WO2023115409A1 - Pad detection method and apparatus, and computer device and storage medium - Google Patents

Pad detection method and apparatus, and computer device and storage medium Download PDF

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Publication number
WO2023115409A1
WO2023115409A1 PCT/CN2021/140593 CN2021140593W WO2023115409A1 WO 2023115409 A1 WO2023115409 A1 WO 2023115409A1 CN 2021140593 W CN2021140593 W CN 2021140593W WO 2023115409 A1 WO2023115409 A1 WO 2023115409A1
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pad
image
circuit board
detection
neural network
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PCT/CN2021/140593
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French (fr)
Chinese (zh)
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逯金辉
沈小乐
毛抒艺
郭学胤
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深圳技术大学
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Priority to PCT/CN2021/140593 priority Critical patent/WO2023115409A1/en
Publication of WO2023115409A1 publication Critical patent/WO2023115409A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/62Analysis of geometric attributes of area, perimeter, diameter or volume
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/70Determining position or orientation of objects or cameras
    • G06T7/73Determining position or orientation of objects or cameras using feature-based methods
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/20Image preprocessing
    • G06V10/25Determination of region of interest [ROI] or a volume of interest [VOI]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/82Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks

Definitions

  • the present application relates to the technical field of FPC detection in artificial intelligence, and in particular to a pad detection method, device, computer equipment and storage medium applied to flexible circuit boards.
  • Flexible printed circuit Flexible Printed Circuit
  • FPC Flexible Printed Circuit
  • the domestic quality inspection of FPC mainly relies on manual visual inspection, which is costly and inefficient.
  • the traditional manual detection method can no longer meet the production needs.
  • the automatic detection of FPC defects has become an inevitable trend of development.
  • the edge detection method is a spatial domain detection method, which extracts the edge contour of the part through a specific algorithm, detects the edge of the part, and judges whether the part is defective by comparison;
  • the zero-mean method is to construct a zero-mean map after processing the image of the part, and to identify the damaged area by comparing and analyzing different thresholds during image segmentation;
  • Background subtraction method Subtract the background image (excluding defects) estimated or calculated in advance from the preprocessed image, leaving a residual image containing defects and random noise;
  • Machine learning method Based on manually defined features and feature extraction methods, these features are used to train machine learning classifiers to achieve final defect detection.
  • the traditional pad detection method is generally not intelligent, and the traditional method can only detect defects under certain conditions, such as a certain size, or an obvious defect outline with strong contrast and low noise under specific lighting conditions.
  • Algorithms based on machine learning have certain robustness, but the natural disadvantages of artificial features are weak representation ability and poor adaptability. Therefore, based on traditional machine learning algorithms, the features that need to be detected cannot be well learned, resulting in the accuracy of the final detection results. lower. It can be seen that the traditional pad detection method has the problem of low accuracy.
  • the purpose of the embodiments of the present application is to provide a pad detection method, device, computer equipment and storage medium applied to flexible circuit boards, so as to solve the problem of low accuracy of traditional pad detection methods.
  • the embodiment of the present application provides a pad detection method applied to flexible circuit boards, which adopts the following technical solutions:
  • the pad annotation image is a pad sample image carrying annotation information
  • the annotation information is good product information or defective product information
  • the pad sample image is converted from the RGB color space to the HSV color space according to the conversion formula, and the conversion formula is expressed as:
  • the original ResNet neural network model is trained to obtain a Before the step of the target ResNet neural network model of disk image quality, the following steps are also included:
  • a pre-classification operation is performed on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
  • the step of inputting the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result specifically includes the following steps:
  • the image of the circuit board to be tested is detected according to the preset good product ratio threshold S1, the defective product ratio threshold S2 and a judgment function, and the judgment function is expressed as:
  • the PI represents the ratio of the change area to the area of the pad position to be tested;
  • f(ROI i ) represents that the pad detection operation is performed on the circuit board image to be tested by the target ResNet neural network model The results obtained.
  • the embodiment of the present application also provides a pad detection device applied to flexible circuit boards, which adopts the following technical solutions:
  • a training request receiving module configured to receive a model training request carrying circuit board sample images and pad position information
  • a segmentation operation module configured to perform a segmentation operation on the circuit board sample image according to the pad position information to obtain a pad sample image
  • An annotation sending module configured to send the pad sample image to a terminal device, so as to perform an annotation operation on the pad sample image
  • An annotation receiving module configured to receive the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
  • the model training module is used to call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform model training operations on the original ResNet neural network model to obtain a Targeted ResNet neural network model for disk image quality;
  • a detection request receiving module configured to accept a pad detection request carrying an image of a circuit board to be tested
  • the pad detection module is used to input the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result;
  • a result output module configured to output the detection result of the pad.
  • the device also includes:
  • the color space conversion module is used to convert the pad sample image from the RGB color space to the HSV color space according to the conversion formula, and the conversion formula is expressed as:
  • the device also includes:
  • the pre-classification module is configured to perform a pre-classification operation on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
  • the pad detection module includes:
  • the change area acquisition submodule is used to count the change area of the B channel value in the RGB color space of each pad position to be tested in the image of the circuit board to be tested;
  • the detection sub-module is used to detect the image of the circuit board to be tested according to the preset good product ratio threshold S1, the defective product ratio threshold S2 and a judgment function, and the judgment function is expressed as:
  • the PI represents the ratio of the change area to the area of the pad position to be tested;
  • f(ROI i ) represents that the pad detection operation is performed on the circuit board image to be tested by the target ResNet neural network model The results obtained.
  • the embodiment of the present application also provides a computer device, which adopts the following technical solutions:
  • It includes a memory and a processor, wherein computer-readable instructions are stored in the memory, and the processor implements the steps of the above-mentioned method for detecting pads applied to flexible circuit boards when executing the computer-readable instructions.
  • the embodiment of the present application also provides a computer-readable storage medium, which adopts the following technical solution:
  • Computer-readable instructions are stored on the computer-readable storage medium, and when the computer-readable instructions are executed by a processor, the steps of the above-mentioned method for detecting a pad applied to a flexible circuit board are implemented.
  • the present application provides a pad detection method applied to a flexible circuit board, including: accepting a model training request carrying a circuit board sample image and pad position information; performing a segmentation operation to obtain a pad sample image; sending the pad sample image to a terminal device for labeling the pad sample image; receiving the pad label image sent by the terminal device, and the pad label image
  • the annotation information is good product information or defective product information
  • the original ResNet neural network model is called, and the pad sample image is used as training data
  • the annotation information is the result data pair
  • the original ResNet neural network model performs a model training operation to obtain a target ResNet neural network model for identifying the quality of the pad image; accepts a pad detection request carrying an image of the circuit board to be tested; inputs the image of the circuit board to be tested Perform pad detection operation to the target ResNet neural network model to obtain a pad detection result; output the pad detection result.
  • This application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network model to detect the flexible circuit board (FPC ) area marked on the image can greatly improve the detection accuracy and speed.
  • FIG. 1 is an exemplary system architecture diagram to which the present application can be applied;
  • FIG. 2 is a flow chart of the implementation of the pad detection method applied to flexible circuit boards provided in Embodiment 1 of the present application;
  • Fig. 3 is a schematic diagram of Mark points provided by Embodiment 1 of the present application.
  • Fig. 4 is a schematic diagram of dividing the ring into four parts provided by Embodiment 1 of the present application;
  • Fig. 5 is a schematic structural diagram of a pad detection device applied to a flexible circuit board provided in Embodiment 2 of the present application:
  • Fig. 6 is a schematic structural diagram of an embodiment of a computer device according to the present application.
  • a system architecture 100 may include terminal devices 101 , 102 , 103 , a network 104 and a server 105 .
  • the network 104 is used as a medium for providing communication links between the terminal devices 101 , 102 , 103 and the server 105 .
  • Network 104 may include various connection types, such as wires, wireless communication links, or fiber optic cables, among others.
  • Terminal devices 101 , 102 , 103 Users can use terminal devices 101 , 102 , 103 to interact with server 105 via network 104 to receive or send messages and the like.
  • Various communication client applications can be installed on the terminal devices 101, 102, 103, such as web browser applications, shopping applications, search applications, instant messaging tools, email clients, social platform software, and the like.
  • Terminal devices 101, 102, 103 can be various electronic devices with display screens and support web browsing, including but not limited to smartphones, tablet computers, e-book readers, MP3 players (Moving Picture Experts Group Audio Layer III, dynamic Video experts compress standard audio layer 3), MP4 (Moving Picture Experts Group Audio Layer IV, moving picture experts compress standard audio layer 4) player, laptop portable computer and desktop computer, etc.
  • MP3 players Moving Picture Experts Group Audio Layer III, dynamic Video experts compress standard audio layer 3
  • MP4 Moving Picture Experts Group Audio Layer IV, moving picture experts compress standard audio layer 4
  • laptop portable computer and desktop computer etc.
  • the server 105 may be a server that provides various services, such as a background server that provides support for pages displayed on the terminal devices 101 , 102 , 103 .
  • the pad detection method applied to flexible circuit boards provided in the embodiments of the present application is generally executed by the server/terminal device, and correspondingly, the pad detection device applied to flexible circuit boards is generally set on the server/terminal device middle.
  • terminal devices, networks and servers in Fig. 1 are only illustrative. According to the implementation needs, there can be any number of terminal devices, networks and servers.
  • FIG. 2 it shows the implementation flow chart of the pad detection method applied to the flexible circuit board provided by Embodiment 1 of the present application. For the convenience of description, only the parts relevant to the present application are shown.
  • the above-mentioned pad detection method applied to a flexible circuit board includes the following steps:
  • step S201 a model training request carrying a circuit board sample image and pad position information is accepted.
  • step S202 the circuit board sample image is segmented according to the pad position information to obtain a pad sample image.
  • the minimum bounding box algorithm is used to frame the ROI area, and the ROI images of 1000 images are cut out.
  • the foreground layouts of different products are different.
  • the pad area to be detected is usually irregular in shape, and there is still a part of the background area in the minimum bounding box. According to the brightness difference between the pad area and the background, the image is converted from RGB color to The space is converted to the HSV color space, and the conversion formula is
  • step S203 the pad sample image is sent to the terminal device for marking the pad sample image.
  • the cut ROI image is manually marked as a good product or a defective product.
  • the existing data sets need to be divided into defective data sets and non-defective data sets. Since the amount of data is not very large, the data can be manually screened, or the data set can be preliminarily screened by extracting obvious defect features and then manually screened, which can reduce the workload.
  • This embodiment detects the discoloration defect of the pad, and judging whether a pad contains a defect needs to judge whether the discoloration area exceeds the allowable ratio, whether the degree of discoloration exceeds the allowable degree, and if a rainbow-like discoloration occurs, that is, a sudden color change, no matter the size of the discoloration area. judged to be defective.
  • the data set is initially screened, and then manually screened to confirm that it is divided into a defective data set and a non-defective data set.
  • this embodiment strengthens the data set.
  • max(R,G,B) max(R,G,B) ⁇ d operation to get the enhanced data set
  • step S204 receiving the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information.
  • step S205 the original ResNet neural network model is called, and the model training operation is performed on the original ResNet neural network model with the pad sample image as the training data and the label information as the result data, and the target ResNet neural network model for identifying the quality of the pad image is obtained. network model.
  • ResNet is a network structure proposed by He et al. in the 2015 ImageNet Challenge, which alleviates the problem that the performance of the network degrades with the deepening of the network depth.
  • the experiment in the paper Deep Residual Learning for Image Recognition found that the deep network has a degradation problem (Degradation problem): when the network depth increases, the network accuracy is saturated or even declines. This phenomenon can be seen directly in the figure: the 56-layer network is even worse than the 20-layer network. This would not be an overfitting problem, since the training error is equally high for a 56-layer network. Because the deep network has the problem of gradient disappearance or explosion, which makes the deep learning model difficult to train.
  • Residual learning is easier than direct learning of original features, because when the residual is 0, the accumulation layer only does the identity mapping at this time, at least the network performance will not decline, in fact the residual will not be 0, which will also This enables the stacking layer to learn new features based on the input features, resulting in better performance.
  • the ResNet50 network is used in the existing deep learning package of "Halcon", which shows that it has certain reliability in industrial inspection. Therefore, this paper uses the ResNet network to detect pad defects combined with inter-channel information.
  • the network structure consists of convolution, pooling, improved residual block and linear classifier.
  • the input features undergo convolution, batch regularization, pooling, and then repeat the above process, and finally the output and input features are superimposed pixel by pixel as the next input; after convolution, the importance of each channel is extracted, so that It is multiplied by the feature layer after convolution, and finally added to the input feature, so that the convolution can obtain the fusion information of the space and channel of the local area.
  • images of good products and defective products are divided into a training set and a verification set according to a ratio of 3:1.
  • Input the training set samples to the network use the BP algorithm to update the model weights, input the verification set to the network, verify the effect of the model, and repeat this operation until the model converges to a satisfactory accuracy rate.
  • the B channel value distribution histogram of the RGB color space of each ROI is counted. For a single ROI, if the ratio P of the discoloration area to the pad area is greater than the threshold S2, the FPC is not Good product; if S1 ⁇ P ⁇ S2, use the trained model f(x) to detect the ROI, if the detection result is a defective product, then the FPC is a defective product, and if the detection result is a good product, then detect the next ROI; If P ⁇ S1, detect the next ROI; if all ROIs are good, the FPC is good, otherwise it is bad.
  • the current FPC is a good product, otherwise it is a defective product.
  • the formula is shown in formula (1):
  • X is the current FPC image
  • n is the number of ROIs of the FPC
  • step S206 the pad detection request carrying the image of the circuit board to be tested is accepted.
  • an area array industrial camera is used to shoot above the FPC board, and the image file is transmitted to the image acquisition card of the computer to save the image file.
  • step S207 the image of the circuit board to be tested is input to the target ResNet neural network model to perform a pad detection operation, and a pad detection result is obtained.
  • step S208 the detection result of the pad is output.
  • a pad detection method applied to a flexible circuit board including: accepting a model training request carrying a circuit board sample image and pad position information; The image is segmented to obtain the pad sample image; the pad sample image is sent to the terminal device for labeling of the pad sample image; the pad label image sent by the terminal device is received, and the pad label image carries label information pad sample image, the label information is good product information or defective product information; the original ResNet neural network model is called, and the model training operation is performed on the original ResNet neural network model with the pad sample image as the training data and the label information as the result data.
  • the target ResNet neural network model used to identify the quality of the pad image accept the pad detection request carrying the image of the circuit board to be tested; input the image of the circuit board to be tested into the target ResNet neural network model for the pad detection operation, and obtain the pad Detection result; output pad detection result.
  • This application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network model to detect the flexible circuit board (FPC ) area marked on the image can greatly improve the detection accuracy and speed.
  • step S205 further include:
  • the pad sample images are pre-classified according to the feature method, and multiple groups of pad sample images with similar pad shapes are obtained.
  • a JSON file should be prepared for each picture, which marks the outline coordinates of the pads to be tested. Because each picture is taken by the camera moving across the entire board, there will be a certain deviation from the coordinates marked in the JSON file, so registration is required.
  • each FPC pad has a prototype pad, so it can be registered through the prototype pad.
  • circuit boards will be made up in the production of circuit boards, and when the spliced boards are passed to the image acquisition system described in step 2, the image of each circuit board will be collected according to the method of moving the camera or moving the spliced boards. Therefore, the position coordinates contained in the corresponding JSON file will have a relative offset relative to the position of the pad on the circuit board image.
  • Mark points are set to help the optical positioning of the placement machine. This method also uses this point to register the JSON file and the circuit board image.
  • Mark points are composed of mark points and open areas, as shown in Figure 3.
  • This method proposes a ring-based solid circle matching algorithm.
  • the algorithm first generates a circular template based on the coordinates of the Mark point marking area in the JSON file.
  • the inner diameter of the ring is 1 pixel smaller than the edge diameter of the Mark marking area, and the outer diameter of the ring is larger than the Mark edge. 1 pixel in diameter.
  • the sets of pixel values on the upper, lower, left, and right sides of the inner and outer arcs are Ui, Uo, Di, Do, Li, Lo, Ri, Ro, respectively.
