连接。沿着第一方向D1,连接区403的宽度可以小于电路区402的宽度,且连接区403可以位于电路区402的右侧。在示例性实施方式中,连接器70可以位于连接区403远离电路区402一侧的端部。在示例性实施方式中,连接器可以作为外连接口,连接器可以采用板对板(Board-to-board,简称BTB)连接器。In an exemplary embodiment, the connection area 403 may at least include a connector (Connector) 70 and a plurality of display signal lines 61 , and the connector 70 is configured to be connected to the plurality of display signal lines 61 . Along the first direction D1 , the width of the connection region 403 may be smaller than the width of the circuit region 402 , and the connection region 403 may be located on the right side of the circuit region 402 . In an exemplary embodiment, the connector 70 may be located at an end of the connection area 403 away from the circuit area 402 . In an exemplary embodiment, the connector may serve as an external connection port, and the connector may be a board-to-board (Board-to-board, BTB for short) connector.
在示例性实施方式中,多条感应信号线41的第一端与第一端子区的多个端子对应连接,通过第一端子区的多个端子和第一引脚区的多个引脚与绑定区域左侧的多条感应引线31对应连接。多条感应信号线41的第二端延伸到触控驱动电路50,与触控驱动电路50连接,因而实现了触控驱动电路50与绑定区域的多条感应引线31连接,使触控驱动电路50可以向多条感应引线31提供触控感应信号。由于第一端子区和触控驱动电路50均位于电路区402的左侧,因而多条感应信号线41可以直接连接触控驱动电路50。In an exemplary embodiment, the first ends of the plurality of sensing signal lines 41 are correspondingly connected to the plurality of terminals in the first terminal area, through the plurality of terminals in the first terminal area and the plurality of pins in the first pin area and A plurality of induction leads 31 on the left side of the binding area are correspondingly connected. The second ends of the plurality of sensing signal lines 41 extend to the touch driving circuit 50 and are connected to the touch driving circuit 50, thereby realizing the connection between the touch driving circuit 50 and the plurality of sensing leads 31 in the binding area, so that the touch driving The circuit 50 can provide touch sensing signals to the plurality of sensing leads 31 . Since the first terminal area and the touch driving circuit 50 are located on the left side of the circuit area 402 , the plurality of sensing signal lines 41 can be directly connected to the touch driving circuit 50 .
在示例性实施方式中,第一主焊盘11可以包括多个第一焊点,第二主焊盘12可以包括多个第二焊点。多条第一驱动信号线51的第一端与第二端子区的多个端子对应连接,通过第二端子区的多个端子和第二引脚区的多个引脚与绑定区域的多条驱动引线32对应连接。多条第一驱动信号线51的第二端延伸到第一主焊盘11,与第一主焊盘11上的多个第一焊点对应连接。多 条第二驱动信号线52的第一端与触控驱动电路50连接,多条第二驱动信号线52的的第二端延伸到第二主焊盘12,与第二主焊盘12上的多个第二焊点对应连接。In an exemplary embodiment, the first main pad 11 may include a plurality of first pads, and the second main pad 12 may include a plurality of second pads. The first ends of the plurality of first drive signal lines 51 are correspondingly connected to the plurality of terminals in the second terminal area, through the plurality of terminals in the second terminal area and the plurality of pins in the second pin area and the plurality of binding areas. The driving leads 32 are correspondingly connected. The second ends of the plurality of first driving signal lines 51 extend to the first main pad 11 and are correspondingly connected to the plurality of first pads on the first main pad 11 . The first ends of the plurality of second driving signal lines 52 are connected to the touch driving circuit 50, the second ends of the plurality of second driving signal lines 52 extend to the second main pad 12, and are connected to the second main pad 12. The plurality of second solder joints are correspondingly connected.
在示例性实施方式中,由于第二端子区位于电路区402的右侧,触控驱动电路50位于电路区402的左侧,因而第一驱动信号线51和第二驱动信号线52需要利用桥接柔性板20相互连接,从电路区402的右侧延伸到电路区402的左侧并跨过多条显示信号线61,实现触控驱动电路50与绑定区域的多条驱动引线32连接,使触控驱动电路50向多条驱动引线32提供触控驱动信号。In an exemplary embodiment, since the second terminal area is located on the right side of the circuit area 402, and the touch driving circuit 50 is located on the left side of the circuit area 402, the first driving signal line 51 and the second driving signal line 52 need to use a bridge The flexible boards 20 are connected to each other, extend from the right side of the circuit area 402 to the left side of the circuit area 402 and cross a plurality of display signal lines 61, so as to realize the connection between the touch driving circuit 50 and the plurality of driving leads 32 in the binding area, so that The touch driving circuit 50 provides touch driving signals to the plurality of driving wires 32 .
在示例性实施方式中,多条显示信号线61的第一端与中部端子区的多个端子对应连接,通过中部端子区的多个端子和中部引脚区的多个引脚与绑定区域的多条显示引线33对应连接。一部分显示信号线61的第二端从电路区402直接延伸到连接区403,与位于连接区中的连接器70连接,另一部分显示信号线61的第二端通过辅助器件60与连接区中的连接器70连接,因而实现了连接器70与绑定区域的多条显示引线33连接,使外部控制装置通过连接器70向多条显示引线33提供显示信号。In an exemplary embodiment, the first ends of the plurality of display signal lines 61 are correspondingly connected to the plurality of terminals in the middle terminal area, and pass through the plurality of terminals in the middle terminal area and the plurality of pins in the middle pin area and the binding area A plurality of display leads 33 are correspondingly connected. A part shows that the second end of the signal line 61 extends directly from the circuit area 402 to the connection area 403, and is connected with the connector 70 located in the connection area; The connector 70 is connected, thus realizing the connection between the connector 70 and the plurality of display leads 33 in the binding area, so that the external control device provides display signals to the plurality of display leads 33 through the connector 70 .
在示例性实施方式中,桥接柔性板20被配置为与主柔性板10上的第一主焊盘11和第二主焊盘12连接。桥接柔性板20可以至少包括第一桥接焊盘21、第二桥接焊盘22和多条连接线81,第一桥接焊盘21可以包括多个第三焊点,第二桥接焊盘22可以包括多个第四焊点,多条连接线81的第一端可以对应连接第一桥接焊盘21的多个第三焊点,多条连接线81的第二端可以对应连接第二桥接焊盘22的多个第四焊点,实现多个第三焊点和多个第四焊点通过多条连接线81对应连接。In an exemplary embodiment, the bridging flexible board 20 is configured to be connected with the first main pad 11 and the second main pad 12 on the main flexible board 10 . The bridging flexible board 20 may at least include a first bridging pad 21, a second bridging pad 22 and a plurality of connection lines 81, the first bridging pad 21 may include a plurality of third soldering points, and the second bridging pad 22 may include A plurality of fourth welding points, the first ends of the plurality of connection lines 81 may correspond to the plurality of third welding points connected to the first bridge pads 21, and the second ends of the plurality of connection lines 81 may be correspondingly connected to the second bridge pads 22, realize the corresponding connection of the multiple third welding points and the multiple fourth welding points through the multiple connection lines 81.
在示例性实施方式中,第一桥接焊盘21的多个第三焊点与第一主焊盘11的多个第一焊点通过熔融态锡膏对应焊接,第二桥接焊盘22的多个第四焊点与第二主焊盘11的多个第二焊点通过熔融态锡膏对应焊接,使得主柔性板10上的多条第一驱动信号线51和多条第二驱动信号线52通过桥接柔性板20对应连接。In an exemplary embodiment, the plurality of third solder joints of the first bridge pad 21 and the multiple first solder joints of the first main pad 11 are correspondingly welded by molten solder paste, and the multiple solder joints of the second bridge pad 22 A fourth solder joint and a plurality of second solder joints of the second main pad 11 are correspondingly welded by molten solder paste, so that a plurality of first drive signal lines 51 and a plurality of second drive signal lines on the main flexible board 10 52 are correspondingly connected by bridging the flexible board 20 .
研究发现,现有柔性线路板存在连接不良等问题,主要原因之一是因焊 盘虚焊或少锡等造成焊点空焊(Open NG)导致的。进一步研究发现,空焊的主要原因之一是柔性电路板上主焊盘和桥接焊盘所在区域变形,导致焊点出现上凸和下凹两种形态,从而使主焊盘和桥接焊盘上各焊点之间距离不同,部分锡膏焊接处断开,导致空焊。The study found that the existing flexible circuit boards have problems such as poor connection, one of the main reasons is that the solder joints are empty (Open NG) caused by solder joints or lack of tin. Further research found that one of the main reasons for empty soldering is the deformation of the area where the main pad and bridge pad are located on the flexible circuit board, resulting in two forms of solder joints, convex and concave, so that the main pad and bridge pad are deformed. The distance between the solder joints is different, and some solder paste solder joints are disconnected, resulting in empty soldering.
本公开提供了一种柔性印刷电路板。柔性印刷电路板可以包括主柔性板和桥接柔性板,所述主柔性板至少包括第一主焊盘、第二主焊盘、至少一条第一信号线和至少一条第二信号线,所述桥接柔性板至少包括第一桥接焊盘、第二桥接焊盘和至少一条连接线。所述第一主焊盘包括至少二个第一焊点,所述第二主焊盘包括至少二个第二焊点,所述第一信号线与一个第一焊点连接,所述第二信号线与一个第二焊点连接。所述第一桥接焊盘包括至少二个第三焊点,所述第二桥接焊盘包括至少二个第四焊点,所述连接线的第一端与一个第三焊点连接,所述连接线的第二端与一个第四焊点连接。所述第一焊点与所述第三焊点通过焊锡连接,所述第二焊点与所述第四焊点通过焊锡连接。所述柔性印刷电路板还包括第一辅助线、第二辅助线、第三辅助线和第四辅助线中的任意一条或多条;所述第一辅助线的第一端与所述第一信号线连接,所述第一辅助线的第二端与另一个第一焊点连接;所述第二辅助线的第一端与所述第二信号线连接,所述第二辅助线的第二端与另一个第二焊点连接;所述第三辅助线的第一端与所述连接线连接,所述第三辅助线的第二端与另一个第三焊点连接;所述第四辅助线的第一端与所述连接线连接,所述第四辅助线的第二端与另一个第四焊点连接。,The present disclosure provides a flexible printed circuit board. The flexible printed circuit board may include a main flexible board and a bridge flexible board, the main flexible board includes at least a first main pad, a second main pad, at least one first signal line and at least one second signal line, the bridging The flexible board at least includes a first bridge pad, a second bridge pad and at least one connection line. The first main pad includes at least two first pads, the second main pad includes at least two second pads, the first signal line is connected to one first pad, and the second The signal line is connected with a second soldering point. The first bridging pad includes at least two third pads, the second bridging pad includes at least two fourth pads, the first end of the connection line is connected to a third pad, the The second end of the connecting wire is connected with a fourth welding point. The first soldering point is connected to the third soldering point through soldering, and the second soldering point is connected to the fourth soldering point through soldering. The flexible printed circuit board further includes any one or more of the first auxiliary line, the second auxiliary line, the third auxiliary line and the fourth auxiliary line; the first end of the first auxiliary line is connected to the first auxiliary line connected to the signal line, the second end of the first auxiliary line is connected to another first solder point; the first end of the second auxiliary line is connected to the second signal line, and the first end of the second auxiliary line The two ends are connected to another second welding point; the first end of the third auxiliary line is connected to the connecting line, and the second end of the third auxiliary line is connected to another third welding point; the first end of the third auxiliary line is connected to the other third welding point; The first ends of the four auxiliary wires are connected to the connection wires, and the second ends of the fourth auxiliary wires are connected to another fourth welding point. ,
在示例性实施方式中,所述主柔性板包括触控驱动电路和至少一个端子,所述第一信号线的第一端与所述端子连接,所述第一信号线的第二端与所述第一主焊盘的第一焊点连接,所述第二信号线的第一端与所述触控驱动电路连接,所述第二信号线的第二端与所述第二主焊盘的第二焊点连接。In an exemplary embodiment, the main flexible board includes a touch driving circuit and at least one terminal, the first end of the first signal line is connected to the terminal, and the second end of the first signal line is connected to the terminal. The first pad of the first main pad is connected, the first end of the second signal line is connected to the touch drive circuit, the second end of the second signal line is connected to the second main pad The second solder joint connection.
在示例性实施方式中,所述桥接柔性板包括连接线区、第一焊盘区和第二焊盘区,所述连接线区设置在所述第一焊盘区和第二焊盘区之间;所述连接线设置在所述连接线区,所述第一桥接焊盘设置在所述第一焊盘区,所述第二桥接焊盘设置在所述第二焊盘区;所述第三辅助线与所述连接线连接的第一连接点位于所述连接线区,和/或,所述第四辅助线与所述连接线连接的 第二连接点位于所述连接线区。In an exemplary embodiment, the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between; the connecting line is set in the connecting line area, the first bridge pad is set in the first pad area, and the second bridge pad is set in the second pad area; the A first connection point where the third auxiliary line is connected to the connection line is located in the connection line area, and/or a second connection point where the fourth auxiliary line is connected to the connection line is located in the connection line area.
在示例性实施方式中,所述桥接柔性板包括连接线区、第一焊盘区和第二焊盘区,所述连接线区设置在所述第一焊盘区和第二焊盘区之间,所述连接线设置在所述连接线区;所述第一焊盘区包括第一焊点区和第一点胶区,所述第一焊点区设置所述第一桥接焊盘,所述第一点胶区设置在所述第一焊点区的外围;所述第二焊盘区包括第二焊点区和第二点胶区,所述第二焊点区设置所述第二桥接焊盘,所述第二点胶区设置在所述第二焊点区的外围;所述第三辅助线与所述连接线连接的第一连接点位于所述第一点胶区,和/或,所述第四辅助线与所述连接线连接的第二连接点位于所述第二点胶区。In an exemplary embodiment, the bridging flexible board includes a connection line area, a first pad area, and a second pad area, and the connection line area is disposed between the first pad area and the second pad area Between, the connection line is arranged in the connection line area; the first pad area includes a first pad area and a first dispensing area, and the first pad area is provided with the first bridging pad, The first dispensing area is arranged on the periphery of the first welding spot area; the second pad area includes a second welding spot area and a second dispensing area, and the second welding spot area is provided with the first welding spot area. Two bridging pads, the second dispensing area is arranged on the periphery of the second welding point area; the first connection point where the third auxiliary line is connected to the connection line is located in the first dispensing area, And/or, the second connection point where the fourth auxiliary line is connected to the connecting line is located in the second dispensing area.
在示例性实施方式中,相邻的第一焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第二焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第三焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第四焊点之间的中心距为1.05mm至1.25mm。In an exemplary embodiment, the center-to-center distance between adjacent first welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent second welding points is 1.05 mm to 1.25 mm; and /or, the center-to-center distance between adjacent third welding points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent fourth welding points is 1.05 mm to 1.25 mm.
在示例性实施方式中,所述第一桥接焊盘还包括至少一个通孔,所述通孔设置在所述相邻的第三焊点之间;和/或,所述第二桥接焊盘还包括至少一个通孔,所述通孔设置在所述相邻的第四焊点之间。In an exemplary embodiment, the first bridging pad further includes at least one through hole disposed between the adjacent third pads; and/or, the second bridging pad It also includes at least one through hole, the through hole is arranged between the adjacent fourth welding points.
在示例性实施方式中,所述通孔的尺寸小于或等于0.1mm,所述通孔的尺寸是指通孔边缘上任意两点之间距离的最大值。In an exemplary embodiment, the size of the through hole is less than or equal to 0.1 mm, and the size of the through hole refers to the maximum value of the distance between any two points on the edge of the through hole.
