WO2023093450A1

WO2023093450A1 - Heating assembly and aerosol generating apparatus

Info

Publication number: WO2023093450A1
Application number: PCT/CN2022/128026
Authority: WO
Inventors: 梁峰; 刘小力; 郭玉
Original assignee: 深圳麦时科技有限公司
Priority date: 2021-11-26
Filing date: 2022-10-27
Publication date: 2023-06-01
Also published as: CN114052297A

Abstract

A heating assembly and an aerosol generating apparatus. The heating assembly (10) comprises a base body (11), an infrared layer (12), and a heating element (13); the base body (11) is used for accommodating an aerosol generating substrate; the infrared layer (12) is arranged on the surface of the base body (11) and/or the infrared layer (12), and is used for radiating infrared rays during heating, so as to heat and atomize the aerosol generating substrate; the heating element (13) is arranged on the base body (11) and is used for heating the infrared layer (12) in the process of being energized; and the heating element (13) has a resistance temperature coefficient characteristic and can be used as a temperature sensor. The heating assembly (10) is convenient to arrange, and is small in occupied space.

Description

Heating element and aerosol generating device

Cross References to Related Applications

This application claims its priority based on Chinese patent application 2021114213272 submitted on November 26, 2021, and its entire description is incorporated herein by reference.

【Technical field】

The invention relates to the technical field of electronic atomization devices, in particular to a heating component and an aerosol generating device.

【Background technique】

Heat Not Burning (HNB) aerosol generators have attracted more and more attention and favor because of their safety, convenience, health, and environmental protection.

The existing heat-not-burn aerosol generating device generally includes a heating assembly and a power supply assembly; wherein the heating assembly is used to heat and atomize the aerosol generating substrate when energized, and the power supply assembly is connected to the heating assembly for feeding the heating assembly powered by. In the specific heating process, it is often necessary to monitor the temperature of the heating element or the aerosol-generating substrate in the heating element in real time, so as to adjust the temperature field at any time to meet different temperature requirements. At present, external temperature measuring elements such as thermocouple temperature sensors are generally added to measure the temperature of the heating component in real time, so as to adjust the heating temperature at any time.

However, measuring temperature by adding a separate temperature measuring sensor or element will not only occupy a large space, but also be inconvenient to install.

【Content of invention】

The present application provides a heating assembly and an aerosol generating device. The heating assembly can solve the existing problem of adding a separate temperature measuring sensor or temperature measuring element to measure temperature, which not only occupies a large space, but also is inconvenient to install.

In a first aspect, the present application provides a heating assembly. The heating assembly includes a substrate, an infrared layer, and a heating element; wherein, the substrate is used to accommodate aerosol-generating substrates; the infrared layer is arranged on the surface of the substrate and/or the infrared layer, and is used for radiating infrared rays during heating to heat and atomize the gas The sol produces a substrate; the heating element is arranged on the substrate to heat the infrared layer when the electricity is applied; wherein, the heating element has a temperature coefficient of resistance (temperature coefficient of resistance, TCR) characteristic and can be used as a temperature sensor.

Wherein, the heating element is a heating layer, and the heating layer is arranged on the surface of the infrared layer away from the substrate.

Wherein, wherein, the heating element is arranged on the surface of the substrate and arranged at intervals from the infrared layer.

Wherein, the heating element is a heating layer, and the heating layer is arranged on the surface of the base body and between the base body and the infrared layer.

In a second aspect, the present application provides a heating assembly. The heating assembly includes a substrate, an infrared layer, a heating element, and a temperature measuring layer; wherein, the substrate is used to contain the aerosol generating substrate; the infrared layer is arranged on the surface of the substrate, and is used to radiate infrared rays during heating to heat and atomize the aerosol Generate a substrate; the heating element is arranged on the substrate for heating the infrared layer when energized; the temperature measuring layer is arranged on the surface of the substrate and/or the infrared layer, and is spaced from the heating element; wherein, the temperature measuring layer has a temperature coefficient of resistance ( TCR) characteristics.

Wherein, the temperature measuring layer is arranged on the surface of the substrate, and the temperature measuring layer and the infrared layer are located on the same surface of the substrate and arranged at intervals from each other.

Wherein, the temperature measuring layer is arranged on the surface of the infrared layer away from the substrate, and the temperature measuring layer is arranged at intervals from the heating element.

Wherein, the temperature measuring layer is arranged around the circumferential direction of the base body.

Wherein, the temperature measuring layer is located at the end of the substrate.

Wherein, the substrate is a hollow columnar body, the infrared layer is arranged on the outer surface of the hollow columnar body, and the heating element is a heating layer arranged on the surface of the infrared layer away from the substrate.

Wherein, the base body is a hollow columnar body, the infrared layer is arranged on the inner surface of the base body of the hollow columnar body, and the heating element is a heating layer arranged on the surface of the infrared layer away from the base body.

Wherein, the heating layer is located in the middle of the base body and is distributed in a wave shape along the circumferential direction of the base body.

Wherein, the substrate is quartz.

Wherein, the infrared layer, the heating element and the temperature measuring layer are all arranged on the outer surface of the substrate by silk screen printing or coating, and the area of the temperature measuring layer is smaller than that of the infrared layer.

