WO2023132620A1 - Display comprising color conversion layer and manufacturing method therefor - Google Patents

Abstract

According to an embodiment disclosed in the present document, a display comprising a first sub-pixel, a second sub-pixel, and a third sub-pixel, which implement different colors from each other, has: a first color conversion layer arranged on a first substrate to correspond to the first sub-pixel; a first color filter arranged to overlap the first color conversion layer; a second color conversion layer arranged on the first substrate to correspond to the second sub-pixel; a second color filter arranged to overlap the second color conversion layer; a transparent layer arranged on the first substrate to correspond to the third sub-pixel; a third color filter arranged to overlap the transparent layer; a partition wall arranged to surround each of the first color conversion layer, the second color conversion layer, and the transparent layer; a black matrix arranged to overlap the partition wall; and a light-transmitting layer arranged between the first color conversion layer and the first color filter, between the second color conversion layer and the second color filter, and between the transparent layer and the third color filter, wherein the light-transmitting layer is higher in at least one of electrical conductivity and permittivity than at least one of the black matrix, the first color filter, the second color filter, the third color filter, and the partition wall.

Description

Display including color conversion layer and manufacturing method thereof

Embodiments disclosed in this document relate to a display capable of achieving high efficiency in forming a color conversion layer and a high color conversion ratio, and a manufacturing method thereof.

Thanks to the remarkable development of information and communication technology and semiconductor technology, the supply and use of various electronic devices including displays are rapidly increasing. In particular, recent electronic devices are being developed to be portable and communicate.

Displays of electronic devices are increasingly applying a color conversion layer including quantum dots in order to increase light efficiency and color reproducibility.

The color conversion layer may be formed by an inkjet printing process rather than a photolithography process, in which a large amount of material is discarded during an exposure process and the efficiency is low. The inkjet printing process may eject ink in the form of droplets by regulating the flow of ink. Instability due to the intermittent ink ejection method is high, and it may be difficult to form the color conversion layer in a desired shape (eg, width or/and height).

Also, in the inkjet printing process, low-viscosity ink may be used to eject ink at a high speed. Since the viscosity of the ink is lowered when the content of the quantum dots included in the color conversion layer is lowered, the color conversion ratio of the color conversion layer may be lowered.

Various embodiments of the present document provide a display capable of achieving high efficiency in forming a color conversion layer and a high color conversion ratio of the color conversion layer, and a manufacturing method thereof.

According to an embodiment disclosed in this document, a display including a first sub-pixel, a second sub-pixel, and a third sub-pixel implementing different colors is disposed on a first substrate to correspond to the first sub-pixel. a first color conversion layer; a first color filter disposed to overlap the first color conversion layer; a second color conversion layer disposed on the first substrate to correspond to the second sub-pixel; a second color filter disposed to overlap the second color conversion layer; a transparent layer disposed on the first substrate to correspond to the third sub-pixel; a third color filter disposed to overlap the transparent layer; barrier ribs disposed to surround each of the first color conversion layer, the second color conversion layer, and the transparent layer; a black matrix disposed to overlap the barrier rib; a light-transmitting layer disposed between the first color conversion layer and the first color filter, between the second color conversion layer and the second color filter, and between the transparent layer and the third color filter; The light transmission layer may have at least one of electrical conductivity and permittivity higher than at least any one of the black matrix, the first color filter, the second color filter, the third color filter, and the barrier rib.

According to one embodiment disclosed in this document, a method of manufacturing a display includes forming a black matrix on a substrate; sequentially forming a first color filter, a second color filter, and a third color filter on the substrate on which the black matrix is formed; forming a light-transmitting layer on the substrate on which the first color filter, the second color filter, and the third color filter are formed; forming barrier ribs on the substrate on which the light-transmitting layer is formed; arranging nozzles on the substrate on which the barrier ribs are formed, and forming an electric field between the nozzles and a stage on which the substrate is seated; forming a first color conversion layer by printing a first quantum dot ink through the nozzle; forming a second color conversion layer by printing second quantum dot ink through the nozzle; and forming a transparent layer by printing transparent ink through the nozzle, wherein the light-transmitting layer comprises at least one of the substrate, the first color filter, the second color filter, the third color filter, and the barrier rib. At least one of electrical conductivity and permittivity may be higher than that.

Since the width and height of the color conversion layer and the transparent layer are uniformly formed in the display according to the embodiments disclosed in this document, excellent process capability is possible and high process efficiency can be realized.

In the display according to the embodiments disclosed in this document, since the color conversion layer can be formed of a high-viscosity ink containing a high content of quantum dots or an additive, the color conversion rate of the color conversion layer can be increased.

In the display according to the embodiments disclosed in this document, the color conversion layer and the transparent layer may be printed on the light transmission layer without being deflected toward the barrier rib.

In addition to this, various effects identified directly or indirectly through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a block diagram of a display module according to various embodiments.

3 is a diagram schematically illustrating a display according to an exemplary embodiment.

4A and 4B are diagrams for explaining a method of manufacturing a display according to an exemplary embodiment.

5A to 5C are diagrams for explaining a trajectory of ink ejected through an electrohydrodynamic method according to an exemplary embodiment.

6 is a cross-sectional view illustrating a color conversion substrate according to an exemplary embodiment.

7A to 7C are cross-sectional views illustrating a method of manufacturing a color conversion substrate according to an exemplary embodiment.

8A to 8C are cross-sectional views illustrating color conversion substrates according to an exemplary embodiment.

9 is a cross-sectional view illustrating a color conversion substrate according to an exemplary embodiment.

10 is a cross-sectional view illustrating a color conversion substrate according to an exemplary embodiment.

11 is a plan view illustrating a first embodiment of a light conversion layer included in a color conversion substrate according to an embodiment.

12 is a plan view illustrating a second embodiment of a light conversion layer included in a color conversion substrate according to an embodiment.

13 is a plan view illustrating a third embodiment of a light conversion layer included in a color conversion substrate according to an embodiment.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the present invention to the specific embodiments, and includes various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram 200 of a display module 160, in accordance with various embodiments.

Referring to FIG. 2 , the display module 160 may include a display 210 and a display driver IC (DDI) 230 for controlling the display 210 . The DDI 230 may include an interface module 231 , a memory 233 (eg, a buffer memory), an image processing module 235 , or a mapping module 237 . The DDI 230 transmits, for example, image data or image information including image control signals corresponding to commands for controlling the image data to other components of the electronic device 101 through the interface module 231. can be received from For example, according to one embodiment, the image information is processed by the processor 120 (eg, the main processor 121 (eg, an application processor) or the auxiliary processor 123 (eg, an auxiliary processor 123 that operates independently of the function of the main processor 121). Example: The DDI 230 can communicate with the touch circuit 250 or the sensor module 176 through the interface module 231. In addition, the DDI 230 can communicate with the touch circuit 250 or the sensor module 176, etc. At least a portion of the received image information may be stored in the memory 233, for example, in units of frames, and the image processing module 235 may, for example, convert at least a portion of the image data to characteristics of the image data or Preprocessing or postprocessing (eg, resolution, brightness, or size adjustment) may be performed based on at least the characteristics of the display 210. The mapping module 237 performs preprocessing or postprocessing through the image processing module 135. A voltage value or a current value corresponding to the image data may be generated According to an embodiment, the generation of the voltage value or the current value may be a property of the pixels of the display 210 (eg, an array of pixels). RGB stripe or pentile structure), or the size of each sub-pixel) At least some pixels of the display 210 are based, for example, at least in part on the voltage value or current value By being driven, visual information (eg, text, image, or icon) corresponding to the image data may be displayed through the display 210 .

According to one embodiment, the display module 160 may further include a touch circuit 250 . The touch circuit 250 may include a touch sensor 251 and a touch sensor IC 253 for controlling the touch sensor 251 . The touch sensor IC 253 may control the touch sensor 251 to detect, for example, a touch input or a hovering input to a specific location of the display 210 . For example, the touch sensor IC 253 may detect a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or charge amount) for a specific position of the display 210 . The touch sensor IC 253 may provide information (eg, location, area, pressure, or time) on the sensed touch input or hovering input to the processor 120 . According to an exemplary embodiment, at least a part of the touch circuit 250 (eg, the touch sensor IC 253) is disposed as a part of the display driver IC 230, the display 210, or outside the display module 160. It may be included as part of other components (eg, the auxiliary processor 123).

According to one embodiment, the display module 160 may further include at least one sensor (eg, a fingerprint sensor, an iris sensor, a pressure sensor, or an illumination sensor) of the sensor module 176 or a control circuit for the sensor module 176 . In this case, the at least one sensor or a control circuit thereof may be embedded in a part of the display module 160 (eg, the display 210 or the DDI 230) or a part of the touch circuit 250. For example, when the sensor module 176 embedded in the display module 160 includes a biometric sensor (eg, a fingerprint sensor), the biometric sensor is biometric information associated with a touch input through a partial area of the display 210. (e.g. fingerprint image) can be acquired. For another example, if the sensor module 176 embedded in the display module 160 includes a pressure sensor, the pressure sensor may acquire pressure information associated with a touch input through a part or the entire area of the display 210. can According to an embodiment, the touch sensor 251 or the sensor module 176 may be disposed between pixels of a pixel layer of the display 210 or above or below the pixel layer.

