WO2023124519A1

WO2023124519A1 - Heating element and electronic atomization device

Info

Publication number: WO2023124519A1
Application number: PCT/CN2022/129414
Authority: WO
Inventors: 郭玉; 刘小力; 梁峰
Original assignee: 深圳麦时科技有限公司
Priority date: 2021-12-31
Filing date: 2022-11-03
Publication date: 2023-07-06
Also published as: CN114304750A

Abstract

A heating element (100) and an electronic atomization device. The heating element (100) comprises: a substrate (10), which is of a longitudinal structure, and comprises a bottom end and a top end opposite the bottom end; and a heating film (20), which is arranged on the substrate (10), and comprises at least two heating sub-films (21) successively arranged in the longitudinal direction of the substrate (10), wherein the initial heating power per unit of area of the heating sub-film (21), among the heating sub-films (21), located at the top end is greater than the initial heating power per unit of area of each of the remaining heating sub-films (21); and the change rate of the heating power of the heating sub-film (21) which is located at the top end and has the largest initial heating power per unit of area is less than the change rate of the heating power of each of the remaining heating sub-films (21). Therefore, in an initial vaping stage, an aerosol is formed by means of rapid baking in a high-temperature region at a top end, and then, the heating temperatures of regions are made to gradually become close to each other, such that the whole aerosol generation matrix is uniformly and fully baked, the situation where the temperature of a certain region is overly high for a long time and thus causes burn is prevented, and the aerosol generation matrix is effectively baked and used, thereby improving the user experience.

Description

Heating element and electronic atomization device

technical field

The present application relates to the technical field of atomization, in particular to a heating element and an electronic atomization device.

Background technique

Aerosol is a colloidal dispersion system formed by dispersing small solid or liquid particles and suspending them in a gaseous medium. For example, an aerosol can be generated by baking and heating an aerosol-generating substrate of herbs or ointments through an electronic atomization device. It is used in different fields to deliver inhalable aerosols to users, replacing conventional product forms and suction methods.

Generally, the electronic atomization device usually uses a heating element to heat the aerosol-generating substrate, and the aerosol-generating substrate is a substrate material capable of generating aerosol after being heated. However, the heating element in the prior art has the defect that the aerosol formation speed is slow, and in order to increase the aerosol formation speed, in some embodiments, the high temperature zone of the heating element body is set close to the suction part of the user's mouth, while the high temperature zone The position and volume of the oven are fixed, so the aerosol-generating matrix baked there is easily burnt, which affects the taste. In other embodiments, in order to increase the rate of aerosol formation, more heating energy is provided for the aerosol-generating substrate at the initial stage of heating, which can also increase the rate of aerosol formation, but because the initial heating energy is relatively large, the aerosol-generating substrate If the carbonization speed is too fast, the number of effective ports will be reduced, and the aerosol-forming matrix cannot be effectively baked.

Therefore, when the heating element in the related art increases the rate of aerosol formation, it is easy to cause local scorching, or it cannot effectively bake the aerosol-generating substrate, which affects user experience.

Contents of the invention

Based on this, it is necessary to provide a heating element and an electronic atomization device, so as to increase the speed of aerosol formation, avoid local burning, and effectively bake the aerosol-generating substrate to improve user experience.

A heating element comprising:

a base, which is an elongated structure and includes a base and a top opposite the base; and

A heating film, disposed on the base, including at least two sub-heating films sequentially arranged along the longitudinal direction of the base;

Wherein, the initial heating power per unit area of the sub-heating film located at the top of each of the sub-heating films is greater than the initial heating power per unit area of each of the other sub-heating films; and, located at the top and The rate of change of heating power of the sub-heating film with the largest initial heating power per unit area is smaller than the rate of change of heating power of each of the other sub-heating films.

Among the above-mentioned heating elements, the sub-heating film at the top has the largest initial heating power per unit area, and a high-temperature region is formed at the top in the early stage of suction to increase the formation speed of aerosol. Moreover, the sub-heating film with the largest initial heating power has the smallest heating power change rate, while the heating power of other sub-heating films has a relatively large change rate. The heating power of the film changes greatly, which can make the heating power of the top terminal heating film and the bottom terminal heating film gradually approach, and even the heating power of the bottom terminal heating film reverses the heating power of the top terminal heating film, and then the bottom terminal heating film can be compared. The temperature is quickly raised to be close to the temperature of the heating film at the top, and the entire heating film can generate heat evenly in the longitudinal direction.

In this way, the at least two sub-heating films in the heat-generating film finally heat and atomize the entire aerosol-generating substrate uniformly, preventing local temperature in a certain area from being too high and causing scorching. At the same time, there is no need to provide large heating energy to the aerosol-generating substrate as a whole in the early stage of heating, so as to prevent the overall carbonization speed of the aerosol-generating substrate from being too fast and reduce the effective number of holes, so as to fully bake and utilize the aerosol-generating substrate. It is equivalent to the rapid baking of the high-temperature area at the top to form an aerosol in the initial stage of suction, and then the heating temperature of each area is gradually approached, so as to evenly and fully bake the entire aerosol-generating matrix and prevent the temperature of a certain area from being too high for a long time. High enough to produce burnt paste, and effective baking uses aerosols to generate substrates to improve user experience.

