WO2023098648A1 - 有源天线单元及基站 - Google Patents

有源天线单元及基站 Download PDF

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Publication number
WO2023098648A1
WO2023098648A1 PCT/CN2022/134937 CN2022134937W WO2023098648A1 WO 2023098648 A1 WO2023098648 A1 WO 2023098648A1 CN 2022134937 W CN2022134937 W CN 2022134937W WO 2023098648 A1 WO2023098648 A1 WO 2023098648A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
antenna unit
power amplifier
board
active antenna
Prior art date
Application number
PCT/CN2022/134937
Other languages
English (en)
French (fr)
Inventor
宋林东
卫东
吴广德
李朋军
麻军
王富强
靖娜坤
Original Assignee
中兴通讯股份有限公司
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Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2023098648A1 publication Critical patent/WO2023098648A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • Embodiments of the present disclosure relate to but are not limited to the technical field of wireless communication, and particularly relate to an active antenna unit and a base station.
  • AAU Active Antenna Unit, active antenna unit
  • the AAU device is an integrated active antenna integrated with a radio frequency unit and an antenna unit.
  • the use of AAU equipment can improve the performance of the radio frequency system of 5G base stations and save tower resources.
  • the low structural integration of the antenna unit and the radio frequency unit in the current AAU equipment is not conducive to the miniaturization of the AAU equipment, and is not conducive to the layout of the base station. Therefore, it is necessary to design an active antenna unit with a high structural integration.
  • the main purpose of the embodiments of the present disclosure is to provide an active antenna unit and a base station, which can improve the structural integration of the device, thereby facilitating miniaturization of the active antenna unit device.
  • an embodiment of the present disclosure provides an active antenna unit, including a circuit board, a power amplifier board stacked on the circuit board, and an antenna oscillator and a filter on the circuit board.
  • the circuit board is configured as The power amplifier board supplies power, the power amplifier board is electrically connected with the filter and is configured to amplify the power of radio frequency signals, and the filter is electrically connected with the antenna dipole and is configured to transmit and receive radio frequency signals.
  • An embodiment of the present disclosure also provides a base station, including the above-mentioned active antenna unit.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of an active antenna unit using a multi-layer structure in the prior art
  • Fig. 2 is a schematic cross-sectional structure diagram of an active antenna unit provided by an embodiment of the present disclosure
  • Fig. 3 is a schematic cross-sectional structure diagram of another active antenna unit provided by an embodiment of the present disclosure.
  • Fig. 4 is a schematic cross-sectional structure diagram of another active antenna unit provided by an embodiment of the present disclosure.
  • the active antenna unit device is an antenna device that integrates a radio frequency unit (including a filter, a power amplifier board) and an antenna unit (including an antenna element). Compared with the separate design of the radio frequency unit and the antenna unit used in the traditional base station (the radio frequency unit and the antenna unit are connected by a feeder), the integrated design of the active antenna unit effectively saves tower resources.
  • the antenna element 11 of the antenna unit is integrated on the antenna reflector 12 to form an antenna array
  • the power amplifier board 13 of the radio frequency unit is connected with the active board 14, and the active board 14 can supply power to the power amplifier board 13.
  • the casing 15 is attached to the side of the active board 14 away from the power amplifier board 13 .
  • the heat dissipation path of the power amplifier board 13 is the active board 14 , thermal conductive silicone grease and the casing 15 .
  • a shielding case 16 is arranged to electromagnetically shield the power amplifier board 13 .
  • a amplifier chamber 18 is formed between the shielding case 16 and the active board 14 .
  • the filter 17 is arranged above the shielding case 16, and then connected to the antenna reflector 12 through a connector to form a multi-layer structure.
  • the multi-layer structure adopted by the active antenna unit several key components of the antenna element 11, the filter 17 and the power amplifier board 13 are arranged in multiple layers, resulting in low integration of the device structure of the active antenna unit.
  • the embodiment of the present application finds that the antenna oscillator, filter and power amplifier board can be integrated with the active board, while avoiding the active board.
