WO2023098891A1 - Image forming apparatus and processing cartridge - Google Patents

Image forming apparatus and processing cartridge Download PDF

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Publication number
WO2023098891A1
WO2023098891A1 PCT/CN2022/136301 CN2022136301W WO2023098891A1 WO 2023098891 A1 WO2023098891 A1 WO 2023098891A1 CN 2022136301 W CN2022136301 W CN 2022136301W WO 2023098891 A1 WO2023098891 A1 WO 2023098891A1
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WO
WIPO (PCT)
Prior art keywords
chip
chip contact
process box
image forming
contact
Prior art date
Application number
PCT/CN2022/136301
Other languages
French (fr)
Chinese (zh)
Inventor
张雄杰
Original Assignee
珠海奔图电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 珠海奔图电子有限公司 filed Critical 珠海奔图电子有限公司
Publication of WO2023098891A1 publication Critical patent/WO2023098891A1/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G21/00Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
    • G03G21/16Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements
    • G03G21/18Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements using a processing cartridge, whereby the process cartridge comprises at least two image processing means in a single unit

Definitions

  • the embodiments of the present application relate to the technical field of image forming devices, and in particular, to an image forming device and a process box.
  • the image forming apparatus prints the data to be imaged provided by an information processing device (such as a computer) on a recording medium, and such an image forming device may be a copier, a printer, and the like.
  • an information processing device such as a computer
  • the image forming device includes a process box installation cavity and a detachable process box disposed in the process box installation cavity.
  • chip the side wall plate corresponding to the chip in the process box installation cavity is provided with a chip contact for identifying the chip, when the process box is installed in the process box installation cavity, the chip is in contact with the chip contact to realize the formation of the chip and the image The signal of the device is turned on.
  • the chip contacts will continue to rub against the end cover of the process box, and then the end cover of the process box will generate debris under the action of friction, which will pollute the chip and cause the chip to be unrecognizable.
  • an embodiment of the present application provides an image forming device and a process cartridge used in conjunction with it to solve the problem that the chip contacts rub against the end cover of the process cartridge caused by the installation of the process cartridge, resulting in debris, contaminating the chip, and causing the chip to be damaged. Unrecognized technical issue.
  • the first aspect of the embodiments of the present application provides an image forming apparatus, including an image forming apparatus body, the image forming apparatus body is provided with a process cartridge installation cavity for installing a process cartridge, and the process cartridge is provided with a chip;
  • the process box installation cavity includes a first side wall opposite to the side where the chip is provided with the process box, and a chip contact telescopic mechanism is provided at the first side wall, and the chip contact telescopic mechanism includes several a chip contact and a pusher for pushing the chip contact to move into the installation cavity of the process cartridge;
  • the process box is provided with a trigger mechanism matched with the pusher
  • the pusher pushes the chip contact to move into the process cartridge installation cavity under the action of the trigger mechanism, and the chip contact contacts the chip when the process cartridge is in place.
  • the beneficial effects of the image forming device provided by the first aspect of the embodiment of the present application are: in the image forming device provided by the embodiment of the present application, the chip contact retractable mechanism is arranged at the first side wall in the process box installation cavity, and the process box There is a trigger mechanism that matches the pusher of the chip contact telescopic mechanism.
  • the trigger mechanism on the process box will push the pusher to move, and then the pusher will play a role in the trigger mechanism. Push the chip contact down to move slowly into the processing box installation cavity. At the initial stage of the chip contact movement, the chip and the chip contact do not contact.
  • Chip contact this setting makes the chip contacts not rub against the end cover of the processing box during the installation process of the processing box, that is, avoids debris from the end cover of the processing box and contaminates the chip, and this setting also avoids Chip contacts rub against the chip causing chip wear to occur.
  • the chip contact retractable mechanism further includes a chip contact mounting bracket
  • the chip contact includes a fixed end arranged on the chip contact mounting frame and a free end away from the fixed end;
  • One end of the pusher is matched with the trigger mechanism, and the other end is placed on the side of the chip contact away from the installation cavity of the process cartridge;
  • the pusher moves from the free end of the chip contact to the fixed end of the chip contact under the action of the trigger mechanism, so as to Push the free end of the chip contact to rotate toward the direction of the chip centering on the fixed end of the chip contact, and the chip contact is in contact with the chip when the process cartridge is installed in place.
  • the chip contact retractable mechanism further includes a signal conductor for connecting the chip contact with the substrate contact of the image forming device, one end of the signal conductor is connected to the chip contact point connection, and the other end is connected to the substrate contact of the image forming device.
  • the chip contact mounting frame includes a mounting bracket and a mounting platen for fixing the signal conductor;
  • the mounting bracket includes a chip contact mounting plate and two mounting side plates, and the two mounting side plates are respectively connected to both ends in the length direction of the chip contact mounting plate;
  • the chip contact is placed on the chip contact mounting plate, and the fixed end of the chip contact is folded to the back of the chip contact mounting plate;
  • the installation pressure plate is connected to the installation side plate
  • the signal conducting member is squeezed between the chip contacts folded to the back of the chip contact mounting plate and the mounting platen.
  • the chip contact includes an elastic sheet and a bump provided on the elastic sheet for contacting the chip, one end of the elastic sheet is folded toward the side facing away from the bump, and the elastic sheet The folded end is the free end of the chip contact.
  • the pusher includes a sliding part, a pushing part and a forcing part connected to both ends of the sliding part, the trigger mechanism cooperates with the forcing part, and the pushing part is located away from the chip contacts.
  • One side of the process box installation cavity, the side of the pushing part opposite to the chip contact is an inclined surface, and the inclined surface is from the end of the pushing part close to the sliding part to the direction away from the chip contact tilt.
  • the chip contact retractable mechanism is arranged on the side of the first side wall facing away from the installation cavity of the process box, and the first side wall is provided with installation holes and limiting holes;
  • the chip contacts are arranged at the mounting holes
  • a part of the pushing member extends from the limiting hole into the process cartridge installation cavity, and the part of the pushing member placed in the limiting hole can push the chip contact along the pushing member in the limiting hole move back and forth in the direction;
  • the trigger mechanism cooperates with the part of the pusher protruding into the installation chamber of the process cartridge to drive the movement of the pusher.
  • the second aspect of the embodiment of the present application provides a process box used in conjunction with the image forming apparatus described in any of the solutions above, the process box is provided with a trigger matching the pusher of the chip contact telescopic mechanism. mechanism.
  • the third aspect of the embodiment of the present application also provides a process box used in conjunction with the image forming apparatus described in any of the solutions above, the process box is provided with a pusher that matches the chip contact telescopic mechanism.
  • a trigger mechanism is a process box hook, the process box hook is set on the end of the process box where the chip is arranged, and there is a hook gap between the process box hook and the process box;
  • the beneficial effect of the process cartridge provided by the third aspect of the embodiment of the present application is that: the process cartridge provided by the embodiment of the present application is provided with a trigger mechanism, so that the process cartridge can be distinguished from other process cartridges, and can effectively avoid poor use of the image forming device The problem of image forming device damage caused by the process box is generated; and the trigger mechanism is set as a process box hook, and there is a hook gap between the process box hook and the process box.
  • the pusher When the process box is installed in the process box installation cavity, the pusher is located in the process box
  • the upwardly bent part in the installation chamber stretches into the hook gap, and the hook gap provides a space for the movement of the process box on the one hand, preventing the upwardly bent part of the pusher from being positioned in the process box installation cavity from blocking the process box and affecting the process box.
  • the sliding installation of the process box on the other hand, the upwardly bent part of the pusher located in the process box installation cavity extends into the hook gap, so that the handle box hook can move with the pusher, so that the pusher pushes the chip contacts to At the same time, the upwardly bent part of the pusher located in the process cartridge installment cavity is located in the hook gap.
  • the handle box hook can hook the pusher, so that the removal of the process box drives the pusher to Move away from the chip contact, so that the pusher no longer acts on the chip contact, and then the chip contact is retracted, that is, reset, so that the chip contact will not rub against the process box during the process of disassembling and assembling the process box end cap.
  • the chip is arranged on the end cover of one end of the process box along its length direction;
  • the first side wall is one of the two side walls of the process box installation chamber in the process box length direction, the first side wall is provided with a process box slideway, and the first side wall faces away from One side of the process box installation cavity is provided with a first slideway plate;
  • the first slideway plate is provided with an installation notch for placing the chip contact mounting frame and the chip contact, and a guide block for installing the pusher.
  • the guide block is provided with a guide chute, and the pusher It is partially placed in the guide chute and can slide in the guide chute.
  • Fig. 1 is a structural schematic diagram of the cooperation between an image forming device and a process box
  • FIG. 2 is a schematic structural diagram of an image forming device according to an embodiment of the present application.
  • Fig. 3 is a structural schematic diagram of the right side plate installed with the chip contact telescopic mechanism
  • Fig. 4 is a partial enlarged view of place A in Fig. 3;
  • Fig. 5 is the structural representation of slideway plate
  • FIG. 6 is a schematic structural view of a slideway plate equipped with a chip contact telescopic mechanism
  • FIG. 7 is a schematic structural diagram of a chip contact telescopic mechanism
  • FIG. 8 is a schematic structural diagram of a chip contact
  • Figure 9 is a schematic structural view of the mounting bracket
  • Fig. 10 is the structural schematic diagram of installing pressing plate
  • Figure 11 is a schematic structural view of the contact spring
  • Figure 12 is a schematic structural view of the pusher
  • Figure 13 is a schematic structural view of the process box
  • Fig. 14 is a partial enlarged view of place B in Fig. 13;
  • Fig. 15 is a structural schematic diagram of the first state in which the process box cooperates with the chip contact retractable mechanism
  • Fig. 16 is a partial enlarged view at C in Fig. 15;
  • Fig. 17 is a structural schematic diagram of the second state in which the process box cooperates with the chip contact retractable mechanism
  • Figure 18 is a partial enlarged view at D in Figure 17;
  • Fig. 19 is a structural schematic diagram of a third state in which the process cartridge cooperates with the chip contact retractable mechanism
  • Figure 20 is a partial enlarged view at E in Figure 19;
  • Fig. 21 is a schematic structural view of the third state in which the process box cooperates with the chip contact retractable mechanism
  • Figure 22 is a partial enlarged view at F in Figure 21;
  • FIG. 23 is a schematic structural view of the chip contact extended state.
  • the chips on the process box and the chip contacts on the side wall of the process box installation cavity are all fixedly arranged, and the chip contacts protrude into the process box installation cavity, which makes the process box insert the image forming
  • the chip contacts will continue to rub against the end cover of the process box, causing the end cover of the process box to generate debris under the action of friction, contaminating the chip, making the chip unrecognizable, and at the same time, the chip contact will also wear the chip.
  • the chip contact can be stretched and retracted on the image forming apparatus body by setting the chip contact retractable mechanism to avoid the wear and tear of the chip contact on the process cartridge and the chip when the process cartridge is installed, specifically, the chip contact
  • the telescopic mechanism is arranged on the side wall plate of the process box installation cavity corresponding to the chip side of the process box. The chip contact telescopic mechanism pushes the chip contact through the pusher so that when the process box is installed in place, the chip contact is just pushed out by the pusher to realize chip contact.
  • Fig. 1 is a schematic diagram of the structure of an image forming device and a process box
  • Fig. 2 is a schematic diagram of the structure of an image forming device according to an embodiment of the present application
  • Fig. 3 is a schematic diagram of the structure of a right side panel equipped with a chip contact retractable mechanism
  • Fig. 4 is Figure 3 is a partial enlarged view of A
  • Figure 5 is a schematic structural view of the slideway plate
  • Figure 6 is a schematic structural view of a slideway plate equipped with a chip contact telescopic mechanism
  • Figure 7 is a structural schematic diagram of a chip contact telescopic mechanism
  • Fig. 8 is a schematic structural diagram of a chip contact
  • Fig. 9 is a schematic structural diagram of a mounting bracket
  • Fig. 10 is a schematic structural diagram of a mounting plate
  • Fig. 11 is a schematic structural diagram of a contact spring
  • Fig. 12 is a schematic structural diagram of a pusher
  • the image forming apparatus includes a paper feeding device 400 , a fixing device 600 and a paper discharge device 500 .
  • the process box 300 includes components such as a photosensitive drum, a transfer roller 330, a powder bin, a waste toner bin, an end cover, and a gear set. Chips are arranged on the end cover, and a powder feeding roller, a developing roller, and a powder outlet knife are installed on the powder bin.
  • the charging roller, photosensitive drum, and cleaning blade are installed on the waste toner box.
  • the interior of the powder bin and the waste toner bin are respectively provided with chambers for accommodating toner
  • the powder feeding roller is arranged at the outlet of the powder bin chamber
  • the developing roller is arranged outside the powder feeding roller
  • the powder feeding roller turns the powder bin
  • the toner inside is transferred to the developing roller.
  • the powder outlet knife is also set on the outlet side of the powder bin chamber.
  • the powder outlet knife consists of two parts, one of which is a thicker powder outlet knife installation part, which is fixed on the powder bin by screws, and the other part is The thinner powder outlet knife contact part, the end of the powder outlet knife contact part is in contact with the surface of the developing roller, and the powder outlet knife is fixed behind the powder bin, which can limit the thickness of the toner on the surface of the developing roller.
  • the paper P is sent out by the paper feeding device 400, and moves along the direction shown by the dotted line and the arrow in FIG.
  • the joint effect of the transfer roller 330 is transferred to the paper P, and then the paper P passes through the fixing device 600, and the fixing device 600 pressurizes and heats the paper P through the rollers, so that the toner is fixed on the paper P, and finally the paper P P is then discharged out of the image forming apparatus through the paper discharge device 500 .
  • the image forming apparatus includes an image forming apparatus body 100, and the image forming apparatus body 100 is provided with a process cartridge installation cavity 110 for installing a process cartridge 300.
  • the process cartridge installation cavity 110 includes On the first side wall 120 opposite to the side where the chip 310 is provided with the process box 300, the first side wall 120 is provided with a chip contact retractable mechanism 200, that is to say, when the process box 300 is installed in the process box installation cavity 110, A chip contact retractable mechanism 200 is provided on the side wall opposite to the side where the chip 310 is arranged on the process box 300 in the process box mounting chamber 110, that is, when the chip 310 is installed on the end cap of the process box 300 along its lengthwise direction.
  • the chip contact retractable mechanism 200 is disposed on the side wall of the process box installation cavity 110 opposite to the end cover of the process box 300 where the chip 310 is installed, and the side wall is the first side wall 120 .
  • the chip contact retractable mechanism 200 includes several chip contacts 220, a chip contact mounting frame for installing the chip contacts 220, a pusher 210 for pushing the chip contacts 220 to move in the process box installation cavity 110, and a chip contact for conducting
  • the chip contact 220 is connected to the signal conductor 250 of the substrate contact of the image forming device.
  • One end of the signal conductor 250 is connected to the chip contact 220, and the other end is connected to the substrate contact of the image forming device.
  • the signal conductor 250 The chip contact 220 is used to connect the circuit board of the image forming device, so as to realize signal transmission between the chip 310 on the process box 300 and the circuit board of the image forming device through the chip contact 220 .
  • the process box 300 slides down into the installation along the slideway on the side wall of the process box installation cavity 110;
  • the slideway pulls upwards and slides out, so in order to realize the movement of the pusher 210, the process box 300 is provided with a trigger mechanism matched with the pusher 210, and the trigger mechanism moves along with the disassembly of the process box 300, and then drives the pusher 210 moves.
  • the trigger mechanism moves into the process cartridge installation chamber 110 along with the process cartridge 300.
  • the trigger mechanism contacts the pusher 210, the pusher 210 Under the action of the trigger mechanism, the chip contact 220 is pushed to move in the process box installation cavity 110.
  • the chip contact 220 just started to move, the chip contact 220 did not contact with the end cover of the process box 300 and the chip 310.
  • chip contact 220 When the process box When 300 is installed in place, chip contact 220 stretches out in place, and chip contact 220 contacts with chip 310, and this setting makes process box 300 in the process of installing, and chip contact 220 can not rub against the end cover of process box 300, namely The chip 310 is prevented from being polluted by debris from the end cover of the process box 300 , and at the same time, the chip contact 220 is prevented from rubbing against the chip 310 to cause the chip 310 to be worn.
  • the chip contact mounting frame in the embodiment of the present application is used to install the chip contact 220, and the pusher 210 directly pushes the chip contact 220 to swing, that is, the pusher 210 directly pushes the chip contact 220 to
  • the position of the chip contact mounting rack remains unchanged when the process box moves inside the cavity 110 .
  • This setting can simplify the swinging structure of the chip contact 220 and reduce the space required for the chip contact 220 to swing.
  • the chip contact 220 includes a fixed end arranged on the chip contact mounting frame and a free end 222 away from the fixed end, that is to say, one end of the chip contact 220 is fixedly connected to the chip contact mounting frame. The other end is the free end 222.