在示例性实施方式中,所述通孔与相邻第三焊点之间的中心距为0.55mm至0.65mm;和/或,所述通孔与相邻第四焊点之间的中心距为0.55mm至0.65mm。In an exemplary embodiment, the center distance between the through hole and the adjacent third welding spot is 0.55mm to 0.65mm; and/or, the center distance between the through hole and the adjacent fourth welding spot 0.55mm to 0.65mm.
在示例性实施方式中,在垂直于柔性印刷电路板的平面内,所述桥接柔性板设置在所述主柔性板上,所述桥接柔性板包括设置在所述主柔性板上的第一桥接绿油层、设置在所述第一桥接绿油层远离所述主柔性板一侧的第一桥接导电层、设置在所述第一桥接导电层远离所述主柔性板一侧的桥接基材层、设置在所述桥接基材层远离所述主柔性板一侧的第二桥接导电层以及设置在所述第二桥接导电层远离所述主柔性板一侧的第二桥接绿油层;所述第一桥接导电层仅设置在所述桥接柔性板的连接线区。In an exemplary embodiment, in a plane perpendicular to the flexible printed circuit board, the bridging flexible board is disposed on the main flexible board, and the bridging flexible board includes a first bridging flexible board disposed on the main flexible board The green oil layer, the first bridging conductive layer arranged on the side of the first bridging green oil layer away from the main flexible board, the bridging substrate layer arranged on the side of the first bridging conductive layer away from the main flexible board, The second bridging conductive layer arranged on the side of the bridging base material layer away from the main flexible board and the second bridging green oil layer arranged on the side of the second bridging conductive layer away from the main flexible board; A bridging conductive layer is only provided in the connecting line area of the bridging flexible board.
在示例性实施方式中,所述第三焊点靠近所述连接线区一侧的边缘与所述连接线区中所述第一桥接导电层靠近所述第三焊点一侧的边缘之间的距离大于或等于1.0mm,和/或,所述第四焊点靠近所述连接线区一侧的边缘与所述连接线区中所述第一桥接导电层靠近所述第四焊点一侧的边缘之间的距离大于或等于1.0mm。In an exemplary embodiment, between the edge of the third solder joint close to the connecting line area and the edge of the first bridging conductive layer in the connecting line area close to the third solder joint The distance is greater than or equal to 1.0mm, and/or, the edge of the fourth solder joint near the connection line area is the same as the first bridging conductive layer in the connection line area close to the fourth solder joint The distance between the edges of the sides is greater than or equal to 1.0 mm.
在示例性实施方式中,所述主柔性板包括屏蔽层、设置在所述屏蔽层上的覆盖层、设置在所述覆盖层远离所述屏蔽层一侧的第一主导电层、设置在所述第一主导电层远离所述屏蔽层一侧的主基材层、设置在所述主基材层远离所述屏蔽层一侧的第二主导电层以及设置在所述第二主导电层远离所述屏蔽层一侧的主绿油层;所述桥接柔性板的第一桥接绿油层与所述主绿油层直接接触。In an exemplary embodiment, the main flexible board includes a shielding layer, a cover layer disposed on the shielding layer, a first main conductive layer disposed on the side of the covering layer away from the shielding layer, a first main conductive layer disposed on the shielding layer, The first main conductive layer is away from the main substrate layer on the side of the shielding layer, the second main conductive layer is arranged on the side of the main substrate layer away from the shielding layer, and the second main conductive layer is arranged on the side of the second main conductive layer. The main green oil layer on the side away from the shielding layer; the first bridging green oil layer of the bridging flexible board is in direct contact with the main green oil layer.
图8为本公开示例性实施例柔性印刷电路板中一种主柔性板的平面结构示意图。在示例性实施方式中,主柔性板可以至少包括第一主焊盘11、第二主焊盘12、触控驱动电路50、辅助器件60、多个端子、多条感应信号线41、多条第一驱动信号线51、多条第二驱动信号线52和多条显示信号线61。FIG. 8 is a schematic plan view of a main flexible board in the flexible printed circuit board of an exemplary embodiment of the present disclosure. In an exemplary embodiment, the main flexible board may at least include a first main pad 11, a second main pad 12, a touch driving circuit 50, an auxiliary device 60, a plurality of terminals, a plurality of sensing signal lines 41, a plurality of A first driving signal line 51 , a plurality of second driving signal lines 52 and a plurality of display signal lines 61 .
在示例性实施方式中,多个端子可以沿着第一方向D1规则排布,多个端子被配置为与绑定区域的多个引脚对应连接。第一主焊盘11可以包括多个第一焊点,多个第一焊点被配置为与多条第一驱动信号线51对应连接。第二主焊盘12可以包括多个第二焊点,多个第二焊点被配置为与多条第二驱动信号线52对应连接。在示例性实施方式中,第一驱动信号线51可以作为本公开的第一信号线,第二驱动信号线52可以作为本公开的第二信号线。In an exemplary embodiment, a plurality of terminals may be regularly arranged along the first direction D1, and the plurality of terminals are configured to be correspondingly connected to a plurality of pins in the binding area. The first main pad 11 may include a plurality of first pads configured to be correspondingly connected to a plurality of first driving signal lines 51 . The second main pad 12 may include a plurality of second pads configured to be correspondingly connected to a plurality of second driving signal lines 52 . In an exemplary embodiment, the first driving signal line 51 may serve as a first signal line of the present disclosure, and the second driving signal line 52 may serve as a second signal line of the present disclosure.
在示例性实施方式中,多条显示信号线61的第一端与多个端子对应连接,多条显示信号线61的第二端与连接器(未示出)连接。在示例性实施方式中,显示信号线61可以与连接器直接连接,或者可以通过辅助器件60与连接器连接,本公开在此不做限定。In an exemplary embodiment, the first ends of the plurality of display signal lines 61 are correspondingly connected to a plurality of terminals, and the second ends of the plurality of display signal lines 61 are connected to a connector (not shown). In an exemplary embodiment, the display signal line 61 may be directly connected to the connector, or may be connected to the connector through the auxiliary device 60 , which is not limited in this disclosure.
在示例性实施方式中,主柔性板可以不设置有辅助器件,本公开在此不做限定。In an exemplary embodiment, the main flexible board may not be provided with auxiliary devices, and the disclosure is not limited herein.
在示例性实施方式中,多条感应信号线41的第一端与多个端子对应连接, 多条感应信号线41的第二端延伸到触控驱动电路50,与触控驱动电路50连接。In an exemplary embodiment, the first ends of the plurality of sensing signal lines 41 are correspondingly connected to a plurality of terminals, and the second ends of the plurality of sensing signal lines 41 extend to the touch driving circuit 50 and are connected to the touch driving circuit 50 .
在示例性实施方式中,多条第一驱动信号线51的第一端与多个端子对应连接,多条第一驱动信号线51的第二端延伸到第一主焊盘11,与第一主焊盘11上的多个第一焊点对应连接。多条第二驱动信号线52的第一端与触控驱动电路50连接,多条第二驱动信号线52的第二端延伸到第二主焊盘12,与第二主焊盘12上的多个第二焊点对应连接。In an exemplary embodiment, the first ends of the plurality of first driving signal lines 51 are correspondingly connected to a plurality of terminals, the second ends of the plurality of first driving signal lines 51 extend to the first main pad 11, and are connected to the first A plurality of first pads on the main pad 11 are correspondingly connected. The first ends of the plurality of second driving signal lines 52 are connected to the touch driving circuit 50, the second ends of the plurality of second driving signal lines 52 extend to the second main pad 12, and are connected to the second main pad 12. The plurality of second solder joints are correspondingly connected.
在示例性实施方式中,第一主焊盘11上的多个第一焊点与第二主焊盘12上的多个第二焊点通过桥接柔性板对应连接,实现多条第一驱动信号线51和第二驱动信号线52对应连接,且跨过多条显示信号线61。In an exemplary embodiment, a plurality of first pads on the first main pad 11 are correspondingly connected to a plurality of second pads on the second main pad 12 through a bridging flexible board to realize multiple first drive signals The line 51 is correspondingly connected to the second driving signal line 52 and straddles a plurality of display signal lines 61 .
图9a为本公开示例性一种焊盘中多个焊点的排布示意图。如图9a所示,在示例性实施方式中,焊盘可以包括25个焊点,25个焊点可以按照7行7列的方式排布形成焊点阵列。第1行、第3行、第5行和第7行均包括沿着第一方向D1依次设置的4个焊点,第2行、第4行和第6行均包括沿着第一方向D1依次设置的3个焊点,相邻两行的焊点交错设置。第1列、第3列、第5列和第7列均包括沿着第二方向D2依次设置的4个焊点,第2列、第4列和第6列均包括沿着第二方向D2依次设置的3个焊点,相邻两列的焊点交错设置。Fig. 9a is a schematic diagram of the arrangement of multiple welding points in an exemplary pad of the present disclosure. As shown in FIG. 9 a , in an exemplary embodiment, the pad may include 25 solder points, and the 25 solder points may be arranged in a manner of 7 rows and 7 columns to form a solder point array. Row 1, Row 3, Row 5, and Row 7 all include four solder joints arranged in sequence along the first direction D1, and Row 2, Row 4, and Row 6 include four solder joints along the first direction D1. The three solder joints are arranged in sequence, and the solder joints in two adjacent rows are arranged alternately. The first column, the third column, the fifth column and the seventh column all include four solder joints arranged in sequence along the second direction D2, and the second column, the fourth column and the sixth column all include four welding points along the second direction D2 Three solder points are arranged in sequence, and the solder points in two adjacent columns are arranged alternately.
在示例性实施方式中,位于焊点阵列内侧的焊点可以称为功能性焊点,位于焊点阵列外侧的焊点可以称为非功能性焊点。例如,功能性焊点可以包括:焊点2-2、焊点2-4、焊点2-6、焊点3-3、焊点3-5、焊点4-2、焊点4-4、焊点4-6、焊点5-3、焊点5-5、焊点6-2、焊点6-4和焊点6-6。又如,非功能性焊点可以包括:焊点1-1、焊点1-3、焊点1-5、焊点1-7、焊点3-1、焊点3-7、焊点5-1、焊点5-7、焊点7-1、焊点7-3、焊点7-5和焊点7-7。In an exemplary embodiment, the solder joints located inside the solder joint array may be referred to as functional solder joints, and the solder joints located outside the solder joint array may be referred to as non-functional solder joints. For example, functional solder joints may include: solder joints 2-2, solder joints 2-4, solder joints 2-6, solder joints 3-3, solder joints 3-5, solder joints 4-2, solder joints 4-4 , solder joint 4-6, solder joint 5-3, solder joint 5-5, solder joint 6-2, solder joint 6-4 and solder joint 6-6. As another example, the non-functional solder joints may include: solder joints 1-1, solder joints 1-3, solder joints 1-5, solder joints 1-7, solder joints 3-1, solder joints 3-7, and solder joints 5 -1, solder joint 5-7, solder joint 7-1, solder joint 7-3, solder joint 7-5 and solder joint 7-7.
图9b为本公开示例性另一种焊盘中多个焊点的排布示意图。如图9b所示,焊盘可以包括25个焊点,25个焊点可以按照7行7列的方式排布形成焊点阵列,焊盘的焊点数量和焊点阵列与图9a所示焊盘基本上相近,所不同的是,图9b中25个焊点的位置与图9a中25个焊点的位置相对于第二方向D2镜像对称。Fig. 9b is a schematic diagram of the arrangement of multiple solder joints in another exemplary solder pad of the present disclosure. As shown in Figure 9b, the pad can include 25 solder joints, and the 25 solder joints can be arranged in 7 rows and 7 columns to form a solder joint array. The number of solder joints and the solder joint array of the pad are the same as those shown in Figure 9a The discs are basically similar, the difference is that the positions of the 25 welding points in FIG. 9b are mirror-symmetrical to the positions of the 25 welding points in FIG. 9a with respect to the second direction D2.
在示例性实施方式中,焊点的形状可以为圆形、正方形、矩形或者多边形等,焊点的尺寸可以小于或等于0.5mm,焊点的尺寸是指焊点的边缘上任意两点之间的距离的最大值。例如,焊点的形状为圆形时,焊点的直径可以约为0.25mm、0.3mm、0.35等。In an exemplary embodiment, the shape of the solder joints can be circular, square, rectangular or polygonal, etc., and the size of the solder joints can be less than or equal to 0.5mm. The size of the solder joints refers to the distance between any two points on the edge of the solder joints. The maximum distance of . For example, when the shape of the solder joint is circular, the diameter of the solder joint may be about 0.25 mm, 0.3 mm, 0.35 mm, and so on.
在示例性实施方式中,在第一方向D1相邻的两个焊点之间的第一中心距L1可以约为1.05mm至1.25mm,在第二方向D2相邻的两个焊点之间的第一中心距L1可以约为1.05mm至1.25mm,第一中心距L1是一个焊点的几何中心与另一个焊点的几何中心之间的距离。In an exemplary embodiment, the first center-to-center distance L1 between two adjacent welding points in the first direction D1 may be about 1.05mm to 1.25mm, and between two adjacent welding points in the second direction D2 The first center-to-center distance L1 may be about 1.05 mm to 1.25 mm, and the first center-to-center distance L1 is the distance between the geometric center of one solder joint and the geometric center of another solder joint.
在示例性实施方式中,第一主焊盘和第二主焊盘上焊点的数量以及排布方式可以根据实际需要进行设置,本公开在此不做限定。In an exemplary embodiment, the number and arrangement of solder points on the first main pad and the second main pad can be set according to actual needs, which is not limited in the present disclosure.
在示例性实施方式中,第一主焊盘可以采用图9a所示排布方式排布第一焊点,第二主焊盘可以采用图9b所示排布方式排布第二焊点。In an exemplary embodiment, the first main pads may be arranged with the first solder joints in the arrangement shown in FIG. 9 a , and the second main pads may be arranged with the second solder joints in the arrangement shown in FIG. 9 b .
在示例性实施方式中,主柔性板还可以包括至少一条第一辅助线71,第一辅助线71的第一端与第一驱动信号线51连接,第一辅助线71的第二端与第一主焊盘11的第一焊点连接。In an exemplary embodiment, the main flexible board may further include at least one first auxiliary line 71, the first end of the first auxiliary line 71 is connected to the first driving signal line 51, the second end of the first auxiliary line 71 is connected to the second A first solder joint of the main pad 11 is connected.
在示例性实施方式中,多个第一焊点可以包括位于焊点阵列内侧的至少一个第一功能性焊点和位于焊点阵列外侧的至少一个第一非功能性焊点。第一驱动信号线51的第一端与一个端子连接,第一驱动信号线51的第二端与一个第一功能性焊点连接。第一辅助线71的第一端与该第一驱动信号线51连接,第一辅助线71的第二端与至少一个第一非功能性焊点连接。In an exemplary embodiment, the plurality of first solder joints may include at least one first functional solder joint located inside the solder joint array and at least one first non-functional solder joint located outside the solder joint array. A first end of the first driving signal line 51 is connected to a terminal, and a second end of the first driving signal line 51 is connected to a first functional pad. A first end of the first auxiliary line 71 is connected to the first driving signal line 51 , and a second end of the first auxiliary line 71 is connected to at least one first non-functional solder joint.