  • the color characteristics of the marked area and the open area of the Mark point are different, and the recognition threshold ⁇ is set.
  • the formula ( 2) (3) Calculate the offset distance between the X-axis and the Y-axis, update the template coordinates to completely move the inner ring of the template to the inner side of the Mark point marking area, and the outer ring of the template is outside the Mark point marking area.
  • x offset represents the horizontal offset distance of the template relative to the current circuit board image
  • y offset represents the vertical offset distance of the template relative to the current circuit board image
  • (x 0 , y 0 ) is the upper left corner point of the bounding box
  • (x 1 , y 1 ) is the lower right corner point of the bounding box
  • X, Y are the horizontal axis coordinate set and the vertical axis coordinate set of the pad.
  • the minimum bounding box is determined according to the coordinates of the above two points to cut out the pad image and save it to the dataset, thereby generating a single pad image dataset with a black background, that is, a pixel value of 0 in the non-pad area.
  • the existing data set needs to be divided into Defective and non-defective datasets. Since the amount of data is not very large, the data can be manually screened, or the data set can be preliminarily screened by extracting obvious defect features and then manually screened, which can reduce the workload.
  • This embodiment detects the discoloration defect of the pad, and judging whether a pad contains a defect needs to judge whether the discoloration area exceeds the allowable ratio, whether the degree of discoloration exceeds the allowable degree, and if a rainbow-like discoloration occurs, that is, a sudden color change, no matter the size of the discoloration area. judged to be defective. Because the color of the non-defective pads collected by the image acquisition system is white and bright, and the color of the defective area is reddish or yellowish, it can be seen from the RGB color space that the change from bright white to red or yellow is mainly related to the decrease in the pixel value of the blue channel. According to this color feature, the data set is initially screened, and then manually screened to confirm that it is divided into a defective data set and a non-defective data set.
  • this embodiment strengthens the data set.
  • max(R,G,B) max(R,G,B) ⁇ d operation to get the enhanced data set.
  • this embodiment strengthens the data set.
  • max(R,G,B) max(R,G,B) ⁇ d operation to get the enhanced data set.
  • this application provides a pad detection method applied to flexible circuit boards, including: accepting a model training request carrying a circuit board sample image and pad position information; The circuit board sample image is segmented to obtain a pad sample image; the pad sample image is sent to the terminal device for labeling the pad sample image; the pad label image sent by the terminal device is received, and the
  • the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
  • the original ResNet neural network model is called, and the pad sample image is used as training data, and the annotation
  • the information is the result data, and the model training operation is performed on the original ResNet neural network model to obtain the target ResNet neural network model used to identify the quality of the pad image; accept the pad detection request carrying the image of the circuit board to be tested;
  • the test circuit board image is input to the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result; and the pad detection result is output.
  • This application aims at the FPC boards of different sizes provided by manufacturers that contain multiple irregularly shaped pads, and studies the design and system implementation of FPC pad defect detection algorithms based on neural networks, while meeting the basic detection requirements and improving Efficiency of defect detection.
  • the detection method of visual inspection is easily affected by subjective and objective factors, the correctness of the results cannot be guaranteed, and the inspection process is very time-consuming.
  • This system can solve these problems well, meets our expectations for defect detection, and has both It has the advantages of versatility and stability.
  • this paper uses the modified Image brightness enhancement data set, first use the data set to train the network model, and then segment out the pads after registering each picture, and finally use the trained resnet network model to detect and separate the pads to realize the defect classification algorithm , and finally realize defect detection and classification.
  • the application can be used in numerous general purpose or special purpose computer system environments or configurations. Examples: personal computers, server computers, handheld or portable devices, tablet-type devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, including A distributed computing environment for any of the above systems or devices, etc.
  • This application may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer.
  • program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types.
  • the application may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network.
  • program modules may be located in both local and remote computer storage media including storage devices.
  • the aforementioned storage medium may be a nonvolatile storage medium such as a magnetic disk, an optical disk, a read-only memory (Read-Only Memory, ROM), or a random access memory (Random Access Memory, RAM).
  • the present application provides an embodiment of a pad detection device applied to a flexible circuit board.
  • This device embodiment is the same as the method embodiment shown in FIG. 2
  • the device can be specifically applied to various electronic devices.
  • the pad detection device 200 applied to a flexible circuit board described in this embodiment includes: a training request receiving module 210, a segmentation operation module 220, a label sending module 230, a label receiving module 240, and a model training module 250 , a detection request receiving module 260 , a pad detection module 270 and a result output module 280 . in:
  • the training request receiving module 210 is configured to receive a model training request carrying circuit board sample images and pad position information
  • a segmentation operation module 220 configured to perform a segmentation operation on the circuit board sample image according to the pad position information to obtain a pad sample image
  • An annotation sending module 230 configured to send the pad sample image to a terminal device, so as to perform an annotation operation on the pad sample image;
  • Annotation receiving module 240 configured to receive the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
  • the model training module 250 is used to call the original ResNet neural network model, and use the pad sample image as training data and the labeling information as result data to perform model training operations on the original ResNet neural network model to obtain Target ResNet neural network model for pad image quality;
  • the detection request receiving module 260 is configured to accept a pad detection request carrying an image of the circuit board to be tested;
  • the pad detection module 270 is configured to input the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result;
  • the result output module 280 is configured to output the detection result of the pad.
  • the minimum bounding box algorithm is used to frame the ROI area, and the ROI images of 1000 images are cut out.
  • the foreground layouts of different products are different.
  • the pad area to be detected is usually irregular in shape, and there is still a part of the background area in the minimum bounding box. According to the brightness difference between the pad area and the background, the image is converted from RGB color to The space is converted to the HSV color space, and the conversion formula is
  • the cut ROI image is manually marked as a good product or a defective product.
  • ResNet is a network structure proposed by He et al. in the 2015 ImageNet Challenge, which alleviates the problem that the performance of the network degrades with the deepening of the network depth.
  • the experiment in the paper Deep Residual Learning for Image Recognition found that the deep network has a degradation problem (Degradation problem): when the network depth increases, the network accuracy is saturated or even declines. This phenomenon can be seen directly in the figure: the 56-layer network is even worse than the 20-layer network. This would not be an overfitting problem, since the training error is equally high for a 56-layer network. Because the deep network has the problem of gradient disappearance or explosion, which makes the deep learning model difficult to train.
  • Residual learning is easier than direct learning of original features, because when the residual is 0, the accumulation layer only does the identity mapping at this time, at least the network performance will not decline, in fact the residual will not be 0, which will also This enables the stacking layer to learn new features based on the input features, resulting in better performance.
  • the ResNet50 network is used in the existing deep learning package of "Halcon", which shows that it has certain reliability in industrial inspection. Therefore, this paper uses the ResNet network to detect pad defects combined with inter-channel information.
  • the network structure consists of convolution, pooling, improved residual block and linear classifier.
  • the input features undergo convolution, batch regularization, pooling, and then repeat the above process, and finally the output and input features are superimposed pixel by pixel as the next input; after convolution, the importance of each channel is extracted, so that It is multiplied by the feature layer after convolution, and finally added to the input feature, so that the convolution can obtain the fusion information of the space and channel of the local area.
  • images of good products and defective products are divided into a training set and a verification set according to a ratio of 3:1.
  • Input the training set samples to the network use the BP algorithm to update the model weights, input the verification set to the network, verify the effect of the model, and repeat this operation until the model converges to a satisfactory accuracy rate.
  • the B channel value distribution histogram of the RGB color space of each ROI is counted. For a single ROI, if the ratio P of the discoloration area to the pad area is greater than the threshold S2, the FPC is not Good product; if S1 ⁇ P ⁇ S2, use the trained model f(x) to detect the ROI, if the detection result is a defective product, then the FPC is a defective product, and if the detection result is a good product, then detect the next ROI; If P ⁇ S1, detect the next ROI; if all ROIs are good, the FPC is good, otherwise it is bad.
  • the current FPC is a good product, otherwise it is a defective product.
  • the formula is shown in formula (1):
  • X is the current FPC image
  • n is the number of ROIs of the FPC
  • an area array industrial camera is used to shoot above the FPC board, and the image acquisition card transmitted to the computer saves the image file.
  • a pad detection device 200 applied to a flexible circuit board including: a training request receiving module 210, configured to receive a model training request carrying a circuit board sample image and pad position information;
  • the segmentation operation module 220 is configured to segment the circuit board sample image according to the pad position information to obtain a pad sample image;
  • the label sending module 230 is configured to send the pad sample image to a terminal device, to perform labeling operations on pad sample images;
  • the label receiving module 240 is configured to receive the pad label image sent by the terminal device, the pad label image is a bond sample image carrying label information, and the label information It is good product information or defective product information;
  • the model training module 250 is used to call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform the original ResNet neural network model
  • the model training operation obtains the target ResNet neural network model for identifying the image quality of the pad;
  • the detection request receiving module 260 is used to accept the pad detection request carrying the image of the circuit board to be tested
  • This application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network model to detect the flexible circuit board (FPC ) area marked on the image can greatly improve the detection accuracy and speed.
  • the above-mentioned pad detection device 200 applied to a flexible circuit board further includes:
  • the pre-classification module is configured to perform a pre-classification operation on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
  • a JSON file should be prepared for each picture, which marks the outline coordinates of the pads to be tested. Because each picture is taken by the camera moving across the entire board, there will be a certain deviation from the coordinates marked in the JSON file, so registration is required.
  • each FPC pad has a prototype pad, so it can be registered through the prototype pad.
  • circuit boards will be made up in the production of circuit boards, and when the spliced boards are passed to the image acquisition system described in step 2, the image of each circuit board will be collected according to the method of moving the camera or moving the spliced boards. Therefore, the position coordinates contained in the corresponding JSON file will have a relative offset relative to the position of the pad on the circuit board image.
  • Mark points are set to help the optical positioning of the placement machine. This method also uses this point to register the JSON file and the circuit board image.
  • Mark points are composed of mark points and open areas, as shown in Figure 3.
  • This method proposes a ring-based solid circle matching algorithm.
  • the algorithm first generates a circular template based on the coordinates of the Mark point marking area in the JSON file.
  • the inner diameter of the ring is 1 pixel smaller than the edge diameter of the Mark marking area, and the outer diameter of the ring is larger than the Mark edge. 1 pixel in diameter.
  • the sets of pixel values on the upper, lower, left, and right sides of the inner and outer arcs are Ui, Uo, Di, Do, Li, Lo, Ri, Ro, respectively.
  • the color characteristics of the marked area and the open area of the Mark point are different, and the recognition threshold ⁇ is set.
  • the formula ( 2) (3) Calculate the offset distance between the X-axis and the Y-axis, update the template coordinates to completely move the inner ring of the template to the inner side of the Mark point marking area, and the outer ring of the template is outside the Mark point marking area.
  • x offset represents the horizontal offset distance of the template relative to the current circuit board image
  • y offset represents the vertical offset distance of the template relative to the current circuit board image
  • the minimum bounding box is determined according to the coordinates of the above two points to cut out the pad image and save it to the dataset, thereby generating a single pad image dataset with a black background, that is, a pixel value of 0 in the non-pad area.
  • the existing data set needs to be divided into Defective and non-defective datasets. Since the amount of data is not very large, the data can be manually screened, or the data set can be preliminarily screened by extracting obvious defect features and then manually screened, which can reduce the workload.
  • This embodiment detects the discoloration defect of the pad, and judging whether a pad contains a defect needs to judge whether the discoloration area exceeds the allowable ratio, whether the degree of discoloration exceeds the allowable degree, and if a rainbow-like discoloration occurs, that is, a sudden color change, no matter the size of the discoloration area. judged to be defective. Because the color of the non-defective pads collected by the image acquisition system is white and bright, and the color of the defective area is reddish or yellowish, it can be seen from the RGB color space that the change from bright white to red or yellow is mainly related to the decrease in the pixel value of the blue channel. According to this color feature, the data set is initially screened, and then manually screened to confirm that it is divided into a defective data set and a non-defective data set.
  • this embodiment strengthens the data set.
  • max(R,G,B) max(R,G,B) ⁇ d operation to get the enhanced data set.
  • this embodiment strengthens the data set.
  • max(R,G,B) max(R,G,B) ⁇ d operation to get the enhanced data set.
  • the present application provides a pad detection device 200 applied to flexible circuit boards, including: a training request receiving module 210, configured to receive a model training request carrying circuit board sample images and pad position information;
  • the segmentation operation module 220 is configured to segment the circuit board sample image according to the pad position information to obtain a pad sample image;
  • the label sending module 230 is configured to send the pad sample image to a terminal device, to perform labeling operations on pad sample images;
  • the label receiving module 240 is configured to receive the pad label image sent by the terminal device, the pad label image is a bond sample image carrying label information, and the label information It is good product information or defective product information;
  • the model training module 250 is used to call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform the original ResNet neural network model
  • the model training operation obtains the target ResNet neural network model for identifying the image quality of the pad;
  • the detection request receiving module 260 is used to accept the pad detection request carrying the image of the circuit board to be
  • This application aims at the FPC boards of different sizes provided by manufacturers that contain multiple irregularly shaped pads, and studies the design and system implementation of FPC pad defect detection algorithms based on neural networks, while meeting the basic detection requirements and improving Efficiency of defect detection.
  • the detection method of visual inspection is easily affected by subjective and objective factors, the correctness of the results cannot be guaranteed, and the inspection process is very time-consuming.
  • This system can solve these problems well, meets our expectations for defect detection, and has both It has the advantages of versatility and stability.
  • this paper uses the modified Image brightness enhancement data set, first use the data set to train the network model, and then segment out the pads after registering each picture, and finally use the trained resnet network model to detect and separate the pads to realize the defect classification algorithm , and finally realize defect detection and classification.
  • FIG. 6 is a block diagram of the basic structure of the computer device in this embodiment.
  • the computer device 300 includes a memory 310 , a processor 320 , and a network interface 330 connected to each other through a system bus for communication. It should be noted that only computer device 300 is shown with components 310-330, but it should be understood that implementation of all illustrated components is not required and that more or fewer components may instead be implemented. Among them, those skilled in the art can understand that the computer device here is a device that can automatically perform numerical calculation and/or information processing according to preset or stored instructions, and its hardware includes but is not limited to microprocessors, dedicated Integrated circuit (Application Specific Integrated Circuit, ASIC), programmable gate array (Field-Programmable Gate Array, FPGA), digital processor (Digital Signal Processor, DSP), embedded devices, etc.
  • ASIC Application Specific Integrated Circuit
  • FPGA Field-Programmable Gate Array
  • DSP Digital Signal Processor
  • the computer equipment may be computing equipment such as a desktop computer, a notebook, a palmtop computer, and a cloud server.
  • the computer device can perform human-computer interaction with the user through keyboard, mouse, remote controller, touch panel or voice control device.
  • the memory 310 includes at least one type of readable storage medium, and the readable storage medium includes flash memory, hard disk, multimedia card, card-type memory (for example, SD or DX memory, etc.), random access memory (RAM), static Random Access Memory (SRAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), Programmable Read Only Memory (PROM), Magnetic Memory, Magnetic Disk, Optical Disk, etc.
  • the storage 310 may be an internal storage unit of the computer device 300 , such as a hard disk or memory of the computer device 300 .
  • the memory 310 can also be an external storage device of the computer device 300, such as a plug-in hard disk equipped on the computer device 300, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, flash memory card (Flash Card), etc.
  • the memory 310 may also include both an internal storage unit of the computer device 300 and an external storage device thereof.
  • the memory 310 is generally used to store the operating system and various application software installed in the computer device 300 , such as computer-readable instructions applied to a pad detection method of a flexible circuit board.
  • the memory 310 can also be used to temporarily store various types of data that have been output or will be output.
  • the processor 320 may be a central processing unit (Central Processing Unit, CPU), controller, microcontroller, microprocessor, or other data processing chips in some embodiments.
  • the processor 320 is generally used to control the overall operation of the computer device 300 .
  • the processor 320 is configured to execute computer-readable instructions stored in the memory 310 or process data, for example, execute computer-readable instructions of the method for detecting pads applied to flexible printed circuit boards.