  • This setting enables the free end 222 of the chip contact 220 to rotate around the fixed end of the chip contact 220, that is, the free end 222 of the chip contact 220 can be moved by the pusher 210
  • the fixed end of the chip contact 220 is the center of rotation and rotates into the process cartridge installation cavity 110 .
  • the pusher 210 has an end that cooperates with the trigger mechanism, and the trigger mechanism realizes the pusher 210 by pushing the end of the pusher 210 to move.
  • one end of the pusher 210 away from the end that it cooperates with the trigger mechanism is arranged at the free end 222 of the chip contact 220, and is positioned at the side of the free end 222 of the chip contact 220 facing away from the process box installation cavity 110, That is to say, one end of the pushing member 210 cooperates with the trigger mechanism, and the other end is placed on the side of the chip contact 220 away from the process cartridge installation cavity 110 .
  • Process cartridge 300 is in the process of being packed into process cartridge installation chamber 110, and pusher 210 moves to the fixed end of chip contact 220 from the free end 222 of chip contact 220 under the effect of trigger mechanism, thereby makes chip contact 220
  • the free end 222 rotates towards the direction of the chip 310 with the fixed end of the chip contact 220 as the center under the action of the pusher 210, that is, the free end 222 of the chip contact 220 is pushed in the process box installation cavity 110, and the initial stage of pushing , the chip contact 220 is not in contact with the chip 310 and the end cap of the ink cartridge.
  • the chip contact 220 When the process cartridge 300 is installed in place in the process cartridge installation cavity 110, the chip contact 220 is fully stretched out and contacts the chip 310, and the chip contact 220 rotates
  • the protruding way of the formula reduces the space required to promote the expansion and contraction of the chip contact 220, and the pusher 210 extends from the free end 222 of the chip contact 220 to the bottom of the chip contact 220 (the pusher 210 extends in FIG. Into the rear end of the chip contact 220, the pusher 210 extends into the bottom of the chip contact 220 in FIG.
  • the chip contact mounting frame includes a mounting bracket 230 and a mounting pressure plate 240, the mounting bracket 230 is used to mount the chip contacts 220, and the mounting pressure plate 240 is used to fix the signal conductor 250.
  • the mounting bracket 230 includes a chip contact mounting plate 231 and mounting side plates 232 connected to both sides of the chip contact mounting plate 231, that is, there are two mounting side plates 232, and the two mounting side plates 232 are respectively connected
  • the mounting pressure plate 240 is located between the two mounting side plates 232, and the two ends of the mounting pressure plate 240 are respectively connected to the two mounting side plates 232, and the mounting pressure plate 240 is connected to the chip contact.
  • the point mounting plate 231 is arranged in parallel, and the signal conductor 250 is located between the mounting platen 240 and the chip contact mounting plate 231 .
  • the chip contact 220 is arranged on the chip contact mounting plate 231 along the width direction of the chip contact mounting plate 231, and the fixed end of the chip contact 220 is folded around one end of the chip contact mounting plate 231 in the width direction to the chip contact mounting plate On the back side of 231, the free end 222 of chip contact 220 stretches out chip contact mounting plate 231 from the other end of chip contact mounting plate 231 width direction, and the free end 222 of chip contact 220 stretches out chip contact mounting plate 231 A space is provided for the pusher 210 to move to the lower part of the chip contact 220 (the pusher 210 extends into the lower part of the chip contact 220 in FIG. 7 ), so that the pusher 210 pushes the chip contact 220 to move.
  • the “rear side of the chip contact mounting plate 231 ” mentioned here refers to the side of the chip contact mounting plate 231 facing the mounting platen 240 .
  • the signal conducting member 250 includes a main body of the signal conducting member 250 and a connecting wire 252 disposed at the lower end of the main body of the signal conducting member 250 .
  • the connecting wire 252 is connected to the substrate contact of the image forming device.
  • the main body of the signal conducting member 250 is squeezed between the chip contact 220 folded to the back of the chip contact mounting plate 231 and the mounting platen 240, that is to say, one end of the main body of the signal conducting member 250 abuts against the folded to the chip On the chip contact 220 on the back of the contact mounting plate 231, the other end abuts on the mounting pressure plate 240, and the main body of the signal conductor 250 passes through the chip contact mounting plate 231 and is folded to the chip contact on the back of the chip contact mounting plate 231.
  • the cooperation between the point 220 and the mounting pressure plate 240 realizes that the main body of the signal conducting member 250 is squeezed between the chip contact 220 and the mounting pressing plate 240 folded to the back of the chip contact mounting plate 231. This arrangement facilitates the signal conducting member 250
  • the installation of the signal conductor 250 reduces the fixing parts.
  • the chip contact mounting plate 231 is provided with several installation indicator blocks 236 corresponding to the chip contacts 220, and the chip contacts 220 are correspondingly installed on the installation indicator blocks 236. This setting is convenient for the chip contact.
  • the installation of the point 220 makes the installation position of the chip contact 220 accurate, and avoids the installation offset that causes the chip contact 220 and the chip 310 to not be in good contact.
  • the main body of the signal conducting member 250 is a contact spring 251 , that is, the main body of the signal conducting member 250 is a spring member.
  • the mounting bracket 230 also includes a limiting plate 233, the limiting plate 233 is arranged below the chip contact mounting plate 231 and connected between the two mounting side plates 232, on the limiting plate 233
  • a limit installation hole 234 is provided corresponding to the installation position of the chip contact 220, and the upper end of the installation pressure plate 240 is provided with a card protrusion 244 corresponding to the limit installation hole 234, and the upper end of the contact spring 251 passes through the limit installation hole 234 to abut against the chip contact.
  • the lower end of the contact spring 251 is placed on the card protrusion 244, the limit installation hole 234 cooperates with the card protrusion 244 and the installation pressure plate 240 to realize the fixing of the position of the contact spring 251, and the installation pressure plate 240 is installed on the installation side plate 232, the installation pressure plate 240 compresses the contact spring 251, so that the contact spring 251 shrinks, and then the contact spring 251 is pressed against the chip contact 220, so that the chip contact 220 is fixedly connected to the chip contact mounting plate 231, and achieve conduction.
  • the chip contact 220 and the chip contact mounting plate 231 can also be reinforced and connected through other connection methods.
  • the chip contact mounting frame is made of insulating material.
  • the mounting platen 240 includes a positioning plate 241, a fixing plate 243 connected to the positioning plate 241 and two connecting hooks, the locking protrusion 244 is arranged on the positioning plate 241, and the lower ends of the two connecting hooks are connected
  • the upper end is provided with a hook bent away from the positioning plate 241
  • the two mounting side plates 232 between the limiting plate 233 and the chip contact mounting plate 231 are provided with hook holes.
  • the position plate 233 is provided with two relief holes, and the two connection hooks pass through the two relief holes respectively and are hooked in the two hook holes respectively.
  • the installation method is simple.
  • the opposite ends of the positioning plate 241 are respectively provided with upwardly protruding limiting edges 245, and one of the limiting edges 245 is provided with a gap 246 corresponding to the locking protrusion 244, and the connecting wire 252 is located at the gap 246.
  • the positioning plate 241 Stretch out, after the installation pressure plate 240 is hooked on the two installation side plates 232 through the two connecting hook plates 242, the positioning plate 241 is placed on the lower part of the limit plate 233 and the two limit edges 245 are stuck on the limit plate 233.
  • the two limiting edges 245 play a limiting role on the installation pressure plate 240, so that it cannot shake along the direction perpendicular to the limiting edges 245.
  • the contact The spring 251 pushes the mounting platen 240 outward to stabilize the position of the mounting platen 240 in the direction in which the contact spring 251 expands and contracts.
  • the stability of the position of the mounting platen 240 can ensure that the contact spring 251 and the chip contact 220 can always be in good contact.
  • the fixing plate 243 is fixedly connected to the end of the positioning plate 241 opposite to the relief notch 246.
  • the fixing plate 243 is provided with an installation through hole 247, and the installation through hole 247 is used to connect the fixing plate 243 to the image forming apparatus body 100 through a connecting piece. on the substrate.
  • hooks are provided at the ends of the two installation side plates 232 away from the chip contact mounting plate 231, hook installation holes 123 corresponding to the hooks are provided on the substrate of the image forming apparatus body 100, and the chip contact mounting frame passes through
  • the hooks on the two mounting side plates 232 cooperate with the hook mounting holes 123 on the substrate of the image forming apparatus body 100, and the fixing plate 243 is connected to the substrate of the image forming apparatus body 100 through connectors to realize chip contact installation.
  • the frame is connected to the substrate of the image forming apparatus body 100 .
  • the chip contact 220 includes an elastic piece 221 and a bump 223 arranged on the elastic piece 221 for contacting with the chip 310 , and one end of the elastic piece 221 faces away from the bump 223 .
  • One side is folded, and the folded end of the elastic piece 221 is the free end 222 of the chip contact 220 , that is, the free end 222 of the elastic piece 221 is folded toward the side facing away from the bump 223 . Since the extension of the chip contact 220 is inclined, that is, the free end 222 rotates and extends around the fixed end, and the elastic piece 221 is provided with a bump 223 for contacting the chip 310.
  • the point of contact can be the side periphery of the bump 223 on the elastic piece 221 , thereby increasing the contact area between the chip contact 220 and the chip 310 , and ensuring that the chip contact 220 can be in good contact with the chip 310 .
  • the chip contact 220 uses the elastic piece 221, and the elastic piece 221 itself has elastic force, which can be reset by its own elastic force after the pusher 210 returns, so that when the process box 300 is drawn out of the process box installation cavity 110, the process box Chip 310 and end caps of 300 are also not rubbed by chip contacts 220 .
  • the free end 222 of the elastic piece 221 is folded to the side facing away from the protruding point 223.
  • This setting makes the free end 222 of the elastic piece 221 guide the movement of the pusher 210, so that the pusher 210 moves to the bottom of the chip contact 220 ( As shown in Figure 7, the pusher 210 extends into the lower part of the chip contact 220), and then the elastic piece 221 is pushed out of the mounting hole 123, and the free end 222 of the elastic piece 221 is turned over to the side facing away from the bump 223 so that the turning of the elastic piece 221
  • the folded end forms an inclined surface, and the inclined surface of the free end 222 of the elastic piece 221 cooperates with the inclined surface 214 of the pusher 210 to reduce the sliding stroke of the pusher 210 .
  • the pusher 210 includes a sliding part 211, a pushing part 213 and a forcing part 212 connected to both ends of the sliding part 211, the trigger mechanism cooperates with the forcing part 212, and the pushing part 213 is located at the free end 222 of the chip contact 220.
  • the side of the pushing portion 213 opposite to the chip contact 220 is an inclined surface 214, and the inclined surface 214 is inclined from the end of the pushing portion 213 near the sliding portion 211 to the direction away from the chip contact 220, That is, as shown in FIG.
  • the upper plane of the pushing part 213 is flush with the upper plane of the sliding part 211
  • the end of the pushing part 213 away from the sliding part 211 is inclined downwards
  • the entire inclined surface 214 protrudes upwards.
  • the setting of the inclined surface 214 of the push portion 213 facilitates the push portion 213 to extend into the bottom of the chip contact 220 on the one hand (as shown in FIG.
  • the inclined surface 214 of the elastic piece 221 cooperates with the inclined surface of the free end 222 of the elastic piece 221 to reduce the sliding stroke of the pusher 210 .
  • the chip contact retractable mechanism 200 is arranged on the side of the first side wall 120 facing away from the process box installation cavity 110, and the first side wall 120 is provided with Mounting hole 123 and limiting hole 122, chip contact 220 and chip contact mounting frame are arranged at mounting hole 123 places, and the part of pushing member 210 stretches in the process box installation chamber 110 from limiting hole 122 places, and limiting hole 122 It is a long hole, and its length direction is the same as the moving direction of the pusher 210.
  • the part of the pusher 210 placed in the limit hole 122 can move back and forth in the limit hole 122 along the direction in which the pusher 210 pushes the chip contact 220, That is, the limiting hole 122 restricts the forward and backward movement of the pusher 210 along its length direction, and plays a role of guiding and giving way to the movement of the pusher 210 .
  • the trigger mechanism and the part of the pusher 210 extending into the process box installation cavity 110 cooperate to drive the movement of the pusher 210, that is to say, the trigger mechanism is arranged on the process box 300, and the process box 300 is installed in the process box installation cavity 110.
  • the member 210 protrudes into the process cartridge installation cavity 110 so as to be able to cooperate with the trigger mechanism.
  • the chip 310 is arranged on the end cover of one end of the process box 300 along its length direction, and the first side wall 120 is the two sides of the process box installation cavity 110 in the process box 300 length direction
  • the first side wall 120 is on the right side plate (with the front of the image forming device as the front side) of the process box installation chamber 110, because the chip 310 on the process box 300 is generally arranged on The right side of the process box 300 (with the direction in which the process box 300 is installed on the image forming apparatus body 100 as a reference) at the end cover, so the chip contact retractable mechanism 200 is arranged on the right side plate of the process box installation cavity 110 to reduce the The modification of the original structure of the image forming apparatus body 100 and the process box 300 is more convenient for processing and production.
  • the trigger mechanism of the chip contact retractable mechanism 200 can be provided at the side end cover, without changing the installation position of the chip 310 or the structure of the process box 300, and the improvement method is simple.
  • the front of the main body 100 of the image forming apparatus is taken as the reference direction for illustration.
  • the chip contact retractable mechanism 200 can also be arranged on other side wall panels of the process box installation cavity 110 body.
  • the structure of the process box 300 needs to be modified accordingly. That is to say, the chip 310 on the process box 300 is changed to the corresponding side end corresponding to the position where the chip contact telescopic mechanism 200 is provided, and a trigger mechanism is set at the side end corresponding to the chip 310.
  • the chip contact telescopic mechanism 200 is arranged on On the left side plate of the process box installation cavity 110, correspondingly, the chip 310 on the process box 300 is changed to the left end cover of the process box 300, and the trigger mechanism is also arranged on the left end cover of the process box 300.
  • the first side wall 120 is provided with a process box slideway 121, and the first side wall 120 is provided with a first slideway plate 130 on the side facing away from the process box installation cavity 110.
  • a process cartridge slideway 121 is provided on the right side plate, and a first slideway plate 130 is provided on the side of the right side plate facing away from the process cartridge installation cavity 110 .
  • the first slideway plate 130 is provided with a process cartridge chute 131, an installation gap 132 for placing the chip contact mounting frame and the chip contact 220 and a guide block 133 for installing the pusher 210, the first slideway plate 130
  • the process cartridge chute 131 provided on it is a chute with an upper side opening, the opening is inclined upward and faces the front upper part of the image forming apparatus, and the right end of the process cartridge 300 slides from the process cartridge.
  • the slot 131 is inserted into the body of the process box installation chamber 110 , and the process box chute 131 plays a guiding role for the installation of the process box 300 .
  • the chip contact 220 and the chip contact mounting frame are installed at the installation gap 132 of the first slideway plate 130.
  • This application uses the original structure of the image forming device body 100 to set the installation position of the chip contact retractable mechanism 200, which can reduce the number of chips.
  • the setting of the installation parts of the contact telescopic mechanism 200 further reduces the overall volume of the chip contact telescopic mechanism 200, thereby saving the installation space of the chip contact telescopic mechanism 200.
  • the first side wall 120 at the installation gap 132 can The fixed end of the chip contact 220 is blocked to ensure that the free end 222 of the chip contact 220 maintains a stable position when the pusher 210 pushes the chip contact 220 .
  • the installation notch 132 is located at the bottom of the process cartridge chute 131 and is close to one end of the front side of the image forming apparatus body 100. This setting realizes that the chip contact retractable mechanism 200 is located at the front side of the image forming apparatus body 100 as a whole, so that the process cartridge 300 is inserted into the image forming apparatus body 100.
  • the trigger mechanism on the process box 300 can trigger the chip contact telescopic mechanism 200 before the process box 300 is put in place, so that the pusher 210 moves, and the pusher 210 can also move along with the process box 300. Insert and push the core contacts continuously until the chip contacts 220 are pushed out and fully contact with the chip 310 on the process cartridge 300 .
  • the guide block 133 is located at the installation notch 132 and at one end of the installation notch 132 close to the front side of the image forming device body 100 , the guide block 133 is provided with a guide chute 134 , and the sliding part 211 of the pusher 210 is placed in the guide chute 134 And can slide in the guide chute 134, the guide chute 134 plays a guiding role to the pusher 210, so that the pusher 210 can slide along the direction of the guide chute 134, ensuring the accuracy of the positional movement of the pusher 210, so that It can only move back and forth in a straight line along the direction of the guide chute 134 , which avoids the situation that the chip contacts 220 cannot be successfully pushed out or pushed out in place due to the deflection of the pushing member 210 .