The display 201 according to various embodiments may be included in an electronic device such as a bar type, a foldable type, a rollable type, a sliding type, a wearable type, a tablet PC, and/or a notebook PC. The display 201 according to various embodiments of the present invention may be included in various electronic devices as well as the examples described above.

3 is a schematic cross-sectional view of a display according to an exemplary embodiment disclosed herein.

Referring to FIG. 3 , the display 210 may include a plurality of pixels PXL, which is a unit for displaying an image. For convenience, only one pixel PXL is illustrated in FIG. 3 as an example. The pixel PXL may include a plurality of sub-pixels SP1 , SP2 , and SP3 emitting different colors. For example, each of the plurality of pixels PXL may include a first sub-pixel SP1 implementing red, a second sub-pixel SP2 implementing green, and a third sub-pixel SP3 implementing blue. can As another example, each of the plurality of pixels PXL may include first to third sub-pixels SP1 , SP2 , and SP3 and a fourth sub-pixel emitting white light. An image may be displayed on the display 210 by controlling the amount of light emitted from each of the sub-pixels SP1 , SP2 , and SP3 .

The display 210 may include a light source substrate 310 and a color conversion substrate 300 facing the light source substrate 310 . Although the light source substrate 310 and the color conversion substrate 300 shown in FIG. 3 are shown spaced apart, the light source substrate 310 and the color conversion substrate 300 may be bonded through a bonding agent.

The light source substrate 310 may be a substrate that generates and emits light required to display an image. The light source substrate 310 may include a rear substrate 311 , a light emitting element 312 , and a pixel circuit driving the light emitting element 312 .

The back substrate 311 may be a plastic substrate or a glass substrate. The back substrate 311 may have a flexible property. A light emitting element 312 and a pixel circuit may be disposed on the rear substrate 311 . The light emitting element 312 is disposed to overlap the color filters 320 disposed on the front substrate 301, and at least a portion of the pixel circuit is disposed to overlap the black matrix 302 disposed on the front substrate 301. can

The light emitting device 312 includes at least one of an organic light emitting diode, a quantum dot light emitting diode, an inorganic-based micro LED, and an inorganic-based nano light emitting diode. may contain one. For example, the light emitting device 312 may be a micro light emitting diode.

The pixel circuit may include a plurality of transistors. For example, the pixel circuit may be formed of a CMOS circuit including a combination of at least one N-type transistor and at least one P-type transistor.

The color conversion substrate 300 may include a front substrate 301 , a color filter 320 , a barrier rib 304 , a color conversion member 330 , a transparent layer 333 and a black matrix 302 .

The front substrate 301 may be formed of a light-transmitting material. The front substrate 301 may be formed of a plastic substrate or a glass substrate. The front substrate 301 may have a flexible property. A color filter 320, a barrier rib 304, a color conversion member 330, a transparent layer 333, and a black matrix 302 may be stacked on one surface of the front substrate 301 (eg, the surface facing the D2 direction). . Since light passing through the color filter 320 is emitted to the outside through the other surface of the front substrate 301 (eg, the surface facing the D1 direction), an image may be provided to a viewer looking at the display.

The color filter 320 may include a first color filter 321 , a second color filter 322 and a third color filter 323 . The first color filter 321 may implement the same color as light emitted from the first color conversion layer 331 . For example, the first color filter 321 may be a red color filter. The first color filter 321 may transmit red light and absorb other color lights other than red light. The first color filter 321 may increase color purity of red light incident through the first color conversion layer 331 . The second color filter 322 may implement the same color as light emitted from the second color conversion layer 332 . For example, the second color filter 322 may be a green color filter. The second color filter 322 may transmit green light and absorb other color lights other than green light. The second color filter 322 may increase color purity of green light incident through the second color conversion layer 332 . The third color filter 323 may implement the same color as light emitted from the light emitting element 312 . For example, the third color filter 323 may be a blue color filter. The third color filter 323 may transmit blue light and absorb color light other than blue light. The third color filter 323 may increase color purity of blue light incident through the transparent layer 333 .

The black matrix 302 may be disposed between the first color filter 321 , the second color filter 322 and the third color filter 323 . Since the black matrix 302 divides the areas of each sub-pixel SP1 , SP2 , and SP3 , it may overlap with the barrier rib 304 . The black matrix 302 may be formed of a material such as metal, synthetic resin, synthetic rubber, or a carbon-based organic material. For example, the black matrix 302 may be formed of chromium (Cr), chromium oxide (CrOx), carbon black, or a double layer including these.

The color conversion member 330 may include a first color conversion layer 331 and a second color conversion layer 332 .

The first color conversion layer 331 may be formed to overlap the first color filter 321 . The first color conversion layer 331 may be disposed between the light emitting element 312 and the first color filter 321 . The first color conversion layer 331 may convert light emitted from the light emitting element 312 into first color light by using first quantum dots. For example, the first color conversion layer 331 may convert blue light emitted from the light emitting element 312 into red light.

The second color conversion layer 332 may be formed to overlap the second color filter 322 . The second color conversion layer 332 may be disposed between the light emitting element 312 and the second color filter 322 . The second color conversion layer 331 may convert light emitted from the light emitting element 312 into second color light by using second quantum dots. For example, the second color conversion layer 331 may convert blue light emitted from the light emitting element 312 into green light.

The transparent layer 333 may be formed to overlap the third color filter 323 . The transparent layer 333 may be disposed between the light emitting element 312 and the third color filter 323 . The transparent layer 333 may transmit light emitted from the light emitting element 312 without color conversion. The transparent layer 333 may have an empty shape to pass incident light as it is, or may be made of a transparent resin such as acrylic-nitrile butadiene styrene (ABS), poly methyl methacrylate (PMMA), or poly carbonate (PC).

The barrier rib 304 may block movement of light between the sub-pixels SP1 , SP2 , and SP3 implementing different colors. The barrier rib 304 may be formed of a black color that absorbs light. The barrier rib 304 may be formed of a material such as metal, synthetic resin, synthetic rubber, or a carbon-based organic material. For example, the barrier rib 304 may be formed of chromium (Cr), chromium oxide (CrOx), carbon black, or a double layer including these.

According to an embodiment, one surface of the barrier rib 304 (eg, a surface facing the second direction D2) and a side surface of the barrier 304 (eg, a surface in contact with the color conversion member 330), and a color filter One surface of the 320 (eg, a surface in contact with the color conversion member 330) may be surface treated. A side surface of the barrier rib 304 and one surface of the color filter 320 may be hydrophilic to form an attraction with ink, which is a material of each of the color conversion member 330 and the transparent layer. One surface of the barrier rib 304 may be hydrophobic treated to form ink and repulsive force. Since the color conversion member 330 and the transparent layer 333 are not formed on one surface of the barrier rib 304, the light source substrate 310 and the color conversion substrate 300 are separated by the color conversion member 330 and the transparent layer 333. During the bonding process, defects caused by the color conversion member 330 and the transparent layer 333 may be prevented.

In such a color conversion substrate 300, the black matrix 302, the color filter 320, and the barrier rib 304 are sequentially formed, and then the color conversion member 330 and the transparent layer 333 are electrohydrodynamically formed. : EHD) can be completed by forming through the process. The electrohydrodynamic (EHD) process can form a continuous ink line by using a constant air pressure and an electric field applied to a nozzle instead of intermittent ink ejection in the inkjet process. Accordingly, in the electrohydrodynamic process, since the width and height of the printed pattern are constant, excellent process capability management may be possible. In addition, since the electrohydrodynamic process can use high-viscosity ink, it is possible to increase the content of quantum dots or add a functional material capable of improving ink characteristics, thereby achieving a high color conversion rate.

4A and 4B are diagrams for explaining a method of manufacturing a color conversion member 330 and a transparent layer 333 according to an exemplary embodiment disclosed herein.

Referring to FIGS. 4A and 4B , a front substrate 301 having a black matrix (eg, the black matrix 302 of FIG. 3 ), a color filter (eg, the color filter 320 of FIG. 3 ) and a barrier rib 304 are formed thereon. may be seated on the stage 411 . The nozzle 412 may be aligned to coincide with the imaginary center line CL of each of the sub-pixels SP1 , SP2 , and SP3 . The nozzle 412 may move in a direction perpendicular to the ground along an imaginary center line CL. At the same time as a constant pressure is applied to the aligned nozzles 412 , an electric field may be formed between the nozzles 412 and the stage 411 . For example, a negative polarity voltage (eg, ground voltage) may be applied to the stage 411 , and a positive polarity voltage (eg, a voltage higher than the ground voltage) may be applied to the nozzle 412 . Since the air pressure and the electric field are controlled to have constant values, the flow rate of the ink 402 can be maintained uniformly. The ink 402 may be ink used as a material of any one of a color conversion member (eg, the color conversion member 330 of FIG. 3 ) and a transparent layer (eg, the transparent layer 333 of FIG. 3 ).

