WO2023134271A1 - 光模块光功率异常判定修正方法及光模块 - Google Patents

光模块光功率异常判定修正方法及光模块 Download PDF

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Publication number
WO2023134271A1
WO2023134271A1 PCT/CN2022/128566 CN2022128566W WO2023134271A1 WO 2023134271 A1 WO2023134271 A1 WO 2023134271A1 CN 2022128566 W CN2022128566 W CN 2022128566W WO 2023134271 A1 WO2023134271 A1 WO 2023134271A1
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WIPO (PCT)
Prior art keywords
value
sampling value
inflection point
optical
optical power
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PCT/CN2022/128566
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English (en)
French (fr)
Inventor
吴堂猛
李刚
石良
金成浩
路磊
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Hisense Broadband Multimedia Technology Co Ltd
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Hisense Broadband Multimedia Technology Co Ltd
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Priority to CN202280078900.0A priority Critical patent/CN118285072A/zh
Publication of WO2023134271A1 publication Critical patent/WO2023134271A1/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
    • H04B10/075—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal
    • H04B10/079—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
    • H04B10/0795—Performance monitoring; Measurement of transmission parameters
    • H04B10/07955—Monitoring or measuring power
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
    • H04B10/073—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an out-of-service signal

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular to a method for judging and correcting abnormal optical power of an optical module and an optical module.
  • optical communication technology the optical module is a tool to realize the mutual conversion of photoelectric signals, and it is one of the key components in optical communication equipment.
  • the transmission rate of optical modules continues to increase.
  • some embodiments of the present disclosure disclose a method for judging and correcting abnormal optical power of an optical module, including: obtaining an inflection point sampling value, and the inflection point sampling value is an optical power sampling corresponding to an inflection point where a preset fitting calibration curve bends value; determine whether the current actual sampling value is greater than the inflection point sampling value; if the current actual sampling value is greater than the inflection point sampling value, obtain a symmetrical sampling value, and the symmetrical sampling value and the current actual sampling value are relative to the inflection point
  • the sampling value is symmetrical; according to the symmetrical sampling value, the inflection point sampling value, and the fitted calibration curve, the symmetrical analog value and the inflection point analog value are calculated; according to the symmetrical sampling value, the inflection point sampling value, The symmetrical analog value and the inflection point analog value are used to calculate a correction algorithm curve; the current actual sampling value is substituted into the correction algorithm curve to calculate an optical power analog value of the current actual sampling
  • an optical module including: an optical emitting device configured to convert an electrical signal into an optical signal; an optical power sampling circuit whose input end is connected to the optical emitting device to acquire The sampling value of the optical signal; the MCU is connected to the output end of the optical power sampling circuit, and an analog curve is built in to convert the sampling value into an analog value; the analog curve includes: a quadratic fitting calibration curve and Correction algorithm curve for large light segment.
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments
  • Fig. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Fig. 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • FIG. 5 is a schematic diagram of a quadratic fitting calibration curve according to some embodiments.
  • Fig. 6 is a schematic diagram of a correction algorithm curve according to some embodiments.
  • Fig. 7 is a schematic flow chart of calculating the sampling value of the inflection point using the Newton iterative method according to some embodiments.
  • Fig. 8 is a schematic flowchart of calculating an analog value of optical power in a large optical segment according to some embodiments.
  • first and second are only configured for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of some embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • the term “coupled” may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact.
  • the terms “coupled” or “communicatively coupled” may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited by the context herein.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • optical communication technology In optical communication technology, light is used to carry information to be transmitted, and the optical signal carrying information is transmitted to information processing equipment such as a computer through optical fiber or optical waveguide and other information transmission equipment to complete the information transmission. Because optical signals have passive transmission characteristics when they are transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (such as an optical modem) through the electrical port. It is mainly configured to realize power supply, I2C signal transmission, data signal transmission, and grounding; the optical network terminal transmits electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).
  • Wi-Fi wireless fidelity technology
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103;
  • optical fiber 101 One end of the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • Optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long-distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach thousands of kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: routers, switches, computers, mobile phones, tablet computers, televisions, and so on.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; electrical signal connection.
  • the optical module 200 implements mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101 .
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 A two-way electrical signal connection is established.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100, as the host computer of the optical module 200, can monitor the optical module 200 work.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • OLT optical Line Terminal
  • the remote server 1000 establishes a two-way signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 further includes a PCB circuit board 105 disposed in the casing, a cage 106 disposed on the surface of the PCB circuit board 105 , and an electrical connector disposed inside the cage 106 .
