WO2023077600A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2023077600A1
WO2023077600A1 PCT/CN2021/135613 CN2021135613W WO2023077600A1 WO 2023077600 A1 WO2023077600 A1 WO 2023077600A1 CN 2021135613 W CN2021135613 W CN 2021135613W WO 2023077600 A1 WO2023077600 A1 WO 2023077600A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
housing
circuit board
assembly
chip
Prior art date
Application number
PCT/CN2021/135613
Other languages
English (en)
Chinese (zh)
Inventor
陈龙
翟雄飞
孙雨舟
王冬寒
于登群
李安利
钱春风
Original Assignee
苏州旭创科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州旭创科技有限公司 filed Critical 苏州旭创科技有限公司
Publication of WO2023077600A1 publication Critical patent/WO2023077600A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers

Definitions

  • the present application relates to the technical field of optical communication, and in particular to an optical module.
  • a module usually includes a housing, a circuit board assembly inside the housing, and a light emitting component and/or a light receiving component.
  • the housing is provided with an electrical interface and an optical interface.
  • One end of the circuit board in the housing is an electrical connection end.
  • the electrical connection end is electrically connected to the electrical interface in the optical cage of the optical communication host through the electrical interface, and the optical interface is used to connect the external optical fiber. , through the external optical fiber to realize the optical transmission with the optical module in the remote optical communication host.
  • the light emitting component and the light receiving component in the commonly used optical module are generally respectively packaged as a light transmitting sub-module and an optical
  • the receiving sub-module is electrically connected to the hard circuit board through the flexible circuit board, so as to realize the signal transmission between the hard circuit board and the photoelectric chips in the light emitting sub-module and the light receiving sub-module.
  • both the light-emitting component and the light-receiving component are assembled in the same sub-module, and the sub-module is electrically connected to the hard circuit board through the flexible circuit board.
  • the Chinese patent application "Optical Module” published on July 19, 2017 with the application number 201710590788.
  • the printed circuit board on the sinking device, and the laser chip and the detector chip arranged on the heat sinking device, the laser chip and the detector chip are electrically connected with the circuit board.
  • the optical port structure at one end of the housing needs to be a separate structure from the housing, that is, the movable head, so that the optical port structure can be adjusted during the assembly process ( movable head) to improve assembly tolerances.
  • the laser chip and detector chip, wavelength division multiplexer/demultiplexer, lens and other optical processing components are first assembled on a carrier, and then connected to the circuit board, and finally Assemble into the housing of the optical module.
  • the above-mentioned various packaging methods have the following disadvantages: 1. There are many structural parts, the production process is complicated, and the production process is long; 2. The heat dissipation path of the device is long and some need to use low thermal conductivity materials, which affects the operation of the module in the full temperature range Performance improvement; 3. The proportion of invalid space in the module is relatively high, which is not conducive to the development of miniaturization and high-density integration of modules; 4.
  • the structure is changeable, and the module assembly process and production costs are high, which sets obstacles for the batch application of modules, etc. .
  • the above problems affect the heat dissipation performance and integration of the optical module, and on the other hand, the cost of the optical module remains high, making it difficult to reduce the cost.
  • the purpose of the present application is to provide an optical module, which has better heat dissipation performance and higher integration, while effectively reducing product cost.
  • an optical module including a housing, a circuit board assembly, an optoelectronic chip, an optical processing assembly, and an optical socket;
  • the housing includes a first housing and a second housing, the The first housing and the second housing are closed to form an internal accommodation cavity;
  • the housing has an optical interface and an electrical interface;
  • the circuit board assembly, the photoelectric chip and the optical processing assembly are arranged in the internal accommodation cavity Inside;
  • the circuit board assembly includes a rigid circuit board and electronic components located on the rigid circuit board;
  • the circuit board assembly, the optoelectronic chip, the optical processing assembly and the optical socket are respectively fixed on the first housing, and the circuit board assembly is fixed in the first housing adjacent to the electrical interface s position;
  • the first housing includes a base plate, the optoelectronic chip is arranged on the base plate, the optoelectronic chip is adjacent to the rigid circuit board and electrically connected to the rigid circuit board;
  • the optical socket is fixed at a position corresponding to the optical interface in the first housing; the optical processing component is arranged on the bottom plate near the optical socket, and the optical processing component is used for the optoelectronic chip optical transmission with the optical receptacle.
  • the optoelectronic chip includes a laser chip, the laser chip is arranged on a substrate, the laser chip is electrically connected to the substrate, and the substrate is electrically connected to the rigid circuit board;
  • the base plate is directly glued or welded to the base plate; or, an electrical isolation layer and/or a semiconductor refrigerator is provided between the base plate and the base plate, and the electrical isolation layer or semiconductor refrigerator is directly glued Or be welded and fixed on the base plate.
  • the substrate is electrically connected to the rigid circuit board through a bonding wire or an adapter plate, or the rigid circuit board is electrically connected to the substrate by overlapping.
  • the substrate is located outside the rigid circuit board and adjacent to the rigid circuit board.
  • the photoelectric chip includes a photodetector chip, and the photodetector chip is glued or welded on an electrical isolation layer, and the electrical isolation layer is directly glued or welded to the base plate.
  • the optical module further includes a transimpedance amplifier, the transimpedance amplifier is disposed on the electrical isolation layer; the photodetector chip is electrically connected to the transimpedance amplifier through a bonding wire, The transimpedance amplifier is electrically connected to the circuit board through bonding wires.
  • the light processing component is directly bonded to the bottom plate through an adhesive layer.
  • the optical processing component includes a transmitting-end optical processing component and a receiving-end optical processing component, the transmitting-end optical processing component includes a wavelength division multiplexer and a first periscope; the receiving-end optical processing component including a wave division multiplexer and a second periscope;
  • the optical processing assembly includes several optical fibers and optical fiber fixing parts, and the optical fiber fixing parts are directly bonded to the base plate through an adhesive layer; one end of the optical fiber is connected to the optical socket, and the other end is fixed to the optical fiber fixing part.