  • the shielding cover on the board is used for electromagnetic shielding of the power amplifier board. In this way, the overall thickness of the active antenna unit device can be reduced, and the structural integration of the radio frequency unit and the antenna unit can be improved.
  • the active antenna unit provided by the embodiment of the present disclosure includes a circuit board 110 , a power amplifier board 120 stacked on the circuit board 110 , and an antenna element 130 and a filter 140 arranged on the circuit board 110 .
  • the circuit board 110 is used for powering the power amplifier board 120 .
  • the power amplifier board 120 is electrically connected with the filter 140 and used for amplifying the power of the radio frequency signal.
  • the filter 140 is electrically connected with the antenna element 130 and used for sending and receiving radio frequency signals.
  • the circuit board 110 is an active board, which can supply power to the power amplifier board 120 and can also lay out other devices.
  • the power amplifier board 120 is a key component of the front end of the radio frequency unit, and plays a role in amplifying the power of the radio frequency signal.
  • the filter 140 is used to filter the radio frequency signal and transmit it through the antenna element 130 , or to filter out the clutter of the radio frequency signal received by the antenna element 130 .
  • the active antenna unit provided by the embodiment of the present disclosure, by changing the structure of the current active antenna unit device, while the power amplifier board 120 is stacked on the circuit board 110, the antenna oscillator 130 and the filter 140 are integrated on the circuit board at the same time 110, and avoid the shielding cover on the circuit board 110 for electromagnetic shielding of the power amplifier board 120, thereby improving the structural integration of the active antenna unit device and facilitating the miniaturization of the active antenna unit device.
  • the circuit board 110 can also be used as a reflector for the antenna vibrator 130, that is, the antenna vibrator 130 can be printed on the circuit board 110, or attached to the circuit board 110 with a patch, and radiation is realized by means of the circuit board 110, thereby removing
  • the current antenna reflector in the active antenna unit is used to further reduce the overall thickness of the active antenna unit device, and is beneficial to reduce the overall weight of the active antenna unit device.
  • the antenna element 130 and the filter 140 can be arranged on the side of the circuit board 110 close to the power amplifier board 120 , or they can be arranged on the side of the circuit board 110 away from the power amplifier board 120 .
  • the filter 140 is arranged on the circuit board 110 close to the power amplifier board 120
  • the antenna element 130 is arranged on the side of the circuit board 110 away from the power amplifier board 120 .
  • the surface space on the circuit board 110 can be effectively used to arrange the antenna dipole 130.
  • the antenna composed of multiple antenna elements 130 can be arranged on the side of the circuit board 110 away from the power amplifier board 120 , thereby facilitating the layout of the antenna elements 130 .
  • the antenna element 130 may be arranged on the front of the circuit board 110
  • the filter 140 and the power amplifier board 120 may be arranged on the back of the circuit board 110 .
  • the antenna elements 130 may be arranged in a rectangular array or a rhombus array on the circuit board 110 .
  • the electrical connection between the filter 140 and the power amplifier board 120 can be realized through microstrip lines or striplines, that is, microstrip lines or striplines can be printed on the circuit board 110 to realize the connection between the filter 140 and the power amplifier board 120. Inter-signal transmission, thereby saving the use of connectors, which is conducive to further reducing the overall weight of the active antenna unit device.
  • a via hole penetrating the circuit board 110 can be provided on the circuit board 110, and the filter 140 can pass through the The connecting piece passing through the via hole is electrically connected to the antenna element 130 .
  • the via hole 111 is connected to the front and back of the circuit board 110, and the connector can be a conductive post or a conductive wire.
  • the electrical connection between the filter 140 and the antenna element 130 may also be implemented by pouring copper through via holes.
  • the filter 140 includes a plurality of filter units, and when the filter 140 is electrically connected to the antenna element 130 , it adopts a one-to-one or one-to-many pairing form.
  • the plurality of filter units of the filter 140 are electrically connected to the plurality of antenna elements 130 correspondingly.
  • the filter unit may be a cavity filter, and multiple cavity filters may share the same substrate.
