WO2023082513A1 - 有源天线系统、基站、无线通信系统 - Google Patents

有源天线系统、基站、无线通信系统 Download PDF

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Publication number
WO2023082513A1
WO2023082513A1 PCT/CN2022/080733 CN2022080733W WO2023082513A1 WO 2023082513 A1 WO2023082513 A1 WO 2023082513A1 CN 2022080733 W CN2022080733 W CN 2022080733W WO 2023082513 A1 WO2023082513 A1 WO 2023082513A1
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WIPO (PCT)
Prior art keywords
active
antenna system
components
active antenna
component
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Application number
PCT/CN2022/080733
Other languages
English (en)
French (fr)
Inventor
孙伟华
韦建华
吴广德
傅杰
武俊
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中兴通讯股份有限公司
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Publication of WO2023082513A1 publication Critical patent/WO2023082513A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08—Access point devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the present application relates to the field of wireless communication equipment, in particular to an active antenna system, a base station, and a wireless communication system.
  • the active antenna system in 5G equipment integrates the active side and the passive side in one device.
  • the active unit and the passive unit are divided into two or more independent units, which is convenient for electrical performance testing.
  • the units need to be connected through connectors or cables. The large number of connectors will not only increase the cost, but also the assembly operation is more complicated, the efficiency is low, and it is not conducive to the realization of automatic production, and the volume and weight are relatively large, which makes it difficult to meet the needs of small and light wireless communication equipment.
  • the present application provides an active antenna system, a base station, and a wireless communication system.
  • an embodiment of the present application provides an active antenna system, including: a device casing; a radome assembly, the radome assembly is connected to the device casing; an integrated single board, the integrated single board is arranged on the Between the device shell and the radome assembly, passive components are arranged on the front of the integrated single board, and active components are arranged on the back of the integrated single board.
  • an embodiment of the present application provides a base station, including the active antenna system described in the embodiment of the first aspect of the present application.
  • the embodiments of the present application provide a wireless communication system, including the active antenna system described in the embodiment of the first aspect of the present application, or including the base station described in the embodiment of the second aspect of the present application.
  • FIG. 1 is an overall disassembled view of an active antenna system provided by an embodiment of the present application
  • Fig. 2 is a schematic diagram of the front of the integrated single board provided by the embodiment of the present application.
  • Fig. 3 is a schematic layout diagram of the front of the integrated board provided by another embodiment of the present application.
  • FIG. 4 is a schematic layout diagram of the back side of the integrated board provided by the embodiment of the present application.
  • Fig. 5 is a schematic diagram of the layout of the back side of the integrated board provided by another embodiment of the present application.
  • An embodiment of the present application provides an active antenna system, a base station, and a wireless communication system.
  • the active antenna system includes: a device casing; a radome assembly, the radome assembly is connected to the device casing; an integrated board, the The integrated single board is arranged between the equipment shell and the radome assembly, the front side of the integrated single board is provided with passive components, and the back side of the integrated single board is provided with active components.
  • the active components and passive components can be integrated on the front and back of the integrated board, which simplifies the layout structure of the active antenna system and can save the connectors between different boards. The cost is saved, and it is beneficial to optimize the weight and volume of the active antenna system.
  • Figure 1 is a schematic disassembly of an active antenna system of the present application.
  • the active antenna system includes:
  • a radome assembly 30, the radome assembly 30 is connected to the equipment casing 10;
  • the integrated board 20 is arranged between the equipment casing 10 and the radome assembly 30 , the front of the integrated board 20 is provided with passive components, and the back of the integrated board 20 is provided with active components.
  • the active antenna system can be an active antenna unit (Active Antenna Unit, AAU) commonly used in the base station, or it can be other units that have both passive components and active components, which is not mentioned in this embodiment. Make a limit.
  • AAU Active Antenna Unit
  • the specific structures of the device case 10 and the radome assembly 30 can be selected according to actual needs, and it is sufficient that the integrated booklet 20 can be installed between the device case 10 and the radome assembly 30 .
  • connection holes may be provided on the outer edge of the equipment housing 10 and the radome assembly 30, and the radome assembly 30 can be fixedly installed on the upper side of the equipment housing 10 through the connecting piece.