Accordingly, the ink 402 from the nozzle 412 may gather and form a Taylor cone having an inverted triangular liquid surface. The ink 402 collected in the form of a tapered cone may be ejected in the form of a continuous ink stream. At this time, the nozzle 402 may move (or scan) in a direction perpendicular to the ground along the imaginary center line CL. Accordingly, since the ink 402 is applied on the front substrate 301 along the imaginary center line CL, the color conversion member and the transparent layer may be formed on the front substrate 301 .

5A to 5C are diagrams for explaining a trajectory of ink ejected through an electrohydrodynamic method according to an exemplary embodiment disclosed herein. 5A to 5C, q0 is a unit of a portion of ink (eg, first quantum dot ink, second quantum dot ink, or/and transparent ink) ejected through an electrohydrodynamic method from the upper center of each sub-pixel SP. It can be defined as charge. q1 may be defined as a first charge charged on the side structure 504 (eg, the barrier rib 304). q2 may be defined as a second charge charged on the lower structure 501 (eg, the color filter 330 or the black matrix 302) or the light transmission layer 540 disposed on the front substrate.

Referring to FIGS. 5A to 5C , the ink ejected through the electrohydrodynamic method is predetermined from the center of the sub-pixel SP according to the relative force of electric attraction by the first charge q1 and the second charge q2. It may be deflected by an angle (or deflection angle) θ. When the ink is ejected to be located at the center of each sub-pixel SP, the force in the direction of the side structure 504 can be offset left and right. Since it is difficult for the ink to maintain the center of each sub-pixel (SP), it may receive a force that causes deflection to some extent. At this time, gravity due to the weight of the ink and momentum due to the ejection speed are not considered, and only the static electric attraction will be considered. Since each of the side structure 504 and the lower structure 501 or the light-transmitting layer 540 is an insulating material, the unit charge q0 charged in the ink depends on the dielectric constant of the side structure 504 and the lower structure 501, respectively. can be proportional. The first electric attraction f1 between the unit charge q0 and the first charge q1 and the second electric attraction f2 between the unit charge q0 and the second charge q2 are expressed by Equations 1 and 2 It can be expressed by Coulomb's law as In Equations 1 and 2, k may be a Coulomb constant. w is a distance between the unit charge q0 and the first charge q1, and may be a distance from the center of each sub-pixel SP to the side structure 504. t is the distance between the unit charge q0 and the second charge q2, and may be the thickness of the side structure 504.

The deflection angle θ may be expressed as a first electrical attraction f1 and a second electrical attraction f2 as shown in Equation 3.

In Equation 3, the permittivity ratio (E) represents the ratio between the first permittivity ε1 of the side structure 504 and the second permittivity ε2 of the lower structure 501 or the light-transmitting layer 540. The ratio R may represent a ratio between a distance w from the center of each sub-pixel SP to the side structure 504 and a thickness t of the side structure 504 . In Equation 3, the first charge q1 is proportional to the first permittivity ε1 of the side structure 504, and the second charge q2 is the second charge q2 of the lower structure 501 or the light-transmitting layer 540. It can be proportional to the permittivity (ε2). As shown in Equation 3, the ratio (E) of the permittivity of the side structure 504 to the permittivity of the lower structure 501 or the light-transmitting layer 540 is the thickness of each sub-pixel (SP) of the side structure 504 It may be smaller than the square of the ratio (R) of the distance (w) from the center of the side structure 504 (R ² ).

In order to stably eject ink into the side structure 504 , the deflection angle θ may be limited to a certain size or less. For example, the deflection angle θ may be greater than 0 degrees (°) and less than 45 degrees (°).

For example, when the first electric attraction f1 is smaller than the second electric attraction f2, the deflection angle θ may be limited to a certain size or less. As another example, when the first permittivity ε1 is smaller than the second permittivity ε2, the deflection angle θ may be limited to a certain size or less. Meanwhile, as the display (eg, the display 201 of FIG. 3) has a higher resolution, the width of each sub-pixel (SP) (or the distance (w) from the center of each sub-pixel (SP) to the side structure 504) Since is smaller than the thickness t of the side structure 504 , a relationship in which the first permittivity ε1 should be smaller than the second permittivity ε2 may be established.

The deflection angle will be described by applying Equation 3 to the structure of the sub-pixels shown in FIGS. 5A to 5C and Table 1.

In Comparative Examples 1 and 2, as shown in FIG. 5A , a lower structure 501 and a side structure 504 may be formed on the front substrate before ink is ejected. In Comparative Example 1 and Comparative Example 2, in which the permittivity of the side structure 504 and the lower structure 501 are the same, the ink deflection angle may be determined by the structure (eg, permittivity ratio or length ratio) of each sub-pixel SP. there is. As the distance (w) from the center of each sub-pixel to the side structure 504 is closer than the thickness (t) of the side structure 504, the ink is deflected toward the side structure 504 at a relatively small deflection angle and ejected. can That is, as the length ratio decreases, the deflection angle may decrease. For example, as in Comparative Example 1, when each of the lower structure 501 and the side structure 504 has a permittivity of 4.0 and the distance ratio R is 4, the ink is 3.6 degrees (tan(θ)=1/ 4 ² ) can be deflected and injected at a deflection angle (θ).

In Examples 1 and 2, the lower structure 501, the light transmission layer 540, and the side structures 504 may be formed on the front substrate before ink is ejected. The light transmission layer 540 may have a similar width and length to that of the lower structure 501 and may have a thickness smaller than that of the side structure 504 . The lower structure 501 and the side structure 504 may have the same permittivity, and the light transmission layer 540 may have a higher permittivity than the side structure 504 . The total permittivity of the region not corresponding to the side structure 504 may be determined according to the permittivity of the light transmission layer 540 . The total permittivity of the region corresponding to the side structure 504 may be determined according to the thickness ratio of the side structure 504 and the light transmission layer 540 .

In Embodiments 1 and 2, in which the permittivity of the light transmission layer 540 is greater than that of the side structure 504, the deflection angle of the ink may be determined by the permittivity as well as the structure of each sub-pixel. Since the permittivity of the light-transmitting layer 540 is greater than the permittivity of the side structures, electrical attraction may act more toward the light-transmitting layer 540 than the side structures. The ink may be deflected at the smallest angle and printed by electric attraction that strongly acts toward the light-transmitting layer 540 .

For example, each of the lower structure 501 and the side structure 504 may have a permittivity of 4.0, the light transmission layer 540 may have a permittivity of 80, and the distance ratio R may be 4. The total permittivity of the region not corresponding to the side structure 504 may be 80, which is the permittivity of the light transmission layer 540 . Since the total permittivity of the region corresponding to the side structure is determined according to the ratio of the thickness of the side structure (eg 10 μm) and the thickness of the second lower structure (eg 1 μm), it is about 27 ( lower than the permittivity of the second lower structure). 1/ε1=1/(80×1)+1/(4×10)). The ratio of permittivity (E) may be 0.34, which is the ratio (=27/80) of the total permittivity of the region corresponding to the side structure 504 and the total permittivity of the region not corresponding to the side structure 504 . Accordingly, the ink of Example 2 can be deflected and ejected at a deflection angle θ that is about 1.2 degrees smaller than the deflection angle of Example 1 (tan(θ)=0.34/4 ² ).

In Comparative Examples 3 and 4, the lower structure 501, the light transmission layer 540, and the side structures 504 may be formed on the front substrate before ink is ejected. The light transmission layer 540 may have a width similar to that of the barrier rib 504 and a similar length, and may overlap the side structure 504 . Each of the lower structure 501, the light transmission layer 540, and the side structure 504 shown in FIG. 5B may have the same dielectric constant and thickness as those of the components shown in FIG. 5C. In Comparative Examples 3 and 4, where the permittivity of the light-transmitting layer 504 overlapping with the side structure 504 is greater than that of the lower structure 501, the electric attraction acts more strongly toward the side structure 504 than the lower structure 501, resulting in a deflection angle. may be formed larger than in Examples 1 and 2. Even if the permittivity of the side structure 504 is greater than that of the lower structure 501, the deflection angle of Comparative Example 3, in which the distance ratio is relatively high, is smaller than that of Comparative Example 4, where the distance ratio is relatively small, so that ink can be printed.

For example, the total permittivity of the region not corresponding to the side structure 504 may be 4, which is the permittivity of the lower structure 501, and the total permittivity of the region corresponding to the side structure 504 may be about 27. The ratio of permittivity (E) may be 6.8, which is the ratio (=27/4) of the total permittivity of the area corresponding to the side structure 504 and the total permittivity of the area not corresponding to the side structure 504 . Accordingly, the inks of Comparative Examples 3 and 4 could be deflected and ejected at a deflection angle θ of about 22.9 degrees or about 64.4, which is greater than that of Examples 1 and 2. Since the inks of Comparative Examples 3 and 4 are applied with an excessive bias towards the side structures 504, the ink cannot be stably formed. In severe cases, ink may be applied to adjacent sub-pixels, resulting in color mixing.