  • the electromagnetic shielding of the power amplifier board 120 can be realized through the housing 150, the housing 150 is connected to the circuit board 110, and forms an inner cavity 151 with the circuit board 110, and the power amplifier board 120 is located in the inner cavity 151 Among them, the housing 150 is used for electromagnetic shielding of the power amplifier board 120 .
  • the electromagnetic shielding of the power amplifier board 120 is achieved by using the inner cavity 151 surrounded by the housing 150 and the circuit board 110, thereby saving the use of shielding covers in the current active antenna unit and further reducing the overall weight of the active antenna unit .
  • the height of the cavity 151 enclosed by the housing 150 and the circuit board 110 can be selected according to the resonance frequency of the cavity required by the power amplifier board 120 .
  • the casing 150 may be made of metal material, or a metal layer may be added to the inner wall of the casing 150 .
  • metal material aluminum alloy can be used as the material of the housing 150 to ensure the weight of the housing 150 and to form a shielding cavity with the circuit board 110 to shield the power amplifier board 120 .
  • the key component on the power amplifier board 120 here is the amplifier 121 .
  • the amplifier 121 is a component arranged on the power amplifier board 120 to amplify the power of the radio frequency signal.
  • the amplifier 121 can be directly arranged on the power amplifier board 120, or indirectly arranged on the power amplifier board 120 through a box.
  • the side of the power amplifier board 120 facing away from the circuit board 110 is fastened with a box body 160 (shown in FIG. 3 ).
  • the box body 160 has a cavity 161 and an opening 162 communicating with the cavity 161 , and the power amplifier board 120 covers the opening 162 .
  • An amplifier 121 is disposed on the inner wall of the box body 160 , and the amplifier 121 is located in the cavity 161 and is electrically connected to the power amplifier board 120 .
  • the amplifier 121 is indirectly arranged on the power amplifier board 120 through the box body 160 , which can facilitate heat dissipation of the power amplifier board 120 .
  • the heat generated by the amplifier 121 arranged on the power amplifier board 120 during operation can be transferred to the casing 150 through the box body 160 , and then the heat is transferred to the outside of the active antenna unit device.
  • a heat conducting material may be filled between the box body 160 and the casing 150 .
  • a gap A between the box body 160 and the housing 150, and the gap A is filled with a heat-conducting material.
  • the heat conduction material can be heat conduction silicone grease, heat conduction silica gel or heat conduction silica mud. Through the heat conduction performance of the heat conduction material, the heat transferred from the amplifier 121 to the box body 160 can be effectively conducted to the housing 150 , so as to effectively realize the heat dissipation of the amplifier 121 on the power amplifier board 120 .
  • the filter 140 is located in the cavity 151 enclosed by the housing 150 and the circuit board 110 .
  • the filter 140 By arranging the filter 140 in the inner cavity 151 surrounded by the housing 150 and the circuit board 110 at the same time, the space in the inner cavity 151 can be effectively used, and the connection between the housing 150 and the circuit board 110 is facilitated, avoiding the 150 makes way for some components provided on the circuit board 110 when it is connected with the circuit board 110 .
  • the housing 150 includes an enclosing portion 152 and an extending portion 153 connected together.
  • the enclosing portion 152 is connected to the circuit board 110 and encloses the inner cavity 151 .
  • the extension portion 153 is bent and extends from the top edge of the enclosing portion 152 along a direction parallel to the circuit board 110 .
  • the enclosing portion 152 refers to a portion of the housing 150 and the circuit board 110 enclosing the inner chamber 151 .
  • the extension portion 153 refers to a portion of the casing 150 extending out of the circuit board 110 .
  • the housing 150 is in contact with the circuit board 110 through the enclosing part 152 to form an inner cavity 151 with the circuit board 110, so that the power amplifier board 120 is placed in the inner cavity 151, and the extension part 153 of the housing 150 is convenient for the housing 150 to arrange other components .
  • the extension part 153 can be bent and extended from the top edge of the enclosing part 152 (ie, the edge of the enclosing part 152 in contact with the circuit board 110 ) along a direction parallel to the circuit board 110 , or can be extended from the outer wall of the enclosing part 152 Bending and extending along a direction parallel to the circuit board 110 .