  • the integrated veneer can also be fixed by setting connection holes or slots inside the device housing 10. This embodiment does not limit too much the specific assembly method between the components, and can realize top-to-bottom It is sufficient to install the radome assembly 30 , the integrated board 20 and the device case 10 .
  • active components and passive components can be selected according to actual needs.
  • active components can be power amplifier daughter cards, baseband components, transceiver components, intermediate frequency circuit components, etc.
  • passive components can be media Filters, etc.
  • the specific type and quantity of components are not limited too much in this embodiment.
  • each active component and passive component is an independent unit, which is arranged in the active antenna system in the form of multiple single boards, and signals or power need to be transmitted between different units, so A large number of connectors are needed, especially for AAU, the number of RF connectors is large, such as the common 32 or 64 groups, which will result in higher cost of AAU, and the large number of connectors will put higher requirements on the assembly process.
  • the technical solution of this embodiment integrates passive components and active components into the front and back of the same integrated board. , improve the overall utilization of the integrated board, and effectively reduce the number of boards, the signals between components can be completed through the lines in the board, eliminating the need for connectors, not only greatly reduced in terms of cost, but also in When the layout space of the integrated single board is sufficient, the integration of active components and passive components can be completed with only one integrated single board, the number of single boards has been effectively reduced, and the volume of the active antenna system can be further reduced, from It has also been greatly optimized in terms of volume and weight, which can better meet the needs of high integration of active antenna systems in the 5G era.
  • passive components are integrated on the front of the integrated board 20, and active components are integrated on the back. It is possible to set active components on the front and passive components on the back without affecting signal transmission and reception, and it is enough to integrate the relevant components in the integrated board 20, which does not affect the technical solution of this embodiment. cause limitation.
  • the integrated board 20 can realize the integration of active components and passive components, in actual use, some components may be relatively large, or there may be too many components integrated in the integrated board 20 However, they cannot all be integrated into the same block. In this case, the number of integrated single boards 20 can also be increased, or individual functional unit single boards can be added, which can reflect that in this embodiment, the number of single boards can be reduced as much as possible in an integrated manner, thereby It only needs to realize volume optimization and weight optimization of the active antenna system.
  • an antenna assembly 211 is disposed on the front of the integrated board 20 .
  • the antenna assembly 211 may be any type of antenna, and the number may be arbitrary, which is not limited in this embodiment. In order to realize signal transmission, the antenna assembly 211 needs to be arranged on the front of the integrated board 20 , and the outside is covered by the radome assembly 30 .
  • the active components may interfere with the signal transmission and reception of the antenna during the working process.
  • the antenna component and the active component are respectively arranged on the front of different boards.
  • an additional isolation cover is usually required between the active component and the antenna component, which will make the structure of the active antenna system more complicated, which is not conducive to volume and weight control.
  • the antenna component 211 is located on the front of the integrated board 20, and the active components are located on the back of the integrated board 20.
  • the component 211 Since the orientation of the active components and the antenna The component 211 is opposite, so it can effectively prevent the active components from interfering with the antenna component 211 without the isolation cover, and ensure the normal transmission and reception of the antenna component 211 while optimizing the structure, volume and weight of the active antenna system.
  • the number of antenna components 211 is at least 2, and a device area 212 is set between two adjacent antenna components 211.
  • the device area 212 is used to set active devices or passive devices. source device.
  • a device area 212 can be set between adjacent antenna components 211, for example, as As shown in FIG. 2 and FIG. 3 , there is a device area 212 between two adjacent rows of antenna components 211 , and passive devices or active devices can be arranged in the device area 212 according to actual needs.
  • the device area 212 can be used not only to set passive devices, but also to set active devices such as power supply components that will not interfere with the antenna component 211, and adjust the type, quantity and can be distributed.
  • a shield is further provided between two adjacent antenna components 211 .
  • FIG. 2 there may be through holes around the antenna component 211 or connection holes for setting connectors.
  • the active components are arranged on the back of the integrated board 20, there may be interference Signals are transmitted from the above-mentioned through holes or connection holes to the front of the integrated board 20, thereby causing interference to the antenna assembly 211.