  • the network interface 330 may include a wireless network interface or a wired network interface, and the network interface 330 is generally used to establish a communication connection between the computer device 300 and other electronic devices.
  • the computer equipment provided by this application accurately marks the position coordinates of the pads of each product, uses the program to analyze the coordinates of the pad positions of each type of pads, and then performs local calibration on the resolved coordinates, and finally uses the ResNet neural network model to detect The area marked on the flexible circuit board (FPC) image can greatly improve the detection accuracy and speed.
  • the present application also provides another implementation manner, which is to provide a computer-readable storage medium, the computer-readable storage medium stores computer-readable instructions, and the computer-readable instructions can be executed by at least one processor to The at least one processor is made to execute the steps of the method for detecting pads applied to flexible printed circuit boards as described above.
  • the computer-readable storage medium provided by this application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each type of pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network
  • the network model detects the marked area on the flexible circuit board (FPC) image, which can greatly improve the detection accuracy and speed.
  • the methods of the above embodiments can be implemented by means of software plus a necessary general-purpose hardware platform, and of course also by hardware, but in many cases the former is better implementation.
  • the technical solution of the present application can be embodied in the form of a software product in essence or the part that contributes to the prior art, and the computer software product is stored in a storage medium (such as ROM/RAM, disk, CD) contains several instructions to make a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) execute the methods described in the various embodiments of the present application.
  • a terminal device which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.

Abstract

A pad detection method and apparatus (200) applied to a flexible printed circuit (FPC), and a computer device (300) and a storage medium, which belong to the technical field of FPC detection in artificial intelligence. By means of accurately labelling pad position coordinates of each product, using a program to analyze pad position coordinates of each pad, then performing local calibration on the analyzed coordinates, and finally detecting an area, which is labeled on an FPC image, using a ResNet neural network model, the detection precision and speed can be greatly improved.

Description

一种焊盘检测方法、装置、计算机设备及存储介质A pad detection method, device, computer equipment and storage medium 技术领域technical field
本申请涉及人工智能中的FPC检测技术领域,尤其涉及一种应用于柔性电路板的焊盘检测方法、装置、计算机设备及存储介质。The present application relates to the technical field of FPC detection in artificial intelligence, and in particular to a pad detection method, device, computer equipment and storage medium applied to flexible circuit boards.
背景技术Background technique
柔性电路板(Flexible Printed Circuit,FPC)以其质量轻、厚度薄、可自由弯曲折叠等优良性能而得到了广泛的应用。但国内有关FPC的质量检测还主要依赖人工目测,成本高且效率低下。随着电子技术的飞快发展,电路板的设计越来越趋于高精度,高密度化,传统的人工检测方法已无法满足生产需求,FPC缺陷的自动化检测已经成为发展的必然趋势。Flexible printed circuit (Flexible Printed Circuit, FPC) has been widely used for its light weight, thin thickness, free bending and folding and other excellent properties. However, the domestic quality inspection of FPC mainly relies on manual visual inspection, which is costly and inefficient. With the rapid development of electronic technology, the design of circuit boards tends to be more and more high-precision and high-density. The traditional manual detection method can no longer meet the production needs. The automatic detection of FPC defects has become an inevitable trend of development.
现有一种焊盘检测方法,即基于计算机视觉并根据边缘检测法、零均值化法、背景相减法、机器学习法等方法进行检测,其中:There is an existing pad detection method, which is based on computer vision and detection according to edge detection method, zero-mean method, background subtraction method, machine learning method and other methods, wherein:
1、边缘检测法:边缘检测法是一种空间域检测方法,通过特定的算法提取出零件的边缘轮廓,对零件边缘进行检测,通过对比判别零件是否有缺损;1. Edge detection method: The edge detection method is a spatial domain detection method, which extracts the edge contour of the part through a specific algorithm, detects the edge of the part, and judges whether the part is defective by comparison;
2、零均值化法:零均值化法是处理零件的图像后构造零均值图,并在图像分割时通过对不同的阈值进行对比分析,来识别损坏区域;2. Zero-mean method: The zero-mean method is to construct a zero-mean map after processing the image of the part, and to identify the damaged area by comparing and analyzing different thresholds during image segmentation;
3、背景相减法:从预处理图像中减去提前估计或计算得到的背景图像(不包含缺陷),留下包含缺陷和随机噪声的残差图像;3. Background subtraction method: Subtract the background image (excluding defects) estimated or calculated in advance from the preprocessed image, leaving a residual image containing defects and random noise;
4、机器学习法:基于人工定义特征以及特征提取方式,并利用这些特征来训练机器学习分类器,实现最终的缺陷检测。4. Machine learning method: Based on manually defined features and feature extraction methods, these features are used to train machine learning classifiers to achieve final defect detection.
然而,申请人发现传统的焊盘检测方法普遍不智能,传统方法只能检测特定条件下的缺陷,例如具有一定大小尺寸,或在特定照明条件下具有强对比度和低噪声的明显缺陷轮廓。基于机器学习的算法有一定的鲁棒性,但人工特征的天然缺点在于表征能力弱和适应性差,因此基于传统机器学习算法不能很好的学习到需要检测的特征,导致最终检测结果的准确性较低。由此可见,传统的焊盘检测方法存在准确性不高的问题。However, the applicant found that the traditional pad detection method is generally not intelligent, and the traditional method can only detect defects under certain conditions, such as a certain size, or an obvious defect outline with strong contrast and low noise under specific lighting conditions. Algorithms based on machine learning have certain robustness, but the natural disadvantages of artificial features are weak representation ability and poor adaptability. Therefore, based on traditional machine learning algorithms, the features that need to be detected cannot be well learned, resulting in the accuracy of the final detection results. lower. It can be seen that the traditional pad detection method has the problem of low accuracy.
技术问题technical problem
本申请实施例的目的在于提出一种应用于柔性电路板的焊盘检测方法、装置、计算机设备及存储介质,以解决传统的焊盘检测方法存在准确性不高的问题。The purpose of the embodiments of the present application is to provide a pad detection method, device, computer equipment and storage medium applied to flexible circuit boards, so as to solve the problem of low accuracy of traditional pad detection methods.
技术解决方案technical solution
为了解决上述技术问题,本申请实施例提供一种应用于柔性电路板的焊盘检测方法,采用了如下所述的技术方案:In order to solve the above technical problems, the embodiment of the present application provides a pad detection method applied to flexible circuit boards, which adopts the following technical solutions:
接受携带有电路板样本图像以及焊盘位置信息的模型训练请求;Accept model training requests that carry circuit board sample images and pad location information;
根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;performing a segmentation operation on the circuit board sample image according to the pad position information to obtain a pad sample image;
将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;Sending the pad sample image to a terminal device for labeling the pad sample image;
接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;receiving the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;Call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform model training operations on the original ResNet neural network model to obtain the target ResNet for identifying the quality of the pad image. neural network model;
接受携带有待测电路板图像的焊盘检测请求;Accept the pad detection request carrying the image of the circuit board to be tested;
将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;Inputting the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result;
输出所述焊盘检测结果。Outputting the detection result of the pad.
进一步的,在所述根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像的步骤之后,还包括下述步骤:Further, after the step of segmenting the circuit board sample image according to the pad position information to obtain the pad sample image, the following steps are further included:
根据转换公式将所述焊盘样本图像从RGB颜色空间转换为HSV颜色空间,所述转换公式表示为:The pad sample image is converted from the RGB color space to the HSV color space according to the conversion formula, and the conversion formula is expressed as:
Figure PCTCN2021140593-appb-000001
Figure PCTCN2021140593-appb-000001
Figure PCTCN2021140593-appb-000002
Figure PCTCN2021140593-appb-000002
其中,max=max(r,g,b),min=min(r,g,b)。Among them, max=max(r,g,b), min=min(r,g,b).
进一步的,在所述调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型的步骤之前,还包括下述步骤:Further, when calling the original ResNet neural network model, and using the pad sample image as training data and the label information as result data, the original ResNet neural network model is trained to obtain a Before the step of the target ResNet neural network model of disk image quality, the following steps are also included:
根据特征法对所述焊盘样本图像进行预分类操作,得到焊盘形状相似的多组焊盘样本图像。A pre-classification operation is performed on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
进一步的,所述将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果的步骤,具体包括下述步骤:Further, the step of inputting the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result specifically includes the following steps:
统计所述待测电路板图像中每个待测焊盘位置的RGB颜色空间中B通道数值的变化区域;Counting the change area of the B channel value in the RGB color space of each pad position to be tested in the image of the circuit board to be tested;
根据预设良品占比阈值S1、不良品占比阈值S2以及判断函数检测所述待测电路板图像,所述判断函数表示为:The image of the circuit board to be tested is detected according to the preset good product ratio threshold S1, the defective product ratio threshold S2 and a judgment function, and the judgment function is expressed as:
Figure PCTCN2021140593-appb-000003
Figure PCTCN2021140593-appb-000003
其中,所述P I表示所述变化区域与待测焊盘位置的面积的占比;f(ROI i)表示通过所述目标ResNet神经网络模型对所述待测电路板图像进行焊盘检测操作得到的结果。 Wherein, the PI represents the ratio of the change area to the area of the pad position to be tested; f(ROI i ) represents that the pad detection operation is performed on the circuit board image to be tested by the target ResNet neural network model The results obtained.
为了解决上述技术问题,本申请实施例还提供一种应用于柔性电路板的焊盘检测装置,采用了如下所述的技术方案:In order to solve the above technical problems, the embodiment of the present application also provides a pad detection device applied to flexible circuit boards, which adopts the following technical solutions:
训练请求接收模块,用于接收携带有电路板样本图像以及焊盘位置信息的模型训练请求;A training request receiving module, configured to receive a model training request carrying circuit board sample images and pad position information;
分割操作模块,用于根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;A segmentation operation module, configured to perform a segmentation operation on the circuit board sample image according to the pad position information to obtain a pad sample image;
标注发送模块,用于将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;An annotation sending module, configured to send the pad sample image to a terminal device, so as to perform an annotation operation on the pad sample image;
标注接收模块,用于接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;An annotation receiving module, configured to receive the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
模型训练模块,用于调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;The model training module is used to call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform model training operations on the original ResNet neural network model to obtain a Targeted ResNet neural network model for disk image quality;
检测请求接收模块,用于接受携带有待测电路板图像的焊盘检测请求;A detection request receiving module, configured to accept a pad detection request carrying an image of a circuit board to be tested;
焊盘检测模块,用于将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;The pad detection module is used to input the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result;
结果输出模块,用于输出所述焊盘检测结果。A result output module, configured to output the detection result of the pad.
进一步的,所述装置还包括:Further, the device also includes:
颜色空间转换模块,用于根据转换公式将所述焊盘样本图像从RGB颜色空间转换为HSV颜色空间,所述转换公式表示为:The color space conversion module is used to convert the pad sample image from the RGB color space to the HSV color space according to the conversion formula, and the conversion formula is expressed as:
Figure PCTCN2021140593-appb-000004
Figure PCTCN2021140593-appb-000004
Figure PCTCN2021140593-appb-000005
Figure PCTCN2021140593-appb-000005
其中,max=max(r,g,b),min=min(r,g,b)。Among them, max=max(r,g,b), min=min(r,g,b).
进一步的,所述装置还包括:Further, the device also includes:
预分类模块,用于根据特征法对所述焊盘样本图像进行预分类操作,得到焊盘形状相似的多组焊盘样本图像。The pre-classification module is configured to perform a pre-classification operation on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
进一步的,所述焊盘检测模块包括:Further, the pad detection module includes:
变化区域获取子模块,用于统计所述待测电路板图像中每个待测焊盘位置的RGB颜色空间中B通道数值的变化区域;The change area acquisition submodule is used to count the change area of the B channel value in the RGB color space of each pad position to be tested in the image of the circuit board to be tested;
检测子模块,用于根据预设良品占比阈值S1、不良品占比阈值S2以及判断函数检测所述待测电路板图像,所述判断函数表示为:The detection sub-module is used to detect the image of the circuit board to be tested according to the preset good product ratio threshold S1, the defective product ratio threshold S2 and a judgment function, and the judgment function is expressed as:
Figure PCTCN2021140593-appb-000006
Figure PCTCN2021140593-appb-000006
其中,所述P I表示所述变化区域与待测焊盘位置的面积的占比;f(ROI i)表示通过所述目标ResNet神经网络模型对所述待测电路板图像进行焊盘检测操作得到的结果。 Wherein, the PI represents the ratio of the change area to the area of the pad position to be tested; f(ROI i ) represents that the pad detection operation is performed on the circuit board image to be tested by the target ResNet neural network model The results obtained.
为了解决上述技术问题,本申请实施例还提供一种计算机设备,采用了如下所述的技术方案:In order to solve the above technical problems, the embodiment of the present application also provides a computer device, which adopts the following technical solutions:
包括存储器和处理器,所述存储器中存储有计算机可读指令,所述处理器执行所述计算机可读指令时实现如上所述的应用于柔性电路板的焊盘检测方法的步骤。It includes a memory and a processor, wherein computer-readable instructions are stored in the memory, and the processor implements the steps of the above-mentioned method for detecting pads applied to flexible circuit boards when executing the computer-readable instructions.
为了解决上述技术问题,本申请实施例还提供一种计算机可读存储介质,采用了如下所述的技术方案:In order to solve the above technical problems, the embodiment of the present application also provides a computer-readable storage medium, which adopts the following technical solution:
所述计算机可读存储介质上存储有计算机可读指令,所述计算机可读指令被处理器执行时实现如上所述的应用于柔性电路板的焊盘检测方法的步骤。Computer-readable instructions are stored on the computer-readable storage medium, and when the computer-readable instructions are executed by a processor, the steps of the above-mentioned method for detecting a pad applied to a flexible circuit board are implemented.
有益效果Beneficial effect
与现有技术相比,本申请实施例主要有以下有益效果:Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects:
本申请提供了一种应用于柔性电路板的焊盘检测方法,包括:接受携带有电路板样本图像以及焊盘位置信息的模型训练请求;根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;接受携带有待测电路板图像的焊盘检测请求;将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;输出所述焊盘检测结果。本申请通过精确标注出每种产品的焊盘位置坐标,使用程序解析每种焊盘的焊盘位置坐标,再对解析出的坐标进行局部校准,最后使用ResNet神经网络模型检测柔性电路板(FPC)图像上标注出的区域,能大幅度提高检测精度与速度。The present application provides a pad detection method applied to a flexible circuit board, including: accepting a model training request carrying a circuit board sample image and pad position information; performing a segmentation operation to obtain a pad sample image; sending the pad sample image to a terminal device for labeling the pad sample image; receiving the pad label image sent by the terminal device, and the pad label image It is a pad sample image carrying annotation information, the annotation information is good product information or defective product information; the original ResNet neural network model is called, and the pad sample image is used as training data, and the annotation information is the result data pair The original ResNet neural network model performs a model training operation to obtain a target ResNet neural network model for identifying the quality of the pad image; accepts a pad detection request carrying an image of the circuit board to be tested; inputs the image of the circuit board to be tested Perform pad detection operation to the target ResNet neural network model to obtain a pad detection result; output the pad detection result. This application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network model to detect the flexible circuit board (FPC ) area marked on the image can greatly improve the detection accuracy and speed.
附图说明Description of drawings
为了更清楚地说明本申请中的方案,下面将对本申请实施例描述中所需要使用的附图作一个简单介绍,显而易见地,下面描述中的附图是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the solution in this application more clearly, a brief introduction will be given below to the accompanying drawings that need to be used in the description of the embodiments of the application. Obviously, the accompanying drawings in the following description are some embodiments of the application. Ordinary technicians can also obtain other drawings based on these drawings on the premise of not paying creative work.
