WO2023074824A1 - Capacitor apparatus, power conversion apparatus, and vehicle - Google Patents

Capacitor apparatus, power conversion apparatus, and vehicle Download PDF

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Publication number
WO2023074824A1
WO2023074824A1 PCT/JP2022/040257 JP2022040257W WO2023074824A1 WO 2023074824 A1 WO2023074824 A1 WO 2023074824A1 JP 2022040257 W JP2022040257 W JP 2022040257W WO 2023074824 A1 WO2023074824 A1 WO 2023074824A1
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WO
WIPO (PCT)
Prior art keywords
insertion hole
capacitor device
capacitor
terminal
connection terminal
Prior art date
Application number
PCT/JP2022/040257
Other languages
French (fr)
Japanese (ja)
Inventor
竜也 雁部
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN202280023789.5A priority Critical patent/CN117083686A/en
Publication of WO2023074824A1 publication Critical patent/WO2023074824A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Definitions

  • the present invention relates to a capacitor device, a power conversion device and a vehicle.
  • Patent Document 1 JP-A-2015-154586
  • Patent Document 2 International Publication 2019/239771
  • the first aspect of the present invention provides a capacitor device.
  • the capacitor device may have insertion holes into which external terminals are inserted.
  • the capacitor device may include a first connection terminal provided on the inner surface of the insertion hole and electrically connected to the external terminal.
  • the insertion hole portion may have a pressing portion that presses the external terminal inserted into the insertion hole portion against the first connection terminal.
  • the insertion hole may have therein a conductive adhesive that adheres to the first connection terminal and the external terminal.
  • the capacitor device may further include a second connection terminal exposed on the outer surface of the capacitor device and electrically connected to another external terminal.
  • the capacitor device may include a capacitor body.
  • the capacitor device may include a housing portion that accommodates the capacitor body and has an insertion hole formed therein.
  • the capacitor body may have a plastic film as a dielectric.
  • the power converter may further include at least one switching element electrically connected between the positive power line and the negative power line.
  • a main terminal of the switching element may be inserted into the insertion hole.
  • the power converter may include at least one pair of switching elements connected in series between the positive power line and the negative power line to form upper and lower arms of the power converter.
  • the capacitor device may have an insertion hole for each arm. The positive terminal of the switching element forming the upper arm or the negative terminal of the switching element forming the lower arm of each pair of switching elements may be inserted into each insertion hole.
  • At least one pair of switching elements may be provided in a single semiconductor package for each pair.
  • the capacitor device may further have a second connection terminal exposed on the outer surface and electrically connected to the positive power line and the negative power line.
  • the capacitor device may be sealed with a sealing material while the main terminals of the switching elements are inserted into the insertion holes.
  • a vehicle is provided in a third aspect of the present invention.
  • a vehicle may include the power conversion device of the second aspect.
  • the vehicle may include a motor driven by AC power output from the power conversion device.
  • FIG. 1 shows a power conversion device 1 according to an embodiment.
  • a first modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown.
  • a second modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown.
  • a third modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown.
  • a fourth modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown.
  • a of power converters which concern on a 5th modification are shown.
  • FIG. 1 shows a power converter 1 according to this embodiment.
  • the power conversion device 1 is a device that converts the supplied power into different power and outputs it, and in this embodiment, as an example, it is an inverter that converts the supplied DC power into three-phase AC power and outputs it.
  • the XYZ directions in the drawing are directions orthogonal to each other, and in the present embodiment, as an example, the Z direction is the direction from the front side to the back side of the paper surface of the drawing.
  • the power conversion device 1 includes a housing 10 , a plurality of pairs of switching elements 2 , an input/output connector 3 , a control board 4 , a capacitor device 5 and microchannels 6 .
  • the power electronics device 1 may further include a sensor that measures internal current and voltage.
  • the housing part 10 is formed in a rectangular parallelepiped shape.
  • the housing portion 10 may house the switching element 2 , the control board 4 , the capacitor device 5 and the microchannel 6 .
  • Each pair of switching elements 2 is electrically connected in series between a positive power supply line and a negative power supply line (not shown) to form upper and lower arms of power converter 1 .
  • the positive power supply line and the negative power supply line may be arranged inside the casing 10 at the ends on the front side and the back side of the paper surface of the drawing, and the switching element of the upper arm. 2 and the switching element 2 of the lower arm may be arranged so as to be aligned in the Z direction.
  • Each switching element 2 may be a semiconductor switch, and is an IGBT as an example in this embodiment.
  • the power conversion device 1 includes a pair of switching elements 2 for each phase, in other words, a total of three pairs of switching elements 2 .
  • These three pairs of switching elements 2 may be provided in a single semiconductor package 20 for each pair.
  • Each semiconductor package 20 may be arranged so that the switching elements 2 of the upper arms are arranged on the front side of the drawing and the switching elements 2 of the lower arms are arranged on the back side of the drawing.
  • Each semiconductor package 20 may have a power supply connection terminal (not shown) connected to the positive power supply line at the end on the front side of the drawing, and this power supply connection terminal is the switching element of the upper arm. 2 positive terminals (collector terminals as an example in this embodiment).
  • each semiconductor package 20 may have a power supply side connection terminal (not shown) connected to the negative side power supply line at the end on the back side of the drawing, and this power supply side connection terminal is provided on the lower arm. It may be electrically connected to the negative terminal of the switching element 2 (the emitter terminal as an example in this embodiment).
  • each semiconductor package 20 is arranged extending in the X direction, and may have a connection terminal 21 for the capacitor device 5 at the left end in the drawing.
  • each semiconductor package 20 may have two columnar connection terminals 21 arranged side by side in the Z direction. At least an outer surface has a conductor electrically connected to the collector terminal of the switching element 2, and the connection terminal 21 on the back side of the paper has at least a conductor electrically connected to the emitter terminal of the switching element 2 on the lower arm. It may have on the outer surface.
  • each semiconductor package 20 may have an AC power output terminal 22 at the right end in the drawing.
  • the output terminal 22 may protrude outside the semiconductor package 20 from the connection point between the switching elements 2 forming the upper and lower arms, and may be electrically connected to the input/output connector 3 .
  • a conductive path 30 may be provided between the output terminal 22 and the input/output connector 3 .
  • the semiconductor packages 20 may be arranged side by side in the Z direction in the drawing, or may be arranged side by side in the Y direction.
  • the input/output connector 3 is provided through the housing 10 , receives DC power from a battery (not shown), and outputs AC power generated by the power converter 1 .
  • the input/output connector 3 may supply DC power from the battery to each pair of switching elements 2 via the positive power line and the negative power line. Further, the input/output connector 3 may supply AC power output from the output terminal 22 of the semiconductor package 20 of each phase to a motor (not shown).
  • the input/output connector 3 may also receive signals from the outside and supply them to the control board 4 .
  • the control board 4 has a control circuit 40 that controls each switching element 2 .
  • the control circuit 40 may be electrically connected to the gate terminal of each switching element 2 via the conductive path 40 .
  • the control circuit 40 may drive the gate terminal of each switching element 2 based on a signal externally input via the input/output connector 3 .
  • the capacitor device 5 has a capacitor body 50 , a housing portion 51 , an insertion hole portion 52 and connection terminals 53 .
  • the capacitor body 50 may be a capacitor element for surface mounting, and may have terminal pairs on the bottom surface. The terminal pairs may be arranged side by side in the Z direction.
  • Capacitor body 50 may be a film capacitor and may have a plastic film as a dielectric.
  • the capacitor body 50 may be a wound type film capacitor or a laminated type film capacitor, and the winding direction and lamination direction may be any of the XYZ directions.
  • the housing part 51 accommodates the capacitor body 50 .
  • the housing part 51 may be insulative, and as an example, may be formed in a rectangular parallelepiped shape from an insulative resin.
  • An insertion hole portion 52 may be formed in the side surface of the housing portion 51 on the side of the semiconductor package 20 (in this embodiment, the center portion of the side surface as an example).
  • the insertion hole portion 52 is a hole portion into which an external terminal is inserted.
  • the main terminal of the switching element 2 may be inserted into the insertion hole portion 52 .
  • An insertion hole 52 may be formed in each arm of the power conversion device 1 in the capacitor device 5 according to this embodiment, and in this embodiment, as an example, a total of six insertion holes 52 may be formed.
  • the collector terminal of the switching element 2 forming the upper arm or the emitter terminal of the switching element 2 forming the lower arm of each pair of switching elements 2 may be inserted into each insertion hole 52 .
  • the connection terminal 53 is an example of a first connection terminal, and is provided on the inner surface of the insertion hole portion 52 .
  • the capacitor device 5 according to the present embodiment includes a connection terminal 53 electrically connected to one terminal pair of the capacitor body 50 and a connection terminal 53 electrically connected to the other terminal pair. you can These connection terminals 53 may each extend to the insertion hole portion 52 and be exposed on the inner surface of the insertion hole portion 52 (the bottom surface as an example in this embodiment).
  • the two connection terminals 53 connected to the terminal pairs of the capacitor body 50 may be provided in separate insertion holes 52 .