  • the extension part 153 can be made to be parallel to the circuit board 110 from the top edge of the enclosing part 152. Bending and extending in the direction.
  • the enclosing portion 152 and the extension portion 153 of the housing 150 can be integrally formed to ensure the overall structural strength of the housing 150 and ensure the service life of the housing 150 .
  • the enclosed portion 152 may include a bottom wall 154 and a side wall 155, the bottom wall 154 faces the circuit board 110 and is connected to the circuit board 110 through the side wall 155, the bottom wall 154 is parallel to the circuit board 110 The direction is concave and convex.
  • the bottom wall 154 refers to the part extending in the direction parallel to the circuit board 110 in the enclosing part 152
  • the side wall 155 refers to the part extending in the direction perpendicular to the circuit board 110 in the enclosing part 152.
  • the bottom wall 154 and the circuit board 110 are spaced apart to form a lumen 151 .
  • the bottom wall 154 By making the bottom wall 154 in a concave-convex shape in a direction parallel to the circuit board 110 , it is suitable for components with different sizes arranged on the circuit board 110 .
  • the active antenna unit shown in FIG. 3 not only an amplifier 121 but also a circulator 122 are disposed on the power amplifier board 120 .
  • the circulator 122 can be used for signal isolation and switching between sending and receiving.
  • the spaces occupied by the amplifier 121, the circulator 122 and the filter 140 are different. .
  • the bottom wall 154 of the enclosure part 152 can be set in a concave-convex shape according to the space occupied by different components in the inner cavity 151, so as to adapt to the layout of the circuit board 110.
  • the side of the circuit board 110 away from the power amplifier board 120 is provided with a phase shifting circuit.
  • the filter 140 is connected to the antenna element 130 via a phase shift circuit.
  • the side of the circuit board 110 provided with the phase shifting circuit is also provided with a cover plate 170 (shown in FIG. 4 ), and the cover plate 170 is used for electromagnetic shielding of the phase shifting circuit.
  • a reflection plate 180 is disposed on a side of the cover plate 170 away from the circuit board 110 .
  • the antenna element 130 is disposed on the reflection plate 180 , and is disposed on the circuit board 110 via the reflection plate 180 and the cover plate 170 .
  • the phase shifting circuit can be used to adjust the downtilt angle of the antenna.
  • the adjustment of the antenna element 130 can be realized by setting a phase shifting circuit on the circuit board 110 .
  • the antenna element 130 is disposed on the circuit board 110 through the reflector 180 and the cover 170 . In this way, without changing the integrated structure of the antenna dipole 130 and the circuit board 110 , the phase shifting circuit provided on the circuit board 110 facilitates the adjustment of the antenna dipole 130 .
  • the cover plate 170 is in the form of a shielding case, and can form a shielding cavity with the circuit board 110 , so as to play the role of electromagnetic shielding for the phase-shifting circuit on the circuit board 110 .
  • An embodiment of the present disclosure further provides a base station, including the active antenna unit in the foregoing embodiment, wherein the active antenna unit is arranged on a tower of the base station.
  • the antenna oscillator 130 and the filter 140 are integrated on the circuit board 110 at the same time, and the circuit board 110 is avoided.