  • the upper opening of the guide chute 134 faces to the left side of the image forming apparatus body 100, that is to say, when the first slideway plate 130 is installed in the image forming apparatus body 100, the upper opening end of the guide chute 134 faces to the right side. Plate, the right plate blocks the upper opening of the guide chute 134, so that the pusher 210 can only move back and forth in a straight line along the direction of the guide chute 134, without moving up and down left and right.
  • the end of the pushing member 210 extending into the process cartridge installation cavity 110 is bent upwards, that is, forcing
  • the push part 212 is an L-shaped structure, that is, it includes a horizontal side and a vertical side.
  • One end of the horizontal side of the pushing part 212 is connected to the sliding part 211, and the other end passes through the limiting hole 122, and the horizontal side crosses the limiting hole 122, and Its two ends are divided into the both sides that are positioned at limit hole 122, and the free end 222 of pushing part 212 vertical sides is towards the top of process box installation cavity 110 body, because when process box 300 is installed in process box installation cavity 110, process box 300 slide track along the process box slideway 121 and process box chute 131 is predetermined, that is, at first the inclination of a larger inclination angle slides downwards, and then slides down with a gentle inclination, that is to say, the sliding track of the process box 300 does not slide horizontally track, and the pushing direction of the pushing member 210 is to push back horizontally, thus, the process box 300 cannot give a horizontal thrust to the pushing part 213, and when the process box 300 slides obliquely downward, along with the movement of the process box 300, the process box
  • the trigger mechanism of 300 can give an
  • FIG. 15 is a schematic structural view of the first state of the process box 300 and the chip contact retractable mechanism 200
  • Figure 16 is a schematic view of Figure 15 Partial enlarged view at C
  • FIG. 17 is a schematic structural view of the second state in which the process box 300 cooperates with the chip contact retractable mechanism 200
  • FIG. 18 is a partial enlarged view at D in FIG. 17
  • FIG. 19 is the process box 300 and The structural diagram of the third state of the cooperation of the chip contact telescopic mechanism 200
  • FIG. 20 is a partial enlarged view of E in FIG. 19
  • FIG. 21 is the structural diagram of the third state of the process box 300 and the chip contact telescopic mechanism 200
  • FIG. 21 is the structural diagram of the third state of the process box 300 and the chip contact telescopic mechanism 200
  • FIG. 21 is the structural diagram of the third state of the process box 300 and the chip contact telescopic mechanism 200
  • FIG. 21 is the structural diagram of the third state of the process box 300 and the chip contact telescopic mechanism
  • FIG. 22 is a partial enlarged view at F in FIG. 21 .
  • the initial state of the trigger mechanism and the pushing part 212 is not in contact (as shown in Figures 15 and 16).
  • the upwardly bent end of the forcing portion 212 stretches into the hook gap 321, and the trigger mechanism contacts the side of the upwardly bending end of the forcing portion 212 (as shown in Figures 17 and 18
  • the upwardly bent end of the pushing portion 212 continues to extend upwards into the hook gap 321, and when the trigger mechanism slides down, it pushes the upwardly bent portion of the pushing portion 212 so that the pushing member 210 touches the chip.
  • the trigger mechanism moves downward along the upward bending part of the pushing part 212 (as shown in Figure 19 and Figure 20); Through the gap 321 of the hook, the trigger mechanism continues to slide down.
  • the trigger mechanism When the trigger mechanism slides down, it pushes the pushing part 212 to bend upward so that the pusher 210 continues to move toward the chip contact 220, and the trigger mechanism continues to move upward along the pushing part 212.
  • the bending part moves downward, and when the process box 300 is installed in place, the trigger mechanism promotes the pusher 210 to move in place, that is, the chip contact 220 is fully pushed out and contacts with the chip 310 (as shown in FIGS. 21 and 22 ), the chip contact
  • FIG. 23 The state of fully extending and mating with the chip 310 is shown in FIG. 23 .
  • the trigger mechanism Since the upwardly bent part of the forcing part 212 passes through the hook gap 321 and is located in the hook gap 321, when the process cartridge 300 is drawn out, the trigger mechanism will drive the forcing part 212 to retreat simultaneously to realize the reset of the pushing part 210. That is to say, the hook gap 321 between the trigger mechanism and the process box 300 can allow the forcing part 212 to pass through, thus, the trigger mechanism will only give a backward thrust to the forcing part 212 to realize the movement of the pushing part 213 , when the process box 300 is installed in place, the upwardly bent part of the forcing part 212 passes through the hook gap 321 and is placed in the hook gap 321.
  • the trigger mechanism can give the forcing part 212 A forward pulling force realizes that the trigger mechanism pulls the pusher 210 forward away from the lower end of the free end 222 of the chip contact 220 (the lower end here refers to the position shown in FIG. 7 ), and the chip contact 220 is under the action of its own elastic force. Realize reset, that is, retract in the mounting hole 123.
  • the setting of the pushing part 212 as an L-shaped structure can cooperate with the trigger mechanism of the process box 300 to realize the reciprocating movement of the pushing part 213, and the driving method is simple and ingenious.
  • the pushing part 212 can be other structures, such as a rod-shaped structure, and the pushing part 212 protrudes from the limit hole 122 perpendicular to the right side plate.
  • the mechanism is that a slideway is set on the right end cover of the process box 300 to fit the sliding track of the process box 300, so that the slideway only has a backward thrust or a forward pull force on the pushing part 212 .
  • the installation indicating block 236, the contact spring 251, the limit installation hole 234 and the card protrusion 244 are all set to be multiple corresponding to the multiple chip contacts 220, and the multiple
  • the chip contacts 220 are arranged parallel to each other on the chip contact mounting frame, the free ends 222 of the plurality of chip contacts 220 are located on the same side, the sliding part 211 is connected with the pushing part 213 to form a T-shaped structure, and the pushing part 213 can move. Simultaneously push the free ends 222 of the plurality of chip contacts 220 .
  • the number of chip contacts 220 of the present application is determined according to the chip 310 on the process box 300.
  • a chip contact 220 can be set on the chip contact telescopic mechanism 200, or 2, 3, 4 or more can be set. .
  • Figure 17 is a schematic diagram of the structure of the second state in which the process box cooperates with the chip contact telescopic mechanism;
  • Figure 18 is a partial enlarged view of D in Figure 17;
  • this specific embodiment provides a process box 300 used in conjunction with the image forming device in Embodiment 1, and the process box 300 is provided with a pusher 210 that is compatible with the chip contact retractable mechanism 200
  • Matching trigger mechanism when the trigger mechanism can push the push member 210 to move backward when the process box 300 is installed in the process box installation cavity 110, so that the chip contact 220 stretches out of the mounting hole 123 and the chip 310 on the process box 300
  • the contact conduction when the process box 300 is drawn out of the process box installation cavity 110 , the trigger mechanism can pull the pusher 210 to move backward, so that the chip contact 220 retracts into the installation hole 123 .
  • the trigger mechanism is the process box hook 320.
  • the process box hook 320 When the process box 300 is installed in the process box installation cavity 110, the travel track of the process box hook 320 passes through the pusher 210.
  • the process box hook 320 passes the pusher 210, the process box hook 320 The hook hooks the pusher 210 and drives the pusher 210 to move.
  • the process cartridge hook 320 is arranged on the right end cover of the process cartridge 300, and the corresponding chip 310 of the process cartridge 300 is arranged on the right end of the process cartridge 300 cover.
  • the process box hook 320 is an L-shaped structure, and the process box hook 320 is provided with the front side lower end of the right end cover of the process box 300, and the process box hook 320 is connected on the process box 300 end cover, and the process box hook 320 There is a hook gap 321 between the process box 300, and the corresponding forcing part 212 is an L-shaped structure.
  • the hook gap 321 is the clearance gap mentioned in Embodiment 1, and this clearance gap can make the pushing part 212 pass through. However, thus, the process cartridge hook 320 will only give a backward thrust to the pushing part 212, so as to realize the movement of the pushing part 213.
  • the hook of the process box 300 is not limited to the structure shown in Figure 12 and Figure 13, as long as it can form a hook gap 321 with the process box 300, the hook gap 321 can be a closed space or an open space 15-22, one end of the process box hook 320 is connected to the process box 300, and the other end is bent downward to form an L-shaped structure.
  • the process box 300 used in conjunction with the image forming apparatus mentioned in Embodiment 1 in the present application only adds a small process box hook 320 on the process box 300, and does not improve the overall structure of the process box 300, which is convenient for implementation. Processing of the processing cartridge 300 used in conjunction with Example 1.

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Abstract

An image forming apparatus and a processing cartridge (300). The image forming apparatus comprises an image forming apparatus body (100), wherein a processing cartridge mounting cavity (110) for mounting a processing cartridge (300) is provided in the image forming apparatus body (100); a chip (310) is arranged on the processing cartridge (300); the processing cartridge mounting cavity (110) comprises a first side wall (120) opposite a side of the processing cartridge (300) that is arranged with the chip (310), a chip contact telescopic mechanism (200) is arranged at the first side wall (120), and the chip contact telescopic mechanism (200) comprises several chip contacts (220) and a pushing member (210) for pushing the chip contacts (220) to move into the processing cartridge mounting cavity (110); a trigger mechanism (320) matching the pushing member (210) is arranged on the processing cartridge (300); and during the process of mounting the processing cartridge (300) into the processing cartridge mounting cavity (110), under the action of the trigger mechanism (320), the pushing member (210) pushes the chip contacts (220) to move into the processing cartridge mounting cavity (110), and the chip contacts (220) are in contact with the chip (310) when the processing cartridge (300) is mounted in place. By means of the image processing apparatus, the problem of a failure of a chip (310) of a processing cartridge (300) caused by the friction between chip contacts (220) and the processing cartridge (300) generating scraps when the processing cartridge (300) is mounted is solved.

Description

图像形成装置及处理盒Image forming device and process cartridge
本申请要求于2021年12月02日提交中国专利局、申请号为202123026608.6、申请名称为“图像形成装置及处理盒”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with the application number 202123026608.6 and the application title "image forming device and process box" filed with the China Patent Office on December 02, 2021, the entire contents of which are incorporated herein by reference.
技术领域technical field
本申请实施例涉及图像形成装置技术领域,尤其涉及一种图像形成装置及处理盒。The embodiments of the present application relate to the technical field of image forming devices, and in particular, to an image forming device and a process box.
背景技术Background technique
图像形成装置是将信息处理设备(例如计算机)提供的待成像的数据打印在记录介质上,这种图像形成设备可以是复印机、打印机等。The image forming apparatus prints the data to be imaged provided by an information processing device (such as a computer) on a recording medium, and such an image forming device may be a copier, a printer, and the like.
在相关技术中,图像形成装置包括处理盒安装腔和可拆卸的设置于处理盒安装腔内处理盒,处理盒上设置有用于记录处理盒内碳粉剩余量、防止用户私自灌粉以及防兼容的芯片,处理盒安装腔内与芯片对应的侧壁板上设置有用于识别芯片的芯片触点,处理盒安装于处理盒安装腔内时,芯片与芯片触点接触,以实现芯片与图像形成装置的信号导通。In the related art, the image forming device includes a process box installation cavity and a detachable process box disposed in the process box installation cavity. chip, the side wall plate corresponding to the chip in the process box installation cavity is provided with a chip contact for identifying the chip, when the process box is installed in the process box installation cavity, the chip is in contact with the chip contact to realize the formation of the chip and the image The signal of the device is turned on.
然而,处理盒拆装的过程中,芯片触点会持续摩擦处理盒端盖,进而使得处理盒端盖在摩擦的作用下产生碎屑,污染芯片,导致芯片无法识别。However, during the process of disassembling and assembling the process box, the chip contacts will continue to rub against the end cover of the process box, and then the end cover of the process box will generate debris under the action of friction, which will pollute the chip and cause the chip to be unrecognizable.
发明内容Contents of the invention
鉴于上述问题,本申请实施例提供一种图像形成装置及与之配套使用的处理盒,用以解决处理盒安装时造成的芯片触点摩擦处理盒端盖,产生碎屑,污染芯片,导致芯片无法识别的技术问题。In view of the above problems, an embodiment of the present application provides an image forming device and a process cartridge used in conjunction with it to solve the problem that the chip contacts rub against the end cover of the process cartridge caused by the installation of the process cartridge, resulting in debris, contaminating the chip, and causing the chip to be damaged. Unrecognized technical issue.
本申请实施例为解决上述技术问题提供如下技术方案:The embodiments of the present application provide the following technical solutions to solve the above technical problems:
本申请实施例的第一方面提供一种图像形成装置,包括图像形成装置本体,所述图像形成装置本体上设置有用于安装处理盒的处理盒安装腔,所述处理盒上设置有芯片;The first aspect of the embodiments of the present application provides an image forming apparatus, including an image forming apparatus body, the image forming apparatus body is provided with a process cartridge installation cavity for installing a process cartridge, and the process cartridge is provided with a chip;
所述处理盒安装腔包括与所述处理盒设置有芯片的一侧相对的第一 侧壁,所述第一侧壁处设置有芯片触点伸缩机构,所述芯片触点伸缩机构包括若干个芯片触点和推动所述芯片触点向所述处理盒安装腔内移动的推动件;The process box installation cavity includes a first side wall opposite to the side where the chip is provided with the process box, and a chip contact telescopic mechanism is provided at the first side wall, and the chip contact telescopic mechanism includes several a chip contact and a pusher for pushing the chip contact to move into the installation cavity of the process cartridge;
所述处理盒上设置有与所述推动件相匹配的触发机构;The process box is provided with a trigger mechanism matched with the pusher;
所述处理盒装入所述处理盒安装腔内的过程中,所述推动件在所述触发机构的作用下推动所述芯片触点向所述处理盒安装腔内移动,所述芯片触点在所述处理盒安装到位时与所述芯片接触。During the process of loading the process cartridge into the process cartridge installation cavity, the pusher pushes the chip contact to move into the process cartridge installation cavity under the action of the trigger mechanism, and the chip contact contacts the chip when the process cartridge is in place.
本申请实施例的第一方面提供的图像形成装置的有益效果是:本申请实施例提供的图像形成装置中,芯片触点伸缩机构设置于处理盒安装腔内的第一侧壁处,处理盒上设置有与芯片触点伸缩机构的推动件相匹配的触发机构,处理盒装入处理盒安装腔内的过程中,处理盒上的触发机构促使推动件移动,进而推动件在触发机构的作用下推动芯片触点向处理盒安装腔内缓慢移动,芯片触点移动的初期,芯片与芯片触点不接触,当处理盒在处理盒安装腔内安装到位时,芯片触点完全伸出并与芯片接触,此设置使得处理盒在安装的过程中,芯片触点不会摩擦到处理盒的端盖,即避免了处理盒端盖产生碎屑,污染芯片的情况发生,同时此设置也避免了芯片触点摩擦芯片导致芯片磨损的情况发生。The beneficial effects of the image forming device provided by the first aspect of the embodiment of the present application are: in the image forming device provided by the embodiment of the present application, the chip contact retractable mechanism is arranged at the first side wall in the process box installation cavity, and the process box There is a trigger mechanism that matches the pusher of the chip contact telescopic mechanism. When the process box is loaded into the process box installation cavity, the trigger mechanism on the process box will push the pusher to move, and then the pusher will play a role in the trigger mechanism. Push the chip contact down to move slowly into the processing box installation cavity. At the initial stage of the chip contact movement, the chip and the chip contact do not contact. Chip contact, this setting makes the chip contacts not rub against the end cover of the processing box during the installation process of the processing box, that is, avoids debris from the end cover of the processing box and contaminates the chip, and this setting also avoids Chip contacts rub against the chip causing chip wear to occur.
优选的,所述芯片触点伸缩机构还包括芯片触点安装架;Preferably, the chip contact retractable mechanism further includes a chip contact mounting bracket;
所述芯片触点包括设置于所述芯片触点安装架上的固定端和远离所述固定端的自由端;The chip contact includes a fixed end arranged on the chip contact mounting frame and a free end away from the fixed end;
所述推动件的一端与所述触发机构配合,另一端置于所述芯片触点远离所述处理盒安装腔的一侧;One end of the pusher is matched with the trigger mechanism, and the other end is placed on the side of the chip contact away from the installation cavity of the process cartridge;
所述处理盒装入所述处理盒安装腔内的过程中,所述推动件在所述触发机构的作用下自所述芯片触点的自由端向所述芯片触点的固定端移动,以推动所述芯片触点的自由端以所述芯片触点的固定端为中心向所述芯片的方向转动,所述芯片触点在所述处理盒安装到位时与所述芯片接触。When the process cartridge is loaded into the process cartridge installation cavity, the pusher moves from the free end of the chip contact to the fixed end of the chip contact under the action of the trigger mechanism, so as to Push the free end of the chip contact to rotate toward the direction of the chip centering on the fixed end of the chip contact, and the chip contact is in contact with the chip when the process cartridge is installed in place.