  • the connection terminal 53 may be provided in a straight line inside the housing portion 51, or may be provided in a bent shape.
  • the connection terminal 53 may be electrically connected to an external terminal (the connection terminal 21 of the semiconductor package 20 as an example in this embodiment) inserted into the insertion hole 52 .
  • the capacitor device 5 may further have other connection terminals (not shown, also referred to as power supply side connection terminals) exposed on the outer surface of the capacitor device 5 .
  • the power supply side connection terminal is an example of a second connection terminal, and may be electrically connected to an external terminal different from the external terminal inserted into the insertion hole 52 .
  • the power-side connection terminal may be electrically connected to a positive power line and a negative power line connected to a bus bar or a wire harness as an external terminal.
  • the busbars and wire harnesses may be fixed to the power supply side connection terminals using fixing members such as screws.
  • the power supply side connection terminal connected to the positive power supply line is electrically connected inside the casing 51 to the connection terminal 53 electrically connected to one of the terminal pairs of the capacitor body 50 .
  • the power supply side connection terminal connected to the negative power supply line is electrically connected inside the casing 51 to the connection terminal 53 electrically connected to the other of the terminal pair of the capacitor body 50 . good.
  • the capacitor device 5 may be sealed with a sealing material (not shown) with the main terminals of the switching element 2 inserted into the insertion holes 52 .
  • a sealing material (not shown) with the main terminals of the switching element 2 inserted into the insertion holes 52 .
  • the capacitor device 5 side of the internal space of the casing 10 may be sealed with a sealant.
  • the switching element 2, the input/output connector 3, the control board 5, the microchannel 6, and the like are assembled, the internal space of the casing 10 may be sealed with a sealant.
  • the sealant may be a conventionally known resin material.
  • the microchannel 6 is a flow path through which a fluid such as water supplied from a cooler (not shown) flows, and is arranged in contact with the semiconductor package 20 or the like.
  • the fluid may flow in the Z direction in the microchannel 6 as an example.
  • connection terminals 53 of the capacitor device 5 are provided on the inner surface of the insertion hole portion 52 and electrically connected to external terminals (connection terminals 21 of the semiconductor package 20 as an example in this embodiment). Therefore, the connecting portion between the capacitor device 5 and the connecting terminal 21 can be reliably insulated from other portions. In addition, since the connection portion is not positioned outside the capacitor device 5, the circuit device using the capacitor device 5 (the power conversion device 1 as an example in the present embodiment) can be space-saving.
  • busbars electrically connected to the positive power line and the negative power line and the power supply side connection terminals electrically connected to the wire harnesses are exposed on the outer surface of the capacitor device 5, the busbars and wire harnesses are not connected to the power supply side. It can be physically fixed to the connection terminal.
  • the capacitor body 50 has a plastic film as a dielectric, the high-frequency characteristics and temperature characteristics of the capacitor device 5 can be improved and the life can be extended compared to the case of having other dielectrics such as ceramics.
  • the surge power generated by switching can be absorbed by the capacitor device 5 and the elements of the power conversion device 1 can be protected.
  • the collector terminal of the switching element 2 forming the upper arm or the emitter terminal of the switching element 2 forming the lower arm is inserted into each insertion hole 52, the surge power generated by switching is reliably absorbed by the capacitor device 5. can be absorbed and the elements of the power conversion device 1 can be protected.
  • the positive power line and the negative power line are electrically connected to the capacitor device 5 . can be reliably connected.
  • the capacitor device 5 is sealed with the main terminals of the switching element 2 inserted into the insertion hole portions 52 , the state in which the main terminals of the switching element 2 are inserted into the insertion hole portions 52 of the capacitor device 5 is It is possible to hold and electrically connect the capacitor device 5 and the switching element 2 reliably. Moreover, the vibration resistance of the connecting portion between the capacitor device 5 and the switching element 2 can be improved.
  • FIG. 2 shows a first modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 . 2 through FIG. 5, which will be described later, the capacitor device 5 and the semiconductor package 20 are partially enlarged.
  • the insertion hole portion 52 of the capacitor device 5 in this modified example has a pressing portion 520 that presses the connection terminal 21 inserted into the insertion hole portion 52 against the connection terminal 53 .
  • the pressing portion 520 may be provided so as to protrude from the inner surface of the insertion hole portion 52 in a region facing the connection terminal 53 (the upper surface as an example in the present embodiment).
  • the pressing portion 520 may be provided in a semicircular shape in a cross section along the insertion direction of the connection terminal 21 (an XY plane as an example in the present embodiment).
  • the pressing portions 520 may be formed in a hemispherical shape and provided scattered in the Z direction, or may be formed in a semi-cylindrical shape and provided to extend in the Z direction.
  • connection terminals 21 of the semiconductor package 20 in this modified example have recesses 210 that engage with the pressing portions 520 on their upper surfaces.
  • the concave portion 210 may be formed in a shape corresponding to the pressing portion 520 .
  • the depth of the concave portion 200 may be smaller than the height of the pressing portion 520 .
  • connection terminals 21 of the semiconductor package 20 inserted into the insertion holes 52 are pressed against the connection terminals 53, the connection terminals 21 and 53 are reliably electrically connected. can do. Moreover, it is possible to prevent the connection terminal 21 from slipping out of the insertion hole portion 52 .
  • FIG. 3 shows a second modification of the connecting portion between the capacitor device 5 and the semiconductor package 20.
  • the insertion hole portion 52 of the capacitor device 5 in this modification has a pressing portion 520A that presses the connection terminal 21 inserted into the insertion hole portion 52 against the connection terminal 53 .
  • the pressing portion 520A may be provided in a region of the inner surface of the insertion hole portion 52 facing the connection terminal 53 (the upper surface as an example in the present embodiment).
  • the pressing portion 520 ⁇ /b>A in this modified example may form an inclined surface that protrudes toward the connection terminal 53 toward the inner side of the insertion hole portion 52 .
  • the connection terminal 21 inserted into the insertion hole portion 52 is pressed toward the connection terminal 53 by the pressing portion 520A.
  • FIG. 5 shows a fourth modification of the connecting portion between the capacitor device 5 and the semiconductor package 20.
  • the connection terminal 21 of the semiconductor package 20 in this modified example has a deformable portion 211 that deforms according to insertion into the insertion hole portion 52 .
  • the deformation portion 211 may be plastically deformed or elastically deformed.
  • the deformable portion 211 may be formed in the shape of a leaf spring and elastically deformed.
  • FIG. 6 shows a power converter 1A according to a fifth modification.
  • a power conversion device 1A according to this modification includes a semiconductor package 20A and a capacitor device 5A.
  • the semiconductor package 20A is arranged extending in the Y direction, and has connection terminals 21 protruding toward the capacitor device 5 at its lower end in the figure, and an input/output connector 3 at its upper end in the figure. may have an output terminal 22 protruding on the side of the .
  • the capacitor device 5A may have an insertion hole portion 52 at the lower end portion of the side surface of the housing portion 51 on the semiconductor package 20 side.
  • the capacitor main body 50 is larger than the housing portion as compared with the case where the insertion hole portion 52 is provided at the central portion (see FIG. 1).
  • the capacitance of the capacitor device 5 can be increased.
  • the power conversion device 1 has been described as having one pair of switching elements 2 for each phase. good.
  • the power converter 1 may be provided with a plurality of semiconductor packages 20 for each phase.
  • the semiconductor packages 20 for each phase may be arranged side by side in the Y direction of FIG. 1 or may be arranged side by side in the Z direction.
  • the power conversion device 1 has been described as a three-phase AC output inverter, and multiple pairs of switching elements 2 forming upper and lower arms are connected in series between the positive power line and the negative power line.
  • the power converter 1 may be an inverter with a single-phase AC output. In this case, at least one pair of switching elements 2 forming upper and lower arms may be connected in series between the positive power supply line and the negative power supply line.
  • the power conversion device 1 may be a type of power conversion device other than an inverter, and in this case, at least one switching element 2 may be connected between the positive power line and the negative power line.
  • the power conversion device 1 may be a rectifier, and in this case, the switching element 2 may not be provided in the power conversion device 1 .
  • each semiconductor package 20 may have the conductors of the two connection terminals 21 insulated from each other on the outer surface of one columnar member.
  • the two connection terminals 21 may be provided on a common surface (the lower surface as an example) of the columnar member, or may be provided on separate surfaces.
  • capacitor device 5 has been described as having power supply side connection terminals exposed to the outside, it may not have power supply side connection terminals.
  • the main terminal of the switching element 2 is inserted into the insertion hole portion 52 of the capacitor device 5
  • other terminals may be inserted in addition to or instead of this.
  • an external terminal electrically connected to the positive power line and the negative power line may be inserted into the insertion hole 52 .
  • the capacitor device 5 has been described as having a single capacitor body 50 , it may have a plurality of capacitor bodies 50 . As an example, the capacitor device 5 may have a capacitor body 50 for each semiconductor package 20 .