  • active components that will generate interference signals are known to those skilled in the art, so Additional shielding can be provided in the through-hole area corresponding to the active component that will generate interference signals, such as welding a housing with a shielding effect at the through-hole, etc.
  • Those skilled in the art know how to choose a suitable shield, here I won't go into details.
  • a dielectric filter 222 is further disposed on the back of the integrated board 20 , and the dielectric filter 222 is adjacent to the active components.
  • the dielectric filter 222 is usually used to filter the input signal, and the input signal is obtained by the transceiver component 225 in the active component, so the dielectric filter 222 needs to be adjacent to the active component, and in order to avoid The interference of the active component to the antenna component 211, in this embodiment, the active component is arranged on the back side of the integrated board 20, therefore, although the dielectric filter 222 belongs to the passive component, in order to realize its filtering function, it also needs to be connected with the active component.
  • the source components are set on the same side.
  • dielectric filter 222 is a common structure, and those skilled in the art can select a suitable dielectric filter 222 according to actual needs, and no further limitation is given here.
  • the active assembly includes transceiver assembly 225, intermediate frequency circuit assembly 224 and at least one power amplifier daughter card 223, and power amplifier daughter card 223 is located at transceiver assembly 225 and dielectric filter Between the converters 222, the intermediate frequency circuit assembly 224 is adjacent to the transceiver assembly 225.
  • the intermediate frequency circuit component 224 is a structure well known to those skilled in the art, and those skilled in the art can select a suitable intermediate frequency circuit component 224 according to the requirements of the active antenna system, and the specific circuit structure will not be repeated here.
  • the intermediate frequency circuit component 224 and the transceiver component 225 can be arranged in the same area, for example, it can be arranged in the middle of the back of the integrated board 20, and the specific arrangement can be adjusted according to the specific size of the device, and will not be repeated here.
  • the number of power amplifier sub-cards 223 can be adjusted according to actual needs, and can be arranged adjacent to the transceiver assembly 225.
  • the transceiver assembly 225 Adjacent to a power amplifier daughter card 223, the other side of the power amplifier daughter card 223 is adjacent to the dielectric filter 222, which is arranged according to the signal transmission direction of the active antenna system.
  • the transceiver assembly After 225 receives the signal, the power is adjusted by the power amplifier daughter card 223, and then filtered by the dielectric filter 222, and finally sent by the antenna assembly 211. Therefore, the power of the transceiver assembly 225, the power amplifier daughter card 223 and the dielectric filter 222
  • the arrangement position is determined by the direction of signal transmission, and those skilled in the art can also adjust it according to actual needs, so no further limitation is made here.
  • the interconnection between various components is relatively complicated.
  • the transmission of radio frequency signals between active components and passive components usually requires the use of radio frequency coaxial connectors. connection, and RF coaxial connectors are usually blind mated or elastic connections, not only the quantity is high and the cost is high, but also the assembly process is easy to cause poor contact; and in the active antenna system of this embodiment, due to the active components and passive components
  • the components are integrated in the same integrated board 20, and the transmission of radio frequency signals can be realized through the circuit inside the board, which not only saves the radio frequency coaxial connector, saves cost, but also avoids quality problems caused by poor contact.
  • a power supply assembly 221 and a baseband assembly 226 are also included, the power supply assembly 221 is arranged on the front or back of the integrated board 20, and the baseband assembly 226 is arranged on the front of the integrated board 20 Or the back.
  • the power supply assembly 221 and the baseband assembly 226 can be arranged on the front or the back at the same time according to actual needs, or the power supply assembly 221 can be arranged on the front, the base station assembly 226 can be arranged on the back, or the power supply assembly 221 can be arranged on the back.
  • the base station component 226 is arranged on the front, and it is enough to have enough area for component installation, such as shown in FIG.
  • the power supply component 221 and the baseband component 226 are arranged on the lower side of the back of the active antenna system, and of course they can also be arranged in the gap area 212 shown in FIG. 2 , which is not limited in this embodiment.