In one of the embodiments, along the direction from the bottom end to the top end, the initial heating power per unit area of each of the sub-heating films gradually increases, and the rate of change of heating power of each of the sub-heating films gradually decreases .

In one of the embodiments, each of the sub-heating films is a thermistor, and the at least two sub-heating films are connected in series;

Along the direction from the bottom end to the top end, the initial resistance per unit area of each sub-heating film connected in series gradually increases, and the resistance change rate of each sub-heating film gradually decreases.

In one of the embodiments, each of the sub-heating films is a thermistor, and the at least two sub-heating films are connected in parallel;

Along the direction from the bottom end to the top end, the initial resistance per unit area of each sub-heating film connected in parallel gradually decreases, and the resistance change rate of each sub-heating film gradually decreases.

In one of the embodiments, all of the sub-heating films are made of materials with a positive temperature coefficient of resistance, or all of the sub-heated films are made of materials with a negative temperature coefficient of resistance.

In one of the embodiments, part of the sub-heating films located at the bottom of the at least two sub-heating films is a positive temperature coefficient material, and the other part of the at least two sub-heating films located at the top is a positive temperature coefficient material. The heating film is a negative temperature coefficient material.

In one of the embodiments, the heating element further includes a first electrode layer and a second electrode layer arranged on the substrate, and the first electrode layer and the second electrode layer are connected to the at least two sub-layers respectively. The two sub-heating films at the first and last ends of the heat-generating film are in contact with each other.

In one of the embodiments, the heating element further includes an infrared radiation layer, the infrared radiation layer is disposed on the substrate and stacked with the heating film;

Wherein, the projection of the infrared radiation layer toward the plane where the heating film is located covers all the sub-heating films.

In one of the embodiments, the base body is configured as a central heating structure, the outer peripheral side of the base body forms the accommodating position, and the heating film and the infrared radiation layer are sequentially stacked on the base body from the inside to the outside. on the outside.

In one of the embodiments, the base body is configured as a pin body, the heating film and the infrared radiation layer are both extended along the circumferential direction of the pin body, and the at least two sub-substrates in the heating film The heating film is arranged along the axial direction of the pin body; or

The substrate is configured as a sheet body, the heating film and the infrared radiation layer are sequentially laminated on one of the front and back sides of the sheet body from the inside to the outside, and the other of the front and back sides of the sheet body is The infrared radiation layer is laminated on the upper layer.

In one of the embodiments, the base body is configured as a peripheral heating structure, and the accommodation position is formed inside the base body;

The outer peripheral surface of the base body is coated with the heating film; the infrared radiation layer is formed between the heating film and the base body, or on the inner peripheral surface of the base body facing the accommodating position.

In one of the embodiments, the substrate is a transparent substrate, and the infrared radiation layer is laminated between the heating film and the substrate; or

The base is a non-transparent base, and the infrared radiation layer is coated on the inner peripheral surface of the base.

An electronic atomization device, comprising the above-mentioned heating element.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present application, and those of ordinary skill in the art can also obtain other drawings according to the disclosed drawings on the premise of not paying creative efforts.

Fig. 1 is a schematic cross-sectional structure diagram of a heating element in an embodiment of the present application;

Fig. 2 is a schematic structural view of the base body and the electric heating film layer of the heating element shown in Fig. 1;

Fig. 3 is an expanded view of the electric heating film layer shown in Fig. 2;

Fig. 4 is a schematic cross-sectional structure diagram of a heating element in another embodiment;

Fig. 5 is a schematic cross-sectional structure diagram of a heating element in another embodiment;

Fig. 6 is a schematic cross-sectional structure diagram of a heating element in another embodiment;

Fig. 7 is a schematic cross-sectional structure diagram of a heating element in another embodiment;

Fig. 8 is a schematic cross-sectional structure diagram of a heating element in another embodiment;

Fig. 9 is a schematic cross-sectional structure diagram of a heating element in another embodiment;

Fig. 10 is a schematic structural view of the heating body and the electric heating film layer shown in Fig. 8 or Fig. 9 .

Reference signs: 100, heating element; 10, base body; 11, accommodating position; 20, heating film; 21, sub-heating film; 32, first electrode layer; 34, second electrode layer; 40, insulating layer; 50 , infrared radiation layer; 60, protective layer.

Detailed ways

In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and thus should not be construed as limiting the application.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In this application, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense, for example, it can be a fixed connection or a detachable connection, unless otherwise clearly specified and limited. , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise specified limit. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In the present application, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may mean that the first and second features are in direct contact, or that the first and second features are indirect through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions are for the purpose of illustration only and are not intended to represent the only embodiments.

Referring to Figures 1-3, in one embodiment of the present application, a heating element 100 is provided for heating the atomized aerosol generating substrate, and the formed aerosol can be sucked into the user's mouth for inhalation by the user.