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inverter Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

There is a growing need for saving space for circuit apparatuses comprising a capacitor apparatus. Provided is a capacitor apparatus comprising an insertion hole portion into which an external terminal is inserted, and a first connection terminal provided on an inner surface of the insertion hole portion to electrically connect to the external terminal. The insertion hole portion includes a pressing portion for pressing the external terminal inserted into the insertion hole portion against the first connection terminal. The capacitor apparatus further comprises a second connection terminal exposed on an outer surface of the capacitor apparatus to electrically connect to another external terminal.

Description

コンデンサ装置、電力変換装置および車両Capacitor device, power conversion device and vehicle
　本発明は、コンデンサ装置、電力変換装置および車両に関する。 The present invention relates to a capacitor device, a power conversion device and a vehicle.
　従来、コンデンサ装置は外部で他の回路部分の端子と電気的に接続されている（例えば特許文献１，２参照）。
　特許文献１　特開２０１５－１５４５８６号公報
　特許文献２　国際公開２０１９／２３９７７１号公報 Conventionally, capacitor devices are electrically connected externally to terminals of other circuit parts (see Patent Documents 1 and 2, for example).
Patent Document 1: JP-A-2015-154586 Patent Document 2: International Publication 2019/239771
解決しようとする課題Problem to be solved
　近年、コンデンサ装置を備える回路装置に対する省スペース化の要望が高まっている。 In recent years, there has been an increasing demand for space-saving circuit devices equipped with capacitor devices.
一般的開示General disclosure
　上記課題を解決するために、本発明の第１の態様においては、コンデンサ装置が提供される。コンデンサ装置は、外部端子が挿入される挿入孔部を備えてよい。コンデンサ装置は、挿入孔部の内面に設けられて、外部端子と電気的に接続する第１接続端子を備えてよい。 In order to solve the above problems, the first aspect of the present invention provides a capacitor device. The capacitor device may have insertion holes into which external terminals are inserted. The capacitor device may include a first connection terminal provided on the inner surface of the insertion hole and electrically connected to the external terminal.
　挿入孔部は、当該挿入孔部に挿入された外部端子を第１接続端子に押圧する押圧部を有してよい。 The insertion hole portion may have a pressing portion that presses the external terminal inserted into the insertion hole portion against the first connection terminal.
　挿入孔部は、第１接続端子と外部端子とに接着する導電性接着剤を内部に有してよい。 The insertion hole may have therein a conductive adhesive that adheres to the first connection terminal and the external terminal.
　コンデンサ装置は、当該コンデンサ装置の外面に露出して他の外部端子と電気的に接続する第２接続端子をさらに備えてよい。 The capacitor device may further include a second connection terminal exposed on the outer surface of the capacitor device and electrically connected to another external terminal.
　コンデンサ装置は、コンデンサ本体を備えてよい。コンデンサ装置は、コンデンサ本体を収容し、挿入孔部が形成された筐体部を備えてよい。 The capacitor device may include a capacitor body. The capacitor device may include a housing portion that accommodates the capacitor body and has an insertion hole formed therein.
　コンデンサ本体は、誘電体としてプラスチックフィルムを有してよい。 The capacitor body may have a plastic film as a dielectric.
　本発明の第２の態様においては、電力変換装置が提供される。電力変換装置は、第１の態様のコンデンサ装置を備えてよい。 A power converter is provided in a second aspect of the present invention. A power conversion device may comprise the capacitor device of the first aspect.
　電力変換装置は、正側電源線および負側電源線の間に電気的に接続された少なくとも１つのスイッチング素子をさらに備えてよい。挿入孔部には、スイッチング素子の主端子が挿入されてよい。 The power converter may further include at least one switching element electrically connected between the positive power line and the negative power line. A main terminal of the switching element may be inserted into the insertion hole.
　電力変換装置は、正側電源線および負側電源線の間に直列に接続されて当該電力変換装置の上下のアームをなす少なくとも１対のスイッチング素子を備えてよい。コンデンサ装置は、アームごとに挿入孔部を有してよい。各挿入孔部には、各対のスイッチング素子のうち、上アームをなすスイッチング素子の正側端子、または、下アームをなすスイッチング素子の負側端子が挿入されてよい。 The power converter may include at least one pair of switching elements connected in series between the positive power line and the negative power line to form upper and lower arms of the power converter. The capacitor device may have an insertion hole for each arm. The positive terminal of the switching element forming the upper arm or the negative terminal of the switching element forming the lower arm of each pair of switching elements may be inserted into each insertion hole.
　少なくとも１対のスイッチング素子は、対ごとに単一の半導体パッケージに具備されてよい。 At least one pair of switching elements may be provided in a single semiconductor package for each pair.
　コンデンサ装置は、外面に露出して正側電源線および負側電源線と電気的に接続する第２接続端子をさらに有してよい。 The capacitor device may further have a second connection terminal exposed on the outer surface and electrically connected to the positive power line and the negative power line.
　コンデンサ装置は、挿入孔部にスイッチング素子の主端子が挿入された状態で、封止材により封止されてよい。 The capacitor device may be sealed with a sealing material while the main terminals of the switching elements are inserted into the insertion holes.
　本発明の第３の態様においては、車両が提供される。車両は、第２の態様の電力変換装置を備えてよい。車両は、電力変換装置から出力される交流電力により駆動されるモータを備えてよい。 A vehicle is provided in a third aspect of the present invention. A vehicle may include the power conversion device of the second aspect. The vehicle may include a motor driven by AC power output from the power conversion device.
　なお、上記の発明の概要は、本発明の必要な特徴の全てを列挙したものではない。また、これらの特徴群のサブコンビネーションもまた、発明となりうる。 It should be noted that the above outline of the invention does not list all the necessary features of the present invention. Subcombinations of these feature groups can also be inventions.
実施形態に係る電力変換装置１を示す。1 shows a power conversion device 1 according to an embodiment. コンデンサ装置５と、半導体パッケージ２０との接続部分の第１変形例を示す。A first modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown. コンデンサ装置５と、半導体パッケージ２０との接続部分の第２変形例を示す。A second modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown. コンデンサ装置５と、半導体パッケージ２０との接続部分の第３変形例を示す。A third modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown. コンデンサ装置５と、半導体パッケージ２０との接続部分の第４変形例を示す。A fourth modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 is shown. 第５の変形例に係る電力変換装置１Ａを示す。1 A of power converters which concern on a 5th modification are shown.
　以下、発明の実施の形態を通じて本発明を説明するが、以下の実施形態は請求の範囲にかかる発明を限定するものではない。また、実施形態の中で説明されている特徴の組み合わせの全てが発明の解決手段に必須であるとは限らない。 Although the present invention will be described below through embodiments of the invention, the following embodiments do not limit the invention according to the scope of claims. Also, not all combinations of features described in the embodiments are essential for the solution of the invention.
　［１．電力変換装置］
　図１は、本実施形態に係る電力変換装置１を示す。電力変換装置１は、供給される電力を異なる電力に変換して出力する装置であり、本実施形態では一例として、供給される直流電力を３相の交流電力に変換して出力するインバータである。なお、図中のＸＹＺ方向は互いに直交する方向であり、本実施形態では一例としてＺ方向は図の紙面の表面側から裏面側に向かう方向である。 [1. power converter]
FIG. 1 shows a power converter 1 according to this embodiment. The power conversion device 1 is a device that converts the supplied power into different power and outputs it, and in this embodiment, as an example, it is an inverter that converts the supplied DC power into three-phase AC power and outputs it. . Note that the XYZ directions in the drawing are directions orthogonal to each other, and in the present embodiment, as an example, the Z direction is the direction from the front side to the back side of the paper surface of the drawing.
　電力変換装置１は、筐体部１０と、複数対のスイッチング素子２と、入出力コネクタ３と、制御基板４と、コンデンサ装置５と、マイクロチャネル６とを備える。電力変換装置１は、内部の電流や電圧を測定するセンサをさらに備えてもよい。 The power conversion device 1 includes a housing 10 , a plurality of pairs of switching elements 2 , an input/output connector 3 , a control board 4 , a capacitor device 5 and microchannels 6 . The power electronics device 1 may further include a sensor that measures internal current and voltage.
　［１．１．筐体部１０］
　筐体部１０は、直方体状に形成されている。筐体部１０は、スイッチング素子２と、制御基板４と、コンデンサ装置５と、マイクロチャネル６とを収容してよい。 [1.1. Case part 10]
The housing part 10 is formed in a rectangular parallelepiped shape. The housing portion 10 may house the switching element 2 , the control board 4 , the capacitor device 5 and the microchannel 6 .