图10为图8中A区域的放大图。下面以5条第一驱动信号线和第一主焊盘为图9a所示结构为例,详细说明第一驱动信号线与第一焊点的连接情况。如图10所示,5条第一驱动信号线可以包括第一驱动子线51-1、第二驱动子线51-2、第三驱动子线51-3、第四驱动子线51-4和第五驱动子线51-5,5条第一辅助线可以包括第一辅助子线71-1、第二辅助子线71-2、第三辅助子线71-3、第四辅助子线71-4和第五辅助子线71-5。FIG. 10 is an enlarged view of area A in FIG. 8 . Taking the structure shown in FIG. 9a as an example of five first driving signal lines and the first main pad, the connection between the first driving signal line and the first pad will be described in detail below. As shown in FIG. 10, the five first driving signal lines may include a first driving sub-line 51-1, a second driving sub-line 51-2, a third driving sub-line 51-3, and a fourth driving sub-line 51-4. and the fifth driving sub-line 51-5, the five first auxiliary lines may include the first auxiliary sub-line 71-1, the second auxiliary sub-line 71-2, the third auxiliary sub-line 71-3, the fourth auxiliary sub-line 71-4 and the fifth auxiliary strand 71-5.
在示例性实施方式中,第一驱动子线51-1的第一端与一个端子连接,第一驱动子线51-1的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第 3行第3列的功能性焊点3-3连接。第一辅助子线71-1的第一端与第一驱动子线51-1连接,第一辅助子线71-1的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第1行第1列的非功能性焊点1-1连接。这样,第一驱动子线利用第一辅助子线可以与第一主焊盘上的两个第一焊点连接,形成“二(焊点)对一(信号线)”的连接方式。In an exemplary embodiment, the first end of the first driving sub-line 51-1 is connected to a terminal, and the second end of the first driving sub-line 51-1 extends toward the first main pad 11, and is connected to the first main pad 11. The functional pads 3 - 3 in the third row and third column on the pad 11 are connected. The first end of the first auxiliary sub-line 71-1 is connected to the first driving sub-line 51-1, and the second end of the first auxiliary sub-line 71-1 extends toward the first main pad 11, and is connected to the first main pad 11 The non-functional solder joints 1-1 in the first row and first column on the pad 11 are connected. In this way, the first driving sub-line can be connected to the two first pads on the first main pad by using the first auxiliary sub-line to form a "two (pad) to one (signal line)" connection.
在示例性实施方式中,第二驱动子线51-2的第一端与一个端子连接,第二驱动子线51-2的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第3行第5列的功能性焊点3-5连接。第二辅助子线71-2的第一端与第二驱动子线51-2连接,第二辅助子线71-2的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第1行第7列的非功能性焊点1-7连接。这样,第二驱动子线利用第二辅助子线可以与第一主焊盘上的两个第一焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the second driving sub-line 51-2 is connected to a terminal, and the second end of the second driving sub-line 51-2 extends toward the first main pad 11, and is connected to the first main pad 11. The functional pads 3-5 in the third row and fifth column on the pad 11 are connected. The first end of the second auxiliary sub-line 71-2 is connected to the second driving sub-line 51-2, and the second end of the second auxiliary sub-line 71-2 extends toward the first main pad 11 and is connected to the first main pad 11. The non-functional solder joints 1-7 in row 1 and column 7 on pad 11 are connected. In this way, the second driving sub-line can be connected to the two first pads on the first main pad by using the second auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第三驱动子线51-3的第一端与一个端子连接,第三驱动子线51-3的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第4行第4列的功能性焊点4-4连接。第三辅助子线71-3的第一端与第三驱动子线51-3连接,第三辅助子线71-3的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第3行第7列的非功能性焊点3-7连接。这样,第三驱动子线利用第三辅助子线可以与第一主焊盘上的两个第一焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the third driving sub-line 51-3 is connected to a terminal, and the second end of the third driving sub-line 51-3 extends toward the first main pad 11, and is connected to the first main pad 11. The functional pads 4-4 in the fourth row and fourth column on the pad 11 are connected. The first end of the third auxiliary sub-line 71-3 is connected to the third driving sub-line 51-3, and the second end of the third auxiliary sub-line 71-3 extends toward the first main pad 11, and is connected to the first main pad 11 The non-functional solder joints 3-7 on the third row and seventh column on the pad 11 are connected. In this way, the third driving sub-line can be connected to the two first pads on the first main pad by using the third auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第四驱动子线51-4的第一端与一个端子连接,第四驱动子线51-4的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第5行第5列的功能性焊点5-5连接。第四辅助子线71-4的第一端与第四驱动子线51-4连接,第四辅助子线71-4的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第7行第7列的非功能性焊点7-7连接。这样,第四驱动子线利用第四辅助子线可以与第一主焊盘上的两个第一焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the fourth driving sub-line 51-4 is connected to a terminal, and the second end of the fourth driving sub-line 51-4 extends toward the first main pad 11, and is connected to the first main pad 11. The functional pads 5 - 5 in the fifth row and fifth column on the pad 11 are connected. The first end of the fourth auxiliary sub-line 71-4 is connected to the fourth driving sub-line 51-4, and the second end of the fourth auxiliary sub-line 71-4 extends toward the first main pad 11, and is connected to the first main pad 11. The non-functional solder joints 7-7 in row 7 and column 7 on pad 11 are connected. In this way, the fourth driving sub-line can be connected to the two first pads on the first main pad by using the fourth auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第五驱动子线51-5的第一端与一个端子连接,第五驱动子线51-5的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第5行第3列的功能性焊点5-3连接。第五辅助子线71-5的第一端与第五驱动 子线51-5连接,第五辅助子线71-5的第二端向着第一主焊盘11延伸后,与第一主焊盘11上第7行第1列的非功能性焊点7-1连接。这样,第五驱动子线利用第五辅助子线可以与第一主焊盘上的两个第一焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the fifth driving sub-line 51-5 is connected to a terminal, and the second end of the fifth driving sub-line 51-5 extends toward the first main pad 11, and is connected to the first main pad 11. The functional pads 5 - 3 in the fifth row and third column on the pad 11 are connected. The first end of the fifth auxiliary sub-line 71-5 is connected to the fifth driving sub-line 51-5, and the second end of the fifth auxiliary sub-line 71-5 extends toward the first main pad 11, and is connected to the first main pad 11. The non-functional solder joint 7-1 in the 7th row and 1st column on the pad 11 is connected. In this way, the fifth driving sub-line can be connected to the two first pads on the first main pad by using the fifth auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第一驱动信号线所连接的功能性焊点与连接该第一驱动信号线的辅助线所连接的非功能性焊点之间,可以设置有至少一个功能性焊点。In an exemplary embodiment, at least one functional soldering point may be provided between the functional soldering point connected to the first driving signal line and the non-functional soldering point connected to the auxiliary line connected to the first driving signal line .
在示例性实施方式中,主柔性板可以还包括至少一条第二辅助线72,第二辅助线72的第一端与第二驱动信号线52连接,第二辅助线72的第二端与第二主焊盘12的第二焊点连接。In an exemplary embodiment, the main flexible board may further include at least one second auxiliary line 72, the first end of the second auxiliary line 72 is connected to the second driving signal line 52, the second end of the second auxiliary line 72 is connected to the first The second solder joints of the two main pads 12 are connected.
在示例性实施方式中,多个第二焊点可以包括位于焊点阵列内侧的至少一个第二功能性焊点和位于焊点阵列外侧的至少一个第二非功能性焊点。第二驱动信号线52的第一端与触控驱动电路连接,第二驱动信号线52的第二端与一个第二功能性焊点连接。第二辅助线72的第一端与该第二驱动信号线52连接,第二辅助线72的第二端与至少一个第二非功能性焊点连接。In an exemplary embodiment, the plurality of second solder joints may include at least one second functional solder joint located inside the solder joint array and at least one second non-functional solder joint located outside the solder joint array. The first end of the second driving signal line 52 is connected to the touch driving circuit, and the second end of the second driving signal line 52 is connected to a second functional pad. A first end of the second auxiliary line 72 is connected to the second driving signal line 52 , and a second end of the second auxiliary line 72 is connected to at least one second non-functional solder joint.
图11为图8中B区域的放大图。下面以5条第二驱动信号线和第二主焊盘为图9b所示结构为例,详细说明第二驱动信号线与第二焊点的连接情况。如图11所示,5条第二驱动信号线可以包括第六驱动子线52-6、第七驱动子线52-7、第八驱动子线52-8、第九驱动子线52-9和第十驱动子线52-10,5条第二辅助线可以包括第六辅助子线72-6、第七辅助子线72-7、第八辅助子线72-8、第九辅助子线72-9和第十辅助子线72-10。FIG. 11 is an enlarged view of area B in FIG. 8 . Taking the structure shown in FIG. 9 b as an example of five second driving signal lines and the second main pad, the connection between the second driving signal lines and the second pads will be described in detail below. As shown in FIG. 11, the five second driving signal lines may include a sixth driving sub-line 52-6, a seventh driving sub-line 52-7, an eighth driving sub-line 52-8, and a ninth driving sub-line 52-9. and the tenth driving sub-line 52-10, the five second auxiliary lines may include the sixth auxiliary sub-line 72-6, the seventh auxiliary sub-line 72-7, the eighth auxiliary sub-line 72-8, the ninth auxiliary sub-line 72-9 and the tenth auxiliary sub-line 72-10.
在示例性实施方式中,第六驱动子线52-6的第一端与触控驱动电路连接,第六驱动子线52-6的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第3行第3列的功能性焊点3-3连接。第六辅助子线72-6的第一端与第六驱动子线52-6连接,第六辅助子线72-6的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第1行第1列的非功能性焊点1-1连接。这样,第六驱动子线利用第六辅助子线与第二主焊盘上的两个第二焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the sixth driving sub-line 52-6 is connected to the touch driving circuit, and the second end of the sixth driving sub-line 52-6 extends toward the second main pad 12, and is connected to the second main pad 12. The functional pads 3 - 3 in the third row and third column on the two main pads 12 are connected. The first end of the sixth auxiliary sub-line 72-6 is connected to the sixth driving sub-line 52-6, and the second end of the sixth auxiliary sub-line 72-6 extends toward the second main pad 12, and is connected to the second main pad 12. The non-functional solder joints 1-1 on the first row and first column on the pad 12 are connected. In this way, the sixth driving sub-line is connected to the two second pads on the second main pad by using the sixth auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第七驱动子线52-7的第一端与触控驱动电路连接,第七驱动子线52-7的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第3行第5列的功能性焊点3-5连接。第七辅助子线72-7的第一端与第七驱动子线52-7连接,第七辅助子线72-7的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第1行第7列的非功能性焊点1-7连接。这样,第七驱动子线利用第七辅助子线与第二主焊盘上的两个第二焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the seventh driving sub-line 52-7 is connected to the touch driving circuit, the second end of the seventh driving sub-line 52-7 extends toward the second main pad 12, and is connected to the second main pad 12. The functional pads 3-5 in the third row and fifth column on the two main pads 12 are connected. The first end of the seventh auxiliary sub-line 72-7 is connected to the seventh driving sub-line 52-7, and the second end of the seventh auxiliary sub-line 72-7 extends toward the second main pad 12, and is connected to the second main pad 12. The non-functional solder joints 1-7 in row 1 and column 7 on pad 12 are connected. In this way, the seventh driving sub-line is connected to the two second pads on the second main pad by using the seventh auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第八驱动子线52-8的第一端与触控驱动电路连接,第八驱动子线52-8的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第4行第4列的功能性焊点4-4连接。第八辅助子线72-8的第一端与第八驱动子线52-8连接,第八辅助子线72-8的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第3行第7列的非功能性焊点3-7连接。这样,第八驱动子线利用第八辅助子线可以与第二主焊盘上的两个第二焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the eighth driving sub-line 52-8 is connected to the touch driving circuit, and the second end of the eighth driving sub-line 52-8 extends toward the second main pad 12, and is connected to the second main pad 12. The functional pads 4-4 on the 4th row and 4th column on the two main pads 12 are connected. The first end of the eighth auxiliary sub-line 72-8 is connected to the eighth driving sub-line 52-8, and the second end of the eighth auxiliary sub-line 72-8 extends toward the second main pad 12, and is connected to the second main pad 12. The non-functional solder joints 3-7 in row 3 and column 7 on pad 12 are connected. In this way, the eighth driving sub-line can be connected to the two second pads on the second main pad by using the eighth auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第九驱动子线52-9的第一端与触控驱动电路连接,第九驱动子线52-9的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第5行第5列的功能性焊点5-5连接。第九辅助子线72-9的第一端与第九驱动子线52-9连接,第九辅助子线72-9的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第7行第7列的非功能性焊点7-7连接。这样,第九驱动子线利用第九辅助子线可以与第二主焊盘上的两个第二焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the ninth driving sub-line 52-9 is connected to the touch driving circuit, the second end of the ninth driving sub-line 52-9 extends toward the second main pad 12, and is connected to the second main pad 12. The functional pads 5-5 in the fifth row and fifth column on the two main pads 12 are connected. The first end of the ninth auxiliary sub-line 72-9 is connected to the ninth driving sub-line 52-9, and the second end of the ninth auxiliary sub-line 72-9 extends toward the second main pad 12, and is connected to the second main pad 12. The non-functional solder joints 7-7 in row 7 and column 7 on pad 12 are connected. In this way, the ninth driving sub-line can be connected to the two second pads on the second main pad by using the ninth auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第十驱动子线52-10的第一端与触控驱动电路连接,第十驱动子线52-10的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第5行第3列的功能性焊点5-3连接。第十辅助子线72-10的第一端与第十驱动子线52-10连接,第十辅助子线72-10的第二端向着第二主焊盘12延伸后,与第二主焊盘12上第7行第1列的非功能性焊点7-1连接。这样,第十驱动子线利用第十辅助子线可以与第二主焊盘上的两个第二焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the tenth driving sub-line 52-10 is connected to the touch driving circuit, and the second end of the tenth driving sub-line 52-10 extends toward the second main pad 12, and is connected to the second main pad 12. The functional pads 5 - 3 in the fifth row and third column on the two main pads 12 are connected. The first end of the tenth auxiliary sub-line 72-10 is connected to the tenth driving sub-line 52-10, and the second end of the tenth auxiliary sub-line 72-10 extends toward the second main pad 12, and is connected to the second main pad 12. The non-functional solder joint 7-1 on the 7th row and 1st column on the pad 12 is connected. In this way, the tenth driving sub-line can be connected to the two second pads on the second main pad by using the tenth auxiliary sub-line to form a "two-to-one" connection.
在示例性实施方式中,第二驱动信号线所连接的功能性焊点与连接该第 二驱动信号线的辅助线所连接的非功能性焊点之间,可以设置有至少一个功能性焊点。In an exemplary embodiment, at least one functional soldering point may be provided between the functional soldering point connected to the second driving signal line and the non-functional soldering point connected to the auxiliary line connected to the second driving signal line .
在示例性实施方式中,作为传输主线路的驱动信号线与焊盘上的功能性焊点连接,作为传输支线路的辅助线与焊盘上的非功能性焊点连接。由于现有结构焊盘上的非功能性焊点通常闲置,因而可以设置辅助线连接非功能性焊点。本公开通过在主柔性版上设置信号线连接功能性焊点,设置辅助线连接非功能性焊点,形成二焊点对应一条信号线的连接结构,实现了焊点连接的冗余,即使有一个焊点出现空焊,也可以保证信号传输,提高了通过焊盘传输信号的可靠性。In an exemplary embodiment, the driving signal line as the main transmission line is connected to the functional pad on the pad, and the auxiliary line as the transmission branch line is connected to the non-functional pad on the pad. Since the non-functional solder joints on the pads of the existing structure are usually idle, auxiliary lines can be set to connect the non-functional solder joints. In the present disclosure, the connection structure of two solder points corresponding to one signal line is formed by setting signal wires on the main flexible plate to connect functional solder joints, and setting auxiliary wires to connect non-functional solder joints. If there is an empty solder joint in one solder joint, signal transmission can also be guaranteed, which improves the reliability of signal transmission through the pad.