The heating element 100 includes a base body 10 and a heating film 20 , the base body 10 is a longitudinal structure and includes a bottom end and a top end opposite to the bottom end, and the base body 10 is used for carrying an aerosol generating matrix. The heating film 20 is arranged on the base body 10, including at least two heating sub-films 21 sequentially arranged along the longitudinal direction B of the base body 10, and the initial heating power per unit area of the heating sub-film 21 at the top of each heating sub-film 21 is greater than The initial heating power per unit area of each remaining sub-heating film 21 is equivalent to the larger initial heating power of the sub-heating film 21 positioned at the top, and the lower initial heating power of the sub-heating film 21 positioned at the bottom, so that the sub-heating film positioned at the top 21 can heat up quickly and the initial temperature is relatively high, the sub-heating film 21 at the bottom heats up slowly and the initial temperature is relatively low, and the sub-heating film 21 with a high initial temperature at the top is closer to the position where the user is pumping, so that when the user pumps When inhaled, the aerosol is formed quickly, which improves the user's first few puffs.

In addition, the rate of change of heating power of the sub-heating film 21 located at the top and having the largest initial heating power per unit area is smaller than the rate of change of heating power of each of the other sub-heating films 21 . That is to say, the sub-heating film 21 located at the top has the largest initial heating power per unit area, and a high-temperature region is formed at the top in the early stage of suction, so as to increase the formation speed of aerosol. And, the heating power change rate of the sub-heating film 21 with the largest initial heating power is the smallest, while the heating power change rates of the other sub-heating films 21 are relatively large. The heating power of the heating film 21 of the bottom terminal varies greatly, which can make the heating power of the heating film 21 of the top terminal and the heating film 21 of the bottom terminal gradually approach, and even the heating power of the heating film 21 of the bottom terminal exceeds the heating power of the heating film 21 of the top terminal. , and then the heating film 21 of the bottom terminal can quickly heat up to the temperature close to that of the heating film 21 of the top terminal, and the entire heating film 20 can generate heat evenly in the longitudinal direction.

In this way, at least two sub-heating films 21 in the heat-generating film 20 will eventually heat and atomize the entire aerosol-generating substrate uniformly, preventing local temperature in a certain area from being too high and causing scorching. At the same time, there is no need to provide large heating energy to the aerosol-generating substrate as a whole in the early stage of heating, so as to prevent the overall carbonization speed of the aerosol-generating substrate from being too fast and reduce the effective number of holes, so as to fully bake and utilize the aerosol-generating substrate. It is equivalent to the rapid baking of the high-temperature area at the top to form an aerosol in the initial stage of suction, and then the heating temperature of each area is gradually approached, so as to evenly and fully bake the entire aerosol-generating matrix and prevent the temperature of a certain area from being too high for a long time. High enough to produce burnt paste, and effective baking uses aerosols to generate substrates to improve user experience.

It should be noted that the above heating power change rate is a vector, and the heating power change rate can be a positive value or a negative value. For example, the heating power change rate of the top terminal heating film 21 is negative, and the heating power of the bottom terminal heating film 21 The rate of change is positive, the heating power of the bottom terminal heating film 21 gradually increases, and the power of the top terminal heating film 21 gradually decreases. After a period of time, the heating power of the bottom terminal heating film 21 can reverse that of the top terminal heating film 21. Heating power. For another example, the rate of change of heating power of the top terminal heating film 21 and the bottom terminal heating film 21 are both positive, and the rate of change of heating power of the top terminal heating film 21 is small, and the increment is small. After a period of time, the bottom terminal generates heat. The heating power of the film 21 just can surpass the heating power of the heating film 21 of the top end. For another example, the resistance change rates of the top terminal heating film 21 and the bottom terminal heating film 21 are both negative, and the heating power change rate of the top terminal heating film 21 is small (the negative value is small, the absolute value is large), that is, the top terminal heating film 21 The absolute value of the heating power reduction of the sub-heating film 21 is relatively large, and after a period of time, the heating power of the bottom terminal heating film 21 can surpass the heating power of the top terminal heating film 21.

Furthermore, along the direction from the bottom to the top, the initial heating power per unit area of each sub-heating film 21 gradually increases, and the rate of change of heating power of each sub-heating film 21 gradually decreases. That is to say, the sub-heating film 21 located at the bottom end has a relatively small initial heating power, but the rate of change of heating power is relatively large, and the sub-heating film 21 located downstream of the suction airflow is closer to the user's suction position, and the initial heating power is larger to quickly Aerosols are formed, but the rate of change in heating power is small. In this way, through dynamic adjustment for a period of time, the sub-heating films 21 with smaller initial heating power heat up rapidly, and the sub-heating films 21 with higher initial heating power slowly heat up, and finally the heating temperatures of the top and bottom sub-heating films 21 are close to each other. The temperature difference between each sub-heating film 21 can be reduced, so that the heating temperature of the whole heating film 20 is relatively uniform.

Optionally, the final temperature difference between each sub-heating film 21 is 0-5 degrees, that is, the final heating temperature of each sub-heating film 21 is the same, or the final temperature difference between each sub-heating film 21 is small to uniformly heat The entire aerosol-generating matrix.