　［１．２．スイッチング素子２］
　各対のスイッチング素子２は、図示しない正側電源線および負側電源線の間に電気的に直列に接続されて、電力変換装置１の上下のアームをなす。本実施形態においては一例として、正側電源線，負側電源線は筐体部１０の内部のうち、図の紙面の表面側，裏面側の端部に配置されてよく、上アームのスイッチング素子２と下アームのスイッチング素子２とは互いにＺ方向に並ぶように配置されてよい。各スイッチング素子２は半導体スイッチであってよく、本実施形態においては一例としてＩＧＢＴである。 [1.2. switching element 2]
Each pair of switching elements 2 is electrically connected in series between a positive power supply line and a negative power supply line (not shown) to form upper and lower arms of power converter 1 . In this embodiment, as an example, the positive power supply line and the negative power supply line may be arranged inside the casing 10 at the ends on the front side and the back side of the paper surface of the drawing, and the switching element of the upper arm. 2 and the switching element 2 of the lower arm may be arranged so as to be aligned in the Z direction. Each switching element 2 may be a semiconductor switch, and is an IGBT as an example in this embodiment.
　ここで、本実施形態においては一例として電力変換装置１は相ごとに１対のスイッチング素子２を備えており、別言すれば、計３対のスイッチング素子２を備えている。これら３対のスイッチング素子２は、対ごとに単一の半導体パッケージ２０に具備されてよい。 Here, in this embodiment, as an example, the power conversion device 1 includes a pair of switching elements 2 for each phase, in other words, a total of three pairs of switching elements 2 . These three pairs of switching elements 2 may be provided in a single semiconductor package 20 for each pair.
　各半導体パッケージ２０は、上アームのスイッチング素子２が図の紙面の表面側、下アームのスイッチング素子２が紙面の裏面側に並ぶように配置されてよい。各半導体パッケージ２０は、正側電源線に接続される電源側接続端子（図示せず）を図の紙面の表面側の端部に有してよく、この電源側接続端子は上アームのスイッチング素子２の正側端子（本実施形態においては一例としてコレクタ端子）と電気的に接続されてよい。また、各半導体パッケージ２０は、負側電源線に接続される電源側接続端子（図示せず）を図の紙面の裏面側の端部に有してよく、この電源側接続端子は下アームのスイッチング素子２の負側端子（本実施形態においては一例としてエミッタ端子）と電気的に接続されてよい。 Each semiconductor package 20 may be arranged so that the switching elements 2 of the upper arms are arranged on the front side of the drawing and the switching elements 2 of the lower arms are arranged on the back side of the drawing. Each semiconductor package 20 may have a power supply connection terminal (not shown) connected to the positive power supply line at the end on the front side of the drawing, and this power supply connection terminal is the switching element of the upper arm. 2 positive terminals (collector terminals as an example in this embodiment). In addition, each semiconductor package 20 may have a power supply side connection terminal (not shown) connected to the negative side power supply line at the end on the back side of the drawing, and this power supply side connection terminal is provided on the lower arm. It may be electrically connected to the negative terminal of the switching element 2 (the emitter terminal as an example in this embodiment).
　また、各半導体パッケージ２０は、Ｘ方向に延在して配置されており、図中の左側の端部に、コンデンサ装置５に対する接続端子２１を有してよい。本実施形態においては一例として、各半導体パッケージ２０は、Ｚ方向に並んで配置された２つの柱状の接続端子２１を有してよく、このうち紙面の表面側の接続端子２１は、上アームのスイッチング素子２のコレクタ端子と電気的に接続された導体を少なくとも外面に有し、紙面の裏面側の接続端子２１は、下アームのスイッチング素子２のエミッタ端子と電気的に接続された導体を少なくとも外面に有してよい。 Also, each semiconductor package 20 is arranged extending in the X direction, and may have a connection terminal 21 for the capacitor device 5 at the left end in the drawing. In this embodiment, as an example, each semiconductor package 20 may have two columnar connection terminals 21 arranged side by side in the Z direction. At least an outer surface has a conductor electrically connected to the collector terminal of the switching element 2, and the connection terminal 21 on the back side of the paper has at least a conductor electrically connected to the emitter terminal of the switching element 2 on the lower arm. It may have on the outer surface.
　また、各半導体パッケージ２０は、図中の右側の端部に交流電力の出力端子２２を有してよい。出力端子２２は上下アームをなすスイッチング素子２どうしの接続点から半導体パッケージ２０の外部に突設されてよく、入出力コネクタ３に対して電気的に接続されてよい。出力端子２２と入出力コネクタ３との間には導電経路３０が設けられてよい。 Also, each semiconductor package 20 may have an AC power output terminal 22 at the right end in the drawing. The output terminal 22 may protrude outside the semiconductor package 20 from the connection point between the switching elements 2 forming the upper and lower arms, and may be electrically connected to the input/output connector 3 . A conductive path 30 may be provided between the output terminal 22 and the input/output connector 3 .
　なお、各半導体パッケージ２０は、図中のＺ方向に並んで配置されてもよいし、Ｙ方向に並んで配置されてもよい。 The semiconductor packages 20 may be arranged side by side in the Z direction in the drawing, or may be arranged side by side in the Y direction.
　［１．３．入出力コネクタ３］
　入出力コネクタ３は、筐体部１０を貫通して設けられ、図示しないバッテリから直流電力の供給を受け、電力変換装置１によって生成された交流電力を出力する。入出力コネクタ３は、正側電源線および負側電源線を介してバッテリからの直流電力を各対のスイッチング素子２に供給してよい。また、入出力コネクタ３は、各相の半導体パッケージ２０の出力端子２２から出力される交流電力を、図示しないモータに供給してよい。入出力コネクタ３は、さらに外部から信号を受信して制御基板４に供給してよい。 [1.3. Input/output connector 3]
The input/output connector 3 is provided through the housing 10 , receives DC power from a battery (not shown), and outputs AC power generated by the power converter 1 . The input/output connector 3 may supply DC power from the battery to each pair of switching elements 2 via the positive power line and the negative power line. Further, the input/output connector 3 may supply AC power output from the output terminal 22 of the semiconductor package 20 of each phase to a motor (not shown). The input/output connector 3 may also receive signals from the outside and supply them to the control board 4 .
　［１．４．制御基板４］
　制御基板４は、各スイッチング素子２を制御する制御回路４０を有する。制御回路４０は、導電経路４０を介して各スイッチング素子２のゲート端子と電気的に接続されてよい。制御回路４０は、入出力コネクタ３を介して外部から入力される信号に基づいて、各スイッチング素子２のゲート端子を駆動してよい。 [1.4. Control board 4]
The control board 4 has a control circuit 40 that controls each switching element 2 . The control circuit 40 may be electrically connected to the gate terminal of each switching element 2 via the conductive path 40 . The control circuit 40 may drive the gate terminal of each switching element 2 based on a signal externally input via the input/output connector 3 .
　［１．５．コンデンサ装置５］
　コンデンサ装置５は、コンデンサ本体５０と、筐体部５１と、挿入孔部５２と、接続端子５３とを有する。 [1.5. Capacitor device 5]
The capacitor device 5 has a capacitor body 50 , a housing portion 51 , an insertion hole portion 52 and connection terminals 53 .
　コンデンサ本体５０は、表面実装用のコンデンサ素子であってよく、底面に端子対を有してよい。端子対は、Ｚ方向に並んで配置されてよい。コンデンサ本体５０は、フィルムコンデンサであってよく、誘電体としてプラスチックフィルムを有してよい。コンデンサ本体５０は、卷回型のフィルムコンデンサであってもよいし、積層型のフィルムコンデンサであってもよく、卷回方向や積層方向はＸＹＺ方向の何れであってもよい。 The capacitor body 50 may be a capacitor element for surface mounting, and may have terminal pairs on the bottom surface. The terminal pairs may be arranged side by side in the Z direction. Capacitor body 50 may be a film capacitor and may have a plastic film as a dielectric. The capacitor body 50 may be a wound type film capacitor or a laminated type film capacitor, and the winding direction and lamination direction may be any of the XYZ directions.
　筐体部５１は、コンデンサ本体５０を収容する。筐体部５１は、絶縁性であってよく、一例として絶縁性の樹脂によって直方体状に形成されてよい。筐体部５１における半導体パッケージ２０側の側面（本実施形態においては一例として側面の中央部）には、挿入孔部５２が形成されてよい。 The housing part 51 accommodates the capacitor body 50 . The housing part 51 may be insulative, and as an example, may be formed in a rectangular parallelepiped shape from an insulative resin. An insertion hole portion 52 may be formed in the side surface of the housing portion 51 on the side of the semiconductor package 20 (in this embodiment, the center portion of the side surface as an example).
　挿入孔部５２は、外部端子が挿入される孔部である。例えば、挿入孔部５２には、スイッチング素子２の主端子が挿入されてよい。本実施形態に係るコンデンサ装置５には、電力変換装置１のアームごとに挿入孔部５２が形成されてよく、本実施形態においては一例として、計６つの挿入孔部５２が形成されてよい。各挿入孔部５２には、各対のスイッチング素子２のうち、上アームをなすスイッチング素子２のコレクタ端子、または、下アームをなすスイッチング素子２のエミッタ端子が挿入されてよい。 The insertion hole portion 52 is a hole portion into which an external terminal is inserted. For example, the main terminal of the switching element 2 may be inserted into the insertion hole portion 52 . An insertion hole 52 may be formed in each arm of the power conversion device 1 in the capacitor device 5 according to this embodiment, and in this embodiment, as an example, a total of six insertion holes 52 may be formed. The collector terminal of the switching element 2 forming the upper arm or the emitter terminal of the switching element 2 forming the lower arm of each pair of switching elements 2 may be inserted into each insertion hole 52 .