优选的,所述芯片触点伸缩机构还包括用于导通所述芯片触点与所述图像形成装置的基板触点的信号导通件,所述信号导通件的一端与所述芯片触点连接,另一端与所述图像形成装置的基板触点连接。Preferably, the chip contact retractable mechanism further includes a signal conductor for connecting the chip contact with the substrate contact of the image forming device, one end of the signal conductor is connected to the chip contact point connection, and the other end is connected to the substrate contact of the image forming device.
优选的,所述芯片触点安装架包括安装支架和用于固定所述信号导通 件的安装压板;Preferably, the chip contact mounting frame includes a mounting bracket and a mounting platen for fixing the signal conductor;
所述安装支架包括芯片触点安装板和两个安装侧板,所述两个安装侧板分别连接于所述芯片触点安装板长度方向的两端;The mounting bracket includes a chip contact mounting plate and two mounting side plates, and the two mounting side plates are respectively connected to both ends in the length direction of the chip contact mounting plate;
所述芯片触点置于所述芯片触点安装板上,所述芯片触点的固定端翻折至所述芯片触点安装板的背面上;The chip contact is placed on the chip contact mounting plate, and the fixed end of the chip contact is folded to the back of the chip contact mounting plate;
所述安装压板连接于所述安装侧板上;The installation pressure plate is connected to the installation side plate;
所述信号导通件挤压于翻折至芯片触点安装板背面的芯片触点和安装压板之间。The signal conducting member is squeezed between the chip contacts folded to the back of the chip contact mounting plate and the mounting platen.
优选的,所述芯片触点包括弹片和设置于所述弹片上用于与所述芯片接触的凸点,所述弹片的其中一端向背向所述凸点的一侧翻折,所述弹片的翻折端为所述芯片触点的自由端。Preferably, the chip contact includes an elastic sheet and a bump provided on the elastic sheet for contacting the chip, one end of the elastic sheet is folded toward the side facing away from the bump, and the elastic sheet The folded end is the free end of the chip contact.
优选的,所述推动件包括滑动部和连接于所述滑动部两端的推动部与迫推部,所述触发机构与所述迫推部配合,所述推动部位于所述芯片触点远离所述处理盒安装腔的一侧,所述推动部与芯片触点相对的一面为倾斜面,所述倾斜面为自所述推动部靠近所述滑动部的一端向远离所述芯片触点的方向倾斜。Preferably, the pusher includes a sliding part, a pushing part and a forcing part connected to both ends of the sliding part, the trigger mechanism cooperates with the forcing part, and the pushing part is located away from the chip contacts. One side of the process box installation cavity, the side of the pushing part opposite to the chip contact is an inclined surface, and the inclined surface is from the end of the pushing part close to the sliding part to the direction away from the chip contact tilt.
优选的,所述芯片触点伸缩机构设置于所述第一侧壁背向所述处理盒安装腔的一侧,所述第一侧壁上设置有安装孔和限位孔;Preferably, the chip contact retractable mechanism is arranged on the side of the first side wall facing away from the installation cavity of the process box, and the first side wall is provided with installation holes and limiting holes;
所述芯片触点设置于所述安装孔处;The chip contacts are arranged at the mounting holes;
所述推动件的局部自所述限位孔处伸至所述处理盒安装腔内,所述推动件置于所述限位孔内的部分能够在限位孔内沿推动件推动芯片触点的方向来回移动;A part of the pushing member extends from the limiting hole into the process cartridge installation cavity, and the part of the pushing member placed in the limiting hole can push the chip contact along the pushing member in the limiting hole move back and forth in the direction;
所述触发机构与所述推动件伸至所述处理盒安装腔内的部分配合驱动推动件的移动。The trigger mechanism cooperates with the part of the pusher protruding into the installation chamber of the process cartridge to drive the movement of the pusher.
本申请实施例的第二方面提供一种与如上任一方案所述的图像形成装置配套使用的处理盒,所述处理盒上设置有与所述芯片触点伸缩机构的推动件相匹配的触发机构。The second aspect of the embodiment of the present application provides a process box used in conjunction with the image forming apparatus described in any of the solutions above, the process box is provided with a trigger matching the pusher of the chip contact telescopic mechanism. mechanism.
本申请实施例的第二方面提供的处理盒的有益效果与本申请实施例第一方面提供的图像形成装置的有益效果相同,在此不再赘述。The beneficial effect of the process cartridge provided by the second aspect of the embodiment of the present application is the same as that of the image forming apparatus provided by the first aspect of the embodiment of the present application, and will not be repeated here.
本申请实施例的第三方面还提供一种与如上任一方案所述的图像形 成装置配套使用的处理盒,所述处理盒上设置有与所述芯片触点伸缩机构的推动件相匹配的触发机构,所述触发机构为处理盒挂钩,所述处理盒挂钩设置于所述处理盒上设置有芯片的一端,所述处理盒挂钩与所述处理盒之间留有挂钩间隙;The third aspect of the embodiment of the present application also provides a process box used in conjunction with the image forming apparatus described in any of the solutions above, the process box is provided with a pusher that matches the chip contact telescopic mechanism. A trigger mechanism, the trigger mechanism is a process box hook, the process box hook is set on the end of the process box where the chip is arranged, and there is a hook gap between the process box hook and the process box;
所述推动件伸至所述处理盒安装腔内的端部向上弯折;The end of the pushing member extending into the installation cavity of the process box is bent upward;
所述处理盒安装到位时,所述推动件位于处理盒安装腔内的向上弯折的部分伸入所述挂钩间隙内。When the process box is installed in place, the upwardly bent part of the push member located in the process box installation cavity protrudes into the gap of the hook.
本申请实施例的第三方面提供的处理盒的有益效果为:本申请实施例提供的处理盒上设置有触发机构,使得该处理盒能够区别于其他处理盒,能够有效避免图像形成装置使用不良处理盒导致的图像形成装置损坏问题的产生;并且触发机构设置为处理盒挂钩,处理盒挂钩与处理盒之间留有挂钩间隙,处理盒安装于处理盒安装腔内时,推动件位于处理盒安装腔内的向上弯折的部分伸入挂钩间隙内,挂钩间隙一方面为处理盒的移动提供了让位空间,避免推动件位于处理盒安装腔内的向上弯折的部分挡住处理盒,影响处理盒的下滑安装,另一方面,推动件位于处理盒安装腔内的向上弯折的部分伸入挂钩间隙内,使得处理盒挂钩能够带着推动件移动,实现推动件将芯片触点推至处理盒安装腔内,同时,推动件位于处理盒安装腔内的向上弯折的部分位于挂钩间隙内,在墨盒拆卸时,处理盒挂钩能够钩住推动件,使得处理盒的拆卸带动推动件向远离芯片触点的方向移动,从而使得推动件不在对芯片触点产生作用,进而芯片触点缩回,即复位,实现在处理盒的拆装过程中,芯片触点均不会摩擦到处理盒的端盖。The beneficial effect of the process cartridge provided by the third aspect of the embodiment of the present application is that: the process cartridge provided by the embodiment of the present application is provided with a trigger mechanism, so that the process cartridge can be distinguished from other process cartridges, and can effectively avoid poor use of the image forming device The problem of image forming device damage caused by the process box is generated; and the trigger mechanism is set as a process box hook, and there is a hook gap between the process box hook and the process box. When the process box is installed in the process box installation cavity, the pusher is located in the process box The upwardly bent part in the installation chamber stretches into the hook gap, and the hook gap provides a space for the movement of the process box on the one hand, preventing the upwardly bent part of the pusher from being positioned in the process box installation cavity from blocking the process box and affecting the process box. The sliding installation of the process box, on the other hand, the upwardly bent part of the pusher located in the process box installation cavity extends into the hook gap, so that the handle box hook can move with the pusher, so that the pusher pushes the chip contacts to At the same time, the upwardly bent part of the pusher located in the process cartridge installment cavity is located in the hook gap. When the ink cartridge is dismounted, the handle box hook can hook the pusher, so that the removal of the process box drives the pusher to Move away from the chip contact, so that the pusher no longer acts on the chip contact, and then the chip contact is retracted, that is, reset, so that the chip contact will not rub against the process box during the process of disassembling and assembling the process box end cap.
优选的,所述芯片设置于所述处理盒沿其长度方向的一端的端盖上;Preferably, the chip is arranged on the end cover of one end of the process box along its length direction;
所述第一侧壁为所述处理盒安装腔在处理盒长度方向上的两侧壁中的一个,所述第一侧壁上设置有处理盒滑道,所述第一侧壁在背向所述处理盒安装腔的一侧设置有第一滑道板;The first side wall is one of the two side walls of the process box installation chamber in the process box length direction, the first side wall is provided with a process box slideway, and the first side wall faces away from One side of the process box installation cavity is provided with a first slideway plate;
所述第一滑道板上设置有用于放置芯片触点安装架和芯片触点的安装缺口以及用于安装推动件的导向块,所述导向块上设置有导向滑槽,所述推动件的局部置于所述导向滑槽内且可在导向滑槽内滑动。The first slideway plate is provided with an installation notch for placing the chip contact mounting frame and the chip contact, and a guide block for installing the pusher. The guide block is provided with a guide chute, and the pusher It is partially placed in the guide chute and can slide in the guide chute.
附图说明Description of drawings
图1为图像形成装置与处理盒配合工作的结构示意图;Fig. 1 is a structural schematic diagram of the cooperation between an image forming device and a process box;
图2为本申请实施例图像形成装置的结构示意图;FIG. 2 is a schematic structural diagram of an image forming device according to an embodiment of the present application;
图3为安装有芯片触点伸缩机构的右侧板的结构示意图;Fig. 3 is a structural schematic diagram of the right side plate installed with the chip contact telescopic mechanism;
图4为图3中A处的局部放大图;Fig. 4 is a partial enlarged view of place A in Fig. 3;
图5为滑道板的结构示意图;Fig. 5 is the structural representation of slideway plate;
图6为安装有芯片触点伸缩机构的滑道板的结构示意图;6 is a schematic structural view of a slideway plate equipped with a chip contact telescopic mechanism;
图7为芯片触点伸缩机构的结构示意图;7 is a schematic structural diagram of a chip contact telescopic mechanism;
图8为芯片触点的结构示意图;FIG. 8 is a schematic structural diagram of a chip contact;
图9为安装支架的结构示意图;Figure 9 is a schematic structural view of the mounting bracket;
图10为安装压板的结构示意图;Fig. 10 is the structural schematic diagram of installing pressing plate;
图11为触点弹簧的结构示意图;Figure 11 is a schematic structural view of the contact spring;
图12为推动件的结构示意图;Figure 12 is a schematic structural view of the pusher;
图13为处理盒的结构示意图;Figure 13 is a schematic structural view of the process box;
图14为图13中B处的局部放大图;Fig. 14 is a partial enlarged view of place B in Fig. 13;
图15为处理盒与芯片触点伸缩机构配合的第一状态的结构示意图;Fig. 15 is a structural schematic diagram of the first state in which the process box cooperates with the chip contact retractable mechanism;
图16为图15中C处的局部放大图;Fig. 16 is a partial enlarged view at C in Fig. 15;
图17为处理盒与芯片触点伸缩机构配合的第二状态的结构示意图;Fig. 17 is a structural schematic diagram of the second state in which the process box cooperates with the chip contact retractable mechanism;
图18为图17中D处的局部放大图;Figure 18 is a partial enlarged view at D in Figure 17;
图19为处理盒与芯片触点伸缩机构配合的第三状态的结构示意图;Fig. 19 is a structural schematic diagram of a third state in which the process cartridge cooperates with the chip contact retractable mechanism;
图20为图19中E处的局部放大图;Figure 20 is a partial enlarged view at E in Figure 19;
图21为处理盒与芯片触点伸缩机构配合的第三状态的结构示意图;Fig. 21 is a schematic structural view of the third state in which the process box cooperates with the chip contact retractable mechanism;
图22为图21中F处的局部放大图;Figure 22 is a partial enlarged view at F in Figure 21;
图23为芯片触点伸出状态的结构示意图。FIG. 23 is a schematic structural view of the chip contact extended state.
具体实施方式Detailed ways
在相关技术中,处理盒上的芯片和处理盒安装腔侧壁板上的芯片触点均为固定设置,且芯片触点向处理盒安装腔内凸出,这便使得处理盒在插入图像形成装置本体的过程中,芯片触点会持续摩擦处理盒端盖,使得处理盒端盖在摩擦的作用下产生碎屑,污染芯片,导致芯片无法识别,同时芯片触点也会对芯片产生磨损。In the related art, the chips on the process box and the chip contacts on the side wall of the process box installation cavity are all fixedly arranged, and the chip contacts protrude into the process box installation cavity, which makes the process box insert the image forming During the process of the device body, the chip contacts will continue to rub against the end cover of the process box, causing the end cover of the process box to generate debris under the action of friction, contaminating the chip, making the chip unrecognizable, and at the same time, the chip contact will also wear the chip.
有鉴于此,本申请实施例通过设置芯片触点伸缩机构使得芯片触点在图像形成装置本体上能够伸缩来避免处理盒安装时芯片触点对处理盒以及芯片的磨损,具体的,芯片触点伸缩机构设置在处理盒安装腔对应处理盒芯片一侧的侧壁板上,芯片触点伸缩机构通过推动件推动芯片触点使得处理盒安装到位时,芯片触点刚好被推动件推出实现芯片触点与芯片的接触,并且处理盒在抽出时,通过推动件回位不再对芯片触点有推动挤压力,进而芯片触点缩回原位,实现处理盒插入或抽出时,芯片触点均不对处理盒和芯片造成磨损。In view of this, in the embodiment of the present application, the chip contact can be stretched and retracted on the image forming apparatus body by setting the chip contact retractable mechanism to avoid the wear and tear of the chip contact on the process cartridge and the chip when the process cartridge is installed, specifically, the chip contact The telescopic mechanism is arranged on the side wall plate of the process box installation cavity corresponding to the chip side of the process box. The chip contact telescopic mechanism pushes the chip contact through the pusher so that when the process box is installed in place, the chip contact is just pushed out by the pusher to realize chip contact. point contact with the chip, and when the processing box is pulled out, there is no pushing force on the chip contact through the return of the pusher, and then the chip contact is retracted to the original position, so that when the processing box is inserted or pulled out, the chip contact Neither causes wear on the process cartridge and chips.
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请的一部分实施例,而不是全部的实施例。The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them.
实施例一Embodiment one
图1为图像形成装置与处理盒配合工作的结构示意图;图2为本申请实施例图像形成装置的结构示意图;图3为安装有芯片触点伸缩机构的右侧板的结构示意图;图4为图3中A处的局部放大图;图5为滑道板的结构示意图;图6为安装有芯片触点伸缩机构的滑道板的结构示意图;图7为芯片触点伸缩机构的结构示意图;图8为芯片触点的结构示意图;图9为安装支架的结构示意图;图10为安装压板的结构示意图;图11为触点弹簧的结构示意图;图12为推动件的结构示意图;图23为芯片触点伸出状态的结构示意图。Fig. 1 is a schematic diagram of the structure of an image forming device and a process box; Fig. 2 is a schematic diagram of the structure of an image forming device according to an embodiment of the present application; Fig. 3 is a schematic diagram of the structure of a right side panel equipped with a chip contact retractable mechanism; Fig. 4 is Figure 3 is a partial enlarged view of A; Figure 5 is a schematic structural view of the slideway plate; Figure 6 is a schematic structural view of a slideway plate equipped with a chip contact telescopic mechanism; Figure 7 is a structural schematic diagram of a chip contact telescopic mechanism; Fig. 8 is a schematic structural diagram of a chip contact; Fig. 9 is a schematic structural diagram of a mounting bracket; Fig. 10 is a schematic structural diagram of a mounting plate; Fig. 11 is a schematic structural diagram of a contact spring; Fig. 12 is a schematic structural diagram of a pusher; Schematic diagram of the structure of the chip contact extended state.