  • the shielding cover is used for electromagnetic shielding of the power amplifier board 120 . In this way, the structural integration of the active antenna unit device can be improved, which is beneficial to realize the miniaturization of the active antenna unit device, thereby saving tower resources of the base station.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
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Abstract

本公开实施例涉及无线通信技术领域并且公开了一种有源天线单元及基站。有源天线单元包括电路板、层叠设置在电路板上的功放板、以及设置在电路板上的天线振子和滤波器，电路板被构造成为功放板供电，功放板与滤波器电连接并且被构造成对射频信号进行功率放大，以及滤波器与天线振子电连接并且被构造成收发射频信号。摘图2

Description

有源天线单元及基站
相关公开的交叉引用
本公开要求在2021年12月1日提交国家知识产权局、公开号为CN202111454858.1、发明名称为“有源天线单元及基站”的中国专利申请的优先权，该申请的全部内容通过引用结合在本公开中。
技术领域
本公开实施例涉及但不限于无线通信技术领域，特别涉及一种有源天线单元及基站。
背景技术
随着5G(5th Generation Mobile Communication Technology，第五代移动通信技术)通信技术的快速迭代发展与推广应用，天面系统越来越多。同时伴随着多频段以及MIMO(Multiple-Input Multiple-Output，多输入多输出)的要求，AAU(Active Antenna Unit，有源天线单元)设备的使用也越来越广泛。AAU设备为射频单元和天线单元集成的一体化有源天线。AAU设备的使用可以提高5G基站的射频系统性能，节约杆塔资源。
但是，目前的AAU设备中天线单元与射频单元结构集成度低，不利于AAU设备的小型化，也就不利于基站的布置，因此，有必要设计一种结构集成度高的有源天线单元。
发明内容
本公开实施例的主要目的在于提出一种有源天线单元及基站，能够提高设备的结构集成度，从而有利于实现有源天线单元设备的小型化。
为实现上述目的，本公开实施例提供了一种有源天线单元，包括电路 板、层叠设置在电路板上的功放板、以及设置在电路板上的天线振子和滤波器，电路板被构造成为功放板供电，功放板与滤波器电连接并且被构造成对射频信号进行功率放大，以及滤波器与天线振子电连接并且被构造成收发射频信号。
本公开实施例还提供了一种基站，包括上述的有源天线单元。
附图说明
图1是现有技术中采用多层架构、有源天线单元的剖面结构示意图；
图2是本公开实施例提供的有源天线单元的剖面结构示意图；
图3是本公开实施例提供的另一种有源天线单元的剖面结构示意图；
图4是本公开实施例提供的再一种有源天线单元的剖面结构示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合附图对本公开的各实施例进行详细的阐述。然而，本领域的普通技术人员可以理解，在本公开各实施例中，为了使读者更好地理解本公开而提出了许多技术细节。但是，即使没有这些技术细节和基于以下各实施例的种种变化和修改，也可以实现本公开所要求保护的技术方案。以下各个实施例的划分是为了描述方便，不应对本公开的具体实现方式构成任何限定，各个实施例在不矛盾的前提下可以相互结合相互引用。
有源天线单元设备是将射频单元(包括滤波器、功放板)和天线单元(包括天线振子)集成在一起的天线设备。相较于传统基站采用的射频单元和天线单元分离式的设计(射频单元和天线单元之间通过馈线连接)，有源天线单元采用的集成式设计有效节约了杆塔资源。