　ここで、スイッチング素子２の主端子が挿入されるとは、主端子が間接的に挿入されることであってもよく、主端子と電気的に接続された端子が挿入されることであってもよい。本実施形態においては一例として、挿入孔部５２には半導体パッケージ２０の接続端子２１が挿入される。挿入孔部５２は、接続端子２１と係合する形状に形成されてよく、本実施形態においては一例として柱状の孔部であってよい。 Here, the insertion of the main terminal of the switching element 2 may be the indirect insertion of the main terminal, or the insertion of a terminal electrically connected to the main terminal. good too. In this embodiment, as an example, the connection terminals 21 of the semiconductor package 20 are inserted into the insertion holes 52 . The insertion hole portion 52 may be formed in a shape that engages with the connection terminal 21, and may be a columnar hole portion as an example in the present embodiment.
　接続端子５３は、第１接続端子の一例であり、挿入孔部５２の内面に設けられる。本実施形態に係るコンデンサ装置５には、コンデンサ本体５０の端子対の一方と電気的に接続された接続端子５３と、端子対の他方と電気的に接続された接続端子５３とがそれぞれ具備されてよい。これらの接続端子５３は、それぞれ挿入孔部５２まで延在し、挿入孔部５２の内面（本実施形態においては一例として底面）に露出してよい。コンデンサ本体５０の端子対に接続された２つの接続端子５３は、別々の挿入孔部５２内に設けられてよい。接続端子５３は、筐体部５１の内部で直線状に設けられてもよいし、屈曲して設けられてもよい。接続端子５３は、挿入孔部５２に挿入された外部端子（本実施形態においては一例として半導体パッケージ２０の接続端子２１）と電気的に接続してよい。 The connection terminal 53 is an example of a first connection terminal, and is provided on the inner surface of the insertion hole portion 52 . The capacitor device 5 according to the present embodiment includes a connection terminal 53 electrically connected to one terminal pair of the capacitor body 50 and a connection terminal 53 electrically connected to the other terminal pair. you can These connection terminals 53 may each extend to the insertion hole portion 52 and be exposed on the inner surface of the insertion hole portion 52 (the bottom surface as an example in this embodiment). The two connection terminals 53 connected to the terminal pairs of the capacitor body 50 may be provided in separate insertion holes 52 . The connection terminal 53 may be provided in a straight line inside the housing portion 51, or may be provided in a bent shape. The connection terminal 53 may be electrically connected to an external terminal (the connection terminal 21 of the semiconductor package 20 as an example in this embodiment) inserted into the insertion hole 52 .
　なお、コンデンサ装置５は、コンデンサ装置５の外面に露出する他の接続端子（図示せず。電源側接続端子とも称する）をさらに有してよい。電源側接続端子は、第２接続端子の一例であり、挿入孔部５２に挿入される外部端子とは異なる他の外部端子と電気的に接続してよい。本実施形態においては一例として、電源側接続端子は、バスバーまたはワイヤーハーネスを外部端子として、当該外部端子に接続された正側電源線および負側電源線と電気的に接続してよい。バスバーやワイヤーハーネスは、ねじなどの固定部材を用いて電源側接続端子に固定されてよい。なお、正側電源線に接続された電源側接続端子は、コンデンサ本体５０の端子対の一方と電気的に接続された接続端子５３に対して筐体部５１の内部で電気的に接続されてよく、負側電源線に接続された電源側接続端子は、コンデンサ本体５０の端子対の他方と電気的に接続された接続端子５３に対して筐体部５１の内部で電気的に接続されてよい。 Note that the capacitor device 5 may further have other connection terminals (not shown, also referred to as power supply side connection terminals) exposed on the outer surface of the capacitor device 5 . The power supply side connection terminal is an example of a second connection terminal, and may be electrically connected to an external terminal different from the external terminal inserted into the insertion hole 52 . In this embodiment, as an example, the power-side connection terminal may be electrically connected to a positive power line and a negative power line connected to a bus bar or a wire harness as an external terminal. The busbars and wire harnesses may be fixed to the power supply side connection terminals using fixing members such as screws. The power supply side connection terminal connected to the positive power supply line is electrically connected inside the casing 51 to the connection terminal 53 electrically connected to one of the terminal pairs of the capacitor body 50 . Often, the power supply side connection terminal connected to the negative power supply line is electrically connected inside the casing 51 to the connection terminal 53 electrically connected to the other of the terminal pair of the capacitor body 50 . good.
　また、コンデンサ装置５は、挿入孔部５２にスイッチング素子２の主端子が挿入された状態で、封止材（図示せず）により封止されてよい。例えば、挿入孔部５２にスイッチング素子２の主端子が挿入された状態で、筐体部１０の内部空間のうちコンデンサ装置５の側が封止剤で封止されてもよいし、筐体部１０、スイッチング素子２、入出力コネクタ３、制御基板５およびマイクロチャネル６などが組みつけられた状態で筐体部１０の内部空間が封止剤で封止されてもよい。封止剤は、従来より公知の樹脂材料であってよい。 Also, the capacitor device 5 may be sealed with a sealing material (not shown) with the main terminals of the switching element 2 inserted into the insertion holes 52 . For example, with the main terminal of the switching element 2 inserted into the insertion hole 52, the capacitor device 5 side of the internal space of the casing 10 may be sealed with a sealant. , the switching element 2, the input/output connector 3, the control board 5, the microchannel 6, and the like are assembled, the internal space of the casing 10 may be sealed with a sealant. The sealant may be a conventionally known resin material.
　マイクロチャネル６は、図示しない冷却器から供給される水などの流体を流す流路であり、半導体パッケージ２０などに当接して配置される。本実施形態においては一例としてマイクロチャネル６内にはＺ方向に流体が流れてよい。 The microchannel 6 is a flow path through which a fluid such as water supplied from a cooler (not shown) flows, and is arranged in contact with the semiconductor package 20 or the like. In this embodiment, the fluid may flow in the Z direction in the microchannel 6 as an example.
　以上のコンデンサ装置５によれば、コンデンサ装置５の接続端子５３が挿入孔部５２の内面に設けられて外部端子（本実施形態においては一例として半導体パッケージ２０の接続端子２１）と電気的に接続するので、コンデンサ装置５と接続端子２１との接続部分を他の部分から確実に絶縁することができる。また、接続部分がコンデンサ装置５の外部に位置しないため、コンデンサ装置５を用いる回路装置（本実施形態においては一例として電力変換装置１）を省スペース化することができる。 According to the capacitor device 5 described above, the connection terminals 53 of the capacitor device 5 are provided on the inner surface of the insertion hole portion 52 and electrically connected to external terminals (connection terminals 21 of the semiconductor package 20 as an example in this embodiment). Therefore, the connecting portion between the capacitor device 5 and the connecting terminal 21 can be reliably insulated from other portions. In addition, since the connection portion is not positioned outside the capacitor device 5, the circuit device using the capacitor device 5 (the power conversion device 1 as an example in the present embodiment) can be space-saving.
　また、正側電源線および負側電源線と電気的に接続されたバスバーやワイヤーハーネスと電気的に接続する電源側接続端子がコンデンサ装置５の外面に露出するので、バスバーやワイヤーハーネスを電源側接続端子に対して物理的に固定することができる。 In addition, since the busbars electrically connected to the positive power line and the negative power line and the power supply side connection terminals electrically connected to the wire harnesses are exposed on the outer surface of the capacitor device 5, the busbars and wire harnesses are not connected to the power supply side. It can be physically fixed to the connection terminal.
　また、コンデンサ本体５０が筐体部５１に収容されるので、コンデンサ本体５０を外部から確実に絶縁することができる。 Also, since the capacitor body 50 is accommodated in the housing portion 51, the capacitor body 50 can be reliably insulated from the outside.
　また、コンデンサ本体５０は誘電体としてプラスチックフィルムを有するので、セラミックなど他の誘電体を有する場合と比較して、コンデンサ装置５の高周波特性や温度特性を向上させ、長寿命化することができる。 In addition, since the capacitor body 50 has a plastic film as a dielectric, the high-frequency characteristics and temperature characteristics of the capacitor device 5 can be improved and the life can be extended compared to the case of having other dielectrics such as ceramics.
　また、以上の電力変換装置１によれば、上述のコンデンサ装置５を備えるので、コンデンサ装置５および接続端子２１の間の接続部分と、電力変換装置１の他の部分とを確実に絶縁しつつ、電力変換装置１を省スペース化することができる。 Further, according to the power conversion device 1 described above, since the above-described capacitor device 5 is provided, the connection portion between the capacitor device 5 and the connection terminal 21 is reliably insulated from other portions of the power conversion device 1. , the power converter 1 can be space-saving.