如图1所示,图像形成装置包括送纸装置400、定影装置600以及排纸装置500。处理盒300包括感光鼓、转印辊330、粉仓、废粉仓、端盖及齿轮组等构件,端盖上设置有芯片,粉仓上安装有送粉辊、显影辊以及出粉刀。废粉仓上安装有充电辊、感光鼓以及清洁刮刀。其中,粉仓与废粉仓内部都分别设置有用于容纳碳粉的腔室,送粉辊设置在粉仓腔室的出口处,显影辊设置在送粉辊的外侧,送粉辊将粉仓内的碳粉转载至显影辊上。出粉刀也设置在粉仓腔室的出口一侧,出粉刀包括两部分,其中一部分为较厚的出粉刀安装部,出粉刀安装部通过螺钉固定在粉仓上,另一部分为较薄的出粉刀接触部,出粉刀接触部的端部与显影辊的表面接触,出粉刀固定在粉仓之后,就能够限制显影辊表面的碳粉的厚度。As shown in FIG. 1 , the image forming apparatus includes a paper feeding device 400 , a fixing device 600 and a paper discharge device 500 . The process box 300 includes components such as a photosensitive drum, a transfer roller 330, a powder bin, a waste toner bin, an end cover, and a gear set. Chips are arranged on the end cover, and a powder feeding roller, a developing roller, and a powder outlet knife are installed on the powder bin. The charging roller, photosensitive drum, and cleaning blade are installed on the waste toner box. Among them, the interior of the powder bin and the waste toner bin are respectively provided with chambers for accommodating toner, the powder feeding roller is arranged at the outlet of the powder bin chamber, the developing roller is arranged outside the powder feeding roller, and the powder feeding roller turns the powder bin The toner inside is transferred to the developing roller. The powder outlet knife is also set on the outlet side of the powder bin chamber. The powder outlet knife consists of two parts, one of which is a thicker powder outlet knife installation part, which is fixed on the powder bin by screws, and the other part is The thinner powder outlet knife contact part, the end of the powder outlet knife contact part is in contact with the surface of the developing roller, and the powder outlet knife is fixed behind the powder bin, which can limit the thickness of the toner on the surface of the developing roller.
图像形成装置工作时,纸张P通过送纸装置400送出,并沿图1中虚线及箭头所示方向移动,先经过处理盒300,处理盒300内的碳粉在处理盒300内的感光鼓与转印辊330的共同作用转印至纸张P上,纸张P之后再经过定影装置600,定影装置600通过辊轮对纸张P进行加压加热处理,以使碳粉固定在纸张P上,最后纸张P再经过排纸装置500排出图像形成装置之外。When the image forming device is in operation, the paper P is sent out by the paper feeding device 400, and moves along the direction shown by the dotted line and the arrow in FIG. The joint effect of the transfer roller 330 is transferred to the paper P, and then the paper P passes through the fixing device 600, and the fixing device 600 pressurizes and heats the paper P through the rollers, so that the toner is fixed on the paper P, and finally the paper P P is then discharged out of the image forming apparatus through the paper discharge device 500 .
如图2-7所示,本申请实施例提供的图像形成装置包括图像形成装置本体100,图像形成装置本体100上设置有用于安装处理盒300的处理盒安装腔110,处理盒安装腔110包括与处理盒300设置有芯片310的一侧相对的第一侧壁120,第一侧壁120处设置有芯片触点伸缩机构200,也就是说处理盒300安装于处理盒安装腔110内时,处理盒安装腔110内与处理盒300上设置有芯片310的一侧相对的侧壁处设置有芯片触点伸缩机构200,即当芯片310安装于处理盒300沿其长度方向的一端的端盖上时,芯片触点伸缩机构200设置于处理盒安装腔110内与处理盒300安装有芯片310的端盖相对的侧壁上,而该侧壁即为第一侧壁120。As shown in FIGS. 2-7 , the image forming apparatus provided by the embodiment of the present application includes an image forming apparatus body 100, and the image forming apparatus body 100 is provided with a process cartridge installation cavity 110 for installing a process cartridge 300. The process cartridge installation cavity 110 includes On the first side wall 120 opposite to the side where the chip 310 is provided with the process box 300, the first side wall 120 is provided with a chip contact retractable mechanism 200, that is to say, when the process box 300 is installed in the process box installation cavity 110, A chip contact retractable mechanism 200 is provided on the side wall opposite to the side where the chip 310 is arranged on the process box 300 in the process box mounting chamber 110, that is, when the chip 310 is installed on the end cap of the process box 300 along its lengthwise direction. When it is on top, the chip contact retractable mechanism 200 is disposed on the side wall of the process box installation cavity 110 opposite to the end cover of the process box 300 where the chip 310 is installed, and the side wall is the first side wall 120 .
芯片触点伸缩机构200包括若干个芯片触点220、用于安装芯片触点220的芯片触点安装架、推动芯片触点220向处理盒安装腔110内移动的推动件210和用于导通芯片触点220与图像形成装置的基板触点的信号导通件250,信号导通件250的一端与芯片触点220连接,另一端与图像形成装置的基板触点连接,信号导通件250用于连接芯片触点220和图像形成装置的电路板,进而实现处理盒300上的芯片310通过芯片触点220与图像形成装置电路板之间的信号传输。The chip contact retractable mechanism 200 includes several chip contacts 220, a chip contact mounting frame for installing the chip contacts 220, a pusher 210 for pushing the chip contacts 220 to move in the process box installation cavity 110, and a chip contact for conducting The chip contact 220 is connected to the signal conductor 250 of the substrate contact of the image forming device. One end of the signal conductor 250 is connected to the chip contact 220, and the other end is connected to the substrate contact of the image forming device. The signal conductor 250 The chip contact 220 is used to connect the circuit board of the image forming device, so as to realize signal transmission between the chip 310 on the process box 300 and the circuit board of the image forming device through the chip contact 220 .
基于处理盒300在安装时,处理盒300顺着处理盒安装腔110侧壁上的滑道向下滑入安装,处理盒300在拆卸时,处理盒300顺着处理盒安装腔110侧壁上的滑道向上抽拉滑出,故为实现推动件210的移动,处理盒300上设置有与推动件210相匹配的触发机构,触发机构随着处理盒300的拆装而移动,进而带动推动件210移动。When the process box 300 is installed, the process box 300 slides down into the installation along the slideway on the side wall of the process box installation cavity 110; The slideway pulls upwards and slides out, so in order to realize the movement of the pusher 210, the process box 300 is provided with a trigger mechanism matched with the pusher 210, and the trigger mechanism moves along with the disassembly of the process box 300, and then drives the pusher 210 moves.
在本申请实施例中,处理盒300装入处理盒安装腔110内的过程中,触发机构随处理盒300向处理盒安装腔110内移动,当触发机构与推动件210接触时,推动件210在触发机构的作用下推动芯片触点220向处理盒 安装腔110内移动,芯片触点220刚开始移动时,芯片触点220与处理盒300的端盖以及芯片310均不接触,当处理盒300安装到位时,芯片触点220伸出到位,芯片触点220与芯片310接触,此设置使得处理盒300在安装的过程中,芯片触点220不会摩擦到处理盒300的端盖,即避免了处理盒300端盖产生碎屑,污染芯片310的情况发生,同时此设置也避免了芯片触点220摩擦芯片310导致芯片310磨损的情况发生。In the embodiment of the present application, during the process of loading the process cartridge 300 into the process cartridge installation chamber 110, the trigger mechanism moves into the process cartridge installation chamber 110 along with the process cartridge 300. When the trigger mechanism contacts the pusher 210, the pusher 210 Under the action of the trigger mechanism, the chip contact 220 is pushed to move in the process box installation cavity 110. When the chip contact 220 just started to move, the chip contact 220 did not contact with the end cover of the process box 300 and the chip 310. When the process box When 300 is installed in place, chip contact 220 stretches out in place, and chip contact 220 contacts with chip 310, and this setting makes process box 300 in the process of installing, and chip contact 220 can not rub against the end cover of process box 300, namely The chip 310 is prevented from being polluted by debris from the end cover of the process box 300 , and at the same time, the chip contact 220 is prevented from rubbing against the chip 310 to cause the chip 310 to be worn.
参考图6和图7所示,本申请实施例中的芯片触点安装架用于安装芯片触点220,推动件210直接推动芯片触点220摆动,即推动件210直接推动芯片触点220向处理盒安装腔110内移动,芯片触点安装架的位置保持不变,此设置可以简化芯片触点220摆动的结构,减少芯片触点220摆动所需要的空间。Referring to Fig. 6 and Fig. 7, the chip contact mounting frame in the embodiment of the present application is used to install the chip contact 220, and the pusher 210 directly pushes the chip contact 220 to swing, that is, the pusher 210 directly pushes the chip contact 220 to The position of the chip contact mounting rack remains unchanged when the process box moves inside the cavity 110 . This setting can simplify the swinging structure of the chip contact 220 and reduce the space required for the chip contact 220 to swing.
在本申请的一些实施例中,芯片触点220包括设置于芯片触点安装架上的固定端和远离固定端的自由端222,也就是说,芯片触点220的一端固定连接于芯片触点安装架上,另一端为自由端222,此设置使得芯片触点220的自由端222能够绕芯片触点220的固定端转动,即芯片触点220的自由端222在推动件210的作用下能够以芯片触点220的固定端为旋转中心向处理盒安装腔110内转动。In some embodiments of the present application, the chip contact 220 includes a fixed end arranged on the chip contact mounting frame and a free end 222 away from the fixed end, that is to say, one end of the chip contact 220 is fixedly connected to the chip contact mounting frame. The other end is the free end 222. This setting enables the free end 222 of the chip contact 220 to rotate around the fixed end of the chip contact 220, that is, the free end 222 of the chip contact 220 can be moved by the pusher 210 The fixed end of the chip contact 220 is the center of rotation and rotates into the process cartridge installation cavity 110 .
为实现推动件210推动芯片触点220的自由端222向处理盒安装腔110内转动,推动件210具有与触发机构配合的端部,触发机构通过推动推动件210的端部移动实现推动件210整体的移动,推动件210远离其与触发机构配合的端部的一端设置于芯片触点220的自由端222处,且位于芯片触点220自由端222背向处理盒安装腔110的一侧,也就是说,推动件210的一端与触发机构配合,另一端置于芯片触点220远离处理盒安装腔110的一侧。处理盒300在装入处理盒安装腔110内的过程中,推动件210在触发机构的作用下自芯片触点220的自由端222向芯片触点220的固定端移动,从而使得芯片触点220自由端222在推动件210的作用下以芯片触点220的固定端为中心向芯片310的方向转动,即将芯片触点220的自由端222向处理盒安装腔110内推动,推动的起始阶段,芯片触点220与芯片310和墨盒的端盖均不接触,当处理盒300在处理盒安装腔110内安装到位时,芯片触点220完全伸出且与芯片310接触,芯片触点220转 动式的伸出方式,减小了促使芯片触点220伸缩所需要的空间,并且推动件210自芯片触点220的自由端222伸入至芯片触点220的下部(图6中推动件210伸入芯片触点220的后端,图7中推动件210伸入芯片触点220的下部),减小了芯片触点伸缩机构200在芯片触点220伸缩方向上的安装空间。In order to realize that the free end 222 of the pusher 210 pushes the chip contact 220 to rotate in the process cartridge installation cavity 110, the pusher 210 has an end that cooperates with the trigger mechanism, and the trigger mechanism realizes the pusher 210 by pushing the end of the pusher 210 to move. Overall movement, one end of the pusher 210 away from the end that it cooperates with the trigger mechanism is arranged at the free end 222 of the chip contact 220, and is positioned at the side of the free end 222 of the chip contact 220 facing away from the process box installation cavity 110, That is to say, one end of the pushing member 210 cooperates with the trigger mechanism, and the other end is placed on the side of the chip contact 220 away from the process cartridge installation cavity 110 . Process cartridge 300 is in the process of being packed into process cartridge installation chamber 110, and pusher 210 moves to the fixed end of chip contact 220 from the free end 222 of chip contact 220 under the effect of trigger mechanism, thereby makes chip contact 220 The free end 222 rotates towards the direction of the chip 310 with the fixed end of the chip contact 220 as the center under the action of the pusher 210, that is, the free end 222 of the chip contact 220 is pushed in the process box installation cavity 110, and the initial stage of pushing , the chip contact 220 is not in contact with the chip 310 and the end cap of the ink cartridge. When the process cartridge 300 is installed in place in the process cartridge installation cavity 110, the chip contact 220 is fully stretched out and contacts the chip 310, and the chip contact 220 rotates The protruding way of the formula reduces the space required to promote the expansion and contraction of the chip contact 220, and the pusher 210 extends from the free end 222 of the chip contact 220 to the bottom of the chip contact 220 (the pusher 210 extends in FIG. Into the rear end of the chip contact 220, the pusher 210 extends into the bottom of the chip contact 220 in FIG.
如图7所示,在本申请的一些实施例中,芯片触点安装架包括安装支架230和安装压板240,安装支架230用于安装芯片触点220,安装压板240用于固定信号导通件250。As shown in FIG. 7 , in some embodiments of the present application, the chip contact mounting frame includes a mounting bracket 230 and a mounting pressure plate 240, the mounting bracket 230 is used to mount the chip contacts 220, and the mounting pressure plate 240 is used to fix the signal conductor 250.
如图9所示,安装支架230包括芯片触点安装板231和连接于芯片触点安装板231两侧的安装侧板232,即安装侧板232为两个,两个安装侧板232分别连接于芯片触点安装板231长度方向的两端,安装压板240位于两个安装侧板232之间,且安装压板240的两端分别连接于两个安装侧板232上,安装压板240与芯片触点安装板231平行设置,信号导通件250位于安装压板240与芯片触点安装板231之间。As shown in Figure 9, the mounting bracket 230 includes a chip contact mounting plate 231 and mounting side plates 232 connected to both sides of the chip contact mounting plate 231, that is, there are two mounting side plates 232, and the two mounting side plates 232 are respectively connected At both ends of the chip contact mounting plate 231 in the length direction, the mounting pressure plate 240 is located between the two mounting side plates 232, and the two ends of the mounting pressure plate 240 are respectively connected to the two mounting side plates 232, and the mounting pressure plate 240 is connected to the chip contact. The point mounting plate 231 is arranged in parallel, and the signal conductor 250 is located between the mounting platen 240 and the chip contact mounting plate 231 .
芯片触点220沿芯片触点安装板231的宽度方向设置于芯片触点安装板231上,芯片触点220的固定端绕芯片触点安装板231宽度方向的一端翻折至芯片触点安装板231的背面上,芯片触点220的自由端222自芯片触点安装板231宽度方向的另一端伸出芯片触点安装板231,芯片触点220的自由端222伸出芯片触点安装板231为推动件210移动至芯片触点220的下部(图7中推动件210伸入芯片触点220的下部)提供伸入空间,便于推动件210推动芯片触点220移动。The chip contact 220 is arranged on the chip contact mounting plate 231 along the width direction of the chip contact mounting plate 231, and the fixed end of the chip contact 220 is folded around one end of the chip contact mounting plate 231 in the width direction to the chip contact mounting plate On the back side of 231, the free end 222 of chip contact 220 stretches out chip contact mounting plate 231 from the other end of chip contact mounting plate 231 width direction, and the free end 222 of chip contact 220 stretches out chip contact mounting plate 231 A space is provided for the pusher 210 to move to the lower part of the chip contact 220 (the pusher 210 extends into the lower part of the chip contact 220 in FIG. 7 ), so that the pusher 210 pushes the chip contact 220 to move.
可以理解的是,此处所述的“芯片触点安装板231的背面”指的是芯片触点安装板231朝向安装压板240的一面。It can be understood that the “rear side of the chip contact mounting plate 231 ” mentioned here refers to the side of the chip contact mounting plate 231 facing the mounting platen 240 .
如图11所示,信号导通件250包括信号导通件250主体和设置于信号导通件250主体下端的连接导线252,连接导线252连接于图像形成装置的基板触点上。信号导通件250主体挤压于翻折至芯片触点安装板231背面的芯片触点220和安装压板240之间,也就是说,信号导通件250主体的一端抵接于翻折至芯片触点安装板231背面的芯片触点220上,另一端抵接于安装压板240上,信号导通件250主体通过芯片触点安装板231、翻折至芯片触点安装板231背面的芯片触点220和安装压板240的配合实 现将信号导通件250的主体挤压于翻折至芯片触点安装板231背面的芯片触点220和安装压板240之间,该设置便于信号导通件250的安装,减少了信号导通件250的固定件。As shown in FIG. 11 , the signal conducting member 250 includes a main body of the signal conducting member 250 and a connecting wire 252 disposed at the lower end of the main body of the signal conducting member 250 . The connecting wire 252 is connected to the substrate contact of the image forming device. The main body of the signal conducting member 250 is squeezed between the chip contact 220 folded to the back of the chip contact mounting plate 231 and the mounting platen 240, that is to say, one end of the main body of the signal conducting member 250 abuts against the folded to the chip On the chip contact 220 on the back of the contact mounting plate 231, the other end abuts on the mounting pressure plate 240, and the main body of the signal conductor 250 passes through the chip contact mounting plate 231 and is folded to the chip contact on the back of the chip contact mounting plate 231. The cooperation between the point 220 and the mounting pressure plate 240 realizes that the main body of the signal conducting member 250 is squeezed between the chip contact 220 and the mounting pressing plate 240 folded to the back of the chip contact mounting plate 231. This arrangement facilitates the signal conducting member 250 The installation of the signal conductor 250 reduces the fixing parts.