在示例性实施方式中,每条驱动子线可以设置n条辅助子线,驱动子线利用n条辅助子线可以与焊盘上的n+1个焊点连接,形成“n+1对一”的连接方式,n为大于1的正整数。例如,对于n=1,每条驱动子线可以设置一条辅助子线,驱动子线利用一条辅助子线可以与焊盘上的二个焊点连接,形成“二对一”的连接方式。又如,对于n=2,每条驱动子线可以设置两条辅助子线,驱动子线利用两条辅助子线可以与焊盘上的三个焊点连接,形成“三对一”的连接方式。In an exemplary embodiment, each driving sub-line can be provided with n auxiliary sub-lines, and the driving sub-line can be connected to n+1 solder points on the pad by using n auxiliary sub-lines to form an "n+1 to one ", n is a positive integer greater than 1. For example, for n=1, each driving sub-line can be provided with an auxiliary sub-line, and the driving sub-line can be connected to two pads on the pad by using one auxiliary sub-line to form a "two-to-one" connection. For another example, for n=2, each driving sub-line can be provided with two auxiliary sub-lines, and the driving sub-line can be connected to three solder points on the pad by using the two auxiliary sub-lines to form a "three-to-one" connection Way.
在示例性实施方式中,多条驱动子线上设置辅助子线的数量可以相同,或者可以不同,本公开在此不做限定。In an exemplary embodiment, the number of auxiliary sub-lines disposed on the plurality of driving sub-lines may be the same or may be different, which is not limited by the present disclosure.
图12为本公开示例性实施例柔性印刷电路板中一种桥接柔性板的平面结构示意图。在示例性实施方式中,桥接柔性板可以至少包括第一桥接焊盘21、第二桥接焊盘22和多条连接线81。第一桥接焊盘21可以包括多个第三焊点,第二桥接焊盘22可以包括多个第四焊点,多条连接线81的第一端与第一桥接焊盘21的多个第三焊点对应连接,多条连接线81的第二端与第二桥接焊盘22的多个第四焊点对应连接。FIG. 12 is a schematic plan view of a bridging flexible board in a flexible printed circuit board according to an exemplary embodiment of the present disclosure. In an exemplary embodiment, the bridging flexible board may at least include a first bridging pad 21 , a second bridging pad 22 and a plurality of connection lines 81 . The first bridging pad 21 may include a plurality of third pads, the second bridging pad 22 may include a plurality of fourth pads, the first ends of the multiple connecting lines 81 and the multiple first ends of the first bridging pad 21 The three welding points are correspondingly connected, and the second ends of the plurality of connection lines 81 are correspondingly connected with the plurality of fourth welding points of the second bridge pad 22 .
在示例性实施方式中,第一桥接焊盘21可以采用图9a所示排布方式排布第三焊点,包括25个焊点,25个焊点可以按照7行7列的方式排布形成焊点阵列。In an exemplary embodiment, the first bridging pad 21 can adopt the arrangement shown in FIG. 9a to arrange the third solder joints, including 25 solder joints, and the 25 solder joints can be arranged in 7 rows and 7 columns. array of solder joints.
在示例性实施方式中,桥接柔性板还可以包括至少一条第三辅助线73 和至少一条第四辅助线74。第三辅助线73的第一端与连接线81连接,第三辅助线73的第二端与第一桥接焊盘21的第三焊点连接。第四辅助线74的第一端与连接线81连接,第三辅助线73的第二端与第二桥接焊盘22的第四焊点连接。In an exemplary embodiment, the bridging flexible board may further include at least one third auxiliary line 73 and at least one fourth auxiliary line 74 . A first end of the third auxiliary line 73 is connected to the connection line 81 , and a second end of the third auxiliary line 73 is connected to the third pad of the first bridge pad 21 . A first end of the fourth auxiliary line 74 is connected to the connection line 81 , and a second end of the third auxiliary line 73 is connected to the fourth soldering point of the second bridge pad 22 .
在示例性实施方式中,多个第三焊点可以包括位于焊点阵列内侧的至少一个第三功能性焊点和位于焊点阵列外侧的至少一个第三非功能性焊点,多个第四焊点可以包括位于焊点阵列内侧的至少一个第四功能性焊点和位于焊点阵列外侧的至少一个第四非功能性焊点。连接线81的第一端与第一桥接焊盘21的一个第三功能性焊点连接,连接线81的第二端与第二桥接焊盘22的一个第四功能性焊点连接。第三辅助线73的第一端与连接线81连接,第三辅助线73的第二端与第一桥接焊盘21的至少一个第三非功能性焊点连接。第四辅助线74的第一端与连接线81连接,第四辅助线74的第二端与第二桥接焊盘22的一个第四非功能性焊点连接。In an exemplary embodiment, the plurality of third solder joints may include at least one third functional solder joint located inside the solder joint array and at least one third non-functional solder joint located outside the solder joint array, and the plurality of fourth The solder joints may include at least one fourth functional solder joint located inside the solder joint array and at least one fourth non-functional solder joint located outside the solder joint array. A first end of the connecting wire 81 is connected to a third functional soldering point of the first bridge pad 21 , and a second end of the connecting wire 81 is connected to a fourth functional soldering point of the second bridge pad 22 . A first end of the third auxiliary line 73 is connected to the connection line 81 , and a second end of the third auxiliary line 73 is connected to at least one third non-functional soldering point of the first bridge pad 21 . A first end of the fourth auxiliary line 74 is connected to the connection line 81 , and a second end of the fourth auxiliary line 74 is connected to a fourth non-functional solder point of the second bridge pad 22 .
图13为图12中C区域的放大图,图14为图12中D区域的放大图。下面以5条连接线、第一桥接焊盘为图9a所示结构和第二桥接焊盘为图9b所示结构为例,详细说明连接线分别与第三焊点和第四焊点的连接情况。如图13和图14所示,5条连接线可以包括第一连接子线81-1、第二连接子线81-2、第三连接子线81-3、第四连接子线81-4和第五连接子线81-5,5条第三辅助线可以包括第十一辅助子线73-11、第十二辅助子线73-12、第十三辅助子线73-13、第十四辅助子线73-14和第十五辅助子线73-15,5条第四辅助线可以包括第十六辅助子线74-16、第十七辅助子线74-17、第十八辅助子线74-18、第十九辅助子线74-19和第二十辅助子线74-20。FIG. 13 is an enlarged view of area C in FIG. 12 , and FIG. 14 is an enlarged view of area D in FIG. 12 . Taking 5 connecting lines, the structure shown in Figure 9a for the first bridge pad and the structure shown in Figure 9b for the second bridge pad as an example, the connection between the connecting wires and the third soldering point and the fourth soldering point respectively will be described in detail. Condition. As shown in Figure 13 and Figure 14, the five connection lines may include a first connection sub-line 81-1, a second connection sub-line 81-2, a third connection sub-line 81-3, and a fourth connection sub-line 81-4 and the fifth connecting sub-line 81-5, the five third auxiliary lines may include the eleventh auxiliary sub-line 73-11, the twelfth auxiliary sub-line 73-12, the thirteenth auxiliary sub-line 73-13, the tenth auxiliary sub-line The four auxiliary sub-lines 73-14 and the fifteenth auxiliary sub-line 73-15, the five fourth auxiliary lines may include the sixteenth auxiliary sub-line 74-16, the seventeenth auxiliary sub-line 74-17, the eighteenth auxiliary sub-line A sub-line 74-18, a nineteenth auxiliary sub-line 74-19 and a twentieth auxiliary sub-line 74-20.
在示例性实施方式中,第一连接子线81-1的第一端与第一桥接焊盘21上第3行第3列的功能性焊点3-3连接,第一连接子线81-1的第二端与第二桥接焊盘22上第3行第3列的功能性焊点3-3连接。第十一辅助子线73-11的第一端与第一连接子线81-1连接,第十一辅助子线73-11的第二端向着第一桥接焊盘21延伸后,与第一桥接焊盘21上第1行第1列的非功能性焊点1-1连接。第十六辅助子线74-16的第一端与第一连接子线81-1连接,第十六辅助子线74-16的第二端向着第二桥接焊盘22延伸后,与第二桥接焊盘 22上第1行第1列的非功能性焊点1-1连接。这样,第一连接子线的第一端利用第十一辅助子线可以与第一桥接焊盘上的两个第三焊点连接,形成“二对一”的连接方式,第一连接子线的第二端利用第十六辅助子线可以与第二桥接焊盘上的两个第四焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the first connection sub-line 81-1 is connected to the functional pad 3-3 in the third row and third column on the first bridge pad 21, and the first connection sub-line 81-1 The second end of 1 is connected to the functional pad 3 - 3 in the third row and third column on the second bridge pad 22 . The first end of the eleventh auxiliary sub-line 73-11 is connected to the first connecting sub-line 81-1, and the second end of the eleventh auxiliary sub-line 73-11 extends toward the first bridge pad 21, and is connected to the first The non-functional pads 1 - 1 in the first row and the first column on the bridge pad 21 are connected. The first end of the sixteenth auxiliary sub-line 74-16 is connected to the first connection sub-line 81-1, and the second end of the sixteenth auxiliary sub-line 74-16 extends toward the second bridge pad 22, and is connected to the second The non-functional pads 1 - 1 in the first row and the first column on the bridge pad 22 are connected. In this way, the first end of the first connection sub-wire can be connected to the two third pads on the first bridge pad by using the eleventh auxiliary sub-wire to form a "two-to-one" connection mode. The first connection sub-wire The second end of the second terminal can be connected to the two fourth pads on the second bridging pad by using the sixteenth auxiliary sub-wire to form a "two-to-one" connection.
在示例性实施方式中,第二连接子线81-2的第一端与第一桥接焊盘21上第3行第5列的功能性焊点3-5连接,第二连接子线81-2的第二端与第二桥接焊盘22上第3行第5列的功能性焊点3-5连接。第十二辅助子线73-12的第一端与第二连接子线81-2连接,第十二辅助子线73-12的第二端向着第一桥接焊盘21延伸后,与第一桥接焊盘21上第1行第7列的非功能性焊点1-7连接。第十七辅助子线74-17的第一端与第二连接子线81-2连接,第十七辅助子线74-17第二端向着第二桥接焊盘22延伸后,与第二桥接焊盘22上第1行第7列的非功能性焊点1-7连接。这样,第二连接子线的第一端利用第十二辅助子线可以与第一桥接焊盘上的两个第三焊点连接,形成“二对一”的连接方式。第二连接子线的第二端利用第十七辅助子线可以与第二桥接焊盘上的两个第四焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the second connection sub-line 81-2 is connected to the functional pad 3-5 in the third row and fifth column on the first bridge pad 21, and the second connection sub-line 81-2 The second end of 2 is connected to the functional pad 3 - 5 in row 3 and column 5 on the second bridge pad 22 . The first end of the twelfth auxiliary sub-line 73-12 is connected to the second connection sub-line 81-2, and after the second end of the twelfth auxiliary sub-line 73-12 extends toward the first bridge pad 21, it is connected to the first The non-functional pads 1-7 in the first row and the seventh column on the bridge pad 21 are connected. The first end of the seventeenth auxiliary sub-line 74-17 is connected to the second connection sub-line 81-2, and the second end of the seventeenth auxiliary sub-line 74-17 extends toward the second bridge pad 22, and then connects with the second bridge pad 22. The non-functional solder joints 1-7 in row 1 and column 7 on pad 22 are connected. In this way, the first end of the second connection sub-wire can be connected to the two third pads on the first bridge pad by using the twelfth auxiliary sub-wire, forming a "two-to-one" connection. The second end of the second connection sub-wire can be connected to the two fourth pads on the second bridge pad by using the seventeenth auxiliary sub-wire to form a "two-to-one" connection.
在示例性实施方式中,第三连接子线81-3的第一端与第一桥接焊盘21上第4行第4列的功能性焊点4-4连接,第三连接子线81-3的第二端与第二桥接焊盘22上第4行第4列的功能性焊点4-4连接。第十三辅助子线73-13的第一端与第三连接子线81-3连接,第十三辅助子线73-13的第二端向着第一桥接焊盘21延伸后,与第一桥接焊盘21上第3行第7列的非功能性焊点3-7连接。第十八辅助子线74-18的第一端与第三连接子线81-3连接,第十八辅助子线74-18的第二端向着第二桥接焊盘22延伸后,与第二桥接焊盘22上第3行第7列的非功能性焊点3-7连接。这样,第三连接子线的第一端利用第十三辅助子线可以与第一桥接焊盘上的两个第三焊点连接,形成“二对一”的连接方式。第三连接子线81-3的第二端利用第十八辅助子线可以与第二桥接焊盘上的两个第四焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the third connection sub-line 81-3 is connected to the functional pad 4-4 in the fourth row and fourth column on the first bridge pad 21, and the third connection sub-line 81-3 The second end of 3 is connected to the functional pad 4 - 4 in the fourth row and fourth column on the second bridge pad 22 . The first end of the thirteenth auxiliary sub-line 73-13 is connected to the third connecting sub-line 81-3, and after the second end of the thirteenth auxiliary sub-line 73-13 extends toward the first bridge pad 21, it is connected to the first The non-functional solder joints 3 - 7 in the third row and seventh column on the bridge pad 21 are connected. The first end of the eighteenth auxiliary sub-line 74-18 is connected to the third connection sub-line 81-3, and the second end of the eighteenth auxiliary sub-line 74-18 extends toward the second bridge pad 22, and connects with the second The non-functional pads 3 - 7 in the third row and seventh column on the bridging pad 22 are connected. In this way, the first end of the third connecting sub-wire can be connected to the two third pads on the first bridge pad by using the thirteenth auxiliary sub-wire, forming a "two-to-one" connection. The second end of the third connection sub-wire 81-3 can be connected to the two fourth pads on the second bridge pad by using the eighteenth auxiliary sub-wire, forming a "two-to-one" connection.
在示例性实施方式中,第四连接子线81-4的第一端与第一桥接焊盘21上第5行第5列的功能性焊点5-5连接,第四连接子线81-4的第二端与第二桥接焊盘22上第5行第5列的功能性焊点5-5连接。第十四辅助子线73-14 的第一端与第四连接子线81-4连接,第十四辅助子线73-14的第二端向着第一桥接焊盘21延伸后,与第一桥接焊盘21上第7行第7列的非功能性焊点7-7连接。第十九辅助子线74-19的第一端与第四连接子线81-4连接,第十九辅助子线74-19的第二端向着第二桥接焊盘22延伸后,与第二桥接焊盘22上第7行第7列的非功能性焊点7-7连接。这样,第四连接子线的第一端利用第十四辅助子线可以与第一桥接焊盘上的两个第三焊点连接,形成“二对一”的连接方式。第四连接子线的第二端利用第十九辅助子线可以与第二桥接焊盘上的两个第四焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the fourth connection sub-wire 81-4 is connected to the functional pad 5-5 in the fifth row and fifth column on the first bridge pad 21, and the fourth connection sub-wire 81-4 The second end of 4 is connected to the functional pad 5 - 5 in row 5 and column 5 on the second bridge pad 22 . The first end of the fourteenth auxiliary sub-line 73-14 is connected to the fourth connecting sub-line 81-4, and after the second end of the fourteenth auxiliary sub-line 73-14 extends toward the first bridge pad 21, it is connected to the first The non-functional solder joints 7 - 7 in the seventh row and seventh column on the bridge pad 21 are connected. The first end of the nineteenth auxiliary sub-line 74-19 is connected to the fourth connecting sub-line 81-4, and after the second end of the nineteenth auxiliary sub-line 74-19 extends toward the second bridge pad 22, it is connected to the second The non-functional pads 7 - 7 in the seventh row and seventh column on the bridging pad 22 are connected. In this way, the first end of the fourth connection sub-wire can be connected to the two third pads on the first bridge pad by using the fourteenth auxiliary sub-wire, forming a "two-to-one" connection. The second end of the fourth connection sub-wire can be connected to the two fourth pads on the second bridge pad by using the nineteenth auxiliary sub-wire to form a "two-to-one" connection.