As such, ink can be stably printed only when the angle of deflection toward the side structure 504 is relatively small. When the deflection angle (θ) is greater than 0 degree (°) and less than 45 degree (°), the printing process using the nozzle can be stably performed. For example, when the deflection angle (θ) is greater than 0 degrees (°) and less than 30 degrees (°) (E/R ² <0.58), some area of the filling space surrounded by side structures (e.g., the minimum length is 50 degrees). It is possible to stably print ink on an area of less than ㎛) or an entire area (eg, an area with a maximum length of about 450 ㎛).

At least one of the lower structure 501 and the light-transmitting layer 540 in the color conversion substrate (for example, the color conversion substrate 300 of FIG. May be formed of an insulating material or a conductive material. For example, at least one of the lower structure 501 and the light-transmitting layer 540 may be formed of an insulating material having a high permittivity (for example, a permittivity of 20 or more) or a conductive material having a large number of free electrons. there is. Accordingly, on at least one surface of the lower structure 501 and the light-transmitting layer 540, charges having a polarity opposite to that induced in the ink printed through the nozzle can be smoothly induced, so that ink can be stably printed. can

6 is cross-sectional views schematically illustrating a color conversion substrate according to an exemplary embodiment disclosed in this document. 7A to 7C are cross-sectional views illustrating a method of manufacturing a color conversion substrate. 6 to 7c are views in which the color conversion substrate is rotated 180 degrees so that the front substrate faces the ground in terms of manufacturing.

Referring to FIGS. 6 to 7C , a color conversion substrate 610 disclosed in this document (eg, the color conversion substrate 210 of FIG. 3 ) may include a light transmission layer 640 . The light-transmitting layer 640 has a structure of a plurality of layers (eg, a color filter 320, a black matrix 302, and a planarization layer) formed between the light-transmitting layer 640 and the front substrate 301 during the manufacturing process. Regardless, electrical properties (e.g. voltage distribution or charge distribution) can be homogenized. For example, the light-transmitting layer 640 includes the black matrix 302, the color filter 320, and the barrier rib 304 before the color conversion member is formed during the manufacturing process of the color conversion member 330 and the transparent layer 333. The electrical characteristics of the formed front substrate 301 can be made uniform.

The light-transmitting layer 640 has electrical conductivity higher than at least one of a plurality of layers (eg, a color filter, a black matrix, and a planarization layer) formed between the light-transmitting layer 640 and the front substrate 301 and/or It can have a high permittivity. The light transmission layer 640 may be disposed on the front substrate 301 in a size corresponding to that of the front substrate 301 . The light transmission layer 640 may be disposed between the barrier rib 304 and the black matrix 302 and overlap the barrier rib 304 . The light transmission layer 640 is formed between the first color filter 321 and the first color conversion layer 331, between the second color filter 322 and the second color conversion layer 332, and the third color filter ( 323) and the transparent layer 333.

The light transmission layer 640 may be disposed on the black matrix 302 and the color filters 330 to cover the black matrix 302 and the color filters 330 . The light transmission layer 640 may serve as a planarization layer for flattening a level difference between the color filter 330 and the black matrix 302 . The light transmission layer 640 may be formed by adding an additive 642 having high electrical conductivity to the transparent organic insulating material 641 . Additive 642 may be an ionic liquid. Ionic liquids can contain cations that combine with anions. The ionic liquid may exist in a liquid state at room temperature and may be solidified during a curing process of the light transmission layer 640 . The cation may be formed of at least one of imidazolium, ammonium, and pyrrolidinium. The anion may be an inorganic anion including at least one of Cl-, AlCl4-, PF6-, BF4-, NTf2- and DCA-, or/and an organic anion including at least one of CH3COO- and CH3SO3-.

The light transmission layer 640 whose electrical conductivity is increased by the ionic liquid may have a relatively large number of free electrons. Free electrons in the light-transmitting layer 640 transfer charge induced through a stage during an electrohydrodynamic (EHD) process for manufacturing the color conversion member 330 and the transparent layer 333 to one surface of the light-transmitting layer 640 (eg : The surface facing the second direction D2) can be easily moved. Since the light-transmitting layer 640 is formed on the entire surface of the front substrate 301, electrical characteristics (eg, voltage distribution or charge distribution) of the light-transmitting layer 640 may be uniform.

Such a color conversion substrate may be formed through the manufacturing method shown in FIGS. 7A to 7C.

As shown in FIG. 7A , a black matrix 302, a first color filter 321, and a second color filter 322 are formed on one side of the front substrate 301 (eg, the side facing the second direction D2). ) and the third color filter 323 may be sequentially formed. A transparent organic insulating material including an additive 642 on the front substrate 301 on which the black matrix 302, the first color filter 321, the second color filter 322, and the third color filter 323 are formed ( 641) may be coated on the entire surface and then cured to form the light transmission layer 640. A barrier rib 304 may be formed on the front substrate 301 on which the light transmission layer 640 is formed. A nozzle 412 may be aligned on the front substrate 301 on which the barrier rib 340 is formed. At the same time as a constant pressure is applied to the aligned nozzles 412 , an electric field may be formed between the nozzles 412 and the stage 411 . A negative voltage may be applied to the stage 411 and a positive voltage may be applied to the nozzle 412 . Accordingly, the first quantum dot ink 402a discharged through the nozzle 412 may be charged with electric charges (eg, positive charges) having the same polarity as the voltage applied to the nozzle 412 . Positive charges having the same polarity as the voltage applied to the stage 411 are induced on the other surface of the light-transmitting layer 640 close to the stage 411 (eg, the surface facing the first direction D1), and the stage 411 ), negative charges having opposite polarity to the voltage applied to the stage 411) may be induced on one surface of the light-transmitting layer 640 . An electrical attraction may be generated between the negative charges induced on one surface of the light-transmitting layer 640 and the positive charges induced in the first quantum dot ink 402a. The first quantum dot ink 402a may be printed on the first color filters 321 along the first color filters 321 by electrical attraction and then cured to form the first color conversion layer 331 .

A nozzle 412 may be aligned on the front substrate 301 on which the first color conversion layer 331 is formed, as shown in FIG. 7B . At the same time as a constant pressure is applied to the aligned nozzles 412 , an electric field may be formed between the nozzles 412 and the stage 411 . A negative voltage may be applied to the stage 411 and a positive voltage may be applied to the nozzle 412 . Accordingly, the second quantum dot ink 402b ejected through the nozzle 412 may be charged with electric charges (eg, positive charges) having the same polarity as the voltage applied to the nozzle 412 . Positive charges are induced on the other surface of the light-transmitting layer 640 closer to the stage 411 (eg, the surface facing the first direction D1), and negative charges are induced on one surface of the light-transmitting layer 640 farther from the stage 411. can be induced. Electrical attraction may be generated between the negative charges induced on one surface of the light-transmitting layer 640 and the positive charges induced on the second quantum dot ink 402b. The second quantum dot ink 402b is printed on the second color filters 322 along the second color filters 322 by electrical attraction and then cured to form the second color conversion layer 332. .

A nozzle 412 may be aligned on the front substrate 301 on which the second color conversion layer 332 is formed, as shown in FIG. 7C . At the same time as a constant pressure is applied to the aligned nozzles 412 , an electric field may be formed between the nozzles 412 and the stage 411 . A negative voltage may be applied to the stage 411 and a positive voltage may be applied to the nozzle 412 . Accordingly, the transparent ink 402c ejected through the nozzle 412 may be charged with an electric charge (eg, positive charge) having the same polarity as the voltage applied to the nozzle 412 . Positive charges are induced on the other surface of the light-transmitting layer 640 closer to the stage 411 (eg, the surface facing the first direction D1), and negative charges are induced on one surface of the light-transmitting layer 640 farther from the stage 411. can be induced. An electrical attraction may be generated between the negative charges induced on one surface of the light-transmitting layer 640 and the positive charges induced on the transparent ink 402c. The transparent ink 402c may be printed on the third color filters 323 along the third color filters 323 by electrical attraction and then cured to form the transparent layer 333 .

8A to 8C are cross-sectional views schematically illustrating a color conversion substrate 810 according to an exemplary embodiment disclosed herein. 8A to 8C are views in which the color conversion substrate 810 is rotated 180 degrees so that the front substrate 301 faces the ground in terms of manufacturing.