在本申请的一些可能的实施例中,芯片触点安装板231上对应芯片触点220设置有若干个安装指示块236,芯片触点220对应安装于安装指示块236上,此设置便于芯片触点220的安装,使得芯片触点220的安装位置精确,避免安装偏移导致芯片触点220与芯片310不能够很好的接触。In some possible embodiments of the present application, the chip contact mounting plate 231 is provided with several installation indicator blocks 236 corresponding to the chip contacts 220, and the chip contacts 220 are correspondingly installed on the installation indicator blocks 236. This setting is convenient for the chip contact. The installation of the point 220 makes the installation position of the chip contact 220 accurate, and avoids the installation offset that causes the chip contact 220 and the chip 310 to not be in good contact.
在本申请的一些实施例中,信号导通件250主体为触点弹簧251,即信号导通件250主体为弹簧件。如图9和图10所示,安装支架230还包括限位板233,限位板233设置于芯片触点安装板231的下方且连接于两个安装侧板232之间,限位板233上对应芯片触点220的安装位置设置有限位安装孔234,安装压板240的上端对应限位安装孔234设置有卡凸244,触点弹簧251的上端穿过限位安装孔234抵接于芯片触点220上,触点弹簧251的下端置于卡凸244上,限位安装孔234和卡凸244以及安装压板240配合实现对触点弹簧251位置的固定,同时安装压板240安装于安装侧板232时,安装压板240压缩触点弹簧251,使得触点弹簧251收缩,进而使得触点弹簧251顶紧芯片触点220,从而使芯片触点220固定连接于芯片触点安装板231上,并实现导通。当然,芯片触点220与芯片触点安装板231还可以通过其他的连接方式加固连接。In some embodiments of the present application, the main body of the signal conducting member 250 is a contact spring 251 , that is, the main body of the signal conducting member 250 is a spring member. As shown in Figure 9 and Figure 10, the mounting bracket 230 also includes a limiting plate 233, the limiting plate 233 is arranged below the chip contact mounting plate 231 and connected between the two mounting side plates 232, on the limiting plate 233 A limit installation hole 234 is provided corresponding to the installation position of the chip contact 220, and the upper end of the installation pressure plate 240 is provided with a card protrusion 244 corresponding to the limit installation hole 234, and the upper end of the contact spring 251 passes through the limit installation hole 234 to abut against the chip contact. At point 220, the lower end of the contact spring 251 is placed on the card protrusion 244, the limit installation hole 234 cooperates with the card protrusion 244 and the installation pressure plate 240 to realize the fixing of the position of the contact spring 251, and the installation pressure plate 240 is installed on the installation side plate 232, the installation pressure plate 240 compresses the contact spring 251, so that the contact spring 251 shrinks, and then the contact spring 251 is pressed against the chip contact 220, so that the chip contact 220 is fixedly connected to the chip contact mounting plate 231, and achieve conduction. Certainly, the chip contact 220 and the chip contact mounting plate 231 can also be reinforced and connected through other connection methods.
值得说明的是,在本申请芯片触点安装架为绝缘材料加工制作。It is worth noting that, in this application, the chip contact mounting frame is made of insulating material.
如图10所示,安装压板240包括定位板241、连接于定位板241上的固定板243和两个连接卡钩,卡凸244设置于定位板241上,两个连接卡钩的下端分别连接于定位板241上,上端均设置有向背离定位板241方向弯折的挂钩,限位板233与芯片触点安装板231之间的两个安装侧板232上均设置有钩挂孔,限位板233上设置有两个让位孔,两个连接卡钩分别穿过两个让位孔后对应钩挂于两个钩挂孔内,安装压板240通过两个连接卡钩卡接于安装支架230上,安装方式简单。As shown in Figure 10, the mounting platen 240 includes a positioning plate 241, a fixing plate 243 connected to the positioning plate 241 and two connecting hooks, the locking protrusion 244 is arranged on the positioning plate 241, and the lower ends of the two connecting hooks are connected On the positioning plate 241, the upper end is provided with a hook bent away from the positioning plate 241, and the two mounting side plates 232 between the limiting plate 233 and the chip contact mounting plate 231 are provided with hook holes. The position plate 233 is provided with two relief holes, and the two connection hooks pass through the two relief holes respectively and are hooked in the two hook holes respectively. On the bracket 230, the installation method is simple.
进一步的,定位板241相对的两端上分别设置有向上凸起的限位边沿245,其中一个限位边沿245上对应卡凸244设置有让位缺口246,连接导线252自让位缺口246处伸出,安装压板240通过两个连接钩板242钩挂 于两个安装侧板232上后,定位板241置于限位板233的下部且两个限位边沿245卡于限位板233的两侧,两个限位边沿245对安装压板240起到限位作用,使其不能够沿垂直于限位边沿245的方向上晃动,同时连接卡钩卡接于挂钩孔235内后,触点弹簧251向外推动安装压板240使得安装压板240在触点弹簧251伸缩的方向上的位置稳定性,安装压板240位置的稳固能够保证触点弹簧251与芯片触点220能够始终接触良好。Further, the opposite ends of the positioning plate 241 are respectively provided with upwardly protruding limiting edges 245, and one of the limiting edges 245 is provided with a gap 246 corresponding to the locking protrusion 244, and the connecting wire 252 is located at the gap 246. Stretch out, after the installation pressure plate 240 is hooked on the two installation side plates 232 through the two connecting hook plates 242, the positioning plate 241 is placed on the lower part of the limit plate 233 and the two limit edges 245 are stuck on the limit plate 233. On both sides, the two limiting edges 245 play a limiting role on the installation pressure plate 240, so that it cannot shake along the direction perpendicular to the limiting edges 245. At the same time, after the connecting hook is engaged in the hook hole 235, the contact The spring 251 pushes the mounting platen 240 outward to stabilize the position of the mounting platen 240 in the direction in which the contact spring 251 expands and contracts. The stability of the position of the mounting platen 240 can ensure that the contact spring 251 and the chip contact 220 can always be in good contact.
固定板243固定连接于定位板241与让位缺口246相对的一端上,固定板243上设置有安装通孔247,安装通孔247用于将固定板243通过连接件连接于图像形成装置本体100的基板上。进一步的,两个安装侧板232远离芯片触点安装板231的一端设置有卡钩,图像形成装置本体100的基板上设置有与卡钩对应的卡钩安装孔123,芯片触点安装架通过两个安装侧板232上的卡钩与图像形成装置本体100的基板上的卡钩安装孔123配合,以及固定板243通过连接件连接于图像形成装置本体100的基板上实现了芯片触点安装架连接于图像形成装置本体100的基板上。The fixing plate 243 is fixedly connected to the end of the positioning plate 241 opposite to the relief notch 246. The fixing plate 243 is provided with an installation through hole 247, and the installation through hole 247 is used to connect the fixing plate 243 to the image forming apparatus body 100 through a connecting piece. on the substrate. Further, hooks are provided at the ends of the two installation side plates 232 away from the chip contact mounting plate 231, hook installation holes 123 corresponding to the hooks are provided on the substrate of the image forming apparatus body 100, and the chip contact mounting frame passes through The hooks on the two mounting side plates 232 cooperate with the hook mounting holes 123 on the substrate of the image forming apparatus body 100, and the fixing plate 243 is connected to the substrate of the image forming apparatus body 100 through connectors to realize chip contact installation. The frame is connected to the substrate of the image forming apparatus body 100 .
如图9所示,在本申请的一些实施例中,芯片触点220包括弹片221和设置于弹片221上用于与芯片310接触的凸点223,弹片221的其中一端向背向凸点223的一侧翻折,弹片221的翻折端为芯片触点220的自由端222,也就是说,弹片221的自由端222向背向凸点223的一侧翻折。由于该芯片触点220的伸出为倾斜伸出,即自由端222绕固定端转动伸出,弹片221上设置凸点223用于与芯片310接触,芯片触点220伸出时,与芯片310接触的点可以为弹片221上凸点223的侧周部,由此增加了芯片触点220与芯片310的接触面积,并且能够保证芯片触点220能够与芯片310较好的接触。另一方面,芯片触点220使用弹片221,弹片221自身具有弹力,其可以在推动件210回位后,利用自身的弹力复位,保证了处理盒300在抽出处理盒安装腔110时,处理盒300的芯片310和端盖同样也不会被芯片触点220摩擦到。弹片221的自由端222向背向凸点223的一侧翻折,此设置使得弹片221的自由端222对推动件210的移动起到导向作用,便于推动件210移动至芯片触点220的下部(如图7所示,推动件210伸入芯片触点220的下部),进而将弹片221推出安装孔123,并且弹片221的自由端222向背向凸点223的一侧翻折使得弹片221的翻折 端形成倾斜面,弹片221自由端222的倾斜面与下述推动件210的倾斜面214配合,可以减少推动件210的滑动行程。As shown in FIG. 9 , in some embodiments of the present application, the chip contact 220 includes an elastic piece 221 and a bump 223 arranged on the elastic piece 221 for contacting with the chip 310 , and one end of the elastic piece 221 faces away from the bump 223 . One side is folded, and the folded end of the elastic piece 221 is the free end 222 of the chip contact 220 , that is, the free end 222 of the elastic piece 221 is folded toward the side facing away from the bump 223 . Since the extension of the chip contact 220 is inclined, that is, the free end 222 rotates and extends around the fixed end, and the elastic piece 221 is provided with a bump 223 for contacting the chip 310. The point of contact can be the side periphery of the bump 223 on the elastic piece 221 , thereby increasing the contact area between the chip contact 220 and the chip 310 , and ensuring that the chip contact 220 can be in good contact with the chip 310 . On the other hand, the chip contact 220 uses the elastic piece 221, and the elastic piece 221 itself has elastic force, which can be reset by its own elastic force after the pusher 210 returns, so that when the process box 300 is drawn out of the process box installation cavity 110, the process box Chip 310 and end caps of 300 are also not rubbed by chip contacts 220 . The free end 222 of the elastic piece 221 is folded to the side facing away from the protruding point 223. This setting makes the free end 222 of the elastic piece 221 guide the movement of the pusher 210, so that the pusher 210 moves to the bottom of the chip contact 220 ( As shown in Figure 7, the pusher 210 extends into the lower part of the chip contact 220), and then the elastic piece 221 is pushed out of the mounting hole 123, and the free end 222 of the elastic piece 221 is turned over to the side facing away from the bump 223 so that the turning of the elastic piece 221 The folded end forms an inclined surface, and the inclined surface of the free end 222 of the elastic piece 221 cooperates with the inclined surface 214 of the pusher 210 to reduce the sliding stroke of the pusher 210 .
如图12所示,推动件210包括滑动部211和连接于滑动部211两端的推动部213与迫推部212,触发机构与迫推部212配合,推动部213位于芯片触点220自由端222远离处理盒安装腔110的一侧,推动部213与芯片触点220相对的一面为倾斜面214,倾斜面214为自推动部213靠近滑动部211的一端向远离芯片触点220的方向倾斜,即如图12所示的,推动部213的上平面与滑动部211的上平面齐平,推动部213远离滑动部211的一端向下倾斜,且整体的倾斜面214向上凸起。推动部213的倾斜面214的设置一方面便于推动部213伸入芯片触点220的下部(如图7所示,推动件210伸入芯片触点220的下部),另一方面,推动部213的倾斜面214与弹片221自由端222的倾斜面配合,可以减少推动件210的滑动行程。As shown in Figure 12, the pusher 210 includes a sliding part 211, a pushing part 213 and a forcing part 212 connected to both ends of the sliding part 211, the trigger mechanism cooperates with the forcing part 212, and the pushing part 213 is located at the free end 222 of the chip contact 220. On the side away from the process box mounting chamber 110, the side of the pushing portion 213 opposite to the chip contact 220 is an inclined surface 214, and the inclined surface 214 is inclined from the end of the pushing portion 213 near the sliding portion 211 to the direction away from the chip contact 220, That is, as shown in FIG. 12 , the upper plane of the pushing part 213 is flush with the upper plane of the sliding part 211 , the end of the pushing part 213 away from the sliding part 211 is inclined downwards, and the entire inclined surface 214 protrudes upwards. The setting of the inclined surface 214 of the push portion 213 facilitates the push portion 213 to extend into the bottom of the chip contact 220 on the one hand (as shown in FIG. The inclined surface 214 of the elastic piece 221 cooperates with the inclined surface of the free end 222 of the elastic piece 221 to reduce the sliding stroke of the pusher 210 .
如图2-图7所示,在本申请的一些实施例中,芯片触点伸缩机构200设置于第一侧壁120背向处理盒安装腔110的一侧,第一侧壁120上设置有安装孔123和限位孔122,芯片触点220和芯片触点安装架设置于安装孔123处,推动件210的局部自限位孔122处伸至处理盒安装腔110内,限位孔122为长条孔,其长度方向与推动件210的移动方向相同,推动件210置于限位孔122内的部分能够在限位孔122内沿推动件210推动芯片触点220的方向来回移动,即限位孔122限制推动件210沿其长度方向前后移动,对推动件210的移动起到导向作用以及让位作用。触发机构与推动件210伸至处理盒安装腔110内的部分配合驱动推动件210的移动,也就是说,触发机构设置于处理盒300上,处理盒300安装于处理盒安装腔110内,推动件210伸至处理盒安装腔110内以实现能够与触发机构配合。As shown in FIGS. 2-7 , in some embodiments of the present application, the chip contact retractable mechanism 200 is arranged on the side of the first side wall 120 facing away from the process box installation cavity 110, and the first side wall 120 is provided with Mounting hole 123 and limiting hole 122, chip contact 220 and chip contact mounting frame are arranged at mounting hole 123 places, and the part of pushing member 210 stretches in the process box installation chamber 110 from limiting hole 122 places, and limiting hole 122 It is a long hole, and its length direction is the same as the moving direction of the pusher 210. The part of the pusher 210 placed in the limit hole 122 can move back and forth in the limit hole 122 along the direction in which the pusher 210 pushes the chip contact 220, That is, the limiting hole 122 restricts the forward and backward movement of the pusher 210 along its length direction, and plays a role of guiding and giving way to the movement of the pusher 210 . The trigger mechanism and the part of the pusher 210 extending into the process box installation cavity 110 cooperate to drive the movement of the pusher 210, that is to say, the trigger mechanism is arranged on the process box 300, and the process box 300 is installed in the process box installation cavity 110. The member 210 protrudes into the process cartridge installation cavity 110 so as to be able to cooperate with the trigger mechanism.
在本申请的一些优选的实施例中,芯片310设置于处理盒300沿其长度方向的一端的端盖上,第一侧壁120为处理盒安装腔110在处理盒300长度方向上的两侧壁中的一个,在本实施例中,第一侧壁120为处理盒安装腔110的右侧板(以图像形成装置的前面为前侧)上,由于处理盒300上的芯片310一般设置于处理盒300的右侧(以处理盒300安装于图像形成装置本体100上的方向为基准)端盖处,因此将芯片触点伸缩机构200 设置于处理盒安装腔110的右侧板上能够减少对图像形成装置本体100以及处理盒300原本结构的改动,更便于加工生产,也就是说,本申请实施例的图像形成装置仅需要在处理盒安装腔110的右侧板上以及右侧板右侧的图像形成装置本体100内部区域内设置芯片触点伸缩机构200安装位点即可,而对于下述实施例二中与该图像形成装置配套使用的处理盒300,仅需要在处理盒300右侧端盖处设置芯片触点伸缩机构200的触发机构即可,无需改动芯片310的安装位置,也无需改动处理盒300的结构,改进方式简单。In some preferred embodiments of the present application, the chip 310 is arranged on the end cover of one end of the process box 300 along its length direction, and the first side wall 120 is the two sides of the process box installation cavity 110 in the process box 300 length direction One of the walls, in this embodiment, the first side wall 120 is on the right side plate (with the front of the image forming device as the front side) of the process box installation chamber 110, because the chip 310 on the process box 300 is generally arranged on The right side of the process box 300 (with the direction in which the process box 300 is installed on the image forming apparatus body 100 as a reference) at the end cover, so the chip contact retractable mechanism 200 is arranged on the right side plate of the process box installation cavity 110 to reduce the The modification of the original structure of the image forming apparatus body 100 and the process box 300 is more convenient for processing and production. It is enough to set the mounting position of the chip contact retractable mechanism 200 in the inner area of the image forming apparatus body 100 on the side, and for the process cartridge 300 used in conjunction with the image forming apparatus in the second embodiment below, it only needs to be located on the right side of the process cartridge 300. The trigger mechanism of the chip contact retractable mechanism 200 can be provided at the side end cover, without changing the installation position of the chip 310 or the structure of the process box 300, and the improvement method is simple.
需要说明的是,在本实施例中的以下陈述部分,均是以图像形成装置本体100的前面为前作为基准方向进行阐述。It should be noted that, in the following statements in this embodiment, the front of the main body 100 of the image forming apparatus is taken as the reference direction for illustration.