In some embodiments, at least two sub-heating films 21 are connected in series, and the initial resistance per unit area of each sub-heating film 21 connected in series increases gradually along the direction from the bottom end to the top. For the entire heating circuit, after connecting multiple sub-heating films 21 in series, the greater the resistance of each sub-heating film 21, the greater the heating power, and there is a proportional relationship between the two. Therefore, the initial resistance of the sub-heating film 21 at the bottom is small, the initial heating power is low, and the initial heating temperature is low; the sub-heating film 21 at the top has a large initial resistance, a large initial heating power, and a high initial heating temperature. In order to quickly form an aerosol that flows to the position where the user inhales, optionally, two adjacent sub-heating films 21 in the heat-generating film 20 are connected in series through edge lamination, or between two adjacent sub-heating films 21 in the heat-generating film 20 The series connection is made by coating with conductive material.

And, each sub-heating film 21 is a thermistor. Along the direction from the bottom end to the top end, the resistance change rate of each sub-heating film 21 decreases gradually. That is to say, with the change of its own temperature, the resistance value of each sub-heating film 21 will change correspondingly. Moreover, the resistance change rate of the sub-heating film 21 located at the bottom is relatively large, which is equivalent to that the sub-heating film 21 at the bottom can increase the resistance quickly, and then can increase the heating temperature quickly; while the sub-heating film 21 located at the top The resistance change rate is small, which means that the sub-heating film 21 at the top increases the resistance slowly, and then increases the heating temperature slowly, so that after a period of time, the heating temperature of the sub-heating film 21 at the bottom can catch up with the top. The heating temperature of the sub-heating films 21 is such that the final heating temperature between every two adjacent sub-heating films 21 is close to uniformly heat the entire aerosol-generating substrate.

Specifically, taking two heating sub-films 21 as an example, the initial resistances of the two heating sub-films 21 are R1 and R2 respectively, the temperature coefficients of resistance of the two heating sub-films 21 are TCR1 and TCR2 respectively, and TCR1≠TCR2, The resistance change rate of one sub-heating film 21 is R1*TCR1, and the resistance change rate of the other sub-heating film 21 is R2*TCR2. In the initial stage of pumping, R1>R2, R1*TCR1<R2*TCR2, after a period of time, the resistance of R2 increases to be greater than R1, and then the heating power of R2 becomes larger, and the heat generation of R2 becomes larger, which can quickly heat up to The temperature is close to that of R1, so that the temperature difference between the two can be narrowed, for example, the heating temperature of both can finally reach the expected temperature.

Understandably, under the same total power and/or total resistance control conditions, by adjusting the difference between R1 and R2 and the difference between R1*TCR1 and R2*TCR2, the temperature rise of the two sub-heating films 21 can be adjusted The time difference to reach the expected temperature; the greater the difference between R1 and R2, the greater the time difference between the heating of the two sub-heating films 21 to reach the expected temperature; the smaller the difference between R1*TCR1 and R2*TCR2, the greater the temperature of the two sub-heating films 21 The greater the difference in time to reach the desired temperature, the heating element 100 can be designed to accommodate different sizes of aerosol-generating substrates.

Specifically, in one embodiment, all sub-heating films 21 are materials with a positive temperature coefficient of resistance, that is, the resistance of each sub-heating film 21 gradually increases as the temperature increases, and the heating power gradually increases, and the sub-heating film at the top 21 has a small resistance change rate and a small increase in heating power. The sub-heating film 21 located at the bottom has a large resistance increase rate and a large increase in heating power. In this way, the difference between the two with a large initial heating power can be gradually made The heating power and temperature gradually approached. Optionally, the material of each sub-heating film 21 is a mixture of metal Ag and glass or a silver-palladium alloy, which is a positive temperature coefficient material, and the appropriate TCR (temperature coefficient of resistance) and resistivity can be adjusted through the proportion of the components.

Specifically, in another embodiment, all sub-heating films 21 are materials with negative resistivity, that is, the resistance of each sub-heating film 21 gradually decreases as the temperature increases, and the heating power gradually decreases, and the sub-heating film 21 at the top The resistance change rate is small, the absolute value of the resistance value decreases per unit time is relatively large, and the absolute value of the heating power decreases is relatively large. The absolute value of is smaller, and the absolute value of heating power reduction is smaller, so the region with higher initial temperature reduces the heating power with a larger absolute value, and the region with a lower initial temperature reduces the heating power with a smaller absolute value, and gradually The heating power in the area with a lower initial temperature can be greater than that in the area with a higher initial temperature, and gradually the area with a lower initial temperature can increase the heating temperature at a faster rate, and gradually make the difference between the two with a large difference in initial heating temperature The final heating temperature gradually approached.

Optionally, each sub-heating film 21 is made of two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel, and zinc through processes such as thorough mixing, molding, and sintering, or each sub-heating film The film 21 is made of non-oxide materials such as silicon carbide, tin selenide, and tantalum nitride. It is a material with a negative temperature coefficient. The appropriate TCR and resistivity can be adjusted by adjusting the proportion of components, sintering atmosphere, sintering temperature and structural state. .