  • the power supply components and active components need to be interconnected through connectors to realize the transmission of high-current power signals and general control signals; 4 or the layout shown in FIG. 5 , the power supply component 221 is integrated in the integrated board 20, so no matter whether the power supply component 221 is arranged on the front or the back, it can be connected to the active component through the circuit in the board, eliminating the need for connection
  • the device not only reduces the hardware cost, but also optimizes the circuit layout and reduces the volume and weight of the active antenna system.
  • cooling teeth 11 are provided on the outside of the device housing 10 .
  • the power amplifier sub-card 223 is a device with high heat generation. Therefore, in order to dissipate heat in time, heat dissipation teeth 11 can be provided on the outside of the device casing 10 to increase heat dissipation efficiency by increasing the heat dissipation area.
  • a heat dissipation structure can also be provided in the integrated board 20, and the specific heat dissipation structure can be selected according to the actual heat dissipation requirements, and this embodiment will not repeat it here.
  • another embodiment of the present application further provides a base station, including the active antenna system in the above embodiment.
  • the active antenna system in the embodiment shown in Figure 1 is set in the base station, because the active antenna system integrates the active components and passive components on the front and back of the integrated board, which simplifies the active antenna system.
  • the layout structure of the system can save the connectors between different boards, save costs, and help optimize the weight and volume of the active antenna system.
  • applying it to the base station can reduce the space occupied in the base station, and the weight of the base station can also be reduced, which is conducive to making the base station smaller and lighter .
  • another embodiment of the present application further provides a wireless communication system, including the active antenna system in the above embodiment, or including the base station in the above embodiment.
