WO2023085675A1 - Dispositif électronique comprenant une antenne - Google Patents

Dispositif électronique comprenant une antenne Download PDF

Info

Publication number
WO2023085675A1
WO2023085675A1 PCT/KR2022/016919 KR2022016919W WO2023085675A1 WO 2023085675 A1 WO2023085675 A1 WO 2023085675A1 KR 2022016919 W KR2022016919 W KR 2022016919W WO 2023085675 A1 WO2023085675 A1 WO 2023085675A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
conductive pattern
module
antenna module
antenna
Prior art date
Application number
PCT/KR2022/016919
Other languages
English (en)
Korean (ko)
Inventor
한상민
신영학
이종혁
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220004881A external-priority patent/KR20230071000A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2023085675A1 publication Critical patent/WO2023085675A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H01Q1/46—Electric supply lines or communication lines
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • Various embodiments of the present invention relate to an electronic device including an antenna and an antenna module.
  • the electronic device may transmit and receive phone calls and various data with other electronic devices through wireless communication.
  • the electronic device may include at least one antenna module and/or at least one antenna to perform wireless communication with other electronic devices using a network.
  • the electronic device may include, for example, an antenna module capable of supporting a frequency band of about 3 GHz to 300 GHz.
  • the electronic device may include, for example, a conductive pattern (eg, an antenna) capable of supporting a frequency band of about 500 MHz to 6 GHz.
  • a conductive pattern eg, an antenna
  • the number of electronic components included in the electronic device may increase.
  • a space in which an antenna module and a conductive pattern can be disposed inside the electronic device may decrease.
  • an antenna module and a conductive pattern may be spaced apart from each other so as not to affect each other's radiation performance.
  • the space in which the antenna module and the conductive pattern can be disposed in the electronic device may be limited.
  • Various embodiments of the present disclosure may provide an electronic device supporting various frequency bands by arranging an antenna module and a conductive pattern (eg, a conductive pattern type antenna) adjacent to each other.
  • a conductive pattern eg, a conductive pattern type antenna
  • the width of the conductive pattern disposed adjacent to the antenna module smaller than the wavelength (eg, about ⁇ / 2 or less) of the frequency band of the antenna module, to improve the radiation performance of the antenna module
  • An electronic device includes a first support member, a side member integrally formed with or coupled to the first support member, disposed on one side of the first support member, and including a wireless communication module.
  • a printed circuit board an antenna module electrically connected to the wireless communication module to support a first frequency band, and at least a part disposed between the side member and the antenna module, and operatively connected to the wireless communication module to control the first frequency band. It may include a conductive pattern supporting 2 frequency bands.
  • An electronic device includes a first support member, a side member integrally formed with or coupled to the first support member, disposed on one side of the first support member, and including a wireless communication module.
  • a conductive pattern may be included, but the width of the conductive pattern may be less than ⁇ /4 of a wavelength of the first frequency band.
  • the radiation performance of the antenna module is improved by making the width of the conductive pattern disposed adjacent to the antenna module smaller than the wavelength (eg, about ⁇ /2 or less) of the frequency band of the antenna module. or reduce the deterioration of radiation performance of the antenna module.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure.
  • 3A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.
  • FIG. 3B is a perspective view of the back of the electronic device of FIG. 3A according to various embodiments of the present disclosure.
  • FIG. 3C is an exploded perspective view of the electronic device of FIG. 3A according to various embodiments of the present disclosure.
  • FIG. 4A is a diagram illustrating an embodiment of a structure of a third antenna module described with reference to FIG. 2 according to various embodiments of the present invention.
  • FIG. 4B is a cross-sectional view taken along line Y-Y' of the third antenna module shown in (a) of FIG. 4A according to various embodiments of the present invention.
  • FIG. 5 is a diagram schematically illustrating an embodiment of a portion F in a state in which an antenna module and a conductive pattern of the electronic device disclosed in FIG. 3C according to various embodiments of the present disclosure are disposed on a printed circuit board.
  • FIG. 6 is a diagram schematically illustrating an example of a first extension part formed on a conductive pattern according to various embodiments of the present disclosure.
  • FIG. 7 is a diagram schematically illustrating an example of a first extension portion and a second extension portion formed on a conductive pattern according to various embodiments of the present disclosure.
  • FIG. 8 is a diagram schematically illustrating various embodiments of first extension parts and second extension parts formed on a conductive pattern according to various embodiments of the present disclosure.
  • FIG. 9 is a diagram illustrating a traveling direction of a radio signal of an antenna module and a conductive pattern of an electronic device according to various embodiments of the present disclosure.
  • FIG. 10 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a first width.
  • FIG. 11 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a second width.
  • FIG. 12 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a third width.
  • FIG. 13 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a fourth width.
  • FIG. 1 is a block diagram of an electronic device 101 within a network environment 100 according to various embodiments of the present invention.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.
  • the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • software eg, the program 140
  • processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor.
  • NPU neural network processing unit
  • the secondary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function.
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, a : a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips).
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low latency
  • -latency communications can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 may be used to realize peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency (for realizing URLLC).
  • peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC.
  • DL downlink
  • UL uplink each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first, second, or first or secondary may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited.
  • a (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits.
  • a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • FIG. 2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments.
  • the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third An RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna (248).
  • the electronic device 101 may further include a processor 120 and a memory 130 .
  • the second network 199 may include a first cellular network 292 (eg, a legacy network) and a second cellular network 294 (eg, a 5G network).
  • the electronic device 101 may further include at least one of the components illustrated in FIG. 1