  • the electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other raised parts that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 .
  • the heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107 .
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100 .
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.
  • Fig. 3 is a structural diagram of an optical module according to some embodiments
  • Fig. 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a housing and a circuit board 300 disposed in the housing;
  • the casing includes an upper casing 201 and a lower casing 202.
  • the upper casing 201 is covered on the lower casing 202 to form the above casing with two openings 204 and 205; the outer contour of the casing is generally square.
  • the lower case 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the two upper side plates are combined by two side walls and two side plates to realize that the upper case 201 is covered on the lower case 202 .
  • the direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may not be consistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the left end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the right end in FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger of the circuit board 300 is stretched out from the electrical port 204, and is inserted into a host computer (such as the optical network terminal 100); the opening 205 is an optical port, configured to be connected to an external optical fiber 101, so that The optical fiber 101 is connected to the optical transceiver components inside the optical module 200 .
  • the combination of the upper case 201 and the lower case 202 is used to facilitate the installation of components such as the circuit board 300 into the case, and the upper case 201 and the lower case 202 can form packaging protection for these devices.
  • the upper case 201 and the lower case 202 can form packaging protection for these devices.
  • the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking part 203 located on the outer wall of its housing, and the unlocking part 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or release the connection between the optical module 200 and the host computer. fixed connection.
  • the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 , and includes an engaging component matching with a cage of the upper computer (for example, the cage 106 of the optical network terminal 100 ).
  • a cage of the upper computer for example, the cage 106 of the optical network terminal 100 .
  • the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing
  • the connection relationship between the engaging part and the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit traces, electronic components and chips, through which the electronic components and chips are connected together according to the circuit design, so as to realize functions such as power supply, electrical signal transmission and grounding.
  • the electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
  • Chips can include, for example, a Microcontroller Unit (MCU), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.
  • MCU Microcontroller Unit
  • limiting amplifier limiting amplifier
  • CDR clock data recovery chip
  • DSP digital signal processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function, such as the rigid circuit board can carry the chip stably; the rigid circuit board can also be inserted into the electrical connector in the cage of the upper computer .
  • the circuit board 300 also includes gold fingers formed on the surface of its end, and the gold fingers are composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the cage 106 and electrically connected with the electrical connector in the cage 106 by the gold finger.
  • Gold fingers can be arranged only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or on the upper and lower sides of the circuit board 300, so as to meet the occasions where the number of pins is large.
  • the golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the optical transceiver component includes a light emitting component and a light receiving component.
  • the optical emission component is equipped with a photodetector to receive the emitted light and convert the optical signal into an electrical signal.
  • the ADC port of the MCU is connected to the output end of the photodetector to convert the electrical signal into a digital signal and output an analog value of optical power.
  • the method for monitoring the optical power in the optical transceiver component is to find a mapping relationship f(x) between the received optical power sampling value and the optical power analog value: optical power sampling value—>f(x)—>optical power analog value.
  • the AD value received by the ADC port is used as the optical power sampling value to calculate the optical power analog value, which is the reported optical power value.
  • the maximum optical power point for calibration and fitting during production will not be set too high, for example, the maximum optical power for calibration is set to -5dB.
  • the module will automatically calculate the reported optical power by means of the extensibility of the quadratic fitting calibration curve.
  • FIG. 5 is a schematic diagram of a quartic fit calibration curve according to some embodiments. Due to the strong dependence of the quartic fitting calibration curve on the calibration points and poor extension, the extension part of the fitting curve is easy to bend. If the optical power point that does not participate in the calibration falls on the curved section, a large reporting deviation will occur, for example, the received optical power of -4dB is reported as -11dB. As shown in Figure 5 below, since the curve bends after the actual sampling value ADn, the sampling point of AD(n+1) is the same as the optical power analog value at AD1.
  • the present disclosure provides a method for judging and correcting abnormal optical power of an optical module, including:
  • the Newton iterative method is used to calculate the sampling value of the inflection point, where the sampling value of the inflection point is the optical power sampling value corresponding to the inflection point where the bending occurs.
  • the inflection point is the point where the fitting calibration curve bends, and it is the point where the curve shows different trends, such as the point with the highest vertical coordinate of the quadratic fitting calibration curve in the figure.
  • FIG. 6 is a schematic diagram of a correction algorithm curve according to some embodiments; the correction process includes:
  • the quartic fitting calibration curve f(x) a*x ⁇ 4+b*x ⁇ 3+c*x ⁇ 2+d*x+e(1).