  • the active antenna system in the embodiment shown in FIG. 1 when the active antenna system in the embodiment shown in FIG. 1 is set in the wireless communication system, since the active antenna system integrates active components and passive components on the front and back of the integrated single board, the active antenna system is simplified.
  • the layout structure of the active antenna system can save the connectors between different boards, save costs, and help optimize the weight and volume of the active antenna system.
  • applying it directly to the wireless communication system, or applying it to the base station and then applying it to the wireless communication system can reduce the space occupied in the wireless communication system, and wireless communication The weight of the system can also be reduced, which is conducive to making the wireless communication system smaller and lighter.
  • the embodiment of the present application includes: a device casing; a radome assembly, the radome assembly is connected to the device casing; an integrated veneer, the integrated veneer is arranged between the device casing and the radome assembly, Passive components are arranged on the front of the integrated single board, and active components are arranged on the back of the integrated single board.
  • the active components and passive components can be integrated on the front and back of the integrated board, which simplifies the layout structure of the active antenna system and can save the connectors between different boards. The cost is saved, and it is beneficial to optimize the weight and volume of the active antenna system.

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Abstract

一种有源天线系统、基站、无线通信系统，有源天线系统包括：设备外壳(10)；天线罩组件(30)，所述天线罩组件(30)与所述设备外壳(10)相连接；集成单板(20)，所述集成单板(20)设置于所述设备外壳(10)和所述天线罩组件(30)之间，所述集成单板(20)的正面设置有无源组件，所述集成单板(20)的背面设置有有源组件。

Description

有源天线系统、基站、无线通信系统
相关申请的交叉引用
本申请基于申请号为202111320814.X、申请日为2021年11月9日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及无线通信设备领域，尤其涉及一种有源天线系统、基站、无线通信系统。
背景技术
5G设备中的有源天线系统，是将有源侧和无源侧集成在一个设备中。在现有的有源天线系统中，有源单元和无源单元分为两个或者两个以上的独立单元，便于进行电性能方面的测试，为了实现射频信号、电流信号以及控制信号的传输，各单元之间需要通过连接器或者线缆等方式连接。而连接器数量多不仅会带来成本的增加，而且装配操作较为复杂，效率较低且不利于实现自动化生产，而且体积和重量较大，很难满足无线通信设备做小做轻的需求。
发明内容
本申请提供一种有源天线系统、基站、无线通信系统。