在示例性实施方式中,第五连接子线81-5的第一端与第一桥接焊盘21上第5行第3列的功能性焊点5-3连接,第五连接子线81-5的第二端与第二桥接焊盘22上第5行第3列的功能性焊点5-3连接。第十五辅助子线73-15的第一端与第五连接子线81-5连接,第十五辅助子线73-15的第二端向着第一桥接焊盘21延伸后,与第一桥接焊盘21上第7行第1列的非功能性焊点7-1连接。第二十辅助子线74-20的第一端与第五连接子线81-5连接,第二十辅助子线74-20的第二端向着第二桥接焊盘22延伸后,与第二桥接焊盘22上第7行第1列的非功能性焊点7-1连接。这样,第五连接子线的第一端利用第十五辅助子线可以与第一桥接焊盘上的两个第三焊点连接,形成“二对一”的连接方式。第五连接子线81-5的第二端利用第二十辅助子线可以与第二桥接焊盘上的两个第四焊点连接,形成“二对一”的连接方式。In an exemplary embodiment, the first end of the fifth connection sub-line 81-5 is connected to the functional pad 5-3 in the fifth row and third column on the first bridge pad 21, and the fifth connection sub-line 81-5 The second end of 5 is connected to the functional pad 5 - 3 in row 5 and column 3 on the second bridge pad 22 . The first end of the fifteenth auxiliary sub-line 73-15 is connected to the fifth connection sub-line 81-5, and the second end of the fifteenth auxiliary sub-line 73-15 extends toward the first bridging pad 21, and is The non-functional solder joint 7 - 1 in row 7 and column 1 on the bridge pad 21 is connected. The first end of the twentieth auxiliary sub-line 74-20 is connected to the fifth connection sub-line 81-5, and after the second end of the twentieth auxiliary sub-line 74-20 extends toward the second bridge pad 22, it is connected to the second The non-functional pads 7 - 1 in row 7 and column 1 on the bridge pad 22 are connected. In this way, the first end of the fifth connection sub-wire can be connected to the two third pads on the first bridge pad by using the fifteenth auxiliary sub-wire to form a "two-to-one" connection. The second end of the fifth connection sub-wire 81 - 5 can be connected to the two fourth pads on the second bridge pad by using the twentieth auxiliary sub-wire to form a "two-to-one" connection.
在示例性实施方式中,连接线所连接的功能性焊点与连接该连接线的辅助线所连接的非功能性焊点之间,可以设置有至少一个功能性焊点。In an exemplary embodiment, at least one functional soldering point may be provided between the functional soldering point connected with the connecting wire and the non-functional soldering point connected with the auxiliary wire connected to the connecting wire.
在示例性实施方式中,作为传输主线路的连接线与焊盘上的功能性焊点连接,作为支线路的辅助线与焊盘上的非功能性焊点连接。由于现有结构焊盘上的非功能性焊点通常闲置,因而可以设置辅助线连接非功能性焊点。本公开通过在桥接柔性版上设置连接线连接功能性焊点,设置辅助线连接非功能性焊点,形成二焊点对应一条连接线的连接结构,实现了焊点连接的冗余,即使有一个焊点出现空焊,也可以保证信号传输,提高了通过焊盘传输信号的可靠性。In an exemplary embodiment, the connection line as the main transmission line is connected to the functional pads on the pad, and the auxiliary line as the branch line is connected to the non-functional pads on the pad. Since the non-functional solder joints on the pads of the existing structure are usually idle, auxiliary lines can be set to connect the non-functional solder joints. In the present disclosure, by setting connecting wires on the bridging flexible plate to connect functional soldering points, and setting auxiliary wires to connect non-functional soldering points, a connection structure in which two soldering points correspond to one connecting wire is formed, and redundancy of soldering point connection is realized, even if there are If there is an empty solder joint in one solder joint, signal transmission can also be guaranteed, which improves the reliability of signal transmission through the pad.
在示例性实施方式中,每条连接子线可以设置n条辅助子线,驱动子线 利用n条辅助子线可以与焊盘上的n+1个焊点连接,形成“n+1对一”的连接方式,n为大于1的正整数。例如,对于n=1,每条连接子线可以设置一条辅助子线,连接子线利用一条辅助子线可以与焊盘上的二个焊点连接,形成“二对一”的连接方式。又如,对于n=2,每条连接子线可以设置两条辅助子线,连接子线利用两条辅助子线可以与焊盘上的三个焊点连接,形成“三对一”的连接方式。In an exemplary embodiment, each connection sub-line can be provided with n auxiliary sub-lines, and the driving sub-line can be connected to n+1 solder points on the pad by using n auxiliary sub-lines to form an "n+1 to one ", n is a positive integer greater than 1. For example, for n=1, each connection sub-line can be provided with an auxiliary sub-line, and the connection sub-line can be connected to two solder points on the pad by using one auxiliary sub-line to form a "two-to-one" connection mode. As another example, for n=2, each connection sub-line can be provided with two auxiliary sub-lines, and the connection sub-line can be connected with three solder points on the pad by using the two auxiliary sub-lines to form a "three-to-one" connection Way.
在示例性实施方式中,多条连接子线上设置辅助子线的数量可以相同,或者可以不同,本公开在此不做限定。In an exemplary embodiment, the number of auxiliary sub-lines provided on the plurality of connecting sub-lines may be the same or different, which is not limited in the present disclosure.
一种双层桥接式柔性印刷电路板中,通常是将一条信号线连接在主焊盘的一个功能性焊点上,将一条连接线连接在桥接焊盘的一个功能性焊点上,将桥接焊盘的功能性焊点与主焊盘的功能性焊点焊接起来后,实现主柔性板上信号线通过桥接柔性板连接起来。例如,主柔性板上第一驱动信号线和第二驱动信号线的连接关系为:第一驱动信号线与第一主焊盘上的焊点3-3连接,第一主焊盘上的焊点3-3与第一桥接焊盘上的焊点3-3连接,第一桥接焊盘上的焊点3-3与连接线的第一端连接,连接线的第二端与第二桥接焊盘上的焊点3-3连接,第二桥接焊盘上的焊点3-3与第二主焊盘上的焊点3-3连接,第二主焊盘上的焊点3-3与第二驱动信号线连接。In a double-layer bridge-type flexible printed circuit board, usually a signal line is connected to a functional soldering point of the main pad, and a connecting line is connected to a functional soldering point of the bridge pad, and the bridge After the functional soldering point of the pad is welded to the functional soldering point of the main pad, the signal lines on the main flexible board are connected through the bridging flexible board. For example, the connection relationship between the first driving signal line and the second driving signal line on the main flexible board is: the first driving signal line is connected to the pad 3-3 on the first main pad, and the pad on the first main pad is connected to 3-3. The point 3-3 is connected to the solder point 3-3 on the first bridge pad, the solder point 3-3 on the first bridge pad is connected to the first end of the connecting line, and the second end of the connecting line is connected to the second bridge The solder point 3-3 on the pad is connected, the solder point 3-3 on the second bridge pad is connected to the solder point 3-3 on the second main pad, and the solder point 3-3 on the second main pad Connect with the second driving signal line.
本公开提供了一种柔性印刷电路板,至少一条信号线连接在主焊盘的一个功能性焊点上,与该信号线连接的至少一条辅助线连接在主焊盘的一个非功能性焊点上,至少一条连接线连接在桥接焊盘的一个功能性焊点上,与该连接线连接的至少一条辅助线连接在桥接焊盘的一个非功能性焊点上。将桥接焊盘的功能性焊点和非功能性焊点与主焊盘的功能性焊点和非功能性焊点对应焊接起来后,不仅实现了主柔性板上信号线通过桥接柔性板连接起来,而且每条信号线在主焊盘与桥接焊盘之间具有至少两个焊点连接通道。例如,主柔性板上第一驱动信号线和第二驱动信号线的连接关系为:第一驱动信号线与第一主焊盘上的焊点3-3连接,第一驱动信号线的辅助线与第一主焊盘上的焊点1-1连接。第一主焊盘上的焊点3-3与第一桥接焊盘上的焊点3-3连接,第一主焊盘上的焊点1-1与第一桥接焊盘上的焊点1-1连接。第一桥接焊盘上的焊点3-3与连接线的第一端连接,第一桥接焊盘上的焊点1-1与 连接线的辅助线连接。连接线的第二端与第二桥接焊盘上的焊点3-3连接,连接线的辅助线与第二桥接焊盘上的焊点1-1连接。第二桥接焊盘上的焊点3-3与第二主焊盘上的焊点3-3连接,第二桥接焊盘上的焊点1-1与第二主焊盘上的焊点1-1连接。第二主焊盘上的焊点3-3与第二驱动信号线连接,第二主焊盘上的焊点1-1与第二驱动信号线的辅助线连接。本公开通过在主焊盘与桥接焊盘之间设置至少两个焊点连接通道,实现了焊点连接的冗余,即使有一个焊点出现空焊,也可以保证信号传输,提高了通过焊盘传输信号的可靠性。The present disclosure provides a flexible printed circuit board, at least one signal line is connected to a functional pad of the main pad, and at least one auxiliary line connected to the signal line is connected to a non-functional pad of the main pad Above, at least one connection line is connected to a functional pad of the bridge pad, and at least one auxiliary line connected to the connection line is connected to a non-functional pad of the bridge pad. After soldering the functional solder joints and non-functional solder joints of the bridge pad to the functional solder joints and non-functional solder joints of the main pad, not only the signal lines on the main flexible board are connected through the bridge flexible board , and each signal line has at least two solder joint connection channels between the main pad and the bridge pad. For example, the connection relationship between the first driving signal line and the second driving signal line on the main flexible board is: the first driving signal line is connected to the pad 3-3 on the first main pad, and the auxiliary line of the first driving signal line Connect to pad 1-1 on the first main pad. The solder point 3-3 on the first main pad is connected to the solder point 3-3 on the first bridge pad, and the solder point 1-1 on the first main pad is connected to the solder point 1 on the first bridge pad. -1 connection. The soldering point 3-3 on the first bridge pad is connected to the first end of the connecting wire, and the soldering point 1-1 on the first bridge pad is connected to the auxiliary wire of the connecting wire. The second end of the connection line is connected to the solder point 3-3 on the second bridge pad, and the auxiliary line of the connection line is connected to the solder point 1-1 on the second bridge pad. The solder point 3-3 on the second bridge pad is connected to the solder point 3-3 on the second main pad, and the solder point 1-1 on the second bridge pad is connected to the solder point 1 on the second main pad. -1 connection. The pad 3-3 on the second main pad is connected to the second driving signal line, and the pad 1-1 on the second main pad is connected to the auxiliary line of the second driving signal line. The present disclosure realizes the redundancy of solder joint connection by setting at least two solder joint connection channels between the main pad and the bridge pad. The reliability of the disk transmission signal.
如图12至图14所示,在示例性实施方式中,桥接柔性板可以包括连接线区210、第一焊盘区211和第二焊盘区212,连接线区210可以设置在第一焊盘区211和第二焊盘区212之间。As shown in FIGS. 12 to 14 , in an exemplary embodiment, the bridging flexible board may include a connection line area 210 , a first pad area 211 and a second pad area 212 , and the connection line area 210 may be disposed on the first pad area. Between the pad area 211 and the second pad area 212 .
在示例性实施方式中,连接线区210可以设置多条连接线81,连接线81的形状可以为沿着第一方向D1延伸的直线或者折线,多条连接线81可以在第二方向D2上依次设置。多条连接线81的第一端延伸到第一焊盘区211,与多个第三焊点对应连接,多条连接线81的第二端延伸到第二焊盘区212,与多个第四焊点对应连接。In an exemplary embodiment, the connection line region 210 may be provided with a plurality of connection lines 81, the shape of the connection lines 81 may be a straight line or a broken line extending along the first direction D1, and the plurality of connection lines 81 may be arranged in the second direction D2. Set in sequence. The first ends of the plurality of connection lines 81 extend to the first pad area 211 and are connected to the plurality of third pads correspondingly, and the second ends of the plurality of connection lines 81 extend to the second pad area 212 to connect with the plurality of third pads. Four solder joints correspond to connections.
在示例性实施方式中,第一焊盘区211可以包括第一焊点区211-1和第一点胶区211-2,第一焊点区211-1被配置为设置第一桥接焊盘,第一点胶区211-2可以设置在第一焊点区211-1的外围,通过点胶机对第一点胶区211-2的表面进行点胶,在第一点胶区211-2内形成点胶层。In an exemplary embodiment, the first pad area 211 may include a first pad area 211-1 and a first dispensing area 211-2, and the first pad area 211-1 is configured to set a first bridging pad , the first dispensing area 211-2 can be arranged on the periphery of the first solder joint area 211-1, and the surface of the first dispensing area 211-2 is dispensed by a glue dispenser, and the first dispensing area 211- 2 to form a dispensing layer.
在示例性实施方式中,第二焊盘区212可以包括第二焊点区212-1和第二点胶区212-2,第二焊点区212-1被配置为设置第二桥接焊盘,第二点胶区212-2可以设置在第二焊点区212-1的外围,通过点胶机对第二点胶区212-2的表面进行点胶,在第二点胶区212-2内形成点胶层。In an exemplary embodiment, the second pad area 212 may include a second pad area 212-1 and a second glue dispensing area 212-2, and the second pad area 212-1 is configured to set a second bridging pad , the second dispensing area 212-2 can be arranged on the periphery of the second solder joint area 212-1, and the surface of the second dispensing area 212-2 is dispensed by a glue dispenser, and in the second dispensing area 212- 2 to form a dispensing layer.
在示例性实施方式中,第一焊点区211-1和第二焊点区212-1可以称为球栅网格阵列封装(Ball Grid Array,简称BGA)区。In an exemplary embodiment, the first pad area 211-1 and the second pad area 212-1 may be referred to as Ball Grid Array (BGA for short) areas.
在示例性实施方式中,第三辅助线73与连接线81连接的第一连接点91可以位于第一点胶区211-2。由于第一点胶区设置有点胶层,因而第一点胶 区不易发生形变,本公开通过将第一连接点设置在第一点胶区,可以避免形变影响第三连接点,提高了连接可靠性。In an exemplary embodiment, the first connection point 91 where the third auxiliary line 73 is connected to the connection line 81 may be located in the first glue dispensing area 211-2. Since the first glue dispensing area is provided with a dispensing layer, the first glue dispensing area is not easily deformed. By setting the first connection point in the first glue dispensing area in the present disclosure, the deformation can be avoided from affecting the third connection point, and the connection is improved. reliability.