Referring to FIGS. 8A to 8C , a color conversion substrate 810 disclosed in this document (eg, the color conversion substrate 210 of FIG. 3 ) may include a light transmission layer 740 having high electrical conductivity. The light transmission layer 740 having high electrical conductivity may have a relatively large number of free electrons. Free electrons in the light-transmitting layer 740 transfer charges induced through a stage during an electrohydrodynamic (EHD) process for manufacturing the color conversion member 330 and the transparent layer 333 to one surface of the light-transmitting layer 740 (eg : The surface facing the second direction D2) can be easily moved. Since the light-transmitting layer 740 is formed on the entire surface of the front substrate 301, electrical characteristics (eg, voltage distribution or charge distribution) of the light-transmitting layer 740 may be uniform. The light-transmitting layer 740 has a structure of a plurality of layers (eg, a color filter 320, a black matrix 302, and a planarization layer) formed between the light-transmitting layer 740 and the front substrate 301 during a manufacturing process. Regardless, electrical properties (e.g. voltage distribution or charge distribution) can be homogenized. For example, the light transmission layer 740 may uniform the electrical characteristics of the front substrate before the color conversion member 330 and the transparent layer 333 are formed. In the manufacturing process of the color conversion member 330 and the transparent layer 333, at least one of the black matrix 302, the color filter 320, the barrier rib 304, and the planarization layer 730 is formed in the light transmission layer 740. Electrical characteristics of the formed front substrate 301 may be uniform.

The light transmission layer 740 may have electrical conductivity higher than at least one of a plurality of layers (eg, a color filter, a black matrix, and a planarization layer) formed between the color conversion member 330 and the front substrate 301. there is. The light transmission layer 740 may be disposed between the black matrix 302 and the barrier rib 304 . The light transmission layer 640 is formed between the first color filter 321 and the first color conversion layer 331, between the second color filter 322 and the second color conversion layer 332, and the third color filter ( 323) and the transparent layer 333.

The light transmission layer 740 may be formed to a thickness thinner than at least one of the color filter 320 and the black matrix 302 . The light transmission layer 740 may be formed of at least one of a transparent conductive material and an opaque conductive material. The light transmission layer 740 made of a transparent conductive material includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium oxide (In2O3). , indium gallium oxide (IGO) and aluminum zinc oxide (AZO). The light-transmitting layer 740 made of an opaque conductive material may include at least one selected from the group consisting of Al, Cr, Ag, and Pt. The light-transmitting layer 740 made of an opaque conductive material may be formed to a thickness such that optical luminance reduction is negligible. For example, the light transmission layer 740 made of an opaque conductive material may be formed to a thickness of several hundred Å to several thousand Å. Since the light-transmitting layer 740 made of an opaque conductive material can transmit light, it is possible to prevent luminance from being reduced by the light-transmitting layer 740 .

For example, the light transmission layer 740 may be formed to directly contact the color filter 320 and the black matrix 302 as shown in FIG. 8A . In the color conversion substrate 810 shown in FIG. 8A, a black matrix 302, a color filter 320, a light transmission layer 740, and a partition wall 304 are sequentially formed on a front substrate 301, and then electrohydraulic power is applied. The first color conversion layer 331, the second color conversion layer 332, and the transparent layer 333 may be sequentially formed through an EHD process, thereby completing the process.

As another example, as shown in FIG. 8B , the light transmission layer 740 is one surface (eg, in the second direction D2) of the planarization layer 730 disposed to cover the color filter 320 and the black matrix 302. side) can be placed on it. The other surface (eg, the surface facing the first direction D1 ) of the light transmission layer 740 may contact the planarization layer 730 . In the color conversion substrate 810 shown in FIG. 8B, a black matrix 302, a color filter 320, a planarization layer 730, a light transmission layer 740, and a barrier rib 304 are sequentially formed on a front substrate 301. After being formed, the first color conversion layer 331, the second color conversion layer 332, and the transparent layer 333 are sequentially formed through an electrohydrodynamic (EHD) process, thereby completing the process.

According to an embodiment, at least one of the first color conversion layer 331, the second color conversion layer 332, and the transparent layer 333 shown in FIGS. 8A and 8B is formed through an electrohydrodynamic (EHD) process. can be formed During the electrohydrodynamic process, one of positive and negative charges may be uniformly induced on one surface of the light-transmitting layer 740, and the other of positive and negative charges may be induced in the ink ejected through the nozzle. For example, an electric charge (eg, negative charge) equal to a voltage applied to a stage (eg, the stage 411 of FIG. 4A ) may be uniformly induced on one surface of the light-transmitting layer 740 . An electric charge equal to the voltage applied to the nozzle (eg, positive charge) may be induced in the ink ejected through the nozzle. Accordingly, since different charges are induced between one surface of the light-transmitting layer 740 and the ink, an electrical attraction may be generated between the ink and one surface of the light-transmitting layer 740 . The ink may be printed toward the front substrate 301 by electrical attraction and then cured.

As another example, the light transmission layer 740 may be disposed to cover the color filter 320 and the black matrix 302 as shown in FIG. 8C . The light transmission layer 740 may be disposed between each of the color filter 320 and the black matrix 302 and the planarization layer 730 . One surface (eg, a surface facing the second direction D2 ) of the light transmission layer 740 may contact the planarization layer 730 . In the color conversion substrate 810 shown in FIG. 8C, a black matrix 302, a color filter 320, a light transmission layer 740, a planarization layer 730, and a barrier rib 304 are sequentially formed on a front substrate 301. After being formed, the first color conversion layer 331, the second color conversion layer 332, and the transparent layer 333 are sequentially formed through an electrohydrodynamic (EHD) process, thereby completing the process.

During the electrohydrodynamic process, an electric charge (eg, negative charge) equal to the voltage applied to the stage (eg, the stage 411 of FIG. 4A) is uniformly induced on one surface of the light-transmitting layer 740, and is injected through a nozzle. A charge equal to the voltage applied to the nozzle (eg positive charge) may be induced in the quantum dot ink. A polarization phenomenon in which dipoles in the planarization layer 730 are aligned in a certain direction may occur due to negative charges induced on one surface of the light-transmitting layer 740 . Due to the polarization phenomenon, positive and negative charges of the planarization layer 730 may be symmetrically arranged on one surface and the other surface of the planarization layer. Negative charges may be induced on one surface of the planarization layer 730 and positive charges may be induced on the other surface of the planarization layer 730 . Accordingly, an electrical attraction may be generated between the negative charges induced on one surface of the planarization layer 740 and the positive charges induced in the ink. The ink may be printed toward the front substrate 301 by electrical attraction and then cured.

9 is cross-sectional views schematically illustrating a color conversion substrate 910 according to an exemplary embodiment disclosed herein. FIG. 9 is a view in which the color conversion substrate 910 is rotated 180 degrees so that the front substrate 301 faces the ground from a manufacturing point of view.

Referring to FIG. 9 , the color conversion substrate 910 disclosed in this document may include a light transmission layer 840 having a multi-layer structure. For example, the light-transmitting layer 840 may include a first light-transmitting layer 841 and a second light-transmitting layer 842 . At least one of the first light-transmitting layer 841 and the second light-transmitting layer 842 may have high electrical conductivity or high permittivity. The light transmission layer 840 is a front substrate 301 on which at least one of the black matrix 302, the color filter 320, and the barrier rib 304 is formed during the manufacturing process of the color conversion member 330 and the transparent layer 333. It is possible to homogenize the electrical characteristics of

The first light-transmitting layer 841 and the second light-transmitting layer 842 may be disposed between the color filter 320 and the black matrix 302 , respectively, and the barrier rib 304 . For example, the first light-transmitting layer 841 may be formed on the second light-transmitting layer 842 and contact the barrier rib 304 . As another example, the second light-transmitting layer 842 may be formed on the first light-transmitting layer 841 and contact the barrier rib 304 .

The first light-transmitting layer 841 may serve as a planarization layer for flattening a level difference between the color filter 320 and the black matrix 302 . The first light-transmitting layer 841 may be formed by adding an additive 642 having high electrical conductivity to the transparent organic insulating material 641 . Additive 642 may be an ionic liquid. Ionic liquids can contain cations that combine with anions. The ionic liquid may exist in a liquid state at room temperature, and may be solidified during a curing process of the first light transmission layer 841 . The cation may be formed of at least one of imidazolium, ammonium, and pyrrolidinium. The anion may be an inorganic anion including at least one of Cl-, AlCl4-, PF6-, BF4-, NTf2- and DCA-, or/and an organic anion including at least one of CH3COO- and CH3SO3-.

The second light-transmitting layer 842 may be formed of a conductive material having a thickness thinner than at least any one of the first light-transmitting layer 841, the color filter 320, and the black matrix 302, and having high electrical conductivity. can The second light-transmitting layer 842 is formed of a transparent conductive material such as indium tin oxide (ITO), or includes at least one of Al, Cr, Ag, and Pt. It may be formed of an opaque conductive material that The second light-transmitting layer 842 made of an opaque conductive material may be formed to a thickness such that optical luminance reduction is negligible. For example, the second light transmission layer 842 made of an opaque conductive material may be formed to a thickness of several hundred Å to several thousand Å. Since the second light-transmitting layer 842 made of an opaque conductive material can transmit light, it is possible to prevent luminance from being reduced by the second light-transmitting layer 842 .