  • the second network 199 may further include at least one other network.
  • a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a fourth RFIC 228, a first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192 .
  • the fourth RFIC 228 may be omitted or included as part of the third RFIC 226 .
  • the first communication processor 212 may establish a communication channel of a band to be used for wireless communication with the first cellular network 292 and support legacy network communication through the established communication channel.
  • the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network.
  • the second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294, and establishes a 5G network through the established communication channel. communication can be supported.
  • the second cellular network 294 may be a 5G network defined by 3GPP.
  • the first communication processor 212 or the second communication processor 214 corresponds to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second cellular network 294. It is possible to support establishment of a communication channel to be established, and 5G network communication through the established communication channel.
  • the first communication processor 212 and the second communication processor 214 may be implemented on a single chip or in a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120, the co-processor 123, or the communication module 190. there is.
  • the first RFIC 222 when transmitted, transmits a baseband signal generated by the first communication processor 212 to about 700 MHz to about 700 MHz used in the first cellular network 292 (eg, a legacy network). It can be converted into a radio frequency (RF) signal at 3 GHz.
  • RF radio frequency
  • an RF signal is obtained from a first cellular network 292 (eg, a legacy network) via an antenna (eg, the first antenna module 242) and transmits an RFFE (eg, the first RFFE 232). It can be preprocessed through The first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .
  • the second RFIC 224 uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second cellular network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter referred to as a 5G Sub6 RF signal) of a Sub6 band (eg, about 6 GHz or less).
  • a 5G Sub6 RF signal is obtained from a second cellular network 294 (eg, a 5G network) through an antenna (eg, the second antenna module 244), and an RFFE (eg, the second RFFE 234) ) can be pretreated through.
  • the second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding communication processor among the first communication processor 212 and the second communication processor 214 .
  • the third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter referred to as 5G Above6 RF signal).
  • the 5G Above6 RF signal may be obtained from the second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248) and preprocessed via a third RFFE 236.
  • the third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 .
  • the third RFFE 236 may be formed as part of the third RFIC 226 .
  • the electronic device 101 may include a fourth RFIC 228 separately from or at least as part of the third RFIC 226.
  • the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, an IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 226.
  • the third RFIC 226 may convert the IF signal into a 5G Above6 RF signal.
  • the 5G Above6 RF signal may be received from the second network 294 (eg, 5G network) via an antenna (eg, antenna 248) and converted to an IF signal by a third RFIC 226.
  • the fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.
  • the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package.
  • the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package.
  • at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.
  • the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 .
  • the wireless communication module 192 or processor 120 may be disposed on a first substrate (eg, main PCB).
  • the third RFIC 226 is provided on a part (eg, bottom surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is placed on another part (eg, top surface). is disposed, the third antenna module 246 may be formed.
  • the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (eg, 5G network).
  • antenna 248 may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming.
  • the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as part of the third RFFE 236 .
  • each of the plurality of phase shifters 238 may convert the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element.
  • each of the plurality of phase shifters 238 may convert the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.
  • the second cellular network 294 may be operated independently (eg, Stand-Alone (SA)) or connected to the first cellular network 292 (eg, a legacy network) ( Example: Non-Stand Alone (NSA)).
  • SA Stand-Alone
  • a 5G network may include only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)) and no core network (eg, a next generation core (NGC)).
  • RAN radio access network
  • NG RAN next generation RAN
  • NNC next generation core
  • the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network.
  • EPC evolved packed core
  • Protocol information for communication with the legacy network eg LTE protocol information
  • protocol information for communication with the 5G network eg New Radio (NR) protocol information
  • other components eg processor 120, the first communications processor 212, or the second communications processor 214.
  • 3A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure
  • 3B is a perspective view of the back of the electronic device of FIG. 3A according to various embodiments of the present disclosure.
  • an electronic device 300 includes a first side (or front side) 310A, a second side (or back side) 310B, and a first side 310A and It may include a housing 310 including a side surface 310C surrounding a space between the second surfaces 310B.
  • the housing 310 may refer to a structure forming some of the first face 310A, the second face 310B, and the side face 310C of FIG. 3A.
  • the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent.
  • the second surface 310B may be formed by a substantially opaque back plate 311 .
  • the back plate 311 may be formed, for example, of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be.
  • the side surface 310C may be formed by a side bezel structure (or “side member”) 318 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer.
  • the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, a metal material such as aluminum).
  • the front plate 302 includes two first regions 310D that are bent from the first surface 310A toward the back plate 311 and extend seamlessly, the front plate 310D. It can be included on both ends of the long edge of (302).
  • the back plate 311 has long edges of two second regions 310E that are curved from the second surface 310B toward the front plate 302 and extend seamlessly. Can be included at both ends.
  • the front plate 302 (or the rear plate 311) may include only one of the first regions 310D (or the second regions 310E). In another embodiment, some of the first regions 310D or the second regions 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 300, is, from the side that does not include the first regions 310D or the second regions 310E as described above. It has a first thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 310D or the second regions 310E.
  • the electronic device 300 includes a display 301, an input device 303, sound output devices 307 and 314, sensor modules 304 and 319, and camera modules 305, 312 and 313. , a key input device 317, an indicator (not shown), and/or connector holes 308 and 309.
  • the electronic device 300 may omit at least one of the components (eg, the key input device 317 or the indicator) or may additionally include other components.