  • the optical fiber corresponds to the optoelectronic chip one by one, and a coupling lens is arranged between the optical fiber fixing part and the optoelectronic chip.
  • the optical module is further provided with a third lens group, and the third lens group is fixed on the bottom plate of the first housing and located between the optical processing component and the optical socket .
  • the optical module is further provided with a third lens group;
  • the optical socket includes a ferrule assembly and an optical fiber ferrule, and the optical fiber ferrule is arranged in the ferrule assembly adjacent to the optical processing One end of the assembly, the other end of the sleeve assembly away from the optical processing assembly is used to receive the fiber ferrule of the external optical fiber when connected to the external optical fiber;
  • An extension structure is provided at one end of the sleeve assembly adjacent to the light processing assembly, and the third lens group is mounted on the extension structure.
  • the first housing is provided with a receiving groove corresponding to the optical interface, and the optical socket is arranged in the receiving groove.
  • the accommodating groove is provided with a first limiting structure
  • the optical socket is provided with a second limiting structure
  • the first limiting structure and the second limiting structure cooperate to define The position of the optical socket in the accommodating groove.
  • the optical interface is integrally formed with the bottom plate.
  • the bottom plate includes a first installation area and a second installation area; the circuit board assembly is fixed on the first installation area, and the photoelectric chip and the optical processing assembly are fixed on the second installation area. 2. Installation area.
  • the first housing has a first reference
  • the light processing component is fixed on the second installation area at a first preset position based on the first reference.
  • the second installation area is a plane.
  • the second installation area is provided with element limiting areas for respectively installing the optical components of the optoelectronic chip and the optical processing assembly according to the optical path design;
  • the second installation area is provided with a plurality of installation platforms of different heights, which are respectively used for installing the optoelectronic chip and the optical fiber components of the optical processing assembly.
  • the circuit board assembly is fixed in the first housing by gluing, fastening and/or buckling.
  • the optical module housing is directly used as the carrier to carry the optical components and the main power consumption chip components, which saves the heat sink for carrying the photoelectric chip and the carrier plate for carrying the optical components, and reduces the structural parts in the optical module.
  • the assembly process is optimized, which not only reduces the cost, but also reduces the occupancy of the invalid space, improves the effective space utilization rate in the optical module, and has a higher integration level; and the main power consumption such as lasers, detectors, and transimpedance amplifiers
  • the chip components dissipate heat directly to the housing without going through a heat sink, which has better heat dissipation performance.
  • Figure 1 is a schematic diagram of an optical cage of a commonly used optical module and an optical communication host
  • FIG. 2 is a schematic structural diagram of an optical module according to Embodiment 1 of the present application.
  • Fig. 3 is an exploded schematic view of the optical module in Fig. 2;
  • Fig. 4 is a structural schematic diagram of an optical socket
  • Fig. 5 is another structural schematic view of the optical socket
  • FIG. 6 is a schematic structural diagram of an optical module according to Embodiment 2 of the present application.
  • FIG. 7 is a schematic structural diagram of an optical module according to Embodiment 3 of the present application.
  • the optical module 200 is generally disposed in the optical cage 100 of the optical communication host in a pluggable manner.
  • the optical module 200 generally includes a casing, a circuit board assembly disposed in the casing, and a light emitting assembly and/or a light receiving assembly.
  • the casing is provided with an electrical interface 200a and an optical interface 200b, and one end of the circuit board assembly inside is an electrical connection end, and the electrical connection end (usually a gold finger) is connected to the electrical interface in the optical cage 100 of the optical communication host through the electrical interface 200a
  • the optical interface 200b is a fiber optic adapter, used to connect to an external optical fiber, and realize optical transmission with the optical module at the remote optical communication host end through the external optical fiber.
  • the optical module of this embodiment includes a housing 210 , a circuit board assembly 220 and an optical assembly including an optoelectronic chip 230 and an optical processing assembly 240 .
  • the housing 210 includes a first housing 211 and a second housing 212, the first housing 211 and the second housing 212 are covered to form an inner cavity, and the housing 210 has an optical interface 200b and an electrical interface 200a;
  • the circuit board assembly 220 , the optoelectronic chip 230 and the optical processing assembly 240 are disposed in the inner cavity of the casing 210 .
  • the circuit board assembly 220 includes a hard circuit board 221 (circuit board for short), electronic components (not shown in the figure), electric chips, etc., such as controllers, signal processors, drivers, transimpedance Amplifiers, etc., wherein the driver and the transimpedance amplifier can be arranged on the hard circuit board 221, or not on the hard circuit board 221, but are arranged on the bottom plate 213 of the first housing 211 together with the optoelectronic chip.
  • the hard circuit board 221 is fixed on the first housing 211, and one end (electrical connection end 222) of the hard circuit board 221 extends out of the electrical interface 200a for electrically connecting the electrical interface in the optical cage of the optical communication host.
  • the hard circuit board 221 can be fixed on the first housing 211 by locking, buckling or glueing with fasteners such as screws, or can be fixed on the first housing 211 by locking or buckling with screws, combined with glue.
  • the hard circuit board 221 is fastened and fixed on the first housing 211 by screws.
  • the bottom plate 213 of the first housing 211 is provided with a platform 216 for supporting the rigid circuit board 221.
  • the platform 216 is provided with a threaded hole 216a, and the position of the rigid circuit board 221 corresponding to the threaded hole 216a is provided with a through hole.
  • the screw passes through the through hole 223 and is locked into the threaded hole 216 a, and the nut presses the hard circuit board 221 , thereby fixing the hard circuit board 221 on the carrier 216 .
  • the carrying platforms 216 are respectively located inside the sidewalls 215 of the first housing 211 for supporting the two edges of the rigid circuit board 221 .
  • the carrier can also be arranged in the middle area of the bottom plate of the first housing, for supporting the middle position of the rigid circuit board.
  • the above-mentioned first housing 211 includes a base plate 213, and side walls 215 respectively located on both sides of the base plate 213, the optoelectronic chip 230 is arranged on the base plate 213, and the optoelectronic chip 230 is electrically connected to the hard circuit board 221; the optical processing component 240 is arranged on On the base plate 213 adjacent to the optical interface 200b, the optical processing component 240 is used for optical transmission between the optoelectronic chip 230 and the optical interface 200b.