As another example, the first light-transmitting layer 841 may be formed of a transparent conductive material or an opaque conductive material, and the second light-transmitting layer 842 may be formed of a transparent organic insulating material containing an ionic liquid.

10 to 13 are diagrams schematically illustrating a color conversion substrate 1010 according to an exemplary embodiment disclosed in this document. FIG. 10 is a view in which the color conversion substrate 1010 is rotated 180 degrees so that the front substrate 301 faces the ground in terms of manufacturing.

10 to 13, the color conversion substrate 1010 disclosed in this document includes a light-transmitting layer 940 capable of forming strong electrical attraction toward the front substrate 301 during a manufacturing process using a nozzle. can include The light transmission layer 940 may be disposed in a central region of each of the sub-pixels SP1 , SP2 , and SP3 (or each color filter 320 ). During the manufacturing process of the color conversion member 330 and the transparent layer 333, the light transmission layer 940 is formed in a direction toward the front substrate 301 (eg, in the first direction D1) rather than toward the barrier rib 304. capable of forming a strong electrical attraction

The light-transmitting layer 940 may include a first light-transmitting layer 941 , a second light-transmitting layer 942 , and a third light-transmitting layer 943 . The first light-transmitting layer 941 , the second light-transmitting layer 942 , and the third light-transmitting layer 943 may have the same size or different sizes.

At least one of the first light-transmitting layer 941, the second light-transmitting layer 942, and the third light-transmitting layer 943 has a higher electrical conductivity than the barrier rib 304 or a higher dielectric constant than the barrier rib 304. material can be formed. For example, at least one of the first light-transmitting layer 941, the second light-transmitting layer 942, and the third light-transmitting layer 943 is made of a transparent conductive material such as indium tin oxide (ITO). or may be formed of an opaque conductive material. The opaque conductive material may include at least one of Al, Cr, Ag, and Pt. The light-transmitting layer 940 formed of an opaque conductive material may be formed to a thickness such that optical luminance reduction is negligible. For example, the light transmission layer 940 formed of an opaque conductive material may be formed to a thickness of several hundred Å to several thousand Å. As another example, at least one of the first light-transmitting layer 941, the second light-transmitting layer 942, and the third light-transmitting layer 943 is formed of an acrylic or epoxy-based photosensitive organic insulating material or an additive that increases dielectric constant. It may be an organic insulating material containing. The first light-transmitting layer 941, the second light-transmitting layer 942, and the third light-transmitting layer 943 may be formed of the same material, or at least one of them may be formed of a material different from the others.

The first light-transmitting layer 941 may be disposed in a central area of the first sub-pixel SP1 (or the first color filter 321). The first light-transmitting layer 941 may be formed along an imaginary center line of the first sub-pixel SP1. The imaginary center line is one side of the barrier rib 304 surrounding the first color conversion layer 331 (eg, a side facing the third direction D3) and the other side of the barrier rib 304 that is opposite to the one side. It can be formed along the middle between. One side and the other side of the barrier rib 304 may face each other with the first light transmitting layer 941 interposed therebetween. The separation distance between one side surface of the barrier rib 304 and the other side surface of the barrier rib 304 and the first light transmission layer 941 may be the same or similar.

The first light transmission layer 941 may be disposed between the first color filter 321 and the first color conversion layer 331 . The first light transmission layer 941 overlaps a portion of each of the first color filter 321 and the first color conversion layer 331, and each of the first color filter 321 and the first color conversion layer 331 May be non-overlapping with some of the others. One surface of the first light-transmitting layer 941 is in contact with a part of the other surface of the first color conversion layer 331, and the other surface of the first light-transmitting layer 941 is in contact with a part of one surface of the first color filter 321. can contact

The second light transmission layer 942 may be disposed at the center of the second sub-pixel SP2 (or the second color filter 322). The second light transmission layer 942 may be formed along an imaginary center line of the second sub-pixel SP2. The imaginary center line is one side of the barrier rib 304 surrounding the second color conversion layer 332 (eg, the side facing the third direction D3) and the other side of the barrier rib 304 that is opposite to the one side. It can be formed along the middle between. One side and the other side of the barrier rib 304 may face each other with the second light transmitting layer 942 interposed therebetween. The separation distance between one side surface of the barrier rib 304 and the other side surface of the barrier rib 304 and the second light transmission layer 942 may be the same or similar.

The second light transmission layer 942 may be disposed between the second color filter 322 and the second color conversion layer 332 . The second light transmission layer 942 overlaps a portion of each of the second color filter 322 and the second color conversion layer 332, and each of the second color filter 322 and the second color conversion layer 332 May be non-overlapping with some of the others. One surface of the second light-transmitting layer 942 is in contact with a part of the other surface of the second color conversion layer 332, and the other surface of the second light-transmitting layer 942 is in contact with a part of one surface of the second color filter 322. can contact

The third light transmission layer 943 may be disposed at the center of the third sub-pixel SP3 (or the third color filter 323). The third light-transmitting layer 943 may be formed along an imaginary center line of the third sub-pixel SP3. The imaginary center line is one side of the barrier rib 304 surrounding the third color conversion layer 333 (eg, the side facing the third direction D3) and the other side of the barrier rib 304 that is opposite to the one side. It can be formed along the middle between. One side and the other side of the barrier rib 304 may face each other with the third light transmitting layer 943 interposed therebetween. A separation distance between one side surface of the barrier rib 304 and the other side surface of the barrier rib 304 and the third light transmitting layer 943 may be the same or similar.

The third light transmission layer 943 may be disposed between the third color filter 323 and the transparent layer 333 . The third light transmission layer 943 may overlap a portion of each of the third color filter 323 and the transparent layer 333, and may not overlap a portion of each of the third color filter 323 and the transparent layer 333. . The third light-transmitting layer 943 may contact a portion of the other surface of the transparent layer 333 , and the other surface of the third light-transmitting layer 943 may contact a portion of one surface of the third color filter 323 .

According to an embodiment, at least one of the first light-transmitting layer 941, the second light-transmitting layer 942, and the third light-transmitting layer 943 has a dot shape (or dotted line) as shown in FIG. form) can be formed. For example, at least one first light-transmitting layer 941 is formed in each of the first sub-pixels SP1, and at least one second light-transmitting layer 942 is formed in each of the second sub-pixels SP2. At least one third light-transmitting layer 943 may be formed for each of the third sub-pixels SP3.

A barrier rib 304 may be disposed between adjacent first light-transmitting layers 941 . Adjacent first light-transmitting layers 941 may be spaced apart from each other with the barrier rib 304 interposed therebetween. The first light transmission layer 941 may not overlap the barrier rib 304 positioned between the first color filters 321 . The first light transmission layer 941 may not overlap the barrier rib 304 positioned between each of the second color filter 322 and the third color filter 323 and the first color filter 321 . The first light-transmitting layer 941 may be formed to cross the central region of the first sub-pixel SP1 surrounded by the barrier rib 304 . The first light-transmitting layer 941 extends in the length direction (eg, the fourth direction D4) of the first sub-pixel SP1 longer than the width direction (eg, the third direction D3) of the first sub-pixel SP1. ) along the central region of the first sub-pixel SP1.

A barrier rib 304 may be disposed between adjacent second light-transmitting layers 942 . Adjacent second light transmission layers 942 may be spaced apart from each other with the barrier rib 304 interposed therebetween. The second light transmission layer 942 may not overlap the barrier rib 304 positioned between the second color filters 322 . The second light transmission layer 942 may not overlap the barrier rib 304 positioned between each of the first color filter 321 and the third color filter 323 and the second color filter 322 . The second light-transmitting layer 942 may be formed to cross the central region of the second sub-pixel SP2 surrounded by the barrier rib 304 . The second light transmission layer 942 extends in the length direction (eg, the fourth direction D4) of the second sub-pixel SP2 longer than the width direction (eg, the third direction D3) of the second sub-pixel SP2. ) may be formed to cross the central area of the second sub-pixel SP2.

A barrier rib 304 may be disposed between adjacent third light-transmitting layers 943 . Adjacent third light-transmitting layers 943 may be spaced apart from each other with the barrier rib 304 interposed therebetween. The third light transmission layer 943 may overlap the barrier rib 304 positioned between the third color filters 323 . The third light transmission layer 943 may not overlap each of the first color filter 321 and the second color filter 322 and the barrier rib 304 positioned between the third color filter 323 . The third light-transmitting layer 943 may be formed to cross the central region of the third sub-pixel SP3 surrounded by the barrier rib 304 . The third light transmission layer 943 extends in the length direction (eg, the fourth direction D4) of the second sub-pixel SP2 longer than the width direction (eg, the third direction D3) of the third sub-pixel SP3. ) along the central region of the third sub-pixel SP3.