Specifically, in yet another embodiment, part of the sub-heating films 21 at the bottom of the at least two sub-heating films 21 are materials with a positive temperature coefficient, and the other part of the at least two sub-heating films 21 at the top is a material with a negative temperature coefficient. . The resistance change rate of the positive temperature coefficient material is greater than the resistance change rate of the negative temperature coefficient material, that is, the resistance of the heating film 21 of the bottom terminal gradually increases, and the resistance of the heating film 21 of the top terminal gradually decreases until the resistance of the heating film 21 of the bottom terminal is greater than that of the top terminal. The resistance of the heating film 21, the heating power of the heating film 21 of the bottom terminal is larger at this time, so that the heating film 21 of the bottom terminal can be heated up to the temperature close to the heating film 21 of the top terminal, so that the adjacent heating film 21 can be reduced The final temperature difference between the baked aerosol-generating substrates for uniform heating.

Optionally, the material of the molecular heating film 21 is a mixture of metal Ag and glass or a silver-palladium alloy, which is a positive temperature coefficient material, and the appropriate TCR (temperature coefficient of resistance) and resistivity can be adjusted through the proportion of the components. Optionally, another part of the molecular heating film 21 is made of two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel, and zinc through processes such as thorough mixing, molding, and sintering, or each The sub-heating film 21 is made of non-oxide materials such as silicon carbide, tin selenide, and tantalum nitride. It is a material with a negative temperature coefficient, and the appropriate TCR and resistivity.

In other embodiments, at least two sub-heating films 21 are connected in parallel, and the initial resistance per unit area of each sub-heating film 21 connected in parallel decreases gradually along the direction from the bottom end to the top. For the entire heating circuit, after connecting multiple sub-heating films 21 in parallel, the greater the resistance of each sub-heating film 21, the smaller the heating power, and there is an inverse proportional relationship between the two. Therefore, the initial resistance of the sub-heating film 21 at the bottom is relatively large, the initial heating power is low, and the initial heating temperature is low; the sub-heating film 21 at the top has a small initial resistance, high heating power, and high initial heating temperature Rapidly forms an aerosol that travels to the point of inhalation by the user. Optionally, two adjacent sub-heating films 21 in the heat-generating film 20 are connected in parallel by coating conductive materials.

And, each sub-heating film 21 is a thermistor. Along the direction from the bottom end to the top end, the resistance change rate of each sub-heating film 21 decreases gradually. That is to say, with the change of its own temperature, the resistance value of each sub-heating film 21 will change correspondingly. Moreover, the resistance change rate of the sub-heating film 21 located at the bottom is relatively large, which means that the downstream sub-heating film 21 can increase the resistance quickly, and then can increase the heating temperature quickly; while the sub-heating film 21 located at the top The resistance change rate is small, which means that the sub-heating film 21 at the top increases the resistance slowly, and then increases the heating temperature slowly, so that after a period of time, the heating temperature of the sub-heating film 21 at the bottom can catch up with the top. The heating temperature of the sub-heating films 21 is such that the final heating temperature between every two adjacent sub-heating films 21 is close to uniformly heat the entire aerosol-generating substrate.

Specifically, taking two heating sub-films 21 as an example, the initial resistances of the two heating sub-films 21 are R1 and R2 respectively, and the temperature coefficients of resistance of the two heating sub-films 21 are TCR1 and TCR2 respectively, and TCR1≠TCR2, The resistance change rate of one sub-heating film 21 is R1*TCR1, and the resistance change rate of the other sub-heating film 21 is R2*TCR2. In the initial stage of pumping, R1<R2, R1*TCR1<R2*TCR2, that is, the resistance of R2 decreases rapidly, and the heating power increases rapidly, until the heating power of R1 is smaller than that of R2, and the heat generation of R2 is larger, which can be compared Raise the temperature quickly to the temperature close to that of R1, so that the temperature difference between the two can be narrowed, for example, the heating temperature of both can finally reach the expected temperature.

Specifically, in one embodiment, all sub-heating films 21 are materials with a positive temperature coefficient of resistance, that is, the resistance of each sub-heating film 21 gradually increases as the temperature increases, and the heating power gradually decreases, and the sub-heating film at the bottom 21 has a small resistance change rate and a small reduction in heating power. The sub-heating film 21 located at the top has a large resistance increase rate and a large heating power reduction. In this way, the two with a large difference in initial heating power can be gradually made The heating power and temperature are gradually approaching.

Optionally, the material of each sub-heating film 21 is a mixture of metal Ag and glass or a silver-palladium alloy, which is a positive temperature coefficient material, and the appropriate TCR (temperature coefficient of resistance) and resistivity can be adjusted through the proportion of the components.

Specifically, in another embodiment, all sub-heating films 21 are materials with negative resistivity, that is, the resistance of each sub-heating film 21 gradually decreases with the increase of temperature, and the heating power gradually increases, and the sub-heating films 21 located at the bottom The resistance change rate of 21 is small, the resistance value of sub-heating film 21 decreases per unit time, and the absolute value of heating power increases; The resistance value of the film 21 decreases by a small amount, and the absolute value of the heating power increases is small, so the area with a higher initial temperature increases the heating power with a smaller absolute value, and the area with a lower initial temperature increases with a larger absolute value. The value increases the heating power, gradually the heating power in the lower initial temperature area can be greater than the heating power in the higher initial temperature area, and then the heating temperature can be increased quickly, and the initial heating temperature can be gradually made between the two. The final heating temperature gradually approached.