但是申请人注意到，目前的有源天线单元设备中天线单元和射频单元结构集成度低。如图1所示，天线单元的天线振子11集成在天线反射板 12上以形成天线阵列，射频单元的功放板13与有源板14连在一起，有源板14可以为功放板13供电。壳体15贴合在有源板14远离功放板13的一侧。功放板13的散热路径为有源板14、导热硅脂和壳体15。有源板14在布置功放板13后，还要布置屏蔽罩16对功放板13进行电磁屏蔽。屏蔽罩16与有源板14之间形成功放腔体18。滤波器17布局在屏蔽罩16上方，再通过连接器转接到天线反射板12上，组成一个多层架构。在有源天线单元所采用的这样的多层架构中，天线振子11、滤波器17和功放板13几个关键的部件分成多层布置，导致有源天线单元的设备结构集成度低。
为了降低有源天线单元设备的体积，以有利于实现有源天线单元设备的小型化，本申请实施例发现，可以将天线振子、滤波器和功放板与有源板集成，而避开有源板上用于对功放板进行电磁屏蔽的屏蔽罩。这样，可以降低有源天线单元设备的整机厚度，提高射频单元和天线单元的结构集成度。
如图2所示，本公开实施例提供的有源天线单元包括电路板110，层叠设置在电路板110上的功放板120，以及设置在电路板110上的天线振子130和滤波器140。电路板110用于为功放板120供电。功放板120与滤波器140电连接、用于对射频信号进行功率放大。滤波器140与天线振子130电连接、用于收发射频信号。
电路板110即有源板，可以为功放板120供电，还可以布局其他器件。功放板120是射频单元前端的关键部件，起到对射频信号进行功率放大的作用。滤波器140则用于将射频信号过滤后通过天线振子130发射出去，或者将天线振子130接收的射频信号进行杂波滤除。
本公开实施例提供的有源天线单元，通过改变目前有源天线单元设备的架构，在将功放板120层叠设在电路板110上的同时，将天线振子130和滤波器140同时集成在电路板110上，而避开电路板110上用于对功放板120进行电磁屏蔽的屏蔽罩，从而提高有源天线单元设备的结构集成度，有利于实现有源天线单元设备的小型化。
另外，电路板110还可以用作天线振子130的反射板，即天线振子130可以印制在电路板110上，或者采用贴片贴附在电路板110上，借助电路 板110实现辐射，从而去除目前有源天线单元中的天线反射板，以进一步降低有源天线单元设备的整机厚度，并且有利于减轻有源天线单元设备的整机重量。
此处天线振子130与滤波器140可以设置在电路板110靠近功放板120的一侧，也可以设置在电路板110远离功放板120的一侧。
在本公开的一些实施例中，为了在使电路板110上层叠设置功放板120后，能够有效利用电路板110上的其余空间，可选地，滤波器140设置在电路板110靠近功放板120的一侧，天线振子130设置在电路板110远离功放板120的一侧。
通过将天线振子130设置在电路板110远离功放板120的一侧，并将滤波器140设置在电路板110靠近功放板120的一侧，能够有效利用电路板110上的表面空间来布置天线振子130。在电路板110上层叠设置功放板120后，由多个天线振子130组成的天线可以布局在电路板110远离功放板120的一面，从而方便天线振子130的布局。如在一种具体实施例中，天线振子130可以布置在电路板110的正面，滤波器140和功放板120可以布置在电路板110的背面。
此处天线振子130在电路板110上可以布置成矩形阵列或者菱形阵列。
此处滤波器140与功放板120之间的电连接可以通过微带线或者带状线实现，即可以在电路板110上印制微带线或者带状线实现滤波器140与功放板120之间的信号传输，从而节省了连接器的使用，有利于进一步降低有源天线单元设备的整机重量。
另外，为了方便实现位于电路板110两侧的滤波器140与天线振子130之间的连接，可以在电路板110上设置贯穿电路板110的过孔(图中未示出)，滤波器140经由穿过过孔的连接件与天线振子130电连接。
此处过孔111连通电路板110的正面和背面，连接件可以为导电柱或者导电线，通过在电路板110上设置过孔，将连接件穿过过孔，从而便于实现位于电路板110两侧的滤波器140与天线振子130之间的电连接。另外，也可以通过过孔覆铜实现滤波器140与天线振子130之间的电连接。
滤波器140包括多个滤波器单元，滤波器140在与天线振子130电连接时，采用一对一或者一对多的配对形式。在多个天线振子130以阵列形式排布形成天线阵列时，滤波器140的多个滤波器单元与多个天线振子130对应电连接。滤波器单元可以为腔体滤波器，多个腔体滤波器可以共用同一基板。