  • the optical module 200 is a transceiver integrated optical module
  • the optoelectronic chip 230 includes a laser chip 231 and a photodetector chip 232
  • the optical processing component 240 includes a transmitting-end optical processing component and a receiving-end optical processing component.
  • the laser chip 231 is fixed on the base plate 213 of the first housing 211 through a base plate 236, and the base plate 236 is bonded or welded to the base plate 213; connect.
  • the laser chip 231 is mounted on the substrate 236 through the eutectic welding process to form a COC (chip on carrier) structure, and the laser chip 231 can be electrically connected to the substrate 236 through the above-mentioned eutectic bonding bonding wire (wire bonding). 236 is then electrically connected to the hard circuit board 221 through a bonding wire or an adapter plate to realize the electrical connection from the hard circuit board 221 to the laser chip 231 .
  • COC chip on carrier
  • the substrate 236 is set in a semiconductor refrigerator (Thermo Electric Cooler, TEC) 233 , the temperature of the COC is controlled through the TEC 233 , and the other side of the TEC 233 is fixed on the bottom plate 213 to dissipate heat directly through the bottom plate 213 .
  • the substrate may also be directly bonded to the bottom plate by an adhesive, and the substrate itself has an electrical isolation function, which electrically isolates the conductive layer of the substrate and the laser chip from the first casing.
  • an electrical isolation layer such as an aluminum nitride sheet, may also be provided between the substrate and the bottom plate of the first housing to realize electrical isolation between the laser chip and the first housing.
  • the substrate 236 is usually located outside the rigid circuit board 221 and adjacent to the edge of the rigid circuit board 221 .
  • the driver is disposed on the rigid circuit board 221 , and in other embodiments, the driver may also be disposed on the substrate.
  • the edge of the rigid circuit board 221 adjacent to the rigid circuit board 221 includes the outer side of the end face of the rigid circuit board 221 and the side wall side of the avoidance through hole provided on the rigid circuit board 221, that is, Not on the board of a rigid circuit board.
  • the hard circuit board 221 is provided with an avoidance hole 224, and the photodetector chip 232 and the transimpedance amplifier 235 are arranged in the avoidance hole 224, and are fixed on the bottom plate 213 of the first housing 211 corresponding to the avoidance hole. 224 locations.
  • the bottom plate 213 is provided with an electrical isolation layer 234 corresponding to the position of the avoidance hole 224, such as an aluminum nitride sheet, etc., the photodetector chip 232 and the transimpedance amplifier 235 are bonded on the electrical isolation layer 234, and the photodetector chip 232 passes through the electrical isolation layer 234.
  • the bonding wire is electrically connected to the transimpedance amplifier 235 , and the transimpedance amplifier 235 is electrically connected to the hard circuit board 221 through the bonding wire, so as to realize the electrical connection from the photodetector chip 232 to the hard circuit board 221 .
  • the escape hole 224 may be a square through hole in the rigid circuit board 221 , or a U-shaped through hole at the end or side of the rigid circuit board 211 .
  • the photodetector chip and the transimpedance amplifier can also be arranged outside the hard circuit board near the edge of the hard circuit board, or the transimpedance amplifier can also be arranged on the hard circuit board.
  • the optical module has a main heat dissipation housing and a secondary heat dissipation housing (the Top surface and the Bottom surface specified in the multi-source protocol).
  • the first housing 211 is the main heat dissipation housing of the optical module.
  • the second housing 212 is an auxiliary heat dissipation housing.
  • Optoelectronic chips 230 such as laser chip 231 and its substrate 236 (COC structure), photodetector chip 232, etc., and main power consumption chips, such as transimpedance amplifiers, drivers, etc., are arranged on the bottom plate of the first housing 213, and work
  • the heat generated during the process can be directly diffused out from the first housing 213, which is faster and faster than the heat dissipation path in the prior art through the heat sink and heat dissipation paste to the first housing, effectively improving the optical module performance. thermal performance.
  • the optical module in this embodiment is a multi-channel optical transceiver module, and the optical interface 200b of the housing 210 is provided with a transmitting-end optical socket 260a and a receiving-end optical socket 260b.
  • the optical processing component at the transmitting end includes a wavelength division multiplexer 241, and a first collimating lens array (ie, the first lens group) 271 is arranged between the wavelength division multiplexer 241 and the laser chip 231, and the wavelength division multiplexer 241 and the transmitting
  • a first coupling lens group 250a is disposed between the end optical sockets 260a.
  • the multiple beams of light reflected by the multiple laser chips 231 are respectively collimated by the collimating lenses of the first collimating lens array 271, and then enter the wavelength division multiplexer 241, and are combined into a beam of synthetic light by the wavelength division multiplexer 241.
  • the synthesized light is coupled into the optical receptacle 260a at the transmitting end through the first coupling lens group 250a, and transmitted into the external optical fiber through the optical receptacle 260a at the transmitting end.
  • the optical processing component at the receiving end includes a wavelength division multiplexer 242, and a second coupling lens array (that is, a second lens group) 272 is arranged between the wavelength division multiplexer 242 and the photodetector chip 232, and a connection between the receiving end optical socket 260b There is a second collimating lens group 250b between them.
  • the first coupling lens group 250a and the second collimating lens group 250b form the third lens group 250, which are respectively located at the ports of the transmitting end optical socket 260a and the receiving end optical socket 260b.
  • the optical socket 26b at the receiving end receives the composite optical signal transmitted by the external optical fiber, it transmits the received composite optical signal to the second collimating lens group 250b, and the composite optical signal is collimated by the second collimating lens group 250b and then enters the
  • the wave-division multiplexer 242 is decomposed into multiple single-channel optical signals by the wave-division multiplexer 242, and each single-channel optical signal is coupled to the corresponding optical detector chip 232 through each coupling lens of the second coupling lens array 272
  • Each photodetector chip 232 converts each single-channel optical signal into an electrical signal and transmits it to the transimpedance amplifier 235.