  • the inflection point sampling value is recorded as x_k
  • the current actual sampling value is recorded as x_(k+1)
  • the symmetrical sampling value is recorded as x_(k-1)
  • x_(k-1) 2 ⁇ *x ⁇ _k-x_(k +1).
  • the Newton iteration method is used to calculate the inflection point sampling value, where the inflection point sampling value is the optical power sampling value corresponding to the inflection point where the bending occurs. If the current actual sampling value is greater than the inflection point sampling value, an abnormality occurs in the large light segment, and correction is made. If the current actual sampling value is not greater than the optical power sampling value corresponding to the inflection point, there is no abnormality in the large optical segment. It can identify whether the optical module is abnormal in the large optical section, and correct the analog value of the abnormal large optical section.
  • each point in the figure corresponds to two values of abscissa and ordinate, where the x-axis is the sampled value, and the y-axis is the simulated value. If the inflection point includes the inflection point sampling value and the inflection point analog value, as shown in FIG. 6 , the inflection point sampling value is the abscissa value corresponding to the inflection point, and the inflection point analog value is the ordinate value corresponding to the inflection point.
  • the simulated curves set in the corrected optical module include:
  • f(x) a*x ⁇ 4+b*x ⁇ 3+c*x ⁇ 2+d*x+e(1), wherein x ⁇ inflection point sampling value;
  • x_n is the inflection point sampling value
  • x_(n-1) is the symmetrical sampling value
  • x_(n+1) is the current actual sampling value
  • Some embodiments of the present disclosure provide a method for calculating an inflection point sampling value, including:
  • Collect multiple sets of actual optical power and test sampling values take the actual optical power as the ordinate f(x), and test the sampling value as the abscissa x, which is substituted into the quartic calibration curve f(x) to calculate (a,b,c , d, e).
  • the preset optical power sampling extreme value of the optical module is denoted as x_max.
  • the optical power sampling extremum value is the maximum sampling value that can be received by the AD port of the MCU in the optical module, which is the maximum sampling capacity of the optical module, such as 13000.
  • the preset maximum number of iterations is denoted as N; the preset precision threshold is denoted as j.
  • the minimum actual sampling value t of the preset large light segment is the minimum test sampling value collected by a large optical segment when calculating the mapping relation of the optical module, such as 5000.
  • the precision threshold j can be set to 0.0001.
  • the first-order derivative of the optical module mapping relational expression is recorded as g
  • the second-order derivative of the optical module mapping relational expression is recorded as h.
  • FIG. 7 is a schematic flow diagram of calculating the inflection point sampling value using the Newton iterative method according to some embodiments. The specific flow is as shown in the figure, including:
  • the module is powered on and "starts" to run
  • Set the accuracy threshold j 0.0001.
  • t is the maximum actual sampling value t in the test phase.
  • startval-secondval is less than 0.0001.
  • startval-secondval is less than the precision threshold, then determine whether secondval is greater than 5000.
  • the secondval is greater than 5000, it means that the inflection point is found, and the AD value corresponding to the inflection point is secondval. Change the inflection point flag bFind to TRUE, indicating that the inflection point is found, and then end the program.
  • Fig. 8 is a schematic flow chart of calculating the analog value of optical power in a large optical segment according to some embodiments, specifically including:
  • the similar triangle method taking the inflection point as the center, calculate the optical power analog value whose current actual sampling value is symmetrical to the left side of the inflection point, and make a linear connection between the symmetrical optical power analog value and the optical power analog value at the inflection point, and correct the calculation of the current
  • the optical power analog value of the actual sampling value corrects the monitoring accuracy of the optical power of the optical module.
  • the reported optical power (dB) of the optical module z 10*log10 (analog value of optical power*0.0001).
  • the present disclosure discloses an optical module and a method for judging and correcting the abnormal optical power of the optical module, including: calculating an inflection point sampling value according to the fitting calibration curve, the inflection point sampling value being the optical power corresponding to the inflection point where the fitting calibration curve bends Sampling value; if the current actual sampling value is greater than the sampling value of the inflection point, an abnormality occurs in the large light segment; an abnormality occurs in the large light segment, and the inflection point is used as the midpoint to calculate the symmetrical sampling point of the current sampling value, and according to the symmetrical sampling point, the inflection point, calculate the optical power analog value of the current actual sampling value; if the current actual sampling value is not greater than the inflection point sampling value, no abnormality occurs in the large optical segment; the preset maximum actual sampling value is The maximum sampling value actually collected during the fitting calibration curve fitting process described above.
  • the monitoring accuracy of the optical power of the optical module is improved by virtue of the extensibility of the quadratic fitting calibration curve.