图1是本申请可以应用于其中的示例性系统架构图;FIG. 1 is an exemplary system architecture diagram to which the present application can be applied;
图2是本申请实施例一提供的应用于柔性电路板的焊盘检测方法的实现流程图;FIG. 2 is a flow chart of the implementation of the pad detection method applied to flexible circuit boards provided in Embodiment 1 of the present application;
图3是本申请实施例一提供的Mark点的示意图;Fig. 3 is a schematic diagram of Mark points provided by Embodiment 1 of the present application;
图4是本申请实施例一提供的将圆环分成四份的示意图;Fig. 4 is a schematic diagram of dividing the ring into four parts provided by Embodiment 1 of the present application;
图5是本申请实施例二提供的应用于柔性电路板的焊盘检测装置的结构示意图:Fig. 5 is a schematic structural diagram of a pad detection device applied to a flexible circuit board provided in Embodiment 2 of the present application:
图6是根据本申请的计算机设备的一个实施例的结构示意图。Fig. 6 is a schematic structural diagram of an embodiment of a computer device according to the present application.
本发明的实施方式Embodiments of the present invention
除非另有定义,本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同;本文中在申请的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本申请;本申请的说明书和权利要求书及上述附图说明中的术语“包括”和“具有”以及它们的任何变形,意图 在于覆盖不排他的包含。本申请的说明书和权利要求书或上述附图中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the application; the terms used herein in the description of the application are only to describe specific embodiments The purpose is not to limit the present application; the terms "comprising" and "having" and any variations thereof in the specification and claims of the present application and the description of the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second" and the like in the description and claims of the present application or the above drawings are used to distinguish different objects, rather than to describe a specific order.
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.
为了使本技术领域的人员更好地理解本申请方案,下面将结合附图,对本申请实施例中的技术方案进行清楚、完整地描述。In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.
如图1所示,系统架构100可以包括终端设备101、102、103,网络104和服务器105。网络104用以在终端设备101、102、103和服务器105之间提供通信链路的介质。网络104可以包括各种连接类型,例如有线、无线通信链路或者光纤电缆等等。As shown in FIG. 1 , a system architecture 100 may include terminal devices 101 , 102 , 103 , a network 104 and a server 105 . The network 104 is used as a medium for providing communication links between the terminal devices 101 , 102 , 103 and the server 105 . Network 104 may include various connection types, such as wires, wireless communication links, or fiber optic cables, among others.
用户可以使用终端设备101、102、103通过网络104与服务器105交互,以接收或发送消息等。终端设备101、102、103上可以安装有各种通讯客户端应用,例如网页浏览器应用、购物类应用、搜索类应用、即时通信工具、邮箱客户端、社交平台软件等。Users can use terminal devices 101 , 102 , 103 to interact with server 105 via network 104 to receive or send messages and the like. Various communication client applications can be installed on the terminal devices 101, 102, 103, such as web browser applications, shopping applications, search applications, instant messaging tools, email clients, social platform software, and the like.
终端设备101、102、103可以是具有显示屏并且支持网页浏览的各种电子设备,包括但不限于智能手机、平板电脑、电子书阅读器、MP3播放器(Moving Picture Experts Group Audio Layer III,动态影像专家压缩标准音频层面3)、MP4(Moving Picture Experts Group Audio Layer IV,动态影像专家压缩标准音频层面4)播放器、膝上型便携计算机和台式计算机等等。 Terminal devices 101, 102, 103 can be various electronic devices with display screens and support web browsing, including but not limited to smartphones, tablet computers, e-book readers, MP3 players (Moving Picture Experts Group Audio Layer III, dynamic Video experts compress standard audio layer 3), MP4 (Moving Picture Experts Group Audio Layer IV, moving picture experts compress standard audio layer 4) player, laptop portable computer and desktop computer, etc.
服务器105可以是提供各种服务的服务器,例如对终端设备101、102、103上显示的页面提供支持的后台服务器。The server 105 may be a server that provides various services, such as a background server that provides support for pages displayed on the terminal devices 101 , 102 , 103 .
需要说明的是,本申请实施例所提供的应用于柔性电路板的焊盘检测方法一般由服务器/终端设备执行,相应地,应用于柔性电路板的焊盘检测装置一般设置于服务器/终端设备中。It should be noted that the pad detection method applied to flexible circuit boards provided in the embodiments of the present application is generally executed by the server/terminal device, and correspondingly, the pad detection device applied to flexible circuit boards is generally set on the server/terminal device middle.
应该理解,图1中的终端设备、网络和服务器的数目仅仅是示意性的。根据实现需要,可以具有任意数目的终端设备、网络和服务器。It should be understood that the numbers of terminal devices, networks and servers in Fig. 1 are only illustrative. According to the implementation needs, there can be any number of terminal devices, networks and servers.
继续参考图2,示出了本申请实施例一提供的应用于柔性电路板的焊盘检测方法的实现流程图,为了便于说明,仅示出与本申请相关的部分。Continuing to refer to FIG. 2 , it shows the implementation flow chart of the pad detection method applied to the flexible circuit board provided by Embodiment 1 of the present application. For the convenience of description, only the parts relevant to the present application are shown.
上述的应用于柔性电路板的焊盘检测方法,包括以下步骤:The above-mentioned pad detection method applied to a flexible circuit board includes the following steps:
在步骤S201中,接受携带有电路板样本图像以及焊盘位置信息的模型训练 请求。In step S201, a model training request carrying a circuit board sample image and pad position information is accepted.
在本申请实施例中,在接收模型训练请求之前,需要对样板图像使用多边形框进行手工标注,获取焊盘位置,即待检测的感兴趣区域ROI,将坐标位置存储到Json文件。In this embodiment of the application, before receiving the model training request, it is necessary to manually mark the template image with a polygon frame to obtain the position of the pad, that is, the region of interest ROI to be detected, and store the coordinate position in the Json file.
在步骤S202中,根据焊盘位置信息对电路板样本图像进行分割操作,得到焊盘样本图像。In step S202, the circuit board sample image is segmented according to the pad position information to obtain a pad sample image.
在本申请实施例中,在制作焊盘样本图像时,使用最小包围框算法框住ROI区域,切割出1000张图像的ROI图像。In the embodiment of the present application, when making the pad sample image, the minimum bounding box algorithm is used to frame the ROI area, and the ROI images of 1000 images are cut out.
在本申请实施例中,不同产品的前景排布都不相同,每更换一批产品时,首先采用手工标注的方式用最小矩形包围框在样图上标注所有需检测的前景区域位置得到C i(x,y,w,h)∈C,其中x,y为最小包围框的左上角点横纵坐标,w,h为最小包围框的宽和高。 In the embodiment of this application, the foreground layouts of different products are different. When replacing a batch of products, first use manual labeling to mark all the foreground area positions to be detected on the sample image with the smallest rectangular bounding box to obtain C i (x, y, w, h)∈C, where x, y are the horizontal and vertical coordinates of the upper left corner of the smallest bounding box, and w, h are the width and height of the smallest bounding box.
在本实施例的一些可选的实现方式中,通常待检测焊盘区域是不规则形状,最小包围框内还剩有一部分背景区域,根据焊盘区域和背景的亮度差异,将图像从RGB颜色空间转换为HSV颜色空间,转换公式为In some optional implementations of this embodiment, the pad area to be detected is usually irregular in shape, and there is still a part of the background area in the minimum bounding box. According to the brightness difference between the pad area and the background, the image is converted from RGB color to The space is converted to the HSV color space, and the conversion formula is
Figure PCTCN2021140593-appb-000007
Figure PCTCN2021140593-appb-000007
Figure PCTCN2021140593-appb-000008
Figure PCTCN2021140593-appb-000008
其中max=max(r,g,b),min=min(r,g,b),转换到HSV空间后使用Otsu法对H通道自动阈值分割,将背景区域的值置零。Where max=max(r,g,b), min=min(r,g,b), after converting to HSV space, use the Otsu method to automatically threshold the H channel, and set the value of the background area to zero.
在步骤S203中,将焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作。In step S203, the pad sample image is sent to the terminal device for marking the pad sample image.
在本申请实施例中,人工标注切割出来的ROI图像为良品或不良品。In the embodiment of the present application, the cut ROI image is manually marked as a good product or a defective product.
在本申请实施例中,为提供后续神经网络模型训练所需数据集,需将现有数据集分为有缺陷数据集与无缺陷数据集。由于数据量不是很大,可以人工筛选数据,也可以通过提取明显缺陷特征对数据集进行初步筛选再人工筛选,可减轻工作量。本实施例检测焊盘变色缺陷,判断一个焊盘是否含有缺陷需判断变色面 积是否超过允许的比例,变色的程度是否超过允许的程度、和若产生彩虹状变色即颜色突变则无论变色面积大小都判为有缺陷。因图像采集系统采集到的无缺陷焊盘颜色白亮,有缺陷区域颜色偏红或偏黄,由RGB色彩空间可知,从颜色白亮到红色或黄色主要与蓝色通道像素值下降相关,本实施例根据此颜色特征对数据集初步筛选,再人工筛选确认分为有缺陷数据集与无缺陷数据集。In the embodiment of the present application, in order to provide the data sets required for subsequent neural network model training, the existing data sets need to be divided into defective data sets and non-defective data sets. Since the amount of data is not very large, the data can be manually screened, or the data set can be preliminarily screened by extracting obvious defect features and then manually screened, which can reduce the workload. This embodiment detects the discoloration defect of the pad, and judging whether a pad contains a defect needs to judge whether the discoloration area exceeds the allowable ratio, whether the degree of discoloration exceeds the allowable degree, and if a rainbow-like discoloration occurs, that is, a sudden color change, no matter the size of the discoloration area. judged to be defective. Because the color of the non-defective pads collected by the image acquisition system is white and bright, and the color of the defective area is reddish or yellowish, it can be seen from the RGB color space that the change from bright white to red or yellow is mainly related to the decrease in the pixel value of the blue channel. According to this color feature, the data set is initially screened, and then manually screened to confirm that it is divided into a defective data set and a non-defective data set.
考虑到实际图像采集系统采集电路板图像时光照强度可能会产生轻微变化,本实施例对数据集进行加强。根据RGB色彩空间与HSV色彩空间的转换公式可知只需修改max(R,G,B)的值即可模拟光照强度的改变,根据此方法对1/3的数据做max(R,G,B)=max(R,G,B)±d操作即可得到强化后的数据集Considering that the light intensity may change slightly when the actual image acquisition system acquires the circuit board image, this embodiment strengthens the data set. According to the conversion formula between RGB color space and HSV color space, it can be known that only the value of max(R,G,B) can be modified to simulate the change of light intensity. According to this method, max(R,G,B )=max(R,G,B)±d operation to get the enhanced data set
在步骤S204中,接收终端设备发送的焊盘标注图像,焊盘标注图像为携带有标注信息的焊盘样本图像,标注信息为良品信息或者不良品信息。In step S204 , receiving the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information.
在步骤S205中,调用原始ResNet神经网络模型,并以焊盘样本图像作为训练数据、标注信息为结果数据对原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型。In step S205, the original ResNet neural network model is called, and the model training operation is performed on the original ResNet neural network model with the pad sample image as the training data and the label information as the result data, and the target ResNet neural network model for identifying the quality of the pad image is obtained. network model.
在本申请实施例中,ResNet是由He等人在2015年的ImageNet挑战赛中提出的网络结构,缓解了随着网络深度的加深,网络的性能反而退化的问题。在论文Deep Residual Learning for Image Recognition中的实验发现深度网络出现了退化问题(Degradation problem):网络深度增加时,网络准确度出现饱和,甚至出现下降。这个现象可以在图中直观看出来:56层的网络比20层网络效果还要差。这不会是过拟合问题,因为56层网络的训练误差同样高。因为深层网络存在着梯度消失或者爆炸的问题,这使得深度学习模型很难训练。In the embodiment of this application, ResNet is a network structure proposed by He et al. in the 2015 ImageNet Challenge, which alleviates the problem that the performance of the network degrades with the deepening of the network depth. The experiment in the paper Deep Residual Learning for Image Recognition found that the deep network has a degradation problem (Degradation problem): when the network depth increases, the network accuracy is saturated or even declines. This phenomenon can be seen directly in the figure: the 56-layer network is even worse than the 20-layer network. This would not be an overfitting problem, since the training error is equally high for a 56-layer network. Because the deep network has the problem of gradient disappearance or explosion, which makes the deep learning model difficult to train.
在本申请实施例中,对于一个堆积层结构(几层堆积而成)当输入为x时其学习到的特征记为H(x),现在我们希望其可以学习到残差F(x)=H(x)-x,这样其实原始的学习特征是F(x)+x。残差学习相比原始特征直接学习更容易,因为当残差为0时,此时堆积层仅仅做了恒等映射,至少网络性能不会下降,实际上残差不会为0,这也会使得堆积层在输入特征基础上学习到新的特征,从而拥有更好的性能。In the embodiment of this application, for a stacked layer structure (several layers stacked) when the input is x, the learned features are denoted as H(x), and now we hope that it can learn the residual F(x)= H(x)-x, so the original learning feature is F(x)+x. Residual learning is easier than direct learning of original features, because when the residual is 0, the accumulation layer only does the identity mapping at this time, at least the network performance will not decline, in fact the residual will not be 0, which will also This enables the stacking layer to learn new features based on the input features, resulting in better performance.
在本申请实施例中,在“Halcon”现有的深度学习包里面就采用了ResNet50网络,说明其在工业检测具有一定的可靠性。因此本文采用ResNet网络,结合通道间信息来检测焊盘缺陷。网络结构由卷积、池化、改进残差块与线性分类器组成。输入特征经过卷积、批量正则化、池化、再重复上述的流程,最后将输出与输入特征按像素进行叠加作为下一次的输入;在卷积过后提取每个通道所占的重要性,使其与卷积过后的特征层进行相乘,最后与输入特征进行相加,从而使 卷积获得局部区域的空间与通道的融合信息。In the embodiment of this application, the ResNet50 network is used in the existing deep learning package of "Halcon", which shows that it has certain reliability in industrial inspection. Therefore, this paper uses the ResNet network to detect pad defects combined with inter-channel information. The network structure consists of convolution, pooling, improved residual block and linear classifier. The input features undergo convolution, batch regularization, pooling, and then repeat the above process, and finally the output and input features are superimposed pixel by pixel as the next input; after convolution, the importance of each channel is extracted, so that It is multiplied by the feature layer after convolution, and finally added to the input feature, so that the convolution can obtain the fusion information of the space and channel of the local area.
在本申请实施例中,良品与不良品图像按照3:1的比例分为训练集与验证集。向网络输入训练集样本,采用BP算法对模型权值更新,向网络输入验证集,验证模型的效果,循环此操作直至模型收敛到满意的准确率。In the embodiment of the present application, images of good products and defective products are divided into a training set and a verification set according to a ratio of 3:1. Input the training set samples to the network, use the BP algorithm to update the model weights, input the verification set to the network, verify the effect of the model, and repeat this operation until the model converges to a satisfactory accuracy rate.
在本申请实施例中,对于待检测FPC图像,统计每个ROI的RGB颜色空间的B通道数值分布直方图,对于单个ROI若变色区域与焊盘面积的比值P大于阈值S2则该FPC为不良品;若S1<P≤S2,则使用训练好的模型f(x)对该ROI进行检测,若检测结果为不良品则该FPC为不良品,若检测结果为良品则检测下一处ROI;若P≤S1,则检测下一处ROI;若所有ROI都为良品则该FPC为良品,否则为不良品。通过判断函数R(X)得到当前FPC的判断结果,当R(X)=0时。当前FPC为良品,否则为不良品,公式如式(1)所示:In the embodiment of this application, for the FPC image to be detected, the B channel value distribution histogram of the RGB color space of each ROI is counted. For a single ROI, if the ratio P of the discoloration area to the pad area is greater than the threshold S2, the FPC is not Good product; if S1<P≤S2, use the trained model f(x) to detect the ROI, if the detection result is a defective product, then the FPC is a defective product, and if the detection result is a good product, then detect the next ROI; If P≤S1, detect the next ROI; if all ROIs are good, the FPC is good, otherwise it is bad. The judgment result of the current FPC is obtained through the judgment function R(X), when R(X)=0. The current FPC is a good product, otherwise it is a defective product. The formula is shown in formula (1):
Figure PCTCN2021140593-appb-000009
Figure PCTCN2021140593-appb-000009
其中,X为当前FPC图像,n为该FPC的ROI的个数Among them, X is the current FPC image, and n is the number of ROIs of the FPC
在步骤S206中,接受携带有待测电路板图像的焊盘检测请求。In step S206, the pad detection request carrying the image of the circuit board to be tested is accepted.
