WO2023072019A1 - Chip assembly, and container having chip assembly - Google Patents

Chip assembly, and container having chip assembly Download PDF

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Publication number
WO2023072019A1
WO2023072019A1 PCT/CN2022/127205 CN2022127205W WO2023072019A1 WO 2023072019 A1 WO2023072019 A1 WO 2023072019A1 CN 2022127205 W CN2022127205 W CN 2022127205W WO 2023072019 A1 WO2023072019 A1 WO 2023072019A1
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WIPO (PCT)
Prior art keywords
chip
container
chip assembly
electrical contact
substrate
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PCT/CN2022/127205
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French (fr)
Chinese (zh)
Inventor
徐长江
黄喜龙
毕庆功
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珠海市拓佳科技有限公司
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Priority claimed from CN202122587136.5U external-priority patent/CN216708788U/en
Priority claimed from CN202122587050.2U external-priority patent/CN216708787U/en
Priority claimed from CN202123071927.9U external-priority patent/CN216708791U/en
Priority claimed from CN202220646068.7U external-priority patent/CN217993885U/en
Application filed by 珠海市拓佳科技有限公司 filed Critical 珠海市拓佳科技有限公司
Publication of WO2023072019A1 publication Critical patent/WO2023072019A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor

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  • Ink Jet (AREA)

Abstract

The present invention relates to a chip assembly, and a container having the chip assembly. The chip assembly can be installed, along with an imaging medium container, in an imaging device which is provided with a contact pin. The chip assembly comprises a substrate, and an electrical contact portion that is arranged on the substrate. The chip assembly further comprises a positioning portion that is arranged on the substrate, and the chip assembly is arranged on a shell of the container in a way in which the substrate can rotate around the positioning portion between a first position and a second position, wherein at the first position, no communication connection is established between the electrical contact portion and a contact pin; and at the second position, a communication connection is established between the electrical contact portion and the contact pin. The structure of the chip assembly is simplified, and since the chip assembly can be installed in a way in which the substrate can rotate, precision requirements for the installation position of the chip assembly can be lowered, and the chip assembly is unlikely to fall off and can be conveniently removed.

Description

芯片组件以及具有该芯片组件的容器Chip component and container with the chip component 技术领域technical field
本发明涉及喷墨成像领域,尤其涉及一种可拆卸地安装在成像设备中的容器和安装在容器中的芯片组件。The invention relates to the field of inkjet imaging, in particular to a container detachably installed in an imaging device and a chip assembly installed in the container.
背景技术Background technique
芯片是一种用于在容器与成像设备(包括喷墨打印机和激光打印机等)之间进行通信的部件,芯片包括基板以及设置在基板上的电接触部,现有技术中,为确保芯片与设备能够保持稳定的电连接,至少基板被设置成与容器壳体固定结合,所述结合方式包括胶粘、焊接、卡接等,当需要对芯片进行更换时,人们需要先破坏芯片与容器壳体之间的结合,再将芯片取下。A chip is a component used for communication between a container and an imaging device (including an inkjet printer and a laser printer, etc.), and the chip includes a substrate and an electrical contact portion arranged on the substrate. The device can maintain a stable electrical connection. At least the substrate is set to be fixedly combined with the container shell. The combination includes gluing, welding, clamping, etc. When the chip needs to be replaced, people need to first destroy the chip and the container shell The combination between the body, and then remove the chip.
很显然的,在安装芯片时,为确保芯片的位置不会发生改变以及防止芯片脱落,无论采用上述哪种结合方式,都需要将芯片精确并牢固的安装在预定的位置,相反的,考虑到芯片还需要被取下,芯片又不宜被安装的过于牢固,但是,安装的不够牢固的芯片不仅可能会发生位置的改变,还可能会脱落,因而,如何降低芯片的安装位置精度要求,并可确保芯片不易脱落,同时还能使得芯片便于被取下是需要研究的课题。Obviously, when installing the chip, in order to ensure that the position of the chip will not change and prevent the chip from falling off, no matter which combination method is used, the chip needs to be installed in the predetermined position accurately and firmly. On the contrary, considering The chip still needs to be removed, and the chip should not be installed too firmly. However, a chip that is not installed firmly may not only change its position, but may also fall off. Ensuring that the chip is not easy to fall off, and at the same time making the chip easy to be removed is a topic that needs research.
发明内容Contents of the invention
本发明提供一种芯片组件以及具有该芯片组件的容器,在确保该芯片组件能够与成像设备形成稳定电连接的同时,还可降低芯片组件的安装位置精度要求,确保芯片组件不易脱落,并便于芯片组件的取下,所采用的具体方案为:The invention provides a chip component and a container with the chip component. While ensuring that the chip component can form a stable electrical connection with an imaging device, it can also reduce the accuracy requirements for the installation position of the chip component, ensure that the chip component is not easy to fall off, and facilitate The specific scheme adopted for removing the chip component is:
芯片组件,可随着成像介质容器被安装至设置有触针的成像设备中,所述芯片组件包括基板、以及设置在基板上的电接触部,芯片组件还包括设置在基板的定位部,芯片组件以基板可绕定位部在第一位置和第二位置之间转动的方式设置在容器的壳体上;在第一位置,电接触部与触针之间不建立通信连接;在第二位置,电接触部与触针之间建立通信连接,该芯片组件的结构变得简单,由于芯片组件能够以基板可转动的方式被安装,芯片组件的安装位置精度要求可被降低,芯片组件也不易脱落,同时还能够被方便的取下。The chip assembly can be installed into the imaging device provided with the contact pin along with the imaging medium container, the chip assembly includes a substrate and an electrical contact portion arranged on the substrate, the chip assembly also includes a positioning portion arranged on the substrate, the chip The assembly is arranged on the casing of the container in such a way that the substrate can rotate around the positioning part between a first position and a second position; in the first position, no communication connection is established between the electrical contact part and the contact pin; in the second position , the communication connection is established between the electrical contact part and the contact pin, and the structure of the chip assembly becomes simple. Since the chip assembly can be mounted in a rotatable manner on the substrate, the requirement for the accuracy of the mounting position of the chip assembly can be reduced, and the chip assembly is not easy Fall off, but also can be easily removed.
附图说明Description of drawings
图1是本发明实施例一涉及的容器被安装前的立体图。Fig. 1 is a perspective view of a container according to Embodiment 1 of the present invention before it is installed.
图2是本发明涉及的容器容纳腔的内部结构示意图。Fig. 2 is a schematic diagram of the internal structure of the container accommodation cavity involved in the present invention.
图3是本发明实施例一涉及的容器的部分部件分解示意图。Fig. 3 is an exploded schematic diagram of some parts of the container related to the first embodiment of the present invention.
图4是本发明实施例一涉及的容器中出墨组件被隐藏部分部件后,沿与前后方向平行的平面经过出 墨口中心线剖切后的立体图。Fig. 4 is a perspective view of the ink outlet assembly in the container according to Embodiment 1 of the present invention, after some components are hidden, and a cutaway view along a plane parallel to the front-rear direction passing through the center line of the ink outlet.
图5是本发明涉及的芯片的立体图。Fig. 5 is a perspective view of a chip involved in the present invention.
图6A和图6B是本发明实施例一涉及的芯片安装座的立体图。6A and 6B are perspective views of the chip mount according to the first embodiment of the present invention.
图7是本发明实施例一涉及的容器沿与前后方向平行的平面经过出墨口中心线剖切后的立体图。Fig. 7 is a perspective view of the container according to the first embodiment of the present invention after being cut along the plane parallel to the front-rear direction and passing through the center line of the ink outlet.
图8A是本发明实施例一涉及的容器被安装至设备后的状态示意图。Fig. 8A is a schematic diagram of the state after the container according to Embodiment 1 of the present invention is installed in the equipment.
图8B是本发明实施例一涉及的容器被安装至设备后,沿与前后方向平行的平面经过出墨口中心线剖切后的立体图。Fig. 8B is a perspective view of the container according to Embodiment 1 of the present invention, after being installed in the equipment, cut along a plane parallel to the front-rear direction and passing through the center line of the ink outlet.
图9是本发明实施例二涉及的容器的立体图。Fig. 9 is a perspective view of a container related to Embodiment 2 of the present invention.
图10是本发明实施例二涉及的容器部分部件的分解示意图。Fig. 10 is an exploded schematic diagram of some parts of the container involved in the second embodiment of the present invention.
图11是本发明实施例二涉及的容器中活动件的立体图。Fig. 11 is a perspective view of the movable parts in the container according to the second embodiment of the present invention.
图12A是本发明实施例二涉及的容器被安装前,芯片组件与容器容纳腔的相对位置示意图。12A is a schematic diagram of the relative positions of the chip component and the container accommodating cavity before the container according to the second embodiment of the present invention is installed.
图12B是本发明实施例二涉及的容器被安装后,芯片组件与容器容纳腔的相对位置示意图。12B is a schematic diagram of the relative positions of the chip component and the container accommodating cavity after the container according to the second embodiment of the present invention is installed.
图13是本发明实施例三涉及的容器被安装后,芯片组件与容器容纳腔的相对位置示意图。FIG. 13 is a schematic diagram of the relative positions of the chip component and the container accommodating cavity after the container involved in the third embodiment of the present invention is installed.
图14是本发明实施例四涉及的容器被安装前,芯片组件与容器容纳腔的相对位置示意图。Fig. 14 is a schematic diagram of the relative positions of the chip component and the container accommodating cavity before the container according to the fourth embodiment of the present invention is installed.
图15是是本发明实施例五涉及的容器的部分部件分解示意图。Fig. 15 is an exploded view of some parts of the container related to the fifth embodiment of the present invention.
图16是本发明实施例五涉及的容器在被安装至容器容纳腔之前,沿左右方向观察容器和设备中的容器容纳腔的侧视图。Fig. 16 is a side view of the container and the container accommodating chamber in the device viewed from the left and right direction before the container according to the fifth embodiment of the present invention is installed in the container accommodating chamber.
图17是本发明实施例六涉及的容器中部分部件的分解示意图。Fig. 17 is an exploded schematic view of some components in the container according to the sixth embodiment of the present invention.
图18是本发明实施例七涉及的容器中部分部件的分解示意图。Fig. 18 is an exploded schematic diagram of some components in the container involved in the seventh embodiment of the present invention.
图19是本发明实施例七涉及的容器中芯片座的立体图。Fig. 19 is a perspective view of the chip holder in the container according to the seventh embodiment of the present invention.
图20是本发明实施例七涉及的容器被安装后,芯片组件与容器容纳腔的相对位置示意图。Fig. 20 is a schematic diagram of the relative positions of the chip component and the container accommodating cavity after the container according to the seventh embodiment of the present invention is installed.
具体实施方式Detailed ways
下面结合附图详细描述本发明的实施例。Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
根据所适用的成像设备不同,本发明涉及的容器也不同,当成像设备是喷墨打印机时,容器是可拆卸地安装在喷墨打印机中的墨盒,墨水作为成像介质被容纳在墨盒中,并通过设置在墨盒的出墨口被向外排出;当成像设备是激光打印机时,容器是可拆卸地安装在激光打印机中的处理盒,碳粉作为成像介质被容纳在处理盒中,并通过设置在处理盒中的出粉口被向外排出,因而,出墨口和出粉口可被统称为成像介质排出口。According to the difference of the applicable imaging device, the container involved in the present invention is also different. When the imaging device is an inkjet printer, the container is an ink cartridge detachably installed in the inkjet printer, the ink is contained in the ink cartridge as an imaging medium, and It is discharged outward through the ink outlet of the ink cartridge; when the imaging device is a laser printer, the container is a process box detachably installed in the laser printer, and the toner is contained in the process box as an imaging medium, and is set by setting The powder outlet in the process cartridge is outwardly discharged, and thus, the ink outlet and the powder outlet may be collectively referred to as an image forming medium discharge port.
下文将以容器为墨盒为例进行描述。Hereinafter, description will be made by taking the container as an ink cartridge as an example.
[墨盒和设备的整体结构][Overall structure of cartridge and device]
图1是本发明实施例一涉及的容器被安装前的立体图;图2是本发明涉及的容器容纳腔的内部结构 示意图。墨盒100能够以可拆卸的方式被安装至设备,为描述方便,定义墨盒100的安装方向为前方,取出方向为后方,当将墨盒100向前安装时,使用者视线的上方、下方、左方和右方分别为墨盒100的上方、下方、左方和右方,位于设备中的墨盒容纳腔200具有与墨盒100相同的方位。Fig. 1 is a perspective view of the container according to Embodiment 1 of the present invention before it is installed; Fig. 2 is a schematic diagram of the internal structure of the container accommodating chamber according to the present invention. The ink cartridge 100 can be installed to the device in a detachable manner. For the convenience of description, the installation direction of the ink cartridge 100 is defined as the front, and the removal direction is the rear. When the ink cartridge 100 is installed forward, the top, bottom, and left of the user's sight and the right are respectively above, below, left and right of the ink cartridge 100, and the ink cartridge accommodating cavity 200 in the device has the same orientation as the ink cartridge 100.
墨盒100包括容纳墨水的壳体1以及设置在壳体1上的出墨组件2、芯片组件3和锁定组件4,所述出墨组件2用于将墨水向设备供应,芯片组件3用于与设备建立通信连接,锁定组件4用于与设备结合,防止墨盒100向后退出。整体上观察,墨盒100具有位于前方的前表面11、位于后方的后表面12、位于上方的上表面13、位于下方的下表面14、位于左方的左表面15和位于右方的右表面16,沿左右方向,壳体1包括相互结合的底壳1a和面盖1b,二者之间形成墨水腔10,芯片组件3和锁定组件4均以至少一部分可活动的方式与壳体1连接。The ink cartridge 100 includes a housing 1 for containing ink, and an ink outlet assembly 2, a chip assembly 3 and a locking assembly 4 arranged on the housing 1, the ink outlet assembly 2 is used to supply ink to the device, and the chip assembly 3 is used to communicate with the device. The device establishes a communication connection, and the locking component 4 is used to combine with the device to prevent the ink cartridge 100 from being withdrawn backward. Viewed as a whole, the ink cartridge 100 has a front surface 11 at the front, a rear surface 12 at the rear, an upper surface 13 at the top, a lower surface 14 at the bottom, a left surface 15 at the left, and a right surface 16 at the right. , along the left and right direction, the casing 1 includes a bottom casing 1a and a cover 1b combined with each other, an ink chamber 10 is formed between the two, and the chip assembly 3 and the locking assembly 4 are connected to the casing 1 in at least a part of a movable manner.
如图1所示,壳体1还包括与前表面11连接的第一子下表面141以及与下表面14连接的子前表面111,第一子下表面141与子前表面111连接,沿上下方向,第一子下表面141和子前表面111均位于前表面11与下表面14之间,出墨组件2位于墨盒下方,靠近下表面14设置,并穿过子前表面111,用于连通墨水腔10和墨盒外部。当墨盒100被组装完成后,下表面14为一个与前后方向平行的平面,该平面可被理解为,在墨盒100沿前后方向被安装和被取出的过程中,该平面可使得墨盒100的运动方向与前后方向平行,虽然墨盒100还具有上述第一子下表面141,但所述第一子下表面141仍不影响墨盒100的下表面14为一个与前后方向平行的平面。As shown in Figure 1, the housing 1 also includes a first sub-lower surface 141 connected to the front surface 11 and a sub-front surface 111 connected to the lower surface 14, the first sub-lower surface 141 is connected to the sub-front surface 111, along the upper and lower Direction, the first sub-lower surface 141 and the sub-front surface 111 are both located between the front surface 11 and the lower surface 14, the ink outlet assembly 2 is located below the ink cartridge, arranged near the lower surface 14, and passes through the sub-front surface 111 for communicating ink cavity 10 and the outside of the cartridge. After the ink cartridge 100 is assembled, the lower surface 14 is a plane parallel to the front-to-back direction, which can be understood as the plane that enables the movement of the ink cartridge 100 when the ink cartridge 100 is installed and taken out along the front-to-back direction. The direction is parallel to the front-back direction. Although the ink cartridge 100 also has the above-mentioned first sub-lower surface 141, the first sub-lower surface 141 still does not affect the lower surface 14 of the ink cartridge 100 to be a plane parallel to the front-back direction.