在示例性实施方式中,第四辅助线74与连接线81连接的第二连接点92可以位于第二点胶区212-2。由于第二点胶区设置有点胶层,因而第二点胶区不易发生形变,本公开通过将第二连接点设置在第二点胶区,可以避免形变影响第二连接点,提高了连接可靠性。In an exemplary embodiment, the second connection point 92 where the fourth auxiliary line 74 is connected to the connection line 81 may be located in the second glue dispensing area 212-2. Since the second glue dispensing area is provided with a dispensing layer, the second glue dispensing area is not easy to be deformed. By setting the second connection point in the second glue dispensing area in the present disclosure, the deformation can be avoided from affecting the second connection point, and the connection is improved. reliability.
图15为本公开示例性实施例柔性印刷电路板中另一种桥接柔性板的平面结构示意图。在示例性实施方式中,本示例性实施例桥接柔性板的结构与前述图12所示桥接柔性板的结构基本上相近,所不同的是,第三辅助线73与连接线81连接的第一连接点91可以位于连接线区210,第四辅助线74与连接线81连接的第二连接点92可以位于连接线区210。FIG. 15 is a schematic plan view of another bridging flexible board in the flexible printed circuit board of the exemplary embodiment of the present disclosure. In the exemplary embodiment, the structure of the bridging flexible board in this exemplary embodiment is basically similar to the structure of the bridging flexible board shown in FIG. The connection point 91 may be located in the connection line area 210 , and the second connection point 92 where the fourth auxiliary line 74 is connected to the connection line 81 may be located in the connection line area 210 .
在示例性实施方式中,由于连接线区远离BGA区,因而连接线区的表面比较平坦,本公开通过将第一连接点和第二连接点设置在连接线区,可以避免形变影响第一连接点和第二连接点,提高了连接可靠性。In an exemplary embodiment, since the connection line area is far away from the BGA area, the surface of the connection line area is relatively flat, and the present disclosure can prevent deformation from affecting the first connection by arranging the first connection point and the second connection point in the connection line area. point and a second connection point, improving connection reliability.
图16为本公开示例性实施例柔性印刷电路板中又一种桥接柔性板的平面结构示意图,示意了第一焊盘区211和部分连接线区210的结构。如图16所示,在示例性实施方式中,本示例性实施例桥接柔性板的结构与前述图12所示桥接柔性板的结构基本上相近,所不同的是,桥接柔性板上还设置有至少一个通孔90。FIG. 16 is a schematic plan view of another bridging flexible board in the flexible printed circuit board according to an exemplary embodiment of the present disclosure, illustrating the structure of the first pad area 211 and part of the connection line area 210 . As shown in Figure 16, in the exemplary embodiment, the structure of the bridging flexible board in this exemplary embodiment is basically similar to the structure of the bridging flexible board shown in Figure 12, the difference is that the bridging flexible board is also provided with at least one through hole 90 .
在示例性实施方式中,通孔90可以设置在第一焊盘区,和/或,可以设置在第二焊盘区的BGA区。In an exemplary embodiment, the via hole 90 may be disposed in the first pad area, and/or, may be disposed in the BGA area of the second pad area.
在示例性实施方式中,通孔90可以位于相邻的第三焊点之间,和/或,可以位于相邻的第四焊点之间。In an exemplary embodiment, the via hole 90 may be located between adjacent third pads, and/or, may be located between adjacent fourth pads.
在示例性实施方式中,通孔90的形状可以包括如下任意一种或多种:三角形、正方形、矩形、菱形、平行四边形、梯形、五边形、六边形,本公开在此不做限定。In an exemplary embodiment, the shape of the through hole 90 may include any one or more of the following: triangle, square, rectangle, rhombus, parallelogram, trapezoid, pentagon, hexagon, the present disclosure is not limited here .
在示例性实施方式中,通孔90尺寸可以小于或等于0.1mm,通孔的尺寸是指通孔的边缘上任意两点之间的距离的最大值。例如,通孔的形状为圆 形时,通孔的直径可以约为0.05mm、0.08mm或者0.1mm等。In an exemplary embodiment, the size of the through hole 90 may be less than or equal to 0.1 mm, and the size of the through hole refers to the maximum value of the distance between any two points on the edge of the through hole. For example, when the shape of the through hole is circular, the diameter of the through hole may be about 0.05 mm, 0.08 mm, or 0.1 mm.
在示例性实施方式中,通孔90与相邻的第三焊点之间的第二中心距L2可以约为0.55mm至0.65mm,和/或,通孔90与相邻的第四焊点之间的第二中心距L2可以约为0.55mm至0.65mm,第二中心距L2是通孔的几何中心与焊点的几何中心之间的距离。In an exemplary embodiment, the second center-to-center distance L2 between the through hole 90 and the adjacent third solder joint may be about 0.55 mm to 0.65 mm, and/or, the through hole 90 and the adjacent fourth solder joint The second center-to-center distance L2 may be about 0.55 mm to 0.65 mm, and the second center-to-center distance L2 is the distance between the geometric center of the through hole and the geometric center of the solder joint.
在示例性实施方式中,相邻的第三焊点或者相邻的第四焊点可以是第一方向D1相邻,或者,可以是第二方向D2相邻。In an exemplary embodiment, the adjacent third welding points or the adjacent fourth welding points may be adjacent in the first direction D1, or may be adjacent in the second direction D2.
图17为本公开示例性实施例一种柔性电路板的剖面结构示意图,为图16中A-A向的剖视图。如图17所示,在垂直于柔性电路板的平面内,桥接柔性板20设置在主柔性板10上,桥接柔性板20可以包括设置在主柔性板10上的桥接屏蔽层420、设置在桥接屏蔽层420远离主柔性板10一侧的第一桥接绿油层421、设置在第一桥接绿油层421远离主柔性板10一侧的第一桥接导电层422、设置在第一桥接导电层422远离主柔性板10一侧的桥接基材层423、设置在桥接基材层423远离主柔性板10一侧的第二桥接导电层424和设置在第二桥接导电层424远离主柔性板10一侧的第二桥接绿油层425。FIG. 17 is a schematic cross-sectional structure diagram of a flexible circuit board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view along the line A-A in FIG. 16 . As shown in FIG. 17 , in a plane perpendicular to the flexible circuit board, the bridge flexible board 20 is arranged on the main flexible board 10, and the bridge flexible board 20 may include a bridge shielding layer 420 arranged on the main flexible board 10, a bridge shield layer 420 arranged on the bridge The shielding layer 420 is away from the first bridging green oil layer 421 on the side of the main flexible board 10, the first bridging conductive layer 422 is set on the side of the first bridging green oil layer 421 away from the main flexible board 10, and the first bridging conductive layer 422 is set on the side away from the main flexible board 10. The bridging substrate layer 423 on one side of the main flexible board 10, the second bridging conductive layer 424 arranged on the side of the bridging substrate layer 423 away from the main flexible board 10, and the second bridging conductive layer 424 arranged on the side away from the main flexible board 10 The second bridging green oil layer 425.
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)设置有多个焊点过孔,焊点过孔内的桥接屏蔽层420、第一桥接绿油层421、第一桥接导电层422、桥接基材层423、第二桥接导电层424和第二桥接绿油层425被去掉,焊点过孔被配置为容置焊锡93以形成焊点,使桥接柔性板20与主柔性板10连接。In an exemplary embodiment, the first pad region 211 (or the second pad region 212) is provided with a plurality of solder joint vias, and the bridge shielding layer 420, the first bridge green oil layer 421, the second solder joint via hole A bridging conductive layer 422, a bridging base material layer 423, a second bridging conductive layer 424, and a second bridging green oil layer 425 are removed, and solder joint vias are configured to accommodate solder 93 to form solder joints, so that the bridging flexible board 20 and the second bridging green oil layer 425 are removed. The main flexible board 10 is connected.
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)可以设置有至少一个通孔90,通孔90可以位于焊点过孔之间,通孔90内的桥接屏蔽层420、第一桥接绿油层421、第一桥接导电层422、桥接基材层423、第二桥接导电层424和第二桥接绿油层425被去掉。在示例性实施方式中,通孔90被配置为作为气体流通通道,在进行真空回炉焊时使焊锡93间的气体排出,提高回炉焊过程中的排气效率,减少焊锡内和焊锡间的气泡,降低虚焊的情况发生。In an exemplary embodiment, the first pad region 211 (or the second pad region 212) may be provided with at least one through hole 90, the through hole 90 may be located between the solder vias, and the bridge shield in the through hole 90 Layer 420, first bridging green oil layer 421, first bridging conductive layer 422, bridging substrate layer 423, second bridging conductive layer 424, and second bridging green oil layer 425 are removed. In an exemplary embodiment, the through hole 90 is configured as a gas circulation channel to discharge the gas between the solder 93 during the vacuum reflow process, improve the exhaust efficiency during the reflow process, and reduce the air bubbles in the solder and between the solder , to reduce the occurrence of false welding.
在示例性实施方式中,第一桥接导电层422可以称为地铜层,第二桥接 导电层424可以称为走线层。In an exemplary embodiment, the first bridge conductive layer 422 may be called a ground copper layer, and the second bridge conductive layer 424 may be called a wiring layer.
在示例性实施方式中,主柔性板10可以包括外屏蔽层411、设置在外屏蔽层411上的覆盖层412、设置在覆盖层412远离外屏蔽层411一侧的第一主导电层413、设置在第一主导电层413远离外屏蔽层411一侧的主基材层414、设置在主基材层414远离外屏蔽层411一侧的第二主导电层415、设置在第二主导电层415远离外屏蔽层411一侧的主绿油层416和设置在主绿油层416远离外屏蔽层411一侧的主屏蔽层417。在示例性实施方式中,主屏蔽层417和主绿油层416上设置有多个主板过孔,主板过孔内的主屏蔽层417和主绿油层416被去掉,且主板过孔的位置与桥接柔性板20上的焊点过孔的位置相对应,桥接柔性板20上的焊点过孔可以暴露出第二主导电层415,使填充在焊点过孔内的焊锡93将桥接柔性板20与主柔性板10连接。In an exemplary embodiment, the main flexible board 10 may include an outer shielding layer 411, a cover layer 412 disposed on the outer shielding layer 411, a first main conductive layer 413 disposed on the side of the covering layer 412 away from the outer shielding layer 411, a set The main substrate layer 414 on the side of the first main conductive layer 413 away from the outer shielding layer 411, the second main conductive layer 415 arranged on the side of the main substrate layer 414 away from the outer shielding layer 411, and the second main conductive layer 415 arranged on the side of the second main conductive layer 415 is the main green oil layer 416 on the side away from the outer shielding layer 411 and the main shielding layer 417 is arranged on the side of the main green oil layer 416 away from the outer shielding layer 411 . In an exemplary embodiment, the main shielding layer 417 and the main green oil layer 416 are provided with a plurality of main board via holes, the main shielding layer 417 and the main green oil layer 416 in the main board via holes are removed, and the position of the main board via holes is the same as that of the bridge The positions of the via holes on the solder joints on the flexible board 20 are corresponding, and the via holes bridging the solder joints on the flexible board 20 can expose the second main conductive layer 415, so that the solder 93 filled in the via holes of the solder joints will bridge the flexible board 20 Connect with the main flexible board 10.
图18为本公开示例性实施例另一种柔性电路板的剖面结构示意图,为图16中A-A向的剖视图。如图18所示,本示例性实施例柔性电路板的主体结构与图17所示结构基本上相近,所不同的是,桥接柔性板的桥接屏蔽层被去除,主柔性板的主屏蔽层被去除。FIG. 18 is a schematic cross-sectional view of another flexible circuit board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view along the line A-A in FIG. 16 . As shown in FIG. 18, the main structure of the flexible circuit board in this exemplary embodiment is basically similar to that shown in FIG. remove.
在示例性实施方式中,桥接柔性板20可以包括设置在主柔性板10上的第一桥接绿油层421、设置在第一桥接绿油层421远离主柔性板10一侧的第一桥接导电层422、设置在第一桥接导电层422远离主柔性板10一侧的桥接基材层423、设置在桥接基材层423远离主柔性板10一侧的第二桥接导电层424和设置在第二桥接导电层424远离主柔性板10一侧的第二桥接绿油层425。In an exemplary embodiment, the bridging flexible board 20 may include a first bridging green oil layer 421 disposed on the main flexible board 10 , and a first bridging conductive layer 422 disposed on the side of the first bridging green oil layer 421 away from the main flexible board 10 , the bridging substrate layer 423 arranged on the side of the first bridging conductive layer 422 away from the main flexible board 10, the second bridging conductive layer 424 arranged on the side of the bridging substrate layer 423 away from the main flexible board 10, and the second bridging conductive layer 424 arranged on the second bridge The conductive layer 424 is away from the second bridging green oil layer 425 on the side of the main flexible board 10 .
在示例性实施方式中,主柔性板10可以包括外屏蔽层411、设置在外屏蔽层411上的覆盖层412、设置在覆盖层412远离外屏蔽层411一侧的第一主导电层413、设置在第一主导电层413远离外屏蔽层411一侧的主基材层414、设置在主基材层414远离外屏蔽层411一侧的第二主导电层415和设置在第二主导电层415远离外屏蔽层411一侧的主绿油层416。In an exemplary embodiment, the main flexible board 10 may include an outer shielding layer 411, a cover layer 412 disposed on the outer shielding layer 411, a first main conductive layer 413 disposed on the side of the covering layer 412 away from the outer shielding layer 411, a set The main substrate layer 414 on the side of the first main conductive layer 413 away from the outer shielding layer 411, the second main conductive layer 415 arranged on the side of the main substrate layer 414 away from the outer shielding layer 411, and the second main conductive layer 415 arranged on the side of the second main conductive layer 415 away from the main green oil layer 416 on the side of the outer shielding layer 411.
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)设置有多个焊点过孔,第一焊盘区211(或者第二焊盘区212)可以设置有至少一个通孔90。In an exemplary embodiment, the first pad area 211 (or the second pad area 212) is provided with a plurality of solder joint vias, and the first pad area 211 (or the second pad area 212) may be provided with at least A through hole 90.
一种柔性电路板的结构中,主柔性板通常包括主屏蔽膜,主屏蔽膜设置在主绿油层远离外屏蔽层的一侧,桥接柔性板通常包括桥接屏蔽膜,桥接屏蔽膜设置在第一桥接绿油层靠近主柔性板的一侧,形成桥接屏蔽膜与主屏蔽膜接触的结构。本示例性实施例所提出的柔性电路板,去除了主柔性板的主屏蔽膜和桥接柔性板的桥接屏蔽膜,形成主柔性板的主绿油层和桥接柔性板的第一桥接绿油层直接接触的结构,不仅能够减小柔性电路板的整体厚度,而且能够防止因屏蔽膜内聚力拉扯导致的变形,提高了表面平整度,提高了主柔性板和桥接柔性板的贴合程度。相比于现有柔性电路板结构,本示例性实施例柔性电路板去除主屏蔽膜和桥接屏蔽膜后的整体厚度可以减小约12μm至20μm左右。由于除了第一焊盘区和第二焊盘区,主柔性板和桥接柔性板之间无功能性连接,因而去除主屏蔽膜和桥接屏蔽膜不会影响屏蔽功能。In a flexible circuit board structure, the main flexible board usually includes a main shielding film, and the main shielding film is arranged on the side of the main green oil layer away from the outer shielding layer, and the bridging flexible board usually includes a bridging shielding film, and the bridging shielding film is arranged on the first The side of the bridging green oil layer close to the main flexible board forms a structure in which the bridging shielding film is in contact with the main shielding film. The flexible circuit board proposed in this exemplary embodiment removes the main shielding film of the main flexible board and the bridging shielding film of the bridging flexible board, forming a direct contact between the main green oil layer of the main flexible board and the first bridging green oil layer of the bridging flexible board The structure can not only reduce the overall thickness of the flexible circuit board, but also prevent the deformation caused by the cohesive pulling of the shielding film, improve the surface flatness, and improve the bonding degree of the main flexible board and the bridge flexible board. Compared with the existing flexible circuit board structure, the overall thickness of the flexible circuit board in this exemplary embodiment after removing the main shielding film and the bridging shielding film can be reduced by about 12 μm to 20 μm. Since there is no functional connection between the main flexible board and the bridging flexible board except for the first pad area and the second pad area, removing the main shielding film and the bridging shielding film will not affect the shielding function.