  • the transimpedance amplifier 235 amplifies each electrical signal and then transmits it to the hard circuit board 221. After the signal processing on the circuit board 221 is uploaded to the optical communication host through the electrical interface 200a.
  • the wavelength division multiplexer and the wavelength division multiplexer can also be composed of photonic integrated chips (Photonic Integrated Chip, PIC) or other optical waveguide chips, the photonic integrated chip or optical waveguide chip is bonded to the bottom plate of the first housing of the optical module by welding or thermally conductive adhesive.
  • the first coupling lens group 250a is a coupling lens
  • the second collimating lens group 250b is a collimating lens.
  • the above-mentioned first coupling lens is two coupling lenses corresponding to two transmitting ports
  • the second collimating lens group is two collimating lenses.
  • the optical module can also be a bidirectional transmission optical module with a single port for sending and receiving.
  • the third lens group is a single lens, which is used to couple the transmitted optical signal into the optical socket and receive the optical signal received by the optical module. The optical signal is collimated onto the optical processing component at the receiving end.
  • the optical processing component further includes an optical path deflecting prism (periscope) 260, and the optical processing component at the transmitting end is provided with a first periscope 243a between the wavelength division multiplexer 241 and the first coupling lens group 250a for adjusting the wavelength
  • the receiving end optical processing component is provided with a second periscope 243b between the second collimating lens group 250b and the wave division multiplexer 242, which is used to adjust the receiving end optical socket 260b and the second collimating lens group 250b and the wave division multiplexer 242 light paths between.
  • the optical module shell The optical components at the transmitting end, such as the laser chip and the wavelength division multiplexer in the body, and the optical socket at the receiving end are located on the same side of the first housing (that is, the left or right side when facing the optical interface), while the optical detector chip and the wave
  • the optical components at the receiving end such as the demultiplexer and the optical socket at the transmitting end are on the other side of the first housing.
  • the optical path can be guided to a corresponding height, making the layout design in the optical module housing more flexible.
  • this design can lengthen the length of the periscope, so as to facilitate the manufacture of the periscope and facilitate the coupling of optical paths.
  • the light processing component is bonded to the bottom plate 213 of the first housing 211 through an adhesive layer.
  • the first collimating lens array 271 is arranged on the TEC 233 or the electrical isolation layer, and the wavelength division multiplexer 241 and the first periscope 243a at the transmitting end are directly bonded to the bottom plate 213 through an adhesive layer (not shown in the figure).
  • the thickness of the adhesive layer is adjusted according to the optical path, so that the wavelength division multiplexer 241 and the first periscope 243a are aligned with each other, and respectively aligned with the front and rear optical paths.
  • the photodetector chip 232 adopts is a surface receiving chip
  • a reflector is arranged above the photodetector chip 232
  • the second coupling lens array 272 is arranged above the photodetector chip 232 together with the reflector to decompose the wave
  • Each optical signal output by the multiplexer 242 is respectively reflected and coupled to each optical detector chip 232 .
  • the second coupling lens array can also be replaced by a large lens.
  • the wave division multiplexer 242 and the second periscope 243b at the receiving end are also directly bonded to the bottom plate 213 through an adhesive layer, and the thickness of the adhesive layer is adjusted according to the optical path so that the wave division multiplexer 243 and the second periscope 243b are aligned with each other, and respectively Align with the front and back light paths.
  • the optical module directly uses the optical module housing as the carrier to carry the optical processing components and the main power consumption chip, which saves the heat sink carrying the photoelectric chip and the carrier plate carrying the optical processing components, reduces the structural parts in the optical module, and optimizes the The assembly process not only reduces the cost, but also reduces the occupancy of the invalid space, improves the utilization rate of the effective space in the optical module, and has a higher degree of integration.
  • the bottom plate 213 of the first housing 211 includes a first installation area 217 and a second installation area 218, the above-mentioned hard circuit board 221 is fixed on the first installation area 217, and the laser chip 231 and the optical processing component are fixed on the second installation area 218.
  • Installation area 218 The first housing 211 has a first reference, and the light processing component is fixed on the second installation area 218 at a first preset position based on the first reference.
  • the first reference may be a mark provided in the second installation area 218 , or a junction between a port and a side wall of the first housing 211 , or a limiting structure in the first housing 211 .
  • the second installation area 218 is provided with periscope positioning slots, wavelength division multiplexer limiting slots, wavelength division multiplexer limiting slots, etc. according to the optical path design.
  • the second installation area can also be a plane on which optical components such as periscopes, wavelength division multiplexers, and wavelength division multiplexers are installed, and by adjusting the glue between each optical component and the plane layer thickness to align individual optical components.
  • the second installation area includes a plurality of installation platforms of different heights, which are respectively used for installing periscopes, wavelength division multiplexers, wavelength division multiplexers, and optoelectronic chips, etc., and the end of the hard circuit board adjacent to the optoelectronic chip can be glued and fixed On the installation platform carrying the optoelectronic chip in the first installation area of the bottom plate.
  • This structure has lower requirements on the processing accuracy of the first installation area and the second installation area, and can effectively reduce the processing cost of the housing.
  • the aforementioned stage 216 is arranged on the first installation area 217 of the bottom plate 213, and the threaded hole 216a on the stage 216 and the corresponding through hole 223 on the hard circuit board 221 can be regarded as two parts on the stage 216 and the circuit board assembly 220 respectively.
  • a position-limiting structure limits the position of the circuit board assembly 220 in the first housing 211 through screw locking, so as to limit the circuit board assembly 220 in the first installation area 217 .
  • protrusions can also be provided on the stage as a limiting structure, which cooperate with limiting structures such as holes or notches on the hard circuit board, so as to limit the position of the circuit board assembly in the first housing.
  • a limiting structure is provided at other positions in the first installation area, and cooperates with the limiting structure on the circuit board assembly to limit the position of the circuit board assembly.
  • the optical socket 260, the optical processing component 240, the optoelectronic chip 230 and the circuit board component 220 are respectively installed in the first housing 211 based on the first housing 211 of the optical module.