墨盒容纳腔200包括安装槽201、触针座202和限位杆203,沿前后方向,触针座202和限位杆203分别位于安装槽201的前方和后方,触针座202面向下方形成有触针腔202a,面向后方形成有阻挡壁202b,触针204设置在触针腔202a中,并可沿上下方向运动。The ink cartridge accommodating cavity 200 includes a mounting groove 201, a contact pin seat 202 and a stop rod 203. Along the front-rear direction, the contact pin seat 202 and the stop rod 203 are respectively located at the front and rear of the mounting groove 201, and the contact pin seat 202 faces downward to form a The stylus cavity 202a is formed with a blocking wall 202b facing backward, and the stylus 204 is disposed in the stylus cavity 202a and can move in the up and down direction.
[出墨组件][Ink outlet assembly]
图3是本发明实施例一涉及的容器的部分部件分解示意图;图4是本发明实施例一涉及的容器中出墨组件被隐藏部分部件后,沿与前后方向平行的平面经过出墨口中心线剖切后的立体图。Fig. 3 is an exploded schematic diagram of some parts of the container related to the first embodiment of the present invention; Fig. 4 is the center of the ink outlet along a plane parallel to the front-back direction after the ink outlet assembly in the container related to the first embodiment of the invention is hidden. Stereoscopic view after line sectioning.
如图3所示,一部分上表面13位于底壳1a上,另一部分上表面13位于面盖1b上,可实现的,上表面13的全部可被设置在底壳1a上,也可以是上表面13的全部被设置在面盖1b上。墨水腔10形成在底壳1a上,墨水腔10具有位于上方的顶面131以及位于下方的第二子下表面142,沿上下方向,顶面131位于上表面13的下方,第二子下表面142位于下表面14的上方,所述第一子下表面141和第二子下表面142形成为墨水腔10的底面的一部分,子前表面111位于第一子下表面141和第二子下表面142之间。As shown in Figure 3, a part of the upper surface 13 is located on the bottom shell 1a, and another part of the upper surface 13 is located on the cover 1b. It can be realized that all of the upper surface 13 can be arranged on the bottom shell 1a, or it can be the upper surface All of 13 are provided on the face cover 1b. The ink chamber 10 is formed on the bottom shell 1a. The ink chamber 10 has a top surface 131 above and a second sub-bottom surface 142 below. Along the up-down direction, the top surface 131 is positioned below the top surface 13, and the second sub-bottom surface 142 is located above the lower surface 14, the first sub-lower surface 141 and the second sub-lower surface 142 are formed as part of the bottom surface of the ink chamber 10, the sub-front surface 111 is located on the first sub-lower surface 141 and the second sub-lower surface Between 142.
出墨组件2沿前后方向延伸,并穿过子前表面111,如图3所示,出墨组件2包括出墨腔/成像介质排出腔21、活塞23和弹性件24,出墨腔21具有与前后方向平行的中心线C,所述出墨腔21的前方末端形成用于向外供应墨水的出墨口22,活塞23在弹性件24的弹性力作用下保持将出墨口22密封。活塞23呈杆状,包括杆体233以及位于杆体233一个末端的密封端231,墨盒100被安装前,在弹性件24的弹性力作用下,密封端231被迫推至密封出墨口22的密封位置。The ink outlet assembly 2 extends along the front-to-back direction and passes through the sub-front surface 111. As shown in FIG. The center line C parallel to the front-back direction, the front end of the ink outlet chamber 21 forms an ink outlet 22 for supplying ink to the outside, and the piston 23 keeps the ink outlet 22 sealed under the elastic force of the elastic member 24 . The piston 23 is rod-shaped, including a rod body 233 and a sealing end 231 located at one end of the rod body 233. Before the ink cartridge 100 is installed, under the elastic force of the elastic member 24, the sealing end 231 is forced to seal the ink outlet 22. Location.
墨盒100还包括用于向墨水腔10导入大气的导气腔5,墨盒100被安装前,导气腔5被导气膜18(如图7所示)密封而与大气不连通。现有的墨盒100在被安装前,使用者需要先撕掉导气膜18,使得导气腔5将墨盒内部和外部连通,再将墨盒100安装至设备,工作时,随着墨水腔10中的墨水被吸出,墨 水腔10中的气压降低,外部大气通过导体腔5补充至墨水腔10,从而,墨水腔10中的压力保持稳定。The ink cartridge 100 also includes an air guide chamber 5 for introducing atmosphere into the ink chamber 10 . Before the ink cartridge 100 is installed, the air guide chamber 5 is sealed by an air guide film 18 (as shown in FIG. 7 ) so as not to communicate with the atmosphere. Before the existing ink cartridge 100 is installed, the user needs to tear off the air guide film 18 first, so that the air guide chamber 5 communicates with the inside and outside of the ink cartridge, and then install the ink cartridge 100 to the device. The ink is sucked out, the air pressure in the ink chamber 10 is reduced, and the external air is replenished into the ink chamber 10 through the conductor chamber 5, so that the pressure in the ink chamber 10 remains stable.
然而,使用者忘记撕掉导气膜18的情形一直存在,尤其对于初次使用此种设备的使用者来说,忘记撕掉导气膜18的情形更容易发生。当没有撕掉导气膜18的墨盒100被安装至设备后,将会产生设备无法将墨水吸出的问题,从而降低使用者的使用体验,为此,本发明涉及的墨盒100设置成,墨盒100在被安装前不需要撕掉导气膜18,使用者只需要将墨盒100向着设备安装,导气膜18在所述安装过程中被打开。However, the situation that the user forgets to tear off the air guide film 18 always exists, especially for the user who uses this kind of equipment for the first time, the situation of forgetting to tear off the air guide film 18 is more likely to occur. When the ink cartridge 100 without tearing off the air guide film 18 is installed in the device, there will be a problem that the device cannot suck the ink out, thereby reducing the user experience. For this reason, the ink cartridge 100 involved in the present invention is set as: There is no need to tear off the air guide film 18 before being installed, the user only needs to install the ink cartridge 100 toward the device, and the air guide film 18 is opened during the installation process.
如图3和图4所示,出墨腔21通过第一连通孔25与墨水腔10连通,因而,墨水腔10中的墨水可不间断的补充至出墨腔21;导气腔5与出墨腔21相邻设置,且导气腔5通过导气通道与墨水腔10连通,活塞23从出墨腔21延伸至导气腔5,在出墨口22被打开的同时,活塞23将导气膜18刺破。具体的,导气腔5与出墨腔21之间通过第二连通孔26连通,杆体233的另一个末端被设置成锥形而形成刺破部232,所述刺破部232位于导气腔5中,随着吸墨针(未示出)通过出墨口22进入出墨腔21,活塞23被吸墨针向后推压,密封端231从密封位置到达打开位置,出墨口22打开,弹性件24发生弹性变形,刺破部232将导气膜18刺破,导气腔5通过导气孔51与大气连通;在墨盒100从设备中取出时,弹性件24推动活塞23向前运动,密封端231从打开位置回到密封位置,由此可见,在活塞23向前和向后运动的过程中,活塞23的运动轨迹被第二连通孔26限制,因而,第二连通孔26可被视为活塞23的运动轨迹管制件。As shown in Figures 3 and 4, the ink outlet chamber 21 is communicated with the ink chamber 10 through the first communication hole 25, thus, the ink in the ink chamber 10 can be supplemented to the ink outlet chamber 21 without interruption; The cavity 21 is arranged adjacently, and the air guiding cavity 5 communicates with the ink cavity 10 through the air guiding channel, and the piston 23 extends from the ink outlet cavity 21 to the air guiding cavity 5. When the ink outlet 22 is opened, the piston 23 will guide the air The membrane 18 is pierced. Specifically, the air guide chamber 5 communicates with the ink outlet chamber 21 through the second communication hole 26, and the other end of the rod body 233 is set in a tapered shape to form a piercing portion 232, and the piercing portion 232 is located in the air guide chamber. 5, as the ink suction needle (not shown) enters the ink outlet cavity 21 through the ink outlet 22, the piston 23 is pushed backward by the ink suction needle, the sealing end 231 reaches the open position from the sealing position, and the ink outlet 22 is opened. , the elastic member 24 is elastically deformed, and the piercing portion 232 punctures the air guide film 18, and the air guide chamber 5 communicates with the atmosphere through the air guide hole 51; when the ink cartridge 100 is taken out from the device, the elastic member 24 pushes the piston 23 to move forward , the sealing end 231 returns to the sealing position from the open position, it can be seen that, in the process of the piston 23 moving forward and backward, the movement track of the piston 23 is limited by the second communication hole 26, thus, the second communication hole 26 can It is regarded as the motion trajectory control member of the piston 23.
作为第二种实现方式的,导气腔5与出墨腔21还可间隔设置,二者相对的表面上分别设置有连通孔,活塞23分别穿过所述连通孔使得刺破部232到达导气腔5,随着活塞23被吸墨针向后推压,刺破部232将导气膜18刺破,此种结构有利于防止从出墨腔21泄漏的少量墨水进入导气腔5,在使用者将墨盒取出时,墨水从导气腔5泄漏而污染使用者的手。As a second implementation, the air guide chamber 5 and the ink outlet chamber 21 can also be arranged at intervals, and communication holes are respectively arranged on the opposite surfaces of the two, and the piston 23 passes through the communication holes respectively so that the piercing part 232 reaches the guide hole. The air chamber 5, as the piston 23 is pushed backward by the ink-absorbing needle, the piercing part 232 will pierce the air-guiding membrane 18, this structure is beneficial to prevent a small amount of ink leaking from the ink outlet chamber 21 from entering the air-guiding chamber 5, When the user takes out the ink cartridge, the ink leaks from the air guide cavity 5 and pollutes the user's hand.
作为第三种实现方式的,刺破部232作为一个独立的部件而与活塞23分体形成,此时,活塞23与刺破部232之间通过中间部件结合,刺破部232通过活塞23被触发,通过该中间部件,活塞23不必延伸至导气腔5,从而降低出墨腔21与导气腔5的密封要求,例如,在活塞23和刺破部232均安装磁性件,通过磁力作用使得刺破部232能够随着活塞23的运动而运动;进一步的,通过调整磁力的大小和方向,活塞23传递至刺破部232的作用力大小和方向还可被控制,从而使得刺破部232能够更精准的将导气膜18刺破;更进一步的,所述中间部件还可被设置成:在刺破部232将导气膜18刺破后,中间部件将刺破部232从导气孔51中移开,防止刺破部232将导气孔51堵塞而影响导气腔5与大气的连通效率。As a third implementation, the piercing portion 232 is formed separately from the piston 23 as an independent component. Trigger, through this intermediate component, the piston 23 does not have to extend to the air guide chamber 5, thereby reducing the sealing requirements between the ink outlet chamber 21 and the air guide chamber 5, for example, magnetic parts are installed on the piston 23 and the piercing part 232, and the magnetic force The piercing part 232 can move along with the movement of the piston 23; further, by adjusting the magnitude and direction of the magnetic force, the magnitude and direction of the force transmitted from the piston 23 to the piercing part 232 can also be controlled, so that the piercing part 232 can more accurately puncture the air-conducting membrane 18; further, the intermediate part can also be set to: after the piercing part 232 pierces the air-conducting film 18, the intermediate part will puncture the part 232 from the guide The air hole 51 is removed to prevent the piercing portion 232 from blocking the air hole 51 and affecting the communication efficiency between the air chamber 5 and the atmosphere.
通过以上描述,活塞23/密封端231可被认为是触发件,刺破部232可被认为是被触发件,当触发件23受到吸墨针的推压时,密封端231从密封位置移动至打开位置,被触发件232与触发件23/231联动,触发件23触发被触发件232将导气膜18刺破,使得导气腔5连通墨水腔10和大气。Through the above description, the piston 23/sealing end 231 can be considered as the triggering part, and the piercing part 232 can be considered as the triggered part. When the triggering part 23 is pushed by the ink-absorbing needle, the sealing end 231 moves from the sealing position to the In the open position, the triggered part 232 is linked with the triggering part 23/231, and the triggering part 23 triggers the triggered part 232 to puncture the air-guiding film 18, so that the air-guiding chamber 5 communicates with the ink chamber 10 and the atmosphere.
[锁定组件][lock components]
如上所述,当墨盒100被安装至墨盒容纳腔200时,吸墨针抵接活塞23使得弹性件24发生弹性变形,进而将使得墨盒100具有向后运动的趋势,为防止墨盒100向后被推出,锁定组件4将与墨盒容纳腔200中的限位杆203结合,使得墨盒100被保持在预定的安装位置。As mentioned above, when the ink cartridge 100 is installed in the ink cartridge accommodating chamber 200, the ink suction needle abuts against the piston 23 so that the elastic member 24 is elastically deformed, and then the ink cartridge 100 has a tendency to move backwards, in order to prevent the ink cartridge 100 from being Pushing out, the locking assembly 4 will be combined with the limit rod 203 in the ink cartridge accommodation cavity 200, so that the ink cartridge 100 is kept at a predetermined installation position.
如图4、图7和图8B所示,锁定组件4包括与壳体1连接的底座41以及设置在底座41上的锁定件42,所述底座41和锁定件42的至少之一被设置成可沿上下方向运动;当墨盒100向着墨盒容纳腔200安装时,沿上下方向,锁定组件4高于限位杆203,因而,在墨盒100的安装过程中,锁定组件4将与限位 杆203产生干涉,并迫使底座41和锁定件42至少之一向下运动,直至限位杆203越过锁定组件4的最高点,随后,底座41和锁定件42至少之一再次向上运动至限位杆203的前方,最后,通过锁定件42与限位杆203的抵接实现防止墨盒100向后退出。As shown in Figure 4, Figure 7 and Figure 8B, the locking assembly 4 includes a base 41 connected to the housing 1 and a locking member 42 arranged on the base 41, at least one of the base 41 and the locking member 42 is set to Can move up and down; when the ink cartridge 100 is installed toward the ink cartridge accommodating cavity 200, along the up and down direction, the locking assembly 4 is higher than the limit rod 203, thus, during the installation process of the ink cartridge 100, the locking assembly 4 will be in contact with the limit rod 203 Interference occurs, and at least one of the base 41 and the locking member 42 is forced to move downward until the limit rod 203 crosses the highest point of the locking assembly 4, and then at least one of the base 41 and the lock member 42 moves upward to the limit of the limit rod 203 In the front, finally, the ink cartridge 100 is prevented from retreating backward through the abutment of the locking member 42 and the limit rod 203 .
本发明优选的,底座41与底壳1a一体形成,底座41从上表面13向上延伸形成,锁定件42被设置成具有弹性,并可沿上下方向运动,锁定件42为安装在底座41上方的弹性橡胶,所述弹性橡胶呈弧状被安装,因而,当限位杆203与弹性橡胶接触时,位于弹性橡胶前方的斜面可对限位杆203起到导引作用,随着限位杆203越过弹性橡胶的顶点,当墨盒100被安装至预定位置时,位于弹性橡胶后方的斜面与限位杆203抵接。Preferably in the present invention, the base 41 is integrally formed with the bottom shell 1a, the base 41 extends upward from the upper surface 13, the locking member 42 is set to be elastic and can move in the up and down direction, the locking member 42 is installed above the base 41 Elastic rubber, the elastic rubber is installed in an arc shape, thus, when the limiting rod 203 is in contact with the elastic rubber, the inclined surface in front of the elastic rubber can guide the limiting rod 203, and as the limiting rod 203 crosses At the apex of the elastic rubber, when the ink cartridge 100 is installed to a predetermined position, the inclined surface behind the elastic rubber abuts against the limit rod 203 .