According to another embodiment, the light transmission layer 940 has a stripe shape along a plurality of sub-pixels (or color filters 320) implementing the same color, as shown in FIGS. 12 and 13 . can be formed The first light-transmitting layer 941 may be formed in a stripe shape along the plurality of first sub-pixels SP1 arranged in a row. The first light-transmitting layer 941 extends in the length direction (eg, the fourth direction D4) of the first sub-pixel SP1 longer than the width direction (eg, the third direction D3) of the first sub-pixel SP1. ) may be formed to cross the central area of the first sub-pixels SP1. The first light transmission layer 941 may overlap the barrier rib 304 positioned between the first color filters 321 implementing the same color. The first light transmission layer 941 may not overlap each of the second color filter 322 and the third color filter 323 and the barrier rib 304 positioned between the first color filter 321 .

The second light-transmitting layer 942 may be formed in a stripe shape along the plurality of second sub-pixels SP2 arranged in a row. The second light transmission layer 942 extends in the length direction (eg, the fourth direction D4) of the second sub-pixel SP2 longer than the width direction (eg, the third direction D3) of the second sub-pixel SP2. ) may be formed to cross the central area of the second sub-pixels SP2. The second light transmission layer 942 may overlap the barrier rib 304 positioned between the second color filters 322 implementing the same color. The second light transmission layer 942 may not overlap the barrier rib 304 positioned between each of the first color filter 321 and the third color filter 323 and the second color filter 322 .

The third light-transmitting layer 943 may be formed in a stripe shape along the plurality of third sub-pixels SP3 arranged in a row. The third light transmission layer 943 extends in the length direction (eg, the fourth direction D4) of the third sub-pixel SP3 longer than the width direction (eg, the third direction D3) of the third sub-pixel SP3. ) may be formed to cross the central area of the third sub-pixels SP3. The third light transmission layer 942 may overlap the barrier rib 304 positioned between the third color filters 323 implementing the same color. The third light transmission layer 943 may not overlap each of the first color filter 321 and the second color filter 322 and the barrier rib 304 positioned between the third color filter 323 .

For example, the light-transmitting layers 940 formed in a stripe shape may be independently formed and separated from adjacent light-transmitting layers 940 as shown in FIG. 12 . Each of the first light-transmitting layers 941 may be formed independently without being connected to the adjacent second light-transmitting layer 942 and third light-transmitting layer 943 . The second light-transmitting layers 942 may be formed independently without being connected to the adjacent first light-transmitting layer 941 and third light-transmitting layer 943 . The third light-transmitting layers 943 may be formed independently without being connected to the adjacent first and second light-transmitting layers 941 and 942 .

As another example, the light transmitting layers 940 formed in a stripe shape may be connected to each other through at least one of a first connection line 951 and a second connection line 952 as shown in FIG. 13 . At least one of the first connection line 951 and the second connection line 952 is in the width direction of each of the first light transmission layer 941 , the second light transmission layer 942 , and the third light transmission layer 943 . (eg, the third direction (D3)) and may be stretched in parallel. One ends of each of the first light-transmitting layer 941 , the second light-transmitting layer 942 , and the third light-transmitting layer 943 may be connected to each other through a first connection line 951 . The other ends of each of the first light-transmitting layer 941 , the second light-transmitting layer 942 , and the third light-transmitting layer 943 may be connected to each other through a second connection line 952 . At least one of the first connection line 951 and the second connection line 952 is at least one of the first light transmission layer 941 , the second light transmission layer 942 , and the third light transmission layer 943 . It can be made of the same material as For example, the first light-transmitting layer 941, the second light-transmitting layer 942, the third light-transmitting layer 943, the first connection line 951, and the second connection line 952 are made of the same material. It can be formed as an integral structure.

For example, the first connection line 951 and the second connection line 952 may be formed of an acrylic or epoxy-based photosensitive organic insulating material, or may be an organic insulating material containing an additive to increase dielectric constant. As another example, the first connection line 951 and the second connection line 952 are formed of a transparent conductive material such as indium tin oxide (ITO) or at least one of Al, Cr, Ag, and Pt. It may be formed of an opaque conductive material including The first connection line 951 and the second connection line 952 formed of an opaque conductive material are at least one of the first light-transmitting layer 941, the second light-transmitting layer 942, and the third light-transmitting layer 943. It may be formed with the same thickness as any one or formed with a thick thickness. The first connection line 951 and the second connection line 952 formed to a thickness greater than at least any one of the first light transmission layer 941, the second light transmission layer 942, and the third light transmission layer 943. ) may be located in a bezel area where the sub-pixels SP1 , SP2 , and SP3 are not disposed.

According to various embodiments, a color conversion substrate (e.g., the color conversion substrate 300 of FIG. 3, the color conversion substrate 610 of FIG. 6, the color conversion substrate 810 of FIGS. 8A to 8C, and the color conversion substrate 810 of FIG. 9) After the substrate 910 and the color conversion substrate 1010 of FIG. 10 are manufactured or the color conversion member 330 is manufactured, each layer included in the color conversion substrate may not be charged. .

According to an embodiment of the present document, a display including a first sub-pixel, a second sub-pixel, and a third sub-pixel implementing different colors is disposed on a first substrate to correspond to the first sub-pixel. 1 color conversion layer; a first color filter disposed to overlap the first color conversion layer; a second color conversion layer disposed on the first substrate to correspond to the second sub-pixel; a second color filter disposed to overlap the second color conversion layer; a transparent layer disposed on the first substrate to correspond to the third sub-pixel; a third color filter disposed to overlap the transparent layer; barrier ribs disposed to surround each of the first color conversion layer, the second color conversion layer, and the transparent layer; a black matrix disposed to overlap the barrier rib; a light-transmitting layer disposed between the first color conversion layer and the first color filter, between the second color conversion layer and the second color filter, and between the transparent layer and the third color filter; The light transmission layer may have at least one of electrical conductivity and permittivity higher than at least any one of the black matrix, the first color filter, the second color filter, the third color filter, and the barrier rib.

According to one embodiment of the present document, the light transmission layer overlaps the barrier rib and may be disposed on the first substrate in a size corresponding to that of the first substrate.

According to one embodiment of the present document, the light transmission layer may be formed of at least one of a transparent conductive material and an opaque conductive material.

According to one embodiment of the present document, the light transmission layer may have a thickness thinner than any one of the first color filter, the second color filter, and the third color filter.

According to one embodiment of the present document, the display further includes a planarization layer disposed to cover the first color filter, the second color filter, the third color filters, and the black matrix, the planarization layer comprising: It may contact one surface of the light-transmitting layer or contact the other surface of the light-transmitting layer, which is a surface opposite to the one surface.

According to an embodiment of the present document, the light-transmitting layer is disposed to cover the first color filter, the second color filter, the third color filters, and the black matrix, and the light-transmitting layer is an ionic liquid. It may be formed of an organic insulating material containing.

According to an embodiment of the present document, the light-transmitting layer may include a first light-transmitting layer disposed on the substrate; It includes a second light-transmitting layer disposed on the first light-transmitting layer, and any one of the first light-transmitting layer and the second light-transmitting layer is a conductive material of at least one of a transparent conductive material and an opaque conductive material. and an organic insulating material containing an ionic liquid, and the other one of the first light-transmitting layer and the second light-transmitting layer is at least one conductive material selected from a transparent conductive material and an opaque conductive material. It may be formed of the other one of organic insulating materials including an ionic liquid.

According to one embodiment of the present document, the light-transmitting layer may include a first light-transmitting layer disposed on a part of at least one of the plurality of first color filters; a second light transmission layer disposed on a part of at least one of the plurality of second color filters; A third light-transmitting layer disposed on a portion of at least one of the plurality of third color filters may be included.

According to an embodiment of the present document, at least one of the first light-transmitting layer, the second light-transmitting layer, and the third light-transmitting layer is formed of at least one conductive material of a transparent conductive material and an opaque conductive material, or , It may be formed of an organic insulating material containing an ionic liquid.

According to one embodiment of the present document, the first light-transmitting layer is disposed on a central region of the first color filters, does not overlap with the barrier rib disposed between the first color filters, and the second light-transmitting layer The transmission layer is disposed on the central region of the second color filters and does not overlap with the barrier rib disposed between the second color filters, and the third light transmission layer is disposed on the central region of the third color filters. and may not overlap with the barrier rib disposed between the third color filters.

According to one embodiment of the present document, the first light-transmitting layer is formed in a stripe shape along the center of the first color filters arranged in a row, and the second light-transmitting layer is formed in a stripe shape along the center of the first color filters arranged in a row. It may be formed in a stripe shape along the center of the filters, and the third light transmission layer may be formed in a stripe shape along the center of the third color filters arranged in a row.

According to one embodiment of the present document, the first light-transmitting layer overlaps the barrier rib disposed between the first color filters, and the second light-transmitting layer disposed between the second color filters. It overlaps the barrier rib, and the third light transmission layer may overlap the barrier rib disposed between the third color filters.

According to one embodiment of the present document, the first light-transmitting layer, the second light-transmitting layer, and the third light-transmitting layer may be formed independently of each other.

According to one embodiment of the present document, the display may further include a connection line connecting the first light-transmitting layer, the second light-transmitting layer, and the third light-transmitting layer.