  • the correction algorithm described in this document is used to correct the analog value greater than the inflection point sampling value, so that the analog value corresponding to the greater than inflection point sampling value is more accurate.

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  • Electromagnetism (AREA)
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Abstract

公开了一种光模块和光模块光功率异常判定修正方法，包括：获取拐点采样值，所述拐点采样值为预设拟合校准曲线发生弯曲的拐点对应的光功率采样值；判断当前实际采样值是否大于所述拐点采样值；如果所述当前实际采样值大于所述拐点采样值，获取对称采样值，所述对称采样值与所述当前实际采样值相对所述拐点采样值对称。根据所述对称采样值、所述拐点采样值、所述拟合校准曲线，计算所述对称模拟值和所述拐点模拟值；根据所述对称模拟值和所述拐点模拟值，计算修正算法曲线。

Description

光模块光功率异常判定修正方法及光模块
相关申请的交叉引用
本公开要求在2022年01月12日提交中国专利局、申请号为202210046584.0的专利优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块光功率异常判定修正方法及光模块。
背景技术
随着云计算、移动互联网、视频等新型业务和应用模式发展，光通信技术的发展进步变的愈加重要。而在光通信技术中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，并且随着光通信技术发展的需求光模块的传输速率不断提高。
发明内容
第一方面，本公开一些实施例公开了一种光模块光功率异常判定修正方法，包括：获取拐点采样值，所述拐点采样值为预设拟合校准曲线发生弯曲的拐点对应的光功率采样值；判断当前实际采样值是否大于所述拐点采样值；如果所述当前实际采样值大于所述拐点采样值，获取对称采样值，所述对称采样值与所述当前实际采样值相对所述拐点采样值对称；根据所述对称采样值、所述拐点采样值、所述拟合校准曲线，计算所述对称模拟值和所述拐点模拟值；根据所述对称采样值、所述拐点采样值、所述对称模拟值和所述拐点模拟值，计算修正算法曲线；将所述当前实际采样值代入所述修正算法曲线，计算得到所述当前实际采样值的光功率模拟值。
第二方面，本公开一些实施例公开了一种光模块，包括：光发射器件，被配置为将电信号转换为光信号；光功率采样电路，其输入端与所述光发射器件连接，获取所述光信号的采样值；MCU，与所述光功率采样电路的输出端连接，内设模拟曲线，将所述采样值转换为模拟值；所述模拟曲线包括：四次拟合校准曲线和大光段的修正算法曲线。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开一些实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的一种光通信系统的连接关系图；
图2为根据一些实施例的一种光网络终端的结构图；
图3为根据一些实施例的一种光模块的结构图；
图4为根据一些实施例的一种光模块的分解图；
图5为根据一些实施例的四次拟合校准曲线示意图；
图6为根据一些实施例的一种修正算法曲线示意图；
图7为根据一些实施例的一种利用牛顿迭代法计算拐点采样值的流程示意图；
图8为根据一些实施例的一种计算大光段光功率模拟值的流程示意图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅被配置为描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开一些实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“被配置为”的使用意味着开放和包容性的语言，其不排除被配置为执行额外任务或步骤的设备。
如本文所使用的那样，“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨 论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
光通信技术中，使用光携带待传输的信息，并使携带有信息的光信号通过光纤或光波导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光信号通过光纤或光波导中传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要被配置为实现供电、I2C信号传输、数据信号传输以及接地等；光网络终端通过网线或无线保真技术(Wi-Fi)将电信号传输给计算机等信息处理设备。
图1为根据一些实施例的一种光通信系统的连接关系图。如图1所示，光通信系统主要包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103；