作为更简单的一种实现方式的,锁定组件4还可被设置成不具有弹性,此时,锁定组件4与限位杆203形成硬接触;对于墨盒100来说,沿上下方向,在墨盒100的下方,吸墨针向墨盒100施加有向后的推力,在墨盒100的上方,限位杆203与锁定组件4的挤压使得墨盒100受到一个向前的推力,如图8B所示,墨盒100整体将具有绕吸墨针与活塞23的接触点为圆心向下前方转动的趋势,在设备的工作过程中,墨盒100可能出现晃动。As a simpler implementation, the locking assembly 4 can also be set to have no elasticity. At this time, the locking assembly 4 forms a hard contact with the stop bar 203; Below the ink cartridge 100, the ink suction needle exerts a backward thrust on the ink cartridge 100. Above the ink cartridge 100, the extrusion of the limit rod 203 and the locking assembly 4 makes the ink cartridge 100 receive a forward thrust. As shown in FIG. 8B, the ink cartridge 100 as a whole will have a tendency to rotate downward and forward around the contact point between the ink suction needle and the piston 23, and the ink cartridge 100 may shake during the working process of the device.
然而,当锁定组件4中的底座41和锁定件42至少之一被设置成可沿上下方向运动时,不仅可减轻墨盒100在安装过程中受到的阻力,而且当墨盒100被安装至预定位置后,限位杆203挤压锁定件42使得墨盒100受到向下的挤压力,墨盒100向下前方转动的趋势可被制止。However, when at least one of the base 41 and the locking member 42 in the locking assembly 4 is configured to move in the up and down direction, not only can the resistance of the ink cartridge 100 be reduced during installation, but also when the ink cartridge 100 is installed to a predetermined position, The limiting rod 203 presses the locking member 42 so that the ink cartridge 100 is subjected to a downward pressing force, and the tendency of the ink cartridge 100 to rotate downward and forward can be stopped.
进一步的,如图3、图4和图7所示,墨盒100还包括设置在壳体1后方的勾部133,沿前后方向,所述勾部133与锁定组件4之间形成凹部132,锁定组件4、凹部132和勾部133从前向后依次排列。当墨盒100需要被取出时,所述凹部132形成容纳使用者手指的容纳部,通过向勾部133施加向后的拉力,使得限位杆203再次越过锁定组件4的最高点,墨盒100在弹性件24的弹性复位力作用下向后退出。Further, as shown in FIG. 3 , FIG. 4 and FIG. 7 , the ink cartridge 100 also includes a hook portion 133 arranged at the rear of the housing 1 , along the front-to-back direction, a concave portion 132 is formed between the hook portion 133 and the locking assembly 4 to lock The assembly 4, the concave portion 132 and the hook portion 133 are arranged in sequence from front to back. When the ink cartridge 100 needs to be taken out, the concave portion 132 forms an accommodating portion for the user’s fingers, and by applying a backward pulling force to the hook portion 133, the limit rod 203 once again crosses the highest point of the locking assembly 4, and the ink cartridge 100 is elastically Part 24 retreats backward under the action of the elastic restoring force.
[芯片组件][chip components]
实施例一Embodiment one
图5是本发明涉及的芯片的立体图;图6A和图6B是本发明实施例一涉及的芯片安装座的立体图。FIG. 5 is a perspective view of the chip involved in the present invention; FIG. 6A and FIG. 6B are perspective views of the chip mounting seat involved in Embodiment 1 of the present invention.
继续如图3所示,芯片组件3位于墨盒的上方,包括相互结合的芯片座31和芯片32,芯片32被固定安装在芯片座31上,芯片座31以可活动的方式与壳体1结合,随着芯片座31的运动,芯片32具有下文所述的第一位置和第二位置,在第一位置,芯片32不与触针204接触,此时,芯片32与设备没有建立通信连接,在第二位置,芯片32与触针204接触,此时,芯片32与设备建立通信连接;所述芯片32不必被固定设置,其安装位置的精度要求可被降低。Continue as shown in Figure 3, the chip assembly 3 is located above the ink cartridge, including a chip holder 31 and a chip 32 combined with each other, the chip 32 is fixedly mounted on the chip holder 31, and the chip holder 31 is combined with the housing 1 in a movable manner , along with the movement of the chip seat 31, the chip 32 has a first position and a second position as described below, in the first position, the chip 32 is not in contact with the contact pin 204, at this time, the chip 32 does not establish a communication connection with the device, In the second position, the chip 32 is in contact with the contact pin 204. At this time, the chip 32 establishes a communication connection with the device; the chip 32 does not need to be fixed, and the precision requirement of its installation position can be reduced.
如图5所示,芯片32包括基板321、以及分别位于基板321两侧的电接触部322和存储部323,电接触部322用于与触针204接触,存储部323存储有墨盒100的各项参数信息,电接触部322与存储部323电连通;进一步的,芯片32还包括与电接触部322和存储部323之一同侧设置的电源324,当芯片32与设备建立通信连接时,电源324向芯片32供应电能;可替换的,存储部323还可与电接触部322同侧设置,只要二者之间形成电连通即可。As shown in FIG. 5 , the chip 32 includes a substrate 321 , and an electrical contact portion 322 and a storage portion 323 located on both sides of the substrate 321 respectively. Item parameter information, the electrical contact part 322 is electrically connected with the storage part 323; further, the chip 32 also includes a power supply 324 arranged on the same side as the electrical contact part 322 and the storage part 323, when the chip 32 establishes a communication connection with the device, the power supply 324 to supply power to the chip 32; alternatively, the storage part 323 can also be provided on the same side as the electrical contact part 322, as long as the two are electrically connected.
常见的,存储部323设置在基板321上,芯片32还可被设置成,电接触部322与基板321分开设置, 此时,电接触部322与存储部323之间通过导线连接,这样,只需要确保相对面积更小的电接触部322被设置在芯片座31上,相对面积更大的基板321、存储部322和电源324可根据墨盒100的空间设计需求被放置在其他位置。Commonly, the storage part 323 is arranged on the substrate 321, and the chip 32 can also be arranged such that the electrical contact part 322 is separately provided from the substrate 321. At this time, the electrical contact part 322 and the storage part 323 are connected by wires. In this way, only It is necessary to ensure that the electrical contact portion 322 with a relatively smaller area is disposed on the chip holder 31 , and the substrate 321 , storage portion 322 and power supply 324 with a relatively larger area can be placed in other positions according to the space design requirements of the ink cartridge 100 .
如图6A和图6B所示,芯片座31包括主体311、分别位于主体311前后两侧的第一支撑部312和第二支撑部313、以及从主体311向上突出的受力部315,所述受力部315面向前方形成受力面315a,第一支撑部312和第二支撑部313沿前后方向间隔设置,沿上下方向,受力部315与所述两个支撑部也间隔设置,芯片32/电接触部322被安装在受力部315与所述支撑部312/313之间,电接触部322面向上方,存储部323和/或电源324位于第一支撑部312和第二支撑部313之间的空间中。进一步的,主体311还设置有与第二支撑部313相对的观察孔314,这样,使用者可通过观察孔314观察基板321是否已被第二支撑部313支撑。As shown in FIG. 6A and FIG. 6B , the chip holder 31 includes a main body 311 , a first supporting portion 312 and a second supporting portion 313 respectively located on the front and rear sides of the main body 311 , and a force receiving portion 315 protruding upward from the main body 311 . The force-receiving part 315 faces forward to form a force-receiving surface 315a, the first support part 312 and the second support part 313 are arranged at intervals along the front-rear direction, and the force-receiving part 315 and the two support parts are also arranged at intervals along the up-down direction. /The electrical contact part 322 is installed between the force receiving part 315 and the support part 312/313, the electrical contact part 322 faces upward, and the storage part 323 and/or the power supply 324 are located on the first support part 312 and the second support part 313 in the space between. Further, the main body 311 is also provided with an observation hole 314 opposite to the second support portion 313 , so that the user can observe through the observation hole 314 whether the substrate 321 is supported by the second support portion 313 .
图7是本发明实施例一涉及的容器沿与前后方向平行的平面经过出墨口中心线剖切后的立体图;图8A是本发明实施例一涉及的容器被安装至设备后的状态示意图;图8B是本发明实施例一涉及的容器被安装至设备后,沿与前后方向平行的平面经过出墨口中心线剖切后的立体图。Fig. 7 is a perspective view of the container according to Embodiment 1 of the present invention after being cut along the plane parallel to the front-rear direction and passing through the center line of the ink outlet; Fig. 8A is a schematic diagram of the state of the container according to Embodiment 1 of the present invention after it is installed in the equipment; Fig. 8B is a perspective view of the container according to Embodiment 1 of the present invention, after being installed in the equipment, cut along a plane parallel to the front-rear direction and passing through the center line of the ink outlet.
本发明中,芯片座31被设置成可绕旋转轴线L转动,优选的,旋转轴线L位于上表面13和顶面131之间,沿上下方向,芯片座31的至少一部分位于上表面13和顶面131之间,从而,墨盒100在上下方向的空间被充分利用,有利于实现墨盒100的小型化。如图3所示,芯片座31可绕旋转轴线L沿r所示方向以及与r方向相反的r’方向转动,相应的,芯片32中,至少电接触部322可随着芯片座31沿r/r’所示方向在所述第一位置和第二位置之间转动,下文中,以电接触部322被设置在基板321,且芯片32全部被安装在芯片座31为例进行描述。In the present invention, the chip holder 31 is configured to be rotatable around the rotation axis L. Preferably, the rotation axis L is located between the upper surface 13 and the top surface 131, and at least a part of the chip holder 31 is located between the upper surface 13 and the top surface 131 along the up-down direction. Between the surfaces 131 , the space in the vertical direction of the ink cartridge 100 is fully utilized, which is beneficial to realize the miniaturization of the ink cartridge 100 . As shown in FIG. 3 , the chip holder 31 can rotate around the rotation axis L along the direction indicated by r and the r' direction opposite to the r direction. Correspondingly, in the chip 32, at least the electrical contact portion 322 can follow the chip holder 31 along the r The direction indicated by /r' rotates between the first position and the second position. Hereinafter, the electric contact portion 322 is disposed on the substrate 321 and the chips 32 are all mounted on the chip holder 31 as an example for description.
如图7所示,墨盒100被安装前,芯片座31位于第一位置,沿上下方向,芯片电接触部322与顶面131之间的距离为h1,活塞23的密封端231位于密封位置,导气孔51被导气膜18密封。沿前后方向,墨盒100向前被安装,如图8A所示,墨盒100沿与前后方向平行的方向进入墨盒容纳腔200,如图8B所示,活塞23受到吸墨针的推压向后运动,密封端231从密封位置到达打开位置,出墨口22被打开,弹性件24发生弹性变形,导气膜18被刺破部232刺破,受力面315a与阻挡壁202b接触,芯片座31带动芯片32沿r所示方向从第一位置转动至第二位置,电接触部322进入触针腔202a并与触针204接触,沿上下方向,芯片电接触部322与顶面131之间的距离为h2,满足h2>h1,也就是说,相对于位于第一位置的电接触部322,位于第二位置的电接触部322更远离顶面131,或者说,沿上下方向,相对于位于第一位置的电接触部322,位于第二位置的电接触部322更远离出墨腔21的中心线C,还可以说,沿上下方向,相对于位于第一位置的电接触部322,位于第二位置的电接触部322更远离墨盒下表面14。As shown in Figure 7, before the ink cartridge 100 is installed, the chip seat 31 is located at the first position, along the up-down direction, the distance between the chip electrical contact portion 322 and the top surface 131 is h1, and the sealing end 231 of the piston 23 is located at the sealing position, The air guide hole 51 is sealed by the air guide film 18 . Along the front-back direction, the ink cartridge 100 is installed forward. As shown in FIG. 8A, the ink cartridge 100 enters the ink cartridge accommodating cavity 200 along a direction parallel to the front-back direction. As shown in FIG. 8B, the piston 23 is pushed backward by the ink-absorbing needle. , the sealing end 231 reaches the open position from the sealing position, the ink outlet 22 is opened, the elastic member 24 is elastically deformed, the air guide film 18 is pierced by the piercing part 232, the force surface 315a contacts the blocking wall 202b, and the chip holder 31 Drive the chip 32 to rotate from the first position to the second position along the direction indicated by r, the electrical contact part 322 enters the contact pin chamber 202a and contacts the contact pin 204, along the up and down direction, the chip electrical contact part 322 and the top surface 131 The distance is h2, satisfying h2>h1, that is, the electrical contact portion 322 at the second position is farther away from the top surface 131 than the electrical contact portion 322 at the first position, or in other words, along the up-down direction, relative to the electrical contact portion 322 at the first position. The electrical contact portion 322 at the first position, the electrical contact portion 322 at the second position is farther away from the centerline C of the ink outlet chamber 21, it can also be said that, in the up-down direction, relative to the electrical contact portion 322 at the first position, it is located at The electrical contact portion 322 at the second position is further away from the lower surface 14 of the ink cartridge.
相反的,当墨盒100从墨盒容纳腔200取出时,在弹性件24的弹性复位力作用下,活塞23向前运动,密封端231从打开位置回到密封位置,同时,受力面315a与阻挡壁202b脱离接触,芯片座31在自身重力作用下沿r’所示方向从第二位置转动至第一位置,电接触部322与触针204脱离接触。On the contrary, when the ink cartridge 100 is taken out from the ink cartridge accommodating cavity 200, under the elastic return force of the elastic member 24, the piston 23 moves forward, and the sealing end 231 returns to the sealing position from the open position. The wall 202b is out of contact, the chip holder 31 is rotated from the second position to the first position along the direction indicated by r′ under its own gravity, and the electrical contact portion 322 is out of contact with the contact pin 204 .
芯片座31具有如上所述的第一位置和第二位置,在第二位置,芯片电接触部322与触针204接触,在芯片座31被设置成可绕旋转轴线L转动的情况下,电接触部322所在的平面将相对于前后方向向上倾斜,如图8B所示,电接触部322将与触针的前方表面接触,相对于现有电接触部与触针顶点接触,本发 明中的电接触部322与触针的接触面积更大。优选的,芯片座31位于第一位置时,芯片电接触部322所在的平面也相对于前后方向倾斜,如图7所示,相对于前后方向,芯片座32向上倾斜,电接触部322位于前上方,这样,沿上下方向,芯片座31运动的距离可减小,电接触部322能够更快的与触针抵接,芯片座31的结构也可得到简化;相对于上下方向,受力面315a向前倾斜,这样,受力面315a更容易与阻挡壁202b接触,并在芯片座31沿r所示方向转动的过程中,受力面315a与阻挡壁202b不会脱离接触。The chip holder 31 has the above-mentioned first position and a second position. In the second position, the chip electrical contact portion 322 is in contact with the contact pin 204. When the chip holder 31 is set to rotate around the rotation axis L, the electrical The plane where the contact portion 322 is located will be inclined upward relative to the front-rear direction. As shown in FIG. 8B , the electrical contact portion 322 will be in contact with the front surface of the stylus. The contact area between the electrical contact portion 322 and the contact pin is larger. Preferably, when the chip holder 31 is at the first position, the plane where the chip electrical contact portion 322 is located is also inclined relative to the front-to-back direction, as shown in FIG. Above, in this way, along the up and down direction, the moving distance of the chip holder 31 can be reduced, the electrical contact part 322 can abut against the contact pin faster, and the structure of the chip holder 31 can also be simplified; 315a is inclined forward, so that the force receiving surface 315a is more likely to be in contact with the blocking wall 202b, and the force receiving surface 315a will not lose contact with the blocking wall 202b when the chip holder 31 rotates in the direction indicated by r.