在本申请实施例中,对于FPC的图像获取,采用面阵工业相机在FPC板上方拍摄,传输到计算机的图像采集卡,保存图像文件。In the embodiment of the present application, for the image acquisition of the FPC, an area array industrial camera is used to shoot above the FPC board, and the image file is transmitted to the image acquisition card of the computer to save the image file.
在步骤S207中,将待测电路板图像输入至目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果。In step S207, the image of the circuit board to be tested is input to the target ResNet neural network model to perform a pad detection operation, and a pad detection result is obtained.
在步骤S208中,输出焊盘检测结果。In step S208, the detection result of the pad is output.
在本申请实施例中,提供了一种应用于柔性电路板的焊盘检测方法,包括:接受携带有电路板样本图像以及焊盘位置信息的模型训练请求;根据焊盘位置信息对电路板样本图像进行分割操作,得到焊盘样本图像;将焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;接收终端设备发送的焊盘标注图像,焊盘标注图像为携带有标注信息的焊盘样本图像,标注信息为良品信息或者不良品信息;调用原始ResNet神经网络模型,并以焊盘样本图像作为训练数据、标注信息为结果数据对原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;接受携带有待测电路板图像的焊盘检测请求;将待测电路板图像输入至目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;输出焊盘检测结果。本申请通过精确标注出每种产品的焊盘位置坐标,使用程序解析每种焊盘的焊盘位置坐标,再对解析出的坐标进行局部校准,最后使用ResNet神经网络模型检测柔性电路板(FPC)图像上标注出的区域,能大幅度提高检测精度与速度。In the embodiment of the present application, a pad detection method applied to a flexible circuit board is provided, including: accepting a model training request carrying a circuit board sample image and pad position information; The image is segmented to obtain the pad sample image; the pad sample image is sent to the terminal device for labeling of the pad sample image; the pad label image sent by the terminal device is received, and the pad label image carries label information pad sample image, the label information is good product information or defective product information; the original ResNet neural network model is called, and the model training operation is performed on the original ResNet neural network model with the pad sample image as the training data and the label information as the result data. The target ResNet neural network model used to identify the quality of the pad image; accept the pad detection request carrying the image of the circuit board to be tested; input the image of the circuit board to be tested into the target ResNet neural network model for the pad detection operation, and obtain the pad Detection result; output pad detection result. This application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network model to detect the flexible circuit board (FPC ) area marked on the image can greatly improve the detection accuracy and speed.
在本实施例的一些可选的实现方式中,在步骤S205之前,还包括:In some optional implementation manners of this embodiment, before step S205, further include:
根据特征法对焊盘样本图像进行预分类操作,得到焊盘形状相似的多组焊盘样本图像。The pad sample images are pre-classified according to the feature method, and multiple groups of pad sample images with similar pad shapes are obtained.
在本申请实施例中,为了通用性,即我们只检测焊盘,而不管产品图片的形状,要为每种图片配一份JSON文件,其中标注待检测焊盘的轮廓坐标。因为每张图片都是相机在整张大板上移动拍出来的,会与JSON文件标记的坐标有一定的偏差,所以需要配准。In the embodiment of this application, for the sake of generality, that is, we only detect the pads, regardless of the shape of the product picture, a JSON file should be prepared for each picture, which marks the outline coordinates of the pads to be tested. Because each picture is taken by the camera moving across the entire board, there will be a certain deviation from the coordinates marked in the JSON file, so registration is required.
配准之后将当前图片的焊盘图片切下来作为测试集。After registration, cut out the pad picture of the current picture as a test set.
根据项目背景,我们知道尽管每种FPC焊盘的形状都不尽相同,但是其中不变的是每种FPC板里都有原型焊盘,所以可以通过原型焊盘来配准。According to the project background, we know that although the shape of each FPC pad is different, what remains unchanged is that each FPC board has a prototype pad, so it can be registered through the prototype pad.
配准步骤:Registration steps:
为了节省成本等考虑,在电路板生产中会将多张电路板拼版,将拼合板传至步骤2所述图像采集系统时因根据移动相机或移动拼合板的方法采集每张电路板的图像,所以对应的JSON文件所含位置坐标相对电路板图像焊盘位置会产生相对偏移。在电路板设计中会设置Mark点用来帮助贴片机光学定位,本方法亦利用该点为JSON文件与电路板图像配准。In order to save costs and other considerations, multiple circuit boards will be made up in the production of circuit boards, and when the spliced boards are passed to the image acquisition system described in step 2, the image of each circuit board will be collected according to the method of moving the camera or moving the spliced boards. Therefore, the position coordinates contained in the corresponding JSON file will have a relative offset relative to the position of the pad on the circuit board image. In the circuit board design, Mark points are set to help the optical positioning of the placement machine. This method also uses this point to register the JSON file and the circuit board image.
Mark点是由标记点和空旷区组成的,如图3所示。Mark points are composed of mark points and open areas, as shown in Figure 3.
本方法提出基于圆环的实心圆匹配算法,算法首先根据JSON文件中Mark点标记区坐标生成一个圆环形模板,圆环内直径小于Mark标记区边缘直径1像素,圆环外直径大于Mark边缘直径1像素。将模板按45度和135度分为4个圆弧如图4所示。This method proposes a ring-based solid circle matching algorithm. The algorithm first generates a circular template based on the coordinates of the Mark point marking area in the JSON file. The inner diameter of the ring is 1 pixel smaller than the edge diameter of the Mark marking area, and the outer diameter of the ring is larger than the Mark edge. 1 pixel in diameter. Divide the template into 4 arcs at 45 degrees and 135 degrees, as shown in Figure 4.
记上下左右侧内外圆弧上像素值集合分别为Ui、Uo、Di、Do、Li、Lo、Ri、Ro,由Mark点的标记区和空旷区颜色特征不同,设置识别阈值δ,根据式(2)(3)计算出X轴与Y轴偏移距离,更新模板坐标将模板内环完全移至Mark点标记区内侧,且模板外环处于Mark点标记区外侧。Note that the sets of pixel values on the upper, lower, left, and right sides of the inner and outer arcs are Ui, Uo, Di, Do, Li, Lo, Ri, Ro, respectively. The color characteristics of the marked area and the open area of the Mark point are different, and the recognition threshold δ is set. According to the formula ( 2) (3) Calculate the offset distance between the X-axis and the Y-axis, update the template coordinates to completely move the inner ring of the template to the inner side of the Mark point marking area, and the outer ring of the template is outside the Mark point marking area.
Figure PCTCN2021140593-appb-000010
Figure PCTCN2021140593-appb-000010
Figure PCTCN2021140593-appb-000011
Figure PCTCN2021140593-appb-000011
其中x offset表示模板相对与当前电路板图像横向偏移距离,y offset表示模板相对与当前电路板图像纵向偏移距离。 Where x offset represents the horizontal offset distance of the template relative to the current circuit board image, and y offset represents the vertical offset distance of the template relative to the current circuit board image.
配准之后,首先根据JSON文件中焊盘坐标将电路板图像的非待检测区域像素值置0,再根据公式4计算出每个焊盘的最小矩形包围框,After registration, first set the pixel value of the non-to-be-detected area of the circuit board image to 0 according to the pad coordinates in the JSON file, and then calculate the minimum rectangular bounding box of each pad according to formula 4,
Figure PCTCN2021140593-appb-000012
Figure PCTCN2021140593-appb-000012
其中(x 0,y 0)为包围框左上角点,(x 1,y 1)为包围框右下角点,X,Y为焊盘的横轴坐标集合与纵轴坐标集合。在电路板图像上根据上述两点坐标确定最小包围框切割出焊盘图像并保存至数据集,从而生成背景为黑色即非焊盘区域像素值为0的单焊盘图像数据集。 Wherein (x 0 , y 0 ) is the upper left corner point of the bounding box, (x 1 , y 1 ) is the lower right corner point of the bounding box, X, Y are the horizontal axis coordinate set and the vertical axis coordinate set of the pad. On the circuit board image, the minimum bounding box is determined according to the coordinates of the above two points to cut out the pad image and save it to the dataset, thereby generating a single pad image dataset with a black background, that is, a pixel value of 0 in the non-pad area.
在本申请实施例中,在生成背景为黑色即非焊盘区域像素值为0的单焊盘图像数据集后,为提供后续神经网络模型训练所需数据集,需将现有数据集分为有缺陷数据集与无缺陷数据集。由于数据量不是很大,可以人工筛选数据,也可以通过提取明显缺陷特征对数据集进行初步筛选再人工筛选,可减轻工作量。本实施例检测焊盘变色缺陷,判断一个焊盘是否含有缺陷需判断变色面积是否超过允许的比例,变色的程度是否超过允许的程度、和若产生彩虹状变色即颜色突变则无论变色面积大小都判为有缺陷。因图像采集系统采集到的无缺陷焊盘颜色白亮,有缺陷区域颜色偏红或偏黄,由RGB色彩空间可知,从颜色白亮到红色或黄色主要与蓝色通道像素值下降相关,本实施例根据此颜色特征对数据集初步筛选,再人工筛选确认分为有缺陷数据集与无缺陷数据集。In the embodiment of this application, after generating a single pad image data set with a black background, that is, a pixel value of 0 in the non-pad area, in order to provide the data set required for subsequent neural network model training, the existing data set needs to be divided into Defective and non-defective datasets. Since the amount of data is not very large, the data can be manually screened, or the data set can be preliminarily screened by extracting obvious defect features and then manually screened, which can reduce the workload. This embodiment detects the discoloration defect of the pad, and judging whether a pad contains a defect needs to judge whether the discoloration area exceeds the allowable ratio, whether the degree of discoloration exceeds the allowable degree, and if a rainbow-like discoloration occurs, that is, a sudden color change, no matter the size of the discoloration area. judged to be defective. Because the color of the non-defective pads collected by the image acquisition system is white and bright, and the color of the defective area is reddish or yellowish, it can be seen from the RGB color space that the change from bright white to red or yellow is mainly related to the decrease in the pixel value of the blue channel. According to this color feature, the data set is initially screened, and then manually screened to confirm that it is divided into a defective data set and a non-defective data set.
考虑到实际图像采集系统采集电路板图像时光照强度可能会产生轻微变化,本实施例对数据集进行加强。根据RGB色彩空间与HSV色彩空间的转换公式可知只需修改max(R,G,B)的值即可模拟光照强度的改变,根据此方法对1/3的数据做max(R,G,B)=max(R,G,B)±d操作即可得到强化后的数据集。Considering that the light intensity may change slightly when the actual image acquisition system acquires the circuit board image, this embodiment strengthens the data set. According to the conversion formula between RGB color space and HSV color space, it can be known that only the value of max(R,G,B) can be modified to simulate the change of light intensity. According to this method, max(R,G,B )=max(R,G,B)±d operation to get the enhanced data set.
在本实施例的一些可选的实现方式中,考虑到实际图像采集系统采集电路板图像时光照强度可能会产生轻微变化,本实施例对数据集进行加强。根据RGB色彩空间与HSV色彩空间的转换公式可知只需修改max(R,G,B)的值即可模拟光照强度的改变,根据此方法对1/3的数据做max(R,G,B)=max(R,G,B)±d操作即可得到强化后的数据集。In some optional implementation manners of this embodiment, considering that the light intensity may slightly change when the actual image acquisition system acquires the circuit board image, this embodiment strengthens the data set. According to the conversion formula between RGB color space and HSV color space, it can be known that only the value of max(R,G,B) can be modified to simulate the change of light intensity. According to this method, max(R,G,B )=max(R,G,B)±d operation to get the enhanced data set.
综上所述,本申请提供了一种应用于柔性电路板的焊盘检测方法,包括:接受携带有电路板样本图像以及焊盘位置信息的模型训练请求;根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;调用原始ResNet神经网络模型,并以所述 焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;接受携带有待测电路板图像的焊盘检测请求;将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;输出所述焊盘检测结果。本申请针对生产商提供的不同尺寸的FPC板上包含多个不规则形状的焊盘,研究基于神经网络的FPC焊盘缺陷检测算法的设计与系统的实现,在满足基本检测要求的同时,提升缺陷检测的效率。肉眼检查的检测方法容易受到主观因素和客观因素的影响,无法保证结果的正确性,而且检查过程十分耗时,该系统可以很好地解决这些问题,符合我们对于缺陷检测的期望,并且兼备了具有通用性和稳定两方面的优势。To sum up, this application provides a pad detection method applied to flexible circuit boards, including: accepting a model training request carrying a circuit board sample image and pad position information; The circuit board sample image is segmented to obtain a pad sample image; the pad sample image is sent to the terminal device for labeling the pad sample image; the pad label image sent by the terminal device is received, and the The pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information; the original ResNet neural network model is called, and the pad sample image is used as training data, and the annotation The information is the result data, and the model training operation is performed on the original ResNet neural network model to obtain the target ResNet neural network model used to identify the quality of the pad image; accept the pad detection request carrying the image of the circuit board to be tested; The test circuit board image is input to the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result; and the pad detection result is output. This application aims at the FPC boards of different sizes provided by manufacturers that contain multiple irregularly shaped pads, and studies the design and system implementation of FPC pad defect detection algorithms based on neural networks, while meeting the basic detection requirements and improving Efficiency of defect detection. The detection method of visual inspection is easily affected by subjective and objective factors, the correctness of the results cannot be guaranteed, and the inspection process is very time-consuming. This system can solve these problems well, meets our expectations for defect detection, and has both It has the advantages of versatility and stability.
实验完成的内容和成效如下:The content and results of the experiment are as follows:
(1)基于JSON文件标注焊盘坐标对样本图像和模板图像进行配准,针对整张FPC图片尺寸较大,传统的模板匹配算法对于旋转、平移后的图像不能很好地匹配到的问题,首先利用JSON文件将焊盘标记出来,针对圆形焊盘来进行图像配准,提高了匹配的准确率和速度,然后提出先做局部的模板匹配找出特征点,再根据特征点做仿射变换的方法,实现样本图片与模板图片配准。(1) Register the sample image and the template image based on the coordinates of the pads marked in the JSON file. In view of the large size of the entire FPC image, the traditional template matching algorithm cannot match the rotated and translated image well. First, use the JSON file to mark the pads, and perform image registration for the circular pads, which improves the accuracy and speed of matching, and then proposes to do local template matching to find the feature points, and then do affine according to the feature points The transformation method realizes the registration of the sample image and the template image.
(2)研究相关图像处理算法,针对焊盘缺陷,设计基于神经网络的FPC缺陷提取算法流程和分类方法。样本图和模板图中因光线和尺寸差别,以及图像在采集、传输、成像等过程中产生的噪声,作差结果中会包含缺陷和非缺陷部分产生的差异,针对这个问题,本文运用了修改图像亮度增强数据集,首先使用数据集训练网络模型,再对每一张图片配准之后,切分出焊盘,最后使用训练好的resnet网络模型检测且分出的焊盘,实现缺陷分类算法,最后实现缺陷检测与分类。(2) Study the relevant image processing algorithm, and design the FPC defect extraction algorithm flow and classification method based on neural network for pad defects. Due to the difference in light and size between the sample image and the template image, as well as the noise generated in the process of image acquisition, transmission, imaging, etc., the error result will include the difference between the defect and the non-defect part. To solve this problem, this paper uses the modified Image brightness enhancement data set, first use the data set to train the network model, and then segment out the pads after registering each picture, and finally use the trained resnet network model to detect and separate the pads to realize the defect classification algorithm , and finally realize defect detection and classification.
(3)基于现有的机械结构,针对FPC缺陷检测系统的总体需求,设计了工艺流程和总体方案,并完成了硬件部分和软件部分的联调与通信,完成图像的采集。(3) Based on the existing mechanical structure and the overall requirements of the FPC defect detection system, the process flow and overall scheme are designed, and the joint debugging and communication of the hardware part and the software part are completed, and the image acquisition is completed.