　また、コンデンサ装置５の挿入孔部５２にスイッチング素子２の主端子が挿入されるので、スイッチングによって生じるサージ電力をコンデンサ装置５で吸収し、電力変換装置１の素子を保護することができる。 Also, since the main terminal of the switching element 2 is inserted into the insertion hole 52 of the capacitor device 5 , the surge power generated by switching can be absorbed by the capacitor device 5 and the elements of the power conversion device 1 can be protected.
　また、各挿入孔部５２には、上アームをなすスイッチング素子２のコレクタ端子、または、下アームをなすスイッチング素子２のエミッタ端子が挿入されるので、スイッチングによって生じるサージ電力をコンデンサ装置５で確実に吸収し、電力変換装置１の素子を保護することができる。 In addition, since the collector terminal of the switching element 2 forming the upper arm or the emitter terminal of the switching element 2 forming the lower arm is inserted into each insertion hole 52, the surge power generated by switching is reliably absorbed by the capacitor device 5. can be absorbed and the elements of the power conversion device 1 can be protected.
　また、上下アームの対ごとに２つのスイッチング素子２が単一の半導体パッケージ２０に具備されるので、電力変換装置１の製造を容易化することができる。 Also, since two switching elements 2 are provided in a single semiconductor package 20 for each pair of upper and lower arms, the manufacture of the power converter 1 can be facilitated.
　また、コンデンサ装置５の外面に露出する電源側接続端子が正側電源線および負側電源線と電気的に接続されるので、正側電源線および負側電源線をコンデンサ装置５に対して電気的に確実に接続することができる。 In addition, since the power-side connection terminals exposed on the outer surface of the capacitor device 5 are electrically connected to the positive power line and the negative power line, the positive power line and the negative power line are electrically connected to the capacitor device 5 . can be reliably connected.
　また、挿入孔部５２にスイッチング素子２の主端子が挿入された状態でコンデンサ装置５が封止されるので、コンデンサ装置５の挿入孔部５２にスイッチング素子２の主端子が挿入された状態を保持し、コンデンサ装置５とスイッチング素子２とを電気的に確実に接続することができる。また、コンデンサ装置５と、スイッチング素子２との接続部の耐振動性を向上させることができる。 Further, since the capacitor device 5 is sealed with the main terminals of the switching element 2 inserted into the insertion hole portions 52 , the state in which the main terminals of the switching element 2 are inserted into the insertion hole portions 52 of the capacitor device 5 is It is possible to hold and electrically connect the capacitor device 5 and the switching element 2 reliably. Moreover, the vibration resistance of the connecting portion between the capacitor device 5 and the switching element 2 can be improved.
　［２．電力変換装置の適用例］
　以上の電力変換装置１は、自動車などの車両に搭載されてよい。例えば、車両は、電力変換装置１と、電力変換装置１から出力される交流電力により駆動されるモータとを備えてよい。モータは、車両駆動用やステアリング用、空調用など、任意の用途に用いられてよい。なお、図１のＸＹＺ方向は、それぞれ車両の上下方向や進行方向、幅方向などの何れであってもよい。 [2. Application example of power converter]
The above power conversion device 1 may be mounted in a vehicle such as an automobile. For example, the vehicle may include a power conversion device 1 and a motor driven by AC power output from the power conversion device 1 . The motor may be used for any purpose such as vehicle driving, steering, and air conditioning. Note that the XYZ directions in FIG. 1 may be any of the vertical direction, traveling direction, and width direction of the vehicle.
　［３．接続部分の変形例］
　図２は、コンデンサ装置５と、半導体パッケージ２０との接続部分の第１変形例を示す。なお、図２から後述の図５においては、コンデンサ装置５および半導体パッケージ２０を部分的に拡大して図示している。 [3. Modified example of connection part]
FIG. 2 shows a first modification of the connecting portion between the capacitor device 5 and the semiconductor package 20 . 2 through FIG. 5, which will be described later, the capacitor device 5 and the semiconductor package 20 are partially enlarged.
　本変形例におけるコンデンサ装置５の挿入孔部５２は、当該挿入孔部５２に挿入された接続端子２１を接続端子５３に押圧する押圧部５２０を有する。押圧部５２０は、挿入孔部５２の内面のうち、接続端子５３と対向する領域（本実施形態においては一例として上面）に突出して設けられてよい。例えば、押圧部５２０は、接続端子２１の挿入方向に沿った断面（本実施形態においては一例としてＸＹ平面）において半円状に設けられてよい。押圧部５２０は、半球状に形成されてＺ方向に点在して設けられてもよいし、半円柱状に形成されてＺ方向に延在して設けられてもよい。 The insertion hole portion 52 of the capacitor device 5 in this modified example has a pressing portion 520 that presses the connection terminal 21 inserted into the insertion hole portion 52 against the connection terminal 53 . The pressing portion 520 may be provided so as to protrude from the inner surface of the insertion hole portion 52 in a region facing the connection terminal 53 (the upper surface as an example in the present embodiment). For example, the pressing portion 520 may be provided in a semicircular shape in a cross section along the insertion direction of the connection terminal 21 (an XY plane as an example in the present embodiment). The pressing portions 520 may be formed in a hemispherical shape and provided scattered in the Z direction, or may be formed in a semi-cylindrical shape and provided to extend in the Z direction.
　また、本変形例における半導体パッケージ２０の接続端子２１は、押圧部５２０と係合する凹部２１０を上面に有する。凹部２１０は、押圧部５２０と対応する形状に形成されてよい。但し、凹部２００の深さは、押圧部５２０の高さよりも小さくてよい。これにより、挿入孔部５２に挿入された接続端子２１は、押圧部５２０によって接続端子５３の側に押圧される。 Also, the connection terminals 21 of the semiconductor package 20 in this modified example have recesses 210 that engage with the pressing portions 520 on their upper surfaces. The concave portion 210 may be formed in a shape corresponding to the pressing portion 520 . However, the depth of the concave portion 200 may be smaller than the height of the pressing portion 520 . As a result, the connection terminal 21 inserted into the insertion hole portion 52 is pressed toward the connection terminal 53 by the pressing portion 520 .
　以上の第１変形例によれば、挿入孔部５２に挿入された半導体パッケージ２０の接続端子２１が接続端子５３に押圧されるので、接続端子２１と接続端子５３とを確実に電気的に接続することができる。また、接続端子２１が挿入孔部５２から抜けてしまうのを防止することができる。 According to the first modification described above, since the connection terminals 21 of the semiconductor package 20 inserted into the insertion holes 52 are pressed against the connection terminals 53, the connection terminals 21 and 53 are reliably electrically connected. can do. Moreover, it is possible to prevent the connection terminal 21 from slipping out of the insertion hole portion 52 .
　図３は、コンデンサ装置５と、半導体パッケージ２０との接続部分の第２変形例を示す。本変形例におけるコンデンサ装置５の挿入孔部５２は、当該挿入孔部５２に挿入された接続端子２１を接続端子５３に押圧する押圧部５２０Ａを有する。押圧部５２０Ａは、挿入孔部５２の内面のうち、接続端子５３と対向する領域（本実施形態においては一例として上面）に設けられてよい。本変形例における押圧部５２０Ａは、挿入孔部５２の奥側ほど、接続端子５３の側に迫り出す傾斜面を形成してよい。これにより、挿入孔部５２に挿入された接続端子２１は、押圧部５２０Ａによって接続端子５３の側に押圧される。 FIG. 3 shows a second modification of the connecting portion between the capacitor device 5 and the semiconductor package 20. FIG. The insertion hole portion 52 of the capacitor device 5 in this modification has a pressing portion 520A that presses the connection terminal 21 inserted into the insertion hole portion 52 against the connection terminal 53 . The pressing portion 520A may be provided in a region of the inner surface of the insertion hole portion 52 facing the connection terminal 53 (the upper surface as an example in the present embodiment). The pressing portion 520</b>A in this modified example may form an inclined surface that protrudes toward the connection terminal 53 toward the inner side of the insertion hole portion 52 . As a result, the connection terminal 21 inserted into the insertion hole portion 52 is pressed toward the connection terminal 53 by the pressing portion 520A.
　図４は、コンデンサ装置５と、半導体パッケージ２０との接続部分の第３変形例を示す。本変形例におけるコンデンサ装置５の挿入孔部５２は、コンデンサ装置５の接続端子５３と半導体パッケージ２０の接続端子２１とに接着する導電性接着剤５２１を内部に有してよい。導電性接着剤５２１は、金や銀、銅、ニッケル、アルミ、めっき、カーボン、グラファイトなどの導電フィラーと、エポキシやウレタン、シリコーン、アクリル、ポリイミドなどのバインダーとを有してよい。 FIG. 4 shows a third modification of the connecting portion between the capacitor device 5 and the semiconductor package 20. FIG. The insertion hole portion 52 of the capacitor device 5 in this modification may have therein a conductive adhesive 521 that adheres to the connection terminals 53 of the capacitor device 5 and the connection terminals 21 of the semiconductor package 20 . Conductive adhesive 521 may have conductive fillers such as gold, silver, copper, nickel, aluminum, plating, carbon, and graphite, and binders such as epoxy, urethane, silicone, acrylic, and polyimide.
