WO2023117299A3 - Coupled etching and deposition process and capacitor foil formed by the process - Google Patents

Coupled etching and deposition process and capacitor foil formed by the process Download PDF

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Publication number
WO2023117299A3
WO2023117299A3 PCT/EP2022/083274 EP2022083274W WO2023117299A3 WO 2023117299 A3 WO2023117299 A3 WO 2023117299A3 EP 2022083274 W EP2022083274 W EP 2022083274W WO 2023117299 A3 WO2023117299 A3 WO 2023117299A3
Authority
WO
WIPO (PCT)
Prior art keywords
deposition process
foil formed
coupled
coupled etching
capacitor foil
Prior art date
Application number
PCT/EP2022/083274
Other languages
French (fr)
Other versions
WO2023117299A2 (en
Inventor
Cristiano BACCO
Erkan Küzeci
Original Assignee
Tdk Electronics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Electronics Ag filed Critical Tdk Electronics Ag
Publication of WO2023117299A2 publication Critical patent/WO2023117299A2/en
Publication of WO2023117299A3 publication Critical patent/WO2023117299A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/055—Etched foil electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029—Processes of manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The present application addresses a coupled etching and deposition process and a capacitor foil formed by the process. According to the coupled etching and deposition process an anodic reaction is coupled to a cathodic reaction, such that in the anodic reaction a first foil containing a metal is electrochemically etched in an electrolyte whereby ions of the metal are dissolved into the electrolyte and whereby in the cathodic reaction ions of the metal from the electrolyte are deposited on a second foil.
PCT/EP2022/083274 2021-12-23 2022-11-25 Coupled etching and deposition process WO2023117299A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021134524.3A DE102021134524A1 (en) 2021-12-23 2021-12-23 Coupled etching and deposition process
DE102021134524.3 2021-12-23

Publications (2)

Publication Number Publication Date
WO2023117299A2 WO2023117299A2 (en) 2023-06-29
WO2023117299A3 true WO2023117299A3 (en) 2023-08-03

Family

ID=84487605

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/083274 WO2023117299A2 (en) 2021-12-23 2022-11-25 Coupled etching and deposition process

Country Status (2)

Country Link
DE (1) DE102021134524A1 (en)
WO (1) WO2023117299A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4073708A (en) * 1976-06-18 1978-02-14 The Boeing Company Apparatus and method for regeneration of chromosulfuric acid etchants
JP4428902B2 (en) * 1999-12-08 2010-03-10 東洋アルミニウム株式会社 Aluminum alloy clad foil for high pressure anode in electrolytic capacitor
US20120000790A1 (en) * 2009-03-17 2012-01-05 Commonwealth Scientific And Industrial Research Organisation Electrorecovery of metals
US20190330752A1 (en) * 2017-02-09 2019-10-31 Uacj Corporation Method for producing aluminum
US20200258692A1 (en) * 2019-02-11 2020-08-13 Pacesetter, Inc. Fabrication of capacitors and recovery of capacitor fabrication materials

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006015599A1 (en) 2006-04-04 2007-10-11 Klaus Klein Production-integrated recycling process for metal salts involves using integrated electrolysis cell with alkaline solution to dissolve galvanized metal from substrate
US9368284B2 (en) 2013-09-02 2016-06-14 Litronik Entwicklungs Gmbh Anode electrode for aluminum electrolytic capacitor and respective production method
DE102013022030B4 (en) 2013-12-19 2017-10-05 Schlenk Metallfolien Gmbh & Co. Kg Process for the electrolytic surface modification of flat metal workpieces in sulfatometallhaltigen copper sulfate treatment liquids, flat metal workpiece and its use
US20210388520A1 (en) 2020-06-10 2021-12-16 Battelle Energy Alliance, Llc Methods and systems for electrochemical deposition of metal from ionic liquids including imidazolium tetrahalo-metallates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4073708A (en) * 1976-06-18 1978-02-14 The Boeing Company Apparatus and method for regeneration of chromosulfuric acid etchants
JP4428902B2 (en) * 1999-12-08 2010-03-10 東洋アルミニウム株式会社 Aluminum alloy clad foil for high pressure anode in electrolytic capacitor
US20120000790A1 (en) * 2009-03-17 2012-01-05 Commonwealth Scientific And Industrial Research Organisation Electrorecovery of metals
US20190330752A1 (en) * 2017-02-09 2019-10-31 Uacj Corporation Method for producing aluminum
US20200258692A1 (en) * 2019-02-11 2020-08-13 Pacesetter, Inc. Fabrication of capacitors and recovery of capacitor fabrication materials

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PERRE E ET AL: "Direct electrodeposition of aluminium nano-rods", ELECTROCHEMISTRY COMMUNICATIONS, ELSEVIER AMSTERDAM, NL, vol. 10, no. 10, 1 October 2008 (2008-10-01), pages 1467 - 1470, XP025467151, ISSN: 1388-2481, [retrieved on 20080725], DOI: 10.1016/J.ELECOM.2008.07.032 *

Also Published As

Publication number Publication date
DE102021134524A1 (en) 2023-06-29
WO2023117299A2 (en) 2023-06-29

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