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现超长距离传输。因此在通常的光通信系统中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平板电脑、电视机等。
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。
光模块200包括光口和电口。光口被配置为与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立连接。示例的，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。
光网络终端100包括大致呈长方体的壳体(housing)，以及设置在壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。示例的，光网络终端100将来自光模块200的电信号传递给网线 103，将来自网线103的信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立了双向的信号传递通道。
图2为根据一些实施例的一种光网络终端的结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100的与光模块200相关的结构。如图2所示，光网络终端100中还包括设置于壳体内的PCB电路板105，设置在PCB电路板105的表面的笼子106，以及设置在笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而光模块200与光纤101建立双向的电信号连接。
图3为根据一些实施例的一种光模块的结构图，图4为根据一些实施例的一种光模块的分解图。如图3和图4所示，光模块200包括壳体、设置于壳体中的电路板300；
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口204和205的上述壳体；壳体的外轮廓一般呈现方形体。
在本公开一些实施例中，下壳体202包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体201包括盖板，以及位于盖板两侧与盖板垂直设置的两个上侧板，由两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。示例地，开口204位于光模块200的端部(图3的左端)，开口205也位于光模块200的端部(图3的右端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。其中，开口204为电口，电路板300的金手指从电口204伸出，插入上位机(如光网络终端100)中；开口205为光口，配置为接入外部的光纤101，以使光纤101连接光模块200内部的光收发组件。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300等器件安装到壳体中，由上壳体201、下壳体202可以对这些器件形成封装保护。此外，在装配电路板300等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化的实施生产。
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外壁的解锁部件203，解锁部件203被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
示例地，解锁部件203位于下壳体202的两个下侧板的外壁，包括与上位机的笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200插入上位机的笼子里，由解锁部件203的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件203时，解锁部件203的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如可以包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如可以包括微控制单元(Microcontroller Unit，MCU)、限幅放大器(limiting amplifier)、时钟数据恢复芯片(Clock and Data Recovery，CDR)、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；硬性电路板还可以插入上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300插入笼子106中，由金手指与笼子106内的电连接器导通连接。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。
光收发组件包括光发射组件及光接收组件。光发射组件设置光探测器，接收发射的光并将光信号转换为电信号，MCU的ADC端口与光探测器的输出端连接，将电信号转换为数字信号，输出光功率模拟值。
光收发组件中监控光功率的方法是：寻找接收光功率采样值和光功率模拟值的一种映射关系f(x)：光功率采样值—>f(x)—>光功率模拟值。将ADC端口接收的AD值作为光功率采样值，计算得到光功率模拟值，即为上报光功率值。