In a third aspect, the present application provides an aerosol generating device. The aerosol generating device includes: a heating assembly, a power supply assembly and a controller; wherein, the heating assembly is used to heat and atomize the aerosol generating substrate when energized; the heating assembly is the heating assembly as mentioned above; the power supply assembly and the heating assembly The connection is used to supply power to the heating component; the controller is used to control the power supply component to supply power to the heating component, detect the resistance value of the heating element or the temperature measuring layer in real time, and monitor the temperature of the heating component according to the resistance value.

The heating assembly and the aerosol generating device provided by the application. The heating component is provided with a substrate, so as to receive the aerosol generating substrate through the substrate. At the same time, an infrared layer is arranged on the surface of the substrate to radiate infrared rays when the infrared layer is heated, so that the substrate is heated and atomized by the radiated infrared rays to generate the substrate, thereby improving the heating efficiency, and the heating uniformity is better. In addition, by disposing a heating element on the substrate and/or the infrared layer, the infrared layer is heated when the heating element is energized, so that the infrared layer radiates infrared rays. In addition, by making the heating element have a temperature coefficient of resistance (TCR) characteristic, it can be used as a temperature sensor, so that the heating assembly can monitor the temperature value of the heating assembly by detecting the resistance value of the heating element. Compared with the prior art, due to the heating The element is in the form of a film, which can be directly deposited on the surface of the substrate and/or the infrared layer, without installing grooves on the surface of the substrate and/or the infrared layer or fixing it with screws or screws, so that the heating element not only Easy to set up and takes up little space. In addition, since the heating element can be selected to cover some specific positions of the substrate and/or the infrared layer and to cover a larger area of the substrate and/or the surface of the infrared layer according to actual needs, it is possible to control the surface of the substrate and/or the infrared layer. The temperature measurement is performed in a specific area, and the temperature measurement accuracy is high, and the temperature measurement can be performed on most areas of the substrate and/or the infrared layer, effectively expanding the temperature measurement range of the heating component.

【Description of drawings】

FIG. 1 is a schematic structural diagram of a heating assembly provided in the first embodiment of the present application;

Fig. 2 is a schematic structural diagram of the heating assembly corresponding to Fig. 1;

Fig. 3 is a schematic structural diagram of a heating assembly provided in a second embodiment of the present application;

Fig. 4 is an A-A sectional view of the heating assembly shown in Fig. 3;

Fig. 5 is a schematic structural diagram of a heating assembly provided in a third embodiment of the present application;

Fig. 6 is a schematic structural diagram of the heating assembly corresponding to Fig. 5;

FIG. 7 is a schematic structural diagram of a heating assembly provided in a fourth embodiment of the present application;

Fig. 8 is a schematic structural diagram of the heating assembly corresponding to Fig. 7;

Fig. 9 is a schematic structural diagram of an aerosol generating device provided by an embodiment of the present application.

【Detailed ways】

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

The terms "first", "second", and "third" in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship between the various components in a certain posture (as shown in the drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

The application will be described in detail below in conjunction with the accompanying drawings and embodiments.

Please refer to Figure 1 and Figure 2, Figure 1 is a schematic structural diagram of the heating assembly provided in the first embodiment of the present application; Figure 2 is a schematic structural diagram of the heating assembly corresponding to Figure 1; in this embodiment, a heating The assembly 10, the heating assembly 10 is specifically used for heating and atomizing the aerosol-generating substrate when energized to form an aerosol. The heating assembly 10 can be used in different fields, such as electronic atomization and other fields. The heating assembly 10 includes a substrate 11 , an infrared layer 12 and a heating element 13 . Wherein, the heating element 13 is used to generate heat when energized.

Wherein, the base body 11 may be in the shape of a hollow column, and the hollow structure of the base body 11 is formed into a receiving cavity 111, and the receiving cavity 111 is used for storing the aerosol-generating substrate. Wherein, the aerosol-generating substrate can be a plant-grass-like substrate or a paste-like substrate. The base body 11 is made of insulating material, and the base body 11 may be a high temperature resistant insulating material such as quartz glass, ceramics or mica, so as to prevent short circuit between two electrodes. Preferably, the substrate 11 can be transparent quartz. Of course, the substrate 11 can also be made of conductive materials, and in this case an insulating layer can be coated on the surface of the substrate 11 . In a specific embodiment, the base body 11 is a cylindrical ceramic tube. It should be noted that, the inner surface of the base body 11 referred to in the following embodiments refers to the inner wall surface of the receiving cavity 111 , and the outer surface of the base body 11 refers to the outer wall surface of the receiving cavity 111 .

The infrared layer 12 is disposed on the surface of the substrate 11 for radiating infrared rays when heated to heat and atomize the aerosol generating substrate. Specifically, the infrared layer 12 can be formed on the inner surface or the outer surface of the substrate 11 by means of silk screen printing, sputtering, coating, printing and the like. The infrared rays radiated from the infrared layer 12 are used to heat the aerosol-generating substrate, so that the heating efficiency is high, and the aerosol-generating substrate is baked more uniformly. In a specific embodiment, the infrared layer 12 may specifically be an infrared heating film, such as an infrared ceramic coating. The thickness and area of the infrared heating film are not limited, and can be selected according to needs.