在本公开的一些实施例中，可以通过壳体150实现对功放板120的电磁屏蔽，壳体150与电路板110连接、并与电路板110围成内腔151，功放板120位于内腔151中，壳体150用于对功放板120进行电磁屏蔽。
通过借助壳体150与电路板110围成的内腔151，实现对功放板120的电磁屏蔽，从而节省了目前有源天线单元中屏蔽罩的使用，进一步降低了有源天线单元的整机重量。在一个实施例中，壳体150与电路板110围成的内腔151的高度可以依据功放板120所需的腔体谐振频率进行选择。
另外，壳体150可以采用金属材料制作而成，或者在壳体150的内壁添加金属层。如壳体150的材料可以采用铝合金，以确保壳体150的轻量化，并能够与电路板110围成屏蔽腔体，对功放板120起到屏蔽作用。
此处功放板120上的关键部件为放大器121。放大器121是功放板120上布置的起到对射频信号进行功率放大的元器件。放大器121可以直接设置在功放板120上，也可以通过盒子间接设置在功放板120上。
在本公开的一些实施例中，可选地，功放板120背离电路板110的一侧扣设有箱体160(图3所示)。箱体160具有空腔161和连通空腔161的开口162，功放板120盖合于开口162上。箱体160的内壁上设置有放大器121，放大器121位于空腔161中并与功放板120电连接。
通过箱体160将放大器121间接设置在功放板120上，可以便于实现功放板120的散热。功放板120上布置的放大器121在工作时产生的热量可以经箱体160传递至壳体150，进而将热量往有源天线单元设备外传递。
在一个实施例中，为了便于实现热量由箱体160至壳体150的传递，可以在箱体160与壳体150之间填充导热材料。具体地，箱体160与壳体150之间具有间隙A，间隙A内填充有导热材料。
导热材料可以为导热硅脂、导热硅胶或者导热硅泥。通过导热材料的导热性能，可以有效地将放大器121传递至箱体160的热量传导至壳体150，从而有效实现功放板120上放大器121的散热。
在本公开的一些实施例中，可选地，滤波器140位于壳体150与电路板110围成的内腔151中。
通过同时将滤波器140布置在壳体150与电路板110围成的内腔151中，可以有效利用内腔151中的空间，并且便于壳体150与电路板110之间的连接，避免壳体150在与电路板110连接时对电路板110上设置的部分部件的让位。
在本公开的一些实施例中，可选地，壳体150包括相连的围合部152和延伸部153。围合部152与电路板110相连并围成内腔151，延伸部153自围合部152的顶缘沿平行于电路板110的方向弯折延伸。
围合部152是指壳体150与电路板110围成内腔151的部分。延伸部153是指壳体150往电路板110外延伸的部分。壳体150通过围合部152与电路板110接触以与电路板110围成内腔151，从而使功放板120置于内腔151中，壳体150的延伸部153便于壳体150布置其他部件。
此处延伸部153可以自围合部152的顶缘(即围合部152与电路板110相接触的边缘)沿平行于电路板110的方向弯折延伸，也可以自围合部152的外壁沿平行于电路板110的方向弯折延伸。为了增大壳体150与电路板110之间的接触面积，以确保壳体150与电路板110连接时的稳定性，可以使延伸部153自围合部152的顶缘沿平行于电路板110的方向弯折延伸。另外，壳体150的围合部152和延伸部153可以为一体成型结构，以确保壳体150的整体结构强度，保证壳体150的使用寿命。
在一个实施例中，围合部152可以包括底壁154和侧壁155，底壁154正对电路板110、并经侧壁155连接至电路板110，底壁154在平行于电路板110的方向呈凹凸起伏状。
底壁154是指围合部152中沿平行于电路板110的方向延伸的部分，侧壁155是指围合部152中沿垂直于电路板110的方向延伸的部分，底壁 154与电路板110之间具有间隔，以形成内腔151。
通过使底壁154在平行于电路板110的方向呈凹凸起伏状，以适应电路板110上布置的具有不同大小的部件。在如图3所示的有源天线单元中，功放板120上不仅设置有放大器121，还设置有环形器122。环形器122可以用于信号隔离以及收发切换，在壳体150的围合部152与电路板110围成的内腔151中，放大器121、环形器122和滤波器140所占的空间各不相同。而为了降低有源天线单元设备的体积，可以依据内腔151中不同部件所占的空间大小，将围合部152的底壁154设置呈凹凸起伏状，从而适应电路板110上布置的具有不同大小的部件，在降低有源天线单元设备的体积的同时，为电路板110上布置的部件留出足够的空间。