  • 221 are electrically connected to the optoelectronic chip 230 and the hard circuit board 221 by wire bonding (wire bonding, such as a gold wire) or an adapter plate.
  • the optical signal is coupled between the optical processing component 240 and the optical socket 260; the first collimating lens array (first lens group) 271 is adjusted to collimate the optical signal emitted by the laser chip 231 before incident To the optical processing component 240 , the second coupling lens array (second lens group) 272 is adjusted to couple each optical signal outputted by the optical processing component 240 to each optical detector chip 232 .
  • Optical sockets, optical processing components, laser chips, optical detector chips, and circuit board components are all installed and placed in the first housing based on the optical module housing (the first housing), which simplifies the production and assembly process and can further Improve production efficiency and reduce costs. At the same time, more space is saved around each device, more important components can be configured, the layout in the module is further optimized, and the integration level is improved, which is conducive to the realization of miniaturized packaging of high-speed optical modules.
  • the optical receptacle 260 (transmitting end optical receptacle and receiving end optical receptacle) used in this embodiment includes a ferrule assembly 261 and an optical fiber ferrule 262 , and the optical fiber ferrule 262 is disposed in the ferrule assembly 261 .
  • the sleeve assembly 261 has a through first end 263 and a second end 264, the first end 263 is used for coupling with the optical processing assembly in the optical module, and the second end 264 is used for connecting with the external optical fiber.
  • the fiber ferrule 262 is arranged in a section of the ferrule assembly 261 close to the first end 263, and a section of the ferrule assembly 261 close to the second end 264 is used to receive the fiber ferrule of the external optical fiber when connecting with the external optical fiber.
  • the optical fiber ferrule 262 faces The end face of the second end 264 is used for mating with the ferrule of the external optical fiber connector.
  • the first end 263 of the sleeve assembly 261 is provided with an extension structure 265 extending axially along the optical socket 260, the extension structure 265 has an open mounting surface 265a, and the mounting surface 265a is used for mounting a lens (such as the above-mentioned third lens group ), that is, the first coupling lens at the transmitting end or the second collimating lens at the receiving end, so that the lens is located in the optical path transmitted by the optical socket.
  • the mounting surface 265a can also be used to mount other passive optical components such as isolators or filters.
  • the third lens group can be fixed on the mounting surface 265a by welding or gluing.
  • the open mounting surface 265a means that the mounting surface 265a has an opening in the radial direction of the sleeve assembly 261, which is convenient for adjusting and fixing the lens during the coupling process.
  • the mounting surface 265a is a carrying plane, located below the fiber core extension line of the fiber ferrule 262, for carrying the above-mentioned lens.
  • the installation surface can also be located at other positions on the side of the fiber core extension line of the optical fiber ferrule 262, and can be a plane or other shapes, such as L-shaped surface, U-shaped surface, arc-shaped surface, V-shaped surface, or V-shaped surface. Surface, etc., to facilitate the adjustment and fixation of the lens.
  • the installation surface is located outside the core extension line of the fiber ferrule and faces the fiber core extension line, so as to allow the light transmission path, so that the light-transmitting surface of the external optical component fixed on the installation surface is aligned with the fiber core.
  • the extension structure and the bushing assembly are integrally formed, and the outer contour of the extension structure is an extension of the outer contour of the first end portion of the bushing assembly.
  • the extension structure can also be welded or glued together with the bushing assembly.
  • the optical path coupling between the optical socket and the optical processing component can be realized conveniently by adjusting the third lens group, and after the adjustment is completed, the lens is fixed on the above-mentioned extension structure, which reduces the difficulty of optical path coupling.
  • the extension structure 265 and the casing assembly 261 are integrally formed. In other embodiments, the extension structure may also be fixed integrally with the casing assembly by welding or bonding.
  • the optical interface 200 b of the optical module 200 is provided with a receiving groove 214 , and the above-mentioned optical socket 260 is arranged in the receiving groove 214 .
  • the receiving groove 214 is provided with a first limiting structure
  • the optical socket 260 is provided with a second limiting structure 266, and the first limiting structure and the second limiting structure 266 cooperate to limit the position of the optical socket 260 in the receiving groove 214. .
  • the optical interface 200b is integrally formed with the first housing 211, and the optical socket 260 can be fixed in the above-mentioned accommodating groove 214 by gluing or welding, or can be fixed in the above-mentioned accommodating groove by other means such as buckle or screw locking. 214 inside.
  • the above-mentioned first limiting structure may be a first protrusion or recess in the first housing 211, such as a protrusion or a flange, etc.
  • the second limiting structure 266 may be a second protrusion on the outer periphery of the sleeve assembly 261, such as bumps or flanges etc. During assembly, the second protrusion abuts against the first protrusion to define the position of the optical socket 260 in the length direction of the optical module 200 .
  • the above-mentioned optical module can also adopt the optical plug-in of this embodiment, and the assembly method of the optical plug-in in the optical module is the same as that of the optical socket of the above-mentioned embodiment.
  • the optical receptacle 260 of this embodiment also includes a ferrule assembly 261 and an optical fiber ferrule 262 .
  • the fiber ferrule 262 is disposed in the ferrule assembly 261 .
  • the sleeve component 261 has a first end 263 and a second end 264, the first end 263 is used for coupling with the optical processing component in the optical module, and the second end 264 is used for connecting with an external optical fiber.
  • the fiber ferrule 262 is disposed in the ferrule assembly 261 close to the first end 263 , and a section of the ferrule assembly 261 adjacent to the second end 264 is used for receiving the fiber ferrule of the external optical fiber when connecting with the external optical fiber.
  • an optical window 267 is provided at the port of the ferrule assembly 261 at the first end 263 of the optical receptacle 260 to seal the fiber ferrule 262 in the ferrule assembly 261, and the end face of the fiber ferrule 262 Effective airtight protection.
  • the optical window can also be directly attached to the end face of the fiber ferrule near the first end.
  • the above-mentioned optical window 267 is an optical flat sheet, such as a glass sheet, and an anti-reflection film may be provided on the light-transmitting surface of the optical flat sheet to reduce surface reflection.