第一方面，本申请实施例提供一种有源天线系统，包括：设备外壳；天线罩组件，所述天线罩组件与所述设备外壳相连接；集成单板，所述集成单板设置于所述设备外壳和所述天线罩组件之间，所述集成单板的正面设置有无源组件，所述集成单板的背面设置有有源组件。
第二方面，本申请实施例提供一种基站，包括本申请第一方面实施例所述的有源天线系统。
第三方面，本申请实施例提供一种无线通信系统，包括本申请第一方面实施例所述的有源天线系统，或者，包括本申请第二方面实施例所述的基站。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
下面结合附图和实施例对本申请进一步地说明；
图1是本申请的一个实施例提供的有源天线系统的整体拆解图；
图2是本申请的实施例提供的集成单板的正面的示意图；
图3是本申请的另一个实施例提供的集成单板的正面的布局示意图；
图4是本申请的实施例提供的集成单板的背面的布局示意图；
图5是本申请的另一个实施例提供的集成单板的背面的布局示意图。
具体实施方式
本部分将详细描述本申请的具体实施例，本申请之较佳实施例在附图中示出，附图的作 用在于用图形补充说明书文字部分的描述，使人能够直观地、形象地理解本申请的每个技术特征和整体技术方案，但其不能理解为对本申请保护范围的限制。
在本申请的描述中，若干的含义是一个或者多个，多个的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。如果有描述到第一、第二只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
本申请的描述中，除非另有明确的限定，设置、安装、连接等词语应做广义理解，所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本申请中的具体含义。
本申请实施例提供一种有源天线系统、基站、无线通信系统，有源天线系统包括：设备外壳；天线罩组件，所述天线罩组件与所述设备外壳相连接；集成单板，所述集成单板设置于所述设备外壳和所述天线罩组件之间，所述集成单板的正面设置有无源组件，所述集成单板的背面设置有有源组件。根据本申请实施例提供的方案，能够将有源组件和无源组件集成在集成单板的正面和背面，简化了有源天线系统的布局架构，能够省去不同单板之间的连接器，节约了成本，有利于优化有源天线系统的重量和体积。
下面结合附图，对本申请实施例作进一步阐述。
图1和图2所示，图1是本申请的一种有源天线系统的拆解示意图，在本实施例中，有源天线系统包括：
设备外壳10；
天线罩组件30，天线罩组件30与设备外壳10相连接；
集成单板20，集成单板20设置于设备外壳10和天线罩组件30之间，集成单板20的正面设置有无源组件，集成单板20的背面设置有有源组件。
需要说明的是，有源天线系统可以是基站内常用的有源天线单元(Active Antenna Unit，AAU)，也可以是其他同时具备无源组件和有源组件的单元，本实施例对此不多作限定。
需要说明的是，设备外壳10和天线罩组件30的具体结构可以根据实际需求选取，能够在设备外壳10和天线罩组件30之间安装集成单本20即可。
可以理解的是，如图1中所示，设备外壳10和天线罩组件30的外侧边缘可以设置有若干个连接孔，能够通过连接件将天线罩组件30固定安装在设备外壳10的上侧，例如通过螺栓连接，在设备外壳10的内部也可以通过设置连接孔或者卡槽等方式固定集成单板，本实施例对各部件之间的具体组装方式不作过多限定，能够实现由上至下安装天线罩组件30、集成单板20和设备外壳10即可。
需要说明的是，有源组件和无源组件的具体组件可以根据实际需求选取，例如有源组件可以是功放子卡、基带组件、收发信机组件、中频电路组件等，无源组件可以是介质滤波器等，本实施例对组件的具体类型和数量不作过多限定。在常见的有源天线系统中，每个有源组件和无源组件为独立的单元，以多个单板的形式设置在有源天线系统内，而不同单元之间需要传输信号或者电源，因此需要借助大量的连接器，尤其是对于AAU，射频连接器的数量较多，例如常见的32组或者64组，这会造成AAU的成本较高，而且连接器数量多会对装配工艺提出更高的要求，很容易在装配过程中引入各种问题和风险。而随着组件集成化技术的提高，大多数有源组件和无源组件已经能够实现集成，因此，本实施例技术方案将无源组件和有源组件集成到同一块集成单板的正面和背面，提高了集成单板的整体利用率，并且有效 减少了单板的数量，组件之间的信号能够通过板内的线路完成，省去了连接器，不仅在成本角度有了大幅下降，而且在集成单板的布局空间足够的情况下，能够仅以一块集成单板完成有源组件和无源组件的集成，单板的数量得到了有效的减少，能够进一步缩小有源天线系统的体积，从在体积和重量层面也有了较大的优化，能够更好地满足5G时代有源天线系统高集成的需求。
值得注意的是，集成单板20的正面集成有无源组件，背面集成有有源组件，这并不意味着正面只能有无源组件，以及背面只能有有源组件，本领域技术人员能够在不影响信号收发的情况下，也可以在正面设置有源组件，在背面设置无源组件，能够将相关组件在集成单板20中集成即可，这并不会对本实施例的技术方案造成限定。
值得注意的是，集成单板20虽然能够实现有源组件和无源组件的集成，但是在实际使用过程中，也可能出现部分组件的体积较大，或者集成单板20中集成的组件过多而无法全部集成到同一块，在这种情况下，也可以增加集成单板20的数量，或者增加个别功能单元单板，能够体现本实施例中以集成的方式尽可能减少单板数量，从而实现有源天线系统的体积优化和重量优化即可。