Specifically, in yet another embodiment, part of the sub-heating films 21 at the bottom of the at least two sub-heating films 21 are materials with a positive temperature coefficient, and the other part of the at least two sub-heating films 21 at the top is a material with a negative temperature coefficient. . The initial resistance of the bottom terminal heating film 21 is greater than the initial resistance of the downstream heating film 21, and the resistance change rate of the positive temperature coefficient material is greater than the resistance change rate of the negative temperature coefficient material, that is, the resistance of the top terminal heating film 21 gradually increases, and the heating power Gradually decrease, the resistance of the heating film 21 of the bottom terminal gradually decreases, and the heating power gradually increases until the heating power of the heating film 21 of the top terminal is smaller than the heating power of the heating film 21 of the bottom terminal, at this time, the heating power of the heating film 21 of the bottom terminal is larger , the heating film 21 of the bottom terminal can be heated up to the temperature close to that of the heating film 21 of the top terminal quickly, so that the final temperature difference between adjacent heating films 21 can be reduced, and the aerosol generating substrate can be evenly heated and baked.

In some embodiments, the heating element 100 further includes a first electrode layer 32 and a second electrode layer 34 disposed on the substrate 10, and the first electrode layer 32 and the second electrode layer 34 are respectively connected to the end of at least two heating films 20. The two sub-heating films 21 at both ends are in contact, so that the first electrode layer 32 and the second electrode layer 34 are respectively arranged at the first and last ends of all the sub-heating films 21 to form the connection terminals for the heating film 20 to connect to the outside world, which is convenient for the heating film. 20 power supply. Moreover, all the sub-heating films 21 only need the first electrode layer 32 and the second electrode layer 34 at the first and last ends, which occupies less space and does not need to add additional electrodes, which can reduce the cost of lead wires and circuits, and is especially suitable for heating small-sized Aerosol-generating substrates.

In some embodiments, the heating element 100 further includes an infrared radiation layer 50. The infrared radiation layer 50 is disposed on the substrate 10 and stacked with the heating film 20, wherein the projection of the infrared radiation layer 50 toward the plane where the heating film 20 is located covers all sub-heating films. twenty one. That is to say, the infrared radiation layer 50 has at least two radiation regions corresponding to at least two sub-heating films 21 respectively, and each radiation region can generate different degrees of infrared radiation according to the heating temperature of its corresponding sub-heating films 21, so as to Realize zoned heating of the aerosol matrix.

In this way, on the one hand, the atomized aerosol-generating substrate can be heated by infrared radiation, so that the heating element 100 can implement a heating-not-burning baking method, and can reduce the content of harmful substances in the aerosol. On the other hand, the degree of infrared radiation is proportional to the heated temperature. After the heating temperature of the heating film 20 is set in different regions, the degree of infrared radiation can be set in different regions correspondingly, so that the radiation degree of the infrared radiation region corresponding to the downstream sub-heating film 21 is relatively high. Strong, can quickly heat the aerosol-generating substrate close to the nozzle to form an aerosol, and increase the speed of aerosol formation during the initial puff. In addition, in the subsequent pumping process, the temperature of each sub-heating film 21 gradually tends to be close, and then the infrared radiation level area of each area on the infrared radiation layer 50 corresponding to each sub-heating film 21 is approached, so that the infrared radiation The radiation degree of each area of the layer 50 is close, so that the entire aerosol-generating matrix is evenly and fully baked, preventing a certain area from being too high in temperature for a long time and being burnt to affect the taste, and can also avoid applying high pressure to the aerosol-generating matrix as a whole. The carbonization speed is too fast due to the initial energy, so as to make full use of the aerosol-generating matrix and effectively ensure the number of suction ports.

In some embodiments, the material of the substrate 10 is high-temperature-resistant materials such as quartz glass, mica, steel or ceramics, and the materials of the first electrode and the second electrode are silver, gold, copper, or alloys containing gold, silver, and copper, etc. A metal material with high conductivity, the material of the infrared radiation layer 50 is at least one of high infrared emissivity materials such as perovskite system, spinel system, carbide, silicide, nitride, oxide and rare earth materials .

Referring to FIGS. 1-5 , in some embodiments, the substrate 10 is configured as a peripheral heating structure, and the interior of the substrate 10 forms an accommodating position 11. During actual use, the aerosol-generating substrate can be placed in the accommodating position inside the substrate 10. Position 11, so that the substrate 10 surrounds the aerosol-generating substrate, and heats and atomizes the aerosol-generating substrate from the periphery. The outer peripheral surface of the base body 10 is coated with a heating film 20 , and an infrared radiation layer 50 is formed between the heating film 20 and the base body 10 , or on the inner peripheral surface of the base body 10 facing the receiving position 11 . In this way, after the substrate 10 is heated by the heat-generating film 20 located on the outer peripheral surface, the infrared radiation layer 50 located inside the heat-generating film 20 generates infrared radiation, and heats and atomizes the aerosol-generating substrate disposed in the accommodation position 11 of the substrate 10. , in order to increase the speed at which the aerosol-generating matrix forms an aerosol at the initial stage of suction, and at the same time fully bake the aerosol-generating matrix evenly and fully during the subsequent suction process, so as to improve user experience.