为了寻找f(x),光模块通过采集多组实际光功率与测试采样值，将实际光功率作为纵坐标f(x)，测试采样值作为横坐标x，其代入四次校准曲线f(x)，将拟合得到采样值和光功率模拟值的一种映射关系f(x)＝a*x^4+b*x^3+c*x^2+d*x+e，然后把四次校准曲线的系数(a,b,c,d,e)存储到光模块中。
光模块进入到实际应用环境后，当接收到光时，通过MCU的ADC单元模拟数字转换单元，可以采样得到光功率采样值,将光功率采样值带入四次校准曲线f(x)＝a*x^4+b*x^3+c*x^2+d*x+e(x＝光功率采样值)就可以计算出光功率模拟值。
由于考虑到生产效率和接收器件的安全，生产时校准拟合的最大光功率点不会设置的太高，比如校准最大光功率设置为-5dB。对于未参加校准的光功率点，如当模块接收到-4dB的光时，模块会借助四次拟合校准曲线的延伸性，自动计算出上报光功率。
图5为根据一些实施例的四次拟合校准曲线示意图。由于四次拟合校准曲线对校准点 依赖性强，外延性差，拟合曲线的外延部分容易弯曲。如果未参与校准的光功率点落在弯曲段，从而导致出现较大的上报偏差，比如-4dB的接收光功率上报-11dB的情况。如下图5由于曲线在实际采样值ADn之后发生了弯曲，导致AD(n+1)的采样点和AD1处的光功率模拟值一样。
为了提高光模块光功率监测准确性，本公开提供了一种光模块光功率异常判定修正方法，包括：
根据预设四次拟合校准曲线，采用牛顿迭代法计算拐点采样值，其中拐点采样值为发生弯曲的拐点对应的光功率采样值。拐点为拟合校准曲线发生弯曲的点，为曲线出现不同走势的点，如图中四次拟合校准曲线的纵坐标最高的点。
如果当前实际采样值大于拐点采样值，则大光段发生异常，进行修正。
如果当前实际采样值不大于拐点对应的光功率采样值，则大光段未发生异常。
对于发生异常的情况，图6为根据一些实施例的一种修正算法曲线示意图；修正过程包括：
以拐点采样值为中点，计算当前实际采样值的对称采样值；
根据对称采样值、拐点采样值及其在四次拟合校准曲线对应的光功率模拟值，计算待测采样值的光功率模拟值。
在本公开的某一些实施例中，四次拟合校准曲线f(x)＝a*x^4+b*x^3+c*x^2+d*x+e(1)。
拐点采样值记为x_k，当前实际采样值记为x_(k+1)，对称采样值记为x_(k-1)，则x_(k-1)＝2〖*x〗_k-x_(k+1)。
拐点采样值对应的光功率模拟值f(x_k)，对称采样值对应的光功率模拟值f(x_(k-1))；根据待测点与拐点、对称点在同一直线，计算当前实际采样点的模拟值y＝2*f(x_k)-f(x_(k-1))＝2*f(x_k)-f(2〖*x〗_k-x_(k+1))(2)。
根据以上光模块光功率异常判定修正方法，根据预设四次拟合校准曲线，采用牛顿迭代法计算拐点采样值，其中拐点采样值为发生弯曲的拐点对应的光功率采样值。如果当前实际采样值大于拐点采样值，则大光段发生异常，进行修正。如果当前实际采样值不大于拐点对应的光功率采样值，则大光段未发生异常。可识别光模块在大光段是否发生异常，并对发生异常的大光段模拟值进行修正。
如图6中所示，图中每个点对应横坐标和纵坐标两个值，其中x轴为采样值，y轴为模拟值。如拐点包含拐点采样值和拐点模拟值，根据图6中所示，拐点采样值为拐点对应的横坐标值，拐点模拟值为拐点对应的纵坐标值。
修正后的光模块中设置模拟曲线包括：
f(x)＝a*x^4+b*x^3+c*x^2+d*x+e(1)，其中x≤拐点采样值；
y(x_(n+1))＝2*f(x_n)-f(x_(n-1))＝2*f(x_n)-f(2〖*x〗_n-x_(n+1))，其中x_n为拐点采样值，x_(n-1)为对称采样值，x_(n+1)为当前实际采样值。
本公开一些实施例提供了一种计算拐点采样值的方法，包括：
计算光模块映射关系式，光模块通过采集多组实际光功率与测试采样值，将实际光功率作为纵坐标f(x)，测试采样值作为横坐标x，其代入四次校准曲线f(x)，将拟合得到采样 值和光功率模拟值的一种映射关系f(x)＝a*x^4+b*x^3+c*x^2+d*x+e，然后把四次校准曲线的系数(a,b,c,d,e)存储到光模块中。
在本公开中，预设光模块映射关系式为四次校准曲线f(x)，记为f(x)＝a*x^4+b*x^3+c*x^2+d*x+e。采集多组实际光功率与测试采样值，将实际光功率作为纵坐标f(x)，测试采样值作为横坐标x，其代入四次校准曲线f(x)，计算得到(a,b,c,d,e)。
预设光模块光功率采样极值，记为x_max。
在本公开的一些实施例中，光功率采样极值的取值为光模块中MCU的AD端口可接收的最大采样值，为光模块的最大采样容值，如13000。
预设最大迭代次数，记为N；预设精度阈值，记为j。预设大光段的最小实际采样值t。在本公开的一些实施例中，最小实际采样值t的取值为计算光模块映射关系式时大光段采集的最小测试采样值，如5000。精度阈值j可设置为0.0001。
计算光模块映射关系式的一阶导数和二阶导数。光模块映射关系式的一阶导数记为g，光模块映射关系式的二阶导数记为h。
赋值第一采样值startval＝x_max，x_max为光模块光功率采样极值。
计算次采样值，secondval＝startval-g/h。将第一采样值代入一阶导数方程和二阶导数方程，计算得到次采样值和精度值。
当前第一采样值小于0，或精度值大于等于预设精度阈值时，将次采样值赋值给第一采样值，继续计算次采样值。