　以上の第３変形例においては、接続端子５３および接続端子２１に導電性接着剤５２１が接着するので、接続端子２１と接続端子５３とを確実に電気的に接続することができる。また、接続端子２１が挿入孔部５２から抜けてしまうのを防止することができる。 In the third modified example described above, the conductive adhesive 521 adheres to the connection terminal 53 and the connection terminal 21, so that the connection terminal 21 and the connection terminal 53 can be reliably electrically connected. Moreover, it is possible to prevent the connection terminal 21 from slipping out of the insertion hole portion 52 .
　図５は、コンデンサ装置５と、半導体パッケージ２０との接続部分の第４変形例を示す。本変形例における半導体パッケージ２０の接続端子２１は、挿入孔部５２への挿入に応じて変形する変形部２１１を有する。変形部２１１は、塑性変形してもよいし、弾性変形してもよい。本実施形態においては一例として、変形部２１１は、板バネ形状に形成されて弾性変形してよい。 FIG. 5 shows a fourth modification of the connecting portion between the capacitor device 5 and the semiconductor package 20. FIG. The connection terminal 21 of the semiconductor package 20 in this modified example has a deformable portion 211 that deforms according to insertion into the insertion hole portion 52 . The deformation portion 211 may be plastically deformed or elastically deformed. In the present embodiment, as an example, the deformable portion 211 may be formed in the shape of a leaf spring and elastically deformed.
　［４．第５の変形例］
　図６は、第５の変形例に係る電力変換装置１Ａを示す。本変形例に係る電力変換装置１Ａは、半導体パッケージ２０Ａおよびコンデンサ装置５Ａを備える。 [4. Fifth Modification]
FIG. 6 shows a power converter 1A according to a fifth modification. A power conversion device 1A according to this modification includes a semiconductor package 20A and a capacitor device 5A.
　半導体パッケージ２０Ａは、Ｙ方向に延在して配置されており、図中の下端に、コンデンサ装置５の側に突設された接続端子２１を有するとともに、図中の上端に、入出力コネクタ３の側に突設された出力端子２２を有してよい。 The semiconductor package 20A is arranged extending in the Y direction, and has connection terminals 21 protruding toward the capacitor device 5 at its lower end in the figure, and an input/output connector 3 at its upper end in the figure. may have an output terminal 22 protruding on the side of the .
　コンデンサ装置５Ａは、筐体部５１における半導体パッケージ２０側の側面の下端部に挿入孔部５２を有してよい。 The capacitor device 5A may have an insertion hole portion 52 at the lower end portion of the side surface of the housing portion 51 on the semiconductor package 20 side.
　以上の電力変換装置１Ａによれば、挿入孔部５２が筐体部５１の下端部に設けられるので、中央部に設けられる場合（図１参照）と比較して、コンデンサ本体５０が筐体部５１内で占める領域を大きくし、コンデンサ装置５の静電容量を大きくすることができる。 According to the power conversion device 1A described above, since the insertion hole portion 52 is provided at the lower end portion of the housing portion 51, the capacitor main body 50 is larger than the housing portion as compared with the case where the insertion hole portion 52 is provided at the central portion (see FIG. 1). By increasing the area occupied within 51, the capacitance of the capacitor device 5 can be increased.
　［５．その他の変形例］
　なお、上記の実施形態および変形例においては、電力変換装置１には相ごとに１対のスイッチング素子２が具備されることとして説明したが、相ごとに複数対のスイッチング素子が具備されてもよい。別言すれば、電力変換装置１には、相ごとに複数の半導体パッケージ２０が具備されてよい。相ごとの半導体パッケージ２０は、図１のＹ方向に並んで配置されてもよいし、Ｚ方向に並んで配置されてもよい。 [5. Other Modifications]
In the above embodiments and modifications, the power conversion device 1 has been described as having one pair of switching elements 2 for each phase. good. In other words, the power converter 1 may be provided with a plurality of semiconductor packages 20 for each phase. The semiconductor packages 20 for each phase may be arranged side by side in the Y direction of FIG. 1 or may be arranged side by side in the Z direction.
　また、電力変換装置１を３相交流出力のインバータとして説明し、上下アームをなす複数対のスイッチング素子２が正側電源線および負側電源線の間に直列に接続されることとして説明したが、電力変換装置１を単相交流出力のインバータとしてもよい。この場合には、上下アームをなす少なくとも１対のスイッチング素子２が正側電源線および負側電源線の間に直列に接続されてよい。また、電力変換装置１はインバータとは異なる種類の電力変換装置であってもよく、この場合には少なくとも１つのスイッチング素子２が正側電源線および負側電源線の間に接続されてよい。但し、電力変換装置１は整流器であってもよく、この場合にはスイッチング素子２が電力変換装置１に具備されなくてもよい。 Also, the power conversion device 1 has been described as a three-phase AC output inverter, and multiple pairs of switching elements 2 forming upper and lower arms are connected in series between the positive power line and the negative power line. , the power converter 1 may be an inverter with a single-phase AC output. In this case, at least one pair of switching elements 2 forming upper and lower arms may be connected in series between the positive power supply line and the negative power supply line. Also, the power conversion device 1 may be a type of power conversion device other than an inverter, and in this case, at least one switching element 2 may be connected between the positive power line and the negative power line. However, the power conversion device 1 may be a rectifier, and in this case, the switching element 2 may not be provided in the power conversion device 1 .
　また、コンデンサ装置５は、アームごとに１つの挿入孔部５２を有することとして説明したが、アーム対ごと、つまりレッグごとに１つの挿入孔部５２を有することとしてもよい。この場合には、挿入孔部５２の内面には、コンデンサ本体５０の端子対に接続された２つの接続端子がそれぞれ露出してよい。この場合には、各半導体パッケージ２０は２つの接続端子２１の導体を互いに絶縁された状態で１本の柱状部材の外面に有してよい。２つの接続端子２１は、柱状部材の共通の面（一例として下面）に設けられてもよいし、別々の面に設けられてもよい。 Also, although the capacitor device 5 has been described as having one insertion hole 52 for each arm, it may have one insertion hole 52 for each pair of arms, that is, for each leg. In this case, two connection terminals connected to the terminal pairs of the capacitor body 50 may be exposed on the inner surface of the insertion hole 52 . In this case, each semiconductor package 20 may have the conductors of the two connection terminals 21 insulated from each other on the outer surface of one columnar member. The two connection terminals 21 may be provided on a common surface (the lower surface as an example) of the columnar member, or may be provided on separate surfaces.
　また、コンデンサ装置５はアームごとやレッグごとに１つの挿入孔部５２を有することとして説明したが、アームごとや、レッグごとに複数の挿入孔部５２を有することとしてもよい。この場合には、スイッチング素子２の配置によって任意の挿入孔部５２に接続端子２１を挿入してよい。また、コンデンサ装置５がアームごとに複数の挿入孔部５２を有する場合には、各アームをなすスイッチング素子２の主端子それぞれが挿入孔部５２に挿入されてよい。例えば、各半導体パッケージ２０は、上アームのスイッチング素子２のコレクタ端子と電気的に接続された導体を少なくとも外面に有する接続端子２１と、上アームのスイッチング素子２のエミッタ端子と電気的に接続された導体を少なくとも外面に有する接続端子２１と、下アームのスイッチング素子２のコレクタ端子と電気的に接続された導体を少なくとも外面に有する接続端子２１と、下アームのスイッチング素子２のエミッタ端子と電気的に接続された導体を少なくとも外面に有する接続端子２１とを有してよく、これらの接続端子２１のそれぞれが挿入孔部５２に挿入されてよい。 Also, although the capacitor device 5 has been described as having one insertion hole 52 for each arm or leg, it may have a plurality of insertion holes 52 for each arm or leg. In this case, the connection terminal 21 may be inserted into any insertion hole 52 depending on the arrangement of the switching element 2 . Moreover, when the capacitor device 5 has a plurality of insertion holes 52 for each arm, each main terminal of the switching element 2 forming each arm may be inserted into the insertion hole 52 . For example, each semiconductor package 20 is electrically connected to a connection terminal 21 having at least an outer surface conductor electrically connected to the collector terminal of the switching element 2 of the upper arm, and the emitter terminal of the switching element 2 of the upper arm. a connection terminal 21 having at least an outer surface a conductor connected to the collector terminal of the lower arm switching element 2; Each of these connection terminals 21 may be inserted into the insertion hole portion 52 .
　また、コンデンサ装置５は外面に露出する電源側接続端子を有することとして説明したが、電源側接続端子を有さなくてもよい。 Also, although the capacitor device 5 has been described as having power supply side connection terminals exposed to the outside, it may not have power supply side connection terminals.
　また、コンデンサ装置５の挿入孔部５２にはスイッチング素子２の主端子が挿入されることとして説明したが、これに加えて、または、これに代えて、他の端子が挿入されてもよい。例えば、挿入孔部５２には、正側電源線および負側電源線と電気的に接続された外部端子が挿入されてもよい。 Also, although it has been described that the main terminal of the switching element 2 is inserted into the insertion hole portion 52 of the capacitor device 5, other terminals may be inserted in addition to or instead of this. For example, an external terminal electrically connected to the positive power line and the negative power line may be inserted into the insertion hole 52 .