(4)最后,根据需求分析和论文的研究目标,重点阐述了整个缺陷检测系统的组成、系统的工艺流程、缺陷检测流程,集成了FPC焊盘检测与分类、可追溯检测数据的可视化系统,经过实验,保证软件的准确性与效率。(4) Finally, according to the requirements analysis and the research objectives of the thesis, it focuses on the composition of the entire defect detection system, the systematic process flow, and the defect detection process. It integrates the visual system of FPC pad detection and classification, and traceable detection data. After experiments, the accuracy and efficiency of the software are guaranteed.
本申请可用于众多通用或专用的计算机系统环境或配置中。例如:个人计算机、服务器计算机、手持设备或便携式设备、平板型设备、多处理器系统、基于微处理器的系统、置顶盒、可编程的消费电子设备、网络PC、小型计算机、大型计算机、包括以上任何系统或设备的分布式计算环境等等。本申请可以在由计 算机执行的计算机可执行指令的一般上下文中描述,例如程序模块。一般地,程序模块包括执行特定任务或实现特定抽象数据类型的例程、程序、对象、组件、数据结构等等。也可以在分布式计算环境中实践本申请,在这些分布式计算环境中,由通过通信网络而被连接的远程处理设备来执行任务。在分布式计算环境中,程序模块可以位于包括存储设备在内的本地和远程计算机存储介质中。The application can be used in numerous general purpose or special purpose computer system environments or configurations. Examples: personal computers, server computers, handheld or portable devices, tablet-type devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, including A distributed computing environment for any of the above systems or devices, etc. This application may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types. The application may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules may be located in both local and remote computer storage media including storage devices.
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流程,是可以通过计算机可读指令来指令相关的硬件来完成,该计算机可读指令可存储于一计算机可读取存储介质中,该计算机可读指令在执行时,可包括如上述各方法的实施例的流程。其中,前述的存储介质可为磁碟、光盘、只读存储记忆体(Read-Only Memory,ROM)等非易失性存储介质,或随机存储记忆体(Random Access Memory,RAM)等。Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be implemented by instructing related hardware through computer-readable instructions, and the computer-readable instructions can be stored in a computer-readable storage medium. , when the computer-readable instructions are executed, they may include the processes of the embodiments of the above-mentioned methods. Wherein, the aforementioned storage medium may be a nonvolatile storage medium such as a magnetic disk, an optical disk, a read-only memory (Read-Only Memory, ROM), or a random access memory (Random Access Memory, RAM).
应该理解的是,虽然附图的流程图中的各个步骤按照箭头的指示依次显示,但是这些步骤并不是必然按照箭头指示的顺序依次执行。除非本文中有明确的说明,这些步骤的执行并没有严格的顺序限制,其可以以其他的顺序执行。而且,附图的流程图中的至少一部分步骤可以包括多个子步骤或者多个阶段,这些子步骤或者阶段并不必然是在同一时刻执行完成,而是可以在不同的时刻执行,其执行顺序也不必然是依次进行,而是可以与其他步骤或者其他步骤的子步骤或者阶段的至少一部分轮流或者交替地执行。It should be understood that although the various steps in the flow chart of the accompanying drawings are displayed sequentially according to the arrows, these steps are not necessarily executed sequentially in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages may not necessarily be executed at the same time, but may be executed at different times, and the order of execution is also It is not necessarily performed sequentially, but may be performed alternately or alternately with at least a part of other steps or sub-steps or stages of other steps.
实施例二Embodiment two
进一步参考图5,作为对上述图2所示方法的实现,本申请提供了一种应用于柔性电路板的焊盘检测装置的一个实施例,该装置实施例与图2所示的方法实施例相对应,该装置具体可以应用于各种电子设备中。Further referring to FIG. 5 , as an implementation of the method shown in FIG. 2 above, the present application provides an embodiment of a pad detection device applied to a flexible circuit board. This device embodiment is the same as the method embodiment shown in FIG. 2 Correspondingly, the device can be specifically applied to various electronic devices.
如图5所示,本实施例所述的应用于柔性电路板的焊盘检测装置200包括:训练请求接收模块210、分割操作模块220、标注发送模块230、标注接收模块240、模型训练模块250、检测请求接收模块260、焊盘检测模块270以及结果输出模块280。其中:As shown in FIG. 5 , the pad detection device 200 applied to a flexible circuit board described in this embodiment includes: a training request receiving module 210, a segmentation operation module 220, a label sending module 230, a label receiving module 240, and a model training module 250 , a detection request receiving module 260 , a pad detection module 270 and a result output module 280 . in:
训练请求接收模块210,用于接收携带有电路板样本图像以及焊盘位置信息的模型训练请求;The training request receiving module 210 is configured to receive a model training request carrying circuit board sample images and pad position information;
分割操作模块220,用于根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;A segmentation operation module 220, configured to perform a segmentation operation on the circuit board sample image according to the pad position information to obtain a pad sample image;
标注发送模块230,用于将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;An annotation sending module 230, configured to send the pad sample image to a terminal device, so as to perform an annotation operation on the pad sample image;
标注接收模块240,用于接收所述终端设备发送的焊盘标注图像,所述焊盘 标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息; Annotation receiving module 240, configured to receive the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
模型训练模块250,用于调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;The model training module 250 is used to call the original ResNet neural network model, and use the pad sample image as training data and the labeling information as result data to perform model training operations on the original ResNet neural network model to obtain Target ResNet neural network model for pad image quality;
检测请求接收模块260,用于接受携带有待测电路板图像的焊盘检测请求;The detection request receiving module 260 is configured to accept a pad detection request carrying an image of the circuit board to be tested;
焊盘检测模块270,用于将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;The pad detection module 270 is configured to input the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result;
结果输出模块280,用于输出所述焊盘检测结果。The result output module 280 is configured to output the detection result of the pad.
在本申请实施例中,在接收模型训练请求之前,需要对样板图像使用多边形框进行手工标注,获取焊盘位置,即待检测的感兴趣区域ROI,将坐标位置存储到Json文件。In this embodiment of the application, before receiving the model training request, it is necessary to manually mark the template image with a polygon frame to obtain the position of the pad, that is, the region of interest ROI to be detected, and store the coordinate position in the Json file.
在本申请实施例中,在制作焊盘样本图像时,使用最小包围框算法框住ROI区域,切割出1000张图像的ROI图像。In the embodiment of the present application, when making the pad sample image, the minimum bounding box algorithm is used to frame the ROI area, and the ROI images of 1000 images are cut out.
在本申请实施例中,不同产品的前景排布都不相同,每更换一批产品时,首先采用手工标注的方式用最小矩形包围框在样图上标注所有需检测的前景区域位置得到C i(x,y,w,h)∈C,其中x,y为最小包围框的左上角点横纵坐标,w,h为最小包围框的宽和高。 In the embodiment of this application, the foreground layouts of different products are different. When replacing a batch of products, first use manual labeling to mark all the foreground area positions to be detected on the sample image with the smallest rectangular bounding box to obtain C i (x, y, w, h)∈C, where x, y are the horizontal and vertical coordinates of the upper left corner of the smallest bounding box, and w, h are the width and height of the smallest bounding box.
在本实施例的一些可选的实现方式中,通常待检测焊盘区域是不规则形状,最小包围框内还剩有一部分背景区域,根据焊盘区域和背景的亮度差异,将图像从RGB颜色空间转换为HSV颜色空间,转换公式为In some optional implementations of this embodiment, the pad area to be detected is usually irregular in shape, and there is still a part of the background area in the minimum bounding box. According to the brightness difference between the pad area and the background, the image is converted from RGB color to The space is converted to the HSV color space, and the conversion formula is
Figure PCTCN2021140593-appb-000013
Figure PCTCN2021140593-appb-000013
Figure PCTCN2021140593-appb-000014
Figure PCTCN2021140593-appb-000014
V=maxV=max
其中max=max(r,g,b),min=min(r,g,b),转换到HSV空间后使用Otsu法对H通道自动阈值分割,将背景区域的值置零。Where max=max(r,g,b), min=min(r,g,b), after converting to HSV space, use the Otsu method to automatically threshold the H channel, and set the value of the background area to zero.
在本申请实施例中,人工标注切割出来的ROI图像为良品或不良品。In the embodiment of the present application, the cut ROI image is manually marked as a good product or a defective product.
在本申请实施例中,ResNet是由He等人在2015年的ImageNet挑战赛中提 出的网络结构,缓解了随着网络深度的加深,网络的性能反而退化的问题。在论文Deep Residual Learning for Image Recognition中的实验发现深度网络出现了退化问题(Degradation problem):网络深度增加时,网络准确度出现饱和,甚至出现下降。这个现象可以在图中直观看出来:56层的网络比20层网络效果还要差。这不会是过拟合问题,因为56层网络的训练误差同样高。因为深层网络存在着梯度消失或者爆炸的问题,这使得深度学习模型很难训练。In the embodiment of this application, ResNet is a network structure proposed by He et al. in the 2015 ImageNet Challenge, which alleviates the problem that the performance of the network degrades with the deepening of the network depth. The experiment in the paper Deep Residual Learning for Image Recognition found that the deep network has a degradation problem (Degradation problem): when the network depth increases, the network accuracy is saturated or even declines. This phenomenon can be seen directly in the figure: the 56-layer network is even worse than the 20-layer network. This would not be an overfitting problem, since the training error is equally high for a 56-layer network. Because the deep network has the problem of gradient disappearance or explosion, which makes the deep learning model difficult to train.
在本申请实施例中,对于一个堆积层结构(几层堆积而成)当输入为x时其学习到的特征记为H(x),现在我们希望其可以学习到残差F(x)=H(x)-x,这样其实原始的学习特征是F(x)+x。残差学习相比原始特征直接学习更容易,因为当残差为0时,此时堆积层仅仅做了恒等映射,至少网络性能不会下降,实际上残差不会为0,这也会使得堆积层在输入特征基础上学习到新的特征,从而拥有更好的性能。In the embodiment of this application, for a stacked layer structure (several layers stacked) when the input is x, the learned features are denoted as H(x), and now we hope that it can learn the residual F(x)= H(x)-x, so the original learning feature is F(x)+x. Residual learning is easier than direct learning of original features, because when the residual is 0, the accumulation layer only does the identity mapping at this time, at least the network performance will not decline, in fact the residual will not be 0, which will also This enables the stacking layer to learn new features based on the input features, resulting in better performance.
在本申请实施例中,在“Halcon”现有的深度学习包里面就采用了ResNet50网络,说明其在工业检测具有一定的可靠性。因此本文采用ResNet网络,结合通道间信息来检测焊盘缺陷。网络结构由卷积、池化、改进残差块与线性分类器组成。输入特征经过卷积、批量正则化、池化、再重复上述的流程,最后将输出与输入特征按像素进行叠加作为下一次的输入;在卷积过后提取每个通道所占的重要性,使其与卷积过后的特征层进行相乘,最后与输入特征进行相加,从而使卷积获得局部区域的空间与通道的融合信息。In the embodiment of this application, the ResNet50 network is used in the existing deep learning package of "Halcon", which shows that it has certain reliability in industrial inspection. Therefore, this paper uses the ResNet network to detect pad defects combined with inter-channel information. The network structure consists of convolution, pooling, improved residual block and linear classifier. The input features undergo convolution, batch regularization, pooling, and then repeat the above process, and finally the output and input features are superimposed pixel by pixel as the next input; after convolution, the importance of each channel is extracted, so that It is multiplied by the feature layer after convolution, and finally added to the input feature, so that the convolution can obtain the fusion information of the space and channel of the local area.
在本申请实施例中,良品与不良品图像按照3:1的比例分为训练集与验证集。向网络输入训练集样本,采用BP算法对模型权值更新,向网络输入验证集,验证模型的效果,循环此操作直至模型收敛到满意的准确率。In the embodiment of the present application, images of good products and defective products are divided into a training set and a verification set according to a ratio of 3:1. Input the training set samples to the network, use the BP algorithm to update the model weights, input the verification set to the network, verify the effect of the model, and repeat this operation until the model converges to a satisfactory accuracy rate.
在本申请实施例中,对于待检测FPC图像,统计每个ROI的RGB颜色空间的B通道数值分布直方图,对于单个ROI若变色区域与焊盘面积的比值P大于阈值S2则该FPC为不良品;若S1<P≤S2,则使用训练好的模型f(x)对该ROI进行检测,若检测结果为不良品则该FPC为不良品,若检测结果为良品则检测下一处ROI;若P≤S1,则检测下一处ROI;若所有ROI都为良品则该FPC为良品,否则为不良品。通过判断函数R(X)得到当前FPC的判断结果,当R(X)=0时。当前FPC为良品,否则为不良品,公式如式(1)所示:In the embodiment of this application, for the FPC image to be detected, the B channel value distribution histogram of the RGB color space of each ROI is counted. For a single ROI, if the ratio P of the discoloration area to the pad area is greater than the threshold S2, the FPC is not Good product; if S1<P≤S2, use the trained model f(x) to detect the ROI, if the detection result is a defective product, then the FPC is a defective product, and if the detection result is a good product, then detect the next ROI; If P≤S1, detect the next ROI; if all ROIs are good, the FPC is good, otherwise it is bad. The judgment result of the current FPC is obtained through the judgment function R(X), when R(X)=0. The current FPC is a good product, otherwise it is a defective product. The formula is shown in formula (1):
Figure PCTCN2021140593-appb-000015
Figure PCTCN2021140593-appb-000015
其中,X为当前FPC图像,n为该FPC的ROI的个数Among them, X is the current FPC image, and n is the number of ROIs of the FPC
在本申请实施例中,对于FPC的图像获取,采用面阵工业相机在FPC板上方 拍摄,传输到计算机的图像采集卡,保存图像文件。In the embodiment of the present application, for the image acquisition of the FPC, an area array industrial camera is used to shoot above the FPC board, and the image acquisition card transmitted to the computer saves the image file.
在本申请实施例中,提供了一种应用于柔性电路板的焊盘检测装置200,包括:训练请求接收模块210,用于接收携带有电路板样本图像以及焊盘位置信息的模型训练请求;分割操作模块220,用于根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;标注发送模块230,用于将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;标注接收模块240,用于接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;模型训练模块250,用于调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;检测请求接收模块260,用于接受携带有待测电路板图像的焊盘检测请求;焊盘检测模块270,用于将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;结果输出模块280,用于输出所述焊盘检测结果。本申请通过精确标注出每种产品的焊盘位置坐标,使用程序解析每种焊盘的焊盘位置坐标,再对解析出的坐标进行局部校准,最后使用ResNet神经网络模型检测柔性电路板(FPC)图像上标注出的区域,能大幅度提高检测精度与速度。In the embodiment of the present application, a pad detection device 200 applied to a flexible circuit board is provided, including: a training request receiving module 210, configured to receive a model training request carrying a circuit board sample image and pad position information; The segmentation operation module 220 is configured to segment the circuit board sample image according to the pad position information to obtain a pad sample image; the label sending module 230 is configured to send the pad sample image to a terminal device, to perform labeling operations on pad sample images; the label receiving module 240 is configured to receive the pad label image sent by the terminal device, the pad label image is a bond sample image carrying label information, and the label information It is good product information or defective product information; the model training module 250 is used to call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform the original ResNet neural network model The model training operation obtains the target ResNet neural network model for identifying the image quality of the pad; the detection request receiving module 260 is used to accept the pad detection request carrying the image of the circuit board to be tested; the pad detection module 270 is used to The image of the circuit board to be tested is input to the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result; the result output module 280 is configured to output the pad detection result. This application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network model to detect the flexible circuit board (FPC ) area marked on the image can greatly improve the detection accuracy and speed.
在本实施例的一些可选的实现方式中,上述应用于柔性电路板的焊盘检测装置200还包括:In some optional implementations of this embodiment, the above-mentioned pad detection device 200 applied to a flexible circuit board further includes:
预分类模块,用于根据特征法对所述焊盘样本图像进行预分类操作,得到焊盘形状相似的多组焊盘样本图像。The pre-classification module is configured to perform a pre-classification operation on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
在本申请实施例中,为了通用性,即我们只检测焊盘,而不管产品图片的形状,要为每种图片配一份JSON文件,其中标注待检测焊盘的轮廓坐标。因为每张图片都是相机在整张大板上移动拍出来的,会与JSON文件标记的坐标有一定的偏差,所以需要配准。In the embodiment of this application, for the sake of generality, that is, we only detect the pads, regardless of the shape of the product picture, a JSON file should be prepared for each picture, which marks the outline coordinates of the pads to be tested. Because each picture is taken by the camera moving across the entire board, there will be a certain deviation from the coordinates marked in the JSON file, so registration is required.