下面结合图3、图7和图8B介绍芯片座31如何被保持在相对于前后方向倾斜的状态。How the chip holder 31 is kept in a state inclined relative to the front-rear direction will be described below with reference to FIG. 3 , FIG. 7 and FIG. 8B .
如图7中局部R2所示,芯片座31的前方末端到旋转轴线L的距离远大于芯片座31的后方末端到旋转轴线L的距离,在自然状态下,芯片座31具有沿r’方向转动的趋势;当芯片32被安装至芯片座31后,芯片32的大部分重量位于旋转轴线L的前方,因而,芯片组件3整体均具有沿r’方向转动的趋势。As shown in the part R2 in Fig. 7, the distance from the front end of the chip holder 31 to the rotation axis L is far greater than the distance from the rear end of the chip holder 31 to the rotation axis L, and in the natural state, the chip holder 31 has the ability to rotate along the r' direction trend; when the chip 32 is mounted on the chip holder 31, most of the weight of the chip 32 is located in front of the rotation axis L, therefore, the chip assembly 3 as a whole has a tendency to rotate along the r' direction.
为保持位于第一位置的芯片座31处于上述倾斜状态,壳体1还设置有保持部,芯片座31设置有被保持部。如图3所示,保持部包括将芯片座31保持在第一位置的第一保持部134以及用于将芯片座31保持在第二位置的第二保持部135,被保持部包括用于与第一保持部134接触的第一被保持部311a以及用于与第二保持部135接触的第二被保持部311b,第一被保持部311a和第二被保持部311b相邻设置,第一保持部134和第二保持部135也相邻设置,当芯片座31被安装时,第一保持部134和第二保持部135进入第一被保持部311a与第二被保持部311b之间的区域内,第一保持部134与第一被保持部311a抵接,使得芯片座31被保持在相对于前后方向向上倾斜的第一位置,如图8B中局部R3所示,当受力面315a受到阻挡壁202b的阻挡而使得芯片座31绕旋转轴线L沿r所示方向转动时,第一保持部134与第一被保持部311a脱离接触,直至芯片座31到达第二位置,此时,第二保持部135与第二被保持部311b抵接,芯片座31被保持在第二位置。In order to keep the chip holder 31 at the first position in the aforementioned inclined state, the housing 1 is further provided with a holding portion, and the chip holder 31 is provided with a held portion. As shown in FIG. 3 , the holding portion includes a first holding portion 134 for holding the chip holder 31 at the first position and a second holding portion 135 for holding the chip holder 31 at the second position, and the held portion includes a The first held portion 311a contacting the first holding portion 134 and the second held portion 311b for contacting the second holding portion 135, the first held portion 311a and the second held portion 311b are adjacently arranged, and the first held portion 311a is adjacent to the second held portion 311b. The holding part 134 and the second holding part 135 are also arranged adjacently. When the chip holder 31 is installed, the first holding part 134 and the second holding part 135 enter the gap between the first held part 311a and the second held part 311b. In the region, the first holding portion 134 abuts against the first held portion 311a, so that the chip holder 31 is held at the first position inclined upward relative to the front-rear direction, as shown by the part R3 in FIG. 8B , when the force-bearing surface 315a When the chip holder 31 is blocked by the blocking wall 202b and rotates in the direction indicated by r around the rotation axis L, the first holding part 134 is out of contact with the first held part 311a until the chip holder 31 reaches the second position. At this time, The second holding portion 135 abuts against the second held portion 311b, and the chip holder 31 is held at the second position.
据此可知,芯片座31在第一位置时相对于前后方向向上倾斜的角度可由第一保持部134与第一被保持部311a的抵接位置来确定,同样的,芯片座31在第二位置时相对于前后方向向上倾斜的角度可由第二保持部134与第二被保持部311b的抵接位置来确定,所述第一保持部134与第一被保持部311a之间以及第二保持部135与第二被保持部311b之间可形成面接触、线接触和点接触中的至少一种;本发明中,第一保持部134与第一被保持部311a之间形成面和面接触,第二保持部135与第二被保持部311b之间形成面和线接触,第一保持部134为相对于前后方向向后倾斜的斜面,第二保持部135为相对于前后方向平行的平面。It can be seen from this that, when the chip holder 31 is in the first position, the upward tilt angle relative to the front-rear direction can be determined by the contact position between the first holding part 134 and the first held part 311a. Similarly, the chip holder 31 is in the second position. The angle of upward inclination relative to the front-rear direction can be determined by the abutment position between the second holding part 134 and the second held part 311b, between the first holding part 134 and the first held part 311a and the 135 and the second held portion 311b can form at least one of surface contact, line contact and point contact; in the present invention, surface and surface contact are formed between the first holding portion 134 and the first held portion 311a, The second holding portion 135 forms surface and line contact with the second held portion 311b, the first holding portion 134 is a slope inclined backward relative to the front-rear direction, and the second holding portion 135 is a plane parallel to the front-rear direction.
进一步的,保持部还包括与第二保持部135相邻设置的第三保持部136,当芯片座31位于第一位置时,除了第一保持部134与第一被保持部311a接触,第三保持部136与主体311也保持接触,芯片座31可被更稳定的定位在第一位置。Further, the holding portion further includes a third holding portion 136 adjacent to the second holding portion 135. When the chip holder 31 is at the first position, except that the first holding portion 134 is in contact with the first held portion 311a, the third holding portion 136 The holding portion 136 is also kept in contact with the main body 311 , and the chip holder 31 can be positioned at the first position more stably.
更进一步的,芯片组件3还可设置与芯片座31结合的诸如拉簧或压簧的复位件,使得芯片座31在第一位置保持在相对于前后方向向上倾斜的姿态,当芯片座31从第一位置向第二位置运动时,复位件发生弹性变形,当受力面315a与阻挡壁202b脱离接触时,芯片座31将在复位件的弹性复位力作用下从第二位置向着第一位置运动。Furthermore, the chip assembly 3 can also be provided with a reset member combined with the chip holder 31, such as a tension spring or a compression spring, so that the chip holder 31 is kept in an upwardly inclined posture relative to the front-to-back direction at the first position. When the first position moves to the second position, the reset member elastically deforms, and when the force-bearing surface 315a is out of contact with the blocking wall 202b, the chip holder 31 will move from the second position to the first position under the elastic reset force of the reset member sports.
所述芯片座31还可以采用平动的方式在第一位置和第二位置之间运动,例如,在受力部315和所述支撑部之间设置一个力转换机构,当受力面315a与阻挡壁202b接触时,所述力转换机构可将受力面315a 受到的力转换成沿上下方向施加至支撑部,进而迫使芯片座31从第一位置向第二位置运动,位于芯片座31中的电接触部322得以与触针204接触,当受力面315a与阻挡壁202b脱离接触时,芯片座31在自身重力作用下,从第二位置回到第一位置;此种实施方式中,芯片座31既可以采用倾斜设置的方式,也可以采用水平设置的方式。The chip holder 31 can also move between the first position and the second position in a translational manner. For example, a force conversion mechanism is provided between the force receiving part 315 and the support part. When the force receiving surface 315a and the supporting part When the blocking wall 202b is in contact, the force conversion mechanism can convert the force received by the force receiving surface 315a to be applied to the supporting part in the up and down direction, thereby forcing the chip holder 31 to move from the first position to the second position, located in the chip holder 31 The electrical contact portion 322 of the contact pin 204 is in contact with the contact pin 204. When the force-bearing surface 315a is out of contact with the blocking wall 202b, the chip holder 31 returns to the first position from the second position under the action of its own gravity; in this embodiment, The chip holder 31 can be arranged obliquely or horizontally.
以上记载了受力面315a与阻挡壁202b接触使得芯片座31运动的方式,然而,根据本发明的技术思路,受力面315a还可被设置在芯片座的其他位置,用于与墨盒容纳腔200的其他位置接触,例如,受力面315a位于主体31的左右两侧,在墨盒100的安装过程中,该受力面315a与墨盒容纳腔200的左右两侧接触,进而迫使芯片座31在所述第一位置和第二位置之间移动。The mode in which the force-bearing surface 315a is in contact with the blocking wall 202b to make the chip holder 31 move has been described above, however, according to the technical ideas of the present invention, the force-bearing surface 315a can also be arranged at other positions of the chip holder for contact with the ink cartridge accommodating chamber. 200, for example, the force-bearing surface 315a is located on the left and right sides of the main body 31. During the installation process of the ink cartridge 100, the force-bearing surface 315a is in contact with the left and right sides of the ink cartridge accommodating chamber 200, thereby forcing the chip holder 31 to moving between the first position and the second position.
实施例二Embodiment two
图9是本发明实施例二涉及的容器的立体图;图10是本发明实施例二涉及的容器部分部件的分解示意图;图11是本发明实施例二涉及的容器中活动件的立体图。Fig. 9 is a perspective view of the container according to the second embodiment of the present invention; Fig. 10 is an exploded schematic view of some parts of the container according to the second embodiment of the present invention; Fig. 11 is a perspective view of the movable parts in the container according to the second embodiment of the present invention.
本实施例中,芯片32以自身可旋转的方式被安装,如图9和图10所示,芯片组件3包括活动件33和芯片32,沿前后方向,活动件33位于芯片32的前方,芯片32和活动件33均可旋转地被安装在壳体1上,如图11所示,活动件33包括活动板331、以及与活动板331结合的受力板333和迫推板332,优选的,受力板333具有倾斜的接触面3331,该接触面3331从前下方向后上方倾斜,迫推板332具有倾斜的迫推面3321,该迫推面3321从后下方向前上方倾斜。所述活动件33的活动方式既可以是转动也可以是平动,当活动件33的活动方式是转动时,活动件33还包括与活动板331结合的转动部334。In this embodiment, the chip 32 is installed in a rotatable manner. As shown in FIGS. 9 and 10 , the chip assembly 3 includes a movable part 33 and a chip 32. 32 and the movable part 33 can be rotatably installed on the housing 1, as shown in Figure 11, the movable part 33 includes a movable plate 331, and a force plate 333 and a forcing plate 332 combined with the movable plate 331, preferably , the force plate 333 has an inclined contact surface 3331, the contact surface 3331 is inclined from front to bottom to rear and upper, and the forcing plate 332 has an inclined forcing surface 3321, and the forcing surface 3321 is inclined from the rear to the front and upward. The movable part 33 can be rotated or translated. When the movable part 33 is rotated, the movable part 33 also includes a rotating part 334 combined with the movable plate 331 .
图12A是本发明实施例二涉及的容器被安装前,芯片组件与容器容纳腔的相对位置示意图;图12B是本发明实施例二涉及的容器被安装后,芯片组件与容器容纳腔的相对位置示意图。Fig. 12A is a schematic diagram of the relative position of the chip component and the container accommodating cavity before the container according to the second embodiment of the present invention is installed; Fig. 12B is a relative position of the chip component and the container accommodating cavity after the container according to the second embodiment of the present invention is installed schematic diagram.
如图12A所示,芯片32还包括设置在基板321上的配合部325,所述配合部325与壳体1上设置的被配合部(未示出)配合在一些实施例中,配合部325设置为突起,被配合部设置为凹槽,相反的,配合部325还可以为设置在基板321上的凹槽,相应的,被配合部101为设置在壳体1上的突起,所述突起325可转动地安装在凹槽101中。通过配合部325与被配合部101的结合,芯片32以可旋转的方式与壳体1结合,优选的,配合部325被设置的更靠近基板321的后方末端,这样,芯片32的大部分重量将位于配合部325的前方而使得芯片32具有绕图12A中r2所示方向的反方向转动的趋势。As shown in FIG. 12A , the chip 32 also includes a mating portion 325 disposed on the substrate 321, and the mating portion 325 is mated with a mated portion (not shown) disposed on the housing 1. In some embodiments, the mating portion 325 It is set as a protrusion, and the matched part is set as a groove. On the contrary, the matching part 325 can also be a groove set on the substrate 321. Correspondingly, the matched part 101 is a protrusion set on the housing 1, and the protrusion 325 is rotatably installed in the groove 101 . Through the combination of the mating portion 325 and the mated portion 101, the chip 32 is combined with the housing 1 in a rotatable manner. Preferably, the mating portion 325 is arranged closer to the rear end of the substrate 321, so that most of the weight of the chip 32 It will be located in front of the matching portion 325 so that the chip 32 has a tendency to rotate around the direction opposite to the direction shown by r2 in FIG. 12A .
在墨盒100被安装前,芯片32位于第一位置,且芯片32与活动件33抵接而被保持在图12A中相对于前后方向向上倾斜的姿态,沿上下方向,芯片组件3的最高点低于触针腔202的最低点,这样,墨盒100在被向着墨盒容纳腔200安装的过程中,芯片组件3不会与触针腔202之间产生干涉。当活动件33的接触面3331与墨盒容纳腔200中的抵接部205抵接时,随着墨盒100继续受到向前的推力,抵接部205向接触面3331施加作用力,迫使活动件33绕转动部334沿r1所示方向转动,迫推部332迫推芯片基板321,使得基板321绕突起325沿r2所示方向转动,电接触部322逐渐远离顶面131/出墨口22,直至芯片32到达图12B所示的第二位置。Before the ink cartridge 100 is installed, the chip 32 is located at the first position, and the chip 32 abuts against the movable part 33 and is kept in an upwardly inclined posture relative to the front-rear direction in FIG. 12A . At the lowest point of the stylus chamber 202 , in this way, the chip assembly 3 will not interfere with the stylus chamber 202 when the ink cartridge 100 is installed toward the ink cartridge accommodating chamber 200 . When the contact surface 3331 of the movable member 33 abuts against the abutting portion 205 in the ink cartridge accommodating chamber 200, as the ink cartridge 100 continues to be pushed forward, the abutting portion 205 exerts a force on the contact surface 3331, forcing the movable member 33 Rotate around the rotating part 334 in the direction indicated by r1, and the pushing part 332 forces the chip substrate 321, so that the substrate 321 rotates around the protrusion 325 in the direction indicated by r2, and the electrical contact part 322 gradually moves away from the top surface 131/ink outlet 22 until Chip 32 reaches the second position shown in FIG. 12B.
如图12B所示,受力部333与抵接部205抵接,迫推面3321与基板321抵接,电接触部322与触针204的前方表面接触。当墨盒100向后被取出时,受力部333不再与抵接部205抵接,在活动件33自身重力和芯片32的重力作用下,活动件33绕转动部334沿r1所示方向的反方向转动,同时,芯片32也绕突 起325沿r2所示方向的反方向转动,电接触部322与触针204脱离接触,芯片32从第二位置回到第一位置。As shown in FIG. 12B , the force receiving portion 333 is in contact with the contact portion 205 , the forcing surface 3321 is in contact with the substrate 321 , and the electrical contact portion 322 is in contact with the front surface of the contact pin 204 . When the ink cartridge 100 is taken out backward, the force-receiving part 333 is no longer in contact with the contact part 205, and under the action of the gravity of the movable part 33 itself and the gravity of the chip 32, the movable part 33 rotates around the rotating part 334 along the direction indicated by r1. Rotate in the opposite direction, at the same time, the chip 32 also rotates around the protrusion 325 in the opposite direction to the direction indicated by r2, the electrical contact portion 322 is out of contact with the contact pin 204, and the chip 32 returns from the second position to the first position.