Wherein, the infrared layer 12 can be a metal layer, a conductive ceramic layer or a conductive carbon layer. The shape of the infrared layer 12 can be continuous film, porous mesh or strip. Wherein, the material, shape and size of the infrared layer 12 can be set as required. In a specific embodiment, when the infrared layer 12 is electrified, it radiates infrared rays to heat the aerosol-generating substrate in the containing cavity 111 . Among them, the wavelength of infrared heating is 2.5um-20um. According to the characteristics of heating aerosol to form a matrix, the heating temperature usually needs to be above 350°C, and the energy radiation extreme value is mainly in the 3-5um band.

In one embodiment, referring to FIG. 1, the infrared layer 12 is specifically arranged on the outer surface of the substrate 11, and the entire outer surface of the substrate 11 can be formed with the infrared layer 12, so as to realize uniform heating while avoiding the generation of the heating element 13. After the heat is conducted through the substrate 11, the heat is lost, resulting in a large error in the temperature measurement result; at the same time, the problem of the infrared layer 12 being scratched by the aerosol-generated substrate is avoided. The following embodiments all take this as an example. Of course, in other embodiments, refer to FIG. 3 and FIG. 4 , wherein FIG. 3 is a schematic structural diagram of the heating assembly provided in the second embodiment of the present application; FIG. 4 is a cross-sectional view of the heating assembly shown in FIG. 3 along the direction A-A. The infrared layer 12 can also be formed on the inner surface of the substrate 11, which is not limited in the present application.

The heating element 13 is disposed on the surface of the substrate 11 and/or the infrared layer 12 for heating the infrared layer 12 when electrified. It can be understood that, in this embodiment, the infrared layer 12 itself does not generate heat, but the temperature of the infrared layer 12 itself changes after the heating element 13 transfers heat to the infrared layer 12 after being energized to generate heat. Specifically, the heating element 13 can also be formed by silk screen printing, sputtering, coating, printing and other methods. Wherein, the heating element 13 can specifically be a heating film; for example, a conductive film such as a copper film or an aluminum film.

Further, the heating element 13 has a temperature coefficient of resistance (TCR) characteristic and can be used as a temperature sensor. That is, the resistance value of the heating element 13 has a monotonous one-to-one correspondence with its own temperature value. For example, the resistance value of the heating element 13 increases as its temperature increases; or, the resistance value of the heating element 13 decreases as its temperature increases. In this way, the heating component 10 can monitor the temperature value of the heating component 10 by detecting the resistance value of the heating element 13 , and then adjust the temperature field of the heating component 10 to achieve the best effect of puffing taste. Compared with the scheme in the prior art that requires additional temperature measuring elements such as temperature measuring sensors, since the heating element 13 is in the form of a film, it can be directly deposited on the surface of the substrate 11 and/or the infrared layer 12, without the need for a layer on the substrate 11 and/or Mounting grooves are provided on the surface of the infrared layer 12 or fixed with screws or screws, so that the heating element 13 is not only easy to install, but also takes up less space. In addition, since the heating element 13 can be selected to cover some specific positions of the substrate 11 and/or the infrared layer 12 and to cover a larger area of the substrate 11 and/or the surface of the infrared layer 12 according to actual needs, the substrate 11 and the infrared layer 12 can be controlled. /or a specific area on the surface of the infrared layer 12 is used for temperature measurement, the temperature measurement accuracy is high, and the temperature can be measured for most areas of the substrate 11 and/or the infrared layer 12, effectively expanding the temperature measurement range of the heating component 10 .

In a specific embodiment, the heating element 13 can at least cover the highest temperature region of the heating component 10, so as to avoid the problem that the local temperature is too high and affects the heating taste of the aerosol generating substrate. It can be understood that, in a specific embodiment, if the highest temperature region of the heating component 10 corresponds to a certain region of the substrate 11, the heating element 13 at least covers this position of the substrate 11; if the highest temperature region of the heating component 10 corresponds to A certain position of the infrared layer 12 , the heating element 13 at least covers this position of the infrared layer 12 .

As shown in FIG. 1 , the heating element 13 can be arranged in a circle along the circumferential direction of the base body 11 . In this embodiment, two electrodes can be set at two preset positions of the heating element 13 , and the two electrodes are respectively used to connect the positive lead and the negative lead to detect the resistance value of the heating element 13 . Of course, in other embodiments, the heating element 13 can also be in the shape of an arc with a notch along the circumferential direction of the base body 11, and the two ends where the notch of the heating element 13 is located can be formed as two electrodes to connect with the positive electrode lead and the negative electrode. The lead connection is not limited in this application.

Specifically, the heating element 13 can be distributed in a wave shape along the circumferential direction of the base body 11, so as to cover different regions of the heating component 10 as much as possible, and then sense the temperature of different positions of the heating component 10, so as to control the different regions of the heating component 10. The temperature of the area is monitored. For example, when the base body 11 is tubular, the heating element 13 is disposed in the middle of the base body 11 and undulates along the length direction of the base body 11 , thereby covering different regions along the length direction of the base body 11 . Of course, in other embodiments, the heating elements 13 can also be distributed in a linear, bent, point-like manner along the circumferential direction of the base body 11; this application does not limit this, and the specific distribution positions of the heating elements 13 It can be selected according to actual needs, as long as the temperature value of the heating component 10 can be detected in real time.