依次迭代，直至当前第一采样值与次采样值的差值小于预设精度阈值且次采样值大于最小实际采样值t(t＝5000)，或完成最大迭代次数。
图7为根据一些实施例的一种利用牛顿迭代法计算拐点采样值的流程示意图，具体流程如图中所示，包括：
开始。模块上电“开始”运行
设定初始值：startval＝MAX；N＝30，j＝0.001；bFind＝FALSE，t＝5000。
其中，其中MAX即上文中提到的MCU的AD端口的最大采样值MAX＝13000。设定牛顿迭代次数N＝30，设定拐点标志bFind＝FALSE表示当前出厂模块是正常模块，无拐点。设定精度阈值j＝0.0001。t为测试阶段最大实际采样值t。
开始进行牛顿法迭代计算：
判定N是否大于0。N>0则进入下一步；N≤0，则结束程序。
把startval带入一阶导数计算方程：4*a*x^3+3*b*x^2+2*c*x+d，计算得到g。
把startval带入二阶导数计算方程：12*a*x^2+6*b*x+2*c，计算得到h。
计算得第二个AD值secondval＝startval-g/h。
判断startval是否小于0，如果是，则把secondval值赋值给startval,即startval＝secondval，N计数减一，程序回到判定N是否大于0。
如果startval不小于0，则判断startval-secondval是否小于0.0001。
如果startval-secondval不小于0.0001，则把secondval值赋值给startval,即startval＝secondval，N计数减一，程序回到判定N是否大于0再次执行。
如果startval-secondval小于精度阈值，则判断secondval是否大于5000。
如果secondval不大于5000，则N计数减一，程序回到判定N是否大于0再次执行。
如果secondval大于5000，则说明找到拐点，拐点对应的AD值为secondval，把拐点标志bFind改为TRUE，表示找到拐点，然后结束程序。
以上程序输出两种结果，bFind＝FALSE或bFind＝TRUE、secondval。bFind＝FALSE表示当前出厂模块是正常模块，无拐点。bFind＝TRUE表示找到拐点，且拐点采样值为secondval，表明此时光功率点处于校准曲线的右侧弯曲段，需要进行修正计算。如果bFind＝TRUE，表明有拐点存在，当接收到很大的光功率时,若采样的原始AD值(假设为bigval)大于secondval，表明此时光功率点处于校准曲线的右侧弯曲段，需要进行修正计算。
图8为根据一些实施例的一种计算大光段光功率模拟值的流程示意图，具体包括：
判断bFind是否为TRUE。如果否，则把大光段的前实际采样值(上文中用bigval代替)带入四次拟合校准曲线f(x)＝a*x^4+b*x^3+c*x^2+d*x+e中计算，然后结束程序。
如果bFind为TRUE，则判断当前采样AD值bigval是否大于拐点采样值secondval。如果不大于则把bigval带入四次拟合校准曲线f(x)＝a*x^4+b*x^3+c*x^2+d*x+e中计算，然后结束程序。
如果bigval大于secondval,则表明此时的待测采样值处于拐点采样值的右侧，采用修正算法：
计算计算待测采样点的对称点对应采样值，以下称为对称采样值。以拐点secondval为对称中心，bigval值的对称点对称采样值val,计算方法：val＝2*secondval-bigval。
计算拐点的模拟值。把secondval带入四次拟合校准曲线f(x)＝a*x^4+b*x^3+c*x^2+d*x+e中计算得f(secondval)。
计算待测采样值对应的对称模拟值。把val带入四次拟合校准曲线f(x)＝a*x^4+b*x^3+c*x^2+d*x+e中计算得f(val)。
计算此时前实际采样值bigval的修正后的模拟值为y(bigval)＝2*f(secondval)-f(val))。
通过根据相似三角形法，以拐点为中心，计算当前实际采样值处于拐点左侧对称的光功率模拟值，并把该对称光功率模拟值和拐点处的光功率模拟值做线性连接，修正计算当前实际采样值的光功率模拟值，修正了光模块光功率的监测准确性。
在本公开的某一些实施例中，光模块的上报光功率(dB)z＝10*log10(光功率模拟值*0.0001)。
本公开公开了一种光模块和光模块光功率异常判定修正方法，包括：根据拟合校准曲线，计算拐点采样值，所述拐点采样值为所述拟合校准曲线发生弯曲的拐点对应的光功率采样值；如果当前实际采样值大于所述拐点采样值，大光段发生异常；大光段发生异常，以所述拐点为中点，计算当前采样值的对称采样点，并根据所述对称采样点、所述拐点，计算所述当前实际采样值的光功率模拟值；如果当前实际采样值不大于所述拐点采样值，则大光段未发生异常；所述预设最大实际采样值为所述拟合校准曲线拟合过程中实际采集的最大采样值。对于大光段未发生异常的情况，借助四次拟合校准曲线的延伸性，提高光 模块光功率的监测准确性。对于大光段发生异常的情况，采用本文档中所述的修正算法，修正大于拐点采样值的模拟值，使得大于拐点的采样值对应的模拟值更加准确。
由于以上实施方式均是在其他方式之上引用结合进行说明，不同实施例之间均具有相同的部分，本说明书中各个实施例之间相同、相似的部分互相参见即可。在此不再详细阐述。