图19为本公开示例性实施例又一种柔性电路板的剖面结构示意图,为图16中A-A向的剖视图。如图19所示,本示例性实施例柔性电路板的主体结构与图17所示结构基本上相近,所不同的是,第一焊盘区211(或者第二焊盘区212)的地铜层被去除。FIG. 19 is a schematic cross-sectional view of yet another flexible circuit board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view along the line A-A in FIG. 16 . As shown in FIG. 19, the main structure of the flexible circuit board in this exemplary embodiment is basically similar to that shown in FIG. layer is removed.
在示例性实施方式中,桥接柔性板20可以包括设置在主柔性板10上的桥接屏蔽层420、设置在桥接屏蔽层420远离主柔性板10一侧的第一桥接绿油层421、设置在第一桥接绿油层421远离主柔性板10一侧的第一桥接导电层422、设置在第一桥接导电层422远离主柔性板10一侧的桥接基材层423、设置在桥接基材层423远离主柔性板10一侧的第二桥接导电层424和设置在第二桥接导电层424远离主柔性板10一侧的第二桥接绿油层425。In an exemplary embodiment, the bridging flexible board 20 may include a bridging shielding layer 420 disposed on the main flexible board 10, a first bridging green oil layer 421 disposed on the side of the bridging shielding layer 420 away from the main flexible board 10, a first bridging green oil layer 421 disposed on the second A bridging green oil layer 421 away from the first bridging conductive layer 422 on the side of the main flexible board 10, a bridging substrate layer 423 arranged on the side of the first bridging conductive layer 422 away from the main flexible board 10, a bridging substrate layer 423 arranged on the side away from the bridging substrate layer 423 The second bridging conductive layer 424 on the side of the main flexible board 10 and the second bridging green oil layer 425 disposed on the side of the second bridging conductive layer 424 away from the main flexible board 10 .
在示例性实施方式中,第一桥接导电层422仅设置在连接线区210,第一焊盘区211(或者第二焊盘区212)的第一桥接导电层422被去除,仅保留焊点过孔处的过孔铜环,过孔铜环被配置为保证桥接柔性板20与主柔性板10的连接可靠性。In an exemplary embodiment, the first bridging conductive layer 422 is only disposed on the connection line region 210, the first bridging conductive layer 422 of the first pad region 211 (or the second pad region 212) is removed, and only the solder joints remain The via copper ring at the via hole is configured to ensure the connection reliability between the bridging flexible board 20 and the main flexible board 10 .
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)中靠近连接线区210一侧的焊点与连接线区210中第一桥接导电层422靠近焊点一侧的边缘之间的距离L3可以大于或等于1.0mm,以减少第一焊盘区211(或者第二焊盘区212)附近的段差,提高该区域的平整度。In an exemplary embodiment, the solder joint in the first pad area 211 (or the second pad area 212 ) close to the connection line area 210 is connected to the side of the first bridge conductive layer 422 in the connection line area 210 close to the solder joint. The distance L3 between the edges can be greater than or equal to 1.0 mm, so as to reduce the level difference near the first pad area 211 (or the second pad area 212 ) and improve the flatness of this area.
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)设置有多个焊点过孔,第一焊盘区211(或者第二焊盘区212)可以设置有至少一个通孔90,主柔性板的结构与图17所示的主柔性板的结构基本上相同。In an exemplary embodiment, the first pad area 211 (or the second pad area 212) is provided with a plurality of solder joint vias, and the first pad area 211 (or the second pad area 212) may be provided with at least A through hole 90, the structure of the main flexible board is basically the same as the structure of the main flexible board shown in FIG. 17 .
一种柔性电路板的结构中,通常是在焊盘区设置开口,开口内的地铜层被去掉,开口外的地铜层被保留,多个焊点设置在地铜开口内,焊点与地铜开口边缘之间的最小距离约为0.3mm左右。经本申请发明人研究发现,由于焊盘区仍保留较大面积的地铜层,造成焊点之间的间距较小,回炉焊时焊盘区易变形。本示例性实施例通过将焊盘区的地铜层去除,增加了焊点区的面积,增加了焊点之间的间距,不仅可以减小焊盘区的变形风险,而且可以在焊点之间设置通孔,提高回炉焊过程中的排气效率,减少焊锡内及焊锡间气泡,降低虚焊的情况发生。相比于现有柔性电路板结构,本示例性实施例柔性电路板提高了焊接可靠性,降低了不良风险,提高了产品良率。此外,本示例性实施例有效减小了柔性电路板的整体厚度,相比于现有柔性电路板结构,本示例性实施例通过去除焊盘区的地铜层,柔性电路板的整体厚度可以减小约8μm至12μm左右。In the structure of a flexible circuit board, an opening is usually provided in the pad area, the ground copper layer in the opening is removed, the ground copper layer outside the opening is retained, and a plurality of solder joints are arranged in the ground copper opening. The minimum distance between the opening edges of the ground copper is about 0.3mm. The inventors of the present application have found through research that since the pad area still retains a large area of ground copper layer, the spacing between solder joints is small, and the pad area is easily deformed during reflow soldering. In this exemplary embodiment, by removing the ground copper layer in the pad area, the area of the solder joint area is increased, and the distance between the solder joints is increased, which not only reduces the risk of deformation in the pad area, but also can Set through holes between them to improve the exhaust efficiency during reflow soldering, reduce air bubbles in and between solders, and reduce the occurrence of false soldering. Compared with the existing flexible circuit board structure, the flexible circuit board in this exemplary embodiment improves soldering reliability, reduces the risk of failure, and improves product yield. In addition, this exemplary embodiment effectively reduces the overall thickness of the flexible circuit board. Compared with the existing flexible circuit board structure, this exemplary embodiment removes the ground copper layer in the pad area, and the overall thickness of the flexible circuit board can be reduced. The reduction is about 8 μm to about 12 μm.
图20为本公开示例性实施例又一种桥接柔性板的剖面结构示意图,为图16中A-A向的剖视图。如图20所示,本示例性实施例柔性电路板的主体结构与图17所示结构基本上相近,所不同的是,桥接柔性板的桥接屏蔽层被去除,主柔性板的主屏蔽层被去除,第一焊盘区211(或者第二焊盘区212)的地铜层被去除。FIG. 20 is a schematic cross-sectional view of another bridging flexible board according to an exemplary embodiment of the present disclosure, which is a cross-sectional view taken along the line A-A in FIG. 16 . As shown in FIG. 20, the main structure of the flexible circuit board in this exemplary embodiment is basically similar to that shown in FIG. Removal, the ground copper layer of the first pad region 211 (or the second pad region 212 ) is removed.
在示例性实施方式中,桥接柔性板20可以包括设置在主柔性板10上的第一桥接绿油层421、设置在第一桥接绿油层421远离主柔性板10一侧的第一桥接导电层422、设置在第一桥接导电层422远离主柔性板10一侧的桥接基材层423、设置在桥接基材层423远离主柔性板10一侧的第二桥接导电层424和设置在第二桥接导电层424远离主柔性板10一侧的第二桥接绿油层425。In an exemplary embodiment, the bridging flexible board 20 may include a first bridging green oil layer 421 disposed on the main flexible board 10 , and a first bridging conductive layer 422 disposed on the side of the first bridging green oil layer 421 away from the main flexible board 10 , the bridging substrate layer 423 arranged on the side of the first bridging conductive layer 422 away from the main flexible board 10, the second bridging conductive layer 424 arranged on the side of the bridging substrate layer 423 away from the main flexible board 10, and the second bridging conductive layer 424 arranged on the second bridge The conductive layer 424 is away from the second bridging green oil layer 425 on the side of the main flexible board 10 .
在示例性实施方式中,主柔性板10可以包括外屏蔽层411、设置在外屏蔽层411上的覆盖层412、设置在覆盖层412远离外屏蔽层411一侧的第一主导电层413、设置在第一主导电层413远离外屏蔽层411一侧的主基材层 414、设置在主基材层414远离外屏蔽层411一侧的第二主导电层415和设置在第二主导电层415远离外屏蔽层411一侧的主绿油层416。在示例性实施方式中,主绿油层416上设置有多个绿油过孔,绿油过孔内的主绿油层416被去掉,且绿油过孔的位置与桥接柔性板20上的焊点过孔的位置相对应,桥接柔性板20上的焊点过孔可以暴露出第二主导电层415,使填充在焊点过孔内的焊锡93将桥接柔性板20与主柔性板10连接。In an exemplary embodiment, the main flexible board 10 may include an outer shielding layer 411, a cover layer 412 disposed on the outer shielding layer 411, a first main conductive layer 413 disposed on the side of the covering layer 412 away from the outer shielding layer 411, a set The main substrate layer 414 on the side of the first main conductive layer 413 away from the outer shielding layer 411, the second main conductive layer 415 arranged on the side of the main substrate layer 414 away from the outer shielding layer 411, and the second main conductive layer 415 arranged on the side of the second main conductive layer 415 away from the main green oil layer 416 on the side of the outer shielding layer 411. In an exemplary embodiment, the main green oil layer 416 is provided with a plurality of green oil via holes, the main green oil layer 416 in the green oil via holes is removed, and the positions of the green oil via holes are in line with the solder joints on the bridging flexible board 20 The positions of the via holes are corresponding, and the solder joint via holes on the bridging flexible board 20 can expose the second main conductive layer 415 , so that the solder 93 filled in the solder joint via holes connects the bridging flexible board 20 to the main flexible board 10 .
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)设置有多个焊点过孔,焊点过孔内的第一桥接绿油层421、第一桥接导电层422、桥接基材层423、第二桥接导电层424和第二桥接绿油层425被去掉,焊点过孔被配置为容置焊锡93以形成焊点,使桥接柔性板20与主柔性板10连接。In an exemplary embodiment, the first pad area 211 (or the second pad area 212) is provided with a plurality of solder joint vias, and the first bridge green oil layer 421 and the first bridge conductive layer 422 in the solder joint vias , the bridging substrate layer 423, the second bridging conductive layer 424 and the second bridging green oil layer 425 are removed, and the solder joint vias are configured to accommodate the solder 93 to form solder joints, so that the bridging flexible board 20 is connected to the main flexible board 10 .
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)可以设置有至少一个通孔90,通孔90可以位于焊点过孔之间。在示例性实施方式中,通孔90被配置为作为气体流通通道,在进行真空回炉焊时使焊锡93间的气体排出,提高回炉焊过程中的排气效率,减少焊锡内和焊锡间的气泡,降低虚焊的情况发生。In an exemplary embodiment, the first pad region 211 (or the second pad region 212 ) may be provided with at least one through hole 90 , and the through hole 90 may be located between the pad via holes. In an exemplary embodiment, the through hole 90 is configured as a gas circulation channel to discharge the gas between the solder 93 during the vacuum reflow process, improve the exhaust efficiency during the reflow process, and reduce the air bubbles in the solder and between the solder , to reduce the occurrence of false welding.
在示例性实施方式中,第一桥接导电层422仅设置在连接线区210,第一焊盘区211(或者第二焊盘区212)的第一桥接导电层422被去除,仅保留焊点过孔处的过孔铜环,过孔铜环被配置为保证桥接柔性板20与主柔性板10的连接可靠性。In an exemplary embodiment, the first bridging conductive layer 422 is only disposed on the connection line region 210, the first bridging conductive layer 422 of the first pad region 211 (or the second pad region 212) is removed, and only the solder joints remain The via copper ring at the via hole is configured to ensure the connection reliability between the bridging flexible board 20 and the main flexible board 10 .
在示例性实施方式中,第一焊盘区211(或者第二焊盘区212)中靠近连接线区210一侧的焊点与连接线区210中第一桥接导电层422靠近焊点一侧的边缘之间的距离L3可以大于或等于1.0mm,以减少第一焊盘区211(或者第二焊盘区212)附近的段差,提高该区域的平整度。In an exemplary embodiment, the solder joint in the first pad area 211 (or the second pad area 212 ) close to the connection line area 210 is connected to the side of the first bridge conductive layer 422 in the connection line area 210 close to the solder joint. The distance L3 between the edges can be greater than or equal to 1.0 mm, so as to reduce the level difference near the first pad area 211 (or the second pad area 212 ) and improve the flatness of this area.
本示例性实施例通过将焊盘区的地铜层去除,增加了焊点区的面积,增加了焊点之间的间距,不仅可以减小焊盘区的变形风险,而且可以在焊点之间设置通孔,提高回炉焊过程中的排气效率,减少焊锡内及焊锡间气泡,降低虚焊的情况发生。相比于现有柔性电路板结构,本示例性实施例柔性电路板提高了焊接可靠性,降低了不良风险,提高了产品良率。此外,本示例性实施例通过去除主柔性板的主屏蔽膜和桥接柔性板的桥接屏蔽膜,且去除焊 盘区的地铜层,最大限度地减小了柔性电路板的整体厚度,相比于现有柔性电路板结构,本示例性实施例柔性电路板的整体厚度可以减小约20μm至32μm左右。In this exemplary embodiment, by removing the ground copper layer in the pad area, the area of the solder joint area is increased, and the distance between the solder joints is increased, which not only reduces the risk of deformation in the pad area, but also can Set through holes between them to improve the exhaust efficiency during reflow soldering, reduce air bubbles in and between solders, and reduce the occurrence of false soldering. Compared with the existing flexible circuit board structure, the flexible circuit board in this exemplary embodiment improves soldering reliability, reduces the risk of failure, and improves product yield. In addition, the present exemplary embodiment minimizes the overall thickness of the flexible circuit board by removing the main shielding film of the main flexible board and the bridging shielding film of the bridging flexible board, and removing the ground copper layer in the pad area, compared with Compared with the existing flexible circuit board structure, the overall thickness of the flexible circuit board in this exemplary embodiment can be reduced by about 20 μm to 32 μm.
本公开示例性实施例还提供了一种显示触控装置,包括触控显示面板以及前述的柔性印刷电路板,所述触控显示面板可以包括有效区域和位于所述有效区域一侧的绑定区域,所述绑定区域可以包括绑定引脚区,所述柔性印刷电路板与所述绑定引脚区连接。Exemplary embodiments of the present disclosure also provide a display touch device, including a touch display panel and the aforementioned flexible printed circuit board, the touch display panel may include an active area and a binding on one side of the active area The binding area may include a binding pin area, and the flexible printed circuit board is connected to the binding pin area.
在示例性实施方式中,本公开显示触控装置可以为:手机、平板电脑、电视机、显示器、笔记本电脑、数码相机、数码相框、导航仪等任何具有显示功能的产品或部件。In an exemplary embodiment, the display touch device of the present disclosure may be any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital camera, a digital photo frame, and a navigator.