  • the sleeve assembly of the optical socket in this embodiment can be a sleeve assembly of a common optical socket, that is, a sleeve assembly without an extension structure, or a sleeve assembly with an extension structure in the above-mentioned embodiment, and the optical window is also arranged on the The sleeve assembly is adjacent to the port of the third lens group.
  • the optical module 300 in this embodiment includes a housing 310 , a circuit board assembly 320 and an optical assembly.
  • the optical assembly includes an optical device carrier 380 , an optoelectronic chip 330 and an optical processing assembly 340 .
  • the housing 310 includes a first housing 311 and a second housing 312, the first housing 311 and the second housing 312 are covered to form an inner cavity, and the optical module 300 has an optical interface 300b and an electrical interface 300a;
  • the circuit board assembly 320 , the optical device carrier 380 , the optoelectronic chip 330 and the optical processing assembly 340 are arranged in the internal cavity of the casing 310 .
  • the optical device carrier 380 is a heat sink, usually a heat-conducting metal, and the optoelectronic chip 330 and the optical processing component 340 are both disposed on the optical device carrier 380 .
  • the optical device carrier may also include a first carrier and a second carrier that are bonded together by overlapping or butt fixing, wherein the first carrier is a heat sink, and the second carrier is a heat sink.
  • the carrier plate is made of a material whose thermal expansion coefficient is close to or the same as that of the light processing component, that is, the thermal expansion coefficient of the second carrier plate matches the thermal expansion coefficient of the light processing component.
  • the photoelectric chip is set on the first carrier, and the optical processing component is set on the second carrier, which avoids the problem of light loss when the ambient temperature changes greatly due to the large difference in thermal expansion coefficient between the optical device carrier and the light processing component. question.
  • the optical device carrier 380 carrying the optoelectronic chip 330 and the optical processing component 340 is fixed in the first housing 310 by bonding or welding with thermally conductive adhesive.
  • the above-mentioned circuit board assembly 320 includes a hard circuit board 321 and electronic components, electric chips, etc., such as controllers, signal processors, drivers, transimpedance amplifiers, etc., wherein the driver and the transimpedance amplifier can be located on the hard circuit board 321, it may not be set on the hard circuit board, but set on the optical device carrier together with the photoelectric chip.
  • the rigid circuit board 321 is fixed on the first housing 311 , and one end (electrical connection end 322 ) of the rigid circuit board 321 extends out of the electrical interface 300 a for electrical connection to the electrical interface in the optical cage of the optical communication host.
  • the end surface of the rigid circuit board 321 adjacent to the optoelectronic chip 330 abuts against the substrate of the optoelectronic chip or the transimpedance amplifier, and is not fixed to the optical device carrier 380 .
  • the end surface of the rigid circuit board 321 adjacent to the optoelectronic chip 330 abuts against the end surface of the optical device carrier 380 , and does not overlap with the optical device carrier 380 .
  • the hard circuit board 321 can be locked, buckled or glued to the first shell 311 by screws and other fasteners, or locked or buckled by screws and other fasteners, combined with glue and fixed to the first shell Body 311.
  • the optical device carrier 380 and the circuit board assembly 320 are respectively installed and placed on the basis of the first housing 311, and are respectively fixed in the first housing 311.
  • the optical device carrier 380 and the hard circuit board 321 do not need to be fixed to each other.
  • the assembly method of the optical module is made more flexible, the production and assembly process is simplified, and rework is also facilitated, which can further improve production efficiency and reduce costs.
  • the fixing method of the hard circuit board in this embodiment is the same as that in embodiment 1.
  • a through hole 323 is provided on the hard circuit board 321, and the screw passes through the through hole 323 and is locked in the threaded hole of the first housing 311. , so as to lock the hard circuit board 321 in the first casing 311 .
  • the optical module of this embodiment is a transceiver integrated optical module.
  • the photoelectric chip 330 includes a laser chip 331 and a photodetector chip 332.
  • the optical processing component 340 includes a transmitting end optical processing component and a receiving end optical processing component. The transmitting end Both the optical path and the optical path at the receiving end are the same as those in Embodiment 1.
  • the assembly structure of the optoelectronic chip 330 and the optical processing assembly 340 on the optical device carrier 380 is the same as the assembly structure of the optoelectronic chip and the optical processing assembly in Embodiment 1, and the electrical connection method between the optoelectronic chip 330 and the circuit board assembly 320 is the same as in Embodiment 1, here No longer.
  • the optical processing component 340 is bonded to the optical device carrier 380 through an adhesive layer, and the optical device carrier 380 is fixed in the first housing 311 by bonding or welding with thermally conductive adhesive.
  • the hard circuit board 321 is provided with a avoidance hole 324 , and the photodetector chip 332 and the transimpedance amplifier are arranged in the avoidance hole 324 , and are fixed on the optical device carrier board 380 corresponding to the avoidance hole 324 .
  • the bottom plate 313 of the first housing 311 also includes a first installation area 314 and a second installation area 315, the above-mentioned rigid circuit board 321 is fixed on the first installation area 314, and an optoelectronic chip 330 and an optical processing assembly 340 are installed therein.
  • the optical device carrier 380 is fixed on the second installation area 315 .
  • the first installation area 314 is provided with a stage 316, and the threaded holes on the stage 316 and the corresponding through holes 323 on the hard circuit board 321 can be regarded as two parts on the stage 316 and the circuit board assembly 220 respectively.
  • a position-limiting structure restricts the position of the circuit board assembly 320 in the first housing 311 through screw locking, so as to restrict the circuit board assembly 320 in the first installation area 314 .
  • protrusions can also be provided on the stage as a limiting structure, which cooperate with limiting structures such as holes or notches on the hard circuit board, so as to limit the position of the circuit board assembly in the first housing.
  • a limiting structure is provided at other positions in the first installation area, and cooperates with the limiting structure on the circuit board assembly to limit the position of the circuit board assembly.
  • the first housing 311 has a first positioning reference, and the optical device carrier 380 on which the optoelectronic chip 330 and the optical processing assembly 340 are installed is fixed on the second installation area 315 at a first preset position based on the first positioning reference .