  • the display 301 may be exposed through a substantial portion of the front plate 302, for example. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310A and the first region 310D of the side surface 310C.
  • the display 301 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor modules 304 and 319 and/or at least a portion of the key input device 317 are in the first area 310D and/or the second area 310E. can be placed.
  • the input device 303 may include a microphone 303 .
  • the input device 303 may include a plurality of microphones 303 disposed to detect the direction of sound.
  • the sound output devices 307 and 314 may include speakers 307 and 314 .
  • the speakers 307 and 314 may include an external speaker 307 and a receiver 314 for communication.
  • the microphone 303, the speakers 307 and 314, and the connectors 308 and 309 are disposed in the space of the electronic device 300, and externally through at least one hole formed in the housing 310. may be exposed to the environment.
  • the hole formed in the housing 310 may be commonly used for the microphone 303 and the speakers 307 and 314.
  • the sound output devices 307 and 314 may include a speaker (eg, a piezo speaker) that operates while excluding holes formed in the housing 310 .
  • the sensor modules 304 and 319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 300 or an external environmental state.
  • the sensor modules 304 and 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 310A of the housing 310. ) (eg, a fingerprint sensor), and/or a third sensor module 319 (eg, an HRM sensor) disposed on the second surface 310B of the housing 310 .
  • the fingerprint sensor may be disposed on the first surface 310A of the housing 310 .
  • a fingerprint sensor (eg, an ultrasonic or optical fingerprint sensor) may be disposed under the display 301 of the first surface 310A.
  • the electronic device 300 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor 304 may be further included.
  • a sensor module for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor 304 may be further included.
  • the camera modules 305, 312, and 313 include a first camera device 305 disposed on the first surface 310A of the electronic device 300 and a second camera device 312 disposed on the second surface 310B. ), and/or flash 313.
  • the camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 .
  • the electronic device 300 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included may include soft keys and the like on the display 301. It can be implemented in different forms.
  • the key input device 317 may be implemented using a pressure sensor included in the display 301 .
  • the indicator may be disposed on the first surface 310A of the housing 310, for example.
  • the indicator may provide, for example, state information of the electronic device 300 in the form of light.
  • the light emitting device may provide, for example, a light source interlocked with the operation of the camera module 305 .
  • Indicators may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector holes 308 and 309 include a first connector hole 308 capable of accommodating a connector (eg, a USB connector or an interface connector port module (IF) module) for transmitting and receiving power and/or data to and from an external electronic device. ), and/or a second connector hole (or earphone jack) 309 capable of accommodating a connector for transmitting and receiving an audio signal to and from an external electronic device.
  • a connector eg, a USB connector or an interface connector port module (IF) module
  • IF interface connector port module
  • Some of the camera modules 305 of the camera modules 305 and 312 , some of the sensor modules 304 of the sensor modules 304 and 319 , or indicators may be disposed to be exposed through the display 101 .
  • the camera module 305, the sensor module 304, or the indicator is disposed in the internal space of the electronic device 300 to be in contact with the external environment through an opening perforated to the front plate 302 of the display 301. It can be.
  • some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device. For example, in this case, the area of the display 301 facing the sensor module may not require a perforated opening.
  • FIG. 3C is an exploded perspective view of the electronic device of FIG. 3A according to various embodiments of the present disclosure.
  • the electronic device 300 includes a side member 310 (eg, a housing or side bezel structure), a first support member 3111 (eg, a bracket), a front plate 302, and a display 301 ) (eg, a display device), a printed circuit board 340, a battery 350, a second support member 360 (eg, a rear case), an antenna 370, and/or a back plate 380.
  • the electronic device 300 may omit at least one of the above components (eg, the first support member 3111 or the second support member 360) or may additionally include other components. there is.
  • At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B, and overlapping descriptions will be omitted below.
  • the first support member 3111 may be disposed inside the electronic device 300 and connected to the side member 310 (eg, a housing) or integrally formed with the side member 310 .
  • the first support member 3111 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the display 301 may be coupled to one surface of the first support member 3111 and the printed circuit board 340 may be coupled to the other surface.
  • a processor, memory, and/or interface may be mounted on the printed circuit board 340 .
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side member 310 and/or the first support member 3111 or a combination thereof.
  • an antenna module 510 and a conductive pattern 520 may be disposed between the printed circuit board 340 and the second support member 360 (eg, a rear case).
  • the antenna module 510 eg, the antenna module 197 of FIG. 1 or the third antenna module 246 of FIG. 2
  • the conductive pattern 520 are formed on the back surface of the printed circuit board 340 (eg, the antenna module 197 of FIG. 1 or the third antenna module 246 of FIG. 2 ). -z axis direction).
  • the antenna module 510 and the conductive pattern 520 may be electrically connected to a wireless communication module (eg, the wireless communication module 192 of FIG. 1 ) disposed on the printed circuit board 340 .
  • the antenna module 510 (eg, mmWave antenna module) may be disposed adjacent to a camera hole 341 formed in the printed circuit board 340 in one direction (eg, the y-axis direction).
  • the antenna module 510 may be disposed adjacent to a camera hole 341 formed in the printed circuit board 340 in one direction (eg, the y-axis direction).
  • the conductive pattern 520 may be disposed between the antenna module 510 and the side member 310 .
  • the wireless communication module 192 disclosed in the electronic device 101 of FIG. 1 or the electronic device 101 of FIG. 2 may be disposed on the printed circuit board 340 .
  • the antenna module 510 may be electrically connected to the wireless communication module 192 .
  • the conductive pattern 520 is electrically connected to the wireless communication module 192 and may operate as an antenna.
  • the conductive pattern 520 may be electrically connected to the wireless communication module 192 using a conductive connecting member (eg, a C clip).
  • the conductive pattern 520 may not be electrically connected to the wireless communication module 192 but may be coupled to a power supply of the wireless communication module 192 .
  • the antenna module 510 may transmit and receive a radio signal of a first frequency band (eg, about 3 GHz to 300 GHz).
  • the conductive pattern 520 may transmit and receive a wireless signal of a second frequency band (eg, about 500 MHz to 6 GHz).
  • FIG. 4A is a diagram showing an embodiment of a structure of a third antenna module described with reference to FIG. 2 , for example.