In a specific embodiment, the infrared layer 12 and the heating element 13 can be arranged on the same surface of the substrate 11, or on different surfaces of the substrate 11, for example, one is arranged on the inner surface of the substrate 11, and the other is arranged on the inner surface of the substrate 11. The outer surface. Heating element 13 can only be arranged on the surface of infrared layer 12, also can only be arranged on the surface of substrate 11, can also be arranged on the surface of infrared layer 12 and substrate 11 simultaneously, for example, a part is arranged on the surface of infrared layer 12, another part set on the surface of the substrate 11. The temperature measuring layer 13 can be arranged on the surface of the infrared layer 12 facing away from the substrate 11 , or on the surface of the infrared layer 12 close to the substrate 11 .

In one embodiment, referring to FIG. 1 and FIG. 4 , the heating element 13 is only disposed on the surface of the infrared layer 12 away from the base 11 . Wherein, the infrared layer 12 can cover the entire surface of the base body 11, and when the infrared layer 12 is arranged on the outer surface of the base body 11, the specific structure of the heating assembly 10 is as shown in Figure 1; On the surface, the specific structure of the heating assembly 10 is shown in Fig. 3 and Fig. 4 . In this embodiment, after the heating element 13 is energized, the temperature of the heating element 13 increases continuously, and its resistance value changes with the change of its own temperature, thereby detecting the temperature of the heating assembly 10 by detecting the resistance value of the heating element 13 itself. value, and then adjust the temperature field of the heating component 10 to achieve the best effect of the taste of the puff.

In this embodiment, since the passive infrared layer 12 itself has a heat conduction function, the parts where the infrared layer 12 and the heating element 13 do not overlap can conduct heat; therefore, the area of the heating element 13 can be made close to or smaller than the area of the infrared layer 12.

Specifically, in this embodiment, the heating element 13 may be located in the middle of the base body 11 along its axial direction, and distributed around the outer surface of the base body 11 in a wave shape.

In another embodiment, the heating element 13 is only arranged on the surface of the substrate 11 and is on the same plane as the infrared layer 12, so that after the heating element 13 is energized and generates heat, the heat is transferred to the substrate 11, and then transferred to the infrared layer through the substrate 11 12, so that the infrared layer 12 heats and radiates infrared rays. In this embodiment, the heating element 13 can be spaced apart from the infrared layer 12; or, the heating element 13 is located between the substrate 11 and the infrared layer 12, which is not limited in the present application.

Of course, in other embodiments, both the heating element 13 and the infrared layer 12 are disposed on the base 11 and located on different surfaces of the base 11 . For example, the heating element 13 is arranged on the inner surface of the base body 11, and the infrared layer 12 is arranged on the outer surface of the base body 11. After the heating element 13 is energized, the temperature after heating is conducted to the base body 11, and the temperature of the base body 11 is further conducted to the infrared layer 12, thereby The infrared layer 12 is heated to radiate infrared rays. Alternatively, the heating element 13 is disposed on the outer surface of the base 11 , and the infrared layer 12 is disposed on the inner surface of the base 11 .

In the heating assembly 10 provided in this embodiment, a base body 11 is provided so as to accommodate the aerosol-generating substrate through the base body 11 . At the same time, by setting the infrared layer 12 on the surface of the substrate 11 to radiate infrared rays when the infrared layer 12 is heated, the radiated infrared rays heat and atomize the aerosol to generate the substrate, thereby improving the heating efficiency, and the heating uniformity is better. In addition, by disposing the heating element 13 on the substrate 11 and/or the infrared layer 12, the infrared layer 12 is heated when the heating element 13 is energized, so that the infrared layer 12 radiates infrared rays. In addition, by making the heating element 13 have a temperature coefficient of resistance (TCR) characteristic, so that the heating assembly 10 can monitor the temperature value of the heating assembly 10 by detecting the resistance value of the heating element 13, compared with the prior art, the heating element 13 Not only is it easy to set up, but it also takes up less space. In addition, since the heating element 13 can be selected to cover some specific positions of the substrate 11 and/or the infrared layer 12 and to cover a larger area of the substrate 11 and/or the surface of the infrared layer 12 according to actual needs, the substrate 11 and the infrared layer 12 can be controlled. /or a specific area on the surface of the infrared layer 12 is used for temperature measurement, the temperature measurement accuracy is high, and the temperature can be measured for most areas of the substrate 11 and/or the infrared layer 12, effectively expanding the temperature measurement range of the heating component 10 .