According to an embodiment of the present document, a first ratio of the permittivity of the barrier rib to the permittivity of the light-transmitting layer is at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel with respect to the thickness of the barrier rib. The size may be smaller than the square of the second ratio of the distance from any one center to the barrier rib.

According to one embodiment of the present document, a method of manufacturing a display includes forming a black matrix on a substrate; sequentially forming a first color filter, a second color filter, and a third color filter on the substrate on which the black matrix is formed; forming a light-transmitting layer on the substrate on which the first color filter, the second color filter, and the third color filter are formed; forming barrier ribs on the substrate on which the light-transmitting layer is formed; arranging nozzles on the substrate on which the barrier ribs are formed, and forming an electric field between the nozzles and a stage on which the substrate is seated; forming a first color conversion layer by printing a first quantum dot ink through the nozzle; forming a second color conversion layer by printing second quantum dot ink through the nozzle; and forming a transparent layer by printing transparent ink through the nozzle, wherein the light-transmitting layer comprises at least one of the substrate, the first color filter, the second color filter, the third color filter, and the barrier rib. At least one of electrical conductivity and permittivity may be higher than that.

According to one embodiment of the present document, the light transmission layer overlaps the barrier rib and may be disposed on the first substrate in a size corresponding to that of the first substrate.

According to one embodiment of the present document, the light-transmitting layer may include a first light-transmitting layer disposed on a part of at least one of the plurality of first color filters; a second light transmission layer disposed on a part of at least one of the plurality of second color filters; A third light-transmitting layer disposed on a portion of at least one of the plurality of third color filters may be included.

According to an embodiment of the present document, at least one of the first light-transmitting layer, the second light-transmitting layer, and the third light-transmitting layer is formed of at least one conductive material of a transparent conductive material and an opaque conductive material, or , It may be formed of an organic insulating material containing an ionic liquid.

Various embodiments of this document and terms used therein are not intended to limit the technology described in this document to a specific embodiment, and should be understood to include various modifications, equivalents, and/or substitutes of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like elements. Singular expressions may include plural expressions unless the context clearly dictates otherwise. In this document, expressions such as "A or B", "at least one of A and/or B", "A, B or C" or "at least one of A, B and/or C" refer to all of the items listed together. Possible combinations may be included. Expressions such as "first," "second," "first," or "second," may modify the corresponding components regardless of order or importance, and are used to distinguish one component from another. It is used only and does not limit the corresponding components. When a (e.g., first) element is referred to as being "(functionally or communicatively) connected" or "connected" to another (e.g., second) element, that element refers to the other (e.g., second) element. It may be directly connected to the component or connected through another component (eg, a third component).

In this document, "adapted to or configured to" means "adapted to or configured to" depending on the situation, for example, hardware or software "adapted to," "having the ability to," "changed to," ""made to," "capable of," or "designed to" can be used interchangeably. In some contexts, the expression "device configured to" can mean that the device is "capable of" in conjunction with other devices or components. For example, the phrase “a processor configured (or configured) to perform A, B, and C” may include a dedicated processor (eg, embedded processor), or one or more stored in a memory device (eg, memory) to perform the operations. By executing programs, it may mean a general-purpose processor (eg, CPU or AP) capable of performing corresponding operations.

The term "module" used in this document includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits, for example. can A “module” may be an integrally constructed component or a minimal unit or part thereof that performs one or more functions. A "module" may be implemented mechanically or electronically, for example, a known or future developed application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs), or A programmable logic device may be included.

At least some of devices (eg, modules or functions thereof) or methods (eg, operations) according to various embodiments may be implemented as instructions stored in a computer-readable storage medium (eg, memory) in the form of program modules. can When the command is executed by a processor (eg, a processor), the processor may perform a function corresponding to the command. Computer-readable recording media include hard disks, floppy disks, magnetic media (e.g. magnetic tape), optical recording media (e.g. CD-ROM, DVD, magneto-optical media (e.g. floptical disks), built-in memory, etc.) The instruction may include code generated by a compiler or code executable by an interpreter.

Each component (eg, module or program module) according to various embodiments may be composed of a single object or a plurality of entities, and some sub-components among the aforementioned corresponding sub-components may be omitted, or other sub-components may be used. can include more. Alternatively or additionally, some components (eg, modules or program modules) may be integrated into one entity and perform the same or similar functions performed by each corresponding component prior to integration. Operations performed by modules, program modules, or other components according to various embodiments are executed sequentially, in parallel, repetitively, or heuristically, or at least some operations are executed in a different order, omitted, or other operations. this may be added.

Claims (15)

1. In a display including a first sub-pixel, a second sub-pixel, and a third sub-pixel implementing different colors,

   a first color conversion layer disposed on a first substrate to correspond to the first sub-pixel;

   a first color filter disposed to overlap the first color conversion layer;

   a second color conversion layer disposed on the first substrate to correspond to the second sub-pixel;

   a second color filter disposed to overlap the second color conversion layer;

   a transparent layer disposed on the first substrate to correspond to the third sub-pixel;

   a third color filter disposed to overlap the transparent layer;

   barrier ribs disposed to surround each of the first color conversion layer, the second color conversion layer, and the transparent layer;

   a black matrix disposed to overlap the barrier rib;

   a light-transmitting layer disposed between the first color conversion layer and the first color filter, between the second color conversion layer and the second color filter, and between the transparent layer and the third color filter;

   The light-transmitting layer has at least one of electrical conductivity and dielectric constant higher than at least any one of the black matrix, the first color filter, the second color filter, the third color filter, and the barrier rib.
2. According to claim 1,

   The light-transmitting layer overlaps the barrier rib and is disposed on the first substrate in a size corresponding to that of the first substrate.
3. According to claim 1,

   The light-transmitting layer is formed of at least one of a transparent conductive material and an opaque conductive material.
4. According to claim 3,

   The light-transmitting layer is thinner than any one of the first color filter, the second color filter, and the third color filter.
5. According to claim 4,

   a planarization layer disposed to cover the first color filter, the second color filter, the third color filter, and the black matrix;

   The flattening layer is in contact with one surface of the light-transmitting layer or in contact with the other surface of the light-transmitting layer, which is a surface opposite to the one surface.
6. According to claim 1,

   the light transmission layer is disposed to cover the first color filter, the second color filter, the third color filter and the black matrix;

   The light-transmitting layer is a display formed of an organic insulating material containing an ionic liquid.
7. According to claim 1,

   The light-transmitting layer is

   a first light transmission layer disposed on the substrate;

   A second light-transmitting layer disposed on the first light-transmitting layer;

   Any one of the first light-transmitting layer and the second light-transmitting layer is formed of at least one conductive material of a transparent conductive material and an opaque conductive material and any one of an organic insulating material containing an ionic liquid,

   The other one of the first light-transmitting layer and the second light-transmitting layer is formed of at least one conductive material of a transparent conductive material and an opaque conductive material and the other of an organic insulating material containing an ionic liquid.
8. According to claim 1,

   The light-transmitting layer is

   a first light-transmitting layer disposed on a part of at least one of the plurality of first color filters;

   a second light transmission layer disposed on a part of at least one of the plurality of second color filters;

   A display comprising a third light transmission layer disposed on a part of at least one of the plurality of third color filters.
9. According to claim 8,

   At least one of the first light-transmitting layer, the second light-transmitting layer, and the third light-transmitting layer

   A display formed of at least one of a transparent conductive material and an opaque conductive material, or formed of an organic insulating material containing an ionic liquid.
10. According to claim 8,

    the first light-transmitting layer is disposed on a central region of the first color filters and does not overlap with the barrier rib disposed between the first color filters;

    the second light-transmitting layer is disposed on a central region of the second color filters and does not overlap with the barrier rib disposed between the second color filters;

    The third light-transmitting layer is disposed on a central region of the third color filters and does not overlap with the barrier rib disposed between the third color filters.
11. According to claim 8,

    The first light-transmitting layer is formed in a stripe shape along the center of the first color filters arranged in a row;

    The second light-transmitting layer is formed in a stripe shape along the center of the second color filters arranged in a row;

    The third light-transmitting layer is formed in a stripe shape along the center of the third color filters arranged in a row.
12. According to claim 11,

    The first light-transmitting layer overlaps the barrier rib disposed between the first color filters;

    the second light-transmitting layer overlaps the barrier rib disposed between the second color filters;

    The third light-transmitting layer overlaps the barrier rib disposed between the third color filters.
13. According to claim 8,

    The first light-transmitting layer, the second light-transmitting layer, and the third light-transmitting layer are formed independently of each other.
14. According to claim 8,

    The display further comprises a connection line connecting the first light-transmitting layer, the second light-transmitting layer and the third light-transmitting layer.
15. According to claim 1,

    A first ratio of the permittivity of the barrier rib to the permittivity of the light-transmitting layer,

    The display of claim 1 , wherein the size is smaller than the square of a second ratio of a distance from a center of at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel to the thickness of the barrier rib to the barrier rib.

Images