配准之后将当前图片的焊盘图片切下来作为测试集。After registration, cut out the pad picture of the current picture as a test set.
根据项目背景,我们知道尽管每种FPC焊盘的形状都不尽相同,但是其中不变的是每种FPC板里都有原型焊盘,所以可以通过原型焊盘来配准。According to the project background, we know that although the shape of each FPC pad is different, what remains unchanged is that each FPC board has a prototype pad, so it can be registered through the prototype pad.
配准步骤:Registration steps:
为了节省成本等考虑,在电路板生产中会将多张电路板拼版,将拼合板传至步骤2所述图像采集系统时因根据移动相机或移动拼合板的方法采集每张电路板的图像,所以对应的JSON文件所含位置坐标相对电路板图像焊盘位置会产生相对偏移。在电路板设计中会设置Mark点用来帮助贴片机光学定位,本方法亦 利用该点为JSON文件与电路板图像配准。In order to save costs and other considerations, multiple circuit boards will be made up in the production of circuit boards, and when the spliced boards are passed to the image acquisition system described in step 2, the image of each circuit board will be collected according to the method of moving the camera or moving the spliced boards. Therefore, the position coordinates contained in the corresponding JSON file will have a relative offset relative to the position of the pad on the circuit board image. In the circuit board design, Mark points are set to help the optical positioning of the placement machine. This method also uses this point to register the JSON file and the circuit board image.
Mark点是由标记点和空旷区组成的,如图3所示。Mark points are composed of mark points and open areas, as shown in Figure 3.
本方法提出基于圆环的实心圆匹配算法,算法首先根据JSON文件中Mark点标记区坐标生成一个圆环形模板,圆环内直径小于Mark标记区边缘直径1像素,圆环外直径大于Mark边缘直径1像素。将模板按45度和135度分为4个圆弧如图4所示。This method proposes a ring-based solid circle matching algorithm. The algorithm first generates a circular template based on the coordinates of the Mark point marking area in the JSON file. The inner diameter of the ring is 1 pixel smaller than the edge diameter of the Mark marking area, and the outer diameter of the ring is larger than the Mark edge. 1 pixel in diameter. Divide the template into 4 arcs at 45 degrees and 135 degrees, as shown in Figure 4.
记上下左右侧内外圆弧上像素值集合分别为Ui、Uo、Di、Do、Li、Lo、Ri、Ro,由Mark点的标记区和空旷区颜色特征不同,设置识别阈值δ,根据式(2)(3)计算出X轴与Y轴偏移距离,更新模板坐标将模板内环完全移至Mark点标记区内侧,且模板外环处于Mark点标记区外侧。Note that the sets of pixel values on the upper, lower, left, and right sides of the inner and outer arcs are Ui, Uo, Di, Do, Li, Lo, Ri, Ro, respectively. The color characteristics of the marked area and the open area of the Mark point are different, and the recognition threshold δ is set. According to the formula ( 2) (3) Calculate the offset distance between the X-axis and the Y-axis, update the template coordinates to completely move the inner ring of the template to the inner side of the Mark point marking area, and the outer ring of the template is outside the Mark point marking area.
Figure PCTCN2021140593-appb-000016
Figure PCTCN2021140593-appb-000016
Figure PCTCN2021140593-appb-000017
Figure PCTCN2021140593-appb-000017
其中x offset表示模板相对与当前电路板图像横向偏移距离,y offset表示模板相对与当前电路板图像纵向偏移距离。 Where x offset represents the horizontal offset distance of the template relative to the current circuit board image, and y offset represents the vertical offset distance of the template relative to the current circuit board image.
配准之后,首先根据JSON文件中焊盘坐标将电路板图像的非待检测区域像素值置0,再根据公式4计算出每个焊盘的最小矩形包围框,After registration, first set the pixel value of the non-to-be-detected area of the circuit board image to 0 according to the pad coordinates in the JSON file, and then calculate the minimum rectangular bounding box of each pad according to formula 4,
Figure PCTCN2021140593-appb-000018
Figure PCTCN2021140593-appb-000018
其中(x 0,y 0)为包围框左上角点,(x 1,y 1)为包围框右下角点,X,Y为焊盘的横轴坐标集合与纵轴坐标集合。在电路板图像上根据上述两点坐标确定最小包围框切割出焊盘图像并保存至数据集,从而生成背景为黑色即非焊盘区域像素值为0的单焊盘图像数据集。 Where (x 0 , y 0 ) is the upper left corner point of the bounding box, (x 1 , y 1 ) is the lower right corner point of the bounding box, and X, Y are the horizontal axis coordinate set and the vertical axis coordinate set of the pad. On the circuit board image, the minimum bounding box is determined according to the coordinates of the above two points to cut out the pad image and save it to the dataset, thereby generating a single pad image dataset with a black background, that is, a pixel value of 0 in the non-pad area.
在本申请实施例中,在生成背景为黑色即非焊盘区域像素值为0的单焊盘图像数据集后,为提供后续神经网络模型训练所需数据集,需将现有数据集分为有缺陷数据集与无缺陷数据集。由于数据量不是很大,可以人工筛选数据,也可以通过提取明显缺陷特征对数据集进行初步筛选再人工筛选,可减轻工作量。本实施例检测焊盘变色缺陷,判断一个焊盘是否含有缺陷需判断变色面积是否超过允许的比例,变色的程度是否超过允许的程度、和若产生彩虹状变色即颜色突变则无论变色面积大小都判为有缺陷。因图像采集系统采集到的无缺陷焊盘颜色白 亮,有缺陷区域颜色偏红或偏黄,由RGB色彩空间可知,从颜色白亮到红色或黄色主要与蓝色通道像素值下降相关,本实施例根据此颜色特征对数据集初步筛选,再人工筛选确认分为有缺陷数据集与无缺陷数据集。In the embodiment of this application, after generating a single pad image data set with a black background, that is, a pixel value of 0 in the non-pad area, in order to provide the data set required for subsequent neural network model training, the existing data set needs to be divided into Defective and non-defective datasets. Since the amount of data is not very large, the data can be manually screened, or the data set can be preliminarily screened by extracting obvious defect features and then manually screened, which can reduce the workload. This embodiment detects the discoloration defect of the pad, and judging whether a pad contains a defect needs to judge whether the discoloration area exceeds the allowable ratio, whether the degree of discoloration exceeds the allowable degree, and if a rainbow-like discoloration occurs, that is, a sudden color change, no matter the size of the discoloration area. judged to be defective. Because the color of the non-defective pads collected by the image acquisition system is white and bright, and the color of the defective area is reddish or yellowish, it can be seen from the RGB color space that the change from bright white to red or yellow is mainly related to the decrease in the pixel value of the blue channel. According to this color feature, the data set is initially screened, and then manually screened to confirm that it is divided into a defective data set and a non-defective data set.
考虑到实际图像采集系统采集电路板图像时光照强度可能会产生轻微变化,本实施例对数据集进行加强。根据RGB色彩空间与HSV色彩空间的转换公式可知只需修改max(R,G,B)的值即可模拟光照强度的改变,根据此方法对1/3的数据做max(R,G,B)=max(R,G,B)±d操作即可得到强化后的数据集。Considering that the light intensity may change slightly when the actual image acquisition system acquires the circuit board image, this embodiment strengthens the data set. According to the conversion formula between RGB color space and HSV color space, it can be known that only the value of max(R,G,B) can be modified to simulate the change of light intensity. According to this method, max(R,G,B )=max(R,G,B)±d operation to get the enhanced data set.
在本实施例的一些可选的实现方式中,考虑到实际图像采集系统采集电路板图像时光照强度可能会产生轻微变化,本实施例对数据集进行加强。根据RGB色彩空间与HSV色彩空间的转换公式可知只需修改max(R,G,B)的值即可模拟光照强度的改变,根据此方法对1/3的数据做max(R,G,B)=max(R,G,B)±d操作即可得到强化后的数据集。In some optional implementation manners of this embodiment, considering that the light intensity may slightly change when the actual image acquisition system acquires the circuit board image, this embodiment strengthens the data set. According to the conversion formula between RGB color space and HSV color space, it can be known that only the value of max(R,G,B) can be modified to simulate the change of light intensity. According to this method, max(R,G,B )=max(R,G,B)±d operation to get the enhanced data set.
综上所述,本申请提供了一种应用于柔性电路板的焊盘检测装置200,包括:训练请求接收模块210,用于接收携带有电路板样本图像以及焊盘位置信息的模型训练请求;分割操作模块220,用于根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;标注发送模块230,用于将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;标注接收模块240,用于接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;模型训练模块250,用于调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;检测请求接收模块260,用于接受携带有待测电路板图像的焊盘检测请求;焊盘检测模块270,用于将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;结果输出模块280,用于输出所述焊盘检测结果。本申请针对生产商提供的不同尺寸的FPC板上包含多个不规则形状的焊盘,研究基于神经网络的FPC焊盘缺陷检测算法的设计与系统的实现,在满足基本检测要求的同时,提升缺陷检测的效率。肉眼检查的检测方法容易受到主观因素和客观因素的影响,无法保证结果的正确性,而且检查过程十分耗时,该系统可以很好地解决这些问题,符合我们对于缺陷检测的期望,并且兼备了具有通用性和稳定两方面的优势。In summary, the present application provides a pad detection device 200 applied to flexible circuit boards, including: a training request receiving module 210, configured to receive a model training request carrying circuit board sample images and pad position information; The segmentation operation module 220 is configured to segment the circuit board sample image according to the pad position information to obtain a pad sample image; the label sending module 230 is configured to send the pad sample image to a terminal device, to perform labeling operations on pad sample images; the label receiving module 240 is configured to receive the pad label image sent by the terminal device, the pad label image is a bond sample image carrying label information, and the label information It is good product information or defective product information; the model training module 250 is used to call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform the original ResNet neural network model The model training operation obtains the target ResNet neural network model for identifying the image quality of the pad; the detection request receiving module 260 is used to accept the pad detection request carrying the image of the circuit board to be tested; the pad detection module 270 is used to The image of the circuit board to be tested is input to the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result; the result output module 280 is configured to output the pad detection result. This application aims at the FPC boards of different sizes provided by manufacturers that contain multiple irregularly shaped pads, and studies the design and system implementation of FPC pad defect detection algorithms based on neural networks, while meeting the basic detection requirements and improving Efficiency of defect detection. The detection method of visual inspection is easily affected by subjective and objective factors, the correctness of the results cannot be guaranteed, and the inspection process is very time-consuming. This system can solve these problems well, meets our expectations for defect detection, and has both It has the advantages of versatility and stability.
实验完成的内容和成效如下:The content and results of the experiment are as follows:
(1)基于JSON文件标注焊盘坐标对样本图像和模板图像进行配准,针对整张FPC图片尺寸较大,传统的模板匹配算法对于旋转、平移后的图像不能很好 地匹配到的问题,首先利用JSON文件将焊盘标记出来,针对圆形焊盘来进行图像配准,提高了匹配的准确率和速度,然后提出先做局部的模板匹配找出特征点,再根据特征点做仿射变换的方法,实现样本图片与模板图片配准。(1) Register the sample image and the template image based on the coordinates of the pads marked in the JSON file. In view of the large size of the entire FPC image, the traditional template matching algorithm cannot match the rotated and translated image well. First, use the JSON file to mark the pads, and perform image registration for the circular pads, which improves the accuracy and speed of matching, and then proposes to do local template matching to find the feature points, and then do affine according to the feature points The transformation method realizes the registration of the sample image and the template image.
(2)研究相关图像处理算法,针对焊盘缺陷,设计基于神经网络的FPC缺陷提取算法流程和分类方法。样本图和模板图中因光线和尺寸差别,以及图像在采集、传输、成像等过程中产生的噪声,作差结果中会包含缺陷和非缺陷部分产生的差异,针对这个问题,本文运用了修改图像亮度增强数据集,首先使用数据集训练网络模型,再对每一张图片配准之后,切分出焊盘,最后使用训练好的resnet网络模型检测且分出的焊盘,实现缺陷分类算法,最后实现缺陷检测与分类。(2) Study the relevant image processing algorithm, and design the FPC defect extraction algorithm flow and classification method based on neural network for pad defects. Due to the difference in light and size between the sample image and the template image, as well as the noise generated in the process of image acquisition, transmission, imaging, etc., the error result will include the difference between the defect and the non-defect part. To solve this problem, this paper uses the modified Image brightness enhancement data set, first use the data set to train the network model, and then segment out the pads after registering each picture, and finally use the trained resnet network model to detect and separate the pads to realize the defect classification algorithm , and finally realize defect detection and classification.
(3)基于现有的机械结构,针对FPC缺陷检测系统的总体需求,设计了工艺流程和总体方案,并完成了硬件部分和软件部分的联调与通信,完成图像的采集。(3) Based on the existing mechanical structure and the overall requirements of the FPC defect detection system, the process flow and overall scheme are designed, and the joint debugging and communication of the hardware part and the software part are completed, and the image acquisition is completed.
(4)最后,根据需求分析和论文的研究目标,重点阐述了整个缺陷检测系统的组成、系统的工艺流程、缺陷检测流程,集成了FPC焊盘检测与分类、可追溯检测数据的可视化系统,经过实验,保证软件的准确性与效率。(4) Finally, according to the requirements analysis and the research objectives of the thesis, it focuses on the composition of the entire defect detection system, the systematic process flow, and the defect detection process. It integrates the visual system of FPC pad detection and classification, and traceable detection data. After experiments, the accuracy and efficiency of the software are guaranteed.
为解决上述技术问题,本申请实施例还提供计算机设备。具体请参阅图6,图6为本实施例计算机设备基本结构框图。In order to solve the above technical problems, the embodiment of the present application further provides computer equipment. Please refer to FIG. 6 for details. FIG. 6 is a block diagram of the basic structure of the computer device in this embodiment.
所述计算机设备300包括通过系统总线相互通信连接存储器310、处理器320、网络接口330。需要指出的是,图中仅示出了具有组件310-330的计算机设备300,但是应理解的是,并不要求实施所有示出的组件,可以替代的实施更多或者更少的组件。其中,本技术领域技术人员可以理解,这里的计算机设备是一种能够按照事先设定或存储的指令,自动进行数值计算和/或信息处理的设备,其硬件包括但不限于微处理器、专用集成电路(Application Specific Integrated Circuit,ASIC)、可编程门阵列(Field-Programmable Gate Array,FPGA)、数字处理器(Digital Signal Processor,DSP)、嵌入式设备等。The computer device 300 includes a memory 310 , a processor 320 , and a network interface 330 connected to each other through a system bus for communication. It should be noted that only computer device 300 is shown with components 310-330, but it should be understood that implementation of all illustrated components is not required and that more or fewer components may instead be implemented. Among them, those skilled in the art can understand that the computer device here is a device that can automatically perform numerical calculation and/or information processing according to preset or stored instructions, and its hardware includes but is not limited to microprocessors, dedicated Integrated circuit (Application Specific Integrated Circuit, ASIC), programmable gate array (Field-Programmable Gate Array, FPGA), digital processor (Digital Signal Processor, DSP), embedded devices, etc.
所述计算机设备可以是桌上型计算机、笔记本、掌上电脑及云端服务器等计算设备。所述计算机设备可以与用户通过键盘、鼠标、遥控器、触摸板或声控设备等方式进行人机交互。The computer equipment may be computing equipment such as a desktop computer, a notebook, a palmtop computer, and a cloud server. The computer device can perform human-computer interaction with the user through keyboard, mouse, remote controller, touch panel or voice control device.