  • the first positioning reference may be a mark provided in the second installation area 315 , or a structural feature such as the interface between the port and the side wall of the first housing, or a limiting structure in the second installation area.
  • the optical device carrier 380 has a second reference, and each optical element of the optical processing assembly 340 is bonded and fixed on the optical device carrier 380 at the second, third, etc. preset positions based on the second reference.
  • the second reference may be a mark or a limiting structure provided on the optical device carrier 380 , or a corner of an end of the optical device carrier 380 , or the like.
  • the optical device carrier 380 is provided with periscope positioning slots, wavelength division multiplexer limiting slots, wavelength division multiplexer limiting slots, etc. according to the optical path design.
  • the optical device carrier can also be a plane on which optical components such as periscopes, wavelength division multiplexers, and wavelength division multiplexers are installed.
  • the optical device carrier board is provided with a plurality of installation platforms of different heights, which are respectively used for installing the periscope, the wavelength division multiplexer, the wavelength division multiplexer, the photoelectric chip, and the like.
  • This structure has lower requirements on the precision of the carrying surface of the optical device carrier 380 for carrying the optical processing component 340 and the optoelectronic chip 330 , and can effectively reduce the processing cost of the optical device carrier.
  • the optical module of this embodiment can use the same optical socket as that of Embodiment 1, and the optical socket can be fixed at the optical interface of the housing as in Embodiment 1, or can be fixed on the optical device carrier.
  • the end of the optical device carrier 380 adjacent to the optical interface 300b is provided with a socket installation part 381, and the optical socket 360 is welded, glued, screwed or clipped to the installation part 381 on.
  • the socket mounting portion 381 may be a side wall disposed at the end of the optical device carrier 380 , and a socket receiving groove 382 for mounting the optical socket 360 is provided on the side wall.
  • the installation and positioning of the optical receptacle 360 on the optical device carrier 380 may be consistent with the installation and positioning of the optical receptacle in the first housing in Embodiment 1, and will not be repeated here.
  • the optical plug-in 360 and the optical processing component 340 are passively fixed on the optical device carrier 380 , and the optical signal is coupled between the optical processing component 340 and the optical socket 360 by adjusting the third lens group 350 .
  • the optoelectronic chip 330 is also passively fixed on the optical device carrier 380 or on a separate heat sink.
  • the circuit board assembly 320 and the optical device carrier 380 carrying the optoelectronic chip 330 and the optical processing assembly 340 are respectively installed and fixed in the first housing 311 with the first housing 311 as a reference, and the optical device carrier 380 and the hard circuit board 321 There is no need to fix each other.
  • the optoelectronic chip 330 and the hard circuit board 321 are electrically connected with a bonding wire (wire bonding, such as a gold wire), and the first collimating lens array (the first lens group 371 ) to collimate the optical signal emitted by the laser chip 331 and then incident on the wavelength division multiplexer, adjust the second coupling lens array (second lens group 372) to couple the optical signals output by the wavelength division multiplexer respectively to each photodetector chip 332.
  • a bonding wire wire bonding, such as a gold wire
  • Both the circuit board assembly 320 and the optical device carrier 380 are installed on the basis of the first housing 311 of the optical module 300, and the optical processing assembly 340, the optoelectronic chip 330, and the assembly between the circuit board assembly 320 can be absorbed by adjusting the lens group. tolerance.
  • the optical module 400 in this embodiment includes a housing 410 , a circuit board assembly 420 and an optical assembly.
  • the optical assembly includes an optoelectronic chip 430 and a light processing assembly 440 .
  • the housing 410 includes a first housing 411 and a second housing 412, the first housing 411 and the second housing 412 are covered to form an inner cavity, and the optical module 400 has an optical interface 400b and an electrical interface 400a;
  • the above-mentioned circuit board assembly 420 , optoelectronic chip 430 and light processing assembly 440 are disposed in the inner cavity of the casing 410 .
  • the optoelectronic chip 430 includes a laser chip 431, the laser chip 431 is installed on a substrate 432, the laser chip 431 is electrically connected to the substrate 432, and the bonding process between the laser chip 431 and the substrate 432 is usually realized by using a gold wire bonding process. electrical connection.
  • the circuit board assembly 420 includes a rigid circuit board 421 and electronic components or integrated circuit chips disposed on the rigid circuit board 421 , such as a digital signal processor (DSP) 422 and the like.
  • DSP digital signal processor
  • the substrate 432 partially overlaps the rigid circuit board 421, that is, the substrate 432 overlaps the rigid circuit board 421, and the surface of the substrate 432 of the overlapped part is provided with an electrical connection terminal, and the rigid circuit board 421
  • the surface of the substrate is also provided with electrical connection ends, and the above-mentioned electrical connection ends on the substrate 432 and the hard circuit board 421 are conductively connected and fixed together by processes such as flip-chip (Flip-chip) or anisotropic conductive glue (ACF),
  • Flip-chip flip-chip
  • ACF anisotropic conductive glue
  • the substrate 432 is thermally connected to the first casing 411 through a heat sink 433, and the heat generated by the operation of the laser chip 431 is transferred to the first casing 411 through the substrate 432 and the heat sink 433.
  • the casing 411 dissipates heat.
  • the optical processing component 440 is disposed on the optical device carrier 450, and the optical processing component 440 may include a wavelength division multiplexer, a periscope, a coupling lens, and the like.
  • the structure between the optical processing component 440 and the optical socket is similar to that of Embodiment 1 or 2, and will not be repeated here.
  • the above-mentioned electrical connection end of the circuit board 421, the DSP 422 and the high-speed signal transmission line connecting the two can be arranged on the same surface of the hard circuit board 421 and the above-mentioned substrate 432, for example, all are arranged on the hard circuit board 421 facing the main heat dissipation housing (here is the first housing 411 ), the DSP 422 is thermally connected to the first casing 411 through a heat dissipation pad 460 , and the heat generated by it is directly transferred out through the first casing 411 .
  • the electrical connection end of the laser chip 431 and the substrate 432 is on the same surface of the substrate 432, and is located on the side of the substrate 432 facing away from the first housing 411.