Please refer to FIG. 5 and FIG. 6 , wherein FIG. 5 is a schematic structural diagram of a heating assembly provided in the third embodiment of the present application; FIG. 6 is a schematic structural diagram of the heating assembly corresponding to FIG. 5 . In this embodiment, another heating assembly 10 is provided. The difference between the heating assembly 10 and the heating assembly 10 provided in the above-mentioned first embodiment is that the heating assembly 10 further includes a temperature measuring layer 14 . The temperature measuring layer 14 has a temperature coefficient of resistance (TCR) characteristic. That is, the resistance value of the temperature measuring layer 14 has a monotonous one-to-one correspondence with its own temperature value. For example, the resistance value of the temperature measuring layer 14 increases as its temperature increases; or, the resistance value of the temperature measuring layer 14 decreases as its temperature increases. In this embodiment, the heating component 10 can monitor the temperature value of the heating component 10 by detecting the resistance value of the temperature measuring layer 14 , and then adjust the temperature field of the heating component 10 to achieve the best effect of puffing taste. Compared with the scheme in the prior art that requires additional temperature-measuring elements such as temperature-measuring sensors, since the temperature-measuring layer 14 is in the form of a film, it can be directly deposited on the surface of the substrate 11 and/or the infrared layer 12 without the need Or the surface of the infrared layer 12 is provided with mounting grooves or fixed with screws or screws, so that the temperature measuring layer 14 is not only easy to install, but also takes up less space.

Of course, in a specific embodiment, the resistance value of the heating element 13 can also be detected simultaneously to monitor the temperature value of the heating assembly 10, so as to improve the accuracy of the temperature monitoring result. Of course, in this embodiment, the heating element 13 may not have a temperature coefficient of resistance (TCR) characteristic, which is not limited in this embodiment.

Wherein, the temperature measuring layer 14 can be formed on the surface of the substrate 11 and/or the infrared layer 12 by means of screen printing, sputtering, coating, printing, etc., and is spaced apart from the heating element 13 . Wherein, because the temperature measuring layer 14 can select some specific positions covering the substrate 11 and/or the infrared layer 12 and select to cover the surface of the substrate 11 and/or the infrared layer 12 in a larger area according to actual needs, thereby being able to control the substrate 11 and/or a specific area on the surface of the infrared layer 12, the temperature measurement accuracy is high, and it is possible to measure the temperature of most areas of the substrate 11 and/or the infrared layer 12, effectively expanding the temperature measurement of the heating element 10 scope.

Specifically, the temperature measuring layer 14 may at least cover the highest temperature region of the heating component 10, so as to avoid the problem that the local temperature is too high and affects the heating taste of the aerosol generating substrate. It can be understood that, in a specific embodiment, if the highest temperature region of the heating component 10 corresponds to a certain region of the substrate 11, the temperature measuring layer 14 covers at least this position of the substrate 11; if the highest temperature region of the heating component 10 corresponds to At a certain position of the infrared layer 12 , the temperature measuring layer 14 at least covers the position of the infrared layer 12 .

In one embodiment, the square resistance of the temperature measuring layer 14 is 1Ω/□˜5Ω/□, and the temperature coefficient of resistance of the temperature measuring layer 14 is 300ppm/°C˜3500ppm/°C. Further, the square resistance of the temperature measuring layer 14 is 2Ω/□˜4Ω/□, and the temperature coefficient of resistance of the temperature measuring layer 14 is 700ppm/°C˜2000ppm/°C.

Wherein, because the resistance of the temperature measuring layer 14 is relatively large, and the temperature measuring layer 14 only realizes the temperature measuring function, therefore, in a specific embodiment, the area of the temperature measuring layer 14 can be smaller than the area of the infrared layer 12, which can not only reduce energy consumption, and does not affect the heating effect of the infrared layer 12; at the same time, the overall temperature field of the infrared layer 12 can be consistent. Specifically, the ratio of the area of the temperature measuring layer 14 to the area of the infrared layer 12 may range from 1:5 to 1:10.

Specifically, the resistance paste for preparing the temperature measuring layer 14 includes an organic vehicle, an inorganic binder and a conductive agent. In terms of parts by mass, the number of parts of the organic vehicle is 10 to 20 parts, and the number of parts of the inorganic binder is 30-45 parts, the number of conductive agent is 30-50 parts, the inorganic binder includes glass powder, and the conductive agent is at least one selected from silver and palladium.

In one embodiment, the organic carrier is at least one selected from terpineol, ethyl cellulose, butyl carbitol, polyvinyl butyral, tributyl citrate and polyamide wax.

In one embodiment, the inorganic binder includes glass frit with a melting point of 700°C-780°C.

As shown in FIG. 5 , the temperature measuring layer 14 may be arranged in a circle along the circumferential direction of the base body 11 . In this embodiment, two electrodes can be set at two preset positions of the temperature measuring layer 14 , and the two electrodes are respectively used to connect the positive electrode lead and the negative electrode lead to detect the resistance value of the temperature measuring layer 14 . Of course, in other embodiments, the temperature-measuring layer 14 can also be in the shape of an arc with a gap along the circumferential direction of the substrate 11, and the two ends where the gap of the temperature-measuring layer 14 is located can be formed as two electrodes to connect with the positive electrode lead. It is connected to the negative electrode lead, which is not limited in this application.

Specifically, the temperature measuring layer 14 may be distributed linearly along the circumferential direction of the substrate 11 to detect the temperature of a specific area of the heating assembly 10 . Of course, in other embodiments, the temperature measuring layer 14 may also be distributed in a linear, connected “Z” shape, U shape, bent shape, point shape, etc. along the circumferential direction of the base body 11 .