需要说明的是，在本说明书中，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或暗示这些实体或操作之间存在任何这种实际的关系或顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的电路结构、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种电路结构、物品或者设备所固有的要素。在没有更多限制的情况下，有语句“包括一个……”限定的要素，并不排除在包括所述要素的电路结构、物品或者设备中还存在另外的相同要素。
本领域技术人员在考虑说明书及实践本公开的公开后，将容易想到本公开的其他实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求的内容指出。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (10)

  1. 一种光模块光功率异常判定修正方法，包括：
    获取拐点采样值，所述拐点采样值为预设拟合校准曲线发生弯曲的拐点对应的光功率采样值；
    判断当前实际采样值是否大于所述拐点采样值；
    如果所述当前实际采样值大于所述拐点采样值，获取对称采样值，所述对称采样值与所述当前实际采样值相对所述拐点采样值对称；
    根据所述对称采样值、所述拐点采样值、所述拟合校准曲线，计算所述对称模拟值和所述拐点模拟值；
    根据所述对称模拟值、所述对称采样值、所述拐点采样值和所述拐点模拟值，计算修正算法曲线；
    将所述当前实际采样值代入所述修正算法曲线，计算得到所述当前实际采样值的光功率模拟值。
  2. 根据权利要求1所述的光模块光功率异常判定修正方法，其中，所述拟合校准曲线为四次拟合校准曲线，f(x)＝a*x^4+b*x^3+c*x^2+d*x+e  (1)，其中(a，b，c，d，e)均为常数，x为光功率采样值，f(x)为光功率模拟值。
  3. 根据权利要求2所述的光模块光功率异常判定修正方法，其中，所述获取拐点采样值，包括：
    预设拟合校准曲线系数、光功率采样极值、最大迭代次数、精度阈值；
    以所述光功率采样极值为起始点，利用牛顿迭代法对所述拟合校准曲线进行迭代，直至相邻的所述光功率采样值的差值小于所述精度阈值，或直至所述迭代次数完成，计算得到所述拐点采样值。
  4. 根据权利要求3所述的光模块光功率异常判定修正方法，其中，所述光功率采样极值为所述光模块的最大采样容值。
  5. 根据权利要求3所述的光模块光功率异常判定修正方法，其中，所述精度阈值为0.0001。
  6. 根据权利要求2所述的光模块光功率异常判定修正方法，其中，所述根据所述对称采样值、所述拐点采样值、所述拟合校准曲线，计算所述对称模拟值和所述拐点模拟值；
    根据所述对称采样值、所述拐点采样值、所述对称模拟值和所述拐点模拟值，计算修正算法曲线；包括：
    以所述拐点采样值为中点，计算所述当前实际采样值对称采样值，x_(n-1)＝2〖*x〗_n-x_(n+1)，其中，x_(n-1)为所述对称采样值，x_n为所述拐点采样值，x_(n+1)为所述当前实际采样值；
    将所述对称采样值代入所述拟合校准曲线，计算所述对称采样值对应的对称模拟值；
    将所述拐点采样值代入所述拟合校准曲线，计算所述拐点采样值对应的拐点模拟值；
    根据所述对称采样值、所述拐点采样值、所述对称模拟值和所述拐点模拟值，计算修 正算法曲线；
    将所述当前实际采样值代入所述修正算法曲线，计算当前实际采样值的光功率模拟值。
  7. 根据权利要求6所述的光模块光功率异常判定修正方法，其中，
    所述修正算法曲线为直线方程，记为y＝Kx+j；
    根据所述对称采样值、所述拐点采样值、所述对称模拟值和所述拐点模拟值，计算修正算法曲线；
    计算得到当前实际采样值的光功率模拟值，y＝2*f(x_n)-f(2〖*x〗_n-x_(n+1))  (2)，其中x_n为所述拐点采样值，x_(n+1)为当前实际的采样值，f(x_n)为所述拐点模拟值。
  8. 根据权利要求1所述的光模块光功率异常判定修正方法，其中，计算所述当前实际采样值的光功率模拟值后，还包括：
    根据所述当前实际采样值的光功率模拟值，计算所述当前实际采样值的上报值，z＝10*log10(y*0.0001)，其中z为所述当前实际采样值的上报值，y为所述当前实际采样值的光功率模拟值。
  9. 一种光模块，包括：
    光发射器件，被配置为将电信号转换为光信号；
    光功率采样电路，其输入端与所述光发射器件连接，获取所述光信号的采样值；
    MCU，与所述光功率采样电路的输出端连接，内设模拟曲线，将所述采样值转换为模拟值；
    所述模拟曲线为：四次拟合校准曲线和大光段的修正算法曲线。
  10. 根据权利要求9所述的光模块，其中，所述四次拟合校准曲线为：
    f(x)＝a*x^4+b*x^3+c*x^2+d*x+e  (1)；
    其中(a，b，c，d，e)均为常数，x为采样值，f(x)为光功率模拟；
    所述大光段的修正算法曲线为：
    y＝2*f(x_n)-f(2〖*x〗_n-x_(n+1))  (2)；
    其中，x_n为所述四次拟合校准曲线的拐点采样值，x_(n+1)为当前实际采样值，x_(n+1)大于所述拐点采样值。
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