  • FIG. 4A is a perspective view of the third antenna module 246 viewed from one side (eg, upper side), and (b) of FIG. 4A is a perspective view of the third antenna module 246 viewed from the other side (eg, lower side). ) is a perspective view from 4A(c) is a cross-sectional view of the third antenna module 246 along the line XX'.
  • the third antenna module 246 (eg, the antenna module 510 of FIG. 3C) includes a printed circuit board 410, an antenna array 430, and an RFIC ( It may include a radio frequency integrate circuit (452) or a power manage integrate circuit (PMIC) (454).
  • the third antenna module 246 may further include a shielding member 490 .
  • at least one of the aforementioned components may be omitted or at least two of the components may be integrally formed.
  • the printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers.
  • the printed circuit board 410 may provide an electrical connection between the printed circuit board 410 and/or various electronic components disposed externally using wires and conductive vias formed on the conductive layer.
  • Antenna array 430 (eg, antenna 248 of FIG. 2 ) includes a plurality of antenna elements 432, 434, 436, or 438 (eg, conductive patches) arranged to form a directional beam. can do.
  • the antenna elements 432 , 434 , 436 , or 438 may be formed on the first surface of the printed circuit board 410 as shown.
  • the antenna array 430 may be formed inside the printed circuit board 410 .
  • the antenna array 430 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes and/or different types.
  • RFIC 452 (e.g., third RFIC 226 in FIG. 2) is located in another area of printed circuit board 410, spaced apart from antenna array 430 (e.g., on the opposite side of the first side). 2nd side).
  • the RFIC 452 is configured to process signals of a selected frequency band transmitted/received through the antenna array 430.
  • the RFIC 452 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band during transmission.
  • the RFIC 452 may convert the RF signal received through the antenna array 430 into a baseband signal and transmit the converted baseband signal to the communication processor.
  • the RFIC 452 upon transmission, an IF signal obtained from an intermediate frequency integrate circuit (IFIC) (eg, the fourth RFIC 228 of FIG. 2) (eg, about 9 GHz to about 11GHz) can be up-converted to an RF signal of a selected band.
  • IFIC intermediate frequency integrate circuit
  • the RFIC 452 down-converts the RF signal obtained through the antenna array 430, converts the RF signal into an IF signal, and transmits the converted signal to the IFIC.
  • the PMIC 454 may be disposed in another partial area (eg, the second surface) of the printed circuit board 410 , spaced apart from the antenna array 430 .
  • the PMIC 454 may receive voltage from the main PCB (eg, the printed circuit board 340 of FIG. 3C ) and provide necessary power to various components (eg, the RFIC 452 ) on the antenna module.
  • the shielding member 490 may be disposed on a portion (eg, the second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 and the PMIC 454 .
  • the shielding member 490 may include a shield can.
  • the third antenna module 246 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface.
  • the module interface may include a connecting member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • FIG. 4B is a cross-sectional view of the third antenna module 246 shown in (a) of FIG. 4A along the line Y-Y'.
  • the printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413 .
  • the antenna layer 411 includes at least one dielectric layer 437-1 and an antenna element 436 (eg, a conductive patch formed on or inside an outer surface of the dielectric layer 437-1). ) and/or a power supply unit 425.
  • the power supply unit 425 may include a power supply point 427 and/or a power supply line 429 (eg, a signal line).
  • the network layer 413 includes at least one dielectric layer 437-2, and at least one ground layer 433 formed on or inside the outer surface of the dielectric layer 437-2, At least one conductive via 435 and/or a transmission line 423 may be included.
  • the RFIC 452 (eg, the third RFIC 226 of FIG. 2 ) of (c) shown in FIG. 4A includes, for example, first and second solder bumps 440- 1, 440-2) may be electrically connected to the network layer 413.
  • various connection structures eg solder or BGA
  • the RFIC 452 uses the first connection part 440-1, the transmission line 423, and the power supply part 425 (eg, the power supply line 429 and the power supply point 427) to transmit the antenna element 436 can be electrically connected with
  • the RFIC 452 may be electrically connected to the ground layer 433 using the second connection portion 440 - 2 and the conductive via 435 .
  • FIG. 5 is a diagram schematically illustrating an embodiment of a portion F in a state in which an antenna module and a conductive pattern of the electronic device disclosed in FIG. 3C according to various embodiments of the present disclosure are disposed on a printed circuit board.
  • FIG. 5 shows a portion F in a state where the antenna module 510 and the conductive pattern 520 are disposed on the printed circuit board 340 of the electronic device 300 shown in FIG. 3C in one direction (eg: -z axis direction) may be a schematic diagram viewed.
  • the electronic device 300 disclosed below may include the electronic device 101 of FIG. 1, the electronic device 101 of FIG. 2, and/or the embodiments described in FIGS. 3A to 4B.
  • the same reference numerals are assigned to substantially the same components as those of the embodiments disclosed in FIGS. 1 to 4B, and redundant descriptions may be omitted.
  • embodiments related to the electronic device 300 disclosed below describe a bar-type electronic device as an example, but are not limited thereto, and include foldable type, rollable type, sliding type, and wearable type. Substantially the same may be applied to electronic devices such as type, tablet PCs, or notebook PCs.
  • an electronic device 300 may include a side member 310, a printed circuit board 340, an antenna module 510, and/or a conductive pattern 520.
  • a side member 310 may include a side member 310, a printed circuit board 340, an antenna module 510, and/or a conductive pattern 520.
  • the side member 310 (eg, the housing) may form at least a part of the exterior of the electronic device 300 .
  • the side member 310 may be integrally formed with or combined with the first support member 3111 .
  • the first support member 3111 may be disposed across the inside of the side member 310 .
  • the first support member 3111 may be disposed inside the electronic device 300 and connected to the side member 310 or integrally formed with the side member 310 .
  • the first support member 3111 may include, for example, a metal material and/or a non-metal material (eg, polymer).
  • a display (eg, the display 301 of FIG. 3C ) may be disposed on the first surface (eg, in the z-axis direction) of the first support member 3111 .
  • the printed circuit board 340 may be disposed on the second surface (eg, in the -z-axis direction) of the first support member 3111 .
  • a wireless communication module 192 may be disposed on the printed circuit board 340 .
  • at least one camera hole 341 may be formed in the first support member 3111 and the printed circuit board 340 .
  • the camera module 180 shown in FIG. 1 may be disposed in the camera hole 341 .
  • the antenna module 510 may be disposed on the printed circuit board 340 .
  • the antenna module 510 may be disposed on the rear surface (eg, -z-axis direction) of the printed circuit board 340 .
  • the antenna module 510 may be disposed on the first support member 3111 .
  • the antenna module 510 may be disposed adjacent to the camera hole 341 in one direction (eg, the y-axis direction). For example, the antenna module 510 may be disposed closer to the camera hole 341 than the conductive pattern 520 (eg, the second portion 522).