在本公开的一些实施例中，可选地，电路板110远离功放板120的一面设置有移相电路。滤波器140经移相电路连接至天线振子130。电路板110设置有移相电路的一面还设置有盖板170(图4所示)，盖板170用于对移相电路进行电磁屏蔽。盖板170远离电路板110的一侧设置有反射板180。天线振子130设置在反射板180上，并且经反射板180和盖板170设置在电路板110上。
移相电路可以用于调整天线的下倾角。通过在电路板110上设置移相电路可以实现对天线振子130的调节。而天线振子130则通过反射板180、盖板170设置在电路板110上。这样，在不改变天线振子130与电路板110的集成结构的同时，通过电路板110上设置的移相电路便于实现对天线振子130的调节。
此处盖板170为屏蔽罩形式，可以与电路板110之间围成屏蔽腔体，从而对电路板110上的移相电路起到电磁屏蔽的作用。
本公开实施例还提供了一种基站，包括上述实施例中的有源天线单元，其中，有源天线单元布置在基站的杆塔上。
通过改变目前有源天线单元设备的架构，在将功放板120层叠设在电路板110上的同时，将天线振子130和滤波器140同时集成在电路板110上，而避开电路板110上用于对功放板120进行电磁屏蔽的屏蔽罩。这样， 可以提高有源天线单元设备的结构集成度，有利于实现有源天线单元设备的小型化，从而节约基站的杆塔资源。
本领域的普通技术人员可以理解，上述各实施方式是实现本公开的具体实施例，而在实际应用中，可以在形式上和细节上对其作各种改变，而不偏离本公开的精神和范围。

Claims (11)

  1. 一种有源天线单元，其中，
    所述有源天线单元包括：电路板、层叠设置在所述电路板上的功放板、以及设置在所述电路板上的天线振子和滤波器，
    所述电路板被构造成为所述功放板供电，
    所述功放板与所述滤波器电连接并且被构造成对射频信号进行功率放大，以及
    所述滤波器与所述天线振子电连接并且被构造成收发射频信号。
  2. 根据权利要求1所述的有源天线单元，其中
    所述滤波器设置在所述电路板靠近所述功放板的一侧，所述天线振子设置在所述电路板远离所述功放板的一侧。
  3. 根据权利要求2所述的有源天线单元，其中，
    所述电路板上设置有贯穿所述电路板的过孔，所述滤波器经由穿过所述过孔的连接件与所述天线振子电连接。
  4. 根据权利要求1所述的有源天线单元，其中，
    所述有源天线单元还包括壳体，所述壳体与所述电路板连接并与所述电路板围成内腔，所述功放板位于所述内腔中，并且所述壳体被构造成对所述功放板进行电磁屏蔽。
  5. 根据权利要求4所述的有源天线单元，其中，
    所述功放板背离所述电路板的一侧扣设有箱体，所述箱体具有空腔和连通所述空腔的开口，所述功放板盖合于所述开口上，所述箱体的内壁上 设置有放大器，并且所述放大器位于所述空腔中并与所述功放板电连接。
  6. 根据权利要求5所述的有源天线单元，其中，
    所述箱体与所述壳体之间具有间隙，所述间隙内填充有导热材料。
  7. 根据权利要求4所述的有源天线单元，其中，
    所述滤波器位于所述内腔中。
  8. 根据权利要求4所述的有源天线单元，其中，
    所述壳体包括相连的围合部和延伸部，所述围合部与所述电路板相连并围成所述内腔，并且所述延伸部自所述围合部的顶缘沿平行于所述电路板的方向弯折延伸。
  9. 根据权利要求8所述的有源天线单元，其中，
    所述围合部包括底壁和侧壁，所述底壁正对所述电路板并经所述侧壁连接至所述电路板，并且所述底壁在平行于所述电路板的方向呈凹凸起伏状。
  10. 根据权利要求1所述的有源天线单元，其中，
    所述电路板远离所述功放板的一面设置有移相电路，所述滤波器经所述移相电路连接至所述天线振子，所述电路板设置有所述移相电路的一面还设置有盖板，所述盖板用于对所述移相电路进行电磁屏蔽，所述盖板远离所述电路板的一侧设置有反射板，所述天线振子设置在所述反射板并经所述反射板和所述盖板设置在所述电路板上。
  11. 一种基站，包括：权利要求1至10任一项所述的有源天线单元。
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