另外，参照图2，在一实施例中，集成单板20的正面设置有天线组件211。
需要说明的是，天线组件211可以是任意类型的天线，且数量可以是任意，本实施例对此不多作限定。为了实现信号的发送，天线组件211需要设置在集成单板20的正面，外侧通过天线罩组件30覆盖。
需要说明的是，有源组件在工作过程中可能对天线的信号收发造成干扰，在常见的有源天线系统中，天线组件与有源组件分别设置在不同单板的正面，为了避免有源组件对天线组件的干扰，通常需要在有源组件和天线组件之间额外设置隔离罩，这会使得有源天线系统的结构更加复杂，不利于体积和重量的控制。而在本实施例的技术方案中，如图1至图3所示，天线组件211位于集成单板20的正面，而有源组件位于集成单板20的背面，由于有源组件的朝向与天线组件211相反，因此能够在省去隔离罩的情况下有效避免有源组件对天线组件211造成干扰，在优化有源天线系统的结构、体积和重量的情况下确保天线组件211正常收发。
另外，参照图2和图3，在一实施例中，天线组件211的数量至少为2，相邻的两个天线组件211之间设置器件区域212，器件区域212用于设置有源器件或者无源器件。
需要说明的是，如图2所示，当天线组件211的数量至少为2的情况下，可以图2所示的行列形式排列，具体的排列方式以及每行每列的数量可以根据实际对天线的需求调整，本实施例对此不多作限定。
值得注意的是，相邻的天线组件211之间存在一定的空隙，为了进一步优化集成单板20的结构，提高利用率，可以在相邻的天线组件211之间设置器件区域212，例如，如图2和图3所述，相邻的两行天线组件211之间具有器件区域212，在该器件区域212中可以根据实际需求设置无源器件或者有源器件。
值得注意的是，在器件区域212中不仅可以用于设置无源器件，也可以用于设置电源组件等不会对天线组件211造成干扰的有源器件，根据实际需求调整器件的类型、数量和分布方式即可。
另外，在一实施例中，相邻的两个天线组件211之间还设置有屏蔽件。
需要说明的是，如图2所示，在天线组件211周围还可能设置有通孔或者用于设置连接件的连接孔，虽然有源组件设置在集成单板20的背面，但是也可能有干扰信号从上述通孔或者连接孔中传递到集成单板20的正面，从而对天线组件211造成干扰，为了避免上述情况，并且会产生干扰信号的有源组件对于本领域技术人员是可知的，因此可以在会产生干扰信号的有源组件所对应的通孔区域设置额外的屏蔽件，例如在通孔处焊接具有屏蔽效果的壳体等，本领域技术人员熟知如何选择合适的屏蔽件，在此不多做赘述。
另外，参照图4和图5，在一实施例中，集成单板20的背面还设置有介质滤波器222，介质滤波器222与有源组件相邻。
需要说明的是，介质滤波器222通常用于对输入信号进行滤波，而输入信号由有源组件中的收发信机组件225获取，因此介质滤波器222需要与有源组件相邻，而为了避免有源组件对天线组件211的干扰，在本实施例中将有源组件设置在集成单板20的背面，因此，介质滤波器222虽然属于无源组件，为了实现其过滤功能，也需要与有源组件设置在同一面。
需要说明的是，介质滤波器222属于常见的结构，本领域技术人员能够根据实际需求选取合适的介质滤波器222，在此不多做限定。
另外，参照图4和图5，在一实施例中，有源组件包括收发信机组件225、中频电路组件224和至少一个功放子卡223，功放子卡223位于收发信机组件225和介质滤波器222之间，中频电路组件224与收发信机组件225相邻。
值得注意的是，中频电路组件224为本领域技术人员熟知的结构，本领域技术人员能够根据有源天线系统的需求选取合适的中频电路组件224，在此对具体的电路结构不多做赘述。中频电路组件224可以与收发信机组件225设置在同一个区域，例如可以设置在集成单板20的背面中部，具体的排列方式可以根据器件的具体尺寸调整，在此不多做赘述。
需要说明的是，功放子卡223的数量可以根据实际需求调整，与收发信机组件225相邻设置即可，例如可以如图4或者图5所示，在功放子卡225的上下两侧分别邻接一个功放子卡223，在功放子卡223的另一侧邻接介质滤波器222，这是根据有源天线系统的信号传输方向排列的，在图4所示的实施例中，收发信机组件225接收到信号之后，经过功放子卡223进行功率调整，再经过介质滤波器222进行滤波，最终由天线组件211进行发送，因此，收发信机组件225、功放子卡223和介质滤波器222的排列位置是由信号传输方向决定的，本领域技术人员也可以根据实际需求进行调整，在此不多做限定。
需要说明的是，在常见的有源天线系统中，各个组件之间的互联方式较为复杂，有源组件和无源组件之间主要是射频信号的传递，通常需要采用诸如射频同轴连接器进行连接，而射频同轴连接器通常是盲插或者弹性连接，不仅数量多成本高，而且装配过程很容易导致接触不良；而在本实施例的有源天线系统中，由于有源组件和无源组件集成在同一块集成单板20中，射频信号的传递可以通过单板内部的线路实现，不仅省去了射频同轴连接器，节约了成本，而且避免了接触不良造成的质量问题。
另外，参照图4和图5，在一实施例中，还包括电源组件221和基带组件226，电源组件221设置于集成单板20的正面或者背面，基带组件226设置于集成单板20的正面或者背面。