  • the antenna module 510 may be electrically connected to the wireless communication module 192 using the first wiring 502 (eg, a power supply line or a signal line).
  • the antenna module 510 may include, for example, the antenna module 197 of FIG. 1 and the third antenna module 246 disclosed in FIG. 2 or FIG. 4A.
  • the antenna module 510 may transmit and receive a radio signal of a first frequency band (eg, about 3 GHz to 300 GHz).
  • the conductive pattern 520 may be disposed on the printed circuit board 340 .
  • the conductive pattern 520 may be disposed on the rear surface (eg, in the -z-axis direction) of the printed circuit board 340 .
  • the antenna module 510 may be disposed on the first support member 3111 .
  • the conductive pattern 520 may be disposed adjacent to the antenna module 510 . At least a portion of the conductive pattern 520 may be disposed closer to the side member 310 than the antenna module 510 .
  • the conductive pattern 520 may be electrically connected to the wireless communication module 192 using a second wiring 520 (eg, a power supply line or a signal line).
  • the conductive pattern 520 may be electrically connected to the wireless communication module 192 using a conductive connecting member (eg, a C clip). In another embodiment, the conductive pattern 520 may not be electrically connected to the wireless communication module 192 but may be coupled to a power supply of the wireless communication module 192 .
  • the conductive pattern 520 may transmit and receive a wireless signal of a second frequency band (eg, about 500 MHz to 6 GHz).
  • the conductive pattern 520 may be disposed between the side member 310 and the antenna module 510 .
  • the conductive pattern 520 may include a first portion 521 and/or a second portion 522 .
  • the first portion 521 of the conductive pattern 520 may be formed to extend in the y-axis direction.
  • the first part 521 may be electrically connected to or coupled to the wireless communication module 192 .
  • the second portion 522 of the conductive pattern 520 extends from the first portion 521 in one direction (eg, the x-axis direction) and may be disposed between the side member 310 and the antenna module 510. there is.
  • the second portion 522 of the conductive pattern 520 has a width smaller than about ⁇ /2 of a wavelength of a first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510. It can be formed to have. According to another embodiment, the second portion 522 of the conductive pattern 520 has a width smaller than about ⁇ /4 of a wavelength of a first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510. can be formed to have
  • the width of the second portion 522 of the conductive pattern 520 is greater than about ⁇ /2 of the wavelength of the first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510. It may be formed small, or may be formed smaller than about ⁇ /4.
  • the width of the second portion 522 of the conductive pattern 520 is about ⁇ /2 of the wavelength of the first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510 or When formed to be less than about ⁇ /4, the radio signal radiated through the antenna module 510 is not reflected through the conductive pattern 520 (eg, the second portion 522), and the outside of the electronic device 300 may be scattered or diffracted toward
  • the width of the second portion 522 of the conductive pattern 520 is equal to or greater than about ⁇ /2 of the wavelength of the first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510 or ⁇ /4 or more, the radio signal radiated through the antenna module 510 is reflected toward the antenna module 510 rather than being scattered or diffracted to the outside of the electronic device 300 through the conductive pattern 520, and Radiation performance of module 510 may be degraded.
  • the antenna module 510 may be arranged to form
  • FIG. 6 is a diagram schematically illustrating an example of a first extension part formed on a conductive pattern according to various embodiments of the present disclosure.
  • the conductive pattern 520 (eg, the second portion 522) of the electronic device 300 according to various embodiments of the present disclosure protrudes toward the antenna module 510 (eg, -y axis). direction) may include at least one first extension part 610 .
  • the first extension part 610 may be formed in plurality. For example, when three or more first extensions 610 are formed, the intervals d1 between the first extensions 610 may be equal intervals and/or unequal intervals.
  • the electrical length of the conductive pattern 520 (eg, the second portion 522) may be adjusted using the first extension part 610.
  • the frequency band of the conductive pattern 520 may be adjusted using the first extension part 610 .
  • a degree of freedom in tuning the resonant frequency of the conductive pattern 520 may be improved by using the first extension part 610 .
  • FIG. 7 is a diagram schematically illustrating an example of a first extension portion and a second extension portion formed on a conductive pattern according to various embodiments of the present disclosure.
  • a conductive pattern 520 (eg, a second portion 522) of an electronic device 300 according to various embodiments of the present disclosure includes a first extension portion 610 and/or a second extension portion. (720).
  • the first extension portion 610 of the conductive pattern 520 (eg, the second portion 522) is formed to protrude (eg, in the -y-axis direction) toward the antenna module 510.
  • At least one first extension part 610 may be included.
  • the first extension part 610 may be formed in plurality. For example, when three or more first extensions 610 are formed, the intervals d1 between the first extensions 610 may be equal or unequal intervals.
  • the second extension portion 720 of the conductive pattern 520 may be formed to protrude (eg, in the y-axis direction) toward the side member 310. there is. At least one second extension part 720 may be included. In one embodiment, the second extension portion 720 may be formed in plurality. For example, when three or more second extension parts 720 are formed, the distance d2 between the second extension parts 720 may be equal and/or unequal.
  • the first extension 610 and the second extension 720 formed on the conductive pattern 520 may be formed at positions corresponding to each other. For example, based on the second portion 522 of the conductive pattern 520, the first extension portion 610 formed below the second portion 522 (eg, in the -y-axis direction), and the second portion The second extension part 720 formed above (eg, in the y-axis direction) 522 may be formed at a substantially corresponding position.
  • the first extension part 610 and the second extension part 720 may be arranged to be substantially aligned with the lower part (eg, in the -y-axis direction) and the upper part (eg, in the y-axis direction) of the second part 522 . .
  • the electrical length of the conductive pattern 520 may be adjusted using the first extension part 610 and/or the second extension part 720.
  • the frequency band of the conductive pattern 520 may be adjusted using the first extension part 610 and/or the second extension part 720.
  • the degree of freedom in tuning the resonant frequency of the conductive pattern 520 may be improved by using the first extension part 610 and/or the second extension part 720.
  • FIG. 8 is a diagram schematically illustrating various embodiments of first extension parts and second extension parts formed on a conductive pattern according to various embodiments of the present disclosure.
  • a conductive pattern 520 (eg, a second portion 522) of an electronic device 300 according to various embodiments of the present disclosure includes a first extension portion 610 and/or a second extension portion. (720).