Referring to Fig. 4 and Fig. 5, in one embodiment, the substrate 10 is a transparent substrate, the infrared radiation layer 50 is stacked between the heating film 20 and the substrate 10, and the infrared rays radiated by the infrared radiation layer 50 can pass through the substrate 10 to the substrate 10. The aerosol-generating substrate accommodated inside is heated and atomized, so that the infrared radiation layer 50 can be heated quickly and then perform infrared radiation, further improving the atomization efficiency. Referring to FIG. 4 , optionally, the infrared radiation layer 50 is an insulating infrared radiation layer 50 . Referring to FIG. 5 , optionally, the infrared radiation layer 50 is a non-insulating layer, and an insulating layer 40 is provided between the infrared radiation layer 50 and the heating film 20 to prevent the heating film 20 from conducting with the infrared radiation layer 50 .

Understandably, when the substrate 10 is a transparent substrate, the infrared radiation layer 50 can also be arranged on the inner peripheral surface of the substrate 10, so that after the heating film 20 on the outer peripheral surface heats the substrate 10, the infrared radiation layer 50 is heated and emits infrared rays to heat The aerosol-generating substrate housed within the atomizing substrate 10 is atomized.

Referring to FIG. 1 , in another embodiment, the substrate 10 is a non-transparent substrate through which infrared rays cannot pass through, and an infrared radiation layer 50 is coated on the inner peripheral surface of the substrate 10 facing to accommodate 11, so that the outer peripheral surface After the heat-generating film 20 heats the substrate 10 , the infrared radiation layer 50 is heated and emits infrared rays to heat the aerosol-generating substrate contained in the atomized substrate 10 .

Referring to FIGS. 6-10 , in some embodiments, the base 10 is configured as a central heating structure, and the heating film 20 and the infrared radiation layer 50 are sequentially stacked on the outer surface of the base 10 from inside to outside. During use, the aerosol-generating substrate is inserted on the outer periphery of the substrate 10, and when the heat-generating film 20 and the infrared radiation layer 50 on the outer periphery of the substrate 10 work, the atomized aerosol-generating substrate is heated and atomized from the inside of the aerosol-generating substrate .

Referring to FIGS. 6-7 , in one embodiment, the base body 10 is configured as a pin body, the heating film 20 and the infrared radiation layer 50 are both extended along the circumferential direction of the pin body, and at least two of the heating film 20 generate heat The films 21 are sequentially arranged along the axial direction of the pin body. In this way, a heat-generating film 20 and an infrared radiation layer 50 are sequentially arranged on the outer peripheral surface of the pin body from inside to outside, and the infrared radiation layer 50 generates infrared radiation outward after the heat-generating film 20 at the bottom heats up, and is sheathed on the periphery of the pin body for heating and baking. The aerosol-generating matrix on the top of the aerosol-generating matrix is used to quickly form an aerosol in the early stage of suction, and the entire aerosol-generating matrix is evenly and fully baked in the later stage to improve user experience.

Referring to FIG. 6 , optionally, the substrate 10 is an insulator, and the heating film 20 is directly formed on the substrate 10 . Referring to FIG. 7 , optionally, the substrate 10 is a conductor, and an insulating layer 40 is provided between the substrate 10 and the heating film 20 to prevent the heating film 20 layer from conducting with the substrate 10 .

Further, the infrared radiation layer 50 is coated with a protective layer 60 , so that the protective layer 60 serves as the outermost layer to protect the various film layer structures on the outer surface of the substrate 10 .

Referring to Fig. 8-Fig. 10, specifically in another embodiment, the substrate 10 is configured as a sheet body, and a heating film 20 and an infrared radiation layer 50 are sequentially stacked on one of the front and back sides of the sheet body from the inside to the outside. An infrared radiation layer 50 is laminated on the other of the front and back sides of the body. After the substrate 10 is constructed as a sheet, the heating film 20 can be formed on only one side of the sheet, and the other side of the sheet can generate heat evenly under the action of heat conduction, so that the infrared radiation layer 50 coated on the front and back sides of the sheet can be evenly distributed. It can be heated to radiate infrared rays outward, and heat the aerosol-generating substrates located on the front and back sides of the sheet.

Specifically, the substrate 10 is a material with high thermal conductivity such as stainless steel or ceramics, and when one side of the chip is heated, the other side can also rapidly heat up and generate heat. Referring to FIG. 8 , optionally, the substrate 10 is an insulator, and the heating film 20 is directly formed on the substrate 10 . Referring to FIG. 9 , optionally, the substrate 10 is a conductor, and both sides of the substrate 10 are coated with an innermost insulating layer 40 to prevent the heating film 20 from conducting with the substrate 10 .

Further, the infrared radiation layer 50 is coated with a protective layer 60 , so that the protective layer 60 serves as the outermost layer to protect the various film layer structures on the outer surface of the substrate 10 . Specifically, the infrared radiation layer 50 is an insulating infrared radiation layer.

Please refer to FIG. 10 , in some embodiments, the heating film 20 can be in a U-shaped structure, the open end 22 of the U-shaped structure is located at the bottom a1 of the base 10 , and the closed end 23 of the U-shaped structure is located at the top of the base 10 a2. The electric heating film layer 20 includes a sub-heating film 21 located at the closed end of the U-shaped structure, and another sub-heated film 21 located at the open end of the U-shaped structure. Certainly, in other embodiments, the electric heating film layer 20 may also adopt other shapes, such as covering the entire surface of the substrate 10 , etc., which are not limited herein.