优选的,在活动件33与壳体1之间或芯片32与壳体1之间还可设置复位件,当芯片32位于第二位置时,复位件积蓄势能,当受力部333不再与抵接部205抵接时,复位件释放势能,活动件33和芯片32能够快速的从第二位置回到第一位置;如上所述,突起325与凹槽的位置可互换,即突起325被设置在壳体1上,与突起325结合的凹槽被设置在基板321上,因而,对于芯片32来说,突起325或凹槽所在的位置为芯片32的定位部,芯片32可绕定位部转动。以上描述了活动件33以转动的方式活动,可实现的,活动件33还可被设置成沿前后方向平动,在墨盒100被安装的过程中,受力部333被抵接部205抵接,活动件33向后运动并将芯片基板321向上推起,使得芯片32到达电接触部321与触针204接触的第二位置,当受力部333不与抵接部205抵接时,活动件33在例如弹性件的弹性力或磁性件的磁力作用下从后向前平动,芯片32从第二位置回到第一位置。Preferably, a reset member can also be provided between the movable part 33 and the housing 1 or between the chip 32 and the housing 1. When the chip 32 is in the second position, the reset member accumulates potential energy. When the connecting portion 205 abuts, the reset member releases the potential energy, and the movable member 33 and the chip 32 can quickly return from the second position to the first position; It is arranged on the housing 1, and the groove combined with the protrusion 325 is arranged on the substrate 321. Therefore, for the chip 32, the position where the protrusion 325 or the groove is located is the positioning part of the chip 32, and the chip 32 can rotate around the positioning part. turn. It has been described above that the movable part 33 moves in a rotational manner. It can be realized that the movable part 33 can also be set to move in translation along the front and rear directions. When the ink cartridge 100 is installed, the force receiving part 333 is abutted by the abutting part 205 , the movable part 33 moves backward and pushes up the chip substrate 321, so that the chip 32 reaches the second position where the electrical contact part 321 is in contact with the contact pin 204. The part 33 translates from back to front under the action of the elastic force of the elastic part or the magnetic force of the magnetic part, and the chip 32 returns from the second position to the first position.
实施例三Embodiment Three
图13是本发明实施例三涉及的容器被安装后,芯片组件与容器容纳腔的相对位置示意图。FIG. 13 is a schematic diagram of the relative positions of the chip component and the container accommodating cavity after the container involved in the third embodiment of the present invention is installed.
本实施例是对实施例二的进一步改进,如图13所示,受力部333被墨盒容纳腔200的底面206抵接,在墨盒200被安装后,受力部333全部位于底面206的下方,活动件33的状态更稳定,进一步的,本实施例中,墨盒100还包括位于芯片32与壳体1之间的复位件19,优选的,复位件19为诸如压缩弹簧/拉伸弹簧、橡胶块等的弹性部件,本实施例更优选的,复位件19为橡胶块。This embodiment is a further improvement on Embodiment 2. As shown in FIG. 13 , the force receiving portion 333 is abutted against the bottom surface 206 of the ink cartridge containing cavity 200 , and after the ink cartridge 200 is installed, the force receiving portion 333 is all located below the bottom surface 206 , the state of the movable part 33 is more stable. Further, in this embodiment, the ink cartridge 100 also includes a reset member 19 located between the chip 32 and the housing 1. Preferably, the reset member 19 is such as a compression spring/tension spring, Elastic components such as rubber blocks, more preferably in this embodiment, the reset member 19 is a rubber block.
如图13所示,橡胶块19包括相互结合的上部19a和下部19b,通过位于下部19b下方呈平面状的底面193,橡胶块19可被稳定的放置在墨水腔顶面131上,沿前后方向,上部19a的最大尺寸小于下部19b的最大尺寸,较为优选的是,底面193在前后方向的尺寸最大,有利于橡胶块19始终稳定的被保持在顶面131上,或者当橡胶块19接触顶面131时能够保持稳定。As shown in Figure 13, the rubber block 19 includes an upper part 19a and a lower part 19b that are combined with each other, and the rubber block 19 can be stably placed on the top surface 131 of the ink chamber through the planar bottom surface 193 below the lower part 19b, along the front-rear direction , the maximum size of the upper part 19a is smaller than the maximum size of the lower part 19b. It is more preferable that the size of the bottom surface 193 in the front-to-back direction is the largest, which is conducive to the rubber block 19 being kept stably on the top surface 131, or when the rubber block 19 touches the top surface. Face 131 can remain stable.
进一步的,上部19a的外表面呈弧形,以利于接收作用力,沿上下方向延伸的第一长条孔/第一椭圆孔191设置在上部19a上,沿前后方向延伸的第二长条孔/第二椭圆孔192设置在下部19b上,橡胶块19通过第一长条孔/第一椭圆孔191与芯片32结合,具体为,突起325穿过第一长条孔/第一椭圆孔191。Further, the outer surface of the upper part 19a is arc-shaped to facilitate receiving force, the first elongated hole/first oval hole 191 extending along the up-down direction is arranged on the upper part 19a, and the second elongated hole extending along the front-rear direction /The second oval hole 192 is arranged on the lower part 19b, and the rubber block 19 is combined with the chip 32 through the first elongated hole/the first oval hole 191, specifically, the protrusion 325 passes through the first elongated hole/the first oval hole 191 .
在墨盒100被安装前,芯片32与橡胶块19的相对位置不做限制,二者可相互接触,也可保持相互分离,芯片32处于电接触部322与触针204之间不建立通信连接的第一位置;当墨盒100被安装时,墨盒容纳腔底面206压迫受力部333,迫推部332迫推基板321,使得芯片32设置有电接触部322的一端向上运动,直至电接触部322与触针204接触,相应的,突起325的后方所在侧向下运动,橡胶块19被压缩,此时,芯片32处于电接触部322与触针204之间建立通信连接的第二位置。当墨盒100被取出时,受力部333不再被墨盒容纳腔底面206压迫,芯片32在自身重力或/和橡胶块19的复位力作用下从第二位置回到第一位置。Before the ink cartridge 100 is installed, the relative position of the chip 32 and the rubber block 19 is not limited, the two can be in contact with each other, and can also be kept separated from each other. First position; when the ink cartridge 100 is installed, the bottom surface 206 of the ink cartridge accommodating chamber presses the stressed portion 333, and the forcing portion 332 pushes the substrate 321, so that the end of the chip 32 provided with the electrical contact portion 322 moves upward until the electrical contact portion 322 Contacting the contact pin 204 , correspondingly, the rear side of the protrusion 325 moves downward, and the rubber block 19 is compressed. At this time, the chip 32 is in the second position where the communication connection is established between the electrical contact portion 322 and the contact pin 204 . When the ink cartridge 100 is taken out, the force receiving portion 333 is no longer pressed by the bottom surface 206 of the ink cartridge accommodating chamber, and the chip 32 returns from the second position to the first position under the action of its own gravity or/and the reset force of the rubber block 19 .
如上所述,第一长条孔/第一椭圆孔191沿上下方向延伸,因而,沿上下方向,上部19a可以具有更大的变形量,第二长条孔/第二椭圆孔192沿前后方向延伸,沿上下方向,下部19b的变形量比上部19a的变形量小,但下部19b可确保橡胶块19稳定的与墨水腔顶面131抵接,进而保证橡胶块19在受到芯片32的压迫力时不发生位移。As mentioned above, the first elongated hole/first elliptical hole 191 extends in the up-down direction, thus, the upper portion 19a can have a larger deformation along the up-down direction, and the second elongated hole/second elliptical hole 192 extends in the front-back direction. Extending, along the up and down direction, the deformation of the lower part 19b is smaller than that of the upper part 19a, but the lower part 19b can ensure that the rubber block 19 is in stable contact with the top surface 131 of the ink chamber, thereby ensuring that the rubber block 19 is pressed by the chip 32 no displacement occurs.
可简化的,第二长条孔/第二椭圆孔192还可被取消,此时,橡胶块19仅保留第一长条孔/第一椭圆孔191,同样的,沿上下方向,上部19a的变形量大于下部19b的变形量;或者,第一长条孔/第一椭圆孔191被取消,橡胶块19仅保留第二长条孔/第二椭圆孔192,此时,沿上下方向,上部19a的变形量小于下部19b的变形量。无论橡胶块19的上部19a和下部19b的形状如何改变,所述长条孔/椭圆孔的形状如何改变,下部19b的底面193优选为平面。Simplified, the second elongated hole/second oval hole 192 can also be canceled. At this time, the rubber block 19 only retains the first elongated hole/first oval hole 191. Similarly, along the up-down direction, the upper part 19a The amount of deformation is greater than that of the lower part 19b; or, the first elongated hole/first elliptical hole 191 is canceled, and the rubber block 19 only retains the second elongated hole/second elliptical hole 192. At this time, along the up-down direction, the upper part The amount of deformation of 19a is smaller than that of the lower portion 19b. No matter how the shape of the upper part 19a and the lower part 19b of the rubber block 19 changes, or how the shape of the elongated hole/elliptical hole changes, the bottom surface 193 of the lower part 19b is preferably a plane.
本领域技术人员可理解的,所述底面193在不被设置成平面的情况下,还可以被设置成具有较大摩擦力的摩擦面,或者下部19b被设置成类似吸盘的结构,以橡胶块19受到芯片32的作用力时能够保持相对于墨水腔顶面131不发生位移为优。Those skilled in the art can understand that, if the bottom surface 193 is not set as a plane, it can also be set as a friction surface with a relatively large frictional force, or the lower part 19b can be set as a structure similar to a suction cup, with a rubber block 19 is preferably able to maintain no displacement relative to the top surface 131 of the ink chamber when subjected to the force of the chip 32 .
实施例四Embodiment four
图14是本发明实施例四涉及的容器被安装前,芯片组件与容器容纳腔的相对位置示意图。Fig. 14 is a schematic diagram of the relative positions of the chip component and the container accommodating cavity before the container according to the fourth embodiment of the present invention is installed.
与实施例二和实施例三不同的是,本实施例中的芯片32位于第一位置时,活动件33与芯片32不接触,芯片32位于第二位置时,活动件33与芯片32接触,也就是说,本实施例中的芯片32通过其自身的结构布置在突起325的前后两侧实现平衡,此处的“平衡”是指芯片32在不借助外部部件的情况下,仅依靠其自身的突起325实现在第一位置保持静止的状态,此时,芯片32除了突起325与壳体1接触外,其他部件均不与壳体1接触。Different from Embodiment 2 and Embodiment 3, when the chip 32 in this embodiment is in the first position, the movable part 33 is not in contact with the chip 32, and when the chip 32 is in the second position, the movable part 33 is in contact with the chip 32, That is to say, the chip 32 in this embodiment is balanced on the front and rear sides of the protrusion 325 through its own structural arrangement. The "balance" here means that the chip 32 only relies on its own The protrusion 325 of the chip 32 realizes a static state at the first position. At this time, except the protrusion 325 is in contact with the housing 1 , other parts of the chip 32 are not in contact with the housing 1 .
例如,如果需要使得芯片32在第一位置保持与前后方向基本平行,那么可将芯片32设置成沿前后方向,芯片32的前方末端到突起325之间的质量与芯片32的后方末端到突起325之间的质量相等即可,如果需要使得芯片32在第一位置保持与前后方向倾斜,且设置有电触点322的前方末端向上倾斜,那么可将芯片32设置成,沿前后方向,芯片32的前方末端到突起325之间的力矩小于芯片32的后方末端到突起325之间的力矩即可。For example, if it is necessary to make the chip 32 remain substantially parallel to the front-to-back direction in the first position, the chip 32 can be arranged so that along the front-to-back direction, the mass between the front end of the chip 32 to the protrusion 325 is the same as the mass between the rear end of the chip 32 to the protrusion 325. If it is necessary to keep the chip 32 in the first position inclined to the front-rear direction, and the front end provided with the electrical contact 322 is inclined upward, then the chip 32 can be set so that, along the front-rear direction, the chip 32 The moment between the front end of the chip 32 and the protrusion 325 is smaller than the moment between the rear end of the chip 32 and the protrusion 325 .
本实施例中,芯片32还包括用于调节突起325两侧质量的配重件326,根据位于第一位置的芯片姿态需求,配重件326可被安装在基板321或电池324上,如图14所示,芯片32位于第一位置,且电接触部322所在的前方末端向上倾斜,配重件326被安装在突起325的后方,如图14中局部R4所示,基板321与活动件的迫推部332之间形成间隙g,芯片32通过突起325被保持在前方末端向上倾斜的姿态。In this embodiment, the chip 32 also includes a counterweight 326 for adjusting the mass on both sides of the protrusion 325. According to the posture requirements of the chip at the first position, the counterweight 326 can be installed on the substrate 321 or the battery 324, as shown in the figure As shown in 14, the chip 32 is located at the first position, and the front end where the electrical contact portion 322 is located is inclined upwards, and the counterweight 326 is installed behind the protrusion 325, as shown by the part R4 in FIG. 14 , the substrate 321 and the movable part A gap g is formed between the pushing parts 332 , and the chip 32 is held by the protrusion 325 in a posture in which the front end is inclined upward.
当墨盒100被安装时,受力部333被抵接部205抵接,迫推部332开始与基板321接触,芯片32/基板321从第一位置向着第二位置转动,直至电接触部322与触针204接触,当墨盒100向后被取出时,受力部333不再被抵接部205抵接,活动件33逐渐复位,芯片32在自身重力作用下也逐渐从第二位置回到第一位置。When the ink cartridge 100 is installed, the force-receiving portion 333 is abutted by the abutment portion 205, the forcing portion 332 starts to contact the substrate 321, and the chip 32/substrate 321 rotates from the first position to the second position until the electrical contact portion 322 is in contact with the substrate 321. When the contact pin 204 is in contact, when the ink cartridge 100 is taken out backwards, the force-receiving part 333 is no longer abutted by the abutment part 205, the movable part 33 is gradually reset, and the chip 32 is also gradually returned from the second position to the first position under the action of its own gravity. a location.
相对于上述实施例中的芯片组件3,本实施例中的芯片组件3被简化成仅包括芯片32,不仅芯片组件3的结构得到简化,相应的,墨盒100的结构也被简化;另一方面,在第一位置,芯片32不与活动件33接触,在受力部333与抵接部205抵接前,活动件33即使与墨盒容纳腔200中的部件产生轻微干涉,导致活动件33产生移动,芯片32也不会运动至与触针座202干涉的位置,因而,活动件33的尺寸精度要求可以降低。Compared with the chip component 3 in the above-mentioned embodiment, the chip component 3 in this embodiment is simplified to only include the chip 32, not only the structure of the chip component 3 is simplified, correspondingly, the structure of the ink cartridge 100 is also simplified; on the other hand , in the first position, the chip 32 is not in contact with the movable part 33, and before the force-receiving part 333 abuts against the abutment part 205, even if the movable part 33 slightly interferes with the components in the ink cartridge accommodating cavity 200, the movable part 33 will Moving, the chip 32 will not move to a position where it interferes with the contact pin seat 202 , therefore, the requirement for dimensional accuracy of the movable part 33 can be reduced.
进一步的,本实施例中的芯片32还可以被设置成,在第一位置时,芯片32仍然通过自身结构设置实现上述平衡,但迫推部332与基板321无限靠近,从视觉上看,二者有接触,但当迫推部332被远离基板 321时,芯片32仍然保持不动;此种结构设置可减小迫推部332的移动距离。Further, the chip 32 in this embodiment can also be set so that, in the first position, the chip 32 still achieves the above-mentioned balance through its own structural setting, but the pushing part 332 is infinitely close to the substrate 321, visually, the two However, when the pushing part 332 is moved away from the substrate 321, the chip 32 remains still; this structural arrangement can reduce the moving distance of the pushing part 332.
实施例五Embodiment five
图15是本发明实施例五涉及的容器的部分部件分解示意图;图16是本发明实施例五涉及的容器在被安装至容器容纳腔之前,沿左右方向观察容器和设备中的容器容纳腔的侧视图。Fig. 15 is an exploded view of some parts of the container according to the fifth embodiment of the present invention; Fig. 16 is a view of the container and the container accommodating chamber in the device viewed from the left and right direction before the container according to the fifth embodiment of the present invention is installed in the container accommodating chamber side view.