  • the distance d3 between the first extension parts 610 shown in FIG. 8 may be wider than the distance d1 between the first extension parts 610 shown in FIG. 7 .
  • the distance d4 between the second extension parts 720 shown in FIG. 8 may be wider than the distance d2 between the plurality of second extension parts 720 shown in FIG. 7 .
  • the distance d3 of the plurality of first extension parts 610 and the distance d4 of the plurality of second extension parts 720 shown in FIG. 8 may be substantially the same.
  • the intervals d3 between the first extensions 610 may be equal or unequal intervals.
  • the intervals d4 between the second extensions 720 may be equal or unequal intervals.
  • the first extension 610 and the second extension 720 formed on the conductive pattern 520 may be formed at positions that do not correspond to each other.
  • the first extension part 610 and the second extension part 720 are the lower part (eg, ⁇ y-axis direction) and the upper part (eg, y-axis direction) of the second portion 522 of the conductive pattern 520. may be arranged substantially non-aligned.
  • FIG. 9 is a diagram illustrating a traveling direction of a radio signal of an antenna module and a conductive pattern of an electronic device according to various embodiments of the present disclosure.
  • the conductive pattern 520 (eg, the second portion 522) may be disposed adjacent to the antenna module 510.
  • the width of the second portion 522 of the conductive pattern 520 is greater than or equal to about ⁇ /2 or about ⁇ of the wavelength of the first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510.
  • the first radio signal 910 radiated through the antenna module 510 is not scattered or diffracted to the outside of the electronic device 300 through the conductive pattern 520, and the antenna module 510 ) can be reflected.
  • the width (w) of the conductive pattern 520 is of a first frequency band supported by the antenna module 510 (eg, about 3 GHz to 300 GHz). It may be formed to have a width smaller than about ⁇ /2 of a wavelength.
  • the conductive pattern 520 (eg, the second portion 522) has a wavelength smaller than ⁇ /4 of a wavelength of a first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510. It can be formed to have a width.
  • the width w of the second portion 522 of the conductive pattern 520 is greater than about ⁇ /2 of the wavelength of the first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510. It may be formed small, or may be formed smaller than about ⁇ /4.
  • the width w of the conductive pattern 520 is a wavelength of a first frequency band (eg, about 3 GHz to 300 GHz) supported by the antenna module 510.
  • a first frequency band eg, about 3 GHz to 300 GHz
  • the first wireless signal 910 radiated through the antenna module 510 is not reflected through the conductive pattern 520, and the electronic device 300 It may be scattered or diffracted like the second radio signal 920 and/or the third radio signal 930 toward the outside of the .
  • the first radio signal 910 radiated through the antenna module 510 passes through the conductive pattern 520 (eg, the second portion 522) to form a second radio signal 920 and/or a third radio signal 930. ), the electronic device 300 can secure wider frequency coverage by using the antenna module 510.
  • FIG. 10 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a first width.
  • a second portion 522 of a conductive pattern 520 has a first width w1 (eg, about 0.3 mm to about 0.9 mm). can be formed to have
  • the first width w1 of the second portion 522 extending from the first portion 521 of the conductive pattern 520 in one direction is from about 0.3 mm to about 0.3 mm.
  • a comparison between the case where the thickness is 0.9 mm and the case where the conductive pattern 520 is omitted may be as shown in Table 1 below, for example.
  • the first width w1 of the second portion 522 of the conductive pattern 520 is formed to be about 0.3 mm to about 0.9 mm, for example, about 24.25 GHz, about 27.5 GHz, In each of the frequency bands of about 28 GHz or about 28.35 GHz, it can be seen that a cumulative distribution function (CDF) of 50% and a peak are further improved compared to the case where the conductive pattern 520 is omitted.
  • CDF cumulative distribution function
  • FIG. 11 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a second width.
  • a second portion 522 of a conductive pattern 520 has a second width w2 (eg, about 1.0 mm to about 1.5 mm). can be formed to have
  • the second width w2 of the second portion 522 extending in one direction (eg, the x-axis direction) from the first portion 521 of the conductive pattern 520 is about 1.0 mm to about 1.0 mm.
  • a comparison between the case where the thickness is 1.5 mm and the case where the conductive pattern 520 is omitted may be as shown in Table 2 below, for example.
  • the second width w2 of the second portion 522 of the conductive pattern 520 is formed to be about 1.0 mm to about 1.5 mm, for example, about 24.25 GHz, about 27.5 GHz, In each of the frequency bands of about 28 GHz or about 28.35 GHz, it can be confirmed that a cumulative distribution function (CDF) of 50% and a peak are substantially the same as or more improved than when the conductive pattern 520 is omitted.
  • CDF cumulative distribution function
  • FIG. 12 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a third width.
  • the second portion 522 of the conductive pattern 520 has a third width w3 (eg, about 2.0 mm to about 2.5 mm). can be formed to have
  • the third width w3 of the second portion 522 extending from the first portion 521 of the conductive pattern 520 in one direction is about 2.0 mm to about 2.0 mm.
  • a comparison between the case of 2.5 mm thickness and the case of omitting the conductive pattern 520 may be as shown in Table 3 below, for example.
  • the third width w3 of the second part 522 of the conductive pattern 520 is formed to be about 2.0 mm to about 2.5 mm, for example, about 24.25 GHz, about 27.5 GHz, In each of the frequency bands of about 28 GHz or about 28.35 GHz, it can be seen that a cumulative distribution function (CDF) of 50% and a peak are more reduced than when the conductive pattern 520 is omitted.
  • CDF cumulative distribution function
  • FIG. 13 is a diagram illustrating an example in which a conductive pattern of an electronic device according to various embodiments of the present disclosure is formed to have a fourth width.
  • the second portion 522 of the conductive pattern 520 has a fourth width w4 (eg, about 2.6 mm to about 3.0 mm). can be formed to have
  • the fourth width w4 of the second portion 522 extending from the first portion 521 of the conductive pattern 520 in one direction is about 2.6 mm to about 2.6 mm.
  • a comparison between the case where the thickness is 3.0 mm and the case where the conductive pattern 520 is omitted may be as shown in Table 4 below, for example.
  • the fourth width w4 of the second part 522 of the conductive pattern 520 is formed to be about 2.6 mm to about 3.0 mm, for example, about 24.25 GHz, about 27.5 GHz, In each of the frequency bands of about 28 GHz or about 28.35 GHz, it can be seen that a cumulative distribution function (CDF) of 50% and a peak are more reduced than when the conductive pattern 520 is omitted.
  • CDF cumulative distribution function
  • the second portion 522 of the conductive pattern 520 of the electronic device 300 has a thickness of about 0.3 mm to about 1.5 mm. It can be formed to have a width. When the second portion 522 of the conductive pattern 520 is formed to have a width of about 0.3 mm to about 1.5 mm, the gain of the antenna module 510 may be improved.
  • the gain of the antenna module 510 may decrease.
  • (a) of FIG. 14 is a case where the conductive pattern 520 is not disposed on the antenna module 510 of the electronic device according to the comparative embodiment, the antenna module 510 for a frequency band of about 24.25 GHz. ) may be a diagram showing the strength of the electric field (eg, beam coverage).