In any embodiment of the present application, the base 10 is set as a central heating structure or a peripheral heating structure. According to different structures of the base 10, an infrared radiation layer 50 is arranged at a suitable position, and the base 10 is designed to have a significant infrared radiation heating effect. The infrared heating element can improve the heating efficiency of the heating element 100. Moreover, the infrared radiation layer 50 can be set as the insulating layer 40, and can also be set as a non-insulating layer. When the infrared radiation layer 50 is set as a non-insulating layer, an insulating layer 40 is added between the infrared radiation layer 50 and the heating film 20 to prevent the heating element 100 from being turned on and leaking electricity.

In an embodiment of the present application, an electronic atomization device is also provided, including the above-mentioned heating element 100, so that the electronic atomization device can quickly form an aerosol-generating matrix in the early stage of puffing, and improve the taste of the user's first few puffs. Moreover, in the subsequent suction process, the atomized aerosol-generating substrate can be evenly and fully heated, preventing the local temperature of the aerosol-generating substrate from being too high for a long time to cause scorching, and preventing the initial suction from providing the aerosol-generating substrate as a whole. If the heating energy is too large, the carbonization speed of the aerosol-generating matrix is increased to fully bake and heat the aerosol-generating matrix, effectively ensuring the number of suction ports.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims

A heating element, characterized in that the heating element comprises:

a base, which is an elongated structure and includes a base and a top opposite the base; and

A heating film, disposed on the base, including at least two sub-heating films sequentially arranged along the longitudinal direction of the base;

Wherein, the initial heating power per unit area of the sub-heating film located at the top of each of the sub-heating films is greater than the initial heating power per unit area of each of the other sub-heating films; and, located at the top and The rate of change of heating power of the sub-heating film with the largest initial heating power per unit area is smaller than the rate of change of heating power of each of the other sub-heating films.
The heating element according to claim 1, characterized in that, along the direction from the bottom end to the top end, the initial heating power per unit area of each of the sub-heating films gradually increases, and the initial heating power of each of the sub-heating films The rate of change of heating power gradually decreases.
The heating element according to claim 2, wherein each of the sub-heating films is a thermistor, and the at least two sub-heating films are connected in series;

Along the direction from the bottom end to the top end, the initial resistance per unit area of each sub-heating film connected in series gradually increases, and the resistance change rate of each sub-heating film gradually decreases.
The heating element according to claim 2, wherein each of the sub-heating films is a thermistor, and the at least two sub-heating films are connected in parallel with each other;

Along the direction from the bottom end to the top end, the initial resistance per unit area of each sub-heating film connected in parallel gradually decreases, and the resistance change rate of each sub-heating film gradually decreases.
The heating element according to claim 3 or 4, wherein all the sub-heating films are materials with a positive temperature coefficient of resistance, or all the sub-heating films are materials with a negative temperature coefficient of resistance.
The heating element according to claim 3 or 4, characterized in that, the part of the at least two sub-heating films located at the bottom end is a positive temperature coefficient material, and the part of the at least two sub-heated films located at the bottom end The other part of the sub-heating film at the top is a material with a negative temperature coefficient.
The heating element according to claim 3 or 4, characterized in that, the heating element further comprises a first electrode layer and a second electrode layer arranged on the substrate, the first electrode layer and the second electrode layer The electrode layers are respectively in contact with the two sub-heating films at the first and last ends of the at least two sub-heating films.
The heating element according to any one of claims 1-4, characterized in that, the heating element further comprises an infrared radiation layer, the infrared radiation layer is disposed on the substrate and stacked with the heating film;

Wherein, the projection of the infrared radiation layer toward the plane where the heating film is located covers all the sub-heating films.
The heating element according to claim 8, characterized in that, the base body is configured as a central heating structure, and the heating film and the infrared radiation layer are sequentially stacked on the outer surface of the base body from inside to outside.
The heating element according to claim 8, wherein the base body is configured as a pin body, the heating film and the infrared radiation layer are both extended along the circumferential direction of the pin body, and the heating film The at least two sub-heating films are arranged along the axial direction of the pin body; or

The substrate is configured as a sheet body, the heating film and the infrared radiation layer are sequentially laminated on one of the front and back sides of the sheet body from the inside to the outside, and the other of the front and back sides of the sheet body is The infrared radiation layer is laminated on the upper layer.
The heating element according to claim 8, wherein the base body is configured as a peripheral heating structure, and the interior of the base body forms a receiving position;

The outer peripheral surface of the base body is coated with the heating film; the infrared radiation layer is formed between the heating film and the base body, or on the inner peripheral surface of the base body facing the accommodating position.
The heating element according to claim 11, wherein the substrate is a transparent substrate, and the infrared radiation layer is laminated between the heating film and the substrate; or

The base is a non-transparent base, and the infrared radiation layer is coated on the inner peripheral surface of the base.
An electronic atomization device, characterized by comprising the heating element described in any one of claims 1-12 above.