所述存储器310至少包括一种类型的可读存储介质,所述可读存储介质包括闪存、硬盘、多媒体卡、卡型存储器(例如,SD或DX存储器等)、随机访问存储器(RAM)、静态随机访问存储器(SRAM)、只读存储器(ROM)、电可擦除可编程只读存储器(EEPROM)、可编程只读存储器(PROM)、磁性存储器、磁盘、光盘 等。在一些实施例中,所述存储器310可以是所述计算机设备300的内部存储单元,例如该计算机设备300的硬盘或内存。在另一些实施例中,所述存储器310也可以是所述计算机设备300的外部存储设备,例如该计算机设备300上配备的插接式硬盘,智能存储卡(Smart Media Card,SMC),安全数字(Secure Digital,SD)卡,闪存卡(Flash Card)等。当然,所述存储器310还可以既包括所述计算机设备300的内部存储单元也包括其外部存储设备。本实施例中,所述存储器310通常用于存储安装于所述计算机设备300的操作系统和各类应用软件,例如应用于柔性电路板的焊盘检测方法的计算机可读指令等。此外,所述存储器310还可以用于暂时地存储已经输出或者将要输出的各类数据。The memory 310 includes at least one type of readable storage medium, and the readable storage medium includes flash memory, hard disk, multimedia card, card-type memory (for example, SD or DX memory, etc.), random access memory (RAM), static Random Access Memory (SRAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), Programmable Read Only Memory (PROM), Magnetic Memory, Magnetic Disk, Optical Disk, etc. In some embodiments, the storage 310 may be an internal storage unit of the computer device 300 , such as a hard disk or memory of the computer device 300 . In other embodiments, the memory 310 can also be an external storage device of the computer device 300, such as a plug-in hard disk equipped on the computer device 300, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, flash memory card (Flash Card), etc. Certainly, the memory 310 may also include both an internal storage unit of the computer device 300 and an external storage device thereof. In this embodiment, the memory 310 is generally used to store the operating system and various application software installed in the computer device 300 , such as computer-readable instructions applied to a pad detection method of a flexible circuit board. In addition, the memory 310 can also be used to temporarily store various types of data that have been output or will be output.
所述处理器320在一些实施例中可以是中央处理器(Central Processing Unit,CPU)、控制器、微控制器、微处理器、或其他数据处理芯片。该处理器320通常用于控制所述计算机设备300的总体操作。本实施例中,所述处理器320用于运行所述存储器310中存储的计算机可读指令或者处理数据,例如运行所述应用于柔性电路板的焊盘检测方法的计算机可读指令。The processor 320 may be a central processing unit (Central Processing Unit, CPU), controller, microcontroller, microprocessor, or other data processing chips in some embodiments. The processor 320 is generally used to control the overall operation of the computer device 300 . In this embodiment, the processor 320 is configured to execute computer-readable instructions stored in the memory 310 or process data, for example, execute computer-readable instructions of the method for detecting pads applied to flexible printed circuit boards.
所述网络接口330可包括无线网络接口或有线网络接口,该网络接口330通常用于在所述计算机设备300与其他电子设备之间建立通信连接。The network interface 330 may include a wireless network interface or a wired network interface, and the network interface 330 is generally used to establish a communication connection between the computer device 300 and other electronic devices.
本申请提供的计算机设备,通过精确标注出每种产品的焊盘位置坐标,使用程序解析每种焊盘的焊盘位置坐标,再对解析出的坐标进行局部校准,最后使用ResNet神经网络模型检测柔性电路板(FPC)图像上标注出的区域,能大幅度提高检测精度与速度。The computer equipment provided by this application accurately marks the position coordinates of the pads of each product, uses the program to analyze the coordinates of the pad positions of each type of pads, and then performs local calibration on the resolved coordinates, and finally uses the ResNet neural network model to detect The area marked on the flexible circuit board (FPC) image can greatly improve the detection accuracy and speed.
本申请还提供了另一种实施方式,即提供一种计算机可读存储介质,所述计算机可读存储介质存储有计算机可读指令,所述计算机可读指令可被至少一个处理器执行,以使所述至少一个处理器执行如上述的应用于柔性电路板的焊盘检测方法的步骤。The present application also provides another implementation manner, which is to provide a computer-readable storage medium, the computer-readable storage medium stores computer-readable instructions, and the computer-readable instructions can be executed by at least one processor to The at least one processor is made to execute the steps of the method for detecting pads applied to flexible printed circuit boards as described above.
本申请提供的计算机可读存储介质,通过精确标注出每种产品的焊盘位置坐标,使用程序解析每种焊盘的焊盘位置坐标,再对解析出的坐标进行局部校准,最后使用ResNet神经网络模型检测柔性电路板(FPC)图像上标注出的区域,能大幅度提高检测精度与速度。The computer-readable storage medium provided by this application accurately marks the pad position coordinates of each product, uses the program to analyze the pad position coordinates of each type of pad, and then performs local calibration on the parsed coordinates, and finally uses the ResNet neural network The network model detects the marked area on the flexible circuit board (FPC) image, which can greatly improve the detection accuracy and speed.
通过以上的实施方式的描述,本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现,当然也可以通过硬件,但很多情况下前者是更佳的实施方式。基于这样的理解,本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中,包括若干指令用 以使得一台终端设备(可以是手机,计算机,服务器,空调器,或者网络设备等)执行本申请各个实施例所述的方法。Through the description of the above embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus a necessary general-purpose hardware platform, and of course also by hardware, but in many cases the former is better implementation. Based on such an understanding, the technical solution of the present application can be embodied in the form of a software product in essence or the part that contributes to the prior art, and the computer software product is stored in a storage medium (such as ROM/RAM, disk, CD) contains several instructions to make a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) execute the methods described in the various embodiments of the present application.
显然,以上所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例,附图中给出了本申请的较佳实施例,但并不限制本申请的专利范围。本申请可以以许多不同的形式来实现,相反地,提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。尽管参照前述实施例对本申请进行了详细的说明,对于本领域的技术人员来而言,其依然可以对前述各具体实施方式所记载的技术方案进行修改,或者对其中部分技术特征进行等效替换。凡是利用本申请说明书及附图内容所做的等效结构,直接或间接运用在其他相关的技术领域,均同理在本申请专利保护范围之内。Apparently, the embodiments described above are only some of the embodiments of the present application, but not all of them. The drawings show preferred embodiments of the present application, but do not limit the patent scope of the present application. The present application can be implemented in many different forms, on the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure content of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features . All equivalent structures made using the contents of the description and drawings of this application, directly or indirectly used in other related technical fields, are also within the scope of protection of this application.

Claims (10)

  1. 一种应用于柔性电路板的焊盘检测方法,其特征在于,包括下述步骤:A method for detecting pads applied to flexible circuit boards, comprising the steps of:
    接受携带有电路板样本图像以及焊盘位置信息的模型训练请求;Accept model training requests that carry circuit board sample images and pad location information;
    根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;performing a segmentation operation on the circuit board sample image according to the pad position information to obtain a pad sample image;
    将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;Sending the pad sample image to a terminal device for labeling the pad sample image;
    接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;receiving the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
    调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;Call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform model training operations on the original ResNet neural network model to obtain the target ResNet for identifying the quality of the pad image. neural network model;
    接受携带有待测电路板图像的焊盘检测请求;Accept the pad detection request carrying the image of the circuit board to be tested;
    将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;Inputting the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result;
    输出所述焊盘检测结果。Outputting the detection result of the pad.
  2. 根据权利要求1所述的应用于柔性电路板的焊盘检测方法,其特征在于,在所述根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像的步骤之后,还包括下述步骤:The pad detection method applied to flexible printed circuit boards according to claim 1, characterized in that, in the step of segmenting the sample image of the circuit board according to the position information of the pads to obtain the sample image of the pads Afterwards, the following steps are also included:
    根据转换公式将所述焊盘样本图像从RGB颜色空间转换为HSV颜色空间,所述转换公式表示为:The pad sample image is converted from the RGB color space to the HSV color space according to the conversion formula, and the conversion formula is expressed as:
    Figure PCTCN2021140593-appb-100001
    Figure PCTCN2021140593-appb-100001
    Figure PCTCN2021140593-appb-100002
    Figure PCTCN2021140593-appb-100002
    V=maxV=max
    其中,max=max(r,g,b),min=min(r,g,b)。Among them, max=max(r,g,b), min=min(r,g,b).
  3. 根据权利要求1所述的应用于柔性电路板的焊盘检测方法,其特征在于,在所述调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作, 得到用于识别焊盘图像品质的目标ResNet神经网络模型的步骤之前,还包括下述步骤:The pad detection method applied to flexible printed circuit boards according to claim 1, wherein the original ResNet neural network model is called, and the pad sample image is used as training data and the label information is the result Carrying out the model training operation on the data to the original ResNet neural network model, before obtaining the step of the target ResNet neural network model for identifying the quality of the pad image, the following steps are also included:
    根据特征法对所述焊盘样本图像进行预分类操作,得到焊盘形状相似的多组焊盘样本图像。A pre-classification operation is performed on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
  4. 根据权利要求1所述的应用于柔性电路板的焊盘检测方法,其特征在于,所述将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果的步骤,具体包括下述步骤:The method for detecting pads applied to flexible printed circuit boards according to claim 1, wherein the input of the image of the circuit board to be tested to the target ResNet neural network model is performed for pad detection operations to obtain pads The steps for detecting the results specifically include the following steps:
    统计所述待测电路板图像中每个待测焊盘位置的RGB颜色空间中B通道数值的变化区域;Counting the change area of the B channel value in the RGB color space of each pad position to be tested in the image of the circuit board to be tested;
    根据预设良品占比阈值S1、不良品占比阈值S2以及判断函数检测所述待测电路板图像,所述判断函数表示为:The image of the circuit board to be tested is detected according to the preset good product ratio threshold S1, the defective product ratio threshold S2 and a judgment function, and the judgment function is expressed as:
    Figure PCTCN2021140593-appb-100003
    Figure PCTCN2021140593-appb-100003
    其中,所述P I表示所述变化区域与待测焊盘位置的面积的占比;f(ROI i)表示通过所述目标ResNet神经网络模型对所述待测电路板图像进行焊盘检测操作得到的结果。 Wherein, the PI represents the ratio of the change area to the area of the pad position to be tested; f(ROI i ) represents that the pad detection operation is performed on the circuit board image to be tested by the target ResNet neural network model The results obtained.
  5. 一种应用于柔性电路板的焊盘检测装置,其特征在于,包括:A pad detection device applied to a flexible circuit board, characterized in that it comprises:
    训练请求接收模块,用于接收携带有电路板样本图像以及焊盘位置信息的模型训练请求;A training request receiving module, configured to receive a model training request carrying circuit board sample images and pad position information;
    分割操作模块,用于根据所述焊盘位置信息对所述电路板样本图像进行分割操作,得到焊盘样本图像;A segmentation operation module, configured to perform a segmentation operation on the circuit board sample image according to the pad position information to obtain a pad sample image;
    标注发送模块,用于将所述焊盘样本图像发送至终端设备,以进行焊盘样本图像的标注操作;An annotation sending module, configured to send the pad sample image to a terminal device, so as to perform an annotation operation on the pad sample image;
    标注接收模块,用于接收所述终端设备发送的焊盘标注图像,所述焊盘标注图像为携带有标注信息的焊盘样本图像,所述标注信息为良品信息或者不良品信息;An annotation receiving module, configured to receive the pad annotation image sent by the terminal device, the pad annotation image is a pad sample image carrying annotation information, and the annotation information is good product information or defective product information;
    模型训练模块,用于调用原始ResNet神经网络模型,并以所述焊盘样本图像作为训练数据、所述标注信息为结果数据对所述原始ResNet神经网络模型进行模型训练操作,得到用于识别焊盘图像品质的目标ResNet神经网络模型;The model training module is used to call the original ResNet neural network model, and use the pad sample image as training data and the label information as result data to perform model training operations on the original ResNet neural network model to obtain a Targeted ResNet neural network model for disk image quality;
    检测请求接收模块,用于接受携带有待测电路板图像的焊盘检测请求;A detection request receiving module, configured to accept a pad detection request carrying an image of a circuit board to be tested;
    焊盘检测模块,用于将所述待测电路板图像输入至所述目标ResNet神经网络模型进行焊盘检测操作,得到焊盘检测结果;The pad detection module is used to input the image of the circuit board to be tested into the target ResNet neural network model to perform a pad detection operation to obtain a pad detection result;
    结果输出模块,用于输出所述焊盘检测结果。A result output module, configured to output the detection result of the pad.
  6. 根据权利要求5所述的应用于柔性电路板的焊盘检测装置,其特征在于,所述装置还包括:The pad detection device applied to flexible circuit boards according to claim 5, wherein the device further comprises:
    颜色空间转换模块,用于根据转换公式将所述焊盘样本图像从RGB颜色空间转换为HSV颜色空间,所述转换公式表示为:The color space conversion module is used to convert the pad sample image from the RGB color space to the HSV color space according to the conversion formula, and the conversion formula is expressed as:
    Figure PCTCN2021140593-appb-100004
    Figure PCTCN2021140593-appb-100004
    Figure PCTCN2021140593-appb-100005
    Figure PCTCN2021140593-appb-100005
    V=maxV=max
    其中,max=max(r,g,b),min=min(r,g,b)。Among them, max=max(r,g,b), min=min(r,g,b).
  7. 根据权利要求5所述的应用于柔性电路板的焊盘检测装置,其特征在于,所述装置还包括:The pad detection device applied to flexible circuit boards according to claim 5, wherein the device further comprises:
    预分类模块,用于根据特征法对所述焊盘样本图像进行预分类操作,得到焊盘形状相似的多组焊盘样本图像。The pre-classification module is configured to perform a pre-classification operation on the pad sample images according to the feature method to obtain multiple groups of pad sample images with similar pad shapes.
  8. 根据权利要求5所述的应用于柔性电路板的焊盘检测装置,其特征在于,所述焊盘检测模块包括:The pad detection device applied to flexible circuit boards according to claim 5, wherein the pad detection module comprises:
    变化区域获取子模块,用于统计所述待测电路板图像中每个待测焊盘位置的RGB颜色空间中B通道数值的变化区域;The change area acquisition submodule is used to count the change area of the B channel value in the RGB color space of each pad position to be tested in the image of the circuit board to be tested;
    检测子模块,用于根据预设良品占比阈值S1、不良品占比阈值S2以及判断函数检测所述待测电路板图像,所述判断函数表示为:The detection sub-module is used to detect the image of the circuit board to be tested according to the preset good product ratio threshold S1, the defective product ratio threshold S2 and a judgment function, and the judgment function is expressed as:
    Figure PCTCN2021140593-appb-100006
    Figure PCTCN2021140593-appb-100006
    其中,所述P I表示所述变化区域与待测焊盘位置的面积的占比;f(ROI i)表示通过所述目标ResNet神经网络模型对所述待测电路板图像进行焊盘检测操作得到的结果。 Wherein, the PI represents the ratio of the change area to the area of the pad position to be tested; f(ROI i ) represents that the pad detection operation is performed on the circuit board image to be tested by the target ResNet neural network model The results obtained.
  9. 一种计算机设备,其特征在于,包括存储器和处理器,所述存储器中存储有计算机可读指令,所述处理器执行所述计算机可读指令时实现如权利要求1至4 中任一项所述的应用于柔性电路板的焊盘检测方法的步骤。A computer device, characterized by comprising a memory and a processor, wherein computer-readable instructions are stored in the memory, and when the processor executes the computer-readable instructions, the computer-readable instructions described in any one of claims 1 to 4 are realized. The steps of the above-mentioned pad detection method applied to flexible circuit boards.
  10. 一种计算机可读存储介质,其特征在于,所述计算机可读存储介质上存储有计算机可读指令,所述计算机可读指令被处理器执行时实现如权利要求1至4中任一项所述的应用于柔性电路板的焊盘检测方法的步骤。A computer-readable storage medium, wherein computer-readable instructions are stored on the computer-readable storage medium, and when the computer-readable instructions are executed by a processor, the computer-readable instructions described in any one of claims 1 to 4 are implemented. The steps of the above-mentioned pad detection method applied to flexible circuit boards.
PCT/CN2021/140593 2021-12-22 2021-12-22 Pad detection method and apparatus, and computer device and storage medium WO2023115409A1 (en)

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