　また、コンデンサ装置５は単一のコンデンサ本体５０を有することとして説明したが、複数のコンデンサ本体５０を有してもよい。一例として、コンデンサ装置５は、半導体パッケージ２０ごとにコンデンサ本体５０を有してよい。 Also, although the capacitor device 5 has been described as having a single capacitor body 50 , it may have a plurality of capacitor bodies 50 . As an example, the capacitor device 5 may have a capacitor body 50 for each semiconductor package 20 .
　以上、本発明を実施の形態を用いて説明したが、本発明の技術的範囲は上記実施の形態に記載の範囲には限定されない。上記実施の形態に、多様な変更または改良を加えることが可能であることが当業者に明らかである。その様な変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、請求の範囲の記載から明らかである。 Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is obvious to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the description of the scope of the claims that forms with such modifications or improvements can also be included in the technical scope of the present invention.
　請求の範囲、明細書、および図面中において示した装置、システム、プログラム、および方法における動作、手順、ステップ、および段階等の各処理の実行順序は、特段「より前に」、「先立って」等と明示しておらず、また、前の処理の出力を後の処理で用いるのでない限り、任意の順序で実現しうることに留意すべきである。請求の範囲、明細書、および図面中の動作フローに関して、便宜上「まず、」、「次に、」等を用いて説明したとしても、この順で実施することが必須であることを意味するものではない。 The execution order of each process such as actions, procedures, steps, and stages in devices, systems, programs, and methods shown in claims, specifications, and drawings is etc., and it should be noted that they can be implemented in any order unless the output of a previous process is used in a later process. Regarding the operation flow in the claims, specification, and drawings, even if explanations are made using "first," "next," etc. for the sake of convenience, it means that it is essential to carry out in this order. isn't it.
　１　電力変換装置
　２　スイッチング素子
　３　入出力コネクタ
　４　制御基板
　５　コンデンサ装置
　６　マイクロチャネル
　１０　筐体部
　２０　半導体パッケージ
　２１　接続端子
　２２　出力端子
　３０　導電経路
　４０　導電経路
　５０　コンデンサ本体
　５１　筐体部
　５２　挿入孔部
　５３　接続端子
　２００　凹部
　２１０　凹部
　２１１　変形部
　５２０　押圧部
　５２１　導電性接着剤 Reference Signs List 1 power conversion device 2 switching element 3 input/output connector 4 control board 5 capacitor device 6 microchannel 10 housing 20 semiconductor package 21 connection terminal 22 output terminal 30 conductive path 40 conductive path 50 capacitor main body 51 housing 52 insertion hole 53 connection terminal 200 concave portion 210 concave portion 211 deformation portion 520 pressing portion 521 conductive adhesive

Claims (13)

  1. 　外部端子が挿入される挿入孔部と、
    　前記挿入孔部の内面に設けられて、前記外部端子と電気的に接続する第１接続端子と、
    を備えるコンデンサ装置。     an insertion hole into which an external terminal is inserted;
    a first connection terminal provided on the inner surface of the insertion hole and electrically connected to the external terminal;
    A capacitor device comprising:
  2. 　前記挿入孔部は、当該挿入孔部に挿入された前記外部端子を前記第１接続端子に押圧する押圧部を有する、請求項１に記載のコンデンサ装置。 2. The capacitor device according to claim 1, wherein said insertion hole portion has a pressing portion for pressing said external terminal inserted into said insertion hole portion against said first connection terminal.
  3. 　前記挿入孔部は、前記第１接続端子と前記外部端子とに接着する導電性接着剤を内部に有する、請求項１に記載のコンデンサ装置。 2. The capacitor device according to claim 1, wherein said insertion hole has therein a conductive adhesive for adhering said first connection terminal and said external terminal.
  4. 　当該コンデンサ装置の外面に露出して他の外部端子と電気的に接続する第２接続端子をさらに備える、請求項１から３の何れか一項に記載のコンデンサ装置。 The capacitor device according to any one of claims 1 to 3, further comprising a second connection terminal exposed on the outer surface of the capacitor device and electrically connected to another external terminal.
  5. 　コンデンサ本体と、
    　前記コンデンサ本体を収容し、前記挿入孔部が形成された筐体部と、
    　をさらに備える、請求項１から４の何れか一項に記載のコンデンサ装置。     the capacitor body,
    a housing portion that accommodates the capacitor body and in which the insertion hole portion is formed;
    5. The capacitor device according to any one of claims 1 to 4, further comprising:
  6. 　前記コンデンサ本体は、誘電体としてプラスチックフィルムを有する、請求項５に記載のコンデンサ装置。 The capacitor device according to claim 5, wherein the capacitor body has a plastic film as a dielectric.
  7. 　請求項１から６の何れか一項に記載のコンデンサ装置を備える電力変換装置。 A power conversion device comprising the capacitor device according to any one of claims 1 to 6.
  8. 　正側電源線および負側電源線の間に電気的に接続された少なくとも１つのスイッチング素子をさらに備え、
    　前記挿入孔部には、前記スイッチング素子の主端子が挿入される、請求項７に記載の電力変換装置。     further comprising at least one switching element electrically connected between the positive power line and the negative power line;
    8. The power converter according to claim 7, wherein main terminals of said switching elements are inserted into said insertion holes.
  9. 　前記正側電源線および前記負側電源線の間に直列に接続されて当該電力変換装置の上下のアームをなす少なくとも１対のスイッチング素子を備え、
    　前記コンデンサ装置は、アームごとに前記挿入孔部を有し、
    　各挿入孔部には、各対のスイッチング素子のうち、上アームをなすスイッチング素子の正側端子、または、下アームをなすスイッチング素子の負側端子が挿入される、請求項８に記載の電力変換装置。     At least one pair of switching elements connected in series between the positive power supply line and the negative power supply line to form upper and lower arms of the power converter,
    The capacitor device has the insertion hole for each arm,
    9. The electric power according to claim 8, wherein, of each pair of switching elements, the positive terminal of the switching element forming the upper arm or the negative terminal of the switching element forming the lower arm is inserted into each insertion hole. conversion device.
  10. 　前記少なくとも１対のスイッチング素子は、対ごとに単一の半導体パッケージに具備される、請求項９に記載の電力変換装置。 The power converter according to claim 9, wherein said at least one pair of switching elements are provided in a single semiconductor package for each pair.
  11. 　前記コンデンサ装置は、外面に露出して前記正側電源線および前記負側電源線と電気的に接続する第２接続端子をさらに有する、請求項８から１０の何れか一項に記載の電力変換装置。 11. The power conversion according to any one of claims 8 to 10, wherein said capacitor device further has a second connection terminal exposed to an outer surface and electrically connected to said positive power supply line and said negative power supply line. Device.
  12. 　前記コンデンサ装置は、前記挿入孔部に前記スイッチング素子の前記主端子が挿入された状態で、封止材により封止される、請求項８から１１の何れか一項に記載の電力変換装置。 The power converter according to any one of claims 8 to 11, wherein the capacitor device is sealed with a sealing material with the main terminals of the switching elements inserted into the insertion holes.
  13. 　請求項７から１２の何れか一項に記載の前記電力変換装置と、
    　前記電力変換装置から出力される交流電力により駆動されるモータと、
    　を備える車両。     The power conversion device according to any one of claims 7 to 12;
    a motor driven by AC power output from the power conversion device;
    vehicle equipped with
PCT/JP2022/040257 2021-10-29 2022-10-27 Capacitor apparatus, power conversion apparatus, and vehicle WO2023074824A1 (en)

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JPH05299146A (en) * 1992-02-19 1993-11-12 Fujitsu Ltd Connecting structure for power supply unit
JP2006136189A (en) * 2004-10-08 2006-05-25 Denso Corp Capacitor device and power conversion device
JP2009005512A (en) * 2007-06-22 2009-01-08 Hitachi Ltd Power converting device
JP2012024950A (en) * 2010-07-20 2012-02-09 Apic Yamada Corp Resin molding apparatus
JP2013163503A (en) * 2012-02-13 2013-08-22 Toshiba Corp Vehicle drive control device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5299146B2 (en) 2009-07-28 2013-09-25 日産自動車株式会社 Control device for hybrid vehicle
JP2012249501A (en) 2011-05-31 2012-12-13 Denso Corp Power conversion apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299146A (en) * 1992-02-19 1993-11-12 Fujitsu Ltd Connecting structure for power supply unit
JP2006136189A (en) * 2004-10-08 2006-05-25 Denso Corp Capacitor device and power conversion device
JP2009005512A (en) * 2007-06-22 2009-01-08 Hitachi Ltd Power converting device
JP2012024950A (en) * 2010-07-20 2012-02-09 Apic Yamada Corp Resin molding apparatus
JP2013163503A (en) * 2012-02-13 2013-08-22 Toshiba Corp Vehicle drive control device

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