Specifically, the material of the temperature measuring layer 14 and the heating element 13 may be the same. Wherein, the power of the temperature measuring layer 14 is greater than the power of the heating element 13 .

In a specific embodiment, the temperature measuring layer 14 and the infrared layer 12 can be arranged on the same surface of the substrate 11, or on different surfaces of the substrate 11, for example, one is arranged on the inner surface of the substrate 11, and the other is arranged on the substrate 11. of the outer surface. The temperature measuring layer 14 can only be arranged on the surface of the infrared layer 12, also can only be arranged on the surface of the substrate 11, can also be arranged on the surface of the infrared layer 12 and the substrate 11 at the same time, for example, a part is arranged on the surface of the infrared layer 12, and another A part is provided on the surface of the substrate 11 . The temperature measuring layer 14 can be arranged on the surface of the infrared layer 12 facing away from the substrate 11 , or on the surface of the infrared layer 12 close to the substrate 11 .

In the first specific embodiment, as shown in FIG. 5 and FIG. 6 , the infrared layer 12 is arranged on the outer surface of the substrate 11 , and the temperature measuring layer 14 is only arranged on the surface of the infrared layer 12 facing away from the substrate 11 . After the heating element 13 is energized, the temperature of the heating element 13 increases, and the heat generated by the heating element 13 is transferred to the infrared layer 12, and then passed to the temperature measuring layer 14 through the infrared layer 12, so that the temperature of the temperature measuring layer 14 increases with the temperature of the infrared layer. The temperature of the heating element 12 rises, and the resistance value of the temperature measuring layer 14 changes with the temperature change, and then the temperature value of the heating component 10 is monitored in real time by detecting the resistance value of the temperature measuring layer 14 .

As shown in Figure 5, the base body 11 is a hollow cylinder, and the infrared layer 12 covers the entire outer surface of the base body 11, which can avoid heat loss after the temperature of the heating element 13 conducts heat through the base body 11, resulting in large errors in temperature measurement results. Problems occur; at the same time, avoid the problem that the heating layer 12 is scratched by the aerosol-generating substrate. In this embodiment, the heating element 13 can be specifically located in the middle of the base 11 along its axial direction, and is arranged around the outer surface of the base 11 in a wave shape to improve heating uniformity; the temperature measuring layer 14 is arranged on the infrared The position near the end of the layer 12 is used to detect the temperature of a specific area of the heating element 10 . Certainly, in other embodiments, the infrared layer 12 may also be disposed on the inner surface of the substrate 11, which is not limited in the present application.

In the second specific embodiment, see FIG. 7 and FIG. 8 , FIG. 7 is a schematic structural diagram of a heating assembly provided in the fourth embodiment of the present application; FIG. 8 is a schematic structural diagram of the heating assembly corresponding to FIG. 7 . The temperature measuring layer 14 is disposed on the surface of the substrate 11 , and is located on the same surface of the substrate 11 as the infrared layer 12 and is spaced apart. In this specific embodiment, the heating element 13 generates heat after being energized, and the temperature of the heating element 13 is conducted to the infrared layer 12, and then transferred to the surface of the substrate 11 through the infrared layer 12, and the temperature of the temperature measuring layer 14 arranged on the surface of the substrate 11 varies with the temperature of the substrate 11. The temperature of the substrate 11 changes, and the resistance value of the temperature-measuring layer 14 changes with the change of temperature, so that the temperature value of the heating component 10 can be monitored in real time by detecting the resistance value of the temperature-measuring layer 14 .

In this embodiment, the position of the temperature measuring layer 14 is selected to be arranged at any position of the base 11 or any position of the covering base 11 according to actual requirements. For example, if the temperature of the first end of the substrate 11 is to be monitored, the temperature measuring layer 14 may be disposed at the first end. If the temperature in the middle of the substrate 11 is to be monitored, the temperature measuring layer 14 can be arranged in the middle of the substrate 11 , as shown in FIG. 1 . If you want to monitor the temperature of the first end portion and the second end portion of the substrate 11 simultaneously, then a plurality of temperature measuring layers 14 can be set, so that one temperature measuring layer 14 covers the first end portion, and another temperature measuring layer 14 covers the second end portion. end, so as to monitor the temperature of the corresponding position of the substrate 11. Preferably, in a specific embodiment, the infrared layer 12 can be arranged on the first end of the outer surface of the substrate 11, and the temperature measuring layer 14 can be arranged on the second end of the substrate 11, and is spaced apart from the infrared layer 12, The temperature value of the second end of the substrate 11 is detected by detecting the resistance value of the temperature measuring layer 14 .

Referring to FIG. 7 , the base 11 is a hollow cylinder, and the infrared layer 12 is disposed on the outer surface of the base 11 and only exposes one end of the base 11 . The temperature measuring layer 14 is disposed on the exposed area of the outer surface of the base body 11 , spaced apart from the infrared layer 12 , and the temperature measuring layer 14 is disposed around the base body 11 in a circumferential direction. Wherein, the temperature measuring layer 14 can be arranged in a circle along the circumferential direction of the base body 11, that is, the temperature measuring layer 14 is in a closed ring shape; of course, the temperature measuring layer 14 can also be arranged in an open ring shape along the circumferential direction of the base body 11, that is, The arc corresponding to the temperature measuring layer 14 is less than 360 degrees.