  • the back side of the substrate 432 faces the first housing 411 and passes through a heat sink 433 It is connected to the first housing 411 for heat dissipation.
  • the high-speed signal transmission line from the DSP 422 to the optoelectronic chip 430 does not need to pass through conductive vias, gold wire bonding, or adapter board transfer, which reduces the impedance mutation of the high-speed signal transmission line and can Effectively improve the high-frequency performance of components and greatly increase the bandwidth of components.
  • the main power consumption devices in the optical module the heat generated by the laser chip 431 and the DSP 422 can be directly transferred from the first housing 411 of the housing 410 (that is, the main heat dissipation housing), which can further improve the performance of the optical module. cooling performance.
  • a semiconductor cooler may also be provided between the substrate 432 and the heat sink 433 to further improve the heat dissipation efficiency of the laser chip 431 .
  • the above-mentioned heat sink 433 can also be integrally formed with the optical device carrier 450; or, the substrate 432 and the optical processing component 440 are directly glued and fixed in the first housing 411, omitting the heat sink or the optical device carrier.
  • the optical path deflecting prism can also be replaced by several optical fibers.
  • the optical fiber has better flexibility, which makes the design of the height/position of the optical processing component more flexible, and is not limited by the position of the optical socket.
  • the alignment of the optical axis of the chip is enough, the design requirements for the inner bottom plate of the first housing or the optical device carrier are lower, and the assembly is easier.
  • an optical fiber segment directly extends from one end of the optical socket close to the optical processing component, and the end of the optical fiber segment away from the optical socket is connected to the optical fiber fixing member.
  • the above-mentioned third lens group is located between the wavelength division multiplexer or the wavelength division multiplexer and between fiber holders for optical coupling between fiber segments and wavelength division multiplexers/wavelength division multiplexers.
  • the optical processing component includes several fiber segments and coupling lenses, that is, the above-mentioned optical path deflection prism and wavelength division multiplexer/WDM are all replaced by the above-mentioned fiber segment, or an arrayed waveguide grating (AWG) wavelength division multiplexer , Planar waveguide (PLC) wavelength division multiplexer with pigtail or photonic integrated chip instead.
  • AMG arrayed waveguide grating
  • PLC Planar waveguide
  • the number of optical sockets is consistent with the number of optical channels of the optoelectronic chip (the sum of the number of optical channels of the laser chip and the number of optical channels of the photodetector chip).
  • one end of each optical socket close to the photoelectric chip is directly extended with the above-mentioned fiber segment, and the end of the fiber segment far away from the optical socket is connected to the fiber holder, and a coupling lens is provided between the fiber holder and the optical channel of each chip. Optical coupling is performed between the fiber segment and the optical channel of each optoelectronic chip.

Abstract

L'invention concerne un module optique (200, 300, 400), comprenant un boîtier (210, 310, 410), un ensemble carte de circuit imprimé (220, 320, 420), une puce photoélectrique (230, 330, 430), un ensemble de traitement optique (240, 340, 440), et une douille optique (260, 360). Le boîtier (210, 310, 410) comprend un premier boîtier (211, 311, 411) et un second boîtier (212, 312, 413) ; l'ensemble carte de circuit imprimé (220, 320, 420) comprend une carte de circuit imprimé dur (221, 321, 421) ; l'ensemble carte de circuit imprimé (220, 320, 420), la puce photoélectrique (230, 330, 430), l'ensemble de traitement optique (240, 340, 440), et la douille optique (260, 360) sont respectivement fixés sur le premier boîtier (211, 311, 411) ; le premier boîtier (211, 311, 411) comprend une plaque inférieure (213, 313) ; la puce photoélectrique (230, 330, 430) est disposée sur la plaque inférieure (213, 313) ; la douille optique (260, 360) est fixée à une position dans le premier boîtier (211, 311, 411) correspondant à une interface optique (200b, 300b, 400b) ; et l'ensemble de traitement optique (240, 340, 440) est disposé à une position sur la plaque inférieure (213, 313) à proximité de la douille optique (260, 360). Le boîtier (210, 310, 410) du module optique (200, 300, 400) sert directement de support pour porter un élément optique et un ensemble puce à consommation d'énergie principale, de telle sorte qu'un dissipateur thermique (433) pour supporter la puce photoélectrique (230, 330, 430) et une plaque de support pour supporter l'élément optique sont omis, le nombre de parties structurales dans le module optique (200, 300, 400) diminue, le coût est réduit, l'occupation d'un espace inefficace est rétrécie, le taux d'utilisation d'un espace efficace dans le module optique (200, 300, 400) est amélioré, et le module optique a un niveau d'intégration plus élevé. L'ensemble puce à consommation d'énergie principale dissipe directement de la chaleur vers le boîtier (210, 310, 410) sans traverser le dissipateur thermique (433), de telle sorte que le module optique présente de meilleures performances de dissipation de chaleur.
PCT/CN2021/135613 2021-11-05 2021-12-06 Module optique WO2023077600A1 (fr)

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Citations (6)

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US20040042740A1 (en) * 2002-08-28 2004-03-04 Opnext Japan, Inc. Optical transmission module
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CN109613661A (zh) * 2018-08-15 2019-04-12 苏州旭创科技有限公司 光模块
CN109683251A (zh) * 2017-12-30 2019-04-26 苏州旭创科技有限公司 光模块
CN110658599A (zh) * 2017-07-19 2020-01-07 苏州旭创科技有限公司 光模块
CN112838897A (zh) * 2021-03-09 2021-05-25 青岛海信宽带多媒体技术有限公司 一种光模块

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040042740A1 (en) * 2002-08-28 2004-03-04 Opnext Japan, Inc. Optical transmission module
US20120266434A1 (en) * 2011-04-19 2012-10-25 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Methods and apparatuses for protecting flexible (flex) circuits of optical transceiver modules from being damaged during manufacturing and assembly of the modules
CN110658599A (zh) * 2017-07-19 2020-01-07 苏州旭创科技有限公司 光模块
CN109683251A (zh) * 2017-12-30 2019-04-26 苏州旭创科技有限公司 光模块
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