当然,在一些可能的实施例中,芯片触点伸缩机构200也可以设置于处理盒安装腔110体的其他侧壁板上,此时,则需要对处理盒300的结构进行相应的改动,也就是说,处理盒300上的芯片310对应芯片触点伸缩机构200设置的位置改动到相应的侧端处,并且对应芯片310设置的侧端设置触发机构,例如,芯片触点伸缩机构200设置于处理盒安装腔110体的左侧板上,对应的,处理盒300上的芯片310改动到处理盒300的左侧端盖上,触发机构同样也设置于处理盒300的左侧端盖上。Of course, in some possible embodiments, the chip contact retractable mechanism 200 can also be arranged on other side wall panels of the process box installation cavity 110 body. At this time, the structure of the process box 300 needs to be modified accordingly. That is to say, the chip 310 on the process box 300 is changed to the corresponding side end corresponding to the position where the chip contact telescopic mechanism 200 is provided, and a trigger mechanism is set at the side end corresponding to the chip 310. For example, the chip contact telescopic mechanism 200 is arranged on On the left side plate of the process box installation cavity 110, correspondingly, the chip 310 on the process box 300 is changed to the left end cover of the process box 300, and the trigger mechanism is also arranged on the left end cover of the process box 300.
在本申请的实施例中,第一侧壁120上设置有处理盒滑道121,第一侧壁120在背向处理盒安装腔110的一侧设置有第一滑道板130,在本实施例中,如图5和图6所示,右侧板上设置有处理盒滑道121,右侧板背向处理盒安装腔110的一侧设置有第一滑道板130。第一滑道板130上设置有处理盒滑槽131、用于放置芯片触点安装架和芯片触点220的安装缺口132以及用于安装推动件210的导向块133,第一滑道板130为图像形成装置本体100原有的结构,其上设置的处理盒滑槽131为上侧开口的滑槽,开口倾斜向上且朝向图像形成装置的前上方,处理盒300的右端部自处理盒滑槽131处安插于处理盒安装腔110体内,处理盒滑槽131对处理盒300的安装起到导向作用。芯片触点220和芯片触点安装架安装于第一滑道板130的安装缺口132处,本申请利用图像形成装置本体100原有的结构设置芯片触点伸缩机构200的安装位置,能够减少芯片触点伸缩机构200安装部件的设置,进而减小芯片触点伸缩机构200整体的体积,从而 节省芯片触点伸缩机构200的安装空间,另一方面,安装缺口132处的第一侧壁120能够挡住芯片触点220的固定端,保证推动件210推动芯片触点220时,芯片触点220的自由端222保持位置稳定。In the embodiment of the present application, the first side wall 120 is provided with a process box slideway 121, and the first side wall 120 is provided with a first slideway plate 130 on the side facing away from the process box installation cavity 110. In an example, as shown in FIG. 5 and FIG. 6 , a process cartridge slideway 121 is provided on the right side plate, and a first slideway plate 130 is provided on the side of the right side plate facing away from the process cartridge installation cavity 110 . The first slideway plate 130 is provided with a process cartridge chute 131, an installation gap 132 for placing the chip contact mounting frame and the chip contact 220 and a guide block 133 for installing the pusher 210, the first slideway plate 130 It is the original structure of the image forming apparatus body 100, and the process cartridge chute 131 provided on it is a chute with an upper side opening, the opening is inclined upward and faces the front upper part of the image forming apparatus, and the right end of the process cartridge 300 slides from the process cartridge. The slot 131 is inserted into the body of the process box installation chamber 110 , and the process box chute 131 plays a guiding role for the installation of the process box 300 . The chip contact 220 and the chip contact mounting frame are installed at the installation gap 132 of the first slideway plate 130. This application uses the original structure of the image forming device body 100 to set the installation position of the chip contact retractable mechanism 200, which can reduce the number of chips. The setting of the installation parts of the contact telescopic mechanism 200 further reduces the overall volume of the chip contact telescopic mechanism 200, thereby saving the installation space of the chip contact telescopic mechanism 200. On the other hand, the first side wall 120 at the installation gap 132 can The fixed end of the chip contact 220 is blocked to ensure that the free end 222 of the chip contact 220 maintains a stable position when the pusher 210 pushes the chip contact 220 .
安装缺口132位于处理盒滑槽131的下部且靠近图像形成装置本体100前侧的一端,此设置实现了芯片触点伸缩机构200整体位于图像形成装置本体100的前侧,使得处理盒300安插于处理盒安装腔110体内时,处理盒300上的触发机构能够在处理盒300安插到位前即能够触发芯片触点伸缩机构200,使得推动件210动作,推动件210也能够随着处理盒300的插入不断的推动芯触点直至将芯片触点220推出且与处理盒300上的芯片310完全接触。The installation notch 132 is located at the bottom of the process cartridge chute 131 and is close to one end of the front side of the image forming apparatus body 100. This setting realizes that the chip contact retractable mechanism 200 is located at the front side of the image forming apparatus body 100 as a whole, so that the process cartridge 300 is inserted into the image forming apparatus body 100. When the process box installation chamber 110 is in the body, the trigger mechanism on the process box 300 can trigger the chip contact telescopic mechanism 200 before the process box 300 is put in place, so that the pusher 210 moves, and the pusher 210 can also move along with the process box 300. Insert and push the core contacts continuously until the chip contacts 220 are pushed out and fully contact with the chip 310 on the process cartridge 300 .
导向块133位于安装缺口132处且位于安装缺口132靠近图像形成装置本体100前侧的一端处,导向块133上设置有导向滑槽134,推动件210的滑动部211置于导向滑槽134内且可在导向滑槽134内滑动,导向滑槽134对推动件210起到导向作用,使得推动件210能够沿着导向滑槽134的方向滑动,保证了推动件210位置移动的准确性,使其仅能够沿着导向滑槽134的方向做直线往返运动,避免了推动件210发生偏转导致芯片触点220不能够被成功推出或推出不到位的情况发生。进一步的,导向滑槽134的上开口朝向图像形成装置本体100的左侧,也就是说第一滑道板130安装于图像形成装置本体100内时,导向滑槽134的上开口端朝向右侧板,右侧板挡在导向滑槽134的上开口处,使得推动件210仅能够沿着导向滑槽134的方向做直线往返运动,而不会发生左右上下移动。The guide block 133 is located at the installation notch 132 and at one end of the installation notch 132 close to the front side of the image forming device body 100 , the guide block 133 is provided with a guide chute 134 , and the sliding part 211 of the pusher 210 is placed in the guide chute 134 And can slide in the guide chute 134, the guide chute 134 plays a guiding role to the pusher 210, so that the pusher 210 can slide along the direction of the guide chute 134, ensuring the accuracy of the positional movement of the pusher 210, so that It can only move back and forth in a straight line along the direction of the guide chute 134 , which avoids the situation that the chip contacts 220 cannot be successfully pushed out or pushed out in place due to the deflection of the pushing member 210 . Further, the upper opening of the guide chute 134 faces to the left side of the image forming apparatus body 100, that is to say, when the first slideway plate 130 is installed in the image forming apparatus body 100, the upper opening end of the guide chute 134 faces to the right side. Plate, the right plate blocks the upper opening of the guide chute 134, so that the pusher 210 can only move back and forth in a straight line along the direction of the guide chute 134, without moving up and down left and right.
在本申请的一些实施例中,如图3、图4、图6、图7、图13和图14所示,推动件210伸至处理盒安装腔110内的端部向上弯折,即迫推部212为L形结构,即包括横边和竖边,迫推部212的横边的一端与滑动部211连接,另一端穿出限位孔122,横边横穿限位孔122,且其两端分为位于限位孔122的两侧,迫推部212竖边的自由端222朝向处理盒安装腔110体的上部,因为处理盒300安装于处理盒安装腔110内时,处理盒300沿处理盒滑道121和处理盒滑槽131的滑动轨迹既定,即首先较大倾斜角的倾斜向下滑动,然后平缓倾斜向下滑动,也就是说处理盒300的滑动轨迹并没有水平滑动的轨迹,而推动件210推动方向为水平向后推动,由此, 处理盒300并不能给予推动部213一个水平的推力,处理盒300倾斜向下滑动时,随处理盒300的移动,处理盒300的触发机构能够给予迫推部212一个斜向下的力,因此,实施例二中与该图像形成装置配套使用的处理盒300上的触发机构与处理盒300之间留有让位间隙,即图14-22中的挂钩间隙321。In some embodiments of the present application, as shown in Fig. 3, Fig. 4, Fig. 6, Fig. 7, Fig. 13 and Fig. 14, the end of the pushing member 210 extending into the process cartridge installation cavity 110 is bent upwards, that is, forcing The push part 212 is an L-shaped structure, that is, it includes a horizontal side and a vertical side. One end of the horizontal side of the pushing part 212 is connected to the sliding part 211, and the other end passes through the limiting hole 122, and the horizontal side crosses the limiting hole 122, and Its two ends are divided into the both sides that are positioned at limit hole 122, and the free end 222 of pushing part 212 vertical sides is towards the top of process box installation cavity 110 body, because when process box 300 is installed in process box installation cavity 110, process box 300 slide track along the process box slideway 121 and process box chute 131 is predetermined, that is, at first the inclination of a larger inclination angle slides downwards, and then slides down with a gentle inclination, that is to say, the sliding track of the process box 300 does not slide horizontally track, and the pushing direction of the pushing member 210 is to push back horizontally, thus, the process box 300 cannot give a horizontal thrust to the pushing part 213, and when the process box 300 slides obliquely downward, along with the movement of the process box 300, the process box The trigger mechanism of 300 can give an oblique downward force to the pushing part 212. Therefore, there is a clearance gap between the trigger mechanism on the process cartridge 300 used in conjunction with the image forming apparatus in the second embodiment and the process cartridge 300. That is, the hook gap 321 in FIGS. 14-22 .
处理盒300与芯片触点伸缩机构200配合工作的状态如图15-图22所示,图15为处理盒300与芯片触点伸缩机构200配合的第一状态的结构示意图;图16为图15中C处的局部放大图;图17为处理盒300与芯片触点伸缩机构200配合的第二状态的结构示意图;图18为图17中D处的局部放大图;图19为处理盒300与芯片触点伸缩机构200配合的第三状态的结构示意图;图20为图19中E处的局部放大图;图21为处理盒300与芯片触点伸缩机构200配合的第三状态的结构示意图;图22为图21中F处的局部放大图。处理盒300沿处理盒滑道121和处理盒滑槽131滑动安装于处理盒安装腔110内时,触发机构与迫推部212的起始状态为不接触(如图15和图16所示),随着处理盒300的下滑,迫推部212向上弯折的端部伸入挂钩间隙321内,触发机构与迫推部212向上弯折的端部的侧面接触(如图17和图18所示);随着处理盒300的下滑,迫推部212向上弯折的端部继续向上伸入挂钩间隙321,触发机构下滑的同时推动迫推部212向上弯折部分使得推动件210向芯片触点220的方向移动,触发机构顺着迫推部212向上弯折部分向下移动(如图19和图20所示);处理盒300继续向下滑动,迫推部212向上弯折的端部穿过挂钩间隙321内,触发机构继续下滑,触发机构下滑的同时推动迫推部212向上弯折部分使得推动件210继续向芯片触点220的方向移动,触发机构继续顺着迫推部212向上弯折部分向下移动,处理盒300安装到位时,触发机构推动推动件210移动到位,即芯片触点220被完全推出并与芯片310接触(如图21和图22所示),芯片触点完全伸出并与芯片310配合的状态如图23所示。由于迫推部212向上弯折的部分穿过挂钩间隙321且位于挂钩间隙321内,处理盒300在抽出的过程中,触发机构会带动迫推部212同时后退,实现推动件210的复位。也就是说,触发机构与处理盒300之间的挂钩间隙321能够使迫推部212穿过,由此,触发机构只会给予迫推部212一个向后的 推力,实现了推动部213的移动,处理盒300安装到位时,迫推部212向上弯折的部分穿过挂钩间隙321且置于挂钩间隙321内,当处理盒300抽出处理盒安装腔110时,触发机构能够给予迫推部212一个向前的拉力实现触发机构将推动件210向前拉离芯片触点220自由端222的下端(此处的下端是指图7所示的位置),芯片触点220在其自身弹力的作用下实现复位,即缩回安装孔123内。迫推部212为L形结构的设置能够与处理盒300的触发机构配合实现推动部213的往返移动,驱动方式简单且巧妙。The working state of the process box 300 and the chip contact retractable mechanism 200 is shown in Figures 15-22, and Figure 15 is a schematic structural view of the first state of the process box 300 and the chip contact retractable mechanism 200; Figure 16 is a schematic view of Figure 15 Partial enlarged view at C; FIG. 17 is a schematic structural view of the second state in which the process box 300 cooperates with the chip contact retractable mechanism 200; FIG. 18 is a partial enlarged view at D in FIG. 17; FIG. 19 is the process box 300 and The structural diagram of the third state of the cooperation of the chip contact telescopic mechanism 200; FIG. 20 is a partial enlarged view of E in FIG. 19; FIG. 21 is the structural diagram of the third state of the process box 300 and the chip contact telescopic mechanism 200; FIG. 22 is a partial enlarged view at F in FIG. 21 . When the process box 300 is slidably installed in the process box installation cavity 110 along the process box slideway 121 and the process box slideway 131, the initial state of the trigger mechanism and the pushing part 212 is not in contact (as shown in Figures 15 and 16). , as the process box 300 slides down, the upwardly bent end of the forcing portion 212 stretches into the hook gap 321, and the trigger mechanism contacts the side of the upwardly bending end of the forcing portion 212 (as shown in Figures 17 and 18 As the process box 300 slides down, the upwardly bent end of the pushing portion 212 continues to extend upwards into the hook gap 321, and when the trigger mechanism slides down, it pushes the upwardly bent portion of the pushing portion 212 so that the pushing member 210 touches the chip. Move in the direction of point 220, and the trigger mechanism moves downward along the upward bending part of the pushing part 212 (as shown in Figure 19 and Figure 20); Through the gap 321 of the hook, the trigger mechanism continues to slide down. When the trigger mechanism slides down, it pushes the pushing part 212 to bend upward so that the pusher 210 continues to move toward the chip contact 220, and the trigger mechanism continues to move upward along the pushing part 212. The bending part moves downward, and when the process box 300 is installed in place, the trigger mechanism promotes the pusher 210 to move in place, that is, the chip contact 220 is fully pushed out and contacts with the chip 310 (as shown in FIGS. 21 and 22 ), the chip contact The state of fully extending and mating with the chip 310 is shown in FIG. 23 . Since the upwardly bent part of the forcing part 212 passes through the hook gap 321 and is located in the hook gap 321, when the process cartridge 300 is drawn out, the trigger mechanism will drive the forcing part 212 to retreat simultaneously to realize the reset of the pushing part 210. That is to say, the hook gap 321 between the trigger mechanism and the process box 300 can allow the forcing part 212 to pass through, thus, the trigger mechanism will only give a backward thrust to the forcing part 212 to realize the movement of the pushing part 213 , when the process box 300 is installed in place, the upwardly bent part of the forcing part 212 passes through the hook gap 321 and is placed in the hook gap 321. When the process box 300 is drawn out of the process box installation cavity 110, the trigger mechanism can give the forcing part 212 A forward pulling force realizes that the trigger mechanism pulls the pusher 210 forward away from the lower end of the free end 222 of the chip contact 220 (the lower end here refers to the position shown in FIG. 7 ), and the chip contact 220 is under the action of its own elastic force. Realize reset, that is, retract in the mounting hole 123. The setting of the pushing part 212 as an L-shaped structure can cooperate with the trigger mechanism of the process box 300 to realize the reciprocating movement of the pushing part 213, and the driving method is simple and ingenious.
当然,迫推部212可以为其他结构,例如为杆状结构,迫推部212垂直右侧板自限位孔122处伸出,相应的为适应迫推部212的结构,处理盒300的触发机构为在处理盒300的右侧端盖上设置滑道,拟合处理盒300的滑动轨迹,使得滑道对迫推部212仅有向后的推力或向前的拉力。Certainly, the pushing part 212 can be other structures, such as a rod-shaped structure, and the pushing part 212 protrudes from the limit hole 122 perpendicular to the right side plate. The mechanism is that a slideway is set on the right end cover of the process box 300 to fit the sliding track of the process box 300, so that the slideway only has a backward thrust or a forward pull force on the pushing part 212 .