In the third specific embodiment, the temperature measuring layer 14 is disposed on the surface of the substrate 11 , and the temperature measuring layer 14 is specifically located between the substrate 11 and the infrared layer 12 . It can be understood that, in this embodiment, the temperature measuring layer 14 and the infrared layer 12 are located on the same surface of the substrate 11 .

In the fourth specific embodiment, the temperature measuring layer 14 is located on the surface of the substrate 11, and the temperature measuring layer 14, the infrared layer 12 and the heating element 13 are arranged on different surfaces of the substrate 11. For example, the infrared layer 12 and the heating element 13 are disposed on the inner surface of the substrate 11 , and the temperature measuring layer 14 is disposed on the outer surface of the substrate 11 . The temperature of the heating element 13 is transmitted to the infrared layer 12 and the substrate 11 sequentially after being energized and heated, and the temperature of the substrate 11 is further conducted to the temperature measuring layer 14, so that the resistance of the temperature measuring layer 14 changes with its temperature. Alternatively, the infrared layer 12 and the heating element 13 are disposed on the outer surface of the base 11 , and the temperature measuring layer 14 is disposed on the inner surface of the base 11 .

In the fifth embodiment, the temperature measuring layer 14 and the heating element 13 are located on the same surface of the substrate 11 , and the surface of the substrate 11 and the infrared layer 12 facing away from the substrate 11 can be provided with the temperature measuring layer 14 . Wherein, the temperature measuring layer 14 disposed on the surface of the substrate 11 and the infrared layer 12 facing away from the substrate 11 can be spaced apart from the heating element 13, and can be arranged in a circle along the circumferential direction of the substrate 11 and distributed in a straight line. Wherein, the temperature measuring layer 14 disposed on the substrate 11 and the temperature measuring layer 14 disposed on the surface of the infrared layer 12 facing away from the substrate 11 can be arranged at intervals or integrally formed.

Wherein, by setting the temperature measuring layer 14 on the infrared layer 12 and the substrate 11, the temperature measuring layer 14 can sense the temperature of the substrate 11 and the heating element 13 at the same time, so as to ensure that the temperature measuring layer 14 covers at least the heating element 10. The highest temperature area avoids the problem that the highest temperature area of the heating component 10 appears in other areas not covered by the temperature measurement layer 14, resulting in large errors in temperature measurement results.

In the heating assembly 10 provided in this embodiment, a base body 11 is provided so as to accommodate the aerosol-generating substrate through the base body 11 . At the same time, by setting the infrared layer 12 on the surface of the substrate 11 to radiate infrared rays when the infrared layer 12 is heated, the radiated infrared rays heat and atomize the aerosol to generate the substrate, thereby improving the heating efficiency, and the heating uniformity is better. In addition, by disposing the heating element 13 on the substrate 11, the infrared layer 12 is heated when the heating element 13 is energized, so that the infrared layer 12 radiates infrared rays. In addition, by setting the temperature measuring layer 14 on the surface of the substrate 11 and/or the infrared layer 12, and making the temperature measuring layer 14 have a temperature coefficient of resistance (TCR) characteristic, so that the heating assembly 10 can detect the resistance of the temperature measuring layer 14 The value is used to monitor the temperature value of the heating component 10. Compared with the prior art, the temperature measuring layer 14 is not only convenient to install, but also takes up less space. In addition, since the temperature measuring layer 14 can be selected to cover some specific positions of the base body 11 and/or the infrared layer 12 and to cover a larger area of the base body 11 and/or the surface of the infrared layer 12 according to actual needs, it is possible to control the base body 11 and/or a specific area on the surface of the infrared layer 12, the temperature measurement accuracy is high, and it is possible to measure the temperature of most areas of the substrate 11 and/or the infrared layer 12, effectively expanding the temperature measurement of the heating element 10 scope.

Please refer to FIG. 9 . FIG. 9 is a schematic structural diagram of an aerosol generating device provided by an embodiment of the present application. In this embodiment, an aerosol generating device 100 is provided. The aerosol generating device 100 includes a heating component 10 , a power component 20 and a controller 30 .

Wherein, the heating component 10 is used for heating and atomizing the aerosol-generating substrate to form an aerosol when energized. The heating component 10 can specifically be the heating component 10 involved in any of the above-mentioned embodiments, and its specific structure and function can refer to the description of the specific structure and function of the heating component 10 in the above-mentioned embodiment, and can realize the same or similar technology effect, see below for details.

The power supply assembly 20 is connected to the heating assembly 10 for supplying power to the heating assembly 10 . Wherein, the heating assembly 10 and the power supply assembly 20 may be detachably connected to facilitate the replacement of the heating assembly 10 and improve the utilization rate of the power supply assembly 20 . Certainly, in other embodiments, the power supply assembly 20 and the heating assembly 10 may also be provided integrally, which is not limited in this application.

The controller 30 is used to control the power supply assembly 20 to supply power to the heating assembly 10, and detect the resistance value of the temperature measuring layer 14 on the heating assembly 10 in real time, and monitor the temperature of the heating assembly 10 according to the resistance value, and then regulate the temperature field of the heating assembly 10, In order to achieve the best effect of smoking taste.