沿前后方向,以突起325所在位置为界,芯片32被分为位于突起325前方的第一部分321a和位于突起325后方的第二部分321b,电接触部322位于第二部分321b。在芯片32被安装后,沿上下方向,第二部分321b位于比第一部分321a更高的位置,或者说,第二部分321b位于第一部分321a的上方,且在第二部分321b中,至少电接触部322突出至壳体1的外侧,优选的,第一部分321a不超出壳体1,在芯片32随着墨盒100向着喷墨打印机安装的过程中,位于前方的第一部分321a不会与喷墨打印机内壁产生干涉,从而可加快墨盒100的安装速度;如图16所示,墨盒100还包括沿前后方向与芯片32相邻设置的光衰减部102,在墨盒100的安装过程中,所述光衰减部102可被喷墨打印机检测到,当光衰减部102位于芯片32的前方时,沿上下方向,至少电接触部322位于光衰减部102的上方,且触针204的最低点与电接触部322相交于一个与上下方向垂直的平面D(如图16中虚线所示);沿前后方向,电接触部322比光衰减部102更远离出墨口,即使有墨水从出墨口泄漏,电接触部322受到的影响也较小。Along the front-to-back direction, the chip 32 is divided into a first portion 321a located in front of the protrusion 325 and a second portion 321b located behind the protrusion 325 with the position of the protrusion 325 as the boundary. The electrical contact portion 322 is located in the second portion 321b. After the chip 32 is mounted, the second part 321b is located at a higher position than the first part 321a along the up-down direction, or in other words, the second part 321b is located above the first part 321a, and in the second part 321b, at least the electrical contacts The part 322 protrudes to the outside of the housing 1. Preferably, the first part 321a does not exceed the housing 1. When the chip 32 is installed toward the inkjet printer along with the ink cartridge 100, the first part 321a positioned at the front will not come into contact with the inkjet printer. The inner walls interfere, thereby speeding up the installation speed of the ink cartridge 100; as shown in Figure 16, the ink cartridge 100 also includes a light attenuation part 102 arranged adjacent to the chip 32 along the front and rear direction, during the installation process of the ink cartridge 100, the light attenuation The part 102 can be detected by the inkjet printer. When the light attenuating part 102 is located in front of the chip 32, along the vertical direction, at least the electrical contact part 322 is located above the light attenuating part 102, and the lowest point of the contact pin 204 is in contact with the electrical contact part. 322 intersects on a plane D perpendicular to the up-down direction (as shown by the dotted line in Figure 16); along the front-to-back direction, the electrical contact portion 322 is farther away from the ink outlet than the light attenuation portion 102, even if there is ink leaking from the ink outlet, the electrical contacts The contact portion 322 is also less affected.
如图16所示,当墨盒100沿向前的方向被安装时,在电接触部322与触针204接触前,电接触部322会与触针座阻挡壁202b干涉,随着墨盒100的继续安装,电接触部322连同第二部分321b被阻挡壁202b向下压迫而使得芯片32绕突起325沿顺时针方向(如图15中从左向右观察的r2方向)转动,直至电接触部322越过阻挡壁202b进入触针腔202a,最后,芯片32在下述保持组件的作用下回到第二部分321b位于第一部分321a上方的位置,电接触部322与触针204保持接触。As shown in FIG. 16, when the ink cartridge 100 is installed in the forward direction, before the electrical contact portion 322 contacts the contact pin 204, the electrical contact portion 322 will interfere with the contact pin seat blocking wall 202b, and as the ink cartridge 100 continues Installation, the electrical contact portion 322 is pressed down by the blocking wall 202b together with the second portion 321b so that the chip 32 rotates clockwise around the protrusion 325 (as viewed from left to right in FIG. 15 in the r2 direction), until the electrical contact portion 322 Going over the barrier wall 202b and entering the contact pin chamber 202a, finally, the chip 32 returns to the position where the second part 321b is above the first part 321a under the action of the holding assembly described below, and the electrical contact part 322 keeps in contact with the contact pin 204 .
当墨盒100沿向后的方向被取出时,位于触针腔202a内的第二部分321b可能会与阻挡壁202b面向触针腔的一侧干涉,此时,可通过减小第二部分321b进入触针腔202a的尺寸,以减轻第二部分321b受到的干涉,在不借助外部部件的情况下,操作人员向后拉动墨盒100即可将墨盒取出。When the ink cartridge 100 is taken out in the backward direction, the second part 321b located in the stylus cavity 202a may interfere with the side of the barrier wall 202b facing the stylus cavity, at this time, the second part 321b can be entered by reducing the The size of the stylus chamber 202a is such that the second part 321b is less interfered, and the operator can pull the ink cartridge 100 backward to take out the ink cartridge without using external parts.
用于将芯片32保持在第二部分321b高于第一部分321a的保持组件既可以是来自芯片32/基板321以外的外部部件也可以是构成芯片32/基板321自身的部件,下面分别进行说明。The holding components used to hold the chip 32 at the second portion 321b higher than the first portion 321a can be external components other than the chip 32/substrate 321 or components constituting the chip 32/substrate 321 itself, which will be described below.
当保持组件是来自芯片32/基板321以外的外部部件时,如图15所示,保持组件是设置在基板32/第一部分321a上的配重件326,总体上,配重件326的安装使得第一部分321a的前方末端到突起325的力矩大于第二部分321b的后方末端到突起325的力矩,这样,当芯片32被安装后,在重力作用下将呈现出第二部分321b高于第一部分321a的状态。在芯片32越过阻挡壁202b的过程中,阻挡壁202b压迫第二部分321b,使得芯片32整体绕突起325沿r2所示方向转动,直至第二部分321b到达触针腔202a,随后,在保持组件的作用下,芯片32再次回到第二部分321b高于第一部分321a的状态;优选的,配重件326到突起325的力矩被设置成远大于电接触部322到突起325的力矩,因而,电接触部322与触针204可保持紧密接触。When the holding component is from an external component other than the chip 32/substrate 321, as shown in FIG. The moment from the front end of the first part 321a to the protrusion 325 is greater than the moment from the rear end of the second part 321b to the protrusion 325, so that when the chip 32 is installed, the second part 321b will appear higher than the first part 321a under the action of gravity. status. When the chip 32 passes over the blocking wall 202b, the blocking wall 202b presses the second part 321b, so that the whole chip 32 rotates around the protrusion 325 in the direction shown by r2 until the second part 321b reaches the contact pin chamber 202a, and then the holding assembly Under the action of the chip 32, the chip 32 returns to the state where the second part 321b is higher than the first part 321a; preferably, the moment of the counterweight 326 to the protrusion 325 is set to be much larger than the moment of the electrical contact 322 to the protrusion 325, thus, The electrical contact portion 322 can maintain close contact with the contact pin 204 .
可实现的,所述保持组件还可以是设置在芯片32/基板321和壳体1上的磁铁组,利用磁力将芯片32保持在第二部分321b高于第一部分321a的状态。Realizable, the holding component can also be a magnet set arranged on the chip 32 /substrate 321 and the housing 1 , and use magnetic force to keep the chip 32 in a state where the second part 321b is higher than the first part 321a.
当保持组件是来自芯片32自身的部件时,保持组件是第一部分321a的至少一部分,此时,第一部 分321a的至少一部分的材质不同于基板321的其他部分材质,第一部分321a的至少一部分的材质密度高于通常形成基板的材质(例如树脂、玻璃纤维、铝基板等)密度,可选的,金属、实木、高密度橡胶等均适用。When the holding component is a part from the chip 32 itself, the holding component is at least a part of the first part 321a. At this time, the material of at least a part of the first part 321a is different from other parts of the substrate 321. The material of at least a part of the first part 321a The density is higher than the density of the material (such as resin, glass fiber, aluminum substrate, etc.) that usually forms the substrate. Optionally, metal, solid wood, high-density rubber, etc. are applicable.
进一步的,在取出墨盒100的过程中,为使得芯片32(第二部分321b/电接触部322)能够相对于壳体1运动,具体为,芯片32进入触针腔202a的部分能够从触针腔202a内部轻易的越过阻挡壁202b到达触针腔202a外部,芯片组件32还包括辅助件,同样的,该辅助件可以是来自芯片32外部的部件也可以是来自芯片32自身的部件,下面分别进行说明。Further, in the process of taking out the ink cartridge 100, in order to enable the chip 32 (second part 321b/electrical contact portion 322) to move relative to the housing 1, specifically, the part of the chip 32 entering the contact pin cavity 202a can be removed from the contact pin The interior of the cavity 202a easily crosses the barrier wall 202b to reach the outside of the stylus cavity 202a. The chip assembly 32 also includes auxiliary parts. Similarly, the auxiliary parts can be parts from the outside of the chip 32 or parts from the chip 32 itself. The following are respectively Be explained.
当该辅助件为芯片32以外的外部部件时,如图15所示,辅助件为位于基板321和壳体1之间的弹性体35,在电接触部322与触针204保持电接触时,芯片32可不借助弹性体35的作用,而是通过上述保持组件保持在第二部分321b高于第一部分321a的状态,当芯片32随着墨盒整体向后移动,第二部分321b与阻挡壁202b面向触针腔的一侧干涉时,芯片32发生翻转或被向下压迫而避开阻挡壁202b,最终,芯片32的第二部分321b越过阻挡壁202b,墨盒100被顺利的取出,当墨盒100从墨盒容纳腔取出后,辅助件35迫使芯片32从第二位置回到第一位置,因而,辅助件35也可被视为保持组件的一种。When the auxiliary part is an external component other than the chip 32, as shown in FIG. 15, the auxiliary part is an elastic body 35 located between the substrate 321 and the housing 1. The chip 32 can be kept in a state where the second part 321b is higher than the first part 321a by the above-mentioned retaining assembly without the action of the elastic body 35. When the chip 32 moves backward with the ink cartridge as a whole, the second part 321b faces the blocking wall 202b. When one side of the stylus cavity interferes, the chip 32 is overturned or pressed downward to avoid the blocking wall 202b. Finally, the second part 321b of the chip 32 crosses the blocking wall 202b, and the ink cartridge 100 is taken out smoothly. After the ink cartridge accommodating cavity is taken out, the auxiliary part 35 forces the chip 32 to return to the first position from the second position, therefore, the auxiliary part 35 can also be regarded as a kind of holding component.
可选的,所述弹性体35还可被固定安装在壳体1上,同样的,所述弹性体35只有在墨盒100取出过程中,芯片32与阻挡壁202b产生干涉时才会起作用。Optionally, the elastic body 35 can also be fixedly mounted on the casing 1 , and similarly, the elastic body 35 will only function when the chip 32 interferes with the blocking wall 202 b during the removal of the ink cartridge 100 .
当该辅助件为芯片32的自身部件时,所述辅助件可以是设置在基板321上的活动连接机构,例如,基板321的第一部分321a与第二部分321b为活动连接,当第二部分321b与阻挡壁202b产生干涉时,第二部分321b相对于第一部分321a/壳体1运动而避开阻挡壁202b。When the auxiliary part is a self-component of the chip 32, the auxiliary part can be an active connection mechanism arranged on the substrate 321, for example, the first part 321a of the substrate 321 is movably connected to the second part 321b, when the second part 321b When interfering with the blocking wall 202b, the second part 321b moves relative to the first part 321a/housing 1 and avoids the blocking wall 202b.
在一些实施例中,辅助件为基板321的至少一部分,且该基板的至少一部分由柔性线路板制成,当第二部分321b与阻挡壁202b产生干涉时,基板321自身可发生变形,使得第二部分321b越过阻挡壁202b。In some embodiments, the auxiliary part is at least a part of the substrate 321, and at least a part of the substrate is made of a flexible circuit board. When the second part 321b interferes with the barrier wall 202b, the substrate 321 itself can be deformed, so that the second part 321b can be deformed. The second portion 321b passes over the barrier wall 202b.
在上述实施例中,容器100沿前后方向向前被安装,沿安装方向,第二部分321b位于第一部分321a的上游,沿与安装方向垂直的上下方向,第二部分321b高于第一部分321a,或者说,第二部分321b比第一部分321a更远离容器壳体1/出墨组件2/出墨口,优选的,第二部分321b超出容器壳体1,第一部分321a不超出容器壳体1;在另一些实施例中,容器100不是沿前后方向向前被安装,而是沿上下方向向下被安装,此时,沿安装方向,第二部分321b仍然位于第一部分321a的上游,沿与安装方向垂直的前后方向,第二部分321b将位于第一部分321a的前方或后方,或者说,第二部分321b比第一部分321a更远离容器壳体1/出墨组件2/出墨口,优选的,第二部分321a超出容器壳体1,第一部分321a不超出容器壳体1。In the above-mentioned embodiment, the container 100 is installed forward along the front-to-back direction, along the installation direction, the second part 321b is located upstream of the first part 321a, and along the up-down direction perpendicular to the installation direction, the second part 321b is higher than the first part 321a, In other words, the second part 321b is farther away from the container housing 1/ink outlet assembly 2/ink outlet than the first part 321a, preferably, the second part 321b exceeds the container housing 1, and the first part 321a does not exceed the container housing 1; In some other embodiments, the container 100 is not installed forward along the front-to-back direction, but is installed downward along the up-down direction. At this time, along the installation direction, the second part 321b is still located upstream of the first part 321a, along with the installation direction. The direction is vertical to the front and rear direction, the second part 321b will be located in front or behind the first part 321a, or in other words, the second part 321b is farther away from the container housing 1/ink outlet assembly 2/ink outlet than the first part 321a, preferably, The second part 321a protrudes from the container housing 1 , and the first part 321a does not protrude from the container housing 1 .
实施例六Embodiment six
图17是本发明实施例六涉及的容器中部分部件的分解示意图。Fig. 17 is an exploded schematic view of some components in the container according to the sixth embodiment of the present invention.
本实施例中的芯片组件3仍然包括相互结合的芯片32和芯片座31,其中,芯片座31被固定设置在壳体1上,相对于前后方向向上倾斜的导引槽316被设置在芯片座31上,芯片32可通过其中设置的突起/定位部327沿导引槽316滑动。进一步的,芯片组件3还包括与芯片32活动结合的活动件34,如图17所示,基板32上设置有开口328,活动件34包括中间体341、受力部342、抬升杆343和转轴344,抬升杆343穿过开口328,二者之间为间隙配合,即开口328的最小尺寸大于抬升杆343的最大尺寸,转轴344 与壳体1可转动地配合。The chip assembly 3 in this embodiment still includes a chip 32 and a chip holder 31 combined with each other, wherein the chip holder 31 is fixedly arranged on the housing 1, and the guide groove 316 inclined upward relative to the front-rear direction is arranged on the chip holder. 31 , the chip 32 can slide along the guide groove 316 through the protrusion/positioning portion 327 provided therein. Further, the chip assembly 3 also includes a movable part 34 that is movably combined with the chip 32. As shown in FIG. 344 , the lifting rod 343 passes through the opening 328 , and there is a clearance fit between the two, that is, the minimum size of the opening 328 is greater than the maximum size of the lifting rod 343 , and the rotating shaft 344 is rotatably matched with the housing 1 .
当墨盒100被安装时,阻挡壁202b与受力部342抵接,抬升杆343随着活动件34绕转轴344转动,同时,抬升杆343通过推动基板321沿导引槽316滑动,使得芯片32从第一位置运动至第二位置。When the ink cartridge 100 is installed, the blocking wall 202b abuts against the force-receiving part 342, and the lifting rod 343 rotates around the rotating shaft 344 along with the movable part 34. Move from a first position to a second position.
当墨盒100被取出时,阻挡壁202b不再与受力部342抵接,在芯片32自身重力和活动件34的重力作用下,活动件34再次绕转轴344反向转动,同时,抬升杆343带动基板321沿导引槽316滑动,使得芯片32从第二位置回到第一位置。When the ink cartridge 100 is taken out, the blocking wall 202b is no longer in contact with the force-receiving part 342, and under the action of the gravity of the chip 32 itself and the gravity of the movable part 34, the movable part 34 rotates in the opposite direction around the rotating shaft 344 again, and at the same time, the lifting lever 343 The substrate 321 is driven to slide along the guide groove 316 , so that the chip 32 returns from the second position to the first position.