  • (b) of FIG. 14 is a second part 522 adjacent to the antenna module 510 of the electronic device 300 according to various embodiments of the present invention and having a width of about 0.3 mm to 1.5 mm.
  • the conductive pattern 520 including ) may be a diagram showing the strength of the electric field (eg, beam coverage) of the antenna module 510 for a frequency band of about 24.25 GHz.
  • FIG. 14 is a comparative example (in a frequency band of about 24.25 GHz when the electronic device 300 is spread to the top, bottom, right, and left).
  • a conductive pattern 520 (eg, a second portion 522) adjacent to the antenna module 510 of the electronic device 300 according to various embodiments of the present disclosure ) is disposed (eg, FIG. 14(b)), when the conductive pattern 520 is not disposed on the antenna module 510 of the electronic device according to the comparative embodiment (eg, FIG. 14(a) ), it can be seen that the strength of the electric field of the antenna module 510 is strong and the beam coverage is wide in the frequency band of about 24.25 GHz.
  • FIG. 15(a) shows the antenna module 510 for a frequency band of about 28 GHz when the conductive pattern 520 is not disposed on the antenna module 510 of the electronic device according to the comparative embodiment. It may be a diagram showing the strength of the electric field of (eg, beam coverage).
  • (b) of FIG. 15 is a second part 522 adjacent to the antenna module 510 of the electronic device 300 according to various embodiments of the present invention and having a width of about 0.3 mm to 1.5 mm.
  • the conductive pattern 520 including ) may be a diagram showing the strength of the electric field (eg, beam coverage) of the antenna module 510 for a frequency band of about 28 GHz.
  • FIG. 15 is a comparative example (eg, in a frequency band of about 28 GHz when the electronic device 300 is spread to the top, bottom, right, and left).
  • a conductive pattern 520 (eg, a second portion 522) adjacent to the antenna module 510 of the electronic device 300 according to various embodiments of the present disclosure ) is disposed (eg, FIG. 15(b)), when the conductive pattern 520 is not disposed on the antenna module 510 of the electronic device according to the comparative embodiment (eg, FIG. 15(a) ), it can be seen that the intensity of the electric field of the antenna module 510 is strong and the beam coverage is wide in the frequency band of about 28 GHz.
  • the electronic devices 101 and 300 include a first support member 3111, a side member 310 integrally formed with or combined with the first support member 3111, and the first support member 3111. It is disposed on one side of the member 311 (eg, in the -z-axis direction) and is electrically connected to the printed circuit board 340 including the wireless communication module 192 and the wireless communication module 192 to generate a first frequency
  • An antenna module 510 supporting a band (eg, about 3 GHz to 300 GHz), and at least a portion disposed between the side member 310 and the antenna module 510, and operating with the wireless communication module 192 It may include a conductive pattern 520 connected to and supporting a second frequency band (eg, about 500 MHz to 6 GHz).
  • the width of the conductive pattern 520 may be less than ⁇ /2 of the wavelength of the first frequency band.
  • the width of the conductive pattern 520 may be less than ⁇ /4 of the wavelength of the first frequency band.
  • the conductive pattern 520 includes a first part 521 and a second part 522, and the first part 521 is electrically connected to the wireless communication module 192 or , coupled with the power supply of the wireless communication module 182, the second part 522 extends from the first part 521, and between the side member 310 and the antenna module 510 can be placed in
  • the second portion 522 may be formed to have a width less than ⁇ /2 of a wavelength of the first frequency band.
  • the second portion 522 may be formed to have a width less than ⁇ /4 of a wavelength of the first frequency band.
  • the second portion 522 may be formed to have a width of 0.3 mm to 1.5 mm.
  • the conductive pattern 520 may include a first extension 610 protruding toward the antenna module 510 .
  • the intervals between the first extensions 610 may be formed at equal and/or unequal intervals.
  • At least a portion of the conductive pattern 520 includes second extension parts 720 protruding toward the side member 310, and the number of second extension parts 720 is three or more.
  • the intervals between the second extension parts 720 may be formed at regular intervals and/or non-equal intervals.
  • first extension part 610 and the second extension part 720 may be disposed substantially aligned and/or non-aligned under and above the conductive pattern 520 .
  • the first wireless signal 910 radiated through the antenna module 510 is directed to the outside of the side member 310 through the conductive pattern 520 to generate a second wireless signal 920 and / or may be configured to be scattered or diffracted into a third radio signal (930).
  • the conductive pattern 520 may be formed to have a width of 0.3 mm to 1.5 mm.
  • At least one camera hole 341 is formed in the first support member 3111 and the printed circuit board 340, and the antenna module 510 and the conductive pattern 520 are It may be disposed between at least one camera hole 341 and the side member 310 .
  • the antenna module 510 may be disposed adjacent to the at least one camera hole 341 , and the conductive pattern 520 may be disposed adjacent to the side member 310 .
  • the electronic devices 101 and 300 include a first support member 3111, a side member 310 integrally formed with or combined with the first support member 3111, and the first support member 3111. Disposed on one side of the member 3111 and electrically connected to the printed circuit board 340 including the wireless communication module 192, the wireless communication module 192 and a first frequency band (eg, about 3 GHz to 300 GHz) An antenna module 510 supporting a ), and disposed adjacent to the antenna module 510 and operatively connected to the wireless communication module 192 to support a second frequency band (eg, about 500 MHz to 6 GHz) and a conductive pattern 520 having a width of less than ⁇ /4 of a wavelength of the first frequency band.
  • a first frequency band eg, about 3 GHz to 300 GHz
  • An antenna module 510 supporting a and disposed adjacent to the antenna module 510 and operatively connected to the wireless communication module 192 to support a second frequency band (eg, about 500 MHz to 6 GHz) and a conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente invention comprend : un premier élément de support ; un élément latéral intégré au premier élément de support ou accouplé à ce dernier ; une carte de circuit imprimé qui est disposée sur une surface du premier élément de support, et qui comprend un module de communication sans fil ; un module d'antenne connecté électriquement au module de communication sans fil de manière à prendre en charge une première bande de fréquence ; et un motif conducteur disposé au moins partiellement entre l'élément latéral et le module d'antenne et connecté fonctionnellement au module de communication sans fil de manière à prendre en charge une seconde bande de fréquence, et pouvant garantir un espace d'agencement d'autres composants électroniques compris dans le dispositif électronique tout en prenant en charge diverses bandes de fréquences. Divers autres modes de réalisation sont possibles.
PCT/KR2022/016919 2021-11-15 2022-11-01 Dispositif électronique comprenant une antenne WO2023085675A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20210156865 2021-11-15
KR10-2021-0156865 2021-11-15
KR10-2022-0004881 2022-01-12
KR1020220004881A KR20230071000A (ko) 2021-11-15 2022-01-12 안테나를 포함하는 전자 장치