需要说明的是，电源组件221和基带组件226可以根据实际需求同时设置在正面或者背面，也可以是电源组件221设置在正面，基站组件226设置在背面，也可以是电源组件221设置在背面，基站组件226设置在正面，能够具备足够的区域进行组件安装即可，例如图4 所示，图4为有源天线系统背面布局的一个示例图，在该实施例中，电源组件221和基带组件226分别位于有源天线系统的上下两侧，二者之间设置有介质滤波器222、功放子卡223、收发信机组件225和中频电路组件224；又如图5所示，图5为有源天线系统背面布局的另一个实施例，在该实施例中，电源组件221和基带组件226设置在有源天线系统的背面的下侧，当然也可以设置在图2所示的空隙区域212中，本实施例对此不多作限定。
需要说明的是，对于常见的有源天线系统，电源组件与有源组件之间需要通过连接器互联，以实现大电流功率信号和一般的控制信号的传输；而在本实施例中，采用图4所示或者图5所示的布局方式，电源组件221集成在集成单板20中，因此无论电源组件221设置在正面或者背面，都能够通过板内线路与有源组件连接，省去了连接器，不仅减少了硬件成本，也能够优化线路布局，减小有源天线系统的体积和重量。
另外，参照图1和图4、图5，在一实施例中，设备外壳10的外侧设置有散热齿11。
需要说明的是，功放子卡223属于发热量较高的器件，因此，为了及时散热，可以在设备外壳10的外侧设置散热齿11，以增加散热面积的方式提高散热效率。
值得注意的是，为了提高功放子卡223的散热效果，还可以在集成单板20中设置散热结构，具体的散热结构可以根据实际散热需求选取，本实施例对此不多做赘述。
另外，本申请的另一个实施例还提供了一种基站，包括如上实施例的有源天线系统。
需要说明的是，在基站中设置图1所示实施例中的有源天线系统，由于有源天线系统将有源组件和无源组件集成在集成单板的正面和背面，简化了有源天线系统的布局架构，能够省去不同单板之间的连接器，节约了成本，有利于优化有源天线系统的重量和体积。在有源天线系统的重量和体积得到优化的情况下，将其应用到基站中，能够减少在基站中占用的空间，而且基站的重量也能够得到减小，有利于实现基站的做小做轻。
另外，本申请的另一个实施例还提供了一种无线通信系统，包括如上实施例有源天线系统，或者，包括如上实施例的基站。
需要说明的是，在无线通信系统中设置图1所示实施例中的有源天线系统，由于有源天线系统将有源组件和无源组件集成在集成单板的正面和背面，简化了有源天线系统的布局架构，能够省去不同单板之间的连接器，节约了成本，有利于优化有源天线系统的重量和体积。在有源天线系统的重量和体积得到优化的情况下，将其直接应用到无线通信系统，或者应用到基站中再应用到无线通信系统，能够减少在无线通信系统中占用的空间，而且无线通信系统的重量也能够得到减小，有利于实现无线通信系统的做小做轻。
本申请实施例包括：设备外壳；天线罩组件，所述天线罩组件与所述设备外壳相连接；集成单板，所述集成单板设置于所述设备外壳和所述天线罩组件之间，所述集成单板的正面设置有无源组件，所述集成单板的背面设置有有源组件。根据本申请实施例提供的方案，能够将有源组件和无源组件集成在集成单板的正面和背面，简化了有源天线系统的布局架构，能够省去不同单板之间的连接器，节约了成本，有利于优化有源天线系统的重量和体积。
上面结合附图对本申请实施例作了详细说明，但是本申请不限于上述实施例，在所述技术领域普通技术人员所具备的知识范围内，还可以在不脱离本申请宗旨的前提下作出各种变化。

Claims (10)

  1. 一种有源天线系统，包括：
    设备外壳；
    天线罩组件，所述天线罩组件与所述设备外壳相连接；
    集成单板，所述集成单板设置于所述设备外壳和所述天线罩组件之间，所述集成单板的正面设置有无源组件，所述集成单板的背面设置有有源组件。
  2. 根据权利要求1所述的有源天线系统，其中：所述集成单板的正面设置有天线组件。
  3. 根据权利要求2所述的有源天线系统，其中，所述天线组件的数量至少为2，相邻的两个所述天线组件之间设置器件区域，所述器件区域用于设置有源器件或者无源器件。
  4. 根据权利要求3所述的有源天线系统，其中，相邻的两个所述天线组件之间还设置有屏蔽件。
  5. 根据权利要求1所述的有源天线系统，其中，所述集成单板的背面还设置有介质滤波器，所述介质滤波器与所述有源组件相邻。
  6. 根据权利要求5所述的有源天线系统，其中，所述有源组件包括收发信机组件、中频电路组件和至少一个功放子卡，所述功放子卡位于所述收发信机组件和所述介质滤波器之间，所述中频电路组件与所述收发信机组件相邻。
  7. 根据权利要求1至6任意一项所述的有源天线系统，其中，还包括电源组件和基带组件，所述电源组件设置于所述集成单板的正面或者背面，所述基带组件设置于所述集成单板的正面或者背面。
  8. 根据权利要求1所述的有源天线系统，其中，所述设备外壳的外侧设置有散热齿。
  9. 一种基站，包括权利要求1至8任一项所述的有源天线系统。
  10. 一种无线通信系统，包括权利要求1至8任一项所述的有源天线系统，或者，包括如权利要求9所述的基站。
PCT/CN2022/080733 2021-11-09 2022-03-14 有源天线系统、基站、无线通信系统 WO2023082513A1 (zh)

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