实施例七Embodiment seven
图18是本发明实施例七涉及的容器中部分部件的分解示意图;图19是本发明实施例七涉及的容器中芯片座的立体图;图20是本发明实施例七涉及的容器被安装后,芯片组件与容器容纳腔的相对位置示意图。Fig. 18 is an exploded schematic view of some components in the container according to Embodiment 7 of the present invention; Fig. 19 is a perspective view of the chip holder in the container according to Embodiment 7 of the present invention; Fig. 20 is after the container according to Embodiment 7 of the present invention is installed, Schematic diagram of the relative positions of the chip assembly and the container cavity.
本实施例中,芯片组件3仍然包括相互结合的芯片座31和芯片32,其中,芯片32被固定安装在芯片座31上,芯片座31与壳体1一体形成,且芯片座31能够相对于壳体1活动。如图19中局部R5所示所示,芯片座31包括主体311、设置在主体311上的受力部315和芯片安装部317、以及连接主体311和壳体1的连接部318,所述受力部315用于与墨盒容纳腔200抵接,以接收作用力,连接部318设置有沿左右方向延伸的凹陷部319,通过该凹陷部319,主体311能够相对于壳体1在前后方向摆动。In this embodiment, the chip assembly 3 still includes a chip holder 31 and a chip 32 combined with each other, wherein the chip 32 is fixedly mounted on the chip holder 31, the chip holder 31 is integrally formed with the housing 1, and the chip holder 31 can be relatively Housing 1 is active. As shown in part R5 in FIG. 19 , the chip holder 31 includes a main body 311 , a force receiving portion 315 and a chip mounting portion 317 arranged on the main body 311 , and a connecting portion 318 connecting the main body 311 and the housing 1 . The force part 315 is used to abut against the ink cartridge containing cavity 200 to receive the acting force, and the connecting part 318 is provided with a recessed part 319 extending in the left-right direction, through which the main body 311 can swing relative to the casing 1 in the front-rear direction .
如图20所示,当受力部315与阻挡壁202b抵接时,主体311整体绕凹陷部319转动,连接部318发生变形,电接触部322所在侧向上摆动,直至电接触部322与触针204接触,芯片32从第一位置到达第二位置;当受力部315与阻挡壁202b脱离接触时,连接部318复位,导致主体311整体绕凹陷部319反向转动,芯片32从第二位置回到第一位置。As shown in Figure 20, when the force receiving part 315 abuts against the blocking wall 202b, the main body 311 rotates around the recessed part 319 as a whole, the connecting part 318 deforms, and the side where the electrical contact part 322 is located swings upward until the electrical contact part 322 and the contactor The needle 204 contacts, and the chip 32 reaches the second position from the first position; when the force-receiving part 315 is out of contact with the blocking wall 202b, the connecting part 318 resets, causing the main body 311 to rotate reversely around the recessed part 319, and the chip 32 moves from the second position to the second position. The position returns to the first position.
上述实施例描述了芯片32在从第一位置到达第二位置后,电接触部322与触针204的前方表面接触,然而,通过设置电接触部322的结构或芯片32的结构还可使得芯片32到达第二位置时,电接触部322与触针204的后方表面接触或电接触部322同时与触针204的前方表面和后方表面接触,例如,将电接触部322设置成如实施例五所述的向后上方突出于壳体1,此时,电接触部322可与触针204的后方表面接触;或将电接触部322设置成U形,此时,电接触部322可与触针204的前方表面和后方表面同时接触,相对于现有技术中的电接触部与触针204的下方尖端接触,本发明中的电接触部322与触针204的接触面积更大,更有利于保持电接触部322与触针204之间形成稳定的电连接。The above embodiment describes that after the chip 32 reaches the second position from the first position, the electrical contact portion 322 is in contact with the front surface of the contact pin 204, however, the structure of the electrical contact portion 322 or the structure of the chip 32 can also make the chip When 32 reaches the second position, the electrical contact portion 322 is in contact with the rear surface of the contact pin 204 or the electrical contact portion 322 is in contact with the front surface and the rear surface of the contact pin 204 at the same time, for example, the electrical contact portion 322 is arranged as in Embodiment 5 The above protrudes from the housing 1 backward and upward. At this time, the electrical contact portion 322 can contact the rear surface of the contact pin 204; or the electrical contact portion 322 is set in a U shape. The front surface and the rear surface of the needle 204 are in contact at the same time. Compared with the electrical contact portion in the prior art that contacts the lower tip of the contact pin 204, the contact area between the electrical contact portion 322 and the contact pin 204 in the present invention is larger and more efficient. It is beneficial to maintain a stable electrical connection between the electrical contact portion 322 and the contact pin 204 .
基于本发明的发明构思,实施例一和实施例七中的芯片座主体311也可被视为各自实施例中的活动件,同实施例二-实施例六中的活动件功能的,所述芯片座主体311被设置成可相对于壳体1活动,且芯片座主体311用于从墨盒容纳腔200中接收作用力,进而使得电接触部322从第一位置到达第二位置,当所述作用力撤销时,电接触部322从第二位置回到第一位置。Based on the inventive concept of the present invention, the chip holder main body 311 in the first embodiment and the seventh embodiment can also be regarded as the movable part in the respective embodiments, which has the same function as the movable part in the second embodiment to the sixth embodiment. The chip holder main body 311 is configured to be movable relative to the housing 1, and the chip holder main body 311 is used to receive force from the ink cartridge accommodating cavity 200, thereby making the electrical contact portion 322 reach the second position from the first position, when the When the force is removed, the electrical contact portion 322 returns from the second position to the first position.
本发明的有益效果如下:The beneficial effects of the present invention are as follows:
下表面14为平面,墨盒100可沿与前后方向平行的方向安装和取出,在所述安装和取出过程中,墨盒100的运动轨迹更简单,相应的,设备和墨盒100的结构均可被简化。The lower surface 14 is a plane, and the ink cartridge 100 can be installed and removed in a direction parallel to the front-back direction. During the installation and removal process, the movement track of the ink cartridge 100 is simpler, and accordingly, the structures of the equipment and the ink cartridge 100 can be simplified .
导气腔5中设置可与活塞23联动的刺破部232,在墨盒100的安装过程中,在吸墨针推动活塞23向后运动的同时,刺破部232将用于密封导气孔51的导气膜18刺破,使得墨水腔10与大气连通,省却了使用者在安装墨盒前需撕掉导气膜18的操作。The piercing part 232 that can be linked with the piston 23 is set in the air guide chamber 5. During the installation process of the ink cartridge 100, when the ink suction needle pushes the piston 23 to move backward, the piercing part 232 will be used to seal the air guide hole 51. The air guide film 18 is pierced, so that the ink chamber 10 communicates with the atmosphere, which saves the user from the operation of tearing off the air guide film 18 before installing the ink cartridge.
优选的,活塞23的一端形成为密封出墨口的密封端231,另一端形成为可刺破导气膜18的刺破部232,即活塞23与刺破部232一体形成,在活塞23向后运动的同时,导气膜18被活塞23直接刺破,吸墨针施加至活塞23的推力可被有效传递至刺破部232,同时,墨盒的结构将变得更简单。Preferably, one end of the piston 23 is formed as a sealing end 231 that seals the ink outlet, and the other end is formed as a piercing portion 232 that can pierce the air-conducting film 18, that is, the piston 23 and the piercing portion 232 are integrally formed, and the piston 23 is formed in the direction of the piercing portion 232. At the same time as the rearward movement, the air guide membrane 18 is directly pierced by the piston 23, and the thrust applied to the piston 23 by the ink suction needle can be effectively transmitted to the piercing part 232, and at the same time, the structure of the ink cartridge will become simpler.
在一些实施例中,当安装有活塞23的出墨腔21与导气腔5相互间隔设置时,在二者相对的面上分别设置有被密封件密封的通孔,墨盒100安装前,出墨腔21与导气腔5相互隔绝,活塞23全部位于出墨腔21,当墨盒100被安装时,吸墨针推动活塞23向后运动,刺破部232穿过密封件到达导气腔5并将导气膜18刺破,在活塞23的运动过程中,密封件与活塞杆体233的外表面接触,出墨腔21和导气腔5的密封性得到保障。In some embodiments, when the ink outlet chamber 21 on which the piston 23 is installed and the air guide chamber 5 are spaced apart from each other, through holes sealed by seals are respectively provided on the opposite surfaces of the two. Before the ink cartridge 100 is installed, the outlet The ink chamber 21 and the air guide chamber 5 are isolated from each other, and the piston 23 is all located in the ink outlet chamber 21. When the ink cartridge 100 is installed, the ink suction needle pushes the piston 23 to move backward, and the piercing part 232 passes through the seal to reach the air guide chamber 5 And the gas-guiding film 18 is punctured, and in the motion process of the piston 23, the sealing member contacts the outer surface of the piston rod body 233, and the sealing of the ink outlet chamber 21 and the air-guiding chamber 5 is guaranteed.
进一步的,出墨腔21与导气腔5相邻设置,二者通过所述第二连通孔26连通,密封件被安装在第二连通孔26上,活塞23穿过第二连通孔26,使得刺破部232位于导气腔5中,同时密封件与活塞杆体233的外表面接触,出墨腔21和导气腔5仍保持相互隔绝的状态;当活塞23向后运动时,刺破部232可更快的将导气膜18刺破。Further, the ink outlet chamber 21 is adjacent to the air guide chamber 5, and the two communicate through the second communication hole 26, the seal is installed on the second communication hole 26, the piston 23 passes through the second communication hole 26, Make the piercing part 232 be located in the air guide chamber 5, while the seal is in contact with the outer surface of the piston rod body 233, the ink outlet chamber 21 and the air guide chamber 5 still remain in a state of being isolated from each other; when the piston 23 moves backward, the pierced The portion 232 can puncture the air-conducting membrane 18 faster.
更进一步的,活塞23与刺破部232分体形成,二者之间通过中间部件连接,通过调整中间部件,刺破部232刺破导气膜18的力度和方向均可被调整,同时,还可根据需求,延缓导气膜18被刺破的时刻,例如,使用者只是需要将墨盒100安装至设备,而不需要在安装后马上进行成像操作,导气膜18可不必在墨盒100的安装过程中被刺破,此时,吸墨针推动活塞23向后运动的作用力可被中间部件储存,待吸墨针开始从出墨腔21吸出墨水时,墨水的流动使得中间部件释放作用力,进而使得刺破部232将导气膜18刺破,此时,刺破部232也可以被认为是被活塞23触发。基于本发明的技术思路,活塞23的运动可理解为,当活塞23偏离密封位置时,导气膜18被刺破,而导气膜18被刺破的时机则可根据需求进行设定。Furthermore, the piston 23 and the puncturing part 232 are formed separately, and the two are connected through an intermediate part. By adjusting the intermediate part, the strength and direction of the piercing part 232 piercing the air-conducting membrane 18 can be adjusted. At the same time, Also according to demand, delay the moment when the air guide film 18 is pierced, for example, the user just needs to install the ink cartridge 100 to the equipment, and does not need to perform imaging operation immediately after installation, the air guide film 18 does not need to be placed on the ink cartridge 100. If it is punctured during the installation process, at this time, the force of the ink-absorbing needle pushing the piston 23 to move backward can be stored by the intermediate part, and when the ink-absorbing needle starts to suck out ink from the ink outlet chamber 21, the flow of the ink will cause the intermediate part to release the action Force, so that the piercing part 232 pierces the air-conducting membrane 18, and at this time, the piercing part 232 can also be considered as being triggered by the piston 23. Based on the technical idea of the present invention, the movement of the piston 23 can be understood as, when the piston 23 deviates from the sealing position, the gas-guiding membrane 18 is pierced, and the timing of the gas-guiding membrane 18 being pierced can be set according to requirements.
如图4、图7和图8B所示,沿上下方向,导气腔5位于第二子下表面142与下表面14之间的空腔17中,且导气腔5不超出下表面14,在墨盒100的安装和取出过程中,导气腔5不会与设备之间产生干涉,导气膜18可被有效保护。沿前后方向,导气腔5与出墨腔21靠近前方设置,在导气腔5的后方,空腔17形成有允许刺破部232运动的空间。As shown in Fig. 4, Fig. 7 and Fig. 8B, along the up-down direction, the air guiding cavity 5 is located in the cavity 17 between the second sub-lower surface 142 and the lower surface 14, and the air guiding cavity 5 does not exceed the lower surface 14, During the installation and removal of the ink cartridge 100, the air guide chamber 5 will not interfere with the device, and the air guide film 18 can be effectively protected. Along the front-rear direction, the air-guiding chamber 5 and the ink outlet chamber 21 are disposed near the front, and behind the air-guiding chamber 5 , the cavity 17 forms a space allowing the piercing part 232 to move.
芯片座31被设置成可在第一位置和第二位置之间移动,在芯片32中,至少电接触部322被安装在芯片座31上,并可随着芯片座31在第一位置和第二位置之间移动,在第一位置,电接触部322不与设备中的触针204接触,在第二位置,电接触部322与触针204接触,且沿上下方向,在第二位置的电接触部322与墨水腔顶面131/出墨腔21的中心线C/墨盒下表面14之间的距离大于在第一位置的电接触部322与墨水腔顶面131/出墨腔21的中心线C/墨盒下表面14之间的距离,一方面,墨盒100在安装过程中,芯片座31/电接触部322不会与设备产生干涉,另一方面,设备工作时,沿上下方向,电接触部322离出墨腔21尽量远,吸墨针从出墨腔21吸取墨水时产生的振动不易对电接触部322与触针的接触造成影响。The chip holder 31 is configured to be movable between the first position and the second position. In the chip 32, at least the electrical contact portion 322 is installed on the chip holder 31, and can move along with the chip holder 31 between the first position and the second position. Move between two positions, in the first position, the electrical contact portion 322 is not in contact with the contact pin 204 in the device, in the second position, the electrical contact portion 322 is in contact with the contact pin 204, and along the up and down direction, in the second position The distance between the electrical contact portion 322 and the centerline C/ink cartridge lower surface 14 of the ink chamber top surface 131/the ink chamber 21 is greater than the distance between the electrical contact portion 322 at the first position and the ink chamber top surface 131/the ink chamber 21 The distance between the center line C/the lower surface 14 of the ink cartridge, on the one hand, during the installation process of the ink cartridge 100, the chip seat 31/electrical contact portion 322 will not interfere with the device; on the other hand, when the device is working, along the up and down direction, The electrical contact part 322 is as far away from the ink outlet chamber 21 as possible, and the vibration generated when the ink sucking needle absorbs ink from the ink outlet chamber 21 is unlikely to affect the contact between the electrical contact part 322 and the contact pin.
另外,至少电接触部322可随着芯片座31在第一位置和第二位置之间移动,因而,电接触部322在芯片座31的安装位置精度要求可被降低。In addition, at least the electrical contact portion 322 can move between the first position and the second position along with the die holder 31 , thus, the accuracy requirement of the mounting position of the electrical contact portion 322 on the die holder 31 can be reduced.
电接触部322位于芯片座31的前方,当芯片座31采用转动的方式时,芯片座31的旋转轴线L更靠近芯片座31的后方末端,在芯片座31自身重力的作用下,芯片座31具有绕旋转轴线L沿图4中r’所示方向转动的趋势,这样,当受力面315a与阻挡壁202b脱离接触时,芯片座31在自身重力作用下自动绕旋转轴线L沿r’所示方向从第二位置回到第一位置;由此可见,此种设置可使得芯片座31不依靠外部作用力即可从第二位置回到第一位置,芯片组件3的结构可被简化。The electrical contact portion 322 is located in front of the chip holder 31. When the chip holder 31 is rotated, the rotation axis L of the chip holder 31 is closer to the rear end of the chip holder 31. Under the action of the chip holder 31's own gravity, the chip holder 31 It has a tendency to rotate around the axis of rotation L along the direction shown by r' in FIG. The direction shown returns from the second position to the first position; it can be seen that this arrangement enables the chip holder 31 to return from the second position to the first position without relying on external force, and the structure of the chip assembly 3 can be simplified.