Publications (1)

Publication Number Publication Date
WO2023085675A1 true WO2023085675A1 (fr) 2023-05-19

Family

ID=86335981

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/016919 WO2023085675A1 (fr) 2021-11-15 2022-11-01 Dispositif électronique comprenant une antenne

Country Status (1)

Country Link
WO (1) WO2023085675A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190221941A1 (en) * 2016-07-05 2019-07-18 Huawei Technologies Co., Ltd. Antenna Device and Beam Direction Adjustment Method Applied to Antenna Device
KR20200012106A (ko) * 2018-07-26 2020-02-05 삼성전자주식회사 5g 안테나 모듈을 포함하는 전자 장치
KR20200101013A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 안테나 및 상기 안테나를 포함하는 전자 장치
KR20210056000A (ko) * 2019-11-08 2021-05-18 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치
KR20210079998A (ko) * 2019-12-20 2021-06-30 삼성전자주식회사 안테나 및 이를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190221941A1 (en) * 2016-07-05 2019-07-18 Huawei Technologies Co., Ltd. Antenna Device and Beam Direction Adjustment Method Applied to Antenna Device
KR20200012106A (ko) * 2018-07-26 2020-02-05 삼성전자주식회사 5g 안테나 모듈을 포함하는 전자 장치
KR20200101013A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 안테나 및 상기 안테나를 포함하는 전자 장치
KR20210056000A (ko) * 2019-11-08 2021-05-18 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치
KR20210079998A (ko) * 2019-12-20 2021-06-30 삼성전자주식회사 안테나 및 이를 포함하는 전자 장치

Similar Documents

Publication Publication Date Title
WO2021025394A1 (fr) Antenne et dispositif électronique la comprenant
WO2020096361A1 (fr) Antenne ayant une structure de rayonnement de direction donnée et dispositif électronique comprenant celle-ci
WO2020166812A1 (fr) Antenne et dispositif électronique comprenant des éléments conducteurs disposés autour d'une antenne
WO2021162262A1 (fr) Antenne et dispositif électronique la comprenant
WO2021091134A1 (fr) Antenne et dispositif électronique la comportant
WO2021025393A1 (fr) Antenne et dispositif électronique la comprenant
WO2019147049A1 (fr) Antenne de type cadre et dispositif électronique la comprenant
WO2022158789A1 (fr) Antenne et dispositif électronique la comprenant
WO2022154347A1 (fr) Antenne et dispositif électronique la comprenant
WO2021261761A1 (fr) Antenne et dispositif électronique la comprenant
WO2020141692A1 (fr) Antenne utilisant un élément latérale conducteur et dispositif électronique la comportant
WO2022145794A1 (fr) Antenne et dispositif électronique comprenant celle-ci
WO2022119392A1 (fr) Appareil électronique comprenant un module d'antenne
WO2022092862A1 (fr) Structure dotée d'un module d'antenne appliquée dans un dispositif électronique pliable
WO2022065746A1 (fr) Ensemble de clé et dispositif électronique le comprenant
WO2022154386A1 (fr) Dispositif électronique comprenant une antenne
WO2022103062A1 (fr) Dispositif électronique comportant une antenne et un stylet
WO2022030850A1 (fr) Antenne et dispositif électronique comprenant cette dernière
WO2021261782A1 (fr) Dispositif électronique comprenant une pluralité d'antennes
WO2021101167A1 (fr) Antenne et dispositif électronique la comportant
WO2023085675A1 (fr) Dispositif électronique comprenant une antenne
WO2023043084A1 (fr) Module d'antenne et dispositif électronique le comprenant
WO2023101233A1 (fr) Dispositif électronique comprenant une antenne
WO2023075266A1 (fr) Dispositif électronique comprenant une antenne
WO2023027388A1 (fr) Antenne et dispositif électronique la comprenant

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22893097

Country of ref document: EP

Kind code of ref document: A1