In a specific embodiment, the aerosol generating device 100 further includes a casing 40 , and the heating assembly 10 is specifically housed in the casing 40 and connected to the power supply assembly 20 .

The aerosol generating device 100 provided in this embodiment, by setting the heating assembly 10 involved in any one of the above embodiments, makes the aerosol generating device 100 not only heat and atomize the aerosol generating substrate by using radiated infrared rays, to improve heating Efficiency and enhanced heating uniformity; and the temperature value of the heating element 10 can be detected by detecting the resistance value of the heating element 13 or the temperature measuring layer 14 to regulate the temperature field of the heating element 10 to achieve the best effect of smoking taste. At the same time, compared with the prior art, since the heating element 13 or the temperature measuring layer 14 is in the form of a film, it can be directly deposited on the surface of the substrate 11 and/or the infrared layer 12 without installing and installing on the surface of the substrate 11 and/or the infrared layer 12. Grooves or fixing parts such as screws or screws are used to install and fix it, so that the heating element 13 or temperature measuring layer 14 is not only convenient to set up, but also takes up less space. In addition, because the heating element 13 or the temperature measuring layer 14 can be selected to cover some specific positions of the substrate 11 or the infrared layer 12 and to cover a larger area of the substrate 11 and/or the surface of the infrared layer 12 according to actual needs, thereby being able to The temperature measurement is performed on a specific area on the surface of the substrate 11 and/or the infrared layer 12, the temperature measurement accuracy is high, and the temperature can be measured on most areas of the substrate 11 and/or the infrared layer 12, effectively expanding the heating element 10. Temperature measurement range.

The above is only the implementation mode of this application, and does not limit the scope of patents of this application. Any equivalent structure or equivalent process conversion made by using the contents of this application specification and drawings, or directly or indirectly used in other related technical fields, All are included in the scope of patent protection of the present application in the same way.

Claims

A heating assembly, comprising:

a substrate for containing an aerosol-generating substrate;

An infrared layer, disposed on the surface of the substrate, is used to radiate infrared rays when heated to heat and atomize the aerosol-generating substrate;

The heating element is arranged on the surface of the substrate and/or the infrared layer, and is used to heat the infrared layer when electricity is applied; wherein, the heating element has a temperature coefficient of resistance characteristic and can be used as a temperature sensor.
The heating assembly according to claim 1, wherein the heating element is a heating layer, and the heating layer is disposed on a surface of the infrared layer away from the substrate.
The heating assembly according to claim 1, wherein the heating element is disposed on the surface of the base body and spaced from the infrared layer.
The heating assembly according to claim 1, wherein the heating element is a heating layer, and the heating layer is disposed on the surface of the base body and located between the base body and the infrared layer.
A heating assembly, comprising:

a substrate for containing an aerosol-generating substrate;

An infrared layer, disposed on the surface of the substrate, is used to radiate infrared rays when heated to heat and atomize the aerosol-generating substrate;

a heating element, arranged on the substrate, for heating the infrared layer when energized;

The temperature measuring layer is arranged on the surface of the substrate and/or the infrared layer, and is spaced apart from the heating element; wherein, the temperature measuring layer has a temperature coefficient of resistance (TCR) characteristic.
The heating assembly according to claim 5, wherein the temperature measuring layer is disposed on the surface of the substrate, and the temperature measuring layer and the infrared layer are located on the same surface of the substrate and are spaced from each other.
The heating assembly according to claim 5, wherein the temperature measuring layer is disposed on a surface of the infrared layer facing away from the substrate, and the temperature measuring layer is spaced apart from the heating element.
The heating assembly according to claim 5, wherein the temperature measuring layer is arranged around the circumferential direction of the base body.
The heating assembly according to claim 5, wherein the temperature measuring layer is located at the end of the base.
The heating assembly according to claim 5, wherein the substrate is a hollow columnar body, the infrared layer is arranged on the outer surface of the hollow columnar body, and the heating element is arranged on the infrared layer away from the substrate The heating layer on one side of the surface.
The heating assembly according to claim 5, wherein the base body is a hollow columnar body, the infrared layer is arranged on the inner surface of the base body of the hollow columnar body, and the heating element is arranged on the infrared layer away from the The heat generating layer on one side surface of the substrate.
The heating assembly according to claim 10, wherein the heating layer is located in the middle of the base body and is distributed in a wave shape along the circumferential direction of the base body.
The heating assembly of claim 5, wherein said substrate is quartz.
The heating assembly according to claim 5, wherein, the infrared layer, the heating element, and the temperature measuring layer are all arranged on the outer surface of the substrate by silk screen printing or coating, and the temperature measuring layer The area is smaller than the area of the infrared layer.
An aerosol generating device, comprising:

A heating component for heating and atomizing the aerosol generating substrate when energized; the heating component is the heating component according to claim 1;

A power supply component, connected to the heating component, for supplying power to the heating component;

The controller is used to control the power supply component to supply power to the heating component, detect the resistance value of the heating element or the temperature measuring layer in real time, and monitor the temperature of the heating component according to the resistance value.