底壳顶面131低于壳体上表面13,如图7所示,至少在第一位置,芯片座31的至少一部分位于顶面131和上表面13之间,当墨盒100组装完成后,芯片座31可被壳体1保护,仅通过壳体1的上方暴露,芯片座31以及安装在芯片座上的电接触部322/芯片32可被壳体1有效保护,降低了电接触部322/芯片32被损坏的概率。The top surface 131 of the bottom case is lower than the upper surface 13 of the casing. As shown in FIG. The seat 31 can be protected by the shell 1, and only exposed through the top of the shell 1, the chip seat 31 and the electrical contact portion 322/chip 32 mounted on the chip seat can be effectively protected by the shell 1, reducing the electrical contact portion 322/ The probability that chip 32 is damaged.
芯片座31位于第一位置时,芯片座31相对于前后方向向上倾斜,相应的,位于芯片座31上的电接触部322也相对于前后方向向上倾斜,这样,无论芯片座31采用转动方式还是平动方式,电接触部322均可更快的与触针204接触,与现有电接触部322相对于前后方向平行的设置方式相比,在芯片座31沿上下方向运动的距离为一定值的情况下,显然,芯片座31位于第二位置时,本发明中的电接触部322与触针204接触的更紧密。When the chip holder 31 is in the first position, the chip holder 31 is inclined upward relative to the front-to-back direction, and correspondingly, the electrical contact portion 322 on the chip holder 31 is also inclined upward relative to the front-rear direction. In the translation mode, the electrical contact part 322 can be in contact with the contact pin 204 faster. Compared with the existing arrangement in which the electrical contact part 322 is parallel to the front and rear directions, the distance that the chip holder 31 moves in the up and down direction is a certain value. Obviously, when the chip holder 31 is in the second position, the electrical contact portion 322 in the present invention is in closer contact with the contact pin 204 .
锁定件42由弹性橡胶制成,限位杆203与弹性橡胶42之间可产生一定的摩擦力,该摩擦力有利于克服吸墨针对活塞23向后的推力,防止墨盒100被向后推出,同时,利用弹性橡胶42的弹性,减小墨盒100安装和取出过程中,限位杆203对墨盒100的阻力;另外,在墨盒100被安装至预定位置后,限位杆203对弹性橡胶42施加有向下的作用力,可防止墨盒100以吸墨针和活塞23的接触点为圆心向下前方转动。The locking member 42 is made of elastic rubber, and a certain frictional force can be generated between the limit rod 203 and the elastic rubber 42. This frictional force is beneficial to overcome the backward thrust of the ink-absorbing piston 23 and prevent the ink cartridge 100 from being pushed out backwards. At the same time, utilize the elasticity of the elastic rubber 42 to reduce the resistance of the stop rod 203 to the ink cartridge 100 during the installation and removal of the ink cartridge 100; There is a downward force, which can prevent the ink cartridge 100 from rotating downward and forward with the contact point of the ink suction needle and the piston 23 as the center of circle.
沿上下方向,锁定组件4和芯片组件3均位于远离出墨组件2的上方,沿前后方向,芯片组件3/电接触部322比出墨组件2更靠近锁定组件4,出墨组件2工作时产生的振动更不易被传递至芯片组件3/电接触部322和锁定组件4,即使有振动从墨盒的下方传递至上方,锁定组件4也可有效抑制该振动,从而确保芯片组件3/电接触部322与设备之间稳定的电连接;沿前后方向,出墨组件2和芯片组件3均位于锁定组件4的前方,当墨盒被安装时,芯片组件3和锁定组件4均不会受到外部干扰,尤其是对于芯片组件3来说,在所述第一位置,芯片组件3仅通过墨盒上方暴露,使用者的手不会触碰到电接触部322,在所述第二位置,芯片组件3仍然被锁定组件4遮挡,使用者的手或外部部件仍然不会触碰到电接触部322,芯片32的工作稳定性得到保障。Along the up and down direction, the locking assembly 4 and the chip assembly 3 are located above and away from the ink outlet assembly 2, and along the front and rear directions, the chip assembly 3/electrical contact portion 322 is closer to the locking assembly 4 than the ink outlet assembly 2, when the ink outlet assembly 2 is working The generated vibration is less likely to be transmitted to the chip assembly 3/electric contact portion 322 and the locking assembly 4. Even if there is vibration transmitted from the bottom to the top of the ink cartridge, the locking assembly 4 can effectively suppress the vibration, thereby ensuring the chip assembly 3/electrical contact Stable electrical connection between the part 322 and the device; along the front and back directions, the ink outlet assembly 2 and the chip assembly 3 are located in front of the locking assembly 4, and when the ink cartridge is installed, the chip assembly 3 and the locking assembly 4 will not be subject to external interference , especially for the chip assembly 3, in the first position, the chip assembly 3 is only exposed above the ink cartridge, and the user's hand will not touch the electrical contact portion 322, and in the second position, the chip assembly 3 Still covered by the locking assembly 4, the user's hands or external components will still not touch the electrical contact portion 322, and the working stability of the chip 32 is guaranteed.

Claims (22)

  1. 芯片组件,可随着成像介质容器被安装至设置有触针的成像设备中,所述芯片组件包括基板、以及设置在基板上的电接触部,其特征在于,A chip assembly, which can be installed into an imaging device provided with contact pins along with the imaging medium container, the chip assembly includes a substrate and an electrical contact portion arranged on the substrate, characterized in that,
    芯片组件还包括设置在基板的定位部,芯片组件以基板可绕定位部在第一位置和第二位置之间转动的方式设置在容器的壳体上;The chip assembly also includes a positioning part arranged on the substrate, and the chip assembly is arranged on the casing of the container in such a way that the substrate can rotate around the positioning part between the first position and the second position;
    在第一位置,电接触部与触针之间不建立通信连接;In the first position, no communication connection is established between the electrical contact and the contact pin;
    在第二位置,电接触部与触针之间建立通信连接。In the second position, a communicative connection is established between the electrical contact and the contact pin.
  2. 根据权利要求1所述的芯片组件,其特征在于,容器沿前后方向向前被安装至成像设备,在第二位置,电接触部与触针的前方表面和后方表面至少之一接触。The chip assembly according to claim 1, wherein the container is mounted forwardly in a front-rear direction to the imaging device, and in the second position, the electrical contacts are in contact with at least one of a front surface and a rear surface of the stylus.
  3. 根据权利要求2所述的芯片组件,其特征在于,对于芯片来说,在第一位置,设置有电接触部的一侧比未设置电接触部的一侧高。The chip assembly according to claim 2, characterized in that, for the chip, in the first position, the side provided with the electrical contacts is higher than the side not provided with the electrical contacts.
  4. 根据权利要求3所述的芯片组件,其特征在于,芯片组件还包括用于将芯片组件保持在第一位置的保持组件。The chip assembly according to claim 3, wherein the chip assembly further comprises a holding assembly for holding the chip assembly at the first position.
  5. 根据权利要求4所述的芯片组件,其特征在于,保持组件为设置在基板上的配重件或设置在基板和壳体上的磁铁组。The chip component according to claim 4, wherein the holding component is a counterweight set on the base plate or a magnet set set on the base plate and the housing.
  6. 根据权利要求4所述的芯片组件,其特征在于,保持组件为基板自身的一部分,所述未设置电接触部的一侧的至少一部分的材质密度比设置有电接触部的一侧的材质密度高。The chip component according to claim 4, wherein the holding component is a part of the substrate itself, and the material density of at least a part of the side where the electrical contact is not provided is higher than the material density of the side where the electrical contact is provided high.
  7. 根据权利要求4所述的芯片组件,其特征在于,当芯片组件被设置成,在第二位置,电接触部与触针的后方表面接触时,芯片组件还包括位于基板与壳体之间的辅助件,在芯片组件随着容器从成像设备被取出的过程中,基板迫使辅助件发生弹性变形,当容器从成像设备被取出后,辅助件迫使基板回到第一位置。The chip assembly according to claim 4, wherein when the chip assembly is arranged such that, in the second position, the electrical contact part is in contact with the rear surface of the contact pin, the chip assembly further comprises a As for the auxiliary part, when the chip assembly is taken out from the imaging device along with the container, the substrate forces the auxiliary part to elastically deform, and when the container is taken out from the imaging device, the auxiliary part forces the substrate to return to the first position.
  8. 根据权利要求7所述的芯片组件,其特征在于,基板的至少一部分由柔性线路板制成,辅助件为该基板的至少一部分。The chip assembly according to claim 7, wherein at least a part of the substrate is made of a flexible circuit board, and the auxiliary part is at least a part of the substrate.
  9. 容器,其特征在于,容器包括容纳成像介质的壳体以及如权利要求1-8中任一项权利要求所述的芯片组件,所述芯片组件被安装在壳体上。A container, characterized in that the container includes a casing for containing the imaging medium and the chip assembly according to any one of claims 1-8, the chip assembly is mounted on the casing.
  10. 根据权利要求9所述的容器,其特征在于,沿容器的安装方向,壳体的下表面为平面。The container according to claim 9, characterized in that, along the installation direction of the container, the lower surface of the shell is a plane.
  11. 根据权利要求9所述的容器,其特征在于,容器还包括设置在壳体上的锁定组件,所述锁定组件的至少之一被设置成可沿与容器安装方向相交的方向运动,当容器被安装至成像设备后,锁定组件与成像设备中的限位杆抵接。The container according to claim 9, characterized in that, the container further comprises locking components arranged on the housing, at least one of the locking components is configured to move in a direction intersecting with the installation direction of the container, when the container is After being installed on the imaging device, the locking component abuts against the limiting rod in the imaging device.
  12. 根据权利要求9或10或11所述的容器,其特征在于,容器还包括成像介质排出腔、触发件、与触发件联动的被触发件、用于向壳体内导入大气的导气腔以及用于密封导气腔的导气膜;The container according to claim 9, 10 or 11, characterized in that the container further comprises an imaging medium discharge chamber, a trigger, a triggered part linked with the trigger, an air guide chamber for introducing atmosphere into the casing, and a The air guide film used to seal the air guide cavity;
    触发件设置在成像介质排出腔中,用于密封成像介质排出腔末端形成的成像介质排出口;The trigger is arranged in the imaging medium discharge chamber, and is used for sealing the imaging medium discharge port formed at the end of the imaging medium discharge chamber;
    当触发件被成像设备中的部件推压而从密封成像介质排出口的密封位置移动至不密封成像介质排出口的打开位置时,被触发件将导气膜刺破,导气腔与大气连通。When the trigger is pushed by the components in the imaging device to move from the sealing position of sealing the imaging medium discharge port to the opening position of not sealing the imaging medium discharge port, the triggered part will puncture the air-guiding membrane, and the air-guiding cavity will communicate with the atmosphere .
  13. 根据权利要求12所述的容器,其特征在于,当容器完成组装时,被触发件位于导气腔中。The container according to claim 12, wherein when the container is fully assembled, the activated member is located in the air-guiding cavity.
  14. 根据权利要求13所述的容器,其特征在于,导气腔和成像介质排出腔相邻设置,二者通过可密封的连通孔连通。The container according to claim 13, characterized in that the air guide chamber and the imaging medium discharge chamber are arranged adjacently, and the two communicate through a sealable communication hole.
  15. 根据权利要求13所述的容器,其特征在于,导气腔和成像介质排出腔间隔设置,二者相对的表面上 分别设置有连通孔,触发件穿过连通孔。The container according to claim 13, characterized in that the air guide chamber and the imaging medium discharge chamber are arranged at intervals, and communication holes are respectively arranged on the opposite surfaces of the two, and the trigger member passes through the communication holes.
  16. 根据权利要求12所述的容器,其特征在于,触发件和被触发件之间还设置有用于将触发件的作用力传递至被触发件的中间部件,所述作用力的大小、方向和作用至被触发件的时刻至少之一可被中间部件控制。The container according to claim 12, wherein an intermediate part for transmitting the force of the trigger to the triggered part is arranged between the trigger and the triggered part, and the magnitude, direction and action of the force At least one of the times to the triggered part can be controlled by the intermediate part.
  17. 根据权利要求12所述的容器,其特征在于,在第二位置的电接触部与成像介质排出腔的中心线之间的距离大于在第一位置的电接触部与成像介质排出腔的中心线之间的距离。The container of claim 12, wherein the distance between the electrical contact in the second position and the centerline of the imaging media discharge chamber is greater than the distance between the electrical contact in the first position and the centerline of the imaging media discharge chamber the distance between.
  18. 根据权利要求17所述的容器,其特征在于,容器还包括可活动地安装在壳体上的活动件,在第一位置,基板与活动件不相互作用,在容器向着成像设备的安装过程中,活动件迫使芯片组件从第一位置运动至第二位置。The container of claim 17, wherein the container further comprises a movable member movably mounted on the housing, and in the first position, the substrate and the movable member do not interact during installation of the container toward the imaging device , the movable member forces the chip assembly to move from the first position to the second position.
  19. 根据权利要求12所述的容器,其特征在于,容器还包括沿安装方向与芯片组件相邻设置的光衰减部,当光衰减部位于芯片的前方时,沿上下方向,至少电接触部位于光衰减部的上方。The container according to claim 12, characterized in that, the container further comprises a light attenuating part arranged adjacent to the chip assembly along the installation direction, when the light attenuating part is located in front of the chip, along the up and down direction, at least the electrical contact part is located on the light above the attenuation.
  20. 根据权利要求19所述的容器,其特征在于,沿安装方向,电接触部比光衰减部更远离成像介质排出口。19. The container of claim 19, wherein the electrical contact is further from the imaging medium discharge opening in the mounting direction than the light attenuating portion.
  21. 根据权利要求12所述的容器,其特征在于,当容器设置有有锁定组件时,沿安装方向,电接触部比成像介质排出口更靠近锁定组件。The container according to claim 12, wherein when the container is provided with the locking assembly, the electrical contact portion is closer to the locking assembly than the imaging medium discharge port along the mounting direction.
  22. 根据权利要求21所述的容器,其特征在于,锁定组件的至少一部分由橡胶制成。21. The container of claim 21, wherein at least a portion of the locking assembly is made of rubber.
PCT/CN2022/127205 2021-10-26 2022-10-25 Chip assembly, and container having chip assembly WO2023072019A1 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
CN202122599657 2021-10-26
CN202122587136.5U CN216708788U (en) 2021-10-26 2021-10-26 Ink box
CN202122599657.2 2021-10-26
CN202122587136.5 2021-10-26
CN202122587050.2 2021-10-26
CN202123071927.9 2021-10-26
CN202122587050.2U CN216708787U (en) 2021-10-26 2021-10-26 Ink box
CN202123071927.9U CN216708791U (en) 2021-10-26 2021-12-08 Chip and ink box with same
CN202220646068.7U CN217993885U (en) 2022-03-23 2022-03-23 Chip assembly and container having the same
CN202220646068.7 2022-03-23

Publications (1)

Publication Number Publication Date
WO2023072019A1 true WO2023072019A1 (en) 2023-05-04

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Application Number Title Priority Date Filing Date
PCT/CN2022/127205 WO2023072019A1 (en) 2021-10-26 2022-10-25 Chip assembly, and container having chip assembly

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Country Link
WO (1) WO2023072019A1 (en)

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CN113954527A (en) * 2021-10-26 2022-01-21 珠海市拓佳科技有限公司 Ink box
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CN216708788U (en) * 2021-10-26 2022-06-10 珠海市拓佳科技有限公司 Ink box
CN216708791U (en) * 2021-10-26 2022-06-10 珠海市拓佳科技有限公司 Chip and ink box with same
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JP2007196648A (en) * 2005-11-28 2007-08-09 Brother Ind Ltd Ink cartridge and inkjet recorder
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