虽然本公开所揭露的实施方式如上,但所述的内容仅为便于理解本公开而采用的实施方式,并非用以限定本发明。任何所属领域内的技术人员,在不脱离本公开所揭露的精神和范围的前提下,可以在实施的形式及细节上进行任何的修改与变化,但本发明的专利保护范围,仍须以所附的权利要求书所界定的范围为准。Although the embodiments disclosed in the present disclosure are as above, the described content is only an embodiment adopted for understanding the present disclosure, and is not intended to limit the present invention. Any person skilled in the art can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in the present disclosure, but the patent protection scope of the present invention must still be based on the The scope defined by the appended claims shall prevail.
Claims (16)
- 一种柔性印刷电路板,包括主柔性板和桥接柔性板,所述主柔性板至少包括第一主焊盘、第二主焊盘、至少一条第一信号线和至少一条第二信号线,所述桥接柔性板至少包括第一桥接焊盘、第二桥接焊盘和至少一条连接线;所述第一主焊盘包括至少二个第一焊点,所述第二主焊盘包括至少二个第二焊点,所述第一信号线与一个第一焊点连接,所述第二信号线与一个第二焊点连接;所述第一桥接焊盘包括至少二个第三焊点,所述第二桥接焊盘包括至少二个第四焊点,所述连接线的第一端与一个第三焊点连接,所述连接线的第二端与一个第四焊点连接;所述第一焊点与所述第三焊点通过焊锡连接,所述第二焊点与所述第四焊点通过焊锡连接;所述柔性印刷电路板还包括第一辅助线、第二辅助线、第三辅助线和第四辅助线中的任意一条或多条;所述第一辅助线的第一端与所述第一信号线连接,所述第一辅助线的第二端与另一个第一焊点连接;所述第二辅助线的第一端与所述第二信号线连接,所述第二辅助线的第二端与另一个第二焊点连接;所述第三辅助线的第一端与所述连接线连接,所述第三辅助线的第二端与另一个第三焊点连接;所述第四辅助线的第一端与所述连接线连接,所述第四辅助线的第二端与另一个第四焊点连接。A flexible printed circuit board, comprising a main flexible board and a bridging flexible board, the main flexible board at least includes a first main pad, a second main pad, at least one first signal line and at least one second signal line, so The bridging flexible board at least includes a first bridging pad, a second bridging pad, and at least one connection line; the first main pad includes at least two first solder points, and the second main pad includes at least two The second welding point, the first signal line is connected to a first welding point, and the second signal line is connected to a second welding point; the first bridging pad includes at least two third welding points, so The second bridging pad includes at least two fourth welding points, the first end of the connecting line is connected to a third welding point, and the second end of the connecting line is connected to a fourth welding point; the first A soldering point is connected to the third soldering point through soldering, and the second soldering point is connected to the fourth soldering point through soldering; the flexible printed circuit board also includes a first auxiliary line, a second auxiliary line, a first Any one or more of the three auxiliary lines and the fourth auxiliary line; the first end of the first auxiliary line is connected to the first signal line, and the second end of the first auxiliary line is connected to another first Solder point connection; the first end of the second auxiliary line is connected to the second signal line, and the second end of the second auxiliary line is connected to another second solder point; the first end of the third auxiliary line One end is connected to the connection line, the second end of the third auxiliary line is connected to another third welding point; the first end of the fourth auxiliary line is connected to the connection line, and the fourth auxiliary line The second end of the wire is connected to another fourth pad.
- 根据权利要求1所述的柔性印刷电路板,其中,所述主柔性板包括触控驱动电路和至少一个端子,所述第一信号线的第一端与所述端子连接,所述第一信号线的第二端与所述第一主焊盘的第一焊点连接,所述第二信号线的第一端与所述触控驱动电路连接,所述第二信号线的第二端与所述第二主焊盘的第二焊点连接。The flexible printed circuit board according to claim 1, wherein the main flexible board includes a touch drive circuit and at least one terminal, the first end of the first signal line is connected to the terminal, and the first signal line The second end of the line is connected to the first pad of the first main pad, the first end of the second signal line is connected to the touch driving circuit, and the second end of the second signal line is connected to the The second solder joint of the second main pad is connected.
- 根据权利要求1所述的柔性印刷电路板,其中,所述第一主焊盘包括多个第一焊点,多个第一焊点以矩阵方式排列成焊点阵列,多个第一焊点包括位于所述焊点阵列内侧的至少一个第一功能性焊点和位于所述焊点阵列外侧的至少一个第一非功能性焊点,所述第一信号线与所述第一功能性焊点连接,所述第一辅助线与所述第一非功能性焊点连接。The flexible printed circuit board according to claim 1, wherein the first main pad includes a plurality of first soldering points, the plurality of first soldering points are arranged in a matrix to form a soldering point array, and the plurality of first soldering points including at least one first functional solder joint located inside the solder joint array and at least one first non-functional solder joint located outside the solder joint array, the first signal line and the first functional solder joint point connection, the first auxiliary line is connected to the first non-functional soldering point.
- 根据权利要求1所述的柔性印刷电路板,其中,所述第二主焊盘包括多个第二焊点,多个第二焊点以矩阵方式排列成焊点阵列,多个第二焊点包 括位于所述焊点阵列内侧的至少一个第二功能性焊点和位于所述焊点阵列外侧的至少一个第二非功能性焊点,所述第二信号线与所述第二功能性焊点连接,所述第一辅助线与所述第二非功能性焊点连接。The flexible printed circuit board according to claim 1, wherein the second main pad includes a plurality of second soldering points, the plurality of second soldering points are arranged in a matrix to form a soldering point array, and the plurality of second soldering points including at least one second functional solder joint located inside the solder joint array and at least one second non-functional solder joint located outside the solder joint array, the second signal line is connected to the second functional solder joint point connection, the first auxiliary line is connected to the second non-functional welding point.
- 根据权利要求1所述的柔性印刷电路板,其中,所述第一桥接焊盘包括多个第三焊点,多个第三焊点以矩阵方式排列成焊点阵列,多个第三焊点包括位于所述焊点阵列内侧的至少一个第三功能性焊点和位于所述焊点阵列外侧的至少一个第三非功能性焊点,所述连接线与所述第三功能性焊点连接,所述第三辅助线与所述第三非功能性焊点连接。The flexible printed circuit board according to claim 1, wherein the first bridging pad includes a plurality of third soldering points, the plurality of third soldering points are arranged in a matrix to form a soldering point array, and the plurality of third soldering points including at least one third functional soldering point located inside the soldering point array and at least one third non-functional soldering point located outside the soldering point array, the connection line is connected to the third functional soldering point , the third auxiliary line is connected to the third non-functional solder joint.
- 根据权利要求1所述的柔性印刷电路板,其中,所述第二桥接焊盘包括多个第四焊点,多个第四焊点以矩阵方式排列成焊点阵列,多个第四焊点包括位于所述焊点阵列内侧的至少一个第四功能性焊点和位于所述焊点阵列外侧的至少一个第四非功能性焊点,所述连接线与所述第四功能性焊点连接,所述第四辅助线与所述第四非功能性焊点连接。The flexible printed circuit board according to claim 1, wherein the second bridging pad includes a plurality of fourth welding points, the plurality of fourth welding points are arranged in a matrix to form a welding point array, and the plurality of fourth welding points including at least one fourth functional soldering point located inside the soldering point array and at least one fourth non-functional soldering point located outside the soldering point array, the connection line is connected to the fourth functional soldering point , the fourth auxiliary line is connected to the fourth non-functional solder joint.
- 根据权利要求1所述的柔性印刷电路板,其中,所述桥接柔性板包括连接线区、第一焊盘区和第二焊盘区,所述连接线区设置在所述第一焊盘区和第二焊盘区之间;所述连接线设置在所述连接线区,所述第一桥接焊盘设置在所述第一焊盘区,所述第二桥接焊盘设置在所述第二焊盘区;所述第三辅助线与所述连接线连接的第一连接点位于所述连接线区,和/或,所述第四辅助线与所述连接线连接的第二连接点位于所述连接线区。The flexible printed circuit board according to claim 1, wherein the bridging flexible board comprises a connection line area, a first pad area and a second pad area, and the connection line area is arranged on the first pad area and the second pad area; the connecting line is set in the connecting line area, the first bridge pad is set in the first pad area, and the second bridge pad is set in the first pad area The second pad area; the first connection point where the third auxiliary line is connected to the connection line is located in the connection line area, and/or the second connection point where the fourth auxiliary line is connected to the connection line located in the connection line area.
- 根据权利要求1所述的柔性印刷电路板,其中,所述桥接柔性板包括连接线区、第一焊盘区和第二焊盘区,所述连接线区设置在所述第一焊盘区和第二焊盘区之间,所述连接线设置在所述连接线区;所述第一焊盘区包括第一焊点区和第一点胶区,所述第一焊点区设置所述第一桥接焊盘,所述第一点胶区设置在所述第一焊点区的外围;所述第二焊盘区包括第二焊点区和第二点胶区,所述第二焊点区设置所述第二桥接焊盘,所述第二点胶区设置在所述第二焊点区的外围;所述第三辅助线与所述连接线连接的第一连接点位于所述第一点胶区,和/或,所述第四辅助线与所述连接线连接的第二连接点位于所述第二点胶区。The flexible printed circuit board according to claim 1, wherein the bridging flexible board comprises a connection line area, a first pad area and a second pad area, and the connection line area is arranged on the first pad area Between the second pad area, the connection line is arranged in the connection line area; the first pad area includes a first pad area and a first dispensing area, and the first pad area is provided with the first pad area The first bridging pad, the first dispensing area is arranged on the periphery of the first pad area; the second pad area includes a second soldering area and a second dispensing area, the second The second bridging pad is provided in the pad area, and the second dispensing area is arranged on the periphery of the second pad area; the first connection point where the third auxiliary line is connected to the connection line is located at the The first dispensing area, and/or, the second connection point where the fourth auxiliary line connects with the connection line is located in the second dispensing area.
- 根据权利要求1所述的柔性印刷电路板,其中,相邻的第一焊点之间 的中心距为1.05mm至1.25mm;和/或,相邻的第二焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第三焊点之间的中心距为1.05mm至1.25mm;和/或,相邻的第四焊点之间的中心距为1.05mm至1.25mm。The flexible printed circuit board according to claim 1, wherein the center-to-center distance between adjacent first soldering points is 1.05 mm to 1.25 mm; and/or, the center-to-center distance between adjacent second soldering points is 1.05mm to 1.25mm; and/or, the center-to-center distance between adjacent third solder joints is 1.05mm to 1.25mm; and/or, the center-to-center distance between adjacent fourth solder joints is 1.05mm to 1.25mm mm.
- 根据权利要求1所述的柔性印刷电路板,其中,所述第一桥接焊盘还包括至少一个通孔,所述通孔设置在所述相邻的第三焊点之间;和/或,所述第二桥接焊盘还包括至少一个通孔,所述通孔设置在所述相邻的第四焊点之间。The flexible printed circuit board according to claim 1, wherein the first bridging pad further comprises at least one through hole disposed between the adjacent third soldering points; and/or, The second bridging pad further includes at least one through hole disposed between the adjacent fourth pads.
- 根据权利要求10所述的柔性印刷电路板,其中,所述通孔的尺寸小于或等于0.1mm,所述通孔的尺寸是指通孔边缘上任意两点之间距离的最大值。The flexible printed circuit board according to claim 10, wherein the size of the through hole is less than or equal to 0.1 mm, and the size of the through hole refers to the maximum distance between any two points on the edge of the through hole.
- 根据权利要求10所述的柔性印刷电路板,其中,所述通孔与相邻第三焊点之间的中心距为0.55mm至0.65mm;和/或,所述通孔与相邻第四焊点之间的中心距为0.55mm至0.65mm。The flexible printed circuit board according to claim 10, wherein, the center distance between the through hole and the adjacent third solder joint is 0.55 mm to 0.65 mm; and/or, the through hole and the adjacent fourth The center distance between solder joints is 0.55mm to 0.65mm.
- 根据权利要求1至12任一项所述的柔性印刷电路板,其中,在垂直于柔性印刷电路板的平面内,所述桥接柔性板设置在所述主柔性板上,所述桥接柔性板包括设置在所述主柔性板上的第一桥接绿油层、设置在所述第一桥接绿油层远离所述主柔性板一侧的第一桥接导电层、设置在所述第一桥接导电层远离所述主柔性板一侧的桥接基材层、设置在所述桥接基材层远离所述主柔性板一侧的第二桥接导电层以及设置在所述第二桥接导电层远离所述主柔性板一侧的第二桥接绿油层;所述第一桥接导电层仅设置在所述桥接柔性板的连接线区。The flexible printed circuit board according to any one of claims 1 to 12, wherein, in a plane perpendicular to the flexible printed circuit board, the bridging flexible board is arranged on the main flexible board, and the bridging flexible board includes The first bridging green oil layer arranged on the main flexible board, the first bridging conductive layer arranged on the side of the first bridging green oil layer away from the main flexible board, the first bridging conductive layer arranged on the side far away from the first bridging conductive layer The bridging substrate layer on one side of the main flexible board, the second bridging conductive layer arranged on the side of the bridging substrate layer away from the main flexible board, and the second bridging conductive layer arranged on the side away from the main flexible board The second bridging green oil layer on one side; the first bridging conductive layer is only provided in the connecting line area of the bridging flexible board.
- 根据权利要求13所述的柔性印刷电路板,其中,所述第三焊点靠近所述连接线区一侧的边缘与所述连接线区中所述第一桥接导电层靠近所述第三焊点一侧的边缘之间的距离大于或等于1.0mm,和/或,所述第四焊点靠近所述连接线区一侧的边缘与所述连接线区中所述第一桥接导电层靠近所述第四焊点一侧的边缘之间的距离大于或等于1.0mm。The flexible printed circuit board according to claim 13, wherein, the edge of the third solder joint close to the side of the connection line region is connected to the first bridging conductive layer in the connection line region close to the third solder joint. The distance between the edges on one side of the points is greater than or equal to 1.0 mm, and/or, the edge of the fourth solder joint close to the connecting line area is close to the first bridging conductive layer in the connecting line area The distance between edges on one side of the fourth welding spot is greater than or equal to 1.0 mm.
- 根据权利要求13所述的柔性印刷电路板,其中,所述主柔性板包括屏蔽层、设置在所述屏蔽层上的覆盖层、设置在所述覆盖层远离所述屏蔽层 一侧的第一主导电层、设置在所述第一主导电层远离所述屏蔽层一侧的主基材层、设置在所述主基材层远离所述屏蔽层一侧的第二主导电层以及设置在所述第二主导电层远离所述屏蔽层一侧的主绿油层;所述桥接柔性板的第一桥接绿油层与所述主绿油层直接接触。The flexible printed circuit board according to claim 13, wherein the main flexible board comprises a shielding layer, a covering layer disposed on the shielding layer, a first first disposed on a side of the covering layer away from the shielding layer. The main conductive layer, the main substrate layer arranged on the side of the first main conductive layer away from the shielding layer, the second main conductive layer arranged on the side of the main substrate layer away from the shielding layer, and the The second main conductive layer is away from the main green oil layer on the side of the shielding layer; the first bridging green oil layer of the bridging flexible board is in direct contact with the main green oil layer.
- 一种显示触控装置,包括触控显示面板以及如权利要求1至15任一项所述的柔性印刷电路板,所述触控显示面板包括有效区域和位于所述有效区域一侧的绑定区域,所述绑定区域包括绑定引脚区,所述柔性印刷电路板与所述绑定引脚区连接。A display touch device, comprising a touch display panel and the flexible printed circuit board according to any one of claims 1 to 15, the touch display panel comprising an effective area and a binding on one side of the effective area An area, the binding area includes a binding pin area, and the flexible printed circuit board is connected to the binding pin area.
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