在本申请的一些实施例中,芯片触点220为多个,安装指示块236、触点弹簧251、限位安装孔234和卡凸244均对应多个芯片触点220设为多个,多个芯片触点220相互平行的设置于芯片触点安装架上,多个芯片触点220的自由端222位于同一侧,滑动部211与推动部213连接形成T字形结构,推动部213移动时能够同时推动多个芯片触点220的自由端222。本申请的芯片触点220设置的数量依据处理盒300上芯片310来定,芯片触点伸缩机构200上可以设置个芯片触点220,也可以设置2个、3个、4个或者更多个。In some embodiments of the present application, there are multiple chip contacts 220, and the installation indicating block 236, the contact spring 251, the limit installation hole 234 and the card protrusion 244 are all set to be multiple corresponding to the multiple chip contacts 220, and the multiple The chip contacts 220 are arranged parallel to each other on the chip contact mounting frame, the free ends 222 of the plurality of chip contacts 220 are located on the same side, the sliding part 211 is connected with the pushing part 213 to form a T-shaped structure, and the pushing part 213 can move. Simultaneously push the free ends 222 of the plurality of chip contacts 220 . The number of chip contacts 220 of the present application is determined according to the chip 310 on the process box 300. A chip contact 220 can be set on the chip contact telescopic mechanism 200, or 2, 3, 4 or more can be set. .
实施例二Embodiment two
图13为处理盒的结构示意图;图14为图13中B处的局部放大图;图15为处理盒与芯片触点伸缩机构配合的第一状态的结构示意图;图16为图15中C处的局部放大图;图17为处理盒与芯片触点伸缩机构配合的第二状态的结构示意图;图18为图17中D处的局部放大图;图19为处理盒与芯片触点伸缩机构配合的第三状态的结构示意图;图20为图19中E处的局部放大图;图21为处理盒与芯片触点伸缩机构配合的第三状态的结构示意图;图22为图21中E处的局部放大图。Fig. 13 is a schematic structural view of the process box; Fig. 14 is a partially enlarged view of place B in Fig. 13; Fig. 15 is a schematic structural view of the first state in which the process box cooperates with the chip contact retractable mechanism; Fig. 16 is a place at C in Fig. 15 Figure 17 is a schematic diagram of the structure of the second state in which the process box cooperates with the chip contact telescopic mechanism; Figure 18 is a partial enlarged view of D in Figure 17; Figure 19 is the process box and the chip contact telescopic mechanism cooperates Fig. 20 is a partial enlarged view of E in Fig. 19; Fig. 21 is a schematic structural view of the third state in which the process box cooperates with the chip contact retractable mechanism; Fig. 22 is E in Fig. 21 Partial zoom-in.
如图12和13所示,本具体实施例提供了一种与实施例一中的图像形成装置配套使用的处理盒300,该处理盒300上设置有与芯片触点伸缩机构200的推动件210相匹配的触发机构,该触发机构能够在处理盒300安 装于处理盒安装腔110内时,推动推动件210向后移动,使得芯片触点220伸出安装孔123与处理盒300上的芯片310接触导通,在处理盒300抽出处理盒安装腔110时,该触发机构能够拉动推动件210向后移动,使得芯片触点220回缩至安装孔123内。As shown in Figures 12 and 13, this specific embodiment provides a process box 300 used in conjunction with the image forming device in Embodiment 1, and the process box 300 is provided with a pusher 210 that is compatible with the chip contact retractable mechanism 200 Matching trigger mechanism, when the trigger mechanism can push the push member 210 to move backward when the process box 300 is installed in the process box installation cavity 110, so that the chip contact 220 stretches out of the mounting hole 123 and the chip 310 on the process box 300 The contact conduction, when the process box 300 is drawn out of the process box installation cavity 110 , the trigger mechanism can pull the pusher 210 to move backward, so that the chip contact 220 retracts into the installation hole 123 .
具体的,触发机构为处理盒挂钩320,处理盒300安装于处理盒安装腔110内时,处理盒挂钩320的行程轨迹经过推动件210,处理盒挂钩320经过推动件210时,处理盒挂钩320钩挂住推动件210且带动推动件210移动。Specifically, the trigger mechanism is the process box hook 320. When the process box 300 is installed in the process box installation cavity 110, the travel track of the process box hook 320 passes through the pusher 210. When the process box hook 320 passes the pusher 210, the process box hook 320 The hook hooks the pusher 210 and drives the pusher 210 to move.
当芯片触点伸缩机构200设置于图像形成装置本体100的右侧板上时,处理盒挂钩320设置于处理盒300的右端盖上,对应的处理盒300的芯片310设置于处理盒300的右端盖处。When the chip contact retractable mechanism 200 is arranged on the right side plate of the image forming apparatus body 100, the process cartridge hook 320 is arranged on the right end cover of the process cartridge 300, and the corresponding chip 310 of the process cartridge 300 is arranged on the right end of the process cartridge 300 cover.
如图12和13所示,处理盒挂钩320为L形结构,处理盒挂钩320设置有处理盒300右端盖的前侧下端,处理盒挂钩320连接于处理盒300端盖上,处理盒挂钩320与处理盒300之间留有挂钩间隙321,对应的迫推部212为L形结构,挂钩间隙321即为实施例一中提及的让位间隙,此让位间隙能够使迫推部212穿过,由此,处理盒挂钩320只会给予迫推部212一个向后的推力,实现了推动部213的移动。As shown in Figures 12 and 13, the process box hook 320 is an L-shaped structure, and the process box hook 320 is provided with the front side lower end of the right end cover of the process box 300, and the process box hook 320 is connected on the process box 300 end cover, and the process box hook 320 There is a hook gap 321 between the process box 300, and the corresponding forcing part 212 is an L-shaped structure. The hook gap 321 is the clearance gap mentioned in Embodiment 1, and this clearance gap can make the pushing part 212 pass through. However, thus, the process cartridge hook 320 will only give a backward thrust to the pushing part 212, so as to realize the movement of the pushing part 213.
当然,处理盒300的挂钩不仅限于图12和图13所示的结构,其只要能够与处理盒300形成挂钩间隙321即可,该挂钩间隙321可以为闭合的空间,也可以为非闭合的空间,例如图15-图22所示,处理盒挂钩320的一端与处理盒300连接,另一端向下弯折形成L形结构。Of course, the hook of the process box 300 is not limited to the structure shown in Figure 12 and Figure 13, as long as it can form a hook gap 321 with the process box 300, the hook gap 321 can be a closed space or an open space 15-22, one end of the process box hook 320 is connected to the process box 300, and the other end is bent downward to form an L-shaped structure.
本申请中与实施例一中提及的图像形成装置配套使用的处理盒300仅是在处理盒300上增加一个小的处理盒挂钩320,对处理盒300整体的结构未作改进,便于与实施例一中配套使用的处理盒300的加工。The process box 300 used in conjunction with the image forming apparatus mentioned in Embodiment 1 in the present application only adds a small process box hook 320 on the process box 300, and does not improve the overall structure of the process box 300, which is convenient for implementation. Processing of the processing cartridge 300 used in conjunction with Example 1.
本实施例中的触发机构与推动件210配合的工作过程在实施例一中已做具体阐述,在此不再赘述。The working process of the cooperation of the trigger mechanism and the pusher 210 in this embodiment has been described in detail in Embodiment 1, and will not be repeated here.

Claims (11)

  1. 一种图像形成装置,其特征在于,包括图像形成装置本体,所述图像形成装置本体上设置有用于安装处理盒的处理盒安装腔,所述处理盒上设置有芯片;An image forming device, characterized in that it comprises an image forming device body, the image forming device body is provided with a process box installation cavity for installing a process box, and a chip is provided on the process box;
    所述处理盒安装腔包括与所述处理盒设置有芯片的一侧相对的第一侧壁,所述第一侧壁处设置有芯片触点伸缩机构,所述芯片触点伸缩机构包括若干个芯片触点和推动所述芯片触点向所述处理盒安装腔内移动的推动件;The process box installation cavity includes a first side wall opposite to the side where the chip is provided with the process box, and a chip contact telescopic mechanism is provided at the first side wall, and the chip contact telescopic mechanism includes several a chip contact and a pusher for pushing the chip contact to move into the installation cavity of the process cartridge;
    所述处理盒上设置有与所述推动件相匹配的触发机构;The process box is provided with a trigger mechanism matched with the pusher;
    所述处理盒装入所述处理盒安装腔内的过程中,所述推动件在所述触发机构的作用下推动所述芯片触点向所述处理盒安装腔内移动,所述芯片触点在所述处理盒安装到位时与所述芯片接触。During the process of loading the process cartridge into the process cartridge installation cavity, the pusher pushes the chip contact to move into the process cartridge installation cavity under the action of the trigger mechanism, and the chip contact contacts the chip when the process cartridge is in place.
  2. 根据权利要求1所述的图像形成装置,其特征在于,所述芯片触点伸缩机构还包括芯片触点安装架;The image forming apparatus according to claim 1, wherein the chip contact retractable mechanism further comprises a chip contact mounting frame;
    所述芯片触点包括设置于所述芯片触点安装架上的固定端和远离所述固定端的自由端;The chip contact includes a fixed end arranged on the chip contact mounting frame and a free end away from the fixed end;
    所述推动件的一端与所述触发机构配合,另一端置于所述芯片触点远离所述处理盒安装腔的一侧;One end of the pusher is matched with the trigger mechanism, and the other end is placed on the side of the chip contact away from the installation cavity of the process cartridge;
    所述处理盒装入所述处理盒安装腔内的过程中,所述推动件在所述触发机构的作用下自所述芯片触点的自由端向所述芯片触点的固定端移动,以推动所述芯片触点的自由端以所述芯片触点的固定端为中心向所述芯片的方向转动,所述芯片触点在所述处理盒安装到位时与所述芯片接触。When the process cartridge is loaded into the process cartridge installation cavity, the pusher moves from the free end of the chip contact to the fixed end of the chip contact under the action of the trigger mechanism, so as to Push the free end of the chip contact to rotate toward the direction of the chip centering on the fixed end of the chip contact, and the chip contact is in contact with the chip when the process cartridge is installed in place.
  3. 根据权利要求2所述的图像形成装置,其特征在于,所述芯片触点伸缩机构还包括用于导通所述芯片触点与所述图像形成装置的基板触点的信号导通件,所述信号导通件的一端与所述芯片触点连接,另一端与所述图像形成装置的基板触点连接。The image forming device according to claim 2, wherein the chip contact stretching mechanism further comprises a signal conductor for connecting the chip contact with the substrate contact of the image forming device, so One end of the signal conductor is connected to the chip contact, and the other end is connected to the substrate contact of the image forming device.
  4. 根据权利要求3所述的图像形成装置,其特征在于,所述芯片触点安装架包括安装支架和用于固定所述信号导通件的安装压板;The image forming apparatus according to claim 3, wherein the chip contact mounting frame includes a mounting bracket and a mounting platen for fixing the signal conducting member;
    所述安装支架包括芯片触点安装板和两个安装侧板,所述两个安装侧板分别连接于所述芯片触点安装板长度方向的两端;The mounting bracket includes a chip contact mounting plate and two mounting side plates, and the two mounting side plates are respectively connected to both ends in the length direction of the chip contact mounting plate;
    所述芯片触点置于所述芯片触点安装板上,所述芯片触点的固定端翻折至所述芯片触点安装板的背面上;The chip contact is placed on the chip contact mounting plate, and the fixed end of the chip contact is folded to the back of the chip contact mounting plate;
    所述安装压板连接于所述安装侧板上;The installation pressure plate is connected to the installation side plate;
    所述信号导通件挤压于翻折至芯片触点安装板背面的芯片触点和安装压板之间。The signal conducting member is squeezed between the chip contacts folded to the back of the chip contact mounting plate and the mounting platen.
  5. 根据权利要求1所述的图像形成装置,其特征在于,所述芯片触点包括弹片和设置于所述弹片上用于与所述芯片接触的凸点,所述弹片的其中一端向背向所述凸点的一侧翻折,所述弹片的翻折端为所述芯片触点的自由端。The image forming apparatus according to claim 1, wherein the chip contact includes an elastic piece and a bump provided on the elastic piece for contacting the chip, one end of the elastic piece faces away from the One side of the bump is folded over, and the folded end of the elastic piece is the free end of the chip contact.
  6. 根据权利要求1所述的图像形成装置,其特征在于,所述推动件包括滑动部和连接于所述滑动部两端的推动部与迫推部,所述触发机构与所述迫推部配合,所述推动部位于所述芯片触点远离所述处理盒安装腔的一侧,所述推动部与芯片触点相对的一面为倾斜面,所述倾斜面为自所述推动部靠近所述滑动部的一端向远离所述芯片触点的方向倾斜。The image forming apparatus according to claim 1, wherein the pushing member comprises a sliding part, a pushing part and a forcing part connected to both ends of the sliding part, the trigger mechanism cooperates with the forcing part, The pushing part is located on the side of the chip contact away from the installation cavity of the process cartridge, and the side of the pushing part opposite to the chip contact is an inclined surface, and the inclined surface is from the pushing part close to the sliding surface. One end of the portion is inclined away from the chip contacts.
  7. 根据权利要求1-6任意一项所述的图像形成装置,其特征在于,所述芯片触点伸缩机构设置于所述第一侧壁背向所述处理盒安装腔的一侧,所述第一侧壁上设置有安装孔和限位孔;The image forming apparatus according to any one of claims 1-6, wherein the chip contact retractable mechanism is arranged on the side of the first side wall facing away from the process cartridge installation cavity, and the second There are installation holes and limit holes on the side wall;
    所述芯片触点设置于所述安装孔处;The chip contacts are arranged at the mounting holes;
    所述推动件的局部自所述限位孔处伸至所述处理盒安装腔内,所述推动件置于所述限位孔内的部分能够在限位孔内沿推动件推动芯片触点的方向来回移动;A part of the pushing member extends from the limiting hole into the process cartridge installation cavity, and the part of the pushing member placed in the limiting hole can push the chip contact along the pushing member in the limiting hole move back and forth in the direction;
    所述触发机构与所述推动件伸至所述处理盒安装腔内的部分配合驱动推动件的移动。The trigger mechanism cooperates with the part of the pusher protruding into the installation chamber of the process cartridge to drive the movement of the pusher.
  8. 根据权利要求7所述的图像形成装置,其特征在于,所述推动件伸至所述处理盒安装腔内的端部向上弯折。The image forming apparatus according to claim 7, wherein an end portion of the pushing member protruding into the process cartridge installation cavity is bent upward.
  9. 根据权利要求7所述的图像形成装置,其特征在于,所述芯片设置于所述处理盒沿其长度方向的一端的端盖上;The image forming apparatus according to claim 7, wherein the chip is arranged on an end cover of one end of the process cartridge along its length direction;
    所述第一侧壁为所述处理盒安装腔在处理盒长度方向上的两侧壁中的一个,所述第一侧壁上设置有处理盒滑道,所述第一侧壁在背向所述处理盒安装腔的一侧设置有第一滑道板;The first side wall is one of the two side walls of the process box installation chamber in the process box length direction, the first side wall is provided with a process box slideway, and the first side wall faces away from One side of the process box installation cavity is provided with a first slideway plate;
    所述第一滑道板上设置有用于放置芯片触点安装架和芯片触点的安装缺口以及用于安装推动件的导向块,所述导向块上设置有导向滑槽,所述推动件的局部置于所述导向滑槽内且可在导向滑槽内滑动。The first slideway plate is provided with an installation notch for placing the chip contact mounting frame and the chip contact, and a guide block for installing the pusher. The guide block is provided with a guide chute, and the pusher It is partially placed in the guide chute and can slide in the guide chute.
  10. 一种与权利要求1-7任意一项所述的图像形成装置配套使用的处理盒,其特征在于,所述处理盒上设置有与所述芯片触点伸缩机构的推动件相匹配的触发机构。A process box used in conjunction with the image forming device according to any one of claims 1-7, characterized in that, the process box is provided with a trigger mechanism that matches the pusher of the chip contact telescopic mechanism .
  11. 一种与权利要求8-9任意一项所述的图像形成装置配套使用的处理盒,其特征在于,所述处理盒上设置有与所述芯片触点伸缩机构的推动件相匹配的触发机构,所述触发机构为处理盒挂钩,所述处理盒挂钩设置于所述处理盒上设置有芯片的一端,所述处理盒挂钩与所述处理盒之间留有挂钩间隙,所述处理盒安装到位时,所述推动件位于处理盒安装腔内的向上弯折的部分伸入所述挂钩间隙内。A process box used in conjunction with the image forming device according to any one of claims 8-9, characterized in that, the process box is provided with a trigger mechanism that matches the pusher of the chip contact telescopic mechanism , the trigger mechanism is a process box hook, the process box hook is arranged on one end of the process box provided with a chip, there is a hook gap between the process box hook and the process box, and the process box is installed When in place, the upwardly bent part of the pushing member located in the process box installation cavity protrudes into the gap of the hook.
PCT/CN2022/136301 2021-12-02 2022-12-02 Image forming apparatus and processing cartridge WO2023098891A1 (en)

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CN216434677U (en) * 2021-12-02 2022-05-03 珠海奔图电子有限公司 Image forming apparatus and process cartridge

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